01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; chemical additives for use in
industry; chemicals for use in metal plating; chemical
compositions for metal plating; chemicals for plating on
plastics; surfactants for use in industry; detergents for
industrial use as part of manufacturing operations; etching
solutions [acids]; catalysts; plating solution, plating
solution additive, plating additives for metal and plastic
plating; chemical agents for the surface treatment of
metals; stripping agents.
2.
WHITE TRIVALENT CHROMIUM PLATING BATH AND WHITE TRIVALENT CHROMIUM PLATING METHOD FOR OBJECT TO BE PLATED USING SAME
A white trivalent chromium plating bath including a trivalent chromium compound, a complexing agent, a sulfate serving as a conductive salt, a pH buffering agent, and one type or two or more types of sulfur-containing organic compounds represented by the following general formula (I) (in which R represents —H, —NH2, —OH, —CH3, —(CH2)n—CH3, or —(CH2)n—COOH, n represents an integer of 1 to 4, and X and Y each independently represent CH2, C═O, or C═S), and a white trivalent chromium plating method using the white trivalent chromium plating bath enable a high plating deposition rate in the trivalent chromium plating bath, and provide an appearance suitable for decorative applications.
A white trivalent chromium plating bath including a trivalent chromium compound, a complexing agent, a sulfate serving as a conductive salt, a pH buffering agent, and one type or two or more types of sulfur-containing organic compounds represented by the following general formula (I) (in which R represents —H, —NH2, —OH, —CH3, —(CH2)n—CH3, or —(CH2)n—COOH, n represents an integer of 1 to 4, and X and Y each independently represent CH2, C═O, or C═S), and a white trivalent chromium plating method using the white trivalent chromium plating bath enable a high plating deposition rate in the trivalent chromium plating bath, and provide an appearance suitable for decorative applications.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; chemicals for use in plating; chemical agents for metal surface cleaning; etching solution; etchant for etching the surface of resin; permanganate etching solution; catalysts for use in chemical processes; surface treatment agent for electroless plating layers on plastics; plating solution; plating solution additive; plating additives; electroplating and electroless plating chemicals, namely, copper, nickel, chrome, silver, gold, cobalt, tin, aluminum, palladium, tungsten, iron, titanium, and zinc based chemicals; plating solution, plating solution additive, plating additives for metal and plastic plating; metal surface treatment chemical agents; chemical agents for stripping of the plated layer from metals
4.
METHOD FOR COARSENING COPPER CRYSTAL GRAINS IN OBJECTS TO BE PLATED AND COPPER-PLATED MEMBRANE HAVING COARSENED COPPER CRYSTAL GRAINS IN COPPER-PLATED MEMBRANE
A copper-plated film having enlarged crystals can be obtained with a simple operation using a method for enlarging copper crystal grains in a plated object. Such a method, may include: (a) electroplating an object to be plated in an electrolytic copper plating solution, which contains sulfuric acid, copper sulfate, chloride ions, a brightener, and a leveler, and in which the content of sulfuric acid is 200 g/L or more; and (b) subjecting the electroplated object to be plated to a heat treatment at 400° C. or lower.
Provided is a plating method by which a satisfactory electroless plated component can be obtained even if the amount of palladium used for applying a catalyst is reduced, and which can be easily and inexpensively executed without requiring a post-treatment with a strong acid or the like after the application of the catalyst. This plating method comprises: a catalyst application step for bringing a catalyst application treatment liquid into contact with a surface to be treated of a substrate so as to apply a catalyst thereto; and an electroless plating step for performing metal plating on the surface to be treated, to which the catalyst has been applied. In the catalyst application step, a liquid containing palladium fine particles formed by means of discharge between a palladium electrode and a counter electrode arranged in the liquid is used as the catalyst application treatment liquid. The catalyst application treatment liquid preferably contains a polyvalent carboxylic acid and/or a salt thereof.
An additive for a composite plating solution, containing non-conductive fine particles, nickel ions, and water. A method for preventing solidification of a precipitate of non-conductive fine particles in an additive for a composite plating solution, including incorporating nickel ions in an additive for a composite plating solution containing non-conductive fine particles and water.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Etchants for use in the manufacture of package substrate; etchants for removing seed layers; etchants for use in the manufacture of printed circuit boards; etchants for use in the manufacture of semiconductors
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Etching solutions; etching solutions [acids]; etchants for use in the manufacture of package substrate; etchants for removing seed layers; etchants for use in the manufacture of printed circuit boards; etchants for use in the manufacture of semiconductors; copper etching solutions.
9.
CHROMIUM PLATED COMPONENT AND METHOD FOR PRODUCING SAME
The purpose of the present invention is to provide: a chromium plated component which exhibits excellent corrosion resistance even if an upper layer is composed of a trivalent chromium plating layer, while having good appearance; and a production method which is capable of producing such a chromium plated component. The present invention provides a chromium plated component which is provided with: a base material that has a surface layer which is formed of copper or a copper alloy; a glossy nickel plating layer that is formed in contact with the surface layer of the base material; a noble potential nickel plating layer that is formed on and in contact with the glossy nickel plating layer and has a potential that is more electropositive than the potential of the glossy nickel plating layer by 30 mV to 180 mV; and a trivalent chromium plating layer that is formed on and in contact with the noble potential nickel plating layer. It is preferable that the film thickness ratio of the glossy nickel plating layer to the noble potential nickel plating layer is 1:30 to 10:1. It is also preferable that the noble potential nickel plating layer does not contain non-conductive fine particles.
C25D 5/14 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
C25D 5/16 - Electroplating with layers of varying thickness
C25D 5/48 - After-treatment of electroplated surfaces
C25D 5/54 - Electroplating of non-metallic surfaces
10.
CHROMIUM-PLATED COMPONENT AND PRODUCTION METHOD FOR SAME
The purpose of the present invention is to provide: a chromium-plated component which exhibits excellent corrosion resistance even when the upper layer thereof is a trivalent chromium plating layer, in which corrosion of copper or a copper alloy in particular is suppressed, and which also has good appearance; and a production method that makes it possible to produce such a chromium-plated component. Provided is a chromium-plated component comprising a base that has a surface layer which comprises copper or a copper alloy, a first nickel plating layer that is formed in contact with the surface layer of the base, a second nickel plating layer that is formed on and in contact with the first nickel plating layer, and a trivalent chromium plating layer that is formed on and in contact with the second nickel plating layer, said chromium-plated component being characterized in that the second nickel plating layer has an anode potential of -215 to -290 mV at a current density of 0.1 mA/cm2, and the first nickel plating layer has a potential 15-150 mV lower than the second nickel plating layer.
C25D 5/14 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
C23C 28/00 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and
C25D 5/48 - After-treatment of electroplated surfaces
11.
DEVICE FOR FORMING METAL COATING AND METHOD FOR FORMING METAL COATING
Provided are a device for forming a metal coating and a method for forming a metal coating, the device and method making it less likely for tarnishing of a metal coating to occur. This device 1 for forming a metal coating comprises an electrolytic head unit 10, a positive electrode 21 disposed in a liquid chamber 17, a solid electrolyte film disposed between the positive electrode and a negative electrode, a power supply unit 29 for applying a voltage between the positive electrode 21 and the negative electrode 22, an electrolytic solution introduction unit 41 for introducing an electrolytic solution L into the liquid chamber 17, an electrolytic solution discharge unit 42 for discharging the electrolytic solution L in the liquid chamber 17 from the liquid chamber 17, and a non-pulsation pump 45 for pumping the electrolytic solution L without pulsation. The operation of the non-pulsation pump 45 continuously introduces the electrolytic solution L into the liquid chamber 17 via the electrolytic solution introduction unit 41 without pulsation, and continuously discharges the electrolytic solution L in the liquid chamber 17 from the liquid chamber 17 via the electrolytic solution discharge unit 42 without pulsation.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; chemicals for use in metal plating;
chemical compositions for metal plating; chemicals and
plating chemicals for use in semiconductor manufacture,
semiconductor device fabrication, and semiconductor
packaging; plating solution, plating solution additive,
plating additives for use in semiconductor manufacture,
semiconductor device fabrication, and semiconductor
packaging; chemicals and plating chemicals for use in
package substrate, and printed circuit boards; plating
solution, plating solution additive, plating additives for
use in package substrate, and printed circuit boards;
surface-active agents [surfactants]; etching solutions
[acids]; etchants for use in the manufacture of
semi-conductors; etchants for use in the manufacture of
printed circuit boards; etchants for use in the manufacture
of package substrate; stripping agents; separating and
unsticking [ungluing] preparations.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; chemicals for use in plating; plating solution; plating solution additive; plating additives; metal surface treatment agents; chemical agents for metal surface cleaning; etching agents; stripping agents; chemical agents for use in the plating industry; chemicals and plating chemicals for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; plating solution, plating solution additive, plating additives for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; metal surface treatment agents, chemical agents for metal surface cleaning, etching agents, stripping agents for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemicals and plating chemicals for use in package substrate, and printed circuit boards; plating solution, plating solution additive, plating additives for use in package substrate, and printed circuit boards; metal surface treatment agents, chemical agents for metal surface cleaning, etching agents, stripping agents for use in package substrate, and printed circuit boards
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; chemicals for use in metal plating;
chemical compositions for metal plating; chemicals and
plating chemicals for use in semiconductor manufacture,
semiconductor device fabrication, and semiconductor
packaging; plating solution, plating solution additive,
plating additives for use in semiconductor manufacture,
semiconductor device fabrication, and semiconductor
packaging; chemicals and plating chemicals for use in
package substrate, and printed circuit boards; plating
solution, plating solution additive, plating additives for
use in package substrate, and printed circuit boards;
surfactants for industrial purposes; detergents for
industrial use as part of manufacturing operations; etching
solutions [acids]; etchants for use in the manufacture of
semi-conductors; etchants for use in the manufacture of
printed circuit boards; etchants for use in the manufacture
of package substrate; stripping agents.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; chemicals for use in metal plating;
chemical compositions for metal plating; chemicals and
plating chemicals for use in semiconductor manufacture,
semiconductor device fabrication, and semiconductor
packaging; plating solution, plating solution additive,
plating additives for use in semiconductor manufacture,
semiconductor device fabrication, and semiconductor
packaging; chemicals and plating chemicals for use in
package substrate, and printed circuit boards; plating
solution, plating solution additive, plating additives for
use in package substrate, and printed circuit boards;
surfactants for industrial purposes; detergents for
industrial use as part of manufacturing operations; etching
solutions [acids]; etchants for use in the manufacture of
semi-conductors; etchants for use in the manufacture of
printed circuit boards; etchants for use in the manufacture
of package substrate; stripping agents.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; chemicals for use in metal plating; chemicals for use in metal plating on metals and non-metals; metal plating chemical compositions, namely, electrolytic acid copper solutions; chemical additive for use in the manufacture of metal plating solution; chemical additives for use in metal plating; chemical additives for use in metal plating on metals and non-metals; metal surface treatment chemical agents; chemical agents for metal surface cleaning; etching agents in the nature of etchants for use in semiconductor manufacture, semiconductor device fabrication, and in the manufacture of package substrate, printed circuit boards, and semiconductor packaging; chemical agents for use in the metal plating industry; chemicals and metal plating chemicals for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; plating solution being chemical composition for metal plating, metal plating solution chemical additive, metal plating chemical additives for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; metal surface treatment chemical agents, chemical agents for metal surface cleaning for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemicals and metal plating chemicals for use in package substrate, and printed circuit boards; metal plating chemical compositions, namely, electrolytic acid copper solutions, plating solution chemical additive, and metal plating chemical additives for use in package substrate, and printed circuit boards; metal surface treatment chemical agents, chemical agents for metal surface cleaning for use in package substrate, and printed circuit boards
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; chemicals for use in metal plating; chemicals for use in metal plating on metals and non-metals; metal plating chemical compositions, namely, electrolytic acid copper solutions; chemical additive for use in the manufacture of metal plating solution; chemical additives for use in metal plating; chemical additives for use in metal plating on metals and non-metals; metal surface treatment chemical agents; chemical agents for metal surface cleaning; etching agents in the nature of etchants for use in semiconductor manufacture, semiconductor device fabrication, and in the manufacture of package substrate, printed circuit boards, and semiconductor packaging; chemical agents for use in the metal plating industry; chemicals and metal plating chemicals for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; plating solution being chemical composition for metal plating, metal plating solution chemical additive, metal plating chemical additives for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; metal surface treatment chemical agents, chemical agents for metal surface cleaning for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemicals and metal plating chemicals for use in package substrate, and printed circuit boards; metal plating chemical compositions, namely, electrolytic acid copper solutions, plating solution chemical additive, and metal plating chemical additives for use in package substrate, and printed circuit boards; metal surface treatment chemical agents, chemical agents for metal surface cleaning for use in package substrate, and printed circuit boards
The present invention provides a plating solution which has excellent via filling characteristics and enables the formation of a flat plating surface. This plating solution contains a water-soluble metal salt and a sulfonio group-containing ether compound. It is preferable that the metal salt contains copper; and it is also preferable that the sulfonio group-containing ether compound has a mass average molecular weight of 2,000 to 10,000. In addition, it is preferable that the concentration of the sulfonio group-containing ether compound in the plating solution is 0.1 mg/L to 1 g/L.
A coating agent for forming an oxide film; a method for producing an oxide film; and a method for producing a metal-plated structure, where the stability of the coating agent can be enhanced, and an oxide film which can be plated and has high adhesion to a substrate can be easily formed. The coating agent for forming an oxide film is a liquid coating agent, essentially contains titanium atoms, and optionally contains silicon atoms and copper atoms, wherein the ratio of the sum of the titanium atoms and copper atoms to the silicon atoms is 1:0-3:2. The method for producing an oxide film includes applying the coating agent to a substrate and heating to form an oxide film. The method for producing a metal-plated structure includes: a metal-film-forming step for forming a metal film on the oxide film; and a baking step for baking the metal film.
C23C 18/12 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
21.
CHROMIUM-PLATED COMPONENT AND METHOD FOR MANUFACTURING SAME
The present invention solves the difficulty of management for plating with a good appearance while maintaining corrosion resistance of trivalent chromium plating, and the complexity of a plating step. A chromium-plated component and a method for manufacturing the same, the chromium-plated component being characterized by comprising: a base; a semi-glossy nickel plating layer that is formed on the base; a glossy nickel plating layer that is formed in contact with the top of the semi-glossy nickel plating layer, has a potential difference with the semi-glossy nickel plating layer of -115 to 30 mV, inclusive, and does not contain non-conductive fine particles; and a trivalent chromium plating layer that is formed in contact with the top of the glossy nickel plating layer.
C25D 5/14 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
C25D 3/06 - ElectroplatingBaths therefor from solutions of chromium from solutions of trivalent chromium
C25D 5/48 - After-treatment of electroplated surfaces
C25D 5/56 - Electroplating of non-metallic surfaces of plastics
22.
METHOD FOR COARSENING COPPER CRYSTAL GRAINS IN OBJECTS TO BE PLATED AND COPPER-PLATED MEMBRANE HAVING COARSENED COPPER CRYSTAL GRAINS IN COPPER-PLATED MEMBRANE
A copper-plated membrane having coarsened crystals can be obtained by a simple operation, by using a method for coarsening copper crystal grains in an object to be plated, said method being characterized by including: a step (a) in which the object to be plated is electroplated using an electrolytic copper plating solution that contains sulfuric acid, copper sulfate, chloride ions, a brightener, and a leveler and containing at least 200g/L of sulfuric acid; and a step (b) in which the electroplated object to be plated is heat treated at no more than 400°C.
232n32n22, C=O, or C=S), and this white trivalent chromium plating method using the white trivalent chromium plating bath, enable a high plating deposition rate in the trivalent chromium plating bath, and provide an appearance suitable for decorative applications.
An additive for composite plating solutions according to the present invention is characterized by containing non-conductive fine particles, nickel ions and water. This additive for composite plating solutions is in the form of a liquid that contains the non-conductive fine particles, and does not require preparation of special fine particles, while exhibiting high stability.
1233 is hydrogen, optionally branched C1-C5 alkyl group or carboxyalkyl group), and one or more selected from an alkali metallic salt of the compound and a hydrate of the alkali metallic salt. Also provided are a method for trivalent chromium plating and a chromium-plated product in which said trivalent chromium plating solution is used. A method for improving the resistance to metal impurities for a trivalent chromium plating solution is a novel approach to block the influence of metal impurities.
Provided is a plating method characterized by comprising the following steps (a)-(d): (a) a step for etching or surface-modifying a resin; (b) a step for causing self-catalytic metal ions to be adsorbed onto the etched or surface-modified resin; (c) a step for reducing the self-catalytic metal ions adsorbed onto the resin; and (d) a step for performing electroless plating on the resin. Also provided is a plated product characterized in that a noble metal is substantially contained in the plating layer and in that an electroless plating layer is provided on a resin and no precious metal is substantially contained in the plating layer. Due to said plating method and said plated product, a plating technology can be achieved that does not use a catalyst containing noble metals such as palladium and silver when performing electroless plating on a resin.
The present invention pertains to: an electroless nickel plating bath characterized by containing a water soluble nickel salt, a reducing agent, and one or more selected from the group consisting of phenolsulfonic acid, phenolsulfonates, and hydrates thereof; and an electroless nickel alloy plating bath containing an alloying metal salt in addition to what is contained in said electroless nickel plating bath. As a result, it is possible to achieve fine generation of a plating film and fine continuous usage of a plating bath, while substantially not containing a nitrogen compound such as ammonia which is a substance subjected to regulations.
C23C 18/36 - Coating with one of iron, cobalt or nickelCoating with mixtures of phosphorus or boron with one of these metals using reducing agents using hypophosphites
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
28.
ELECTROLYTIC SILVER PLATING BATH AND ELECTROLYTIC SILVER PLATING METHOD USING SAME
11231231 6122 may be linked to form cyclic alkyl or an aromatic ring.]. Accordingly, with this electrolytic silver plating bath, consumption of an additive, such as a brightening agent, can be suppressed and performance degradation of the plating bath even when plating is continuously carried out using the same plating bath can be suppressed.
A microporous plating solution characterized by containing nonconductive particles and polyaluminum chloride allows for easy preparation of positively charged nonconductive particles and is highly stable. Then, a method for performing microporous plating on an object to be plated, characterized by plating the object to be plated in the microporous plating solution results in a favorable number of micropores in the plating.
Provided is a curable resin composition with which it is possible to achieve excellent adhesion between an insulation layer and a conductor layer, even when the surface irregularities (surface roughness) are small (e.g., even when Ra is 200nm or less). A curable resin composition according to the present invention comprises an epoxy resin, a catalyzing metal-containing silicon oligomer, a phenol resin and an active ester compound, the curable resin composition characterized in that: the epoxy resin contains a bisphenol A-type epoxy resin, a biphenyl aralkyl-type epoxy resin, and an epoxy resin other than the bisphenol A-type epoxy resin and biphenyl aralkyl-type epoxy resin; and the catalyzing metal-containing silicon oligomer is obtained by subjecting a tetraalkoxy silane and a polyvalent alcohol, in which a hydroxy group is bonded to at least the n and n+1 sites or n and n+2 sites (where n is an integer of at least 1), to a condensation reaction in the presence of a metal having catalytic properties with respect to electroless plating.
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
Provided is a curable resin composition with which conductor layer coating can be excellently carried out, and which is suitable for use as an underlayer coating film of an adhesiveness-imparting coating that has excellent adhesion with the coated conductor layer, even when surface irregularities (surface roughness) are small (e.g., even when Ra is 200nm or less). A curable resin composition according to the present invention is for forming an underlayer coating film provided between a base material and an adhesiveness-imparting coating provided in order to improve the adhesion of a coating layer to the base material, the curable resin composition characterized in that: the curable resin composition comprises an epoxy resin (A) and an active ester compound (B); the adhesiveness-imparting coating comprises a catalyzing metal-containing silicon oligomer; and the catalyzing metal-containing silicon oligomer is obtained by subjecting a tetraalkoxy silane and a polyvalent alcohol, in which a hydroxy group is bonded to at least the n and n+1 sites or n and n+2 sites (where n is an integer of at least 1), to a condensation reaction in the presence of a catalyzing metal.
A trivalent chromium plating solution containing a trivalent chromium compound, a complexing agent, a conductive salt, and a pH-buffering agent, and further containing an organic compound having 2-4 carbon atoms and three or more chloro groups, and a trivalent chromium plating method using the same provide a practical trivalent chromium plating with enhanced corrosion resistance as compared to the ordinary trivalent chromium plating.
This microporous plating solution, characterized by containing non-conductive particles and polyaluminum chloride, allows for easy preparation of positively charged nonconductive particles and is safe. Also, this method for performing microporous plating on an object to be plated, characterized by plating the object to be plated in the microporous plating solution, results in a favorable number of micropores in the plating.
[Problem] To provide a plating apparatus and plating method whereby plating treatment can be satisfactorily performed even when a long sheet as the material to be plated has a large electrical resistance, and also whereby adhesion of a metal thin film of copper or the like to the surface of the long sheet is enhanced, and a long sheet is obtained that is provided with a high-quality plating treatment and on which a nickel metal coating is formed. [Solution] A plating apparatus 10 for continuously conveying a long sheet 18 as a material to be plated between an unwinding-side roll 12 and a winding-side roll 14 via a hollow cathode roll 16, and supplying electricity to the long sheet 18 from the cathode roll 16 while conveying the long sheet 18 through a plating tank 24 in which an anode 22 submerged in a plating liquid 20 is provided, thereby performing an electroplating treatment on the long sheet 18, is furthermore configured so that the cathode roll 16 is provided upstream from the plating tank 24 in the conveyance direction of the long sheet 18, and so that the distance of the cathode roll 16 from an upstream-side entrance of the plating tank 24 is in the range of 150 mm or less.
C23C 28/02 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and only coatings of metallic material
C25D 3/38 - ElectroplatingBaths therefor from solutions of copper
C25D 21/00 - Processes for servicing or operating cells for electrolytic coating
The present invention provides an electrolytic copper plating bath which has excellent via hole filling properties. An electrolytic copper plating bath according to the present invention contains a reaction product of a compound that contains an amino group in each molecule and a compound that contains an epoxy group in each molecule, said reaction product being obtained in the presence of an acid. The compound that contains an amino group in each molecule contains an amine compound that is represented by a specific general formula. The compound that contains an epoxy group in each molecule contains an epoxide compound that is represented by a specific general formula.
C25D 3/38 - ElectroplatingBaths therefor from solutions of copper
C25D 7/00 - Electroplating characterised by the article coated
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
A copper sulfate plating solution which contains a compound containing at least a nitrogen atom, a hydrogen atom and a carbon atom, the copper sulfate plating solution being characterized in that the compound is such a compound that the ratio (X) of the number of nitrogen atoms to the total number of all of atoms, which is represented by formula (1) [Mathematical formula (1)], in the molecular formula of the compound from which hydrogen atoms are removed from the whole of the compound or a repeating unit in the compound and the relative molecular weight (Mw) of the compound satisfy formula (2) or (3) [Mathematical formula 2]; and a copper sulfate plating method using the copper sulfate plating solution.
C25D 3/38 - ElectroplatingBaths therefor from solutions of copper
C07C 217/28 - Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having etherified hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being acyclic and saturated having one amino group and at least two singly-bound oxygen atoms, with at least one being part of an etherified hydroxy group, bound to the carbon skeleton, e.g. ethers of polyhydroxy amines
A practical trivalent chromium plating having better corrosion resistance than conventional trivalent chromium plating is obtained by: this trivalent chromium plating solution characterized by being obtained by adding an organic compound having 2-4 carbon atoms and three or more chloro groups to a trivalent chromium plating solution containing a trivalent chromium compound, a complexing agent, a conductive salt, and a pH-buffering agent; and this trivalent chromium plating method using the trivalent chromium plating solution.
Provided is a technique for coloring without any problem with waste water or stability of color development or deposition. A plating solution for coloring characterized by containing a molybdate and a carboxylic acid having one or more carboxyl groups and one or more hydroxy groups and having two or more carbon atoms or a salt thereof, and having a pH of 4.5 to 7.5. A method for coloring a member to be plated characterized by electrolyzing the member to be plated as a cathode in this plating solution for coloring.
Provided are: a coating agent for forming an oxide film; a method for producing an oxide film; and a method for producing a metal-plated structure, wherein the stability of the coating agent can be enhanced, and an oxide film which can be plated and has high adhesion to a substrate can be easily formed. The coating agent for forming an oxide film is a liquid coating agent, essentially contains titanium atoms, and optionally contains silicon atoms and copper atoms, wherein the ratio of the sum of the titanium atoms and copper atoms to the silicon atoms is 1:0-3:2. The method for producing an oxide film comprises a step for applying the coating agent to a substrate and heating to form an oxide film. The method for producing a metal-plated structure comprises: a metal-film-forming step for forming a metal film on the oxide film; and a firing step for firing the metal film.
C23C 18/12 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
C23C 18/18 - Pretreatment of the material to be coated
C25D 5/54 - Electroplating of non-metallic surfaces
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
40.
TRIVALENT CHROMIUM PLATING SOLUTION AND METHOD FOR CHROMIUM-PLATING USING SAME
Provided is a trivalent chromium plating solution containing: a trivalent chromium compound; a complexing agent; potassium sulfate and ammonium sulfate as conductive salts; a pH buffer; and a sulfur-containing organic compound, wherein a carboxylic acid having two or more hydroxy groups and two or more carboxy groups, or a salt thereof is used as said complexing agent, and a saccharine or a salt thereof, and a sulfur-containing organic compound having an allyl group are used in combination as said sulfur-containing organic compound. The trivalent chromium plating solution is practical and has a high plating deposition rate.
1 22 is absent or represents a hydrocarbon group having 1-10 carbon atoms; and X represents a hydrogen atom or an alkali metal atom); and a trivalent chromium plating method which uses this trivalent chromium plating solution. The trivalent chromium plating solution and the trivalent chromium plating method according to the present invention are consequently free from problems such as deposition failure of a plating and generation of color unevenness such as brown stripes in a plating even if a metal impurity is contained in the plating solution.
To provide a technology that facilitates removal of a resist between fine wires, the present invention provides: a resist stripping solution characterized by containing a potassium salt and cellosolve; and a resist removing method characterized by treating a substrate to which a resist is applied with the resist stripping solution.
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
A substrate is held in a substrate holder and accommodated in a treatment chamber. A positive electrode panel is arranged opposite to a surface of the substrate. Process gas is sent from a blower panel, toward the positive electrode panel and the substrate. A positive electrode of a high-frequency power source is connected to the positive electrode panel, and a negative electrode of the high-frequency power source is connected to the blower panel, to apply a high-frequency voltage. The process gas passes between the positive electrode panel and the blower panel which is the negative electrode, so that plasma is generated. The generated plasma removes contaminants on the surface of the substrate.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
33Y (here, R denotes a vinyl group or an ethynyl group, X denotes an optionally substituted alkylene group or phenylene group, and Y denotes an alkali metal) and being characterized by further containing two or more carboxylic acid compounds, each of which has two or more carbon atoms, one or more carboxyl groups and two or more hydroxyl groups; and a method for obtaining an iron-nickel alloy having a wide temperature range and excellent performance by means of plating using an electroplating method that uses the electroplating liquid.
A treatment device 1 has: a treatment tank 2 provided with a constant temperature heater 3 on the outer periphery; an electrolytic cell 6 continuing from a pipe 4 provided with a circulation pump 5; and a pipe 7 for supply to the treatment tank 2 from the electrolytic cell 6. Within the electrolytic cell 6 are provided a positive electrode 6A and a negative electrode 6B formed from diamond electrodes and a bipolar electrode 6C disposed between the two. The treatment tank 2 and the electrolytic cell 6 are filled with a prescribed concentration of sulfuric acid. The treatment device is configured such that a persulfate solution S such as peroxydisulfuric acid is generated by electrolysis of the sulfuric acid by making a prescribed current flow from a direct current power supply unit to the positive electrode 6A and the negative electrode 6B, and this persulfate solution S can be supplied to the treatment tank 2 via the pipe 7. A plating pretreatment method for Cr and Mn-free ABS resin surfaces that can form plating sufficiently adhering to an ABS resin surface can be applied to this treatment device 1.
A wet type processing apparatus includes a processing bath for reserving inside the processing liquid and rendering the resin film pass through the processing liquid; a pair of conveyance members arranged on a loading side for the resin film of the processing bath and on a delivery side for resin film of the processing bath at a position higher than a liquid surface of the processing liquid reserved in the processing bath; and a spouting unit arranged between the pair of the conveyance members at a position lower than the conveyance members and formed with a circumferential surface having plural holes for spouting the processing liquid from the circumferential surface to change a direction of the resin film along the circumferential surface in a non-contact manner in the processing liquid according to spouted flows from the holes.
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
C23C 18/32 - Coating with one of iron, cobalt or nickelCoating with mixtures of phosphorus or boron with one of these metals
A new method capable of forming a circuit by performing metal plating on a desired portion on a substrate through a small number of steps regardless of the kind of the substrate. A method for forming a circuit on a substrate characterized in that when forming a circuit by plating on a substrate, the method includes steps of applying a coating film containing a silicone oligomer and a catalyst metal onto the substrate, and thereafter, performing an activation treatment of the catalyst metal in the coating film to make the catalyst metal exhibit autocatalytic properties, and then, performing electroless plating.
H01L 21/288 - Deposition of conductive or insulating materials for electrodes from a liquid, e.g. electrolytic deposition
C23C 18/18 - Pretreatment of the material to be coated
C23C 18/20 - Pretreatment of the material to be coated of organic surfaces, e.g. resins
C25D 5/02 - Electroplating of selected surface areas
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
B05D 3/06 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
48.
MULTI-STAGE RESIN SURFACE ETCHING METHOD, AND PLATING METHOD ON RESIN USING SAME
Provided is a resin surface etching method characterized in that, in etching a resin surface, one set of steps (a) and (b), is performed two or more times without performing a resin swelling step, wherein step (a) is a step for treating the resin surface with a solution containing an oxidizing agent and adsorbing the oxidizing agent on the resin surface, and step (b) is a step for activating the oxidizing agent adsorbed on the resin surface in step (a). This rein surface etching method provides a novel technique operable at an industrial level, as a resin etching technique that does not use a chromic acid.
Provided are: an iron-nickel alloy electroplating liquid for filling, characterized in that an acetylene alcohol is furthermore contained in the iron-nickel alloy electroplating liquid; a method for filling an opening using the iron-nickel alloy electroplating liquid for filling; and a technique whereby an iron-nickel alloy can be utilized in circuit formation by electroplating using a method for manufacturing a circuit substrate.
METAL COATING FOR ELECTROMAGNETIC WAVE PENETRATION, METHOD FOR FORMING METAL COATING FOR ELECTROMAGNETIC WAVE PENETRATION, AND RADAR DEVICE FOR VEHICLE INSTALLATION
The purpose of the present invention is to provide a metal coating for electromagnetic wave penetration having a sufficient metallic luster for appearance, and a method for forming a metal coating for electromagnetic wave penetration suitable for forming this metal coating for electromagnetic wave penetration. To achieve this purpose, a metal coating, which is obtained by way of a dry process such as sputtering, is an aggregation of micro-islands surrounded by micro-cracks that form penetration paths for electromagnetic waves, and has metallic luster, with 2 – 10000 micro-islands being present in a unit surface area (1 mm2), is provided on the surface of a base material as a metal coating for electromagnetic wave penetration.
C23C 28/00 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and
B05D 1/18 - Processes for applying liquids or other fluent materials performed by dipping
51.
PLATING SOLUTION FOR COLORING, AND COLORING METHOD
Provided is a technique for coloring, which has no problem with waste water, exhibition of color, or stability of deposition. This plating solution for coloring is characterized by containing: a molybdate; and a carboxylic acid having one or more carboxyl groups and one or more hydroxyl groups and having two or more carbon atoms, or a salt thereof, wherein the pH of the plating solution is 4.5-7.5. This method for coloring a member to be plated, is characterized in that, as a cathode, the member to be plated is electrolyzed in the plating solution for coloring.
[Problem] To provide a resin film treatment device for reliably conveying a resin film to a treatment tank and performing satisfactory treatment even when a thin resin film is conveyed. [Solution] A resin film treatment device whereby a resin film is sent between a delivery-side roll and a winding-side roll and a necessary treatment is performed, wherein the resin film treatment device is characterized by having a sending roller for sending the resin film to which a predetermined tension is imparted, and an elastomer resin surface part for contacting the resin film is formed on the surface of the sending roller.
An object of the present invention is to provide a silicon oligomer having a novel function that has not been achieved by a conventional condensation product of water and a tetraalkoxysilane. Provided are a silicon oligomer represented by the following formula (I) and a production method therefor:
3 each independently is a group represented by the following formula (II); n is 0 or 1; and m is an integer of 1 to 3 when n is 0, and m is 1 when n is 1:
wherein A is an alkylene group having 2 to 4 carbon atoms which may be branched, and 1 is an integer of 1 to 3.
C09D 183/00 - Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon onlyCoating compositions based on derivatives of such polymers
54.
PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHOD
Provided are a plasma processing device and a plasma processing method for uniformly performing, with respect to a substrate, i.e., a subject to be processed, surface processing using plasma. A substrate (11) is held by a substrate holder (31), and is stored in a processing chamber (14). A positive electrode panel 32 is disposed to face the front surface of the substrate (11). A process gas is sent toward the positive electrode panel (32) and the substrate (11) from a blow-out panel (33). A high frequency voltage is applied by connecting the positive electrode of a high frequency power supply to the positive electrode panel (32), and connecting the negative electrode of the high frequency power supply to the blow-out panel (33). The process gas passes through the positive electrode panel (32) and the blow-out panel (33), i.e., the negative electrode, and plasma is generated. A contaminant on the front surface of the substrate (11) is removed by means of the plasma thus generated.
Provided is a remover liquid for resists which is characterized by containing a quaternary ammonium salt, an alkanolamine, and an aliphatic amine. Even when the remover liquid is used over days and carbonic acid dissolves therein with a lapse of the days, the remover liquid is less apt to deteriorate in performance.
To provide: a coating agent for forming a metal oxide film, which contains an organic solvent that is different from N, N-dimethyl acetamide (DMA) or N-methyl pyrrolidone (NMP), and which has excellent conformal coating properties; and a method for producing a base having a metal oxide film. A coating agent for forming a metal oxide film, which contains a solvent and a metal, and wherein the solvent contains a compound (A) represented by formula (1). (In formula (1), each of R1 and R2 independently represents an alkyl group having 1-3 carbon atoms; and R3 represents a group represented by formula (1-1) or formula (1-2). In formula (1-1), R4 represents a hydrogen atom or a hydroxyl group; and each of R5 and R6 independently represents an alkyl group having 1-3 carbon atoms. In formula (1-2), each of R7 and R8 independently represents a hydrogen atom or an alkyl group having 1-3 carbon atoms.)
[Problem] To provide a plasma generating device capable of efficient film formation while avoiding damage to a member to be film-formed due to plasma heat. [Solution] The plasma generating device according to the present invention is characterized in that: a pair of plate-like conductor parts 12, 14 each having a plurality of through-holes 26, 28 passing between main surfaces are opposed to each other with a predetermined gap 13 therebetween; a gas is flowed into the through-holes from one side of the pair of plate-like conductor parts 12, 14; plasma discharge is generated in the gap by applying a high-frequency voltage between the pair of plate-like conductor parts 12 and 14; and the generated plasma is flowed out to the other side of the pair of plate-like conductor parts 12, 14.
H05H 1/46 - Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
C23C 16/509 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
C23C 16/54 - Apparatus specially adapted for continuous coating
A new method is provided by which a desired portion of a substrate surface can be plated with a metal through a small number of steps regardless of the kind of the substrate, thereby forming a circuit. The method for forming a circuit on a substrate through plating is characterized by including the steps of forming a coating film comprising a silicone oligomer and a catalyst metal on a substrate, thereafter activating the catalyst metal contained in the coating film to make the coating film exhibit autocatalytic properties, and then conducting electroless plating.
[Problem] The purpose of the present invention is to provide a resin film wet treatment apparatus for performing surface treatment such as electroless plating even on relatively thin resin films. [Solution] A wet treatment apparatus for applying a specified treatment on the surface of a resin film web by immersing said resin film in a specified treatment liquid is characterized in comprising: a treatment tank for passing the resin film through the treatment liquid; a pair of conveying members that are respectively provided at the resin film introducing side and the resin film discharging side of the treatment tank; and a jetting unit, which is disposed between the pair of conveying members at a position lower than the conveying members, the circumferential surface of which is provided with multiple holes for jetting the treatment liquid from the circumferential surface, and which contactlessly changes the direction of the resin film in the treatment liquid along said circumferential surface by jetting from the holes.
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
60.
METHOD FOR ETCHING RESIN SURFACE AND METHOD FOR PLATING RESIN UTILIZING SAID ETCHING METHOD
Provided is a novel etching technique for resins, which does not use chromic acid and is able to be put in industrial practice. A method for etching a resin surface, which is characterized by comprising the following steps (a) and (b). (a) A step wherein a resin is treated with a solution that contains an oxidant so that the oxidant is adsorbed on the resin surface. (b) A step wherein the oxidant, which is adsorbed on the resin surface in step (a), is activated.
C09K 13/12 - Etching, surface-brightening or pickling compositions containing heavy metal salts in an amount of at least 50% of the non-solvent components
C09K 13/06 - Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
61.
NICKEL-PLATING ADDITIVE AND SATIN NICKEL-PLATING BATH CONTAINING SAME
Provided are: a nickel-plating additive characterized in containing a benzethonium salt; a satin nickel-plating bath containing same; and a satin nickel-plating method that uses same. Thus, it is possible to provide technology with which a satin-like appearance can be obtained in nickel-plating.
[Problem] To stably obtain a satin-like appearance with a small number of layers without using a satin Ni plating layer and using a ductile Cu plating layer. [Solution] A decorative component comprises: a base material 1; a first Cu plating layer 2 for which surface roughness Ra is 0.1-0.8 µm; and a second Cu plating layer 3, which is formed on the first Cu plating layer 2 and for which film thickness is 1-6.1 µm and surface roughness Ra is 15-80% of the surface roughness Ra of the first Cu plating layer 2. The decorative component exhibits a satin-like appearance on the basis of the surface roughness of the second Cu plating layer 3.
Provided is a technique with which decomposition of permanganic acid can be suppressed at low cost while maintaining the etching performance of the permanganic acid, the technique being achieved by an acidic etching solution including permanganate ion for resin molded bodies, the solution characterized by further including a pH buffer, and an etching method of the resin molded bodies and a method of plating on the resin molded bodies, which use the etching solution.
[Problem] To provide a surface treatment apparatus capable of efficiently treating a variety of objects to be treated. [Solution] This surface treatment apparatus carries out a necessary surface treatment by contacting the surface of an object to be treated with a treatment solution and is characterized by comprising: a tank main body having a cut-out portion in a side wall as a side wall opening and containing the treatment solution; a replaceable side panel detachably disposed at the side wall opening and having a treatment opening through which the surface of the object to be treated faces the interior of the tank main body during the surface treatment; and a support mechanism which holds the object to be treated and moves such that the surface of the object to be treated faces the interior of the tank main body through the treatment opening.
To show a liquid crystal composition having at least one or a suitable balance regarding at least two of characteristics such as a short response time, a large voltage holding ratio, a low threshold voltage, a large contrast ratio, a long service life and a small flicker rate; and an AM device having characteristics such as a short response time, a large voltage holding ratio, a low threshold voltage, a large contrast ratio and a long service life.
The liquid crystal composition has a negative dielectric anisotropy and contains a specific compound having a large negative dielectric anisotropy as a first component, and the composition may contain a specific compound having a high maximum temperature or a small viscosity as a second component, a specific compound having a large negative dielectric anisotropy as a third component, and a specific compound having a polymerizable group as an additive component.
C09K 19/34 - Non-steroidal liquid crystal compounds containing at least one heterocyclic ring
C09K 19/30 - Non-steroidal liquid crystal compounds containing at least two non-condensed rings containing saturated or unsaturated non-aromatic rings, e.g. cyclohexane rings
C09K 19/54 - Additives having no specific mesophase
C09K 19/04 - Liquid crystal materials characterised by the chemical structure of the liquid crystal components
C09K 19/12 - Non-steroidal liquid crystal compounds containing at least two non-condensed rings containing at least two benzene rings at least two benzene rings directly linked, e.g. biphenyls
G09G 3/36 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix by control of light from an independent source using liquid crystals
66.
SATIN FINISH IMMERSION COATING AND SURFACE TREATMENT METHOD USING SAME
The purpose of the present invention is to provide surface treatment technology with which protection of a raw material without damaging the raw material is possible with a simple process and which is capable of forming a metal appearance with high corrosion resistance and a controlled sheen. Said technology is: a satin finish immersion coating characterized in containing metal flakes with a mean particle diameter of 1-50 µm and a mean flake thickness of 5-50 nm, a silicon oligomer, and a resin; and a surface treatment method characterized in that a member to be treated is immersed in said satin finish immersion coating.
C09D 201/00 - Coating compositions based on unspecified macromolecular compounds
C09D 5/28 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects producedFilling pastes for wrinkle, crackle, orange-peel, or similar decorative effects
C09D 133/00 - Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofCoating compositions based on derivatives of such polymers
C09D 161/00 - Coating compositions based on condensation polymers of aldehydes or ketonesCoating compositions based on derivatives of such polymers
Provided is a technique for managing a copper sulfate plating solution by objectively assessing the age of the copper sulfate plating solution, in place of conventional management of copper sulfate plating solutions in which the plating solution is renewed or purified according to experimental assessments, or the volume of defective products or the like as a follow-up response. This method for managing a copper sulfate plating solution is characterized in that the concentration of impurities in a copper sulfate plating solution for plating a to-be-plated material with copper sulfate is measured, and the age of the copper sulfate plating solution is assessed from the concentration of impurities.
[Problem] To reliably evaluate the degree of degassing of a processing liquid for processing a work object having a fine pattern comprising grooves or holes in the surface thereof, regardless of the type of gas and the like. [Solution] This method for evaluating the degassing of a processing liquid includes: immersing a pseudo work object provided with a fine pattern having required protrusions and recesses on the surface thereof, in a degassing processing tank for degassing a gas included in the processing liquid for processing a work object having a fine pattern comprising grooves or holes in the surface thereof, in order to evaluate the degree of degassing of the processing gas in the degassing processing tank; and evaluating the degree of degassing of the processing liquid in accordance with the change over time of the surface condition of the pseudo work object.
Provided is a cyanogen-free gold electroplating liquid with which conventional gold electroplating liquids comprising cyanogen-based compounds can be replaced, the cyanogen-free gold electroplating liquid being characterized by containing components (a) through (c): (a) is a monovalent metal complex represented by general formula (I) (where in general formula (I), R1 is hydrogen or an optionally branched C1-4 alkyl group optionally having mercapto groups, R2 is hydrogen or an optionally branched C1-4 alkyl group, R3 is hydrogen, an optionally branched C1-4 alkyl group, a hydroxyalkyl group, or an optionally branched C1-4 carboxyalkyl group optionally having mercapto groups, and n is an integer of 1 to 10); (b) is an electrolyte; and (c) is a crystal modifier selected from metals.
The purpose of the present invention is to provide a new technique whereby plating can be performed regardless of the type of substrate. This technique is a plating method using a catalyst-containing metal silicon oligomer and a coating agent including the same, the catalyst-containing metal oligomer being obtained by condensation of a tetraalkoxysilane and a polyhydric alcohol in which hydroxyl groups are bonded in at least n and n+1 positions or n and n+2 positions (where n is an integer of 1 or greater), in the presence of a catalyst metal.
C08G 77/08 - Preparatory processes characterised by the catalysts used
C08G 77/60 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon in which all the silicon atoms are connected by linkages other than oxygen atoms
C08G 79/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon
Provided is a technique for changing the temperature, concentration, current density, and other conditions of conventional copper plating to increase the speed of filling a hole or groove formed in a substrate. Provided is a method for filling a hole or groove formed in a substrate with copper plating, wherein said method is characterized in that the substrate in which the hole or groove is formed is immersed in a 30-70ºC acidic copper plating solution containing copper ions, sulfate ions, and halide ions, and the plating uses an insoluble electrode as an anode at a current density of 3A/dm2 or greater.
The problem addressed by the present invention is providing packing for a substrate plating jig that is more advantageous in terms of cost than O-rings and can handle various dimensions and shapes for a substrate jig and a substrate plating jig that uses the packing for a substrate plating jig. Provided is packing for a substrate plating jig that is attached to the plating jig and is for sealing conductive members for electrifying the substrate and parts of the substrate surface in contact with the conductive members from plating fluid, and is characterized by being provided with a packing main body formed from an elastic material that has an elongated shape and an end, and a connecting member for making a non-ending shape by connecting and affixing connecting ends of both end parts of the packing main body to each other, and is characterized by the connecting member being formed from a shaft part and a plurality of hooks provided so as to protrude at a prescribed angle from the shaft part and the connecting member being provided inside and extending within the packing main body in both directions from the connecting point within a prescribed range so as to extend over the connecting point where the connection ends are linked when the two ends of the packing main body are linked. Also provided is a substrate plating jig that uses the packing for a substrate plating jig.
The present invention is a method for manufacturing a magnesium alloy product in which a magnesium alloy material is coated by a coating material, characterized in that the magnesium alloy material is heat-treated at 200˚C or greater prior to the magnesium alloy material being coated by the coating material, thereby solving a problem that when a magnesium alloy is coated with a coating material, the coating material could not be well-coated due to mold release agents, the effect of oils and the like such as grinding fluids and fingerprints clinging to the magnesium alloy during work such as polishing, and due to hydrogen-absorbing properties of magnesium.
B22D 29/00 - Removing castings from moulds, not restricted to casting processes covered by a single main groupRemoving coresHandling ingots
B05D 3/02 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
B05D 7/14 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
B22D 17/00 - Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
C22C 23/02 - Alloys based on magnesium with aluminium as the next major constituent
C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
C22F 1/06 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of magnesium or alloys based thereon
74.
BLACK COATING FILM-FORMING VEHICLE COMPONENT AND/OR FASTENING COMPONENT, AND MANUFACTURING METHOD THEREFOR
The purpose of the present invention is to provide a technology with which it is possible to form, on a galvanised component by a simple process, a coating film which is highly corrosion-resistant and dark black in appearance. A black coating film-forming vehicle component and/or fastening component that is obtained by: a galvanised metal base surface being treated with a black chemical conversion agent that has trivalent chromium as an active ingredient, and a black chemical conversion coating film being formed, said black chemical conversion coating film having an L value (brightness) of 33-30; thereafter, the black chemical conversion coating film being coated with a black coating composition which, among thermosetting coating film-forming ingredients, contains an alkoxysilane oligomer and 25-65 mass% of a black pigment; and the coated black chemical conversion coating film being heat cured.
C23C 28/00 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and
B05D 3/10 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by other chemical means
B05D 7/14 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
B05D 7/24 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
C23C 22/53 - Treatment of zinc or alloys based thereon
75.
ELECTROPLATING SOLUTION FOR TIN OR TIN ALLOY, AND USE FOR SAME
The present invention addresses the problem that attempts to fill a via- or a through-hole using a conventional plating solution for tin or tin alloy plating are either unsatisfactory or, even when successful, extremely time-consuming. An electroplating solution for tin or a tin alloy for addressing this problem is characterized in containing the following components: (a) a carboxyl-group-containing compound; and (b) a carbonyl-group-containing compound, the amounts contained in the electroplating solution being 1.3 g/L or greater for component (a) and 0.3 g/L or greater for component (b).
The purpose of the present invention is to provide a silicon oligomer having a novel function that conventional condensates of water and tetra-alkoxysilane do not have. Provided are: a silicon oligomer that is represented by formula (I) (wherein each of R1-R10 independently represents an alkyl group or a hydroxyalkyl group having 1-4 carbon atoms, each of X1-X3 independently represents a group that is represented by formula (II) [wherein A is an alkylene group that has 2-4 carbon atoms and that may be branched and l is an integer of 1-3], n is 0 or 1, m is an integer of 1-3 when n is 0, and m is 1 when n is 1); and a production method therefor.
C09D 183/00 - Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon onlyCoating compositions based on derivatives of such polymers
77.
COATING AGENT COMPRISING SILICON OLIGOMER AND USE THEREFOR
The purpose of the present invention is to provide a coating agent that uses a silicon oligomer having a novel function that conventional condensates of water and tetra-alkoxysilane do not have. Provided are: a coating agent that is characterized by comprising a silicon oligomer that is represented by formula (I) (wherein each of R1-R10 independently represents an alkyl group or a hydroxyalkyl group having 1-4 carbon atoms, each of X1-X3 independently represents a group that is represented by formula (II) [wherein A is an alkylene group that has 2-4 carbon atoms and that may be branched and l is an integer of 1-3], n is 0 or 1, m is an integer of 1-3 when n is 0, and m is 1 when n is 1); and a surface treatment method that uses the coating agent.
C09D 183/00 - Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon onlyCoating compositions based on derivatives of such polymers
A solution for preventing the occurrence of bridging of an electroless metal coat, which can prevent the occurrence of bridging, i.e., the deposition of an electroless metal coat on a resin in a wiring substrate, after the formation of a circuit pattern, said solution being characterized by comprising a polythiol compound; and a method for manufacturing a printed wiring board using the solution.
Provided is a noble metal-coated member having further improved corrosion resistance. The noble metal-coated member is characterized by comprising a member, a nickel-cobalt alloy layer containing cobalt in an amount of 0.5 to 99 mass% and a noble metal layer, wherein the nickel-cobalt alloy layer and the noble metal layer are laminated in this order on the surface of the member.
The purpose of the present invention is to provide a plating device, whereby it becomes possible to make the flow rate to become uniform in an area located between the bottom of a plating bath and a solution level without the need of providing a circulating pump at the outside of the plating bath, and therefore it becomes possible to form a plating film having a uniform thickness over the entire area of a substrate. A plating device equipped with: a plating bath in which a plating solution is to be placed; a substrate holder which can hold a substrate in such a manner that the substrate can be detached freely; an anode which is arranged so as to face the substrate that is held by the substrate holder; a cross-flow impeller which is arranged rotatablly and in a suspended state on the upstream side of the flow of the plating solution as observed from the substrate side; and a driving means for the cross-flow impeller.
The purpose of the present invention is to provide a plating device, whereby it becomes possible to increase the flow rate of a plating solution and to make the flow rate of the plating solution to become uniform in an area located between the bottom of a plating bath and the solution level of the plating solution without the need of providing a circulating pump at the outside of the plating bath, and therefore it becomes possible to form a plating film having a uniform thickness over the entire area of a substrate and to perform the plating procedure at a high deposition rate. A plating device equipped with a plating bath in which a plating solution is to be placed, a substrate holder which can hold a substrate in such a manner that the substrate can be detached freely, an anode which is arranged so as to face the substrate that is held by the substrate holder, a rail part which is arranged above the plating bath in parallel to the substrate holder, and a paddle which is held by the rail part in a suspended state and can reciprocate along the rail part, said plating device being characterized in that the paddle is provided with a vane part in a suspended state, wherein the vane part is rotatable about the axis of the paddle or is povitable around the axis.
The purpose of the present invention is to provide a plating jig, which is capable of forming metal plating films at the same time on both the surfaces of a semiconductor wafer by performing plating one time, and which has a simple configuration with a thinner holding section. This plating jig is provided with: a base section and a cover section, which are formed such that the sections can hold a substrate to be plated; and a center section, which is sandwiched between the base section and the cover section, and which aligns the substrate to be plated. The plating jig is characterized in that: each of the base section, the cover section, and the center section has an annular portion having an opening at the center; to each of the facing surfaces of the base section annular portion and the cover section annular portion, a seal packing having a conductive ring disposed thereon is attached; the substrate to be plated is disposed in the opening of the center section; and the substrate to be plated is sandwiched from both the front and rear surfaces by means of the seal packing attached to each of the cover section and the center section.
Provided are a plasma treatment device and method by which plasma surface treatment is performed uniformly on an object to be treated. A substrate (11) is held by a holder (33) and housed inside a treatment chamber. Electrode sets (31, 32) are arranged opposite the surfaces of the substrate (11) and the electrode sets (31, 32) are configured from first electrode units (31a, 32a) and second electrode units (31b, 32b) comprising high-frequency electrodes (25) and ground electrodes (26) arranged in rows. A process gas emitted from an inlet is passed between the electrodes (25, 26) to generate plasma, and the generated plasma removes contaminants on the surface of the substrate (11).
This plasma treatment device and method allow evenly performing plasma surface treatment on an object to be treated. A substrate (11) is held by a holder (33) and housed inside a treatment chamber. Electrode units (31, 32) are arranged opposite the surfaces of the substrate (11), and the electrode units (31, 32) are configured from first electrode rows (31a, 32a) and second electrode rows (31b, 32b) comprising high-frequency electrodes (25) and ground electrodes (26) arranged in rows. A process gas emitted from an inlet is passed between the electrodes (25, 26) to generate a plasma, and the generated plasma removes contaminants on the surface of the substrate (11).
The purpose of the present invention is to treat the surfaces of multiple articles of interest with plasma uniformly. A holder (21) in which multiple substrates (11) are housed is set in a vacuum treatment chamber (14). First and second electrodes (41, 42) are arranged with being spaced apart from each other between the holder (21) and an inlet port (38). A process gas discharged through the inlet port (38) is excited with the first and second electrodes (41, 42) to generate plasma. The generated plasma is supplied to the inside of the holder (21) through a side opening provided on a side plate (22) of the holder (21), and removes contaminants on the surfaces of the substrates (11).
The present invention relates to a plating jig and a plating device that are used for substrate plating processing, and the purpose thereof is to provide a plating jig that has a rotation driving means for a substrate holder and, together with a support portion, is attachable to and detachable from a plating tank, and a plating device using the same. This plating jig is characterized by being configured from a support portion that is formed to be able to be hung on a plating tank side wall, and a substrate holder that is vertically rotatably provided to the support portion, and being provided with a rotation means for the substrate holder.
In this selective etching method, a layer, which is provided on a base material selected from among glass, silicon, copper, and nickel, and which is composed of a metal selected from among titanium, niobium, tungsten, molybdenum, ruthenium, rhodium, arsenic, aluminum and gallium, the oxides of such metals, the nitrides of such metals, silicon nitride, hafnium nitride, tantalum nitride, or an alloy of such metals, is selectively etched using an alkaline etching solution containing a predetermined complexing agent.
The purpose of the invention is to provide a plating jig: which does not expose the conducting pins or conducting members to the plating solution during plating of substrates such as semiconductor wafers, glass plates or ceramic plates; which can conduct electricity reliably to the substrate; and for which the replacement of the conducting pins, conducting members and seal packing is simple. Said plating jig is a substrate plating jig, which is provided with a first board-shaped holding member, and a second holding member on which a ring-shaped seal packing, which has an internal circumferential part and an external circumferential part and an opening formed at the center of the ring-shaped seal packing, is provided. The substrate plating jig is configured so that by interposing and clamping the substrate-to-be-plated between the first holding member and the second holding member: the leading edges of the internal circumferential part and the external circumferential part of the ring-shaped seal packing come in close contact with the substrate surface-to-be-plated and the first holding member, respectively; the edge of the substrate-to-be-plated is held between the internal circumferential part and the external circumferential part of the ring-shaped seal packing; and the substrate surface-to-be-plated is exposed in the opening. The substrate plating jig is characterized in being provided with a first ring-shaped conducting member having multiple protruding contact points inside the ring-shaped seal packing, and in the substrate surface-to-be-plated coming in contact with the protruding contact points inside the ring-shaped seal packing by the interposing and clamping of the substrate-to-be-plated between the first holding member and the second holding member.
Provided is a copper plating technique that enables the filling of high aspect-ratio via-holes and through-holes in semiconductor substrates such as silicon substrates, organic material substrates or ceramic substrates. The disclosed technique involves a tertiary amine compound, which is obtained by reacting a heterocyclic compound with the epoxy group of a glycidyl ether group of a compound that has three or more glycidyl ether groups, and a quaternary amine compound thereof, as well as a copper plating additive, a copper plating bath, and a copper plating method employing the compounds.
C25D 3/38 - ElectroplatingBaths therefor from solutions of copper
C07D 295/08 - Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly bound oxygen or sulfur atoms
C07D 295/088 - Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly bound oxygen or sulfur atoms with the ring nitrogen atoms and the oxygen or sulfur atoms attached to the same carbon chain, which is not interrupted by carbocyclic rings to an acyclic saturated chain
H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
H01L 21/288 - Deposition of conductive or insulating materials for electrodes from a liquid, e.g. electrolytic deposition
The purpose of the present invention is to provide a process for producing a two-layer FCCL which comprises a polyimide and a metallic conductor layer formed thereon by a highly economical wet process. This method for forming a metallic film is a method for metallizing a polyimide which comprises alkali modification, catalyst impartation, and electroless plating, and is characterized in that the polyimide to be treated is treated with a solution of an acidic fluoride in the stage which is either prior to the alkali modification, or between the alkali modification and the catalyst impartation, or between the catalyst impartation and the electroless plating.
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
92.
METHOD FOR MAINTAINING ETCHING LIQUID AND SYSTEM THEREFOR
The purpose of the present invention is to provide a method for maintaining an etching liquid, which is capable of stabilizing an etching liquid and extending the life of the etching liquid by removing copper ions from the etching liquid, said copper ions greatly affecting the etching performance, thereby reducing cost and waste and eventually protecting environmental resources. The method for maintaining an etching liquid comprises: a step wherein an etching liquid, the performance of which is deteriorated due to copper ions that are accumulated as etching is carried out, is sent from an etching tank to a negative electrode chamber of an electrolytic cell that is separated by a cation-exchange membrane so as to perform electrolysis thereof; and a step wherein the electrolyzed negative electrode liquid in the negative electrode chamber is returned to the etching tank. The method for maintaining an etching liquid is characterized in that an acid solution is contained in a positive electrode chamber of the electrolytic cell and the electrolysis is performed such that the copper ion concentration in the etching liquid is maintained within the range of 0.1-10 g/L.
01 - Chemical and biological materials for industrial, scientific and agricultural use
09 - Scientific and electric apparatus and instruments
Goods & Services
Chemical agents for use in the plating industry; surfactants
for metal, plastic and printed circuit boards plating;
surface active compounds for general use in the industrial
arts, namely, as dispersing auxiliary agents; chemical
agents for metal, plastic and printed circuit boards
plating; chemical additive for metal, plastic and printed
circuit boards plating; chemical auxiliary agents for metal,
plastic and printed circuit boards plating; pre-treatment
chemical agents for metal, plastic and printed circuit
boards plating; etching agents for metal, plastic and
printed circuit boards plating; composite agents for
plating, namely, metal plating chemical compositions;
chemical agents for stripping of the plated layer from
metals. Electroplating machines; electroless plating machines;
control machines for electroplating machines; automatic
analyze and control machines for plating solution; automatic
analyze and control machines for surface treatment solution.
01 - Chemical and biological materials for industrial, scientific and agricultural use
09 - Scientific and electric apparatus and instruments
Goods & Services
Chemical agents for use in the plating industries; chemical
additives for plating solution; auxiliary agents for
plating; pre-treatment agents for plating; pre-treatment
agents for plating plastic with electroless plated layer;
pre-treatment agents for etching metal; chemical etching
agents for plating; composite agents for plating; agents for
stripping of the plated layer; chemical agents used for
plating metal analysis. Electroless plating machines; electroplating machines;
controllers for electroplating machines.
01 - Chemical and biological materials for industrial, scientific and agricultural use
09 - Scientific and electric apparatus and instruments
Goods & Services
Chemical agents for use in the plating industry; [ surfactants for metal, plastic and printed circuit boards plating; surface active compounds for general use in the industrial arts, namely, as dispersing auxiliary agents; ] chemical agents for metal, plastic and printed circuit boards plating; chemical additive for metal, plastic and printed circuit boards plating; [ chemical auxiliary agents for metal, plastic and printed circuit boards plating; pre-treatment chemical agents for metal, plastic and printed circuit boards plating; ] etching agents for metal, plastic and printed circuit boards plating [ ; composite agents for plating, namely, metal plating chemical compositions; chemical agents for stripping of the plated layer from metals ] [ Electroplating machines; electroless plating machines; control machines for electroplating machines; automatic analyze and control machines for plating solution; ] automatic analyze and control machines for surface treatment solution
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Chemicals for use in industry; [ surfactants for metal, plastic and printed circuit boards plating; surface active compounds for general use in the industrial arts, namely, as dispersing auxiliary agents; ] chemical agents for metal, plastic and printed circuit boards plating; chemical additive for metal, plastic and printed circuit boards plating; [ chemical auxiliary agents for metal, plastic and printed circuit boards plating; pre-treatment chemical agents for plating plastic; chemical cleaner for metal surface; ] etching agents for metal, plastic and printed circuit boards plating [; composite agents for plating, namely, metal plating chemical compositions; chemical agents for stripping of the plated layer from metals ]
01 - Chemical and biological materials for industrial, scientific and agricultural use
03 - Cosmetics and toiletries; cleaning, bleaching, polishing and abrasive preparations
09 - Scientific and electric apparatus and instruments
Goods & Services
Chemicals; surfactants; dispersants; dispersing auxiliary agents; chemical agents; additives for plating; auxiliary agents for plating; etching agents; agents for plating including composite agents for plating; agents for stripping of plated layers; surface treatment agents for plastics including pretreatment agents for plastics; detergents for use in manufacturing processes; finishing preparations for use in the manufacture of steel. Cleaners for metal surfaces. Plating machines; electroplating machines; control machines for electroplating machines; soft solder plating machines; analysis and control machines for plating solutions; analysis and control machines for surface treatment solutions; analysis and control machines for surface treatment bath; sputtering apparatus.
