Proposed is a solder soldering method using a laser. The solder soldering method performs solder soldering within a few seconds by using the laser so that warpage occurring due to a difference in a coefficient of thermal expansion between a chip and a substrate may be reduced, thermal shock that occurs on the chip and the substrate may be reduced, an entire process time may be reduced, and defects due to an uneven solder processing temperature may be reduced. The solder soldering method includes a supplying process in which a substrate having solder is supplied to a substrate fixing member, a preheating process in which the substrate and the solder are preheated, an attachment process in which the substrate is irradiated with the laser and the solder is melted and attached to the substrate, and a discharging process in which the substrate is moved to a tray.
Proposed is a method for controlling a boat carrier/substrate strip type solder ball placement system that allows solder ball mounting processes for a boat carrier type of a material and a substrate strip type of a material to be all performed in one system. In specific, the method allows the components or operation setting of the system to be automatically controlled according to the types of materials loaded on a magazine, thereby performing solder ball mounting processes for the two types of materials with high speed and high accuracy. In more specific, the method allows a component applied only to the solder ball mounting process for the boat carrier type of material and a component applied to the solder ball mounting process for the substrate strip type of material to be integrated with each other as a single component in the process of mounting the solder balls on the material on-loaded, thereby making it possible to perform the solder ball mounting processes for the two different types of materials in one system.
G05B 19/19 - Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path
A dual-type solder ball placement system is capable of allowing solder balls of the same type or solder balls having two different types to be mounted simultaneously through two ball mounting lines, thereby efficiently mounting the solder balls arranged with various purposes and patterns. Specifically, the dual-type solder ball placement system allows solder balls serving as terminals and core balls serving as supports to be mounted simultaneously through an inline method, thereby preventing a wafer, a unit, a chipset, and the like that become lighter, thinner, shorter, and smaller from being bent.
A flux tool allows the elastic pad to pressurize each flux pin individually in a process of dotting flux, so that even though a wafer or die may be deformed, high-quality flux dotting is achieved. Specifically, the flux tool allows the elastic pad pressurizing the flux pins to be made of rubber, especially silicone, so that primarily, the flux pins are entirely pressurized uniformly by means of the elastic force of the elastic pad, and secondarily, each flux pin is individually pressurized against the underside of the elastic pad, thereby adjusting the heights of the flux pins upon flux dotting according to the flatness or bent shape of the wafer or die to minimize the flux dotting defects.
H01L 23/00 - Details of semiconductor or other solid state devices
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
5.
METHOD FOR CONTROLLING BOAT/STRIP TYPE SOLDER BALL PLACEMENT SYSTEM
The present invention relates to a method for controlling a boat/strip type solder ball placement system and, more specifically, enables both a boat carrier type solder ball mounting process and a substrate strip type solder ball mounting process in one system. Particularly, the present invention enables the two types of solder ball mounting process to be carried out quickly and accurately by automatically adjusting the configuration of the system, the operation settings or the like in accordance with the type of material onloaded to a magazine. Also, the present invention enables the two different types of process to be carried out in one system by combining, into one configuration, a configuration applied only to a boat carrier type and a configuration applied only to a substrate strip type in a process for mounting a solder ball to an onloaded material. Therefore, reliability and competitiveness can be improved in the semiconductor field, semiconductor package manufacturing field, PCB manufacturing field, particularly, wafer level chip scale package (WLCSP)-based manufacturing field, solder ball placement system field as well as fields similar or related thereto.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
The present invention relates to a dual-type solder ball placement system and, more specifically, links two types of ball mounting lines to one solder ball placement system so that solder balls can be mounted in various manners. Specifically, the present invention can simultaneously mount the same solder balls or two types of solder balls having different purposes on two lines in one device, so that the solder balls arranged for various purposes in various patterns can be efficiently mounted. Particularly, the present invention can simultaneously mount, in an in-line system, the solder ball acting as a terminal and a core ball acting as a support, and can prevent the bending of a substrate, a unit, or a chipset according to the trend of being light, thin, short and small. Therefore, reliability and competitiveness can be improved in the semiconductor field, the semiconductor package manufacturing field, the PCB manufacturing field, particularly, the wafer level chip scale package (WLCSP)-based manufacturing field, the solder ball placement system field, and other fields that are similar or related thereto.
The present invention relates to a flux tool using an elastic pad and, more specifically, to a flux tool configured for flux printing equipment for dotting a flux in order to attach a solder ball to a substrate. Particularly, according to the present invention, respective flux pins configured for a flux tool are pressurized individually (pin-by-pin) during a flux dotting process such that, even if the substrate or die is deformed, a flux can be dotted with a constant quality. Specifically, according to the present invention, all flux pins are uniformly pressurized primarily by an elastic force from an elastic pad, and respective flux pins are individually (pin-by-pin) pressurized on the lower surface. Accordingly, the height of each flux pin can be adjusted according to the flatness and bending shape of the substrate or die during flux dotting, thereby minimizing defective flux dotting. A conductive thin film may be provided on the lower surface of the elastic pad so as to prevent static electricity and to prevent damage and deformation of the elastic pad. Therefore, reliability and competitiveness can be improved in semiconductor fields, semiconductor package manufacturing fields, PCB manufacturing fields, particularly wafer level chip scale package (WLCSP)-based manufacturing fields, solder ball placement system fields, fields related to flux tools and flux printing equipment comprising same, and other fields similar or related thereto.
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Semiconductor manufacturing machines; machines for transporting semiconductor wafers for use in manufacturing automation; machines for transporting semiconductor elements
Disclosed is a solder ball supply device for performing a ball bumping process by supplying solder balls to the upper side of a ball mask so as to carry out ball bumping. The solder ball supply device, according to the present invention, comprises: a housing of which the lower part is open; a rotary shaft coupled to the center of the housing; a press member which is fixed inside the housing so as to uniformly disperse the solder balls on the upper side of the ball mask and slightly press the solder balls positioned on the upper side of the ball mask such that the solder balls are inserted into mask holes of the ball mask; an air curtain part for spraying gas into the housing so as to prevent the solder balls from escaping out of the housing; and a rotation driving means for rotating the housing and the press member by rotating the rotary shaft. According to the present invention, the solder balls put onto the upper side of the mask are uniformly distributed and are pushed or slightly pressed by the press member so as to be more stably inserted into the mask holes. In addition, the solder balls are continuously maintained in a ball retaining region at the center of the inside of the housing by the gas sprayed from the outer edges thereof, and thus the ball bumping process can be more efficiently performed by using a reduced amount of the solder balls when compared to conventional ball bumping processes.
H01L 23/488 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions
