Abstract

A capacitive transducer or microphone includes a first substrate of one or more layers and which includes a first surface, a first cavity in the first surface, and a mesa diaphragm that spans the first cavity. The capacitive transducer or microphone includes a second substrate fixed to the first substrate. The second substrate has one or more layers which includes a second cavity having a nonplanar (e.g., contoured or structured or stepped) bottom surface that faces the mesa diaphragm. A shape or relief of the bottom surface of the cavity may advantageously be, to at least some degree, complementary to a deformed shape of the diaphragm. The second substrate may include one or more acoustic holes, non-uniformly distributed thereacross. One or more vents may vent the second cavity.

IPC Classes  ?

• H04R 19/04 - Microphones
• B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
• B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
• H04R 1/04 - Structural association of microphone with electric circuitry therefor
• H04R 7/04 - Plane diaphragms
• H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor

Abstract

A capacitive transducer or microphone includes a first substrate of one or more layers and which includes a first surface, a first cavity in the first surface, and a mesa diaphragm that spans the first cavity. The capacitive transducer or microphone includes a second substrate fixed to the first substrate. The second substrate has one or more layers which includes a second cavity having a nonplanar (e.g., contoured or structured or stepped) bottom surface that faces the mesa diaphragm. A shape or relief of the bottom surface of the cavity may advantageously be, to at least some degree, complementary to a deformed shape of the diaphragm. The second substrate may include one or more acoustic holes, non-uniformly distributed thereacross. One or more vents may vent the second cavity.

IPC Classes  ?

• H04R 19/04 - Microphones
• H04R 1/04 - Structural association of microphone with electric circuitry therefor
• H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
• H04R 7/04 - Plane diaphragms
• B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
• B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate

Abstract

Aspects of the disclosure provide a waterproof packaging technique for fabricating waterproof microphones in mobile devices. A device based on the waterproof packaging technique can include a microelectromechanical system (MEMS) device, a housing enclosing the MEMS device, and a liquid-resistant air inlet passive device (LRAPD) on the housing. The LRAPD can include at least one channel connecting an exterior of the housing with a chamber formed between the housing and the MEMS device. An inside surface of the channel can be coated with a liquid-repellant coating. In some examples, the liquid-repellant coating can be a self-assembled monolayer (SAM) coating.

IPC Classes  ?

• B81B 7/00 - Microstructural systems
• H04R 19/04 - Microphones
• H04R 1/44 - Special adaptations for subaqueous use, e.g. for hydrophone
• H04R 1/04 - Structural association of microphone with electric circuitry therefor
• H04R 1/28 - Transducer mountings or enclosures designed for specific frequency responseTransducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
• H04R 17/02 - Microphones

Abstract

A capacitive transducer or microphone includes a first substrate of one or more layers and which includes a first surface, a first cavity in the first surface, and a mesa diaphragm that spans the first cavity. The capacitive transducer or microphone includes a second substrate fixed to the first substrate. The second substrate has one or more layers which includes a second cavity having a nonplanar (e.g., contoured or structured or stepped) bottom surface that faces the mesa diaphragm. A shape or relief of the bottom surface of the cavity may advantageously be, to at least some degree, complementary to a deformed shape of the diaphragm. The second substrate may include one or more acoustic holes, non-uniformly distributed thereacross. One or more vents may vent the second cavity.

IPC Classes  ?

• H04R 19/00 - Electrostatic transducers
• H04R 19/04 - Microphones
• B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
• B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
• H04R 1/04 - Structural association of microphone with electric circuitry therefor
• H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
• H04R 7/04 - Plane diaphragms

Abstract

Aspects of the disclosure provide a packaging technique for making a directional microphone which employs mechanical structures to cancel undesired background noise to realize the directional function instead of an extra sensor required in electronic noise-cancelling techniques, thus reducing footprint and cost of a directional microphone. A directional microphone based on this technique can include an acoustic sensor and a housing enclosing the acoustic sensor. The acoustic sensor can include a sensing diaphragm, a cavity below the sensing diaphragm, and a first substrate. The directional microphone device can further include a channel with an inlet open at an edge of the first substrate and an outlet connected with the cavity. The housing can include a cover attached to a second substrate supporting the first substrate. The cover can include a first opening over the sensing diaphragm and a second opening at a side of the cover.

IPC Classes  ?

• H04R 19/04 - Microphones
• B81B 7/00 - Microstructural systems
• H04R 1/44 - Special adaptations for subaqueous use, e.g. for hydrophone
• H04R 1/04 - Structural association of microphone with electric circuitry therefor
• H04R 1/28 - Transducer mountings or enclosures designed for specific frequency responseTransducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
• H04R 17/02 - Microphones
• H04R 19/00 - Electrostatic transducers

Abstract

Aspect of the disclosure provide a packaging technique for making a directional microphone which employs mechanical structures to cancel undesired background noise to realize the directional function instead of an extra sensor required in electronic noise-cancelling techniques, thus reducing footprint and cost of a directional microphone. A directional microphone based on this technique can include an acoustic sensor and a housing enclosing the acoustic sensor. The acoustic sensor can include a sensing diaphragm, a cavity below the sensing diaphragm, and a first substrate. The directional microphone device can further include a channel with an inlet open at an edge of the first substrate and an outlet connected with the cavity. The housing can include a cover attached to a second substrate supporting the first substrate. The cover can include a first opening over the sensing diaphragm and a second opening at a side of the cover.

IPC Classes  ?

• H04R 19/04 - Microphones
• B81B 7/00 - Microstructural systems
• H04R 1/44 - Special adaptations for subaqueous use, e.g. for hydrophone
• H04R 1/04 - Structural association of microphone with electric circuitry therefor
• H04R 1/28 - Transducer mountings or enclosures designed for specific frequency responseTransducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
• H04R 17/02 - Microphones
• H04R 19/00 - Electrostatic transducers

Abstract

Aspects of the disclosure provide a packaging technique for making a directional microphone which employs mechanical structures to cancel undesired background noise to realize the directional function instead of an extra sensor required in electronic noise-cancelling techniques, thus reducing footprint and cost of a directional microphone. A directional microphone based on this technique can include an acoustic sensor and a housing enclosing the acoustic sensor. The acoustic sensor can include a sensing diaphragm, a cavity below the sensing diaphragm, and a first substrate. The directional microphone device can further includes a channel with an inlet open at an edge of the first substrate and an outlet connected with the cavity. The housing can include a cover attached to a second substrate supporting the first substrate. The cover can include a first opening over the sensing diaphragm and a second opening at a side of the cover.

IPC Classes  ?

• H04R 19/04 - Microphones
• B81B 7/00 - Microstructural systems
• H04R 1/44 - Special adaptations for subaqueous use, e.g. for hydrophone
• H04R 1/04 - Structural association of microphone with electric circuitry therefor
• H04R 1/28 - Transducer mountings or enclosures designed for specific frequency responseTransducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
• H04R 17/02 - Microphones
• H04R 19/00 - Electrostatic transducers

Abstract

The invention discloses a capacitive pressure sensor and a method of fabricating the same. The capacitive pressure sensor includes a fixed plate configured as a back plate, a movable plate configured as diaphragm for sensing pressure, wherein a cavity is formed between the fixed plate and the movable plate, an isolation layer between the fixed plate and the movable plate and electrical contacts thereof for minimizing the leakage current, plurality of damping holes for configuring the contour of the fixed plate as the deflected diaphragm when pressure is exerted, a vent hole extending to the cavity having resistive air path for providing equilibrium to the diaphragm and an extended back chamber for increasing the sensitivity of the capacitive pressure sensor. The capacitive pressure sensor is also configured for minimizing parasitic capacitance.

IPC Classes  ?

• G01L 1/14 - Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
• G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
• G01L 19/06 - Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
• B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate