The present embodiments relate to methods and apparatuses for providing fault protection in a power controller such as a voltage regulator, and particularly protection against reverse over current fault conditions. Some embodiments are capable of distinguishing between different types of reverse over current conditions, such as a high-side short or a normal over voltage condition. In these and other embodiments, fault protection is performed in favor of a load connected to the voltage regulator, rather than components of the voltage regulator itself.
H02M 3/157 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators with digital control
H02H 7/12 - Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions for convertersEmergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions for rectifiers for static converters or rectifiers
H02M 3/156 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
An apparatus including a proportional gain circuit, an integral gain circuit, a limit circuit, a gain booster circuit and a combiner. The gain circuits apply a proportional gain and an integral gain to an error signal, and the combiner combines both gained error signals to provide a control signal. The limit circuit applies a limit function that limits the proportional gain to a magnitude. The gain booster circuit increases gain while the limit function is being applied. The increased gain may be applied to only the integral gain, or to both the integral and proportional gains such as by boosting gain of the error signal. The apparatus may be a regulator that may include multiple control loops providing multiple error signals, in which a mode selector selects one of the error signals to control regulation. The limit function increases stability while the boosted gain improves transient response during mode transitions.
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
H03K 5/08 - Shaping pulses by limiting, by thresholding, by slicing, i.e. combined limiting and thresholding
H02M 3/156 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
H02J 7/02 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries for charging batteries from AC mains by converters
A voltage error signal is provided to a PWM controller of a voltage regular and used to produce a PWM signal that drives a power stage of the regulator. When operating in an adapter current limit regulation mode, an adapter current sense voltage, indicative of an adapter current, is compared to an adapter current reference voltage to produce an adapter current error signal. A compensator receives the adapter current error signal and outputs a compensated adapter current error signal. The adapter current sense voltage, or a high pass filtered version thereof, is subtracted from the compensated adapter current error signal to produce the voltage error signal provided to the PWM controller. Alternatively, an input voltage, or a high pass filtered version thereof, is added to the compensated adapter current error signal to produce the voltage error signal.
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
H02J 3/00 - Circuit arrangements for ac mains or ac distribution networks
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 7/04 - Conversion of AC power input into DC power output without possibility of reversal by static converters
H02M 1/14 - Arrangements for reducing ripples from DC input or output
One embodiment pertains to a method including determining if external power is supplied to a power system which includes a DC-DC voltage converter; if external power is not supplied to the power system, then turn on a switching transistor in the DC-DC voltage converter and provide battery power to the load through the switching transistor; if external power is supplied to the power system, then charge a battery.
The present embodiments relate to methods and apparatuses for providing fault protection in a power controller such as a voltage regulator, and particularly protection against reverse over current fault conditions. Some embodiments are capable of distinguishing between different types of reverse over current conditions, such as a high-side short or a normal over voltage condition. In these and other embodiments, fault protection is performed in favor of a load connected to the voltage regulator, rather than components of the voltage regulator itself.
H02M 3/157 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators with digital control
H02H 7/12 - Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions for convertersEmergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions for rectifiers for static converters or rectifiers
H02M 3/156 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
One embodiment is directed towards an encapsulated device. The encapsulated device includes a device, and a first encapsulation covering the device. The first encapsulation has one or more exterior surfaces. One or more recesses in one or more of the exterior surfaces is configured to receive a second encapsulation.
Photodetectors, methods for use in manufacturing photodetectors, and systems including photodetectors, are described herein. In an embodiment, a photodetector includes a plurality of photodiode regions, at least some of which are covered by an optical filter. A plurality of metal layers are located between the photodiode regions and the optical filter. The metal layers include an uppermost metal layer that is closest to the optical filter and a lowermost metal layer that is closest to the photodiode regions. One or more inter-level dielectric layers separate the metal layers from one another. Each of the metal layers includes one or more metal portions and one or more dielectric portions. The uppermost metal layer is devoid of any metal portions underlying the optical filter.
In an embodiment, a power supply includes first and second supply input nodes, a supply output node, first and second switch circuits, a filter circuit, and a drive circuit. The first and second supply input nodes are respectively configured to receive first and second input voltages, and the supply output node is configured to provide an output voltage. The first switch circuit has a first conduction node coupled to the first supply input node, a second conduction node, and a control node configured to receive a first control signal, and the filter circuit has a first node coupled to the second conduction node and has a second node. The second switch circuit has a first conduction node coupled to the second node of the filter circuit, a second conduction node coupled to the second supply input node, and a control node. And the drive circuit has an input node coupled to one of the control node of the first switch circuit and the first node of the filter circuit, and has an output node coupled to the control node of the second switch circuit.
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 3/156 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
One embodiment is directed towards a molded insulator substrate. The molded insulator substrate includes a first insulator having a first surface and a second surface. A recess in said first surface of the first insulator is configured to facilitate venting of a second insulator over exposed regions of the first surface. A first conductive terminal is exposed through the first surface. A second conductive terminal is exposed through the second surface and electrically coupled to the first terminal.
H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
10.
Method and system controlling DC-DC voltage converters using tracking signal
On embodiment pertains to an apparatus including a control loop configured to receive an output voltage sense signal. The control loop includes a compensator; a PWM signal generator coupled to an output of the compensator; a reference circuit configured to receive a tracking signal, and which is configured to low bandwidth low pass filter the tracking signal when the tracking signal amplitude becomes substantially constant and representative of an output voltage that is substantially non-zero, and an error amplifier having a first input coupled to an output of the reference circuit, a second input configured to receive the output voltage sense signal, and an output coupled to the compensator.
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
G05F 1/46 - Regulating voltage or current wherein the variable actually regulated by the final control device is DC
H02M 3/156 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
Systems and methods for an open wire scan are provided. In certain embodiments, An apparatus comprising a circuit includes a plurality of inputs for connecting with a plurality of outputs of a multi-cell battery pack; and an open connection detection circuit, formed within the circuit, for detecting an open connection on at least one of the plurality of inputs connected to the multi-cell battery pack and generating a fault condition responsive thereto. The open connection detection circuit comprises at least one current source device; and at least one device for turning on and off the at least one current source device. The open connection detection circuit also comprises at least one amplifier; an analog to digital converter; and a control logic circuit.
G01R 31/36 - Arrangements for testing, measuring or monitoring the electrical condition of accumulators or electric batteries, e.g. capacity or state of charge [SoC]
G01R 31/396 - Acquisition or processing of data for testing or for monitoring individual cells or groups of cells within a battery
G01R 31/50 - Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
G01R 31/3835 - Arrangements for monitoring battery or accumulator variables, e.g. SoC involving only voltage measurements
G01R 19/165 - Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values
12.
Method and system for reducing transients in DC-DC converters
One embodiment pertains to a method including determining the duty cycle of a PWM signal, operating in valley current control mode when the duty cycle is greater than fifty percent, operating in peak current control mode when the duty cycle is less than fifty percent, and including, commencing a PWM pulse upon the occurrence of a pulse of a first clock signal pulse, and terminating the PWM pulse upon a level of a signal exceeding a positive window threshold.
G06F 1/26 - Power supply means, e.g. regulation thereof
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
A system, DC-DC converter, and compensation method and circuit for a DC-DC converter are disclosed. For example, a compensation circuit for a DC-DC converter is disclosed. The compensation circuit includes an integrator circuit configured to receive and integrate a first voltage signal, a differential difference amplifier circuit coupled to the integrator circuit and configured to generate a first filter transfer function associated with the integrated first voltage signal, and a switched capacitor filter circuit coupled to the differential difference amplifier circuit and configured to generate a second filter transfer function, wherein the differential difference amplifier is further configured to output a second voltage signal responsive to the first filter transfer function and the second filter transfer function. In one implementation, the compensation circuit is a type-III switched capacitor filter (SCF) compensation circuit.
H02M 3/156 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
An optical proximity detector includes a driver, light detector, analog front-end, sensor(s) that sense correction factor(s) (e.g., temperature, supply voltage and/or forward voltage drop), and a digital back end. The driver drives the light source to emit light. The light detector produces a light detection signal indicative of a magnitude and a phase of a portion of the emitted light that reflects off an object and is incident on the light detector. The analog front-end receives the light detection signal and outputs a digital light detection signal, or digital in-phase and quadrature-phase signals, which are provided to the digital back-end. The digital back-end performs closed loop correction(s) for dynamic variation(s) in gain and/or phase caused by a portion of the analog front-end, uses polynomial equation(s) and sensed correction factor(s) to perform open loop correction(s) for dynamic variations in temperature, supply voltage and/or forward voltage drop, and outputs a distance value.
G08B 21/00 - Alarms responsive to a single specified undesired or abnormal condition and not otherwise provided for
G06F 3/03 - Arrangements for converting the position or the displacement of a member into a coded form
G01S 17/36 - Systems determining position data of a target for measuring distance only using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated with phase comparison between the received signal and the contemporaneously transmitted signal
Body contact layouts for semiconductor structures are disclosed. In at least one exemplary embodiment, a semiconductor structure comprises: a plurality of gates disposed on a semiconductor layer, each gate extending parallel to a y-axis in a coordinate space; a source region disposed between two of the plurality of gates; a plurality of body contacts disposed in each source region; and wherein a portion of each source region, adjacent to the gate, has a width extending parallel to the y-axis that is greater than the width of the source region parallel to the y-axis at a distance on an x-axis from the gate.
H01L 29/10 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
H01L 27/088 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
H01L 23/535 - Arrangements for conducting electric current within the device in operation from one component to another including internal interconnections, e.g. cross-under constructions
H01L 29/78 - Field-effect transistors with field effect produced by an insulated gate
H01L 29/06 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions
H01L 29/08 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01L 23/528 - Layout of the interconnection structure
A circuit for generating an output voltage to a top node of a plurality of LED strings. The circuit includes an inductor having a load current flowing therethrough and a switching transistor responsive to a switching control signal. An integrator generates a compensation voltage responsive to a voltage at a bottom node of the LED string and a reference voltage. Circuitry for combining an a correction offset with the compensation voltage is responsive to the compensation voltage and the load current through the inductor. The offset is generated only during a step load change of the load current and substantially reduces voltage transients from the compensation voltage and the output voltage. A summation circuit sums the compensation voltage including the correction offset with at least the voltage at the bottom node of the LED string to generate a first control signal. A latch generates the switching control signal responsive to the first control signal and a leading edge blanking signal.
An electronic system, DC-DC voltage converter, method of operating a buck-boost DC-DC converter, and method for power mode transitioning in a DC-DC voltage converter are disclosed. For example, one method includes receiving a compensated error signal associated with an output voltage of the DC-DC voltage converter, determining a power mode of operation of the DC-DC voltage converter, and if the power mode of operation is a first mode, outputting a first control signal to regulate the output voltage of the DC-DC voltage converter. If the power mode of operation is a second mode, outputting a second control signal to regulate the output voltage of the DC-DC voltage converter, and if the power mode of operation is a third mode, outputting a third control signal to regulate the output voltage of the DC-DC voltage converter.
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
18.
Method and system for increasing efficiency and controlling slew rate in DC-DC converters
One embodiment pertains to a method including transitioning a logic state of at least one enable signal. A first power transistor begins to turn off. A parameter level of the input of the first power transistor is directly sensed. A second power transistor is turned off when the parameter level is less than a threshold level.
H03K 5/12 - Shaping pulses by steepening leading or trailing edges
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H03K 19/0185 - Coupling arrangementsInterface arrangements using field-effect transistors only
H03K 5/04 - Shaping pulses by increasing durationShaping pulses by decreasing duration
H03K 5/24 - Circuits having more than one input and one output for comparing pulses or pulse trains with each other according to input signal characteristics, e.g. slope, integral the characteristic being amplitude
Disclosed herein is a power converter with low step down conversion ratio with improved power conversion efficiency. The power converter includes a first inductor to receive the input voltage, and a second inductor to supply the output voltage to a load. The first inductor and the second inductor are electromagnetically coupled to each other. The power converter further includes a first switch coupled between the first inductor and the second inductor. The first switch is switched according to a pulse having a frequency corresponding to a resonant frequency of (i) a series inductance between the first inductor and the second inductor and (ii) a parallel capacitance across the first switch. The power converter further includes a second switch coupled to the first switch and the second inductor to supply a reference voltage to the second inductor according to another pulse having the frequency.
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
H02M 1/44 - Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
A voltage error signal is provided to a PWM controller of a voltage regular and used to produce a PWM signal that drives a power stage of the regulator. When operating in an adapter current limit regulation mode, an adapter current sense voltage, indicative of an adapter current, is compared to an adapter current reference voltage to produce an adapter current error signal. A compensator receives the adapter current error signal and outputs a compensated adapter current error signal. The adapter current sense voltage, or a high pass filtered version thereof, is subtracted from the compensated adapter current error signal to produce the voltage error signal provided to the PWM controller. Alternatively, an input voltage, or a high pass filtered version thereof, is added to the compensated adapter current error signal to produce the voltage error signal.
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
H02J 3/00 - Circuit arrangements for ac mains or ac distribution networks
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 7/04 - Conversion of AC power input into DC power output without possibility of reversal by static converters
H02M 1/14 - Arrangements for reducing ripples from DC input or output
One embodiment is directed towards a method. The method includes forming a drift region of a first conductivity type above or in a substrate. The substrate has first and second surfaces. A first insulator is formed over a first portion of the channel, and which has a first thickness. A second insulator is formed over the second portion of the channel, and which has a second thickness that is less than the first thickness. A first gate is formed over the first insulator. A second gate is formed over the second insulator. A body region of a second conductivity type is formed above or in the substrate.
H01L 31/113 - Devices sensitive to infrared, visible or ultraviolet radiation characterised by field-effect operation, e.g. junction field-effect photo- transistor being of the conductor-insulator- semiconductor type, e.g. metal- insulator-semiconductor field-effect transistor
H01L 29/10 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
H01L 29/08 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
H01L 29/78 - Field-effect transistors with field effect produced by an insulated gate
H01L 29/06 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions
A power supply (50) includes a first supply input node (38) and a second supply input node (40), a supply output node (42), first and second switch circuits (24, 28), a filter circuit (32), and a drive circuit (54). The first and second supply input nodes are respectively configured to receive first and second input voltages, and the supply output node is configured to provide an output voltage. The first switch circuit (24) has a first conduction node coupled to the first supply input node, a second conduction node, and a control node configured to receive a first control signal (S 1). The filter circuit has a first node (60) coupled to the second conduction node and has a second node. The second switch circuit (28) has a first conduction node coupled to the second node of the filter circuit, a second conduction node coupled to the second supply input node, and a control node. The drive circuit has an input node (58) coupled to one of the control node of the first switch circuit and the first node of the filter circuit, and has an output node (62) coupled to the control node of the second switch circuit.
H02M 3/155 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
23.
Method and system for DC-DC voltage converters with diminished PWM jitter
An embodiment pertains to a method including determining if an amplitude of an error signal has entered steady state. If the amplitude of the error signal has not entered steady state, then amplify with a high gain the amplitude of the AC component of the error signal. If the amplitude of the error signal has entered steady state, then initiate a timer. Determining if the amplitude of the error signal has remained in steady state while the timer runs. If the amplitude of the error signal has remained in steady state while the timer runs, then amplify with a low gain the amplitude of the AC component of the error signal.
H02M 1/14 - Arrangements for reducing ripples from DC input or output
H02M 1/15 - Arrangements for reducing ripples from DC input or output using active elements
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 3/157 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators with digital control
An integrated circuit is disclosed including a primary input for receiving an input voltage, a battery voltage input for receiving a battery voltage signal and an output for providing an output voltage higher than the battery voltage. First circuitry responsive to the input voltage is provided for turning off the output voltage responsive to an input over voltage condition. Second circuitry responsive to the battery voltage signal is provided for turning off the output voltage responsive to a battery over voltage condition. Third circuitry provides for over current protection.
An embodiment of a power-supply controller includes first and second circuits. The first circuit is operable to cause a first current to flow through a first phase of a power supply. And the second circuit is operable to cause the second phase of the power supply to operate in a reduced-power-dissipation mode for at least a portion of a time period during which a second current magnetically induced by the first current flows through the second phase.
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
A system, power supplies, controller and method for enhanced phase current sharing are disclosed. For example, a power supply for enhanced phase current sharing is disclosed, which includes a plurality of power modules, a communication bus coupled to an input of each power module of the plurality power modules, and an output voltage node coupled to a first side of an inductor of each power module of the plurality of power modules, wherein each power module of the plurality of power modules includes a digital controller coupled to the input of the power module, and an RC circuit enabled to generate a feedback signal, coupled to a second side of the inductor and the output voltage node. In some implementations, the power supply is at least part of a power management integrated circuit (PMIC) or at least part of a power supply formed on a semiconductor IC, wafer, chip or die.
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
A method to soft start a charge pump circuit according to embodiments includes enabling switching for a plurality of power transistors, selecting a first switching control signal from a plurality of switching control signals for the selected plurality of power transistors, slowly ramping up a plurality of bootstrap supply voltages associated with the selected plurality of power transistors, driving a gate-to-source voltage of each power transistor of the selected plurality of power transistors at a first predefined level, and determining if the plurality of bootstrap supply voltages are less than a second predefined level. If the plurality of bootstrap supply voltages are less than the second predefined level, the method further includes toggling and thereby selecting a second switching control signal from the plurality of switching control signals for a second selected plurality of power transistors.
H02M 3/07 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode
H02M 1/36 - Means for starting or stopping converters
28.
Systems and methods for lead frame locking design features
Systems and methods for lead frame locking design features are provided. In one embodiment, a method comprises: fabricating a lead frame for a chip package, the lead frame having a paddle comprising a step-out bottom locking feature profile across at least a first segment of an edge of the paddle that provides an interface with a mold compound; etching the paddle to have at least a second segment of the edge having either an extended-step-out bottom locking feature profile or an overhanging top locking feature profile; and alternating first and second segments along the edge of the paddle.
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
A circuit module includes a plurality of electronic components and a single-layer conductive package substrate. The single-layer conductive package substrate is adapted to physically support and electrically interconnect the electronic components. The substrate has a peripheral portion and an interior portion. The peripheral portion includes a plurality of peripheral contact pads coupled to corresponding electronic components. The interior portion includes a plurality of floating contact pads that are electrically isolated from the peripheral contact pads and are coupled to corresponding electronic components.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 23/00 - Details of semiconductor or other solid state devices
An enhanced ESD clamp is provided with a resistor connected between the body terminal and the source terminal of a MOSFET device. In one exemplary embodiment, the MOSFET device is a grounded-gate NMOS (ggNMOS) transistor device with the resistor (“body resistor”) connected externally to the MOSFET device. In another embodiment, the MOSFET device is a ggPMOS transistor device. In yet another embodiment, the body resistor is disposed within and connected internally to the MOSFET device. In any event, the resistance value of the body resistor determines the level to which the trigger voltage of the ESD clamp will be reduced when an ESD event occurs.
H02H 9/04 - Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
H01L 27/02 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
31.
Enhanced layout of multiple-finger electrostatic discharge (ESD) protection device
An enhanced layout for a multiple-finger ESD protection device has several embodiments. In these embodiments, the base contacts of the NPN (or PNP) transistors utilized as voltage clamps in the multiple-finger NPN-based (or PNP-based) multiple-finger ESD protection device are disposed at opposite edges of the multiple-finger ESD protection device and oriented perpendicularly to the orientation of the fingers in the multiple-finger ESD protection device. Similarly, the body contacts of the NMOS (or PMOS) transistors utilized as voltage clamps in the multiple-finger NMOS-based (or PMOS-based) multiple-finger ESD protection device are disposed at opposite edges of the multiple-finger ESD protection device and oriented perpendicularly to the orientation of the fingers in the multiple-finger ESD protection device.
H01L 27/02 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
H01L 29/10 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
Systems and methods for digital voltage compensation in a power supply integrated circuit are provided. In at least one embodiment, a method comprises receiving a digital voltage code, the digital voltage code corresponding to an output voltage value; setting an output count on a first counter to change from a present first digital count corresponding to a present voltage code value toward a target first digital count corresponding to a new voltage code value; and setting a second count to an offset count value on a second counter when the new voltage code value is received. The method also comprises combining the second count with the output count to form a combined count value; and decrementing the second count value from the offset count value to zero when the first counter reaches the target first digital count.
H02M 3/157 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators with digital control
G06F 1/26 - Power supply means, e.g. regulation thereof
An electronic system, a multiple charger configuration, and method of operating a multiple input, multiple charger configuration are disclosed. For example, a multiple charger configuration is disclosed, which includes a first battery charger circuit configured to receive to a first input voltage, and a second battery charger circuit configured to receive a second input voltage. A first switching transistor is coupled to an output of the first battery charger circuit, a system voltage output terminal, and a battery terminal configured to connect to a battery stack or at least one battery cell. A second switching transistor is coupled to an output of the second battery charger circuit and the battery terminal. Thus, the multiple chargers can be utilized in one system to charge or discharge a battery stack or at least one battery cell and thereby deliver power for a battery-operated system, product or device.
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
B60L 53/24 - Using the vehicle's propulsion converter for charging
B60L 53/10 - Methods of charging batteries, specially adapted for electric vehiclesCharging stations or on-board charging equipment thereforExchange of energy storage elements in electric vehicles characterised by the energy transfer between the charging station and the vehicle
H02J 9/06 - Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting in which the distribution system is disconnected from the normal source and connected to a standby source with automatic change-over
An optical proximity detector includes a plurality photodetectors (PDs) and a winner-take-all (WTA) circuit. Each of the PDs has a respective field of view (FOV) and produces a respective analog current detection signal indicative of light incident on and detected by the PD. In an embodiment, the WTA circuit includes a comparator and a multiplexor (MUX). The comparator compares the analog current detection signals produced by the PDs and produces a selection signal in dependence thereon. The MUX receives the analog current detection signals produced by the PDs and outputs one of the analog current detection signals in dependence on the selection signal produced by the comparator. Circuitry, which is shared by the PDs, produces a digital detection signal corresponding to the one of the analog current detection signals output by the MUX. Such design can be used to reduce power consumption, size and cost of an optical proximity detector.
A method includes determining whether to switch from a first input video signal to a second input video signal. Upon switching from a first input video signal to a second input video signal, determining whether the current displayed frame has terminated. If the current displayed frame has terminated, process the second video input signal and load data corresponding to the second video input signal from the timing generator, scale and pixel clock registers correspondingly into the timing generator, scaler and pixel clock. Generate a clock signal for the second input video signal. Calculate generator parameter(s) corresponding to the second input video signal. Generate timing control signals for the second input video signal. Determine if a new frame of the second input video signal has occurred. Provide timing control signals and pixel data for the video to be displayed and corresponding the second input video signal.
The system and method creates a substantially constant output voltage ripple in a buck converter in discontinuous conduction mode by varying the on-time of a pulse width modulator (PWM) signal driving the buck converter when the buck converter is operating in discontinuous conduction mode. A first signal is generated that is a function of the switching frequency of the buck converter. This signal is low-pass filtered and compared with a second signal that is a function of the switching frequency of the buck converter when operating in continuous conduction mode and with constant PWM on-time. The output signal generated by the comparator is a signal that is equal to the ratio of the first signal and the second signal. The on-time of a voltage controlled oscillator is controlled by the output signal, the oscillator signal causing the on-time of the PWM signal to vary in a controlled fashion.
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 3/157 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators with digital control
H02M 1/15 - Arrangements for reducing ripples from DC input or output using active elements
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
37.
Current mode 3-state buck-boost PWM control architecture
A voltage regulator including a converter and a modulator. The converter includes a switching circuit coupled to an inductor for converting an input voltage to an output voltage. The modulator controls the switching circuit in a buck mode of operation, a boost mode of operation, and an intermediate buck-boost mode of operation. During the buck-boost mode of operation, the modulator controls the switching circuit during each switching cycle to sequentially switch between three different switching states, including a first switching state that applies the input voltage across the inductor, a second switching state that applies a difference between the input and output voltages across the inductor, and a third switching state that applies the output voltage across the inductor. The modulator is controlled based on voltage applied across or current flowing through the inductor to regulate the output voltage to a target level.
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 3/157 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators with digital control
H02M 3/156 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
38.
Hysteretic current mode buck-boost control architecture having sequential switching states
A hysteretic current mode buck-boost voltage regulator including a buck-boost voltage converter, a switching controller, a window circuit, a ramp circuit, and a timing circuit. The timing circuit may be additional ramp circuits. The voltage converter is toggled between first and second switching states during a boost mode, is toggled between third and fourth switching states during a buck mode, and is sequentially cycled through each switching state during a buck-boost mode. The ramp circuit develops a ramp voltage that simulates current through the voltage converter, and switching is determined using the ramp voltage compared with window voltages provided by the window circuit. The window voltages establish frequency, and may be adjusted based on the input and output voltages. The timing circuit provides timing indications during the buck-boost mode to ensure that the second and fourth switching states have approximately the same duration to provide symmetry of the ramp signal.
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
On embodiment pertains to an apparatus including a control loop configured to receive an output voltage sense signal. The control loop includes a compensator; a PWM signal generator coupled to an output of the compensator; a reference circuit configured to receive a tracking signal, and which is configured to low bandwidth low pass filter the tracking signal when the tracking signal amplitude becomes substantially constant and representative of an output voltage that is substantially non-zero; and an error amplifier having a first input coupled to an output of the reference circuit, a second input configured to receive the output voltage sense signal, and an output coupled to the compensator.
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
G05F 1/46 - Regulating voltage or current wherein the variable actually regulated by the final control device is DC
H02M 3/156 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
An adaptive pulse positioning modulator including a sense circuit which provides a compensation signal indicative of output voltage error, a filter circuit having an input receiving the compensation signal and an output providing an adjust signal, a leading ramp circuit which provides a repetitive first leading edge ramp signal having a slope which is adjusted by the adjust signal, a comparator circuit which provides a first start trigger signal when the first leading edge ramp signal reaches the compensation signal and a first end trigger signal when a first trailing edge ramp signal reaches the compensation signal, a trailing ramp circuit which initiates ramping of the first trailing edge ramp signal when the first start trigger signal is provided, and a pulse control logic which asserts pulses on a PWM signal based on the trigger signals.
G05F 1/40 - Regulating voltage or current wherein the variable is actually regulated by the final control device is AC using discharge tubes or semiconductor devices as final control devices
41.
Audio frequency deadband system and method for switch mode regulators operating in discontinuous conduction mode
A controller for controlling operation of a switching regulator including a modulator, a discontinuous conduction mode (DCM) controller, an audible DCM (ADCM) controller, and a sub-sonic discontinuous conduction mode (SBDCM) controller. The modulator generally operates in a continuous conduction mode. The DCM controller modifies operation to DCM during low loads. The ADCM controller detects when the switching frequency is less than a super-sonic frequency threshold and modifies operation to maintain the switching frequency at a super-sonic frequency level. The SBDCM controller detects a sub-sonic operating condition during ADCM operation and responsively inhibits operation of the ADCM mode controller to allow a SBDCM mode within a sub-sonic switching frequency range. The SBDCM operating mode allows for efficient connected standby operation. The SBDCM controller allows operation to return to other modes when the switching frequency increases above the subsonic level.
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
H02M 3/156 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
An electronic system, voltage regulator, controller and fault reporting method and circuit for a voltage regulator or other type of DC-DC converter are disclosed. For example, a fault reporting circuit is disclosed. The fault reporting circuit includes a first transistor device configured to generate a first signal indicating an occurrence of a fault in an associated circuit, a second transistor device coupled to the first transistor device, the second transistor device configured to generate at least one data signal indicating an identity of the fault in the associated circuit, and an output coupled to the first transistor device and the second transistor device, wherein the output is configured to receive the first signal and the at least one data signal. In some implementations, the fault reporting circuit is in a controller for a voltage regulator circuit formed on one or more semiconductor ICs, wafers, chips or dies.
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
One embodiment pertains to a method including transitioning a logic state of at least one enable signal. A first power transistor begins to turn off. A parameter level of the input of the first power transistor is directly sensed. A second power transistor is turned off when the parameter level is less than a threshold level.
H03B 1/00 - GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNERGENERATION OF NOISE BY SUCH CIRCUITS Details
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H03K 19/0185 - Coupling arrangementsInterface arrangements using field-effect transistors only
H03K 5/04 - Shaping pulses by increasing durationShaping pulses by decreasing duration
H03K 5/24 - Circuits having more than one input and one output for comparing pulses or pulse trains with each other according to input signal characteristics, e.g. slope, integral the characteristic being amplitude
One embodiment pertains to a method including determining the duty cycle of a PWM signal, operating in valley current control mode when the duty cycle is greater than fifty percent, operating in peak current control mode when the duty cycle is less than fifty percent, and including, commencing a PWM pulse upon the occurrence of a pulse of a first clock signal pulse, and terminating the PWM pulse upon a level of a signal exceeding a positive window threshold.
G06F 1/26 - Power supply means, e.g. regulation thereof
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
One embodiment is directed towards an encapsulated device. The encapsulated device includes a device, and a first encapsulation covering the device. The first encapsulation has one or more exterior surfaces. One or more recesses in one or more of the exterior surfaces is configured to receive a second encapsulation.
In an embodiment, a power-supply controller includes a control circuit, a drive circuit, and a signal-drop-reducing circuit. The control circuit is configured to generate a drive signal having a duty cycle, and the drive circuit is configured to cause a phase circuit of a power supply to generate, in response to the drive signal, an output signal having a magnitude. And the signal-drop-reducing circuit is configured to disable the driver circuit in response to the duty cycle corresponding to a signal magnitude that is lower than the magnitude of the output signal. For example, where a power supply has a non-zero residual output signal (e.g., output voltage) on its output node after the power supply is deactivated, such a power-supply controller can reduce or eliminate a drop in the residual output signal caused by, or that would be caused by, a restarting of the power supply.
H02M 1/36 - Means for starting or stopping converters
H02M 1/14 - Arrangements for reducing ripples from DC input or output
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 3/00 - Conversion of DC power input into DC power output
G06F 1/26 - Power supply means, e.g. regulation thereof
47.
Reducing a drop in a residual supply-signal level on start up or restart of a power supply
In an embodiment, a method includes generating a pulse-width-modulated signal having a duty cycle, and isolating a power-supply output node in response to the duty cycle corresponding to a signal magnitude that is less than a magnitude of an output signal on the power-supply output node. For example, where a power supply has a non-zero residual output signal (e.g., output voltage) on its output node after the power supply is deactivated, a power-supply controller can use such a technique to reduce or eliminate a drop in the residual output signal caused by, or that would be caused by, a restarting of the power supply.
H02M 1/36 - Means for starting or stopping converters
H02M 1/14 - Arrangements for reducing ripples from DC input or output
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 3/00 - Conversion of DC power input into DC power output
G06F 1/26 - Power supply means, e.g. regulation thereof
48.
Enhanced power mode transitions in buck-boost converters
An electronic system, DC-DC voltage converter, method of operating a buck-boost DC-DC converter, and method for power mode transitioning in a DC-DC voltage converter are disclosed. For example, one method includes receiving a compensated error signal associated with an output voltage of the DC-DC voltage converter, determining a power mode of operation of the DC-DC voltage converter, and if the power mode of operation is a first mode, outputting a first control signal to regulate the output voltage of the DC-DC voltage converter. If the power mode of operation is a second mode, outputting a second control signal to regulate the output voltage of the DC-DC voltage converter, and if the power mode of operation is a third mode, outputting a third control signal to regulate the output voltage of the DC-DC voltage converter.
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
49.
Method of forming body contact layouts for semiconductor structures
Methods for forming body contact layouts for semiconductor structures are disclosed. In at least one exemplary embodiment, a method comprises: forming a plurality of gates disposed on a semiconductor layer, each gate extending parallel to a y-axis in a coordinate space; a source region disposed between two of the plurality of gates; a plurality of body contacts disposed in each source region; and wherein a portion of each body contact, adjacent to the gate, has a width extending parallel to the y-axis that is less than the width of the body contact parallel to the y-axis at a distance on an x-axis from the gate.
H01L 29/10 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
H01L 27/088 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
H01L 23/535 - Arrangements for conducting electric current within the device in operation from one component to another including internal interconnections, e.g. cross-under constructions
H01L 29/78 - Field-effect transistors with field effect produced by an insulated gate
H01L 29/06 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions
H01L 29/08 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01L 23/528 - Layout of the interconnection structure
50.
Method and structure for reducing switching power losses
One embodiment is directed towards a method. The method includes forming a drift region of a first conductivity type above or in a substrate. The substrate has first and second surfaces. A first insulator is formed over a first portion of the channel, and which has a first thickness. A second insulator is formed over the second portion of the channel, and which has a second thickness that is less than the first thickness. A first gate is formed over the first insulator. A second gate is formed over the second insulator. A body region of a second conductivity type is formed above or in the substrate.
H01L 29/78 - Field-effect transistors with field effect produced by an insulated gate
H01L 29/08 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
H01L 29/423 - Electrodes characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
H01L 29/10 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
H01L 29/06 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions
Embodiments disclosed herein provide for a circuit including first die having an active side and a backside, wherein the first die is flip-chip mounted to a carrier. The circuit also includes a second die stacked on the backside of the first die, wherein the second die is stacked on the first die such that a backside of the second die is facing the backside of the first die and an active side of the second die faces away from the first die.
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 23/433 - Auxiliary members characterised by their shape, e.g. pistons
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 23/367 - Cooling facilitated by shape of device
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
A system, DC-DC converter, and compensation method and circuit for a DC-DC converter are disclosed. For example, a compensation circuit for a DC-DC converter is disclosed. The compensation circuit includes an integrator circuit configured to receive and integrate a first voltage signal, a differential difference amplifier circuit coupled to the integrator circuit and configured to generate a first filter transfer function associated with the integrated first voltage signal, and a switched capacitor filter circuit coupled to the differential difference amplifier circuit and configured to generate a second filter transfer function, wherein the differential difference amplifier is further configured to output a second voltage signal responsive to the first filter transfer function and the second filter transfer function. In one implementation, the compensation circuit is a type-III switched capacitor filter (SCF) compensation circuit.
H02M 3/156 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
Certain embodiments described herein relate to optical sensors including a light detector and including and/or for use with a light source, and methods for use with such optical sensors. Certain embodiments involve detecting an amount of ambient light that is incident on the light detector and producing ambient light detection data indicative thereof. Additionally, such embodiments involve detecting interference light and producing interference light detection data indicative thereof. Further, such embodiments can involve producing an ambient light compensation signal based on the ambient light detection data, producing an interference light compensation signal based on the interference light detection data, and detecting light of interest that is incident on the light detector and outputting proximity detection data indicative thereof. The light of interest is caused by light that reflects off an object that is external to the optical sensor and is within a sense region of the optical sensor.
G01D 5/34 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using optical means, i.e. using infrared, visible or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
One embodiment is directed towards a molded insulator substrate. The molded insulator substrate includes a first insulator having a first surface and a second surface. A recess in said first surface of the first insulator is configured to facilitate venting of a second insulator over exposed regions of the first surface. A first conductive terminal is exposed through the first surface. A second conductive terminal is exposed through the second surface and electrically coupled to the first terminal.
H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
An adjustable current-synthesizer may generate synthesized current representative of an actual current, according to a model of a circuit that produces the actual current. The current synthesizer may under-sample a current sense signal derived from the actual current to obtain a few samples of the actual current, which are then used to adjust the synthesized current, thereby ensuring accuracy of the synthesized current. Sample values of the actual current are compared with corresponding generated values of the synthesized current to obtain offset values. In order to maintain monotonicity in the synthesizer results, the offset values are used to make adjustments to the slope of the synthesized current. The slope of the synthesized current may also be adjusted according to the slope of the actual current. Sub-Nyquist sampling of the actual current may be performed on the down-slope, with up-slope adjustments made based on the offset adjustment and down-slope adjustment.
G01R 19/00 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof
H03L 5/00 - Automatic control of voltage, current, or power
G01R 19/25 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof using digital measurement techniques
H02M 3/157 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators with digital control
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
An apparatus including a proportional gain circuit, an integral gain circuit, a limit circuit, a gain booster circuit and a combiner. The gain circuits apply a proportional gain and an integral gain to an error signal, and the combiner combines both gained error signals to provide a control signal. The limit circuit applies a limit function that limits the proportional gain to a magnitude. The gain booster circuit increases gain while the limit function is being applied. The increased gain may be applied to only the integral gain, or to both the integral and proportional gains such as by boosting gain of the error signal. The apparatus may be a regulator that may include multiple control loops providing multiple error signals, in which a mode selector selects one of the error signals to control regulation. The limit function increases stability while the boosted gain improves transient response during mode transitions.
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
H03K 5/08 - Shaping pulses by limiting, by thresholding, by slicing, i.e. combined limiting and thresholding
H02J 7/02 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries for charging batteries from AC mains by converters
H02M 3/156 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
57.
Wafer level optoelectronic device packages with crosstalk barriers and methods for making the same
A method for wafer level fabricating a plurality of optoelectronic devices, starting with a wafer that includes a plurality of light detector sensor regions, includes attaching each of a plurality of light source dies to one of a plurality of bond pads on a top surface of the wafer that includes the plurality of light detector sensor regions. The method also includes attaching, to the wafer, a preformed opaque structure made off-wafer from an opaque material, wherein the preformed opaque structure includes opaque vertical optical barriers. Additionally, solder balls or other electrical connectors are attached to the bottom of the wafer. The wafer is diced to separate the wafer into a plurality of optoelectronic devices, each of which includes at least one of the light detector sensor regions, at least one of the light source dies and at least two of the solder balls or other electrical connectors.
H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices
G01S 17/02 - Systems using the reflection of electromagnetic waves other than radio waves
G01S 7/481 - Constructional features, e.g. arrangements of optical elements
58.
Scanning projectors that use guard bands to reduce color shifts, and methods and controllers for use therewith
A scanning projector system includes a controller, a driver and one or more micro-mirror(s). The controller produces first, second and third pixel data in dependence on a video signal. The driver drives first, second and third light emitting elements in dependence on the first, second and third pixel data produced by the controller, to thereby emit light of first, second and third colors. The micro-mirror(s) project an image in dependence on light beams produced in dependence on the light of the first, second and third colors. To reduce color shifts due to inter-pixel interference, the controller and/or driver causes at least one timing guard band per pixel period associated with each instance of the pixel data.
A scanning projector system includes a controller, a driver and one or more micro-mirror(s). The controller produces first, second and third pixel data in dependence on a video signal. The driver drives first, second and third light emitting elements in dependence on the first, second and third pixel data, to thereby emit light of first, second and third colors. The micro-mirror(s) project an image in dependence on light beams produced in dependence on the light of the first, second and third colors. The controller controls intensities of the light emitted by the light emitting elements, at least in part, by controlling duty-cycles of pulses included in pixel periods associated with the first, second and third drive signals. To reduce color shifts, the controller and/or the driver causes at least two pulses to be included in each pixel period associated with drive signals used to drive the light emitting elements.
A system, switching regulators, and methods of control for enhanced peak current-mode PWM switching regulators are disclosed. For example, a switching regulator is disclosed, which includes a master controller circuit and a slave controller circuit coupled to the master controller circuit, wherein the slave controller circuit is configured to generate a ripple current at a first ripple node, and a sensor circuit is configured to sense the ripple current at the first ripple node and convey the sensed ripple current to a second ripple node in the master controller circuit. In some implementations, the switching regulator is part of a power subsystem formed on one or more semiconductor ICs, wafers, chips or dies.
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
An electronic device that determines an adapter current limit for a power adapter, including a regulator, a voltage comparator, and a controller. The regulator regulates an adapter output current level to prevent it from exceeding the adapter current limit, and provides a regulation signal during regulation. The voltage comparator provides an under-voltage signal when adapter output voltage level falls below a low voltage threshold. The controller initially sets the adapter current limit at a lowest level, increases the adapter current limit by an incremental amount when the regulation signal is provided, and when the under-voltage signal is provided, decreases the adapter current limit by the incremental amount to determine a final adapter current limit. The final adapter current limit is at or near the actual maximum current limit of the power adapter. The adapter current limit may be increased only when regulation occurs for at least a predetermined time period.
H02M 3/156 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
G05F 1/56 - Regulating voltage or current wherein the variable actually regulated by the final control device is DC using semiconductor devices in series with the load as final control devices
H02J 1/00 - Circuit arrangements for dc mains or dc distribution networks
H02M 1/32 - Means for protecting converters other than by automatic disconnection
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
Systems and methods for overcurrent protection in a battery charger are provided. For example, a method for overcurrent protection may include controlling a switching regulator to direct electrical current between the switching regulator and a battery port; sensing a voltage drop that is related to the electrical current passing between the switching regulator and the battery port; applying a first ramp voltage to the sensed voltage drop generating a modified sensed voltage drop; comparing the modified sensed voltage drop against at least one reference voltage; and when the modified sensed voltage drop exceeds the at least one reference voltage, changing operation of the switching regulator to protect the battery charger from an overcurrent state.
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
H02H 3/20 - Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition, with or without subsequent reconnection responsive to excess voltage
Systems and methods are provided for overcurrent protection in a battery charger. In certain embodiments, a method includes turning on an adapter switch to receive electrical power from an adapter connected to the battery charger; controlling a switching regulator to direct electrical current between the switching regulator and a battery port. Further, the method includes sensing a voltage drop that is related to the electrical current passing between the switching regulator and the battery port; comparing the sensed voltage drop against at least one reference voltage; and, when the sensed voltage exceeds the reference voltage, changing operation of the adapter switch to protect the battery charger from an overcurrent state.
An apparatus includes a buck boost converter for generating a regulated output voltage responsive to an input voltage. The buck boost converter includes an inductor, a first pair of switching transistors responsive to a first PWM signal and a second pair of switching transistors responsive to a second PWM signal. An error amplifier generates an error voltage responsive to the regulated output voltage and a reference voltage. A control circuit generates the first PWM signal and the second PWM signal responsive to the error voltage and a sensed current voltage responsive to a sensed current through the inductor. The control circuit controls switching of the first pair of switching transistors and the second pair of switching transistors using the first PWM signal and the second PWM signal responsive to the sensed current through the inductor and a plurality of offset error voltages based on the error voltage.
G05F 1/613 - Regulating voltage or current wherein the variable actually regulated by the final control device is DC using semiconductor devices in parallel with the load as final control devices
65.
Precision estimation for optical proximity detectors
An optical proximity detector includes a driver, light detector, analog front-end and digital back end. The driver drives the light source to emit light. The light detector produces a light detection signal indicative of a magnitude and a phase of a portion of the emitted light that reflects off an object and is incident on the light detector. The analog front-end includes amplification circuitry, and one or more analog-to-digital converters (ADCs) that output a digital light detection signal, or digital in-phase and quadrature-phase signals indicative thereof. The digital back-end includes a distance calculator and a precision estimator. The distance calculator produces a digital distance value in dependence on the digital light detection signal, or the digital in-phase and quadrature-phase signals, output by the ADC(s) of the analog front-end. The precision estimator produces a precision value indicative of a precision of the digital distance value.
G01S 7/481 - Constructional features, e.g. arrangements of optical elements
G01S 17/36 - Systems determining position data of a target for measuring distance only using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated with phase comparison between the received signal and the contemporaneously transmitted signal
G01S 17/08 - Systems determining position data of a target for measuring distance only
66.
Open loop correction for optical proximity detectors
An optical proximity detector includes a driver, light detector, analog front-end, sensor(s) that sense correction factor(s) (e.g., temperature, supply voltage and/or forward voltage drop), and a digital back end. The driver drives the light source to emit light. The light detector produces a light detection signal indicative of a magnitude and a phase of a portion of the emitted light that reflects off an object and is incident on the light detector. The analog front-end receives the light detection signal and outputs a digital light detection signal, or digital in-phase and quadrature-phase signals, which are provided to the digital back-end. The digital back-end performs closed loop correction(s) for dynamic variation(s) in gain and/or phase caused by a portion of the analog front-end, uses polynomial equation(s) and sensed correction factor(s) to perform open loop correction(s) for dynamic variations in temperature, supply voltage and/or forward voltage drop, and outputs a distance value.
G01S 17/36 - Systems determining position data of a target for measuring distance only using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated with phase comparison between the received signal and the contemporaneously transmitted signal
Systems and methods for operating cameras are described. An image signal received from an image sensor can be processed as a plurality of video signals representative of the image signal. An encoder may combine baseband and digital video signals in an output signal for transmission over a cable. The video signals may include substantially isochronous baseband and digital video signals. The baseband video signal can comprise a standard definition analog video signal and the digital video signal may be frequency modulated before combining with the baseband video signal and/or transmitting wirelessly. The digital video signal may be a compressed high definition digital video signal. A decoder demodulates an upstream signal to obtain a control signal for controlling the position and orientation of the camera and content of the baseband and digital video signals.
H04N 5/77 - Interface circuits between an apparatus for recording and another apparatus between a recording apparatus and a television camera
H04N 5/782 - Television signal recording using magnetic recording on tape
H04N 9/64 - Circuits for processing colour signals
H04N 9/804 - Transformation of the television signal for recording, e.g. modulation, frequency changingInverse transformation for playback involving pulse code modulation of the colour picture signal components
In an embodiment, an amplifier includes first, second, and third stages, and a feedback network. The first stage has a first passband and is configured to generate a first output signal in response to first and second input signals, and the second stage has a second passband that is higher in frequency than the first passband and is configured to generate a second output signal in response to third and fourth input signals. The third stage has a first input node coupled to receive the first output signal, a second input node coupled to receive the second output signal, and an output node. And the feedback network is coupled between the second input node and the output node of the third stage. For example, where the first, second, and third stages are respective operational-transconductance-amplifier stages, such an amplifier may be suitable for low-power applications.
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
A remote differential voltage sensing circuit having a voltage input (Vin) and a voltage output (Vout), comprises a dual differential input stage including a common-source or common-collector differential input stage in parallel with a common-gate or common-base differential input stage. The common-source or collector differential input stage has differential inputs, one coupled to the voltage input (Vin) and the other coupled to the voltage output (Vout). The common-gate or common-base differential input stage has differential inputs, one coupled to a local ground (Agnd) and the other coupled to a remote ground (Rgnd). An output stage is driven by an output of the dual differential input stage and produces an output voltage at the voltage output (Vout). A compensation network is coupled between the voltage output (Vout) and the output of the dual differential input stage.
G05F 1/30 - Regulating voltage or current wherein the variable is actually regulated by the final control device is AC using bucking or boosting transformers as final control devices combined with discharge tubes or semiconductor devices semiconductor devices only
G05F 1/56 - Regulating voltage or current wherein the variable actually regulated by the final control device is DC using semiconductor devices in series with the load as final control devices
70.
Current mode control modulator with combined control signals and improved dynamic range
A modulator for controlling a switch circuit of a voltage regulator, including a sense circuit that provides a current sense signal indicative of current through the output inductor, a ramp circuit that develops a ramp voltage on a ramp node using the current sense signal, an error circuit that develops an error signal indicative of output voltage error and that injects the error signal into the ramp node to adjust the ramp voltage, a comparator circuit that compares the ramp voltage with a fixed control voltage to develop a compare signal, and a logic circuit that uses the compare signal to develop a pulse control signal that controls the switch circuit. The output voltage error may be determined by comparing the output voltage with a reference voltage and converting the error voltage to a current applied to the ramp node.
H02M 3/156 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
G05F 1/56 - Regulating voltage or current wherein the variable actually regulated by the final control device is DC using semiconductor devices in series with the load as final control devices
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
G01K 13/00 - Thermometers specially adapted for specific purposes
G01R 19/00 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof
G01R 35/00 - Testing or calibrating of apparatus covered by the other groups of this subclass
H02M 1/32 - Means for protecting converters other than by automatic disconnection
System, circuit and method for converting a differential voltage signal including a high common mode voltage component to a ground referenced signal for battery voltage managment
A system, circuit and method for converting a differential voltage signal including a high common mode voltage component to a ground referenced signal are disclosed. For example, a circuit for converting a differential voltage signal including a high common mode voltage component to a ground referenced signal is disclosed. The circuit includes a comparator configured to receive a differential voltage signal including a high common mode voltage component, and output a digital signal associated with the differential voltage signal. The circuit also includes a level shifter configured to receive the digital signal and shift the level of the digital signal to a low level, and an integrator configured to receive the digital low level signal and output a ramping voltage associated with the low level signal. Furthermore, the circuit includes an analog-to-digital converter configured to receive the ramping voltage and output a digital bit-stream associated with the ramping voltage.
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
H02J 7/02 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries for charging batteries from AC mains by converters
Embodiments described herein relate to a packaged component including a lead frame and a non-conductive plug disposed between two or more adjacent sections of the lead frame. The plug is composed of a non-conductive material functions to impede the flow of solder along edges of the two or more adjacent sections during second level solder reflow events that occur after encapsulation of the packaged component. The plug includes a main portion disposed within a space between the two or more adjacent sections, and one or more overlap portions extending from the main portion. The one or more overlap portions are disposed on an internal surface of at least one of the two or more adjacent sections. At least one component is mounted on one of the plurality of sections of the lead frame.
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 23/00 - Details of semiconductor or other solid state devices
74.
Fast recovery scheme of transconductance gain for folded cascode amplifier
A folded cascode amplifier (FCA) including cascode stages coupled in a stacked cascode configuration, an input stage, and a switch circuit. The stages may include first and second P-type stages and first and second N-type stages, in which the first N-type stage and the input stage receive first and second bias voltages, respectively. The switch circuit couples a first cascode bias voltage to the second P-type stage and couples a second cascode bias voltage to the first N-type stage in a high power state, and decouples the first and second cascode bias voltages in a low power state. A non-switched low current bias generator provides the first and second bias and cascode bias voltages, which remain substantially stable in the low and high power states. Only low parasitic capacitance nodes are switched between power states so that the gain of the FCA recovers very quickly for the high power state.
In an embodiment, a coupled-inductor structure includes first and second windings. The first winding is configured to conduct a phase current, has a first node configured for coupling to a phase node of a power supply, and has a second node configured for coupling to an output node of the power supply and to a first node of a sense impedance that is configured to generate a sense signal representative of the phase current. And the second winding is configured for magnetic coupling with the first winding, has a first node coupled to the first node of the first winding, and has a second node configured for coupling to a second node of the sense impedance. For example, the first winding may be a phase inductor of a switching power supply, and the impedance may be a capacitor that generates a sense voltage representative of the phase current.
H02M 3/335 - Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
G05F 1/00 - Automatic systems in which deviations of an electric quantity from one or more predetermined values are detected at the output of the system and fed back to a device within the system to restore the detected quantity to its predetermined value or values, i.e. retroactive systems
G05F 5/00 - Systems for regulating electric variables by detecting deviations in the electric input to the system and thereby controlling a device within the system to obtain a regulated output
H01F 17/04 - Fixed inductances of the signal type with magnetic core
G05F 1/62 - Regulating voltage or current wherein the variable actually regulated by the final control device is DC using bucking or boosting DC sources
H01F 27/40 - Structural association with built-in electric component, e.g. fuse
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
In an embodiment, a coupled-inductor structure includes first and second windings. The first winding is configured to conduct a phase current, has a first node configured for coupling to a phase node of a power supply, and has a second node configured for coupling to an output node of the power supply and to a first node of a sense impedance that is configured to generate a sense signal representative of the phase current. And the second winding is configured for magnetic coupling with the first winding, has a first node coupled to the first node of the first winding, and has a second node configured for coupling to a second node of the sense impedance. For example, the first winding may be a phase inductor of a switching power supply, and the impedance may be a capacitor that generates a sense voltage representative of the phase current.
G05F 1/62 - Regulating voltage or current wherein the variable actually regulated by the final control device is DC using bucking or boosting DC sources
H01F 27/40 - Structural association with built-in electric component, e.g. fuse
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
Systems and methods for an open wire scan are provided. In certain embodiments, An apparatus comprising a circuit includes a plurality of inputs for connecting with a plurality of outputs of a multi-cell battery pack; and an open connection detection circuit, formed within the circuit, for detecting an open connection on at least one of the plurality of inputs connected to the multi-cell battery pack and generating a fault condition responsive thereto. The open connection detection circuit comprises at least one current source device; and at least one device for turning on and off the at least one current source device. The open connection detection circuit also comprises at least one amplifier; an analog to digital converter; and a control logic circuit.
G01R 31/02 - Testing of electric apparatus, lines, or components for short-circuits, discontinuities, leakage, or incorrect line connection
G01R 31/36 - Arrangements for testing, measuring or monitoring the electrical condition of accumulators or electric batteries, e.g. capacity or state of charge [SoC]
G01R 19/165 - Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values
78.
Systems and methods for optical proximity detection with multiple field of views
An optical proximity detector includes a plurality photodetectors (PDs) and a winner-take-all (WTA) circuit. Each of the PDs has a respective field of view (FOV) and produces a respective analog current detection signal indicative of light incident on and detected by the PD. In an embodiment, the WTA circuit includes a comparator and a multiplexor (MUX). The comparator compares the analog current detection signals produced by the PDs and produces a selection signal in dependence thereon. The MUX receives the analog current detection signals produced by the PDs and outputs one of the analog current detection signals in dependence on the selection signal produced by the comparator. Circuitry, which is shared by the PDs, produces a digital detection signal corresponding to the one of the analog current detection signals output by the MUX. Such design can be used to reduce power consumption, size and cost of an optical proximity detector.
A universal serial bus charger comprises a universal serial bus connector for providing a connection to a voltage source. An output voltage connector provides a charging voltage to a connected battery. A switching voltage regulator generates the charging voltage responsive to the voltage source. Control circuitry monitors an actual charging current applied to the connected battery and provides a programmed current signal enabling the actual charging current to operate at a programmed level if the actual charging current does not exceed a programmed charging current level. The control circuitry provides a charging current limit signal enabling the actual charging current to operate at a predetermined charge current limit if the actual charging current exceeds the programmed charging current level. PWM control circuitry generates switching control signals to control operation of the switching voltage regulator responsive to the control circuitry.
Systems and methods for lead frame locking design features are provided. In one embodiment, a method comprises: fabricating a lead frame for a chip package, the lead frame having a paddle comprising a step-out bottom locking feature profile across at least a first segment of an edge of the paddle that provides an interface with a mold compound; etching the paddle to have at least a second segment of the edge having either an extended-step-out bottom locking feature profile or an overhanging top locking feature profile; and alternating first and second segments along the edge of the paddle.
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
Exemplary embodiments provide a solar cell device, and method for forming the solar cell device by integrating a switch component into a solar cell element. The solar cell element can include a solar cell, a solar cell array and/or a solar cell panel. The integrated solar cell element can be used for a solar sensor, while the solar sensor can also use discrete switches for each solar cell area of the sensor. Exemplary embodiments also provide a connection system for the solar cell elements and a method for super-connecting the solar cell elements to provide a desired connection path or a desired power output through switch settings. The disclosed connection systems and methods can allow for by-passing underperforming solar cell elements from a plurality of solar cell elements. In embodiments, the solar cell element can be extended to include a battery or a capacitor.
H01L 31/02 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof - Details
H02S 50/10 - Testing of PV devices, e.g. of PV modules or single PV cells
H01L 29/78 - Field-effect transistors with field effect produced by an insulated gate
H01L 31/112 - Devices sensitive to infrared, visible or ultraviolet radiation characterised by field-effect operation, e.g. junction field-effect photo- transistor
H02S 50/00 - Monitoring or testing of PV systems, e.g. load balancing or fault identification
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H01L 31/05 - Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
H02S 40/34 - Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
H02S 10/00 - PV power plantsCombinations of PV energy systems with other systems for the generation of electric power
H02S 40/36 - Electrical components characterised by special electrical interconnection means between two or more PV modules, e.g. electrical module-to-module connection
82.
Audio frequency deadband system and method for switch mode regulators operating in discontinuous conduction mode
A controller for controlling operation of a switching regulator including a modulator, a discontinuous conduction mode (DCM) controller, an audible DCM (ADCM) controller, and a sub-sonic discontinuous conduction mode (SBDCM) controller. The modulator generally operates in a continuous conduction mode. The DCM controller modifies operation to DCM during low loads. The ADCM controller detects when the switching frequency is less than a super-sonic frequency threshold and modifies operation to maintain the switching frequency at a super-sonic frequency level. The SBDCM controller detects a sub-sonic operating condition during ADCM operation and responsively inhibits operation of the ADCM mode controller to allow a SBDCM mode within a sub-sonic switching frequency range. The SBDCM operating mode allows for efficient connected standby operation. The SBDCM controller allows operation to return to other modes when the switching frequency increases above the sub-sonic level.
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
H02M 3/156 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
Body contact layouts for semiconductor structures are disclosed. In at least one exemplary embodiment, a semiconductor structure comprises: a plurality of gates disposed on a semiconductor layer, each gate extending parallel to a y-axis in a coordinate space; a source region disposed between two of the plurality of gates; a plurality of body contacts disposed in each source region; and wherein a portion of each source region, adjacent to the gate, has a width extending parallel to the y-axis that is greater than the width of the source region parallel to the y-axis at a distance on an x-axis from the gate.
H01L 29/10 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
H01L 27/088 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
H01L 23/535 - Arrangements for conducting electric current within the device in operation from one component to another including internal interconnections, e.g. cross-under constructions
H01L 29/78 - Field-effect transistors with field effect produced by an insulated gate
H01L 29/06 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions
H01L 29/08 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
84.
Input current compensation during current measurement
A current measurement circuit may include unbuffered inputs, and the current may be sampled directly from the input pins. The input current created from each sample may be cancelled by injecting opposite charge on the subsequent sample. This direct sampling from the pins increases the common mode input range of the sense path without having to build high linearity rail-to-rail input buffers, hence lowering cost and power consumption of the current measurement path. It also allows for high-impedance input sampling. The measurement circuit may include multiple sampling stages, with a first sampling stage implemented as a switched-capacitor based circuit. A compensator circuit coupled in a feedback loop from the output of the first sampling stage to the input pins may be operated to provide the equivalent charge back to the input pins every cycle to cancel the input current required to charge the sampling capacitors of the first sampling stage.
G01R 19/00 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof
H03L 5/00 - Automatic control of voltage, current, or power
G01R 19/25 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof using digital measurement techniques
H02M 3/157 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators with digital control
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
An adjustable current-synthesizer may generate synthesized current representative of an actual current, according to a model of a circuit that produces the actual current. The current synthesizer may under-sample a current sense signal derived from the actual current to obtain a few samples of the actual current, which are then used to adjust the synthesized current, thereby ensuring accuracy of the synthesized current. Sample values of the actual current are compared with corresponding generated values of the synthesized current to obtain offset values. In order to maintain monotonicity in the synthesizer results, the offset values are used to make adjustments to the slope of the synthesized current. The slope of the synthesized current may also be adjusted according to the slope of the actual current. Sub-Nyquist sampling of the actual current may be performed on the down-slope, with up-slope adjustments made based on the offset adjustment and down-slope adjustment.
H03L 5/00 - Automatic control of voltage, current, or power
G01R 19/00 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof
G01R 19/25 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof using digital measurement techniques
H02M 3/157 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators with digital control
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
The system and method creates a substantially constant output voltage ripple in a buck converter in discontinuous conduction mode by varying the on-time of a pulse width modulator (PWM) signal driving the buck converter when the buck converter is operating in discontinuous conduction mode. A first signal is generated that is a function of the switching frequency of the buck converter. This signal is low-pass filtered and compared with a second signal that is a function of the switching frequency of the buck converter when operating in continuous conduction mode and with constant PWM on-time. The output signal generated by the comparator is a signal that is equal to the ratio of the first signal and the second signal. The on-time of a voltage controlled oscillator is controlled by the output signal, the oscillator signal causing the on-time of the PWM signal to vary in a controlled fashion.
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 1/15 - Arrangements for reducing ripples from DC input or output using active elements
87.
Current pulse count control in a voltage regulator
A method of regulating voltage with a switching regulator is disclosed. The method includes sensing an output voltage provided by the regulator. If the output voltage drops below a low voltage threshold, a burst of one or more current pulses is provided. If the output voltage raises above a high voltage threshold during the burst, discontinuing the burst of current pulses. The method includes counting a number of the one or more current pulses in the burst, and comparing the number of the one or more current pulses with at least one pulse threshold. The upper current threshold is adjusted based on the number of the one or more current pulses.
H02M 3/156 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
An apparatus for charging a plurality of series connected battery cells, includes a first and second input terminals for providing a charging voltage to the plurality of series connected battery cell. A transformer includes a primary side associated with the charging voltage and a secondary side includes a plurality of portions. Each of the plurality of portions is connected across at least one of the plurality of series connected battery cell. A switch in series between each of the plurality of portions of the secondary side and the at least one of the plurality of series connected battery cells increases an impedance between the portion of the secondary side and the associated one of the plurality of series connected battery cells in a first state and decreases the impedance between the portion of the secondary side and the associated one of the plurality of series connected battery cells in a second state.
A drive control circuit generates switching drive signals for a single phase of a multiphase voltage regulator. A driver circuitry generates the switching drive signals for the voltage regulator responsive to a clock signal. A clock circuitry generates the clock signal responsive to a monitored external clock signal. A phase number detector determines a number of active phases in the multiphase voltage regulator in real time responsive to an indicator on a phase number input monitored by the phase detector.
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
90.
Digital voltage compensation for power supply integrated circuits
Systems and methods for digital voltage compensation in a power supply integrated circuit are provided. In at least one embodiment, a method includes receiving a digital voltage code, the digital voltage code corresponding to an output voltage value; setting an output count on a first counter to change from a present first digital count corresponding to a present voltage code value toward a target first digital count corresponding to a new voltage code value; and setting a second count to an offset count value on a second counter when the new voltage code value is received. The method also includes combining the second count with the output count to form a combined count value; and decrementing the second count value from the offset count value to zero when the first counter reaches the target first digital count.
H02M 3/157 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators with digital control
G06F 1/26 - Power supply means, e.g. regulation thereof
91.
Battery charge system with transition control that protects adapter components when transitioning from battery mode to adapter mode
A battery charge system including an adapter node, a system node, a battery, a first isolation switch coupled between the adapter and system nodes, a second isolation switch coupled between the battery and system nodes, a boost converter, and a controller. The controller turns off the first isolation switch and turns on the second isolation switch during a battery mode, activates the boost converter when an adapter voltage is detected, turns off the second isolation switch when the system voltage rises above the battery voltage, and turns on the first isolation switch when the system voltage rises to an operating voltage level. The boost converter may then be turned off once in the adapter mode. The second isolation switch may initially be turned on partially at a low current level when the adapter is detected, and then turned fully on when the system voltage is at the operating voltage level.
Exemplary embodiments provide a solar cell device, and method for forming the solar cell device by integrating a switch component into a solar cell element. The solar cell element can include a solar cell, a solar cell array and/or a solar cell panel. The integrated solar cell element can be used for a solar sensor, while the solar sensor can also use discrete switches for each solar cell area of the sensor. Exemplary embodiments also provide a connection system for the solar cell elements and a method for super-connecting the solar cell elements to provide a desired connection path or a desired power output through switch settings. The disclosed connection systems and methods can allow for by-passing underperforming solar cell elements from a plurality of solar cell elements. In embodiments, the solar cell element can be extended to include a battery or a capacitor.
H01L 31/112 - Devices sensitive to infrared, visible or ultraviolet radiation characterised by field-effect operation, e.g. junction field-effect photo- transistor
H01L 29/78 - Field-effect transistors with field effect produced by an insulated gate
H02S 50/00 - Monitoring or testing of PV systems, e.g. load balancing or fault identification
H01L 31/02 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof - Details
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H01L 31/05 - Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
H02S 40/34 - Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
H02S 10/00 - PV power plantsCombinations of PV energy systems with other systems for the generation of electric power
H02S 40/36 - Electrical components characterised by special electrical interconnection means between two or more PV modules, e.g. electrical module-to-module connection
H02S 50/10 - Testing of PV devices, e.g. of PV modules or single PV cells
93.
Semiconductor structures for enhanced transient response in low dropout (LDO) voltage regulators
Systems, semiconductor structures, electronic circuits and methods for enhanced transient response in Low Dropout (LDO) voltage regulators are disclosed. For example, a semiconductor structure for enhanced transient response in an LDO voltage regulator is disclosed, which includes a first current mirror circuit coupled to an input connection and an output connection of the LDO voltage regulator, a second current mirror circuit coupled to the input connection of the LDO voltage regulator. A first input of a first amplifier circuit is coupled to the second current mirror circuit, a second input of the first amplifier circuit is coupled to the output connection of the LDO voltage regulator, and a third input of the first amplifier circuit is coupled to a reference voltage. An input of a second amplifier circuit is coupled to an output of the first amplifier circuit, an output of the second amplifier circuit is coupled to the first current mirror circuit, an input of a third amplifier circuit is coupled to the output of the first amplifier circuit, and an output of the third amplifier circuit is coupled to the second current mirror circuit. In some implementations, the semiconductor structure is an adaptively-biased LDO voltage regulator formed in a power management integrated circuit (PMIC) or in a power supply on a semiconductor IC, wafer, chip or die.
G02F 1/1368 - Active matrix addressed cells in which the switching element is a three-electrode device
G05F 1/56 - Regulating voltage or current wherein the variable actually regulated by the final control device is DC using semiconductor devices in series with the load as final control devices
94.
Reduced-noise reference voltage platform for a voltage converter device
An electronic system, a reduced-noise reference voltage platform for a voltage converter device, and a method of manufacture of a reduced-noise reference voltage platform for a voltage converter device are disclosed. For example, the reduced-noise reference voltage (e.g., ground) platform includes a first conductor unit, a second conductor unit, and an insulator unit interposed between a first surface of the first conductor unit and a first surface of the second conductor unit. The reduced-noise reference voltage platform also includes a phase terminal connected to the first conductor unit, and a reference voltage (e.g., ground) terminal connected to the second conductor unit, wherein a second surface of the second conductor unit forms a platform coupled to the reference voltage (e.g., ground).
H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups or
H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
H02M 3/155 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
95.
Methods for fabricating a plurality of optoelectronic devices from a wafer that includes a plurality of light detector sensor areas
Optoelectronic devices (e.g., optical proximity sensors), methods for fabricating optoelectronic devices, and systems including optoelectronic devices, are described herein. An optoelectronic device includes a light detector die that includes a light detector sensor area. A light source die is attached to a portion of the light detector die that does not include the light detector sensor area. An opaque barrier is formed between the light detector sensor area and the light source die, and a light transmissive material encapsulates the light detector sensor area and the light source die. Rather than requiring a separate base substrate (e.g., a PCB substrate) to which are connected a light source die and a light detector die, the light source die is connected to the light detector die, such that the light detector die acts as the base for the finished optoelectronic device. This provides for cost reductions and reduces the total package footprint.
H01L 31/16 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
H01L 31/0232 - Optical elements or arrangements associated with the device
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 31/02 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof - Details
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
G01S 7/481 - Constructional features, e.g. arrangements of optical elements
H01L 31/173 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by at least one potential or surface barrier formed in, or on, a common substrate
G01S 17/02 - Systems using the reflection of electromagnetic waves other than radio waves
96.
Packaged circuit with a lead frame and laminate substrate
Embodiments of the subject application provide for a circuit comprising: a lead frame having a first plurality of exposed terminals, the lead frame defining a plane; a laminate substrate in the plane defined by the lead frame, adjacent to the lead frame, and electrically coupled to the lead frame, the laminate substrate having a first surface including a second plurality of exposed terminals and a second surface opposite the first surface; a first one or more dies mounted on the lead frame and electrically coupled to the lead frame; and a second one or more dies mounted on the second surface of the laminate substrate and electrically coupled to the laminate substrate.
H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
97.
Discrete multi-tone systems for half-duplex IP links
A DMT system for a half-duplex two-way link carries Internet protocol encoded video stream on a coaxial cable that also carries a baseband rendition of the same video stream. A plurality of downlink symbols modulated on a subband of subcarriers in a downlink signal are decoded. The symbols may carry data encoded on a subband using a constellation of QAM symbols assigned to the subband. Other subbands may be associated with different QAM constellations. Lower-order constellations of QAM symbols may be assigned to subbands that include higher-frequency subcarriers and higher-order constellations of QAM symbols may be assigned to subbands that include lower-frequency subcarriers. A block error correction decoder may be synchronized based on an identification of the first constellation of QAM symbols and information identifying boundaries between the plurality of downlink symbols.
Described herein are optical proximity detectors, methods for use therewith, and systems including an optical proximity detector. Such optical proximity detectors include an analog front-end and a digital back-end. In certain embodiments, the digital back-end includes a dynamic gain and phase offset corrector, a cross-talk corrector, a phase and magnitude calculator, and a static phase offset corrector. The dynamic gain and phase offset corrector corrects for dynamic variations in gain and phase offset of the analog front-end due to changes in temperature and/or operating voltage levels. The crosstalk corrector corrects for electrical and/or optical crosstalk associated with the analog front-end. The phase and magnitude calculator calculates phase and magnitude values in dependence on the corrected versions of digital in-phase and quadrature-phase signals received from the analog front-end. The static phase offset corrector corrects for a static phase offset of the optical proximity detector.
G06F 3/03 - Arrangements for converting the position or the displacement of a member into a coded form
G01S 17/02 - Systems using the reflection of electromagnetic waves other than radio waves
H03K 17/94 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the way in which the control signals are generated
G01S 17/36 - Systems determining position data of a target for measuring distance only using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated with phase comparison between the received signal and the contemporaneously transmitted signal
Embodiments described herein relate to a packaged component including a lead frame and a non-conductive plug disposed between two or more adjacent sections of the lead frame. The plug is composed of a non-conductive material and is adhered to the two or more adjacent sections of the lead frame. The plug functions to impede the flow of solder along edges of the two or more adjacent sections during second level solder reflow events that occur after encapsulation of the packaged component. The plug includes a main portion disposed within a space between the two or more adjacent sections, and one or more overlap portions extending from the main portion. The one or more overlap portions are disposed on an internal surface of at least one of the two or more adjacent sections. At least one component is mounted on one of the plurality of sections of the lead frame.
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
100.
Optical sensors for detecting relative motion and/or position and methods and systems for using such optical sensors
An optical sensor, according to an embodiment of the present invention, includes a photodetector region and a plurality of slats over the photodetector region. In an embodiment, the slats are made of an opaque polymer material, such as an opaque photoresist. In an embodiment, the slats are angled relative to a surface of the photodetector region.
