Abstract

A lens assembly includes a lens barrel, a lens disposed on the lens barrel, and a filter configured to filter light passing through the lens, wherein the lens barrel includes a seating portion in which the filter is disposed, and a step portion disposed facing the filter between the seating portion and an optical axis, wherein an avoidance groove formed to be concave in an optical axis direction is disposed on an upper surface of the seating portion.

IPC Classes  ?

• G02B 7/00 - Mountings, adjusting means, or light-tight connections, for optical elements
• G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses

Abstract

A multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, and a plating layer disposed on the electrode layer, wherein the electrode layer includes a connection electrode layer including copper (Cu) and glass, and a band electrode layer including silver (Ag) and glass, and the external electrode further includes a conductive resin layer disposed between the band electrode layer and the plating layer and including a conductive metal and a resin.

IPC Classes  ?

• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/008 - Selection of materials
• H01G 4/12 - Ceramic dielectrics
• H01G 4/30 - Stacked capacitors

Abstract

A multilayer electronic component includes: a body including a dielectric layer and first and second internal electrodes alternately disposed in a first direction while having the dielectric layer interposed therebetween; and first and second external electrodes disposed on opposite surfaces of the body in a second direction perpendicular to the first direction, wherein the body includes a main portion in which the first and second internal electrodes are alternately disposed in the first direction, a first cover portion disposed on one surface of the main portion in the first direction, and a second cover portion disposed on the other surface of the main portion in the first direction, one of the first and second cover portions includes a cover electrode whose average size in the second direction is larger than that of the first or second internal electrode.

IPC Classes  ?

• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/30 - Stacked capacitors

Abstract

A coil component includes: a body having a first surface, a second surface opposing the first surface in a first direction, and one or more side surfaces connecting the first and second surfaces to each other; first and second support members disposed to be spaced apart from each other in the first direction inside the body; and a coil portion including first and third coils disposed on both surfaces of the first support member, a first via connecting the first and third coils to each other, second and fourth coils disposed on both surfaces of the second support member, and a second via connecting the second and fourth coils to each other, in which the third coil and the fourth coil are bonded to each other inside the body.

IPC Classes  ?

• H01F 27/30 - Fastening or clamping coils, windings, or parts thereof togetherFastening or mounting coils or windings on core, casing, or other support
• H01F 5/04 - Arrangements of electric connections to coils, e.g. leads
• H01F 27/29 - TerminalsTapping arrangements

Abstract

An imaging lens system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, and a sixth lens, sequentially arranged from an object side. The imaging lens system satisfies the following conditional expressions: −2.6

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/62 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having six components only

Abstract

A printed circuit board includes: a substrate having a cavity; a semiconductor device at least partially disposed in the cavity, with a first metal pad and a gate being disposed on a lower side of the semiconductor device and a second metal pad being disposed on an upper side of the semiconductor device; a metal block at least partially disposed in the cavity, the metal block being connected to the second metal pad; and a first insulating layer covering at least a portion of each of the substrate, the semiconductor device, and the metal block, and filling at least a portion of the cavity.

IPC Classes  ?

• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 29/417 - Electrodes characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
• H01L 29/45 - Ohmic electrodes
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/42 - Plated through-holes
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A coil component includes: a body having a first surface and a second surface opposing each other in a first direction, and a third surface and a fourth surface opposing each other in a second direction perpendicular to the first direction; a support member disposed inside the body and having one surface and another surface opposing each other, and a side surface connecting the one surface and the other surface to each other; a coil disposed on the support member 10 and including coil portions respectively having at least one turn and lead portions extending from respective outermost turns of the coil portions and bent toward the first surface; and external electrodes disposed on the first surface and connected to the respective lead portions.

IPC Classes  ?

• H01F 27/29 - TerminalsTapping arrangements
• H01F 27/255 - Magnetic cores made from particles
• H01F 27/30 - Fastening or clamping coils, windings, or parts thereof togetherFastening or mounting coils or windings on core, casing, or other support
• H01F 27/32 - Insulating of coils, windings, or parts thereof

Abstract

A coil component includes: a body; a support member disposed inside the body and having one surface and another surface opposing each other; a first coil disposed on the one surface of the support member and including a first core; a second coil disposed on the other surface of the support member and including a second core; a first lead portion disposed on the other surface of the support member and connected to the first coil; and a second lead portion disposed on the one surface of the support member and connected to the second coil, in which the first core partially overlaps the second core when viewed in a stacking direction of the first and second coils on the support member, and a length of the second coil in one direction is larger than a length of the first coil in the one direction.

IPC Classes  ?

• H01F 5/04 - Arrangements of electric connections to coils, e.g. leads
• H01F 27/28 - CoilsWindingsConductive connections

Abstract

An optical imaging system is provided. The optical imaging system includes a first lens group including at least one lens disposed toward a first optical axis; a second lens group including at least one lens disposed in a second optical axis direction perpendicular to the first optical axis direction; and a prism disposed between the first lens group and the second lens group and configured to convert a path of incident light from the first optical axis direction to the second optical axis direction, wherein the conditional expression 0.200≤D1/OAL2≤0.500 is satisfied, wherein D1 is a maximum effective diameter of the first lens group, and OAL2 is a distance on a second optical axis from a reflective surface of the prism to an imaging plane.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/04 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having two components only

Abstract

255), the margin layer includes ceramic glass that does not contain lithium, and the aluminosilicate particles are included in an amount of 10 vol% to 70 vol% based on the entire volume of the margin layer.

IPC Classes  ?

• H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
• H01M 10/052 - Li-accumulators
• H01M 10/0562 - Solid materials
• H01M 10/42 - Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
• H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulatorsProcesses of manufacture thereof

Abstract

The disclosed all-solid-state battery includes a laminate including first and second surfaces facing each other in a first direction, third and fourth surfaces facing each other in a second direction and connecting the first and second surfaces, and fifth and sixth surfaces facing each other in a third direction and connecting the first and second surfaces, and including a solid electrolyte layer and positive and negative electrode layers alternately stacked in the third direction with the solid electrolyte layer interposed therebetween; a first external electrode connected to the positive electrode layer and disposed outside the laminate; and a second external electrode connected to the negative electrode layer and disposed outside the laminate. The positive electrode layer may include a positive electrode current collector including an aluminum foil, the negative electrode layer may include a negative electrode active material including graphite, and the positive electrode current collector may be connected to the first external electrode on the first, third, and fourth surfaces of the laminate.

IPC Classes  ?

• H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
• H01M 10/052 - Li-accumulators
• H01M 10/0562 - Solid materials
• H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulatorsProcesses of manufacture thereof
• H01M 4/587 - Carbonaceous material, e.g. graphite-intercalation compounds or CFx for inserting or intercalating light metals
• H01M 4/66 - Selection of materials
• H01M 4/70 - Carriers or collectors characterised by shape or form

Abstract

A power selection switch circuit configured to select either one or both of a first power supply voltage and a second power supply voltage, and supply the selected power supply voltage to a power amplifier, the power selection switch circuit includes: an n-type first transistor configured to turn on in response to a first switching control signal having a first voltage generated by charge pumping the first power supply voltage, and supply the first power supply voltage to a power supply terminal of the power amplifier when turned on; and an n-type second transistor configured to turn on in response to a second switching control signal having a second voltage generated by charge pumping the second power supply voltage, and supply the second power supply voltage to the power supply terminal of the power amplifier when turned on.

IPC Classes  ?

• H03F 3/24 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
• H03K 5/00 - Manipulation of pulses not covered by one of the other main groups of this subclass
• H03K 19/20 - Logic circuits, i.e. having at least two inputs acting on one outputInverting circuits characterised by logic function, e.g. AND, OR, NOR, NOT circuits

Abstract

A camera module includes a lens barrel; an image sensor, mounted on a substrate, disposed below the lens barrel along an optical axis direction of the lens barrel; and a sub-housing, disposed between the lens barrel and the substrate, comprising a seating portion on which an infrared filter is accommodated, and a frame portion supported by the substrate. The sub-housing is configured to space apart the seating portion from the substrate. The sub-housing comprises an inner surface facing the image sensor and an outer surface facing away from the inner surface. The frame portion includes a gas discharge portion including a first channel communicating the inner surface with the outer surface in a first direction and a second channel extending from the first channel to the outer surface along the optical axis direction in a second direction different from the first direction.

IPC Classes  ?

• H04N 23/51 - Housings
• G03B 11/00 - Filters or other obturators specially adapted for photographic purposes
• H04N 23/54 - Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils

Abstract

An optical imaging system includes first, second, third, fourth, fifth, and sixth lenses each having a refractive power. The first to sixth lenses are sequentially disposed in ascending numerical order along an optical axis of the optical imaging system from an object side of the optical imaging system toward an imaging plane of the optical imaging system, and are the only lenses having a refractive power in the optical imaging system. A radius of curvature of an object-side surface of the fourth lens at the optical axis is greater than a radius of curvature of an object-side surface of the second lens at the optical axis and a radius of curvature of an image-side surface of the second lens at the optical axis. A thickness of the third lens is greater than a distance from an image-side surface of the third lens to the object-side surface of the fourth lens.

IPC Classes  ?

• G02B 9/62 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having six components only
• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 13/02 - Telephoto objectives, i.e. systems of the type + – in which the distance from the front vertex to the image plane is less than the equivalent focal length

Abstract

A multilayer ceramic capacitor including: a capacitor body including a dielectric layer and an internal electrode layer; and an external electrode arranged outside the capacitor body, wherein the dielectric layer includes a barium titanate-based main ingredient and an element of phosphorus (P), and the element of phosphorus (P) is included in an amount of 0.006 parts by mole to 0.23 parts by mole based on 100 parts by mole of the barium titanate-based main ingredient, and a manufacturing method thereof are provided.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/12 - Ceramic dielectrics
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor

Abstract

A lens assembly includes a first lens barrel; a second lens barrel disposed in front of the first lens barrel while surrounding at least a portion of the first lens barrel; and a first lens disposed in front of the second lens barrel in contact with a portion of the second lens barrel, wherein a thermal conductance of the second lens barrel is higher than a thermal conductance of the first lens barrel.

IPC Classes  ?

• G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
• G03B 17/08 - Waterproof bodies or housings
• G03B 17/12 - Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets

Abstract

A multi-layer ceramic electronic component includes: a ceramic body having a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface opposing each other in a third direction perpendicular to the first direction and the second direction, and including a plurality of dielectric layers, and a first internal electrode and a second internal electrode alternately disposed in the third direction while having the dielectric layer interposed therebetween; a first external electrode connected to the first internal electrode and including a first conductive layer including a first groove in a surface and a first plating layer disposed on the first conductive layer; a first coating portion disposed in the first groove and in contact with the first plating layer.

IPC Classes  ?

• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/12 - Ceramic dielectrics
• H01G 4/30 - Stacked capacitors

Abstract

An embodiment of the present disclosure provides a circuit board including: an insulating layer including a first area on one surface on which an electronic component is mounted and a second area adjacent to the first area; a connection pad disposed in the first area; and a solder resist layer covering the one surface of the insulating layer and being opened to expose the connection pad. At least a portion of the solder resist layer extends from the second area to the first area, and a portion of the insulating layer is exposed from the solder resist layer in the first area.

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

The present disclosure relates to a printed circuit board and a manufacturing method of the printed circuit board. The printed circuit board includes: a first insulating layer including a groove portion on an upper side; and a first wiring layer having an embedded portion embedded in the groove portion and a protruding portion protruding onto the first insulating layer. The protruding portion of the first wiring layer has a width of a lower end portion, narrower than a width of an upper end portion.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details

Abstract

A printed circuit board includes a substrate with first through-portion; a magnetic layer disposed in at least a portion of the first through-portion and having a second through-portion; an electronic component having at least a portion disposed in the second through-portion; a first wiring pattern disposed on an upper surface of the magnetic layer; a second wiring pattern disposed on a lower surface of the magnetic layer; and a first through-via having at least a portion surrounded by the magnetic layer, and including a first via pattern connecting the first and second wiring patterns to each other.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

A printed circuit board includes an insulating layer, a wiring layer disposed on the insulating layer and including a plurality of metal pads and at least one metal pattern, and a solder resist layer disposed on an upper portion of the insulating layer, covering at least a portion of the wiring layer, and having a plurality of first openings respectively exposing at least a portion of each of the plurality of metal pads and one or more second openings respectively exposing at least a portion of the at least one metal pattern. The one or more second openings respectively have at least two concave portions concave in a plane toward an inside of each of the second openings. The plurality of first openings and the one or more second openings are disposed in a mounting area of a semiconductor chip of the solder resist layer.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

Abstract

A printed circuit board includes a first substrate including a first antenna pattern; a second substrate disposed on a first substrate and including a second antenna pattern; a metal layer disposed between the first and second substrates; and a bonding layer disposed between the first and second substrates. At least one of the first and second substrates has a cavity having at least a portion disposed between the first and second antenna patterns, each of the first and second substrates includes an organic material, and the bonding layer includes an inorganic material.

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/03 - Use of materials for the substrate
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/14 - Structural association of two or more printed circuits
• H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal

Abstract

A multilayered capacitor according to the present disclosure includes a capacitor body that includes a dielectric layer and an internal electrode, and an external electrode that is disposed on the outside of the capacitor body, and the internal electrode contain a Ni—Ge alloy, and when the average content (wt %) of Ge relative to Ni at the center portion of the internal electrode is denoted by X and the average content (wt %) of Ge relative to Ni at points spaced 20 nm apart from the interface between the internal electrode and the dielectric layer toward the center portion of the internal electrode is denoted by Y, the relationship between X and Y satisfies Expression 1: A multilayered capacitor according to the present disclosure includes a capacitor body that includes a dielectric layer and an internal electrode, and an external electrode that is disposed on the outside of the capacitor body, and the internal electrode contain a Ni—Ge alloy, and when the average content (wt %) of Ge relative to Ni at the center portion of the internal electrode is denoted by X and the average content (wt %) of Ge relative to Ni at points spaced 20 nm apart from the interface between the internal electrode and the dielectric layer toward the center portion of the internal electrode is denoted by Y, the relationship between X and Y satisfies Expression 1: ❘ "\[LeftBracketingBar]" X - Y ❘ "\[RightBracketingBar]" X ≤ 0.2 .

IPC Classes  ?

• H01G 4/008 - Selection of materials
• H01G 4/12 - Ceramic dielectrics
• H01G 4/30 - Stacked capacitors

Abstract

A printed circuit board according to an embodiment includes: a first insulating layer; a first wiring layer buried in the first insulating layer; a first via disposed within a first via hole in the first insulating layer; a second insulating layer disposed below the first insulating layer; a second wiring layer buried in the second insulating layer; a first solder resist layer disposed on the first insulating layer; and a cavity extending along a height direction by penetrating the first solder resist layer and penetrating a portion of the first insulating layer. The cavity includes a first portion, a second portion, and a third portion having different 10 widths. Along the height direction, the first portion is disposed on the second portion and the third portion is disposed on the first portion. The first via is exposed through the second portion of the cavity.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/02 - Printed circuits Details
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes, the body having a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction, and a fifth surface and a sixth surface opposing each other in a third direction, an external electrode including a lower electrode layer, the lower electrode layer disposed between extension lines of the first and second surfaces, an upper electrode layer disposed on the lower electrode layer, the upper electrode layer disposed to extend onto a portion of the first and the second surfaces, and a glass layer disposed between the lower and upper electrode layers. The lower electrode layer includes Ag and a first glass. The upper electrode layer includes Cu and a second glass.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/008 - Selection of materials
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics

Abstract

A multilayer electronic component may include: a body including a capacitance formation portion including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a first direction, an upper cover portion disposed above the capacitance formation portion in the first direction, a lower cover portion disposed below the capacitance formation portion in the first direction, and an identification portion disposed above the upper cover portion in the first direction; and an external electrode disposed on the body, and an average thickness of the lower cover portion may be greater than an average thickness of the upper cover portion, and the identification portion may include a water-repellent material and a non-conductive heat-resistant paint.

IPC Classes  ?

• H01G 4/224 - HousingEncapsulation
• H01G 2/24 - Distinguishing marks, e.g. colour coding
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/30 - Stacked capacitors

Abstract

A multilayer electronic component of the present disclosure may include: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; a connection portion disposed in an end of the internal electrode; an interface plating layer disposed to contact at least a portion of an end of the dielectric layer disposed between the internal electrodes and to cover the connection portion; and an external electrode disposed on the interface plating layer, wherein the connection portion may have a different crystal structure from the internal electrode.

IPC Classes  ?

• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/30 - Stacked capacitors

Abstract

A coil component includes a body, a first coil including a first coil portion having a winding axis oriented in a first direction and first and second lead-out portions, a second coil including a second coil portion having a winding axis oriented in the first direction and third and fourth lead-out portions, a coupling adjustment portion including a first region located in at least a portion of regions overlapping a first core of the first coil portion and a second core of the second coil portion in the first direction, and a second region located in at least a portion of regions surrounding the first region in a lateral direction and having magnetic permeability, different from magnetic permeability of the first region, first to fourth external electrodes respectively connected to the firth to fourth lead-out portions.

IPC Classes  ?

• H01F 27/30 - Fastening or clamping coils, windings, or parts thereof togetherFastening or mounting coils or windings on core, casing, or other support
• H01F 27/28 - CoilsWindingsConductive connections
• H01F 27/29 - TerminalsTapping arrangements

Abstract

A printed circuit board includes an insulating layer and a wiring pattern disposed on or within the insulating layer, wherein the wiring pattern includes a first metal layer, a second metal layer disposed on an upper surface of the first metal layer, and an inorganic oxide film disposed on a side surface of the second metal layer.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/09 - Use of materials for the metallic pattern

Abstract

A multilayer electronic component may include: a body including a dielectric layer and internal electrodes alternately disposed in a first direction; and an external electrode disposed on the body and connected to the internal electrode, wherein the internal electrode may include a plurality of electrode portions and disconnection portions, and the disconnection portion may include at least one of a dielectric and a pore.

IPC Classes  ?

• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/30 - Stacked capacitors

Abstract

A coil component includes an insulating substrate; a coil portion including a coil pattern, having a planar spiral shape, disposed on the insulating substrate; and a body embedding the insulating substrate and the coil portion, wherein the coil pattern comprises a first conductive layer disposed to contact the insulating substrate, and a second conductive layer disposed on the first conductive layer, wherein a thickness (T1) of the insulating substrate and a thickness (T2) of the first conductive layer satisfy 10≤T1/T2≤20.

IPC Classes  ?

• H01F 27/28 - CoilsWindingsConductive connections
• H01F 27/29 - TerminalsTapping arrangements
• H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
• H01F 41/12 - Insulating of windings

Abstract

An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens sequentially disposed in numerical order along an optical axis of the optical imaging system from an object side of the optical imaging system toward an imaging plane of the optical imaging system, wherein the optical imaging system satisfies 1<|f123457−f|/f, where f123457 is a composite focal length of the first to seventh lenses calculated with an index of refraction of the sixth lens set to 1.0, f is an overall focal length of the optical imaging system, and f123457 and f are expressed in a same unit of measurement.

IPC Classes  ?

• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components
• G02B 5/00 - Optical elements other than lenses
• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 13/18 - Optical objectives specially designed for the purposes specified below with lenses having one or more non-spherical faces, e.g. for reducing geometrical aberration
• G02B 27/00 - Optical systems or apparatus not provided for by any of the groups ,
• H04N 23/55 - Optical parts specially adapted for electronic image sensorsMounting thereof

Abstract

A printed circuit board includes a first substrate including a first wiring layer; a second substrate disposed on the first substrate and including a second wiring layer; a metal layer disposed between the first and second substrates; and a bonding layer disposed between the first and second substrates. Each of the first and second substrates includes an organic material, and the bonding layer includes an inorganic material.

IPC Classes  ?

• H05K 1/14 - Structural association of two or more printed circuits
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
• H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal

Abstract

A printed circuit board includes a core layer, a plurality of first wirings disposed on the core layer, a first pad disposed on the core layer, the first pad including an adjacent portion having a side disposed to be substantially parallel to a side of an adjacent first wiring of the plurality of first wirings, and an open portion disposed to not be parallel to the adjacent wiring, among the plurality of first wirings, and a first build-up insulating layer disposed on the core layer, the first build-up insulating layer covering at least a portion of the plurality of first wirings and the first pad. The core layer includes an insulating material, substantially different from that of the first build-up insulating layer.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

A semiconductor package includes a first substrate including a first insulating layer and a first wiring layer disposed on or in the first insulating layer; first and second packages disposed on the first substrate, and each including a substrate, a semiconductor chip on the substrate, connection members connecting the substrate to the semiconductor chip, and a SERDES chip embedded in the substrate; 1-1 connection members connecting the first substrate to the first package; and 2-1 connection members connecting the first substrate to the second package. The number of connection members of the first package is greater than the number of 1-1 connection members. The number of connection members of the second package is greater than the number of 2-1 connection members.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or

Abstract

A multilayer electronic component includes a body containing a dielectric layer and an internal electrode alternately disposed with the dielectric layer, and an external electrode disposed on the body and connected to the internal electrode. The external electrode includes a conductive resin layer including metal particles, core-shell particles including a polymer core and a metal shell disposed on at least a portion of the polymer core, and a resin. The conductive resin layer includes a first region adjacent to the body and a second region adjacent to an outside of the conductive resin layer. In at least one cross section passing through the body, an area fraction occupied by the core-shell particles in the second region is greater than an area fraction occupied by the core-shell particles in the first region.

IPC Classes  ?

• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/30 - Stacked capacitors

Abstract

A coil component includes a body including a first surface, a second surface facing the first surface in a first direction, and a plurality of side surfaces connecting the first surface to the second surface, a support member disposed within the body and having a through-hole, and a coil disposed on at least one surface of the support member, wherein the support member includes a first layer, a second layer disposed on both surfaces of the first layer and contacting the coil, both ends of the coil extend to both side surfaces of the body facing each other in a second direction, respectively, and the first layer extends to one of both side surfaces of the body facing each other in a third direction.

IPC Classes  ?

• H01F 27/32 - Insulating of coils, windings, or parts thereof
• H01F 27/29 - TerminalsTapping arrangements

Abstract

xxM1yyM21-x-y22.

IPC Classes  ?

• H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
• H01M 10/0562 - Solid materials
• H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
• H01M 10/052 - Li-accumulators

Abstract

A circuit board according to the present disclosure includes: a substrate including a first insulating layer with a first surface, and a cavity penetrating the first insulating layer in a direction perpendicular to the first surface; a first wiring layer embedded in the first insulating layer and having at least one surface exposed from the first insulating layer; and a buffer portion disposed adjacent to an edge of the cavity in the first insulating layer and having a receiving surface retreated further from the exposed surface of the first wiring layer. An electronic device package according to the present disclosure includes: an electronic device accommodated in a cavity of the circuit board; an insulation material disposed on the buffer portion to fill and insulate between the electronic device and the first wiring layer; and a redistribution layer disposed on the first surface of the first insulating layer and to which the electronic device is connected.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

A circuit board including a substrate having a first surface and a second surface facing each other, including an insulating layer disposed between the first surface and the second surface, and having a cavity penetrating in a direction perpendicular to the first surface, a first wiring pattern embedded in the insulating layer on the first surface to enable signal transmission, and a first reinforcement pattern embedded in the insulating layer on the first surface, disposed around the cavity to be spaced apart from an edge of the cavity, and configured to be separated from the first wiring pattern.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/42 - Plated through-holes

Abstract

A multilayer electronic component according to an example embodiment of the present disclosure may include: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, and including first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; side margin portions disposed on the fifth and sixth surfaces; and external electrodes disposed on the third and fourth surfaces, and an additional pattern spaced apart from the internal electrodes may be disposed in at least one of a region between the internal electrodes and the fifth surface or a region between the internal electrodes and the sixth surface.

IPC Classes  ?

• H01G 2/00 - Details of capacitors not covered by a single one of groups
• H01G 4/005 - Electrodes
• H01G 4/30 - Stacked capacitors

Abstract

A multilayer electronic component may include: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; an interface plating layer disposed on an end of the internal electrode; and an external electrode disposed to contact at least a portion of an end of the dielectric layer disposed between the internal electrodes and to cover the interface plating layer, and including a conductive resin layer including a conductive metal and a resin.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/008 - Selection of materials
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics

Abstract

A magnetic component includes a magnetic body, wherein the magnetic body includes a plurality of magnetic particles including an Fe-based alloy, at least a portion of magnetic particles, among the plurality of magnetic particles, include a first layer disposed on surfaces of the at least a portion of magnetic particles and a second layer disposed on a surface of the first layer, the first layer includes an Fe oxide component and has an average thickness of less than 5 nm, and the second layer includes an Si oxide component and has an average thickness of 5 nm or more.

IPC Classes  ?

• H01F 3/08 - Cores, yokes or armatures made from powder
• H01F 1/147 - Alloys characterised by their composition

Abstract

A coil component includes a body; a first wound coil including a first coil portion, and first and second lead-out portions; a second wound coil including a second coil portion, and third and fourth lead-out portions; a coupling adjustment portion including a first region through which a winding axis of the first coil portion and a winding axis of the second coil portion pass, and a second region surrounding the first region in a lateral direction; first and second external electrodes respectively connected to the first and second lead-out portions; and third and fourth external electrodes respectively connected to the third and fourth lead-out portions, wherein the first region and the second region include a plurality of magnetic particles and an insulating material interposed between the plurality of magnetic particles, respectively, and magnetic permeability of the first region is different from magnetic permeability of the second region.

IPC Classes  ?

• H01F 27/32 - Insulating of coils, windings, or parts thereof
• H01F 1/147 - Alloys characterised by their composition
• H01F 1/20 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
• H01F 27/02 - Casings
• H01F 27/29 - TerminalsTapping arrangements

Abstract

A lithium ion conductor according to the present disclosure includes a Li element, a B element, an O element, an M element, and an X element and has a peak due to a main crystal phase at diffraction angles (2θ) of 24.5° to 26°, 32° to 34°, 35.5° to 36.2°, 37.5° to 38.5°, 43.5° to 45.5°, or a combination thereof in an X-ray diffraction analysis spectrum using a CuKα ray. The M element is Al, Si, Ge, P, or a combination thereof, and the X element is F, Cl, I, Br, or a combination thereof as a halogen element.

IPC Classes  ?

• H01M 10/0562 - Solid materials

Abstract

A radio frequency (RF) switch circuit and a method for operation of a RF switch circuit. The RF switch circuit may include a first switch connected between a first port and an antenna port, a second switch connected between a second port and the antenna port, a third switch connected between the antenna port and ground, a fourth switch connected between the antenna port and the ground, and a switch control circuit configured to control the first switch, the second switch, and the third switch to be turned off and the fourth switch to be turned on in a low power mode.

IPC Classes  ?

• H03K 3/012 - Modifications of generator to improve response time or to decrease power consumption
• H03K 17/56 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices

Abstract

A multilayer electronic component includes a body including a dielectric layer and an internal electrode layer alternately disposed with the dielectric layer in a first direction, wherein the internal electrode layer includes a main portion, a lead portion extending from the main portion to the external electrode and having a size smaller than the main portion, and a reinforcing pattern disposed on both sides of the lead portion, and the reinforcing pattern includes a carbide.

IPC Classes  ?

• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/30 - Stacked capacitors

Abstract

A printed circuit board includes a substrate; first and second through-portions penetrating between upper and lower surfaces of the substrate; a magnetic layer disposed in the first through-portion; a voltage regulator disposed in the second through-portion; a first through-hole penetrating between upper and lower surfaces of the magnetic layer; a first insulating layer disposed on the substrate, covering the magnetic layer and the voltage regulator, and filling the second through-portion and the first through-hole; a second through-hole penetrating between upper and lower surfaces of the first insulating layer in the first through-hole; a first wiring pattern disposed on an upper surface of the magnetic layer; a second wiring pattern disposed on a lower surface of the magnetic layer; and a first via pattern disposed in the second through-hole and connecting the first and second wiring patterns to each other.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H01L 23/498 - Leads on insulating substrates
• H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

A multilayer electronic component according to an example embodiment of the present disclosure may include: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, and including first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; side margin portions disposed on the fifth and sixth surfaces; and external electrodes disposed on the third and fourth surfaces, wherein at least one of both ends of the internal electrodes in the third direction may be spaced apart from the side margin portion.

IPC Classes  ?

• H01G 4/005 - Electrodes
• H01G 4/12 - Ceramic dielectrics
• H01G 4/224 - HousingEncapsulation
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/30 - Stacked capacitors

Abstract

A multilayer electronic component includes a body having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, the body including a capacitance formation portion including a dielectric layer and an internal electrode, and a cover portion, and an external electrode. When maximum sizes of the multilayer electronic component in the first to third directions are L, W and T, respectively, average sizes of the cover portion, dielectric layer, and internal electrode in the first direction are tc, td, and te, respectively, 0.75 mm≤L≤1.25 mm, 0.25 mm≤W≤0.75 mm, T<0.5 mm, 28 μm≤tc≤34 μm, 0.4 μm≤td≤0.5 μm, and 0.4 μm≤te≤0.5 μm are satisfied.

IPC Classes  ?

• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/30 - Stacked capacitors

Abstract

A coil component includes a body, a support member disposed within the body, a coil disposed on the support member, and including a lower surface in contact with the support member, an upper surface facing the lower surface, an insulating wall covering a side of the coil and filling a gap between respective turns of the coil, an insulating film disposed between adjacent the insulating walls and covering the upper surface of the coil, and an external electrode disposed on the body. The insulating wall includes a plurality of layers, with an interface therebetween. A height of the insulating wall is greater than or equal to a height of an upper surface of the insulating film.

IPC Classes  ?

• H01F 27/32 - Insulating of coils, windings, or parts thereof
• H01F 27/30 - Fastening or clamping coils, windings, or parts thereof togetherFastening or mounting coils or windings on core, casing, or other support

Abstract

An all-solid-state battery according to an embodiment includes: a solid electrolyte layer; a positive electrode layer and a negative electrode layer disposed with the solid electrolyte layer interposed therebetween; and margin layers disposed at edges of the positive electrode layer and the negative electrode layer, respectively, in a lateral direction, wherein the solid electrolyte layer includes a first solid electrolyte that is glass or glass ceramic that does not contain an element S (sulfur), and the margin layers include a second solid electrolyte that is glass or glass ceramic that contains the element S (sulfur).

IPC Classes  ?

• H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
• H01M 10/0562 - Solid materials
• H01M 10/052 - Li-accumulators

Abstract

A multilayer ceramic capacitor and a method of manufacturing the same are disposed. The multilayer ceramic capacitor includes: a body including a plurality of internal electrodes and a dielectric layer interposed between the plurality of internal electrodes; and external electrodes disposed on the body and connected to the internal electrodes, respectively. One of the external electrodes includes a first plating layer, and the first plating layer includes a crystal grain in which an average ratio of major and minor axes thereof is 1:1 to 3:1.

IPC Classes  ?

• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/12 - Ceramic dielectrics
• H01G 4/248 - Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
• H01G 4/30 - Stacked capacitors

Abstract

A disclosed circuit board includes: a first insulating layer that has a first surface and a second surface opposing each other; a first wire layer that is buried within the first insulating layer; and a bump that includes a base portion disposed laterally to the first wire layer to be buried within the first insulating layer and a protrusion portion integrally extending and protruding from the base portion and having a width at an upper end thereof less than a width of the protrusion portion at a height of the first surface.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details

Abstract

A printed circuit board includes a wiring portion including one or more insulating layers, one or more wiring layers respectively disposed on or in the one or more insulating layers, a first pad disposed on a lowermost insulating layer, of the one or more insulating layers, and a second pad disposed on an uppermost insulating layer, of the one or more insulating layers, a first solder resist layer disposed on a lower side of the wiring portion to cover at least a portion of the first pad, the first solder resist layer having a first opening, on the first pad, a second solder resist layer disposed on an upper side of the wiring portion to cover at least a portion of the second pad, a first surface treatment layer disposed on at least a portion of the first pad, and a barrier layer disposed on the first solder resist layer.

IPC Classes  ?

• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Abstract

A coil component includes a body including a first surface and a second surface opposing in a first direction, and a third surface and a fourth surface opposing in a second direction; a coil disposed in the body; a first lead-out electrode connected to an external end of the coil and drawn out to the first surface; a second lead-out electrode connected to an internal end of the coil and drawn out to the second surface; a first external electrode disposed on the third surface, extending to the first surface and connected to the first lead-out electrode; and a second external electrode disposed on the third surface, extending to the second surface and connected to the second lead-out electrode, wherein a thickness of each of the first and second lead-out electrodes in the second direction is smaller than a thickness of the coil in the second direction.

IPC Classes  ?

• H01F 27/29 - TerminalsTapping arrangements
• H01F 17/00 - Fixed inductances of the signal type
• H01F 27/32 - Insulating of coils, windings, or parts thereof

Abstract

A multilayer capacitor includes a body including a dielectric layer and first and second internal electrodes, first external electrodes respectively be connected to the first internal electrode and second external electrodes respectively connected to the second internal electrode. The first internal electrode includes a first main portion and a first lead-out portion. The first lead-out portion includes a first inclined portion and a first connection portion. The first inclined portion is connected to the first main portion and has a side surface, at least a portion of which is inclined with respect to a side surface of the first main portion connected thereto. The first connection portion is connected to the first inclined portion and the first external electrode, and has a side surface, at least a portion of which is inclined with respect to the side surface of the first inclined portion connected thereto.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/008 - Selection of materials
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor

Abstract

An optical imaging system includes a first lens having an object-side surface that is convex; a second lens having a refractive power; a third lens having a refractive power; a fourth lens having a refractive power; a fifth lens having a refractive power and an object-side surface that is concave; and a sixth lens having a refractive power and an object-side surface that is concave, wherein the first lens through the sixth lens are sequentially disposed in numerical order from an object side of the optical imaging system toward an imaging plane, and the optical imaging system satisfies the conditional expressions 0.7

IPC Classes  ?

• G02B 9/62 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having six components only
• G02B 7/04 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 27/00 - Optical systems or apparatus not provided for by any of the groups ,
• G03B 30/00 - Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles

Abstract

An all-solid-state battery includes: a solid electrolyte layer; and a plurality of electrode layers disposed in a stacking direction with the solid electrolyte layer interposed between the plurality of electrode layers. At least one of the plurality of electrode layers includes: a current collector in which an active material accommodating portion is disposed; and an electrode active material layer disposed in the active material accommodating portion and also disposed at at least one surface of the current collector. The active material accommodating portion may include a plurality of slits provided in the current collector.

IPC Classes  ?

• H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
• H01M 4/04 - Processes of manufacture in general
• H01M 4/75 - Wires, rods, or strips
• H01M 50/46 - Separators, membranes or diaphragms characterised by their combination with electrodes

Abstract

A multilayer ceramic capacitor includes: a capacitor body that includes a dielectric layer and an internal electrode layer; and an external electrode that is disposed outside the capacitor body. The internal electrode layer includes nickel (Ni) and cerium (Ce), and along a thickness direction of the internal electrode layer, the internal electrode layer comprises an upper portion, a middle portion, and a lower portion, the middle portion is referred to as a central region, and at least one of the upper portion and the lower portion having an interface between the internal electrode layer and the dielectric layer is referred to as an interface region, both the central region and the interface region of the internal electrode layer include the cerium (Ce), and the interface region includes the cerium (Ce) in a content higher than a content of cerium (Ce) in the central region.

IPC Classes  ?

• H01G 4/008 - Selection of materials
• H01G 4/12 - Ceramic dielectrics
• H01G 4/30 - Stacked capacitors

Abstract

An optical imaging system includes a first lens group, including at least one lens disposed on a first optical axis, a second lens group, including at least one lens disposed on a second optical axis, perpendicular to the first optical axis, and a prism disposed between the first lens group and the second lens group to convert a light path from the first optical axis to the second optical axis. A conditional expression 0.20

IPC Classes  ?

• G02B 9/62 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having six components only
• G02B 5/04 - Prisms

Abstract

A release film including: a base film; and a release layer disposed on one surface of the base film, wherein the release layer is a cured layer of a release composition including a heterocyclic compound including nitrogen and polydimethylsiloxane, and when analyzing a surface using X-ray photoelectron spectroscopy (XPS), the release layer has an atomic ratio of nitrogen (N) to silicon (Si) (N/Si) of 0.6 to 1.1.

IPC Classes  ?

• H01G 4/008 - Selection of materials
• C04B 37/00 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating
• C04B 41/45 - Coating or impregnating
• C04B 41/51 - Metallising
• C08K 5/42 - Sulfonic acidsDerivatives thereof
• C09D 5/16 - Anti-fouling paintsUnderwater paints
• C09D 7/63 - Additives non-macromolecular organic
• C09D 183/08 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
• H01G 4/12 - Ceramic dielectrics
• H01G 4/30 - Stacked capacitors

Abstract

A multilayer electronic component according to an example embodiment may include: a body including a plurality of dielectric layers, a first internal electrode, a second internal electrode, and a margin pattern; and an external electrode disposed on the body. The first and second internal electrodes may be alternately disposed in a first direction with the dielectric layer interposed therebetween, and the margin pattern may be disposed in a position different from the first and second internal electrodes in the first direction and may be disposed so as not to overlap the first internal electrode or the second internal electrode in the first direction.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• C04B 35/64 - Burning or sintering processes
• H01G 4/008 - Selection of materials
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics

Abstract

A multilayer electronic component includes a body including a dielectric layer and an internal electrode disposed on the dielectric layer, an external electrode including a base electrode layer connected to the internal electrode, and an interface layer disposed between an end of the dielectric layer and the base electrode layer. The interface layer includes a first glass containing Ba, Zn, and Si. The base electrode layer includes a second glass containing Ba and Si. When an average molar ratio (Ba/Si) of Ba to Si contained in the first glass is M1 and an average molar ratio (Ba/Si) of Ba to Si contained in the second glass is M2, M1 and M2 satisfy M1/M2≥1.5.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/008 - Selection of materials
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics

Abstract

A lens module includes: a first lens having negative refractive power; a second lens having positive refractive power; a third lens having negative refractive power; a fourth lens having negative refractive power; a fifth lens of which an object-side surface is concave; and a sixth lens having one or more inflection points on an image-side surface thereof, wherein the first to sixth lenses are sequentially disposed from an object side of the lens module to an image side of the lens module.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/62 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having six components only

Abstract

A lens module may include a first lens having positive refractive power; a second lens having positive refractive power; a third lens having negative refractive power; a fourth lens having refractive power; a fifth lens having refractive power; a sixth lens having negative refractive power; and a seventh lens having refractive power and one or more inflection points formed in locations thereof not crossing an optical axis, wherein the first lens, the second lens, the third lens, the fourth lens, the fifth lens, the sixth lens and the seventh lens are disposed in a sequential order from the first lens to the seventh lens.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components
• G02B 27/00 - Optical systems or apparatus not provided for by any of the groups ,

Abstract

A printed circuit board includes: a core substrate including a plurality of core layers; a plurality of magnetic members embedded in each of the plurality of core layers; a first coil pattern disposed on the core substrate; and a second coil pattern disposed below the core substrate.

IPC Classes  ?

• H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• H01F 27/24 - Magnetic cores
• H01F 27/28 - CoilsWindingsConductive connections
• H01F 27/30 - Fastening or clamping coils, windings, or parts thereof togetherFastening or mounting coils or windings on core, casing, or other support
• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

Provided is a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes a capacitor body including a dielectric layer and an internal electrode layer, and an external electrode disposed outside the capacitor body. The dielectric layer includes barium titanate-based main ingredient including barium (Ba) and titanium (Ti), and gallium (Ga)Peak intensity ratio of Ba/Ga (IBa/IGa), obtained by TEM-EDS analysis of a region from an interface between the dielectric layer and the internal electrode layer to a depth surface of 10 nm to 500 nm into the dielectric layer, is 1.0 to 5.0.

IPC Classes  ?

• H01G 4/12 - Ceramic dielectrics
• H01G 4/30 - Stacked capacitors

Abstract

A charge pump system and method of operating the same are provided. The charge pump system includes a charge pump circuit configured to convert an input voltage to an output voltage; a comparator configured to compare the output voltage with a reference voltage, and output a control signal that corresponds to a result of the comparing; a driver configured to generate the input voltage in response to an operation clock signal, and provide the generated input voltage to the charge pump circuit; and a selector configured to provide one of a first clock signal of a first frequency and a second clock signal of a second frequency lower than the first frequency as the operation clock signal to the driver, based on the control signal.

IPC Classes  ?

• H02M 3/07 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode
• H03K 5/24 - Circuits having more than one input and one output for comparing pulses or pulse trains with each other according to input signal characteristics, e.g. slope, integral the characteristic being amplitude

Abstract

A coil component includes a coil component includes a body including a first surface and a second surface opposing each other in a first direction; a coil disposed in the body and including a plurality of coil layers; an insulating layer disposed in each of regions between the plurality of coil layers; an external electrode disposed on the first surface of the body; and a connection portion disposed in the body, connecting one of the plurality of coil layers to the external electrode, and having one surface in contact with the one of the plurality of coil layers and the other surface in contact with the external electrode. The connection portion includes a fusion portion disposed on an end thereof to be in contact with the one of the plurality of coil layers.

IPC Classes  ?

• H01F 27/28 - CoilsWindingsConductive connections
• H01F 27/02 - Casings
• H01F 27/29 - TerminalsTapping arrangements

Abstract

An all-solid-state battery includes: a solid electrolyte layer; and a first electrode layer and a second electrode layer arranged with the solid electrolyte layer therebetween. The first electrode layer and second electrode layer respectively include a current collector including first current collecting portions spaced from each other by through holes in a first direction and second current collecting portions spaced from each other by the through holes in a second direction that is vertical to the first direction and crossing the first current collecting portions, and an electrode active material layer including a first layer disposed on one surface of the current collector and a second layer disposed in the through holes in the current collector.

IPC Classes  ?

• H01M 4/70 - Carriers or collectors characterised by shape or form
• H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
• H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulatorsProcesses of manufacture thereof
• H01M 4/74 - Meshes or woven materialExpanded metal
• H01M 4/75 - Wires, rods, or strips
• H01M 4/76 - Containers for holding the active material, e.g. tubes, capsules
• H01M 10/052 - Li-accumulators

Abstract

An optical imaging system includes a first lens having a positive refractive power, a second lens having a positive refractive power, a third lens having a positive refractive power, a fourth lens having a negative refractive power, a fifth lens having a positive refractive power, wherein an object-side surface of the fifth lens is concave; and a sixth lens having a negative refractive power, wherein the sixth lens has an inflection point formed on an image-side surface thereof, wherein the first to sixth lenses are sequentially disposed from an object side toward an imaging plane.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 5/00 - Optical elements other than lenses
• G02B 5/20 - Filters
• G02B 9/62 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having six components only

Abstract

The present disclosure relates to a printed circuit board including: an insulating layer; a through-hole penetrating between an upper surface and a lower surface of the insulating layer opposing in a thickness direction; a metal wiring disposed inside the through-hole; and a metal via filling the through-hole and covering the metal wire.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/42 - Plated through-holes

Abstract

An optical imaging system includes a first lens group including a first lens and a second lens, a second lens group including a third lens, a fourth lens, and a fifth lens, and a third lens group including a sixth lens and a seventh lens. The first to seventh lenses are arranged in order from an object side, at least one of the first lens group to the third lens group is moved on an optical axis to change a distance between the first lens group to the third lens group, and the following conditional expression is satisfied: An optical imaging system includes a first lens group including a first lens and a second lens, a second lens group including a third lens, a fourth lens, and a fifth lens, and a third lens group including a sixth lens and a seventh lens. The first to seventh lenses are arranged in order from an object side, at least one of the first lens group to the third lens group is moved on an optical axis to change a distance between the first lens group to the third lens group, and the following conditional expression is satisfied: 0.2 < BFL / ( 2 * IMG ⁢ HT ) < 2. where BFL is a distance on the optical axis from an image-side surface of the seventh lens to an imaging surface of an image sensor, and IMG HT is half a diagonal length of the imaging surface of the image sensor.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components
• G02B 13/02 - Telephoto objectives, i.e. systems of the type + – in which the distance from the front vertex to the image plane is less than the equivalent focal length
• H04N 23/55 - Optical parts specially adapted for electronic image sensorsMounting thereof

Abstract

A multilayer electronic component is provided, the multilayer electronic component including: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; an external electrode disposed externally on the body; and a frame terminal including a connection portion disposed on the external electrode and extending in a first direction, a mounting portion spaced apart from the connection portion and extending in a second direction, intersecting the first direction, and a linking portion connecting the connection portion and the mounting portion, wherein the linking portion includes an inward portion extending inwardly from one end of the connection portion in the second direction and an outward portion extending outwardly from one end of the inward portion in the second direction, wherein, when an angle formed by the inward portion and the outward portion is defined as θ, the angle θ satisfies 10°≤θ≤150°.

IPC Classes  ?

• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/30 - Stacked capacitors

Abstract

The present disclosure relates to a printed circuit board including a first insulating layer, a pad disposed on an upper side of the first insulating layer, a protrusion disposed on the pad; and a metal post disposed on the pad and covering the protrusion, wherein the metal post has a tapered shape, such that a width of an upper surface of the metal post is smaller than a width of a lower surface of the metal post, and a method of manufacturing the printed circuit board.

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/498 - Leads on insulating substrates
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Abstract

A printed circuit board includes a glass layer, a through-hole penetrating through the glass layer, a seed layer provided along an inner wall of the through-hole, and a through-via disposed on the seed layer and filling the through-hole. The seed layer includes a carbon-based conductive material.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/03 - Use of materials for the substrate

Abstract

A multilayer electronic component may include a body including a capacitance forming portion including a dielectric layer including a plurality of dielectric grains, and a plurality of internal electrodes alternately disposed to be stacked with the dielectric layer; and an external electrode disposed on the body, wherein the plurality of dielectric grains include a first dielectric grain including a nano domain that is a domain region with a major diameter of 10 nm to 100 nm, and a second dielectric grain including a polar nano region including a domain region with a major diameter of less than 10 nm, and when the number of the first dielectric grains included in the capacitance forming portion is ND, and the number of the second dielectric grains included in the capacitance forming portion is RD, 50%

IPC Classes  ?

• H01G 4/12 - Ceramic dielectrics
• H01G 4/30 - Stacked capacitors

Abstract

A multilayer electronic component includes a body including a capacitance formation portion that is a region a dielectric layer and internal electrodes alternately arranged with the dielectric layer interposed therebetween in a first direction and including first and second surfaces opposing each other in the first direction, and external electrodes disposed on the body. The body further includes cover portions disposed on one side and the other surface of the capacitance formation portion in the first direction. A surface of one of the cover portions includes a flat portion forming the first surface or the second surface, a protrusion protruding from the first surface or the second surface in the first direction, and a recess portion concave from the first surface or the second surface in the first direction. One end of the protrusion is spaced apart from the recess portion and is disposed on the recess portion.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor

Abstract

A composite solid electrolyte according to the present disclosure includes a Garnet-type solid electrolyte and a LISICON-type solid electrolyte containing Cl element. The LISICON-type solid electrolyte is represented by LiaMbPcCldOe, in which M includes Zn, Al, Ga, Si, Ge, Ti, Mg, or a combination thereof, and a, b, c, d, and e are molar ratios of each component and satsify 5≤a≤12, 0

IPC Classes  ?

• H01M 10/0562 - Solid materials
• H01M 10/0525 - Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodesLithium-ion batteries

Abstract

An optical imaging system is provided. The optical imaging system includes a first lens, a second lens, a third lens, and a fourth lens arranged in order from an object side toward an image plane, wherein the first lens may be formed of glass, and wherein a conditional expression 70

IPC Classes  ?

• G02B 9/12 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having three components only
• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 27/00 - Optical systems or apparatus not provided for by any of the groups ,

Abstract

A printed circuit board including: an insulating layer; a wiring layer disposed on an outermost side of the insulating layer and including a first pad and a first pattern; a first post disposed on the first pattern; and a resist layer disposed on the insulating layer and covering the wiring layer and the first post, wherein the resist layer may have a first protrusion in a region covering the first post and may have a first opening exposing the first pad from the resist layer.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

A coil component includes a body having a first surface, a second surface opposing the first surface in a first direction, and side surfaces connecting the first surface and the second surface to each other, a support member disposed in the body, a coil disposed on each of one surface of the support member and the other surface of the support member opposing the one surface in the first direction, including first and second lead-out portions respectively extending to a first side surface and a second side surface of the body opposing each other in a second direction, and a first dummy lead-out portion disposed on the other surface of the support member, and connected to the first lead-out portion. W2/W1 satisfies 0.3 or more and 0.8 or less, W1 is a width of the first lead-out portion, W2 is a width of the first dummy lead-out portion.

IPC Classes  ?

• H01F 27/28 - CoilsWindingsConductive connections
• H01F 27/02 - Casings
• H01F 27/29 - TerminalsTapping arrangements
• H01F 27/30 - Fastening or clamping coils, windings, or parts thereof togetherFastening or mounting coils or windings on core, casing, or other support

Abstract

A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; and an external electrode disposed on the body. The external electrode includes a first electrode layer in contact with the internal electrode and a second electrode layer disposed on the first electrode layer. The first electrode layer includes Cu, the second electrode layer includes Cu and SiC, and an area fraction of SiC in the second electrode layer is 5% or more and 20% or less. Moisture resistance reliability and adhesion strength of a multilayer electronic component may be improved.

IPC Classes  ?

• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/30 - Stacked capacitors

Abstract

A solid oxide cell according to an embodiment includes: a fuel electrode and an air electrode that face each other; and an electrolyte electrode that is disposed between the fuel electrode and the air electrode. The fuel electrode has a plate shape, an edge of the fuel electrode is rounded along a thickness direction of the fuel electrode, the fuel electrode includes a central layer and an outer layer disposed on both sides of the central layer, and a first porosity, which is a porosity of the central layer of the fuel electrode, is smaller than a second porosity, which is a porosity of the outer layer of the fuel electrode.

IPC Classes  ?

• C25B 11/031 - Porous electrodes
• C25B 9/19 - Cells comprising dimensionally-stable non-movable electrodesAssemblies of constructional parts thereof with diaphragms
• C25B 9/77 - Assemblies comprising two or more cells of the filter-press type having diaphragms
• C25B 13/07 - DiaphragmsSpacing elements characterised by the material based on inorganic materials based on ceramics
• H01M 4/86 - Inert electrodes with catalytic activity, e.g. for fuel cells
• H01M 8/12 - Fuel cells with solid electrolytes operating at high temperature, e.g. with stabilised ZrO2 electrolyte
• H01M 8/2404 - Processes or apparatus for grouping fuel cells
• H01M 8/2432 - Grouping of unit cells of planar configuration

Abstract

An imaging lens system includes an optical path folding member including a forwardmost reflective surface disposed closest to an object side, a rearmost reflective surface disposed closest to an imaging plane, and a rear reflective surface disposed to form an acute angle with the rearmost reflective surface and configured to reflect light reflected by the rearmost reflective surface to the imaging plane, and a first lens group disposed on an object side of the forwardmost reflective surface or an image side of the forwardmost reflective surface, wherein an angle between a first virtual plane including the forwardmost reflective surface and a second virtual plane including the rearmost reflective surface is 15 to 27 degrees.

IPC Classes  ?

• H04N 23/55 - Optical parts specially adapted for electronic image sensorsMounting thereof
• G02B 9/10 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having two components only one + and one – component
• G02B 13/00 - Optical objectives specially designed for the purposes specified below

Abstract

A camera module is provided. The camera module includes a lens barrel configured to accommodate a lens, a barrel holder configured to be coupled to the lens barrel, a first reinforcing member, disposed on the lens barrel, a second reinforcing member, disposed on the barrel holder, and configured to be melt-coupled to the first reinforcing member, and a driving unit, configured to move the lens barrel and the barrel holder in an optical axis direction. A driving coil of the driving unit is disposed on a housing of the camera module, and a driving magnet of the driving unit is disposed on the barrel holder.

IPC Classes  ?

• G03B 17/12 - Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
• G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
• G02B 7/10 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification by relative axial movement of several lenses, e.g. of varifocal objective lens
• G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
• H04N 23/51 - Housings
• H04N 23/55 - Optical parts specially adapted for electronic image sensorsMounting thereof

Abstract

The present disclosure relates to a printed circuit board including: an insulating layer, a through-hole penetrating the insulating layer from an upper surface to a lower surface of the insulating layer and having an inclined wall surface; a metal ball disposed within the through-hole and in contact with the inclined wall surface; and a metal via filling the through-hole and surrounding the metal ball.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

The disclosed multilayer ceramic capacitor includes a ceramic main body including a first surface and a second surface facing in a first direction, a third surface and a fourth surface facing in a second direction and connecting the first surface and the second surface, and a fifth surface and a sixth surface facing in a third direction and connecting the first surface and the second surface, an internal electrode disposed inside the ceramic main body, a protective layer disposed on the third surface and the fourth surface of the ceramic main body, and a connection electrode covering the protective layer. The protective layer includes a first protective layer disposed on the third surface and a second protective layer disposed on the fourth surface, and has openings positioned on the third surface and the fourth surface.

IPC Classes  ?

• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/30 - Stacked capacitors

Abstract

A multilayered capacitor includes: a body including a first internal electrode and a second internal electrode disposed in a first direction while having a dielectric layer therebetween; and a first external electrode and a second external electrode respectively disposed at ends of the body in a second direction. The first internal electrode includes a first capacitance forming portion and a plurality of first lead portions extending from the first capacitance forming portion to connect to the first external electrode. The second internal electrode includes a second capacitance forming portion overlapping the first capacitance forming portion in the first direction and a plurality of second lead portions extending from the second capacitance forming portion to connect to the second external electrode. For a thickness in the first direction, one of the plurality of the first lead portion has a thickness smaller than a thickness of the first capacitance forming portion.

IPC Classes  ?

• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/30 - Stacked capacitors

Abstract

An imaging lens system includes a first lens group, an optical path conversion element, and a second lens group arranged in order from an object side. An optical axis of the second lens group is disposed eccentrically in a direction with respect to a geometric optical axis of the optical path conversion element.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 3/00 - Simple or compound lenses
• G03B 17/17 - Bodies with reflectors arranged in beam forming the photographic image, e.g. for reducing dimensions of camera

Abstract

A multilayer capacitor may include a capacitor body including a dielectric layer and an internal electrode, and an external electrode disposed outside the capacitor body, where the capacitor body may include titanium (Ti) and indium (In), and in the entire capacitor body, the content of the indium (In) based on 100 moles of titanium (Ti) may be 0.2 moles to 4 moles.

IPC Classes  ?

• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/008 - Selection of materials
• H01G 4/12 - Ceramic dielectrics
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/30 - Stacked capacitors

Abstract

A printed circuit board includes: a first insulating layer; a cavity unit including a first cavity penetrating through a portion of the first insulating layer from an upper surface thereof in a thickness direction, and a second cavity penetrating through another portion of the first insulating layer from the first cavity; a first wiring layer disposed at an upper side of the first insulating layer; a second wiring layer disposed at a lower side of the first insulating layer; and a third wiring layer at least partially buried in the first insulating layer and disposed on a level between the first and second wiring layers in the thickness direction. The third wiring layer includes pads in which at least a portion of each of upper surfaces thereof is exposed from the first insulating layer through the cavity unit, and the first cavity has a wider cross-section than the second cavity.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

An imaging lens system is provided. The imaging lens system includes a first lens having refractive power, a second lens having refractive power, a third lens having a convex object-side surface, a fourth lens having refractive power, a fifth lens having refractive power, and a sixth lens having refractive power. The first lens to the sixth lens are sequentially arranged from an object side toward an imaging plane. The imaging lens system satisfies the conditional expressions TTL/f<1.0 and 0.9

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/62 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having six components only

Abstract

A printed circuit board includes a first wiring portion including a plurality of first wirings, a first integrated circuit chip connected to one side of the first wiring portion, the first integrated circuit chip configured to convert N signals into one signal, where N is a natural number, a second integrated circuit chip connected to an opposite side of the first wiring portion, the second integrated circuit chip configured to convert one signal into N signals, a second-first wiring portion connected to the first integrated circuit chip, the second-first wiring portion including a plurality of second-first wirings, and a second-second wiring portion connected to the second integrated circuit chip, the second-second wiring portion including a plurality of second-second wirings. X and Y1 satisfy Y1/N

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

A coil electronic component includes: a body surrounding a first coil with both ends exposed to the outside of the body and a second coil with both ends exposed to the outside of the body, and including a magnetic material; and external electrodes connected to the first coil and the second coil. One of the external electrodes includes an intermetallic compound disposed on the exposed ends of the first coil and the second coil, respectively.

IPC Classes  ?

• H01F 27/29 - TerminalsTapping arrangements
• H01F 27/28 - CoilsWindingsConductive connections

Abstract

A printed circuit board includes: a first insulating layer; a first wiring layer embedded in the first insulating layer on one side thereof; a glass layer disposed on the other side, opposite to the one side of the first insulating layer; a second wiring layer disposed on the glass layer; and a first via layer connecting the first wiring layer and the second wiring layer to each other, and including a first via portion penetrating the glass layer and a second via portion penetrating the first insulating layer. In a cross-sectional view of the printed circuit board, at least one of the first via portion and the second via portion has a width becoming substantially narrower toward the first wiring layer.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A coil component according to an aspect of the present disclosure includes a coil component having a body including a first surface and a second surface opposing each other in a first direction, and a third surface and a fourth surface connecting the first surface to the second surface and opposing each other in a second direction; a coil disposed in the body; an external electrode disposed on the body and connected to the coil; and a first heat dissipation portion disposed on the first surface, wherein the body includes a groove disposed in a region between the first heat dissipation portion and the external electrode.

IPC Classes  ?

• H01F 27/22 - Cooling by heat conduction through solid or powdered fillings
• H01F 27/32 - Insulating of coils, windings, or parts thereof

Abstract

An imaging device includes a first lens assembly including a plurality of first lens modules and a single first image sensor, and a second lens assembly including a plurality of second lens modules and a single second image sensor, wherein the first lens assembly and the second lens assembly are arranged to be adjacent to each other, wherein a field of view of each first lens module of the plurality of first lens modules is wider than a field of view of each second lens module of the plurality of second lens modules, and wherein f35t/f35w≥2 is satisfied, where f35t is a 35 mm equivalent focal length of the second lens module and f35w is a 35 mm equivalent focal length of the first lens module.

IPC Classes  ?

• H04N 23/55 - Optical parts specially adapted for electronic image sensorsMounting thereof
• H04N 23/698 - Control of cameras or camera modules for achieving an enlarged field of view, e.g. panoramic image capture

Abstract

An all-solid-state battery includes a solid electrolyte layer and a first electrode layer and a second electrode layer disposed in a stacking direction with the solid electrolyte layer interposed therebetween, and having different polarities. Each of the first electrode layer and the second electrode layer includes a central portion and an outer portion located outside the central portion. The central portions of the first electrode layer and the second electrode layer overlap each other and overlap the solid electrolyte layer in the stacking direction. The outer portions of the first electrode layer and the second electrode layer overlap the solid electrolyte layer in the stacking direction, and have corner portions located on opposite sides to each other along a diagonal direction in different electrode layers.

IPC Classes  ?

• H01M 10/0562 - Solid materials
• H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
• H01M 50/593 - SpacersInsulating plates