Abstract

An integrated substrate includes: a dielectric substrate having a first surface and a second surface opposite to each other in a thickness direction of the dielectric substrate, where the dielectric substrate includes a first connection via running through the dielectric substrate in the thickness direction of the dielectric substrate; a first buffer layer on the first surface side and provided with a first hollowed-out pattern; a second buffer layer on the second surface side and provided with a second hollowed-out pattern; a first conductive structure in the first hollowed-out pattern; a second conductive structure in the second hollowed-out pattern; and a first connection electrode in the first connection via, where the first conductive structure and the second conductive structure are connected through, and form an integral structure with, the first connection electrode.

IPC Classes  ?

• H10W 70/65 -
• H01F 27/28 - CoilsWindingsConductive connections
• H10W 70/05 -
• H10W 70/63 -

Abstract

An antenna is provided. The antenna includes a plurality of radiating elements. A respective radiating element of the plurality of radiating elements includes a dielectric substrate, one or more radiating oscillators on the dielectric substrate, and one or more conductors configured to optimize polarization isolation of the antenna. The one or more conductors are spaced apart from the one or more radiating oscillators. The plurality of radiating elements are arranged along a first direction, and the one or more conductors are arranged along a direction substantially parallel to a second direction, the second direction being different from the first direction, and the first direction and the second direction intersecting each other.

IPC Classes  ?

• H01Q 21/26 - Turnstile or like antennas comprising arrangements of three or more elongated elements disposed radially and symmetrically in a horizontal plane about a common centre
• H01Q 1/52 - Means for reducing coupling between antennas Means for reducing coupling between an antenna and another structure
• H01Q 19/10 - Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces
• H01Q 21/08 - Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along, or adjacent to, a rectilinear path

Abstract

An adjustable phase shifter and a manufacturing method therefor, and an electronic device. The adjustable phase shifter includes: a first substrate and a second substrate, which are arranged opposite each other; an adjustable dielectric layer, which is arranged between the first substrate and the second substrate; a first electrode, which is located on the side of the first substrate facing the adjustable dielectric layer; and a second electrode, which is located on the side of the second substrate facing the adjustable dielectric layer, wherein an adjustable capacitor is formed in an overlap region between the first electrode and the second electrode.

IPC Classes  ?

• H01P 1/18 - Phase-shifters
• H01P 11/00 - Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type

Abstract

A packaging substrate and a manufacturing method therefor, and a packaged device. The packaging substrate comprises: a plurality of stacked substrate assemblies, the substrate assemblies each comprising a dielectric substrate and a plurality of connection portions penetrating the dielectric substrate in the direction of thickness thereof; and first redistribution layers, each of which is located between two adjacent substrate assemblies, wherein the first redistribution layers each comprise a first transmission sub-layer and a second transmission sub-layer which are stacked and electrically connected to each other, the first transmission sub-layer and the second transmission sub-layer being electrically connected to the connection portions of two adjacent substrate assemblies, respectively.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates

Abstract

Provided in the present disclosure are a package carrier board and a preparation method therefor. The package carrier board comprises a dielectric substrate, wherein the dielectric substrate has a first surface and a second surface facing away from each other, the first surface and the second surface being each provided with at least one recessed portion; an adhesive layer is provided in each recessed portion, and the material of the adhesive layer comprises an organic material; and the first surface and the second surface are each further provided with a first metal layer, the first metal layer covering at least one adhesive layer. The present disclosure can solve the problem of insufficient adhesion between metal and glass.

IPC Classes  ?

• H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
• H05K 1/05 - Insulated metal substrate

Abstract

The present disclosure belongs to the technical field of display. Provided are a package substrate and a manufacturing method therefor, and a functional substrate and a manufacturing method therefor. The package substrate comprises: a carrier plate, which comprises a first surface and a second surface arranged opposite each other in the thickness direction thereof; and a first circuit structure, which is located on the first surface, and comprises a capacitor and a wiring structure located on the side of the capacitor away from the carrier plate, the wiring structure comprising at least two wiring layers and a first insulation layer adjacent to the wiring layers. The present embodiment can optimize the manufacturing process for a package substrate, reduce process steps, and reduce manufacturing costs.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates
• H05K 1/02 - Printed circuits Details

Abstract

The present application relates to the technical field of pressure sensors, and discloses a pressure sensitive chip and a pressure sensor. The pressure sensitive chip comprises: a first substrate, a second substrate, a pressure sensing element, and a conductive portion. The pressure sensing element is located in a pressure reference cavity between the first substrate and the second substrate, and therefore, when the pressure sensitive chip is applied to a scenario where a pressure medium is a corrosive gas or liquid, the pressure sensing element will not be damaged. Therefore, the pressure sensitive chip in the present application can be used, without additional packaging, for measuring the pressure of a corrosive gas or liquid, which serves as the pressure medium. Compared with an existing oil-filled sensing element, the pressure sensitive chip has a smaller size and lower cost. Moreover, at least a portion of the conductive portion is located in a first through hole of the second substrate, and the end of the conductive portion facing away from the first substrate may be exposed through the first through hole. In this way, the conductive portion enables an electrical connection between the pressure sensing element located in the pressure reference cavity and an external circuit, thereby ensuring normal operation of the pressure sensitive chip.

IPC Classes  ?

• G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges

Abstract

A pressure sensing chip, comprising a substrate (101), a support layer (102), a pressure-sensitive structure (104), and a reinforcement layer (105). The substrate (101) comprises a pressure-sensing membrane portion (1011). The support layer (102) is disposed on one side of the substrate (101), a recess (1021) is formed in the surface of the support layer (102) close to the substrate (101), and a pressure cavity (103) is formed between the recess (1021) and the pressure-sensing membrane portion (1011). At least a portion of the pressure-sensitive structure (104) is embedded in the surface of the side of the pressure-sensing membrane portion (1011) close to the support layer (102), and a partial surface of the pressure-sensitive structure (104) is exposed in the pressure cavity (103). The reinforcement layer (105) is disposed on the side of the support layer (102) distant from the substrate (101), and is capable of preventing the support layer (102) above the pressure cavity (103) from being ruptured under pressure. Also provided are a manufacturing method for a pressure sensing chip and an electronic product comprising a pressure sensing chip.

IPC Classes  ?

• G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means

Abstract

The present disclosure provides a pressure sensor, including a base substrate (10), and a plurality of sensing units (100) on the base substrate (10). Each of the plurality of sensing units (100) includes a pressure sensing chamber (21), and orthogonal projections of at least two of pressure sensing chambers (21) on the base substrate (10) have areas different from each other. The present disclosure further provides a method for manufacturing a pressure sensor, and an electronic device.

IPC Classes  ?

• G01L 9/04 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers of resistance strain gauges
• B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate

Abstract

A composite sensor, comprising a pressure sensor (10), an accelerometer structure layer (20) and an encapsulation layer (30) which are stacked. The accelerometer structure layer (20) comprises a substrate (21) and a first cavity (22) provided on the substrate (21), the first cavity (22) passing through the substrate (21) in a direction perpendicular to the plane where the composite sensor is located; the accelerometer structure layer (20) further comprises a suspended structure (23), a plurality of connecting beams (24) and a plurality of bridges (25); the plurality of bridges (25) constitute at least one of a first Wheatstone bridge, a second Wheatstone bridge and a third Wheatstone bridge; the suspended structure (23) is located within the first cavity (22), the plurality of connecting beams (24) being arranged around the suspended structure (23), and the suspended structure (23) is connected to the substrate (21) by means of the plurality of connecting beams (24). The pressure sensor (10) comprises a carrier plate (11) and a plurality of piezoresistive members (12), the surface of the side of the piezoresistive members (12) close to the accelerometer structure layer (20) being exposed by the carrier plate (11). Also disclosed is manufacturing method for the composite sensor.

IPC Classes  ?

• G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means

Abstract

A liquid crystal antenna is provided. The liquid crystal antenna includes a liquid crystal layer, a first substrate, a second substrate, a first connection portion and a second connection portion. The first substrate and the second substrate are located on both sides of the liquid crystal layer in a first direction. The first substrate includes a plurality of first control lines, and the second substrate includes a plurality of second control lines. The first connection portion and the second connection portion are located on the same side edge of the liquid crystal antenna and are staggered in the first direction. The first connection portion is electrically connected to the plurality of first control lines, and the second connection portion is electrically connected to the plurality of second control lines.

IPC Classes  ?

• H01Q 21/00 - Antenna arrays or systems
• H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart

Abstract

A transparent antenna, wherein the transparent antenna includes: a supporting plate and a radiation element provided on one side of the supporting plate, wherein the radiation element includes a substrate and a first radiator provided on one side of the substrate, the first radiator has a grid-line-like structure, and the shape of the outer contour of the first radiator is a rectangle having at least one cut corner; and a connecting component, wherein the connecting component is electrically connected to the radiation element.

IPC Classes  ?

• H01Q 1/36 - Structural form of radiating elements, e.g. cone, spiral, umbrella
• H01Q 1/12 - SupportsMounting means
• H01Q 19/10 - Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces

Abstract

The present disclosure provides a radio frequency apparatus, an antenna and an electronic device, and belongs to the field of communication technology. The radio frequency apparatus includes first and second dielectric substrates opposite to each other, first and second phase shifting structures between the first and second dielectric substrates; wherein the radio frequency apparatus further includes a first connection electrode and a second connection electrode; the first phase shifting structure and the second phase shifting structure each have a first end and a second end, the first ends of the first phase shifting structure and the second phase shifting structure are electrically connected to each other by the first connection electrode; the second ends of the first phase shifting structure and the second phase shifting structure are electrically connected to each other by the second connection electrode, to form a ring circuit structure.

IPC Classes  ?

• H01Q 3/36 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture varying the phase by electrical means with variable phase-shifters

Abstract

A dimming device includes a first substrate (1), a first adhesive layer (3), a dimming assembly (5), a second adhesive layer (4) and a second substrate (2) sequentially stacked together. The dimming assembly includes a third substrate (51), a first sealant (52), a plurality of spacers (53), and a fourth substrate (54), the third substrate and the fourth substrate are aligned and assembled to form an alignment gap therebetween, and liquid crystal (50) is filled in the alignment gap. The spacers are positioned between the third substrate and the fourth substrate, and surrounded by the first sealant. The first sealant is positioned between the third substrate and the fourth substrate. The first adhesive layer and the second adhesive layer at least cover an effective dimming region of the dimming assembly. Each of the first and second adhesive layers may adopt a solid or liquid adhesive.

IPC Classes  ?

• G02F 1/1339 - GasketsSpacersSealing of cells
• B60J 3/04 - Antiglare equipment associated with windows or windscreensSun visors for vehicles adjustable in transparency

Abstract

A phase shifter includes a first dielectric substrate and a second dielectric substrate opposite to each other, a tunable dielectric layer between the first dielectric substrate and the second dielectric substrate, a first electrode layer on a side of the first dielectric substrate close to the tunable dielectric layer, a second electrode layer on a side of the second dielectric substrate close to the tunable dielectric layer, and a third electrode layer on a side of the first dielectric substrate away from the tunable dielectric layer. One of the first electrode layer or the second electrode layer includes a signal electrode for transmitting electromagnetic waves. The third electrode layer is provided with a first opening, and orthographic projections of the first opening and the signal electrode on the first dielectric substrate are partially overlapped.

IPC Classes  ?

• H01P 1/18 - Phase-shifters
• H01Q 3/36 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture varying the phase by electrical means with variable phase-shifters

Abstract

An antenna includes first and second phase adjustment structures, first and second feed lines, and a first radiation structure. The first phase adjustment structure includes first and second transmission lines, and the second phase adjustment structure comprises third and fourth transmission lines. Each of the first and second feed lines has a first end and a second end. The first end of the first feed line, the second end of the first feed line, the first end of the second feed line, and the second end of the second feed line are electrically connected to the first transmission line, the second transmission line, the third transmission line, and the fourth transmission line, respectively. The first and second feed lines are both electrically connected to the first radiation structure, and a feed direction of the first feed line is different from a feed direction of the second feed line.

IPC Classes  ?

• H01Q 3/26 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture
• H01Q 1/50 - Structural association of antennas with earthing switches, lead-in devices or lightning protectors

Abstract

A detection substrate and a manufacturing method thereof, a detector, and an imaging system are provided. The detection substrate includes: a base substrate including a pixel setting area; and a plurality of pixel units, located in the pixel setting area; the plurality of pixel units include a marking pixel, and at least one alignment mark is arranged in the marking pixel.

IPC Classes  ?

• H10F 39/00 - Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group , e.g. radiation detectors comprising photodiode arrays
• H10F 39/18 - Complementary metal-oxide-semiconductor [CMOS] image sensorsPhotodiode array image sensors

Abstract

Provided in the present disclosure are an integrated passive device and a manufacturing method therefor. The integrated passive device comprises: a base substrate provided with a first via hole and a second via hole; a first electrically conductive post and a second electrically conductive post located in the first via hole and the second via hole, respectively; a first electrically conductive layer located on one side of the base substrate; a second electrically conductive layer located on the side of the base substrate opposite the first electrically conductive layer, wherein the second electrically conductive layer comprises a first electrically conductive portion and a second electrically conductive portion that are separated from each other, the first electrically conductive portion is electrically connected to the first electrically conductive layer by means of the first electrically conductive post, and the second electrically conductive portion is electrically connected to the first electrically conductive layer by means of the second electrically conductive post; a dielectric layer located on the side of the first electrically conductive portion away from the base substrate; and a third electrically conductive layer located on the side of the dielectric layer away from the base substrate, wherein the first electrically conductive layer comprises a first metal material, at least one of the first electrically conductive portion and the third electrically conductive layer comprises a main body layer and an adhesive layer stacked together, and the main body layer comprises a second metal material different from the first metal material.

IPC Classes  ?

• H10D 1/68 - Capacitors having no potential barriers

Abstract

Provided is an antenna. The antenna includes: a first substrate, wherein the first substrate includes: a first dielectric substrate, including a main substrate and a side substrate, wherein the main substrate is provided with a first surface and a second surface, and the side substrate is provided with a third surface and a fourth surface; a first reference electrode layer, disposed on the first surface and the fourth surface; at least one support assembly, disposed on the second substrate; at least one radiation structure, disposed on a side of the support assembly; and at least one first feeder set, configured to feed one of the at least one radiation structure, wherein each of the at least one first feeder set includes a first feeder and a second feeder.

IPC Classes  ?

• H01Q 9/04 - Resonant antennas
• H01Q 21/08 - Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along, or adjacent to, a rectilinear path

Abstract

A radiation detection panel and a preparation method therefor, and a radiation detector. The radiation detection panel comprises a detection substrate (20) and a scintillator layer (10) located on one side of the detection substrate (20), wherein the scintillator layer (10) has scintillator units (100) arranged in an array; each scintillator unit (100) includes at least two layers of stacked scintillator sub-units; in any two adjacent layers of scintillator sub-units, the scintillator subunits on the side closer to the detection substrate (20) have a higher conversion rate for radiation rays than the scintillator subunits on the side farther away from the detection substrate (20), and the scintillator subunits on the side closer to the detection substrate (20) have a lower tolerance to the radiation rays than the scintillator subunits on the side farther away from the detection substrate (20). Therefore, the radiation detection panel can use a low-dose radiation source to achieve high-resolution radiation imaging.

IPC Classes  ?

• G01T 1/20 - Measuring radiation intensity with scintillation detectors

Abstract

A piezoresistive chip (200), comprising a substrate (1), piezoresistors (R), resistive leads (3) and lead-out electrodes (4). The substrate (1) is provided with a pressure sensing portion (11) and a support portion (12); the support portion (12) is provided at the periphery of the pressure sensing portion (11) to form a pressure sensing cavity (13); the support portion (12) comprises a first support portion (121) and a second support portion (122); the width of each lead-out electrode (4) is greater than the width of the first support portion (121) and less than the width of the second support portion (122); the first support portion (121) is provided only with the resistive leads (3); and the second support portion (121) is provided with the lead-out electrodes (4). By means of arranging the resistive leads (3) and the lead-out electrodes (4) in separate regions, the area occupied by the resistive leads (3) can be reduced, thereby reducing the volume of the piezoresistive chip (200), and reducing the cost of pressure sensors. Also disclosed is a pressure sensor having the piezoresistive chip (200).

IPC Classes  ?

• G01L 9/04 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers of resistance strain gauges

Abstract

A detection substrate and a flat panel detector. The detection substrate includes a group of pixel units distributed in an array, each pixel unit including a thin-film transistor, a photoelectric conversion device, a first bias voltage line and a compensation capacitor. A bottom electrode of the photoelectric conversion device is electrically connected to a source electrode of the thin-film transistor, and the first bias voltage line is electrically connected to a top electrode of the photoelectric conversion device. The compensation capacitor includes: a bottom electrode, a dielectric layer, and a compensation electrode. In a peripheral area, the detection substrate includes: a group of first conductive layers and a second bias voltage line. A first conductive layer is electrically connected to a column of compensation electrodes, the second bias voltage line is electrically connected to the first bias voltage line and the first conductive layer.

IPC Classes  ?

• G01T 1/24 - Measuring radiation intensity with semiconductor detectors

Abstract

Provided are a filter and a preparation method therefor, and an electronic device. The filter comprises a base substrate, which is provided with a conductive column, wherein a first structure layer is provided on a first surface of the base substrate, and a second structure layer, a first insulating layer, a lead layer, a second insulating layer and a pad layer are provided on a second surface of the base substrate. The first structure layer and the second structure layer each comprise a connecting electrode connected to the conductive column, and the second structure layer further comprises a capacitor structure; the lead layer comprises at least one lead, wherein the lead is connected to the capacitor structure; the pad layer comprises at least one pad, wherein the pad is connected to the lead; and the materials of the first insulating layer and the second insulating layer comprise an organic material.

IPC Classes  ?

• H03H 1/00 - Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
• H03H 3/00 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators

Abstract

The present application relates to the technical field of sensors. Disclosed in the present application are a pressure sensor chip and a manufacturing method therefor, and a pressure sensor. The pressure sensor chip comprises a support layer, a conductive layer and a first insulating layer; a first sub-support layer of the support layer comprises a first cavity, and a second sub-support layer thereof comprises at least part of a pressure sensitive film; the conductive layer comprises piezoresistive portions; at least a recess of the first insulating layer, the conductive layer and the support layer may enclose a second cavity. As the piezoresistive portions are enclosed inside the second cavity, the piezoresistive portions can be prevented from being exposed outside, thereby avoiding the impact of external media on the piezoresistive portions, and improving the reliability of pressure sensors.

IPC Classes  ?

• G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges

Abstract

A pressure sensor chip, comprising a first support layer (101), a second support layer (102), an isolation layer (103) and a conductive layer (104), wherein the first support layer (101) comprises a first cavity (101a); the second support layer (102) comprises at least part of a pressure-sensitive membrane (M); and the orthographic projection, on a reference plane, of a varistor portion (1041) comprised in the conductive layer (104) is located within the orthographic projection of the isolation layer (103) on the reference plane, such that the isolation layer (103) can completely isolate the varistor portion (1041) from the first support layer (101), thereby reducing a leakage current between the varistor portion (1041) and the first support layer (101), and ensuring the reliability of a pressure sensor. Further provided are a preparation method for the pressure sensor chip, and a pressure sensor.

IPC Classes  ?

• G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
• G01L 1/18 - Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material

Abstract

An integrated passive device, comprising a first conductive plate (21) and a second electrode (42). The first conductive plate (21) is disposed on a first surface of a substrate (1). A second conductive pillar (421) is disposed in a second via (12), and the second conductive pillar (421) is connected to the first conductive plate (21). The first conductive plate (21) is directly formed on the substrate (1). The substrate (1) has a relatively small coefficient of thermal expansion, which can greatly reduce warpage of the first conductive plate (21). In the integrated passive device, a dielectric layer (22) can be formed on the first conductive plate (21) before the second conductive pillar (421) is formed. Even if the second conductive pillar (421) warps during annealing, the flatness of the first conductive plate (21) is not affected. Thus, the thickness uniformity of the dielectric layer (22) is not affected, thereby achieving the objective of improving capacitance uniformity. A manufacturing method for the integrated passive device and an electronic device comprising the integrated passive device are further provided.

IPC Classes  ?

• H10D 86/85 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components

Abstract

Provided are a passive device and an integrated passive device. The passive device comprises a base substrate and an inductor located on one side of the base substrate. The inductor comprises: a first conductive layer and a second conductive layer, the first conductive layer being arranged on one side of the base substrate, the second conductive layer being arranged on the side of the first conductive layer away from the base substrate, and the first conductive layer and the second conductive layer having different thicknesses; a first insulation layer, which is arranged between the first conductive layer and the second conductive layer; and at least one first connecting portion, which runs through the first insulation layer and is electrically connected to the first conductive layer and the second conductive layer.

IPC Classes  ?

• H10N 97/00 - Electric solid-state thin-film or thick-film devices, not otherwise provided for
• H10D 86/85 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
• H10D 84/00 - Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers

Abstract

The present application relates to the field of photoelectric sensing, and provides a detection panel, a detection apparatus, and an image processing method. The detection panel comprises: a plurality of pixels, each pixel comprising a photosensitive device and a thin film transistor. The plurality of pixels are arranged in an array to form a pixel array, the pixel array comprises a plurality of areas, and at least one target area comprises a first pixel and a second pixel. The thin film transistor in the first pixel is a first transistor; in a first direction, the overlap width between a gate of the first transistor and a first electrode of the first transistor is a first width, and the overlap width between the gate of the first transistor and a second electrode of the first transistor is a second width, the first width being greater than the second width; the thin film transistor in the second pixel is a second transistor; in a second direction, the overlap width between a gate of the second transistor and a first electrode of the second transistor is a third width, and the overlap width between the gate of the first transistor and the second electrode of the first transistor is a fourth width, the third width being smaller than the fourth width; and the first direction is opposite to the second direction. Fixed-pattern noise is reduced, and the imaging quality is improved.

IPC Classes  ?

• H10F 39/90 - Assemblies of multiple devices

Abstract

An integrated device and an integrated module. A radio frequency assembly comprises a substrate, a first radio frequency device, a second radio frequency device, a first external via, and a first connection structure. The substrate has a first surface and a second surface opposite each other. The first radio frequency device is located on the first surface of the substrate, and the second radio frequency device is located on the second surface of the substrate. The first external via extends through the substrate from the first surface to the second surface. The first connection structure is located within the first external via and electrically connects the first radio frequency device and the second radio frequency device through the first external via.

IPC Classes  ?

• H10D 84/40 - Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups or with at least one component covered by groups or , e.g. integration of IGFETs with BJTs

Abstract

A pressure transducer and a preparation method thereof, and a detection device are disclosed, which relate to the technical field of pressure transducers. The pressure transducer includes: a first substrate; a second substrate including a pressure sensitive film, a sealed pressure reference chamber being provided between the pressure sensitive film and the first substrate, the pressure sensitive film being capable to be deformed in a direction towards or away from the first substrate, and the second substrate being a glass substrate; a first polar plate, a part or all area of the first polar plate is arranged on the pressure sensitive film; and a second polar plate arranged on a side of the first substrate facing the pressure sensitive film, and a part or all area of the second polar plate being directly opposite to the first polar plate to form a capacitor with the first polar plate.

IPC Classes  ?

• G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
• G01L 19/00 - Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges

Abstract

A filter circuit, a filter, and an electronic device are disclosed. The filter circuit includes: a first port and a second port arranged opposite to each other, a grounding terminal, a series branch between the first port and the second port, and at least one parallel branch connected with the series branch; where the series branch includes at least one series resonance unit arranged in sequence, each of the at least one parallel branch includes a parallel resonance unit, and the parallel resonance unit is connected with the grounding terminal.

IPC Classes  ?

• H03H 7/01 - Frequency selective two-port networks

Abstract

An electromagnetic-wave radiation system includes: a first metal substrate; a second metal substrate, opposite to the first metal substrate; an electromagnetic wave transmission component, between the first metal substrate and the second metal substrate; where the electromagnetic wave transmission component includes a first glass substrate and a second glass substrate arranged opposite to each other, a liquid crystal layer between the first glass substrate and the second glass substrate, and a plurality of electromagnetic wave transmission structures on a side of that first glass substrate facing the liquid crystal layer; the first glass substrate is close to the first metal substrate; and an electromagnetic shielding structure, between the electromagnetic wave transmission component and the first metal substrate.

IPC Classes  ?

• H01Q 1/52 - Means for reducing coupling between antennas Means for reducing coupling between an antenna and another structure
• H01Q 1/42 - Housings not intimately mechanically associated with radiating elements, e.g. radome
• H01Q 3/36 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture varying the phase by electrical means with variable phase-shifters
• H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart

Abstract

A dimming module is provided to include a first substrate, a second substrate, spacers, a border sealing glue and dye liquid crystals; the first substrate includes a first base, a first conductive layer and a first alignment film sequentially stacked on a side of the first base close to dye liquid crystals; the spacers are on a side of the first conductive layer close to the dye liquid crystals; the second substrate includes a second base, a second conductive layer and a second alignment film sequentially stacked on a side of the second base close to dye liquid crystals; the second substrate and the first substrate are aligned and assembled, the border sealing glue is therebetween and surrounds them to form a dimming region in which the dye liquid crystals are positioned and a spacing distance between every two adjacent spacers is from 50 μm to 1000 μm.

IPC Classes  ?

• G02F 1/1339 - GasketsSpacersSealing of cells
• G02F 1/1337 - Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers

Abstract

A photoelectric conversion substrate and a flat panel detection apparatus. The photoelectric conversion substrate comprises a first region, and the photoelectric conversion substrate further comprises a substrate and at least one pixel unit, which is located on one side of the substrate and located in the first region, wherein the pixel unit comprises a photoelectric conversion element, which is located on one side of the substrate; the photoelectric conversion element comprises a first electrode, a photoelectric conversion layer and a second electrode, and the first electrode, the photoelectric conversion layer and the second electrode are sequentially stacked away from the substrate; the pixel unit further comprises at least three conductive patterns, which are located between the photoelectric conversion element and the substrate, the at least three conductive patterns are sequentially stacked away from the substrate and insulated from each other, and signals of any two adjacent ones of the at least three conductive patterns and the first electrode are different, and the orthographic projections of any two adjacent ones of the at least three conductive patterns and the first electrode on the substrate at least partially overlap. The dynamic range of the photoelectric conversion substrate during use is significantly improved, and the detail presentation capability of the photoelectric conversion substrate for a collected image can be significantly improved.

IPC Classes  ?

• H10F 55/155 - Radiation-sensitive semiconductor devices covered by groups , or being structurally associated with electric light sources and electrically or optically coupled thereto wherein the radiation-sensitive semiconductor devices control the electric light source, e.g. image converters, image amplifiers or image storage devices wherein the radiation-sensitive devices and the electric light source are all semiconductor devices formed in, or on, a common substrate

Abstract

An antenna includes a first substrate and a second substrate oppositely arranged; the first substrate includes: a first dielectric substrate having a first surface and a second surface oppositely arranged; a reference electrode layer on the first surface; at least one first radiation part on the second surface and having an orthographic projection on the first dielectric substrate at least partially overlapping that of the reference electrode layer; and at least one feeding structure on the second surface, electrically connected to the first radiation part, and having an orthographic projection on the first dielectric substrate at least partially overlapping that of the reference electrode layer; the second substrate includes: a second dielectric substrate opposite to the second surface; and at least one second radiation part on the second dielectric substrate, and each having an orthographic projection on the first surface within that of one first radiation part.

IPC Classes  ?

• H01Q 1/12 - SupportsMounting means
• H01Q 9/04 - Resonant antennas

Abstract

A microfluidic chip, comprising: a first substrate (10); a plurality of first electrodes (20) located on the first substrate (10); and a cavity-defining layer (50) located on the first substrate (10). The cavity-defining layer (50) at least defines a plurality of cavities (30) respectively corresponding to the plurality of first electrodes (20), and the orthographic projection of each cavity (30) among the plurality of cavities (30) on the first substrate (10) covers the orthographic projection of the corresponding first electrode (20) among the plurality of first electrodes (20) on the first substrate (10).

IPC Classes  ?

• B01L 3/00 - Containers or dishes for laboratory use, e.g. laboratory glasswareDroppers

Abstract

A dual-polarized antenna and an electronic device, relates to the technical field of mobile communication. The dual-polarized antenna includes: a radiation unit including a first substrate and a radiation pattern disposed on a side of the first substrate; and a feed unit including a second substrate, wherein the second substrate is disposed on a side of the first substrate away from the radiation pattern; and the radiation unit is electrically connected to the feed unit. The present application provides a dual-polarized antenna with compact space, high structural stability and omni-directional coverage of signals on the horizontal plane by adopting a stacking structure.

IPC Classes  ?

• H01Q 5/48 - Combinations of two or more dipole type antennas
• H01Q 25/00 - Antennas or antenna systems providing at least two radiating patterns

Abstract

A pressure sensor, relating to the technical field of sensors. The pressure sensor comprises a first substrate (21) and a second substrate (22) arranged opposite to each other, and a cavity (23) located between the first substrate (21) and the second substrate (22). The first substrate (21) comprises a pressure-sensitive film (211), and bonding rings (212), piezoresistors (213) and conductive columns (214) which are arranged on the side of the pressure-sensitive film (211) close to the second substrate (22). In the orthographic projection on the second substrate (22), each piezoresistor (213) is located within the range of the cavity (23) and close to the edge of the cavity (23), the corresponding bonding rings (212) are arranged on the side of the piezoresistor (213) distant from the center of the cavity (23), the bonding rings (212) are at least partially adjacent to the piezoresistor (213), and the piezoresistor (213) is connected to the corresponding conductive column (214). In a direction in which the first substrate (21) points to the second substrate (22), the height of the bonding rings (212) is greater than that of the piezoresistors (213). Also disclosed is a preparation method for the pressure sensor.

IPC Classes  ?

• G01L 1/20 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress

Abstract

A drive circuit for a digital microfluidic array element, a digital microfluidic chip and a droplet driving and detection method using same. The drive circuit for a digital microfluidic array element comprises a switch module and an export module. The switch module comprises an input node used for connecting to a data line, an output node used for connecting to an element electrode and a first switch, the first switch being connected to a scan line. The export module comprises an import node used for connecting to the output node, an export node used for connecting to an export voltage line and a second switch. On the basis of a data value of the scan line, the first switch is configured to address the output node, wherein (i) when the data value of the scan line is an active level, the first switch electrically connects the input node to the output node, so that the drive voltage of an element is equal to or greater than a threshold voltage required to control droplets that are present in the element, so as to set the element electrode to an actuated state, and (ii) when the data value of the scan line is an inactive level, the first switch electrically isolates the input node from the output node. In a first state, the second switch is configured to export a weak leakage current generated by the first switch, so that the drive voltage of the element electrode is less than the threshold voltage, so as to set the element electrode to a non-actuated state. In the actuated state, the element electrode is configured to actuate the droplets present therein, while in the non-actuated state, the element electrode is configured not to actuate the droplets present therein.

IPC Classes  ?

• B01L 3/00 - Containers or dishes for laboratory use, e.g. laboratory glasswareDroppers
• G01N 27/26 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variablesInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by using electrolysis or electrophoresis
• B81B 1/00 - Devices without movable or flexible elements, e.g. microcapillary devices

Abstract

A conductive structure and a preparation method therefor, and an integrated device and a preparation method therefor, which relate to the technical field of semiconductors. The conductive structure comprises: a glass substrate body (1), wherein the glass substrate body (1) has a first surface and a second surface arranged opposite each other, the glass substrate body (1) has a through hole structure that brings the first surface into communication with the second surface, and the through hole structure comprises a first hole structure (3) which extends from the first surface into the glass substrate body and is gradually reduced in terms of size, and a second hole structure (4) which extends from the second surface into the glass substrate body and is gradually reduced in terms of size, with the depth-to-width ratio of either one of the first hole structure (3) and the second hole structure (4) being less than 5; and a conductive connector (2), which is located in the through hole structure and extends from the first surface to the second surface. The conductive structure can prevent a glass substrate from breaking and failing during the manufacturing process.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates

Abstract

A transparent antenna unit, comprising: a phase modulation layer, wherein the phase modulation layer comprises a first dielectric plate, a tunable dielectric layer and a second dielectric plate which are stacked in sequence, a first functional electrode located between the first dielectric plate and the tunable dielectric layer, and a second functional electrode located between the tunable dielectric layer and the second dielectric plate, and the orthographic projections of the first functional electrode and the second functional electrode on the first dielectric plate overlap with each other; and a transparent feed layer located on the layer of the first dielectric plate away from the first functional electrode, and connected to the first functional electrode or the second functional electrode.

IPC Classes  ?

• H01Q 3/36 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture varying the phase by electrical means with variable phase-shifters
• H01Q 21/00 - Antenna arrays or systems

Abstract

A capacitor structure, comprising a substrate, a first electrode, a dielectric layer, and a second electrode. The first electrode, the dielectric layer and the second electrode are sequentially stacked on one side of the substrate, and orthographic projections of the first electrode, the dielectric layer, and the second electrode onto the substrate at least partially overlap. The second electrode comprises a first sub-layer, a second sub-layer and a third sub-layer, the first sub-layer, the second sub-layer and the third sub-layer being stacked in sequence away from the substrate, and an orthographic projection of the second sub-layer onto the substrate being located within orthographic projection areas of the first sub-layer and the third sub-layer onto the substrate.

IPC Classes  ?

• H10N 97/00 - Electric solid-state thin-film or thick-film devices, not otherwise provided for
• H01L 27/04 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
• H10B 12/00 - Dynamic random access memory [DRAM] devices

Abstract

A capacitor device, comprising: a first substrate (10) and a second substrate (20), wherein the first substrate (10) and the second substrate (20) are arranged opposite each other, and a first cavity (60) is provided between the first substrate (10) and the second substrate (20), the first substrate (10) being configured to be capable of elastically deforming towards the second substrate (20); a first electrode plate (31), wherein the first electrode plate (31) is located in the first cavity (60), and the first electrode plate (31) comprises a first connecting portion (311) and a first suspended portion (312), the first connecting portion (311) being connected to the first substrate (10), and the first suspended portion (312) being suspended relative to the first substrate (10); a second electrode plate (32), wherein the second electrode plate (32) is arranged on the second substrate (20) and is opposite the first electrode plate (31); and a support structure (40), wherein the support structure (40) is located in the first cavity (60), and the end of the support structure (40) facing the first substrate (10) supports the first substrate (10). Further provided is an electronic apparatus.

IPC Classes  ?

• G01D 5/24 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance

Abstract

A passive device. The passive device (100) comprises at least two functional parts, wherein the edges of insulating parts retract relative to the edge of a substrate (1) to expose the surface of the substrate (1), and the exposed part of the substrate (1) can protect side faces of the functional parts, so that the impact on the side faces of the functional parts can be reduced or prevented during a manufacturing or packaging process, thereby enabling the passive device (100) to have a more stable structure, good reliability and relatively good electrical consistency. When two adjacent passive devices (100) are separated using a scribing and cutting process, cutting can be performed from the exposed part of the substrate (1) between the adjacent passive devices (100), so that the insulating parts are not subjected to a cutting stress and naturally do not peel off from the substrate (1), and the problem of electrically conductive parts in the passive devices (100) falling off is avoided, thereby achieving the purpose of nondestructive cutting. Further provided is a manufacturing method for a passive device.

IPC Classes  ?

• H10N 97/00 - Electric solid-state thin-film or thick-film devices, not otherwise provided for
• H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
• H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Abstract

Provided in the present disclosure is a capacitor structure, comprising a substrate, and a first electrode, a dielectric layer and a second electrode, which are sequentially stacked on one side of the substrate in a direction away from the substrate, wherein at least one of the first electrode and the second electrode comprises a first sub-layer, a second sub-layer and a third sub-layer, which are sequentially stacked in the direction away from the substrate; the first sub-layer has a first edge portion; the third sub-layer has a second edge portion; and the first edge portion and the second edge portion overlap each other around the second sub-layer. Further provided in the present disclosure are a preparation method for the capacitor structure, and a radio frequency device.

IPC Classes  ?

• H10N 97/00 - Electric solid-state thin-film or thick-film devices, not otherwise provided for

Abstract

A distributed control method, system and apparatus for a liquid crystal phased array antenna radio-frequency module. The system comprises an antenna array control module, a receiving/transmitting radio-frequency module, a sub-array beam control module and a liquid crystal phased array; the liquid crystal phased array comprises a plurality of periodically arranged liquid crystal phased array units; the antenna array control module receives external control information or an external control instruction, sends first internal control information or a first internal control instruction to the receiving/transmitting radio-frequency module on the basis of the external control information or the external control instruction, and sends second internal control information or a second internal control instruction to the sub-array beam control module on the basis of the external control information or the external control instruction; the receiving/transmitting radio-frequency module transmits and/or receives a carrier on the basis of the first internal control information or the first internal control instruction; the sub-array beam control module concurrently sends configuration information or a configuration instruction to the plurality of liquid crystal phased array units on the basis of the second internal control information or the second internal control instruction; and the liquid crystal phased array realizes antenna beamforming on the basis of the configuration information or the configuration instruction.

IPC Classes  ?

• H01Q 3/00 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
• H01Q 21/00 - Antenna arrays or systems

Abstract

A detection panel and a flat panel detector. The detection panel comprises: a substrate (100); a thin-film transistor (200), located on the substrate (100), the thin-film transistor (200) comprising a gate layer (01), an active layer (03) and a source/drain layer (110); a photosensitive portion (400), located on the side of the thin-film transistor (200) facing away from the substrate (100), the photosensitive portion (400) comprising a bottom electrode (11), a PIN layer (12) and a top electrode (14) which are sequentially arranged facing away from the substrate (100), and the bottom electrode (11) being electrically connected to the thin-film transistor (200) by means of the source/drain layer (110); and at least one electrode layer (300), located between the bottom electrode (11) and the substrate (100), each electrode layer among the at least one electrode layer (300) and one of conductive layers within the thin-film transistor (200) being arranged on a same layer, the orthographic projections of the electrode layers on the substrate (100) entirely falling within the area range of the orthographic projection of the bottom electrode (11) on the substrate (100), at least one storage capacitor comprising a first storage capacitor being formed between the at least one electrode layer (300) and the bottom electrode (11), and a second storage capacitor being formed between the bottom electrode (11) and the top electrode (14).

IPC Classes  ?

• H10F 39/12 - Image sensors
• H10F 77/20 - Electrodes
• H10F 30/292 - Bulk-effect radiation detectors, e.g. Ge-Li compensated PIN gamma-ray detectors

Abstract

An antenna includes: a first substrate and a second substrate. The first substrate includes: a first dielectric substrate, a first reference electrode layer, a first radiation part, and a feeder group. The first dielectric substrate includes a main substrate and a side substrate, the feeder group includes at least one feeder, in each of which, each feeder is electrically connected to one first radiation part, and different feeders are electrically connected to different first radiation parts. The second substrate includes: a second dielectric substrate, a second reference electrode layer, and a feed structure. The feed structure corresponds to the feeder group, and for corresponding feed structure and feeder group, each first feed port in the feed structure is electrically connected to one feeder in the feeder group through a first connection via which runs through at least the side substrate, the second reference electrode layer, and the second dielectric substrate.

IPC Classes  ?

• H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart
• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support

Abstract

An inductance structure and a filter, and relates to the technical field of passive devices. The inductance structure includes a dielectric substrate, a first conductive structure and a second conductive structure; the dielectric substrate is provided with a plurality of connection through-holes penetrating in a thickness direction thereof; connection electrodes are provided in the connection through-holes; the first conductive structure and the second conductive structure are electrically connected by the connection electrodes to form a coil of the inductance structure; one of the first conductive structure and the second conductive structure includes at least three sub-layers, and the other includes at least one sub-layer; and orthographic projections of two of the sub-layers of the first conductive structure and the second conductive structure on the dielectric substrate at least partially overlap, and the flow directions of currents of both are roughly parallel.

IPC Classes  ?

• H01F 27/28 - CoilsWindingsConductive connections

Abstract

The present disclosure relates to the technical field of passive devices, and provides a capacitive device and an electronic apparatus. The capacitive device comprises a substrate, a capacitor, and a first electrode layer. The substrate has a first side and a second side that face away from each other in the thickness direction of the substrate. The capacitor comprises a first electrode plate, a dielectric layer, and a second electrode plate which are stacked on the second side. The first electrode layer is arranged on the first side and is electrically connected to the first electrode plate. The first electrode layer is used for being connected to an external circuit by means of soldering. In this way, the connection between the capacitive device and a printed circuit board is firmer.

IPC Classes  ?

• H01G 4/002 - Fixed capacitorsProcesses of their manufacture Details
• H01L 23/498 - Leads on insulating substrates

Abstract

A sensor chip is provided. The sensor chip includes a first base substrate; a piezoresistor on the first base substrate; a second base substrate on a side of the piezoresistor away from the first base substrate; a metal wire bond extending through the second base substrate; and a pressure reference chamber between the first base substrate and the second base substrate. The first base substrate and the second base substrate encapsulate at least a portion of the piezoresistor inside the pressure reference chamber.

IPC Classes  ?

• G01L 19/00 - Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
• G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means

Abstract

A sensor chip is provided. The sensor chip includes a first base substrate; a piezoresistor and a resistor lead on the first base substrate; a second base substrate on a side of the piezoresistor and the resistor lead away from the first base substrate; a metal wire bond extending through the second base substrate and connected to the resistor lead; a redistribution layer on a side of the second base substrate away from the first base substrate; and a pressure reference chamber between the first base substrate and the second base substrate. The first base substrate and the second base substrate encapsulate at least a portion of the piezoresistor inside the pressure reference chamber. The metal wire bond is connected to the resistor lead, and is connected to the redistribution layer. The resistor lead is connected to the piezoresistor.

IPC Classes  ?

• G01L 1/18 - Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material

Abstract

The present disclosure provides a detection apparatus, a training method and a training apparatus. The detection apparatus includes a plurality of MEMS sensors configured to collect signals to be detected in real time and output sensing signals according to the signals to be detected; a processing module configured to receive the sensing signals of the plurality of MEMS sensors and determine a detection result of the detection apparatus according to the sensing signals of the plurality of MEMS sensors at each sampling time; wherein, there is a predetermined interval duration between two adjacent sampling times, and a sensing signal of each of the MEMS sensors at the current sampling time is related to a signal to be detected at the current sampling time, a sensing signal at the previous sampling time and an attenuation coefficient.

IPC Classes  ?

• G01L 9/06 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers of piezo-resistive devices
• B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

Abstract

Provided in the present disclosure are a circularly polarized antenna and a communication system, which relate to the technical field of antennas. The circularly polarized antenna comprises a radiating plate, a substrate and a plurality of feed probes, wherein the radiating plate is provided with a plurality of slots, the slots extend through the radiating plate in the thickness direction of the radiating plate, and the slots are arranged in a circumferential array; the substrate is opposed to and spaced apart from the radiating plate, and the substrate is provided with a feed network; and the plurality of feed probes are located between the radiating plate and the substrate and are spaced apart from each other, and one end of each feed probe is electrically connected to the feed network, and the other end thereof is electrically connected to the radiating plate. The circularly polarized antenna has a high gain and a relatively small size.

IPC Classes  ?

• H01Q 1/36 - Structural form of radiating elements, e.g. cone, spiral, umbrella
• H01Q 13/10 - Resonant slot antennas

Abstract

A dimming device and a dimming structure. The dimming device comprises a first substrate (11), a first adhesive layer (12), a dimming functional layer (13), a second adhesive layer (50) and a second substrate (41) which are sequentially stacked, and further comprises a rubber frame (20) arranged between the first substrate (11) and the second substrate (41) and surrounding the first adhesive layer (12), the dimming functional layer (13) and the second adhesive layer (50). The orders of magnitude of the thermal expansion coefficients of materials of the glue frame (20), the first adhesive layer (12) and the second adhesive layer (50) are all 10-4. The dimming device and the dimming structure can reduce or even avoid interface bubbles at the junction between the rubber frame (20) and the first adhesive layer (12) and the junction between the rubber frame (20) and the second adhesive layer (50), so that the step of printing black edges for masking can be omitted, and the problem of bubbles appearing in a display area is avoided.

IPC Classes  ?

• G02F 1/1333 - Constructional arrangements

Abstract

A pressure sensor, comprising: a substrate (10), and at least one capacitor, which is arranged on the substrate (10), wherein one of the at least one capacitor comprises: a first electrode (11, 101) and a second electrode (12, 102), which are arranged opposite each other and insulated from each other, the second electrode (12, 102) is located on the side of the first electrode (11, 101) that is away from the substrate (10), a plurality of cavities (13, 103) are arranged between the first electrode (11, 101) and the second electrode (12, 102), the orthographic projection of the first electrode (11, 101) on the substrate (10) is at least partially overlapped with the orthographic projection of the second electrode (12, 102) on the substrate (10), the orthographic projection of an overlapping area of the first electrode (11, 101) and the second electrode (12, 102) on the substrate (10) is at least partially overlapped with the orthographic projections of the plurality of cavities (13, 103) on the substrate (10), and the second electrode (12, 102) is arranged in a way at least partially enclosing on the surfaces of the plurality of cavities (13, 103) that are away from the first electrode (11, 101). Further provided are a preparation method for a pressure sensor, and a pressure sensor assembly.

IPC Classes  ?

• G01L 1/14 - Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators

Abstract

A pressure sensor, comprising a substrate (100); at least one second electrode (12) of a capacitor provided on the substrate (100), wherein the at least one second electrode (12) is provided with release holes (121), a cavity (13) is formed between the at least one second electrode (12) and the substrate (100), and the at least one second electrode (12) is arranged around the side wall of the cavity (13); and a hole sealing layer (30), wherein the hole sealing layer (30) is arranged at the periphery of the cavity (13), and the hole sealing layer (30) covers the release holes (121) and at least part of the surface of the at least one second electrode (12) away from the substrate (100). The present invention further discloses a manufacturing method for the pressure sensor and a pressure sensing assembly.

IPC Classes  ?

• G01L 1/14 - Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators

Abstract

A pressure sensor and a fabrication method therefor, and a pressure sensing assembly. The pressure sensor comprises a substrate (10) and at least one capacitor disposed on the substrate (10). One of the at least one capacitor comprises a first electrode (11) and a second electrode (12), which are arranged opposite each other and are insulated from each other, wherein the second electrode (12) is located on the side of the first electrode (11) away from the substrate (10); a cavity (13) is disposed between the first electrode (11) and the second electrode (12); the orthographic projection of the first electrode (11) on the substrate (10) at least partially overlaps with the orthographic projection of the second electrode (12) on the substrate (10); the orthographic projection of an overlapping region between the first electrode (11) and the second electrode (12) on the substrate (10) at least partially overlaps with the orthographic projection of the cavity (13) on the substrate (10); and the second electrode (12) surrounds the cavity (13) to form a sidewall, and at least partially covers the surface of the cavity (13) away from the first electrode (11).

IPC Classes  ?

• G01L 1/14 - Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
• G01L 9/12 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance

Abstract

A dimming module (300) and a dimming apparatus (1000). The dimming apparatus (1000) comprises a first substrate (100), a second substrate (200), at least one dimming module (300), a first adhesive layer (400), a second adhesive layer (500) and a first edge sealant (601); the first substrate (100) and the second substrate (200) are arranged opposite to each other; the at least one dimming module (300) is arranged between the first substrate (100) and the second substrate (200); the first adhesive layer (400) is arranged between the first substrate (100) and the dimming module (300), and the second adhesive layer (500) is arranged between the second substrate (200) and the dimming module (300); the first edge sealant (601) is arranged between the first adhesive layer (400) and the second adhesive layer (500) and is connected to the first adhesive layer (400) and the second adhesive layer (500); the first edge sealant (601) is bonded to the side wall of the dimming module (300); the boundary of the orthographic projection of the first substrate (100) on a first reference plane comprises a plurality of first boundaries (101) connected in sequence, the first reference plane being parallel to the surface of the first substrate (100) close to the second substrate (200); and the first edge sealant (601) is provided between some first boundaries (101) among the plurality of first boundaries (101) in the orthographic projection on the first reference plane and the boundary of the orthographic projection of the dimming module (300) on the first reference plane.

IPC Classes  ?

• G02F 1/137 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells characterised by the electro-optical or magneto-optical effect, e.g. field-induced phase transition, orientation effect, guest-host interaction or dynamic scattering

Abstract

An antenna and a driving method therefor, and an electronic apparatus. The antenna comprises at least one antenna unit (100), wherein the antenna unit comprises a first feed structure layer (11), a second feed structure layer (12), and a radiation structure layer (13) which are stacked, and a switch structure (14) is provided between the first feed structure layer (11) and the second feed structure layer (12). The second feed structure layer (12) is provided with a plurality of connection paths (L0); the radiation structure layer (13) comprises a plurality of feed points (K0); the switch structure (14) comprises a first port and a plurality of second ports, the first port being electrically connected to the first feed structure layer (11), and at least two second ports being respectively electrically connected to at least some of the feed points (K0) by means of at least two connection paths (L0); and the switch structure (14) is configured to control the first port to be in communication with at least some of the second ports, so as to control a polarization mode of the antenna.

IPC Classes  ?

• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support

Abstract

The present disclosure relates to the technical field of communications, and provides a phase shifter, an antenna structure and an electronic device. The phase shifter of the present disclosure comprises a first substrate and a second substrate which are provided opposite to each other, and a tunable dielectric layer provided between the first substrate and the second substrate. A first electrode layer is provided on the side of the first substrate close to the tunable dielectric layer, a second electrode layer is provided on the side of the second substrate close to the tunable dielectric layer, and a third electrode layer is provided on the side of the first substrate away from the tunable dielectric layer. The first substrate has a plurality of connecting vias penetrating along the thickness direction of the first substrate, and first connecting electrodes are provided in the connecting vias; the first electrode layer comprises a plurality of first branch structures, and one first branch structure is electrically connected to the third electrode layer by means of at least one first connecting electrode; and the orthographic projection of each first branch structure on the first substrate at least partially overlaps the orthographic projection of the second electrode layer on the first substrate.

IPC Classes  ?

• H01P 1/18 - Phase-shifters
• H01Q 3/36 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture varying the phase by electrical means with variable phase-shifters

Abstract

The present disclosure relates to the technical field of communications, and provides a circularly polarized antenna and an electronic device. The circularly polarized antenna of the present disclosure comprises a first dielectric layer and a second dielectric layer which are oppositely arranged, and four antenna elements which are arranged in an array; each antenna element comprises a first radiation electrode, a reference electrode layer, a first isolation assembly, and a second isolation assembly; the first radiation electrode is arranged on the side of the first dielectric layer away from the second dielectric layer, the reference electrode layer is arranged on the side of the second dielectric layer away from the first dielectric layer, the first isolation assembly is integrated on the first dielectric layer, and the orthographic projection of the first isolation assembly and the orthographic projection of the second isolation assembly on a plane where the first dielectric layer is located both confine the orthographic projection of the first radiation electrode on the plane where the first dielectric layer is located within respective interiors; each first radiation electrode is provided with a U-shaped first through slot, the first through slot has a first side wall and a second side wall which are oppositely arranged, and the length of the first side wall is greater than that of the second side wall.

IPC Classes  ?

• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support

Abstract

A pressure sensing chip and a pressure sensor, relating to the technical field of sensors, and aiming at prolonging the service life of sensors and expanding application scenarios. The pressure sensing chip comprises: a pressure sensing film; a substrate, connected to the pressure sensing film, wherein a cavity is formed between the pressure sensing film and the substrate; a pressure-sensitive assembly, located between the substrate and the pressure sensing film, wherein the orthographic projection of the pressure-sensitive assembly and the orthographic projection of the cavity on the substrate partially overlap; and a first signal output structure, arranged on the side of the substrate facing away from the pressure sensing film, wherein the first signal output structure is electrically connected to the pressure-sensitive assembly by means of a lead structure passing through the substrate.

IPC Classes  ?

• G01L 1/20 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress

Abstract

An array antenna (10), comprising: a feed source layer (1), which comprises a feed network (11) having an input port (12) and a plurality of output ports (13); an energy re-allocation layer (2), which has a plurality of allocation regions, wherein the energy re-allocation layer (2) is used for re-allocating near-field energy at the output ports (13) in the plurality of allocation regions; and a radiation layer (3), which comprises a plurality of radiation units (31) corresponding to the plurality of output ports (13) on a one-to-one basis. In the embodiments of the present disclosure, the near-field energy at the output ports (13) is re-allocated in the plurality of allocation regions by means of the energy re-allocation layer (2), thereby ensuring that the distribution of the re-allocated near-field energy meets requirements; and then the re-allocated near-field energy at the output ports (13) is radiated by means of the radiation units (31) of the radiation layer (3), thereby ensuring the radiation directivity of the radiation units (31), and ensuring the radiation characteristics of the array antenna (10). (FIG. 1)

IPC Classes  ?

• H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart
• H01Q 3/26 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture
• H01Q 9/04 - Resonant antennas

Abstract

A flat panel antenna (10), comprising a plate-shaped structure (1) and a phase shifter (2). The plate-shaped structure (1) is provided with a radiation surface (11), a feed source surface (12), and a contour surface (13). The plate-shaped structure (1) is further provided with a radiation cavity (14), a feed source cavity (15), and a first slot (16). The phase shifter (2) is located in the first slot (16). In an embodiment of the present disclosure, an integrated structure having the radiation cavity (14) and the feed source cavity (15) is implemented by means of the plate-shaped structure (1), so that alignment deviation between the radiation cavity (14) and the feed source cavity (15) can be avoided. Accordingly, when the phase shifter (2) is mounted, only the alignment of the phase shifter (2) and the radiation cavity (14) or the feed source cavity (15) needs to be ensured, thereby simplifying the assembly process of the flat panel antenna (10) while reducing alignment errors during assembly and ensuring the antenna performance of the flat panel antenna (10).

IPC Classes  ?

• H01Q 1/36 - Structural form of radiating elements, e.g. cone, spiral, umbrella

Abstract

Provided is a filter, comprising: a base substrate, comprising a first surface; a capacitor, comprising a first electrode arranged on the first surface and a second electrode arranged on the side of the first electrode away from the base substrate, a first insulating layer being arranged between the first electrode and the second electrode; a second insulating layer, which is arranged on the side of the second electrode away from the base substrate, a first via being formed in the second insulating layer; an inductor, comprising a first conductive end and a second conductive end, the first conductive end and the second conductive end being electrically connected to form a coil structure of the inductor; a third insulating layer, which is arranged on the side of the second insulating layer away from the base substrate, a second via hole being formed in the third insulating layer; and an electrode conductive part, which is arranged on the side of the third insulating layer away from the base substrate and is electrically connected to the second electrode by means of the first via and the second via. The radial cross-sectional area of the first via is smaller than the radial cross-sectional area of the second via, and the orthographic projection of the first via on the base substrate overlaps the orthographic projection of the second via on the base substrate.

IPC Classes  ?

• H03H 1/00 - Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network

Abstract

The present disclosure relates to a conversion device. The conversion device includes a first waveguide and a transition substrate. The first waveguide includes a waveguide transmission cavity and a waveguide back cavity. The transition substrate is provided between the waveguide transmission cavity and the waveguide back cavity. The transition substrate includes at least one dielectric substrate, the dielectric substrate includes a first base substrate and at least one group of signal transmission structures, one of the signal transmission structures includes a CPW signal transmission line and a probe, the CPW signal transmission line includes a signal line and ground electrodes. The probe, the signal line and the ground electrode pass through a transition region, the probe is located in the waveguide transmission cavity, and the signal line and the ground electrode partially extend into the waveguide transmission cavity.

IPC Classes  ?

• H01P 5/107 - Hollow-waveguide/strip-line transitions
• H01P 3/12 - Hollow waveguides
• H01Q 13/10 - Resonant slot antennas

Abstract

The present invention relates to the technical field of passive devices, and provides an integrated substrate and a preparation method therefor, and an electronic device. The integrated substrate in the present invention comprises: a dielectric substrate, which has a first surface and a second surface which are oppositely arranged in the thickness direction of the dielectric substrate, wherein the dielectric substrate comprises a first connecting via hole running through in the thickness direction of the dielectric substrate; a first buffer layer, which is arranged on the first surface side, wherein the first buffer layer is provided with a first hollowed-out pattern; a second buffer layer, which is arranged on the second surface side, wherein the second buffer layer is provided with a second hollowed-out pattern; a first conductive structure, which is located in the first hollowed-out pattern; a second conductive structure, which is located in the second hollowed-out pattern; and a first connecting electrode, which is located in the first connecting via hole, wherein the first conductive structure and the second conductive structure are connected by means of the first connecting electrode, and the three are of an integrated structure.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates
• H01L 23/28 - Encapsulation, e.g. encapsulating layers, coatings
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A sensing substrate and an electronic device are provided. The sensing substrate includes a sensing unit on a base substrate. The sensing unit includes a sensing element and a conductive pattern, the sensing element has a light incident surface and a back surface that are opposite and a side surface between the light incident surface and the back surface. The conductive pattern is on a side of the sensing element away from the base substrate, and has a hollow portion and a transparent conductive portion surrounding the hollow portion, an orthographic projection of the hollow portion on the base substrate is at least partially within an orthographic projection of the sensing element on the base substrate, and an orthographic projection of the transparent conductive portion on the base substrate at least partially overlaps with an orthographic projection of the side surface of the sensing element on the base substrate.

IPC Classes  ?

• H01L 23/60 - Protection against electrostatic charges or discharges, e.g. Faraday shields
• G01T 1/20 - Measuring radiation intensity with scintillation detectors
• H10F 39/00 - Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group , e.g. radiation detectors comprising photodiode arrays
• H10F 39/18 - Complementary metal-oxide-semiconductor [CMOS] image sensorsPhotodiode array image sensors

Abstract

An antenna and an electronic device. The antenna comprises at least one antenna unit (100). The antenna unit (100) at least comprises: a dielectric substrate comprising a first substrate (101) and a second substrate (102) which are arranged opposite to each other; a conductive layer comprising a first conductive layer (11) and a second conductive layer (12); and a phase shift structure (1001) provided between the first substrate (101) and the second substrate (102). The first conductive layer (11) is arranged on the side of the first substrate (101) away from the second substrate (102). The second conductive layer (12) is arranged on the side of the second substrate (102) away from the first substrate (101). The first conductive layer (11) is provided with a first periodic structure (111), and the first periodic structure (111) comprises a plurality of first conductive structures (1111) arranged at periodic intervals. The second conductive layer (12) is provided with a radiation structure (121), and the orthographic projections of the radiation structure (121), the phase shift structure (1001), and the first periodic structure (111) on the first substrate (101) at least partially overlap.

IPC Classes  ?

• H01Q 21/00 - Antenna arrays or systems

Abstract

Disclosed in the embodiments of the present disclosure are a detection substrate and a flat panel detector. The detection substrate comprises: a base substrate, and a gate metal layer, a source-drain metal layer, a photoelectric conversion device and a bias voltage electrode layer which are sequentially stacked on the base substrate. The gate metal layer comprises a gate electrode and a scanning line electrically connected to the gate electrode. The source-drain metal layer comprises a first electrode, a second electrode and a first connecting part electrically connected to the second electrode. The photoelectric conversion layer comprises a bottom electrode, a photoelectric conversion layer and a top electrode which are sequentially stacked, wherein the bottom electrode is close to the base substrate, and the bottom electrode is electrically connected to the first electrode. The bias voltage electrode layer comprises a bias voltage line and a first reading line which extend in the same direction and are spaced apart. The detection substrate further comprises a second connecting part arranged on the same layer as the bottom electrode, wherein the first reading line is electrically connected to the second connecting part, and the second connecting part is electrically connected to the first connecting part.

IPC Classes  ?

• H01L 27/146 - Imager structures

Abstract

The present disclosure relates to the technical field of antennas. Provided are a liquid crystal antenna and a communication apparatus. The liquid crystal antenna comprises a feed structure, a first substrate, a liquid crystal cell and a radiation plate, which are sequentially stacked, wherein the feed structure comprises a plurality of first output ends, and the feed structure is configured to feed power to the first substrate by means of the plurality of first output ends; the first substrate comprises a plurality of first substrate integrated waveguides, one first substrate integrated waveguide is arranged opposite one first output end, and each first substrate integrated waveguide comprises a plurality of second output ends; the liquid crystal cell comprises a plurality of liquid crystal phase shifters, and one liquid crystal phase shifter is arranged opposite one second output end; and the radiation plate comprises a plurality of radiation units, and the radiation units are arranged opposite the liquid crystal phase shifters. The feed loss of the liquid crystal antenna is reduced.

IPC Classes  ?

• H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart

Abstract

A phase shifter and a preparation method thereof, and an electronic device. The phase shifter includes: an adjustable dielectric layer, arranged between a first electrode layer and a second electrode layer, and including a first support structure, wherein the first support structure is arranged on at least one side of a first region, and an orthographic projection of the first support structure on a first base plate is at least non-overlapping with an orthographic projection of the first region on the first base plate. The phase shifter provided in the present application is arranged in the non-capacitive overlap region between the first base plate and the second base plate through the first support structure, which can not only provide good support, but also reduce or even eliminate the impact on phase shifting, achieving large phase shift amount, high uniformity of phase shift degrees, and low loss.

IPC Classes  ?

• H01P 1/18 - Phase-shifters
• H01P 11/00 - Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
• H01Q 3/36 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture varying the phase by electrical means with variable phase-shifters

Abstract

A digital microfluidic chip and a use thereof. The digital microfluidic chip comprises: a first substrate (10), comprising a first base (11), the first base (11) being provided with a sample input hole (12); an interposer layer (20), one side of the interposer layer (20) being connected to the first substrate (10), the interposer layer (20) comprising a flow channel in communication with the sample input hole (12), the flow channel sequentially comprising a droplet generation region (21), a droplet deceleration region (22) and a digital microfluidic region (23), the droplet generation region (21) being configured to generate micro-droplets, and the droplet deceleration region (22) being configured to decelerate the micro-droplets; a second substrate (30), the second substrate (30) being connected to a side of the interposer layer (20) distant from the first substrate (10), the second substrate (30) comprising a driving electrode (31), and the driving electrode (31) being configured to drive the micro-droplets in the interposer layer (20) to move.

IPC Classes  ?

• B01L 3/00 - Containers or dishes for laboratory use, e.g. laboratory glasswareDroppers

Abstract

An antenna is provided. The antenna includes a feed source configured to provide polarized waves with orthogonal polarization states, a converter configured to convert a linearly polarized wave into a circularly polarized wave, and a reflector configured to reflect a linearly polarized wave. The antenna is configured to receive a first linearly polarized wave having a frequency in a first frequency range, and convert the first linearly polarized wave into a first circularly polarized wave; and emit a second linearly polarized wave having a frequency in a second frequency range, and convert the second linearly polarized wave into a second circularly polarized wave, the first frequency range being different from the second frequency range. Reception of the first linearly polarized wave and emission of the second circularly polarized wave are configured to pass through a same aperture.

IPC Classes  ?

• H01Q 15/24 - Polarising devicesPolarisation filters

Abstract

The present disclosure provides a single-channel test device. The single-channel test device includes a metal flange, and a waveguide-coaxial conversion structure and a first square straight waveguide which are disposed along a central axis of the metal flange and disposed on two opposite sides of the metal flange respectively, wherein in the case that a waveguide aperture of one end of the first square straight waveguide distal to the metal flange is placed on and is kept in close contact with a single antenna unit to be tested in a phased reflectarray to be tested, the single-channel test device is configured to test a scattering parameter of the antenna unit to be tested.

IPC Classes  ?

• G01R 29/08 - Measuring electromagnetic field characteristics
• G01R 29/10 - Radiation diagrams of antennas

Abstract

An antenna includes a first substrate, the first substrate includes: a first base substrate; at least one first radiation unit on a side of the first base substrate; a first electrode layer on a side of the first base substrate away from the at least one first radiation unit; and at least one second radiation unit on a side of the at least one first radiation unit away from the first electrode layer; wherein an orthographic projection of each second radiation unit on the first base substrate at least partially overlaps an orthographic projection of one first radiation unit on the first base substrate; and an 10 orthographic projection of the at least one first radiation unit on the first base substrate is within an orthographic projection of the first electrode layer on the first base substrate, wherein the antenna further includes a first feeding unit.

IPC Classes  ?

• H01Q 9/04 - Resonant antennas
• H01Q 1/52 - Means for reducing coupling between antennas Means for reducing coupling between an antenna and another structure

Abstract

An antenna is provided. The antenna includes a plurality of radiating elements. A respective radiating element of the plurality of radiating elements includes a dielectric substrate, one or more radiating oscillators on the dielectric substrate, and one or more conductors configured to optimize polarization isolation of the antenna. The one or more conductors are spaced apart from the one or more radiating oscillators. The plurality of radiating elements are arranged along a first direction, and the one or more conductors are arranged along a direction substantially parallel to a second direction, the second direction being different from the first direction, and the first direction and the second direction intersecting each other.

IPC Classes  ?

• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
• H01Q 1/52 - Means for reducing coupling between antennas Means for reducing coupling between an antenna and another structure

Abstract

The present disclosure relates to the technical field of satellite antennas, and in particular relates to a satellite tracking method, system, and apparatus, and an electronic device. The method comprises: determining a communication state between a carrier and a satellite, and acquiring, in real time, attitude information of the carrier; and activating a correction policy corresponding to the communication state to determine a target angle at which the carrier points to the satellite. The correction policy comprises: when the communication state represents a disconnected state, using a tracking network to correct the attitude information, using the tracking network to correct a first theoretical pointing angle, and obtaining a target angle. The first theoretical pointing angle is obtained on the basis of the corrected attitude information. The tracking network is obtained by performing training on the basis of sample data separately corresponding to a plurality of continuous moments. The sample data is acquired when the communication state represents a connected state, and each piece of sample data comprises: an attitude information sample and an angle information sample, the angle information sample being a theoretical pointing angle of the carrier calculated on the basis of the attitude information sample.

IPC Classes  ?

• G01C 21/16 - NavigationNavigational instruments not provided for in groups by using measurement of speed or acceleration executed aboard the object being navigatedDead reckoning by integrating acceleration or speed, i.e. inertial navigation
• G01S 19/47 - Determining position by combining measurements of signals from the satellite radio beacon positioning system with a supplementary measurement the supplementary measurement being an inertial measurement, e.g. tightly coupled inertial
• H04B 7/185 - Space-based or airborne stations

Abstract

th photoelectric conversion structure, with n being greater than or equal to 1; and a bias voltage line on a side of the photoelectric conversion device away from the substrate base, the bias voltage line being electrically connected to a top electrode of a last photoelectric conversion structure.

IPC Classes  ?

• H10F 39/00 - Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group , e.g. radiation detectors comprising photodiode arrays
• G01T 1/24 - Measuring radiation intensity with semiconductor detectors
• H10F 39/18 - Complementary metal-oxide-semiconductor [CMOS] image sensorsPhotodiode array image sensors

Abstract

A liquid crystal phase shifter (10), comprising: a first substrate (1), a first metal layer (11) being arranged on one side of the first substrate (1), and the first metal layer (11) comprising a first electrode (111); and a second substrate (2), wherein a second metal layer (21) and a third metal layer (22) are arranged on the side of the second substrate (2) facing the first substrate (1), the second metal layer (21) comprises a second electrode (211), and the third metal layer (22) comprises a plurality of first heating wires (221) connected in parallel, and two second heating wires (222) connected in series at two ends of the first heating wires (221). In the present disclosure, different voltage signals can be applied to the first electrode (111) and the second electrode (211) to drive the liquid crystal molecules of a liquid crystal layer (3) to deflect, and the liquid crystal layer (3) is heated by means of the first heating wires (221) and the second heating wires (222), thereby ensuring the working stability of the liquid crystal phase shifter (10) in a low-temperature environment.

IPC Classes  ?

• H01P 1/18 - Phase-shifters

Abstract

The present invention relates to the technical field of antennas, and provides a liquid crystal antenna and a communication apparatus. The liquid crystal antenna comprises a first substrate, a second substrate, and a liquid crystal cell, wherein the first substrate and the second substrate are arranged opposite to each other, and the liquid crystal cell is located between the first substrate and the second substrate; the first substrate comprises a plurality of first radiation units, the plurality of first radiation units are arranged at intervals, and the liquid crystal cell comprises liquid crystal phase shifters arranged opposite to the first radiation units; and a first heating wire is further embedded in the first substrate or in the surface of the first substrate, the first heating wire is configured to generate heat when energized so as to heat the liquid crystal cell, and the orthographic projection of a part of the structure of the first heating wire on the liquid crystal cell is located between the orthographic projections of two adjacent first radiation units on the liquid crystal cell. The response speed of the liquid crystal antenna is increased.

IPC Classes  ?

• H01Q 3/34 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture varying the phase by electrical means

Abstract

The present invention relates to the technical field of communications, and provides an antenna unit, an antenna array, and an electronic device. The antenna unit of the present invention comprises a first substrate and at least one radiation structure, wherein the first substrate comprises a first dielectric substrate and a first reference electrode layer; the first dielectric substrate has a first surface and a second surface which are arranged opposite to each other; the first reference electrode layer is arranged on the first surface, and the radiation structure is arranged on the second surface; and the radiation structure comprises a first balun assembly, a second balun assembly, and a radiation layer.

IPC Classes  ?

• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support

Abstract

A flat panel detector and a detection device, which can reduce the leakage current, and improve the detection efficiency and accuracy. A detection substrate of the flat panel detector comprises a base substrate (10), at least one gate line (1), at least one scanning line (2), a pixel unit, and a photoelectric converter. The pixel unit comprises a thin film transistor (3). The thin film transistor (3) comprises a semiconductor layer (32), a first electrode (33), and a second electrode (34). The photoelectric converter comprises a bottom electrode (6), and the bottom electrode (6) is electrically connected to the first electrode (33) by means of a first via (9). In at least one pixel unit, the minimum distance between the orthographic projection of the first via (9) on the base substrate (10) and the orthographic projection of the scanning line (2) closest to the first via (9) on the base substrate (10) is L1, and the maximum distance between the orthographic projection of the semiconductor layer (32) on the base substrate (10) and the orthographic projection of the scanning line (2) closest to the first via (9) on the base substrate (10) is L2, wherein L2 is greater than or equal to L1.

IPC Classes  ?

• H01L 27/146 - Imager structures

Abstract

An adjustable antenna array and an electronic apparatus are provided. The adjustable antenna array includes: a first substrate and a second substrate opposite to each other, and antenna sub-arrays in an array. Each of at least some antenna sub-arrays includes a phase shifter, a power division feeding network, and a plurality of radiating units. The phase shifter and the power division feeding network are between the first substrate and the second substrate. At least some radiating units are connected to the phase shifter through the power division feeding network. Antenna patterns corresponding to the plurality of radiating units at least include patterns on a side of the second substrate away from the first substrate. An area of an orthographic projection of the power division feeding network on the first substrate is smaller than an area of an orthographic projection of the phase shifter on the first substrate.

IPC Classes  ?

• H01Q 3/36 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture varying the phase by electrical means with variable phase-shifters
• H01Q 21/22 - Antenna units of the array energised non-uniformly in amplitude or phase, e.g. tapered array or binomial array

Abstract

A phase shifter, a phase shifter array, an antenna array and an electronic device are provided and belong to the field of communication technology. The phase shifter includes: first and second dielectric substrates opposite to each other, a first transmission line and a second transmission line on a side of the first dielectric substrate close to the second dielectric substrate, patch electrodes on a side of the second dielectric substrate close to the first dielectric substrate, and a tunable dielectric layer between a layer where the transmission lines are located and a layer where the patch electrodes are located; wherein orthographic projections of two ends of each patch electrode on the first dielectric substrate overlap with orthographic projections of the first and second transmission lines on the first dielectric substrate, respectively; and at least two of the plurality of patch electrodes are connected to different first bias voltage lines.

IPC Classes  ?

• H01P 1/18 - Phase-shifters
• G02F 1/1343 - Electrodes
• H01Q 3/36 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture varying the phase by electrical means with variable phase-shifters

Abstract

A light adjustment device includes a first substrate and a second substrate that are arranged opposite to each other, a light adjustment module, and an ultraviolet light blocking layer. The light adjustment module is located between the first substrate and the second substrate. The ultraviolet light blocking layer is located between the first substrate and the light adjustment module or located inside the light adjustment module. A refractive index of the ultraviolet light blocking layer is greater than a refractive index of the first substrate.

IPC Classes  ?

• G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
• B60J 3/00 - Antiglare equipment associated with windows or windscreensSun visors for vehicles
• B60J 3/04 - Antiglare equipment associated with windows or windscreensSun visors for vehicles adjustable in transparency
• E06B 9/24 - Screens or other constructions affording protection against light, especially against sunshineSimilar screens for privacy or appearance

Abstract

The present disclosure provides a phase shifter, an antenna and an electronic device, and belongs to the field of communication technology. The phase shifter includes a plurality of phase shifting units, a first power division network and a second power division network; each phase shifting unit includes a first transmission structure and a second transmission structure; the first power division network includes a first feeding port and a plurality of second feeding ports; the second power division network includes a third feeding port and a plurality of fourth feeding ports; and the first transmission structure of the phase shifting unit is electrically connected to one second feeding port; the second transmission structure of the phase shifting unit is electrically connected to one fourth feeding port.

IPC Classes  ?

• H01P 1/18 - Phase-shifters
• H01Q 1/50 - Structural association of antennas with earthing switches, lead-in devices or lightning protectors

Abstract

A phase shifter, including: first and second substrates opposite to each other; an adjustable dielectric layer and a plurality of pillar supports between the first and second substrates; first and second conductive layers on sides of first and second substrates close to the adjustable dielectric layer, respectively, where patterns of the first and second conductive layers include at least one first electrode and at least one second electrode, respectively, orthographic projections of the at least one first electrode and the at least one second electrode on the first substrate at least partially overlap each other; orthographic projections of each of the plurality of pillar support, and the pattern of the first conductive layer on the first substrate do not overlap each other, and the pillar supports of the plurality of pillar supports close to an edge of the pattern of the first conductive layer are equally spaced apart therefrom.

IPC Classes  ?

• H01P 1/18 - Phase-shifters
• H01Q 3/36 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture varying the phase by electrical means with variable phase-shifters

Abstract

The present disclosure provides a digital microfluidic nucleic acid detection chip, detection method, and detection apparatus. The digital microfluidic nucleic acid detection chip includes: a first substrate and a second substrate assembled with the first substrate, and a cavity formed between the first substrate and the second substrate includes a functional region (AC), which is configured to perform a nucleic acid detection processing on a droplet to be detected and obtain a hybridization color development signal for indicating whether a target gene exists in the droplet to be detected; the first substrate at least includes a plurality of drive units, which are configured to drive the droplet to be detected to move, a volume of the droplet to be detected is 10 μl to 200 μl, and a dimension of a drive unit is 2 mm to 100 mm in a moving direction of the droplet to be detected.

IPC Classes  ?

• B01L 3/00 - Containers or dishes for laboratory use, e.g. laboratory glasswareDroppers
• B01L 7/00 - Heating or cooling apparatusHeat insulating devices
• C12Q 1/6825 - Nucleic acid detection involving sensors
• C12Q 1/686 - Polymerase chain reaction [PCR]

Abstract

Provided is a method for tracking a satellite. The method includes: acquiring trajectory information and antenna attitude information of a COTM device; calculating a theoretical pointing angle of an antenna beam for a target satellite based on an orbit parameter of the target satellite and the trajectory information; acquiring an actual pointing angle of the antenna beam by correcting, based on the antenna attitude information, the theoretical pointing angle of the antenna beam; controlling, based on the actual pointing angle of the antenna beam, a receiving phased array antenna to form an antenna beam; acquiring data information of the satellite signal, and correcting an actual pointing angle of the current antenna beam; controlling a transmitting phased array antenna to form an antenna beam based on a corrected actual pointing angle; establishing a communication link and updating ephemeris data of the target satellite.

IPC Classes  ?

• G01S 19/26 - Acquisition or tracking of signals transmitted by the system involving a sensor measurement for aiding acquisition or tracking
• G01S 19/30 - Acquisition or tracking of signals transmitted by the system code related
• H01Q 3/36 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture varying the phase by electrical means with variable phase-shifters

Abstract

The present disclosure belongs to the technical field of communications. Provided is a satellite tracking method. The satellite tracking method disclosed in the present disclosure comprises: acquiring track information and antenna attitude information of a communications-on-the-move device in real time; for a target satellite, performing calculation on the basis of orbital parameters of the target satellite and the track information of the communications-on-the-move device, so as to obtain a theoretical pointing angle of an antenna beam; on the basis of the antenna attitude information of the communications-on-the-move device, correcting the theoretical pointing angle of the antenna beam, so as to obtain an actual pointing angle of the antenna beam; on the basis of the actual pointing angle of the antenna beam, controlling a receiving phased-array antenna in the communications-on-the-move device to form an antenna beam; in response to the signal strength of a satellite signal being greater than or equal to a preset value, acquiring data information of the received satellite signal, and correcting the actual pointing angle of the current antenna beam; on the basis of the corrected actual pointing angle of the antenna beam, controlling a transmitting phased-array antenna to form an antenna beam; and establishing a communication link, and updating ephemeris data of the target satellite.

IPC Classes  ?

• H04B 7/185 - Space-based or airborne stations

Abstract

A detection device, comprising: a plurality of MEMS sensors (1), wherein the MEMS sensors (1) are configured to acquire, in real time, signals to undergo detection, and output sensing signals on the basis of the signals to undergo detection; and a processing module (2), wherein the processing module (2) is configured to receive the sensing signals from the plurality of MEMS sensors (1), and on the basis of sensing signals of the plurality of MEMS sensors (1) at each sampling time point, determine a detection result of the detection device; wherein there is a predetermined interval duration between two adjacent sampling time points, and a sensing signal of each MEMS sensor (1) at a current sampling time point is related to a signal to undergo detection at the current sampling time point, a sensing signal at a previous sampling time point, and an attenuation coefficient. The invention further relates to a training method for the detection device, a training device for the detection device, and a computer-readable storage medium.

IPC Classes  ?

• G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges

Abstract

A sensor chip is provided. The sensor chip includes a first base substrate; a piezoresistor on the first base substrate; a second base substrate on a side of the piezoresistor away from the first base substrate; a metal wire bond extending through the second base substrate; and a pressure reference chamber between the first base substrate and the second base substrate. The first base substrate and the second base substrate encapsulate at least a portion of the piezoresistor inside the pressure reference chamber.

IPC Classes  ?

• G01L 1/18 - Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material

Abstract

A dimming panel and a control method therefor, a dimming structure and a dimming device. The dimming panel comprises a first substrate, a second substrate, a dye liquid crystal layer, and a plurality of light absorption particles. The first substrate comprises a first electrode. The second substrate is arranged opposite to the first substrate, and the second substrate comprises a second electrode and a third electrode. The second electrode is electrically insulated from the third electrode, and the third electrode comprises a plurality of first sub-electrodes arranged at intervals. The dye liquid crystal layer is located between the first substrate and the second substrate. The plurality of light absorption particles are located in the dye liquid crystal layer, and the plurality of light absorption particles are configured to absorb infrared light. The control method comprises: applying a direct current to at least one of the first electrode, the second electrode and the third electrode, so that an electric field perpendicular to the direction of the first substrate is formed between the first substrate and the second substrate, and the plurality of light absorption particles are distributed on the surface of the first substrate or the second substrate close to the dye liquid crystal layer.

IPC Classes  ?

• G02F 1/1333 - Constructional arrangements
• G02F 1/1337 - Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers

Abstract

A transition unit of a radio frequency device provides a transition between a planar differential pair transmission line and a hollow radio frequency waveguide. A substrate layer arrangement with a planar differential pair transmission line is arranged on one or more surfaces of at least one substrate layer. An end section of the transmission line is configured as a radio frequency signal emission pattern. The transition unit has an end section of a waveguide for electromagnetic waves that is attached to the substrate layer arrangement and superposes the radio frequency signal emission pattern. The waveguide is directed perpendicular to the substrate layer arrangement. An open end of the end section of the wave-guide is attached to a first outer surface or a second outer surface of the substrate layer arrangement. Opposite to the end section a back cavity is attached with an open end towards the substrate layer arrangement.

IPC Classes  ?

• H01P 5/107 - Hollow-waveguide/strip-line transitions
• H01P 3/08 - MicrostripsStrip lines
• H01P 3/12 - Hollow waveguides

Abstract

Provided in the present disclosure are a filter and a preparation method therefor, and an electronic device. The filter comprises a base substrate, which is provided with a conductive column, wherein a first structure layer is provided on a first surface of the base substrate, and a second structure layer, a first insulating layer, a lead layer, a second insulating layer and a pad layer are provided on a second surface of the base substrate. The first structure layer and the second structure layer each comprise a connecting electrode connected to the conductive column, and the second structure layer further comprises a capacitor structure; the lead layer comprises at least one lead, wherein the lead is connected to the capacitor structure; the pad layer comprises at least one pad, wherein the pad is connected to the lead; and the materials of the first insulating layer and the second insulating layer comprise an organic material. By means of providing a first insulating layer and a second insulating layer, which are made of an organic material, the present disclosure can improve the performance stability and reliability of a filter, thereby also improving the performance of the filter.

IPC Classes  ?

• H03H 1/00 - Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
• H03H 3/00 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators

Abstract

There is provided a light adjusting structure, a light adjusting module and a light adjusting device, the light adjusting structure includes one or two light adjusting functional layers stacked, each light adjusting functional layer includes functional sub-layers in different regions, first substrates and/or second substrates of the functional sub-layers constitute a full-layer planar substrate, one of first electrodes or second electrodes of the functional sub-layers are disposed at an interval, and the other one of the first electrodes or the second electrodes are disposed at an interval or constitute a full-layer planar electrode; dye liquid crystal layers of the functional sub-layers each include a sealant between the first alignment layer and the second alignment layer, and dye molecules and liquid crystal molecules in a space surrounded by the sealant; sealants of the functional sub-layers are disposed at an interval, and spaces surrounded by the sealants are isolated.

IPC Classes  ?

• G02F 1/1345 - Conductors connecting electrodes to cell terminals
• G02F 1/1339 - GasketsSpacersSealing of cells
• G02F 1/1343 - Electrodes

Abstract

The present disclosure provides a radio frequency apparatus, an antenna and an electronic device, and belongs to the field of communication technology. The radio frequency apparatus includes first and second dielectric substrates opposite to each other, first and second phase shifting structures between the first and second dielectric substrates; wherein the radio frequency apparatus further includes a first connection electrode and a second connection electrode; the first phase shifting structure and the second phase shifting structure each have a first end and a second end, the first ends of the first phase shifting structure and the second phase shifting structure are electrically connected to each other by the first connection electrode; the second ends of the first phase shifting structure and the second phase shifting structure are electrically connected to each other by the second connection electrode, to form a ring circuit structure.

IPC Classes  ?

• H01Q 3/36 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture varying the phase by electrical means with variable phase-shifters

Abstract

A light-adjusting glass is provided to include: a first toughened glass layer, a first adhesive layer, a first substrate, a second substrate, a second adhesive layer, a second toughened glass layer and supporting spacers between the first and second substrates, which are sequentially stacked; materials of the first and second adhesive layers are melted under the conditions that a temperature is in a range of 130° C. to 150° C. and a pressure is in a range of 12 bar to 14 bar, and are solidified after being cooled; the light-adjusting glass further includes an edge sealing structure around the first and second substrates, and the edge sealing structure, the first and second substrates are enclosed to form a gap filled with a liquid crystal; the edge sealing structure includes a liquid crystal pouring port therein; a sealing glue is at an opening of the liquid crystal pouring port and seals the opening.

IPC Classes  ?

• G02F 1/1341 - Filling or closing of cells
• G02F 1/1333 - Constructional arrangements
• G02F 1/1337 - Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
• G02F 1/1339 - GasketsSpacersSealing of cells
• G02F 1/1343 - Electrodes