A substrate architecture is disclosed, comprising a bridging substrate, a function chip unit, and a filling material. The bridging substrate defines a coefficient of thermal expansion (CTE) no greater than 10 ppm/° C. along a horizontal plane thereof and has a passage. The function chip unit is at least partially accommodated in the passage, with a gap derived between the function chip unit and the bridging substrate. The filling material is arranged in the gap. By controlling the CTE of the bridging substrate and integrating the function chip unit within the passage, the substrate architecture effectively addresses thermal stress issues and enhances structural integration.
A semiconductor device includes a substrate structure, a first semiconductor chip, an optoelectronic conversion element array, an optoelectronic driving circuit, a waveguide array, and an optical transmission path. The first semiconductor chip is arranged at and electrically connected to the substrate structure, and has a functional circuit. The optoelectronic conversion element array is connected to the substrate structure, and the optoelectronic driving circuit is electrically connected to the optoelectronic conversion element array and the functional circuit of the first semiconductor chip. The optoelectronic driving circuit performs electrical signal transmission and reception with the functional circuit of the first semiconductor chip. The waveguide array defines an optical coupling region, which includes multiple waveguide ports. The optical transmission path is defined between the waveguide array and the optoelectronic conversion element array, and the waveguide array corresponds to and optically couples to the optoelectronic conversion element array by the optical transmission path.
G02B 6/42 - Coupling light guides with opto-electronic elements
H10F 55/00 - Radiation-sensitive semiconductor devices covered by groups , or being structurally associated with electric light sources and electrically or optically coupled thereto
A stacked substrate includes a first tiling layer, a second tiling layer and a bonding layer. The first tiling layer includes plural first tiling substrates adjacent by one another and plural first gaps formed between adjacent two first tiling substrates. The second tiling layer includes plural second tiling substrates and plural second gaps formed between adjacent two second tiling substrates. The bonding layer is arranged between the first tiling layer and the second tiling layer, and defines a first bonding surface connecting to a second surface of the first tiling substrates and a second bonding surface connecting to a first surface of the second tiling substrates. Some projections of at least some of the first gaps and some of the second gaps are offset from each other along a direction perpendicular to one or both of the first bonding surface and the second bonding surface.
B32B 3/14 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. apertured or formed of separate pieces of material characterised by a face layer formed of separate pieces of material
A substrate assembly is disclosed, comprising a carrier board defining a planar direction and a plurality of substrates adjacently arranged thereon. Each substrate has opposite first and second surfaces, with a temporary adhesive layer bonding the second surface to the carrier board. A functional material fills the gaps between adjacent substrates. The carrier board's area is no less than the total area of the substrates. Crucially, in a direction perpendicular to the planar direction, the height difference between the first surfaces or the second surfaces of adjacent substrates is controlled to be no greater than 50μm. This structure ensures precise alignment and stability for subsequent processing.
A substrate architecture includes a substrate, a film-layered structure, and a plurality of conductive components. The substrate defines a plurality of through-holes; each of the through-holes is defined with a reception accommodation and an inner surface designating the reception accommodation. The film-layered structure at least partially encloses an opening of the corresponding one of the through-holes located at a surface of the substrate; the film-layered structure defines a conductive face facing the opening, and where the conductive face corresponding with the opening is at least partially conductive. The conductive components are respectively arranged in the reception accommodations of the through-holes, at least partially contacting the inner surfaces of the corresponding through-holes, and electrically connected to the film-layered structure. In a direction parallel with a horizontal plane of the substrate, one of the conductive components has a cross-sectional profile characterized by a homogeneous medium.
An electronic device includes a core substrate, a conductive layer structure, an adhesive pattern layer, and a conductive member. The core substrate defines two opposite surfaces and has a through hole penetrating the two surfaces. The conductive layer structure is stacked over one side of the core substrate, at least partially covering one opening of the through hole. The adhesive pattern layer is disposed between the conductive layer structure and the core substrate, bonding the conductive layer structure to the core substrate; the adhesive pattern layer has an opening window exposing at least a portion of the conductive layer structure; the through hole and the opening window at least partially overlap in the projection direction. The conductive member is formed from a thermally cured conductive material, disposed in the through hole of the core substrate, with one end electrically connected to the conductive layer structure through the opening window.
An electronic device and an electronic apparatus are disclosed. The electronic device includes a substrate and a plurality of element units. The substrate defines a plurality of edges and a functional region. The plurality of element units are arranged in the functional region, each of the element units includes one or more functional elements and a driving circuit. The one or more functional elements defines an element geometric center, and the driving circuit defines a circuit geometric center. In one of the one or more element units adjacent to one edge of the substrate, the circuit geometric center is located at a side of the element geometric center and away from the corresponding edge of the substrate.
H10K 59/121 - Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
H10H 29/14 - Integrated devices comprising at least one light-emitting semiconductor component covered by group comprising multiple light-emitting semiconductor components
H10H 29/32 - Active-matrix LED displays characterised by the geometry or arrangement of elements within a subpixel, e.g. arrangement of the transistor within its RGB subpixel
The present invention provides a substrate assembly including a substrate, a composite-layered structure and a bonding layer. The composite-layered structure defines a conjunction plane, and one or more conductive-trace layers and one or more optical-trace layers are arranged either or both of over and beneath the conjunction plane; wherein the optical-trace layer defines a plurality of optical traces, and the conductive-trace layer defines a plurality of conductive traces. The bonding layer is adhesive between the substrate and the composite-layered structure. The present invention also provides an electronic device including a substrate assembly and a plurality of semiconductor components arranged on the composite-layered structure of the substrate assembly; wherein some of the semiconductor components are electrically connected to the conductive-trace layers, and some of the semiconductor components are optically communicated with the optical-trace layers.
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H10B 80/00 - Assemblies of multiple devices comprising at least one memory device covered by this subclass
H10D 80/30 - Assemblies of multiple devices comprising at least one device covered by this subclass the at least one device being covered by groups , e.g. assemblies comprising integrated circuit processor chips
9.
ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF
The present invention provides an electronic apparatus including a function board, at least one substrate assembly and a plurality of semiconductor components. Each of the substrate assembly includes a substrate, a composite-layered structure and a bonding layer. The composite-layered structure defines a conjunction plane, and one or more conductive-trace layers and one or more optical-trace layers are arranged either or both of over and beneath the conjunction plane; wherein the optical-trace layer defines a plurality of optical traces, and the conductive-trace layer defines a plurality of conductive traces. The bonding layer is adhesive between the substrate and the composite-layered structure. The semiconductor components are arranged on the composite-layered structure of the at least one substrate assembly; wherein some of the semiconductor components electrically connect the conductive layers, and some of the semiconductor components optically communicate with the optical-trace layers.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
An electronic device includes a functional substrate, a conductive layer having a plurality of circuitries on the functional substrate, a plurality of redistribution-layered substrates arranged along one surface of the functional substrate, a plurality of functional components arranged on the functional substrate, and a plurality of computing and memory components arranged on one side of the redistribution-layered substrate.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
G02B 6/42 - Coupling light guides with opto-electronic elements
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H10B 80/00 - Assemblies of multiple devices comprising at least one memory device covered by this subclass
H10D 80/30 - Assemblies of multiple devices comprising at least one device covered by this subclass the at least one device being covered by groups , e.g. assemblies comprising integrated circuit processor chips
An electronic device includes a substrate, a trace layer, through holes, conductive members, functional elements and a protection member. The substrate defines a first surface and a second surface. The trace layer is arranged on the first surface. The through holes communicate with the first surface and the second surface, and the through hole defines a first opening approaching the first surface and a second opening approaching the second surface. The conductive members are electrically connected to the trace layer and arranged in the through holes respectively. At least one conductive member defines a revealed portion protruding from the second opening of the corresponding through hole. The functional elements are arranged on the first surface and electrically connected with one or ones of the conductive members through the trace layer. The protection member is arranged on the first surface and covers one or ones of the functional elements.
An LED display device (1) comprises: an LED display layer (10) that has surfaces (10A, 10B) positioned on mutually opposite sides in the thickness direction, the LED display layer (10) including a plurality of LED elements (11) disposed along one of the surfaces; a photovoltaic layer (20) that is disposed side by side with one of the surfaces of the LED display layer (10); and a battery unit (30) that is electrically connected to the LED display layer (10) and the photovoltaic layer (20), the battery unit (30) including a plurality of batteries (31). Power generated in the photovoltaic layer (20) is stored in the battery unit (30), and the LED display layer (10) is driven by the power stored in the battery unit (30).
G09F 9/33 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
An electronic device includes a first substrate, a second substrate, an adhesion layer, a plurality of passages, a plurality of first contacts, a plurality of second contacts, a plurality of conductors and an electronic component. The passages are tapered from the second substrate to the first substrate. One of the first contacts conceals the first opening of the corresponding one of the passages. One of the second contacts is adjacent to the second opening of the corresponding one of the passages. The second end of the corresponding one of the conductors electrically connects the corresponding one of the second contacts and covers at least partial of the second surface of the second contact. The conductors respectively disposed in the passages. The electronic component is arranged on a first face of the first substrate and electrically connects the corresponding one of the first contacts.
A flexible electronic device capable of rolling or bending about an axis so that it can transform between a rolled state and an extended state. The flexible electronic device includes an electronic structure and a support structure. The electronic structure has a first surface and a second surface opposite to the first surface. The support structure has a third surface and a fourth surface opposite to each other. The third surface is connected with the second surface. The support structure defines a first direction parallel to the direction of the axis and defines a second direction perpendicular to the first surface. The second surface of the support structure includes a plurality of ribs parallel to the first direction, and a groove is formed between any two adjacent ribs. Each groove defines an open end and a closed end in the second direction.
An electronic device includes a sustaining layer, a substrate, a plurality of photoelectric units, and a plurality of signal layers. The substrate is arranged on a contact surface of the sustaining layer. A first end edge of the substrate approaches a first end edge of the sustaining layer, and a second end edge of the substrate approaches a second end edge of the sustaining layer. The sustaining layer and the substrate are arranged in one on one manner. The photoelectric units are arranged on a first surface or/and a second surface of the substrate. The signal layers are arranged on the substrate and electrically connected to the photoelectric units.
An electronic circuitry and an electronic device. The electronic circuitry includes a plurality of light-emitting components and a plurality of driving circuits corresponding to the light-emitting components. The driving circuit includes a transistor for delivering a driving signal to a corresponding light-emitting component, a detecting unit for providing a detecting output in response to the corresponding light-emitting component, and a feedback-control unit for directing the transistor to regulate the driving signal in response to the detecting output.
G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
17.
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
An electronic device and a manufacturing method thereof are provided. The electronic device includes a redistribution structure configured with a redistribution layer trace; a substrate configured with a substrate trace facing the redistribution structure; an adhesion layer attaching the redistribution structure to the substrate; and a plurality of conductive members arranged at least through the adhesion layer and electrically connecting the RDL trace of the redistribution structure to the substrate trace of the substrate.
An electronic device and a manufacturing method thereof are provided. The electronic device includes a redistribution structure configured with a redistribution layer trace; a substrate configured with a substrate trace facing the redistribution structure; an adhesion layer attaching the redistribution structure to the substrate; and a plurality of conductive members arranged at least through the adhesion layer and electrically connecting the RDL trace of the redistribution structure to the substrate trace of the substrate.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
An electronic device, including a substrate. The substrate includes a plurality of driver units converting a data signal into a driving signal, a plurality of functional elements driven by the driver units, and a plurality of switches coupling to the driver units and the functional elements. The switch is enabled via a prompt signal to activate the driving signal to the functional elements. The driving signal is transmitted from the driver unit to the functional element by switches enabling.
H04N 25/78 - Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
H03K 17/56 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices
H04N 25/30 - Circuitry of solid-state image sensors [SSIS]Control thereof for transforming X-rays into image signals
An antenna device includes substrate layers, metallic layers, a non-shielding channel, an electronic component, a shielding layer and an antenna unit. The substrate layers include an upper substrate layer and a lower substrate layer located on two sides respectively. The metallic layers are disposed on the substrate layers. The non-shielding channel is at least defined at the upper substrate layer and communicates with the inner and outer surfaces of the upper substrate layer without being interfered by the first metallic layer. The electronic component is disposed on the outer surface of the upper substrate layer and corresponds to and at least partially covers the non-shielding channel. The shielding layer electrically shields the electronic component and is electrically connected to the first metallic layer. The antenna unit is disposed on an outer surface of the lower substrate layer and electrically coupled to the electronic component.
An electronic device is provided. The electronic device includes a first substrate, a second substrate and a third substrate. The first substrate has a first trace layer, which defines a first trace width. The second substrate has a second trace layer and stacked under the first substrate. The second substrate defines a first surface connecting to the first substrate and a second surface opposite to the first surface. The second trace layer is formed on either or both of the first and second surfaces and defines a second trace width. The third substrate is stacked under the second substrate and connected to the second surface. The third substrate has a third trace layer, which defines a third trace width. At least a partial of the second trace width is no greater than both of the first trace width and the third trace width.
An image assembly and an electronic system thereby are provided. The image assembly includes a light-transmissive substrate. The light-transmissive substrate is provided with a light projection surface. The light projection surface defines a plurality of light projection areas, and each of the light projection areas is defined with one or more first regions and a second region. The first region is neighbored by the second region. A light energy projected on the first regions is at least two times greater than a light energy projected on the second region.
An electronic system includes a substrate and a control unit. The substrate includes at least one lighting unit and at least one driving unit corresponding to the lighting unit, and the driving unit includes a signal receiver. The control unit includes a signal providing unit for providing an optical signal to the signal receiver. The driving unit provides a current or a voltage to the corresponding lighting unit according to the optical signal received by the signal receiver from the signal providing unit of the control unit.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
An electronic device includes a flexible substrate, a conductive pattern layer, at least one transistor and at least one guarding portion. The transistor electrically connects the conductive pattern layer. The transistor includes an active layer, a source electrode and a drain electrode electrically connected to the active layer, at least one gate electrode, and an insulation layer disposed between the active layer and the gate electrode. The active layer defines a channel portion, which defines a gated channel overlapped with the gate electrode in a projection direction perpendicular to the flexible substrate. The gated channel defines a plurality of edges coherent to the first direction. The guarding portion is arranged under the transistor and overlaps at least one of the edges of the gated channel in the projection direction perpendicular to the flexible substrate. The Young's modulus of the flexible substrate is less than that of the guarding portion.
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
An electronic device includes a sustaining layer, multiple substrates, multiple photoelectric units, and multiple signal layers. The substrates are arranged on a contact surface of the sustaining layer. A first end edge of at least one substrate approaches a first end edge of the sustaining layer, and a first side edge of one substrate is adjacent to a second side edge of another substrate. The photoelectric units are arranged on the first or/and second surfaces of the substrates. The signal layers are arranged on the substrates and electrically connected to the photoelectric units.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
An electronic device and an electronic apparatus having the same are provided. The electronic device comprises a substrate defining a first face and a second face opposite to each other, a thin film layer formed on the first face of the substrate, one or more passive elements arranged on the thin film layer, and one or more semiconductor chips are disposed on the first face of the substrate and electrically connecting to the thin film layer. One or ones of the semiconductor chips define an operating frequency not less than 1 GHz.
An electronic device and an electronic apparatus with a mating structure. The electronic device comprises a first substrate with a first face and a second face opposite to each other, a plural of tiles on the first face and with a second substrate and a patterned layer, a trace layer between the tiles and the first substrates and electrically connected to the patterned layer, and a connection component disposed at a second surface of the first substrate and electrically connected to the trace layer.
An electronic device includes a first substrate, a second substrate, plural conductive pads, plural hole structures, plural connection pads and plural conductive structures. Hole structures penetrate through the first and second substrates, and are arranged corresponding to the conductive pads. Second ends of hole structures are located at the second substrate, and the corresponding conductive pad is exposed by one of the second ends. Connection pads enclose first ends of hole structures. Conductive structures are arranged in the hole structures and electrically connected to corresponding conductive pads and connection pads. The second diameter portion of each conductive structure penetrates through first substrate and conductive pad and is electrically connected to corresponding connection pad and conductive pad, and first diameter portion thereof penetrates through second substrate and is electrically connected to corresponding conductive pad. Each conductive pad defines an opening, which is exposed by second end of corresponding hole structure.
An electronic device includes a first substrate and a second substrate stacked on each other, a plurality of pad groups, a plurality of channels, and a plurality of conductive members. The first substrate and the second substrate respectively have an inner surface facing to each other and an outer surface away from each other. Each pad group includes two conductive pads, which are respectively disposed at the outer surfaces of the first substrate and the second substrate and are located corresponding to each other. The channels pass through the first substrate and the second substrate, and each channel is disposed corresponding to one of the pad groups. Two ends of each channel are respectively sealed by the two conductive pads of the corresponding pad group. The conductive members are disposed in the channels, and each conductive member is electrically connected to the two conductive pads of the corresponding pad group.
A display device includes a display structure having a display surface and an actuator mechanism. The actuator mechanism drives the display structure travels along a motion path with a periodic cycle.
An antenna device includes a first substrate, plural antenna elements, a second substrate, plural circuit units, plural circuit patterned layers and plural conductive structures. The first substrate is defined with a first surface and a second surface opposite to each other. The antenna elements are arranged on the first surface of the first substrate. The second substrate is connected to the second surface of the first substrate. The circuit units are arranged at the second substrate. The circuit patterned layers are arranged on the first substrate and the second substrate. The conductive structures are connected to at least ones of the circuit patterned layers. One of the circuit patterned layers includes plural induction units corresponding to the antenna elements, at least ones of the circuit units correspond to the induction units, and the induction units and the antenna elements transmit a carrier signal to each other by electromagnetic induction.
An antenna device includes a substrate and a plurality of antenna elements arranged in an array. The substrate has a driving circuit. The driving circuit defines a frame rate N and a refresh time, wherein the sum of N refresh times is 1 second. The antenna elements are arranged on the substrate and are electrically connected to the driving circuit. The antenna elements jointly define a beamforming in each refresh time (1/N second), and the beamforming defines a signal, which includes a carrier frequency that is not less than 10 GHz and a characteristic information for communicating with a satellite. M consecutive beamformings contain two or more kinds of the characteristic information, wherein M is an integer not greater than 20.
H01Q 3/40 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture varying the phase by electrical means with phasing matrix
An electronic device includes a substrate, a trace layer and a plurality of electronic components. The substrate defines a thickness less than or equal to 100 µm. The substrate further defines a plurality of transmittances, and at least one of the transmittances is greater than 20% under the condition of the wavelength of light being between 500 nm and 1300 nm. The trace layer is arranged on the substrate, and the trace layer includes a plurality of connection pads. The electronic components are arranged on the substrate. Each electronic component is provided with at least one electrode, which is arranged on a face of the electronic component facing the substrate. At least one electrode of each electronic component is eutectic bonded to one of the connection pads.
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
An antenna device includes a first substrate, an antenna element, a second substrate, a circuitry, and one or more conductive structures. The antenna element is arranged on one surface of the first substrate, and the second substrate is arranged on another surface of the first substrate. The conductive structure defines a through hole at least penetrating through the second substrate and a conductive member arranged in the through hole. At least some of the conductive structures are electrically connected to the antenna element and the circuitry, and the antenna elements are electrically connected to corresponding electronic elements.
A resilient substrate structure, which can be rolled up around an axis, includes a substrate, a working patterned layer and a resilient structure. The substrate has a first surface and a second surface. The substrate is defined with a first edge and a second edge in a direction parallel to the axis. The working patterned layer is arranged on the substrate. The resilient structure is arranged on the second surface. The resilient structure includes a composite layer and a supporting layer, which keep attaching to each other. The composite layer has curve-able segments, each of which is parallel to the axis and connects to the first and second edges. The resilient structure is transformed to contain multiple wavy segments when the resilient substrate structure is at the retraction state. An electronic device including the resilient substrate structure and electronic elements is also disclosed.
An electronic device includes a substrate, plural varactors, a memory element, a driving unit and plural antenna elements. Each varactor is defined with a capacitor-voltage characteristic curve. The memory element is defined with one or more lookup tables for recording the capacitance values and varactor voltage values of the capacitor-voltage characteristic curve. The driving unit outputs plural voltage signals respectively to the varactors, and each voltage signal respectively provided with one varactor voltage value. Each antenna element is provided with various phase values in response to the capacitance values of the corresponding varactor. A selective one of the varactor voltage values in response to the required capacitance value of the corresponding varactor is found out from the lookup table(s) and delivered by the driving unit. The antenna elements are together enabled to form a wave beam with a characteristic wavefront in accordance with the capacitance values.
H01Q 3/36 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture varying the phase by electrical means with variable phase-shifters
H01Q 3/26 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture
A substrate structure includes a substrate and plural conductive structures. The substrate has a substrate body, plural through holes penetrating the substrate body, and two conductive patterns formed on two opposite surfaces of the substrate body respectively. The substrate body is defined with two openings, a hole wall, and a surface roughness along the hole wall. The conductive structures are respectively oriented at the through holes. Each conductive structure is defined with two larger-diameter caps, and a small-diameter segment linking the two larger-diameter caps. In each conductive structure, the two larger-diameter caps are respectively located at the two openings and electrically connected the two conductive patterns, and the surface roughness of the small-diameter segment is less than the surface roughness of the hole wall of a corresponding one of the through holes.
An electronic device with high density for component arrangement includes a first substrate, a second substrate, a plural of passages formed through the first and the second substrates, a first contact arranged on the first face of the first substrate to conceal the corresponding one of the passages, a second contact arranged on the second substrate and adjacent to the corresponding one of the passages, and a conductor disposed in the passages. A first end of the conductor electrically connects the first contact, while a second end of the conductor electrically connects the second contact.
A display device includes a display module and a light-shielding structure. The display module has a substrate, a plurality of photoelectric units and a protective layer. The substrate defines with a first surface and a second surface. The photoelectric units are arranged on the first surface of the substrate, and each photoelectric unit has at least one photoelectric element. The protective layer is arranged on the first surface of the substrate and is filled between the photoelectric elements. The light-shielding structure is arranged on and connected to the protective layer. The light-shielding structure has a light-shielding layer including light-absorption materials and a plurality of windows defined in the light-shielding layer. The windows respectively correspond to the photoelectric units, and the photoelectric units are viewed through the corresponding windows in the direction perpendicular to the first surface of the substrate.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 33/46 - Reflective coating, e.g. dielectric Bragg reflector
H01L 33/22 - Roughened surfaces, e.g. at the interface between epitaxial layers
40.
Electronic device beneficial of retaining slightly power drop
An electronic device includes a first substrate, multiple unit tiles, multiple electrical components, multiple holes, and multiple conductors. The first substrate includes a first patterned trace, multiple driving members electrically connected with the first patterned trace, and multiple pads electrically connected with the first patterned trace and respectively corresponding with the driving members. Each of the unit tiles defines a second face and a first face opposing to each other, the electrical components are disposed on the second faces of the unit tiles, and the conductors are exposed from the first faces of the unit tiles and respectively corresponding with the electrical components. The conductors are arranged in the holes respectively and overlapping the pads of the first substrate respectively for electrically connecting the electrical components to the pads of the first substrate, wherein the conductors are underneath the second faces of the unit tiles.
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
H10D 86/60 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
H10H 20/857 - Interconnections, e.g. lead-frames, bond wires or solder balls
41.
METHOD FOR FABRICATING SEMICONDUCTOR CHIP STRUCTURES, SEMICONDUCTOR CARRIER AND SEMICONDUCTOR CHIP STRUCTURE
A method for fabricating semiconductor chip structures, which comprises steps of: providing plural slice units tiled with one another on a process carrier, wherein each slice unit is made from a wafer and includes a substrate with an outline, and a gap is formed between adjacent two of the slice units; planarizing tops of the slice units; accomplishing circuits on the slice units and turning them into circuited slice units; and forming plural semiconductor chip structures individually with each other by at least breaking down the circuited slice units; wherein a planar size of one slice unit is no less than that of a corresponding semiconductor chip structure, or the planar size of one slice unit is no less than multiple of the planar size of the corresponding semiconductor chip structure. A semiconductor carrier and a semiconductor chip structure made by the method are also provided.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
H01L 21/18 - Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
42.
Substrate structure with high density layout and electronic device using the same
A substrate structure includes a carrier board and a laminated structure. The carrier board has a board body, through holes and conductive portions. The board body has a first surface and a second surface. The through holes communicate the first and second surfaces. Each through hole has a first opening and a second opening. The conductive portions are arranged on the first surface, and the first opening is sealed by a corresponding conductive portion. The laminated structure includes a viscid layer and conductive elements. One surface of the viscid layer is in surface contact with the second surface. Each conductive element passes through and accommodates in the viscid layer, and corresponds to one through hole in a projection direction of the carrier board. One end of each conductive element is electrically connected to one conductive portion through the corresponding through hole.
H01L 33/48 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor body packages
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
43.
Substrate structure and manufacturing method thereof, electronic device
A substrate structure, a manufacturing method thereof, and an electronic device. The substrate structure includes a substrate, conductive wires and conductive members. Multiple through holes penetrate through the substrate body of the substrate. Multiple first conductive pads are arranged on the first surface of the substrate body. Multiple second conductive pads are arranged on the second surface of the substrate body. The conductive wires are accommodated in the through holes and each has a first end in the first opening of corresponding through hole and a second end in the second opening of corresponding through hole. The conductive members are distributed on the first and second surfaces, and both ends thereof are connected to the corresponding first and second conductive pads through the conductive members. At least part of each conductive wire does not contact the hole wall of each through hole in a direct manner.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
An electronic device includes a supporting board, an electrical board and electronic units. The supporting board includes a circuit layer. The electrical board has a board body, through holes through the board body, an electrical layer on the board body, and primary conductive elements respectively in the through holes. The board body has opposite first and second surfaces. The through holes communicate with the first surface and the second surface. The primary conductive elements electrically connect the electrical layer to the circuit layer. The electronic units are arranged on the first surface. Each electronic unit partially overlaps with one corresponding through hole in a projection direction of the electrical board. Each electronic unit has an electronic component and a secondary conductive element electrically connecting the electronic component to the electrical layer. The secondary conductive elements and the primary conductive elements are arranged in dislocation in the projection direction.
An electronic device includes a sustaining layer, multiple substrates, multiple photoelectric units, multiple signal layers, multiple driving structures, and a constraining structure. The substrates are arranged on a contact surface of the sustaining layer. A first end edge of at least one substrate approaches a first end edge of the sustaining layer, and a first side edge of one substrate is adjacent to a second side edge of another substrate. The photoelectric units are arranged on the first or/and second surfaces of the substrates. The signal layers are arranged on the substrates and electrically connected to the photoelectric units. The driving structures are electrically connected to the substrates and disposed close to the first or second end edge of the sustaining layer. The constraining structure constrains the first or second end edge of the sustaining layer, and at least one driving structure is accommodated in the constraining structure.
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
H01L 23/528 - Layout of the interconnection structure
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
An electronic device includes a circuit board, a plurality of carrier boards, a plurality of photoelectric elements, and a plurality of driving elements. The circuit board has a first conductive layer. The carrier boards are arranged on the circuit board with a component distance in a direction. Each carrier board has a substrate and a second conductive layer. The second conductive layer is disposed on the substrate and electrically connected to the first conductive layer of the circuit board. The substrate defines a substrate area, and each photoelectric element defines an element area. The ratio of the substrate area to the element area is not less than 5. The driving elements are disposed on the circuit board or the carrier boards. The driving elements are electrically connected to the first conductive layer and the second conductive layers, and drive the photoelectric elements.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
A light-emitting device comprises a transparent substrate, a reflection structure and a light-emitting unit. The transparent substrate is defined with a first surface and a second surface opposite to each other. The reflection structure is disposed on and contacts the second surface of the transparent substrate. The reflection structure includes a reflection layer and a circuit layer. The reflection structure is configured to define a light-transmitting window. The light-emitting unit is disposed corresponding to the light-transmitting window. The light-emitting unit is electrically connected to the circuit layer of the reflection structure, and one optical path of the light-emitting unit passes through the light-transmitting window.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
An electronic device and a manufacturing method thereof are provided. The pattern circuit of each surface mount structure of the electronic device is disposed on the substrate; at least two through holes are respectively corresponding to at least two signal lines of the pattern circuit; and the two ends of at least one optoelectronic element are respectively electrically connected to at least two signal lines of the pattern circuit. Each connection pad group of the driving circuit board is corresponding to each surface mount structure, and at least two connection pads are respectively corresponding to the at least two through holes of the surface mount structure. At least two conductive members of each conductive member unit are disposed in the at least two through holes of the surface mount structure, respectively, and extending to the first surface and the second surface of the substrate. The conductive member disposed in each through hole electrically connects the signal lines of each surface mounting structure to the connection pads of each connection pad group of the driving circuit board.
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
An electronic device comprises plural first substrates, plural photoelectric structures, a third substrate, plural driving units, plural conductive layers and plural first conductive structures. The first substrates are arranged in coplanar in a first direction. The photoelectric structures are arranged in coplanar in the first direction and disposed on the first substrate. Each photoelectric structure has a second substrate, a signal layer and a photoelectric component. The photoelectric component is electrically connected to the signal line of the signal layer. One of the photoelectric structures straddles two adjacent first substrates. The third substrate is connected to the first substrate or the photoelectric structure. The driving units are distributed on the first substrate or the photoelectric structure, and the driving units correspondingly drive the photoelectric components of the photoelectric structures. The optoelectronic structures are electrically connected to the conductive layers via the first conductive structures, respectively.
H01L 29/04 - Semiconductor bodies characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
H01L 29/10 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
H01L 31/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
H01L 31/0392 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates
H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H01L 31/0352 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
09 - Scientific and electric apparatus and instruments
35 - Advertising and business services
42 - Scientific, technological and industrial services, research and design
Goods & Services
Monitors, computer hardware; wearable video display monitors; LED monitors; light-emitting diodes; display; image transfer apparatus; apparatus and instruments for transferring, receiving and storing sound, images and data, both in digital and analog form; touch panels; touch pads for computers; touchscreen monitors; monitoring apparatus, other than for medical purposes; video screens; interactive touch screen terminals. Business intermediary and advisory services in the field of product sales; providing commercial information and advice for consumers in the choice of products and services; providing an on-line commercial information directory on the Internet; providing consumer product information via the Internet; import-export agency services. Providing research and development; research and development of new products for others; technological research; conducting technical project studies; technical writing; industrial analysis and research services; design consultancy.
09 - Scientific and electric apparatus and instruments
Goods & Services
monitors being computer hardware; wearable video display monitors; LED monitors; light-emitting diodes; display, namely, electronic display boards, plasma display boards, electronic display screens; apparatus for transmitting images; apparatus and instruments for transferring, receiving and storing sound, images and data, both in digital and analog form; touch panels; touch pads for computers; touchscreen monitors; monitoring apparatus, other than for medical purposes, namely, wireless controllers to monitor and control the functioning of other electronic devices excluding gaming apparatus; video screens; interactive touch screen terminals
42 - Scientific, technological and industrial services, research and design
Goods & Services
providing research and development in the field of LCD backlight panels, thin-film process-related technology for product innovation, thin-film technology hubs, smart home hubs comprised of voice-activated speakers, computer hardware and downloadable software for controlling network devices in the internet of things (IoT), flexible panel displays, flexible curved displays, micro light emitting diodes (micro-LEDs) displays, mini light emitting diodes (mini-LEDs) displays, flexible light emitting diodes (LEDs) displays, flexible curved displays for innovative communications, apparatus for transmitting and/or receiving electromagnetic waves, and electromagnetic waves communication apparatus comprised of phased array elements or devices; research and development of new products for others; technological research in the field of LCD backlight panels, thin-film process-related technology for product innovation, thin-film technology hubs, smart home hubs comprised of voice-activated speakers, computer hardware and downloadable software for controlling network devices in the internet of things (IoT), flexible panel displays, flexible curved displays, micro light emitting diodes (micro-LEDs) displays, mini light emitting diodes (mini-LEDs) displays, flexible light emitting diodes (LEDs) displays, flexible curved displays for innovative communications, apparatus for transmitting and/or receiving electromagnetic waves, and electromagnetic waves communication apparatus comprised of phased array elements or devices; conducting technical project studies in the field of LCD backlight panels, thin-film process-related technology for product innovation, thin-film technology hubs, smart home hubs comprised of voice-activated speakers, computer hardware and downloadable software for controlling network devices in the internet of things (IoT), flexible panel displays, flexible curved displays, micro light emitting diodes (micro-LEDs) displays, mini light emitting diodes (mini-LEDs) displays, flexible light emitting diodes (LEDs) displays, flexible curved displays for innovative communications, apparatus for transmitting and/or receiving electromagnetic waves, and electromagnetic waves communication apparatus comprised of phased array elements or devices; technical writing; industrial analysis and research service in the field of LCD backlight panels, thin-film process-related technology for product innovation, thin-film technology hubs, smart home hubs comprised of voice-activated speakers, computer hardware and downloadable software for controlling network devices in the internet of things (IoT), flexible panel displays, flexible curved displays, micro light emitting diodes (micro-LEDs) displays, mini light emitting diodes (mini-LEDs) displays, flexible light emitting diodes (LEDs) displays, flexible curved displays for innovative communications, apparatus for transmitting and/or receiving electromagnetic waves, and electromagnetic waves communication apparatus comprised of phased array elements or devices; design consultancy in the field of LCD backlight panels, thin-film process-related technology for product innovation, thin-film technology hubs, smart home hubs comprised of voice-activated speakers, computer hardware and downloadable software for controlling network devices in the internet of things (IoT), flexible panel displays, flexible curved displays, micro light emitting diodes (micro-LEDs) displays, mini light emitting diodes (mini-LEDs) displays, flexible light emitting diodes (LEDs) displays, flexible curved displays for innovative communications, apparatus for transmitting and/or receiving electromagnetic waves, and electromagnetic waves communication apparatus comprised of phased array elements or devices
business intermediary and advisory services in the field of product sales; providing commercial information and advice for consumers in the choice of products and services; Providing an on-line commercial information directory on the internet; providing consumer product information via the Internet; import-export agency services
A package structure and an electronic device including the package structure are disclosed. The package structure includes a substrate, a wire layer disposed on the substrate, a visual unit disposed on the substrate, and an encapsulation element disposed on the substrate. The wire layer includes a plurality of patterned circuits. The visual unit includes a first area and a second area defined along a periphery of the first area. The first area is configured with a photoelectric element, and the photoelectric element is electrically connected to and disposed corresponding to at least one of the patterned circuits. The encapsulation element completely covers the first area of the visual unit and overlaps the corresponding patterned circuit, such that an average reflectance inside the encapsulation element is greater than an average reflectance outside the encapsulation element.
An electronic device comprises at least one sub matrix unit, a driving circuit board, and at least one surface mount device. The sub matrix unit comprises a substrate, thin-film circuits and first connecting pads. The thin-film circuits and the first connecting pads are disposed on the operation face of the substrate. The sub matrix unit defines a loading face and comprises second connecting pads, at least one first conductive line, and at least one second conductive line all together arranged on the loading face. A second height defined between a top of the surface mount device and the loading face of the driving circuit board is no less than a first height defined between an uppermost face of the sub matrix unit and the loading face of the driving circuit board.
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
56.
Electronic device and manufacturing method of the same
An electronic device and manufacturing method of the electronic device are disclosed. The manufacturing method includes: providing a substrate; forming a thin film circuit on the substrate, wherein the thin film circuit comprises at least one thin film transistor and at least one conductive trace; forming at least one first connection pad on the substrate, wherein the first connection pad is electrically connected with the thin film transistor through the conductive trace; disposing the substrate on a driving circuit board, wherein the driving circuit board comprises at least one second connection pad adjacent to and corresponding to the first connection pad; and forming a conductive member covering at least a part of the second connection pad and the first connection pad, wherein the second connection pad is electrically connected with the first connection pad through the conductive member.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H05K 1/14 - Structural association of two or more printed circuits
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
H01L 21/77 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
A display apparatus and manufacturing method thereof are disclosed. The manufacturing method comprises: providing at least one sub-matrix unit, wherein each thin-film circuit comprises at least one thin-film transistor and at least one conductive line, the thin-film transistor is electrically connected with the conductive line, and the first connecting pads are electrically connected with the thin-film transistor through the conductive line; disposing the sub-matrix unit on a driving circuit board, wherein the second connecting pads are disposed facing to the first connecting pads and correspondingly connected to the first connecting pads, respectively, and the scan line and the data line are electrically connected with the corresponding first connecting pads through the second connecting pads; and disposing at least one surface mount device on the driving circuit board, wherein the surface mount device is electrically connected with the corresponding first connecting pads through the second connecting pads.
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
G09G 3/3266 - Details of drivers for scan electrodes
G09G 3/3275 - Details of drivers for data electrodes
H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
58.
Electronic device having individual wrapping of electronic package units and manufacturing method thereof
An electronic package unit, a manufacturing method thereof and an electronic device are disclosed. The manufacturing method includes: providing an insulation substrate, wherein the insulation substrate has a first surface and a second surface opposite to the first surface; forming a plurality of sub-matrix circuits on the insulation substrate, wherein each sub-matrix circuit comprises at least one thin film transistor; disposing at least one functional chip on the first surface, wherein the functional chip is electrically connected with the sub-matrix circuit; forming a plurality of through-holes on the insulation substrate and disposing a conductive material in the through-holes, so that the functional chip is electrically connected to the second surface through the sub-matrix circuits and the conductive material; forming a protection layer on the first surface to cover the functional chips; and cutting the insulation substrate and the protection layer to form a plurality of electronic package units.
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 23/00 - Details of semiconductor or other solid state devices
59.
Electronic device and manufacturing method thereof
An electronic device and a manufacturing method thereof are disclosed. The manufacturing method of an electronic device includes following steps: forming a flexible substrate on a rigid carrier plate; forming at least a thin-film device on the flexible substrate; forming a conductive line on the flexible substrate, wherein the conductive line is electrically connected with the thin-film device; forming at least an electrical connection pad on the flexible substrate, wherein the electrical connection pad is electrically connected with the conductive line, and the thickness of the electrical connection pad is between 2 and 20 microns; disposing at least a surface-mount device (SMD) on the flexible substrate, wherein the SMD is electrically connected with the thin-film device through the electrical connection pad and the conductive line; and removing the rigid carrier plate.
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
H01L 27/30 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for either the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 21/3213 - Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
60.
Semiconductor chip module with stacked flip-chip unit
A semiconductor chip module includes a first flip-chip unit and a second flip-chip unit. The first flip-chip unit has a first chip and a first glass circuit board. The first chip is connected with the first glass circuit board by flip-chip bonding. The second flip-chip unit has a second chip and a second glass circuit board. The second chip is connected with the second glass circuit board by flip-chip bonding. The first flip-chip unit and the second flip-chip unit are attached to each other. A method for manufacturing the semiconductor chip module is also disclosed.
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
A light emitting device includes at least one light emitting unit, a switching unit, a comparator unit, a charge storage unit and a sensing unit. The switching unit is electrically connected to the light emitting unit. The comparator unit is electrically connected to the switching unit. The charge storage unit is electrically connected to the comparator unit and stores an amount of electric charges. The sensing unit has a light sensing circuit and is electrically connected to the charge storage unit. The light sensing circuit senses a light intensity of the light emitting unit. The sensing unit adjusts the amount of the electric charges and a voltage corresponding to the amount of the electric charges according to the light intensity. The comparator unit compares the voltage with a threshold voltage. The switching unit controls the light emitting unit in accordance with the result of the comparison.
G01J 1/32 - Photometry, e.g. photographic exposure meter by comparison with reference light or electric value intensity of the measured or reference value being varied to equalise their effects at the detector, e.g. by varying incidence angle using variation of intensity or distance of source using electric radiation detectors adapted for automatic variation of the measured or reference value
