An object is to provide a polishing apparatus and a polishing method with which surface modification is implemented on a workpiece surface in consideration of the distribution of recesses and protrusions on the workpiece surface and with short-time processability improved. As a solution, a polishing apparatus (10) polishes a workpiece (W) under the following requirements. The polishing apparatus (10) includes a cavitation generating emission device (50). The cavitation generating emission device (50) has an inner tube (54) in which a first liquid flow (A) flows. The inner tube (54) includes a cavitation generating unit (54a). The cavitation generating emission device (50) is configured to generate cavitation in the first liquid flow (A) and make the first liquid flow (A) collide with the workpiece (W).
In a work polishing apparatus, a polishing head including a head base portion, in an upper portion, to which a vertically movable and rotatable head shaft is fixed, and a holding member, in a lower portion, having a lower surface on which a work is held, is provided with, on the upper surface side of the holding member, a vertically movable partitioning portion and first and second fluid chambers respectively on the inner and outer circumference sides of the partitioning portion. Pressure in the first fluid chamber and in the second fluid chamber can be independently increased or decreased. The partitioning portion can be lowered at least to a position where the first fluid chamber and the second fluid chamber are partitioned such that a pressure difference can be produced between the interior of the first fluid chamber and the interior of the second fluid chamber.
A double-sided polishing apparatus includes: a lower surface plate; an upper surface plate; and a carrier disposed between the lower surface plate and the upper surface plate and holding a disk-shaped workpiece, wherein the carrier is configured to rotate about a center of the lower surface plate and the upper surface plate and to rotate about a center of the carrier, the double-sided polishing apparatus includes a thickness measuring sensor at a fixed position above the upper surface plate or below the lower surface plate or at a movable position in an upper portion of the upper surface plate or a lower portion of the lower surface plate, the carrier includes circular perforations each holding the workpiece at a position eccentric to the center of the carrier, when a central position of any of the perforations preset by a user is defined as a first reference position, with a distance between a center of the upper surface plate or the lower surface plate and a center of any of the perforations preset by the user being shortest or longest, and a position apart from the first reference position by half of a first distance in a direction of the center of the carrier is defined as a second reference position, with the first distance being a predetermined length within 30% of a radius of the perforation, then the thickness measuring sensor is provided in a range of the first distance about the second reference position in a plan view, and the thickness measuring sensor is configured to measure a thickness of the workpiece in a state in which the workpiece is held in the perforation, through a measuring hole provided on the upper surface plate or the lower surface plate closer to a side on which the thickness measuring sensor is disposed.
B24B 37/08 - Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
B24B 37/005 - Control means for lapping machines or devices
The present invention addresses the problem of providing a polishing device and a polishing method with which a workpiece surface is modified in consideration of a distribution of irregularities on the workpiece surface, and with which machinability in a short time period is improved. As a means for overcoming the problem, a polishing device (10) for polishing a workpiece (10) is required to have a configuration provided with a cavitation generating ejection device (50), wherein: the cavitation generating ejection device (50) includes an inner cylinder (54) through the interior of which a first liquid flow (A) flows; the inner cylinder (54) includes a cavitation generating unit (54a); the cavitation generating ejection device (50) generates cavitation in the first liquid flow (A); and the first liquid flow (A) is caused to impinge on the workpiece (W).
B24B 37/00 - Lapping machines or devices; Accessories
B24B 1/00 - Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
B24B 37/10 - Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
5.
PRODUCTION APPARATUS FOR METAL OXIDE SINGLE CRYSTAL AND PRODUCTION METHOD FOR METAL OXIDE SINGLE CRYSTAL
A production apparatus for a metal oxide single crystal according to the present invention includes a crucible for housing a crystal raw material and a seed crystal, which has a first end and a second end, and in which the crystal raw material is disposed on a first end side, and the seed crystal is disposed on a second end side, a heater that heats the crucible, and a cooling rod, which has a third end and a fourth end, and in which the third end is provided in contact with or in proximity to the second end of the crucible so as to cool the second end by depriving the second end of heat.
C30B 35/00 - Apparatus not otherwise provided for, specially adapted for the growth, production or after-treatment of single crystals or of a homogeneous polycrystalline material with defined structure
National University Corporation Nagaoka University of Technology (Japan)
Fujikoshi Machinery Corp. (Japan)
Inventor
Aida, Hideo
Takeda, Hidetoshi
Doi, Toshiro
Miyashita, Tadakazu
Kajikura, Atsushi
Abstract
A work processing apparatus performs processing of a surface to be processed of a work by causing a processing head to come into sliding contact with the work held on an upper surface of a holding plate. The processing head includes a plasma electrode that generates plasma and radiates the plasma to the surface to be processed of the work. In the plasma electrode, an annular or solid cylindrical central electrode provided at a center in a radial direction and an annular outer circumferential electrode provided at an outer side in the radial direction with respect to the central electrode are arranged with an annular slit portion intermediating therebetween at a boundary position thereof, the slit portion is configured as a plasma generation space, and a processing pad is provided at bottom surfaces of the central electrode and the outer circumferential electrode.
Production apparatus for gallium oxide crystal capable of preventing harmful substances formed in furnace from being diffused to surroundings of furnace
A production apparatus for a metal oxide single crystal according to one aspect of the present invention includes: a furnace having an interior heated to a temperature of 1,500° C. or more in an oxidative atmosphere, a heater heating the interior of the furnace, an inlet pipe being disposed in a lower part of the furnace and connecting an interior and an exterior of the furnace, an exhaust pipe being disposed in an upper part of the furnace and connecting an interior and an exterior of the furnace, a duct being disposed above the furnace, and an exhaust fan and a harmful substance elimination device being disposed in the middle of the duct.
A non-contact-type apparatus for measuring wafer thickness includes a monolithic-type wavelength sweeping semiconductor laser light source having a laser source, a laser control unit that controls the laser source, and a processor to control the laser source to oscillate laser light having a wavelength that changes with a setting profile relative to time; an optical system that guides and emits the laser light onto a wafer; a detection unit that detects an interference light signal of reflected light; an A/D converter that converts the interference light signal detected by the detection unit into a digital signal; and a calculation unit that calculates a thickness of the wafer by analyzing the digital signal from the A/D converter. The processor causes the laser control unit to operate with a clock signal, and to oscillate laser light that performs wavelength-sweeping with the setting profile relative to the time, from the laser source. The A/D converts the interference light signal by generating a sampling clock in synchronization with the clock signal or directly using the clock signal as a sampling clock.
The present invention provides a polishing head configured to hold a wafer, and perform polishing by rotating the wafer within a polishing surface of a polishing pad while applying pressure to the wafer and pressing the wafer against the polishing surface. The polishing head is characterized by comprising a pressure application surface, and a retainer ring at an outer peripheral portion on the pressure application surface side, wherein the retainer ring includes an outside retainer ring and an inside retainer ring located inside the outside retainer ring, a portion of the pressure application surface corresponding to the inside of the inside retainer ring is configured to apply pressure to the wafer, and the outside retainer ring and the inside retainer ring are configured to mutually independently apply a load to the polishing pad. Thus, it is possible to provide a polishing head capable of controlling a load applied in the vicinity of a wafer edge independently of a load applied within a wafer plane, and a single-sided polishing method for a wafer using this polishing head.
A crucible for growing a metal oxide single crystal is provided that can facilitate the balance between the thickness and the strength (hardness) of the constant diameter portion of the crucible and is capable of performing growth of a crystal having a large diameter. The crucible according to the present invention is a crucible for growing a metal oxide single crystal, including a reinforcing belt material provided on an outer periphery of a constant diameter portion of the crucible. It is possible that the crucible has an upper portion having a thickness that is smaller than a thickness of a lower portion of the crucible, and the upper portion of the crucible is the constant diameter portion.
C30B 35/00 - Apparatus not otherwise provided for, specially adapted for the growth, production or after-treatment of single crystals or of a homogeneous polycrystalline material with defined structure
A gallium oxide crystal manufacturing device includes a crucible to hold a gallium oxide source material therein, a crucible support that supports the crucible from below, a crucible support shaft that is connected to the crucible support from below and vertically movably supports the crucible and the crucible support, a tubular furnace core tube that surrounds the crucible, the crucible support and the crucible support shaft, a tubular furnace inner tube that surrounds the furnace core tube, and a resistive heating element including a heat-generating portion placed in a space between the furnace core tube and the furnace inner tube. Melting points of the furnace core tube and the furnace inner tube are not less than 1900° C. A thermal conductivity of a portion of the furnace core tube located directly next to the crucible in a radial direction thereof is higher than a thermal conductivity of the furnace inner tube.
C30B 35/00 - Apparatus not otherwise provided for, specially adapted for the growth, production or after-treatment of single crystals or of a homogeneous polycrystalline material with defined structure
C30B 11/00 - Single-crystal-growth by normal freezing or freezing under temperature gradient, e.g. Bridgman- Stockbarger method
The present invention is characterized by being provided with: a monolithic-type wavelength sweeping semiconductor laser light source (12) having a laser source (14), a laser control unit (16) for controlling the laser source (14), and a processor (18) configured to cause the laser control unit (16) to control the laser source (14) so as to oscillate laser light, the wavelength of which is changed according to a setting profile with respect to time; an optical system (20, 22) that guides the laser light to a wafer (24) and irradiates the wafer with the laser light; a detection unit (26) that detects an interference light signal of reflected light; an A/D converter (28) that converts, to a digital signal, the interference light signal detected by the detection unit (26); and a calculation unit (30) that calculates the thickness of the wafer (24) by analyzing the digital signal from the A/D converter (28), wherein the processor (18) causes the laser control unit (16) to operate on the basis of a clock signal and to oscillate laser light, from the laser source (14), so as to be wavelength-swept with the setting profile with respect to time, and the A/D converter (28) performs A/D conversion of the interference light signal by generating a sampling clock in synchronization with the clock signal or directly using the same as the sampling clock.
The present invention is a two-side polishing device equipped with: a lower platen that is provided so as to be rotatable about a rotating shaft and that has a polishing pad affixed to an upper surface thereof; an upper platen that is provided above the lower platen so as to be movable up and down and rotatable about the rotating shaft and that has a polishing pad affixed to a lower surface thereof; and a suspended top that is provided above the upper platen. The two-side polishing device is characterized by comprising: a connecting part that connects the suspended top and the upper platen; and an actuator that is provided between the suspended top and the upper platen, in a position different from the connecting part, and that is capable of deforming the shape of the upper platen. Due to this configuration, a platen moving mechanism is provided that enables the shape of a platen to be deformed into various shapes without promoting thermal deformation of the platen in a duplex polishing device in a suspended state.
B24B 37/005 - Control means for lapping machines or devices
B24B 37/08 - Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
B24B 37/12 - Lapping plates for working plane surfaces
B24B 37/14 - Lapping plates for working plane surfaces characterised by the composition or properties of the plate materials
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
14.
Apparatus for producing a single crystal of a metal oxide comprising a Pt-Rh alloy heater coated with zirconia
To provide a single crystal production apparatus that is capable of prolonging the lifetime of a heater, and capable of reducing the cost. A single crystal production apparatus of the present invention is the single crystal production apparatus which produces a single crystal of a metal oxide in an oxidative atmosphere, containing: a base body; a cylindrical furnace body having heat resistance disposed above the base body; a lid member occluding the furnace body; a heater disposed inside the furnace body; a high frequency coil heating the heater through high frequency induction heating; and a crucible heated with the heater, the heater containing a Pt-based alloy and having a zirconia coating on an overall surface of the heater.
A polishing apparatus including: a turntable with an attached polishing pad; a polishing head that holds a wafer; a tank that stores a polishing agent; a polishing agent supply mechanism which supplies the stored polishing agent to the polishing pad; a waste liquid receiver which collects the polishing agent flowing from the turntable; and a circulation mechanism which is connected to the waste liquid receiver and supplies the collected polishing agent to the tank, the polishing agent is supplied to the polishing pad from the tank with the polishing agent supply mechanism, the used polishing agent which flows from the turntable is collected by the waste liquid receiver, a surface of the wafer held by the polishing head is rubbed against the pad to polish it while supplying the collected polishing agent to the tank to circulate the polishing agent, and the waste liquid receiver is fixed to the turntable and the waste liquid receiver having a bottom plate and a removable side plate.
B24B 37/00 - Lapping machines or devices; Accessories
B24B 37/12 - Lapping plates for working plane surfaces
B24B 37/10 - Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
B24B 37/20 - Lapping pads for working plane surfaces
B24B 57/00 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
B24B 57/02 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
16.
Work polishing method and work polishing apparatus
The polishing apparatus comprises: a dressing section for dressing a polishing pad; a measuring section for measuring a surface property of the polishing pad; a polishing result measuring section for measuring a polishing result of a work; a storing section for storing correlation data between dressing condition data for dressing the polishing pad, surface property of the polishing pad and polishing results, which are learned by an artificial intelligence; and an input section for inputting an object polishing result. The artificial intelligence performs a first arithmetic process, in which the surface property of the polishing pad corresponding to the object polishing result is inversely estimated on the basis of the correlation data, and a second arithmetic process, in which the corresponding dressing condition is derived on the basis of the surface property of the polishing pad inversely estimated.
B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
B24B 37/10 - Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
The polishing head comprises: a head main body part; a carrier being connected to the head main body part; a pressure chamber; a fluid supplying section; a linear motion guide having an outer cylindrical body and a spline shaft, which is provided in the outer cylindrical body and capable of moving in an axial direction thereof, and which is prohibited to rotate with respect to the outer cylindrical body so as to transmit a rotational force to the spline shaft through the outer cylindrical body; and a rotation transmitting plate being provided between a lower end of the spline shaft and an upper face of the carrier, the rotation transmitting plate being capable of tiltably supporting the carrier and transmitting a rotational force of the spline shaft to the carrier.
B24B 37/10 - Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
B24B 37/30 - Work carriers for single side lapping of plane surfaces
The apparatus for producing a gallium oxide crystal relating to the invention contains a vertical Bridgman furnace containing: a base body; a cylindrical furnace body having heat resistance disposed above the base body; a lid member occluding the furnace body; a heater disposed inside the furnace body; a crucible shaft provided vertically movably through the base body; and a crucible disposed on the crucible shaft, heated with the heater, the crucible is a crucible containing a Pt-based alloy, the furnace body has an inner wall that is formed as a heat-resistant wall containing plural ring shaped heat-resistant members each having a prescribed height accumulated on each other, and the ring shaped heat-resistant members each contain plural divided pieces that are joined to each other to the ring shape.
A polishing apparatus includes: a plurality of polishing heads for holding a wafer, a polishing pad for polishing the wafer, a rotatable turn table having the polishing pad attached thereto, a turn table driving mechanism for rotating the turn table, a plurality of wafer-detecting sensors for detecting coming off of the wafer from the polishing head during polishing, wherein the polishing apparatus has the wafer-detecting sensor disposed above peripheral portions of the respective polishing heads and on each downstream side in a rotation direction of the turn table with respect to the respective polishing heads. The polishing apparatus can detect coming off of a wafer from a polishing head during polishing more rapidly, and can prevent a breakage of the wafer thereby.
B24B 37/005 - Control means for lapping machines or devices
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
B24B 37/10 - Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
A polishing apparatus which is an index system polishing apparatus which includes a polishing head for holding a wafer, a plurality of turn tables to which polishing pads for polishing the wafer are attached, and a loading/unloading stage for loading the wafer to the polishing head or unloading the wafer from the polishing head, and which polishes the wafer while switching the turn tables to be used for polishing the wafer held at the polishing head by causing the polishing head to perform rotation movement, the polishing apparatus including a turn table upward and downward movement mechanism which allows the turn table to move upward and downward. With this polishing apparatus, it is possible to reduce an amount of displacement caused when moment load is applied on the polishing head during polishing.
A nozzle according to the invention includes a liquid flow passage through which a liquid flows, a gas flow passage through which a gas flows, the gas flow passage communicating with the liquid flow passage and feeding the gas to the liquid flow passage, and a plasma generating mechanism for generating plasma in the gas fed from the gas flow passage to the liquid flow passage, in which the plasma generating mechanism includes a first electrode provided so as to be exposed to an inside of the liquid flow passage, a second electrode provided so as not to be exposed to the inside of the liquid flow passage and so as to be exposed to an inside of the gas flow passage, and a power source for applying a predetermined voltage across the first electrode and the second electrode, and in which the liquid with which the gas including the generated plasma is mixed as bubbles having a predetermined diameter is spouted.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B24B 57/02 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
B24B 37/04 - Lapping machines or devices; Accessories designed for working plane surfaces
The method of the present invention comprises the steps of: previously obtaining correlation data between surface properties of the polishing pad dressed under a plurality of stages of dressing conditions and polishing effects of the work polished by the polishing pad dressed under the dressing conditions; determining an assumed dressing condition capable of achieving an object polishing effect from the correlation data; dressing the polishing pad under the assumed dressing condition determined; polishing the work; cleaning the polishing pad which has been used for polishing the work; and measuring a surface property of the cleaned polishing pad.
B24B 49/18 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
B24B 37/005 - Control means for lapping machines or devices
B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
B24B 37/20 - Lapping pads for working plane surfaces
B24B 37/04 - Lapping machines or devices; Accessories designed for working plane surfaces
B24B 53/06 - Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
B24B 53/08 - Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels controlled by information means, e.g. patterns, templets, punched tapes or the like
23.
Work processing apparatus and liquid chemical bag for the same
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
Tsukada, Masayuki
Shibuya, Kazutaka
Fuse, Takayuki
Nakamura, Yoshio
Hara, Shiro
Abstract
The work processing apparatus of the present invention comprises: a processing section for processing or treating a work; and a liquid chemical supplying section for supplying a liquid chemical to the processing section. The liquid chemical supplying section includes: a plurality of liquid chemical bags for storing the liquid chemical; a bag holding part in which the liquid chemical bags are attached and held; and a liquid feeding part, to which the liquid chemical bags are detachably connected, for feeding the liquid chemical from the liquid chemical bags to the processing section. Each of the liquid chemical bags is produced by overlapping flexible resin sheets with each other and welding their edge parts to form into a bag. Each of the liquid chemical bags has a port part communicating with an outside. A joint with a valve is attached to each of the port parts.
The present invention is a polishing apparatus equipped with a surface plate on which a polishing fabric is affixed, a polishing head for holding a wafer, a tank for storing an abrasive, an abrasive supply mechanism for supplying the abrasive stored in the tank to the polishing fabric, a waste fluid receptacle for recovering abrasive flowing down from the surface plate, and a circulating mechanism connected to the waste fluid receptacle for supplying the abrasive recovered in the waste fluid receptacle into the tank. The polishing apparatus supplies abrasive to the polishing fabric from inside the tank using the abrasive supply mechanism, recovers used abrasive flowing down from the surface plate in the waste fluid receptacle, and polishes the surface of a wafer held by the polishing head by rubbing same on the polishing fabric while circulating the abrasive by supplying recovered abrasive into the tank. The polishing apparatus is characterized in that the waste fluid receptacle is fixed to the surface plate. As a result, it is possible to provide a polishing apparatus wherein when recovering abrasive that is to be re-used, mixing with other solutions is limited and worsening of abrasive recovery efficiency is limited, and that is easy to maintain.
B24B 37/00 - Lapping machines or devices; Accessories
B24B 37/12 - Lapping plates for working plane surfaces
B24B 57/02 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
25.
Polishing apparatus for a work with mechanical polishing function and chemical polishing function
The method of the present invention is capable of polishing a high hardness work at high polishing efficiency. The method comprises the steps of: pressing a surface of the work onto a polishing part of a rotating polishing plate; and supplying slurry while performing the pressing step. The method is characterized in that an activated gas, which has been activated by gas discharge, is turned into bubbles and mixed into the slurry.
B24B 37/04 - Lapping machines or devices; Accessories designed for working plane surfaces
H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
B24B 57/02 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
C23F 1/08 - Apparatus, e.g. for photomechanical printing surfaces
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 29/16 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System in uncombined form
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
The present invention is a polishing device equipped with multiple polishing heads for holding wafers, a rotatable surface plate on which a polishing cloth for polishing the wafers is affixed, a surface plate-driving mechanism for rotating the surface plate, and multiple wafer-detecting sensors for detecting the expulsion of the wafers from said polishing heads during polishing. The polishing device is characterized in that the wafer-detecting sensors are provided on the downstream side of the respective polishing heads in the surface plate rotation direction and above the area surrounding the circumferences of the polishing heads. Provided thereby is a polishing device capable of preventing wafer damage by earlier detection of the expulsion of wafers from polishing heads during polishing.
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
The present invention is an index-type polishing device that is provided with a polishing head that is for holding a wafer, with a plurality of surface plates to which are stuck a polishing cloth that is for polishing the wafer, and with a loading/unloading stage that is for loading the wafer onto the polishing head or peeling the wafer away from the polishing head. By turning the polishing head, the polishing device polishes the wafer that is held by the polishing head while switching the surface plate that is used to polish the wafer. The polishing device is characterized by having a surface plate vertical motion mechanism that can vertically move the surface plates. As a result, the present invention can reduce the amount of deformation that occurs during polishing when a moment load is applied to the polishing head.
The present invention is a surface plate transport dolly that is for transporting a surface plate that has been removed from a polishing device or a surface plate that is to be installed on the polishing device. The surface plate transport dolly is provided with a surface plate holding unit that is for holding the surface plate, with a support stand that supports the surface plate holding unit from the bottom side, with an elevation mechanism that raises/lowers the surface plate holding unit, and with a tilting mechanism that tilts the surface plate holding unit that holds the surface plate. The surface plate transport dolly is characterized by being capable of transporting the surface plate while the surface plate holding unit that holds the surface plate has been tilted by the tilting mechanism. Thereby provided is a surface plate transport dolly that has a narrow width when transporting a surface plate and that can narrow the width of a path for transporting the surface plate.
The method of the present invention is capable of polishing a high hardness work at high polishing efficiency. The method comprises the steps of: pressing a surface of the work onto a polishing part of a rotating polishing plate; and supplying slurry while performing the pressing step. The method is characterized in that an activated gas, which has been activated by gas discharge, is turned into bubbles and mixed into the slurry.
H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
B24B 37/04 - Lapping machines or devices; Accessories designed for working plane surfaces
B24B 57/02 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
C23F 1/08 - Apparatus, e.g. for photomechanical printing surfaces
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 29/16 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System in uncombined form
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
Nakamura, Yoshio
Ichikawa, Daizo
Sumizawa, Haruo
Hara, Shiro
Khumpuang, Sommawan
Ikeda, Shinichi
Abstract
A method of manufacturing semiconductor wafers which facilitates formation of orientation flat lines and allows beveling work without problems. The method of manufacturing semiconductor wafers includes steps wherein a plurality of small-diameter wafers is cut out from a large-diameter semiconductor wafer, the method including: a marking step of forming straight groove-like orientation flat lines by a laser beam so as to cross the respective small-diameter wafers in each row in the large-diameter semiconductor wafer, wherein cutout positions of the small-diameter wafers are aligned in rows in a specific direction, collectively for each of the rows; and a cutting step of cutting out the small-diameter wafers separately from the large-diameter semiconductor wafer, by a laser beam, after the marking step, in such a way that the orientation flat lines are located at required positions in the small-diameter wafers to be obtained.
H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
National Institute of Advanced Industrial Science and Technology (Japan)
Inventor
Nakamura, Yoshio
Otsuka, Yoshio
Okubo, Takashi
Shibuya, Kazutaka
Fuse, Takayuki
Hara, Shiro
Khumpuang, Sommawan
Ikeda, Shinichi
Abstract
The wafer polishing apparatus comprises a polishing plate, a polishing head capable of holding a wafer, and a slurry supplying section. The polishing plate includes: a plurality of concentric polishing zones, each of which has a prescribed width for polishing the wafer and on each of which a polishing cloth is adhered; and a groove for discharging slurry being formed between the polishing zones. A head cleaning section, which cleans the polishing head, or a wafer cleaning section, which cleans the polished wafer, is provided to a center part of the polishing plate and located on the inner side of the innermost polishing zone.
B24B 7/22 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
B24B 37/16 - Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
B24B 37/10 - Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
B24B 37/26 - Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
B24B 37/30 - Work carriers for single side lapping of plane surfaces
A polishing head including, below a polishing head body, a rubber film held by a disk-shaped mid plate and an annular guide ring disposed around the rubber film holding the back surface of the workpiece on a lower face portion of the rubber film. The polishing head also includes a base member that is coupled to a polishing head body through an elastic film and holds the guide ring and the mid plate such that the lower surface of the guide ring does not contact the polishing pad during polishing. The polishing head and polishing apparatus, are operable in both of the rough polishing process and final polishing process, that can stably achieve predetermined high flatness and high polishing stock removal uniformity in polishing of a workpiece and can obtain a workpiece with fewer fine particles having a diameter of 45 nm or more.
In the double-side polishing apparatus, one end part of a slurry supply hole has a female-tapered face whose inner diameter is gradually increased toward a polishing face of a polishing plate. A pad hole, which corresponds to the slurry supply hole, is formed in a polishing pad covering the slurry supply hole. An edge of the pad hole is located in the slurry supply hole. A fixation pipe, in which a flange section facing the female-tapered face is formed at one end part, is fixed in the slurry supply hole. The edge of the pad hole is sandwiched and held between the female-tapered face of the slurry supply hole and the flange section of the fixation pipe.
A polishing apparatus which includes a polishing head for holding a work, and a polishing plate on which a polishing pad is adhered. The polishing head includes a holding plate, an elastic sheet member fixed to an edge of the holding plate, a ring-shaped template fixed to an outer edge of a lower face of the elastic sheet member, a pressure chamber formed between a lower face of the holding plate and an upper face of the elastic sheet member, a seal ring having a main body part which is fitted to a supporting plate, a seal lip, which slidelingly contacts the elastic sheet member and divides the inside of the pressure chamber into an inner divided chamber and an outer divided chamber; and a fluid supply section for individually supplying a fluid to the divided chambers.
B24B 29/00 - Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
B24B 37/30 - Work carriers for single side lapping of plane surfaces
The method of the present invention are capable of stabilizing a polishing rate, reducing number of times of performing dressing operations, improving work efficiency and extending a span of life of the polishing pad. The method for dressing a polishing pad, which has been used to polish a surface of a work by pressing the work onto the polishing pad fixed on a polishing plate with supplying slurry thereto, by using a grind stone, comprises the steps of: cleaning the polishing pad by supplying high-pressure cleaning water to the polishing pad; and dressing the polishing pad by moving a dressing grind stone, in the radial direction of the polishing pad, along a surface profile thereof, while performing the cleaning step.
Disclosed is an abrasive head wherein in the lower portion of the abrasive head body, there are provided a rubber film held by a disk-shaped intermediate plate, and an annular guide ring disposed around the rubber film; and wherein the back surface of a workpiece is held on the lower surface of the rubber film, and the front surface of the workpiece is brought into sliding contact with an abrasive cloth bonded to a surface plate, resulting in the workpiece being abraded. This abrasive head has a base member which holds the guide ring and the intermediate plate in such a way that the lower surface of the guide ring does not come into contact with the abrasive cloth during abrasion and which is connected to the abrasive head body via an elastic film. A portion of the upper surface of the base member comes into contact with the abrasive head body, resulting in the axial displacement of the base member being restricted. Furthermore, due to the elastic film, the base member is capable of undergoing radial displacement during abrasion. Thus provided are an abrasive head and an abrading device whereby a certain degree of high flatness and high uniformity of abrasion margin can be obtained in a stable manner during abrasion of a workpiece, whereby furthermore, it is possible to obtain a workpiece having only a small number of minute particles 45 nm or more in size, and which can be used in both a rough abrasion process and a finish abrasion process.
A polishing head for holding a workpiece when a surface of the workpiece is polished and a polishing apparatus provided with the polishing head, and more particularly a polishing head for holding the workpiece on a rubber film and a polishing apparatus provided with the polishing head. The polishing head and the polishing apparatus provided with the polishing head that can adjust the polishing profile on the basis of the shape of the workpiece before polishing and can stably obtain good flatness.
The present invention is a polishing head in which a rubber film is formed in a boot shape in such a manner that a position where the rubber film is held by a mid plate is distantly positioned from a work holding portion; an end portion of the boot shaped rubber film is formed in O-ring shape so that the rubber film is held by the mid plate with decreasing an area of contact between the mid plate and the rubber film as much as possible. As a result, there is provided a polishing head with rubber chuck method in which an occurrence of a surface defect, such as a scratch, on a surface of the work is suppressed as much as possible and the work can be uniformly and stably polished to the outer periphery.
B24B 49/00 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
39.
METHOD OF PREPARING POLISHING HEAD AND POLISHNG APPARATUS
The present invention relates to a method of preparing a polishing head comprising a step of gluing to a rigid ring a rubber film made of rubber having at least 40-90 deg. of hardness in JIS A scale and a step of selecting the rubber film glued to the rigid ring attached to a backing plate, the bottom surface of the rubber film having the flatness of 40 μm or less as measured along the periphery thereof where the rubber film is glued to the rigid ring. The selected rubber film glued to the rigid ring attached to a backing plate is used for a polishing head. The polishing head thus prepared and the polishing apparatus accomplish a constant flatness and a constant polishing allowance.
A polishing head having a disklike carrier in which an annular projecting portion and a carrier-engagement portion are formed in a peripheral portion, a disklike head body in which a head-body-engagement portion is formed outside, a diaphragm for connecting the head body with the carrier, a spacer located between the carrier-engagement portion and the head-body-engagement portion in a part of the carrier-engagement portion and/or the head-body-engagement portion, in which the spacer abuts on the carrier-engagement portion and/or the head-body-engagement portion at the time of lifting the head body so that the workpiece is demounted from the polishing pad by lifting the carrier with it inclined. As a result, there is provided a polishing head in which the workpiece can be easily, safely and surely demounted from the polishing pad by lifting the polishing head holding the workpiece without overhanging the polishing head from the turn table and the like.
B24B 5/00 - Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
B24B 41/06 - Work supports, e.g. adjustable steadies
b) into a plurality of regions, and the motor for driving the lower stool is arranged in a region other than the region containing the lower stool. The polishing apparatus can manufacture a wafer of a stable shape, irrespective of the time elapsed from the running start and the presence/absence of the stop of the polishing apparatus.
B24B 29/00 - Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
A polishing head is provided with at least an annular rigid ring; a rubber film adhered uniformly on the rigid ring with a tensile force; an intermediate plate which is connected to the rigid ring and forms a space section with the rubber film and the rigid ring; an annular template concentrically arranged with the rigid ring at the periphery of a lower surface section of the rubber film; and a pressure adjusting mechanism which changes pressure in the space section. A plurality of airtight spaces are formed by partitioning the space section by means of at least one annular wall which is concentric with the rigid ring. The outer diameter of at least one inner airtight space among the airtight spaces partitioned by the annular wall is equivalent to the diameter of the planarity-guaranteed region of a work or more, and the pressure adjusting mechanism independently adjusts pressure in each airtight space.
A method of producing an abrasive head which comprises an annular rigid ring, a rubber film bonded to the rigid ring with a uniform tension, an intermediate plate connected to the rigid ring and forming a space together with the rubber film and the rigid ring, and a pressure regulation mechanism for varying a pressure in the space, and which laps a work by holding the back surface thereof on the underside surface of the rubber film and allowing the front surface of the work to slide on a polishing cloth affixed onto a surface plate. The method of producing an abrasive head comprises a step for performing tensile test on the rubber film conforming to JIS K6251 at least before the rubber film is bonded to the rigid ring, and sorting out a rubber film which has a value of inclination of 10 MPa or less obtained by linear approximation of a stress-strain curve having a strain within 5%, characterized in that the abrasive head is produced by bonding a sorted out rubber film having a value of inclination of 10 MPa or less to the rigid ring. Consequently, a method of producing an abrasive head and an abrasive apparatus which ensure a stabe and constant flatness are provided.
The present invention is a polishing head provided with an annular rigid ring, a rubber film bonded to the rigid ring with a uniform tension, a mid plate joined to the rigid ring and forming a space portion together with the rubber film and the rigid ring, and an annular template provided concentrically with the rigid ring in a peripheral portion on a lower face part of the rubber film and having an outer diameter larger than an inner diameter of the rigid ring, in which a pressure of the space portion can be changed by a pressure adjustment mechanism, a back face of a work is held on the lower face part of the rubber film, and a surface of the work is brought into sliding contact with the polishing pad attached onto a turn table for performing polishing, and an inner diameter of the template is smaller than an inner diameter of the rigid ring, and a ratio between an inner diameter difference between the rigid ring and the template and a difference between the inner diameter and an outer diameter of the template is 26% or more and 45% or less. Thereby, a polishing head and the like that can obtain constant flatness stably can be provided.
A polishing head (11) is composed of at least a substantially disc-like middle plate (12), and a rubber film (13) which covers at least a lower surface section and a side surface section of the middle plate. The polishing head has a space section (14) surrounded by the middle plate and the rubber film, and is configured to have pressure in the space section changed by a pressure adjusting mechanism (15). The polishing head holds the rear surface of a work (W) at a lower surface section of the rubber film, and polishes the surface of the work by sliding the surface of the work on a polishing cloth (22) adhered on a surface plate. In the polishing head, the middle plate and the rubber film are not in contact with each other at least entirely on a lower surface section of the middle plate, and a gap (14a) is provided. Thus, the rubber chuck system polishing head applies uniform polishing load to the entire work without being affected by rigidity and planarity of the middle plate.
A polishing head (11) is provided with a disc-like carrier (13) whereupon an annular protruding section (13a) and a carrier locking section (13b) are formed at the periphery; a disc-like head main body (12) whereupon an annular head main body locking section (12a) is formed on the outer side; a diaphragm (14) for connecting the head main body and the carrier; and a spacer (15) positioned between the carrier locking section and the head main body locking section, at a part of the carrier locking section and/or the head main body locking section. When the head main body in brought up, since the carrier locking section and/or the head main body locking section is permitted to abut to the spacer, the carrier is tilted to be brought up, and a work (W) is removed from a polishing cloth. Thus, the work can be easily, safely and surely removed from the polishing cloth by bringing up the polishing head, which is holding the work, without forming a groove on the polishing cloth and overhanging the polishing head from a surface table.
Provided is a polishing head, in which a rubber film is given such a boot-shaped structure that its fixed position on an intermediate plate may be apart from the side of a work holding portion, and in which the trailing end portion of the boot-shaped rubber film is formed into an O-ring shape so that the rubber film may be supported in the intermediate plate by reducing the contact area between the intermediate plate and the rubber film to the minimum. In the polishing head of the rubber chuck type, therefore, the surface defect such as flaws is suppressed to the minimum so that the work can be polished stably and homogeneously to its outer circumference. Also provided is a polishing apparatus, which is equipped with the polishing head.
The double-side polishing apparatus for polishing both faces of a wafer is capable of reliably measuring not only a thickness of an outer part of the wafer but also a thickness of a center part thereof. The double-side polishing apparatus comprises: a lower polishing plate; an upper polishing plate held by a frame; and a carrier having a through-hole for holding the wafer. A window section, through which a laser beam passes, is formed in a part of the upper polishing plate, under which the wafer held by the carrier passes. An optical thickness measuring equipment is provided to a part of the frame, under which the window section passes while the upper polishing plate is rotated. The thickness measuring equipment emits the laser beam through the window section, receives reflected beams reflected from an upper face and a lower face of the wafer, and calculates the thickness of the wafer on the basis of peak values of the reflected beams.
B24B 49/00 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
B24B 51/00 - Arrangements for automatic control of a series of individual steps in grinding a workpiece
Provided is a polishing apparatus comprising a lower stool (12), a motor (18a) and a speed reducer (19a) for driving the lower stool, and a box (17) for covering at least the portion of the lower stool below the working action face. The polishing apparatus polishes a wafer by forcing the wafer to contact the lower stool and by rotating the lower stool. The box has its inside separated by partitions (31a and 31b) into a plurality of regions, and the motor for driving the lower stool is arranged in a region other than the region containing the lower stool. The polishing apparatus can manufacture a wafer of a stable shape, irrespective of the time elapsed from the running start and the presence/absence of the stop of the polishing apparatus.
B24B 37/08 - Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
B24B 55/02 - Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
A polishing head is provided with an annular rigid ring (12); a rubber film (13) bonded on the rigid ring with uniform tensile strength; a middle plate (14) connected to the rigid ring to form a space with the rubber film and the rigid ring; and an annular template (16), which is concentrically arranged with the rigid ring at the periphery of a lower surface section of the rubber film and has an outer diameter larger than the inner diameter of the rigid ring. Pressure in the space can be changed by a pressure adjusting mechanism (17). The polishing head holds the rear surface of a work (W) on the lower surface section of the rubber film and polishes the surface of the work by bringing the surface of the work slidably into contact with a polishing cloth adhered on a platen. The inner diameter of the template is smaller than that of the rigid ring, and a ratio of a difference between the inner diameter of the rigid ring and that of the template to a difference between the inner diameter and the outer diameter of the template is 26% or more but not more than 45%. Thus, the polishing head or the like is provided for stably obtaining constant planarity.
The double face polishing apparatus is capable of controlling an amount of supplying slurry to a lower polishing plate. The double face polishing apparatus comprises: a lower polishing plate and an upper polishing plate; a carrier provided between the polishing plates, the carrier having a through-hole for holding a workpiece; a plate driving unit for rotating the polishing plates; a carrier driving unit for rotating the carrier; ring-shaped ducts coaxially provided to the upper polishing plate; a slurry supply source supplying slurry to the ring-shaped ducts; and supply pipes for supplying the slurry to the lower polishing plate. The slurry is supplied to each of coaxial polishing zones of the lower polishing plate via the corresponding ring-shaped ducts and the supply pipes.
B24B 7/00 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
B24B 9/00 - Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
B24B 57/02 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
52.
Workpiece centering apparatus and method of centering workpiece
The workpiece centering apparatus is capable of highly reducing damage of a workpiece. The workpiece centering apparatus comprises: a guide plate being provided in a tray and covering a water inlet so as to horizontally introduce water into the tray; and at least three overflow outlets for overflowing the water from the tray, the overflow outlets being formed in a peripheral wall of the tray and arranged in the circumferential direction at regular intervals. The workpiece, which is horizontally fed on a surface of the water stored in the tray, is received and floated by surface tension of the water. Then, the workpiece is centered in the tray by water flows radially overflowing from the tray via the overflow outlets.
B24B 49/00 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
The polishing apparatus is capable of transferring a work piece to a top ring without moving the work piece from the center and capable of precisely polishing the work piece. The polishing apparatus has a transfer unit for transferring the work piece to the top ring. The transfer unit comprises: a guide member having a receiving section, which centers the work piece; a mounting table vertically moving with respect to the guide member, the mounting table having a mounting section, which receives the centered work piece; and a supporting mechanism supporting the mounting table and allowing the mounting table to move downward. The mounting table is relatively moved close to the top ring and presses the work piece onto the top ring so as to transfer the work piece to the top ring.
B24B 49/00 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
patents
