Black coatings on optical substrates, compositions for producing such coatings and the use of the compositions for edge-blackening and stray light control. The present coatings comprise a film formed by a cured polymer mixed with nanoparticles and black pigment, wherein the film has a refractive index of more than 1.6. The present compositions comprise 5 to 100 parts by weight of a curable polymer; 5 to 100 parts by weight of nanoparticles; and 0.1 to 20 parts by weight of black pigment, and the nanoparticles and black pigment are mixed with the curable polymer. The present compositions exhibit RI values which match that of high-RI glass substrates while providing efficient edge-blackening properties.
Black coatings on optical substrates, compositions for producing such coatings and the use of the compositions for edge-blackening and stray light control. The present coatings comprise a film formed by a curable composition mixed with nanoparticles and black pigment, wherein the film has a refractive index of more than 1.75. The present cured compositions comprise 0 to 50 parts by weight of a curable polymers; 0 to 50 parts by weight of curable monomers; 50 to 100 parts by weight of nanoparticles; and 0.1 to 20 parts by weight of black pigment, and the nanoparticles and black pigment are mixed with the curable polymers and monomers. The present compositions exhibit RI values which match that of high-RI glass substrates while providing efficient edge-blackening properties.
C09D 5/00 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects producedFilling pastes
C09D 4/06 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups
Black coatings on optical substrates, compositions for producing such coatings and the use of the compositions for edge-blackening and stray light control. The present coatings comprise a film formed by a cured polymer mixed with nanoparticles and black pigment, wherein the film has a refractive index of more than 1.6. The present compositions comprise 5 to 100 parts by weight of a curable polymer; 5 to 100 parts by weight of nanoparticles; and 0.1 to 20 parts by weight of black pigment, and the nanoparticles and black pigment are mixed with the curable polymer. The present compositions exhibit RI values which match that of high-RI glass substrates while providing efficient edge-blackening properties.
B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
A composition for a low refractive film, said composition comprising 10 parts by weight of a polysiloxane and 3 to 150 parts by weight of a volatile hydroxyalkylsilane. Based on the polysiloxane composition, films can be produced having a porous polysiloxane network and exhibiting a low refractive index of 1.4 or less and dielectric constant of 1.5 or less.
C08J 9/28 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof by elimination of a liquid phase from a macromolecular composition or article, e.g. drying of coagulum
C08K 5/5419 - Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
C08K 5/5425 - Silicon-containing compounds containing oxygen containing at least one C=C bond
C08L 83/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
5 is an alkyl or aryl group, and where b=1 to 2, and c=1 to (4−b). The first and second compounds are polymerized together to form a siloxane polymer and a plurality of particles mixed with the siloxane polymer.
C08F 2/46 - Polymerisation initiated by wave energy or particle radiation
C08F 2/50 - Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
C08G 61/04 - Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
C08G 77/18 - Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
C08L 83/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
C08G 77/08 - Preparatory processes characterised by the catalysts used
C08G 77/50 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
C08K 3/00 - Use of inorganic substances as compounding ingredients
C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
C08G 77/14 - Polysiloxanes containing silicon bound to oxygen-containing groups
A composition for a low refractive film, said composition comprising 10 parts by weight of a polysiloxane and 3 to 150 parts by weight of a volatile hydroxyalkylsilane. Based on the polysiloxane composition, films can be produced having a porous polysiloxane network and exhibiting a low refractive index of 1.4 or less and dielectric constant of 1.5 or less.
An adhesive or encapsulant composition, having a siloxane polymer having a molecular weight of from 300 to 150,000 g/mol and having a viscosity of from 1000 to 100,000 mPa-sec at 5 rpm viscometer and at 25° C., and a curing agent that aids in curing the siloxane polymer upon the application of ultraviolet light. The composition is transmissive to visible light with an optical transmissivity of 95% or more in the visible spectrum at a thickness of 1 mm or less, and wherein the siloxane polymer is a material formed without hydrosilylation and has less than 5 mol % of Si—OH groups compared to all groups bound to Si therein, and substantially no Si—H bonds.
H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H01L 33/56 - Materials, e.g. epoxy or silicone resin
H01L 51/52 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) - Details of devices
C03C 17/30 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with organic material with silicon-containing compounds
C08L 83/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
C08G 77/14 - Polysiloxanes containing silicon bound to oxygen-containing groups
C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
Phenoxyphenylsilane monomers were synthesized and polymerized. The polymers have high refractive indices and excellent UV and thermal stability. Their water and oxygen permeability is lower than commercial phenyl silicone elastomers. They show good compatibility with metal oxide nanoparticles. The polymers of the invention are suitable as LED encapsulant, as light guide material in CMOS image sensors, in OLED devices, lasers and in other optical applications.
C08G 77/18 - Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
C09D 183/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
C08L 83/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
C07F 7/08 - Compounds having one or more C—Si linkages
C07F 7/18 - Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
C08G 77/08 - Preparatory processes characterised by the catalysts used
C08G 77/16 - Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxy groups
H01L 33/56 - Materials, e.g. epoxy or silicone resin
9.
Electrically conductive siloxane particle films, and devices with the same
A display has a plurality of pixels in a matrix, the pixels each comprising a liquid crystal layer and/or light emitting diode layer, a plurality of substrates, at least a first substrate being optically transmissive to visible light, an electrode formed on one of the substrates and having electrically conductive material that has an electrical resistivity of less than 200 Ω/sq and that comprises a siloxane material and particles having an average particle size of less than 10 microns.
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
H01L 51/44 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation - Details of devices
C08G 77/14 - Polysiloxanes containing silicon bound to oxygen-containing groups
H01L 51/52 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) - Details of devices
C09D 183/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
C09J 183/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
10.
Dielectric siloxane particle films and devices having the same
An optical coating has a siloxane polymer and noble metal particles. The coating has an index of refraction that is different for in-plane and out-of-plane. The coating has reverse optical dispersion within the visible wavelength range, and preferably a maximum absorption peak between 400-1000 nm wavelength range is greater than 700 nm. In one example the metal particles are noble metal nanorods having an average particle width of less than 400 nm.
G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
G02F 1/13363 - Birefringent elements, e.g. for optical compensation
G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
An LED lamp is formed from a die substrate wherein the substrate has formed thereon a semiconductor material, an electrode for the application of a bias across the semiconductor material for causing light to be emitted therefrom, and an adhesive that bonds the die substrate to a support substrate, wherein the adhesive is a polymerized siloxane polymer having a thermal conductivity of greater than 0.1 watts per meter kelvin (W/(m·K)) wherein the adhesive is not light absorbing, wherein the siloxane polymer has silicon and oxygen in the polymer backbone, as well as aryl or alky groups bound thereto, and wherein the adhesive further comprises particles having an average particle size of less than 100 microns.
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
H01L 33/20 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
Phenoxyphenylsilane monomers were synthesized and polymerized. The polymers have high refractive indices and excellent UV and thermal stability. Their water and oxygen permeability is lower than commercial phenyl silicone elastomers. They show good compatibility with metal oxide nanoparticles. The polymers of the invention are suitable as LED encapsulant, as light guide material in CMOS image sensors, in OLED devices, lasers and in other optical applications.
C08L 83/00 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon onlyCompositions of derivatives of such polymers
C07F 7/08 - Compounds having one or more C—Si linkages
C07F 7/18 - Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
C08G 77/12 - Polysiloxanes containing silicon bound to hydrogen
C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08L 83/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
H01L 33/56 - Materials, e.g. epoxy or silicone resin
C09D 183/08 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
C08K 5/56 - Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
13.
SILOXANE MONOMERS, THEIR POLYMERIZATION AND USES THEREOF
Phenoxyphenylsilane monomers were synthesized and polymerized. The polymers have high refractive indices and excellent UV and thermal stability. Their water and oxygen permeability is lower than commercial phenyl silicone elastomers. They show good compatibility with metal oxide nanoparticles. The polymers of the invention are suitable as LED encapsulant, as light guide material in CMOS image sensors, in OLED devices, lasers and in other optical applications.
5 is an alkyl or aryl group, and where b=1 to 2, and c=1 to (4−b). The first and second compounds are polymerized together to form a siloxane polymer. The siloxane polymer can be then used in a final composition where the siloxane polymer comprises from 5 to 100% by weight, and filler (e.g. microparticles, nanoparticles, nanowires, etc.) comprises from zero to 95% by weight. The siloxane polymer composition is useful in a variety of areas such as an adhesive, e.g. as a die attach adhesive in semiconductor (e.g. LED) packaging applications, encapsulants, optical coatings, protective coatings, and other applications.
C08F 2/46 - Polymerisation initiated by wave energy or particle radiation
C08F 2/50 - Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
C08G 61/04 - Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
C08G 77/18 - Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
C08L 83/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
C08G 77/08 - Preparatory processes characterised by the catalysts used
C08G 77/50 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
C08K 3/00 - Use of inorganic substances as compounding ingredients
C08G 77/14 - Polysiloxanes containing silicon bound to oxygen-containing groups
C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
An adhesive or encapsulant composition, having a siloxane polymer having a molecular weight of from 300 to 150,000 g/mol and having a viscosity of from 1000 to 100,000 mPa-sec at 5 rpm viscometer and at 25° C., and a curing agent that aids in curing the siloxane polymer upon the application of ultraviolet light. The composition is transmissive to visible light with an optical transmissivity of 95% or more in the visible spectrum at a thickness of 1 mm or less, and wherein the siloxane polymer is a material formed without hydrosilylation and has less than 5 mol % of Si—OH groups compared to all groups bound to Si therein, and substantially no Si—H bonds.
C08L 83/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
C03C 17/30 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with organic material with silicon-containing compounds
G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H01L 33/56 - Materials, e.g. epoxy or silicone resin
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
H01L 51/52 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) - Details of devices
C08G 77/14 - Polysiloxanes containing silicon bound to oxygen-containing groups
C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
A method for making a dielectric film includes a substrate on which is deposited a siloxane starting material and particles, wherein the siloxane starting material has a siloxane polymer, a siloxane oligomer and/or silane monomers, and wherein the particles have an average particle size of less than 400 nm. After deposition, heat and/or electromagnetic energy is applied to the siloxane particle layer so as to cure the layer and form a dielectric film on the substrate. The formed film is optically transmissive to visible light and transmits at least 80% of the visible light incident thereon, and is electrically insulating and has a sheet resistance of 1000 Ω/sq or more.
C08L 83/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
H01L 33/56 - Materials, e.g. epoxy or silicone resin
C08G 77/14 - Polysiloxanes containing silicon bound to oxygen-containing groups
C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H01L 51/52 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) - Details of devices
C08L 83/00 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon onlyCompositions of derivatives of such polymers
A display has a plurality of pixels in a matrix, the pixels each comprising a liquid crystal layer and/or light emitting diode layer, a plurality of substrates, at least a first substrate being optically transmissive to visible light, an electrode formed on one of the subtrates and having electrically conductive material that has an electrical resistivity of less than 200 Ω/sq and that comprises a siloxane material and particles having an average particle size of less than 10 microns.
C09D 183/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
C09J 183/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
H01L 51/52 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) - Details of devices
18.
THREE DIMENSONAL PRINTING MATERIALS AND METHOD FOR MAKING A 3D PRINTED ARTICLE
Methods and materials are dislosed for making three dimensional articles via 3d printing. The methods can include printing both electrically insulating and electrically conducting portions, transparent, reflective or opaque portions, transparent portions having different refractive indices, portions of different colors, and where the various deposited portions are UV or heat curable, and optionally comprise particles, such as metallic particles in electrically conductive portions and ceramic particles in electrically insulating portions. A variety of 3D articles can be made, such as transparent articles such as eyeglasses, or electronics articles such as portions of smartphones, tablets or the like.
An optical coating has a siloxane polymer and noble metal particles. The coating has an index of refraction that is different for in-plane and out-of-plane. The coating has reverse optical dispersion within the visible wavelength range, and preferably a maximum absorption peak between 400–1000nm wavelength range is greater than 700nm. In one example the metal particles are noble metal nanorods having an average particle width of less than 400nm.
Phenoxyphenylsilane monomers were synthesized and polymerized. The polymers have high refractive indices and excellent UV and thermal stability. Their water and oxygen permeability is lower than commercial phenyl silicone elastomers. They show good compatibility with metal oxide nanoparticles. The polymers of the invention are suitable as LED encapsulant, as light guide material in CMOS image sensors, in OLED devices, lasers and in other optical applications.
An adhesive or encapsulant composition, having a siloxane polymer having a molecular weight of from 300 to 150,000 g/mol and having a viscosity of from1000 to 100,000 mPa-sec at 5 rpm viscometer and at 25º C, and a curing agent that aids in curing the siloxane polymer upon the application of ultraviolet light. The composition is transmissive to visible light with an optical transmissivity of 95% or more in the visible spectrum at a thickness of 1 mm or less, and wherein the siloxane polymer is a material formed without hydrosilylation and has less than 5 mol% of Si-OH groups compared to all groups bound to Si therein, and substantially no Si-H bonds.
An LED lamp is formed from a die substrate wherein the substrate has formed thereon a semiconductor material, an electrode for the application of a bias across the semiconductor material for causing light to be emitted therefrom, and an adhesive that bonds the die substrate to a support substrate, wherein the adhesive is a polymerized siloxane polymer having a thermal conductivity of greater than 0.1watts per meter kelvin(W/(m·K)) wherein the adhesive is not light absorbing, wherein the siloxane polymer has silicon and oxygen in the polymer backbone, as well as aryl or alky groups bound thereto, and wherein the adhesive further comprises particles having an average particle size of less than 100 microns.
ABSTRACT OF THE DISCLOSURE A composition has a siloxane material and a filler material that comprises particles preferably with a particle size of less than 100 microns. The siloxane material can have a [-Si-O-Si-O]n repeating backbone, with preferably alkyl or aryl groups thereon, and b) as well as functional cross-linking groups thereon. The composition also has a filler material that includes particles that can be metal, semi-metal or ceramic particles. The composition may also include coupling agents, a catalyst, antioxidants, etc. The composition can be used in a wide variety of areas, such as an adhesive, encapsulant, solder or other layer in a semiconductor package or the like.
A method for making a dielectric film includes a substrate on which is deposited a siloxane starting material and particles,wherein the siloxane starting material has a siloxane polymer, a siloxane oligomer and/or silane monomers, and wherein the particles have an average particle size of less than 400nm. After deposition, heat and/or electromagnetic energy is applied to the siloxane particle layer so as to cure the layer and form a dielectric film on the substrate. The formed film is is optically transmissive to visible light and transmits at least 80% of the visible light incident thereon, and is electrically insulating and has a sheet resistance of 1000 Ω/sq or more.
C08G 77/14 - Polysiloxanes containing silicon bound to oxygen-containing groups
C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
C08L 83/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
H01L 33/56 - Materials, e.g. epoxy or silicone resin
A siloxane polymer is made by providing a first compound having the chemical formula SiR1aR24-a where a is from 1 to 3, R1 is a reactive group, and R2 is an alkyl group or an aryl group, and providing a second compound having the chemical formula SiR3bR4cR54-(b+c) where R3 is a cross- linking functional group, R4 is a reactive group, and R5 is an alkyl or aryl group, and where b = 1 to 2, and c = 1 to (4-b). The first and second compounds are polymerized together to form a siloxane polymer. The siloxane polymer can be then used in a final composition where the siloxane polymer comprises from 5 to 100% by weight, and filler (e.g. microparticles, nanoparticles, nanowires, etc.) comprises from zero to 95% by weight. The siloxane polymer composition is useful in a variety of areas such as an adhesive, e.g. as a die attach adhesive in semiconductor (e.g. LED) packaging applications, encapsulants, optical coatings, protective coatings, and other applications.
01 - Chemical and biological materials for industrial, scientific and agricultural use
17 - Rubber and plastic; packing and insulating materials
40 - Treatment of materials; recycling, air and water treatment,
Goods & Services
Chemicals used in industry, science and photography, as well
as in agriculture, horticulture and forestry; unprocessed
artificial resins, unprocessed plastics; manures; tempering
and soldering preparations; adhesives used in industry;
industrial chemicals; industrial adhesives; industrial
electrolytes; chemical preparations having conductive
properties; chemicals and chemical preparations for use in
the manufacture of coatings, pigments, paper, carton board,
printing materials, plastics and printing inks; chemical
plating solutions; chemicals for use in metal plating;
chemicals used for plating non-conducting surfaces with
metals; chemicals having antimicrobial properties [other
than medical or veterinary]; formulations for electroplating
metals; compositions for coating metal in preparation for
plating; metal plating compositions; plating solutions;
protective coatings containing particles; raw plastics in
the form of powders, liquids or pastes; unprocessed
artificial resins as raw materials in the form of powders,
liquids or pastes. Rubber, gutta-percha, gum, asbestos, mica and polymer film
for use in the manufacture of printed circuit boards and
display panels; plastics in extruded form for use in
manufacture; insulating materials, namely, electrical
insulating materials, insulating and protective interlayer
dielectric materials and coatings for use in integrated
circuits, semiconductor devices, computer disk drives and
other computer hardware, and insulating film for use in the
manufacture of semiconductors; flexible pipes, not of metal. Aluminum plating; copper plating; electroplating;
galvanization; gilding; gold-plating; grinding; laminating;
magnesium plating; metal plating; metal treating; metal
tempering; metal casting; nickel plating; printing; refining
services; silver-plating; soldering; sorting of waste and
recyclable material [transformation]; tin-plating; material
treatment information; vulcanization [material treatment];
waste treatment [transformation]; water treating; zinc
plating.
01 - Chemical and biological materials for industrial, scientific and agricultural use
17 - Rubber and plastic; packing and insulating materials
40 - Treatment of materials; recycling, air and water treatment,
Goods & Services
Chemicals used in industry, science and photography, as well
as in agriculture, horticulture and forestry; unprocessed
artificial resins, unprocessed plastics; manures; tempering
and soldering preparations; adhesives used in industry;
industrial chemicals; industrial adhesives; industrial
electrolytes; chemical preparations having conductive
properties; chemicals and chemical preparations for use in
the manufacture of coatings, pigments, paper, carton board,
printing materials, plastics and printing inks; chemical
plating solutions; chemicals for use in metal plating;
chemicals used for plating non-conducting surfaces with
metals; chemicals having antimicrobial properties [other
than medical or veterinary]; formulations for electroplating
metals; compositions for coating metal in preparation for
plating; metal plating compositions; plating solutions;
protective coatings containing particles; raw plastics in
the form of powders, liquids or pastes; unprocessed
artificial resins as raw materials in the form of powders,
liquids or pastes. Rubber, gutta-percha, gum, asbestos, mica and polymer film
for use in the manufacture of printed circuit boards and
display panels; plastics in extruded form for use in
manufacture; insulating materials, namely, electrical
insulating materials, insulating and protective interlayer
dielectric materials and coatings for use in integrated
circuits, semiconductor devices, computer disk drives and
other computer hardware, and insulating film for use in the
manufacture of semiconductors; flexible pipes, not of metal. Aluminum plating; copper plating; electroplating;
galvanization; gilding; gold-plating; grinding; laminating;
magnesium plating; metal plating; metal treating; metal
tempering; metal casting; nickel plating; printing; refining
services; silver-plating; soldering; sorting of waste and
recyclable material [transformation]; tin-plating; material
treatment information; vulcanization [material treatment];
waste treatment [transformation]; water treating; zinc
plating.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Chemicals used in industry, science and [ photography, as well as in agriculture, ] horticulture, [ and forestry ] except fungicides, herbicides, insecticides and parasiticides; unprocessed artificial resins, unprocessed plastics; manures; [ tempering preparations ] and soldering chemicals; adhesives used in industry; industrial chemicals; industrial adhesives; industrial electrolytes, namely, electrolytes for plating and stripping metals; chemical preparations having conductive properties for use in industry; chemicals and chemical preparations for use in the manufacture of coatings, pigments, [ paper, carton board, ] printing materials, plastics and printing inks; chemical plating solutions, namely, metal plating chemical compositions; chemicals for use in metal plating; chemicals used for plating non-conducting surfaces with metals; chemicals having antimicrobial properties other than for medical or veterinary purposes for industrial use; chemicals for electroplating metals; chemical preparations for coating metal in preparation for plating; metal plating chemical compositions; plating solutions, namely, metal plating chemical compositions; protective coatings containing particles, namely, chemical coatings used in the manufacture of printed circuit boards; raw plastics in the form of powders, liquids or pastes; unprocessed artificial resins as raw materials in the form of powders, liquids or pastes
01 - Chemical and biological materials for industrial, scientific and agricultural use
17 - Rubber and plastic; packing and insulating materials
40 - Treatment of materials; recycling, air and water treatment,
Goods & Services
Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins, unprocessed plastics; manures; tempering and soldering preparations; adhesives used in industry; industrial chemicals; industrial adhesives; industrial electrolytes; chemical preparations having conductive properties; chemicals and chemical preparations for use in the manufacture of coatings, pigments, paper, carton board, printing materials, plastics and printing inks; chemical plating solutions; chemicals for use in metal plating; chemicals used for plating non-conducting surfaces with metals; chemicals having antimicrobial properties [other than medical or veterinary]; formulations for electroplating metals; compositions for coating metal in preparation for plating; metal plating compositions; plating solutions; protective coatings containing particles; raw plastics in the form of powders, liquids or pastes; unprocessed artificial resins as raw materials in the form of powders, liquids or pastes. Rubber, gutta-percha, gum, asbestos, mica and polymer film for use in the manufacture of printed circuit boards and display panels; plastics in extruded form for use in manufacture; insulating materials, namely, electrical insulating materials, insulating and protective interlayer dielectric materials and coatings for use in integrated circuits, semiconductor devices, computer disk drives and other computer hardware, and insulating film for use in the manufacture of semiconductors; flexible pipes, not of metal. Aluminum plating; copper plating; electroplating; galvanization; gilding; gold-plating; grinding; laminating; magnesium plating; metal plating; metal treating; metal tempering; metal casting; nickel plating; printing; refining services; silver-plating; soldering; sorting of waste and recyclable material [transformation]; tin-plating; material treatment information; vulcanization [material treatment]; waste treatment [transformation]; water treating; zinc plating.
01 - Chemical and biological materials for industrial, scientific and agricultural use
17 - Rubber and plastic; packing and insulating materials
40 - Treatment of materials; recycling, air and water treatment,
Goods & Services
Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins, unprocessed plastics; manures; tempering and soldering preparations; adhesives used in industry; industrial chemicals; industrial adhesives; industrial electrolytes; chemical preparations having conductive properties; chemicals and chemical preparations for use in the manufacture of coatings, pigments, paper, carton board, printing materials, plastics and printing inks; chemical plating solutions; chemicals for use in metal plating; chemicals used for plating non-conducting surfaces with metals; chemicals having antimicrobial properties [other than medical or veterinary]; formulations for electroplating metals; compositions for coating metal in preparation for plating; metal plating compositions; plating solutions; protective coatings containing particles; raw plastics in the form of powders, liquids or pastes; unprocessed artificial resins as raw materials in the form of powders, liquids or pastes. Rubber, gutta-percha, gum, asbestos, mica and polymer film for use in the manufacture of printed circuit boards and display panels; plastics in extruded form for use in manufacture; insulating materials, namely, electrical insulating materials, insulating and protective interlayer dielectric materials and coatings for use in integrated circuits, semiconductor devices, computer disk drives and other computer hardware, and insulating film for use in the manufacture of semiconductors; flexible pipes, not of metal. Aluminum plating; copper plating; electroplating; galvanization; gilding; gold-plating; grinding; laminating; magnesium plating; metal plating; metal treating; metal tempering; metal casting; nickel plating; printing; refining services; silver-plating; soldering; sorting of waste and recyclable material [transformation]; tin-plating; material treatment information; vulcanization [material treatment]; waste treatment [transformation]; water treating; zinc plating.
