Abstract

A flexible circuit board is disclosed, including a first insulation layer, a second insulation layer and a circuit layer, wherein the first insulation layer is attached to one side of the circuit layer and the second insulation layer is attached to the other side of the circuit layer, each of the first insulation layer and the second insulation layer is provided with a foldable portion along their length, the foldable portion of the first insulation layer is corresponding in position with the foldable portion of the second insulation layer, and the circuit layer includes a set of power wires and at least one lighting wire. And a method for manufacturing the flexible circuit board, and a LED flexible strip light are also disclosed.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• F21S 4/00 - Lighting devices or systems using a string or strip of light sources
• F21V 19/00 - Fastening of light sources or lamp holders
• F21Y 101/02 - Miniature, e.g. light emitting diodes (LED)

Goods & Services

Standard lamps; light bulbs; ceiling lights; lamps; lighting apparatus and installations; miners' lamps; searchlights; aquarium lights; diving lights; lights for vehicles; lighting apparatus for vehicles; lights for automobiles; tunnel lamps; panel lights; grille lights; table lamps; down lamps; led lights.

Abstract

A flexible neon light for uniformly emitting light comprises a flexible core (1) for transmitting light, a light emitting assembly arranged in the flexible core (1) and a covering layer (2) diffusing light and covering the outside of the flexible core (1). The light emitting assembly comprises several light emitting bodies (3) connected in series, in parallel or in series-parallel. A light diffusing sheath (4) is provided between the light emitting body (3) and the core (1).

IPC Classes  ?

• F21S 4/00 - Lighting devices or systems using a string or strip of light sources
• F21V 5/00 - Refractors for light sources
• F21W 121/00 - Use or application of lighting devices or systems for decorative purposes, not provided for in groups
• F21Y 101/02 - Miniature, e.g. light emitting diodes (LED)

Abstract

A LED lighting fitting comprises a housing (1) and a LED module (2) installed in the housing (1). The LED module (2) comprises at least a white LED, a red LED and a green LED. A diffusing plate (7) is installed in front of the LED module (2), which is connected with heat-dissipating fins (4).

IPC Classes  ?

• F21S 6/00 - Lighting devices intended to be free-standing
• F21S 8/00 - Lighting devices intended for fixed installation
• F21Y 101/02 - Miniature, e.g. light emitting diodes (LED)

Abstract

A method for manufacturing LED involves: preparing a packaging substrate (1); a first metal layer (3) and a second metal layer (2) are formed on upper surface and lower surface of the packaging substrate (1) respectively; a luminous structure is prepared and the luminous structure comprise: a substrate (5), a luminous lamination formed on a substrate (5) and a reflection metal layer (4) formed on a lower surface of the substrate (5); the luminous lamination includes a n-type semiconductor layer (6), a luminous layer (7), a p-type (8) semiconductor layer and a transparent electrode layer (9) and these layers are deposited on the substrate (5) in sequence; the first metal layer (3) on the upper surface of the packaging substrate (1) is bonded with the reflection metal layer (4) on lower surface of the substrate (5) by ultrasonic thermal compress technology.

IPC Classes  ?

• H01L 33/46 - Reflective coating, e.g. dielectric Bragg reflector
• H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
• H01L 33/40 - Materials therefor
• H01L 33/42 - Transparent materials

Abstract

A LED and the manufacturing method of LED .The LED includes: a substrate (16,26,36);a n-type semiconductor layer(15,25,35),which is located on the substrate (16,26,36);a luminous layer (4,14,24,34),which is located on the n-type semiconductor layer(15,25,35);a p-type semiconductor layer (13,23,33),which is located on the luminous layer (4,14,24,34);and a transparent electrode layer (12,22,32),which is located on the p-type semiconductor layer (13,23,33).The upper surface of the transparent electrode layer (12,22,32) has many concavo convex structure .The LED decreases or avoids optical loss which is created by total reflection ,the LED increases the exterior optical efficiency of the LED.

IPC Classes  ?

• H01L 33/22 - Roughened surfaces, e.g. at the interface between epitaxial layers
• H01L 33/42 - Transparent materials

Abstract

A manufacturing method of LED apparatus, luminous surface of the LED and bonding wire area (13,39) are comparted by compartmentation baffle (12,27,38),thereby phosphor is only coated the luminous surface within the process of coating phosphor. The method also can be applied to flip chip structure or perpendicularity of the LED apparatus. The method can manufacture white light LED directly and has no need of packaging process of adopting phosphor within packaging process, thereby the method predigests the manufacturing process of the white light LED.

IPC Classes  ?

• H01L 33/50 - Wavelength conversion elements
• H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof

Abstract

A LED and its manufacturing method are provided. Said LED includes: heat-sink substrate; a metal contact pad which is formed on the heat-sink substrate; a reflecting layer which is formed on the metal contact pad, and a lighting lamilation which is formed on the reflecting layer. The lighting lamination includes a p-type layer, an lighting layer and a n-type layer which are formed successively; two electrode layer which are formed on the back side of the heat-sink substrate and the n-type layer respectively.

IPC Classes  ?

• H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
• H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
• H01L 33/40 - Materials therefor
• H01L 33/64 - Heat extraction or cooling elements

Abstract

A decorative lamp holder, comprises an LED (1), wires (2) connected with the two conductive feet (7) of the LED (1), and an insulated post (3) provided between the two conductive feet (7) of the LED (1). The LED (1) and the connection part of the LED (1) and the wires (2) are provided in a glass cover (4), the glass cover (4) is filled with a waterproof glue (5), and the connection part of the glass cover (4) and the wires (2) is secured by a thermal shrinkage bushing (6). The connection part of the LED (1) and the wires (2) and the interspace between the wires (2) and the glass cover (4) are full filled with the waterproof glue (5). The glass cover (4) may be an enclosed round-head or cusp.

IPC Classes  ?

• F21S 8/00 - Lighting devices intended for fixed installation
• F21V 17/10 - Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
• F21V 31/00 - Gas-tight or water-tight arrangements
• F21W 121/00 - Use or application of lighting devices or systems for decorative purposes, not provided for in groups
• F21Y 101/02 - Miniature, e.g. light emitting diodes (LED)

Abstract

A LED includes: a substrate (8);a n-type semiconductor material layer (7) formed on the face of the substrate (8);a luminous layer (6) formed on the n-type semiconductor material layer (7);a p-type semiconductor material layer (5) formed on the luminous layer (6);a protective layer (2),which covers the p-type semiconductor material layer (5);an anode (1) which penetrates the protective layer (2) and is formed on the p-type semiconductor material layer (5);and a cathode (4) which is surround n-type semiconductor material layer (7) and electric contacts with the n-type semiconductor material layer (7).The invention also provides a package structure having the LED and the method of manufacturing the LED.

IPC Classes  ?

• H01L 33/38 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the electrodes with a particular shape

Abstract

A LED lamp cap comprises: a LED chip (3) mounted on the leadframe (4), a packaging body (2) covering the leadframe (4), two lamp pins (41) extending from the leadframe (4) to the underside of the packaging body (2), wires (6) electrically connected with the packaging body (2) respectively, a partition (5) disposed between the lamp pins (41), an intergrative lamp holder (1) formed to wrap the lamp pins (41) and a part of the wires (6) on the underside of the packaging body (2).

IPC Classes  ?

• H01R 33/06 - Two-pole devices with two current-carrying pins, blades, or analogous contacts, having their axes parallel to each other
• F21V 21/06 - Bases for movable standing lampsFixing standards to the bases
• F21V 31/00 - Gas-tight or water-tight arrangements
• F21Y 101/02 - Miniature, e.g. light emitting diodes (LED)

Abstract

A method of providing light distribution involves directly irradiating a part of light beam emitting from a light source (14) to the outer of a cup for providing light distribution, leading the other light beam emitting from the light source (14) to irradiate the inner wall (12, 13) of the cup, and then reflecting them to the outer of the cup, wherein the light beam directly irradiated forms a rectangular main light spot, and the light beam reflectively irradiated forms a rectangular light spot which superposes with the main light spot and has a shape corresponding to the shape of the main light spot. A cup for providing light distribution includes a base (11) and walls (12, 13), the center of the base (11) is used for installing a light source (14), the base (11) has a shape of rectangular, the interior surfaces of the walls (12,13) are inwardlydished cambered surfaces, and the walls (12, 13) surround the body of the cup and form a rectangular opening. A roadway lamp using the cup includes a lamppost and the cup provided on the top of the lamppost, the inside of the cup is provided with the light source (14), and the long sides of the opening of the cup and the road have the same direction.

IPC Classes  ?

• F21V 7/04 - Optical design
• F21S 8/08 - Lighting devices intended for fixed installation with a standard

Abstract

An LED street lamp, which comprises a base (4) with a cavity, an LED lamp board (61) arranged on the inner wall of the base (4), a reflecting plate (64) and electronic components (5). The LED lamp board (61) and the electronic components (5) are setted apart in the cavity of the base (4). Radiating fins are disposed on the backside of the base (4). The reflecting plate (64) changes the light emission angles of the LEDs so as to guide the light toward the road way.

IPC Classes  ?

• F21S 8/08 - Lighting devices intended for fixed installation with a standard
• F21V 23/00 - Arrangement of electric circuit elements in or on lighting devices
• F21V 31/00 - Gas-tight or water-tight arrangements
• F21V 29/00 - Protecting lighting devices from thermal damageCooling or heating arrangements specially adapted for lighting devices or systems
• F21W 131/103 - Outdoor lighting of streets or roads
• F21Y 101/02 - Miniature, e.g. light emitting diodes (LED)

Abstract

A tip LED comprises a LED chip (1), a frame (2) and a encapsulation layer (3). The top portion of encapsulation layer (3) is a subwarhead shaped swivel (31). The height of swivel (31) is larger than radius of bottom thereof. The bottom diameter of swivel (31) is equal to diameter of root (32) of encapsulation layer (3). The distance from acme (311) of swivel (31) to LED chip (1) is 2.5~3.5 times than diameter of root (32) of encapsulation layer (3). The light emitted from LED chip (1) is concentrated to form a light point at the acme (311) of swivel (31).

IPC Classes  ?

• H01L 33/54 - Encapsulations having a particular shape

Abstract

A color temperture adjustable LED lamp comprising a lamp holder (1) in which a light source (3) is disposed and a lamp socket (2) in which a controlling circuit (6) and a power source (7) are disposed. An adjusting knob (5) is disposed on the lamp socket. The light source (3) is constituted of at least two LED groups (4) arranged on an Al substrate. Each LED group is composed of the LEDs emitting light with the same color temperature, and the LEDs of the diffrenet LED groups emit light with different color temperature. Each LED group is connected in series with a controlling circuit (6), which includes a varistor (61) and a constant current source (62) connected in series. The varistors (61) are controlled by the adjusting knob (5).

IPC Classes  ?

• F21S 10/02 - Lighting devices or systems producing a varying lighting effect changing colours
• F21S 6/00 - Lighting devices intended to be free-standing
• F21S 8/00 - Lighting devices intended for fixed installation
• F21V 23/00 - Arrangement of electric circuit elements in or on lighting devices
• F21Y 101/02 - Miniature, e.g. light emitting diodes (LED)

Abstract

A method for synthesizing warm light with a lower color temperature and a lighting device using the same comprise an LED element (4), phosphor powder (5) which can be excited by the LED element (4), and a sealing colloid (1) for sealing the LED element (4) and the phosphor powder (5). An electrode bracket (2) is led out from the sealing colloid (1) to connect the LED element (4) with an external power supply. The lighting peak wavelength of the LED element (4) is 460-500nm, and the excited lighting peak wavelength of the phosphor powder (5) is 580-630nm.

IPC Classes  ?

• F21S 2/00 - Systems of lighting devices, not provided for in main groups or , e.g. of modular construction
• H01L 33/50 - Wavelength conversion elements
• F21Y 101/02 - Miniature, e.g. light emitting diodes (LED)

Abstract

A method of producing a white light LED lamp and the LED lamp obtained by using such producing method are provided. The white LED lamp includes: a cup (1); a blue chip (2) mounted within the cup (1) and having the light-emitting wavelength within the range of 430-480nm, and a green phosphor layer(3) and a red phosphor layer(4) coated on the blue chip(2) respectively.

IPC Classes  ?

• C09K 11/08 - Luminescent, e.g. electroluminescent, chemiluminescent, materials containing inorganic luminescent materials
• F21V 9/08 - Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters for producing coloured light, e.g. monochromaticElements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters for reducing intensity of light
• H01L 33/50 - Wavelength conversion elements
• H05B 33/10 - Apparatus or processes specially adapted to the manufacture of electroluminescent light sources

Abstract

A heat dissipating structure of LED comprises a translucent cover (1), a chip (3), a base (2), electrode pieces (4) and a heat sink (5). The base (2) is bowl shaped. There is a circular through hole (23) in the center of the base (2). The heat sink (5) is in the through hole (23). The chip (3) is mounted on the heat sink (5). Each electrode of chip (3) is connected to at least two electrode pieces (5). Heat is dissipated through the heat sink (5) and the electrode pieces (4).

IPC Classes  ?

• H01L 33/64 - Heat extraction or cooling elements

Abstract

A method of producing white light and a white light LED obtained by using such producing method are provided. The white light LED comprises a first LED element (4), a second LED element (5), and fluorescent powder (6) activated by light emitted by said first LED element and said second LED element. The peak wavelength of said first LED element (4) is within the range of 430~480nm, the peak wavelength of said second LED element (5) is within the range of 510~555nm, and the activated peak wavelength of the fluorescent powder (6) is within the range of 600~630nm.

IPC Classes  ?

• F21V 9/08 - Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters for producing coloured light, e.g. monochromaticElements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters for reducing intensity of light
• H01L 33/50 - Wavelength conversion elements
• C09K 11/08 - Luminescent, e.g. electroluminescent, chemiluminescent, materials containing inorganic luminescent materials

Abstract

A manufacture method of a LED illuminant lamp device, which includes steps of arranging pattern on a lightguide plate (3); covering a reflective layer (4) on the surface of the lightguide plate (3) which has the pattern, and attaching the reflective surface of the reflective layer (4) to the surface which has the pattern; covering a diffusing layer (2) on the surface opposite to the surface of the lightguide plate (3) which has the pattern; arranging the circuit board (5) with LEDs (6) on the edge of the lighguide plate (3); fixing the reflective layer (4), the lightguide plate (3), the diffusing layer (2) and the circuit board (5) as an integer with a frame (1). The LEDs are high power LEDs. Since a diffusing layer, a lightguide plate, a reflective layer and high power LEDs are properly used, the structure and the manufacture technology are simple, the glare problem in prior illuminant lamp device is solved. The light is bright and soft, not glare, and power consumption is low. It can be used as an illuminant lamp device or a decorated lamp device.

IPC Classes  ?

• F21S 2/00 - Systems of lighting devices, not provided for in main groups or , e.g. of modular construction

Abstract

A lamp integrated with an umbrella includes a cover (2) and a lamp plate (1) providing a circuit board, a control chip and a power. Both the cover (2) and the lamp plate (1) are formed into disks with an U-shaped opening. The two U-shaped openings are combined to form an U-shaped slot (9) when the cover (2) and the lamp plate (1) are assembled. A lock device (6) is provided in the slot (9), which is a spring set or a pinchcock with a rubber member. A block (14) in the slot (9) is fitted on the lamp body to prevent the lamp from falling off the stick.

IPC Classes  ?

• A45B 3/04 - Sticks combined with other objects with illuminating devices electrical
• F21V 33/00 - Structural combinations of lighting devices with other articles, not otherwise provided for

Abstract

A flexible neon light comprises a core line (02), an LED lamp string arranged in the core line (02), a scatter body (08) arranged over the core line, a covering layer (14) covering the outside of the core line (02) and the scatter body (08), the LED lamp string is a double-chips LED lamp string, there are two LED chips arranged side by side in each LED bulb (04a, 04b), and the two LED chips are connected in parallel, the double-chips LED lamp string extend in a length same as the length of the light body of the neon light. The scatter body (08) and the covering layer (14) are a molding body that is extruded out, and both of them are integrated. The scatter body (08) is a strip shape body which is extruded out with flexible transparent plastic. The covering layer (14) is a plastic layer which is extruded out to be molded with flexible transparent plastic.

IPC Classes  ?

• F21S 4/00 - Lighting devices or systems using a string or strip of light sources

Abstract

An improved structure of a color changeable soft-tube light comprises an opaque core line, a plurality of LEDs disposed within the core line, a translucent diffuser placed over the LEDs and its length being equal to the core line, and a jacket surrounding the core line and the translucent diffuser and its length being also equal to the core line. The jacket is integrally extruded and moulded on the outer portions of the core line and the diffuser. The LEDs are divided into many groups, each of which comprises a red LED, a green LED and a blue LED, and each of which is placed into a fixing device to form a unit. A plurality of the units are connected in series and placed into the transversal through-holes locating in the core line. The fixing device can be a box, which is quadrate, circular or elliptical. The improved structure of the soft-tube light simulation can afford a color changeable, color mixable, and chromatically versatile fixture, which can have the same uniform and sequential effect as neon light. Therefore, it can achieve the aim that is desired and pursued in the soft-tube light industry.

IPC Classes  ?

• F21S 4/00 - Lighting devices or systems using a string or strip of light sources
• F21S 10/00 - Lighting devices or systems producing a varying lighting effect
• F21V 23/00 - Arrangement of electric circuit elements in or on lighting devices

Abstract

A flexible tubular light having the effect of flowing flicker comprises a transparent inner cladding layer, a plurality of PCB boards which are connected each other in string and are provided within the through-hole of the inner cladding layer. Each PCB board is provided with a plurality of LEDs, series current limiting resistances corresponding quantity and chips for driving LEDs. The PCB boards are connected into the copper strands of the inner cladding layer in parallel. The signal wires of the LED driving chips are connected with the controller in series. A transparent outer cladding layer encloses the inner cladding layer. The LED driving chips comprise serial shift registers and output registers, adopt concatenation in bridge and supply currents for driving output. The main-wires are provided on the PCB boards, and the main-wires of the adjacent PCB boards are connected in parallel.

IPC Classes  ?

• F21S 4/00 - Lighting devices or systems using a string or strip of light sources
• F21V 23/00 - Arrangement of electric circuit elements in or on lighting devices

Abstract

The new type light hose has a flexible strip (2) several flexible boards (03) with multiple light emitting diodes (04),a strip-shaped transparent molded part (07) for scattering the light and a jacket (13) for wrapping up the flexible strip (2) The strip is of rectangular cross-section with continuous through hole (05)and a slit (06) for fitting the boards. At least two parallel copper wires are inside the sidewall of the strip. The jacket is integrated with the strip-shaped transparent molded part. The strip-shaped transparent molded part has a semicircular cross-section surface (09) so that the light hose emits a uniform and soft light.

IPC Classes  ?

• F21S 4/00 - Lighting devices or systems using a string or strip of light sources
• F21V 21/00 - Supporting, suspending, or attaching arrangements for lighting devicesHand grips

Abstract

A light string comprises a string extruded from soft plastic with predeterminate length and rectangular cross section, in which a rectangular through-hole provided in the string along longitudinal direction; at least two copper stranded wires provided with up-and-down spacing in the cross section along longitudinal direction, a plurality of flexible string circuit boards with LEDs provided in the rectangular through-hole, a translucent scattering body provided above the LEDs, and a cladding layer enclosing both the rectangular bar and the scattering body. The cladding layer can be integrated with the scattering body. The light string of the present invention has the effect of even and continuous light rays, simulating a neon light. The light string can be cut and connected continuously, and can be bent optionally in its installing surface.

IPC Classes  ?

• F21S 4/00 - Lighting devices or systems using a string or strip of light sources
• F21V 21/00 - Supporting, suspending, or attaching arrangements for lighting devicesHand grips
• F21V 5/04 - Refractors for light sources of lens shape