An automated work machine in which periodoc operations by an operator have been curtailed, said machine comprising: a plurality of drive devices which are driven in accordance with control commands; a clocking device which measures the current time; an input device which allows a configuration input for operating times for operating one or more of the drive devices at scheduled times; and a control device which stores an operation configuration unit that drives the drive devices at the configured operating times on the basis of time information from the clocking device.
G05B 19/18 - Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
B23Q 15/00 - Automatic control or regulation of feed movement, cutting velocity or position of tool or work
2.
System for performing work on substrate and insertion method
A cut and clinch device is provided with a pair of slide bodies, unit main body that holds the pair of slide bodies so as to be capable of moving towards and away from each other, and pitch changing mechanism that changes an insertion hole spacing distance that is a distance between insertion holes formed in the pair of slide bodies. Also, the leaded component held by the component holding tool is imaged by the imaging device before the leads are inserted into the through-holes of the board, and based on the imaging data, the lead spacing distance that is the distance between the pair of leads of the leaded component is calculated. Then, the pair of slide bodies are moved towards or away from each other such that the calculated lead spacing distance and the insertion hole spacing distance are the same.
To provide a data conversion device whereby data necessary for shaping an object using an inkjet method can be generated in accordance with impact diameter when the data are generated from three-dimensional data. A grid data generating unit 33 of a data conversion device 13 generates grid data D5 in which layer data D3 are partitioned for each grid region 41 indicating a position at which a droplet is discharged by an inkjet method. A discharge position changing unit 35 changes the position (discharge region 51) at which a droplet is discharged in the grid data D5 on the basis of an impact diameter R1 when the droplet is discharged and the length L1 of a grid region 41.
A manufacturing system includes a base and multiple work machine modules that are attachable and detachable to and from the base arranged in the arrangement direction on the base or on the side of the base, in which the plurality of work machine modules include one or more processing work modules that perform machine processing work on a workpiece using a tool, and one or more supplementary work modules that perform supplementary work that is work supplementarily performed to the machine processing work. Since it is possible to easily increase and decrease the number of processing work modules and supplementary work modules or sort the modules, it is possible to easily recombine the modules with respect to modification of the manufacturing process.
B23Q 37/00 - Metal-working machines, or constructional combinations thereof, built-up from units designed so that at least some of the units can form parts of different machines or combinationsUnits therefor in so far as the feature of interchangeability is important
B23Q 41/02 - Features relating to transfer of work between machines
B23Q 17/20 - Arrangements for indicating or measuring on machine tools for indicating or measuring workpiece characteristics, e.g. contour, dimension, hardness
B23Q 7/10 - Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of magazines
B23Q 7/14 - Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting co-ordinated in production lines
B23Q 1/58 - Movable or adjustable work or tool supports using particular mechanisms with sliding pairs only a single sliding pair
B23Q 17/24 - Arrangements for indicating or measuring on machine tools using optics
The present invention is a screw conveyor (5) for appropriately discharging swarf in cutting fluid and comprises: a container-shaped body (32) with a reservoir (33); a screw (35) installed inside the reservoir (33) so as to be rotatable; a discharge pipe (37) formed towards the back of the body (32) so as to be in communication with the reservoir (33); an input section (33A), which is towards the front and is for receiving swarf and cutting fluid into the reservoir (33); a guide plate (65) for guiding the swarf and cutting fluid to the screw (35); a screw cover (53) that covers the space above the screw (35) and in which multiple micropores are formed; and drop openings (337), which are at positions higher than the screw cover (53) and are formed in the reservoir (33) so that cutting fluid can flow into the body (32).
B23Q 11/00 - Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling workSafety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
This inspection device reduces measurement error. This inspection device is provided with a component mounting unit, an attraction unit which attracts an electronic component to be mounted on the component mounting unit towards the component mounting unit, and multiple probes which are disposed so as to be capable of electrically connecting to each of multiple electrodes of the electronic component mounted on the component mounting unit. When the electronic component is mounted on the component mounting unit, the electronic component can be mounted on the component mounting unit in a suitable orientation because the electronic component is attracted by means of the attraction unit towards the component mounting unit. Consequently, measurement error is reduced in the measurement of electric properties of the electronic component.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
This inspection device reduces measurement error. The inspection device is provided with: a component mounting unit which includes a groove extending in a first direction and comprising a bottom part which extends in the first direction and a pair of inclined surfaces which extend in the first direction and separate from each other upwards from the bottom part; and a pair of probes which are provided so as to enable connection, from both ends of the groove in the first direction, to each of a pair of electrodes of an electronic component mounted on the component mounting unit. The inspection device inspects the electronic component which, when the pair of electrodes thereof are aligned in the first direction, has a smaller dimension on the bottom surface in a second direction than the dimension of the aforementioned bottom part of the component mounting unit in the second direction, the second direction being the direction orthogonal in the horizontal direction with respect to the first direction. When inspecting an electronic component which has a smaller dimension in the second direction than the dimension in the second direction of the bottom part of the component mounting unit, the electronic component is arranged in the component mounting unit in a state in which the bottom surface of the electronic component is in contact with the bottom part of the component mounting unit. For that reason, frictional force between the bottom surface of the electronic component and the bottom part of the component mounting unit prevents disturbance of the attitude of the mounted electronic component. Consequently, measurement error is reduced in the measurement of electric properties of the electronic component.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
8.
COMPONENT CHUCK DEVICE AND COMPONENT MOUNTING DEVICE
A component chuck device (30) moves downward a pusher member (36) when supplied with a negative pressure, and keeps the attitude of a component by bringing the pusher member (36) into contact with the upper surface of the component held by a holding mechanism (32). Then, when the negative pressure supply stops, the component chuck device (30) stops holding the component, and moves downward the pusher member (36), while having the pusher member in contact with the upper surface of the component, thereby inserting the lead of the component into a hole of a base material, while keeping the attitude of the component. Consequently, the lead can be smoothly inserted into the hole, while stabilizing the attitude of the component that is being mounted.
This plasma exposure system 10 is provided with a spray nozzle 78 for spraying a heated inert gas, exposure nozzle 54 for plasma exposure, and a spray nozzle 84 for spraying a cooled inert gas. Furthermore, an article 90 to be treated, which has been heated by the heated gas, is exposed to plasma. Furthermore, the article to be treated that has been exposed to the plasma is cooled by spraying the cooled gas on the article to be treated. Thus, it is possible to efficiently carry out plasma treatment by plasma exposure of the high temperature article to be treated. In addition, after plasma treatment, the article to be treated is cooled rapidly; therefore, it is possible to appropriately prevent effects of oxidation and the like on the article to be treated in a high temperature state. Furthermore, by spraying the article to be treated with an inert gas, the surroundings of the article to be treated are filled with the inert gas and virtually no active gas is present; therefore, it is possible to suitably prevent the effects of active gasses on the article to be treated.
In an atmospheric-pressure plasma generating device 10 of the present invention, a plasma gas jetting device 12, which brings a processing gas into a plasma state in a reaction chamber, and which jets the plasma gas thus brought into the plasma state, and a heating gas supply device 14 are disposed to face each other, said heating gas supply device jetting a heating gas to the plasma jetted from the plasma gas jetting device 12. A heat blocking cover 100 is disposed between the plasma gas jetting device 12 and the heating gas supply device 14 in a state of having a clearance 108 between the plasma gas jetting device 12 and the heat blocking cover. Consequently, heat transfer from the heating gas supply device 14 to the plasma gas jetting device 12 can be effectively eliminated by means of the heat blocking cover and the clearance.
Provided is an electronic component insertion and assembly machine equipped with a cut-and-clinch device (20), wherein a backup preliminary operation, in which a cut-and-clinch head (21) is moved below a component mounting position on a circuit board (14) and raised up to a backup position, is initiated before the timing at which an operation, in which an electronic component (12) supplied by a component supply device (13) is picked up by a mounting head (17) and the mounting head is moved above the component mounting position on the circuit board, is complete. For example, the backup preliminary operation of the cut-and-clinch head is initiated at the same time as the electronic component pickup operation of the mounting head is initiated. Due to this configuration, when the operation in which the mounting head is moved above the component mounting position on the circuit board has completed, the mounting head can be immediately lowered without any delay at the component mounting position to carry out the cut-and-clinch operation.
A teaching system for performing corrective teaching without adding a new structure to a multi-joint robot. The teaching system comprises: a multi-joint robot (8) to which arm members (22, 25) are connected by a joint mechanism provided with driving motors (471, 472, 473) and which performs a specified work with a partner device (5) by means of a robot hand (28) that is provided on the distal end; a first teaching member (51) that is held on the partner device; a second teaching member (52) that is held on the robot hand and is brought into contact with the first teaching member; and a control device (40) for bringing the second teaching member (52) that is held by the robot hand (28) into contact with the first teaching member (51) that is held by the partner device (5) from multiple directions, determining contact position on the basis of the torque values for the driving motors (471, 472, 473) that rise due to said contact, and calculating the position of the robot hand.
A part supply device is configured so that a suction nozzle or chuck can be mounted on a work head. For each part to be held, a part holder that is capable of holding said part and the holding surface of the part to be held by said part holder are stored in a storage device as a correlation table. Parts that are scattered on a part support member are imaged by an imaging device and on the basis of said imaging data and the correlation table, a part holder is specified for each of the multiple parts on the part support member, thereby making it possible for the parts to be held by a suction nozzle or chuck and making it possible to hold parts that have a variety of orientations using the part holders.
This coil for a noncontact power supply is a power supply coil (3) that is provided with a winding (35) in which an alternating current of a specific frequency flows and a core (31) forming a part of a loop magnetic path linked with the winding and constitutes a noncontact power supply system (1), wherein the winding is formed by winding wire material (36) having an insulating coating (38) around a conductor (37), and the coating thickness (Ti) for the insulating coating is set so as to make the effects of the proximity effect arising mutually between adjacent wire material at the specific frequency a prescribed amount or less. Thus, the spacing distance between the conductors can be freely adjusted by changing the coating thickness, and alternating current loss arising because of the proximity effect is appropriately suppressed.
This coil for a noncontact power supply is a power receiving coil (4) that is provided with a winding (45) in which an alternating current of a specific frequency flows and a core (41) forming a part of a loop magnetic path linked with the winding and constitutes a noncontact power supply system (1), wherein the winding is formed from a plurality of winding blocks (453, 454) each of which has wire material (46) having an insulating coating (48) wound around a conductor (47), and the coil is further provided with a bobbin (7) having main dividers (71, 72) dividing the winding and the core and an inter-block divider (73) dividing the plurality of winding blocks from each other. Thus, the spacing distance between the conductors of the wire material on both sides of the inter-block divider is increased by the thickness (Tb) of the inter-block divider, and occurrences of alternating current loss caused by the proximity effect are suppressed.
The present invention is a coil (1) for noncontact power supply that is provided with a winding (31) and a core (41) forming a part of a loop magnetic path linked with the winding and is used in a power supply side device and/or a power receiving side device of a noncontact power supply system (9), wherein the core is constituted of three or more core units joined in a series, and the core units include one or more linking core units (E shape core 5) for linking with the winding and two non-linking core units (L shape core 6) that are disposed respectively on the two ends of the one or more linking core units in the direction of joining and do not link with the winding. Thus, because the non-linking core units have a magnetic shielding effect so that magnetic flux generated by the winding does not leak to the outside even though the contribution of the non-linking core units to electromagnetic coupling is small, it is possible to provide a coil for noncontact power supply wherein increases in magnetic flux leakage are suppressed.
Disclosed is a control device wherein an image of a leading end of a suction nozzle is picked up when inspecting the leading end of the suction nozzle. Then, on the basis of the picked up image data, an opening at the leading end of the suction nozzle is identified. At that time, in an image 170 based on the picked up image data, regions 176, 178 inside of a region 172 having a luminance equal to or higher than a set luminance are identified as the opening, said regions 176, 178 having a lower luminance than the set luminance. Furthermore, the identified opening is divided into four sections by boundary lines 190, 192, and the area of the opening is calculated by each section. On the basis of the area thus calculated, whether the suction nozzle is acceptable is determined by each section. Consequently, for instance, even in the cases where the area of the whole opening of a defective nozzle is substantially equal to the area of the whole opening of a normal nozzle, whether the suction nozzle is acceptable can be reliably determined by determining whether the suction nozzle is acceptable on the basis of the area of the opening by each section.
The purpose of the present invention is to provide a stick feeder which permits variation in the length of a plurality of stacked sticks (90), and is capable of transporting an electronic component in a favorable manner. A stick feeder drive device (40) moves a rear-side support member (32) to three positions consisting of: a reference position for receiving, along with a front-side support member (31), a stick (90) to be supplied that a guide device (20) guides and lowers; a pressing position for pressing, toward the front-side support member (31) side, a stick (90) to be supplied which has advanced from the reference position; and a discharge position for discharging a stick (90) to be supplied that has withdrawn from the reference position, and discharging through the interval between the front-side support member (31) and the rear-side support member (32).
A non-contact power supply device (1) of the present invention is provided with: a plurality of power supply elements (power supply coils 31) that are disposed in the moving direction by being separated from each other; an alternating current power supply (2) that supplies alternating current power to the power supply elements; a plurality of power receiving elements (power receiving coils 41), which are provided in a mobile body (99), and receive the alternating current power in a non-contact manner; and a power receiving circuit (5), which converts the alternating current power received by the power receiving elements, and outputs the power to an electric load (57). When the power supply element length in the moving direction is represented by LT, the separated distance between the power receiving elements is represented by DT, the power receiving element length in the moving direction is represented by LR, and the separated distance between the power receiving elements is represented by DR, the relationship of DT≤DR, and the relationship of (2×LR+DR)≤LT are satisfied. Consequently, irrespective of the position of the mobile body, since at least one of the power receiving elements can constantly receive large alternating current power by ensuring an excellent power receiving state, stable non-contact power supply can be constantly performed by suppressing pulsation of the receiving alternating current power.
H02J 50/00 - Circuit arrangements or systems for wireless supply or distribution of electric power
B60L 5/00 - Current-collectors for power supply lines of electrically-propelled vehicles
B60M 7/00 - Power lines or rails specially adapted for electrically-propelled vehicles of special types, e.g. suspension tramway, ropeway, underground railway
The purpose of the present invention is to provide a stick feeder which makes it possible to test an unmounted electronic component, and is capable of reducing the occurrence of faults in a circuit board product. The stick feeder supplies an electronic component by pushing the electronic component outward from the front tip of a stick that houses multiple electronic components. The stick feeder (10) is equipped with: a guide path for guiding an electronic component which is transported from the front end of the stick to an electronic component supply position; and a testing device that is provided in the guide path and tests the quality and state of an electronic component guided along the guide path.
A tape feeder (10) is provided with a cover tape peeling member (41, 42) for peeling, in accompaniment with a component supply tape (12) feeding operation, at least a part of a cover tape (22) from the upper surface of the component supply tape upstream of the component vacuum-chucking position and exposing a component in the component supply tape. The cover tape peeling member is attached to the tape feeder so as to be capable of being exchanged, and can be exchanged between: a half-peel cover tape peeling member (42) for peeling only the join part on one side from among join parts (34a, 34b) on both sides of the cover tape, stripping the cover tape from one side, and exposing the component in the component supply tape; and a full-peel cover tape peeling member (41) for peeling the join parts on both sides of the cover tape, stripping the cover tape from the front end side, and exposing the component in the component supply tape.
The present invention is an addition-type reel holding device (7) that is additionally attachable to a component supply device (3) comprising a plurality of feeder units (81, 82) and a standard reel holding part (35) for rotatably and exchangeably holding a plurality of tape reels (TR) and mounted in a component mounter (1). The addition-type reel holding device is additionally attached to the standard reel holding part, rotatably and exchageably holds an additional tape reel other than the tape reels held by the standard reel holding part, and enables a carrier tape (CT) wound around the additional tape reel to be advanced to the feeder unit (82). Consequently, the total number of carrier tapes that can be advanced from the standard reel holding part and the addition-type reel holding device to the feeder unit can be increased.
A multi-joint robot arm (5), for which origin determination is easy, comprises: a support member (21) erected on a base member (15); a first arm member (22) rotatably supported with respect to the support member (21) by a first joint (23); and first position-determining holes (61: 215, 225), which are formed in a portion of the first joint (23) where the first arm member (22) and the support member (21) overlap and into which a first position-determining pin (51) can be inserted at the same time in the first arm member (22) and the support member (21) at a specified orientation.
B25J 19/00 - Accessories fitted to manipulators, e.g. for monitoring, for viewingSafety devices combined with or specially adapted for use in connection with manipulators
The present invention is a separate installation-type reel holding device (7) that is installed separately from a component mounter (1) provided with a component supply device (3) comprising a plurality of feeder units (81, 82) and a main body-side reel holding part (35) for rotatably and exchangeably holding a plurality of tape reels (TR). The separate installation-type reel holding device rotatably and exchageably holds a separately installed tape reel other than the tape reels held by the main body-side reel holding part, and enables a carrier tape (CT) wound around the separately installed tape reel to be advanced to the feeder unit (82). Consequently, the total number of carrier tapes that can be advanced from the main body-side reel holding part and an addition-type reel holding device to the feeder unit can be increased.
In this atmospheric pressure plasma irradiation device (10), an upper cover (76) descends and makes intimate contact with a lower cover (78) to seal a cover housing (22). Then, an inert gas is fed into the interior of the sealed cover housing (22), and plasma is subsequently discharged by a plasma generation device (20) towards the interior of the cover housing (22). The supply of the inert gas into the interior of the cover housing (22) is maintained while the plasma is being discharged. It thereby becomes possible for air to be discharged from the interior of the cover housing (22) by the inert gas, and for the concentration of oxygen around a body to be treated by plasma irradiation to be managed.
The present invention is a component mounting device (1) provided with a feeder device (3) and a component transfer device (4), wherein the component mounting device (1) is provided with: a splice part detection unit (33) for detecting a splice part (79) frontward of the feed position (32) of the feeder device; a passing-through determination unit (steps S2, S3) for determining whether or not the splice part is in a passing-through state in which the splice part is located within a pass-through zone; a suction fault determination unit (steps S5, S8) for determining a suction fault state to be in effect, in which a suction nozzle (46) is not able to suction a component (P) thereto; a work defect determination unit (step S9) for determining splicing work to be defective if a suction fault state has been identified and the splice part is determined to be in a passing-through state; and a fault display unit (388) for displaying a dedicated fault display if the splicing work is determined to be defective. A worker is thereby able to determine whether or not the suction fault state is caused by defective splicing work by checking the dedicated fault display on the fault display unit.
In the present invention, a CPU of a management computer: sets, as a target part, the nth part in the mounting order in the current sequence (S120); calculates (acquires) peripheral situation data of the target part (S130); and sets a required precision of the target part on the basis of the peripheral situation data, and stores the required precision in an HDD (83) (S140). Because the required precision is automatically set on the basis of peripheral situation data in this manner, the set required precision matches the actual state better than conventionally. Accordingly, the required precision of a target part can be automatically set appropriately.
In the present invention, a CPU of a management computer, upon starting a work allocation processing routine, first acquires the specification precision of each mounting machine (Step S110), and next acquires a required precision corresponding to a part type of first through last parts to be mounted on a single substrate (S) (Step S120). Next, the CPU of the management computer allocates the work of mounting the first through last parts (Step S130), and ends the routine. Specifically, the CPU allocates, for each part, the work of mounting the part to a mounting machine that has a specification precision which satisfies the required precision corresponding to the part type.
Laser light 80 is irradiated coaxially to the irradiation direction of plasma in a plasma irradiation device 20 in a plasma irradiation system 10. When plasma is irradiated on a patient 12 from the plasma irradiation device 20, an image of the patient is captured by an imaging device 24 and the irradiation position of the laser light on the processing target, i.e., the plasma irradiation position 82, is calculated by a control device 22 on the basis of this imaging data. An image corresponding to the irradiation position is displayed on a display device 26. As a result, a person providing treatment can be aware of the plasma irradiation position and plasma can be appropriately irradiated on the patient.
A testing device for sorting and collecting components (s) after measuring the electrical properties thereof, the testing device including a support base (32), a pair of measurement probes (34, 36) that hold the components (s) supported by the support base (32), and are capable of measuring electrical properties, and a relative movement device for moving the support base (32) and the pair of measurement probes (34, 36) relative to one another. On the basis of the results obtained by measuring the electrical properties of the components (s), the testing device sorts and collects the components (s) by changing the relative positions of the movable probe (36) and the support base (32).
A component-mounting machine (10) for mounting an electronic component (4) on a circuit board (2), wherein a technique is provided with which it is possible to display a movable region inside the component-mounting machine (10) within the same image. This component-mounting machine (10) is provided with a fixed camera (29) for monitoring the interior of the component-mounting machine (10), and a display unit (28) that can display the image captured by the fixed camera (29). The fixed camera (29) can capture within the same image a range from the suction position at which a suction nozzle (6) suctions an electronic component (4) supplied from a component feeder (12) to the mounting position at which the electronic component (4) is mounted on the circuit board (2).
In a component mounting device of the present invention, a cut-and-clinch unit is disposed under a circuit substrate 200 which is transported by a transport device, wherein the unit is adapted to be movable by a moving device to an arbitrary position. When an image of a fiducial mark 202 of the circuit substrate is captured by an image capture device, the unit is moved such that a recognition assist seal 117 disposed on the unit provides a background to the fiducial mark. The color around the fiducial mark of the circuit substrate is white-based, and the color of the recognition assist seal is black-based. In this way, the contour of the fiducial mark is made clear, whereby the fiducial mark can be appropriately recognized on the basis of image capture data.
This magazine (40) is formed with elongate holes (43a) in side walls (43) of a housing (42), the elongate holes (43a) having longitudinal axes situated in the height direction. An operator uses mounting members (45) and fastens mounting screws (47) into screw holes (44a) of a support rail (44) with plates (46) and the side wall (43) interposed therebetween in order to mount the support rail (44) at an optional position on the side wall (43). Each of the mounting members (45) is configured from: the plate (46) formed with a through-hole (46a); and the mounting screw (47) passing through the through-hole (46a) and the elongate hole (43a). Thus, it is possible to change slot pitches in a stepless manner depending upon the height of a component (tray T) to be mounted on each pallet (P), and therefore efficiently house components within the magazine (40).
This plasma irradiation device 10 comprises a main unit 12, a pair of electrodes 14, 16, a gas supply device 20, and a laser irradiation device 22. The gas supply device 20 supplies treatment gas to inside the main unit 12. Treatment gas that flows through the inside of a cylinder section 23 of the main unit 12 is converted into plasma by voltage being applied to the electrodes 14, 16 and electrical discharge occurring between the electrodes 14, 16. As a result, plasma is ejected in the axial direction of the cylinder section 23 from an opening in an end surface of the cylinder section 23, said end surface being on the opposite side to an end surface on the side that the laser irradiation device 22 is connected to. The laser irradiation device 22 irradiates laser light in the axial direction of the cylinder section 23. As a result, the plasma irradiation position can be visually checked by laser light and plasma can be appropriately irradiated on an object to be treated.
When a cut-and-clinch head (21) is lifted by a Z-axis drive device (24) from a stand-by position spaced apart downward from a lower surface of a circuit substrate (14) to an operation position for performing a cut-and-clinch operation, the cut-and-clinch head is high-speed lifted at a maximum speed in an interval from the stand-by position spaced apart downward from the lower surface of the circuit substrate to a deceleration start position, the lift speed of the cut-and-clinch head is reduced from the deceleration start position, and the cut-and-clinch head is stopped at the operation position where the cut-and-clinch operation is performed. In this case, in accordance with the amount of downward warping of the circuit substrate or information having correlation therewith, the height of the deceleration start position is modified. For example, control is provided to decrease the height of the deceleration start position as the amount of downward warping of the circuit substrate increases. In this way, regardless of the amount of downward warping of the circuit substrate, a proper deceleration distance between the deceleration start position and the lower surface of the circuit substrate can be stably ensured.
Provided is a robot system (10) which performs control to drive a robot arm relative to an object according to information obtained by a camera, wherein the robot system comprises: a robot (1) including an operation part (2); a camera (3) that is attached to the robot (1) near the operation part; and a control device (5) that controls the driving of the robot (1) while confirming the object on the basis of captured image data of the camera (3). When the control device (5) makes the operation part (2) move relative to the object (30) along a preset trajectory (20), the control device performs image capture control a multiple number of times to capture images of the object (30), and performs focus control by which focusing is carried out for a prescribed image capture from among the multiple instances of image capture under the image capture control.
The present invention is a component mounting machine for mounting electronic components on a circuit substrate, and provides a technique for limiting the amount of static electricity generated inside the component mounting machine. This component mounting machine is provided with a humidifier for humidifying the inside thereof, a sensor for measuring the humidity therein, and a control device for controlling the humidifier in response to an output of the sensor. The humidifier is disposed in a position facing a tape peeling part and emits humidified air toward the tape peeling part.
A feeder maintenance device 11 cleans a predetermined unit (such as a sprocket unit 66 or a member processing mechanism 70) including a delivery mechanism 65 for a feeder 60, using a cleaning unit (air washing units 30, 40, or liquid washing units 34, 44), and measures backlash of the delivery mechanism 65, using a backlash examination unit 51 (measurement unit). In this way, the feeder maintenance device 11 performs cleaning of the feeder 60, whereby variations in maintenance quality can be better suppressed compared with when performed by a worker. In addition, because the feeder maintenance device 11 measures the backlash of the delivery mechanism 65, maintenance regarding the delivery mechanism 65 for the feeder can be more reliably performed.
A component mounting position error amount measurement unit (25) is set in a feeder setting unit (24) of a component mounting device (12) interchangeably with a cassette-type feeder (14). The component mounting position error amount measurement unit is provided with: a measurement nozzle placement portion (56a to 56c) for placing measurement nozzles (55a to 55c) to be interchangeably held on a mounting head (15) of the component mounting device; a measurement component placement portion (58a, 58b) for placing a measurement component (57); and a measurement mounting base (60) provided with a measurement reference mark (59), wherein, when a component mounting position error amount of the component mounting device is measured, the measurement nozzle is held on the mounting head, the measurement component is suction-attached to the measurement nozzle and mounted on the measurement mounting base, and an error amount of the mounting position of the measurement component with respect to the measurement reference mark is measured as the component mounting position error amount of the component mounting device.
A component mounting line (10) is provided with: a plurality of component mounting devices (20) arranged in a substrate transport direction; a feeder store (60) in which a plurality of feeders (30) which can be attached to and detached from the component mounting devices (20) are stored; and an interchange robot (50) which can interchange the feeders (30) between the feeder store (60) and each of the component mounting devices (20). The feeder store (60) is installed in the same row as the plurality of component mounting devices (20), and the interchange robot (50) is moved in the substrate transport direction to interchange the feeders (30). In this way, the feeders (30) can be replenished or collected in the feeder store (60) no matter in which of the component mounting devices (20) the feeder may be used, thereby making it easy for the operator to replenish or collect the feeders (30).
A feeder maintenance device (11) manages history information (84) including at least one of the number of times of use of an expendable item and a measurement value of the expendable item concerning a cleaner unit (an air washing unit (30, 40, 49) and a liquid washing unit (34, 44)), and causes information about a use status of the expendable item to be displayed and output as an expendable item screen on the basis of the history information (84). The feeder maintenance device (11) can notify a worker of information about the expendable item. In addition, the feeder maintenance device (11) enables the worker to exchange or supplement the expendable item. Accordingly, a maintenance process for a feeder (60) can be performed with increased reliability.
This component mounting device comprises a component mounting head (28) including an engaging member (152) which is to be engaged with or which is engaged with a suction attachment nozzle, and an action force detector (160) which detects an action force in a vertical direction acting on the engaging member (152), wherein, in a state in which the suction attachment nozzle (50) and the engaging member (152) are engaged with each other so that the suction attachment nozzle (50) and the engaging member (152) do not become displaced relative to each other, a nozzle holder (52) and the suction attachment nozzle (50) are displaced relative to each other, and at this time an assessment of the acceptability of a slide state between the nozzle holder (52) and the suction attachment nozzle (50) is made on the basis of the action force detected by the action force detector (160). According to the present component mounting device, the need to move the component mounting head (28) to a specific position to assess the slide state between the nozzle holder (52) and the suction attachment nozzle (50) is eliminated, thereby making it possible to decrease the time required to assess the slide state.
The purpose of the present invention is to provide a measurement device with which it is possible to achieve an increase in measurement accuracy and an increase in the number of times a measurement jig can be used. The measurement device is provided with: a movement control unit which positions a measurement jig (80) in a directed position in a transfer direction; an imaging control unit which captures an image of the positioned measurement jig (80) using a measurement camera, to acquire image data; an image processing unit which, on the basis of a plurality of measurement marks (83) included in the image data, calculates the actual position of the measurement jig (80); and an error measurement unit which measures a transfer-direction positioning error due to a drive device, on the basis of the directed position and the actual position.
A component mounting device 10 is provided with a controller for controlling a mounting head. The mounting head is provided with: a nozzle holder 30; a nozzle 42 resiliently supported so as to be vertically movable with respect to the nozzle holder 30; a flange 42c disposed in a position offset from a central axis of the nozzle 42; and a second engaging portion 52 capable of moving the nozzle 42 downward by engaging and pressing the flange 42c down against the resilience of a nozzle spring 46. The controller previously measures an error amount of the tip position of the nozzle 42 before and after the downward movement of the nozzle 42 by the second engaging portion 52, and, by taking the error amount into consideration, controls the mounting head to suction and mount a component on a substrate.
A feeder (200) is provided with: a cutting/bending mechanism (241) which cuts off a tip section of a first lead (R1) and of a second lead (R2) of an axial part (P) in a parts tape (900) that is fed to a parts supply unit (212) by a feeding device (220), and bends the remaining tip section of the first lead 1 (R1) and of the second lead (R2); and a cutter/bender drive device (242) which is provided in a feeder main body (210) and which drives the cutting/bending mechanism (241). The cutting/bending mechanism (241) is a unit (unit mechanism 300) which is detachably attached to the feeder main body (210).
The purpose of the present invention is to provide a nozzle cleaning device with which it is possible to increase the efficiency of work including transition to a recovery process, and a nozzle station installation device which can be applied to the nozzle cleaning device, etc. The nozzle cleaning device is provided with a cleaning unit for cleaning a suction nozzle used in a component mounter, an inspection unit for inspecting the state of the suction nozzle cleaned by the cleaning unit, and a determining unit for determining, on the basis of the inspection result, whether or not the suction nozzle requires a stipulated recovery process. The nozzle cleaning device collects the suction nozzles determined by the determining unit to require the recovery process in a dedicated cartridge of a recovery process device for performing the recovery process.
This mounting device (11) is a device for mounting a component to a substrate, and is provided with: a component supply unit (14) that supplies a component by feeding a tape member (25) accommodating a plurality of components; a transfer part (31) that transfers a disused tape which is the tape member (25) cut after the component has been collected, via a transfer path (30) to a disused tape accommodating part (32); and a chute part (40) that changes a moving direction of the disused tape multiple times to drop the disused tape to the transfer path (30) through an opening part. The chute part (40) has an inclining member (46) formed with an inclining surface (46b) and arranged so as to cover, from above, an opening part (42) through which the disused tape passes, in a state where a passing space is kept through which the dropped disused tape passes.
A mounting device (11) is provided with a chute (40) through which passes waste tape cut from a tape member after a component is extracted, a transfer path (30) formed between the chute (40) and a waste tape container (32), and a transfer section (37) for transferring the waste tape from the chute (40) to the waste tape container (32). The transfer section (37) has a negative-pressure imparting section (38) for imparting negative pressure to the transfer path (30) from the waste tape container (32) side and a positive-pressure imparting section (39) for imparting positive pressure to the transfer path (30) from the waste tape container (32) side and to the transfer path (30) toward the chute (40) side.
A component-mounting device is provided with an XY robot 20, a Z-axis slider 29 fastened to an X-axis slider 26 of the XY robot so as to be able to move in the Z-axis direction, a head 30 mounted on the Z-axis slider 29, and a nozzle fastened to the head 30 so as to be able to move in the Z-axis direction. The component-mounting device 10 suctions to the nozzle a component supplied from a component supply unit 70, conveys the component to a prescribed position on a substrate S, and mounts the component. A flexible part 56 having an external shape in a U shape, the flexible part being capable of being extended and compressed in the X-axis direction and the Z-axis direction, is disposed rearward of a Y-axis slider 22. The flexible part 56 is combined with at least some of the X-axis wiring and piping and at least some of the Z-axis wiring and piping.
B25J 19/00 - Accessories fitted to manipulators, e.g. for monitoring, for viewingSafety devices combined with or specially adapted for use in connection with manipulators
H02G 11/00 - Arrangements of electric cables or lines between relatively-movable parts
A control device (150) causes a pallet (P, PP) with a plurality of individual substrates (B) placed thereon side by side in a conveyance direction (X) to be conveyed to a carrying-in position (Pi1, Pi2) and to be positioned thereat, and causes one of the plurality of individual substrates (B) to be raised from the pallet (P, PP). The position of the raised individual substrate (B) and the position of an opening part (121a) of a screen mask (121) are detected, and the raised individual substrate (B) is positioned at a printing position (Pp1, Pp2) to serve as a substrate to be printed (BB). The substrate to be printed (BB) is further raised and is brought into contact with the opening part (121a) of the screen mask (121) and screen printing is performed on the substrate to be printed (BB). The above operation is performed with respect to each of the plurality of individual substrates B, one by one in the order of arrangement thereof in the conveyance direction X.
B41F 15/26 - Supports for workpieces for articles with flat surfaces
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
A component mounting apparatus (1) of the present invention is provided with: a component supply unit (3) having a feeder device (31) that sequentially supplies components (P) to a supply position (34) by feeding a carrier tape (9) having cavities (93) formed therein; and a component placing device (4) having a mounting head (44), a head drive mechanism (49), and a suction nozzle (46), which sucks a component from a cavity at the supply position and mounts the component on a substrate (K). The component mounting apparatus is also provided with: a component fewness detection unit (camera device 7) that detects that the number of the remaining components held by the carrier tape is reduced to a predetermined small number; and an ineffective suction avoiding unit (control device 6) that avoids, on the basis of detection results obtained from the component fewness detection unit, ineffective suction operations of the section nozzle when the number of the remaining components held by the carrier tape becomes zero. With the present invention, substrate production efficiency can be improved by eliminating the ineffective suction operations with respect to the cavities not holding the components.
Provided is a cassette-type tape feeder (10) that comprises: a tape feeding device (21) that feeds a component supplying tape (12), which is pulled out from a reel (13), toward a component suction position; a cover tape drawing-in device (23) that, along with an operation of feeding the component supplying tape, tears off a cover tape (22) from the component supplying tape in front of the component suction position and draws the cover tape in a direction opposite the feeding direction of the component supplying tape; a cover tape collecting case (24) that collects the cover tape that has been drawn in by the cover tape drawing-in device; and the like. The cover tape collecting case is constituted by a fixed case part (24a) that is fixed to a cassette case (11) and a movable case part (24b) that increases the volume of the cover tape collecting case by displacing in a direction toward an empty space inside the reel as the collected amount of the cover tape increases. The movable case part is urged in a contracting direction by a torsion coil spring 29.
The present invention pertains to a solder printing machine (1) provided with: a conveyance device (3) for a substrate (K); a clamp device (including a substrate width adjustment section 33 and a side surface clamp member 38) that clamps the substrate at a clamp height (Hc) higher than a conveyance height (Ht); an elevation device (4) that drives the substrate to move upward from the conveyance height to the clamp height and then drives the clamped substrate to move upward together with the clamp device and the conveyance device, to be held at a print height (Hp); and a print execution device (5), the solder printing machine being further provided with an upward-movement operation monitoring device (8) that determines that an abnormality has occurred if an upward movement of the conveyance device is detected at a point in time at which the elevation device has driven the substrate to move upward to the clamp height. Thus, the two pairs of elevation driving devices that have conventionally been used are integrated into one device to provide a simple equipment configuration, and reliability against intrusion of foreign matter is improved.
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
The present invention addresses the problem of providing a chuck device (1) wherein a structure is simple, and a replaceable member (3) can be easily replaced. The chuck device (1) is provided with a chuck main body (2), the replaceable member (3), an axis direction regulation mechanism (4), and a circumferential direction regulation mechanism (5). The axis direction regulation mechanism (4) has: a circumferential direction trench section (40), which is provided by being recessed in one of the chuck main body (2) and the replaceable member (3), and which extends in the circumferential direction; and a diameter direction protruding section (41), which is disposed on the other one of the chuck main body (2) and the replaceable member (3), and which can protrude in the diameter direction. The circumferential direction regulation mechanism (5) has: an axis direction recessed section (50), which is disposed in one of the chuck main body (2) and the replaceable member (3), and which is provided by being recessed in the axis direction; and an axis direction protruding section (51), which is disposed on the other one of the chuck main body (2) and the replaceable member (3), and which can protrude in the axis direction.
B23B 31/10 - Chucks characterised by the retaining or gripping devices or their immediate operating means
B23Q 3/12 - Devices holding, supporting, or positioning, work or tools, of a kind normally removable from the machine for securing to a spindle in general
55.
COMPONENT MOUNTING MACHINE AND COMPONENT MOUNTING SYSTEM
In a POP mounting for mounting an upper component PU on a lower component PL after mounting the lower component PL on the substrate S of the present invention, the Z-axis position Z of an adsorption nozzle tip end at the time when a lower component PL is mounted on a substrate S is detected and stored as a lower component height Zlp (S180-S220). When the upper component PU is mounted, an adsorption nozzle 60 (upper component PU) is lowered at a relatively high speed V1 until reaching a predetermined position (Zlp+α) that is higher than the lower component height Zlp by a distance α. The adsorption nozzle 60 is lowered at a speed V2 slower than the speed V1 after reaching the predetermined position (Zlp+α) until making contact with the lower component PL.
In a production device, which is provided with an inkjet head 76 for discharging an ultraviolet-curable resin, an irradiation device 82 for performing ultraviolet irradiation, and a stage 52 for producing a structural object, the ultraviolet-curable resin is discharged on the stage, and irradiated with ultraviolet. As a result, the ultraviolet-curable resin is cured, and a resin layer is formed. Furthermore, discharge of the ultraviolet-curable resin and ultraviolet irradiation are repeated to stack a plurality of resin layers and form the structural object. In this production device, a pair of incidence-inhibiting units 120 are provided to two edges of the stage 52. The incidence-inhibiting units 120 extend in the movement direction of the stage 52, and block ultraviolet emitted by the irradiation device. As a result, incidence of ultraviolet on a discharge port of a discharge device can be inhibited, and curing of the ultraviolet-curable resin in the discharge port can be inhibited.
A component feeder that is provided with a feeding mechanism (70) that feeds, at a designated feeding pitch, a component tape wherein components are held on a carrier tape at a designated arrangement pitch. The component feeder supplies one component at a time from a designated supply position. The component feeder is also provided with a feed verification mechanism (170) that is for verifying whether the component tape has been fed by the feed mechanism at the feeding pitch. For example, a pin (172) is inserted at a designated position into a feed hole that is provided in the carrier tape, and a sensor (176) detects whether the pin has actually been inserted. The feeder is highly reliable because the feeder verifies whether a component will be or has been properly fed to the supply position.
A component feeder that supplies lead-equipped components P that have a plurality of leads Le from a designated supply position SS one by one. A positioning mechanism 108 that sandwiches leads by means of a sandwiching part 128 of a clamp 110 is configured such that a guide part 150 that is provided with V notches 154 is integrated with the sandwiching part and such that the guide part and the sandwiching part are exchanged as a whole according to component. Because the rigidity of the guide part has been increased, the present invention can avoid situations in which the guide part is raised by a bend in a lead, even if the lead is improperly positioned. Because the clamp easily closes all the way to a proper closed position, the component feeder can easily verify that leads Le are properly positioned at the supply position by detecting that the clamp has closed.
A component feeder that supplies lead-equipped components P that have a plurality of leads Le from a designated supply position SS one by one while using a guide part 150 to guide each lead to a prescribed position and using a clamp 110 to position each lead. The component feeder is provided with a clamp closed-position verification mechanism 160 that is for verifying whether the active position of the clamp is proper when the clamp is closed. By using the clamp closed-position verification mechanism to verify that the closed position of the clamp is improper, the component feeder can easily detect improper lead states, such as a bend in a lead, can easily detect that a lead is improperly positioned, etc., even if one of the plurality of leads is bent and the bent lead has been guided into the prescribed position for the other lead.
A component feeder that supplies lead-equipped components (P) that have a plurality of leads (Le) from a designated supply position (SS) one by one. The component feeder is provided with a lead-position verification mechanism (210) that is for verifying whether each of the plurality of leads of a component that is being fed to the supply position is properly positioned in the feed direction to the upstream side of the supply position. By means of the lead position verification mechanism, the component feeder can, to the upstream side of the supply position, detect whether each lead would be improperly positioned at the supply position as a result of a bend or the like in the lead.
This component mounting machine (10) includes: an adsorption nozzle (6) having a nozzle adsorption surface (6a); a camera (24) for acquiring nozzle imaging data (100) of a tip end of the adsorption nozzle (6); and a control device (30) for determining quality of the nozzle adsorption surface (6a). The nozzle imaging data (100) contains a nozzle region in which the tip end of the adsorption nozzle (6) is imaged and a background region in which a background that is lower than the tip end of the adsorption nozzle (6) is imaged. The control device (30) calculates the lowermost end position of the nozzle adsorption surface (6a) or foreign matter (110) adhered to the nozzle adsorption surface (6a), calculates a first height (h1) and a second height (h2) that are positions, in the vertical direction, of the nozzle adsorption surface (6a) or the foreign matter (110) adhered to the nozzle adsorption surface (6a) in a first position (L1) that is apart from the lowermost end position by a first setting distance or more and in a second position (L2) that is apart from the lowermost end position by a second setting distance or more, calculates a difference for calculating a first difference (I1) between the first height (h1) and the height of the lowermost end position, and a second difference (I2) between the second height (h2) and the height of the lowermost end position, and determines the quality of the nozzle adsorption surface (6a) on the basis of the difference that is the smallest of the first difference (I1) and the second difference (I2).
In the present invention, in accordance with the size of circuit substrates (A1, A2) used in two types of production which are executed in order, a component mounting station (10) is divided into two component mounting areas (B1, B2) in the substrate conveyance direction, and an area in which backup pins (16) are disposed on a backup plate (15) is divided into two pin disposition areas (C1, C2) in accordance with the two component mounting areas. The number of backup pins necessary for receiving and supporting component mounted substrates which are produced in the component mounting areas are disposed in advance in a predetermined disposition pattern in each pin disposition area. The circuit substrates conveyed by the conveyor (11) are caused to stop at the component mounting area corresponding to the type of component mounted substrate to be produced, the backup plate is raised, and the circuit substrates are clamped by a clamp member (26). The circuit substrates are received and held by the backup pins of the pin disposition area positioned below the circuit substrates, and components are mounted on the circuit substrates.
The purpose of the present invention is to provide a care robot which enables the performance of an auxiliary operation by a retaining member that retains a care receiver, and which can prevent inhibition with respect to other care equipment or the like. The care robot is provided with: a pair of support arms arranged on both sides in the left-right direction when the traveling direction of a base is the front; a retaining device capable of performing an auxiliary operation in a state of retaining part of the body of the care receiver; and an auxiliary operation actuator that drives the auxiliary operation of the retaining device. The auxiliary operation actuator is arranged between the pair of support arms in the left-right direction.
By making the height of a board transporting surface of a conveyor device (15) of a wide component mounting machine (12) changeable and changing the height of the board transporting surface in accordance with the height of a component to be mounted onto a circuit board, the distance between the board transporting surface and a mounting head (17) is changed. More specifically, conveyor legs (29) with a standard height and conveyor legs (29a) that are for large components and are shorter than the standard-height conveyor legs are prepared in advance. When small components or medium-size components, which are standard-size components, are to be mounted, the standard-height conveyor legs are used as the conveyor legs of the conveyor device; when large components, such as tall connector components, are to be mounted, the conveyor legs are changed to the conveyor legs for large components. Compared to the height of the standard-height conveyor legs, the height of the conveyor legs for large components is shorter by an amount equivalent to the difference in height between components to be mounted or by a dimension slightly greater than said difference.
In this component mounting machine, before automatically replacing a suction nozzle (14) held on a rotary head (15), the respective nozzle ID codes of all suction nozzles arranged on a nozzle station (17) are consecutively read at high speed, and are stored in association with the respective positions of the suction nozzles. More specifically, an operation is executed wherein, while moving a mark imaging camera (30) along the arrangement direction of each row of suction nozzles on the nozzle station, images of respective nozzle ID code display parts (54) of the suction nozzles in the respective rows are sequentially captured without stopping the mark imaging camera. At this time, every time the last image-capturing operation for a single row is finished and the sequence moves on to the image-capturing operation for an adjacent row, the movement direction of the mark imaging camera is reversed, and the respective nozzle ID codes of the suction nozzles in each row as read off in an image processing operation are stored in a storage device (43) in association with the respective positions of the suction nozzles.
A component mounting device (1) is provided with a nozzles station (72), and the nozzles station is provided with: a lift member (86) that can be raised and lowered; a nozzle housing device (77) which detachably houses a plurality of types of suction attachment nozzles (66) corresponding to the type of a nozzle tool (60); a positioning device (95) which positions the nozzle housing device at a plurality of height positions depending on the type of the nozzle tool; and a reference mark (78) with which the nozzle housing device is provided. A replacement control device (93) includes: a reference mark position calculation unit (93a) which positions the nozzle housing device at the plurality of height positions and which calculates the position of the reference mark for each of the plurality of height positions; and a nozzle replacement control unit (93b) which, when the nozzle housing device is positioned at the plurality of height positions as a result of replacement of the nozzle tool, replaces the suction attachment nozzle by positioning the nozzle tool relative to the nozzle housing device, with reference to the calculated position of the reference mark.
A component mounting machine is equipped with a head unit having a plurality of suction nozzles and makes it possible to supply negative pressure supplied from the same negative pressure source to each of the suction nozzles separately. When allowing a target nozzle among the plurality of suction nozzles to suction a component, the component mounting machine controls a negative pressure supply device so that negative pressure is started to be supplied to the target nozzle (suction portion) (S180) after a pressure sensor detects that the target nozzle has made contact with the component (S160, S170). This makes it possible to start supplying the negative pressure to the suction nozzle (suction portion) at a more appropriate timing.
When a component-mounting machine detects the lowest-end position Zp of a component P suctioned by a suction nozzle 71, the bottom edge position (black dot) of the component P is detected at each of prescribed intervals D from the left and right sides using the lowest-end position Zp as a reference. The component-mounting machine then derives an approximate straight line that approximates the plurality of bottom edge positions and the lowest end position Zp detected from the side having the largest number of detected points (in fig. (b) this is the side to the right of the lowest-end position Zp), and detects the angle of the approximate straight line as the suction angle of the component P. The component-mounting machine can thereby adequately detect the suction angle of the component P using a simple process, and correctly determine the suction posture of the component P.
In this rotary head-type component installing machine, multiple suction nozzles among a predetermined number of suction nozzles (14) held on a rotary head (15) are configured to be able to be simultaneously lowered. When the rotary head is moved to a nozzle replacement area by a head movement mechanism (20) to replace suction nozzles, station reference marks (47) located on two spots of a nozzle station (17) are imaged by a mark imaging camera (30) to identify the positions of the two station reference marks, and the tilt angle and the position of the nozzle station are calculated. Then, the tilt angle and the position of the rotary head are corrected in accordance with the tilt angle and the position of the nozzle station, and the multiple suction nozzles held by the rotary head are, by a Z-axis driving mechanism (22), simultaneously lowered and are simultaneously replaced with multiple suction nozzles of the nozzle station.
In this working machine (20), a conveyor belt (50) is rotated such that a protrusion (58) is positioned on the upstream side of an end surface on the side opposite the conveyance direction of a circuit board (54) while the circuit board (54) is clamped by a clamp device (40). Accordingly, interference between the protrusion (58) and the circuit board (54) can be prevented and the circuit board (54) can be reliably pushed out to the downstream side by the protrusion (58). Further, in this board working system (10), the circuit boards (54) are conveyed at the same time after the clamping of the circuit boards (54) is released in a plurality of working machines (20). Thus, since the need for the upstream working machine (20) to wait for the conveyance of the circuit board (54) by the working machine (20) disposed at the downstream side is eliminated, a decrease in throughput can be prevented.
In order to make a component drop in a favorable manner from a probe after measurement of electrical properties, the present invention provides an inspection device that includes a pair of probes 34, 36, which can be made to approach and separate from each other and are capable of gripping a component to measure electrical properties, and an air supply device 73, which supplies air to at least one of a pair of mutually opposing surfaces 34f, 36f of the pair of probes 34, 36, wherein if air is supplied by the air supply device 73 to at least one opposing surface 36f, a component s that has adhered to at least opposing surface 36f can be made to drop in a favorable manner.
H05K 13/08 - Monitoring manufacture of assemblages
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
72.
WIRING FORMATION METHOD AND WIRING FORMATION DEVICE
With the wiring formation device and method according to the present invention, a first wiring 150 is formed on a circuit board 70 by means of a metal-containing liquid, and a resin layer 156 having a via-hole 152 that partially exposes the wiring is formed on the circuit board. In addition, a conductive metal lump 96 is placed in the via-hole. Then, a second wiring 160 is formed on the resin layer by means of a metal-containing liquid. In such a manner, in the wiring formation method according to the present invention, the first wiring and the second wiring are electrically connected when the conductive metal lump is placed in the via-hole. On the other hand, in a conventional wiring formation method, a first wiring and a second wiring are electrically connected when a metallic thin film is laminated inside a via-hole through baking of a metal-containing liquid. Thus, with the wiring formation method according to the present invention, since it is not necessary to form a lamination of a metallic thin film, improvement in throughput is achieved and deterioration of the resin layer can be prevented.
Provided is a component mounter in which an R-shaft driving mechanism (46), which causes a rotary head (14) to rotate around an R shaft (13), is constituted by: an R-shaft gear (42) that integrally rotates with the rotary head around the R shaft; and an R-shaft motor (48) that rotationally drives a driving gear (47) that is meshed with the R-shaft gear. The R-shaft gear is disposed on a lower surface side of the rotary head. The R shaft is fixed to a main frame (12) of a head unit (11) and the rotary head is rotatably supported by the R shaft via a bearing (15). The main frame (12) of the head unit (11) is provided with a head rotation supporting part (41) that rotatably supports an outer circumferential part of the rotary head via a bearing (40). The R-shaft motor is disposed at a position higher than the rotary head, towards the R shaft side.
A patient care robot (1) is provided with a base (10) and a pair of underarm side holding parts (65a, 65b) provided to the base (10) and capable of holding both underarm sides of a care recipient (M1), and the patient care robot (1) assists the care recipient (M1) with standing or sitting. The pair of underarm side holding parts (65a, 65b) is provided so that each underarm side holding part can turn about a support point (C) provided further toward the inside of the care recipient (M1) than at least a region (S) where the underarm sides of the care recipient (M1) are held.
Provided is an inspection device in which measurement accuracy for the electrical properties of a component is improved. This inspection device includes: a holding platform 32; a pair of probes 34, 36 that are capable of gripping a component s held by said holding platform 32 and measuring electrical properties; and a relative movement device that moves the holding platform 32 and the pair of probes 34, 36 relative to each other. In a state (b) in which the component s is clamped by the pair of probes 34, 36, the holding platform 32 is moved to separate the component s and the holding platform 32 by at least a set value, and electrical properties are measured in this measurement state (c). As a result, even if the holding platform 32 is produced using a conductive material, the influence on the component s can be reduced, and electrical properties can be measured accurately.
H05K 13/08 - Monitoring manufacture of assemblages
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
A printing device 20 that has a supply/replacement device 40 that is provided with: an air-supply part 42 that connects to a cartridge 50 and that supplies, to the cartridge 50, air that is for discharging a viscous fluid from the cartridge 50; a clamp part 43 that, when the air-supply part 42 is connected to the cartridge 50, fastens the cartridge 50 in a fastened position; and a supply head 41 that has the air-supply part 42 and the clamp part 43 provided thereto and that moves between a position at which the viscous fluid is discharged and a holder 30 at which a replacement cartridge 50 is located.
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
77.
MOUNTING DEVICE, PHOTOGRAPHIC PROCESSING METHOD, AND PHOTOGRAPHIC UNIT
A mounting device (11) photographs a reference mark (25) in a first photographing condition at a first position at which a mounting head (22) is held still, and photographs a component (60) in a second photographing condition. Next, the mounting device (11) photographs the reference mark (25) in the first photographing condition at a second position to which the mounting head (22) is moved and then held still, and photographs the component (60) in the second photographing condition. The mounting device (11) then generates, using a first image and a second image, a high-resolution image of the component (60) collected by the mounting head (22), on the basis of the positional relationship thereof with the reference mark (25).
A controller that is mounted on a component mounting machine for mounting electronic components on a circuit substrate, and that controls at least some operations of the component mounting machine, wherein: said controller is provided with a processor for executing a plurality of tasks, and a ring buffer for storing log information relating to the tasks executed by the processor; the ring buffer is divided into partial ring buffers, each of which stores log information relating to execution of one of the plurality of tasks by the processor; and the processor is configured to store log information relating to each task of the plurality of tasks in the corresponding one of the partial ring buffers on a per processing cycle basis.
In this solder printer, when a squeegee device 26 is moved while a recovery squeegee 88 is separated from a printing squeegee 82, cream solder 132 that is on a metal mask 40 is collected between the two squeegees. Then the collected cream solder is printed onto a circuit board 36. As a result, cream solder from places other than between the two squeegees can be printed onto the circuit board. In addition, when the recovery squeegee is brought into proximity with the printing squeegee and the squeegee device is moved while the two squeegees have cream solder collected therebetween, cream solder can be moved to an arbitrary position. As a result, cream solder from places other than between the two squeegees can be recovered. This solder printer can thereby eliminate the need to incorporate a solder supply device and can achieve a simplified structure.
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
80.
COMPONENT MOUNTING MACHINE AND COMPONENT MOUNTING ASSEMBLY LINE
The component mounting machine (1) according to the present invention is provided with: a machine base (9); a plurality of replaceably mounted component supply devices (3), each of which has a plurality of component supply units (feeder units 8); a component transfer device (4) which has a set reference level (H0) serving as a reference for raising and lowering a mounting nozzle (suction nozzle 46); a height storage unit (device control unit 38) which stores, for each component supply device, a specific height value (Heg) that is determined on the basis of the unit heights (HL, HC, HR) of the component supply units of the component supply device as measured when the component supply device is mounted in place; and a height correction control unit (control device 6) which, on the basis of the specific height value for the mounted component supply device, corrects the amount of downward stroke to be made by the mounting nozzle to pick up a component. Thus, the component pick-up operation of the mounting nozzle is controlled on the basis of the specific height value for each component supply device, making it possible to comprehensively accommodate errors in the height direction and thereby reliably pick up components.
A manufacturing device provided with an inkjet head 78 for discharging a curable resin containing a liquid-repellent component and being cured by light irradiation, and an irradiation device 86 for radiating light to the discharged curable resin, wherein the irradiation dose of light to the curable resin and/or the elapsed time from discharging of the curable resin until irradiation with light is calculated so that the impact diameter of droplets of the curable resin discharged by the inkjet head is uniform. Light is radiated to the discharged curable resin in accordance with the calculated irradiation dose and/or elapsed time. The impact diameter of the curable resin can thereby be made uniform, and the shaping precision of a formed object of the curable resin can be ensured.
In this component mounting device 10, if a rotary head 30 held by a head holder 54 is significantly misaligned with respect to a predetermined reference position, then a CPU 72 performs a process for dealing with this holding error. Examples of processes for dealing with such a holding error include causing the head holder 54 to release and then re-grasp the rotary head 30. If a component mounting process is performed with the rotary head 30 being significantly misaligned with respect to the predetermined reference position, then inaccurate mounting of the component may result. Therefore, the CPU 72 performs a process for handling the holding error, instead of performing a component mounting process.
Using a first Q-axis encoder (73) and a parts camera, the CPU of a mounting device acquires information that represents the correlation between a first rotation value (Eu) and a second rotation value (Qu) representing the rotation position of a component holding part (55). The first rotation value (Eu) corresponding to the second rotation value (Qu) at which a component is at a desired attitude (Pd*) (desired value (Qu*)) is calculated as the desired rotation value (Eu*) on the basis of the correlation information, as well as the component rotation value (Pu) and the second rotation value (Qu), which is acquired while the component is held by the component holding part (55). The component holding part (55) is caused to rotate so that the first rotation value (Eu) acquired by the first Q-axis encoder is equal to the desired rotation value (Eu*).
A non-contact power feeding apparatus (1) according to the present invention is provided with: a power receiving element (41) provided on a power-receiving side device (1B); a power receiving circuit (5) which converts AC power received by the power receiving element to generate a motive voltage (VM), outputs the motive voltage to a motive load, generates a control voltage (VC), and outputs the control voltage to a control load; a power feeding element (31) provided at a power-feeding side device (1A); an AC power source (2) which performs switching between an operation frequency used when driving the motive load and the control load and a stand-by frequency used when driving only the control load, and which supplies the AC power to the power feeding element; frequency sensing units (71, 72, 73) that sense a power receiving frequency of the AC power received by the power receiving element; and an motive power cutoff unit (73) that cuts off the output of the motive voltage when the power receiving frequency is changed from the operation frequency to the stand-by frequency. According to this configuration, when the power-receiving side device is temporarily shut down, the motive load is shut down but a non-contact power feeding is maintained to keep driving the control load, and thus the power-receiving side device can be promptly and smoothly restarted.
Provided is a cut and clinch device (10) in which a movable part (122) can slide with respect to a body part (120). The body part (120) is constituted by a body first part (147) and a body second part (148) that can be attached to and detached from the body first part (147). A first insertion hole (130) is formed in the body second part (148). In addition, the movable part (122) is constituted by a movable first part (144) and a movable second part (146) that can be attached to and detached from the movable first part (144). A second insertion hole (136) is formed in the movable second part (146). A lead is cut by the movable part (122) sliding in a state where the lead has been inserted into the first insertion hole (130) and the second insertion hole (136). In the thus-structured device, recognition marks (230) are provided on the movable second part (146) and the body second part (148) and the types of the movable second part (146) and the body second part (148) are recognized on the basis of image-captured data of the recognition marks (230). Due to this configuration, the type of part that cuts a lead can be properly checked.
This servomotor drive device is provided with: an encoder (12) for detecting the rotation of a servomotor (11); a servo amplifier (13) for feedback-controlling the rotation of the servomotor on the basis of a count value (hereafter referred to as "encoder value") of the encoder; and an amplifier control unit (17) for controlling the operation of the servo amplifier. When an error occurs in the encoder, the amplifier control unit transmits to the servo amplifier an initialization instruction for initializing the encoder, while the amplifier control unit is in a state of fixed-cycle connection with the servo amplifier via a servo network. Meanwhile, the servo amplifier, upon receiving the initialization instruction transmitted from the amplifier control unit, initializes the encoder without disconnecting the servo network.
This tape feeder (1) is configured in such a way that a component tape (10) wound on a tape reel (5) is unwound from the tape reel (5) by means of the rotation of a sprocket (41) having teeth which catch in successive feed holes (15) formed in the component tape (10), the component tape (10) comprising a top sheet (12) affixed to a carrier tape (11) in which components (18) are held, wherein a suction nozzle (25) is disposed below the carrier tape (11), and feed holes (15) passing over an opening portion (37) of the suction nozzle (25) serve as suction openings for sucking dust.
In a mounting machine according to the present invention, a measurement nozzle (120) is mounted on a mounting head. The measurement nozzle is provided with a body cylinder (62) and a suction tube (66) held by the body cylinder and is made to expand and contract through the movement of the body cylinder and suction tube in relation to each other using a force greater than or equal to a set load. In this mounting machine, the leading end position of the suction tube of the measurement nozzle mounted on the mounting head is measured. Next, the measurement nozzle is lowered so that the leading end of the suction tube comes into contact with a target part (electronic component (124)). Further, after the leading end of the suction tube is made to come into contact with the target part as a result of the lowering of the measurement nozzle, the leading end position of the suction tube is measured again, and from these two measurements, the height of the target part is calculated on the basis of the suction tube leading end position difference obtained from the two measurements. As a result, it is possible to appropriately measure the height of the target part.
According to the present invention, if a feeder receives an instruction to determine whether or not maintenance of the feeder is required, the feeder controls the drive of a drive motor by setting, as a reference voltage Vref of a pulse signal to be used to drive the drive motor, a low voltage Vlo that is lower than during mounting board production (S180), and if the drive motor does not experience a loss of synchronization, the feeder determines that maintenance is not required (S200), and if the drive motor experiences a loss of synchronization, the feeder determines that maintenance is required, and issues a maintenance notification to an operator (S210, S220). In this way it is possible to determine appropriately whether or not maintenance is required, before a feeder abnormality arises.
A component mounter (10), wherein disc parts (37) of adjacent nozzles (32) are spaced far enough apart so that a pressing roller (44) can pass therethrough vertically. It is therefore possible to make the disc parts (37) relatively small, and reduce the size of a rotary head (30). A horizontal protrusion (45) is of such size that when the pressing roller (44) is positioned between the disc parts (37) of adjacent nozzles (32), the horizontal protrusion (45) overlaps one or both of two annular protrusions (38) of the adjacent nozzles as viewed from above. Therefore, even if the power supply to a z-axis linear actuator (47) is cut and a raising/lowering member (42) unexpectedly loses support and falls when the pressing roller (44) is positioned above the gap between the disc parts (37) of adjacent nozzles (32), the horizontal protrusion (45) of the raising/lowering member (42) is received and stopped by the annular protrusion (38) of a nozzle (32).
A guide server (40) sets a movement path of a worker (M), on the basis of an installed position of mounting-associated process devices which are associated with a mounting process of mounting components upon substrates, the present position of the worker (M), and a path which the worker (M) is able to take in a work area (11), and outputs the set movement path to a projection device (36). The projection device (36) projects the movement path in the work area (11) as an image. The worker is thus able to move along the movement path which is projected in the work area (11) to a device whereat work has arisen.
G05B 19/418 - Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
H05K 13/00 - Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
The soldering device according to the present invention is provided with a detection sensor (128) that can detect the height of the liquid surface of molten solder within a solder tank (106). It is determined whether a detection height (H2), which is the height of the liquid surface of the molten solder detected by the detection sensor, is greater than or equal to a first set height (H1), which is set to an optional value. When doing so, if the detection height (H2) is greater than or equal to the first set height (H1), then it is estimated that there is enough molten solder stored in the solder tank to be able to perform soldering on a prescribed number of substrates or more (first estimation unit 160). By multiplying a horizontal direction area (S) of the solder tank by a difference (ΔH2=U) between the detection height (H2), which is the height of the liquid surface of the molten solder detected by the detection sensor (128), and a second set height (HMAX) set in advance, the amount of molten solder stored in the solder tank is estimated (second estimation unit 162). According to the present invention, it is possible to estimate the amount of stored molten solder by various methods.
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
The present invention relates to a work unit power supply device (power supply device 1 for a component supplying unit) which supplies power to a plurality of work units (component supplying units 81, 82, 83) which constitute a working device (component supplying device 93), wherein the work unit power supply device is provided with a first power supply line (41) from which the supply of power is suspended when emergency stop conditions are met, and a second power supply line (42) from which the supply of power is not suspended even if emergency stop conditions are met. The invention makes it possible for the first power supply line and the second power supply line to be used individually as appropriate in accordance with structural differences relating to the safety of each work unit. Thus, when emergency stop conditions are met, the invention makes it possible to reduce the recovery time after the cause of the emergency stop has been resolved, while ensuring the overall safety of the working device, configured from a plurality of work units.
A substrate inspection apparatus (1) of the present invention is provided with: a carrier transfer device (2), which carries in a carrier member (8) having placed thereon a plurality of divided substrates (85) on which a paste-like solder is to be printed and components are to be mounted, respectively, said carrier transfer device also aligning and carrying out the carrier member; a substrate lifting device (3) that lifts the divided substrates; and a planarity inspecting device (three-dimensional coplanarity inspection device 4), which inspects the planarity of the divided substrates that are lifted, and which determines whether the divided substrates can be used. Consequently, efficient inspection is performed since the divided substrates are sequentially lifted by means of the substrate lifting device, and the planarity can be sequentially inspected by means of the planarity inspecting device. Furthermore, since total inspection of the planarity of the divided substrates can be performed, qualities of the divided substrates are improved.
A component mounting apparatus (1) of the present invention is provided with: a die component supply device (3) having a fixing member (322) for fixing wafer holding members (36, 37) to a table (321), said wafer holding members holding a die component (D); and a component placing device (5) having a loading nozzle (51), a mounting head (52), and a head drive mechanism (54). The die component supply device also has: a height changing unit (323) for changing the supply height (HD) of the die component by lifting the table; and a supply height determining unit (48) that determines the supply height such that a wafer-side height (HW) is less than a head-side height (HH). Consequently, production efficiency of mounting steps can be improved, while preventing the loading nozzle, the mounting head and the like from interfering with obstacles, such as the fixing member, in accordance with differences among the structures of a plurality of kinds of wafer holding members.
This component mounting machine is configured in such a way that a substrate held by a substrate holding plate can be heated using a heater. The component mounting machine carries out a mounting step (S140 to S170) in which a component is mounted in a region N for mounting, the region N being within a mounting region of the substrate, and then carries out a pressure-application step (S210, S220) in which, while heat is being applied to the substrate, pressure is applied simultaneously by means of a pressure-application head to components P that have been mounted in the region N, wherein, while the pressure-application step is being carried out, the next mounting step of mounting components in the next region is carried out (S230, S240). In this way, by carrying out the pressure-application step and the mounting step in parallel, waiting times for each step in a cycle comprising the mounting step and the pressure-application step can be reduced, and the overall operating time can be shortened.
This mounting management device 80 manages a component mounting machine 10 which picks up components supplied from a feeder 40 and mounts the components on a substrate. An HDD of the mounting management device 80 stores a formula for calculating a novel production index including a recipe-based productivity of the component mounting machine 10, and downtime elements of the component mounting machine 10 (for example setup changeover time, component waiting time, maintenance time and device error time). A CPU of the mounting management device 80 calculates the novel production index, and displays the novel production index on a display 86, after the component mounting machine 10 has produced a prescribed number of a single type of substrate on which components have been mounted.
H05K 13/00 - Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
98.
METHOD FOR INSPECTING POSITIONING OF INSERT COMPONENT, METHOD FOR MOUNTING INSERT COMPONENT, DEVICE FOR INSPECTING POSITIONING OF INSERT COMPONENT, AND DEVICE FOR MOUNTING INSERT COMPONENT
When inspecting whether an insert component (41) provided with a protruding (42) part for positioning and an electrode part (45) for surface mounting can be mounted on a circuit substrate (43) provided with a land (46) for connecting the electrode part for surface mounting and with a positioning hole (44) into which the protruding part for positioning is inserted, images of the protruding part for positioning and the electrode part for surface mounting on the insert component are separately or simultaneously formed by a camera (16) for forming the image of a component, and the images thus formed are processed, whereby the position of the protruding part for positioning and the position of the electrode part for surface mounting are recognized. The positional offset between the electrode part for surface mounting on the insert component and the land of the circuit substrate is then calculated on the assumption that the protruding part for positioning on the insert component is inserted into the positioning hole of the circuit substrate, and it is inspected whether the insert component can be mounted on the circuit substrate by determining whether the positional offset is within an allowable range.
A management device (30) of this path data creation system (10) acquires movement data resulting from an operator (M) moving a mobile terminal (20) along a planned movement path of an automated guided vehicle (40), and uses the acquired movement data to create path data that indicates a movement path for the automated guided vehicle (40). For this reason, when creating the path data of a movement path, the mobile terminal (20) can be used, and the automated guided vehicle (40) need not necessarily be used, which can facilitate creation of movement data.
A substrate holding device 24 is provided with: a table 84 disposed below a substrate S; a lift mechanism 86 for lifting the table; supporting columns 126, each of which stands on the table, and has an upper end portion capable of being displaced in the vertical direction with respect to the table; elastic bodies 130 that apply a pressing force to the supporting columns, said pressing force being in the direction in which the upper end portions of the supporting columns are displaced upward; and a pair of stoppers 140 for locking both end portions of the substrate from above, said both end portions being in the width direction of the substrate. The substrate holding device brings up the substrate via the supporting columns by lifting the table, and locks both the end portions of the substrate to the pair of stoppers in a state wherein the upper end portions of the supporting columns are displaced downward against the pressing force of the elastic bodies, thereby applying to the substrate a holding force corresponding to the pressing force of the elastic bodies, and holding the substrate. The substrate holding device is configured such that the holding force to be applied to the substrate can be discretionary changed by controlling the lifting position of the table. The substrate can be held with a suitable holding force corresponding to the substrate.
patents
