A MEMS microphone, an electronic device, and a preparation method for the MEMS microphone. The MEMS microphone comprises a substrate, a first diaphragm, a back electrode and a second diaphragm, wherein a sound cavity is formed in the substrate; the back electrode is arranged on the substrate; a first support structure is provided on the side of the back electrode that faces the first diaphragm; a second support structure is provided on the side of the back electrode that is away from the first diaphragm; the second diaphragm is arranged on the back electrode; a second gap is formed between the second diaphragm and the back electrode; and the first diaphragm and/or the second diaphragm are/is a graphene diaphragm.
A piezoelectric diaphragm (200), a piezoelectric transducer and a preparation method, a sound-emitting apparatus, and an electronic device. The piezoelectric diaphragm (200) comprises a first piezoelectric layer (210) and a second piezoelectric layer (220), which covers one side of the first piezoelectric layer (210), wherein the lower surface of the first piezoelectric layer (210) is provided with a first electrode (230), the upper surface of the second piezoelectric layer (220) is provided with a third electrode (250), and a second electrode (240) is provided between the first piezoelectric layer (210) and the second piezoelectric layer (220); and in a projection direction, the first electrode (230) and the third electrode (250) are respectively disposed on two sides of the second electrode (240) and are both arranged in a manner of being staggered with the second electrode (240). The piezoelectric diaphragm (200) is a base-free composite film structure of a double-layer piezoelectric material and a three-layer electrode material, solves the problem of the flatness and performance of diaphragms being poor, and significantly reduces a driving voltage and a power compared with a design with a base.
Disclosed in the present application are a sensor chip and a manufacturing method therefor, a capacitive sensor, and an electronic device. The sensor chip comprises a substrate and a sensing assembly, which is arranged on the substrate, wherein the sensing assembly comprises a vibrating diaphragm, a fixed electrode assembly and a movable electrode; the vibrating diaphragm is supported on one side of the substrate, and encloses a vacuum cavity with the substrate; the fixed electrode assembly comprises two high-bias electrodes and a grounding electrode; the grounding electrode and the two high-bias electrodes are all arranged on the substrate and located on one side of the vacuum cavity; the movable electrode is arranged on the vibrating diaphragm, can serve as a detection node to be virtually grounded, and is opposite the grounding electrode; a support column is provided on the side of the vibrating diaphragm that is located in the vacuum cavity, and the support column can make the distance between the vibrating diaphragm and each high-bias electrode greater than a critical distance under the atmospheric pressure; under the application of a high bias, an electrostatic repulsion force is formed between the movable electrode and each high-bias electrode, and the diaphragm and the movable electrode can move in a direction away from the high-bias electrode under the electrostatic repulsion force; and the movable electrode generates an alternating-current signal output voltage during operation. FIG. 1 is an abstract drawing.
Disclosed in embodiments of the present application are a MEMS acoustic sensing chip, a microphone and an electronic device. The MEMS acoustic sensing chip comprises a substrate, a first diaphragm, a second diaphragm, a backplate and a supporting structure. A back cavity is formed in the substrate. The first diaphragm, the second diaphragm and the backplate are arranged on one side of the substrate by means of the supporting structure, an internal cavity is formed between the first diaphragm and the second diaphragm, and the backplate is suspended in the internal cavity. An air discharge hole is formed in the supporting structure, the air discharge hole is communicated with the back cavity, and the air discharge hole is independent of the internal cavity. A release hole is formed in at least one of the first diaphragm and the second diaphragm, and the release hole is communicated with the internal cavity.
Disclosed in the embodiments of the present application are a piezoelectric MEMS transducer, a processing method therefor, a package structure, and an electronic device. The piezoelectric MEMS transducer comprises a base and a diaphragm, the diaphragm comprises a piezoelectric layer, and the piezoelectric layer comprises a first area and a second area. The second area is arranged on at least one side of the first area, the first area and the second area are arranged in a staggered manner in a first direction, and the first area and the second area are arranged spaced apart in a second direction, wherein the first direction is the height direction of the piezoelectric MEMS transducer, and the second direction is perpendicular to the first direction; and a first electrode layer is provided on each of the two opposite surfaces of the first area, and a second electrode layer is provided on each of the two opposite surfaces of the second area. One technical effect of the embodiments of the present application lies in that providing a diaphragm in which a substrate is omitted and a single piezoelectric layer is used greatly reduces the voltage required for driving a piezoelectric MEMS transducer.
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
A MEMS microphone is provided, comprising a substrate having a back cavity, and a plate capacitor structure arranged on the substrate, the plate capacitor structure being formed by a vibration diaphragm, a backplate and a support portion; wherein a pressure relief device is provided in the vibration diaphragm, a pressure maintaining channel is formed between the vibration diaphragm and the backplate; and the pressure relief device in the vibration diaphragm constitutes an inlet of the pressure maintaining channel.
Disclosed is a MEMS chip that in certain embodiments includes a substrate with a back cavity, and a plate capacitor bank provided on the substrate; the plate capacitor bank at least includes a first plate capacitor structure and a second plate capacitor structure located below the first plate capacitor structure and arranged in parallel with the first plate capacitor structure; the first plate capacitor structure includes a first diaphragm and a first hack electrode; and the second plate capacitor structure includes a second. diaphragm and a second back electrode.
Disclosed is a packaging structure for circuit units, comprising: a circuit baseplate, wherein the circuit baseplate is provided thereon with a circuit unit, the circuit unit including a silicon dioxide layer and an electronic device arranged on the silicon dioxide layer; an insulator, wherein the insulator surrounds the circuit unit; and an electromagnetic shielding layer, wherein the electromagnetic shielding layer covers the circuit unit and the insulator.
Disclosed is a packaging method for circuit units, wherein the circuit units comprise a silicon layer substrate and a silicon dioxide layer overlaid on the silicon layer substrate. The packaging method for a circuit unit comprises: attaching a plurality of circuit units to a circuit baseplate in a spaced and inverted mode, wherein the silicon dioxide layer is attached to the circuit baseplate, and the silicon layer substrate faces away from the circuit baseplate; forming an insulator between the circuit units; removing the silicon layer substrate to expose the silicon dioxide layer; and forming an electromagnetic shielding layer on the silicon dioxide layer and the insulator.
Disclosed are a MEMS chip and an electronic device. The chip can include a substrate having a back cavity, as well as a back electrode and an induction membrane both disposed on the substrate, wherein the back electrode and the induction membrane are located on the back cavity and constitute a capacitor structure, the induction membrane comprises an active area opposite to the back cavity, an inactive area disposed outside the active area, and an isolation area located between the active area and the inactive area, and the isolation area comprises two insulation loops connected to the active area and the inactive area respectively, and a buffer area connected between the two insulation loops, both of the insulation loops being disposed around the active area.
Disclosed is a micro-filter comprising a substrate with a back cavity and a film layer provided on the substrate and suspended above the back cavity; the film layer has through holes distributed thereon, and is made of an amorphous metal film. Also disclosed is an acoustic device comprising the micro-filter.
Disclosed is a method for packaging a chip, comprising the following steps: providing a baseplate formed with an open slot thereon penetrating through opposite sides of the baseplate; providing a release base material, wherein the release base material is bonded to a first side of the baseplate and covers the open slot; providing a chip, wherein the chip is mounted on the release base material at the position of the open slot; packaging a second side of the baseplate facing away from the release base material so as to form a packaging layer which packages the chip and fixes it on the baseplate; removing the release base material so as to obtain a package structure for the chip.
H01L 21/44 - Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
13.
Noise reduction method and apparatus for microphone array of earphone, earphone and TWS earphone
Disclosed are a noise reduction method for a microphone array of an earphone, an apparatus, and an earphone comprising: acquiring, when an earphone wearer speaks, a first sound signal collected by a bone conduction microphone arranged on the earphone and second sound signals collected respectively by a preset number of microphones arranged on the earphone; determining, according to the first sound signal and the second sound signal, a delay time from a time when the voice signal arrives at each microphone to a time when the voice signal arrives at the bone conduction microphone; computing, according to the delay time, a pointing angle of the microphone array formed by the microphones relative to the wearer's mouth; and adjusting a beam pointing angle of the microphone array according to the pointing angle, such that the microphone array forms a beam by an adjusted beam pointing angle.
An air pressure sensor chip and a method for preparing same. The air pressure sensor chip comprises two first capacitors (101) and two second capacitors (102), wherein one of the two first capacitors (101) is connected in series with one of the two second capacitors (102) to form a first branch, the other one of the two first capacitors (101) is connected in series with the other one of the two second capacitors (102) to form a second branch, and the first branch is connected in parallel with the second branch; the first capacitors (101) are configured such that the capacitance values thereof increase under the action of external air pressure; and the second capacitors (102) are configured such that the capacitance values thereof decrease under the action of external air pressure.
G01L 9/12 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance
15.
ULTRASONIC CONTROL METHOD, APPARATUS AND DEVICE, AND MEDIUM
Provided are an ultrasonic control method, apparatus and device, and a storage medium. Said method comprises: in the process of transmitting an ultrasonic driving signal, acquiring driving sound wave characteristics of the ultrasonic driving signal (S10); determining suppressing sound wave characteristics of an inverted suppressing signal according to the driving sound wave characteristics (S20); and when the transmission of the ultrasonic driving signal ends, applying the inverted suppressing signal to an ultrasonic sensor according to the suppressing sound wave characteristics, so as to suppress the resonance generated by the ultrasonic driving signal by means of the inverted suppressing signal (S30).
Provided are a timing adjustment method, a terminal device and a computer-readable storage medium. The timing adjustment method comprises: acquiring a duty cycle of a first pulse width modulation waveform, wherein a low level state is continuously set within a signal period of the first pulse width modulation waveform; and on the basis of the duty cycle, performing timing adjustment on the low level state of the first pulse width modulation waveform, so as to generate a second pulse width modulation waveform, wherein a low level state is discretely set within a signal period of the second pulse width modulation waveform, and the duty cycle of the first pulse width modulation waveform is the same as a duty cycle of the second pulse width modulation waveform.
H02P 7/29 - Arrangements for regulating or controlling the speed or torque of electric DC motors for regulating or controlling an individual DC dynamo-electric motor by varying field or armature current by master control with auxiliary power using discharge tubes or semiconductor devices using semiconductor devices controlling armature supply only using pulse modulation
Disclosed is a shielding process for SIP packaging, including: providing a circuit board; cutting the covering layer to form half-cut trenches separating different SIP packaging modules from each other, and to form grooves in each single SIP packaging module; forming a metal overlay, the metal overlay on an outer surface of the SIP packaging module and at positions where the half-cut trenches are located constituting a conformal shielding, the metal overlay at positions where the grooves are located constituting a compartment shielding; and cutting the half-cut trenches to obtain a plurality of SIP packaging modules that are separate from each other.
Disclosed are an electromagnetic shielding structure and a manufacturing method thereof, and an electronic product. The manufacturing method includes covering an injection mold on a circuit substrate, so that different circuit units on the circuit substrate are respectively accommodated in different injection molding cavities of the injection mold; injecting a non-conductive plastic sealant into the injection molding cavities so as to form non-conductive plastic sealing bodies on the circuit units, wherein spacing grooves are formed between the non-conductive plastic sealing bodies; and forming a conductive shielding layer on the non-conductive plastic sealing bodies, so that the conductive shielding layer covers the non-conductive plastic sealing bodies and fills the spacing grooves to form shielding barrier walls, thereby realizing shielding between the different circuit units in respective cavities.
Disclosed is a method for detecting coverage rate of an intermetallic compound, the method comprising putting a chip subjected to wire bonding into a mixed reagent of fuming nitric acid and fuming sulfuric acid for soaking, wherein the chip subjected to wire bonding comprises a silver wire and an aluminum; taking out the chip after the silver wire is removed; and detecting the coverage rate of an intermetallic compound on the aluminum pad.
The present application discloses a sensing chip and a MEMS sensor. The sensing chip comprises: a back electrode, the back electrode being provided with protrusions protruding from the surface of the back electrode; and a diaphragm, the diaphragm and the back electrode being stacked and spaced from each other. The protrusions are provided on the surface of the back electrode facing the diaphragm; and when the diaphragm is deformed towards the back electrode, the thickness of the portions of the diaphragm in contact with the protrusions is greater than the thickness of the portions of the diaphragm not in contact with the protrusions.
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
21.
GAS SENSOR BASED ON FIELD EFFECT TRANSISTOR, AND MANUFACTURING METHOD THEREFOR
A gas sensor based on a field effect transistor, and a manufacturing method therefor. The gas sensor comprises a substrate (1), an insulating layer (2), an active layer (3), a source (4), and a drain (5); the insulating layer (2) is disposed between the substrate (1) and the active layer (3); the source (4) and the drain (5) are separately disposed on the side of the active layer (3) distant from the insulating layer (2) and spaced from each other; the active layer (3) is formed of a titanium dioxide nanofiber or a zinc oxide nanofiber, which is easy to chemically react with VOC gas, improves the gas detection reaction speed and sensitivity, has a large specific surface area, and increases the sensing area. The size of the sensor can be smaller at the same reaction speed level and sensitivity precision; the titanium dioxide nanofiber or zinc oxide nanofiber is prepared by means of electrostatic spinning technology; the manufacturing method is simple; the electrostatic spinning device is simple in process and high in production efficiency; it is beneficial to application of the gas sensor in consumer electronics, and popularization thereof in more application scenarios.
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
22.
Phase-locked loop circuit and digital operation system
Disclosed is a phase-locked loop circuit, including: a phase-locked loop, a locking detection circuit, an input end for inputting a reference clock signal, a first output end for outputting an oscillator clock signal, and a second output end for outputting a locking signal, wherein the phase-locked loop is configured to output the oscillator clock signal according to the reference clock signal and control the reference clock signal and the oscillator clock signal to be synchronous; and the locking detection circuit is configured to output the locking signal to the second output end when the oscillator clock signal and the reference clock signal are synchronous.
H03L 7/095 - Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal using a lock detector
H03L 7/089 - Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal the phase or frequency detector generating up-down pulses
H03L 7/093 - Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal using special filtering or amplification characteristics in the loop
H03L 7/099 - Details of the phase-locked loop concerning mainly the controlled oscillator of the loop
23.
Sound signal processing method, apparatus and device based on microphone array
Disclosed are a microphone array-based sound signal processing method, apparatus and device. The method comprises: selecting, from a microphone array, a target microphone combination which is used for receiving a sound signal of a target sound source, the target microphone combination comprising a first microphone and at least one second microphone; obtaining target compensation information corresponding to the target microphone combination, the target compensation information comprising a signal compensation parameter of each second microphone with respect to the first microphone; according to the target compensation information, performing signal compensation processing on a second sound signal received by means of the second microphone; and according to the second sound signal subjected to the signal compensation processing and a first sound signal received by means of the first microphone, obtaining a target sound signal and outputting same.
H04R 1/40 - Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers
H04R 3/04 - Circuits for transducers for correcting frequency response
24.
Heart Rate Module, and Electronic Device for Collecting Heart Rate
Disclosed are a heart rate module and an electronic device for collecting heart rate, the heart rate module includes a substrate, and a first light wave emitting unit, a second light wave emitting unit, a first optical sensor chip, and a second optical sensor chip provided on the substrate; the substrate is also provided thereon with an isolation grating wall separating the first light wave emitting unit, the second light wave emitting unit, the first optical sensor chip, and the second optical sensor chip from each other; the isolation grating wall together with the substrate enclose respectively a first accommodating cavity for accommodating the first light wave emitting unit, a second accommodating cavity for accommodating the second light wave emitting unit, a third accommodating cavity for accommodating the first optical sensor chip, and a fourth accommodating cavity for accommodating the second optical sensor chip.
A61B 5/1455 - Measuring characteristics of blood in vivo, e.g. gas concentration or pH-value using optical sensors, e.g. spectral photometrical oximeters
25.
HEART RATE SENSOR AND ELECTRONIC DEVICE FOR COLLECTING HEART RATE
Disclosed are a heart rate sensor and an electronic device for collecting heart rate. The heart rate sensor includes a substrate provided thereon with modules optically isolated from each other, the modules including: a first light wave emitting module, configured to emit a green light wave for testing heart rate; second light wave emitting modules, configured to emit a red light wave and an infrared light wave for testing blood oxygen and the heart rate; a first light wave receiving module and a second light wave receiving module, configured to receive a reflected green light wave, a reflected red light wave and a reflected infrared light wave; wherein, the first light wave receiving module and the second light wave receiving module are located on two respective sides of the first light wave emitting module, and the second light wave emitting modules are provided in two groups.
A61B 5/1455 - Measuring characteristics of blood in vivo, e.g. gas concentration or pH-value using optical sensors, e.g. spectral photometrical oximeters
26.
SENSOR PACKAGING STRUCTURE, AND DIFFERENTIAL PRESSURE SENSOR
A sensor packaging structure (100) and a differential pressure sensor. The sensor packaging structure (100) comprises: a housing (10); a base plate (20), the housing (10) being arranged on the base plate (20) and enclosing an accommodating space (50) with the base plate (20), with a first vent hole (11) of the housing (10) and a second vent hole (21) of the base plate (20) both being in communication with the accommodating space (50); a sensor chip (30) and a signal processing chip (40) which are accommodated in the accommodating space (50) and electrically connected to and stacked on the base plate (20), the sensor chip (30) being located on a side of the signal processing chip (40) that is away from the base plate (20), the sensor chip (30) having a vibration cavity (31), the signal processing chip (40) being provided with a third vent hole (41), and the vibration cavity (31) being in communication with the second vent hole (21) by means of the third vent hole (41); and waterproof glue (60) filling the accommodating space (50) and covering the sensor chip (30) and the signal processing chip (40).
G01L 13/02 - Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements
G01L 19/04 - Means for compensating for effects of changes of temperature
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
27.
BAROMETRIC PRESSURE SENSOR ASSEMBLY AND PACKAGING METHOD THEREFOR
The present application discloses a barometric pressure sensor assembly and a packaging method therefor. The barometric pressure sensor assembly comprises a substrate and a barometric pressure sensor chip. An air hole passes through the substrate. The barometric pressure sensor chip is disposed on the substrate and corresponds to the air hole. A side of the barometric pressure sensor chip facing the air hole is a first side, and another side of the barometric pressure sensor chip facing away from the air hole is a second side. A packaging adhesive is provided on each of the first side and the second side.
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
G01L 19/00 - Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
G01L 19/06 - Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
Disclosed by the present application is a sealing structure, a sealing method, a sensor and an electronic device. The sealing structure is used for a chip, and the sealing structure comprises: a substrate, a housing, a light-blocking adhesive and a light-reflective adhesive, and one surface of the substrate is used for the placement of the chip; the housing encases the chip, one end of the housing is connected to the substrate, and the end of the housing that faces away from the substrate is provided with a sealing opening; the light-blocking adhesive is provided on the side of the chip facing away from the substrate, and covers the chip; and the light-reflective adhesive is provided at the side of the light-blocking adhesive facing away from the substrate. The technical solution of the present application can improve the accuracy of sensor measurement.
Disclosed are an MEMS microphone and an electronic device. The MEMS microphone comprises a housing and a sensor chip provided in the housing. The housing comprises a bottom plate, a top plate opposite to the bottom plate, an enclosure plate for connecting the bottom plate and the top plate, and a connecting unit; the connecting unit comprises first solder paste welding portions and first protective portions, the first solder paste welding portions are provided between the top plate and the enclosure plate so as to connect the top plate and the enclosure plate, and the first protective portions are provided on the surfaces of the first solder paste welding portions; and/or the connecting unit comprises second solder paste welding portions and second protective portions, the second solder paste welding portions are provided between the bottom plate and the enclosure plate so as to connect the bottom plate and the enclosure plate, and the second protective portions are provided on the surfaces of the second solder paste welding portions.
Disclosed are a package housing, a waterproof air pressure sensor, and an electronic device. The package housing comprises a protective part, a solder paste welding part, a base plate, and a housing body having two ends thereof open; the base plate is disposed at one open end of the housing body; the solder paste welding part is disposed between said open end of the housing body and the base plate to connect said open end of the housing body and the base plate; the protective part is disposed on the surfaces of the solder paste welding part.
A manufacturing method for a sensor (100), comprising: providing a first PCB board (200), a second PCB board (300), and a third PCB board (400), wherein the first PCB board (200) comprises a plurality of top board units (10a), the second PCB board (300) comprises a plurality of enclosing board units (20a), and the third PCB board (400) comprises a plurality of bottom board units (30a); respectively mounting the first PCB board (200) and the third PCB board (400) at two sides of the second PCB board (300) to form a sensor assembly (500), wherein each of the enclosing board units (20a) is correspondingly connected to one of the top board units (10a) and one of the bottom board units (30a) to form a plurality of sensor units on the sensor assembly (500); and separating the sensor units from the sensor assembly (500) to obtain a plurality of sensors (100).
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
A method for manufacturing a sensor (100), comprising: providing a first PCB (200) comprising multiple first board units, a second PCB (300) comprising multiple board surrounding units, and a third PCB (400) comprising multiple second board units, one of the first board unit and the second board unit being a top board unit (10a), and the other one being a bottom board unit (30a); mounting the second PCB (300) on the first PCB (200) so as to form a first combined body (600); connecting each board surrounding unit (20a) to one first board unit, so as to form multiple intermediate transitional body units on the first combined body (600); separating intermediate transitional bodies (40) from the first combined body (600); mounting the intermediate transitional bodies (40) on the third PCB (400) so as to form a second combined body (700); correspondingly mounting one intermediate transitional body (40) to each second board unit, so as to form multiple sensor units on the second combined body (700); and separating the sensor units from the second combined body (700) so as to acquire multiple sensors (100).
B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
Disclosed is a waterproof key module, including: a housing with a hollow inner chamber and an opening at an end, comprising a front housing portion and a bottom housing portion secured to each other, and the opening being provided on the front housing portion; a touch component limited in the inner chamber, comprising a touch plate extending out from the opening; and a waterproof adhesive film in a pre-tensioned status and isolating the touch component from the bottom housing portion, an edge of the film being secured to a position where the front housing portion is connected to the bottom housing portion, and the touch component being supported on the film; wherein at least one pressure sensor module is provided between the touch component and the bottom housing portion and configured to generate a pressure signal that represents a pressure degree according to a pressing on the touch component.
An MEMS capacitor microphone is provided, comprising a first substrate and a vibration diaphragm supported above the first substrate by a spacing portion, the first substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the first substrate, wherein a lower electrode forming a capacitor structure with the vibration diaphragm is provided on a side of the first substrate that is adjacent to the vacuum chamber, and an electric field between the vibration diaphragm and the lower electrode is 100-300 V/μm.
Disclosed in the present disclosure are a dustproof structure, a microphone encapsulation structure, and an electronic device. The dustproof structure comprises a carrier and a grid part; the carrier is a hollow structure, a buffer part is formed surrounding the hollow structure, a strip-shaped hollowed-out area is provided on the buffer part so as to form an elastic structure, and an edge part is formed surrounding the buffer part; the grid part is provided at an end of the carrier, the grid part comprises a grid structure and a fixing part that surrounds the grid structure, the grid structure and the hollow structure are opposite one another, and the fixing part and the carrier are connected. The described dustproof structure has the feature of small strain.
Disclosed in the present invention are a dustproof structure, a microphone packaging structure and an electronic device. The dustproof structure comprises a support and a mesh portion; the support has a hollow structure, the support comprises multiple support layers provided in a height direction, the mesh portion comprises a mesh structure and a fixing portion provided around the mesh structure, the fixing portion is connected to the support, the mesh structure is opposite to the hollow structure, and the thermal expansion coefficient of at least one of the support layers is different from that of other support layers other than said support layer.
Disclosed are a dustproof structure, a microphone packaging structure and an electronic device. The dustproof structure comprises a carrier and a grid part, wherein the carrier is of a hollow structure, the carrier comprises a plurality of support layers arranged in a stacked manner, the plurality of support layers are connected together, at least one of the support layers forms a stress relief part, and the stress relief part is provided with a material or in-plane structure different from other support layers except for the support layer where the stress relief part is located; and the grid part comprises a grid structure and a fixing part arranged around the grid structure, the fixing part is connected to the carrier, and the grid structure is opposite the hollow structure.
Disclosed are a dustproof structure and a MEMS microphone packaging structure used for a micro-electro-mechanical system (MEMS) device; the dustproof structure used for a MEMS device comprises a mesh membrane and a carrier having a cylindrical structure, the mesh membrane having a fixed connection area and a sound transmission area, the fixed connection area surrounding the sound transmission area, and the fixed connection area being located at the edge of the mesh membrane; the carrier has an opening running therethrough, the opening corresponding to the position of the sound transmission area, the carrier having a first end surface and a second end surface opposite to each other, the first end surface being connected to one side of the fixed connection area, and the second end surface being configured to form a connection with a substrate of the MEMS device; the outer contour of the carrier along the circumferential direction of the cylindrical structure at the first end surface is larger than the outer contour of the carrier along the circumferential direction of the cylindrical structure at the second end surface.
Disclosed in the present invention are a dustproof structure for an MEMS device and an MEMS microphone packaging structure. The dustproof structure for an MEMS device comprises a mesh membrane and a support; the mesh membrane has a fixed connection region and a sound transmission region, the fixed connection region surrounds the sound transmission region, and the fixed connection region is located at an edge of the mesh membrane; the support has a through opening, and the opening corresponds to the position of the sound transmission region; and the support comprises at least two support layers, a first support layer of the support layers is connected to one side of the fixed connection region, and the other support layers are sequentially laminated and distributed on the side of the first support layer away from the mesh membrane in the thickness direction of the mesh membrane, and the support layers have different coefficients of thermal expansion.
Disclosed is a MEMS device, comprising a substrate, a MEMS chip layer and a grid film; the substrate is provided with a first surface and a second surface, and a penetrating first through hole is formed on the substrate; the MEMS chip layer is arranged at one side of the second surface of the substrate; the grid film is arranged at one side of the first surface of the substrate, the grid film is formed with a sound transmission area at the position corresponding to the first through hole, and a mesh is arranged on the sound transmission area. The substrate of the MEMS device achieves traditional structure packaging and signal transmission, while also having a good supporting effect with respect to the grid film. In addition, the assembly process of the MEMS device is simplified, and the manufacturing costs are reduced.
Disclosed are a dustproof structure, a microphone packaging structure, and an electronic device. The dustproof structure comprises a carrier and a grid part; the carrier is of a hollow structure; the grid part is arranged at one end of the carrier and covers the hollow structure; the grid part comprises a filter screen, a stress buffer area arranged around the filter screen, and a fixing part arranged around the stress buffer area, the filter screen is opposite to the hollow structure, the fixing part is connected to the carrier, and the filter screen and the stress buffer area are arranged in a suspended manner. One technical effect of the present invention is that the filter screen on the grid part can be kept in a flat state, so that the grid part can effectively block external particles and foreign matters from entering the microphone packaging structure.
Disclosed are a dustproof structure, a microphone packaging structure and an electronic device. The dustproof structure comprises a support and a grid part. The support is of a hollow structure. The grid part comprises a filter screen and a fixing part provided around the filter screen. The filter screen comprises a central hole, and multiple columns of mesh structures extending outwards from the central hole and arranged concentrically along the circumferential direction of the central hole. The grid part is provided at one end of the support and covers the hollow structure, the filter screen is opposite to the hollow structure, and the fixing part is connected to the support. One technical effect of the present invention is that the filter screen on the grid part can be kept in a flat state, and the grid part can effectively prevent external particles and foreign matters from entering the microphone packaging structure.
Disclosed are a dustproof structure, a microphone packaging structure and an electronic device. The dustproof structure comprises a carrier and a grid part, wherein the carrier is of a hollow structure; the grid part comprises a filter screen, a reinforcing part arranged around the filter screen, and a fixing part arranged around the reinforcing part; the reinforcing part comprises a plurality of columns of first grid hole structures that extend towards the outer side of the filter screen and are concentrically arranged in the circumferential direction of the filter screen; and the grid part is arranged at one end of the carrier and covers the hollow structure, the filter screen is opposite the hollow structure, and the fixing part is connected to the carrier. The present invention has one technical effect that the filter screen on the grid part can remain in a flat state, and the grid part can effectively stop external particulate matter and foreign matter from entering the interior of the microphone packaging structure.
Disclosed are a dustproof structure for a MEMS device and a MEMS microphone packaging structure. The dustproof structure comprises a grid film, a first carrier and a second carrier, wherein the first carrier is provided with a through first opening, and the second carrier is provided with a through second opening; the first carrier and the second carrier are arranged on two sides of the grid film respectively, and the grid film is spaced between the first opening and the second opening; and the first carrier and/or the second carrier are/is configured for being fixed on a MEMS device. Arrangement of the first carrier and the second carrier of the present invention plays a good support and protection role for the grid film, and can prevent direct contact damage of the grid film; and the first opening and the second opening are arranged opposite through holes in the grid film, such that smooth channels are provided for air, and sound transmission is facilitated.
Disclosed in the present invention are a dustproof structure, a microphone packaging structure and an electronic device. The dustproof structure comprises a carrier and a mesh part; the mesh part comprises a filter screen and a fixing part surrounding the filter screen; the carrier has a hollow structure, and the carrier is provided with a hole structure extending in the thickness direction of the carrier; the mesh part is provided at one end of the carrier and covers the hollow structure; the filter screen is opposite to the hollow structure; and the fixing part is connected to the carrier. One technical effect of the present invention is that: the filter screen on the mesh part can be kept in a flat state, and the mesh part can effectively block external particle matter and foreign matter entering the inside of the microphone packaging structure.
Disclosed are a dustproof structure, a microphone packaging structure and an electronic device. The dustproof structure comprises: a carrier, wherein the carrier is made of a metal material, and a through hole is provided in the middle of the carrier; and a film body, wherein the film body is made of a metal material, the film body comprises a grid structure and a connecting part arranged around the grid structure, the grid structure covers one end of the through hole, and the connecting part is connected to the carrier. The present invention has one technical effect that the carrier and the film body are both made of metal materials, so that the thermal expansion coefficient of the carrier of the dustproof structure is reduced, and deformation of the dustproof structure after being affected by heat is reduced.
Disclosed are a dustproof structure, a microphone packaging structure and an electronic device, the dustproof structure comprising: a carrier layer, wherein a through hole is formed at the center of the carrier layer; a film body layer, comprising a grid structure and a connection portion arranged around the grid structure, the grid structure covering one end of the through hole, the connection portion being connected on the carrier layer; a warping compensation layer, fixed on the side of the carrier layer away from the film body layer, the thermal expansion coefficient of the warping compensation layer being lower than that of the carrier layer. One technical effect of the present invention is that the arrangement of the warping compensation layer having a lower thermal expansion coefficient than the carrier layer effectively inhibits warping deformation of the dustproof structure during mounting.
Disclosed are a dustproof structure, a microphone packaging structure and an electronic device. The dustproof structure comprises a carrier and a grid part; the carrier is of a hollow structure; the grid part comprises a filter screen and a fixing part arranged around the filter screen; a grid hole structure is provided on the filter screen; the ratio of the area sum of all grid holes on the grid hole structure to the area of the grid part is defined as the opening rate of the grid part; the opening rate of the grid part ≥ 75%; and the grid part is arranged at one end of the carrier and covers the hollow structure, the filter screen is opposite the hollow structure, and the fixing part is connected to the carrier. The present invention has the technical effect that the dustproof structure is conducive to improving the signal-to-noise ratio (SNR) of a microphone, and can also stop external particulate matter from entering the interior of the microphone packaging structure.
Disclosed in the present invention are a dustproof structure for an MEMS device and an MEMS microphone packaging structure. The dustproof structure comprises a mesh membrane and a support; the support is of a columnar frame structure, the support has a through opening provided in an axial direction thereof, and an arc-shaped surface is provided on a side wall of the support; the mesh membrane has a fixed connection region and a sound transmission region, the fixed connection region surrounds the sound transmission region, and the fixed connection region is located at an edge of the mesh membrane; and the mesh membrane is provided on an end face of the support, and the sound transmission region corresponds to the position of the opening. By configuring the side wall of the support to be an arc-shaped surface, deformation and stress caused by different thickness dimensions and material characteristics of the support and the MEMS device can be released easily, preventing the stress from being concentrated and transferred to the mesh membrane, achieving good protection for the mesh membrane, and improving the stability and prolonging the service life of the dustproof structure.
Disclosed are a dust-proof structure, a microphone packaging structure and an electronic device. The dust-proof structure comprises: a carrier, a through-hole being formed at the middle portion of the carrier; and a membrane, wherein the membrane comprises a grid structure and a connecting portion provided surrounding the grid structure, the grid structure covers one end of the through-hole, and the connecting portion is connected onto the carrier; the carrier comprises an organic material and a filler, and the thermal expansion coefficient of the filler is lower that of the organic material. One effect of the present invention is that, by adding into the carrier the filler having a thermal expansion coefficient that is lower than that of the organic material, the thermal expansion coefficient of the carrier is lowered and the amount of deformation of the carrier after heating is reduced in order to ensure that the dust-proof structure will not fall off or be damaged.
Disclosed is a material strip for dustproof structures, the material strip comprising: a plurality of dustproof structures, wherein each dustproof structure comprises a film body (1) and a carrier (2) connected to the film body (1), a grid structure (11) is arranged on the film body (1), a through hole is provided in the middle of the carrier (2), and the grid structure (11) covers one end of the through hole; and a plurality of connecting strips (3), wherein the plurality of connecting strips (3) form connection among the plurality of dustproof structures, such that the plurality of dustproof structures form an array. By arranging the connecting strips (3) among the dustproof structures, the structural strength of the array formed by the dustproof structures is enhanced, and the problem of the device structure being damaged due to disordered positions of the dustproof structures in the manufacturing process is solved.
Disclosed are a dustproof structure for a MEMS device and a MEMS microphone packaging structure. The dustproof structure for a MEMS device comprises a grid film and a carrier, wherein the grid film is provided with a fixed connection area, a buffer area and a sound transmission area, the buffer area surrounds the sound transmission area, the fixed connection area surrounds the buffer area, the fixed connection area is located at an edge of the grid film, and a through hole penetrating the grid film is provided in the buffer area; and the carrier is provided with a through opening, the carrier is connected to one side of the fixed connection area, and the opening corresponds to positions of the buffer area and the sound transmission area.
Disclosed in the present invention are a dustproof structure, a microphone packaging structure and an electronic device. The dustproof structure comprises: a mesh structure; a support part, the support part comprising a connecting part and a carrier fixed to the connecting part, the connecting part surrounding the mesh structure, a first through hole being formed on the central portion of the carrier, and the mesh structure covering one end of the first through hole; and a stress concentration part, formed at the inner side of the support part, the stress concentration part being configured to concentrate stress of the support part. One technical effect of the present invention is reducing, by providing the stress concentration part, the stress generated on the mesh structure when the dustproof structure deforms, avoiding the generation of disordered folds on the mesh structure.
Disclosed are a dust-proof structure, a microphone structure, and an electronic device. The dust-proof structure comprises: a carrier, a through hole being formed in the middle of the carrier, and the carrier being subjected to hydrophobic treatment to form a hydrophobic portion at the bottom of the carrier; and a membrane, the membrane comprising a grid structure and a connection portion surrounding the grid structure, the grid structure covering one end of the through hole, and the connection portion being connected to the carrier. The bottom of the carrier is the surface of the carrier distant from the membrane. The technical effect of the present invention is that the bonding strength between the dust-proof structure and a UV adhesive tape to which the structure is transferred is reduced by performing hydrophobic treatment on the surface of the carrier, so that the dust-proof structure can be removed from the UV adhesive tape more easily, without causing damage to the dust-proof structure.
Disclosed is a MEMS chip. The chip comprises a substrate layer having a back cavity, and a plate capacitor structure composed of a diaphragm layer, a first insulating layer, and a back electrode layer is disposed on the substrate layer. A pressure relief hole and a filter screen covering the pressure relief hole are formed on the diaphragm layer. According to the MEMS chip provided by the present invention, the pressure relief capabilities of the pressure relief hole can be ensured while chip performance is prevented from being damaged due to micro-dust particles being blown into the MEMS chip, and the reliability of the MEMS chip is improved. Furthermore, the filter screen can effectively buffer high-pressure air flow entering the diaphragm layer and prevent the high-pressure air flow from damaging the diaphragm layer. Moreover, the preparation process of the pressure relief hole and the filter screen is simple and easy to implement. In addition, by providing the filter screen covering the pressure relief hole, the impact of the filter screen on the signal-to-noise ratio (SNR) of a microphone can be minimized.
The embodiments of the present invention disclose a microphone packaging structure and an electronic device. The packaging structure comprises: a housing, a cavity being formed inside the housing, at least a part of the housing comprising a first layer and a second layer which are provided in the thickness direction, and an accommodating cavity being formed between the first layer and the second layer; an MEMS acoustic chip, the MEMS acoustic chip being provided within the cavity; and an ASIC chip, the ASIC chip being provided within the accommodating cavity, the ASIC chip being connected to the MEMS chip. The ASIC chip does not occupy the space of the cavity, so that the adjustment effect of the cavity on sound pickup is more prominent, and the acoustic-electro conversion effect of the microphone packaging structure is better.
Disclosed is a MEMS chip, said MEMS chip comprising: a substrate having a rear cavity, and a plate capacitor set arranged on the substrate; the plate capacitor set at least comprises a first plate capacitor structure and a second plate capacitor structure located below said first plate capacitor structure and arranged in parallel with the first plate capacitor structure; the first plate capacitor structure comprises a first diaphragm and a first back electrode; the second plate capacitor structure comprises a second diaphragm and a second back electrode. The first plate capacitor and the second plate capacitor of the MEMS chip provided by the present invention can form a differential capacitance to improve linear distortion, improving the ability to suppress linear distortion and enhancing the performance of the MEMS chip.
The present disclosure discloses a sensitive diaphragm comprising a diaphragm body, an edge region of the diaphragm body being provided with a rim structure, wherein the rim structure is in a non-closed annular shape, a non-closed region is located at a part not closed by the rim structure, and the non-closed region are integral and continuous with parts of the diaphragm body adjacent to the rim structure. According to the sensitive diaphragm of the present disclosure, the annular rim structure is separated by the non-closed region.
The present invention relates to a microphone structure and an electronic device. The microphone structure comprises a sound sensing element which is provided with a first sound hole; a protective housing which forms a sealed protective cavity outside the first sound hole, and is provided with a second sound hole; and a water-proof film which is fixed in the protective cavity and divides the protective cavity into a first cavity body communicated with the first sound hole and a second cavity body communicated with the second sound hole. One technical effect of the present invention is that interior and the exterior of the sound sensing element are separated from each other by providing the water-proof film, so that internal elements of a microphone are prevented from being affected or damaged.
Disclosed are a microphone structure and an electronic device, and the microphone structure comprises: a sound sensing element, wherein the sound sensing element is provided with a first sound hole; a protective shell, wherein the protective shell is provided with a sealed protective cavity outside the first sound hole, and a second sound hole is provided in the protective shell; a waterproof film, wherein the waterproof film is fixed in the protective cavity and divides the protective cavity into a first cavity in communication with the first sound hole and a second cavity in communication with the second sound hole; and an elastic sealing element, wherein the one end of the elastic sealing element is fixed around the second sound hole, the other end of the elastic sealing element is used for being fixed to a component to which the microphone structure is applied, the elastic sealing element is in a compressed state, the sound sensing element is provided with a protruding part surrounding the protective shell, the top of the protruding part is in contact with the component to which the microphone structure is applied, and the amount of compression of the elastic sealing element is defined by the height of the protruding part. The present invention has the technical effect that the elements in the microphone structure are separated from the outer part, preventing foreign matter from influencing or damaging the elements in a microphone.
A polyimide-based humidity sensor and a preparation method therefor. The humidity sensor comprises a substrate (1), a first oxide layer (2), a lower electrode (3), a second oxide layer (4), a dielectric layer (5), and an upper electrode (6), wherein the dielectric layer (5) is made of a polyimide nanofiber. The polyimide-based humidity sensor has the characteristics of high in detection precision and small in device size.
G01N 27/22 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
62.
WATERPROOF AND DUSTPROOF PRESSURE SENSOR AND PROCESSING METHOD THEREFOR
Disclosed are a waterproof and dustproof pressure sensor and a processing method therefor. The waterproof and dustproof pressure sensor comprises an encapsulation structure formed by a housing and a substrate (2), a chip (3) is arranged in the encapsulation structure, and the chip (3) is fixed on the substrate (2) and is electrically connected to the substrate (2). The housing comprises a plastic encapsulation structure (11) and a chip sensitive area protective film (12), wherein the plastic encapsulation structure (11) is arranged around the chip (3), a sensitive area of the chip (3) is arranged outside the plastic encapsulation structure (11), and the bottom end of the plastic encapsulation structure (11) is fixed on the substrate (2); and the chip sensitive area protective film (12) is arranged at the upper end of the sensitive area of the chip (3), and end portions of the chip sensitive area protective film (12) are in sealed connection with the plastic encapsulation structure (11). The problems in the prior art, such as realizing a waterproof function by filling an encapsulation structure with silica gel, however as silica gel is easily contaminated with foreign matter, product performance is affected, can be solved.
G01L 9/08 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of piezoelectric devices
H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
63.
COMBINED SENSOR AND METHOD FOR MANUFACTURE THEREOF
Provided are a combined sensor (100) and a method for manufacture thereof. The combined sensor (100) comprises a first wafer (10), a second wafer (20), and a plurality of sensors; the first wafer (10) and the second wafer (20) are bonded and connected, and enclosed to form a plurality of independent sensors; an electrical isolation structure (30) is arranged between two adjacent sensors so as to provide a miniaturized, integrated, and combined sensor (100) having less electromagnetic interference.
A MEMS sensor assembly manufacturing method and a MEMS sensor assembly. The manufacturing method comprises: providing a filter membrane, comprising micrometer-scale or nanometer-scale objects (102) coated on a substrate (100); depositing a filter membrane material (104) on the substrate (100); removing the micrometer-scale or nanometer-scale objects (102), so as to form through holes (106) in the deposited filter membrane material (104). The manufacturing method further comprises providing a MEMS sensor, the MEMS sensor having thereon an opening, and being capable of performing sensing via the opening. The manufacturing method further comprises joining the filter membrane onto the MEMS sensor, causing the filter membrane to cover the opening, thereby forming a MEMS sensor assembly.
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
65.
MICRO-NANO STRUCTURE ASSEMBLY MANUFACTURING METHOD, AND MICRO-NANO STRUCTURE ASSEMBLY MANUFACTURED BY MEANS OF SAME
A method for manufacturing a micro-nano structure assembly, comprising: providing a filter membrane; providing an MEMS sensor, wherein the MEMS sensor is provided with an opening and can perform sensing by means of the opening; and bonding the filter membrane onto the MEMS sensor, so that the filter membrane covers the opening. The method for providing the filter membrane comprises: coating a substrate (108) with a filter membrane material layer (107), and then coating the filter membrane material layer with a photoresist layer (106); heating the substrate (108) to soften the photoresist layer; using a mold to pressurize the substrate (108), wherein the mold consists of a pattern layer (104) and a back layer (102) that are superimposed, and the back layer is pressurized to make the pattern layer be in contact with the photoresist layer; when continuously using the mold to pressurize the photoresist layer, cooling the photoresist layer to solidify the photoresist layer so as to form, on the photoresist layer, a pattern conforming to the pattern layer; removing the mold; by means of dry etching, removing a photoresist remaining on the pattern; and using the photoresist layer as a mask to perform dry etching or wet etching on the filter membrane material layer (107) so as to transfer the pattern of the photoresist layer onto the filter membrane material layer.
An optical filter, comprising a bearing element (102) having a penetrating cavity (104) which is formed inside the bearing element (102) and penetrates through the thickness direction of the bearing element (102); and an optical filter film (106) overlapped on the bearing element (102) and covering an opening of the penetrating cavity (104). Through holes (110) are distributed on the optical filter film (106) in periodic patterns, and the optical filter film (106) is made of metallic glass.
A wearable device (100), and a detection method and detection apparatus for human body signs; the wearable device (100) comprises: a housing (11), a system-in-package module (12), which is provided in the housing (11) and comprises a circuit board (121), as well as a body fat rate detection circuit and electrocardiogram detection circuit that are provided on the circuit board (121); and at least four multiplexing electrodes (13), all the multiplexing electrodes (13) being exposed to the housing (11) in contact with human skin, and all the multiplexing electrodes (13) being electrically connected to the body fat rate detection circuit and the electrocardiogram detection circuit; the body fat rate detection circuit and the electrocardiogram detection circuit are turned on in a time-sharing manner so as to collect body fat rate data and electrocardiogram data in a time-sharing manner. The device has the advantages of being able to achieve the multiplexing of the multiplexing electrodes (13) and facilitate the miniaturization of the wearable device (100).
A sensor packaging structure and an electronic device. The sensor packaging structure comprises: a housing (2); a packaging substrate (1), which is fixedly connected to the housing (2), wherein the housing (2) and the packaging structure (1) enclose together to form an accommodation cavity; an ASIC chip (5), which is embedded in the packaging substrate (1); and two shielding layers (3) disposed on the packaging substrate (1), the two shielding layers (3) being respectively located directly above and directly below the ASIC chip (5) and both being grounded. By means of providing shielding layer (3), the shielding effect of the ASIC chip (5) is enhanced, which improves the anti-radio frequency interference capabilities of a sensor.
Disclosed is a microfilter, comprising a bearing member (201) and a filter membrane (102). The bearing member (201) is provided with a through cavity (205) formed therein and penetrating same in the thickness direction thereof. The filter membrane (102) is stacked on the bearing member (201). The filter membrane (102) comprises a first portion (104) covering one opening of the through cavity (205) and a second portion (106) uncovering the opening, and the first portion (104) is surrounded by the second portion (106). Through holes (207) are arranged and distributed in the first portion (104), and the second portion (106) is jointed with the bearing member (201). The first portion (104) is connected to the second portion (106) by means of only a single beam (108), such that the first portion (104) is suspended above the through cavity (205). Further provided is an MEMS sensor assembly.
The method for manufacturing the micro-nano structure assembly comprises: providing a filter membrane; providing an MEMS sensor, wherein the MEMS sensor is provided with an opening and can perform sensing through the opening; bonding the filter membrane to the MEMS sensor such that the filter membrane covers the opening. Providing the filter membrane comprises: heating a substrate (108) coated with a photoresist layer (106) to soften the photoresist layer (106) (202); pressurizing the substrate (108) with a mold, the mold consisting of a pattern layer (104) and a back layer (102) that are superimposed, wherein the back layer (102) being pressurized such that the pattern layer (104) contacts the photoresist layer (106) (204); cooling the photoresist layer (106) to solidify the photoresist layer (106) while continuously pressurizing the photoresist layer (106) with the mold, thereby forming a pattern conforming to the pattern layer (104) on the photoresist layer (106) (206); removing the mold, removing the photoresist remaining on the pattern by dry etching (208); depositing a filter membrane material (107) on the photoresist layer (106) (210); peeling off the photoresist layer (106) from the substrate (108) (212).
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
71.
MEMS SENSOR ASSEMBLY MANUFACTURING METHOD AND MEMS SENSOR ASSEMBLY MANUFACTURED BY METHOD
A method for manufacturing an MEMS sensor assembly, comprising: providing a filter membrane (104), comprising coating a buffer material on one surface of a substrate (100) where a heat release adhesive layer (106) covers to form a buffer layer (102) on the heat release adhesive layer (106), and depositing a filter membrane material on the buffer layer (102) to form the filter membrane (104); heating the substrate (100) so that the buffer layer (102) and the filter membrane (104) together are pushed away from the substrate (100) under the action of the heat release adhesive layer (106); removing the buffer layer (102) from the filter membrane (104); providing an MEMS sensor having an opening and capable of sensing by means of the opening; and bonding the filter membrane (104) to the MEMS sensor so that the filter membrane (104) covers the opening. The method reduces the risk of physical damage to the filter membrane (104) in a manufacturing process.
B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
Disclosed are a dustproof structure and a manufacturing method therefor. The dustproof structure is used for carrying out dustproofing for a sensor, and the sensor comprises a housing and a sensing unit arranged inside the housing, wherein the housing is provided with a communicating hole, the communicating hole is in communication with the sensing unit and the external environment, and a dustproof portion of the dustproof structure covers the communicating hole. The manufacturing method for the dustproof structure comprises the following steps: providing a substrate, and arranging a release film on a surface of the substrate; carrying out deposition on a surface of the release film to form a metal layer; forming a plurality of dustproof net holes in the metal layer by means of laser drilling, wherein the plurality of dustproof net holes jointly form a dustproof portion; and separating the metal layer on which the dustproof portion is formed from the release film. According to the technical solution of the present invention, the dustproof structure has a good dustproof function, can allow a dustproof sensor to communicate with the external environment, and guarantees the detection sensitivity and the measurement accuracy of the sensor.
Disclosed in the present invention are a dustproof structure and a manufacturing method therefor. The dustproof structure is used for dust prevention of a sensor; the sensor comprises a housing and a sensing unit provided in the housing; the housing is provided with a communication hole; the communication hole is communicated with the sensing unit and an external environment; the dustproof portion of the dustproof structure covers the communication hole. The manufacturing method for the dustproof structure comprises the following steps: providing a substrate, and providing a release film on one surface of the substrate; performing deposition on the surface of the release film to form a metal layer; forming a plurality of dustproof mesh holes on the metal layer by means of a photoetching process, wherein the plurality of dustproof mesh holes together form a dustproof portion; and mutually separating the metal layer forming the dustproof portion from the release film. The technical solution of the present invention is aimed at making the dustproof structure have a good dustproof function, also can make the dustproof sensor be communicated with the external environment, and ensures the detection sensitivity and the measurement accuracy of the sensor.
A MEMS chip and an electronic device, the MEMS chip comprising a substrate (11) having a back cavity (12), and a back electrode and two sensing films (14, 16) arranged on the substrate (11), the back electrode and the two sensing films (14, 16) being positioned on the back cavity (12), the two sensing films (14, 16) respectively forming a capacitor structure with the back electrode, the two sensing films (14, 16) respectively being positioned on the upper and lower sides of the back electrode, and at least one of the two sensing films (14, 16) comprising an active area (10a) opposite to the back cavity (12), an inactive area (10b) arranged on the outside of the active area (10a), and an isolation area positioned between the active area (10a) and the inactive area (10b), the isolation area comprising two insulating rings (18, 19) respectively connected to the active area (10a) and the inactive area (10b), and a buffer area (17) connected between the two insulating rings (18, 19), the two insulating rings (18, 19) being arranged around the effective area (10a); a sealed cavity (29) is formed between the two sensing films (14, 16), the cavity (29) being filled with gas with a viscosity coefficient less than air or the cavity (29) being filled with air having an air pressure less than standard atmospheric pressure.
An MEMS chip and an electronic device. The chip comprises a substrate (11) provided with a back cavity (12), and a back electrode and a sensing film arranged on the substrate (11), wherein the back electrode and the sensing film are located on the back cavity (12); the back electrode and the sensing film form a capacitor structure; the sensing film comprises an active region (10a) opposite the back cavity (12), an inactive region (10b) arranged at the outer side of the active region (10a), and an isolation region located between the active region (10a) and the inactive region (10b); the isolation region comprises two insulation rings (18, 19) respectively connected to the active region (10a) and the inactive region (10b), and a buffer region (17) connected between the two insulation rings (18, 19); and the two insulation rings (18, 19) are arranged around the active region (10a).
A system-in-package structure (100) and an electronic device using the system-in-package structure (100). The system-in-package structure (100) comprises: a substrate (10) which is provided with an installation surface; a light source (20) provided on the installation surface and electrically connected to the substrate (10); a photoelectric conversion device (30) provided on the installation surface, electrically connected to the substrate (10) and spaced apart from the light source (20); and an analog front end (40) provided on the substrate (10) and electrically connected to the substrate (10). According to the system-in-package structure (100), the structure of an electronic device can be simplified, and the manufacturing convenience is improved.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
77.
MEMS microphone, a manufacturing method thereof and an electronic apparatus
A MEMS microphone, a manufacturing method thereof and an electronic apparatus are disclosed. The MEMS microphone comprises: a MEMS microphone device including a MEMS microphone chip and a mesh membrane monolithically integrated with the MEMS microphone chip; and a housing including an acoustic port, wherein the MEMS microphone device is mounted in the housing, and the mesh membrane is arranged between the MEMS microphone chip and the acoustic port as a particle filter for the MEMS microphone chip.
A sensor assembly (100) and a wearable device. The sensor assembly (100) comprises: a double-sided circuit board (10); a controller (20), said controller (20) being located on a surface of the double-sided circuit board (10); and a pulse sensor (30), an electrocardiogram sensor (40) and an inertial sensor (50), said sensors all being electrically connected to the double-sided circuit board (10). The electrocardiogram sensor (40) is provided with a sensor chip (41) that is electrically connected to the double-sided circuit board (10), and at least one from among the sensor chip (41), the pulse sensor (30) and the inertial sensor (50) is located on the surface of the double-sided circuit board (10) away from the controller (20). The sensor assembly (100) is aimed at improving the functioning of a smart wearable device.
Provided are an inertial navigation system initial alignment method, apparatus, and electronic device. The method comprises: selecting a three-axis accelerometer corresponding to the highest-accuracy acceleration measurement result among a plurality of three-axis accelerometers; selecting the three-axis magnetometer corresponding to the highest-accuracy magnetic field strength measurement result among a plurality of three-axis magnetometers; according to the acceleration measurement result corresponding to the selected three-axis accelerometer and the magnetic field strength measurement result corresponding to the selected three-axis magnetometer, obtaining attitude information corresponding to a target moment (S2300).
Disclosed in the present invention is a digital-to-analog converter of an R-2R ladder-shaped network architecture. The digital-to-analog converter is an R-2R ladder-shaped network structure formed of first switches and first resistors that are connected in series, and second switches and second resistors that are connected in series. In the digital-to-analog converter, the sum of the on impedance of the first switch and the impedance of the first resistor that is connected in series with the first switch at each bit is a half of the sum of the on impedance of the second switch and the impedance of the second resistor, so that the current passing through each bit of branch is a half of the current passing through an adjacent high bit of branch.
A current and voltage adjustment method, apparatus (40) and device (50), and a storage medium. The method comprises: obtaining the constant current value of an input constant current and the constant voltage value of an input constant voltage, and obtaining the rated current value and rated voltage value of a driven body (S101), wherein the rated current value is less than or equal to the constant current value, and the rated voltage value is less than or equal to the constant voltage value; according to a first ratio between the rated current value and the constant current value, generating a first PWM signal with a duty ratio being the first ratio (S102); according to a second ratio between the rated voltage value and the constant voltage value, generating a second PWM signal with a duty ratio being the second ratio (S103); and adjusting the constant current by using the first PWM signal to input the current with the rated current value to the driven body, and adjusting the constant voltage by using the second PWM signal to input the voltage with the rated voltage value to the driven body (S104).
A method for sensing vibration by a vibration sensing device and the vibration sensing device. The vibration sensing device comprises: a housing (26), a cavity being formed inside the housing (26); a pressure generating device, the pressure generating device comprising an elastic element and a mass element, the elastic element being disposed in the cavity, the mass element being suspended in the cavity by means of the elastic element and being able to move in the cavity together with the elastic element, and the mass element and the elastic element partitioning the cavity into a sealed first chamber (15) and a second chamber (16); and a pressure sensing device, the pressure sensing device being respectively communicated with the first chamber (15) and the second chamber (16). The method comprises: obtaining the pressure difference between the first chamber (15) and the second chamber (16) by means of the pressure sensing device; and calculating, according to the pressure difference, the vibration state of the position where the pressure sensing device is located.
A magnetic sensor manufacturing method, a magnetic sensor, and an electronic device. A magnetoresistor array on a growth substrate (1) is combined with a receiving substrate (4); the growth substrate (1) is selectively irradiated by laser from the growth substrate (1) side to peel off the selected magnetoresistors from the growth substrate (1) and transfer same onto the receiving substrate (4); the growth substrate (1) is rotated to a predetermined position, and the magnetoresistor array on the growth substrate (1) is combined with the receiving substrate (4); the growth substrate (1) is selectively irradiated by laser from the growth substrate (1) side to peel off the selected magnetoresistors from the growth substrate (1) and transfer same onto the receiving substrate (4), so as to obtain magnetoresistor patterns having different pinning directions. According to the manufacturing method, the manufacturing cost can be reduced, and magnetoresistors having different pinning directions can be obtained.
A manufacturing method of a magnetic sensor, and a magnetic sensor. The method comprises the following steps: providing a permanent magnet template, providing a magnetoresistive unit to be annealed, and aligning the permanent magnet template with the magnetoresistive unit, such that magnetoresistance elements in a magnetoresistance element pattern array correspond one-to-one with permanent magnets in a permanent magnet pattern array; and an annealing step comprising placing the bonded permanent magnet template and magnetoresistive unit in an annealing furnace, and performing heating and annealing to fix a pinning direction of the magnetoresistance elements. The manufacturing method of a magnetic sensor can reduce costs, and enables formation of multiple types of magnetic sensors on a wafer.
An anti-fuse cell circuit and an integrated chip. The anti-fuse cell circuit comprises a programming unit (100) and a detection unit (200). The programming unit (100) is used for programming an anti-fuse cell according to a programming voltage and an enable voltage; the detection unit (200) is used for detecting the working current of the anti-fuse cell, generating a working voltage according to the working current, and generating a feedback voltage if the working voltage is greater than a preset voltage threshold; the programming unit (100) is also used for ending programming when receiving the feedback voltage. The programming time of the anti-fuse cell is variable and is determined according to the time required by the programming of each anti-fuse cell. Compared with a conventional fixed programming period, the programming period of the anti-fuse cells is greatly shortened. In addition, due to the fact that the period is shortened, the circuit loss in the programming process of the anti-fuse cells is also reduced.
G11C 17/16 - Read-only memories programmable only onceSemi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using electrically-fusible links
G11C 17/18 - Auxiliary circuits, e.g. for writing into memory
H03K 19/20 - Logic circuits, i.e. having at least two inputs acting on one outputInverting circuits characterised by logic function, e.g. AND, OR, NOR, NOT circuits
H03K 19/21 - EXCLUSIVE-OR circuits, i.e. giving output if input signal exists at only one inputCOINCIDENCE circuits, i.e. giving output only if all input signals are identical
86.
Integrated structure of mems microphone and air pressure sensor and fabrication method thereof
An integrated structure of a MEMS microphone and an air pressure sensor, and a fabrication method for the integrated structure, the structure including a base substrate; a vibrating membrane, back electrode, upper electrode, and lower electrode formed on the base substrate, as well as a sacrificial layer formed between the vibrating membrane and the back electrode and between the upper electrode and the lower electrode; a first integrated circuit electrically connected to the vibrating membrane and the back electrode respectively; and a second integrated circuit electrically connected to the lower electrode and the upper electrode respectively, wherein a region of the base substrate corresponding to the vibrating membrane is provided with a back cavity; the sacrificial layer between the vibrating membrane and the back electrode is hollowed out to from a vibrating space that communicates with the exterior of the integrated structure, and the sacrificial layer between the upper electrode and the lower electrode is hollowed out to form a closed space; and the integrated circuits are formed on a chip, thereby reducing the interference of connection lines on the performance of a microphone, reducing the introduction of noise, reducing the size of a product and reducing power consumption.
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
A wafer-level magnetic sensor and an electronic device, comprising a bearing part (1) and at least one first magnetic resistor (3) and at least one second magnetic resistor (4) which are provided on the bearing part (1), wherein a resistance value of the second magnetic resistor (4) is configured to change under the induction of a working magnetic field. A metal wire (6) is also provided above the first magnetic resistor (3); the metal wire (6) is configured to allow a current to be introduced to generate a compensation magnetic field acting on the first magnetic resistor (3); the first magnetic resistor (3) is positioned in detection saturation regions of the compensation magnetic field and the working magnetic field. Such structure is simple in production process and low in costs, and can also realize batch production in the wafer-level manufacturing.
G01C 21/08 - NavigationNavigational instruments not provided for in groups by terrestrial means involving use of the magnetic field of the earth
H01L 27/22 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate using similar magnetic field effects
A microfilter and an acoustic device, comprising a substrate (1) provided with a back cavity (3), and a film layer (2) that is disposed on the substrate (1) and that is suspended on the back cavity (3); the film layer (2) is provided with distributed through holes (4), and the film layer (2) comprises at least one layer of a first diaphragm (2a) having tensile stress and at least one layer of a second diaphragm (2b) having compressive stress, which are composited together; the first diaphragm (2a) and the second diaphragm (2b) are configured to reduce the stress on the entire film layer (2) so as to control the stress on the entire film layer (2) to be within a desired range.
A miniature filter, comprising a substrate (1) having a rear cavity (3) and a film layer (2) provided on the substrate (1) and suspended above the rear cavity (3). The film layer (2) is provided with arranged through holes (4) and employs an amorphous metal film. Also disclosed is an acoustic device comprising the miniature filter.
Disclosed are a microfilter and an acoustic device, comprising a substrate that is provided with a back cavity, and a metal film disposed on the substrate and suspended on the back cavity; the outer surface of the metal film is coated with a non-stick layer; the degree of stickiness between the non-stick layer and particles is lower than the degree of stickiness between the metal film and the particles; the metal film and the non-stick layer are provided with distributed through holes. According to an embodiment of the present invention, by means of providing a non-stick layer on the metal film, the problem in which particles used for a long time stick to the metal film provided with through holes may be avoided, thus ensuring the sensitivity of a sensor.
An accelerometer and environmental sensor integrated chip, comprising a support part (2) and a mass block (4) connected to the support part (2) by means of a cantilever beam (3); a first pressure-sensitive resistor (6) is arranged on the cantilever beam (3); the first pressure-sensitive resistor (6) is configured to detect the degree of deformation of the cantilever beam (3) when the mass block (4) is affected by acceleration; the mass block (4) is provided with a recessed groove (13); also comprising a sensitive film (5) arranged on the mass block (4) and covering the recessed groove (13); a second pressure-sensitive resistor (7) is arranged on the sensitive film (5); and the second pressure-sensitive resistor (7) is configured to detect the degree to which the sensitive film (5) is deformed by environmental change. The accelerometer and the environment sensor are integrated into the same chip, greatly reducing the space occupied by the chip and being conducive to the development of miniaturisation of electronic devices.
G01P 15/12 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by alteration of electrical resistance
Disclosed is a microfilter and an acoustic device, comprising a substrate provided with a back cavity, and a film layer that is provided on the substrate and that is suspended on the back cavity; the film layer is provided with distributed through holes, and the film layer employs a metal thin film or a polyimide thin film; the substrate employs a photosensitive polymer material, and the shape of the substrate is formed by means of exposure and polymerization processing. According to one embodiment of the present disclosure, the substrate is fabricated by using a photosensitive polymer, which results in the process of fabrication becoming easy. Moreover, the microfilter can be simultaneously completely fabricated on a wafer.
A game controller (10), comprising a housing (11); a rolling ball (12) arranged in the housing (11) and rotating relative to the housing (11) under user operation, an identification pattern being arranged on the outer surface of the rolling ball (12); an image acquisition module (13) configured to continuously acquire a plurality of rolling ball images; and a direction identification module (14) configured to select a positioning icon from the identification pattern of the rolling ball image and determine the direction of game operation corresponding to the current rotation of the rolling ball (12) according to position changes of the positioning icon in the plurality of rolling ball images. Further disclosed are a game system and a method for direction identification of game operation. A rolling ball (12) with an identification unit on the outer surface is provided in the housing (11), and the direction of game operation corresponding to the rotation of the rolling ball (12) is determined according to the position changes of the positioning icon in the plurality of rolling ball images acquired by the image acquisition module (13), which improves the accuracy of direction control by the game controller (10), better adapts to multiple direction switching operations within a short time and ensures high comfort level.
A method for packaging a chip (3a, 3b, 3c). The method comprises the following steps: providing a substrate (1a, 1b, 1c), wherein an opening groove (10a, 10b, 10c) is formed on the substrate (1a, 1b, 1c) and penetrates through two opposite sides of the substrate; providing a release substrate (2a, 2b, 2c), wherein the release substrate (2a, 2b, 2c) is pasted onto one side of the substrate (1a, 1b, 1c) and covers the opening groove (10a, 10b, 10c); providing a chip (3a, 3b, 3c), and pasting and mounting the chip (3a, 3b, 3c) onto the release substrate (2a, 2b, 2c) located at the position of the opening groove (10a, 10b, 10c); packaging one side, far away from the release substrate (2a, 2b, 2c), of the substrate (1a, 1b, 1c), so as to form a package layer (4a, 4b, 4c) on which the chip (3a, 3b, 3c) is packaged, and same is then fixed onto the substrate (1a, 1b, 1c); and removing the release substrate (2a, 2b, 2c) so as to obtain a package structure of the chip (3a, 3b, 3c). The package method improves the reliability of packaging between the chip (3a, 3b, 3c) and the substrate (1a, 1b, 1c), and can also reduce the space occupied by the chip (3a, 3b, 3c), especially the thickness when a plurality of chips (3a, 3b, 5a, 5b) are stacked, thereby reducing the thickness of the entire package, and facilitating the development of lighter and thinner electronic products.
An encapsulation method for circuit units (20), wherein a circuit unit (20) comprises a silicon layer substrate (23) and a silicon dioxide layer (21) laminated on the silicon layer substrate (23). The encapsulation method for circuit units (20) comprises the following steps: inversely surface-mounting a plurality of circuit units (20) on a circuit substrate (10) at intervals, wherein the silicon dioxide layer (21) is attached to the circuit substrate (10), and the silicon layer substrate (23) faces away from the circuit substrate (10); forming an insulator (30) between the circuit units (20); removing the silicon layer substrate (23) to expose the silicon dioxide layer (21); and forming an electromagnetic shielding layer (40) on the silicon dioxide layer (21) and the insulator (30). By means of the encapsulation method for circuit units (20), the encapsulation structure of the circuit units (20) has a good electromagnetic shielding effect and is capable of efficient cooling.
A circuit unit packaging structure (100), comprising: a circuit substrate (10), wherein a circuit unit (20) is disposed on the circuit substrate (10), and comprises a silicon dioxide layer (21) and an electronic device disposed on the silicon dioxide layer (21); an insulator (30) surrounding the circuit unit (20); and an electromagnetic shielding layer (40) covering the circuit unit (20) and the insulator (30). The circuit unit packaging structure (100) provides good electromagnetic shielding and efficient heat dissipation.
Disclosed are a noise reduction method and device of a microphone array of an earphone, an earphone, and a TWS earphone. Said method comprises: when a wearer of an earphone speaks, acquiring a first sound signal collected by a bone conduction microphone provided on the earphone and second sound signals respectively collected by a preset number of microphones; determining, according to the first sound signal and the second sound signals, a delay time between arrival of a voice signal at each microphone and arrival of the voice signal at the bone conduction microphone; calculating, according to the delay time, a pointing angle between a microphone array consisting of the microphones and the mouth of the wearer; and adjusting, according to the pointing angle, a beam pointing angle of the microphone array, so as to perform beam forming on the microphone array by using the adjusted beam pointing angle. In the present invention, the bone conduction microphone is used to determine a time delay of receiving a voice signal by each microphone in the microphone array relative to the bone conduction microphone, thereby adaptively adjusting the beam pointing angle of the microphone array, ensuring a noise reduction effect of the microphone array, and improving the user experience.
A shielding process for SIP packaging: providing a circuit board (1); cutting a cover layer (3) to form half-cut channels (40) that separate different SIP packaging modules, and forming a groove (41) in a single SIP packaging module; forming a metal coating layer, the metal coating layer located on an outer surface of the SIP packaging module and at the positions of the half-cut channels (40) constituting a conformal shield (50), while the metal coating layer located at the positions of the grooves (41) constitutes a regional shield (51); and cutting the half-cut channels (40) to obtain a plurality of independent SIP packaging modules. By means of the described process, the conformal shield (50) and the regional shield (51) may be formed at the same time, and the conformal shield (50) and the regional shield (51) are completed in the same procedure and use the same material. The described shielding process may be fabricated continuously in large batches, which improves the efficiency of manufacturing, and reduces the costs of production while reducing the problem of burrs.
Disclosed are a microphone array-based sound signal processing method, apparatus and device. The method comprises: selecting, from a microphone array, a target microphone combination which is used for receiving a sound signal of a target sound source, the target microphone combination comprising a first microphone and at least one second microphone; obtaining target compensation information corresponding to the target microphone combination, the target compensation information comprising a signal compensation parameter of each second microphone with respect to the first microphone; according to the target compensation information, performing signal compensation processing on a second sound signal received by means of the second microphone; and according to the second sound signal subjected to the signal compensation processing and a first sound signal received by means of the first microphone, obtaining a target sound signal and outputting same.
A method for detecting the coverage of an intermetallic compound, comprising the following steps: putting a chip subjected to wire bonding into a mixed reagent of fuming nitric acid and fuming sulfuric acid for soaking, the chip subjected to wire bonding comprising a silver wire and an aluminum pad (S10); after the silver wire is removed, taking out the chip (S20); and detecting the coverage of an intermetallic compound on the aluminum pad (S30). The detection method uses the fuming nitric acid in the mixed reagent to remove the silver wire, so as to achieve the purpose of directly detecting the coverage of the intermetallic compound, thereby avoiding an operation of flipping a solder ball; moreover, corrosion of the intermetallic compound is slowed down by means of the fuming sulfuric acid in the mixed reagent, thereby guaranteeing the accuracy of coverage detection of the intermetallic compound.
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