Abstract

A steam reflow apparatus includes a heating furnace including a preheating zone, a uniform heating zone, a melting zone and a cooling zone to which superheated steams are respectively supplied. The apparatus further includes a furnace-inlet-side dew condensation prevention zone and a furnace-outlet-side dew condensation prevention zone, to which air or nitrogen gas with 100° C. or higher heated by a heater is supplied, respectively adjacently provided with an upstream side of the preheating zone and a downstream side of the cooling zone. Atmospheric pressures of the furnace-inlet-side dew condensation prevention zone and the furnace-outlet-side dew condensation prevention zone are higher than atmospheric pressures of the preheating zone and the cooling zone.

IPC Classes  ?

• B23K 31/02 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to soldering or welding
• B23K 1/015 - Vapour-condensation soldering
• B23K 1/012 - Soldering with the use of hot gas
• B23K 1/00 - Soldering, e.g. brazing, or unsoldering
• B23K 37/00 - Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass

Abstract

The purpose of the present invention is to provide a water vapor reflow device and water vapor reflow method that use superheated water vapor and that make practical use possible. A water vapor reflow device (1) provided with a heating furnace (2) having a preheating zone (Z2), a soaking zone (Z3), a melting zone (Z4), and a cooling zone (Z5), to each of which heated water vapor is supplied, wherein a furnace exit-side condensation prevention zone (Z6) and a furnace entrance-side condensation prevention zone (Z1) to which air or nitrogen gas heated by a heater (H1) to 100°C or higher is fed are respectively provided adjacent to the downstream of the cooling zone (Z5)and to the upstream of the preheating zone (Z2) to which superheated water vapor is fed. When a substrate (S) enters the heating furnace (2), and when the substrate (S) exits the heating furnace (2), the water vapor that has come into contact with the substrate (S) can be prevented from falling to 100°C or lower, liquefying, and condensing, and therefore a practicable water vapor reflow can be realized.

IPC Classes  ?

• B23K 1/008 - Soldering within a furnace
• B23K 1/012 - Soldering with the use of hot gas
• B23K 3/04 - Heating appliances
• B23K 31/02 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to soldering or welding
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
• B23K 101/42 - Printed circuits