3 is 0-5%, and CuO+SnO is 0-4%. The glass material has low-temperature softening properties, melt stability, and a low coefficient of thermal expansion and is inhibited from thermally adversely affecting organic EL elements The glass material can attain high sealing properties and high sealing strength in high yield.
A lead-free glass material for sealing organic EL elements is provided with which satisfactory sealing quality is obtained through laser sealing without requiring the addition of a metallic powder. The glass material has excellent low-temperature softening properties, excellent melt stability, and a low coefficient of thermal expansion and is sufficiently inhibited from thermally adversely affecting the organic EL elements, and the sealing conditions need not to be strictly managed or controlled. The glass material can attain high sealing properties and high sealing strength in high yield. The lead-free glass material for sealing organic EL elements has a glass composition which comprises, in terms of mol%, 30-60% V2O5, 5-20% ZnO, 5-20% BaO, 15-40% TeO2, 0-7% Nb2O5, 0-7% Al2O3, 0-5% SiO2, 0-5% MgO, 0-5% Sb2O3, 0-4% CuO, and 0-4% SnO and in which Nb2O5+Al2O3 is 0.5-10%, SiO2+MgO+Sb2O3 is 0-5%, and CuO+SnO is 0-4%.
H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
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