Server baskets for use in immersion tanks are described herein. In one example, a server basket may be configured to receive a computer server. The server basket may include a cable management housing that has one or more data and power ports. The cable management housing may be located at or proximate to a top portion of the server basket. When the server basket is immersed in dielectric fluid in an immersion tank, the cable management housing may be located above a liquid level, thereby providing convenient access to the one or more ports. A signal repeater may be located in the cable management housing and above the liquid level. The server basket may include support arms that can be deployed when removing the server from the dielectric fluid. The support arms may enable drip drying and fluid recapture by the immersion tank. Other examples may be claimed or described.
Liquid immersion cooling apparatus; coolant distribution
units (CDUs) for liquid cooling; liquid immersion cooling
apparatus for use in data centers and micro data centers;
liquid immersion cooling units for cooling information
technology hardware; housings containing liquid immersion
cooling units.
3.
BAFFLE ASSEMBLY FOR USE IN AN IMMERSION COOLING SYSTEM
A two-phase immersion cooling system may include an immersion tank containing dielectric fluid. When cooling an electronic device that is immersed in the dielectric fluid, vigorous boiling may occur proximate to the device, and a stream of vapor bubbles may be produced. To prevent the stream of vapor bubbles from adversely affecting cooling performance elsewhere in the immersion tank, a baffle assembly may be provided. The baffle assembly may be removably attachable to the electronic device. In one embodiment, the baffle assembly may include a plate having one or more slots. The baffle assembly may include one or more posts extending from the plate and being configured to attach to a substrate of the electronic device. The baffle assembly may include a baffle that is removably attachable to the one or more slots. Other examples may be claimed or described.
(1) Liquid immersion cooling apparatus; coolant distribution units (CDUs) for liquid cooling; liquid immersion cooling apparatus for use in data centers and micro data centers; liquid immersion cooling units for cooling information technology hardware; housings containing liquid immersion cooling units.
Liquid immersion cooling apparatus; coolant distribution units (CDUs) for liquid cooling; liquid immersion cooling apparatus for use in data centers and micro data centers; liquid immersion cooling units for cooling information technology hardware; housings containing liquid immersion cooling units.
6.
ACTIVELY CONTROLLED IMMERSION COOLING SYSTEM AND METHOD
Embodiments of immersion cooling systems and methods of operation are described herein. In one example, a method of operating an immersion cooling system can include providing an immersion cooling system, providing IT equipment to be cooled by the immersion cooling system, performing a readiness check of the immersion cooling system, performing a performance check of the immersion cooling system, determining a cooling power of the immersion cooling system, determining a cooling need of the IT equipment, determining a power delta, and adjusting a setting of the immersion cooling system or a setting of the IT equipment to reduce the power delta if the power delta is nonzero. Other examples may be described and claimed.
Condenser tubes with non-uniform surface enhancements are described herein. In one example, the condenser tube may include a tube having a first end, a second end opposite the first end, an interior surface, and an exterior surface. The condenser tube may have a longitudinal bore defined by the interior surface and extending from the first end to the second end and configured to transport a coolant. The exterior surface may have a top portion and a bottom portion. The top portion may have a substantially smooth region. The bottom portion may have a plurality of surface enhancements extending longitudinally from the first end to the second end. In one application, the condenser tubes with non-uniform surface enhancements may be deployed in condensers for two-phase immersion cooling systems. Other examples may be claimed or described.
F28F 1/28 - Tubular elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being integral with the element the element being built-up from finned sections
Server baskets for use in immersion tanks are described herein. In one example, a server basket may be configured to receive a computer server. The server basket may include a cable management housing that has one or more data and power ports. The cable management housing may be located at or proximate to a top portion of the server basket. When the server basket is immersed in dielectric fluid in an immersion tank, the cable management housing may be located above a liquid level, thereby providing convenient access to the one or more ports. A signal repeater may be located in the cable management housing and above the liquid level. The server basket may include support arms that can be deployed when removing the server from the dielectric fluid. The support arms may enable drip drying and fluid recapture by the immersion tank. Other examples may be claimed or described.
Embodiments of busbar assemblies for use in immersion cooling apparatuses are described herein. In one embodiment, a busbar assembly may include an insulator block and a busbar. The insulator block may include a first barrier having a first barrier height, a second barrier having a second barrier height, a channel located between the first barrier and the second barrier, and a slot formed in the channel. The busbar may be positioned in the slot and have an effective busbar height that is less than the first barrier height and less than the second barrier height. Other examples may be described and claimed.
A filter assembly for dielectric fluid may include a filter body. The filter body may include an inlet and an outlet. The filter assembly may include a first compartment located between the inlet and the outlet. The filter assembly may include a second compartment located between the first compartment and the outlet. The filter assembly may include a flow distributing structure located between the inlet and the first compartment. The flow distributing structure may be positioned along a centerline of the inlet and configured to distribute dielectric fluid entering the filter assembly in at least two diverging directions within the filter assembly. By doing so, the flow distributing structure may improve distribution of the fluid through one or more filter materials in the first and second compartments and thereby improve filtering performance. Other examples may be claimed or described.
B01D 24/00 - Filters comprising loose filtering material, i.e. filtering material without any binder between the individual particles or fibres thereof
B01D 24/10 - Filters comprising loose filtering material, i.e. filtering material without any binder between the individual particles or fibres thereof with the filter bed stationary during the filtration the filtering material being held in a closed container
B01D 24/40 - Feed or discharge devices for feeding
B01D 24/04 - Filters comprising loose filtering material, i.e. filtering material without any binder between the individual particles or fibres thereof with the filter bed stationary during the filtration the filtering material being clamped between pervious fixed walls
B01D 24/06 - Filters comprising loose filtering material, i.e. filtering material without any binder between the individual particles or fibres thereof with the filter bed stationary during the filtration the filtering material being clamped between pervious fixed walls the pervious walls comprising a series of louvres or slots
C02F 1/00 - Treatment of water, waste water, or sewage
11.
ACTIVELY CONTROLLED IMMERSION COOLING SYSTEM AND METHOD
Embodiments of immersion cooling systems and methods of operation are described herein. In one example, a method of operating an immersion cooling system can include providing an immersion cooling system, providing IT equipment to be cooled by the immersion cooling system, performing a readiness check of the immersion cooling system, performing a performance check of the immersion cooling system, determining a cooling power of the immersion cooling system, determining a cooling need of the IT equipment, determining a power delta, and adjusting a setting of the immersion cooling system or a setting of the IT equipment to reduce the power delta if the power delta is nonzero. Other examples may be described and claimed.
A two-phase immersion cooling system may include an immersion tank configured to receive a dielectric fluid. The immersion tank may have an interior volume including a lower portion and an upper portion. The immersion tank may have an electronic device region configured to receive one or more electronic devices. The system may include a condenser mounted in the upper portion of the immersion tank. The system may include a liquid deflector located in the upper portion of the immersion tank and at least partially between a top side of the electronic device region and a top side of the condenser. The liquid deflector may be configured to prevent or inhibit dielectric liquid from splashing from the electronic device region onto the condenser. Other examples may be claimed or described.
A two-phase immersion cooling system may include an immersion tank containing dielectric fluid. When cooling an electronic device that is immersed in the dielectric fluid, vigorous boiling may occur proximate to the device, and a stream of vapor bubbles may be produced. To prevent the stream of vapor bubbles from adversely affecting cooling performance elsewhere in the immersion tank, a baffle assembly may be provided. The baffle assembly may be removably attachable to the electronic device. In one embodiment, the baffle assembly may include a plate having one or more slots. The baffle assembly may include one or more posts extending from the plate and being configured to attach to a substrate of the electronic device. The baffle assembly may include a baffle that is removably attachable to the one or more slots. Other examples may be claimed or described.
An immersion cooling system may include an immersion tank filled with dielectric fluid. To reduce vapor loss when accessing the tank, a retractable cover sheet assembly may be provided. The assembly may include a case having side walls defining an opening. A retractable cover sheet may be located above the opening of the case. The retractable cover sheet may be movable from a first position to a second position to provide a sized opening that is smaller than the opening of the case. A condenser may be mounted to a side wall of the case. The condenser may condense dielectric vapor at or near the sized opening. The condenser may be recessed from the sized opening to avoid interfering with servers being raised or lowered through the sized opening during hot swapping or servicing. Other examples may be claimed or described.
A two-phase immersion cooling apparatus may include an immersion tank with a primary condenser in thermal communication with an interior volume of the immersion tank and a vapor management system fluidically connected to the immersion tank. The vapor management system may enable the apparatus to effectively manage periods of high vapor production by removing vapor and other gases from a headspace of the immersion tank, condensing the vapor to liquid, and returning the liquid to the immersion tank.
A device for and method of hot swapping one or more electronic devices from an immersion cooling tank having a first opening, the device including a condensing unit removably locatable in first opening of the immersion cooling tank, the condensing device having a condensing coil forming a second opening through which the electronic device(s) is removable. A retractable cover sheet assembly, under computer control, is positioned to form a sized opening, which may include a containment structure, prior to opening the tank lid to minimize dielectric fluid loss.
A method and system for controlling operation of an immersion cooling system to filter a heat transfer fluid having an immersion cooling tank adapted to contain the heat transfer fluid used to immersion cool a heat-generating object contained therein, the method and system comprises: sampling the heat transfer fluid in the tank; measuring at least one property or parameter of the sampled heat transfer fluid; generating and transmitting measurement data to a control unit; comparing measurement data with respective threshold data using the control unit; and filtering the heat transfer fluid with a filter based on the comparison results of the control unit.
09 - Scientific and electric apparatus and instruments
11 - Environmental control apparatus
40 - Treatment of materials; recycling, air and water treatment,
Goods & Services
Liquid immersion cooling apparatus for processors,
electronic circuits, central processing units [cpu] and
electronic components; central processing unit (cpu)
coolers; microprocessor chips; electronic components for
computers; electronic circuit coolers; mobile computer data
centers comprising computer hardware, central processing
unit (cpu) coolers, and servers; replacement and structural
parts and components for all of the foregoing. Liquid cooling system, namely, a cooling tank and cooling
container containing liquid immersion cooling apparatus for
cooling electronic components and integrated circuits. Custom liquid immersion cooling systems and electronic
circuit cooler manufacturing services for others; prototype
custom fabrication of products for liquid immersion cooling
and of electronic circuit coolers; consulting services in
the field of custom fabrication of liquid immersion cooling
systems cooling central processing units, microprocessor
chips, electronic components for computers, and other
electronic devices.
09 - Scientific and electric apparatus and instruments
11 - Environmental control apparatus
40 - Treatment of materials; recycling, air and water treatment,
Goods & Services
(1) Liquid immersion cooling apparatus for processors, electronic circuits, central processing units [cpu] and electronic components; central processing unit (cpu) coolers; microprocessor chips; electronic components for computers; electronic circuit coolers; mobile computer data centers comprising computer hardware, central processing unit (cpu) coolers, and servers; replacement and structural parts and components for all of the foregoing.
(2) Liquid cooling system, namely, a cooling tank and cooling container containing liquid immersion cooling apparatus for cooling electronic components and integrated circuits. (1) Custom liquid immersion cooling systems and electronic circuit cooler manufacturing services for others; prototype custom fabrication of products for liquid immersion cooling and of electronic circuit coolers; consulting services in the field of custom fabrication of liquid immersion cooling systems cooling central processing units, microprocessor chips, electronic components for computers, and other electronic devices.
Embodiments of busbar assemblies for immersion cooling are described herein. In one embodiment, a busbar assembly (100) can include an insulator block (10) and a busbar (20). The insulator block can include a first barrier extending from a first end of the insulator block to a second end of the insulator block. The insulator block (10) can include a second barrier extending from the first end to the second end. The first barrier can include a first support surface. The second barrier can include a second support surface. The insulator block (10) can include a channel between the first barrier and the second barrier. The channel can extend from the first end to the second end. The busbar (20) can be positioned in the channel. The busbar may have a top surface that is recessed below the first support surface and the second support surface. Other examples may be described and claimed. To be accompanied, when published, by figure 3A of the drawings.
40 - Treatment of materials; recycling, air and water treatment,
09 - Scientific and electric apparatus and instruments
11 - Environmental control apparatus
Goods & Services
Custom liquid immersion cooling systems and electronic circuit cooler manufacturing services for others; Prototype fabrication of custom liquid immersion cooling systems and electronic circuit coolers; Consulting services in the field of custom fabrication of liquid immersion cooling systems cooling central processing units, microprocessor chips, electronic components for computers, and other electronic devices Central processing unit (CPU) coolers; Microprocessor chips; Electronic components for computers; Mobile computer data centers comprising computer hardware, central processing unit (CPU) coolers, and servers; Replacement and structural parts and components for all of the foregoing Liquid cooling system, namely, a cooling tank and cooling container containing liquid immersion cooling apparatus for cooling electronic components and integrated circuits
Liquid cooling system, namely, a cooling tank and cooling
container containing liquid immersion cooling apparatus for
cooling electronic components and integrated circuits.
23.
TWO-PHASE IMMERSION COOLING APPARATUS WITH ACTIVE VAPOR MANAGEMENT
A two-phase immersion cooling apparatus may include an immersion tank with a primary condenser in thermal communication with an interior volume of the immersion tank and a vapor management system fluidically connected to the immersion tank. The vapor management system may enable the apparatus to effectively manage periods of high vapor production by removing vapor and other gases from a headspace of the immersion tank, condensing the vapor to liquid, and returning the liquid to the immersion tank.
Liquid cooling system, namely, a cooling tank and cooling container containing liquid immersion cooling apparatus for cooling electronic components and integrated circuits
A device for and method of hot swapping one or more electronic devices from an immersion cooling tank having a first opening, the device including a condensing device removably locatable in the first opening of the immersion cooling tank, the condensing device having a condensing coil forming a second opening through which the electronic device(s) is removable and an apparatus coupled to the condensing device for selectively adjusting a height and/or a location of the condensing device about the first opening of the immersion cooling tank.
B66C 17/12 - Overhead travelling cranes comprising one or more substantially-horizontal girders the ends of which are directly supported by wheels or rollers running on tracks carried by spaced supports specially adapted for particular purposes, e.g. in foundries, forgesOverhead travelling cranes comprising one or more substantially-horizontal girders the ends of which are directly supported by wheels or rollers running on tracks carried by spaced supports combined with auxiliary apparatus serving particular purposes for handling workpieces, e.g. ingots, which require to be supported temporarily within, or withdrawn from, a treatment chamber, e.g. tong cranes, soaking-pit cranes, stripper cranes
B66C 19/00 - Cranes comprising trolleys or crabs running on fixed or movable bridges or gantries
B66C 23/36 - Cranes comprising essentially a beam, boom or triangular structure acting as a cantilever and mounted for translatory or swinging movements in vertical or horizontal planes or a combination of such movements, e.g. jib cranes, derricks or tower cranes specially adapted for use in particular locations or for particular purposes mounted on road or rail vehiclesManually-movable jib cranes for use in workshopsFloating cranes
B66C 23/34 - Self-erecting cranes, i.e. with hoisting gear adapted for crane erection purposes
B66C 23/90 - Devices for indicating or limiting lifting movement
09 - Scientific and electric apparatus and instruments
37 - Construction and mining; installation and repair services
40 - Treatment of materials; recycling, air and water treatment,
41 - Education, entertainment, sporting and cultural services
42 - Scientific, technological and industrial services, research and design
Goods & Services
Central processing unit (cpu) coolers; microprocessor chips;
electronic components for computers; electronic circuit
coolers; mobile computer data centers comprising computer
hardware, central processing unit (cpu) coolers, and
servers; replacement and structural parts and components for
all of the foregoing. Installation, maintenance and repair of computer hardware;
installation, maintenance and repair of central processing
units, microprocessor chips, electronic components for
computers, and electronic circuit coolers; consulting
services in the fields of installing and maintaining central
processing units, microprocessor chips, electronic
components for computers and electronic circuit coolers. Custom electronic and mechanical computer central processing
unit, microprocessor chip, computer electronic component,
and electronic circuit cooler manufacturing services for
others; prototype fabrication of products for others;
consulting services in the field of custom fabrication of
central processing units, microprocessor chips, electronic
components for computers, and electronic circuit coolers. Providing training in the field of installation, operation
and maintenance of central processing units, microprocessor
chips, electronic components for computers, and electronic
circuit coolers; providing online training services in the
field of installation, operation and maintenance of central
processing units, microprocessor chips, electronic
components for computers, and electronic circuit coolers. Rental of computer hardware; rental of modular, portable
computer data centers comprising computer hardware, central
processing unit (cpu) coolers, and servers; technical
consulting services in the field of planning, designing, and
engineering central processing units, microprocessor chips,
electronic components for computers, and electronic circuit
coolers; research and development in the field of the liquid
immersion cooling of electronic components and integrated
circuits; rental of central processing units, microprocessor
chips, electronic components for computers, and electronic
circuit coolers; technical advice relating to operation of
central processing units, microprocessor chips, electronic
component for computers, and electronic circuit coolers.
Embodiments of busbar assemblies for immersion cooling are described herein. In one embodiment, a busbar assembly can include an insulator block and a busbar. The insulator block can include a first barrier extending from a first end of the insulator block to a second end of the insulator block. The insulator block can a second barrier extending from the first end to the second end. The first barrier can include a first support surface. The second barrier can include a second support surface. The insulator block can include a channel between the first barrier and the second barrier. The channel can extend from the first end to the second end. The busbar can be positioned in the channel. The busbar may have a top surface that is recessed below the first support surface and the second support surface. Other examples may be described and claimed.
A method and system for controlling operation of an immersion cooling system having an immersion cooling tank adapted to contain a heat transfer fluid used to immersion cool a heat-generating object contained therein, the method including: sampling a volume of the heat transfer fluid while the object remains in an operating state; measuring at least one property or parameter of the sampled heat transfer fluid; generating and transmitting measurement data to a control unit; comparing measurement data with respective threshold data using the control unit; and controlling operation of the immersion cooling system with the control unit based on the comparison.
An immersion cooling system (100) for cooling an object in an immersion cooling tank (102) including an anti-sloshing device (127) adapted to be attached to or attachable to (e.g., an inner surface (121) of) the immersion cooling tank, the device including a connecting device(s), a first plate (129) fixedly attached to or rotatably attached to the connecting device (128), and a second plate (130) rotatably attached to the connecting device.
A method and system for controlling operation of an immersion cooling system (200) having an immersion cooling tank (202) adapted to contain a heat transfer fluid (203) used to immersion cool a heat-generating object (201) contained therein, the method including: sampling a volume of the heat transfer fluid (203) while the object (201) remains in an operating state; measuring at least one property or parameter of the sampled heat transfer fluid (203); generating and transmitting measurement data to a control unit (214); comparing measurement data with respective threshold data using the control unit (214); and controlling operation of the immersion cooling system (200) with the control unit (214) based on the comparison.
An immersion cooling system for cooling an object in an immersion cooling tank including an anti-sloshing device adapted to be attached to or attachable to (e.g., an inner surface of) the immersion cooling tank, the device including a connecting device(s), a first plate fixedly attached to or rotatably attached to the connecting device, and a second plate rotatably attached to the connecting device.
09 - Scientific and electric apparatus and instruments
37 - Construction and mining; installation and repair services
40 - Treatment of materials; recycling, air and water treatment,
41 - Education, entertainment, sporting and cultural services
42 - Scientific, technological and industrial services, research and design
Goods & Services
(1) Central processing unit (cpu) coolers; microprocessor chips; electronic circuit coolers; mobile computer data centers comprising computer hardware, central processing unit (cpu) coolers, and servers; parts for electronic circuit coolers. (1) Installation, maintenance and repair of computer hardware; installation, maintenance and repair of central processing units, microprocessor chips, electronic components for computers, and electronic circuit coolers; consulting services in the fields of installing and maintaining central processing units, microprocessor chips, electronic components for computers and electronic circuit coolers.
(2) Custom electronic and mechanical computer central processing unit, microprocessor chip, computer electronic component, and electronic circuit cooler manufacturing services for others; consulting services in the field of custom fabrication of central processing units, microprocessor chips, electronic components for computers, and electronic circuit coolers.
(3) Providing training in the field of installation, operation and maintenance of central processing units, microprocessor chips, electronic components for computers, and electronic circuit coolers; providing online training services in the field of installation, operation and maintenance of central processing units, microprocessor chips, electronic components for computers, and electronic circuit coolers.
(4) Rental of computer hardware; rental of modular, portable computer data centers comprising computer hardware, central processing unit (cpu) coolers, and servers; technical consulting services in the field of planning, designing, and engineering central processing units, microprocessor chips, electronic components for computers, and electronic circuit coolers; research and development in the field of the liquid immersion cooling of electronic components and integrated circuits; rental of central processing units, microprocessor chips, electronic components for computers, and electronic circuit coolers; technical advice relating to operation of central processing units, microprocessor chips, electronic component for computers, and electronic circuit coolers.
A device for and method of hot swapping one or more electronic devices from an immersion cooling tank having a first opening, the device including a condensing device removably locatable in the first opening of the immersion cooling tank, the condensing device having a condensing coil forming a second opening through which the electronic device(s) is removable and an apparatus coupled to the condensing device for selectively adjusting a height and/or a location of the condensing device about the first opening of the immersion cooling tank.
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
B66C 23/90 - Devices for indicating or limiting lifting movement
B66C 17/12 - Overhead travelling cranes comprising one or more substantially-horizontal girders the ends of which are directly supported by wheels or rollers running on tracks carried by spaced supports specially adapted for particular purposes, e.g. in foundries, forgesOverhead travelling cranes comprising one or more substantially-horizontal girders the ends of which are directly supported by wheels or rollers running on tracks carried by spaced supports combined with auxiliary apparatus serving particular purposes for handling workpieces, e.g. ingots, which require to be supported temporarily within, or withdrawn from, a treatment chamber, e.g. tong cranes, soaking-pit cranes, stripper cranes
B66C 19/00 - Cranes comprising trolleys or crabs running on fixed or movable bridges or gantries
B66C 23/36 - Cranes comprising essentially a beam, boom or triangular structure acting as a cantilever and mounted for translatory or swinging movements in vertical or horizontal planes or a combination of such movements, e.g. jib cranes, derricks or tower cranes specially adapted for use in particular locations or for particular purposes mounted on road or rail vehiclesManually-movable jib cranes for use in workshopsFloating cranes
B66C 23/34 - Self-erecting cranes, i.e. with hoisting gear adapted for crane erection purposes
35.
Two-phase immersion cooling apparatus with active vapor management
A two-phase immersion cooling apparatus may include an immersion tank with a primary condenser in thermal communication with an interior volume of the immersion tank and a vapor management system fluidically connected to the immersion tank. The vapor management system may enable the apparatus to effectively manage periods of high vapor production by removing vapor and other gases from a headspace of the immersion tank, condensing the vapor to liquid, and returning the liquid to the immersion tank.
G05D 15/00 - Control of mechanical force or stressControl of mechanical pressure
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
G01F 1/74 - Devices for measuring flow of a fluid or flow of a fluent solid material in suspension in another fluid
F28F 27/02 - Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus for controlling the distribution of heat-exchange media between different channels
36.
Method and apparatus for recovering dielectric fluids used for immersion cooling
A method of and system for recovering a dielectric fluid used for immersion cooling of electronic devices, the method including filtering the dielectric fluid to remove a first group of solid contaminants; distilling the filtered dielectric fluid in one or more distillation tanks to produce a vaporized dielectric fluid; separating the vaporized dielectric fluid from less volatile contaminants, such that the vaporized dielectric fluid is introduced as a condensate into a circulation tank; circulating the condensate by pumping the condensate from the circulation tank through one or more filters; filtering the circulating condensate through the filter(s) to remove a second group of contaminants; and returning the filtered condensate to the circulation tank.
B01D 36/00 - Filter circuits or combinations of filters with other separating devices
B01D 5/00 - Condensation of vapoursRecovering volatile solvents by condensation
B01D 15/08 - Selective adsorption, e.g. chromatography
B01D 29/56 - Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups Filtering elements therefor with multiple filtering elements, characterised by their mutual disposition in series connection
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
37.
Method and apparatus for recovering dielectric fluids used for immersion cooling
A method of and system for recovering a dielectric fluid used for immersion cooling of electronic devices, the method including filtering the dielectric fluid to remove a first group of solid contaminants; distilling the filtered dielectric fluid in one or more distillation tanks to produce a vaporized dielectric fluid; separating the vaporized dielectric fluid from less volatile contaminants, such that the vaporized dielectric fluid is introduced as a condensate into a circulation tank; circulating the condensate by pumping the condensate from the circulation tank through one or more filters; filtering the circulating condensate through the filter(s) to remove a second group of contaminants; and returning the filtered condensate to the circulation tank.
B01D 36/00 - Filter circuits or combinations of filters with other separating devices
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
B01D 29/56 - Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups Filtering elements therefor with multiple filtering elements, characterised by their mutual disposition in series connection
B01D 5/00 - Condensation of vapoursRecovering volatile solvents by condensation
B01D 15/08 - Selective adsorption, e.g. chromatography
40 - Treatment of materials; recycling, air and water treatment,
37 - Construction and mining; installation and repair services
41 - Education, entertainment, sporting and cultural services
42 - Scientific, technological and industrial services, research and design
Goods & Services
Consulting services in the field of custom fabrication of electronic circuit coolers Installation, maintenance and repair of electronic circuit coolers Providing training in the field of installation, operation and maintenance of electronic circuit coolers Technical consulting services in the field of planning, designing, and engineering electronic circuit coolers; Research and development in the field of the liquid immersion cooling of electronic components and integrated circuits; Technical advice relating to operation of electronic circuit coolers
09 - Scientific and electric apparatus and instruments
Goods & Services
Central processing unit (CPU) coolers; Electronic circuit coolers; Mobile computer data centers comprising central processing unit (CPU) coolers; Replacement and structural parts and components for all of the foregoing
Liquid cooling system, namely, a cooling tank and cooling
container containing liquid immersion cooling apparatus for
cooling electronic components and integrated circuits.
(1) Liquid cooling system, namely, a cooling tank and cooling container containing liquid immersion cooling apparatus for cooling electronic components and integrated circuits
An immersion cooling system for electronic equipment including a tank adapted to hold a liquid heat transfer fluid into which the electronic equipment can be immersed and a filter assembly(ies) having a filter housing with an inlet and an outlet and containing a filter cartridge. In some embodiments the filter assembly(ies) is adapted to be located in the heat transfer fluid in the tank, such that a cross-sectional area of the filter housing inlet is greater than a cross-sectional area of the filter housing outlet, the filter housing inlet is substantially vertically oriented on a side of the filter housing, the filter cartridge is positioned within the filter housing at an inclined angle relative to the filter housing inlet, and the filter housing outlet is disposed adjacent to a top of the housing. Advantageously, heat generated by the immersed electronic equipment produces a convective flow of heat transfer fluid through the filter housing.
A method of apparatus for immersion cooling electronic equipment including immersing the electronic equipment in a pressure-sealed tank containing a heat transfer fluid and including a vapor space fluidicly coupled to a condenser; operating the electronic equipment to generate heat and evaporate some of the heat transfer fluid, causing heat transfer fluid vapor to enter the condenser; condensing the heat transfer fluid vapor in the condenser to produce a condensate; returning the condensate to the tank; and increasing power consumption to increase heat generated by the electronic equipment and develop an increased pressure of the heat transfer fluid vapor to bring the apparatus into an equilibrium condition.
liquid cooling system, namely, a cooling tank and cooling container containing liquid immersion cooling apparatus for cooling electronic components and integrated circuits
