A composition comprising
(a1) a polyether polyol,
(a2) a polyolefine polyol and
(a3) a polyester polyol obtainable by epoxidation of an unsaturated fatty acid ester and
subsequent ring-opening reaction with a compound containing active hydrogen, can be used for the preparation of PUR foam which distinguishes by low-temperature flexibility and low dielectric loss and is suitable for filling the gap between the condenser core and the outer composite or porcelain insulator in the manufacture of resin impregnated paper (RIP) bushings.
C08G 18/62 - Polymers of compounds having carbon-to-carbon double bonds
C08G 18/76 - Polyisocyanates or polyisothiocyanates cyclic aromatic
C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof
C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
C08L 19/00 - Compositions of rubbers not provided for in groups
H01B 3/42 - Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes polyesters, polyethers, polyacetal
2.
METHOD FOR ENCAPSULATING ELECTRICAL CELLS BEARING A NICKEL-BASED SURFACE
The present invention is directed to a method for encapsulating an article bearing a surface made of nickel, in particular an electrical component bearing a surface made of nickel, with a thermosetting polymer material as encapsulation material. The invention is also directed to kits of materials for encapsulating an article bearing a surface made of nickel and to articles resulting from the encapsulation. The method of the invention is based on application of a first coating based on a polymeric material of acrylic-based type between the article bearing a nickel-based surface and the encapsulation material.
B32B 15/092 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising epoxy resins
B32B 15/095 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyurethanes
C09D 133/08 - Homopolymers or copolymers of acrylic acid esters
C09D 133/10 - Homopolymers or copolymers of methacrylic acid esters
C09D 133/12 - Homopolymers or copolymers of methyl methacrylate
H01M 50/124 - Primary casingsJackets or wrappings characterised by the material having a layered structure
H01M 50/129 - Primary casingsJackets or wrappings characterised by the material having a layered structure comprising three or more layers with two or more layers of only organic material
The present disclosure generally relates to a one-component cationic polymerizable composition including an aromatic epoxy resin, an epoxy reactive diluent, a cationic polymerization initiator, a free radical forming compound and optionally a carboxylic acid and its use in impregnation processes.
C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
C09D 163/00 - Coating compositions based on epoxy resinsCoating compositions based on derivatives of epoxy resins
C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
H01B 3/40 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes epoxy resins
H02K 3/30 - Windings characterised by the insulating material
4.
LOW DIELECTRIC RESIN COMPOSITION AND AN ARTICLE OF MANUFACTURE PREPARED THEREFROM
The present disclosure generally relates to a resin composition having a low dielectric constant (Dk) and a low dielectric dissipation factor (Df) including a crosslinker selected from a vinylbenzyl indene compound, a vinylbenzyl fluorene compound and a mixture thereof and a resin selected from a polyphenylene ether derivative, a hydrocarbon thermoplastic and a compound containing one or more maleimide groups.
C08F 212/32 - Monomers containing only one unsaturated aliphatic radical containing two or more rings
C08F 283/06 - Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass on to polyethers, polyoxymethylenes or polyacetals
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
The present disclosure generally relates to a one component epoxy resin-based composition including an epoxy resin, a reactive diluent, a cyanoacetamide derived from a cycloaliphatic-type diamine and a polyoxyalkylene amine, a protected base in the form of an adduct or salt which can release a base upon heating at a temperature of greater than about 50° C. and a polyacid and its use in trickle impregnation processes.
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
C09D 163/00 - Coating compositions based on epoxy resinsCoating compositions based on derivatives of epoxy resins
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
H02K 3/30 - Windings characterised by the insulating material
6.
METHOD TO AVOID CRACKS IN ENCAPSULATION OF SHARP-EDGED INSERTS
A method to encapsulate inserts with an encapsulation resin, said method comprising: a. Applying on part or all of the surface of the insert a coating layer of a thermosetting material, b. Curing the coating layer resulting from step a., c. Encapsulating the coated insert resulting from step b. with an encapsulation resin.
B29C 39/10 - Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressureApparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
B29C 39/12 - Making multilayered or multicoloured articles
B29C 39/02 - Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressureApparatus therefor for making articles of definite length, i.e. discrete articles
B29C 39/00 - Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressureApparatus therefor
H01B 3/30 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes
H01B 3/40 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes epoxy resins
The present invention relates to a curable two-part resin system having a resin part containing at least one cycloaliphatic epoxy resin and a hardener part containing (i) at least one alicyclic anhydride, and (ii) a block-copolymer having polysiloxane blocks and organic blocks, and containing greater than 60 wt % of an inorganic filler.
Ultra-low loss curable hydrocarbon resin compositions comprising vinylbenzyl compounds, a method for the preparation thereof and their use for the manufacture of articles which find application in the electric/electronic industries.
C08G 61/02 - Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
C08L 65/00 - Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chainCompositions of derivatives of such polymers
C09D 165/00 - Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chainCoating compositions based on derivatives of such polymers
C08F 12/00 - Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
C07C 13/465 - IndenesCompletely or partially hydrogenated indenes
C08F 232/08 - Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having condensed rings
9.
A POLYOL COMPOSITION FOR THE PRODUCTION OF POLYURETHANE FOAMS SUITABLE FOR FILLING HOLLOW CORE INSULATORS
The invention relates to a polyol composition comprising, based on the total weight of the composition al) from 35% to 90% by weight of one or more polyether polyols having an average hydroxyl functionality of greater than 2, a2) from 10% to 50% by weight of castor oil, a3) from 5% to 30% by weight of one or more mineral oil, a4) from 0.05% to 10% by weight of one or more foam stabilizing agent, wherein at least 80% by weight of the total weight of polyols in the composition is provided by the polyether polyol a1) and the castor oil a2). The invention also relates to a two-constituent composition for the production of polyurethane foams comprising the polyol composition and a polyisocyanate compound. The invention further relates to the use of the polyurethane foams prepared from this composition for filling hollow core insulators, as well as to the hollow core insulator filled with the polyurethane foam.
C08K 5/5415 - Silicon-containing compounds containing oxygen containing at least one Si—O bond
H01B 3/18 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances
H01B 17/58 - Tubes, sleeves, beads or bobbins through which the conductor passes
H01B 3/30 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes
This disclosure generally provides compositions with improved thermal aging resistance, crack resistance and flux compatibility, wherein the resin composition comprising: (a) an epoxy resin comprising a compound having two or more epoxy groups per molecule; (b) a binder comprising a compound having at least one carboxyl group per molecule; (c) a photopolymerization initiator; and (d) a filler composition comprising silica, talc and wollastonite.
The present invention relates to a heat-curable-reaction-resin mixture suitable for impregnation or encapsulation material for coils, stators, rotors in electric engine, which reaction-resin mixture comprises: a) A polyfunctional isocyanate, b) An epoxy resin composition predominantly comprising a compound A based on glycidyl ether of aliphatic and / or cycloaliphatic alcohols having at least 2 alcohol functionalities, or a compound B based on glycidyl esters of aliphatic and / or cycloaliphatic carbonic acids having at least 2 carboxylic acid functionalities, c) A cure accelerator, wherein the cure accelerator is based on boron trichloride-amine complex.
C08G 18/76 - Polyisocyanates or polyisothiocyanates cyclic aromatic
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
The present invention relates to a heat-curable-reaction-resin mixture suitable for impregnation or encapsulation material for coils, stators, rotors in electric engine, which reaction-resin mixture comprises: a) A polyfunctional isocyanate, b) An epoxy resin composition predominantly comprising a compound A based on glycidyl ether of aliphatic and / or cycloaliphatic alcohols having at least 2 alcohol functionalities, or a compound B based on glycidyl esters of aliphatic and / or cycloaliphatic carbonic acids having at least 2 carboxylic acid functionalities, c) A cure accelerator, wherein the cure accelerator is based on boron trichloride-amine complex.
C08G 18/76 - Polyisocyanates or polyisothiocyanates cyclic aromatic
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
13.
LOW DIELECTRIC RESIN COMPOSITION AND AN ARTICLE OF MANUFACTURE PREPARED THEREFROM
The present disclosure generally relates to a resin composition having a low dielectric constant (Dk) and a low dielectric dissipation factor (Df) including a crosslinker selected from a vinylbenzyl indene compound, a vinylbenzyl fluorene compound and a mixture thereof and a resin selected from a polyphenylene ether derivative, a hydrocarbon thermoplastic and a compound containing one or more maleimide groups.
The present disclosure generally relates to a resin composition having a low dielectric constant (Dk) and a low dielectric dissipation factor (Df) including a crosslinker selected from a vinylbenzyl indene compound, a vinylbenzyl fluorene compound and a mixture thereof and a resin selected from a polyphenylene ether derivative, a hydrocarbon thermoplastic and a compound containing one or more maleimide groups.
The present disclosure generally relates to a one component epoxy resin-based composition including an epoxy resin, a reactive diluent, a cyanoacetamide derived from a cycloaliphatic-type diamine and a polyoxyalkylene amine, a protected base in the form of an adduct or salt which can release a base upon heating at a temperature of greater than about 50°C and a polyacid and its use in trickle impregnation processes.
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
The present disclosure generally relates to a one component epoxy resin-based composition including an epoxy resin, a reactive diluent, a cyanoacetamide derived from a cycloaliphatic-type diamine and a polyoxyalkylene amine, a protected base in the form of an adduct or salt which can release a base upon heating at a temperature of greater than about 50°C and a polyacid and its use in trickle impregnation processes.
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
The present invention relates to a curable two-part resin system having a resin part containing at least one cycloaliphatic epoxy resin and a hardener part containing (i) at least one alicyclic anhydride, and (ii) a block-copolymer having polysiloxane blocks and organic blocks, and containing greater than 60 wt% of an inorganic filler.
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
C08G 59/42 - Polycarboxylic acidsAnhydrides, halides, or low-molecular-weight esters thereof
The present invention relates to a curable two-part resin system having a resin part containing at least one cycloaliphatic epoxy resin and a hardener part containing (i) at least one alicyclic anhydride, and (ii) a block-copolymer having polysiloxane blocks and organic blocks, and containing greater than 60 wt% of an inorganic filler.
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
C08G 59/42 - Polycarboxylic acidsAnhydrides, halides, or low-molecular-weight esters thereof
The disclosure relates to a curable two-component resin-based system, comprising
(a) a resin component, comprising (i) at least one epoxy resin, (ii) a block-copolymer comprising silicone and organic blocks, (iii) a silane, and (iv) a filler comprising aluminium oxide and wollastonite, and
(b) a hardener component, comprising at least one polyoxyalkylene polyamine,
wherein the curable system contains in total >60 wt % filler with a ratio of wollastonite to aluminium oxide of 50 to 75 wt % wollastonite and 25 to 50 wt % aluminium oxide, and wherein the hardener component (b) does not comprise any anhydride, as well as cured articles obtainable by curing the curable system and uses thereof.
This disclosure generally provides compositions with improved thermal aging resistance, crack resistance and flux compatibility, wherein the resin composition comprising: (a) an epoxy resin comprising a compound having two or more epoxy groups per molecule; (b) a binder comprising a compound having at least one carboxyl group per molecule; (c) a photopolymerization initiator; and (d) a filler composition comprising silica, talc and wollastonite.
The disclosure relates to an accelerator composition for the cure of epoxy resins with aromatic amines comprising: (a) a metal complex with carboxylate ligands; and (b) a boron trifluoride amine complex or a boron trifluoride phenol complex. The disclosure also relates to a curing composition for the cure of epoxy resin comprising: (i) an aromatic amine as curing agent; and (ii) the above accelerator composition or, alternatively, a mixture of (1) a metal complex with carboxylate ligands and (2) neat boron trifluoride or boron trifluoride etherate for in-situ formation of a boron trifluoride amine complex with the aromatic amine . Additionally, the disclosure relates to the use of such compositions and to a cured resin product obtainable from the use of such compositions.
C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
23.
Compositions for use in impregnation of paper bushings
The disclosure relates to a curable mixture for use in impregnation of paper bushings comprising a resin mixture of a bisphenol-A-diglycidylether (BADGE) and a bisphenol-F-diglycidylether (BFDGE), methyltetrahydrophthalic anhydride (MTHPA) as hardener, and an accelerator selected from the group consisting of tertiary alkylamine aminoethylalcohols and corresponding ethers thereof as well as paper bushings impregnated with such mixture and uses of such mixture.
H01B 3/52 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials woodInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials paperInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials pressboard
Disclosed are a storage stable resin composition, comprising an epoxy resin, a block-copolymer with silicone and organic blocks, and a silane, a process for obtaining such storage stable resin composition, a curable resin composition obtainable from the above storage stable resin composition as well as a cured article obtainable from the latter and uses thereof.
The disclosure relates to a curable two-component resin-based system, comprising (a) a resin component, comprising (i) at least one epoxy resin, (ii) a block-copolymer comprising silicone and organic blocks, (iii) a silane, and (iv) a filler comprising aluminium oxide and wollastonite, and (b) a hardener component, comprising at least one polyoxyalkylene polyamine, wherein the curable system contains in total > 60 wt% filler with a ratio of wollastonite to aluminium oxide of 50 to 75 wt% wollastonite and 25 to 50 wt% aluminium oxide, and wherein the hardener component (b) does not comprise any anhydride, as well as cured articles obtainable by curing the curable system and uses thereof.
The disclosure relates to a curable two-component resin-based system, comprising (a) a resin component, comprising (i) at least one epoxy resin, (ii) a block-copolymer comprising silicone and organic blocks, (iii) a silane, and (iv) a filler comprising aluminium oxide and wollastonite, and (b) a hardener component, comprising at least one polyoxyalkylene polyamine, wherein the curable system contains in total > 60 wt% filler with a ratio of wollastonite to aluminium oxide of 50 to 75 wt% wollastonite and 25 to 50 wt% aluminium oxide, and wherein the hardener component (b) does not comprise any anhydride, as well as cured articles obtainable by curing the curable system and uses thereof.
16 - Paper, cardboard and goods made from these materials
Goods & Services
Adhesives for stationery and household use; Adhesives for stationery or household purposes; strong adhesives for stationery and household purposes; adhesive materials for office use; adhesives for do-it-yourself purposes
12 dialkylamino groups, cyano groups or halogen atoms, n is 1 or 2; and (C) a protected base in the form of an adduct or salt which is able to release a basic compound upon heating to a temperature greater than 70° C., is storage-stable, allows processing over a longer period of time (pot-life) and produces cured products having outstanding mechanical and thermal properties.
C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
The present disclosure relates to an adhesive composition comprising one or more (meth)acrylate ester monomers, a catalyst system and a retarding additive, wherein the retarding additive is a secondary amine; and to the use of secondary amines as retarding agents for adhesive compositions comprising methacrylate monomers.
The present disclosure relates to an adhesive composition comprising one or more (meth)acrylate ester monomers, a catalyst system and a retarding additive, wherein the retarding additive is a secondary amine; and to the use of secondary amines as retarding agents for adhesive compositions comprising methacrylate monomers.
The present disclosure is related to an accelerator composition for the cure of polyfunctional isocyanates with epoxy resins comprising (a) a boron trihalide-amine complex, and (b) a quaternary ammonium or phosphonium halide as well as the use of such accelerator composition, cured isocyanate-epoxy resin products obtainable therefrom and a method of making a cured isocyanate-epoxy resin product.
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
C08G 18/00 - Polymeric products of isocyanates or isothiocyanates
The present disclosure is related to an accelerator composition for the cure of polyfunctional isocyanates with epoxy resins comprising (a) a boron trihalide-amine complex, and (b) a quaternary ammonium or phosphonium halide as well as the use of such accelerator composition, cured isocyanate-epoxy resin products obtainable therefrom and a method of making a cured isocyanate-epoxy resin product.
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
The disclosure relates to an accelerator composition for the cure of epoxy resins with aromatic amines comprising: (a) a metal complex with carboxylate ligands; and (b) a boron trifluoride amine complex or a boron trifluoride phenol complex. The disclosure also relates to a curing composition for the cure of epoxy resin comprising: (i) an aromatic amine as curing agent; and (ii) the above accelerator composition or, alternatively, a mixture of (1) a metal complex with carboxylate ligands and (2) neat boron trifluoride or boron trifluoride etherate for in-situ formation of a boron trifluoride amine complex with the aromatic amine. Additionally, the disclosure relates to the use of such compositions and to a cured resin product obtainable from the use of such compositions.
C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
The disclosure relates to an accelerator composition for the cure of epoxy resins with aromatic amines comprising: (a) a metal complex with carboxylate ligands; and (b) a boron trifluoride amine complex or a boron trifluoride phenol complex. The disclosure also relates to a curing composition for the cure of epoxy resin comprising: (i) an aromatic amine as curing agent; and (ii) the above accelerator composition or, alternatively, a mixture of (1) a metal complex with carboxylate ligands and (2) neat boron trifluoride or boron trifluoride etherate for in-situ formation of a boron trifluoride amine complex with the aromatic amine. Additionally, the disclosure relates to the use of such compositions and to a cured resin product obtainable from the use of such compositions.
C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
The disclosure relates to a curable mixture, in particular for use in impregnation of paper bushings, comprising (a) a resin composition comprising a bisphenol-A-diglycidylether; a polyglycidylether different from BADGE and/or a cycloaliphatic epoxy resin; a N-glycidyl component; a nano-size or dissolvable toughener; and a silane component, and b) a hardener composition comprising methyltetrahydrophthalic anhydride (MTHPA) and at least one curing accelerator as well as paper bushings impregnated with such mixture and uses of such mixture.
H01B 3/52 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials woodInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials paperInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials pressboard
The disclosure relates to a curable mixture for use in impregnation of paper bushings comprising a resin mixture of a bisphenol-A-diglycidylether (BADGE) and a bisphenol-F-diglycidylether (BFDGE), methyltetrahydrophthalic anhydride (MTHPA) as hardener, and an accelerator selected from the group consisting of tertiary alkylamine aminoethylalcohols and corresponding ethers thereof as well as paper bushings impregnated with such mixture and uses of such mixture.
H01B 3/52 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials woodInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials paperInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials pressboard
C08G 59/42 - Polycarboxylic acidsAnhydrides, halides, or low-molecular-weight esters thereof
37.
CURABLE MIXTURES FOR USE IN IMPREGNATION OF PAPER BUSHINGS
The disclosure relates to a curable mixture, in particular for use in impregnation of paper bushings, comprising (a) a resin composition comprising a bisphenol-A-diglycidylether; a polyglycidylether different from BADGE and/or a cycloaliphatic epoxy resin; a N-glycidyl component; a nano-size or dissolvable toughener; and a silane component, and b) a hardener composition comprising methyltetrahydrophthalic anhydride (MTHPA) and at least one curing accelerator as well as paper bushings impregnated with such mixture and uses of such mixture.
H01B 3/52 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials woodInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials paperInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials pressboard
C08G 59/42 - Polycarboxylic acidsAnhydrides, halides, or low-molecular-weight esters thereof
The disclosure relates to a curable mixture for use in impregnation of paper bushings comprising a resin mixture of a bisphenol-A-diglycidylether (BADGE) and a bisphenol-F-diglycidylether (BFDGE), methyltetrahydrophthalic anhydride (MTHPA) as hardener, and an accelerator selected from the group consisting of tertiary alkylamine aminoethylalcohols and corresponding ethers thereof as well as paper bushings impregnated with such mixture and uses of such mixture.
H01B 3/52 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials woodInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials paperInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials pressboard
C08G 59/42 - Polycarboxylic acidsAnhydrides, halides, or low-molecular-weight esters thereof
Disclosed are a storage stable resin composition, comprising an epoxy resin, a block-copolymer with silicone and organic blocks, and a silane, a process for obtaining such storage stable resin composition, a curable resin composition obtainable from the above storage stable resin composition as well as a cured article obtainable from the latter and uses thereof.
Disclosed are a storage stable resin composition, comprising an epoxy resin, a block-copolymer with silicone and organic blocks, and a silane, a process for obtaining such storage stable resin composition, a curable resin composition obtainable from the above storage stable resin composition as well as a cured article obtainable from the latter and uses thereof.
This disclosure relates to a fire-retardant composite material comprising a fibre-reinforced plastic covered by an aluminium foil and its application in passenger transport industries such as aerospace, railway or marine.
B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
B32B 5/26 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer another layer also being fibrous or filamentary
B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B32B 19/04 - Layered products essentially comprising natural mineral fibres or particles, e.g. asbestos, mica next to another layer of a specific substance
B32B 19/06 - Layered products essentially comprising natural mineral fibres or particles, e.g. asbestos, mica next to a fibrous or filamentary layer
B32B 3/12 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. apertured or formed of separate pieces of material characterised by a layer of regularly-arranged cells whether integral or formed individually or by conjunction of separate strips, e.g. honeycomb structure
42.
VALVE DEVICE, LID ASSEMBLY, CONTAINER AND USAGE THEREOF
A valve device is disclosed. The valve device comprises a valve component (200) and a membrane component(300). The valve component (200) comprises a bottom cover (210) with one or more first apertures (211); a top cover (220) with one or more second apertures (221), wherein the bottom cover (210) and the top cover (220) enclose a venting chamber (230); a plate (240) accommodated inside the venting chamber (230) and being pressed by one or more projections (222) attaching to the top cover (220) against the one or more second apertures (211) on the bottom cover (210); and wherein silicon oil (250) is provided between the bottom cover (210) and the plate (240); and wherein the plate (240) has a diameter between 5mm and 20mm. The membrane component (300) comprises a membrane (320) made from hydrophobic material.
A multiple component anhydride-free, thermosetting epoxy resin composition comprising, (A) at least one epoxy resin, and (B) at least one curing agent selected from the group of (b1) a polyetheramine of the formula (1) (Formula (1)), wherein x is a number of from 2 to 8, and (b2) a polyetheramine with at least one terminal end group of the formula (2) (Formula (2)), and (C) at least one epoxy silane, is, in particular, suitable for the manufacture of instrument transformers and dry-type transformers by casting, potting and encapsulation processes, wherein said articles exhibit good mechanical, electrical and dielectrical properties.
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
H01B 3/40 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes epoxy resins
44.
A THERMOSETTING EPOXY RESIN COMPOSITION FOR THE PREPARATION OF ARTICLES FOR ELECTRICAL ENGINEERING, AND THE ARTICLES OBTAINED THEREFROM
A multiple component anhydride-free, thermosetting epoxy resin composition comprising, (A) at least one epoxy resin, and (B) at least one curing agent selected from the group of (b1) a polyetheramine of the formula (1) (Formula (1)), wherein x is a number of from 2 to 8, and (b2) a polyetheramine with at least one terminal end group of the formula (2) (Formula (2)), and (C) at least one epoxy silane, is, in particular, suitable for the manufacture of instrument transformers and dry-type transformers by casting, potting and encapsulation processes, wherein said articles exhibit good mechanical, electrical and dielectrical properties.
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
H01B 3/40 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes epoxy resins
A curable composition comprising (A) an epoxy resin containing on average more than one epoxy group per molecule; (B) a compound of formula A[-X-CO-CH2-CN]n (1), wherein A is hydrogen or C1-C12 alkyl which is unsubstituted or substituted by one or more C1-C12 alkoxy groups, C1-C12 alkylcarbonyl groups, C7-C25 arylcarbonyl groups, hydroxyl groups, amino groups, C1-C12 alkylamino groups, C1-C12 dialkylamino groups, cyano groups or halogen atoms, or A is a bivalent aliphatic, cycloaliphatic, aromatic, araliphatic or heterocyclic organic radical, X denotes -O- or -NR1-, wherein R1 is hydrogen or C1-C12 alkyl which is unsubstituted or substituted by one or more Ci-Ci2 alkoxy groups, C1-C12 alkylcarbonyl groups, C7-C25 arylcarbonyl groups, hydroxyl groups, amino groups, C1-C12 alkylamino groups, C1-C12 dialkylamino groups, cyano groups or halogen atoms, n is 1 or 2; and (C) a protected base in the form of an adduct or salt which is able to release a basic compound upon heating to a temperature greater than 70 °C, is storage-stable, allows processing over a longer period of time (pot-life) and produces cured products having outstanding mechanical and thermal properties.
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C09D 163/00 - Coating compositions based on epoxy resinsCoating compositions based on derivatives of epoxy resins
C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
A curable composition comprising (A) an epoxy resin containing on average more than one epoxy group per molecule; (B) a compound of formula A[-X-CO-CH2-CN]n (1), wherein A is hydrogen or C1-C12 alkyl which is unsubstituted or substituted by one or more C1-C12 alkoxy groups, C1-C12 alkylcarbonyl groups, C7-C25 arylcarbonyl groups, hydroxyl groups, amino groups, C1-C12 alkylamino groups, C1-C12 dialkylamino groups, cyano groups or halogen atoms, or A is a bivalent aliphatic, cycloaliphatic, aromatic, araliphatic or heterocyclic organic radical, X denotes -O- or -NR1-, wherein R1 is hydrogen or C1-C12 alkyl which is unsubstituted or substituted by one or more Ci-Ci2 alkoxy groups, C1-C12 alkylcarbonyl groups, C7-C25 arylcarbonyl groups, hydroxyl groups, amino groups, C1-C12 alkylamino groups, C1-C12 dialkylamino groups, cyano groups or halogen atoms, n is 1 or 2; and (C) a protected base in the form of an adduct or salt which is able to release a basic compound upon heating to a temperature greater than 70 °C, is storage-stable, allows processing over a longer period of time (pot-life) and produces cured products having outstanding mechanical and thermal properties.
Disclosed is an anhydride-free insulation system for insulating an electrical conductor or a coil of conductors, comprising: (a) a liquid epoxy resin formulation comprising at least 80% by weight, based on the liquid epoxy resin bath formulation, of bisphenol A diglycidyl ether, (b) a mica tape comprising a mica paper adhered by means of a binder to a support (c) an imidazole compound of the formula (I) wherein R1, R2 and R3 are individually selected from hydrogen, branched or unbranched C1-C4-alkyl, phenyl and benzyl, provided that at least one of R1 and R2 is hydrogen.
H01B 3/04 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances mica
48.
ELECTRICAL INSULATION SYSTEM BASED ON EPOXY RESINS FOR GENERATORS AND MOTORS
Disclosed is an anhydride-free insulation system for current-carrying construction parts of an electric engine which comprises: (A) a mica paper or mica tape for wrapping parts of said electric engine that are potentially current-carrying during operation of the engine, which mica paper or mica tape is impregnable via vacuum pressure impregnation with a thermally curable epoxy resin formulation and comprises a complex of boron trihalogenide with an amine of the formula BX3 . NR1R2R3 or R1R2N-A-NR1 R2, wherein X denotes halogen, R1, R2 and R3 are each independently of the others hydrogen, C1-C12alkyl, C5-C30aryl, C6-C36aralkyl or C6-C14cycloalkyl, which can be unsubstituted or substituted by one or more C1- C12alkyl groups, A is a bivalent aliphatic aromatic or cycloaliphatic radical; (B) a thermally curable bath formulation for the vacuum pressure impregnation comprising bisphenol A diglycidyl ether and optionally bisphenol F diglycidyl ether, which formulation is substantially or, preferably, entirely free of thermally activatable curing initiators for the epoxy resin formulation.
H01B 3/04 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances mica
H01B 3/40 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes epoxy resins
H02K 3/30 - Windings characterised by the insulating material
H02K 15/12 - Impregnating, moulding insulation, heating or drying of windings, stators, rotors or machines
Disclosed is an anhydride-free insulation system for current-carrying construction parts of an electric engine which comprises: (A) a mica paper or mica tape for wrapping parts of said electric engine that are potentially current-carrying during operation of the engine, which mica paper or mica tape is impregnable via vacuum pressure impregnation with a thermally curable epoxy resin formulation and comprises one or more thermally activatable sulfonium salt initiators for the homopolymerisation of the epoxy resins present in said said thermally curable epoxy resin formulation or a mixture thereofin an amount sufficient to homopolymerize the epoxy resin taken up by the mica paper or mica tape and the construction part of the engine during the vacuum pressure impregnation step; (B) a thermally curable bath formulation for the vacuum pressure impregnation comprising (i)a polyglycidyl ether or a mixture thereof, and (ii)a cycloaliphatic epoxy resin comprising at least two epoxy groups, which are fused to a cycloaliphatic ring, or a mixture thereof, which formulation is substantially or, preferably, entirely free of thermally activatable curing initiators for the epoxy resin formulation.
H01B 3/04 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances mica
Resin-rich mica tapes comprising one or more than one layer of mica paper and one or more than one layer of a nonmetallic inorganic fabric, in particular a glass fabric, which are pre- impregnated with an impregnation resin composition comprising an epoxy resin with more than one epoxy group, which is solid or semisolid at ambient temperature, a latent curing agent for said epoxy resin, about 5 to about 20% by weight of hexagonal boron nitride of a particle size (D50) of equal or less than about 3 μm, about 0.05 to about 1 % by weight of a wetting agent and a suitable solvent which is removed after pre-impregnation of the mica tape with the impregnation resin mixture are useful to prepare electrical insulations with excellent thermal conductivity and dielectric dissipation factor.
H01B 3/04 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances mica
H01B 3/40 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes epoxy resins
H01B 3/50 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials fabric
B32B 19/02 - Layered products essentially comprising natural mineral fibres or particles, e.g. asbestos, mica bonded with or embedded in a plastic substance
51.
A PROCESS FOR THE PREPARATION OF INSULATION SYSTEMS FOR ELECTRICAL ENGINEERING, THE ARTICLES OBTAINED THEREFROM AND THE USE THEREOF
A process for the preparation of insulation systems for electrical engineering by automatic pressure gelation (APG) or vacuum casting, wherein a multiple component thermosetting resin composition is used, said resin composition comprising (A) at least one epoxy resin, (B) at least one carboxylic acid anhydride curing agent, and (C) 2,4,6-tris(dimethylaminomethyl)phenol, provides encased articles exhibiting good mechanical, electrical and dielectrical properties which can be used as, for example, insulators, bushings, switchgears and instrument transformers.
H01B 3/40 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes epoxy resins
A process for the preparation of insulation systems for electrical engineering by automatic pressure gelation (APG) or vacuum casting, wherein a multiple component thermosetting resin composition is used, said resin composition comprising (A) at least one epoxy resin, (B) at least one carboxylic acid anhydride curing agent, and (C) 2,4,6-tris(dimethylaminomethyl)phenol, provides encased articles exhibiting good mechanical, electrical and dielectrical properties which can be used as, for example, insulators, bushings, switchgears and instrument transformers.
H01B 3/40 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes epoxy resins
Disclosed is a mica paper or mica tape for wrapping parts of an electric engine that are potentially current-carrying during operation of the engine, which mica paper or mica tape is impregnable via vacuum pressure impregnation with a thermally curable epoxy resin formulation and comprises a thermally activatable curing initiator for the epoxy resin formulation consisting of one or more quarternary ammonium salts of an aromatic-heterocyclic compound, which contains 1 or 2 nitrogen atoms, and a complex anion selected from the group consisting of BF4, PF6-, SbF6-, SbF 5 (OH) ", AsF6- and AI[OC(CF3)3]4 in an amount sufficient to cure the epoxy resin taken up by the mica paper or mica tape and the construction part of the engine during the vacuum pressure impregnation step. Also recites an anhydride-free insulation system therewith.
H01B 3/04 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances mica
H02K 3/30 - Windings characterised by the insulating material
H01B 3/40 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes epoxy resins
54.
A CURABLE POLYURETHANE COMPOSITION FOR THE PREPARATION OF OUTDOOR ARTICLES, AND THE ARTICLES OBTAINED THEREFROM
A curable composition comprising (A) a mixture of homopolymers of polyisocyanates comprising (a1) from 50 wt% to 90 wt% of at least one homopolymer of an aliphatic polyisocyanate, and (a2) from 10 wt% to 50 wt% of at least one homopolymer of a cycloaliphatic polyisocyanate, each based on the total weight of (a1) and (a2), (B) at least one polyol selected from the group of polyether polyol and polyester polyol, and (C) at least one filler selected from the group of quartz sand, quartz powder, silica, aluminium oxide, titanium oxide, zirconium oxide, Mg(OH)2, AI(OH)3, dolomite [CaMg (CO3)2], AIO(OH), silicon nitride, boron nitride, aluminium nitride, silicon carbide, boron carbide, chalk, calcium carbonate, barite, gypsum, hydromagnesite, zeolites, talcum, mica, kaolin and wollastonite, wherein the at least one filler may be silanized, which, in particular, is suitable for the manufacture of outdoor insulation system articles for electrical engineering by casting, potting, encapsulation, and impregnation processes, wherein said articles exhibit good mechanical, electrical and dielectrical properties, and can be used as insulators, bushings, switchgears and instrument transformers.
A curable composition comprising (A) a mixture of homopolymers of polyisocyanates comprising (a1) from 50 wt% to 90 wt% of at least one homopolymer of an aliphatic polyisocyanate, and (a2) from 10 wt% to 50 wt% of at least one homopolymer of a cycloaliphatic polyisocyanate, each based on the total weight of (a1) and (a2), (B) at least one polyol selected from the group of polyether polyol and polyester polyol, and (C) at least one filler selected from the group of quartz sand, quartz powder, silica, aluminium oxide, titanium oxide, zirconium oxide, Mg(OH)2, AI(OH)3, dolomite [CaMg (CO3)2], AIO(OH), silicon nitride, boron nitride, aluminium nitride, silicon carbide, boron carbide, chalk, calcium carbonate, barite, gypsum, hydromagnesite, zeolites, talcum, mica, kaolin and wollastonite, wherein the at least one filler may be silanized, which, in particular, is suitable for the manufacture of outdoor insulation system articles for electrical engineering by casting, potting, encapsulation, and impregnation processes, wherein said articles exhibit good mechanical, electrical and dielectrical properties, and can be used as insulators, bushings, switchgears and instrument transformers.
A liquid composition comprising (a)a solvent or solvent mixture containing at least 50 % by weight, based on the total amount of solvents,of a dioxabicycloalkane derivative, (b)an aromatic tricarboxylic acid anhydride, and (c)an aromatic diisocyanate, can be used as coating composition for metal surfaces.
A thermosetting epoxy resin composition comprising (A) a glycidyl-type epoxy resin comprising a mixture of (a1) from 10 wt% to 90 wt% of at least one cycloaliphatic glycidyl-type epoxy resin without an ester group, and (a2) from 90 wt% to 10 wt% of at least one cycloaliphatic glycidyl-type epoxy resin containing an ester group, each based on the total weight of (a1) and (a2), (B) at least one cationic curing agent, and optionally (C) at least one silanized filler, which, in particular, is suitable for the manufacture of outdoor insulation system articles for electrical engineering by casting, potting, encapsulation, and impregnation processes, wherein said articles exhibit good mechanical, electrical and dielectrical properties, and can be used as insulators, bushings, switchgears and instrument transformers.
C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
H01B 3/40 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes epoxy resins
A composition comprising (a) a cationically polymerisable epoxy resin, (b) an thermal initiator for the cationic polymerisation, (c) a microparticle filler, and (d) a nanoparticle filler can be used for the production of thermally stable insulating material for electrical and electronic components.
A composition comprising (a) a cationically polymerisable epoxy resin, (b) an thermal initiator for the cationic polymerisation, (c) a microparticle filler, and (d) a nanoparticle filler can be used for the production of thermally stable insulating material for electrical and electronic components.
C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
C08K 3/00 - Use of inorganic substances as compounding ingredients
60.
A CURING AGENT FOR THERMOSETTING EPOXY RESINS, AND A PROCESS FOR THE PREPARATION OF INSULATION SYSTEMS FOR ELECTRICAL ENGINEERING
There is provided a curing agent for thermosetting epoxy resins comprising (a) at least one aromatic amine containing at least two amino groups, and (b) at least one clathrate compound obtained by reacting a tetrakisphenol of the formula or a 9,9-Bis(4-hydroxyphenyl)fluorene of formula , as the host molecule and an imidazole or an imidazolium derivative as the guest molecule. The curing agent can be used for the curing of epoxy resins, yielding epoxy resin compositions having a good pot life and high reactivity, which be used for the manufacturing of insulation encased articles for electrical applications.
A curing agent for thermosetting epoxy resins comprising (a) at least one aromatic amine containing at least two amino groups, and (b) at least one clathrate compound obtained by reacting a tetrakisphenol of the formula (1), or a 9,9-Bis(4-hydroxyphenyl)fluorene of formula (2), as the host molecule and an imidazole or an imidazolium derivative as the guest molecule, wherein, R1, R2, R3, R4, R5, R6, R7, R8, R10, and R11 are each independently of one another hydrogen, halogen, C1-C4alkyl, C1-C4alkoxy, or phenyl which is unsubstituted or substituted by C1-C4alkyl, C1-C4alkoxy or halogen, R12, R13, R14 and R15 are each independently of one another hydrogen, halogen, C1-C4alkyl or C1-C4alkoxy, and n is the number 0, 1, 2 or 3, can advantageously be used for the curing of epoxy resins. The thermosetting epoxy resin compositions obtained are distinguished by a good pot life and a high reactivity, and can advantageously be used for the manufacturing of insulation encased articles for electrical applications which exhibit good mechanical, electrical and dielectrical properties.
C08G 59/56 - Amines together with other curing agents
C08G 59/18 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
62.
A PROCESS FOR THE PREPARATION OF INSULATION SYSTEMS FOR ELECTRICAL ENGINEERING, THE ARTICLES OBTAINED THEREFROM AND THE USE THEREOF
A process for the preparation of insulation systems for electrical engineering by automatic pressure gelation (APG), wherein a multiple component thermosetting resin composition is used, said resin composition comprising (A) at least one epoxy resin, and (B) at least one curing agent comprising (b1) at least one cycloaliphatic amine, and (b2) at least one polyetheramine, provides encased articles exhibiting good mechanical, electrical and dielectrical properties, which can be used as, for example, insulators, bushings, switchgears and instrument transformers.
H01B 3/40 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes epoxy resins
A multiple component thermosetting epoxy resin composition comprising (A) at least one cycloaliphatic glycidyl-type epoxy resin without an ester group, (B) at least one curing agent selected from the group aliphatic amine, cycloaliphatic amine, and dicyandiamide, and (C) at least one silanized filler, which, in particular, is suitable for the manufacture of outdoor insulation system articles for electrical engineering by casting, potting, encapsulation, and impregnation processes, wherein said articles exhibit good mechanical, electrical and dielectrical properties, and can be used as insulators, bushings, switchgears and instrument transformers.
A process for the preparation of insulation systems for electrical engineering by automatic pressure gelation (APG), wherein a multiple component thermosetting resin composition is used, said resin composition comprising (A) at least one epoxy resin, and (B) at least one curing agent comprising (b1) at least one cycloaliphatic amine, and (b2) at least one polyetheramine, provides encased articles exhibiting good mechanical, electrical and dielectrical properties, which can be used as, for example, insulators, bushings, switchgears and instrument transformers.
H01B 3/40 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes epoxy resins
A multiple component thermosetting epoxy resin composition comprising (A) at least one cycloaliphatic glycidyl-type epoxy resin without an ester group, (B) at least one curing agent selected from the group aliphatic amine, cycloaliphatic amine, and dicyandiamide, and (C) at least one silanized filler, which, in particular, is suitable for the manufacture of outdoor insulation system articles for electrical engineering by casting, potting, encapsulation, and impregnation processes, wherein said articles exhibit good mechanical, electrical and dielectrical properties, and can be used as insulators, bushings, switchgears and instrument transformers.
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
A composition comprising (a1) a polyether polyol, (a2) a polyolefine polyol and (a3) a polyester polyol obtainable by epoxidation of an unsaturated fatty acid ester and subsequent ring-opening reaction with a compound containing active hydrogen, can be used for the preparation of PUR foam which distinguishes by low-temperature flexibility and low dielectric loss and is suitable for filling the gap between the condenser core and the outer composite or porcelain insulator in the manufacture of resin impregnated paper (RIP) bushings.
C08G 18/76 - Polyisocyanates or polyisothiocyanates cyclic aromatic
C08J 9/04 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent
C08L 47/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bondsCompositions of derivatives of such polymers
C08L 67/08 - Polyesters modified with higher fatty oils or their acids, or with natural resins or resin acids
A composition comprising (a1) a polyether polyol, (a2) a polyolefine polyol and (a3) a polyester polyol obtainable by epoxidation of an unsaturated fatty acid ester and subsequent ring-opening reaction with a compound containing active hydrogen, can be used for the preparation of PUR foam which distinguishes by low-temperature flexibility and low dielectric loss and is suitable for filling the gap between the condenser core and the outer composite or porcelain insulator in the manufacture of resin impregnated paper (RIP) bushings.
A process for the preparation of a fiber reinforced composite article comprising the steps of a) providing a mold, comprising an upper die (11) and a lower die (12), the lower die (12) having a molding surface and vertically extending side walls (14), the upper die (11) having a complementary molding surface and vertically extending side walls (13) substantially aligned with the side walls of the lower die, so that the upper die vertically moves into the lower die to form a cavity (17) in a partially and completely closed position of the mold, wherein the cavity (17) in a partially closed position is sealed vacuum-tight by at least one seal (15) placed around the vertically extending walls of the upper die (11), or the lower die (12), horizontally to the moving direction of the upper die (11), and wherein the at least one seal (15) also works as a resin retention seal which prevents the resin from leaking, b) applying a thermosetting resin composition onto a fibre reinforcement, and placing the thus treated fibre reinforcement into the lower die of the mold (12), or c) placing a fibre reinforcement into the lower die of the mold (12), and applying a thermosetting resin composition onto the fibre reinforcement d) moving the upper die (11) into the lower die (12) and partially closing the mold, e) evacuating the mold in the partially closed position by means of a vacuum outlet to a pressure of from 0.1 to 100 mbar, f) completely closing the mold and exerting an hydraulic pressure of from 2 to 100 bar onto the resin treated reinforcement to complete impregnation of the fibre reinforcement, g) curing the resin impregnated reinforcement, h) demolding the cured composite article, facilitates manufacturing of composite articles with reduced cycle times, said composite articles exhibit high fibre content, low void content and excellent visual and mechanical properties, and can be used for the construction of mass transportation vehicles, in particular, in automotive and aerospace industry.
B29C 70/46 - Shaping or impregnating by compression for producing articles of definite length, i.e. discrete articles using matched moulds, e.g. for deforming sheet moulding compounds [SMC] or prepregs
B29C 43/36 - Moulds for making articles of definite length, i.e. discrete articles
B29C 43/56 - Compression moulding under special conditions, e.g. vacuum
69.
A PROCESS FOR MANUFACTURING A FIBER REINFORCED COMPOSITE ARTICLE, THE COMPOSITE ARTICLE OBTAINED AND THE USE THEREOF
A process for the preparation of a fiber reinforced composite article comprising the steps of a) providing a mold, comprising an upper die (11) and a lower die (12), the lower die (12) having a molding surface and vertically extending side walls (14), the upper die (11) having a complementary molding surface and vertically extending side walls (13) substantially aligned with the side walls of the lower die, so that the upper die vertically moves into the lower die to form a cavity (17) in a partially and completely closed position of the mold, wherein the cavity (17) in a partially closed position is sealed vacuum-tight by at least one seal (15) placed around the vertically extending walls of the upper die (11), or the lower die (12), horizontally to the moving direction of the upper die (11), and wherein the at least one seal (15) also works as a resin retention seal which prevents the resin from leaking, b) applying a thermosetting resin composition onto a fibre reinforcement, and placing the thus treated fibre reinforcement into the lower die of the mold (12), or c) placing a fibre reinforcement into the lower die of the mold (12), and applying a thermosetting resin composition onto the fibre reinforcement d) moving the upper die (11) into the lower die (12) and partially closing the mold, e) evacuating the mold in the partially closed position by means of a vacuum outlet to a pressure of from 0.1 to 100 mbar, f) completely closing the mold and exerting an hydraulic pressure of from 2 to 100 bar onto the resin treated reinforcement to complete impregnation of the fibre reinforcement, g) curing the resin impregnated reinforcement, h) demolding the cured composite article, facilitates manufacturing of composite articles with reduced cycle times, said composite articles exhibit high fibre content, low void content and excellent visual and mechanical properties, and can be used for the construction of mass transportation vehicles, in particular, in automotive and aerospace industry.
B29C 70/46 - Shaping or impregnating by compression for producing articles of definite length, i.e. discrete articles using matched moulds, e.g. for deforming sheet moulding compounds [SMC] or prepregs
70.
PROCESS FOR THE IMPREGNATION OF AIR CORE REACTORS, IMPREGNATED AIR CORE REACTOR AND USE OF AN IMPREGNATION SYSTEM
The invention relates to a process for the impregnation of air core reactors or parts of air core reactors and impregnated air core reactors or parts thereof obtainable by said process.
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
C09D 163/00 - Coating compositions based on epoxy resinsCoating compositions based on derivatives of epoxy resins
H01F 27/32 - Insulating of coils, windings, or parts thereof
H01F 30/08 - Fixed transformers not covered by group characterised by the structure without magnetic core
A thermosetting composition comprising (a) at least one phosphorous-free dihydrobenzoxazine component; (b) at least a quaternary ammonium salt and (c) optionally a compound comprising at least an epoxy group is disclosed. Cured products made from these compositions have valuable chemical, physical and mechanical properties.
C09D 179/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chainPolyhydrazidesPolyamide acids or similar polyimide precursors
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
B32B 27/12 - Layered products essentially comprising synthetic resin next to a fibrous or filamentary layer
C08G 73/06 - Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromoleculePolyhydrazidesPolyamide acids or similar polyimide precursors
Disclosed is a curable composition comprising an epoxy resin and a filler composition, a cured product obtained by curing said curable composition as well as the use of the cured products as electrically insulating construction material for electrical or electronic components.
B05D 3/02 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
H01B 3/40 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes epoxy resins
A method for the preparation of a photocurable resin by a reaction comprising the following steps i) reacting a mixture of a novolak type epoxy resin (A) and a dicyclopentadiene-phenol glycidylether resin (B) with ii) an advancement component (C) containing at least 2 phenolic hydroxyl groups per molecule; iii) reacting with an unsaturated monocarboxylic acid (D); and iv) esterification of the unsaturated group containing resin obtained from the steps of i) to iii) with a polycarboxylic acid anhydride or a carboxylic acid anhydride (E) is disclosed.
The instant invention relates to 3,3′-bis(3,4-dihydro-3-phenyl-2H-1,3-benzoxazin-6-yl)-1(3H)-isobenzofuranone and analogues based on phenolphthalein, formaldehyde and a primary amine. Such compounds are, when cured to form polymeric networks, difficultly inflammable and resistant to high temperatures. Such compounds may especially be used in the production of printed wiring boards.
C07D 413/14 - Heterocyclic compounds containing two or more hetero rings, at least one ring having nitrogen and oxygen atoms as the only ring hetero atoms containing three or more hetero rings
A thermosetting composition comprising (a) at least one phosphorous-free dihydrobenzoxazine component; (b) at least a quaternary ammonium salt and (c) optionally a compound comprising at least an epoxy group is disclosed. Cured products made from these compositions have valuable chemical, physical and mechanical properties.
An photo-curable sealing agent composition comprising (A) an unsaturated group-containing urethane resin having a number average molecular weight of 1,000-100,000 and an unsaturation degree of 0.1-1 mol/kg, which is obtained by reaction of (a) a polycarbonate diol having a number average molecular weight of 500-3,000, (b) a bifunctional epoxy (meth)acrylate having two hydroxyl groups and two ethylenically unsaturated groups, and (c) a polyisocyanate; (B) a (meth)acrylic acid ester monomer, wherein an alcohol residue, ester-bonded with an (meth)acyloyl group, is a hydrocarbon group which may contain an oxygen atom, and has 1-20 carbon atoms and a molecular weight of not larger than 1,000; and (C) a photo-polymerization initiator. The sealing agent composition exhibits a high curability performance and gives a cured product having a low hardness and enhanced flexibility and elongation, and improved physical and mechanical strength and enhanced durability.
C08F 299/06 - Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polyurethanes
b2) a polyphenol novolac, and wherein the polyphenol novolac is used in an amount of from 30% to 45% by weight, based on the total weight of hardener blend comprising b1) and b2), useful for rapid setting and protective coatings and adhesives in application fields like civil engineering, marine, architectural and maintenance.
B05D 1/00 - Processes for applying liquids or other fluent materials
B05D 3/02 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
B32B 27/26 - Layered products essentially comprising synthetic resin characterised by the use of special additives using curing agents
01 - Chemical and biological materials for industrial, scientific and agricultural use
02 - Paints, varnishes, lacquers
05 - Pharmaceutical, veterinary and sanitary products
16 - Paper, cardboard and goods made from these materials
17 - Rubber and plastic; packing and insulating materials
19 - Non-metallic building materials
Goods & Services
Chemicals used in industry, unprocessed artificial resins,
unprocessed plastics; adhesives used in industry. Paints, coatings [paints], varnishes, lacquers, enamels
[varnishes], preservatives against rust and against
deterioration of wood; dyestuffs for clothing; colorants;
raw natural resins. Adhesive tapes and self-adhesive tapes for medical purposes;
adhesives for medical purposes. Gums (adhesives) for stationery or household purposes;
adhesives tapes for stationary or household purposes;
adhesives (glues) for stationary or household purposes; glue
for stationary or household purposes; pastes for stationary
or household purposes; self-adhesive tapes for stationary or
household purposes; sealing compounds for stationary
purposes; isinglass for stationary or household purposes;
non-setting adhesive paper. Resin boards; plastic substances, semi-processed;
soundproofing material; compositions to prevent the
radiation of heat; insulation coating; fibreglass for
insulation; insulators for electric; water proofing
insulating powder; waterproof packings; flexible pipes, not
of metal; caulking material; chemical compositions for
repairing leaks; synthetic resin (semi-finished products);
artificial resins (semi-finished products); epoxy resins
(semi-finished products); adhesive tapes other than
stationery and not for medical or household purposes;
self-adhesive tapes other than stationery and not for
medical or household purposes. Non metallic building materials; adhesives and resin based
products for building purposes, including products for
filling, jointing, sealing, finishing, repairing,
installing, assembling and isolating also for use in
connection to stone including marble and granite; adhesives
based products for manufacturing and processing building
materials, including granite, marble and other building
materials; resin composite sheets; adhesives based products
for installing and assembling building materials, including
granite, marble and other building materials; mortar, filing
mortar and pastes; mortar and adhesives for tiles.
c) from 0.5 to 15 wt.-%, based on the sum of the components b) and c), of a compound of the general formula (I)
providing due to the presence of component c) an adjustable and recognizable end of pot life during application, for example coating, adhesive, as flooring, casting, tooling or encapsulating.
The instant invention relates to compositions comprising a benzoxazine resin and an advancement resin based on bisphenol A diglycidyl ether and bisphenol S and, optionally, ferrocene and aluminium trihydrate. Such compositions are, when cured to form polymeric networks, difficultly inflammable and resistant to high temperatures. Such compositions may especially be used in the production of printed wiring boards.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Chemicals used in industry, science and photography, as well
as in agriculture, horticulture and forestry; unprocessed
artificial resins, unprocessed plastics; tanning substances;
adhesives used in industry.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Chemicals used in industry, science and photography, as well
as in agriculture, horticulture and forestry; unprocessed
artificial resins, unprocessed plastics; tanning substances;
adhesives used in industry.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Chemicals used in industry, science and photography, as well
as in agriculture, horticulture and forestry; unprocessed
artificial resins, unprocessed plastics; tanning substances;
adhesives used in industry.
84.
NANOCOMPOSITES BASED ON POLYURETHANE OR POLYURETHANE-EPOXY HYBRID RESINS PREPARED AVOIDING ISOCYANATES
A fast curable non-isocyanate-based polyurethane- and polyurethane-epoxy network nanocomposite polymeric compositions are derived upon crosslinking a mixture comprising of natural or modified nano-clay [ionic phyllosilicate] with platelet thickness in the scale of A (~1 nm) and aspect ratio (length/thickness) higher than 10 (nm)] preferably natural or modified montmorillonite with either a monomer(s) or oligomer(s) bearing at least one cyclocarbonate group or a mixture of the latter with an epoxy resin, with a hardener, which is a monomer or oligomer or mixtures therefrom, bearing primary and/or secondary amino groups.The use of the nanoclays reduces the gel time and increases the adhesion of the cured polyurethane and polyurethane/epoxy hybrid and also reduces its water absorption.
01 - Chemical and biological materials for industrial, scientific and agricultural use
17 - Rubber and plastic; packing and insulating materials
Goods & Services
Unprocessed plastic materials and synthetic resins. Boards, panels, blocks, plates, bars, rods, tubes and
sheets, made of plastic materials (semifinished).
01 - Chemical and biological materials for industrial, scientific and agricultural use
17 - Rubber and plastic; packing and insulating materials
Goods & Services
Unprocessed plastic materials and synthetic resins. Boards, panels, blocks, plates, bars, rods, tubes and
sheets, made of plastic materials (semifinished).
