Ohashi Engineering Co., Ltd

Japan

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IPC Class
B65H 37/04 - Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching, or stapling 2
H01L 21/52 - Mounting semiconductor bodies in containers 2
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits 2
A01G 9/08 - Devices for filling-up flower-potsDevices for setting plants in pots 1
B23P 21/00 - Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control 1
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Found results for  patents

1.

MOUNTING DEVICE

      
Application Number JP2024012253
Publication Number 2025/017971
Status In Force
Filing Date 2024-03-27
Publication Date 2025-01-23
Owner OHASHI ENGINEERING CO., LTD. (Japan)
Inventor
  • Kashitani, Hisayoshi
  • Kitagawa, Junichiro
  • Watanabe, Yusuke

Abstract

Provided is a mounting device with which it is possible to solve problems such as an increase in weight that occur in relation to a heater for heating a component to be mounted. The mounting device (21) is provided with: a fixed unit (U1); and a moving unit (U2) that is held by the fixed unit (U1) so as to be movable in a direction in which the moving unit advances and retracts with respect to a substrate (102). The fixed unit (U1) has a heating unit (23). The moving unit (U2) has: a head part (35); and a shaft body (14) at the tip of which the head part (35) is provided. In a state in which the moving unit (U2) is retracted with respect to the fixed unit (U1), the head part (35) and/or the shaft body (14) is in contact with the heating unit (23), and the head part (35) is heated. In a state in which the moving unit (U2) is advanced with respect to the fixed unit (U1) and a component (103) is pressed against the substrate (102), the head part (35) and the shaft body (14) are not in contact with the heating unit (23).

IPC Classes  ?

  • H01L 21/52 - Mounting semiconductor bodies in containers

2.

TAPE AFFIXING DEVICE

      
Application Number JP2023017252
Publication Number 2024/176475
Status In Force
Filing Date 2023-05-08
Publication Date 2024-08-29
Owner OHASHI ENGINEERING CO., LTD. (Japan)
Inventor
  • Kashitani, Hisayoshi
  • Tomita, Akira
  • Kondo, Tsuyoshi

Abstract

Provided is a tape affixing device that can equalize the length of anisotropic conductive tape affixed to a workpiece. In this tape affixing device (1), a conveyance unit (30) intermittently executes an operation for conveying a tape member (T) by a length obtained by adding a gap length (L2) to a prescribed length (L1). A cutting unit (10) comprises a blade holding part (12) that holds a downstream cutting blade (13) and an upstream cutting blade (14) in a state in which the length from the downstream cutting blade (13) to the upstream cutting blade (14) is the prescribed length (L1), and when the conveyance unit (30) stops the operation for conveying the tape member (T), the blade holding unit moves forward toward anisotropic conductive tape (t1) and cuts the anisotropic conductive tape (t1) to the prescribed length (L1).

IPC Classes  ?

  • B26D 1/09 - Cutting through work characterised by the nature or movement of the cutting memberApparatus or machines thereforCutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member wherein the cutting member reciprocates of the guillotine type with a plurality of cutting members
  • B26D 3/08 - Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
  • B26D 7/06 - Arrangements for feeding or delivering work of other than sheet, web, or filamentary form
  • B26D 7/18 - Means for removing cut-out material or waste
  • B65H 35/07 - Adhesive-tape dispensers
  • H01L 21/52 - Mounting semiconductor bodies in containers

3.

AFFIXING DEVICE

      
Application Number JP2022011778
Publication Number 2022/244423
Status In Force
Filing Date 2022-03-16
Publication Date 2022-11-24
Owner OHASHI ENGINEERING CO., LTD. (Japan)
Inventor
  • Kashitani, Hisayoshi
  • Tomita, Akira
  • Kato, Akira
  • Kondo, Tsuyoshi
  • Watanabe, Yusuke

Abstract

Provided is an affixing device capable of affixing an individual film piece to a workpiece with higher accuracy. An affixing device (1) comprises: an affixing means (2B) having a first moving means that moves a tool (20) toward a tape member (T), and a second moving means that moves the tool (20) along a direction in which the tape member (T) is fed; a carrier means (3) that moves a table (26) holding a workpiece (W); an image capturing means (4) that captures an image of an individual film piece (t1) positioned at the front; and a control means that is capable of controlling the tool (20) to be pressed against the tape member (T) by sending a command to the first moving means, calculates, on the basis of captured image data from the image capturing means (4), the current position of the individual film piece (t1) positioned at the front, and also calculates a deviation amount between the current position and an affixing reference position, and sends a command to the second moving means and a table moving means to move the tool (20) and the workpiece (W) to locations corresponding to the current position, on the basis of the deviation amount.

IPC Classes  ?

  • B23P 21/00 - Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
  • B65H 37/04 - Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching, or stapling
  • H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

4.

TAPE ADHESION APPARATUS

      
Application Number JP2022011777
Publication Number 2022/209882
Status In Force
Filing Date 2022-03-16
Publication Date 2022-10-06
Owner OHASHI ENGINEERING CO., LTD. (Japan)
Inventor
  • Kashitani, Hisayoshi
  • Tomita, Akira
  • Nakamura, Hidemasa

Abstract

Provided is a tape adhesion apparatus capable of causing an anisotropic conductive tape to adhere with high accuracy to an object. The tape adhesion apparatus (1) comprises: a supply means that supplies a tape member (T); a transport means that is provided with a drive part for sending the tape member (T) and a tension-applying part for applying a prescribed tension to the tape member (T), and that transports the tape member (T) and causes a portion of an anisotropic conductive tape (t1) positioned at the transport-direction tip end thereof to be positioned above an object (W); an adhesion means that causes the anisotropic conductive tape (t1) to adhere to the object (W); a peeling means that peels a separator (t2) from the anisotropic conductive tape (t1); and a recovery means that recovers the tape member (T). Guide members that are provided between the drive part and the tension-applying part and contact the tape member (T), and guide members that contact the tape member (T) at the peeling means are all incapable of rotating with respect to the tape member (T).

IPC Classes  ?

  • B65H 37/04 - Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching, or stapling
  • B65H 41/00 - Machines for separating superposed webs
  • B65H 20/02 - Advancing webs by friction roller
  • B65H 23/14 - Tensioning rollers applying braking forces
  • B65H 23/16 - Registering, tensioning, smoothing, or guiding webs longitudinally by weighted or spring-pressed movable bars or rollers
  • H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

5.

GRIPPING DEVICE AND DIVIDING DEVICE, AND TRANSPLANT DEVICE AND TRANSPLANT SYSTEM USING SAME

      
Application Number JP2019039927
Publication Number 2020/075786
Status In Force
Filing Date 2019-10-09
Publication Date 2020-04-16
Owner OHASHI ENGINEERING CO., LTD. (Japan)
Inventor
  • Ohashi Kazumichi
  • Suzuki Hiroki

Abstract

A gripping device (60) grips a seedling bed piece (C3) into which a seedling has been planted. The gripping device comprises: at least a pair of gripping members (65) that are provided so as to be able to move relative to each other along a first direction; and at least a pair of tip portions (66) that are provided to the tips of the pair of gripping members (65) and that can grip the seedling bed piece (C3) by sandwiching at least two opposing side surfaces of the seedling bed piece. In conjunction with the relative movement of the pair of gripping members (65), each tip portion of the pair of tip portions (66) can mutually approach and separate while maintaining an equal distance therebetween over the entire length of the tip portions (66).

IPC Classes  ?

  • A01G 9/08 - Devices for filling-up flower-potsDevices for setting plants in pots
  • B25J 15/00 - Gripping heads

6.

DEVICE FOR ELIMINATING SLACKNESS OF SHOCK-ABSORBING TAPE

      
Application Number JP2008073386
Publication Number 2009/081924
Status In Force
Filing Date 2008-12-24
Publication Date 2009-07-02
Owner OHASHI ENGINEERING CO., LTD (Japan)
Inventor Suzuki, Shinji

Abstract

Disclosed is a shock-absorbing tape slackness eliminating device, which can be made small in size. A shock-absorbing tape (80) has its source side wound on a let-off shaft (6) and its target side wound on a take-up shaft (7). In order to adhere an ACF to an electric work or to apply an electric part to the electric work through the ACF, a head member moves forward to the electric work while pushing the shock-absorbing tape (80) and then backward so that the shock-absorbing tape (80) becomes slack. The take-up shaft (7) is connected to a drive shaft (16) by connecting means (24), and friction members (31 and 33) are arranged between the drive shaft (16) and the let-off shaft (6). The rotations of the drive shaft (16) are transmitted through the connecting means (24) to the take-up shaft (7) and through the friction members (31 and 33) to the let-off shaft (6), so that the aforementioned slackness is eliminated by the take-up shaft (7) and the let-off shaft (6) to rotate in the directions opposite to each other.

IPC Classes  ?

  • H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation