17 - Rubber and plastic; packing and insulating materials
Goods & Services
Insulating systems of metal-lined ceramic fibres; Insulating systems of ceramic fibres, lined with stainless steel films and/or ceramic filament fabrics; Insulating systems of ceramic fibres and/or microporous insulating materials, lined with titanium/tin films and/or stainless steel sheets/films; Insulating systems of mineral fibre boards and/or ceramic high-temperature fibres and/or microporous silicon dioxide, lined with steel sheets and stainless steel films; Fibre bowls with acoustic and thermal adsorption and thermal reflection properties; All the aforesaid goods for components for conducting hot media, for use in automobile, motor and engine, turbine and power train construction, in heating and air-conditioning systems, in mechanical engineering and construction, and in the aeronautical industry.
C12N 15/10 - Processes for the isolation, preparation or purification of DNA or RNA
C12Q 1/6806 - Preparing nucleic acids for analysis, e.g. for polymerase chain reaction [PCR] assay
C12Q 1/68 - Measuring or testing processes involving enzymes, nucleic acids or microorganismsCompositions thereforProcesses of preparing such compositions involving nucleic acids
C12N 15/00 - Mutation or genetic engineeringDNA or RNA concerning genetic engineering, vectors, e.g. plasmids, or their isolation, preparation or purificationUse of hosts therefor
3.
TREATMENT MEMBER, TREATMENT METHOD, AND TREATMENT DEVICE
A treatment device 100 comprising a treatment member 110 and a container 120 for housing the treatment member 110, wherein: the treatment member 110 has a partition wall 111 that forms a flow channel 113; the partition wall 111 comprises elemental metal and has macro holes of 0.1-10 μm diameter and meso holes of 1-10 nm diameter; the cell density of the treatment member 110 is at least 1000 cpsi; and the opening ratio of the flow channel 113 in the partition wall 111 is at least 40%.
This method for manufacturing an encased film capacitor is for manufacturing an encased film capacitor provided with: a case; a film capacitor element that is accommodated in the case; and a sealing resin for sealing the film capacitor element. The method comprises: a first step for layering or winding a metalized film that has a dielectric film and a metal deposited film that is provided on one surface of the film; a second step for shaping the layered or wound metalized film; a third step for obtaining a film capacitor element by providing a metal contact electrode to the shaped metalized film; a fourth step for attaching an external lead terminal to the metal contact electrode of the film capacitor element; a fifth step for accommodating in the case the film capacitor element to which the external lead terminal has been attached; and a sixth step for sealing the film capacitor element accommodated in the case with a resin. Further included between the third step and the sixth step is a moisture adjustment step for adjusting the amount of moisture contained in the film capacitor element.
A manufacturing method for a conductor-filled through-hole substrate according to one embodiment comprises: a preparation step for preparing a through-hole substrate including an insulating base having through-holes disposed therein, the through-holes communicating with both main surfaces; a copper sintered body forming step for forming a copper sintered body having a porous structure so that the copper sintered body fills at least the through holes; a resin impregnation step for impregnating the copper sintered body with a curable resin composition; and a resin curing step for curing the curable resin composition impregnated into the copper sintered body to form a conductor composed of the copper sintered body having a resin cured product packed in the pores therein.
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
H05K 1/09 - Use of materials for the metallic pattern
6.
METHOD FOR PRODUCING SUBSTRATE HAVING THROUGH-SILICON VIAS, SUBSTRATE HAVING THROUGH-SILICON VIAS, AND COPPER PASTE FOR THROUGH-SILICON VIA FORMATION
This method for producing a substrate having through-silicon vias according to one embodiment comprises: a preparation step for preparing a silicon substrate having through-holes that communicate with both main surfaces; a copper sintered body formation step for forming a copper sintered body having a porous structure, such that the copper sintered body fills at least through-holes; a resin impregnation step for impregnating the copper sintered body with a curable resin composition; and a resin curing step for curing the curable resin composition that has impregnated the copper sintered body and thereby forming a conductor that is constituted of the copper sintered body having pores packed with resin cured product, to provide through-silicon vias in the through-holes.
H01L 21/3205 - Deposition of non-insulating-, e.g. conductive- or resistive-, layers, on insulating layersAfter-treatment of these layers
H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
7.
SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND METHOD OF MANUFACTURING SAME AND LAMINATE FILM FOR FORMING SUPPORT PIECE AND METHOD OF MANUFACTURING SAME
A semiconductor device according to the present disclosure has a dolmen structure including a substrate, a first chip disposed on the substrate, a plurality of support pieces arranged on the substrate and around the first chip, and a second chip supported by the plurality of support pieces and disposed to cover the first chip, wherein the support pieces are made of a cured product of a thermosetting resin composition or include a layer made of the cured product of the thermosetting resin composition and a resin layer or a metal layer.
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
8.
SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND METHOD FOR MANUFACTURING SAME, METHOD FOR MANUFACTURING SUPPORT PIECE, AND LAMINATE FILM FOR SUPPORT PIECE FORMATION
Disclosed is a method for manufacturing a support piece for use in a manufacturing process of a semiconductor device which has a dolmen structure and which includes a substrate, a first chip disposed on the substrate, a plurality of support pieces arranged on the substrate so as to surround the first chip, and a second chip supported by the support pieces and disposed so as to cover the first chip, the method including: (A) a step for preparing a laminate film provided with, in this order, a base material film, an adhesive layer, and a support piece formation film which has a multilayer structure including at least a metal layer; (B) a step for forming a plurality of support pieces on a surface of the adhesive layer by dividing the support piece formation film into individual pieces; and (C) a step for picking up the support pieces from the adhesive layer.
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
9.
SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND METHOD FOR MANUFACTURING SAME
This semiconductor device having a dolmen structure includes: a substrate; a first chip disposed on the substrate; a plurality of support pieces arranged on the substrate so as to surround the first chip; and an adhesive-attached chip which is supported by the support pieces and disposed so as to cover the first chip, wherein the adhesive-attached chip includes a second chip and an adhesive piece provided on one surface of the second chip, and the shear strength between the support pieces and the adhesive-attached chip at 250°C is 3.2 MPa or more.
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
10.
ORGANIC ELECTRONICS MATERIAL AND METHOD FOR PREPARING CHARGE-CARRYING POLYMER
An embodiment of the present invention pertains to an organic electronics material containing a charge transport polymer which includes: a structural unit represented by formula (1); at least one structural unit selected from the group consisting of a structural unit represented by formula (2-1) and a structural unit represented by formula (2-2); and a structural unit which is represented by formula (3) an of which an amount is 85-100 mol% with respect to the total amount of monovalent structural units.
H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
11.
ORGANIC ELECTRONIC MATERIAL AND METHOD FOR PRODUCING CHARGE-TRANSPORTING POLYMER
An embodiment of the present invention relates to an organic electronic material which includes a charge-transporting polymer comprising a structural unit represented by formula (1), at least one structural unit selected from the group consisting of structural units represented by formula (2-1) and structural units represented by formula (2-2), a structural unit represented by formula (3), and at least one structural unit selected from the group consisting of structural units represented by formula (4-1) and structural units represented by formula (4-2).
H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
12.
MOISTURE-CURABLE HOT-MELT ADHESIVE COMPOSITION, BONDED OBJECT, AND GARMENT
A moisture-curable hot-melt adhesive composition is disclosed. The moisture-curable hot-melt adhesive composition comprises: a urethane prepolymer which includes a polymer chain comprising a structural unit derived from a polyol and a structural unit derived from a polyisocyanate and has two or more isocyanate groups; and a modified urethane prepolymer which includes a polymer chain comprising a structural unit derived from a polyol and a structural unit derived from a polyisocyanate and has one or more isocyanate groups modified with a castor oil monool.
D06M 15/572 - Reaction products of isocyanates with polyesters or polyesteramides
C08G 18/10 - Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
13.
SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND SUPPORT PIECE FORMATION LAMINATE FILM AND MANUFACTURING METHOD THEREFOR
A support piece formation laminate film according to the present disclosure comprises: a base film; a pressure-sensitive adhesive layer; and a support piece formation film in this order, wherein the support piece formation film has a multilayer structure including at least a metal layer. This support piece formation laminate film is applied to a process of manufacturing a semiconductor device having a dolmen structure, the semiconductor device comprising: a substrate; a first chip disposed on the substrate; a plurality of support pieces arranged on the substrate and around the first chip; and a second chip supported by the plurality of support pieces and disposed to cover the first chip.
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
14.
SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND METHOD FOR MANUFACTURING SAME, AND LAMINATED FILM FOR FORMING SUPPORT PIECE AND METHOD FOR MANUFACTURING SAME
The laminated film for forming a support piece according to the present invention includes, in order, a base film, an adhesive layer, and a film for forming a support piece, wherein the film for forming a support piece has a multilayer structure including at least a resin layer having a tensile elasticity of 8.0 MPa or more. This laminated film for forming a support piece is applied to a manufacturing process of a semiconductor device having a dolmen structure including a substrate, a first chip disposed on the substrate, a plurality of support pieces disposed on the substrate around the first chip, and a second chip supported by the plurality of support pieces and disposed so as to cover the first chip.
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
15.
SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND SUPPORT PIECE FORMATION LAMINATE FILM AND MANUFACTURING METHOD THEREFOR
A semiconductor device according to the present disclosure has a dolmen structure including: a substrate; a first chip disposed on the substrate; a plurality of support pieces arranged on the substrate and around the first chip; and a second chip supported by the plurality of support pieces and disposed to cover the first chip, wherein the support piece is made of a cured product of a thermosetting resin composition or includes a layer made of a cured product of the thermosetting resin composition and a resin layer or a metal layer.
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
16.
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE, AND METHOD FOR MANUFACTURING SUPPORT PIECE
One aspect of the present disclosure is a method for manufacturing a support piece to be used in the formation of a dolmen structure of a semiconductor device, the method comprising: (A) a step for preparing a layered film comprising, in the stated order, a base material film, an adhesive layer, and a support piece formation film made of a thermosetting resin layer, for example; (B) a step for forming a plurality of support pieces on the surface of the adhesive layer by solidifying the support piece formation film; and (C) a step for picking up the support pieces in a state where the support pieces are pushed up from the base material film side by a member having a plurality of needles or a flat distal end surface.
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
17.
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE, METHOD FOR MANUFACTURING SUPPORT PIECE, AND LAMINATED FILM
One aspect of the present invention is a method for manufacturing a support piece used to form a dolmen structure in a semiconductor device, the method comprising (A) a step of preparing a laminated film which includes, in order, a base film, an adhesive layer, and a film for forming a support piece comprising, for example, a thermosetting resin layer, and (B) a step of forming a plurality of support pieces on the surface of the adhesive layer by singulating the film for forming a support piece, wherein the step (B) includes, in order, a step of forming a cut part way through the thickness of the film for forming a support piece, and singulating, by expansion, the film for forming a support piece which is cooled.
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
18.
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND METHOD FOR PRODUCING SUPPORTING PIECES
A method for producing supporting pieces according to the present disclosure comprises: (A) a step for preparing a multilayer film that sequentially comprises, in the following order, a base material film, an adhesive layer and a film for forming supporting pieces, said film being formed, for example, of a thermosetting resin layer; (B) a step for bonding a dicing ring to the peripheral region of the adhesive layer; (C) a step for forming a plurality of supporting pieces on a second surface of the adhesive layer by dividing the film for forming supporting pieces into separate pieces; and (D) a step for heating a part of the base material film positioned in the inside region of the dicing ring, thereby shrinking the base material film positioned in the inside region.
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
19.
RESIN COMPOSITION, WRAP FILM AND WRAP FILM-CONTAINING BODY
One aspect of the present invention is a resin composition which contains a thermoplastic resin and a compound having an ester group and an epoxy group, wherein the compound has a molecular weight of from 300 to 1,500 (inclusive).
One aspect of the present invention is a method for producing supporting pieces that are used for the formation of a dolmen structure of a semiconductor device, which comprises: (A) a step for preparing a multilayer film that sequentially comprises a base material film, an adhesive layer and a film for forming supporting pieces, said film being formed, for example, of a thermosetting resin layer, in this order; and (B) a step for forming a plurality of supporting pieces on the surface of the adhesive layer by dividing the film for forming supporting pieces into separate pieces. The step (B) sequentially comprises, in the following order, a step for providing the film for forming supporting pieces with a cut to a partway point in the thickness direction, and a step for dividing the film for forming supporting pieces, said film being in a cooled state, into separate pieces by means of expansion.
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
21.
SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE, METHOD FOR MANUFACTURING SAME, LAMINATED FILM FOR FORMING SUPPORT PIECE, AND METHOD FOR MANUFACTURING SAME
A laminated film for forming a support piece according to this disclosure is provided with, in this order, a base material film, a pressure-sensitive adhesive layer, and a support piece-forming film, wherein the support piece-forming film has a multilayer structure including at least a metal layer. The laminated film for forming a support piece is applied in a process for manufacturing a semiconductor device having a dolmen structure comprising a substrate, a first chip disposed on the substrate, a plurality of support pieces disposed around the first chip on the substrate, and a second chip which is supported by the plurality of support pieces and disposed so as to cover the first chip.
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
22.
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE, METHOD FOR MANUFACTURING SUPPORT PIECE, AND LAMINATE FILM FOR SUPPORT PIECE FORMATION
This method is for manufacturing a support piece for use in a manufacturing process of a semiconductor device which has a dolmen structure and which includes a substrate, a first chip disposed on the substrate, a plurality of support pieces arranged on the substrate so as to surround the first chip, and a second chip supported by the support pieces and disposed so as to cover the first chip, the method including: (A) a step for preparing a laminate film provided with a base material film, an adhesive layer, and a support piece formation film in this order; (B) a step for forming a plurality of support pieces on the surface of the adhesive layer by dividing the support piece formation film into individual pieces; and (C) a step for picking up the support pieces from the adhesive layer, wherein the shear viscosity of the support piece formation film at 120°C is 4000 Pa·s or more.
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
23.
SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND METHOD FOR MANUFACTURING SAME, AND LAMINATED FILM FOR FORMING SUPPORT PIECE AND METHOD FOR MANUFACTURING SAME
The laminated film for forming a support piece according to the present invention includes, in order, a base film, an adhesive layer, and a film for forming a support piece, wherein the film for forming a support piece has a multilayer structure including at least a resin layer having a tensile elasticity of 8.0 MPa or more. This laminated film for forming a support piece is applied to a manufacturing process of a semiconductor device having a dolmen structure including a substrate, a first chip disposed on the substrate, a plurality of support pieces disposed on the substrate around the first chip, and a second chip supported by the plurality of support pieces and disposed so as to cover the first chip.
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
24.
COMPOUND, MOLDED ARTICLE, HARDENED PRODUCT OF COMPOUND, AND METHOD FOR MANUFACTURING COMPOUND
This compound comprises a metal filler containing a first metal powder, and a resin composition. The first metal powder contains a plurality of first metal particles, at least some of the surface of the first metal particles being covered by glass that contains Si, and the median diameter in the first metal powder being 1.0 to 5.0 µm [inclusive].
H01F 1/26 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
H01F 1/14 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
The present disclosure pertains to a sound-absorbing material comprising, in the following order: a resin film; a first substrate layer having communication holes; and a second substrate layer having communication holes.
G10K 11/16 - Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
B32B 5/22 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous
The present disclosure pertains to a sound-absorbing material comprising, in the following order: a first substrate layer having communication holes; an adhesive layer; and a second substrate layer having communication holes.
G10K 11/16 - Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
B32B 5/22 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous
The present disclosure pertains to a sound absorbing material comprising, in the following order: a first substrate layer having a communication hole; an adhesive layer; and a second substrate layer having a communication hole.
The present disclosure pertains to a sound-absorbing material comprising, in the following order, a resin film, a first substrate layer having communication holes, and a second substrate layer having communication holes.
The present invention relates to a sound-absorbing material comprising, in the following order, a first resin film, a first substrate layer, which has interconnected pores, a second resin film, and a second substrate layer, which has interconnected pores.
The present disclosure pertains to a sound-absorbing material comprising, in the following order: a first resin film; a first substrate layer having communication holes; a second resin film; and a second substrate layer having communication holes.
G10K 11/16 - Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
B32B 5/22 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous
Provided is a method for manufacturing a rare earth non-sintered magnet, the method involving a step for heat-treating a molded body including rare earth element-containing magnetic material particles in an atmosphere including oxygen.
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
B22F 3/00 - Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sinteringApparatus specially adapted therefor
H01F 1/055 - Alloys characterised by their composition containing rare earth metals and magnetic transition metals, e.g. SmCo5
H01F 1/059 - Alloys characterised by their composition containing rare earth metals and magnetic transition metals, e.g. SmCo5 and Va elements, e.g. Sm2Fe17N2
32.
WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT, AND IMAGE DISPLAY DEVICE
This wavelength conversion member is provided with a wavelength conversion layer containing a phosphorous and a light diffusion material, and satisfies at least one of (1) and (2) below. (1) The diffuse transmittance is less than or equal to 50% and the wavelength conversion layer thickness is less than or equal to 100 μm. (2) The content ratio of the light diffusion material is greater than or equal to 2.0 mass% of the entire wavelength conversion layer.
This composite material contains: aerogel particles; and at least one type of a cellulose-based resin selected from the group consisting of cellulose and cellulose derivatives, wherein the content of the aerogel particles is 95 vol% or more.
This coating liquid contains: aerogel particles; at least one type of a cellulose-based resin selected from the group consisting of cellulose and cellulose derivatives; an amphiphilic compound having a macrocyclic structure; and a liquid medium.
OPTICALLY SOFTENING RESIN COMPOSITION, METHOD FOR PRODUCING SOFTENED PRODUCT OF OPTICALLY SOFTENING RESIN COMPOSITION, CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME, AND PATTERNED FILM AND METHOD FOR PRODUCING SAME
The present invention discloses an optically softening resin composition which contains a compound having a disulfide bond and a radical scavenger. The present invention also discloses a curable resin composition which contains a monomer having a disulfide bond and a functional group, a monomer having a substituent that is reactive with a functional group, and a radical scavenger.
B01J 23/83 - Catalysts comprising metals or metal oxides or hydroxides, not provided for in group of the iron group metals or copper combined with metals, oxides or hydroxides provided for in groups with rare earths or actinides
A lithium ion secondary battery which is provided with: a positive electrode that contains, as a positive electrode active material, an active material into which lithium ions are intercalated and deintercalated at a potential of 4.5 V or more with respect to the lithium potential; a negative electrode that contains, as a negative electrode active material, an active material into which lithium ions are intercalated and deintercalated at a potential of 0.4 V or more with respect to the lithium potential; a separator that is interposed between the positive electrode and the negative electrode; and an electrolyte solution that contains a lithium salt and a nonaqueous solvent. This lithium ion secondary battery is configured such that: the nonaqueous solvent contains a phosphoric acid ester that contains fluorine atoms; and the content of the phosphoric acid ester that contains fluorine atoms is more than 5% by volume with respect to the total amount of the nonaqueous solvent.
A photosensitive resin composition comprising a component (A) that is an organic compound having thermal crosslinkability, a component (B) that is an aliphatic compound having at least one member selected from the group consisting of at least three acryloyloxy groups, at least three methacryloyloxy groups, at least three glycidyloxy groups and at least three hydroxyl groups, and a component (C) that is a photo-responsive acid generator, wherein, when the photosensitive resin composition is irradiated with light having a wavelength of 365 nm at a light exposure amount of 1000 mJ/cm2 to form an exposed portion and then each of the exposed portion and an unexposed portion in the photosensitive resin composition is brought into contact with a 2.38-mass% aqueous tetramethylammonium hydroxide solution, the dissolution rate of the exposed portion is 0.05 μm/s or less and the dissolution rate of the unexposed portion is 1.0 μm/s or more.
A lithium ion secondary battery which is provided with: a positive electrode that contains, as a positive electrode active material, an active material into which lithium ions are intercalated and deintercalated at a potential of 4.5 V or more with respect to the lithium potential; a negative electrode that contains, as a negative electrode active material, an active material into which lithium ions are intercalated and deintercalated at a potential of 0.4 V or more with respect to the lithium potential; a separator that is interposed between the positive electrode and the negative electrode; and an electrolyte solution that contains a lithium salt and a nonaqueous solvent. This lithium ion secondary battery is configured such that: the nonaqueous solvent contains at least one compound that is selected from the group consisting of phosphoric acid esters which contain fluorine atoms, ethers which contain fluorine atoms and carboxylic acid esters which contain fluorine atoms; and the content of the compound is more than 5% by volume with respect to the total amount of the nonaqueous solvent.
Provided is a lead storage battery 100 comprising a positive electrode 10, a negative electrode 20, and an electrolyte 40, wherein the positive electrode 10 has a tube 10a for retaining an active material, the negative electrode 20 has a negative electrode material that contains a surfactant, and the total content of surfactants in the electrolyte 40, other than the surfactant in the negative electrode material, is at most 0.1 mass%.
This invention pertains to a resin composition containing: a phosphate ester flame retardant (A) having an aromatic hydrocarbon group containing two or more aromatic ring structures; and a polyphenylene ether derivative (B) having an ethylenically unsaturated bond-containing group at both terminals.
C08G 73/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
C08K 3/013 - Fillers, pigments or reinforcing additives
C08K 5/521 - Esters of phosphoric acids, e.g. of H3PO4
C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C08L 79/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chainPolyhydrazidesPolyamide acids or similar polyimide precursors
Provided is a polishing solution containing abrasive grains, a first nitrogen-containing compound, a second nitrogen-containing compound, and water, wherein the first nitrogen-containing compound comprises at least one selected from the group consisting of: (I) a compound including an aromatic ring having one nitrogen atom in the ring, and a hydroxyl group; (II) a compound including an aromatic ring having one nitrogen atom in the ring, and a functional group including a nitrogen atom; (III) a compound including a six-membered ring having two nitrogen atoms in the ring; (IV) a compound including a benzene ring and a ring including a nitrogen atom in the ring; and (V) a compound including a benzene ring to which two or more functional groups having a nitrogen atom are attached. The second nitrogen-containing compound has an HLB value of more than or equal to 7.
Disclosed is an adhesive agent set comprising a main agent and a curing agent, wherein: the main agent contains a urethane prepolymer having an isocyanate group as a terminal group, and a multimer of a hexamethylene diisocyanate including at least two unmodified isocyanate groups and an isocyanate group modified by a silane coupling agent including a mercapto group or an amino group; and the curing agent contains a polyol.
Disclosed is a die-bonding film for attaching a semiconductor chip to a support member on which the semiconductor chip is to be mounted. The elongation at break of the die-bonding film is 5% or less at -15°C. The die-bonding film also contains an epoxy resin, an epoxy resin curing agent, and an epoxy group-containing (meth)acrylic copolymer. The sum of the contained amounts of the epoxy resin and the epoxy resin curing agent is not less than 10 mass% but less than 30 mass% with respect to the total amount of the epoxy resin, the epoxy resin curing agent, and the epoxy group-containing (meth)acrylic copolymer. The elongation at break of the die-bonding film is 5% or less at -15°C.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
A cooling structure that comprises: a passage formation member that is made of resin and forms a passage through which a refrigerant is made to flow; and a cooling fin that extends from an inner wall of the passage toward the inside of the passage. The tip of the cooling fin contacts the inner wall, and at least the surface of the cooling fin is made of resin.
H01L 23/467 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing gases, e.g. air
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
This cooling structure is provided with: a flow passage forming member that is made of resin and forms a flow passage that circulates a coolant; an inflow port that causes the coolant to flow into the flow passage; an outflow port that causes the coolant to flow out of the flow passage; and a plurality of objects to be cooled that are to be cooled by the coolant, wherein the flow passage is configured such that the coolant introduced from the inflow port directly reach at least two of the objects to be cooled.
H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H01L 23/467 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing gases, e.g. air
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
This cooling structure is provided with a resin flowpath forming member which forms a flowpath for circulating a refrigerant, a plate-shape, metal thermal diffusion unit which is embedded in the flowpath forming member or is bonded to the flowpath forming member, and one or multiple cooling fins which extend from the thermal diffusion unit into the flow path, and at least the surface of which is made of resin.
H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H01L 23/467 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing gases, e.g. air
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
Provided is a cooling structure comprising: a resin-made flow channel forming member that forms a flow channel through which a coolant circulates; a protruding part at which the flow channel protrudes outwardly in a direction of the flow channel from an inner wall at an upstream side in a circulation direction of the coolant; and a flow adjusting part for adjusting the circulation direction of the coolant to the protruding part side.
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
Provided is a cooling structure provided with: a flow passage forming member that is made of resin and forms a flow passage which circulates a coolant; a plate-like thermal diffusion unit embedded in the flow passage forming member or joined to the flow passage forming member; one cooling fin or a plurality of cooling fins extending from the thermal diffusion unit into the flow passage; and a busbar that transfers heat to the thermal diffusion unit, wherein there is a space between the outer wall surface of the flow passage forming member and the busbar, and thus the flow passage forming member and the busbar do not make contact with each other.
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
H05K 7/06 - Arrangements of circuit components or wiring on supporting structure on insulating boards
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
51.
RESIN FORMED ARTICLE AND METHOD FOR PRODUCING RESIN FORMED ARTICLE
This resin formed article includes: a main body containing a first resin; a functional layer which is disposed on at least a part of the surface of the main body and contains a fiber and a second resin; and a protrusion disposed on the functional layer, wherein the protrusion contains the first resin and the second resin.
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
B29C 45/56 - Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
B32B 3/02 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
52.
ADHESIVE AGENT FOR SEMICONDUCTOR, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
This adhesive agent for a semiconductor contains a resin having a weight-average molecular weight of less than 10,000, a curing agent, an inorganic filler, and a silicone rubber filler.
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
This resin composition contains insulating filler with a 6.0 or higher specific gravity, and a resin that has a polar group, wherein the content ratio of the insulating filler with a 6.0 or higher specific gravity is greater than or equal to 50 vol% of the total solids of the resin composition.
C08L 33/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofCompositions of derivatives of such polymers
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C08L 67/00 - Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chainCompositions of derivatives of such polymers
C08L 71/00 - Compositions of polyethers obtained by reactions forming an ether link in the main chainCompositions of derivatives of such polymers
C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
54.
EPOXY RESIN, EPOXY RESIN COMPOSITION, EPOXY RESIN CURED PRODUCT, AND COMPOSITE MATERIAL
This epoxy resin contains the reaction product of an epoxy compound having a mesogenic structure, and of at least one item selected from the group consisting of aromatic hydroxycarboxylic acid formed by a carboxyl group and a hydroxyl group bonding to an aromatic ring and an aromatic dicarboxylic acid formed by two carboxylic groups bonding to an aromatic ring.
Disclosed is a production method that is for a semiconductor device, the method comprising: a step for preparing a dicing/die-bonding integrated adhesive sheet including an adhesive layer made of a die-bonding film having an elongation at break of 5% or less at -15°C, a pressure-sensitive adhesive layer, and a substrate film, which are stacked in that order; a step for preparing a semiconductor wafer, and forming a modified layer on the semiconductor wafer; a step for pasting the adhesive layer surface of the dicing/die-bonding integrated adhesive sheet to the semiconductor wafer; a step for expanding the substrate film to separate the semiconductor wafer and the adhesive layer into pieces, and thereby producing semiconductor chips having the adhesive layer; a step for picking up a semiconductor chip having the adhesive layer from the pressure-sensitive adhesive layer; and a step for adhering the semiconductor chip having the adhesive layer to a support substrate for mounting a semiconductor chip with the adhesive layer interposed therebetween.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
H01L 21/52 - Mounting semiconductor bodies in containers
56.
LUBRICANT, POWDERED MIXTURE, AND METHOD FOR PRODUCING SINTERED BODY
This lubricant contains lubricant A, which is a compound in which at least one monovalent organic group having at least one hydroxy group is bonded to the nitrogen atom of an amide bond.
Provided is a speckle noise reduction optical system that is low-cost, compact in size, and quiet. One preferable aspect of the present invention pertains to a speckle noise reduction optical system characterized by being provided with: a light source for emitting a laser beam; an integrator which is transparent to the laser beam and has particles filled in a part thereof; and an oscillation unit which oscillates the laser beam relative to the integrator at a speed greater than zero, wherein the laser beam progresses inside the integrator, resulting in the laser beam emitted from the integrator to have a reduced level of speckle noise.
Disclosed is a method for producing a cured product of a urethane prepolymer composition containing a urethane prepolymer. The production method includes a step of moisture-curing a urethane prepolymer composition to obtain a first cured product of the urethane prepolymer composition, and a step of heating the first cured product to obtain a second cured product of the urethane prepolymer composition. The urethane prepolymer has a structural unit derived from a polyol including a structural unit derived from a crystalline polyol.
A cooling structure of the present invention is provided with: a resin flow-path-forming member which forms a flow path through which a refrigerant circulates; and a cooling fin in which at least a surface provided extending from an inside wall of the flow path into the flow path is made out of resin, wherein a surface roughness Ra of a portion of the cooling fin which comes in contact with the refrigerant is 10 µm or more.
H01L 23/467 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing gases, e.g. air
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
60.
LUBRICANT, POWDERED MIXTURE, AND METHOD FOR PRODUCING SINTERED BODY
This lubricant contains lubricant A, which is a compound in which at least one monovalent organic group having at least one hydroxy group is bonded to the nitrogen atom of an amide bond.
A circuit sheet (11) includes: a first circuit (1) having a first average thickness and a first circuit pitch; a second circuit (2) having a second average thickness which is thinner than the first average thickness, and a circuit pitch; and a resin (3) filling in a space between the first circuit and the second circuit.
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 3/20 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
62.
RESIN COMPOSITION, CURED PRODUCT, SEMICONDUCTOR ELEMENT, AND ELECTRONIC DEVICE
This resin composition contains a resin component, a disulfide compound, and a cross-linking agent. This cured product is obtained by curing the resin composition. This semiconductor element includes the cured product. This electronic device is provided with the semiconductor element.
A resin composition for sealing which contains an epoxy resin, a curing agent, and an inorganic filler material, wherein the inorganic filler material comprises an inorganic filler material which has been surface treated.
Disclosed is an adhesive agent composition containing a thermosetting resin, a curing agent, an elastomer, and an inorganic filler, wherein the curing agent contains a phenol resin having an alicyclic ring, and the contained amount of the elastomer is 10-80 parts by mass with respect to 100 parts by mass of the thermosetting resin. Also disclosed are: a film-like adhesive agent using such an adhesive agent composition; and an adhesive sheet and a semiconductor device manufacturing method which use such a film-like adhesive agent.
C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
H01L 21/52 - Mounting semiconductor bodies in containers
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
66.
WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT, IMAGE DISPLAY DEVICE, AND WAVELENGTH CONVERSION RESIN COMPOSITION
This wavelength conversion member comprises: quantum dot phosphor bodies and filler; and a resin cured article that encloses the quantum dot phosphor bodies and filler. The content of the filler is at least 3 mass% with respect to the total amount of the resin cured product.
ADHESIVE FILM FOR CIRCUIT CONNECTION, MANUFACTURING METHOD THEREOF, MANUFACTURING METHOD OF CIRCUIT CONNECTION STRUCTURE, AND ADHESIVE FILM ACCOMMODATING SET
An adhesive film 1 for circuit connection comprises a first adhesive layer 2 and a second adhesive layer 3 laminated on the first adhesive layer 2, wherein the first adhesive layer 2 is composed of a photocured product of a photocurable thermosetting composition including a polymerizable compound, a photopolymerization initiator, a thermal polymerization initiator, and conductive particles 4, and the second adhesive layer 3 is composed of a thermosetting composition.
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H01B 5/16 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
H05K 1/14 - Structural association of two or more printed circuits
H05K 3/36 - Assembling printed circuits with other printed circuits
Disclosed are: an adhesive agent composition containing a thermosetting resin, an elastomer, and a curing agent that contains a phenol resin having an alicyclic ring; a film-like adhesive agent using such an adhesive agent composition; and an adhesive sheet and a semiconductor device manufacturing method which use such a film-like adhesive agent.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
H01L 21/52 - Mounting semiconductor bodies in containers
69.
COMPOSITION FOR FORMING BARRIER MATERIAL, BARRIER MATERIAL AND METHOD FOR PRODUCING SAME, AND PRODUCT AND METHOD FOR PRODUCING SAME
The present invention provides a composition for forming a barrier material containing a silane oligomer and a silane monomer having a reactive functional group. At least part of the silane oligomer is modified by a metal alkoxide.
C08G 79/10 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon a linkage containing aluminium
This photosensitive resin composition contains an alkali-soluble resin, a nadiimide compound that is represented by formula (1), a thermal crosslinking agent, and a compound that generates an acid by means of light. In formula (1), each R11independently indicates an allyl group, m is 0 or 1, and R12 indicates a divalent organic group.
This wavelength conversion member comprises: quantum dot phosphor bodies and filler; and a resin cured article that encloses the quantum dot phosphor bodies and filler. The content of the filler is at least 3 mass% with respect to the total amount of the resin cured product.
F21S 2/00 - Systems of lighting devices, not provided for in main groups or , e.g. of modular construction
F21V 9/45 - Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters with provision for controlling spectral properties, e.g. colour, or intensity by adjustment of photoluminescent elements
One aspect of the present invention is a curable composition containing a compound represented by formula (1) and a polymerization initiator. In formula (1), R11and R12each independently represent a hydrogen atom or a methyl group, and R13 represents a divalent group having a polyoxyalkylene chain.
One aspect of the present invention is a curable composition containing a compound represented by formula (1) and a polymerization initiator. In formula (1), R11and R12each independently represent a hydrogen atom or a methyl group, and R13 represents a divalent group having a polyoxyalkylene chain.
A circuit-connecting adhesive film 1 comprising a first adhesive layer 2 and a second adhesive layer 3 layered upon the first adhesive layer 2, wherein the first adhesive layer 2 is formed from a cured product of a photosetting composition, the second adhesive layer 3 is formed from a thermosetting composition, the photosetting composition contains a polymerizable compound, a photoinitiator having an oxime ester structure, and conductive particles 4, and the photoinitiator content is 0.3-1.2 mass% in terms of the total amount of the components other than the conductive particles in the photosetting composition.
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H01B 5/16 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
75.
ADHESIVE FILM FOR CIRCUIT CONNECTION AND METHOD FOR PRODUCING SAME, METHOD FOR PRODUCING CIRCUIT CONNECTED STRUCTURE, AND ADHESIVE FILM HOUSING SET
One aspect of the present invention is an adhesive film for circuit connection, provided with: a first adhesive layer containing conductive particles and a second adhesive layer disposed on the first adhesive layer, wherein the shortest distance from the surface on the first adhesive layer side of the adhesive film to the surface of the conductive particles is greater than 0 µm but 1 µm or less; the ratio of the thickness of the first adhesive layer to the average particle diameter of the conductive particles is 10 to 80%; and the ratio of the thickness of the second adhesive layer to the total thickness of the first adhesive layer and the second adhesive layer is less than 96%.
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
H05K 3/36 - Assembling printed circuits with other printed circuits
76.
ADHESIVE FILM FOR CIRCUIT CONNECTION, METHOD FOR PRODUCING CIRCUIT CONNECTED STRUCTURE, AND ADHESIVE FILM HOUSING SET
An adhesive film 11 for circuit connection is provided with: a peelable support film 12, a first adhesive layer 13 containing conductive particles P, the first adhesive layer being disposed on the support film; and a second adhesive layer 14 disposed on the first adhesive layer 13. The thickness of the first adhesive layer is 0.1 to 1.0-times the average particle diameter of the conductive particles.
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
C08F 2/48 - Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
C09J 7/10 - Adhesives in the form of films or foils without carriers
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
H05K 1/14 - Structural association of two or more printed circuits
77.
FRICTION MEMBER, FRICTION MATERIAL COMPOSITION, FRICTION MATERIAL, AND VEHICLE
The present invention provides: a friction member having a friction material that (1) has a stable friction coefficient in a wide frequency band from low frequency to high frequency, making brake squeal and abnormal sounds less likely to occur, and (2) has a high friction coefficient, even though the friction material does not contain copper, or else has a copper content of less than 0.5 mass% as copper element; a friction material composition capable of providing the friction material; the friction material; and a vehicle equipped with the friction member or the friction material. Specifically, the friction member has a friction material and a back metal, wherein the friction material: does not contain copper, or else has a copper content of less than 0.5 mass% as copper element; substantially does not contain substances having a Mohs hardness exceeding 6.4; and contains wollastonite as a mineral fiber.
Disclosed is a method for manufacturing an electronic component device, said method comprising; a step of forming a via hole in a curable sealing resin layer disposed on a substrate by an imprint method of pressing a mold from the opposite side from the substrate, said via hole extending in the thickness direction of the sealing resin layer; a step of curing the sealing resin layer; a step of filling the via hole with a conductor precursor body; and a step of forming a conductive via by heating the conductor precursor body with which the via hole is filled.
Disclosed is a method for producing an electronic component, the method comprising: a step for arranging a plurality of electronic components on an adhesive layer of a composite substrate that is equipped with a support, a temporary fixing material layer, and the adhesive layer, while having a connection part making contact with the adhesive layer interposed between the adhesive layer and the electronic components; a step for fixing the plurality of electronic components to the composite substrate by hardening the adhesive layer; a step for forming a sealing layer for sealing the electronic components; a step for obtaining a sealed structure by removing the temporary fixing material layer from the adhesive layer; and a step for forming a circuit surface by grinding the sealed structure from the adhesive layer side. The electronic components include an IC chip and a chip-type passive component. The passive component is disposed on the adhesive layer by a method that comprises, in the following sequence: disposing, on the adhesive layer, a conductive body precursor used for forming a pattern as the connection part; placing the passive component on the conductive body precursor; and heating the conductive body precursor so as to form a conductive pattern as the connecting part.
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
H01L 25/04 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
A sealing composition that contains: a first epoxy resin which comprises, in each molecule, at least two benzene rings and at least one ether bond that connects the two benzene rings directly or via a linking group, and which is configured such that the two benzene rings do not have a substituent at the ortho position and the meta position of the bonding position of the ether bond; a curing agent; and an inorganic filler.
C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C08K 3/013 - Fillers, pigments or reinforcing additives
81.
METHOD FOR MANUFACTURING CIRCUIT BOARD, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT PACKAGE
This method for manufacturing a circuit board comprises: a step for pressurizing using a mold a laminate that includes a metal plate, an insulating material, and a circuit placed inside the mold in this order; and a step for supplying a sealing material to the mold in a state with the laminate pressurized by the mold.
H05K 3/20 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
A curable resin composition which comprises one or more epoxy resins and one or more hardeners, wherein the epoxy resins comprise an epoxy resin including an aromatic ring having no electron-donating group bonded thereto and having an epoxidized group bonded thereto and the hardeners comprise a hardener including an aromatic ring having an electron-donating group bonded thereto and having a hydroxyl group bonded thereto.
A lead storage battery 1 comprises an electrode plate group 7 in which a positive electrode plate 9 and a negative electrode plate 10 are stacked with a separator 11 being interposed therebetween, and a battery case 2 that houses the electrode plate group 7. The separators 11 adjacent to each other through the target electrode plate, which is either the positive electrode plate 9 or the negative electrode plate 10, are connected to each other on the target electrode plate side of a bottom portion 31 of the battery case 2. The separator 11 has a base portion 21 and a rib 22 protruding from the base portion 21. The rib 22 has a bottom rib portion 22a arranged between the base portion 21 and the bottom portion 31. The battery case 2 has a shape in which the base portion 21 does not reach the bottom portion 31 when the electrode plate group 7 is inserted into the battery case 2.
One aspect of the present invention is a polishing liquid containing abrasive grains, a copolymer, and a liquid medium, wherein the copolymer has a structural unit derived from at least one styrene compound selected from the group consisting of styrene and styrene derivatives and a structural unit derived from acrylic acid; the content of copolymer is from more than 0.01 mass% to 0.2 mass% based on the total weight of the polishing liquid; and the pH of the polishing liquid exceeds 4.5.
An expand tape used in a manufacturing method for a semiconductor device, the method comprising: a tape expanding step in which an expand tape is stretched whilst being heated, widening the interval between a plurality of semiconductor chips fixed onto the expand tape from 100µm or less to 300µm or more; an ultraviolet irradiation step in which ultraviolet light is irradiated on the stretched expand tape; and a peeling step in which the expand tape which has been irradiated with ultraviolet light is peeled away from the plurality of semiconductor chips, wherein the peel strength of the expand tape before the ultraviolet irradiation is at least 6N/25mm, and the peel strength after the ultraviolet irradiation is not more than 0.4N/25mm.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
An expand tape used in a manufacturing method for a semiconductor device, the method comprising: a tape expanding step in which an expand tape is stretched whilst being heated, widening the interval between a plurality of semiconductor chips fixed onto the expand tape from 100µm or less to 250µm or more; an ultraviolet irradiation step in which ultraviolet light is irradiated on the stretched expand tape; and a peeling step in which the expand tape which has been irradiated with ultraviolet light is peeled away from the plurality of semiconductor chips, wherein the peel strength of the expand tape before the ultraviolet irradiation is at least 6N/25mm, and the peel strength after the ultraviolet irradiation is not more than 0.4N/25mm.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
87.
SEPARATION MEMBRANE FOR MEMBRANE DISTILLATION, AND MEMBRANE DISTILLATION MODULE
A separation membrane for membrane distillation, which comprises a porous layer that has communicating pores, while having an average pore diameter of 1 μm or less and a tortuosity of 4 or less.
B01D 69/02 - Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or propertiesManufacturing processes specially adapted therefor characterised by their properties
Disclosed is a reactive hot-melt adhesive composition comprising a protected functional group-type silane coupling agent and a urethane prepolymer that contains a polymer chain containing a polyol-derived structural unit and a polyisocyanate-derived structural unit, and that has an isocyanate group as a terminal group on the polymer chain.
RESEARCH CENTER FOR ECO-ENVIRONMENTAL SCIENCES, CHINESE ACADEMY OF SCIENCES (China)
Inventor
Inui Yuji
Iwamuro Mitsunori
Murakami Yasuharu
Iwanaga Kouta
Kotake Tomohiko
Fujimoto Daisuke
Wang Jun
Zhang Yong
Hou Deyin
Abstract
The present invention provides a laminate having: a support substrate having communicated air holes; and a porous resin layer laminated on at least one surface of the support substrate, the porous resin layer having communicated air holes. The porous resin layer includes porous particles.
Disclosed is a film-like adhesive for adhering a semiconductor device and a support member on which the semiconductor device is mounted. The film-like adhesive contains an acrylic rubber. The acrylic rubber satisfies either of the following conditions (i) or (ii). Condition (i): the acrylic rubber has a constitutional unit derived from acrylonitrile and has a glass transition temperature (Tg) over 12°C. Condition (ii): The acrylic rubber has no constitutional unit derived from acrylonitrile and has a glass transition temperature (Tg) of at least 0°C.
C09J 119/00 - Adhesives based on rubbers, not provided for in groups
C09J 133/04 - Homopolymers or copolymers of esters
C09J 133/20 - Homopolymers or copolymers of acrylonitrile
H01L 21/52 - Mounting semiconductor bodies in containers
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
91.
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD
The present invention relates to a photosensitive resin composition which contains a binder polymer, a photopolymerizable compound and a photopolymerization initiator. The binder polymer contains a structural unit derived from a (meth)acrylate compound having a dicyclopentanyl group.
C08F 257/02 - Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group on to polymers of styrene or alkyl-substituted styrenes
C08F 265/06 - Polymerisation of acrylate or methacrylate esters on to polymers thereof
G03F 7/033 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
92.
METHOD FOR MANUFACTURING CIRCUIT BOARD, CIRCUIT BOARD, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING CIRCUIT BOARD MEMBER, METAL PLATE, AND CIRCUIT BOARD MEMBER
This method for manufacturing a circuit board includes: preparing a metal plate having a convex pattern; placing a resin layer between the metal plate and a board placed facing the rear surface of the surface of the metal plate on which the convex pattern is formed; and removing at least some of the portions of the metal plate other than the convex pattern.
H05K 3/20 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
93.
LATTICE BASE MATERIAL, ELECTRODE, AND LEAD STORAGE BATTERY
This lattice base material is provided with: a frame portion comprising a pair of first frame ribs disposed facing one another in a first direction, and a pair of second frame ribs disposed facing one another in a second direction intersecting the first direction; and, arranged inside the frame portion, first lattice ribs extending from one of the first frame ribs to the other first frame rib, and second lattice ribs extending from one of the second frame ribs to the other second frame rib. The second lattice ribs each include a first part from one of the second frame ribs to a boundary portion in the direction in which the second lattice ribs extend, and a second part from the boundary portion toward the other second frame rib, and the second lattice ribs are each formed in such a way that the average cross-sectional area of the first part is greater than the average cross-sectional area of the second part.
The present invention discloses a filmy adhesive for bonding a semiconductor element and a support member on which the semiconductor element is mounted. The filmy adhesive contains a heat-curable resin component and a labelling agent.
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
95.
RESIN COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
A resin composition comprising (a) a high-molecular-weight component having a weight average molecular weight of 10000 or more, (b) a heat-curable resin having a weight average molecular weight of less than 10000, (c) a curing agent and (d) a filler, wherein the filler (d) comprises strontium titanate.
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 179/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chainPolyhydrazidesPolyamide acids or similar polyimide precursors
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
96.
FRICTION MATERIAL COMPOSITION, FRICTION MATERIAL AND FRICTION MEMBER
The present invention provides a friction material composition which does not contain elemental antimony and does not contain elemental copper or has a copper content of less than 0.5% by mass in terms of elemental copper even if copper is contained therein, and is thus less harmful to the environment and the human body, but which still enables the achievement of a friction material that has a high static friction coefficient and a high friction coefficient during braking at high speeds and high temperatures, while exhibiting excellent wear resistance at high temperatures and not being susceptible to rust adhesion. The present invention specifically provides a friction material composition which contains a binder, an organic filler, an inorganic filler and a fiber base material, and which does not contain elemental copper or has a copper content of less than 0.5% by mass in terms of elemental copper even if copper is contained therein, and does not contain elemental antimony, while containing 5% by mass or less of iron fibers, 1-5% by mass of a zinc powder, 2.5-6% by mass of calcium hydroxide, 0.7-1.5% by mass of sodium carbonate and a silicone-containing phenolic resin.
One aspect of the present invention is an anisotropic heat-conducting resin member provided with a first fiber group comprising multiple stretched thermoplastic resin fibers that have been bundled and a second fiber group and a third fiber group branched from the first fiber group.
The present invention discloses an adhesive composition which contains a thermosetting resin, a curing agent and an elastomer, and which is configured such that: the thermosetting resin contains an epoxy resin that has an alicyclic ring; and the elastomer contains an elastomer that has a carboxy group. The present invention also discloses a film-like adhesive which uses this adhesive composition. The present invention additionally discloses: an adhesive sheet which uses this film-like adhesive; and a method for producing a semiconductor device.
C09J 133/02 - Homopolymers or copolymers of acidsMetal or ammonium salts thereof
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups or
In a lead storage battery 1, a positive grid body 12 has a grid portion 22 composed of a plurality of grid bones 26, 27, and a negative grid body 14 has a grid portion 32 composed of a plurality of grid bones 36, 37, wherein, seen along the direction in which a positive electrode 9, a negative electrode 10, and a separator 11 are stacked, in at least a portion of a region A of the grid portions 22 and 32, intersections C11, C12 of the grid bones of either one of the grid portions 22 and 32 are located in openings O1, O2 formed by the grid bones of the other grid portion of the grid portions 22 and 32.
