SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
G02B 7/08 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
The present embodiments relate to tilt modules and related methods that can use a fulcrum rotation point for multiple axis. Further, silicone can be used as a return spring and a material to hold the pieces of the tilt module from shifting in unwanted directions (e.g., side to side). Silicone can be used on the module and can be stiff laterally while also being pliable rotationally.
G02B 7/04 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
G02B 6/35 - Optical coupling means having switching means
G02B 6/38 - Mechanical coupling means having fibre to fibre mating means
G03B 17/38 - Releasing-devices separate from shutter
H10N 30/50 - Piezoelectric or electrostrictive devices having a stacked or multilayer structure
The present embodiments relate to shape memory alloy (SMA) haptics devices. An example device can include a fixed bow that is fixed to a base and a moving bow that is configured to move in a direction. The moving bow and fixed bow can each include a flat portion and angled portions that allow the moving bow and fixed bow to be connected at a first end and/or second end. The device can also include a SMA element that, in response to a current, is configured to actuate.
G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
The present embodiments relate to shape memory alloy (SMA) haptics devices. An example device can include a fixed bow that is fixed to a base and a moving bow that is configured to move in a direction. The moving bow and fixed bow can each include a flat portion and angled portions that allow the moving bow and fixed bow to be connected at a first end and/or second end. The device can also include a SMA element that, in response to a current, is configured to actuate.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
The present embodiments relate to a cross-spring actuator (CSA) and device designs that incorporate one or more cross-spring actuators. The CSA can include a first cross-spring element and a second cross-spring element that each have end portions. The CSA can also include a set of spring arms connecting the first cross-spring element and the second cross-spring element. The set of spring arms can be disposed at an angle such that each of the set of spring arms cross at a pivot point. The CSA can also include at least one shape-memory alloy (SMA) wire connected between end portions of any of the cross-spring elements. The CSA can be part of a two-axis tilt module, a serial rotational joint, a spine device, and a revolute joint device.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
H02N 10/00 - Electric motors using thermal effects
The present embodiments relate to a cross-spring actuator (CSA) and device designs that incorporate one or more cross-spring actuators. The CSA can include a first cross-spring element and a second cross-spring element that each have end portions. The CSA can also include a set of spring arms connecting the first cross-spring element and the second cross-spring element. The set of spring arms can be disposed at an angle such that each of the set of spring arms cross at a pivot point. The CSA can also include at least one shape-memory alloy (SMA) wire connected between end portions of any of the cross-spring elements. The CSA can be part of a two-axis tilt module, a serial rotational joint, a spine device, and a revolute joint device.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
The present embodiments relate to a bistable SMA actuator. The bistable SMA actuator as described herein can include a two-position actuator to move a bistable structure between two positions. Multiple SMA actuators can be disposed opposite one another to move the bistable structure between the two positions. For example, a first SMA actuator can actuate to move the bistable structure from a first position to a second position. After actuation by the first SMA actuator, the actuator can de-actuate, and the bistable structure can use spring force to hold the bistable structure in the second position. The bistable structure can include multiple springs that use force(s) from the springs to hold the bistable structure at a position with zero external force provided by the SMA actuators.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
The present embodiments relate to a bistable SMA actuator. The bistable SMA actuator as described herein can include a two-position actuator to move a bistable structure between two positions. Multiple SMA actuators can be disposed opposite one another to move the bistable structure between the two positions. For example, a first SMA actuator can actuate to move the bistable structure from a first position to a second position. After actuation by the first SMA actuator, the actuator can de-actuate, and the bistable structure can use spring force to hold the bistable structure in the second position. The bistable structure can include multiple springs that use force(s) from the springs to hold the bistable structure at a position with zero external force provided by the SMA actuators.
F16K 99/00 - Subject matter not provided for in other groups of this subclass
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
10.
CONFIGURABLE COMPONENTS FOR SHAPE MEMORY ALLOY (SMA) ACTUATORS
The present embodiments relate to shape memory alloy (SMA) actuator designs that can have a custom sized SMA wire length and/or a carriage specific to different systems (e.g., optical image stabilization systems, autofocus systems). The actuator can include a common base (or fixed end) and a common tip portion (or free end) that can be common across different SMA designs.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
The present embodiments relate to shape memory alloy (SMA) actuator designs that can have a custom sized SMA wire length and/or a carriage specific to different systems (e.g., optical image stabilization systems, autofocus systems). The actuator can include a common base (or fixed end) and a common tip portion (or free end) that can be common across different SMA designs.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
12.
ACTUATOR WITH PARALLELOGRAM SPRING GUIDING STRUCTURE
The present embodiments relate to an actuator that includes a parallelogram spring guiding structure. The actuator can include a base and a moving carriage configured to move in a direction (e.g., Z direction). The parallelogram spring guiding structure can be fixed to the moving carriage and the base. Further, the parallelogram spring guiding structure can include side lengths and flexible hinge areas configured to flex as the moving carriage is actuated, preventing or mitigating unwanted motion of the moving carriage during actuation.
The present embodiments relate to an actuator that includes a parallelogram spring guiding structure. The actuator can include a base and a moving carriage configured to move in a direction (e.g., Z direction). The parallelogram spring guiding structure can be fixed to the moving carriage and the base. Further, the parallelogram spring guiding structure can include side lengths and flexible hinge areas configured to flex as the moving carriage is actuated, preventing or mitigating unwanted motion of the moving carriage during actuation.
G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
14.
SYSTEM AND METHOD FOR IMPROVED RESISTANCE WELDING ELECTRODE LIFE
A shape memory alloy (SMA) actuator can include an element (e.g., an SMA wire) configured to actuate when provided a current. The SMA element can be joined to the beam (e.g., made of stainless steel) using a resistance welding process that includes joining two metals by passing electrical current through them. A resistance welder, with smaller step sizes of power, lower total power, smaller step sizes of electrode clamp force, and lower time to time variability can produce additional test samples. Further, an approach can be taken to rebalance the heat of the system. The bottom electrode resistance (R6) can be increased by changing the electrode material from tungsten copper to a more resistive tungsten alloy. Further, a tungsten alloy can be used. The short duration pulse weld recipe with the higher resistivity bottom electrode can be the baseline resistance welding process for attaching SMA wire to stainless steel.
A shape memory alloy (SMA) actuator can include an element (e.g., an SMA wire) configured to actuate when provided a current. The SMA element can be joined to the beam (e.g., made of stainless steel) using a resistance welding process that includes joining two metals by passing electrical current through them. A resistance welder, with smaller step sizes of power, lower total power, smaller step sizes of electrode clamp force, and lower time to time variability can produce additional test samples. Further, an approach can be taken to rebalance the heat of the system. The bottom electrode resistance (R6) can be increased by changing the electrode material from tungsten copper to a more resistive tungsten alloy. Further, a tungsten alloy can be used. The short duration pulse weld recipe with the higher resistivity bottom electrode can be the baseline resistance welding process for attaching SMA wire to stainless steel.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
The present embodiments relate to a flex hinge actuator. The actuator can include a base and a moving carriage configured to move in a direction (e.g., Z direction). A flex hinge assembly can include structures disposed on multiple sides (e.g., 2-sides, 4-sides). The flex hinge assembly structures can limit movement of the moving carriage in other directions than the Z direction to limit adverse motions of the moving carriage. The actuators as described herein can include a simple structure to constrain pitch and yaw tilt during Z motion of a payload. The actuator can push on sides of structure to move a carriage up and down (or in the Z-direction).
G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
G02B 7/04 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
The present embodiments relate to a flex hinge actuator. The actuator can include a base and a moving carriage configured to move in a direction (e.g., Z direction). A flex hinge assembly can include structures disposed on multiple sides (e.g., 2-sides, 4-sides). The flex hinge assembly structures can limit movement of the moving carriage in other directions than the Z direction to limit adverse motions of the moving carriage. The actuators as described herein can include a simple structure to constrain pitch and yaw tilt during Z motion of a payload. The actuator can push on sides of structure to move a carriage up and down (or in the Z-direction).
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
The present embodiments relate to a shape memory alloy (SMA) actuator with a joint between an SMA wire the SMA actuator being disposed at a bottom surface of the SMA actuator. The SMA actuator can include at least one fixed end configured to be fixed to a carriage, at least one free end, at least one beam connecting the fixed end and the free end, and at least one SMA wire. The at least one SMA wire can be electrically connected to the at least one fixed end and the at least one free end via electrical contact portions. The position of the at least one SMA wire being affixed to the bottom surface can allow for reduced stress and a wire exit angle at the weld joint between each SMA wire and the actuator, improving resiliency of the SMA actuator.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
G03B 5/00 - Adjustment of optical system relative to image or object surface other than for focusing of general interest for cameras, projectors or printers
The present embodiments relate to a shape memory alloy (SMA) actuator with a reduced number of materials for manufacturing the actuator. In some instances, elements of the SMA actuator can comprise a dielectric material disposed on the actuator via an injection molding process. In other instances, the SMA actuator can dispose SMA wires above a base of the SMA actuator without the use of any dielectric material. In a first example, an SMA actuator can include a carriage and a base. The base can include a fixed end fixed to the carriage, a free end, a beam connecting the fixed end and the free end, and at least one SMA wire. The SMA actuator can also include an insulator comprising a dielectric material electrically isolating a set of electrical contacts at the fixed end.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
H01R 4/01 - Connections using shape memory materials, e.g. shape memory metal
20.
SHAPE MEMORY ALLOY (SMA) BIMORPH ACTUATORS AND METHODS FOR MANUFACTURING THE SAME
The present embodiments relate to a shape memory alloy (SMA) actuator with a reduced number of materials for manufacturing the actuator. In some instances, elements of the SMA actuator can comprise a dielectric material disposed on the actuator via an injection molding process. In other instances, the SMA actuator can dispose SMA wires above a base of the SMA actuator without the use of any dielectric material. In a first example, an SMA actuator can include a carriage and a base. The base can include a fixed end fixed to the carriage, a free end, a beam connecting the fixed end and the free end, and at least one SMA wire. The SMA actuator can also include an insulator comprising a dielectric material electrically isolating a set of electrical contacts at the fixed end.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
G03B 5/00 - Adjustment of optical system relative to image or object surface other than for focusing of general interest for cameras, projectors or printers
An improved method for manufacturing an electrical device is described herein. In some embodiments according to the present disclosure, the method includes: providing a base layer with a coil set, thermal flattening the base layer, and forming a circuit on the base layer opposite of the coil set in the base layer.
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
G02B 6/35 - Optical coupling means having switching means
G02B 6/38 - Mechanical coupling means having fibre to fibre mating means
G03B 17/38 - Releasing-devices separate from shutter
H10N 30/50 - Piezoelectric or electrostrictive devices having a stacked or multilayer structure
23.
High-Aspect Ratio Electroplated Structures And Anisotropic Electroplating Processes
A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.
H01F 41/26 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids using electric currents
H01F 27/32 - Insulating of coils, windings, or parts thereof
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.
C23C 28/02 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and only coatings of metallic material
C25D 5/02 - Electroplating of selected surface areas
25.
Shape metal alloy (SMA) bimorph actuators with reduced wire exit angle
The present embodiments relate to a shape memory alloy (SMA) actuator with a joint between an SMA wire the SMA actuator being disposed at a bottom surface of the SMA actuator. The SMA actuator can include at least one fixed end configured to be fixed to a carriage, at least one free end, at least one beam connecting the fixed end and the free end, and at least one SMA wire. The at least one SMA wire can be electrically connected to the at least one fixed end and the at least one free end via electrical contact portions. The position of the at least one SMA wire being affixed to the bottom surface can allow for reduced stress and a wire exit angle at the weld joint between each SMA wire and the actuator, improving resiliency of the SMA actuator.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
G03B 5/00 - Adjustment of optical system relative to image or object surface other than for focusing of general interest for cameras, projectors or printers
SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator is attached to the base.
G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
G03B 5/00 - Adjustment of optical system relative to image or object surface other than for focusing of general interest for cameras, projectors or printers
An etch chemistry solution for treating metallic surfaces in which the etch chemistry solution includes an oxidizing agent and gluconic acid. The etch chemistry solution may also include an oxidizing agent and a short-chained polyethylene polymer glycol or a short-chained polyethylene copolymer glycol. The metallic surfaces are usually used in circuits such as flexible circuits.
H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
G02B 7/08 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.
G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
G01L 1/14 - Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
G02B 6/35 - Optical coupling means having switching means
G02B 6/38 - Mechanical coupling means having fibre to fibre mating means
G03B 17/38 - Releasing-devices separate from shutter
H10N 30/50 - Piezoelectric or electrostrictive devices having a stacked or multilayer structure
A buckler wire actuator assembly is provided herein. The buckler wire actuator assembly includes at least one buckler frame mounted onto a base of the buckler wire actuator assembly and including at least one isolated electrical conductor. The buckler wire actuator assembly also includes a first SMA wire in electrical connection to one of the at least one isolated electrical conductor a second SMA wire opposite the first SMA wire. The first and second SMA wires are arranged in series to enable both the first and second SMA wires to receive equal current from a current input.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
G02B 7/04 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
G02B 6/35 - Optical coupling means having switching means
G02B 6/38 - Mechanical coupling means having fibre to fibre mating means
G03B 17/38 - Releasing-devices separate from shutter
H10N 30/00 - Piezoelectric or electrostrictive devices
H10N 30/50 - Piezoelectric or electrostrictive devices having a stacked or multilayer structure
SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
G02B 6/35 - Optical coupling means having switching means
G02B 6/38 - Mechanical coupling means having fibre to fibre mating means
G03B 17/38 - Releasing-devices separate from shutter
H10N 30/00 - Piezoelectric or electrostrictive devices
H10N 30/50 - Piezoelectric or electrostrictive devices having a stacked or multilayer structure
A camera assembly comprises a lens assembly supported on a support structure, wherein the lens assembly includes an autofocus actuator arrangement and the camera assembly includes an optical image stabilization assembly arranged to move the lens assembly in a plane perpendicular to the optical axis. A flexible printed circuit tape connected between the support structure and the lens assembly and providing an electrical connection to the auto-focus actuator arrangement is bent around a corner, thereby allowing the flexible printed circuit tape to accommodate the motion of the lens assembly perpendicular to the optical axis. A crimp plate connected to the lens assembly which crimps shape memory alloy wires has features extending out of the plane of the crimp plate for reducing flexibility. At least part of the optical image stabilization assembly overlaps the lens assembly in the direction along the optical axis, thereby reducing the height of the camera assembly.
G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
G02B 7/08 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
Devices including a substrate and a plurality of coil portions disposed on the substrate. The plurality of coil portions electrically coupled to form a coil structure.
C25D 3/38 - ElectroplatingBaths therefor from solutions of copper
C25D 7/00 - Electroplating characterised by the article coated
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
G11B 5/48 - Disposition or mounting of heads relative to record carriers
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
37.
Stabilization Suspensions And Methods Of Manufacture
A suspension assembly is described. A suspension assembly including a support member configured to receive at least a first circuit member. The first circuit member including at least a trace. The first circuit member disposed on the support member.
F16M 13/02 - Other supports for positioning apparatus or articlesMeans for steadying hand-held apparatus or articles for supporting on, or attaching to, an object, e.g. tree, gate, window-frame, cycle
G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
A component is disclosed. A component includes an elongated body, with a first end and a second end; and one or more tabs at the first end and the second end, the tabs configured to have a lower tensile strength than other regions of the component.
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
H05K 13/00 - Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
G02B 7/04 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
A buckler wire actuator assembly is provided herein. The buckler wire actuator assembly includes at least one buckler frame mounted onto a base of the buckler wire actuator assembly and including at least one isolated electrical conductor. The buckler wire actuator assembly also includes a first SMA wire in electrical connection to one of the at least one isolated electrical conductor a second SMA wire opposite the first SMA wire. The first and second SMA wires are arranged in series to enable both the first and second SMA wires to receive equal current from a current input.
G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
42.
High-Aspect Ratio Electroplated Structures And Anisotropic Electroplating Processes
A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.
SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
H02N 10/00 - Electric motors using thermal effects
G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
48.
Chain extenders and formulations thereof for improving elongation in photosensitive polyimide
Photosensitive polymer formulations, materials and uses of such materials are disclosed. Embodiments of the present disclosure provide photosensitive polyimide materials having chain extenders and formulations thereof that improve elongation and formability of the polyimide materials, and methods of making such polymer materials.
G03F 7/037 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
49.
Surface treatment producing high conductivity vias with simultaneous polymer adhesion
Treatment solutions and methods for treating a substrate including forming a first layer on a surface of the substrate, providing a process gas to the one or more plasma sources, the process gas includes a gas mixture of a reactive gas species and an inert gas species; forming a plasma under vacuum in the one or more plasma sources; and exposing the substrate to the plasma under vacuum to treat the first layer on the surface of the substrate.
A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.
G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
G01L 1/14 - Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
51.
Electroless nickel etch chemistry, method of etching and pretreatment
Etchant solutions, pretreatment and methods for etching electroless nickel on metallic materials are provided herein. More specifically, etchant solutions for selectively removing electroless nickel from the surface of metallic materials containing copper, and optionally as containing stainless steel, methods of etching and pretreatment are provided.
SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
G02B 6/35 - Optical coupling means having switching means
G02B 6/38 - Mechanical coupling means having fibre to fibre mating means
H10N 30/00 - Piezoelectric or electrostrictive devices
H10N 30/50 - Piezoelectric or electrostrictive devices having a stacked or multilayer structure
SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
G02B 7/08 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
A suspension assembly is described. The suspension assembly including a static member or plate; a moving member or plate movable about an x-axis and a y-axis with respect to the static plate; a sensor mounting region on the moving plate; and one or more shape memory alloy (SMA) elements extending between and coupled to the static plate and moving plate. The SMA elements, when driven by a controller, move the moving plate and the sensor mounting region thereon about the x-axis and the y-axis with respect to the static plate.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
F16F 15/00 - Suppression of vibrations in systemsMeans or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
F16F 15/06 - Suppression of vibrations of non-rotating, e.g. reciprocating, systemsSuppression of vibrations of rotating systems by use of members not moving with the rotating system using elastic means with metal springs
F16M 11/04 - Means for attachment of apparatusMeans allowing adjustment of the apparatus relatively to the stand
F16M 11/18 - Heads with mechanism for moving the apparatus relatively to the stand
F16M 13/02 - Other supports for positioning apparatus or articlesMeans for steadying hand-held apparatus or articles for supporting on, or attaching to, an object, e.g. tree, gate, window-frame, cycle
G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
G03B 5/00 - Adjustment of optical system relative to image or object surface other than for focusing of general interest for cameras, projectors or printers
Treatment solutions and methods for improving adhesion of gold electroplating onto metal surfaces are provided herein. More specifically, the disclosure relates to micro-etching stainless steel surfaces using to remove any organic contamination and chromium oxide formed on the surface, neutralize and strip the surface of any iron content, and repassivate the surface with a thin chromium oxide layer, prior to gold electroplating of the stainless steel surfaces.
C25D 5/36 - Pretreatment of metallic surfaces to be electroplated of iron or steel
C23F 17/00 - Multi-step processes for surface treatment of metallic material involving at least one process provided for in class and at least one process covered by subclass or or class
C23F 1/28 - Acidic compositions for etching iron group metals
C25D 3/48 - ElectroplatingBaths therefor from solutions of gold
Autofocus assembly and related methods are described. One example of an autofocus assembly includes a housing element. The housing element including a hall housing wall configured to secure a hall sensor. The autofocus assembly includes a lens carriage configured to secure a hall magnet and configured to be received within the housing element and configured to define a receiving space between the lens carriage and the housing element to receive one or more bearing elements. The autofocus assembly includes a magnetic element disposed at the hall housing wall and configured to magnetically attract the hall magnet and to secure the hall housing wall to the housing element and secure the one or more bearing elements between the hall housing wall and the lens carriage.
G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
57.
Microetch neutralizer chemistry for Ni—Au plating defect elimination
A neutralizing composition comprising ascorbic acid as a reducing agent, citric acid as a chelator and a pH adjusting agent applied to microetched copper substrates bussed to stainless steel, which have been cleaned with an agent comprising permanganate ions. Unlike the prior art neutralizing agents comprising oxalic acid, which leave insoluble residue on the surface of the copper substrate, the present neutralizing composition leaves no residue and acts quickly. A surprising reduction in defects of Ni—Au plated copper substrates is achieved by utilization of the neutralization composition in a manufacturing process.
SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
G02B 7/04 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
G02B 7/10 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification by relative axial movement of several lenses, e.g. of varifocal objective lens
SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
H04N 5/335 - Transforming light or analogous information into electric information using solid-state image sensors [SSIS]
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
G02B 6/35 - Optical coupling means having switching means
G02B 6/38 - Mechanical coupling means having fibre to fibre mating means
G02B 7/08 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
Autofocus assembly and related methods are described. One example of an autofocus assembly includes a housing element. The housing element including a hall housing wall configured to secure a hall sensor. The autofocus assembly includes a lens carriage configured to secure a hall magnet and configured to be received within the housing element and configured to define a receiving space between the lens carriage and the housing element to receive one or more bearing elements. The autofocus assembly includes a magnetic element disposed at the hall housing wall and configured to magnetically attract the hall magnet and to secure the hall housing wall to the housing element and secure the one or more bearing elements between the hall housing wall and the lens carriage.
G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
An apparatus is described. The apparatus may include a substrate and one or more sensors mounted to the substrate. The one or more sensors may be mounted to the substrate using adhesive material and one or more spot welds.
G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
G01K 7/16 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements
G01L 1/14 - Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
An apparatus is described. The apparatus may include a substrate and one or more sensors mounted to the substrate. The one or more sensors may be mounted to the substrate using adhesive material and one or more spot welds.
G01B 7/16 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
G01B 5/30 - Measuring arrangements characterised by the use of mechanical techniques for measuring the deformation in a solid, e.g. mechanical strain gauge
A suspension assembly for a camera lens element includes a support member with a wire attach structure and a moving member coupled to the support member. The moving member includes a plate, flexure arms extending from the plate and coupled to the support member, and a wire attach structure. A bearing supports the plate of the moving member for movement with respect to the support member. A shape memory alloy wire is coupled to and extends between the wire attach structures of the support member and the moving member. The limiter limits a range of movement of the moving member with respect to the support member, and in embodiments includes an opening in one of the moving member plate and the support member, and a stop that includes an engagement portion extending into the opening in the other of the moving member plate and the support member.
G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
F16F 1/02 - Springs made of steel or other material having low internal frictionWound, torsion, leaf, cup, ring or the like springs, the material of the spring not being relevant
F16F 15/00 - Suppression of vibrations in systemsMeans or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
F16M 13/02 - Other supports for positioning apparatus or articlesMeans for steadying hand-held apparatus or articles for supporting on, or attaching to, an object, e.g. tree, gate, window-frame, cycle
G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
G02B 7/08 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
H05K 7/14 - Mounting supporting structure in casing or on frame or rack
SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
G03B 5/00 - Adjustment of optical system relative to image or object surface other than for focusing of general interest for cameras, projectors or printers
An identification device includes a first metal layer patterned into a planar coil winding and a second metal layer electrically connected to the first metal layer. The first metal layer is operable to provide a circuit inductance. The second metal layer is patterned to provide one or more overlapping areas with the first metal layer. The second metal layer is operable to provide a circuit capacitance. The identification device includes a dielectric layer separating the first metal layer and the second metal layer.
H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
H01Q 23/00 - Antennas with active circuits or circuit elements integrated within them or attached to them
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
H01Q 7/00 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
An identification device includes a first metal layer patterned into a planar coil winding and a second metal layer electrically connected to the first metal layer. The first metal layer is operable to provide a circuit inductance. The second metal layer is patterned to provide one or more overlapping areas with the first metal layer. The second metal layer is operable to provide a circuit capacitance. The identification device includes a dielectric layer separating the first metal layer and the second metal layer.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
70.
METHOD FOR FORMING COMPONENTS WITHOUT ADDING TABS DURING ETCHING
A method for producing a component without tabs during etching. The method includes: applying a wafer tape to the plated side of the substrate; depositing a resist layer on a metal layer on a metal side of the substrate that is opposite of the plated side; exposing the resist layer to UV light; developing the resist layer; and etching the metal layer.
H01L 21/302 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
71.
Method for forming components without adding tabs during etching
A method for producing a component without tabs during etching. The method includes: applying a wafer tape to the plated side of the substrate; depositing a resist layer on a metal layer on a metal side of the substrate that is opposite of the plated side; exposing the resist layer to UV light; developing the resist layer; and etching the metal layer.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
C23C 2/02 - Pretreatment of the material to be coated, e.g. for coating on selected surface areas
C23C 16/02 - Pretreatment of the material to be coated
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
An apparatus is described. The apparatus including a substrate; one or more sensors and one or more electrical circuits formed on the substrate, the one or more electrical circuits electrically coupled with at least one of the one or more sensors; and a metal layer formed over the sensors, wherein the metal layer is positioned over the one or more sensors to provide a barrier.
A system and methods for manufacturing devices such as flexures using process coupons are described are described. The method including performing a test on at least one feature of a coupon, the coupon is included on an assembly sheet used in manufacturing flexures. The at least one feature is produced by a manufacturing processing step that is used to produce a portion of a flexure. And, the physical characteristics of the feature include at least one physical characteristic that is different than physical characteristics of the portion. The method also including determining the manufacturing processing step will produce an abnormal portion of a flexure based on the performed test. Further, the method includes adjusting the manufacturing processing step and manufacturing a portion of a flexure using the adjusted manufacturing processing step.
A camera lens suspension assembly includes a support member including a support metal base layer, a moving member including a moving metal base layer, bearings and smart memory alloy wires. The support member includes a bearing plate portion, static wire attach structures, and mount regions. A printed circuit on the support metal base layer includes traces extending to each static wire attach structure. The moving member includes a moving plate portion, elongated flexure arms extending from a periphery of the moving plate portion and including mount regions on ends opposite the moving plate portion, and moving wire attach structures. The bearings are between and engage the bearing plate portion of the support member and the moving plate portion of the moving member. Each of the smart memory alloy wires is attached to and extends one of the static wire attach structures and one of the moving wire attach structures.
G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
F16F 1/02 - Springs made of steel or other material having low internal frictionWound, torsion, leaf, cup, ring or the like springs, the material of the spring not being relevant
G02B 7/08 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
F16F 15/00 - Suppression of vibrations in systemsMeans or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
F16M 13/02 - Other supports for positioning apparatus or articlesMeans for steadying hand-held apparatus or articles for supporting on, or attaching to, an object, e.g. tree, gate, window-frame, cycle
G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
H05K 7/14 - Mounting supporting structure in casing or on frame or rack
G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
A suspension assembly is described. The suspension assembly including a rigid interposer circuit; a plurality of flexible circuits configured to attach to the rigid interposer circuit and movable about an x-axis and a y-axis with respect to the static plate; and a sensor mounting region on the rigid interposer circuit.
G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
G03B 5/00 - Adjustment of optical system relative to image or object surface other than for focusing of general interest for cameras, projectors or printers
H04N 5/232 - Devices for controlling television cameras, e.g. remote control
H04N 23/68 - Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
76.
SENSOR SHIFT STRUCTURES IN OPTICAL IMAGE STABILIZATION SUSPENSIONS
A suspension assembly is described. The suspension assembly including a rigid interposer circuit; a plurality of flexible circuits configured to attach to the rigid interposer circuit and movable about an x-axis and a y-axis with respect to the static plate; and a sensor mounting region on the rigid interposer circuit.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
F03G 7/00 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for
F16F 15/00 - Suppression of vibrations in systemsMeans or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
G03B 17/00 - Details of cameras or camera bodiesAccessories therefor
SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
H02N 10/00 - Electric motors using thermal effects
G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
G02B 7/08 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
An electrode tab is described. The electrode tab including a base layer and an outer layer disposed on the base layer. The base layer including a sensor.
H01M 50/531 - Electrode connections inside a battery casing
H01M 10/48 - Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
G01R 31/36 - Arrangements for testing, measuring or monitoring the electrical condition of accumulators or electric batteries, e.g. capacity or state of charge [SoC]
G01K 7/16 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements
G01L 9/04 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers of resistance strain gauges
G01L 9/12 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance
G01K 1/02 - Means for indicating or recording specially adapted for thermometers
An electrode tab is described. The electrode tab including a base layer and an outer layer disposed on the base layer. The base layer including a sensor.
Electric tabs and methods for manufacturing are described. A method includes disposing a dielectric layer on a second side of a base material, the base material having a first side and the second side. The method including developing the dielectric layer on the second side of the base material. And, the method including etching the first side of the base material to form an electrode tab.
Electric tabs and methods for manufacturing are described. A method includes disposing a dielectric layer on a second side of a base material, the base material having a first side and the second side. The method including developing the dielectric layer on the second side of the base material. And, the method including etching the first side of the base material to form an electrode tab.
A wire feeding and bonding tool and method for attaching wires to a component having first and second spaced-apart wire attach structures. Wire from a supply is fed through a capillary having at least a linear end portion with a feed opening. The capillary is positioned with respect to the component to locate a first portion of the wire extending from the feed opening adjacent to the first wire attach structure, and the wire is attached to the first attach structure. The capillary is moved with respect to the component along a wire feed path to feed the wire from the first wire attach structure to the second wire attach structure and to locate a second portion of the wire extending from the feed opening adjacent to the second attach structure. The wire is attached to the second wire attach structure, and cut from the supply.
H01R 43/052 - Crimping apparatus or processes with wire-feeding mechanism
B21F 45/00 - Wire-working in the manufacture of other particular articles
B21F 23/00 - Feeding wire in wire-working machines or apparatus
B21F 15/10 - Connecting wire to wire or other metallic material or objectsConnecting parts by means of wire wire with sheet metal
H04N 23/68 - Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
G02B 7/08 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
85.
Wire feeding and attaching system for camera lens suspensions
A wire feeding and bonding tool and method for attaching wires to a component having first and second spaced-apart wire attach structures. Wire from a supply is fed through a capillary having at least a linear end portion with a feed opening. The capillary is positioned with respect to the component to locate a first portion of the wire extending from the feed opening adjacent to the first wire attach structure, and the wire is attached to the first attach structure. The capillary is moved with respect to the component along a wire feed path to feed the wire from the first wire attach structure to the second wire attach structure and to locate a second portion of the wire extending from the feed opening adjacent to the second attach structure. The wire is attached to the second wire attach structure, and cut from the supply.
H01R 43/052 - Crimping apparatus or processes with wire-feeding mechanism
B21F 45/00 - Wire-working in the manufacture of other particular articles
B21F 23/00 - Feeding wire in wire-working machines or apparatus
B21F 15/10 - Connecting wire to wire or other metallic material or objectsConnecting parts by means of wire wire with sheet metal
H04N 23/68 - Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
G02B 7/08 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
86.
Stabilization suspensions and methods of manufacture
A suspension assembly is described. A suspension assembly including a support member configured to receive at least a first circuit member. The first circuit member including at least a trace. The first circuit member disposed on the support member.
F16M 13/02 - Other supports for positioning apparatus or articlesMeans for steadying hand-held apparatus or articles for supporting on, or attaching to, an object, e.g. tree, gate, window-frame, cycle
G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
A system for electroplating a web of conductive material with a source material comprises a transport mechanism, an electrical contact, a plating bath, and at least one nozzle. The transport mechanism transports the web through the system. The electrical contact electrically engages the web to cause current to flow into the web. The plating bath contains a volume of an electrically conductive liquid contain ions of the source material. The nozzle is configured to flow a low electrical conductivity fluid onto the web. A portion of the web is immersed in the electrically conductive liquid. The current flowing in the web causes the ions of the source material in the electrically conductive liquid to attach to a surface of the portion of the web.
A method to fuse ceramic to a metallic substrate is provided. The method includes dispensing a ceramic material onto the metallic substrate and firing of the ceramic material to the metallic substrate at a predetermined temperature. The firing of the ceramic material promotes adhesion between the ceramic material and the metallic substrate.
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
B32B 15/18 - Layered products essentially comprising metal comprising iron or steel
B32B 37/04 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
89.
Multi-layer actuator electrode configuration for resonance improvement
A piezoelectric actuator assembly is described. The piezoelectric actuator assembly includes a first, second and third active piezoelectric layers. The first layer includes a top surface and a bottom surface. The second layer includes a top surface and a bottom surface over the top surface of the first layer. The third layer includes a top surface and a bottom surface over the top surface of the second layer. The first and second layers can define a first effective electrode length. Similarly, the second and third layers can define a second effective electrode length configured to be longer than the first effective electrode length.
Photosensitive polymer formulations, materials and uses of such materials are disclosed. Embodiments of the present disclosure provide photosensitive polyimide materials having chain extenders and formulations thereof that improve elongation and formability of the polyimide materials, and methods of making such polymer materials.
SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
Disk drive head suspension components having microstructured surfaces and a method for making the components. One embodiment of the method includes depositing a layer of photoimageable polymer having an associated set of process parameters including a minimum resolution and exposing the photoimageable polymer through a photomask having a microstructure-producing region with features below the minimum resolution for the photoimageable polymer. The exposed photoimageable polymer is developed to produce a layer of polymer having a thickness and a microstructured surface region with depressions that are less than the thickness of the polymer. In one embodiment the photomask has a microstructure-producing region with features sized and spaced between about 1 μm and 10 μm. Microstructured surfaces on structures such as flying leads, flying termination pads, cover coat layers and at insulating layer-trace interfaces and insulating layer-cover coat interfaces can be manufactured.
SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
G02B 7/08 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
G02B 7/08 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
95.
High aspect ratio electroplated structures and anisotropic electroplating processes
Devices including high-aspect ratio electroplated structures and methods of forming high-aspect ratio electroplated structures are described. A method for manufacturing metal structures includes providing a substrate having a metal base characterized by a height to width aspect ratio A/B and electroplating a metal crown on the base to form the metal structure with a height to width aspect ratio A/S greater than the aspect ratio A/B of the base.
C25D 5/02 - Electroplating of selected surface areas
C25D 5/18 - Electroplating using modulated, pulsed or reversing current
C25D 7/00 - Electroplating characterised by the article coated
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
A gold electroplating solution includes a gold (III) cyanide compound, a chloride compound, and hydrochloric acid. The gold (III) cyanide compound is potassium gold (III) cyanide, ammonium gold (III) cyanide, or sodium gold (III) cyanide. The chloride compound is potassium chloride, ammonium chloride, or sodium chloride. Various structures may be made with the gold electroplating solution having a gold layer deposited directly on the stainless steel (SST) layer using a photolithography process. Such structures include a gold pattern having a discontinuous pattern, a bond pad region having one or more traces on the opposite side of the dielectric layer, a gimbal having gold bond pads, and a bonding joint having an electrical interface including a gold layer.
Devices including a substrate and a plurality of coil portions disposed on the substrate. The plurality of coil portions electrically coupled to form a coil structure.
An etch chemistry solution for treating metallic surfaces in which the etch chemistry solution includes an oxidizing agent and gluconic acid. The etch chemistry solution may also include an oxidizing agent and a short-chained polyethylene polymer glycol or a short-chained polyethylene copolymer glycol. The metallic surfaces are usually used in circuits such as flexible circuits.
H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
C09K 13/06 - Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
G11B 5/48 - Disposition or mounting of heads relative to record carriers
An apparatus is described. The apparatus including a substrate; one or more sensor components formed on the substrate; and one or more electrical circuits formed on the substrate electrically coupled with at least one of the one or more sensor components formed on the substrate.
G01L 1/14 - Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
B25J 13/08 - Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
G01K 7/02 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using thermoelectric elements, e.g. thermocouples
G01L 5/22 - Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring the force applied to control members, e.g. control members of vehicles, triggers
100.
High-aspect ratio electroplated structures and anisotropic electroplating processes
A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.
B32B 3/00 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form
