Abstract

A multilayer ceramic capacitor and a method of manufacturing the same are disposed. The multilayer ceramic capacitor includes: a body including a plurality of internal electrodes and a dielectric layer interposed between the plurality of internal electrodes; and external electrodes disposed on the body and connected to the internal electrodes, respectively. One of the external electrodes includes a first plating layer, and the first plating layer includes a crystal grain in which an average ratio of major and minor axes thereof is 1:1 to 3:1.

IPC Classes  ?

• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/12 - Ceramic dielectrics
• H01G 4/248 - Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
• H01G 4/30 - Stacked capacitors

Abstract

A printed circuit board includes a wiring portion including one or more insulating layers, one or more wiring layers respectively disposed on or in the one or more insulating layers, a first pad disposed on a lowermost insulating layer, of the one or more insulating layers, and a second pad disposed on an uppermost insulating layer, of the one or more insulating layers, a first solder resist layer disposed on a lower side of the wiring portion to cover at least a portion of the first pad, the first solder resist layer having a first opening, on the first pad, a second solder resist layer disposed on an upper side of the wiring portion to cover at least a portion of the second pad, a first surface treatment layer disposed on at least a portion of the first pad, and a barrier layer disposed on the first solder resist layer.

IPC Classes  ?

• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Abstract

A disclosed circuit board includes: a first insulating layer that has a first surface and a second surface opposing each other; a first wire layer that is buried within the first insulating layer; and a bump that includes a base portion disposed laterally to the first wire layer to be buried within the first insulating layer and a protrusion portion integrally extending and protruding from the base portion and having a width at an upper end thereof less than a width of the protrusion portion at a height of the first surface.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details

Abstract

A coil component includes a body including a first surface and a second surface opposing in a first direction, and a third surface and a fourth surface opposing in a second direction; a coil disposed in the body; a first lead-out electrode connected to an external end of the coil and drawn out to the first surface; a second lead-out electrode connected to an internal end of the coil and drawn out to the second surface; a first external electrode disposed on the third surface, extending to the first surface and connected to the first lead-out electrode; and a second external electrode disposed on the third surface, extending to the second surface and connected to the second lead-out electrode, wherein a thickness of each of the first and second lead-out electrodes in the second direction is smaller than a thickness of the coil in the second direction.

IPC Classes  ?

• H01F 27/29 - TerminalsTapping arrangements
• H01F 17/00 - Fixed inductances of the signal type
• H01F 27/32 - Insulating of coils, windings, or parts thereof

Abstract

An optical imaging system includes a first lens having an object-side surface that is convex; a second lens having a refractive power; a third lens having a refractive power; a fourth lens having a refractive power; a fifth lens having a refractive power and an object-side surface that is concave; and a sixth lens having a refractive power and an object-side surface that is concave, wherein the first lens through the sixth lens are sequentially disposed in numerical order from an object side of the optical imaging system toward an imaging plane, and the optical imaging system satisfies the conditional expressions 0.7

IPC Classes  ?

• G02B 9/62 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having six components only
• G02B 7/04 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 27/00 - Optical systems or apparatus not provided for by any of the groups ,
• G03B 30/00 - Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles

Abstract

A multilayer ceramic capacitor includes: a capacitor body that includes a dielectric layer and an internal electrode layer; and an external electrode that is disposed outside the capacitor body. The internal electrode layer includes nickel (Ni) and cerium (Ce), and along a thickness direction of the internal electrode layer, the internal electrode layer comprises an upper portion, a middle portion, and a lower portion, the middle portion is referred to as a central region, and at least one of the upper portion and the lower portion having an interface between the internal electrode layer and the dielectric layer is referred to as an interface region, both the central region and the interface region of the internal electrode layer include the cerium (Ce), and the interface region includes the cerium (Ce) in a content higher than a content of cerium (Ce) in the central region.

IPC Classes  ?

• H01G 4/008 - Selection of materials
• H01G 4/12 - Ceramic dielectrics
• H01G 4/30 - Stacked capacitors

Abstract

An optical imaging system includes a first lens group, including at least one lens disposed on a first optical axis, a second lens group, including at least one lens disposed on a second optical axis, perpendicular to the first optical axis, and a prism disposed between the first lens group and the second lens group to convert a light path from the first optical axis to the second optical axis. A conditional expression 0.20

IPC Classes  ?

• G02B 9/62 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having six components only
• G02B 5/04 - Prisms

Abstract

A multilayer electronic component includes a body including a dielectric layer and an internal electrode disposed on the dielectric layer, an external electrode including a base electrode layer connected to the internal electrode, and an interface layer disposed between an end of the dielectric layer and the base electrode layer. The interface layer includes a first glass containing Ba, Zn, and Si. The base electrode layer includes a second glass containing Ba and Si. When an average molar ratio (Ba/Si) of Ba to Si contained in the first glass is M1 and an average molar ratio (Ba/Si) of Ba to Si contained in the second glass is M2, M1 and M2 satisfy M1/M2≥1.5.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/008 - Selection of materials
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics

Abstract

An all-solid-state battery includes: a solid electrolyte layer; and a plurality of electrode layers disposed in a stacking direction with the solid electrolyte layer interposed between the plurality of electrode layers. At least one of the plurality of electrode layers includes: a current collector in which an active material accommodating portion is disposed; and an electrode active material layer disposed in the active material accommodating portion and also disposed at at least one surface of the current collector. The active material accommodating portion may include a plurality of slits provided in the current collector.

IPC Classes  ?

• H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
• H01M 4/04 - Processes of manufacture in general
• H01M 4/75 - Wires, rods, or strips
• H01M 50/46 - Separators, membranes or diaphragms characterised by their combination with electrodes

Abstract

A multilayer capacitor includes a body including a dielectric layer and first and second internal electrodes, first external electrodes respectively be connected to the first internal electrode and second external electrodes respectively connected to the second internal electrode. The first internal electrode includes a first main portion and a first lead-out portion. The first lead-out portion includes a first inclined portion and a first connection portion. The first inclined portion is connected to the first main portion and has a side surface, at least a portion of which is inclined with respect to a side surface of the first main portion connected thereto. The first connection portion is connected to the first inclined portion and the first external electrode, and has a side surface, at least a portion of which is inclined with respect to the side surface of the first inclined portion connected thereto.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/008 - Selection of materials
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor

Abstract

A multilayer electronic component according to an example embodiment may include: a body including a plurality of dielectric layers, a first internal electrode, a second internal electrode, and a margin pattern; and an external electrode disposed on the body. The first and second internal electrodes may be alternately disposed in a first direction with the dielectric layer interposed therebetween, and the margin pattern may be disposed in a position different from the first and second internal electrodes in the first direction and may be disposed so as not to overlap the first internal electrode or the second internal electrode in the first direction.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• C04B 35/64 - Burning or sintering processes
• H01G 4/008 - Selection of materials
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics

Abstract

A release film including: a base film; and a release layer disposed on one surface of the base film, wherein the release layer is a cured layer of a release composition including a heterocyclic compound including nitrogen and polydimethylsiloxane, and when analyzing a surface using X-ray photoelectron spectroscopy (XPS), the release layer has an atomic ratio of nitrogen (N) to silicon (Si) (N/Si) of 0.6 to 1.1.

IPC Classes  ?

• H01G 4/008 - Selection of materials
• C04B 37/00 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating
• C04B 41/45 - Coating or impregnating
• C04B 41/51 - Metallising
• C08K 5/42 - Sulfonic acidsDerivatives thereof
• C09D 5/16 - Anti-fouling paintsUnderwater paints
• C09D 7/63 - Additives non-macromolecular organic
• C09D 183/08 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
• H01G 4/12 - Ceramic dielectrics
• H01G 4/30 - Stacked capacitors

Abstract

Provided is a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes a capacitor body including a dielectric layer and an internal electrode layer, and an external electrode disposed outside the capacitor body. The dielectric layer includes barium titanate-based main ingredient including barium (Ba) and titanium (Ti), and gallium (Ga)Peak intensity ratio of Ba/Ga (IBa/IGa), obtained by TEM-EDS analysis of a region from an interface between the dielectric layer and the internal electrode layer to a depth surface of 10 nm to 500 nm into the dielectric layer, is 1.0 to 5.0.

IPC Classes  ?

• H01G 4/12 - Ceramic dielectrics
• H01G 4/30 - Stacked capacitors

Abstract

A charge pump system and method of operating the same are provided. The charge pump system includes a charge pump circuit configured to convert an input voltage to an output voltage; a comparator configured to compare the output voltage with a reference voltage, and output a control signal that corresponds to a result of the comparing; a driver configured to generate the input voltage in response to an operation clock signal, and provide the generated input voltage to the charge pump circuit; and a selector configured to provide one of a first clock signal of a first frequency and a second clock signal of a second frequency lower than the first frequency as the operation clock signal to the driver, based on the control signal.

IPC Classes  ?

• H02M 3/07 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode
• H03K 5/24 - Circuits having more than one input and one output for comparing pulses or pulse trains with each other according to input signal characteristics, e.g. slope, integral the characteristic being amplitude

Abstract

A coil component includes a coil component includes a body including a first surface and a second surface opposing each other in a first direction; a coil disposed in the body and including a plurality of coil layers; an insulating layer disposed in each of regions between the plurality of coil layers; an external electrode disposed on the first surface of the body; and a connection portion disposed in the body, connecting one of the plurality of coil layers to the external electrode, and having one surface in contact with the one of the plurality of coil layers and the other surface in contact with the external electrode. The connection portion includes a fusion portion disposed on an end thereof to be in contact with the one of the plurality of coil layers.

IPC Classes  ?

• H01F 27/28 - CoilsWindingsConductive connections
• H01F 27/02 - Casings
• H01F 27/29 - TerminalsTapping arrangements

Abstract

A lens module includes: a first lens having negative refractive power; a second lens having positive refractive power; a third lens having negative refractive power; a fourth lens having negative refractive power; a fifth lens of which an object-side surface is concave; and a sixth lens having one or more inflection points on an image-side surface thereof, wherein the first to sixth lenses are sequentially disposed from an object side of the lens module to an image side of the lens module.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/62 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having six components only

Abstract

A lens module may include a first lens having positive refractive power; a second lens having positive refractive power; a third lens having negative refractive power; a fourth lens having refractive power; a fifth lens having refractive power; a sixth lens having negative refractive power; and a seventh lens having refractive power and one or more inflection points formed in locations thereof not crossing an optical axis, wherein the first lens, the second lens, the third lens, the fourth lens, the fifth lens, the sixth lens and the seventh lens are disposed in a sequential order from the first lens to the seventh lens.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components
• G02B 27/00 - Optical systems or apparatus not provided for by any of the groups ,

Abstract

A printed circuit board includes: a core substrate including a plurality of core layers; a plurality of magnetic members embedded in each of the plurality of core layers; a first coil pattern disposed on the core substrate; and a second coil pattern disposed below the core substrate.

IPC Classes  ?

• H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• H01F 27/24 - Magnetic cores
• H01F 27/28 - CoilsWindingsConductive connections
• H01F 27/30 - Fastening or clamping coils, windings, or parts thereof togetherFastening or mounting coils or windings on core, casing, or other support
• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

An all-solid-state battery includes: a solid electrolyte layer; and a first electrode layer and a second electrode layer arranged with the solid electrolyte layer therebetween. The first electrode layer and second electrode layer respectively include a current collector including first current collecting portions spaced from each other by through holes in a first direction and second current collecting portions spaced from each other by the through holes in a second direction that is vertical to the first direction and crossing the first current collecting portions, and an electrode active material layer including a first layer disposed on one surface of the current collector and a second layer disposed in the through holes in the current collector.

IPC Classes  ?

• H01M 4/70 - Carriers or collectors characterised by shape or form
• H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
• H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulatorsProcesses of manufacture thereof
• H01M 4/74 - Meshes or woven materialExpanded metal
• H01M 4/75 - Wires, rods, or strips
• H01M 4/76 - Containers for holding the active material, e.g. tubes, capsules
• H01M 10/052 - Li-accumulators

Abstract

The present disclosure relates to a printed circuit board including: an insulating layer; a through-hole penetrating between an upper surface and a lower surface of the insulating layer opposing in a thickness direction; a metal wiring disposed inside the through-hole; and a metal via filling the through-hole and covering the metal wire.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/42 - Plated through-holes

Abstract

An optical imaging system includes a first lens having a positive refractive power, a second lens having a positive refractive power, a third lens having a positive refractive power, a fourth lens having a negative refractive power, a fifth lens having a positive refractive power, wherein an object-side surface of the fifth lens is concave; and a sixth lens having a negative refractive power, wherein the sixth lens has an inflection point formed on an image-side surface thereof, wherein the first to sixth lenses are sequentially disposed from an object side toward an imaging plane.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 5/00 - Optical elements other than lenses
• G02B 5/20 - Filters
• G02B 9/62 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having six components only

Abstract

A composite solid electrolyte according to the present disclosure includes a Garnet-type solid electrolyte and a LISICON-type solid electrolyte containing Cl element. The LISICON-type solid electrolyte is represented by LiaMbPcCldOe, in which M includes Zn, Al, Ga, Si, Ge, Ti, Mg, or a combination thereof, and a, b, c, d, and e are molar ratios of each component and satsify 5≤a≤12, 0

IPC Classes  ?

• H01M 10/0562 - Solid materials
• H01M 10/0525 - Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodesLithium-ion batteries

Abstract

A multilayer electronic component is provided, the multilayer electronic component including: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; an external electrode disposed externally on the body; and a frame terminal including a connection portion disposed on the external electrode and extending in a first direction, a mounting portion spaced apart from the connection portion and extending in a second direction, intersecting the first direction, and a linking portion connecting the connection portion and the mounting portion, wherein the linking portion includes an inward portion extending inwardly from one end of the connection portion in the second direction and an outward portion extending outwardly from one end of the inward portion in the second direction, wherein, when an angle formed by the inward portion and the outward portion is defined as θ, the angle θ satisfies 10°≤θ≤150°.

IPC Classes  ?

• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/30 - Stacked capacitors

Abstract

The present disclosure relates to a printed circuit board including a first insulating layer, a pad disposed on an upper side of the first insulating layer, a protrusion disposed on the pad; and a metal post disposed on the pad and covering the protrusion, wherein the metal post has a tapered shape, such that a width of an upper surface of the metal post is smaller than a width of a lower surface of the metal post, and a method of manufacturing the printed circuit board.

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/498 - Leads on insulating substrates
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Abstract

A printed circuit board includes a glass layer, a through-hole penetrating through the glass layer, a seed layer provided along an inner wall of the through-hole, and a through-via disposed on the seed layer and filling the through-hole. The seed layer includes a carbon-based conductive material.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/03 - Use of materials for the substrate

Abstract

A multilayer electronic component may include a body including a capacitance forming portion including a dielectric layer including a plurality of dielectric grains, and a plurality of internal electrodes alternately disposed to be stacked with the dielectric layer; and an external electrode disposed on the body, wherein the plurality of dielectric grains include a first dielectric grain including a nano domain that is a domain region with a major diameter of 10 nm to 100 nm, and a second dielectric grain including a polar nano region including a domain region with a major diameter of less than 10 nm, and when the number of the first dielectric grains included in the capacitance forming portion is ND, and the number of the second dielectric grains included in the capacitance forming portion is RD, 50%

IPC Classes  ?

• H01G 4/12 - Ceramic dielectrics
• H01G 4/30 - Stacked capacitors

Abstract

A multilayer electronic component includes a body including a capacitance formation portion that is a region a dielectric layer and internal electrodes alternately arranged with the dielectric layer interposed therebetween in a first direction and including first and second surfaces opposing each other in the first direction, and external electrodes disposed on the body. The body further includes cover portions disposed on one side and the other surface of the capacitance formation portion in the first direction. A surface of one of the cover portions includes a flat portion forming the first surface or the second surface, a protrusion protruding from the first surface or the second surface in the first direction, and a recess portion concave from the first surface or the second surface in the first direction. One end of the protrusion is spaced apart from the recess portion and is disposed on the recess portion.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor

Abstract

An optical imaging system includes a first lens group including a first lens and a second lens, a second lens group including a third lens, a fourth lens, and a fifth lens, and a third lens group including a sixth lens and a seventh lens. The first to seventh lenses are arranged in order from an object side, at least one of the first lens group to the third lens group is moved on an optical axis to change a distance between the first lens group to the third lens group, and the following conditional expression is satisfied: An optical imaging system includes a first lens group including a first lens and a second lens, a second lens group including a third lens, a fourth lens, and a fifth lens, and a third lens group including a sixth lens and a seventh lens. The first to seventh lenses are arranged in order from an object side, at least one of the first lens group to the third lens group is moved on an optical axis to change a distance between the first lens group to the third lens group, and the following conditional expression is satisfied: 0.2 < BFL / ( 2 * IMG ⁢ HT ) < 2. where BFL is a distance on the optical axis from an image-side surface of the seventh lens to an imaging surface of an image sensor, and IMG HT is half a diagonal length of the imaging surface of the image sensor.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components
• G02B 13/02 - Telephoto objectives, i.e. systems of the type + – in which the distance from the front vertex to the image plane is less than the equivalent focal length
• H04N 23/55 - Optical parts specially adapted for electronic image sensorsMounting thereof

Abstract

An optical imaging system is provided. The optical imaging system includes a first lens, a second lens, a third lens, and a fourth lens arranged in order from an object side toward an image plane, wherein the first lens may be formed of glass, and wherein a conditional expression 70

IPC Classes  ?

• G02B 9/12 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having three components only
• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 27/00 - Optical systems or apparatus not provided for by any of the groups ,

Abstract

A printed circuit board including: an insulating layer; a wiring layer disposed on an outermost side of the insulating layer and including a first pad and a first pattern; a first post disposed on the first pattern; and a resist layer disposed on the insulating layer and covering the wiring layer and the first post, wherein the resist layer may have a first protrusion in a region covering the first post and may have a first opening exposing the first pad from the resist layer.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

A coil component includes a body having a first surface, a second surface opposing the first surface in a first direction, and side surfaces connecting the first surface and the second surface to each other, a support member disposed in the body, a coil disposed on each of one surface of the support member and the other surface of the support member opposing the one surface in the first direction, including first and second lead-out portions respectively extending to a first side surface and a second side surface of the body opposing each other in a second direction, and a first dummy lead-out portion disposed on the other surface of the support member, and connected to the first lead-out portion. W2/W1 satisfies 0.3 or more and 0.8 or less, W1 is a width of the first lead-out portion, W2 is a width of the first dummy lead-out portion.

IPC Classes  ?

• H01F 27/28 - CoilsWindingsConductive connections
• H01F 27/02 - Casings
• H01F 27/29 - TerminalsTapping arrangements
• H01F 27/30 - Fastening or clamping coils, windings, or parts thereof togetherFastening or mounting coils or windings on core, casing, or other support

Abstract

A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; and an external electrode disposed on the body. The external electrode includes a first electrode layer in contact with the internal electrode and a second electrode layer disposed on the first electrode layer. The first electrode layer includes Cu, the second electrode layer includes Cu and SiC, and an area fraction of SiC in the second electrode layer is 5% or more and 20% or less. Moisture resistance reliability and adhesion strength of a multilayer electronic component may be improved.

IPC Classes  ?

• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/30 - Stacked capacitors

Abstract

A solid oxide cell according to an embodiment includes: a fuel electrode and an air electrode that face each other; and an electrolyte electrode that is disposed between the fuel electrode and the air electrode. The fuel electrode has a plate shape, an edge of the fuel electrode is rounded along a thickness direction of the fuel electrode, the fuel electrode includes a central layer and an outer layer disposed on both sides of the central layer, and a first porosity, which is a porosity of the central layer of the fuel electrode, is smaller than a second porosity, which is a porosity of the outer layer of the fuel electrode.

IPC Classes  ?

• C25B 11/031 - Porous electrodes
• C25B 9/19 - Cells comprising dimensionally-stable non-movable electrodesAssemblies of constructional parts thereof with diaphragms
• C25B 9/77 - Assemblies comprising two or more cells of the filter-press type having diaphragms
• C25B 13/07 - DiaphragmsSpacing elements characterised by the material based on inorganic materials based on ceramics
• H01M 4/86 - Inert electrodes with catalytic activity, e.g. for fuel cells
• H01M 8/12 - Fuel cells with solid electrolytes operating at high temperature, e.g. with stabilised ZrO2 electrolyte
• H01M 8/2404 - Processes or apparatus for grouping fuel cells
• H01M 8/2432 - Grouping of unit cells of planar configuration

Abstract

An all-solid-state battery includes a solid electrolyte layer and a first electrode layer and a second electrode layer disposed in a stacking direction with the solid electrolyte layer interposed therebetween, and having different polarities. Each of the first electrode layer and the second electrode layer includes a central portion and an outer portion located outside the central portion. The central portions of the first electrode layer and the second electrode layer overlap each other and overlap the solid electrolyte layer in the stacking direction. The outer portions of the first electrode layer and the second electrode layer overlap the solid electrolyte layer in the stacking direction, and have corner portions located on opposite sides to each other along a diagonal direction in different electrode layers.

IPC Classes  ?

• H01M 10/0562 - Solid materials
• H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
• H01M 50/593 - SpacersInsulating plates

Abstract

The disclosed multilayer ceramic capacitor includes a ceramic main body including a first surface and a second surface facing in a first direction, a third surface and a fourth surface facing in a second direction and connecting the first surface and the second surface, and a fifth surface and a sixth surface facing in a third direction and connecting the first surface and the second surface, an internal electrode disposed inside the ceramic main body, a protective layer disposed on the third surface and the fourth surface of the ceramic main body, and a connection electrode covering the protective layer. The protective layer includes a first protective layer disposed on the third surface and a second protective layer disposed on the fourth surface, and has openings positioned on the third surface and the fourth surface.

IPC Classes  ?

• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/30 - Stacked capacitors

Abstract

A multilayered capacitor includes: a body including a first internal electrode and a second internal electrode disposed in a first direction while having a dielectric layer therebetween; and a first external electrode and a second external electrode respectively disposed at ends of the body in a second direction. The first internal electrode includes a first capacitance forming portion and a plurality of first lead portions extending from the first capacitance forming portion to connect to the first external electrode. The second internal electrode includes a second capacitance forming portion overlapping the first capacitance forming portion in the first direction and a plurality of second lead portions extending from the second capacitance forming portion to connect to the second external electrode. For a thickness in the first direction, one of the plurality of the first lead portion has a thickness smaller than a thickness of the first capacitance forming portion.

IPC Classes  ?

• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/30 - Stacked capacitors

Abstract

An imaging lens system includes a first lens group, an optical path conversion element, and a second lens group arranged in order from an object side. An optical axis of the second lens group is disposed eccentrically in a direction with respect to a geometric optical axis of the optical path conversion element.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 3/00 - Simple or compound lenses
• G03B 17/17 - Bodies with reflectors arranged in beam forming the photographic image, e.g. for reducing dimensions of camera

Abstract

A multilayer capacitor may include a capacitor body including a dielectric layer and an internal electrode, and an external electrode disposed outside the capacitor body, where the capacitor body may include titanium (Ti) and indium (In), and in the entire capacitor body, the content of the indium (In) based on 100 moles of titanium (Ti) may be 0.2 moles to 4 moles.

IPC Classes  ?

• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/008 - Selection of materials
• H01G 4/12 - Ceramic dielectrics
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/30 - Stacked capacitors

Abstract

A printed circuit board includes: a first insulating layer; a cavity unit including a first cavity penetrating through a portion of the first insulating layer from an upper surface thereof in a thickness direction, and a second cavity penetrating through another portion of the first insulating layer from the first cavity; a first wiring layer disposed at an upper side of the first insulating layer; a second wiring layer disposed at a lower side of the first insulating layer; and a third wiring layer at least partially buried in the first insulating layer and disposed on a level between the first and second wiring layers in the thickness direction. The third wiring layer includes pads in which at least a portion of each of upper surfaces thereof is exposed from the first insulating layer through the cavity unit, and the first cavity has a wider cross-section than the second cavity.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

An imaging lens system is provided. The imaging lens system includes a first lens having refractive power, a second lens having refractive power, a third lens having a convex object-side surface, a fourth lens having refractive power, a fifth lens having refractive power, and a sixth lens having refractive power. The first lens to the sixth lens are sequentially arranged from an object side toward an imaging plane. The imaging lens system satisfies the conditional expressions TTL/f<1.0 and 0.9

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/62 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having six components only

Abstract

A printed circuit board includes a first wiring portion including a plurality of first wirings, a first integrated circuit chip connected to one side of the first wiring portion, the first integrated circuit chip configured to convert N signals into one signal, where N is a natural number, a second integrated circuit chip connected to an opposite side of the first wiring portion, the second integrated circuit chip configured to convert one signal into N signals, a second-first wiring portion connected to the first integrated circuit chip, the second-first wiring portion including a plurality of second-first wirings, and a second-second wiring portion connected to the second integrated circuit chip, the second-second wiring portion including a plurality of second-second wirings. X and Y1 satisfy Y1/N

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

A coil electronic component includes: a body surrounding a first coil with both ends exposed to the outside of the body and a second coil with both ends exposed to the outside of the body, and including a magnetic material; and external electrodes connected to the first coil and the second coil. One of the external electrodes includes an intermetallic compound disposed on the exposed ends of the first coil and the second coil, respectively.

IPC Classes  ?

• H01F 27/29 - TerminalsTapping arrangements
• H01F 27/28 - CoilsWindingsConductive connections

Abstract

A printed circuit board includes: a first insulating layer; a first wiring layer embedded in the first insulating layer on one side thereof; a glass layer disposed on the other side, opposite to the one side of the first insulating layer; a second wiring layer disposed on the glass layer; and a first via layer connecting the first wiring layer and the second wiring layer to each other, and including a first via portion penetrating the glass layer and a second via portion penetrating the first insulating layer. In a cross-sectional view of the printed circuit board, at least one of the first via portion and the second via portion has a width becoming substantially narrower toward the first wiring layer.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A coil component according to an aspect of the present disclosure includes a coil component having a body including a first surface and a second surface opposing each other in a first direction, and a third surface and a fourth surface connecting the first surface to the second surface and opposing each other in a second direction; a coil disposed in the body; an external electrode disposed on the body and connected to the coil; and a first heat dissipation portion disposed on the first surface, wherein the body includes a groove disposed in a region between the first heat dissipation portion and the external electrode.

IPC Classes  ?

• H01F 27/22 - Cooling by heat conduction through solid or powdered fillings
• H01F 27/32 - Insulating of coils, windings, or parts thereof

Abstract

An imaging device includes a first lens assembly including a plurality of first lens modules and a single first image sensor, and a second lens assembly including a plurality of second lens modules and a single second image sensor, wherein the first lens assembly and the second lens assembly are arranged to be adjacent to each other, wherein a field of view of each first lens module of the plurality of first lens modules is wider than a field of view of each second lens module of the plurality of second lens modules, and wherein f35t/f35w≥2 is satisfied, where f35t is a 35 mm equivalent focal length of the second lens module and f35w is a 35 mm equivalent focal length of the first lens module.

IPC Classes  ?

• H04N 23/55 - Optical parts specially adapted for electronic image sensorsMounting thereof
• H04N 23/698 - Control of cameras or camera modules for achieving an enlarged field of view, e.g. panoramic image capture

Abstract

An imaging lens system includes an optical path folding member including a forwardmost reflective surface disposed closest to an object side, a rearmost reflective surface disposed closest to an imaging plane, and a rear reflective surface disposed to form an acute angle with the rearmost reflective surface and configured to reflect light reflected by the rearmost reflective surface to the imaging plane, and a first lens group disposed on an object side of the forwardmost reflective surface or an image side of the forwardmost reflective surface, wherein an angle between a first virtual plane including the forwardmost reflective surface and a second virtual plane including the rearmost reflective surface is 15 to 27 degrees.

IPC Classes  ?

• H04N 23/55 - Optical parts specially adapted for electronic image sensorsMounting thereof
• G02B 9/10 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having two components only one + and one – component
• G02B 13/00 - Optical objectives specially designed for the purposes specified below

Abstract

A camera module is provided. The camera module includes a lens barrel configured to accommodate a lens, a barrel holder configured to be coupled to the lens barrel, a first reinforcing member, disposed on the lens barrel, a second reinforcing member, disposed on the barrel holder, and configured to be melt-coupled to the first reinforcing member, and a driving unit, configured to move the lens barrel and the barrel holder in an optical axis direction. A driving coil of the driving unit is disposed on a housing of the camera module, and a driving magnet of the driving unit is disposed on the barrel holder.

IPC Classes  ?

• G03B 17/12 - Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
• G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
• G02B 7/10 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification by relative axial movement of several lenses, e.g. of varifocal objective lens
• G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
• H04N 23/51 - Housings
• H04N 23/55 - Optical parts specially adapted for electronic image sensorsMounting thereof

Abstract

The present disclosure relates to a printed circuit board including: an insulating layer, a through-hole penetrating the insulating layer from an upper surface to a lower surface of the insulating layer and having an inclined wall surface; a metal ball disposed within the through-hole and in contact with the inclined wall surface; and a metal via filling the through-hole and surrounding the metal ball.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

An antenna substrate according to an embodiment of the present disclosure includes an antenna including an antenna pattern configured to transmit or receive an RF signal, and a directionality adjustment pattern including a plurality of metal layers having a preset area and disposed to be spaced apart from one another, the directionality adjustment pattern being disposed on one surface of the antenna, through which the RF signal emitted from the antenna pattern propagates, and provided such that at least one of the plurality of metal layers has a larger height than each of the remaining metal layers.

IPC Classes  ?

• H01Q 17/00 - Devices for absorbing waves radiated from an antenna Combinations of such devices with active antenna elements or systems
• H01Q 1/22 - SupportsMounting means by structural association with other equipment or articles
• H01Q 1/52 - Means for reducing coupling between antennas Means for reducing coupling between an antenna and another structure

Abstract

A dielectric composition according to the present disclosure includes dielectric grains containing barium titanate-based compounds; and a secondary phase located between the dielectric grains, and the secondary phase includes a first secondary phase including Ga and Si. A multilayered capacitor includes a capacitor body including a dielectric layer and an internal electrode; and an external electrode disposed outside the capacitor body. The dielectric layer includes the dielectric composition according to the present disclosure.

IPC Classes  ?

• H01G 4/12 - Ceramic dielectrics
• C04B 35/468 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
• H01G 4/30 - Stacked capacitors

Abstract

A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed in a first direction, and including first and second surfaces opposing each other in the first direction, the third and fourth surfaces connected to the first and second surfaces and connected to each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; an insulating layer disposed on the first, second, fifth and sixth surfaces and including at least one of Al2O3 and BN; an external electrode disposed on the body, wherein each of the first and second surfaces is concave into the body.

IPC Classes  ?

• H01G 4/12 - Ceramic dielectrics
• H01G 4/008 - Selection of materials
• H01G 4/252 - Terminals the terminals being coated on the capacitive element
• H01G 4/30 - Stacked capacitors

Abstract

A multilayer electronic component according to an example embodiment may include: a body including dielectric layers and internal electrodes; and an external electrode including a connection portion, and a band portion extending from the connection portion, wherein the external electrode may include an electrode layer connected to the internal electrode and including a first conductive metal and glass, a conductive resin layer disposed on the electrode layer and including a second conductive metal and a resin, and a silver (Ag) coating layer disposed between an electrode layer and a conductive resin layer of the band portion, and an average thickness of the silver (Ag) coating layer may be 2 μm or more and 5 μm or less.

IPC Classes  ?

• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/30 - Stacked capacitors

Abstract

A coil electronic component includes a main body; a coil embedded in the main body, an insulating layer disposed on one surface of the main body, a first conductive layer covering a portion of the one surface, a second conductive layer covering another portion of the one surface, and first and external electrodes respectively covering the first conductive layer. The coil electronic component has a first length L1 in a first direction, and a second length L2 is a sum of a third length L3 in the first direction of a region where the insulating layer, the first conductive layer, and the first external electrode overlap and a fourth length L4 in the first direction of a region where the insulating layer, the second conductive layer, and the second external electrode overlap. A ratio L2/L1 is 0.3 or more and 0.7 or less.

IPC Classes  ?

• H01F 27/28 - CoilsWindingsConductive connections
• H01F 27/29 - TerminalsTapping arrangements
• H01F 27/32 - Insulating of coils, windings, or parts thereof

Abstract

A lens module includes a first lens having refractive power, a second lens having refractive power, a third lens having refractive power, a fourth lens having refractive power, a fifth lens having refractive power and having a concave object-side surface and a concave image-side surface, and a sixth lens having refractive power and a concave image-side surface. The first to sixth lenses are sequentially disposed from an object side to an image side.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/62 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having six components only

Abstract

A solid oxide cell including a solid oxide electrolyte, and a fuel electrode on one side of the solid oxide electrolyte and an air electrode on the other side, wherein the fuel electrode includes core-shell hollow particles in which the core has an empty space and the shell includes nickel oxide (NiO) particles.

IPC Classes  ?

• H01M 4/86 - Inert electrodes with catalytic activity, e.g. for fuel cells
• C25B 9/23 - Cells comprising dimensionally-stable non-movable electrodesAssemblies of constructional parts thereof with diaphragms comprising ion-exchange membranes in or on which electrode material is embedded
• C25B 11/031 - Porous electrodes
• C25B 11/037 - Electrodes made of particles
• C25B 11/047 - Ceramics
• C25B 13/07 - DiaphragmsSpacing elements characterised by the material based on inorganic materials based on ceramics
• H01M 4/90 - Selection of catalytic material
• H01M 8/12 - Fuel cells with solid electrolytes operating at high temperature, e.g. with stabilised ZrO2 electrolyte
• H01M 8/1213 - Fuel cells with solid electrolytes operating at high temperature, e.g. with stabilised ZrO2 electrolyte characterised by the electrode/electrolyte combination or the supporting material
• H01M 8/1253 - Fuel cells with solid electrolytes operating at high temperature, e.g. with stabilised ZrO2 electrolyte characterised by the process of manufacturing or by the material of the electrolyte the electrolyte consisting of oxides the electrolyte containing zirconium oxide
• H01M 8/126 - Fuel cells with solid electrolytes operating at high temperature, e.g. with stabilised ZrO2 electrolyte characterised by the process of manufacturing or by the material of the electrolyte the electrolyte consisting of oxides the electrolyte containing cerium oxide

Abstract

A solid oxide composite according to present disclosure includes a solid oxide electrolyte including mesopores; and an oxide-based electrode active material in the mesopores.

IPC Classes  ?

• C25B 1/042 - Hydrogen or oxygen by electrolysis of water by electrolysis of steam
• C25B 11/054 - Electrodes comprising electrocatalysts supported on a carrier
• C25B 11/067 - Inorganic compound e.g. ITO, silica or titania
• C25B 11/077 - Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalysts material consisting of a single catalytic element or catalytic compound the compound being a non-noble metal oxide
• H01M 8/1213 - Fuel cells with solid electrolytes operating at high temperature, e.g. with stabilised ZrO2 electrolyte characterised by the electrode/electrolyte combination or the supporting material

Abstract

Disclosed is solid oxide cell that includes a unit cell including a solid oxide electrolyte including a first solid oxide electrolyte layer and a second solid oxide electrolyte layer, and a fuel electrode and an air electrode, and a frame having a first manifold surrounding a side of the unit cell and through which air supplied to the first solid oxide electrolyte layer flows.

IPC Classes  ?

• H01M 8/2483 - Details of groupings of fuel cells characterised by internal manifolds
• C25B 9/77 - Assemblies comprising two or more cells of the filter-press type having diaphragms
• C25B 13/02 - DiaphragmsSpacing elements characterised by shape or form
• C25B 13/07 - DiaphragmsSpacing elements characterised by the material based on inorganic materials based on ceramics
• H01M 8/12 - Fuel cells with solid electrolytes operating at high temperature, e.g. with stabilised ZrO2 electrolyte
• H01M 8/1213 - Fuel cells with solid electrolytes operating at high temperature, e.g. with stabilised ZrO2 electrolyte characterised by the electrode/electrolyte combination or the supporting material
• H01M 8/1246 - Fuel cells with solid electrolytes operating at high temperature, e.g. with stabilised ZrO2 electrolyte characterised by the process of manufacturing or by the material of the electrolyte the electrolyte consisting of oxides
• H01M 8/1253 - Fuel cells with solid electrolytes operating at high temperature, e.g. with stabilised ZrO2 electrolyte characterised by the process of manufacturing or by the material of the electrolyte the electrolyte consisting of oxides the electrolyte containing zirconium oxide
• H01M 8/126 - Fuel cells with solid electrolytes operating at high temperature, e.g. with stabilised ZrO2 electrolyte characterised by the process of manufacturing or by the material of the electrolyte the electrolyte consisting of oxides the electrolyte containing cerium oxide
• H01M 8/2432 - Grouping of unit cells of planar configuration

Abstract

An all-solid-state battery according to present disclosure includes a cell stack including a solid electrolyte layer, and a positive electrode layer and a negative electrode layer with the solid electrolyte layer disposed therebetween, and an outermost layer on one surface or both surfaces of the cell stack in a stacking direction, wherein the outermost layer includes an epoxy resin and glass particles and the glass particles include a boron (B) oxide, a silicon (Si) oxide, and an aluminum (Al) oxide.

IPC Classes  ?

• H01M 10/0562 - Solid materials
• H01M 4/04 - Processes of manufacture in general

Abstract

A printed circuit board includes a glass layer having a first region having first transmittance and a second region having second transmittance, different from the first transmittance, and a first wiring layer disposed on the glass layer.

IPC Classes  ?

• H05K 1/03 - Use of materials for the substrate
• H05K 1/05 - Insulated metal substrate
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

An optical system includes a first lens having negative refractive power and having two concave surfaces, a second lens having positive refractive power, a third lens having refractive power, a fourth lens having refractive power, a fifth lens having refractive power, a sixth lens having refractive power, and a seventh lens having refractive power. The first to seventh lenses are sequentially disposed from an object side.

IPC Classes  ?

• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components
• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 13/04 - Reversed telephoto objectives

Abstract

An aperture module includes a base including a guide slot and a protruding pivot pin; a blade unit including a plurality of blades which pivot to form a first diameter aperture and a second diameter aperture; and an aperture driver including a driving pin that moves along the guide slot. The driving hole includes a first end portion and a second end portion that contact the driving pin when the first and second diameter apertures are formed, and a central portion that connects the first end portion and the second end portion. A width of a central portion of the driving hole in a first direction that is vertical to a center line connecting two points between the first end portion and the second end portion by a maximum distance is greater than maximum widths of the first end portion and the second end portion.

IPC Classes  ?

• G03B 9/14 - Two separate members moving in opposite directions
• G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
• G03B 5/00 - Adjustment of optical system relative to image or object surface other than for focusing of general interest for cameras, projectors or printers
• G03B 13/36 - Autofocus systems

Abstract

The present disclosure relates to a printed circuit board including: a glass layer; a plurality of blind cavities respectively penetrating through a portion of the glass layer from an upper surface or a lower surface of the glass layer; a plurality of passive elements respectively disposed in the plurality of blind cavities; and an insulating layer covering at least a portion of each of the glass layer and the plurality of passive elements and disposed in at least a portion of each of the plurality of blind cavities. At least two of the plurality of blind cavities have different depths.

IPC Classes  ?

• H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• H05K 1/03 - Use of materials for the substrate
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

A coil component, may include: a body including a first surface and a second surface facing each other in a first direction, and a third surface connecting the first surface and the second surface; a support member disposed within the body; a coil disposed on the support member, and including a coil pattern having at least one turn and a lead-out portion extending from an outer end of the coil pattern to the first surface or the second surface; and an electrode 10 portion extending from the lead-out portion externally of the body and disposed on the body, and having an average thickness smaller than the average thickness of the lead-out portion.

IPC Classes  ?

• H01F 5/00 - Coils
• H01F 5/04 - Arrangements of electric connections to coils, e.g. leads
• H01F 27/29 - TerminalsTapping arrangements

Abstract

A multilayer electronic component includes a body including a capacitance forming portion including a dielectric layer and an internal electrode, alternately arranged in a first direction, and a cover portion disposed on both surfaces of the capacitance forming portion opposing the first direction; and an external electrode disposed outside the body and connected to the internal electrode, wherein the cover portion includes a first dielectric material having a perovskite structure represented by the formula ABO3, and a first metal including one or more of Cu, W, Ag, and Zn, and wherein, in at least a portion of the cover portion, an amount of the first metal is 2.0 mole or more and 9.0 mole or less, based on 100 mole of an element of B.

IPC Classes  ?

• H01G 2/10 - HousingEncapsulation
• H01G 2/14 - Protection against electric or thermal overload
• H01G 4/30 - Stacked capacitors

Abstract

A spacer includes: an opening through which light passes; an inner side surface forming the opening; and a protruding portion including a plurality of protrusions protruding from the inner side surface. Lengths of the plurality of protrusions vary in a circumferential direction of the protruding portion.

IPC Classes  ?

• G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses

Abstract

A disclosed multilayer ceramic electronic component includes: a stacked body that includes a plurality of dielectric layers stacked in a first direction and a plurality of internal electrodes stacked in the first direction; and a first external electrode, a second external electrode, a third external electrode, and a fourth external electrode that are disposed outside the stacked body. The plurality of internal electrodes includes a plurality of first internal electrodes connected to the first external electrode and the second external electrode and a plurality of second internal electrodes connected to the third external electrode and the fourth external electrode, and an edge of a cross-section of the stacked body that intersects the first direction is a curve.

IPC Classes  ?

• H01G 4/008 - Selection of materials
• H01G 4/12 - Ceramic dielectrics
• H01G 4/30 - Stacked capacitors

Abstract

A printed circuit board includes a glass layer having a first surface, and a second surface opposing the first surface, a through-via penetrating the glass layer, a first wiring layer disposed on and in contact with the first surface of the glass layer, a first insulating layer disposed on the first surface and covering the first wiring layer, a second insulating layer disposed on the second surface of the glass layer and covering a side surface of the glass layer connecting the first and second surfaces of the glass layer, a second wiring layer disposed on the second insulating layer, and a connection via penetrating the second insulating layer to connect the second wiring layer and the through-via to each other, the connection via being in contact with the through-via. The first insulating layer includes an insulating material different from an insulating material of the second insulating layer.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

A circuit board include: a substrate having a first surface including a first region and a second region; a connection pad disposed in the first region and having a first height in a direction perpendicular to the first surface; a circuit wiring disposed in the second region, including different metal films, and having a second height in the direction perpendicular to the first surface to be greater than the first height; and an insulating pattern layer covering the circuit wiring in the second region and protruding from the first surface to have a step from the first region.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Abstract

The present disclosure relates to a printed circuit board including: a first insulating layer; a first wiring layer disposed on the first insulating layer; a second wiring layer disposed on the first insulating layer; a second insulating layer disposed on the first insulating layer; a third wiring layer disposed on the second insulating layer; a first cavity penetrating through at least a portion of the first insulating layer; and a second cavity penetrating through at least a portion of the second insulating layer and connected to the first cavity. The first and second cavities have different wall surface inclinations, and a depth of the first cavity is smaller than a thickness of the first insulating layer and is greater than a thickness of each of the first and second wiring layers.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/02 - Printed circuits Details

Abstract

A coil component, may include: a body having a first surface and a second surface facing each other in a first direction; a support member disposed within the body; a coil disposed on the support member; an external electrode disposed on the first surface of the body; and a connection portion disposed within the body to connect the coil and the external electrode, the connection portion having one surface in contact with the coil and another surface in contact with the external electrode, in which the connection portion may include a fused portion formed at an end in contact with the coil.

IPC Classes  ?

• H01F 5/04 - Arrangements of electric connections to coils, e.g. leads
• H01F 27/29 - TerminalsTapping arrangements
• H01F 27/30 - Fastening or clamping coils, windings, or parts thereof togetherFastening or mounting coils or windings on core, casing, or other support
• H01F 27/32 - Insulating of coils, windings, or parts thereof

Abstract

A camera module is provided. The lens module includes a substrate on which an image sensor is disposed; a lens module, disposed in an inner housing of the camera module, and further disposed on a first surface of the substrate; and a heat transfer member, including a thermoelectric element, and disposed on a second surface of the substrate, wherein the substrate includes a heat transfer portion, wherein the heat transfer portion includes a plurality of holes which penetrate the substrate, and wherein a heat transfer material is disposed in the plurality of holes.

IPC Classes  ?

• G03B 17/55 - Details of cameras or camera bodiesAccessories therefor with provision for heating or cooling, e.g. in aircraft
• G03B 17/12 - Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets

Abstract

A multilayered capacitor according to an embodiment includes a capacitor body that includes a dielectric layer and an internal electrode, and an external electrode that are disposed on the outside of the capacitor body, and the dielectric layer contain a plurality of dielectric grains containing a major component and a minor component, and at least one of the plurality of dielectric grains has a core-shell structure including a core, a shell, and a core-shell wall positioned between the core and the shell, and between at least two dielectric grains of the plurality of dielectric grains, a grain boundary is included, and when the average concentration of the minor component in the grain boundary is denoted by CGB (at %) and the average concentration of the minor component in the core-shell wall is denoted by CCS (at %), CCS/CGB is in a range from 0.40 to 0.75.

IPC Classes  ?

• H01G 4/12 - Ceramic dielectrics
• H01G 4/30 - Stacked capacitors

Abstract

Disclosed is a coil electronic component including: a main body including a first magnetic body, and a second magnetic body facing the first magnetic body; a first coil, at least a portion of which is embedded in the first magnetic body; and a second coil, at least a portion of which is embedded in the second magnetic body, in which the first magnetic body is an integral structure having a recess, and the first coil is disposed in the recess.

IPC Classes  ?

• H01F 27/30 - Fastening or clamping coils, windings, or parts thereof togetherFastening or mounting coils or windings on core, casing, or other support
• H01F 1/20 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
• H01F 27/255 - Magnetic cores made from particles
• H01F 27/28 - CoilsWindingsConductive connections
• H01F 27/29 - TerminalsTapping arrangements
• H01F 27/32 - Insulating of coils, windings, or parts thereof

Abstract

An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, and a fifth lens sequentially disposed from the first lens to the fifth lens from an object-side of the imaging system to an image-side of the imaging system and each having refractive power. The fourth lens has a convex object-side surface and an expression 0.7

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/60 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having five components only
• G02B 13/02 - Telephoto objectives, i.e. systems of the type + – in which the distance from the front vertex to the image plane is less than the equivalent focal length

Abstract

An image capturing lens system includes a first lens having negative refractive power, a second lens having positive refractive power, a third lens having negative refractive power, a fourth lens having positive refractive power, a fifth lens having refractive power, a sixth lens having refractive power, a seventh lens having positive refractive power, and an eighth lens having refractive power. The first to eighth lenses are sequentially disposed from an object side. The first lens and the fourth lens are formed of a glass material. The second lens, the third lens, the fifth lens, the sixth lens, the seventh lens, and the eighth lens are formed of a plastic material.

IPC Classes  ?

• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components
• G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
• G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses

Abstract

The present disclosure relates to a printed circuit board, including: a first insulating layer having a through-portion; a chip stack including a first chip having a rear surface opposite to a front surface on which a connection pad is disposed, and a second chip attached to the rear surface of the first chip and having a different thickness from the first chip, wherein at least a portion of the chip stack is disposed in the through-portion.; and a second insulating layer covering at least a portion of each of the first insulating layer and the chip stack and disposed in at least a portion of the through-portion.

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens and a seventh lens sequentially disposed from an object side. The optical imaging system satisfies |Pnu|[10−6° C.−1 mm−1]≤30, where Pnu is ΣPnui in which i=1, 2, . . . , 7, Pnui is 1/(vti·fi), vti is [DTni/(ni−1)−CTEi]−1, fi is an effective focal length of an i-th lens, ni is a refractive index of the i-th lens, DTni is a rate (dni/dT) of change of the refractive index according to a temperature of the i-th lens, and CTEi is a thermal expansion coefficient of the i-th lens.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components
• G02B 27/00 - Optical systems or apparatus not provided for by any of the groups ,
• H04N 23/55 - Optical parts specially adapted for electronic image sensorsMounting thereof

Abstract

A capacitor may include a substrate, a first capacitor portion disposed on the substrate, and a second capacitor portion disposed on the first capacitor portion. The first capacitor portion may include a first insulation layer having a plurality of trenches, a first electrode disposed on the first insulation layer and in the plurality of trenches, a dielectric layer disposed on the first electrode, and a second electrode disposed on the dielectric layer.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/10 - Metal-oxide dielectrics
• H01G 4/228 - Terminals
• H01G 4/38 - Multiple capacitors, i.e. structural combinations of fixed capacitors

Abstract

A capacitor may include a structure body including a first surface and a second surface positioned in opposite directions, where a plurality of openings are positioned on the first surface, a first internal electrode disposed on a region where the plurality of openings are positioned, a dielectric layer disposed on a partial region of the first internal electrode, a second internal electrode disposed on the dielectric layer, a first external electrode disposed on the first surface, and connected to the first internal electrode, and a second external electrode disposed on the first surface, and connected to the second internal electrode.

IPC Classes  ?

• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/30 - Stacked capacitors

Abstract

An optical imaging system is provided. The optical imaging system includes a first lens group including a first lens, a reflective member, and a second lens arranged in order from an object side to an imaging side; and a second lens group disposed behind the second lens and including a plurality of lenses, wherein the first lens has positive refractive power, and has a convex object-side surface and a concave image-side surface, and the first lens is spaced apart from the reflective member, and the second lens is bonded to the reflective member.

IPC Classes  ?

• G02B 9/10 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having two components only one + and one – component

Abstract

A metal-solid oxide composite includes a plurality of nanowire portions including a solid oxide electrolyte material, a metal portion at one end of each of the plurality of nanowire portions and including a metal, and a center portion connected to the other ends of the nanowire portions.

IPC Classes  ?

• H01M 8/1253 - Fuel cells with solid electrolytes operating at high temperature, e.g. with stabilised ZrO2 electrolyte characterised by the process of manufacturing or by the material of the electrolyte the electrolyte consisting of oxides the electrolyte containing zirconium oxide
• C25B 9/23 - Cells comprising dimensionally-stable non-movable electrodesAssemblies of constructional parts thereof with diaphragms comprising ion-exchange membranes in or on which electrode material is embedded
• C25B 13/07 - DiaphragmsSpacing elements characterised by the material based on inorganic materials based on ceramics
• H01M 8/1004 - Fuel cells with solid electrolytes characterised by membrane-electrode assemblies [MEA]
• H01M 8/12 - Fuel cells with solid electrolytes operating at high temperature, e.g. with stabilised ZrO2 electrolyte

Abstract

The present disclosure relates to a printed circuit board, including: a plurality of insulating layers having a through-portion; a plurality of wiring layers respectively disposed on or in the plurality of insulating layers; a plurality of via layers respectively penetrating through at least a portion of at least one of the plurality of insulating layers and respectively connected to at least one of the plurality of wiring layers; an electronic component at least partially disposed in the through-portion, and embedded in at least one of the plurality of insulating layers; and an insulating film disposed in the plurality of insulating layers, and covering at least a portion of a side surface of the electronic component and at least a portion of a wall surface of the through-portion.

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

A multilayer electronic component includes a body including a dielectric layer, a first internal electrode layer, and a second internal electrode layer alternately disposed in a first direction; first and second external electrodes respectively disposed on surfaces of the body in a second direction. The first internal electrode layer includes first internal electrodes connected to the first external electrode, and the second internal electrode layer includes a second internal electrodes connected to the second external electrode. The first and second internal electrodes are alternately disposed in a third direction, the first internal electrodes of the first internal electrode layer are alternately disposed with the second internal electrodes of the second internal electrode layer in the first direction, and the second internal electrodes of the first internal electrode layer are alternately disposed with the first internal electrodes of the second internal electrode layer in the first direction.

IPC Classes  ?

• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics
• H01G 4/30 - Stacked capacitors

Abstract

A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a first direction, and having a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction, and an external electrode disposed on the body. The internal electrode is connected to the external electrode through a lead-out portion, the external electrode includes first to fourth external electrodes spaced apart from each other, and includes a first connection electrode connecting the first and third external electrodes, and the first connection electrode includes a conductive material.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/008 - Selection of materials
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor

Abstract

An actuator for optical image stabilization includes a fixed frame; a moving frame, accommodated in the fixed frame, configured to move relatively to the fixed frame on a plane perpendicular to an optical axis; and a sensor substrate, on which an image sensor is disposed, comprising a fixed portion coupled to the fixed frame, a moving portion comprising the image sensor and coupled to the moving frame, and a connecting portion disposed between the moving portion and the fixed portion to support movement of the moving portion. The moving portion includes a heat dissipation member dissipating heat generated from the image sensor, and the heat dissipation member includes a substrate having a through-hole, and a conductive electrode filling the through-hole.

IPC Classes  ?

• H04N 23/68 - Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
• H04N 23/51 - Housings
• H04N 23/52 - Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements

Abstract

A multilayer electronic component includes: a body including a dielectric layer, a first internal electrode layer, and a second internal electrode layer alternately disposed in a first direction with the dielectric layer interposed therebetween; a first external electrode disposed on the body, perpendicular to the first direction; and a second external electrode disposed on the body, wherein the first internal electrode layer includes a first internal electrode connected to the first external electrode, and the second internal electrode layer includes a second internal electrode connected to the second external electrode, wherein, when the shortest distance between the first internal electrode and a second internal electrode, most adjacent to the first internal electrode is defined as a, and the maximum size of the first internal electrode in the first direction is defined as te, 0.01≤(a/te)≤1.37 is satisfied.

IPC Classes  ?

• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/30 - Stacked capacitors

Abstract

A circuit board is provided. The circuit board includes a substrate portion including at least one circuit wire, an adhesive layer disposed on a first side of the substrate portion, and a metal reinforcing layer disposed opposite to the substrate portion with respect to the adhesive layer, wherein the metal reinforcing layer includes a first surface which has a convex portion, and a second surface disposed opposite to the first surface.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/03 - Use of materials for the substrate
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a first direction; an external electrode disposed outside the body; and an oxide layer disposed between the body and the external electrode and connecting the internal electrode and the external electrode, wherein the oxide layer includes one or more of an Ni oxide and a Cu oxide.

IPC Classes  ?

• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/30 - Stacked capacitors

Abstract

A multilayer electronic component includes a body having a first internal electrode, a second internal electrode, and a first auxiliary electrode and a second auxiliary electrode spaced apart from each other, in which the first internal electrode and the second internal electrode are alternately arranged with the first and second auxiliary electrode layers interposed therebetween; a first external electrode connected to the first internal electrode and the first auxiliary electrode; and a second external electrode connected to the second internal electrode and the second auxiliary electrode, in which at least a portion of the first internal electrode overlaps the second auxiliary electrode, and at least a portion of the second internal electrode overlaps the first auxiliary electrode.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/008 - Selection of materials
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics
• H01G 4/224 - HousingEncapsulation

Abstract

A coil component according to an aspect of the present disclosure includes a body including a magnetic material; a coil disposed in the body; an external electrode including a first layer connected to the coil and including at least one of Pd and Cr, a second layer disposed on the first layer and including Ni, and a third layer disposed on the second layer and including a conductive material and resin.

IPC Classes  ?

• H01F 27/29 - TerminalsTapping arrangements
• H01F 27/24 - Magnetic cores
• H01F 27/28 - CoilsWindingsConductive connections

Abstract

A solid oxide electrolysis cell according to an embodiment includes a solid oxide electrolysis cell including a unit including: a first unit cell including a first fuel electrode, a first electrolyte layer including a solid oxide, and a first air electrode; a second unit cell disposed to be spaced apart from the first unit cell, and including a second fuel electrode, a second electrolyte layer, and a second air electrode; a first porous conductive layer disposed between the first unit cell and the second unit cell; and a separator disposed outside of the unit and having a passage. The second unit cell is disposed on the first unit cell, a stacking order of the first fuel electrode, and the first electrolyte layer, and the first air electrode of the first unit cell is mirror symmetrical to a stacking order of the second fuel electrode, the second electrolyte layer, and the second air electrode of the second unit cell in a stacking direction.

IPC Classes  ?

• C25B 1/04 - Hydrogen or oxygen by electrolysis of water
• C25B 9/65 - Means for supplying currentElectrode connectionsElectric inter-cell connections
• C25B 9/77 - Assemblies comprising two or more cells of the filter-press type having diaphragms
• C25B 13/07 - DiaphragmsSpacing elements characterised by the material based on inorganic materials based on ceramics

Abstract

A lens module includes a lens barrel including a plurality of lenses arranged in a first direction, a zoom ring configured to accommodate the lens barrel, and a lens gap adjustment member coupled to the lens barrel and the zoom ring to adjust a gap between the plurality of lenses. The lens barrel and the zoom ring form a sliding groove extending in the first direction to guide a movement of the lens gap adjustment member. The sliding groove includes a serrated portion to which the lens gap adjustment member slidably engages in the first direction.

IPC Classes  ?

• G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
• G02B 7/10 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification by relative axial movement of several lenses, e.g. of varifocal objective lens

Abstract

A method for measuring DC bias aging characteristics of a multilayer capacitor includes applying a first poling voltage to a multilayer capacitor including a body having a dielectric layer including a plurality of dielectric grains and an internal electrode disposed alternately with the dielectric layer in a first direction, and an external electrode disposed on the body, maintaining the first poling voltage for a first period of time (t1), applying a DC bias voltage lower than the first poling voltage, maintaining the DC bias voltage for a second period of time (t2), and measuring saturated capacitance after the DC bias voltage is applied.

IPC Classes  ?

• G01R 31/64 - Testing of capacitors
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics
• H01G 4/30 - Stacked capacitors

Abstract

A printed circuit board includes a first substrate portion including a first insulating portion and a plurality of first wiring layers respectively disposed on or in the first insulating portion, a resin layer disposed to cover a side surface of the first insulating portion, and a second substrate portion including a second insulating portion disposed to cover each of an upper surface of the first insulating portion and an upper surface of the resin layer, and a second wiring layer disposed on or in the second insulating portion.

IPC Classes  ?

• H05K 1/14 - Structural association of two or more printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

A multilayer electronic component includes a body including a plurality of dielectric layers, a plurality of internal electrodes, a capacitance formation portion in which the plurality of dielectric layers and the plurality of internal electrodes are alternately disposed in a first direction, a first cover portion disposed on one surface of the capacitance formation portion in the first direction and including a dielectric layer, and a second cover portion disposed on the other surface of the capacitance formation portion in the first direction and including a dielectric layer; and an external electrode disposed on the body, wherein, if an internal electrode disposed closest to the first cover portion, among the plurality of internal electrodes, is referred to as IE1, a ratio of Ni(OH)2 mass to NiO mass in IE1 is 4.5 or more and 7.5 or less.

IPC Classes  ?

• H01G 4/008 - Selection of materials
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/30 - Stacked capacitors

Abstract

An optical imaging system includes a first lens having refractive power, a second lens including a first reflective region formed on an object-side surface of the second lens, a third lens having a second reflective region formed on an image-side surface of the third lens, and a fourth lens having refractive power.

IPC Classes  ?

• G02B 17/08 - Catadioptric systems
• G02B 13/00 - Optical objectives specially designed for the purposes specified below

Abstract

The present disclosure relates to a printed circuit board, including: an interconnect bridge including an insulating material, a plurality of conductive pattern layers respectively disposed on or in the insulating material, and a conductive post disposed on the insulating material; a first insulating layer embedding the interconnect bridge and having a recess portion exposing a portion of the conductive post; and a first wiring layer disposed on the first insulating layer and including a first pad pattern connected to the exposed portion of the conductive post on the recess portion.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

A semiconductor package includes: a package board; a first semiconductor chip disposed on the package board, and having a first recess portion adjacent to a first front surface of the first semiconductor chip facing the package board; a second semiconductor chip disposed side by side with the first semiconductor chip on the package board, and having a second recess portion adjacent to a second front surface of the second semiconductor chip facing the package board; and an interconnect bridge disposed on the first and second front surfaces, and at least partially disposed in each of the first and second recess portions.

IPC Classes  ?

• H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H01L 23/528 - Layout of the interconnection structure
• H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or

Abstract

A coil electronic component includes: a main body including a first surface and a second surface facing each other, and including a magnetic material; a coil including at least one turn of a conductive wire, at least a portion of which being embedded in the main body; a first external electrode connected to a first lead-out portion of the coil; and a second external electrode connected to a second lead-out portion of the coil, wherein a cross-sectional shape of the coil is a triangular shape.

IPC Classes  ?

• H01F 27/28 - CoilsWindingsConductive connections
• H01F 5/04 - Arrangements of electric connections to coils, e.g. leads
• H01F 27/29 - TerminalsTapping arrangements

Abstract

An all-solid-state battery according to the present disclosure includes a stack including: a solid electrolyte layer, and a positive electrode layer and a negative electrode layer disposed with the solid electrolyte layer interposed therebetween; and a first packaging material layer and a second packaging material layer disposed with the stack interposed therebetween. The first packaging material layer or the second packaging material layer includes bentonite-based clay, and ceramic glass not including lithium.

IPC Classes  ?

• H01M 50/483 - Inorganic material
• H01M 10/0562 - Solid materials
• H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
• H01M 50/437 - Glass