The present invention relates to a ceramic substrate unit comprising: a ceramic substrate including a ceramic basic material and a circuit pattern formed on the ceramic basic material; an electrode pattern portion included in the circuit pattern on the ceramic substrate and connected to an electrode of a semiconductor chip mounted on the ceramic substrate; and a spacer bonded to the electrode pattern portion of the ceramic substrate by means of a bonding layer, wherein the spacer is made of a metal or alloy having electrical conductivity and thermal conductivity. According to the present invention, a power semiconductor chip can be mounted on a substrate in a form similar to flip-chip bonding, and thus the bonding strength of the bonding surface between a spacer and the substrate is increased to improve the reliability thereof.
H05K 1/09 - Use of materials for the metallic pattern
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
H05K 3/07 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
2.
CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREFOR
The present invention relates to a ceramic substrate unit and a manufacturing method therefor. The ceramic substrate unit comprises: a ceramic substrate having metal layers on the upper and lower surfaces of the ceramic substrate; a heat dissipation spacer bonded to the upper metal layer of the ceramic substrate; and a heat sink bonded to the lower metal layer of the ceramic substrate, wherein the heat dissipation spacer is provided with an electrode in a region to which a semiconductor chip is bonded, so that the semiconductor chip may be bonded in the form of a flip chip.
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
3.
MAGNETIC-FIELD SHIELDING SHEET AND MANUFACTURING METHOD THEREFOR
Provided is a magnetic-field shielding sheet. The magnetic-field shielding sheet according to an embodiment of the present invention comprises: a polymer matrix formed by including a polymer resin; and a plurality of plate-shaped metal-based powders stacked and disposed in the polymer matrix, and is implemented to include at least one first region and at least one second region having a lower density than the first region. Accordingly, the effects of demonstrating excellent magnetic characteristics, improving antenna characteristics, effectively shielding a magnetic field, and having excellent durability against an external force, can be simultaneously exhibited.
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
4.
PIEZOELECTRIC ACTUATOR AND MANUFACTURING METHOD THEREOF
A piezoelectric actuator is provided. The piezoelectric actuator according to one embodiment of the present invention comprises: a piezoelectric layer including a polarized first piezoelectric body and a polarized second piezoelectric body having a predetermined separation distance in a horizontal direction from the first piezoelectric body; and an electrode layer including a first electrode disposed on at least one surface of the first piezoelectric body and a second electrode electrically connected to the first electrode and disposed on at least one surface of the second piezoelectric body. Accordingly, the effects of a high resonance frequency, an appropriate interval between a first resonance frequency and a second resonance frequency, and excellent piezoelectric characteristics can be simultaneously exhibited.
A wireless power supply device capable of wirelessly supplying power to a vehicle seat is disclosed. The wireless power supply device for a vehicle seat, of the present invention, comprises: a rail frame on which a vehicle seat is movably provided; a wireless power transmission module disposed outside of the rail frame and connected to a power source of a vehicle so as to wirelessly transmit power; a wireless power reception module, which is disposed to face the wireless power transmission module outside of the rail frame, moves together with the seat, and wirelessly receives power transmitted from the wireless power transmission module; and an accommodation frame, which is provided outside of the rail frame and accommodates the wireless power transmission module and the wireless power reception module.
H02J 50/00 - Circuit arrangements or systems for wireless supply or distribution of electric power
H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
B60R 16/03 - Electric or fluid circuits specially adapted for vehicles and not otherwise provided forArrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric for supply of electrical power to vehicle subsystems
6.
DEVICE AND METHOD FOR PROCESSING VOICES OF SPEAKERS
A voice processing device for generating translation results for voices of speakers is disclosed. The voice processing device comprises: a microphone for generating voice signals associated with voices of speakers in response to the voices of the speakers; a memory for storing location-language information indicating languages corresponding to sound source locations of the voices of the speakers; and a processor which uses the voice signals and the location-language information so as to generate translation results obtained by translating the languages of the voices of each speaker, and which uses the translation results so as to generate translation conference minutes including the voice contents of each speaker expressed in different languages.
G06F 40/58 - Use of machine translation, e.g. for multi-lingual retrieval, for server-side translation for client devices or for real-time translation
G10L 17/02 - Preprocessing operations, e.g. segment selectionPattern representation or modelling, e.g. based on linear discriminant analysis [LDA] or principal componentsFeature selection or extraction
G10L 21/028 - Voice signal separating using properties of sound source
The present disclosure provides information content to a pedestrian while guiding the pedestrian to safely use a crosswalk by outputting the information content while displaying a signal state of the crosswalk. To this end, the floor type walking signal system of the present disclosure is configured to provide information to a pedestrian using a crosswalk by outputting information content according to a signal state of the crosswalk.
E01F 9/547 - Kerbs or road edgings specially adapted for alerting road users illuminated
F21S 8/00 - Lighting devices intended for fixed installation
G09F 9/33 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
G09F 19/22 - Advertising or display means on roads, walls or similar surfaces, e.g. illuminated
G09F 27/00 - Combined visual and audible advertising or displaying, e.g. for public address
The present invention pertains to a ceramic substrate for a power module, a method for manufacturing same, and a power module having same. By forming a protruding electrode integrated with an electrode pattern, the ceramic substrate can improve electrical conductivity when bonded to an electrode of a semiconductor device, can stably convert rated voltage and current while eliminating electrical hazards that can occur during wire bonding, and can improve reliability and efficiency when used in high power applications.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
According to the present disclosure, a text and/or a sound is output when a pedestrian leaves the safe zone of a crosswalk, thereby guiding the pedestrian to safely use the crosswalk. To this end, the ground-type pedestrian signal device of the present disclosure is configured to output a text and/or a sound upon detecting a pedestrian leaving the safety zone of a crosswalk while the red light among traffic lights is turned on, thereby warning the pedestrian that he/she has left the safety zone.
G08B 3/10 - Audible signalling systemsAudible personal calling systems using electric transmissionAudible signalling systemsAudible personal calling systems using electromagnetic transmission
G08B 5/22 - Visible signalling systems, e.g. personal calling systems, remote indication of seats occupied using electric transmissionVisible signalling systems, e.g. personal calling systems, remote indication of seats occupied using electromagnetic transmission
Disclosed is a wireless power supply device capable of wirelessly supplying power to a vehicle seat. The wireless power supply device for a vehicle seat according to the present invention comprises: a rail frame installed below a seat; a wireless power transmission module arranged outside the rail frame and connected to a power source of a vehicle to wirelessly transmit power; and a wireless power reception module arranged outside the rail frame to face the wireless power transmission module, moving together with the seat, and wirelessly receiving power transmitted from the wireless power transmission module.
H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
H02S 50/10 - Testing of PV devices, e.g. of PV modules or single PV cells
H01F 27/36 - Electric or magnetic shields or screens
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
The present invention relates to a ceramic substrate for a power module, a method for manufacturing same, and a power module having same, the power module electrically connecting, by means of a conductive spacer, an electrode of a semiconductor device and a metal layer pattern of a ceramic substrate without a wire, thereby converting rated voltage and current while removing electrical risk factors, which may be generated during wire bonding, and increasing reliability and efficiency when used with high power.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
12.
HEAT-DISSIPATING MAGNETIC FIELD SHIELDING SHEET AND ANTENNA MODULE AND ELECTRONIC DEVICE INCLUDING SAME
A magnetic field shielding sheet including: a plurality of magnetic layers having at least one eddy current reduction pattern part formed thereon; and a heat-dissipating magnetic field shielding unit including heat-dissipating adhesive members arranged between adjacent magnetic layers to improve the heat transfer in the thickness direction of the magnetic field shielding unit. By the magnetic field shielding sheet, the occurrence of eddy currents can be reduced, a high magnetic permeability of 2000 or more can be implemented while having a very thin thickness, and eddy currents that increase by selectively forming an eddy current reduction pattern locally in a region corresponding to the antenna among the entire area and the heat generated by the increase in eddy currents due to the thinner thickness according to the recent trend of being light, thin, short and miniaturized and the resulting decrease in resistance can be quickly discharged to the outside.
H01Q 1/52 - Means for reducing coupling between antennas Means for reducing coupling between an antenna and another structure
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 15/01 - Layered products essentially comprising metal all layers being exclusively metallic
H01Q 1/02 - Arrangements for de-icingArrangements for drying-out
13.
GROUND-TYPE PEDESTRIAN SIGNAL DEVICE HAVING IMPROVED WATERPROOF AND DUSTPROOF FUNCTIONS DUE TO INCREASED LOAD RESISTANCE AND DURABILITY RESULTING FROM DISTRIBUTION AND ABSORPTION OF LOADS
Disclosed is a ground-type pedestrian signal device capable of increasing load resistance and improving service life. The present invention provides a ground-type pedestrian signal device which is buried and installed in the ground between a road and a sidewalk, the device including: a body part having a base surface; an LED module which is installed on the base surface of the body part and on which multiple LED elements for generating signal light are arranged; a reflector disposed on the upper portion of the LED module and including multiple reflection surfaces corresponding to the multiple LED elements; and a cover part coupled to the body part and surrounding the LED module and the reflector, wherein the body part includes an elastic member for allowing the reflector to be elastically pressed toward the cover part side.
F21S 2/00 - Systems of lighting devices, not provided for in main groups or , e.g. of modular construction
F21V 17/16 - Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts of the lighting deviceSnap action mounting
F21V 31/00 - Gas-tight or water-tight arrangements
The present invention suggests a radar antenna in which a rounded edge surface is formed in a receiving hole formed by an antenna body and a shielding frame. The suggested radar antenna comprises: an antenna body having a plurality of first slots formed on a first surface thereof; and a shielding frame through which reception holes for receiving the plurality of first slots are formed, the reception holes being arranged on the first surface of the antenna body to receive the plurality of first slots, wherein a corner at which the inner wall surface of the shielding frame is connected to the first surface of the antenna body is formed to have a round structure.
233. Therefore, the present invention can be sintered at the same time as an inner electrode while being thin, has excellent piezoelectric property so as to have excellent performance when applied to a speaker, and has high permittivity.
H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
C04B 35/491 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on zirconium or hafnium oxides or zirconates or hafnates containing also titanium oxide or titanates based on lead zirconates and lead titanates
A ceramic speaker is provided. The ceramic speaker according to one embodiment of the present invention is implemented such that height deviation thereof in the thickness direction measured using a predetermined measurement method is 20 μm or less. Therefore, the present invention can exhibit an excellent sound pressure property by frequency while being lightweight and thin, can be sintered simultaneously with an inner electrode during manufacturing, has excellent flatness by having no curve or thickness imbalance, has an excellent piezoelectric property so as to have excellent performance when applied to a speaker, and has high permittivity.
H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
C04B 35/491 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on zirconium or hafnium oxides or zirconates or hafnates containing also titanium oxide or titanates based on lead zirconates and lead titanates
The present invention relates to a heatsink-integrated ceramic substrate and a method for manufacturing same, the heatsink-integrated ceramic substrate comprising: a ceramic substrate including metal layers on the upper and lower surfaces of a ceramic base; and a heatsink bonded to one surface of a metal layer, wherein the heatsink may include a flat portion having one surface in contact with the metal layer, and a plurality of heat dissipation fins formed to protrude from the other surface of the flat portion to be spaced apart from each other and contacting a liquid-type refrigerant.
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
233. According to the present invention, the composition can be formed into a thin film, can be co-sintered with internal electrodes, and has excellent piezoelectric properties, and thus has the effects of exhibiting excellent performance and a high dielectric constant when applied to speakers.
H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
C04B 35/491 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on zirconium or hafnium oxides or zirconates or hafnates containing also titanium oxide or titanates based on lead zirconates and lead titanates
Disclosed are a voice processing device, an operation method thereof, and a vehicle control system comprising same voice processing device. The disclosed voice processing device, which is a voice processing device installed in a vehicle, comprises: a microphone that is configured to respond to the voice of a passenger in the vehicle and generate a voice signal associated with the voice of the passenger; a speaker; and a processor that outputs, as a voice, a conversation attempt message to the passenger through the speaker when a collision occurrence signal is received from a vehicle controller configured to control the operation of the vehicle, processes response voice signals of the passenger with respect to the conversation attempt message, received from the microphone and generates sound source location information indicating a sound source location of the response voice signals, groups the response voice signals according to the sound source location information, and outputs the grouped response voice signal.
G10L 25/51 - Speech or voice analysis techniques not restricted to a single one of groups specially adapted for particular use for comparison or discrimination
G10L 15/30 - Distributed recognition, e.g. in client-server systems, for mobile phones or network applications
B60W 40/08 - Estimation or calculation of driving parameters for road vehicle drive control systems not related to the control of a particular sub-unit related to drivers or passengers
20.
SPEECH PROCESSING APPARATUS AND OPERATING METHOD THEREOF, AND VEHICLE CONTROL SYSTEM INCLUDING SPEECH PROCESSING APPARATUS
Disclosed are a speech processing apparatus, an operating method thereof, and a vehicle control system, the speech processing apparatus being capable of, if an emergency situation such as a vehicle collision occurs, generating and outputting information corresponding thereto. The disclosed speech processing apparatus is installed in a vehicle and comprises: a microphone configured to generate a speech signal associated to a speech of a passenger in the vehicle, in response to the speech of the passenger; and a processor configured to generate seated position information of the passenger, based on a speech position of the speech corresponding to the speech signal, by processing the speech signal from the microphone and, if a collision occurrence signal is received from a vehicle controller, output the seated position information in response to the collision occurrence signal.
B60R 21/015 - Electrical circuits for triggering safety arrangements in case of vehicle accidents or impending vehicle accidents including means for detecting the presence or position of passengers, passenger seats or child seats, e.g. for disabling triggering
B60R 11/02 - Arrangements for holding or mounting articles, not otherwise provided for for radio sets, television sets, telephones, or the likeArrangement of controls thereof
G08B 25/00 - Alarm systems in which the location of the alarm condition is signalled to a central station, e.g. fire or police telegraphic systems
B60R 21/00 - Arrangements or fittings on vehicles for protecting or preventing injuries to occupants or pedestrians in case of accidents or other traffic risks
21.
CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREOF
The present invention relates to a ceramic substrate and a manufacturing method thereof, the ceramic substrate comprising: a ceramic base material; a first metal sheet attached to an upper portion of the ceramic base material and provided in the form of a circuit pattern; and a second metal sheet attached to a lower portion of the ceramic base material. The second metal sheet may include a flat portion in contact with the lower surface of the ceramic base material and a plurality of heat dissipation fins that are spaced apart from each other and protrude from a lower portion of the flat portion, wherein the heat dissipation fins are in contact with a liquid refrigerant.
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
Provided is a magnetic field shielding sheet. The magnetic field shielding sheet, according to an embodiment of the present invention, comprises: a sheet body which is provided as a magnetic sheet containing a metallic component so as to shield the magnetic field generated in an antenna and has a flat shape comprising a first surface and second surface which are opposite to each other; a first protective sheet attached to the first surface of the sheet body through an adhesive layer to prevent the first surface from being exposed to the outside; and a second protective sheet attached to the second surface of the sheet body through an adhesive layer to prevent the second surface from being exposed to the outside, wherein each of the first protective sheet and second protective sheet may be made of a material that is non-conductive but can shield a magnetic field, so as to protect the sheet body from the external environment and reduce losses due to eddy currents while complementing the shielding capacity of the sheet body.
H01F 1/153 - Amorphous metallic alloys, e.g. glassy metals
H01F 1/16 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of sheets
H01F 1/20 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
H01F 27/34 - Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
The present disclosure relates to a power module comprising: a base plate; a ceramic substrate bonded to the top surface of the base plate; a semiconductor chip bonded to the top surface of the ceramic substrate; a spacer bonded to the top surface of the ceramic substrate so as to be spaced apart from the semiconductor chip; a connection pin provided at an electrode layer formed on the top surface of the spacer; and a bonding wire for connecting a terminal of the semiconductor chip to the electrode layer of the spacer.
H01L 23/49 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions wire-like
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
24.
METHOD OF MANUFACTURING POWER SEMICONDUCTOR MODULE, AND POWER SEMICONDUCTOR MODULE MANUFACTURED THEREBY
The present invention relates to a method of manufacturing a power semiconductor module and a power semiconductor module manufactured thereby, the method comprising the steps of: removing thermal stress by annealing a base plate; disposing a brazing filler layer on the upper surface of the base plate; and laminating and brazing a ceramic substrate onto the base plate having the brazing filler layer disposed thereon.
Disclosed is an electrostatic chuck sheet included in an electrostatic chuck for chucking a substrate by using electrostatic force. The electrostatic chuck sheet comprises: a first dielectric layer comprising a polymer material; a first electrode layer, which is arranged on the first dielectric layer and comprises first electrodes made of a conductive metal material; a second electrode layer, which is arranged on the first electrode layer and comprises second electrodes made of a conductive metal material; an interlayer dielectric layer, which is arranged between the first electrode layer and the second electrode layer and comprises a polymer material; and a protective layer, which is arranged on the second electrode layer and comprises a polymer material, wherein the first electrodes and the second electrodes are arranged so as not to overlap each other in the direction perpendicular to the electrostatic chuck sheet.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
Disclosed is a smart tracker for communicating with a parent terminal by Bluetooth communication and communicating with the parent terminal by ultra-wideband communication during positioning. The disclosed smart tracker comprises: a first housing; a second housing coupled to the first housing to form an inner space; a circuit board arranged in the inner space formed by the first housing and the second housing; a buzzer mounted on the lower surface of the circuit board; a battery mounted on a surface of the circuit board; a first antenna arranged on the upper surface of the circuit board and spaced from the areas on which the buzzer and the battery are mounted; and a second antenna arranged on the upper surface of the circuit board and spaced from the areas on which the buzzer and the battery are mounted and from the first antenna.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G08B 3/10 - Audible signalling systemsAudible personal calling systems using electric transmissionAudible signalling systemsAudible personal calling systems using electromagnetic transmission
H05K 7/14 - Mounting supporting structure in casing or on frame or rack
27.
COMPOSITION FOR MANUFACTURING SILICON NITRIDE SUBSTRATE AND SILICON NITRIDE SUBSTRATE MANUFACTURED THEREBY
Provided is a composition for manufacturing a silicon nitride substrate. According to an embodiment of the present invention, the composition for manufacturing a silicon nitride substrate comprises a mixed powder including a silicon nitride-based powder and a nitride-based sintering aid, wherein the mixed powder has an average particle diameter of 0.65-1.1 µm. According to the present invention, the sintered body is compact and has excellent thermal conductivity, and uniform physical properties can be exhibited whilst also having excellent mechanical strength such as bending strength or abrasion resistance.
Provided is a composition for manufacturing a silicon nitride substrate. According to an embodiment of the present invention, the composition for manufacturing a silicon nitride substrate comprises a mixed powder including a silicon-based powder and a nitride-based sintering aid, wherein the mixed powder has a particle distribution coefficient of variation (CV value) of 65-86%. According to the present invention, the sintered body is compact and has excellent thermal conductivity, and uniform physical properties can be exhibited whilst also having excellent mechanical strength such as bending strength or abrasion resistance.
An electrostatic chuck is provided. Implemented according to an embodiment of the present invention is an electrostatic chuck comprising: a silicon nitride sintered body; a silicon carbide (SiC) surface modification layer covering at least a portion of the external surface of the silicon nitride sintered body and having corrosion resistance and plasma resistance; and an electrostatic electrode laid inside the silicon nitride sintered body. Therefore, the electrostatic chuck includes a ceramic sintered body of silicon nitride, and thus has excellent plasma resistance, chemical resistance, and thermal shock resistance while exhibiting an equivalent or similar level of heat dissipation performance compared to ceramic sintered bodies of aluminum nitride that have been conventionally widely used, so that the electrostatic chuck can be widely used in semiconductor processes.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
30.
MAGNETIC COMPOSITE CORE FOR ELECTRIC VEHICLE, AND WIRELESS POWER TRANSMISSION MODULE FOR ELECTRIC VEHICLE COMPRISING SAME
A magnetic composite core for an electric vehicle is provided. The magnetic composite core for an electric vehicle, according to one embodiment of the present invention, is applied to a wireless power transmission module for an electric vehicle and comprises: a main body formed of a material containing magnetic powder so as to shield a magnetic field generated from a planar coil on which a conductive member is wound a plurality of times; and a coil accommodation groove recessed a certain depth from one surface of the main body to accommodate the thickness of the planar coil, wherein the main body may be formed by injection-molding a mixture in which unoxidized plate-shaped magnetic powder and polymer resin are mixed at a predetermined ratio.
H01F 27/36 - Electric or magnetic shields or screens
H01F 1/20 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
B60L 53/34 - Plug-like or socket-like devices specially adapted for contactless inductive charging of electric vehicles
31.
VOICE PROCESSING APPARATUS FOR PROCESSING VOICES, VOICE PROCESSING SYSTEM, AND VOICE PROCESSING METHOD
Disclosed is a voice processing apparatus for processing voices of a plurality of speakers. The voice processing apparatus comprises: a microphone configured to generate voice signals in response to the voices of the plurality of speakers; a communication circuit configured to transmit and receive data; memory; and a processor, wherein the processor, on the basis of instructions stored in the memory, performs sound source separation of the voice signals on the basis of sound source positions of each of the voices, generates separate voice signals associated with each of the voices according to the sound source separation, determines output modes corresponding to the sound source positions of each of the voices, and uses the communication circuit to output the separate voice signals according to the determined output modes.
G10L 21/028 - Voice signal separating using properties of sound source
G10L 17/02 - Preprocessing operations, e.g. segment selectionPattern representation or modelling, e.g. based on linear discriminant analysis [LDA] or principal componentsFeature selection or extraction
G10L 17/06 - Decision making techniquesPattern matching strategies
The present disclosure relates to an inverter power module, and includes a ceramic substrate (110), an LTCC substrate (120) disposed to be spaced apart from an upper portion of the ceramic substrate (110), and a semiconductor chip (130) having a lower surface bonded to a metal pattern (112) on an upper surface of the ceramic substrate (110) and an upper surface bonded to an external electrode (123) of the LTCC substrate (120). The present disclosure has the advantage of being able to provide an inverter power module with more improved functions and operational reliability by using a ceramic substrate and an LTCC substrate.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H02M 7/00 - Conversion of AC power input into DC power outputConversion of DC power input into AC power output
33.
WIRELESS POWER TRANSMISSION MODULE FOR ELECTRIC VEHICLE
A wireless power transmission module for an electric vehicle is provided. A wireless power transmission module for an electric vehicle according to an embodiment of the present invention may include: an antenna unit including a flat plate-type coil for wireless power transmission and a cover member surrounding the flat plate-type coil to enable dissipation of heat generated from the flat plate-type coil while preventing the flat plate-type coil from being exposed to the outside; a shielding unit disposed on one surface of the cover member and including multiple ferrite blocks which are arranged adjacent to each other and have a predetermined area and thickness to shield a magnetic field; and a metal plate disposed on one surface of the shielding unit to shield electromagnetic waves, wherein the flat plate-type coil and the cover member of the antenna unit are formed integrally through insert molding so that the flat plate-type coil is embedded in the cover member.
B60L 53/38 - Means for automatic or assisted adjustment of the relative position of charging devices and vehicles specially adapted for charging by inductive energy transfer
H02J 50/00 - Circuit arrangements or systems for wireless supply or distribution of electric power
H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
H01Q 7/06 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
H01Q 1/22 - SupportsMounting means by structural association with other equipment or articles
H01F 17/04 - Fixed inductances of the signal type with magnetic core
Disclosed is an above-ground switchgear that increases the output efficiency of a power induction device by suppressing the dispersion of induced power. The disclosed above-ground switchgear comprises: a connection member configured to connect, to the above-ground switchgear, an underground power line emerging above the ground from the underground; an energy harvester installed on the underground power line connected to the connection member; and a neutral wire current suppression member installed on a neutral wire connected to the ground from the underground power line.
Disclosed is an antenna performance test system for testing the performance of UWB and BLE antennas by reflecting a loss of a cable without changing test conditions. The disclosed antenna performance test system comprises a tester, which: responds to a first test mode setting signal so as to output, to a first antenna, a first test signal (a UWB band signal), and then generate a UWB communication performance measurement value based on a first response signal received from the first antenna and a second antenna with respect to the first test signal; and responds to a second test mode setting signal so as to output, to the first antenna, a second test signal(a BLE band signal), and then generate a BLE communication performance measurement value based on a second response signal received from the first antenna with respect to the second test signal.
The present invention provides a floor-type walking signal device for installation in which the device is buried in the ground between a road and a sidewalk, comprising a reflector having a plurality of reflective surfaces respectively corresponding to a plurality of LED elements. The present invention can prevent the luminance from being lowered by using the reflector, even if the distance between light-emitting surfaces and the LED elements is relatively long, and can improve the luminance uniformity on the light exit surfaces.
In a system for testing antenna performance, antenna performance is tested by reflecting the loss of a cable used in the antenna performance test. The system for testing antenna performance includes a tester having a test port, the test port being connected, via a cable, to an antenna that communicates with a terminal to be tested, in a shield box, when a test mode is set, wherein the tester outputs a test signal to the test port, receives a response signal corresponding to the test signal via the test port, and obtains a value, as a communication performance measurement value, by adding a calibration value to a reception signal strength of the response signal.
An electrostatic chuck is provided. Implemented according to an embodiment of the present invention is an electrostatic chuck comprising: a silicon nitride sintered body; a surface modification layer covering at least a portion of the external surface of the silicon nitride sintered body and having corrosion resistance and plasma resistance; and an electrostatic electrode laid inside the silicon nitride sintered body. Therefore, the electrostatic chuck includes a ceramic sintered body of silicon nitride, and thus has excellent plasma resistance, chemical resistance, and thermal shock resistance while exhibiting an equivalent or similar level of heat dissipation performance compared to ceramic sintered bodies of aluminum nitride that have been conventionally widely used, so that the electrostatic chuck can be widely used in semiconductor processes.
C04B 41/50 - Coating or impregnating with inorganic materials
C04B 35/584 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxides based on borides, nitrides or silicides based on silicon nitride
C04B 35/626 - Preparing or treating the powders individually or as batches
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H05B 3/26 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
According to an embodiment of the present invention: in order to track an accurate location of an asset, an asset location, which is a location of an asset terminal installed in the asset to be tracked, is measured; a relative location of the asset terminal, which is based on a reference terminal, is measured through communication between the reference terminal and the asset terminal; and the asset location is corrected using the relative location. Based on this, the present invention minimizes a measurement error of an asset location, compared to a scheme of measuring an asset location by using only GPS communication.
A shielding member is provided. The shielding member according to an embodiment of the present invention may comprise: a base part through which an arrangement hole having a predetermined area is formed at the center thereof; a ring-shaped first blocking part which is formed along the rim of the arrangement hole to protrude a certain height from the base part; and an antenna accommodation part which is defined by one surface of the first blocking part and one surface of the base part and is formed at one surface of the base part along the circumferential direction of the first blocking part, wherein each of the base part and the first blocking part is made of a polymer material comprising a polymer resin and platelike magnetic bodies mixed in the polymer resin to have an orientation along one direction, and the base part and the first blocking part are formed integrally with each other.
H01F 27/36 - Electric or magnetic shields or screens
H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
H02J 50/90 - Circuit arrangements or systems for wireless supply or distribution of electric power involving detection or optimisation of position, e.g. alignment
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
41.
METHOD FOR MANUFACTURING MAGNETIC FIELD SHIELDING SHEET FOR WIRELESS POWER TRANSMISSION, AND MAGNETIC FIELD SHIELDING SHEET FOR WIRELESS POWER TRANSMISSION, MANUFACTURED USING SAME
A method for manufacturing a magnetic field shielding sheet for wireless power transmission is provided. The magnetic field shielding sheet according to one embodiment of the present invention can be implemented through the steps of: (1) interposing, between planar amorphous or nanocrystal grain soft magnetic layers, a hot-melt adhesive member having a thermoplastic resin as a base material, so as to manufacture a sheet body in which multiple sheets of soft magnetic layers are stacked; (2) applying heat and pressure or ultrasonic waves to the sheet body so as to melt the hot-melt adhesive member, and then solidifying same; and (3) performing flake processing so that each of the soft magnetic layers in the sheet body breaks into multiple pieces while forming layers. Therefore, the flake processing, during which various sheets of soft magnetic alloys are stacked to have a magnetic property required for improving transmission/reception performance of a wireless power signal, can be performed such that the flaked pieces have a desired size and distribution, and positional movement into the thickness direction of the soft magnetic alloy pieces after the flake processing compared to before the flake processing, or changing of the main surface direction of the pieces can be minimized.
H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
D04H 1/587 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties by applying, incorporating or activating chemical or thermoplastic bonding agents, e.g. adhesives characterised by the bonding agents used
C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
C09J 167/00 - Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chainAdhesives based on derivatives of such polymers
C09J 177/00 - Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chainAdhesives based on derivatives of such polymers
C09J 123/00 - Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondAdhesives based on derivatives of such polymers
42.
MAGNETIC FIELD SHIELDING SHEET AND WIRELESS POWER TRANSMISSION MODULE INCLUDING SAME
A magnetic field shielding sheet is provided. The magnetic field shielding sheet according to an embodiment of the present invention is attached to a wireless power transfer antenna and a wireless communication antenna, and comprises: a shielding part made of a magnetic material so as to shield a magnetic field; and at least one eddy current-reducing pattern part which is formed in the shielding part to increase the resistance of the shielding part and thereby reduce the generation of eddy currents. The eddy current-reducing pattern part includes: a first eddy current-reducing pattern part formed to intersect with both the wireless power transfer antenna and the wireless communication antenna; and a second eddy current-reducing pattern part formed to intersect with the wireless communication antenna.
H01Q 1/52 - Means for reducing coupling between antennas Means for reducing coupling between an antenna and another structure
H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
43.
UNDERGROUND LINE CONDITION MEASUREMENT DEVICE, AND MONITORING SYSTEM USING SAME
An underground line condition measurement device and a monitoring system using same are disclosed. The disclosed device comprises: a sensor for measuring a characteristic value of an underground line inside an underground power cable tunnel connected to an external device outside of the underground power cable tunnel; and a control box for collecting measurement data from the sensor and transmitting the collected measurement data through the underground line to the external device.
G01R 31/08 - Locating faults in cables, transmission lines, or networks
G08C 17/02 - Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
G08C 19/02 - Electric signal transmission systems in which the signal transmitted is magnitude of current or voltage
H02M 1/10 - Arrangements incorporating converting means for enabling loads to be operated at will from different kinds of power supplies, e.g. from AC or DC
H04W 4/80 - Services using short range communication, e.g. near-field communication [NFC], radio-frequency identification [RFID] or low energy communication
The present invention relates to a power module and a manufacturing method therefor, the power module using a conductive spacer to electrically connect an electrode of a semiconductor chip and an electrode pattern of a ceramic substrate without a wire, thereby converting rated voltage and current while removing electrical risk elements, which can be generated during wire bonding, and increasing reliability and efficiency when used with high power.
The present invention relates to a method of manufacturing a power module. The method involves joining a base plate and a ceramic substrate by brazing while pressing same with an upper jig and a lower jig, and thus can suppress bending, improve joint reliability, and increase heat dissipation.
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/367 - Cooling facilitated by shape of device
H01L 23/373 - Cooling facilitated by selection of materials for the device
Proposed is a radar antenna to which detachable modules including one or more antennas are coupled. The proposed radar antenna comprises: a first detachable module in which one or more antennas are formed; and a second detachable module in which one or more antennas are formed, wherein a first side surface of the second detachable module is bonded to a first side surface of the first detachable module.
Provided are a magnetic field shielding sheet and a manufacturing method therefor. The magnetic field shielding sheet includes: a sheet main body formed from a magnetic material to be capable of shielding a magnetic field; a first protection layer disposed to cover one surface of the sheet main body; a second protection layer disposed to cover the other surface, opposite from the one surface, of the sheet main body; a third protection layer interposed between the first protection layer and the second protection layer to cover the side surface of the sheet main body in the thickness direction of the sheet main body; and a sealing part formed on the side portion of the sheet main body so that the sheet main body is sealed, wherein a stepped portion formed between the sheet main body and the sealing part is reduced by means of the third protection layer.
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
H01F 41/14 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
An electrostatic chuck is provided. An electrostatic chuck is implemented by comprising a silicon nitride sintered body and an electrostatic electrode embedded in the silicon nitride sintered body. Therefore, the electrostatic chuck includes a ceramic sintered body, which is silicon nitride, to have excellent plasma resistance, chemical resistance and thermal shock resistance while exhibiting heat dissipation performance of a level equivalent or similar to that of an aluminum nitride ceramic sintered body, which has been conventionally and widely used, and thus can be widely used in a semiconductor process.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
C04B 35/591 - Fine ceramics obtained by reaction sintering
C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
H05B 3/28 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
The present invention relates to a power module and a method for producing same, in which the bottom electrode layer of a ceramic substrate is inserted into recesses of a base plate, and with the ceramic substrate stacked on the base plate, adhesion via brazing is carried out, thus improving adhesion reliability, preventing flexure, and provides highly efficient heat dissipation.
A piezoelectric ceramic mass production method is provided. The piezoelectric ceramic mass production method according to one embodiment of the present invention comprises the steps of: (1) preparing at least one type from among a single-layer piezoelectric ceramic green sheet and a multi-layer piezoelectric ceramic green sheet, which are firing objects; (2) arranging a separation sheet, which contains an acryl-based binder resin, between adjacent firing objects so as to manufacture a firing stack in which a plurality of firing objects are stacked; and (3) firing the firing stack, and then separating same into a plurality of fired bodies. Therefore, a large quantity of firing objects can be readily and rapidly arranged within a firing furnace and, simultaneously, remaining impurities, that exclude components contained in the firing objects, are nearly absent in the fired body, and thus the present invention is very advantageous for mass firing.
Proposed is an antenna module in which a partial area, which overlaps with a magnet mounted on an antenna sheet, of the entire area of a shielding sheet is punched out to prevent the shielding sheet from being magnetically saturated (magnetized) by the magnet. The proposed antenna module comprises: the antenna sheet having a radiation pattern formed thereon and having a magnet array formed along the outer circumference of the radiation pattern inserted thereto; and the shielding sheet laminated on the antenna sheet, and having an anti-overlapping hole formed in the area overlapping with the magnet array.
H01Q 1/24 - SupportsMounting means by structural association with other equipment or articles with receiving set
H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
H02J 50/90 - Circuit arrangements or systems for wireless supply or distribution of electric power involving detection or optimisation of position, e.g. alignment
52.
ANTENNA MODULE, WIRELESS POWER TRANSMISSION SYSTEM, AND CASE FOR PORTABLE TERMINAL
The present invention has a circular or arc-shaped magnet array disposed around a receiving coil and transmitting coil for wireless power transmission, thereby increasing the alignment accuracy of the receiving coil and transmitting coil, and preventing the deterioration of properties such as inductance, charging efficiency, etc.
Provided is a wireless ear module having a UWB antenna to easily obtain location information of a wireless ear module case and ear modules. The wireless ear module comprises: ear modules for receiving and playing a sound source signal from an electronic device; and a case comprising an upper housing and a lower housing which are rotatably coupled, and for storing the ear modules. The ear modules and/or the case transmit a location positioning signal, and the location positioning signal is a signal for sensing the distance and direction from the electronic device to the ear modules or the case.
The present invention provides a plurality of floor-type pedestrian signals, in which a control signal and voltage control power are applied, the voltage control power is converted into constant current power in each floor-type pedestrian signal, and the constant current power is applied to an LED array according to the control signal. Through this, the present invention prevents the brightness of the floor-type pedestrian signal from lowering as the distance from a controller increases, and maintains a constant lighting time of the plurality of floor-type pedestrian signals, so that even if the width of a crosswalk increases, the visibility of the floor-type pedestrian signal is kept constant.
Proposed is a hybrid communication device which enables multiple indoor and outdoor communications in association with an access point (AP) without a separate network construction. The proposed device is a hybrid communication device connected to an access point, the hybrid communication device comprising: a first communication module which receives a first signal from an external device by using a first communication scheme and transmits the received first signal to the access point by using the first communication scheme; a second communication module which receives a second signal from the external device by using a second communication scheme and transmits the received second signal to the access point by using the second communication scheme; and a third communication module which receives a third signal from the external device by using a third communication scheme and transmits the received third signal to the access point by using the third communication scheme, wherein the hybrid communication device is in the form of a USB-type dongle.
The present invention relates to a wireless power supply device for a vehicle seat, capable of wirelessly supplying power to a vehicle seat that is moved along a moving line. The wireless power supply device for a vehicle seat, according to the present invention, comprises: a pair of rail frames having a first opening formed so that a seat connection portion connected to a vehicle seat can move linearly; a motor coupled to the seat connection portion and installed to allow linear movement within the rail frames; a wireless power transmission board fixed to the inside of the rail frames and comprising a plurality of transmission coils connected to a power supply inside a vehicle to wirelessly transmit power; a wireless power reception board which is disposed at a position opposite to the wireless power transmission board, comprises a plurality of reception coils for receiving power wirelessly transmitted from the transmission coils, and linearly moves in conjunction with the motor, wherein the wireless power transmission board and the wireless power reception board are installed perpendicularly to the bottom surface of the rail frames, at positions horizontally spaced apart from the motor.
B60N 2/02 - Seats specially adapted for vehiclesArrangement or mounting of seats in vehicles the seat or part thereof being movable, e.g. adjustable
B60R 16/03 - Electric or fluid circuits specially adapted for vehicles and not otherwise provided forArrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric for supply of electrical power to vehicle subsystems
57.
METHOD FOR MANUFACTURING ANTENNA MODULE CERAMIC SUBSTRATE
A method for manufacturing an antenna module ceramic substrate is provided. Provided is a method for manufacturing an antenna module ceramic substrate, according to one embodiment of the present invention, the method comprising the steps of: stacking a first base material layer and a second base material layer so that each of a radiation pattern formed between the first and second base material layers and a connection pattern formed inside the second base material layer to be electrically connected with the radiation pattern are provided; compressing the first and second base material layers; and calcinating the compressed first and second base material layers.
A wireless power reception module including an antenna unit which includes a circuit board including a first surface and a second surfaces which are opposite to each other, a wireless power reception antenna formed as an antenna pattern on the first surface of the circuit board, a terminal pattern extending to a predetermined length from the wireless power reception antenna on the first surface, and a first coverlay attached to the first surface and a shielding unit which includes a magnetic sheet formed of a magnetic material to shield a magnetic field and having a side surface exposed to the outside and disposed on one surface of the antenna unit to be positioned at a position corresponding to the wireless power reception antenna, the first coverlay attached to the first surface, covering both the wireless power reception antenna and part of the total length of the terminal pattern.
H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
H02J 50/00 - Circuit arrangements or systems for wireless supply or distribution of electric power
An antenna module comprises a plurality of directors provided to be spaced apart from each other on the top surface of a first base layer; a second base layer disposed under the first base layer; a plurality of radiation patterns spaced apart from each other at positions corresponding to the respective directors on the top surface of the second base layer and functioning as antennas; an RF chipset disposed on bottom surface of the second base layer to transmit and receive RF signals; a connection pattern comprising a power feeding via electrode penetrating the second base layer and connecting the RF chipset and the radiation pattern; and a grounding via electrode that penetrates a part of the second base layer, is spaced apart from a side surface of the power feeding via electrode, and surrounds at least a portion of the side surface of the power feeding via electrode.
An antenna module is provided. An antenna module includes a radiation pattern that functions as an antenna; a base layer disposed on one side of the radiation pattern and implemented by stacking a plurality of low-temperature co-fired ceramic (LTCC) substrates to have a connection pattern electrically connected to the radiation pattern; an RF chipset electrically connected to the radiation pattern through the connection pattern to generate an RF signal to be transmitted from the radiation pattern or to process an RF signal received from the antenna; a thermal interface material (TIM) disposed at one side of the RF chipset to transfer heat generated from the RF chipset; a heat sink disposed at one side of the TIM to spread heat transferred from the TIM; and a fan disposed at one side of the heat sink to cool the heat sink by introducing outside air.
A magnetic shielding sheet for a wireless power reception module is provided. A magnetic shielding sheet for a wireless power reception module according to an exemplary embodiment of the present invention, which is applied to a wireless power reception module capable of a wireless power share (WPS) function and has an overall thickness of 150 μm or less. The magnetic shielding sheet includes a first sheet made of a magnetic material to shield a magnetic field, and a second sheet laminated as a monolayer on one surface of the first sheet by means of a bonding adhesive layer, wherein the second sheet is provided to have a smaller thickness than a thickness of the first sheet while having a saturation magnetic flux density twice or more than a saturation magnetic flux density of the first sheet.
H01Q 1/52 - Means for reducing coupling between antennas Means for reducing coupling between an antenna and another structure
H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
62.
INJECTION-MOLDING-TYPE MAGNETIC FIELD SHIELDING MEMBER AND WIRELESS POWER RECEPTION MODULE COMPRISING SAME
An injection-molding-type magnetic field shielding member is provided. The injection-molding-type magnetic field shielding member according to one embodiment of the present invention comprises: a base part including an arrangement hole that penetrates the center so as to have a predetermined area; a ring-shaped first shielding part, which protrudes a predetermined height from the base part along the edge of the arrangement hole; and an antenna accommodation part which is defined by one surface of the first shielding part and one surface of the base part, and which is formed on the one surface of the base part in the circumferential direction of the first shielding part, wherein the base part and the first shielding part can be integrated through injection molding by using any one material from among ferrite powder, sandust, and nano-grain alloy powder.
H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
H01F 27/36 - Electric or magnetic shields or screens
H01F 1/03 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity
H01F 1/10 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials non-metallic substances, e.g. ferrites
H01F 1/34 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
H02J 50/90 - Circuit arrangements or systems for wireless supply or distribution of electric power involving detection or optimisation of position, e.g. alignment
Disclosed is a wireless power transmitting module comprising: a coil unit provided with a coil body in which a conductive member having a predetermined length is wound in one direction, and with a planar coil including a pair of terminal portions extending from the coil body by a predetermined length for electrical connection; a main shielding sheet arranged on one surface of the coil unit to shield a magnetic field generated from the coil unit; an accommodating portion formed through the main shielding sheet so as to accommodate the thickness of at least one of the pair of terminal portions; and an auxiliary shielding sheet attached to one surface of the main shielding sheet so as to cover the accommodating portion in order to shield a magnetic field leaking through the accommodating portion, wherein the auxiliary shielding sheet has a relatively thinner thickness than the main shielding sheet.
H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
H02J 50/40 - Circuit arrangements or systems for wireless supply or distribution of electric power using two or more transmitting or receiving devices
H02J 50/00 - Circuit arrangements or systems for wireless supply or distribution of electric power
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
64.
Magnetic shielding sheet for antenna module and antenna module including the same
Disclosed is an magnetic field shielding sheet for an antenna module is applied to an antenna module comprising an antenna unit operating in a predetermined frequency band and a magnet for position alignment, and comprises: a main shielding sheet made of a magnetic material so as to be able to shield a magnetic field generated from the antenna unit; and at least one magnetic saturation-prevention member stacked on one side of the main shielding sheet so as to be able to prevent magnetic saturation of the main shielding sheet by inducing a direct magnetic field generated from the magnet, wherein the magnetic saturation-prevention member is provided in a number corresponding to the number of magnets provided in the antenna module and is positioned on one side of the main shielding sheet so as to be positioned at a position corresponding to the magnets provided in the antenna module.
Disclosed are an airbag system for a vehicle and an operating method thereof. Disclosed is the airbag system of a vehicle, including an airbag module, the system comprising: a transmitting unit main module that, in response to receiving an airbag operating signal, generates information for generating a second voltage different from a first voltage to be supplied to other electronic components of a vehicle seat excluding the airbag module and outputs the generated information; a power transmitting unit that receives the information, converts power from a vehicle battery into an electric signal indicating the second voltage on the basis of the received information, and wirelessly transmits same; and a power receiving unit that wirelessly receives the electric signal indicating the second voltage, generates airbag driving power on the basis of the wirelessly received electric signal, and supplies the airbag driving power to the airbag module to operate the airbag module.
B60R 21/017 - Electrical circuits for triggering safety arrangements in case of vehicle accidents or impending vehicle accidents including arrangements for providing electric power to the safety arrangements
B60R 16/033 - Electric or fluid circuits specially adapted for vehicles and not otherwise provided forArrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric for supply of electrical power to vehicle subsystems characterised by the use of electrical cells or batteries
B60R 21/01 - Electrical circuits for triggering safety arrangements in case of vehicle accidents or impending vehicle accidents
Disclosed is a waveguide having a first vertical transfer path formed at a lower plate coupled to a signal processing substrate, and having a horizontal transfer path and a second vertical transfer that are formed at an upper plate coupled to a radar antenna, and thus minimizing tolerance during assembly. The disclosed waveguide is constructed by stacking the upper plate on the upper surface of the lower plate, a first vertical through-hole is formed in the lower plate, a second vertical through-hole and a horizontal groove are formed in the upper plate, and the horizontal groove connects the first vertical through-hole and the second vertical through-hole to form a radio wave transfer path.
Disclosed is a radar antenna having an antenna and a waveguide that are coupled using a jig on which a plurality of alignment pins are arranged, and thus minimizing tolerance during assembly. The disclosed radar antenna comprises: an alignment jig having a plurality of alignment pins; a circuit board having a plurality of first alignment holes through which the plurality of alignment pins penetrate, and being stacked on the upper surface of the alignment jig; a waveguide having a plurality of second alignment holes through which the plurality of alignment pins penetrate, and being stacked on the upper surface of the circuit board; and an antenna having a plurality of third alignment holes through which the plurality of alignment pins penetrate, and being stacked on the upper surface of the waveguide.
Disclosed is a radar antenna which has a shielding space corresponding to each antenna of an antenna body by using an accommodation hole of a shielding member to prevent mutual coupling between antennas. The disclosed radar antenna comprises an antenna body which has a first surface and a second surface and in which a plurality first slot groups are formed to be spaced apart from each other on the first surface, and a shielding member which is stacked on the first surface of the antenna body and in which a plurality of accommodation holes are formed to respectively overlap the plurality of first slot groups.
A voice processing device is disclosed. The voice processing device comprises: a voice processing circuit configured to generate an isolated voice signal associated with respective voices spoken at a plurality of sound source locations in a vehicle by isolating, and output an interpretation result for the respective voices on the basis of the isolated voice signal; a memory configured to store source language information indicating a source language and target language information indicating a target language in order to interpret the voice associated with the isolation voice signal; and a communication circuit configured to output the interpretation result, wherein the voice processing circuit generates the interpretation result in which the language of the voice corresponding to the isolated voice signal is interpreted from the source language into the target language.
A mobile terminal is disclosed. The mobile terminal comprises: a microphone configured to generate a voice signal in response to voices of speakers; a processor configured to generate a separated voice signal associated with each of the voices by separating the voice signal from a sound source on the basis of a sound source location of each of the voices, and output the result of translation for each of the voices, on the basis of the separated voice signal; and a memory configured to store source language information indicating source languages that are uttered languages of the voices of the speakers. The processor outputs the results of translations in which the languages of the voices of the speakers have been translated from the source languages into a target language, on the basis of the source language information and the separated voice signal.
Disclosed is a speech processing device. The speech processing device comprises: a speech reception circuit configured to receive a speech signal associated with speech uttered by speakers; a speech processing circuit configured to perform sound source separation for the speech signal on the basis of a sound source position of the speech so as to generate a separated speech signal associated with the speech and generate a translation result for the speech by using the separated speech signal; a memory; and an output circuit configured to output the translation result for the speech, wherein the sequence in which transmission results are output is determined on the basis of an utterance time point of the speech.
A wireless power transmission system is provided. The wireless power transmission system, according to an embodiment of the present invention, comprises: a transmission unit including a first shielding sheet and an antenna for transmitting wireless power, which is arranged on one surface of the first shielding sheet; and a reception unit including a second shielding sheet and an antenna for receiving wireless power, which is arranged on one surface of the second shielding sheet to face the antenna for transmitting wireless power, wherein the antenna for transmitting wireless power may include a first transmission antenna portion arranged on one surface of a first horizontal portion and a second transmission antenna portion arranged on one surface of a first wing portion, and the antenna for receiving wireless power may include a first reception antenna portion arranged on one surface of a second horizontal portion to face the first transmission antenna portion and a second reception antenna portion arranged on one side of a second wing portion to face the second transmission antenna portion.
H02J 50/00 - Circuit arrangements or systems for wireless supply or distribution of electric power
H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
H01F 27/36 - Electric or magnetic shields or screens
H01Q 7/00 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
H01F 5/02 - Coils wound on non-magnetic supports, e.g. formers
The present invention relates to a waveguide comprising: a first body and a second body which are injected-molded, have metal-coated surfaces, and are connected in the up-down or left-right direction so as to form a transmission space in which radio waves can move in the longitudinal direction; and a first coupling surface and a second coupling surface which come into surface contact with each other when the first body and the second body are coupled, wherein the coupling surfaces are coupled through a coupling body, or by forming a bending structure in which protrusions and grooves formed on the coupling surfaces are engaged with each other.
A wireless power transmission module is provided. The wireless power transmission module, according to an embodiment of the present invention, comprises: a wireless power transmission antenna for transmitting wireless power; a shielding member that is made of a ferrite material to shield a magnetic field generated from the wireless power transmission antenna and includes an accommodation groove drawn in from one surface to a certain depth to accommodate the wireless power transmission antenna; and a separation prevention member that is provided in the shielding member to prevent a portion of the shielding member surrounding the outer edge of the wireless power transmission antenna, which is arranged in the accommodation groove while forming the accommodation groove, from being separated from the shielding member.
H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
H01F 27/36 - Electric or magnetic shields or screens
H01F 1/10 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials non-metallic substances, e.g. ferrites
H02J 50/90 - Circuit arrangements or systems for wireless supply or distribution of electric power involving detection or optimisation of position, e.g. alignment
C09J 1/00 - Adhesives based on inorganic constituents
C09J 7/00 - Adhesives in the form of films or foils
A folding plate according to an embodiment of the present invention has first and second support portions located on both sides of a folding portion that is foldable, and is formed as a multilayer structure in which first and second metal sheets of different metal materials are braze-bonded, and thus, is thin and lightweight, has excellent flexibility, and easily dissipates heat.
The present invention relates to a power module and a method for manufacturing same, the power module including: a lower ceramic substrate; an upper ceramic substrate which is disposed spaced apart from the upper portion of the lower ceramic substrate, and on the lower surface of which a semiconductor chip is mounted; spacers each having one end bonded to the lower ceramic substrate and the other end bonded to the upper ceramic substrate; first bonding layers each bonding the one end of each spacer to the lower ceramic substrate; and second bonding layers each bonding the other end of each spacer to the upper ceramic substrate. The present invention maintains a constant distance between the lower ceramic substrate and the upper ceramic substrate by having the spacers arranged therebetween, and thus is advantageous in that the semiconductor chip can be protected and heat dissipation efficiency can be increased.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/373 - Cooling facilitated by selection of materials for the device
77.
VOICE PROCESSING DEVICE FOR PROCESSING VOICE SIGNAL AND VOICE PROCESSING SYSTEM COMPRISING SAME
A voice processing device is disclosed. The voice processing device comprises: a voice data receiving circuit receives input voice data associated with voices of speakers; a memory stores starting language data; a voice data output circuit outputs output voice data associated with the voices of the speakers; and a processor generates a control command for outputting the output voice data, wherein the processor uses the input voice data to generate first speaker position data indicating a position of a first speaker of the speakers and first output voice data associated with a voice of the first speaker, reads first source language data corresponding to the first speaker position data with reference to the memory, and transmits, to the voice data output circuit, a control command for outputting the first output voice data to a translation environment for translating a first source language indicated by the first starting language data.
G10L 17/02 - Preprocessing operations, e.g. segment selectionPattern representation or modelling, e.g. based on linear discriminant analysis [LDA] or principal componentsFeature selection or extraction
H04R 1/40 - Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers
G10L 21/028 - Voice signal separating using properties of sound source
The present invention relates to a power module and a manufacturing method therefor, the power module comprising: a base plate having recessed grooves formed on the upper surface thereof; brazing filler layers arranged in the recessed grooves; and a ceramic substrate brazed to the upper surface of the base plate by means of the brazing filler layers. The present invention solves an existing soldering problem, enables reliable joining to various base plates, and can simplify processes.
Provided is a power source-less sensor device. A power source-less sensor device according to an exemplary embodiment of the present invention comprises: a sensor module which includes a sensing unit including at least one sensor and includes a communication unit for transmitting, to the outside, information sensed from the sensing unit; a capacitor for providing driving power to the sensor module; and an NFC antenna module for generating an induced current so as to charge the capacitor during NFC tagging. The sensor module is periodically driven by using power charged in the capacitor.
Disclosed is a voice processing device. The voice processing device comprises a memory and a processor configured to perform sound source isolation on voice signals associated with the voices of speakers on the basis of the sound source positions of the respective voices. The processor is configured to: generate sound source position information indicating the sound source positions of the respective voices using the voice signals associated with the voices; generate isolated voice signals associated with the voices of the respective speakers from the voice signals on the basis of the sound source position information; and match the isolated voice signals and the voice source position information and store the same in the memory.
An antenna module is provided. An antenna module according to an exemplary embodiment of the present invention comprises: a circuit board; a radiation pattern formed on at least one surface of the circuit board and formed in a loop shape to have an empty space part formed at a central part thereof; a first shielding sheet stacked on the upper surface of the circuit board to include an area corresponding to the empty space part; and a second shielding sheet stacked on the lower surface of the circuit board to include an area corresponding to the empty area part, wherein the first shielding sheet and the second shielding sheet are disposed such that the areas corresponding to the empty space part on the opposite surfaces of the circuit board overlap each other.
H01Q 1/52 - Means for reducing coupling between antennas Means for reducing coupling between an antenna and another structure
H01Q 7/00 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
The present invention relates to a power module comprising: a lower ceramic substrate (200); an upper ceramic substrate (300) which is disposed above the lower ceramic substrate (200) and has a semiconductor chip (G) mounted on the lower surface thereof; a PCB substrate (400) disposed above the upper ceramic substrate (300); and a connection pin (800) which extends through through holes (320 and 420) formed in the upper ceramic substrate (300) and the PCB substrate (400), and vertically connects electrode patterns (a, b, c, and d) formed on the upper ceramic substrate (300) and the PCB substrate (400). The present invention provides a shortened electrical connection distance between the upper ceramic substrate and the PCB substrate, and thus can minimize a current path and enhance the moving efficiency of a high-speed current.
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
83.
HYBRID BASE PLATE AND MANUFACTURING METHOD THEREFOR
The present invention relates to a hybrid base plate and a manufacturing method therefor. Metal sheets of different materials having excellent thermal conductivity can be joined to have a thickness favorable for heat dissipation, and by arranging a metal sheet of a material with a low coefficient of thermal expansion between metal sheets with a high coefficient of thermal expansion, there is an effect of preventing warpage when manufacturing a large-area heat sink.
Disclosed is a voice processing device. The voice processing device comprises: a voice data reception circuit configured to receive input voice data associated with the voice of a speaker; a wireless signal reception circuit configured to receive a wireless signal including a terminal ID from a speaker terminal of the speaker; a memory; and a processor configured to generate terminal location data indicating the location of the speaker terminal on the basis of the wireless signal, and match and store the generated terminal location data and the terminal ID in the memory, wherein the processor uses the input voice data to generate first speaker location data and first output voice data associated with a first voice spoken at the first location and matches a first terminal ID corresponding to the first speaker location data and the first output voice data.
A disposable electronic thermometer is provided. The disposable electronic thermometer, according to an exemplary embodiment of the present invention, comprises: a base substrate including an adhesive layer formed on one surface to be attached to a body of a user; a control part including a circuit board arranged on one surface of the base substrate and at least one driving chip mounted on the circuit board; a temperature sensor arranged on one surface of the base substrate and electrically connected to the circuit board, to thus measure a body temperature of a user; an NFC antenna electrically connected to the circuit board and arranged on one surface of the base substrate to surround the circuit board; and a cover member attached to one surface of the base substrate to prevent external exposure of the circuit board, the temperature sensor, and the NFC antenna.
G01K 13/20 - Clinical contact thermometers for use with humans or animals
H01Q 7/00 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
A61B 5/00 - Measuring for diagnostic purposes Identification of persons
An antenna module is provided. An antenna module according to an exemplary embodiment of the present invention comprises: an antenna unit including an antenna pattern, which has a pattern portion and a lead portion formed, respectively, on both surfaces of a circuit board; a magnetic field shielding sheet including a sheet body made of a magnetic material to block a magnetic field, and a plurality of eddy current reducing pattern portions formed on the sheet body to reduce the generation of eddy current by increasing the resistance of the sheet body; and an insulation member arranged between the antenna unit and the magnetic field shielding sheet, wherein the antenna unit is provided in an asymmetric form in which the pattern portion and the lead portion respectively formed on both surfaces of the circuit board have different thicknesses.
H01Q 7/00 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
H01Q 1/24 - SupportsMounting means by structural association with other equipment or articles with receiving set
H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
H01Q 1/52 - Means for reducing coupling between antennas Means for reducing coupling between an antenna and another structure
Disclosed is a flexible PCB RF cable having a ground pattern that is divided into two ground patterns, which are connected through a connection pattern arranged in an area overlapped with a signal line pattern, and thus cracks are minimized during bending. The disclosed flexible PCB RF cable comprises: a signal line pattern interposed between a first dielectric sheet and a second dielectric sheet; first and second lower ground patterns, which are mesh patterns arranged to be spaced from each other below the first dielectric sheet; a lower connection pattern connected to the first and second lower ground patterns; first and second upper ground patterns, which are mesh patterns arranged to be spaced from each other above the second dielectric sheet; and an upper connection pattern connected to the first and second ground patterns.
Proposed are a radar antenna configured to form a waveguide through a partition wall on a plate having a plurality of slots, and a method for manufacturing same. The proposed radar antenna comprises: a first plate having an inner surface; and a second plate stacked so as to have an inner surface facing the inner surface of the first plate, wherein the first plate includes a partition wall extending in the direction of the second plate from the inner surface of the first plate, and the partition wall contacts the inner surface of the second plate to form a waveguide between the inner surface of the first plate and the inner surface of the second plate.
The present invention relates to a ceramic substrate unit and a manufacturing method therefor. The ceramic substrate unit comprises: a ceramic substrate having metal layers on the upper and lower surfaces of the ceramic substrate; a heat dissipation spacer bonded to the upper metal layer of the ceramic substrate; and a heat sink bonded to the lower metal layer of the ceramic substrate, wherein the heat dissipation spacer is provided with an electrode in a region to which a semiconductor chip is bonded, so that the semiconductor chip may be bonded in the form of a flip chip.
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
H01L 23/367 - Cooling facilitated by shape of device
The present invention relates to a power module comprising: an upper ceramic substrate (300); a PCB substrate (400) disposed spaced apart from the upper ceramic substrate (300); a plurality of semiconductor chips (G1, G2, G3, G4) spaced apart from each other, arranged in parallel, and mounted on the lower surface of the upper ceramic substrate (300); and a plurality of capacitors (310) mounted on the top surface of the PCB substrate (400) to correspond to locations between the semiconductor chips (G1, G2, G3, G4). The present invention has the advantage of forming a short current path through which the semiconductor chips and the capacitors are connected, thereby increasing a circuit stabilization effect.
The present invention relates to a ceramic substrate unit comprising: a ceramic substrate including a ceramic basic material and a circuit pattern formed on the ceramic basic material; an electrode pattern portion included in the circuit pattern on the ceramic substrate and connected to an electrode of a semiconductor chip mounted on the ceramic substrate; and a spacer bonded to the electrode pattern portion of the ceramic substrate by means of a bonding layer, wherein the spacer is made of a metal or alloy having electrical conductivity and thermal conductivity. According to the present invention, a power semiconductor chip can be mounted on a substrate in a form similar to flip-chip bonding, and thus the bonding strength of the bonding surface between a spacer and the substrate is increased to improve the reliability thereof.
The present disclosure relates to an adhesive transfer film for bonding a semiconductor chip and a spacer to a substrate and a method for manufacturing a power module substrate by using same, the adhesive transfer film being obtained by manufacturing an Ag sintering paste in the form of a film. The present disclosure can reduce the process time by minimizing a sintering process, and can reduce equipment investment cost.
H01L 23/00 - Details of semiconductor or other solid state devices
C09J 5/06 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
C09J 7/25 - PlasticsMetallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
C09J 135/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least another carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereofAdhesives based on derivatives of such polymers
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
The present invention relates to a power module and a method for manufacturing same, the power module comprising: a ceramic substrate including a ceramic base and an electrode pattern formed on the upper and lower surfaces of the ceramic base; a PCB substrate disposed above the ceramic substrate and including an electrode pattern; a plurality of through-holes formed in at least one of the ceramic substrate and the PCB substrate; and a connection pin coupled to the through-holes and connecting the electrode pattern of the ceramic substrate and the electrode pattern of the PCB substrate to each other. The present invention has advantages in that it is easy to fix the connection pin to the ceramic substrate, the position accuracy of the connection pin is improved, and the convenience of assembly is increased.
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01R 12/52 - Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
H01R 12/58 - Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
H01R 43/02 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
A remote body temperature monitoring system is provided. A remote body temperature monitoring system according to an embodiment of the present invention comprises: a patch-type thermometer attached to the body of a user so as to periodically measure body temperature; a web service server for collecting information about the body temperature measured by the patch-type thermometer and notifying a manager terminal of a suspected fever; a collection device for receiving the information about the measured body temperature from the patch-type thermometer and transmitting same to the web service server; and an AI server for receiving the information about the body temperature from the web service server to manage a health status by using artificial intelligence.
H04W 4/14 - Short messaging services, e.g. short message service [SMS] or unstructured supplementary service data [USSD]
H04W 4/80 - Services using short range communication, e.g. near-field communication [NFC], radio-frequency identification [RFID] or low energy communication
The present invention relates to a phased array antenna module. The phased array antenna module comprises: a package antenna having a plurality of patch antennas formed on an upper surface thereof; and a substrate having the package antenna mounted thereon and having a connection pattern electrically connected to the package antenna, wherein the package antenna includes a plurality of package antennas. The plurality of package antennas are arranged on the top surface of the substrate in a 2N × 2N array arrangement and are mounted without a gap by making one side surface come into contact with each other. N is a natural number. The present invention has advantages capable of providing a high yield, and replacing only a corresponding portion when a defect occurs, and stably implementing a fast speed of 5G due to a low dielectric constant, and a low loss material and structure.
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
H01Q 3/26 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture
96.
WIRELESS POWER TRANSMISSION SYSTEM AND KITCHEN APPLIANCE ACCESSORIES COMPRISING SAME
A wireless power transmission system is provided. A wireless power transmission system according to one embodiment of the present invention comprises: a first power transmission unit including a first shielding sheet, which has both ends open, is formed in a hollow shape with a predetermined length, and has a closed-loop-shaped cross section in the direction perpendicular to the longitudinal direction, and a first coil wound a plurality of times in the longitudinal direction of the first shielding sheet so as to encompass the outer circumferential surface of the first shielding sheet; and a second power transmission unit including a second shielding sheet, which has both ends open, is formed in a hollow shape with a predetermined length, and has a closed-loop-shaped cross section in the direction perpendicular to the longitudinal direction, and a second coil wound a plurality of times in the longitudinal direction of the second shielding sheet so as to encompass the inner circumferential surface of the second shielding sheet, wherein any one of the first coil and the second coil is a transmission coil for transmitting wireless power, and the other one is a reception coil for receiving wireless power, and the first power transmission unit and the second power transmission unit can perform wireless power transmission in a state in which the first power transmission unit is inserted into the second shielding sheet.
H02J 50/00 - Circuit arrangements or systems for wireless supply or distribution of electric power
H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
H02J 50/80 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the exchange of data, concerning supply or distribution of electric power, between transmitting devices and receiving devices
An electronic thermometer is provided. The electronic thermometer according to an exemplary embodiment of the present invention is for periodically measuring a body temperature by being attached to a body of a user, and comprises: at least one temperature sensor mounted on the one surface of a flexible circuit board; a memory unit for storing information obtained via the temperature sensor; a communication unit for externally transmitting the information stored in the memory unit; a control unit for controlling the operations of the temperature sensor, memory unit, and communication unit; a power supply unit arranged on the one surface of the flexible circuit board such that driving power can be provided; and a protection member surrounding the flexible circuit board such that external exposure of the temperature sensor, memory unit, communication unit, control unit, and power supply unit can be prevented.
Provided is a magnetic field shielding module for an electric vehicle. The magnetic field shielding module for an electric vehicle according to an embodiment of the present invention is utilized in a wireless power transmission module for an electric vehicle, and comprises: a shielding layer including a plurality of unit blocks which are made of ferrite materials so as to be able to block a magnetic field generated from a flat coil in which a conductive member is wound multiple times; and a coil accommodation groove recessed to a certain depth from one surface of the shielding layer so as to be able to accommodate the thickness of the flat coil. The shielding layer is formed in a plate shape having a certain area by arranging the plurality of unit blocks adjacent to each other. At least some of the plurality of unit blocks include unit accommodation grooves for accommodating a portion of the flat coil, and the unit accommodation grooves respectively formed in the at least some of the unit blocks may be connected to each other in a state in which the plurality of unit blocks are arranged adjacent to each other, and thereby form the coil accommodation groove having a shape corresponding to the flat coil.
H01F 27/36 - Electric or magnetic shields or screens
H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
A magnetic field shielding module for an electric vehicle is provided. A magnetic field shielding module for an electric vehicle according to an embodiment of the present invention may comprise: a main shielding layer including a plurality of unit blocks made of a ferrite material to shield a magnetic field generated from a planar coil in which a conductive member is wound multiple times, the main shielding layer being formed in a plate shape having a predetermined area by the plurality of unit blocks arranged adjacent to each other; and an auxiliary shielding layer made of a magnetic material containing a metal component to supplement the main shielding layer, disposed on one surface of the main shielding layer, and including a penetrating portion formed in a shape corresponding to that of the planar coil.
H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
A magnetic shielding sheet for a reception antenna, and a wireless power reception module including same are provided. A magnetic shielding sheet for a reception antenna, according to an exemplary embodiment of the present invention, blocks the magnetic field induced in a reception antenna, and comprises: a planar first shielding sheet including a through-hole penetratively formed with a predetermined area in a region corresponding to a hollow portion of the reception antenna; and a second shielding sheet arranged to come in contact with one surface of the first shielding sheet, so as to block the magnetic field leaking through the through-hole.
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