PI Advanced Materials Co., Ltd. (Republic of Korea)
Inventor
Lee, Hosung
Yang, Minseok
Lee, Iksang
Abstract
Provided are a manufacturing method of polyimide powder capable of promoting imidization and having excellent intrinsic viscosity by controlling a polymerization reaction using a mixed solvent comprising a polar organic solvent and a high-boiling aromatic hydrocarbon solvent, and polyimide powder manufactured by the same.
PI Advanced Materials Co., Ltd. (Republic of Korea)
Inventor
Ro, Gyeong Hyeon
Moon, Gyeong Min
Lee, Ik Sang
Abstract
The present invention relates to a polyamic acid composition and a method for preparing same. Polyimide using a polyamic acid composition according to the present invention has excellent dielectric breakdown voltage performance and corona discharge initiation voltage while maintaining heat resistance and mechanical strength, and a polyimide coating prepared using the polyamic acid composition according to the present invention has excellent voltage endurance characteristics.
C09D 179/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
H01B 3/30 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes
3.
POLYIMIDE COMPOSITION COMPRISING ECO-FRIENDLY SOLVENT AND POLYIMIDE VARNISH FOR DISPLAY PRODUCED THEREFROM
POLYIMIDE PRECURSOR COMPRISING ECO-FRIENDLY SOLVENT AND POLYIMIDE FILM HAVING EXCELLENT SUBSTRATE ADHESION AND EXCELLENT HEAT RESISTANCE CHARACTERISTICS MANUFACTURED THEREFROM
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
We, Jung Hoon
Lee, Ik Sang
Park, Se Joo
Kim, Sung Ryul
Park, Joon Chul
Abstract
The present invention provides a polyimide precursor comprising: a polyamic acid including a dianhydride monomer and a diamine monomer as polymerization units; and an eco-friendly solvent, wherein the diamine monomer includes a first diamine monomer and a second diamine monomer, the first diamine monomer is different from the second diamine monomer, the second diamine monomer includes 3,4'-diaminodiphenylether (3,4'-ODA), and the diamine monomer includes 80-99.9 mol% of the first diamine monomer and 0.01-20 mol% of the second diamine monomer with respect to a total of 100 mol% of the diamine monomer.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Kim, Tae Min
Kim, Dong Young
Back, Sung Yul
Abstract
The present invention relates to a polyimide film for a flexible metal clad laminate and a manufacturing method therefor and, more specifically, to a polyimide film comprising a polyimide layer and a diamine coating layer formed on one surface or both surfaces of the polyimide layer, and a manufacturing method therefor.
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Chae, Yun Seok
Yoo, Dae-Geon
Won, Dong Young
Kim, Kyung Su
Abstract
The present invention provides a polyimide film comprising: a polyimide comprising, as repeating units, an anhydride monomer and a diamine monomer; and nanoparticles having an average particle size of 100 to 500 nm, wherein the polyimide film has a breakdown voltage (BDV) of 350 kV/mm or more and a surface roughness (Ra) value of 0.01 nm or more.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Jung, Hyeong Seop
Abstract
The present invention relates to a polyimide film and a graphite sheet manufactured therefrom, and, more specifically, to a polyimide film and a graphite sheet manufactured therefrom, the polyimide film comprising a phosphorus-based additive and a foam control agent in specific amounts.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Yoo, Dae-Geon
Chae, Yun-Seok
Kim, Kyung-Su
Abstract
The present invention relates to a polyimide film, a method for producing the polyimide film, and an energy storage device comprising the polyimide film, the polyimide film comprising a polyimide comprising a dianhydride monomer and a diamine monomer as polymerization units, wherein the diamine monomer comprises 4,4-diaminodiphenylmethane and m-phenylenediamine.
H01M 50/59 - Means for preventing undesired use or discharge for preventing incorrect connections inside or outside the batteries characterised by the protection means
10.
POLYIMIDE HAVING SOLUBILITY, AND PREPARATION METHOD THEREFOR
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Hwang, Jeong Jae
Lee, Kyu Won
Ryu, Han Tae
Lee, Kil Nam
Abstract
The present invention provides a polyimide having solubility in an organic solvent and comprising, as polymerized units, a dianhydride monomer including bisphenol A dianhydride (BPADA), and a diamine monomer including 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (6FAP).
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Kim, Tae Min
Kim, Dong Young
Back, Sung Yul
Abstract
The present invention provides a polyimide film comprising a block copolymer comprising a dianhydride monomer including pyromellitic dianhydride (PMDA), and a diamine monomer including 4,4'-diaminodiphenyl ether (ODA) and m-tolidine (m-TD), wherein the polyimide film has a water absorption rate of 2.5% or less when measured after being stored in water at room temperature (20-25°C) for one day or more, and a moisture absorption rate of 1.5% or less when measured after being stored in a constant temperature and humidity chamber (under conditions of temperature 25°C and humidity 50%) for one day or more.
PI Advanced Materials Co., Ltd. (Republic of Korea)
Inventor
Lee, Ho Sung
Yang, Min Seok
Lee, Ik Sang
Abstract
The present invention relates to polyimide powder and a manufacturing method therefor. Being polymerized from diamine monomers and dianhydride monomers using graphene, the polyimide powder according to the present invention exhibits electroconductivity whilst having minimal reduction in tensile strength and elongation, and thus can be provided as a polyimide powder capable of preventing static electricity.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Cho, Min-Sang
Back, Sung-Yul
Lee, Kil-Nam
Abstract
The present invention provides a polyimide film and a manufacturing method therefor, the polyimide film having a dielectric dissipation factor (Df) of 0.003 or less, a haze of 3.5% or less, a transmittance of 45% or greater, and a glass transition temperature (Tg) that is equal to or greater than 300° C. and is less than 320° C.
PI Advanced Materials Co., Ltd. (Republic of Korea)
Inventor
Ro, Gyeong Hyeon
Moon, Gyeong Min
Park, Se Joo
Lee, Ik Sang
Abstract
Provided is a polyimide varnish comprising: polyamic acid and nanosilica, wherein the nanosilica contains 5 to 23 wt % relative to the solid content of the polyamic acid, and the nanosilica has a moisture content of less than 0.5 wt %.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Lee, Kyuwon
Hwang, Jeong Jae
Ryu, Han Tae
Lee, Kil Nam
Abstract
The present invention provides a preparation method for polyamide, comprising the steps of: (a) preparing polyamic acid by polymerizing a dianhydride monomer and a diamine monomer; and (b) preparing soluble polyimide by reacting the polyamic acid with carbonyl diimidazole, wherein the soluble polyimide is in a varnish form.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Kim, Dong Young
Back, Sung Yul
Won, Dong Young
Abstract
TDTD in the transverse direction (TD) of the film, measured under conditions of a temperature range of 50-200°C and a heating rate of 10°C/min, is -5 to 2.5ppm/°C, and the modulus thereof is 8GPa or more.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Yang, Min Seok
Lee, Ik Sang
Lee, Ho Sang
Abstract
The present invention relates to a polyimide powder and a preparation method therefor, and according to the present invention, a diamine monomer and a dianhydride monomer are polymerized using a glass fiber powder, and thus a high-heat-resistant polyimide powder capable of ensuring stability at a high temperature of 800° C. while maintaining insulation, and having excellent chemical resistance can be provided.
PI Advanced Materials Co., Ltd. (Republic of Korea)
Inventor
Moon, Gyeong Min
Ro, Gyeong Hyeon
Lee, Ik Sang
Abstract
The present invention relates to a polyamic acid composition and a method for preparing same. A polyimide using the polyamic acid composition according to the present invention has excellent dielectric breakdown voltage performance and corona discharge initiation voltage while maintaining heat resistance or mechanical strength, and a polyimide coating manufactured using the polyamic acid composition according to the present invention has excellent voltage endurance characteristics.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Back, Sung-Yul
Lee, Kil-Nam
Cho, Min-Sang
Chae, Su-Kyung
Abstract
The present invention provides a polyamic acid, polyimide film and a flexible metal clad laminate using same, the polyamic acid comprising the following components copolymerized: an acid dianhydride component comprising biphenyl-tetracarboxylic acid dianhydride (BPDA), pyromellitic dianhydride (PMDA) and p-phenylenebis(trimellitate anhydride) (TAHQ); and a diamine component comprising m-tolidine and para-phenylenediamine (PPD).
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Yoo, Dae-Geon
Kim, Dong-Young
Won, Dong-Young
Abstract
The present invention provides a multilayer polyimide film and a manufacturing method therefor, wherein the multilayer polyimide film comprises a first skin layer and a second skin layer respectively formed on one outer surface of a core layer and an opposite surface of the outer surface, has a thermal expansion coefficient that is between 2.0 ppm/° C. and 6.0 ppm/° C., and has a hygroscopic expansion coefficient that is between 3.0 ppm/RH % and 6.0 ppm/RH %.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Cho, Min-Sang
Lee, Kil-Nam
Back, Sung-Yul
Chae, Su-Kyung
Abstract
The present invention provides low-dielectric polyamic acid and a polyimide film, the low-dielectric polyamic acid comprising: a dianhydride acid component including two or more selected from the group consisting of biphenyltetracarboxylic dianhydride (BPDA), pyromellitic dianhydride (PMDA), and p-phenylenebis(trimellitate anhydride) (TAHQ); and a diamine component including one or more selected from the group consisting of oxydianiline (ODA), m-tolidine, and paraphenylene diamine (PPD), and the low-dielectric polyamic acid being obtained by copolymerizing the components.
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Jung, Hyeong-Seop
Won, Dong-Young
Abstract
The present invention provides a polyimide film and a graphite sheet prepared therefrom, wherein the polyimide film is obtained by an imidication reaction of a polyamic acid comprising: quinoline and β-picoline as imidication catalysts; and acetic anhydride as a dehydrating agent.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Moon, Gyeong Min
Ro, Gyeong Hyeon
Lee, Ik Sang
Abstract
The present invention provides: a polyimide coating material, which has low dielectric properties and improved adhesion between a conductor and the coating material and flexibility of the coating material while simultaneously preventing dielectric breakdown and partial discharge; and a coated electric wire.
H01B 3/30 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes
PI Advanced Materials Co., Ltd. (Republic of Korea)
Inventor
Yang, Min Seok
Lee, Ho Sung
Lee, Ik Sang
Abstract
The present invention relates to a polyimide powder and a preparation method therefor. With respect to the polyimide powder and the preparation method therefor, according to the present invention, a preparation process is simplified such that process efficiency can be improved, a polyimide is prepared in the form of a powder so as to facilitate molding thereof, and the polyimide has a low precipitation temperature and a high intrinsic viscosity so as to facilitate processing thereof, and has a uniform particle size so as to have excellent processability.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Lee, Kyuwon
Hwang, Jeong Jae
Ryu, Han Tae
Lee, Kil Nam
Abstract
The present disclosure provides a polyimide comprising: as polymerized units, a dianhydride monomer; and a diamine monomer including 4,4'-methylenebis(2,6-diethylaniline) (MEDA), wherein the polyimide is a random copolymer in which the polymerized units are irregularly arranged.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Jung, Hyeong-Seop
Won, Dong-Young
Abstract
Disclosed is a polyimide film comprising a first plasticizer and a second plasticizer, wherein the molecular weights of the first plasticizer and the second plasticizer are 700 g/mol or less. In addition, a method for manufacturing a graphite sheet using the polyimide film and a graphite sheet having an excellent appearance prepared therefrom are disclosed.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Ro, Gyeong Hyeon
Moon, Gyeong Min
Lee, Ik Sang
Abstract
The present invention relates to a polyamic acid composition for coating a conductor, and provides a polyamic acid composition for coating a conductor that prevents dielectric breakdown and partial discharge of a cured product while improving adhesion between a conductor and a coating material and flexibility of the coating material.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Park, Se Joo
Park, Joon Chul
Lee, Ik Sang
Abstract
The present disclosure provides a polyamic acid composition comprising: a dianhydride monomer including pyromellitic dianhydride (PMDA); and a diamine monomer including two or more selected from the group consisting of 2,2'-bis(trifluoromethyl)benzidine (TFMB), 9,9-bis(3-fluoro-4-aminophenyl)fluorene (FFDA), 9,9-bis(4-aminophenyl)fluorene (FDA), and 1,3-bis(3-aminopropyl)tetramethyldisiloxane (MDSA), wherein a content of fluorine (F) atoms is calculated according to Equation 1 below, and the content of fluorine atoms is 17 to 21 wt%: [Equation 1] Fluorine atom content (wt%) = (total atomic weight of fluorine atoms / molecular weight of polyamic acid repeating unit) Х 100.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Jung, Hyeong-Seop
Won, Dong-Young
Abstract
Disclosed in the present invention are a polyimide film for the preparation of graphite sheets and a graphite sheet prepared therefrom, the polyimide film including a phosphorous compound having at least one alkyl group having 1-6 carbon atoms.
C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
C08K 5/521 - Esters of phosphoric acids, e.g. of H3PO4
C04B 35/52 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxides based on carbon, e.g. graphite
C04B 35/622 - Forming processesProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Ro, Gyeong Hyeon
Lee, Ik Sang
Abstract
The present application provides; a varnish, which is a polyimide precursor that is imidized by thermal curing, and implements the insulation, adhesion, heat resistance, mechanical strength, and light resistance of polyimide; a film including same; and a vehicle device coated with the film.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Park, Joon Chul
Park, Se Joo
We, Jung Hoon
Kim, Sung Ryul
Lee, Ik Sang
Abstract
The present application provides: a polyimide precursor capable of achieving a high imidization rate even with the use of environmentally friendly organic solvents, and a polyimide film having optical properties and mechanical strength, similar to those of polyimide films manufactured using organic solvents designated as hazardous substances, even with the use of environmentally friendly organic solvents.
PI Advanced Materials Co., Ltd. (Republic of Korea)
Inventor
Lee, Hosung
Lee, Ik Sang
Yang, Minseok
Abstract
Provided is a polyimide molded product comprising polyimide powder obtained by imidizing a dianhydride monomer and a diamine monomer, in which a bidirectional coefficient of thermal expansion (CTEBi-direction) according to Equation 1 below in the range of 25° C. to 300° C. is 0.7 to 1.5:
Provided is a polyimide molded product comprising polyimide powder obtained by imidizing a dianhydride monomer and a diamine monomer, in which a bidirectional coefficient of thermal expansion (CTEBi-direction) according to Equation 1 below in the range of 25° C. to 300° C. is 0.7 to 1.5:
Bidirectinal
coefficient
of
thermal
expansion
(
CTE
Bi
-
direction
)
=
Transverse
coefficient
of
thermal
expansion
(
CTE
x
)
/
Longitudinal
coefficient
of
thermal
expansion
(
CTE
y
)
=
C
T
E
x
/
CTE
y
.
[
Equation
1
]
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Kim, Sung Ryul
Park, Se Joo
We, Jung Hoon
Park, Joon Chul
Lee, Ik Sang
Abstract
The present application provides: a polyimide precursor enabling an eco-friendly polyimide film having high adhesiveness, excellent surface flatness, and low roughness to be implemented; and a polyimide film comprising a cured product of the polyimide precursor.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
We, Jung Hoon
Lee, Ik Sang
Park, Se Joo
Kim, Sung Ryul
Park, Joon Chul
Abstract
The present application provides: a polyamic acid composition capable of implementing a polyimide film with excellent surface properties and durability in an environmentally friendly manner and implementing a polyimide film having optical properties and durability equivalent to or higher than those of existing polyimide films manufactured using substances defined as hazardous substances, despite the use of environmentally friendly organic solvents; a polyimide precursor comprising a polymerized product of the polyamic acid composition; a polyimide film comprising a cured product of the polyimide precursor; and a method for preparing the polyimide precursor.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Park, Se Joo
Hwang, In Hwan
Lee, Ik Sang
Abstract
The present application relates to a polyamic acid composition, a binder resin composition for an electrode, an electrode active material composition comprising the binder resin composition, and an electrode comprising same, and provides a novel binder material which has excellent mechanical strength and excellent binding force by synthesizing polyamic acid and applying same as a silicone-based negative electrode binder.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Moon, Gyeongmin
Ro, Gyeonghyeon
Lee, Ik Sang
Abstract
Provided is polyimide varnish comprising: a polyamic acid solution containing diamine monomer and dianhydride monomer as polymerized units; an additive containing boron nitride; and a dispersant.
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
H01B 3/30 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes
37.
BLENDED POLYIMIDE FILM AND MANUFACTURING METHOD THEREFOR
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Chae, Su-Kyung
Won, Dong-Young
Back, Sung-Yul
Jung, Young-Jin
Choi, Jeong-Yeul
Abstract
The present invention provides a polyimide film that has a dielectric constant (Dk) of 3.5 or less and a dielectric loss (Df) of 0.003 or less as measured at 10 GHz after being left 24 hours in an environment of 85°C and 85% RH.
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
C08L 101/04 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups containing halogen atoms
B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Kim, Dong-Young
Won, Dong-Young
Yoo, Dae-Geon
Abstract
The present invention provides a polyimide film and a method for producing same, the polyimide film having a moisture absorption rate of 0.9% or less and an elongation of 20-50%.
C08K 5/521 - Esters of phosphoric acids, e.g. of H3PO4
C23C 14/20 - Metallic material, boron or silicon on organic substrates
C23C 16/06 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Cho, Min Sang
Lee, Kil Nam
Ryu, Han Tae
Abstract
Provided is a polyimide comprising: as polymerized units a dianhydride monomer including at least one selected from the group consisting of 3,3',4,4'-benzophenone tetracarboxylic dianhydride (BTDA), oxydiphthalic anhydride (ODPA), 4,4'-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) and 3,3',4,4'-diphenylsulfonetetracarboxylic dianhydride; and a diamine monomer including 4,4'-methylenebis(2,6-diethylaniline) (MEDA).
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Yoo, Dae-Geon
Kim, Dong-Young
Won, Dong-Young
Abstract
The present invention provides a multilayer polyimide film and a method for manufacturing same, wherein the multilayer polyimide film comprises: a core layer; and a first skin layer and a second skin layer that are formed on one outer surface of the core layer and an opposite surface of the outer surface, respectively, wherein the surface hardness measured with a nanoindenter ranges between 0.4 GPa and 0.6 GPa.
B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 37/15 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Kim, Kyung Su
Won, Dong Young
Choi, Jeong-Yeul
Jung, Hyeong-Seop
Abstract
Provided is a polyimide film for graphite sheets comprising: a polyamic acid containing a diamine monomer and a dianhydride monomer as polymerized units; and an additive containing metal acetylacetonate, wherein some or all of the metal contained in the additive remains in the polyimide film. The polyimide film for graphite sheets of the present disclosure may contain the additive and/or the plasticizer to reduce the foam thickness of the graphite sheets, thereby preventing overfoaming, making it easier to be fired into graphite, and securing high thickness.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Jeon, Jin-Seok
Yeo, Moon-Jin
Chae, Yun-Seok
Won, Dong-Young
Abstract
The present invention relates to a polyimide film produced by imidization of a polyamic acid solution containing: a dianhydride component including biphenyl tetracarboxylic dianhydride, pyromellitic dianhydride, and benzophenone tetracarboxylic dianhydride; and a diamine component including oxydianiline, paraphenylene diamine, and 4,4'-diaminobenzanilide.
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Yang, Min Seok
Lee, Ho Sung
Lee, Ik Sang
Abstract
The present application provides a polyimide powder in which a conductive filler is uniformly dispersed within particles, and a polyamic acid varnish that is prepared from the powder and capable of implementing a polyimide molded article that not only has excellent moldability and processability, but also has excellent conductivity, tensile strength, elongation, and elastic modulus.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Chae, Yun-Seok
Won, Dong-Young
Yeo, Moon-Jin
Jeon, Jin-Seok
Abstract
The present invention provides: a polyimide film having excellent heat resistance and mechanical properties, such as a yield strength of at least 138 MPa and a glass transition temperature of at least 370°C; and a method for producing same.
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
45.
BLACK POLYIMIDE FILM AND THE MANUFACTURING METHOD THEREOF
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Yeo, Moon Jin
Jeon, Jin Seok
Chae, Yun Seok
Won, Dong Young
Abstract
The present invention provides a black polyimide film manufactured by imidizing a polyamic acid obtained from dianhydride monomers and diamine monomers, the black polyimide film comprising: a black pigment containing bituminous coal and perylene black.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Lee, Ho Sung
Lee, Ik Sang
Jeon, Jin Seok
Abstract
The present invention relates to a method for producing a polyimide powder, particularly to a method for producing a polyimide powder, which includes a) preparing a dispersion by dispersing a dianhydride and a diamine in distilled water; and b) introducing the dispersion of step a) into a reactor and conducting the reaction at a stirring speed of 300 rpm or more under temperature and pressure conditions. In the present invention, it is possible to improve physical properties and control the particle size and dispersibility without additional processes by using water-based polymerization and controlling the stirring speed in the production process.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Cho, Min Sang
Lee, Kil Nam
Ryu, Han Tae
Back, Sung Yul
Chae, Su Kyung
Jung, Young Jin
Abstract
The present invention provides a polyimide varnish comprising: a first polyamic acid comprising a first block derived by polymerization of a first dianhydride acid component comprising biphenyltetracarboxylic dianhydride (BPDA) and a first diamine component comprising para-phenylene (PPD) and m-tolidine; and a second polyamic acid comprising a second block derived by polymerization of a second dianhydride acid component comprising biphenyltetracarboxylic dianhydride (BPDA) and pyromellitic dianhydride (PMDA) and a second diamine component comprising at least one selected from para-phenylene (PPD) and m-tolidine.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Moon, Gyeong Min
Ro, Gyeong Hyeon
Lee, Ik Sang
Abstract
The present application provides: a polyamic acid composition; polyimide, which is a cured product of the composition; a coated product comprising the polyimide; and an electronic device comprising the coated product, the composition simultaneously exhibiting excellent storage stability, low permittivity, heat resistance, an insulation property, and mechanical properties under severe conditions of high temperature and the like.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Yoo, Dae-Geon
Kim, Dong-Young
Won, Dong-Young
Abstract
The present invention provides: a polyimide film having a surface hardness of 0.4 GPa to 0.6 GPa, as measured by a nanoindenter; and a method for producing same.
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
50.
POLYIMIDE FILM HAVING HIGH DIMENSIONAL STABILITY AND MANUFACTURING METHOD THEREFOR
PI Advanced Materials Co., Ltd. (Republic of Korea)
Inventor
Kim, Dong-Young
Yoo, Dae-Geon
Won, Dong-Young
Abstract
The present invention provides a polyimide film and a manufacturing method therefor, wherein the polyimide film satisfies the following equation (1) as measured for dimensional change by a thermomechanical analyzer (TMA) undergoing a temperature elevation process from 25° C. to 400° C. and then a cooling process from 400° C. to 25° C. Equation (1) dimensional measurement in TD direction (cooling, 50° C.)−dimensional measurement in TD direction (temperature elevation, 50° C.)<0 μm.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Hwang, In Hwan
Lee, Ik Sang
Abstract
The present application relates to a polyamic acid composition and a polyimide comprising same, and provides a polyamic acid composition which has a high concentration of polyamic acid solids and a low viscosity and, after hardening, has superior electrical properties as well as superior heat resistance, dimensional stability, and mechanical properties, and a polyimide and a polyimide film produced therefrom.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Jung, Hyeong-Seop
Won, Dong-Young
Abstract
Disclosed are a polyimide film for preparing a graphite sheet, and a graphite sheet prepared therefrom, the polyimide film comprising 1.5 wt% to 8 wt% of a phosphorus-based compound with respect to the total 100 wt% weight of an imidization catalyst contained in the polyimide film.
C04B 35/52 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxides based on carbon, e.g. graphite
C04B 35/622 - Forming processesProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products
C04B 35/626 - Preparing or treating the powders individually or as batches
53.
POLYAMIC ACID COMPOSITION, AND POLYIMIDE COMPRISING SAME
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Hwang, In Hwan
Lee, Ik Sang
Abstract
The present application relates to a polyamic acid composition and a polyimide comprising same, and provides a polyamic acid composition which has a high concentration of polyamic acid solids and a low viscosity and, after hardening, has superior heat resistance, dimensional stability, and mechanical properties, and a polyimide and a polyimide film produced therefrom.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Hwang, In Hwan
Lee, Ik Sang
Abstract
The present application relates to a polyamic add composition and a polyimide comprising same, and provides a polyamic add composition which has a high concentration of polyamic acid solids and a low viscosity and, after hardening, has superior electrical properties as well as superior heat resistance, dimensional stability, and mechanical properties, and a polyimide and a polyimide film produced therefrom.
PI Advanced Materials Co., Ltd. (Republic of Korea)
Inventor
Min, Jae-Ho
Won, Dong-Young
Abstract
Disclosed are a polyimide film for a graphite sheet, the polyimide film having a thickness of 100 μm or larger and a 1%-weight-loss thermal decomposition temperature of 480° C. or lower and/or an L* value of 40 or higher being measured with a colorimeter, a method of forming the same polyimide film, and a graphite sheet manufactured using the same polyimide film.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Ro, Gyeong Hyeon
Moon, Gyeong Min
Kim, Se Jong
Lee, Ik Sang
Abstract
The present invention provides polyimide varnish comprising: polyamic acid including, as a polymerization unit, at least one dianhydride monomer and at least one diamine monomer; nano silica surface-modified with an organosilane; a silicon-based additive represented by chemical formula 1; and an organic solvent.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Hwang, In Hwan
Lee, Ik Sang
Abstract
The present application relates to a polyamic acid composition and a polyimide comprising same, and provides a polyamic acid composition which has a high concentration of polyamic acid solids and a low viscosity and, after hardening, has superior heat resistance, dimensional stability, and mechanical properties, and a polyimide and a polyimide film produced therefrom.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Hwang, In Hwan
Lee, Ik Sang
Abstract
The present application relates to a polyamic acid composition and a polyimide comprising same, and provides a polyamic acid composition which has a high concentration of polyamic acid solids and a low viscosity and, after hardening, has superior heat resistance, dimensional stability, and mechanical properties, and a polyimide and a polyimide film produced therefrom.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Yeo, Moon Jin
Jeon, Jin Seok
Won, Dong Young
Abstract
Provided is a black polyimide film formed by imidizing a polyamic acid obtained from a dianhydride monomer and a diamine monomer, comprising: a black pigment containing bituminous coal and lactam black.
PI Advanced Materials Co., Ltd. (Republic of Korea)
Inventor
Kim, Dong-Young
Yoo, Dae-Geon
Won, Dong-Young
Abstract
The present invention provides: a polyimide film having excellent dimensional stability; and a method for manufacturing same, wherein the polyimide film has a coefficient of thermal expansion of 1 ppm/° C. to 5 ppm/° C., an elastic modulus of 9 GPa to 11.5 GPa, and a glass transition temperature of 340° C. to 400° C.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Jung, Young-Jin
Won, Dong-Young
Back, Sung-Yul
Cho, Min-Sang
Chae, Su-Kyung
Abstract
Provided is a polyimide film that is prepared by imidizing a polyamic acid solution containing two or more dianhydride components selected from the group consisting of biphenyltetracarboxylic dianhydride (BPDA), pyromellitic dianhydride (PMDA), and p-phenylenebis(trimellitate anhydride) (TAHQ), and at least one diamine component selected from oxydianiline (ODA), p-phenylenediamine (PPD), and m-tolidine (mTD), and that has a dielectric dissipation factor (Df) of 0.0025 or less and a glass transition temperature (Tg) of 240 ℃ or more.
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Park, Se Joo
We, Jung Hoon
Park, Joon Chul
Lee, Ik Sang
Abstract
The present application provides: a polyimide precursor capable of achieving all of a low dielectric constant, light resistance, heat resistance, insulating properties, and mechanical properties under severe conditions such as high temperatures, by comprising a high-molecular-weight polyamic acid; a method for preparing the polyamic acid; a method for increasing the molecular weight of the polyamic acid; a film comprising the precursor; and a display device having a substrate to which the film is attached.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Park, Se Joo
We, Jung Hoon
Park, Joon Chul
Lee, Ik Sang
Abstract
The present application provides: a polyimide precursor capable of implementing a polyimide with environmentally friendly high adhesion and excellent surface flatness and durability; a method for preparing the polyimide precursor; and a polyimide film comprising a cured product of the polyimide precursor.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Lee, Hosung
Yang, Minseok
Lee, Iksang
Abstract
Provided are a manufacturing method of polyimide powder capable of promoting imidization and having excellent intrinsic viscosity by controlling a polymerization reaction using a mixed solvent comprising a polar organic solvent and a high-boiling aromatic hydrocarbon solvent, and polyimide powder manufactured by the same.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Kim, Dong-Young
Yoo, Dae-Geon
Won, Dong-Young
Abstract
The present invention provides a polyimide film and a manufacturing method therefor, wherein in the dimension change measurement by a thermomechanical analyzer (TMA) that performs a temperature rise procedure from 25°C to 400°C after storage for 48 hours at a humidity of 50% RH, the temperature-rise thermal expansion coefficient (50 to 200°C) in the TD direction is -1.5 ppm/°C to 6 ppm/°C, the temperature-rise thermal expansion coefficient (50 to 200°C) being the slope of a straight line connecting a dimensional measurement value in the TD direction of the polyimide film as measured at 200°C in the first run during the temperature rise procedure and a dimensional measurement value in the TD direction of the polyimide film as measured at 50°C in the first run during the temperature rise procedure, and the dimensional measurement values in the TD direction correspond to dimensional change values calculated by converting, into 1 m, the length of a sample of the polyimide film used in the measurement by the thermomechanical analyzer.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Park, Joon Chul
Park, Se Joo
Lee, Ik Sang
Abstract
The present invention relates to a polyimide precursor composition with improved flexibility and elongation. The polyimide precursor composition according to the present invention is a polyimide precursor having a dianhydride monomer and a diamine monomer as polymerized units, and by comprising a triphenylamine additive, exhibits an improved imidation rate and improved elongation, and thus, a polyimide precursor composition with excellent flexibility can be provided.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Yang, Min Seok
Lee, Ik Sang
Lee, Ho Sung
Abstract
The present invention relates to a polyimide powder and a preparation method therefor, and according to the present invention, a diamine monomer and a dianhydride monomer are polymerized using a glass fiber powder, and thus a high-heat-resistant polyimide powder capable of ensuring stability at a high temperature of 800°C while maintaining insulation, and having excellent chemical resistance can be provided.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Park, Se Joo
Park, Joon Chul
Lee, Ik Sang
Abstract
The present disclosure relates to a polyamic acid composition comprising: a polyamic acid comprising, as a polymerization unit, at least one selected from a dianhydride monomer represented by Chemical Formula 1 and a diamine monomer represented by Chemical Formula 2 or Chemical Formula 3; an imidazole-based compound; an epoxy-based compound; and an organic solvent, and a polyimide comprising the same. The polyamic acid composition of the present disclosure and the polyimide comprising the same have excellent mechanical properties such as strength and elongation while maintaining a low yellow index and excellent thermal properties.
G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
69.
POLYIMIDE POWDER WITH IMPROVED CONDUCTIVITY USING GRAPHENE AND MANUFACTURING METHOD THEREFOR
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Lee, Ho Sung
Yang, Min Seok
Lee, Ik Sang
Abstract
The present invention relates to a polyimide powder and a manufacturing method therefor. Being polymerized from diamine monomers and dianhydride monomers using graphene, the polyimide powder according to the present invention exhibits electroconductivity whilst having minimal reduction in tensile strength and elongation, and thus can be provided as a polyimide powder capable of preventing static electricity.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Cho, Min-Sang
Lee, Kil-Nam
Back, Sung-Yul
Chae, Su-Kyung
Abstract
The present invention provides low-dielectric polyamic acid and a polyimide film, the low-dielectric polyamic acid comprising: a dianhydride acid component including two or more selected from the group consisting of biphenyltetracarboxylic dianhydride (BPDA), pyromellitic dianhydride (PMDA), and p-phenylenebis(trimellitate anhydride)(TAHQ); and a diamine component including one or more selected from the group consisting of oxydianiline (ODA), m-tolidine, and paraphenylene diamine (PPD), and the low-dielectric polyamic acid being obtained by copolymerizing the components.
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
71.
MULTILAYER POLYIMIDE FILM AND METHOD FOR MANUFACTURING SAME
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Back, Sung-Yul
Lee, Kil-Nam
Cho, Min-Sang
Abstract
The present invention provides a multilayer polyimide film and a method for manufacturing same, the multilayer polyimide film comprising at least one skin layer, which is formed on at least one outer surface of a core layer, and having a dielectric dissipation factor of 0.003 or less and an adhesive force of 1,000 gf/cm or more.
B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 37/15 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Yoo, Dae-Geon
Kim, Dong-Young
Won, Dong-Young
Abstract
The present invention provides a multilayer polyimide film and a manufacturing method therefor, wherein the multilayer polyimide film comprises a first skin layer and a second skin layer that are disposed on one outer surface and an opposite surface thereto in a core layer, respectively, and has an adhesive force to copper foil of 0.8 kgf/cm or greater.
B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Chae, Su-Kyung
Lee, Kil-Nam
Back, Sung-Yul
Cho, Min-Sang
Abstract
The present invention provides a multi-layered polyimide film comprising at least one skin layer formed on at least one outer surface of a core layer, wherein the multi-layered polyimide film has a dielectric loss factor of 0.003 or less, an adhesive strength of 1,000 gf/cm or more, and a storage modulus of 1,000 MPa or more at 300℃, and a method for manufacturing same.
B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
B32B 37/15 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Yoo, Dae-Geon
Kim, Dong-Young
Won, Dong-Young
Abstract
The present invention provides a multilayer polyimide film and a manufacturing method therefor, wherein the multilayer polyimide film comprises a first skin layer and a second skin layer respectively formed on one outer surface of a core layer and an opposite surface of the outer surface, has a thermal expansion coefficient that is between 2.0 ppm/℃ and 6.0 ppm/℃, and has a hygroscopic expansion coefficient that is between 3.0 ppm/RH% and 6.0 ppm/RH%.
B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
B32B 37/15 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B29C 48/18 - Articles comprising two or more components, e.g. co-extruded layers the components being layers
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Back, Sung-Yul
Lee, Kil-Nam
Cho, Min-Sang
Chae, Su-Kyung
Abstract
The present invention provides a polyamic acid, polyimide film and a flexible metal clad laminate using same, the polyamic acid comprising the following components copolymerized: an acid dianhydride component comprising biphenyl-tetracarboxylic acid dianhydride (BPDA), pyromellitic dianhydride (PMDA) and p-phenylenebis(trimellitate anhydride) (TAHQ); and a diamine component comprising m-tolidine and para-phenylenediamine (PPD).
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
76.
POLYIMIDE PRECURSOR COMPOSITION AND POLYIMIDE FILM COMPRISING SAME
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Back, Sung-Yul
Won, Dong-Young
Lee, Kil-Nam
Cho, Min-Sang
Chae, Su-Kyung
Jung, Young-Jin
Abstract
The present invention provides a polyimide film comprising a block copolymer, the block copolymer comprising: a first block obtained by imidizing polyamic acid derived from a polymer consisting of a dianhydrous acid component including biphenyltetracarboxylic dianhydride and a diamine component including paraphenylenediamine; a second block obtained by imidizing polyamic acid derived from a polymer consisting of a dianhydrous acid component including biphenyltetracarboxylic dianhydride and a diamine component including m-tolidine; and a third block obtained by imidizing polyamic acid derived from a polymer consisting of a dianhydrous acid component including pyromellitic dianhydride (PMDA) and a diamine component including m-tolidine.
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Jung, Hyeong-Seop
Won, Dong-Young
Abstract
The present invention provides a polyimide film and a graphite sheet prepared therefrom, wherein the polyimide film is obtained by an imidization reaction of a polyamic acid comprising: quinoline and β-picoline as imidization catalysts; and acetic anhydride as a dehydrating agent.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Jeon, Jin-Seok
Yeo, Moon-Jin
Lee, Kil-Nam
Abstract
The present invention relates to a polyimide film and a manufacturing method therefor, the polyimide film having a tensile strength of 370MPa or higher, an elasticity modulus of 6.3GPa or higher, a chemical resistance of 80% or higher, and a glass transition temperature of 365℃ or higher, and being manufactured through imidization of a polyamic acid solution comprising a diacid anhydride component and a diamine component.
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
79.
POLYAMIC ACID COMPOSITION AND METHOD FOR PREPARING SAME
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Ro, Gyeong Hyeon
Moon, Gyeong Min
Lee, Ik Sang
Abstract
The present invention relates to a polyamic acid composition and a method for preparing same. Polyimide using a polyamic acid composition according to the present invention has excellent dielectric breakdown voltage performance and corona discharge initiation voltage while maintaining heat resistance and mechanical strength, and a polyimide coating prepared using the polyamic acid composition according to the present invention has excellent voltage endurance characteristics.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Moon, Gyeong Min
Ro, Gyeong Hyeon
Lee, Ik Sang
Abstract
The present invention relates to a polyamic acid composition and a method for preparing same. A polyimide using the polyamic acid composition according to the present invention has excellent dielectric breakdown voltage performance and corona discharge initiation voltage while maintaining heat resistance or mechanical strength, and a polyimide coating manufactured using the polyamic acid composition according to the present invention has excellent voltage endurance characteristics.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Kim, Dong-Young
Yoo, Dae-Geon
Won, Dong-Young
Abstract
Provided are a polyimide film having excellent dimensional stability and having a expansion coefficient ratio, represented by equation 1 below, of greater than 0 and less than or equal to 2.5, and a method for preparing same. The polyamide film is prepared by means of an imidization reaction of a polyamic acid solution containing two or more types of acid dianhydride components and two or more types of diamine components, thereby satisfying the the expansion coefficient ratio. Expansion coefficient ratio = hygroscopic expansion coefficient (ppm/RH%)/thermal expansion coefficient (ppm/℃)
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
82.
LOW-DIELECTRIC BLACK POLYIMIDE FILM AND PREPARATION METHOD THEREOF
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Yeo, Moon-Jin
Lee, Kil-Nam
Abstract
The present invention relates to a polyimide film having transmittance of 1.0% or lower, glossiness of 50% or lower, and a dielectric loss rate of 0.01 or lower, and a preparation method thereof. The polyimide film having adjusted the type and composition ratio of dianhydride component, diamine component and carbon black has the advantage of exhibiting excellent optical properties, dielectric properties and chemical resistance.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Jeon, Jin-Seok
Yeo, Moon-Jin
Back, Sung-Yul
Lee, Kil-Nam
Abstract
The present invention provides a polyimide film that is obtained by imidizing a polyamic acid solution containing a dianhydride component including benzophenonetetracarboxylic dianhydride (BTDA), biphenyltetracarboxylic dianhydride (BPDA) and pyromellitic dianhydride (PMDA), and a diamine component including m-tolidine and paraphenylene diamine (PPD)), and comprises graphene nanoplatelets in an amount of 0.5-2.5% by weight.
B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Yeo, Moon-Jin
Lee, Kil-Nam
Abstract
The present invention relates to a polyimide film and a method for manufacturing same, the polyimide film being manufactured by imidizing a polyamic acid solution comprising: a dianhydride acid component including biphenyltetracarboxylic dianhydride (BPDA), pyromellitic dianhydride (PMDA), and benzophenonetetracarboxylic dianhydride (BTDA); and a diamine component including oxydianiline (ODA), paraphenylene diamine (PPD), and 4,4'-diaminobenzanilide (DABA).
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Yang, Min Seok
Lee, Ho Sung
Lee, Ik Sang
Abstract
The present invention relates to a polyimide powder and a preparation method therefor. With respect to the polyimide powder and the preparation method therefor, according to the present invention, a preparation process is simplified such that process efficiency can be improved, a polyimide is prepared in the form of a powder so as to facilitate molding thereof, and the polyimide has a low precipitation temperature and a high intrinsic viscosity so as to facilitate processing thereof, and has a uniform particle size so as to have excellent processability.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Hwang, In Hwan
Abstract
The present invention relates to a polyamic acid composition, and a polyimide produced therefrom, the polyimide having excellent electrical conductivity while having high transparency.
C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
C08L 65/00 - Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chainCompositions of derivatives of such polymers
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
87.
POLYAMIC ACID COMPOSITION AND POLYIMIDE PREPARED THEREFROM
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Hwang, In Hwan
Park, Se Joo
Abstract
The present invention relates to a polyamic acid composition and a polyimide including same and exhibits excellent thermal properties such as dimensional stability and heat resistance while retaining high transparency.
PI Advanced Materials Co., Ltd. (Republic of Korea)
Inventor
Won, Dong Young
Kim, Dong Young
Abstract
A polyimide film, a method of manufacturing the same, and a flexible metal foil clad laminate including the same. The polyimide film includes: a first imide bond unit having a glass transition temperature of 400° C. or higher; and a second imide bond unit having a glass transition temperature of less than 400° C., wherein the first imide bond unit is present in an amount of about 39 mol % to about 90 mol % in the polyimide film.
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
89.
POLYAMIC ACID COMPOSITION AND POLYIMIDE COATING MATERIAL COMPRISING SAME
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Ro, Gyeong Hyeon
Moon, Gyeong Min
Lee, Ik Sang
Abstract
The present invention relates to a polyamic acid composition for coating a conductor, and provides a polyamic acid composition for coating a conductor that prevents dielectric breakdown and partial discharge of a cured product while improving adhesion between a conductor and a coating material and flexibility of the coating material.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Moon, Gyeong Min
Ro, Gyeong Hyeon
Lee, Ik Sang
Abstract
The present invention provides: a polyimide coating material, which has low dielectric properties and improved adhesion between a conductor and the coating material and flexibility of the coating material while simultaneously preventing dielectric breakdown and partial discharge; and a coated electric wire.
PI Advanced Materials Co., Ltd. (Republic of Korea)
Inventor
Jeon, Jin-Seok
Cho, Min-Sang
Lee, Kil-Nam
Abstract
The present invention provides: a polyimide composite powder which includes 1-30 wt % of a fluorine-based resin filler, and has excellent low dielectric properties; and a production method using water as a dispersion medium. Also provided are a molded body including the polyimide composite powder, and a method for producing same.
PI Advanced Materials Co., Ltd. (Republic of Korea)
Inventor
Kim, Dong Young
Won, Dong Young
Choi, Jeong Yeul
Abstract
The present disclosure relates to a method for manufacturing a polyimide film and a polyimide film manufactured thereby. In one embodiment, the method for preparing a polyimide film includes: preparing a polyamic acid by polymerizing a mixture containing an aromatic diamine and an aromatic acid dianhydride; preparing a first composition containing the polyamic acid, an amine-based catalyst, an acid anhydride-based dehydrating agent, and a solvent; and forming a polyimide film at 150° C. or less using the first composition, wherein the first composition contains the amine-based catalyst and the acid anhydride-based dehydrating agent in a molar ratio of 1:2 to 1:5.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Cho, Min-Sang
Back, Sung-Yul
Lee, Kil-Nam
Abstract
The present invention provides a polyimide film and a manufacturing method therefor, the polyimide film having a dielectric dissipation factor (Df) of 0.003 or less, a haze of 3.5% or less, a transmittance of 45% or greater, and a glass transition temperature (Tg) that is equal to or greater than 300℃ and is less than 320℃.
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
94.
HIGHLY ADHESIVE AND LOW-DIALECTRIC POLYIMIDE FILM AND METHOD FOR PRODUCING SAME
PI Advanced Materials Co., Ltd. (Republic of Korea)
Inventor
Back, Sung-Yul
Lee, Kll-Nam
Abstract
Provided herein is a method for manufacturing a polyimide film, the method including the steps of: preparing a polyamic acid solution; preparing a polyamic acid composition by adding a dehydrating agent and an imidizing catalyst to the polyamic acid solution; and applying the polyamic acid to a support to form a film, followed by thermosetting the film in a heater, wherein the thermosetting step comprises a first heating step, a second heating step, and a third heating step, each of the first, the second, and the third step being carried out in a processing temperature range of 100° C. to 550° C.
PI Advanced Materials Co., Ltd. (Republic of Korea)
Inventor
Back, Sung-Yul
Lee, Kil-Nam
Kim, Ki-Hoon
Abstract
Disclosed herein are a highly thick polyimide film that contains a reduced number of bubbles therein and exhibits high elasticity and high heat resistance, and a manufacturing method therefor. The polyimide film is obtained by imidizing a poly(amic acid) solution containing an acid dianhydride component including 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA), 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), and pyromellitic dianhydride (PMDA), and a diamine component including 4,4′-oxydianiline (ODA), para-phenylenediamine (p-phenylenediamine, PPD), and 3,5-diaminobenzoic acid (DABA), and contains a phosphorus (P)-based compound.
PI ADVANCED MATERIALS CO., LTD. (Republic of Korea)
Inventor
Ryu, Han Tae
Cho, Sung Il
Abstract
The present invention relates to the provision of a composite sheet comprising: a polymer foam layer; and polyimide layer(s) laminated on one or both surfaces of the polymer foam layer. The composite sheet according to the present invention exhibits excellent impact resistance in a secondary battery module, provides improved structural stability against external pressure through a polyimide layer with excellent mechanical rigidity, and implements flame retardancy along with cell swelling control, and thus has an excellent advantage of solving the weakness of a secondary battery module.
B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
B32B 5/18 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
H01M 50/242 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by physical properties of casings or racks, e.g. dimensions adapted for protecting batteries against vibrations, collision impact or swelling
97.
POLYIMIDE FILM FOR GRAPHITE SHEET, MANUFACTURING METHOD THEREFOR, AND GRAPHITE SHEET MANUFACTURED THEREFROM
PI Advanced Materials Co., Ltd. (Republic of Korea)
Inventor
Jung, Hyeong Seop
Won, Dong Young
Abstract
Disclosed herein are a polyimide film for graphite sheets, a method of fabricating the same, and a graphite sheet fabricated using the same. The polyimide film is fabricated by imidizing a polyamic acid formed by reaction between a dianhydride monomer and a diamine monomer, wherein the reaction is carried out in the presence of a metal compound and the polyamic acid forms a chelate with metal ions.
PI Advanced Materials Co., Ltd. (Republic of Korea)
Inventor
Back, Sung-Yul
Cho, Min-Sang
Jeon, Jin-Seok
Kim, Ki-Hoon
Lee, Kil-Nam
Abstract
Disclosed herein is a polyimide film that is obtained by imidizing a polyamic acid solution containing two or more dianhydride components selected from the group consisting of 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA), 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), and pyromellitic dianhydride (PMDA), and a diamine component including m-tolidine and p-phenylenediamine (PPD) and has a glass transition temperature (Tg) of 320° C. or higher, a moisture absorption rate of 0.4% or less, and a dielectric dissipation factor (Df) of 0.004 or less.
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 15/18 - Layered products essentially comprising metal comprising iron or steel
99.
POLYIMIDE FILM FOR GRAPHITE SHEET, MANUFACTURING METHOD THEREFOR, AND GRAPHITE SHEET MANUFACTURED THEREFROM
PI Advanced Materials Co., Ltd. (Republic of Korea)
Inventor
Jung, Hyeong Seop
Won, Dong Young
Abstract
Disclosed herein are a polyimide film for graphite sheets, a method of fabricating the same, and a graphite sheet fabricated using the same. The polyimide film is fabricated by imidizing a polyamic acid formed by reaction between a dianhydride monomer and a diamine monomer, wherein the reaction is carried out in the presence of particles of a metal compound having an average particle diameter (D50) of about 1 μm to about 6 μm.
PI Advanced Materials Co., Ltd. (Republic of Korea)
Inventor
Son, Won Ho
Jo, Hyong Sop
Abstract
Disclosed herein are a polyimide film for graphite sheets and a graphite sheet manufactured using the same. The polyimide film is fabricated by imidizing a precursor composition including: a polyamic acid prepared by reacting a dianhydride monomer with a diamine monomer; and an organic solvent, wherein the diamine monomer includes about 30 mol % to about 70 mol % of 4,4′-methylenedianiline and about 30 mol % to about 70 mol % of 4,4′-oxydianiline based on the total number of moles of the diamine monomer, 4,4′-methylenedianiline and 4,4′-oxydianiline being present in total in an amount of about 85 mol % or more based on the total number of moles of the diamine monomer.
C04B 35/52 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxides based on carbon, e.g. graphite
