The present invention provides a polishing pad obtained by a method in which, when a rugged pattern is transferred to a resin 50 using an intaglio plate 72, protrusions 51 of the resin 50 are less apt to fall off, the protrusions 51 having excellent strength. Disclosed is a polishing pad having a polishing layer 11 comprising protrusions 51 and a base 52 provided beneath the protrusions 51. The polishing pad is characterized in that the protrusions 51 and the base 52 were of the polishing layer 11 have been integrally molded from the same resin 50 and that the base 52 has a fibrous material 6 embedded therein.
B24B 37/24 - Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
B24B 37/22 - Lapping pads for working plane surfaces characterised by a multi-layered structure
B24B 37/26 - Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
B29C 33/42 - SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING - Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
B29C 39/10 - Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
B29C 70/42 - Shaping or impregnating by compression for producing articles of definite length, i.e. discrete articles
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
The present invention provides a method for producing a polishing pad, wherein, when a rugged pattern is transferred onto a resin using an intaglio plate, the resin can be easily peeled at low cost. Disclosed is a method for producing a polishing pad having a polishing layer obtained by curing a resin, the method comprising: a step for preparing a plastic intaglio plate having a textured pattern formed by vacuum molding or injection molding; a step for pouring a resin material onto the plastic intaglio plate; a step for curing the resin; and a step for peeling the cured resin from the plastic intaglio plate to obtain the polishing layer.
B29C 39/10 - Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
B24B 37/24 - Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
B24B 37/26 - Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
B29C 33/38 - SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING - Details thereof or accessories therefor characterised by the material or the manufacturing process
B29C 33/42 - SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING - Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
B29C 33/60 - Releasing, lubricating or separating agents
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
3.
POLISHING PAD AND METHOD FOR MANUFACTURING POLISHING PAD
This polishing pad has a polishing layer that comprises a polyurethane resin foam derived from an isocyanate-terminated prepolymer and a curing agent, wherein: the distance between hard segments in the polishing layer as measured by small-angle X-ray scattering is 9.5 nm or less; or the ratio (NC80/CC80) of the content proportion by weight (NC80) of an amorphous phase in the polishing layer as measured by pulse NMR at 80° C. to the content proportion by weight (CC80) of a crystalline phase in the polishing layer as measured by pulse NMR at 80° C. is 2.6-3.1, and the ratio (NC40/CC40) of the content proportion by weight (NC40) of an amorphous phase in the polishing layer as measured by pulse NMR at 40° C. to the content proportion by weight (CC40) of a crystalline phase in the polishing layer as measured by pulse NMR at 40° C. is 0.5-0.9.
Provided is a polishing pad comprising a polishing layer made of a polyurethane resin foam containing an isocyanate-terminated prepolymer, and a curing agent, wherein the ratio (NC80/NC40) of a weight proportion (NC80) of an amorphous phase content in the polishing layer measured at 80° C. by a pulsed NMR method to a weight proportion (NC40) of the amorphous phase content in the polishing layer measured at 40° C. by the pulsed NMR method is between 1.5 and 2.5.
A polishing pad including a polyurethane sheet as a polishing layer, wherein the polyurethane sheet has a ratio (E′B40/E′T40) of a storage elastic modulus E′B40 at 40° C. in dynamic viscoelasticity measurement performed under a bending mode condition with a frequency of 1.6 Hz to a storage elastic modulus E′T40 at 40° C. in dynamic viscoelasticity measurement performed under a tension mode condition with a frequency of 1.6 Hz of 0.60 to 1.60.
A polishing pad comprising a polishing layer that has a polishing surface for performing a polishing process on an item to be polished, wherein the polishing layer includes hollow microspheres that form hollow bodies within the polishing layer, a cross-section of the polishing layer has an average pore diameter of 10-14 μm, and in a histogram of pore diameters in a cross-section of the polishing layer where the bin width is 1 μm, the sum of pores that are 25 μm or greater is 5% or less with respect to the total number of pores in the cross-section, and the sum of the areas of the pores in each bin that is 25 μm or greater is 20% or less with respect to the total area of the pores in the cross-section.
B24B 37/24 - Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
B24D 3/00 - Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
7.
POLISHING PAD AND METHOD FOR MANUFACTURING POLISHING PAD
The present invention provides a polishing pad that can suppress variations in light transmittance or a polishing pad that can reduce adhesion and sticking of polishing swarf to the surface on the polishing surface side of the light-transmitting resin member (window member).
The present invention relates to a polishing pad including a polishing layer and a cushion layer, wherein a ratio E′B40/E′C40 of a storage elastic modulus at 40° C. in dynamic viscoelasticity measurement performed under a bending mode condition with a dry state, a frequency of 10 rad/s, and 20 to 100° C., E′B40, to a storage elastic modulus at 40° C. in dynamic viscoelasticity measurement performed under a compression mode condition with a dry state, a frequency of 10 rad/s, and 20 to 100° C., E′C40, is 3.0 or more and 15.0 or less, and a loss factor tan δ in the dynamic viscoelasticity measurement performed under the bending mode condition is 0.10 or more and 0.30 or less in a range of 40° C. or more and 70° C. or less.
A polishing pad contains: a polishing layer having a polishing surface for polishing a workpiece; and a cushion layer disposed on the side of the polishing layer opposite from the polishing surface. With regard to the ratio (tanδ) of the storage elastic modulus E′ to the loss elastic modulus E″ of the whole polishing pad, as obtained through dynamic viscoelasticity measurement using frequency dispersion (25° C.) in a bending mode, the ratio of the maximum value of tanδ measured at 100-1000 rad/s (tanδmax100-100) to the maximum value of tanδ measured at 1 to 10 rad/s (tanδmax1-10) is 0.75 to 1.30.
The purpose of the present invention is to provide a polishing pad capable of inhibiting the occurrence of scratches, a method for producing the polishing pad, and a method for polishing the surface of an optical material or semiconductor material using the polishing pad. The polishing pad has a polishing layer containing microspheres, wherein: open holes are present on the surface of the polishing layer; on a distribution curve of the open-hole diameter obtained by using, as a reference, the number fraction thereof on the surface of the polishing layer, the peak top is present in a range in which the open-hole diameter is 15 μm or less; and the number fraction of the open holes at the peak top is 15% or more.
A polishing pad having a polishing layer and an endpoint detection window provided to an opening in the polishing layer, the polishing pad being such that, in measurement of dynamic viscoelasticity in an elongation mode at a frequency of 1.6 Hz and a temperature of 30-55°C in a submerged state, the ratio (E'p40/E'w40) of the storage elastic modulus E'p40 of the polishing layer at 40°C to the storage elastic modulus E'w40 of the endpoint detection window at 40°C is 0.70-3.00.
B24B 37/24 - Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
B24B 37/013 - Devices or means for detecting lapping completion
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
12.
POLISHING PAD, POLISHING UNIT, POLISHING DEVICE, AND METHOD FOR MANUFACTURING POLISHING PAD
Provided is a polishing unit that can reduce penetration of a polishing slurry into a base material layer and that can prevent impairment in polishing performance. A polishing unit (10a) in accordance with a first aspect of the present invention includes: a polishing pad (100a) that includes a polishing layer (101) and a base material layer (103); and a surface plate (150), the base material layer (103) having a diameter smaller than a diameter of the polishing layer (101) and greater than a diameter of the surface plate (150).
A polishing layer having an endpoint detection window is manufactured in the following manner. First, a curing agent and a polymer which form the endpoint detection window are mixed, and then the mixture is poured into a mold to form a columnar material. Next, the roughness of the outer peripheral surface of the columnar material is adjusted, and a plurality of projections and recesses are formed on the outer peripheral surface. Next, in a state where the columnar material is housed in a mold frame, the mixture obtained by mixing the polymer and the curing agent is poured into the mold frame and solidified to create a polyurethane polyurea resin molded article. Next, the polyurethane polyurea resin molded article is horizontally cut with a necessary thickness so as to form a sheet-like member, and the sheet-like member forms a polishing layer having the endpoint detection window.
Provided is a polishing pad comprising a polishing layer made of a polyurethane resin foam containing an isocyanate-terminated prepolymer, and a curing agent, wherein the ratio (NC80/NC40) of a weight proportion (NC80) of an amorphous phase content in the polishing layer measured at 80℃ by a pulsed NMR method to a weight proportion (NC40) of the amorphous phase content in the polishing layer measured at 40℃ by the pulsed NMR method is between 1.5 and 2.5.
B24B 37/24 - Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
C08G 18/00 - Polymeric products of isocyanates or isothiocyanates
C08G 18/10 - Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
C08G 18/12 - Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
A polishing pad comprising a polishing layer that has a polishing surface for performing a polishing process on an item to be polished, wherein the polishing layer includes hollow microspheres that form hollow bodies within the polishing layer, a cross-section of the polishing layer has an average pore diameter of 10-14 μm, and in a histogram of pore diameters in a cross-section of the polishing layer where the bin width is 1 μm, the sum of pores that are 25 μm or greater is 5% or less with respect to the total number of pores in the cross-section, and the sum of the areas of the pores in each bin that is 25 μm or greater is 20% or less with respect to the total area of the pores in the cross-section.
This polishing pad has a polishing layer that comprises an isocyanate-terminated prepolymer and a polyurethane resin foam derived from a curing agent, wherein: the distance between hard segments in the polishing layer as measured by small-angle X-ray scattering is 9.5 nm or less; or the ratio (NC80/CC80) of the content proportion by weight (NC80) of an amorphous phase in the polishing layer as measured by pulse NMR at 80°C to the content proportion by weight (CC80) of a crystalline phase in the polishing layer as measured by pulse NMR at 80°C is 2.6–3.1, and the ratio (NC40/CC40) of the content proportion by weight (NC80) of an amorphous phase in the polishing layer as measured by pulse NMR at 40°C to the content proportion by weight (CC80) of a crystalline phase in the polishing layer as measured by pulse NMR at 40°C is 0.5–0.9.
B24B 37/24 - Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
C08G 18/12 - Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
The present invention can prevent a decrease in the accuracy of stopping point detection in which a window for stopping point detection is used, while also suppressing influence on polishing performance. A polishing pad 3 comprises a window 12 for stopping point detection, through which an inspection light L1 can pass. A plurality of concentric circle-shaped annular grooves 11 are formed in a polishing surface 3A of the polishing pad. A surface of the window 12 for stopping point detection is formed at the same height as the polishing surface 3A, and among the annular grooves 11, a plurality of annular grooves 11A that are formed in the same radial location as the location where the window 12 for stopping point detection is formed comprise end sections 11a near the window 12 for stopping point detection, said grooves not being formed in the surface of the window 12 for stopping point detection. Furthermore, the end sections 11a of the plurality of annular gooves 11A that are formed in the same radial location as the window 12 for stopping point detection are connected to one another by linking grooves 13.
Provided is a method for manufacturing a polishing pad that comprises a polishing layer having an endpoint detection window, the method including: a curing step for fixing an endpoint detection window member inside of a die, and curing a curable resin that is in contact with the endpoint detection window member so as to form a resin sheet in which the endpoint detection window member is incorporated; and a slicing step for slicing the resin sheet so as to form the polishing layer. In the curing step, the endpoint detection window member is fixed so as to be suspended from a position fixation jig which is installed on top of the die.
The purpose of the present invention is to provide: a polishing pad which uses, as a high-molecular-weight polyol of an isocyanate-terminated urethane prepolymer, a polyol that is different from conventionally used PTMG or the like, said polyol forming a polishing layer; a method for producing this polishing pad; and a method for polishing the surface of an optical material or semiconductor material, said method using this polishing pad. A polishing pad which has a polishing layer that contains a polyurethane resin, wherein: the polyurethane resin is a cured product of a curable resin composition that contains an isocyanate-terminated urethane prepolymer and a curing agent; the isocyanate-terminated urethane prepolymer is a reaction product of a polyol component and a polyisocyanate component; and the polyol component contains a polyol that has a carbonate group in each molecule.
C08G 18/76 - Polyisocyanates or polyisothiocyanates cyclic aromatic
C08J 5/14 - Manufacture of abrasive or friction articles or materials
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
22.
POLISHING PAD, PRODUCTION METHOD THEREFOR, PRODUCTION METHOD FOR POLISHED ARTICLE, LAPPING PAD, PRODUCTION METHOD THEREFOR, AND PRODUCTION METHOD FOR LAPPED ARTICLE
The present invention provides, for example, a polishing pad which is capable of providing favorable flatness to a polishing target article, and which has excellent affinity to a slurry. Provided is, for example, a polishing pad comprising a resin sheet that has pores, wherein in the pore distribution of the resin sheet, as measured by mercury intrusion with a contact angle of 130° and a mercury surface tension of 485 dyn/cm, the cumulative pore volume V in the pore diameter range of 0.010-1.0 μm is 0.21-1.00 cm3/g, and the density of the resin sheet is 0.3-0.9 g/cm3.
B24B 37/24 - Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
C08J 5/14 - Manufacture of abrasive or friction articles or materials
C08J 9/02 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by the reacting monomers or modifying agents during the preparation or modification of macromolecules
C08J 9/04 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
23.
POLISHING PAD AND METHOD FOR MANUFACTURING POLISHING PAD
According to the present invention, there is provided a polishing pad in which it is possible to suppress variation in optical transmittance, or a polishing pad in which it is possible to reduce adhesion and bonding of a polishing layer to the polishing-surface-side surface of a translucent resin member (window member).
B40C40B40C40C40 being a storage elastic modulus at 40℃ in a dynamic viscoelasticity measurement performed under a compression mode condition with a 10 rad/s frequency and a 20-100℃ temperature in a dried state; and a loss coefficient tanδ in a dynamic viscoelasticity measurement performed under the bending mode condition is 0.10 to 0.30 inclusive within a range of 40-70℃.
An object is to provide a polishing pad that can reduce generation of scratches, and a method for producing a polished product. A polishing pad including a polyurethane sheet as a polishing layer, wherein the polyurethane sheet exhibits a peak of loss tangent tan δ in the range from 40 to 60° C. in dynamic viscoelasticity measurement performed under conditions of a frequency of 1.6 Hz and a temperature of 20 to 100° C. in a water immersion condition.
Provided is a polishing unit with which it is possible to reduce permeation of a polishing slurry into a substrate layer and to prevent reductions in polishing performance. A polishing unit (10a) according to a first aspect of the present invention comprises a polishing pad (100a) having a polishing layer (101) and a substrate layer (103), and a surface plate (150), the diameter of the substrate layer (103) being less than the diameter of the polishing layer (101) and being greater than the diameter of the surface plate (150).
B24B 37/22 - Lapping pads for working plane surfaces characterised by a multi-layered structure
B24B 37/10 - Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
B24B 37/12 - Lapping plates for working plane surfaces
B24B 37/24 - Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
B32B 5/24 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer
dry represents the peak value of the loss tangent tan δ, of the polyurethane sheet in a dry state without being immersed in water, within a temperature range of 20-100° C. in a tensile mode under an initial load of 148 g with a strain range of 0.1% at a measurement frequency of 1.6 Hz.
The present invention prevents detachment of an endpoint detection window from a polishing layer during polishing of an article being polished. A polishing layer 3C having an endpoint detection window 3B is manufactured in the following manner. First, a curing agent and a polymer which form the endpoint detection window are mixed, and then the mixture is poured into a mold 99 to form a columnar material 100 (FIG. 4(a)). Next, the roughness of the outer peripheral surface of the columnar material 100 is adjusted, and a plurality of projections and recesses are formed on the outer peripheral surface (FIG. 4(b)). Next, in a state where the columnar material 100 is housed in a mold frame 101, the mixture obtained by mixing the polymer and the curing agent is poured into the mold frame 101 and solidified to create a polyurethane polyurea resin molded article 102 (FIG. 4(c)). Next, the polyurethane polyurea resin molded article 102 is horizontally cut with a necessary thickness so as to form a sheet-like member 103, and the sheet-like member 103 forms a polishing layer (3C) having the endpoint detection window 3B (FIG. 4(d)).
B24B 37/013 - Devices or means for detecting lapping completion
B24B 37/24 - Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
B24B 49/04 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
B24B 49/16 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
C08L 33/02 - Homopolymers or copolymers of acids; Metal or ammonium salts thereof
31.
Polishing pad and method for producing the same, and method for producing polished product
A polishing pad comprising a knitted fabric constituted by warp knitting or weft knitting, and a resin with which the knitted fabric is impregnated, and having a cross section cut in a surface direction of the knitted fabric, as a polishing surface.
D04B 1/12 - Patterned fabrics or articles characterised by thread material
D04B 1/22 - Weft knitting processes for the production of fabrics or articles not dependent on the use of particular machines; Fabrics or articles defined by such processes specially adapted for knitting goods of particular configuration
D06M 13/127 - Mono-aldehydes, e.g. formaldehyde; Monoketones
D06M 15/564 - Polyureas, polyurethanes or other polymers having ureide or urethane links; Precondensation products forming them
D06M 23/10 - Processes in which the treating agent is dissolved or dispersed in organic solvents; Processes for the recovery of organic solvents thereof
B24B 37/04 - Lapping machines or devices; Accessories designed for working plane surfaces
A polishing pad includes: a polishing layer having a polyurethane sheet containing substantially spherical cells, wherein E′(90%)/E′(30%) falls within a range of 0.4 to 0.7, where E′(90%) represents a storage modulus of the polyurethane sheet that has been exposed to an environment with a temperature of 23° C. and a relative humidity of 90%, as measured in a tension mode at 40° C. with an initial load of 148 g, a strain range of 0.1%, and a measurement frequency of 1.6 Hz, and E′(30%) represents a storage modulus of the polyurethane sheet that has been exposed to an environment with a temperature of 23° C. and a relative humidity of 30%, as measured in a tension mode at 40° C. with an initial load of 148 g, a strain range of 0.1%, and a measurement frequency of 1.6 Hz. Also provided is a method for manufacturing the polishing pad.
The purpose of the present invention is to provide: a polishing pad which is capable of reducing the occurrence of scratches; and a method for producing a polished article. A polishing pad which is provided with a polyurethane sheet as a polishing layer, and which is configured such that the polyurethane sheet has a loss tangent (tan δ) peak within the range of 40-60°C in a submerged state in a dynamic viscoelasticity measurement performed at a frequency of 1.6 Hz at 20-100°C.
The purpose of the present invention is to provide a polishing pad that minimizes defects in a polished object, is capable of achieving a flat topography, and exhibits excellent defect performance and topography performance. Provided is a polishing pad having a polishing layer that contains a polyurethane resin, wherein: the polyurethane resin is a cured product of a curable resin composition comprising an isocyanate-terminated urethane prepolymer and a curing agent; the isocyanate-terminated urethane prepolymer is a reaction product between a polyisocyanate component and a polyol component containing a glycol having a molecular weight of 50-300; and the content of the glycol is more than 0 wt% but less than 5 wt% with respect to the total amount of the isocyanate-terminated urethane prepolymer.
wetdrydrywetdrydry represents the peak value of the loss tangent tanδ, of the polyurethane sheet in a dry state without being immersed in water, within a temperature range of 20-100°C in a tensile mode under an initial load of 148 g with a strain range of 0.1% at a measurement frequency of 1.6 Hz.
The objective of the present invention is to provide a polishing pad with which it is possible to reduce the occurrence of scratches while maintaining a high polishing rate, and a method for manufacturing the same. This polishing pad is provided with a polishing layer including a polyurethane sheet containing substantially spherical bubbles, wherein E'(90%)/E'(30%) lies in a range of 0.4 to 0.7, where E'(90%) is the storage modulus of the polyurethane sheet in a tension mode at 40°C, with an initial load of 148 g, a strain range of 0.1% and a measuring frequency of 1.6 Hz, when the polyurethane sheet has been exposed in an environment at a temperature of 23°C and a relative humidity of 30%, and E'(30%) is the storage modulus of the polyurethane sheet in a tension mode at 40°C, with an initial load of 148 g, a strain range of 0.1% and a measuring frequency of 1.6 Hz, when the polyurethane sheet has been exposed in an environment at a temperature of 23°C and a relative humidity of 30%.
17 - Rubber and plastic; packing and insulating materials
24 - Textiles and textile goods
Goods & Services
Polyester core material, namely, polyester polymer sheets for use in the manufacture of bags and luggage Woven fabrics; knitted fabrics; felt and non-woven textile fabrics; oilcloth; gummed waterproof cloth; vinyl coated cloth; rubberized cloth; filtering materials of textile; woven textile goods being woven fabrics and synthetic woven fiber fabrics of nylon for personal use; mosquito nets; bedsheets; futon quilts; quilt covers for futons; futon ticks, namely, unstuffed futon covers not of paper; pillowcases; blankets, namely, lap blankets; table napkins of textile
17 - Rubber and plastic; packing and insulating materials
24 - Textiles and textile goods
Goods & Services
Polyester core material, namely, polyester sheets for use in the manufacture of bags and luggage Woven fabrics; knitted fabrics; felt and non-woven textile fabrics; oilcloth; gummed waterproof cloth; vinyl coated cloth; rubberized cloth; filtering materials of textile; woven textile goods being woven fabrics and fibers of nylon for personal use; mosquito nets; bedsheets; futon quilts; quilt covers for futons; Futon ticks, namely, unstuffed futon covers not of paper; pillowcases; blankets, namely, lap blankets; table napkins of textile
42.
POLISHING PAD, METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING POLISHED ARTICLE
A polishing pad which is provided with a base material and a resin part that is arranged on the base material, and which is configured such that: the resin part constitutes a recessed and projected pattern by itself or together with the base material; the recessed and projected pattern has a plurality of arranged projections that have polishing surfaces; the total area of the polishing surfaces when a polishing pressure of 500 g/cm2 is applied to the projections is 0.05-0.8 cm2 per unit area (1 cm2) of the base material surface; and the angle θ between the inclined side and the base side of each projection is 5-60°.
B24B 37/24 - Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
B24D 3/00 - Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
The purpose of the present invention is to provide: a polishing pad capable of maintaining a stable polishing rate due to having a proper disintegration property; a manufacturing method thereof; and a method for manufacturing a polished product by using the polishing pad. According to the present invention, the polishing pad 10 is provided with a substrate 12, and a resin part 11 disposed on the substrate, wherein the resin part has a rosin-based compound and fixed abrasive particles 13 contributing to polishing of a material to be polished.
Provided is a polishing pad having a knit fabric configured from a warp and a weft, and a resin with which the knit fabric is impregnated, the polishing pad having a cross-section cut along the direction of the surface of the knit fabric as a polishing surface.
Provided is a polishing pad capable of sufficiently reducing minute defects to be generated after polishing on a workpiece which are detected in measurement for a particle size of 26 nm or smaller and capable of providing the workpiece with excellent surface flatness. The polishing pad includes a polishing layer having a polishing surface to polish a workpiece, and includes, in the side opposite to the polishing surface of the polishing layer, an intermediate layer having an amount of deformation C larger than that of the polishing layer, a hard layer having an amount of deformation C smaller than that of the polishing layer, and a cushion layer having an amount of deformation C larger than that of the intermediate layer, in which each of the amounts of deformations C is defined as an amount of deformation in the case of compression in a thickness direction, and the intermediate layer, the hard layer, and the cushion layer are laminated in this order from the side of the polishing layer.
B24B 7/22 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
B24B 37/22 - Lapping pads for working plane surfaces characterised by a multi-layered structure
B24B 37/24 - Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
B24B 37/26 - Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
47.
WRAPPING MATERIAL AND METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING ABRASIVE
Provided is a polishing pad which is capable of providing a high flatness to a polishing workpiece and suppressing the formation of scratches, and a method therefor. The polishing pad comprises a foamed urethane sheet on the surface which includes closed cells and open cells and which satisfies the following requirements: (1) an open cell ratio is 20-80 vol % where the total volume of closed cells and open cells is taken as 100 vol %, (2) the ratio [tan δ (wet/dry) ratio] of a loss factor tan δ in a water-absorption state to that in a dry state is 1.3-1.7, the loss factors being measured according to JIS K7244-4 with an initial load of 20 g at a measuring frequency of 1 Hz at a temperature of 26° C. in a tensile mode over a strain range from 0.01 to 0.1%, and (3) the Shore DO hardness according to ASTM D2240 is 60-80.
C08G 18/76 - Polyisocyanates or polyisothiocyanates cyclic aromatic
C08G 18/12 - Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
A polishing pad comprising a resin-containing polishing cloth having a polishing cloth base impregnated with a polyurethane resin and silicon carbide, wherein the silicon carbide has a particle diameter in a range from 0.2 to 3.0 μm, and the content of the silicon carbide in the resin-containing polishing cloth is in a range from 60 to 500 parts by mass relative to 100 parts by mass of the polishing cloth base.
B24B 37/24 - Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/322 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to modify their internal properties, e.g. to produce internal imperfections
The present invention provides a polishing pad with which it is possible to improve polishing accuracy and minimize polishing unevenness when the surface of a to-be-polished object of varying thickness is polished. A polishing pad (1) is formed by bonding at least two sheets together, the two sheets being a lower layer sheet (5) and an upper layer sheet (3) having a polishing surface (9). The thickness of the upper layer sheet is 1.0-2.0 mm, the Shore A hardness of the polishing surface (9) is 20-90, and the hardness at 25% compression as measured using a 10-mm indenter with respect to the entire polishing pad (1) is 0.35 MPa.
Provided is a polishing pad which is capable of achieving sufficient polishing accuracy if used for mirror finish polishing. This polishing pad 1 is obtained by bonding a polishing film 9 to the outer circumferential surface of a circular disk-shaped center base 7, and is characterized in that the polishing film 9 is formed by a wet film forming method. This polishing pad 1 having the above-described configuration enables the achievement of a polishing pad wherein a polishing film 9 formed by a wet film forming method is bonded on the outer circumference. By performing finish polishing with use of the polishing film 9 formed by a wet film forming method, a product which is reduced in distortion of reflected light and scratches, while having a stable shape can be obtained.
B24B 29/00 - Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
This polishing brush (4) has many separate protruding parts (4b) and a support section (4a) on which the protruding parts (4b) are fixed, said protruding parts (4b) and support section (4a) being integrally formed from the same flexible material. Furthermore, side surfaces of the protruding parts (4b) have multiple apertures, the ratio of aperture coverage being 10-70%. Also, the ratio (h/r) between the height (h) of a protruding part and the radius (r) of a circumscribed circle in a cross section of the base part of the protruding part is 1.0-5.0. Consequently, when polishing an object to be polished (1), the side surfaces of the protruding parts are pressed against the object to be polished (1), and the object can be polished by means of a slurry which is held in the apertures formed on the side surfaces of the protruding parts. Not only are the protruding parts (4b) not liable to fall off, but polishing can be carried out with the slurry being securely held in the side surfaces of the protruding parts (4b).
The present invention provides a holder for a polishing device which prevents a polishing pad from being damaged while also suppressing sagging of an edge of an object to be polished and detachment thereof, and which also prevents a frame member from being peeled off. A holder (13) includes a holder pad (15) formed of a foamed polyurethane containing a large number of pores (19) thereinside, and an annular frame member (17) that encircles a holding surface of the holder pad (15) along the perimeter of the holding surface. The holder pad (15) includes a step (21) formed by cutting the perimeter of the holding surface by a predetermined depth. The frame member (17) is bonded to the holder pad (15) on the horizontal plane of the step (21), and is fastened to the holder pad (15) in such a way that the inner perimeter surface faces a vertical face of the step (21).
KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION (Japan)
FUJIBO HOLDINGS, INC. (Japan)
Inventor
Doi, Toshiro
Seshimo, Kiyoshi
Takagi, Masataka
Kashiwada, Hiroshi
Abstract
The present invention provides a polishing pad including a polishing member having a polishing surface, wherein the polishing member contains a material having dilatancy characteristics.
Provided is a polishing pad whereby minute defects to be detected after polishing a subject to be polished can be sufficiently reduced in the cases where measurement with a particle size equal to or smaller than 26 nm is performed, and excellent surface planarity of the subject can be achieved. The polishing pad is provided with: a polishing layer (110) having a polishing surface for polishing a subject to be polished; an intermediate layer (120), which is provided on the reverse side of the polishing surface of the polishing layer, and which has a larger deformation amount (C) than that of the polishing layer when the intermediate layer is compressed in the thickness direction; a hard layer (130) having the deformation amount (C) that is smaller than that of the polishing layer; and a cushion layer (140) having the deformation amount (C) that is larger than that of the intermediate layer. The polishing layer, the intermediate layer, the hard layer, and the cushion layer are laminated in this order from the side close to the polishing layer.
This abrasive pad (13) is used to abrade a convex curving surface portion (1a) of an abraded article (1) having a convex curving surface portion, wherein the abrasive pad is characterized in that an annular concave abrading portion (13a) for contacting the convex curving surface portion of the abraded article while driven to rotate in the circumferential direction about an axis at the center of the circle of a disk is arranged on the side surface of a disk-shaped elastic body having thickness, the compressive stress of the elastic body constituting the annular concave abrading portion being in the range of 50-150 gf/cm2 at 0.1 mm compression, and the ratio of compressive stress (compressive stress at 0.5 mm compression/compressive stress at 0.1 mm compressive stress) being in the range of 5-30. The convex curving surface portion of the abraded article can thus be abraded to a mirror finish with high accuracy.
Provided are: a polishing pad with which an object to be polished can have high flatness imparted thereto and can be inhibited from having scratches; and a process for producing the polishing pad. The polishing pad includes, in a surface thereof, a foamed urethane sheet having closed cells and open cells, the foamed urethane sheet being configured so as to satisfy the following requirements (1) to (3): (1) to have an open cell proportion (proportion of the volume of the open cells to the total volume, which is taken as 100 vol%, of the closed cells and the open cells) of 20-80 vol%; (2) to have a ratio of the loss coefficient tanδ in a water-holding state to the loss coefficient tanδ in a dry state, tanδ(wet/dry) ratio, of 1.3-1.7 when examined in accordance with JIS K7244-4 (initial load, 20 g; measurement frequency, 1 Hz; temperature, 26°C; tensile mode; strain range, 0.01-0.1%); and (3) to have a Shore DO hardness of 60-80 when examined in accordance with ASTM D2240.
The purpose of the present invention is to provide a polishing pad, which reduces the problem of polishing scratches that occur due to foreign matter during polishing and which has excellent polishing rate and flattening properties, and a manufacturing method therefor. The polishing pad is provided with a polishing layer with a polyurethane resin sheet comprising roughly spherical air bubbles, and in the polishing pad: the polyurethane resin sheet has a thermal conductivity of not more than 0.10 W/(m∙k); the ratio of the loss modulus with respect to the storage modulus for the polyurethane resin sheet in a tensile mode at 45°C, 200 g initial load, 0.1-05% strain range, and 1.6 Hz measurement frequency is in the range of 0.130-0.270; and the compressive elastic modulus of the polyurethane resin sheet is 60-100%.
B24B 37/20 - Lapping pads for working plane surfaces
B24B 37/14 - Lapping plates for working plane surfaces characterised by the composition or properties of the plate materials
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
B24B 37/24 - Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 29/16 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System in uncombined form
A holding pad which is provided with a polyurethane resin sheet having a holding surface for holding an object to be polished. The storage modulus (E') of the polyurethane resin sheet at 40°C is 0.3-2.0 MPa, and the water absorption of the polyurethane resin sheet is 95-200 mg/50.3 cm2.
A polishing pad provided with a plastic sheet, wherein after a prescribed polishing test, the polishing surface of the sheet has a roughness curve skewness (Rsk) of -2.00 to -0.20, and a height distribution variation coefficient of 0.5-2.5 %.
Provided are a method for producing a finish polishing pad and the polishing pad which allow formation of a stable film and enables polishing with fewer polishing scratches. The method includes the steps of: dissolving a composition for forming polyurethane resin film containing a polyurethane resin and an additive(s) in a solvent capable of dissolving the resin; removing an insoluble component(s) to make the content of the insoluble component(s) in the solution less than 1% by mass relative to the total mass of the composition; adding a poor solvent to the solution from which the insoluble component(s) has(have) been removed, followed by mixing, the amount of the poor solvent added being calculated according to a defined Formula 1; and forming a film from the mixture solution on the film formation substrate by a wet coagulation method, to thereby form the polyurethane resin film.
B24B 1/00 - Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
B24D 3/00 - Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
B24B 37/24 - Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
A polishing pad including a resin-containing polishing cloth obtained by impregnating a polishing cloth base with a polyurethane resin and silicon carbide, wherein the silicon carbide has a grain diameter within a range of 0.2 to 3.0 μm, and the amount of the silicon carbide contained in the resin-containing polishing cloth is within a range of 60-500 mass parts in relation to 100 mass parts of the polishing cloth base.
Provided is a polishing pad, which is capable of limiting reductions in polishing pad polishing rate by limiting clogging of the polishing surface, and which is also long-lived. The donut-shaped polishing pad (7), which is equipped with a round polishing surface (9) and the center of which has been hollowed out as a circle, is equipped with multiple circular grooves (19) formed on the polishing surface (9). Each circular groove (19) is disposed so as to form a perfect circle and to contact the circumference of the round polishing surface (9). When the radius of the circle forming the polishing surface (9) is defined as (R), the radius of the circle of the hollowed-out center as (r) and the diameter of the circular grooves (19) as (X), the relationship (R)-(r) ≤ (X) ≤ (R) holds true.
KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION (Japan)
FUJIBO HOLDINGS, INC. (Japan)
Inventor
Doi, Toshiro
Seshimo, Kiyoshi
Takagi, Masataka
Kashiwada, Hiroshi
Abstract
The present invention provides a polishing pad provided with a polishing member having a polishing surface, the polishing member containing a material having dilatancy characteristics.
The present invention provides a film for lid materials, which enables the formation of a drug-housing container that can accurately discharge and supply a predetermined amount of a drug housed in a housing section. The film for lid materials according to the present invention is a film (A) for lid materials which can be used for closing an opening of a housing section (4) in a drug-housing member (B) equipped with the housing section (4), wherein the housing section (4) can house a drug therein and a discharge port (42), through which the drug can be discharged upon the application of a stress, can be formed in the housing section (4). The film (A) for lid materials is characterized by being provided with: a surface layer (2); and a closing layer (1) which is laminated peelably on the surface layer (2), comprises a polyolefin resin, is integrated with the drug-housing member (B) so as to close the opening of the housing section (4), and is so adapted that, after the peeling of the surface layer (2), a pressure can be applied to the inside of the housing section (4) by the action of a pressing force applied and the drug housed in the housing section (4) can be discharged through the discharge port (42), which is formed in the housing section (4) by the action of the stress, by the action of the pressure.
G01N 35/02 - Automatic analysis not limited to methods or materials provided for in any single one of groups ; Handling materials therefor using a plurality of sample containers moved by a conveyor system past one or more treatment or analysis stations
B65D 77/20 - Container closures formed after filling by applying separate lids or covers
C12M 1/00 - Apparatus for enzymology or microbiology
A61J 1/05 - Containers specially adapted for medical or pharmaceutical purposes for collecting, storing or administering blood, plasma or medical fluids
G01N 37/00 - INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES - Details not covered by any other group of this subclass
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
Provided is a polishing pad capable of shortening the time for the polishing process to start and of improving smoothness. A polishing pad (10) comprises a polyurethane sheet (2) formed by the wet deposition method. The polyurethane sheet (2) is formed in a state without carbon black or ionic surfactants being added. On the polyurethane sheet (2), a polishing face (P) is configured by way of a surface with the skin layer removed. An opening (5) and an opening (6) are formed in the polishing face (P). For the polyurethane sheet (2), a contact angle change ratio, indicated by {(CA1 - CA2) / CA1} × 100, where CA1 is the contact angle 0.5 seconds after a water drop is dropped onto the polishing face (P) and CA2 is the contact angle 10.5 seconds after the water drop is dropped, is adjusted to a range of 20 to 50%. The slurry supplied during the polishing process easily penetrates the polyurethane sheet (2).
C08G 18/10 - Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
B24B 37/24 - Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
3. The polishing pad remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and can be used for primary polishing or finish polishing.
B24B 37/24 - Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
B24B 37/22 - Lapping pads for working plane surfaces characterised by a multi-layered structure
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
A method for producing a polishing pad having a polyurethane resin film as a polishing layer on a film substrate, the method comprising: a step in which a polyurethane resin film-forming composition containing a polyurethane resin and an additive is dissolved in a solvent in which the resin can be dissolved; a step for removing an insoluble component in the solution so that the insoluble component reaches less than 1 mass% in relation to the total mass of the polyurethane resin film-forming composition; a step for adding and mixing a poor solvent into the solution from which the insoluble component has been removed, in an amount (in mL) calculated by the formula (1): "Coagulation value of the polyurethane resin in the poor solvent (in mL) × A" (where A = 0.007 to 0.027) per gram by mass of the solid content of the resin; and a step for forming a film of the mixed solution on a film-forming substrate by wet coagulation to produce the polyurethane resin film. Provided thereby are a method for producing a finishing polishing pad and a polishing pad which enable polishing with fewer polishing defects and make it possible to form a stable film.
Provided are a method for manufacturing a finishing polishing pad, and the polishing pad, allowing few polishing flaws and being capable of forming a stable film, by means of a polishing pad having a polyurethane resin film as a polishing layer on a film-formation substrate, the polishing pad characterized in that the polishing layer comprises a polishing slurry holding section and a polishing slurry flow channel section, the polishing slurry holding section having air bubbles and the polishing slurry flow channel section not having air bubbles, and the polishing layer also contains hydrophobic spherical silica in the amount of 0.5 to 6% of the total polyurethane resin film mass.
The purpose of the invention is to provide: a polishing pad that has minute bubbles that are substantially uniform in the thickness direction and is already provided with openings without performing an opening-forming process such as surface grinding; and a manufacturing method for same. A polishing pad manufacturing method comprising: a process (1) of applying a mixed solution containing a polyurethane resin and an organic solvent onto a film-forming base material; after the application process, a process (2) of exposing the polyurethane resin for two minutes or more to an atmosphere of 10-80°C temperature and 65-100% relative humidity; and a process (3) of coagulating the polyurethane resin by immersion in a coagulation solution.
B24B 37/24 - Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
B05D 3/10 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by other chemical means
B05D 7/24 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
C08J 5/14 - Manufacture of abrasive or friction articles or materials
C08J 9/28 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by elimination of a liquid phase from a macromolecular composition or article, e.g. drying of coagulum
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
Provided are: a polishing pad, which improves the problem of scratches that are produced in cases where conventional hard (dry) polishing pads are used, which has having excellent polishing rate and polishing uniformity, and which is applicable not only to primary polishing but also to final polishing; and a method for producing the polishing pad. A polishing pad for semiconductor device polishing, which comprises a polishing layer having a polyurethane polyurea resin molded body that contains generally spherical cells. This polishing pad for semiconductor device polishing is characterized in that: the polyurethane polyurea resin molded body has a closed cell ratio of 60-98%; the ratio of the loss modulus (E") to the storage modulus (E'), namely loss modulus/storage modulus (tan δ) of the polyurethane polyurea resin molded body is 0.15-0.30; the storage modulus (E') is 1-100 MPa; and the polyurethane polyurea resin molded body has a density (D) of 0.4-0.8 g/cm3.
The purpose of the present invention is to provide an adhesive structure, and a removal method therefor, that enables only the top layer of a laminated film to be reliably and easily removed. The adhesive structure is a laminated film comprising at least two film layers glued onto a substrate and is characterized by the following: among the laminated film layers, at a minimum the bottommost film glued onto the substrate is formed of an elastic material; among the laminated film layers, at a minimum a topmost film laminated on top of the bottommost film is formed of a material that has almost no elasticity, or none at all; the bottommost film and the topmost film are laminated so that they can be detached from one another; and a concave section is formed in one part of the adhesion surface of the substrate, and a non-adhesive surface is formed by providing a space between the bottommost film and the substrate in the concave section.
B65D 65/40 - Applications of laminates for particular packaging purposes
B65D 83/00 - Containers or packages with special means for dispensing contents
B65D 85/00 - Containers, packaging elements or packages, specially adapted for particular articles or materials
G01N 35/02 - Automatic analysis not limited to methods or materials provided for in any single one of groups ; Handling materials therefor using a plurality of sample containers moved by a conveyor system past one or more treatment or analysis stations
The invention relates to a reagent container that forms a discharge port by pressing a bottom protruding piece and is capable of discharging the contents thereof. The purpose is to provide a reagent container with which the contents can be easily and reliably discharged. The reagent container comprises: a bottom; a surrounding wall erected on the perimeter of the bottom; a receptacle part that is open towards the top and is formed so that the internal diameter of the inner circumferential walls decreases as depth increases; a film that seals the opening of the receptacle part; a discharge channel that penetrates from the inside bottom surface of the receptacle part to the bottom of the main container body; and a protruding part that is formed to protrude downward from the bottom so as to seal the discharge channel outlet. The reagent container is characterized in that a rupturing part is formed on the perimeter of the protruding part, the rupturing part being obtained from a thick film part and a thin film part that is formed thinner than the thick film part, and in that pressing the protruding part from the outside of the container ruptures the rupturing part, inserts the protruding part into the discharge channel, and opens the seal of the outlet.
G01N 35/02 - Automatic analysis not limited to methods or materials provided for in any single one of groups ; Handling materials therefor using a plurality of sample containers moved by a conveyor system past one or more treatment or analysis stations
G01N 37/00 - INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES - Details not covered by any other group of this subclass
The invention relates to a test reagent container in which a discharge port can be formed by depressing a projection in the bottom part, making it possible for the contents to be discharged, and has the purpose of providing a test reagent container in which it is possible for the contents to be discharged easily and reliably. The test reagent container is provided with a bottom part, a peripheral wall extending generally upright from the circumferential edge of the bottom part, and a storage part defined by the bottom part and the peripheral wall, the test reagent container being characterized in that the bottom part is furnished with a projecting part projecting toward the container exterior, the basal end of which is formed to be bendable with respect to the bottom part, and having an easily-ruptured part formed at the circumferential edge excluding the basal end; the projecting part being formed such that the distal end side thereof is positioned near the bottom part circumferential edge, and a section that reaches maximum projecting height from the bottom part is positioned toward the bottom part circumferential edge; and the easily-ruptured part being adapted to rupture by depressing the projecting part from the container exterior, the projecting part being pressed into the container interior to form a discharge port.
B65D 17/34 - Arrangement or construction of pull or lift tabs
B65D 17/347 - Arrangement or construction of pull or lift tabs characterised by the connection between the tab and a detachable member or portion of the container
B65D 17/353 - Arrangement or construction of pull or lift tabs characterised by the connection between the tab and a detachable member or portion of the container the connecting means being integral with the tab or with the detachable member or portion
G01N 35/02 - Automatic analysis not limited to methods or materials provided for in any single one of groups ; Handling materials therefor using a plurality of sample containers moved by a conveyor system past one or more treatment or analysis stations
G01N 35/08 - Automatic analysis not limited to methods or materials provided for in any single one of groups ; Handling materials therefor using a stream of discrete samples flowing along a tube system, e.g. flow injection analysis
G01N 37/00 - INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES - Details not covered by any other group of this subclass
Provided is a polishing pad, which alleviates the problem of scratching that occurs when conventional hard (dry) polishing pads are used, exhibits an excellent polishing rate and polishing uniformity, and can also be used for not only primary polishing but also final polishing, and also provided is a manufacturing method therefor. This polishing pad for polishing semiconductor devices includes a polishing layer that has polyurethane-polyurea resin foam containing generally spherical bubbles, and is characterized in that the Young's modulus (E) of the polyurethane-polyurea resin foam is in the range of 450-30,000 kPa, and the density (D) of the polyurethane-polyurea resin foam is in the range of 0.30-0.60 g/cm3.
Provided is a polishing pad, which alleviates the problem of scratching that occurs when conventional hard (dry) polishing pads are used, exhibits an excellent polishing rate and polishing uniformity, and can also be used for not only primary polishing but also final polishing, and also provided is a manufacturing method therefor. The polishing pad includes a polishing layer that has polyurethane-polyurea resin foam containing generally spherical bubbles, and is characterized in that the hard segment content (HSC) of the polyurethane-polyurea resin foam calculated using formula (1) is in the range of 26-34%, and a density (D) of the polyurethane-polyurea resin foam is in the range of 0.30-0.60 g/cm3. (1): HSC=100×(r-1)×(Mdi+Mda)÷(Mg+r×Mdi+(r-1)×Mda)
Provided is a polishing pad, which alleviates the problem of scratching that occurs when conventional hard (dry) polishing pads are used, exhibits an excellent polishing rate and polishing uniformity, and can also be used for not only primary polishing but also final polishing, and also provided is a manufacturing method therefor. This polishing pad for polishing semiconductor devices includes a polishing layer that has polyurethane-polyurea resin foam containing generally spherical bubbles, and is characterized in that a spin-spin relaxation time (T2) of an M component for the polyurethane-polyurea resin foam is 160-260 µs, the storage modulus (E') of the polyurethane-polyurea resin foam is 1-30 MPa in tensile mode, at a temperature of 40°C, an initial load of 10g, a strain range of 0.01-4%, and a measurement frequency of 0.2 Hz, and the density (D) of the polyurethane-polyurea resin foam is in the range of 0.30-0.60 g/cm3.
03 - Cosmetics and toiletries; cleaning, bleaching, polishing and abrasive preparations
07 - Machines and machine tools
21 - HouseHold or kitchen utensils, containers and materials; glassware; porcelain; earthenware
Goods & Services
[ ANTI-STATIC PREPARATIONS FOR HOUSEHOLD PURPOSES; DE-GREASING PREPARATIONS FOR HOUSEHOLD PURPOSES; RUST REMOVING PREPARATIONS; STAIN REMOVING PREPARATIONS, NAMELY, BENZINE; FABRIC SOFTENERS FOR LAUNDRY USE; LAUNDRY BLEACH; POLISHING PREPARATIONS; SOAPS AND DETERGENTS; DENTIFRICES; COSMETICS AND NON-MEDICATED TOILETRIES; PERFUME AND FRAGRANCES; ABRASIVE PAPER; ABRASIVE CLOTH; ABRASIVE SAND; ARTIFICIAL PUMICE STONE; POLISHING PAPER; ABRASIVE SHEETS; INDUSTRIAL ABRASIVES FOR USE IN SEMICONDUCTOR INDUSTRY ] [ PADS FOR GLASS SUBSTRATE POLISHING MACHINES; POLISHING MACHINES FOR USE IN POLISHING GLASS SUBSTRATE; PADS FOR GLASS POLISHING MACHINES; POLISHING MACHINES FOR USE IN POLISHING GLASS; ] PADS FOR SEMICONDUCTOR WAFER POLISHING MACHINES; POLISHING MACHINES FOR USE IN POLISHING SEMICONDUCTOR WAFER SURFACES [ ; SEMICONDUCTOR MANUFACTURING MACHINES; PADS FOR ALUMINUM POLISHING MACHINES; POLISHING MACHINES FOR USE IN POLISHING ALUMINUM ] [ POLISHING CLOTH; HOUSEHOLD POLISHING PADS ]
03 - Cosmetics and toiletries; cleaning, bleaching, polishing and abrasive preparations
07 - Machines and machine tools
21 - HouseHold or kitchen utensils, containers and materials; glassware; porcelain; earthenware
Goods & Services
[ ANTI-STATIC PREPARATIONS FOR HOUSEHOLD PURPOSES; DE-GREASING PREPARATIONS FOR HOUSEHOLD PURPOSES; RUST REMOVING PREPARATIONS; STAIN REMOVING PREPARATIONS, NAMELY, BENZINE; FABRIC SOFTENERS FOR LAUNDRY USE; LAUNDRY BLEACH; POLISHING PREPARATIONS; SOAPS AND DETERGENTS; DENTIFRICES; COSMETICS AND NON-MEDICATED TOILETRIES; PERFUME AND FRAGRANCES; ABRASIVE PAPER; ABRASIVE CLOTH; ABRASIVE SAND; ARTIFICIAL PUMICE STONE; POLISHING PAPER; ABRASIVE SHEETS; INDUSTRIAL ABRASIVES FOR USE IN SEMICONDUCTOR INDUSTRY ] [ PADS FOR GLASS SUBSTRATE POLISHING MACHINES; POLISHING MACHINES FOR USE IN POLISHING GLASS SUBSTRATE; PADS FOR GLASS POLISHING MACHINES; POLISHING MACHINES FOR USE IN POLISHING GLASS; ] PADS FOR SEMICONDUCTOR WAFER POLISHING MACHINES; POLISHING MACHINES FOR USE IN POLISHING SEMICONDUCTOR WAFER SURFACES [ ; SEMICONDUCTOR MANUFACTURING MACHINES; PADS FOR ALUMINUM POLISHING MACHINES; POLISHING MACHINES FOR USE IN POLISHING ALUMINUM ] [ POLISHING CLOTH; HOUSEHOLD POLISHING PADS ]
86.
Polishing pad, manufacturing method thereof and polishing method
Disclosed is a glass substrate holding film body such that、in terms of configuration, a self-adsorption type sheet (32) is bonded to a back plate with a double-faced adhesive sheet (34) therebetween, and that a glass substrate is held by being adsorbed on the self-adsorption type sheet. The double-faced adhesive sheet is composed of a piece of sheet-like base material (38) and adhesive layers (40, 42) provided on both surfaces of the base material. The adhesive layers are provided in such a way that predetermined gaps (B" ", B" ") are formed, respectively, in the same plane of the base material. The gaps provided on both surfaces of the base material do not overlap each other in the lamination direction of the adhesive layers.
B24B 7/24 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
88.
FILM FOR HOLDING GLASS SUBSTRATE AND METHOD FOR POLISHING GLASS SUBSTRATE
Disclosed is a film for holding a glass substrate, wherein a self-sucking sheet is attached, via a double-coated adhesive sheet, to a back plate, and the glass substrate is sucked and held by the self-sucking sheet, characterized in that the double-coated adhesive sheet comprises multiple double-coated adhesive sheet pieces that are located in a single plane and these double-coated adhesive sheet pieces are attached, at definite intervals between adjacent pieces, to the self-sucking sheet and the back plate.
A supporting pad is provided which has a supporting face with heightened flatness precision and can improve the in-plane evenness of an object to be polished. The supporting pad (10) includes a urethane sheet (2) formed by the wet solidification method and having a supporting face (Sh). The urethane sheet (2) has a skin layer (2a) formed therein and has many cells (4) formed on the inner side of the skin layer (2a). The cells (4) have such a size that the cells (4) extend over almost the whole thickness of the urethane sheet (2). The cells (4) each has been formed so that the diameter thereof in a lower layer (Pr) of the urethane sheet (2) is larger than the diameter thereof in an upper layer (Ph) of the sheet (2). The cells (4) have been formed so that the direction of cell formation in the upper layer (Ph) is evenly inclined in a certain direction relative to the thickness direction and that the direction of cell formation in the lower layer (Pr) is the same as the thickness direction. When the pad (10) is compressed in polishing, a stress is evenly imposed on the object being polished.
A supporting pad is provided which has a supporting face with heightened flatness precision and can improve the in-plane evenness of an object to be polished. The supporting pad (10) includes a urethane sheet (2). The urethane sheet (2) has been formed by the wet solidification method and has a supporting face (Sh) for supporting an object to be polished. The urethane sheet (2) has a skin layer (2a) of a microporous structure, and has many cells (3) formed on the inner side of the skin layer (2a) and having such a size that the cells (3) extend over almost the whole thickness of the urethane sheet. In the urethane sheet (2), the bottoms of the cells (3) are located in the range of from the back side (Sr) to a depth of 0.1t therefrom, provided that t is the thickness of the urethane sheet (2). In a lower layer part (Pr) sandwiched between the section which is located 0.1t inward from the back side (Sr) and is parallel to the back side (Sr) and the section which is located 0.4t inward from the back side (Sr) and is parallel to the back side (Sr), the urethane sheet has a porosity, concerning the cells (3), regulated to 75-95%. In polishing, the urethane sheet (2) shows an increased compressive deformation in the lower layer part (Pr).
Provided is a polishing pad which is capable of improving the affinity to a polishing liquid and achieving the stabilization of the polishing performance. The polishing pad (10) is provided with a urethane sheet (2). The urethane sheet (2) has a polishing surface (P) to polish an object to be polished. The urethane sheet (2) is formed by a dry molding and is formed by slicing a urethane foam which is obtained by reacting and curing a liquid mixture in which isocyanate group-containing compound, water, a foam control agent, and polyamine compound are mixed. A foam (3) is dispersed in the urethane sheet (2) in a substantially uniform manner. Pores (4), which are opened parts of the foam (3), are formed on the polishing surface (P). In the urethane sheet (2), parts of the foam (3) formed adjacently to each other communicate through connection holes (9) which are formed at a rate of 800 connection holes/cm2 or more when viewed from the polishing surface (P) side. The polishing liquid moves through the connection holes (9) and the foam (3).
Provided is a holding pad the whole area of which can be applied to a holding panel while ensuring flatness even in the case of having an enlarged size. A holding pad (10) is provided with a buffed urethane sheet (2) on the rear side of a substantially flat holding plane (P). One surface of a pressure-sensitive adhesive sheet (4) is bonded to the surface of the urethane sheet (2) on the rear side of the holding plane (P). In the pressure-sensitive adhesive sheet (4), non-support tapes (41, 42) having pressure-sensitive adhesiveness are located adjacent to each other. One surface of a resin base member (5) is bonded to the other surface of the pressure-sensitive adhesive sheet (4). The resin base member (5) includes one surface and the other surface continuous to each other. A pressure-sensitive adhesive sheet (6) is bonded to the other surface of the resin base member (5). The pressure-sensitive adhesive sheet (6) has one surface to be mounted onto a holding panel. In the pressure-sensitive adhesive sheet (6), non-support tapes (61, 62) having pressure-sensitive adhesiveness are located adjacent to each other. The whole area of the holding pad (10) is supported by the resin base member (5).
B24B 37/30 - Work carriers for single side lapping of plane surfaces
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, ; Adhesives based on derivatives of such polymers
C09J 163/00 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
A polishing pad which suppresses occurrence of a scratch or a roll-off on an object to be polished so that flatness is improved is provided. A polishing pad 1 is comprised a polyurethane sheet 2 having a polishing surface P for performing polishing processing to an object to be polished and an elastic sheet 3 having elasticity joined on a surface of the polyurethane sheet 2 on the opposite side to the polishing surface P. The polyurethane sheet 2 is set higher in compressibility than the elastic sheet 3, and is set lower in A hardness than the elastic sheet 3. The elastic sheet 3 is set at 1% or more in compressibility, and is set at 90 degrees or less in A hardness. Further, both of the polyurethane sheet 2 and the elastic sheet 3 are formed to have a thickness of 0.2 mm or more. The flexibility of the polyurethane sheet 2 is exerted during polishing processing so that the polyurethane sheet 2 deforms to press the polishing surface P approximately evenly on the object to be polished.
B32B 3/26 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids
B24D 11/02 - Backings, e.g. foils, webs, mesh fabrics
2 of the polishing face P is set in a range of from 50 to 100. An average value of ratio of an opened pore diameter D1 of the opened pore 6 of the elongated foam 4 to an opened pore diameter D2 of the opened pore 6 at a depth position of at least 200 μm from the polishing face P is set in a range of from 0.65 to 0.95.
B32B 3/26 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids
B24D 11/00 - Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
Provided is a polishing pad for improving planarity by suppressing scratches and roll off on an object to be polished. A polishing pad (1) is provided with a polyurethane sheet (2) having a polishing surface (P) for polishing the object to be polished, and an elastic sheet (3) which is bonded on the opposite surface to the polishing surface (P) and has elasticity. The polyurethane sheet (2) has a compressibility set higher than that of the elastic sheet (3), and JIS-A hardness at 90 degrees or less. Both the polyurethane sheet (2) and the elastic sheet (3) are formed to have a thickness of 0.2mm or more. When the object to be polished is being polished, flexibility of the polyurethane sheet (2) works, and the polishing surface (P) is pressed to the object to be polished substantially uniformly while the polyurethane sheet (2) is being deformed.
Fabrics, felt, non-woven textile fabrics, oilcloth for use
as tablecloths, towels of textile, sheets of textile,
pillowcases, blankets, table napkins of textile, shower
curtains, fitted toilet seat covers of textile, chair
coverings of textile, wall hangings of textile, curtains. Clothing, footwear, headgear for wear.
Fabrics, felt, non-woven textile fabrics, oilcloth for use
as tablecloths, towels of textile, sheets of textile,
pillowcases, blankets, table napkins of textile, shower
curtains, fitted toilet seat covers of textile, chair
coverings of textile, wall hangings of textile, curtains. Clothing, footwear, headgear for wear.
