Shenzhen Shokz Co., Ltd.

China

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New (last 4 weeks) 29
2025 May (MTD) 29
2025 April 27
2025 March 11
2025 February 37
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IPC Class
H04R 1/10 - EarpiecesAttachments therefor 550
H04R 9/06 - Loudspeakers 337
H04R 1/28 - Transducer mountings or enclosures designed for specific frequency responseTransducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means 221
H04R 25/00 - Deaf-aid sets 205
H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details 201
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1.

LOUDSPEAKERS AND ELECTRONIC DEVICES

      
Application Number 19026319
Status Pending
Filing Date 2025-01-16
First Publication Date 2025-05-29
Owner
  • SHENZHEN SHOKZ CO., LTD. (China)
  • KING TONE INNOVATION (BEIJING) TECHNOLOGY CO. LTD. (China)
Inventor
  • Zhang, Lei
  • Tong, Peigeng
  • Xie, Guolin
  • Gu, Shanyong
  • Zhao, Hongqiang
  • Qi, Xin

Abstract

A loudspeaker and an electronic device are provided. The loudspeaker includes a basket and a coil. The coil includes an annular body and a lead wire connected with the annular body. The annular body is located on an inner side of the basket. The lead wire moves along with the annular body relative to the basket after an excitation signal is input into the loudspeaker. An avoidance groove is disposed on the basket. An orthographic projection of the lead wire along a vibration direction of the loudspeaker at least partially falls within the avoidance groove.

IPC Classes  ?

  • H04R 1/06 - Arranging circuit leadsRelieving strain on circuit leads
  • H04R 7/04 - Plane diaphragms
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
  • H04R 9/04 - Construction, mounting, or centering of coil
  • H04R 9/06 - Loudspeakers

2.

LOUDSPEAKER APPARATUS

      
Application Number 19037193
Status Pending
Filing Date 2025-01-25
First Publication Date 2025-05-29
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Li, Yongjian
  • Zhang, Haofeng
  • You, Fen

Abstract

The present disclosure discloses a loudspeaker apparatus. The loudspeaker apparatus may include a circuit housing, an ear hook, a rear hook, a loudspeaker component, and a magnetic connector. The circuit housing may be configured to accommodate a control circuit or a battery component. The ear hook may be connected to one end of the circuit housing and at least partially covered by a first protective housing. The rear hook connected to another end of the circuit housing and at least partially covered by a second protective housing. The magnetic connector may be configured to absorb a charging interface of an external power source to establish an electrical connection so as to charge the loudspeaker apparatus.

IPC Classes  ?

  • H04R 1/10 - EarpiecesAttachments therefor
  • H04R 1/02 - CasingsCabinetsMountings therein
  • H04R 1/06 - Arranging circuit leadsRelieving strain on circuit leads
  • H04R 5/033 - Headphones for stereophonic communication
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details
  • H04R 9/06 - Loudspeakers

3.

EARPHONES

      
Application Number 19030979
Status Pending
Filing Date 2025-01-17
First Publication Date 2025-05-22
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zheng, Zeying
  • Xu, Jiang
  • Zhao, Tao

Abstract

An earphone comprises a core module located at a front side of an ear in a wearing state and a hook structure at least a portion of which is located at a rear side of the ear in the wearing state. In a non-wearing state and along a thickness direction of the hook structure, the hook structure extends toward a side of the inner side surface of the core module away from the outer side surface of the core module, so that a portion of the hook structure is offset relative to a projection of the core module along a direction perpendicular to the thickness direction. Then, the portion of the hook structure extends toward a side of the inner side surface toward the outer side surface, which allows the other portion of the hook structure to overlap with the projection of the core module.

IPC Classes  ?

4.

HEADPHONES

      
Application Number 19034587
Status Pending
Filing Date 2025-01-23
First Publication Date 2025-05-22
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Tong, Peigeng
  • Xie, Shuailin
  • Zhang, Sifu

Abstract

A headphone includes a housing including a bottom wall portion and a side wall portion connected with the bottom wall portion which cooperate to form an accommodation space, a sealing ring, a microphone assembly including a sound guiding member configured to hold the sealing ring against a microphone and a support surface provided on a side of the side wall portion facing the accommodation space, and a positioning member inserted between the housing and the sound guiding member to enable the sound guiding member to remain the sealing ring in a press-hold condition. The sealing ring encircling the sound guiding hole provided on the support surface for connecting the accommodation space and an exterior of the housing is provided on a support surface. A sound guiding channel is provided on the sound guiding member for guiding a sound input from the sound guiding hole to the microphone.

IPC Classes  ?

5.

BATTERY ASSEMBLIES

      
Application Number 18942748
Status Pending
Filing Date 2024-11-10
First Publication Date 2025-05-15
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Xie, Shuailin
  • Liu, Chunjian

Abstract

The present disclosure provides a battery assembly that solves the problem of low space utilization of battery assembly in the prior art. The battery assembly includes a circuit board, a male connector, a female connector, a wire, and a battery. The wire is electrically connected to the male connector. The battery includes a step structure. The circuit board is provided on the step structure and is electrically connected to the battery. The female connector is provided on the circuit board and is electrically connected to the circuit board, and the male connector is capable of being plugged into the female connector. When the male connector is plugged into the female connector, the female connector is electrically connected to the male connector. The present disclosure may effectively improve space utilization and simplify the assembly process of battery assembly.

IPC Classes  ?

  • H01M 50/298 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by the wiring of battery packs
  • H01M 50/247 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders specially adapted for portable devices, e.g. mobile phones, computers, hand tools or pacemakers
  • H01M 50/519 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing comprising printed circuit boards [PCB]
  • H01R 4/2429 - Flat plates, e.g. multi-layered flat plates mounted in an insulating base
  • H01R 12/79 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures

6.

EARPHONES

      
Application Number 19026747
Status Pending
Filing Date 2025-01-17
First Publication Date 2025-05-15
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhang, Haofeng
  • Liu, Zhiqing
  • Yang, Yunfan
  • Zhang, Chenxi

Abstract

An earphone is provided. The earphone comprises a core module, and a hook structure and an auxiliary structure which are connected with the core module. The core module is located on a front side of an ear in a wearing state. At least a portion of the hook structure is located on a rear side of the ear in the wearing state. At least a portion of the auxiliary structure is located on the front side of the ear in the wearing state. The core module is pressed on a first ear region corresponding to a cymba conchae of the ear, and the auxiliary structure is pressed on a second ear region corresponding to an antihelix of the ear.

IPC Classes  ?

7.

ACOUSTIC OUTPUT DEVICE

      
Application Number CN2023129868
Publication Number 2025/097271
Status In Force
Filing Date 2023-11-06
Publication Date 2025-05-15
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Cui, Chaojie
  • Zhang, Lei

Abstract

An acoustic output device (10), comprising: a housing (12) and a driving device (11), the driving device (11) being accommodated in the housing (12), and sound being generated by the vibration of the driving device (11) and being led out through a sound output hole (13) provided in the housing (12); a liquid discharge member arranged at the sound output hole (13); and an ultrasonic emission module (23) for outputting an ultrasonic excitation signal, wherein the liquid discharge member comprises an oscillation unit (24) and a plurality of hole portions, the hole portions comprising a plurality of sound-passing holes (31) allowing for sound transmission, and the oscillation unit (24) generating ultrasonic oscillation under the action of the ultrasonic excitation signal so as to discharge liquid at and near the sound-passing holes (31).

IPC Classes  ?

  • H04R 3/12 - Circuits for transducers for distributing signals to two or more loudspeakers

8.

BATTERY ASSEMBLY

      
Application Number CN2023131014
Publication Number 2025/097432
Status In Force
Filing Date 2023-11-10
Publication Date 2025-05-15
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Xie, Shuailin
  • Liu, Chunjian

Abstract

The present utility model provides a battery assembly, solving the problem in the art of a low space utilization rate of battery assemblies. The battery assembly comprises a circuit board, a male connector, a female connector, leads, and a battery; the leads are electrically connected to the male connector; the battery comprises a stepped structure; the circuit board is arranged on the stepped structure and is electrically connected to the battery; the female connector is arranged on the circuit board and is electrically connected to the circuit board; the male connector can be inserted into the female connector; and when the male connector is inserted into the female connector, the female connector is electrically connected to the male connector. The present utility model can effectively increase the space utilization rate and simplify the assembly process of the battery assembly.

IPC Classes  ?

  • H01R 4/00 - Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one anotherMeans for effecting or maintaining such contactElectrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
  • H01R 13/02 - Contact members

9.

SYSTEMS AND METHODS FOR NOISE CONTROL

      
Application Number 19021106
Status Pending
Filing Date 2025-01-14
First Publication Date 2025-05-15
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhang, Chengqian
  • Liao, Fengyun
  • Qi, Xin

Abstract

A system for reducing noise for a user includes a first detector configured to generate a first noise signal, wherein the first noise signal is a representation of a first noise that is transmitted to the user through a first sound pathway, and a second detector configured to generate a second noise signal, wherein the second noise signal indicates a second noise perceived by the user. The system also includes a processor configured to determine a noise correction signal based on the first noise signal and/or the second noise signal, and a speaker configured to generate a sound for reducing the noise based on the noise correction signal.

IPC Classes  ?

  • G10K 11/178 - Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effectsMasking sound by electro-acoustically regenerating the original acoustic waves in anti-phase
  • G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer
  • H04R 1/10 - EarpiecesAttachments therefor

10.

CORE MODULES AND EARPHONES

      
Application Number 19021136
Status Pending
Filing Date 2025-01-14
First Publication Date 2025-05-15
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Yue, Gong
  • Wang, Chong
  • Chen, Yunbin

Abstract

The present disclosure relates to a core module and an earphone. The core module comprises a core shell, a speaker, and a main control circuit board. The speaker and the main control circuit board are arranged in the core shell. The speaker includes a first coil coupled to the main control circuit board, a second coil is arranged on the main control circuit board, and a winding axis direction of the second coil crosses a winding axis direction of the first coil.

IPC Classes  ?

  • H05K 1/02 - Printed circuits Details
  • H04R 1/10 - EarpiecesAttachments therefor
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details
  • H04R 9/06 - Loudspeakers

11.

LOUDSPEAKER APPARATUS

      
Application Number 19026576
Status Pending
Filing Date 2025-01-17
First Publication Date 2025-05-15
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Li, Chaowu
  • Li, Yongjian
  • Wang, Yueqiang

Abstract

A loudspeaker apparatus includes a circuit housing configured to accommodate a circuit component or a battery; an ear hook; a housing of an earphone core configured to accommodate the earphone core; and a housing protector at least partially covering a periphery of the circuit housing and the ear hook. A first end of the ear hook is connected to the circuit housing. The earphone core is driven by the circuit component or the battery to vibrate to generate sound. The housing of the earphone core is connected to a second end of the ear hook away from the circuit housing through a hinge component. The hinge component is capable of rotating to change a position of the housing of the earphone core relative to the ear hook.

IPC Classes  ?

12.

LOUDSPEAKERS AND ELECTRONIC DEVICES

      
Application Number 19026713
Status Pending
Filing Date 2025-01-17
First Publication Date 2025-05-15
Owner
  • SHENZHEN SHOKZ CO., LTD. (China)
  • KING TONE INNOVATION (BEIJING) TECHNOLOGY CO. LTD. (China)
Inventor
  • Zhang, Lei
  • Tong, Peigeng
  • Xie, Guoiin
  • Gu, Shanyong
  • Zhao, Hongqiang
  • Qi, Xin

Abstract

A loudspeaker and an electronic device are provided. The loudspeaker includes a basket and a coil. The coil includes an annular body and a lead wire connected with the annular body. The annular body is located on an inner side of the basket. The lead wire moves along with the annular body relative to the basket after an excitation signal is input into the loudspeaker. A soldering pad is disposed on the basket. The lead wire is provided with a first end close to the annular body and a second end away from the annular body. The second end is fixed on the soldering pad. A ratio of a length of the lead wire to a maximum amplitude of a movement of the coil relative to the basket is in a range of 8-75. The technical problem of stress concentration in the lead wire is improved.

IPC Classes  ?

  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details
  • H04R 9/06 - Loudspeakers

13.

SYSTEMS FOR BONE CONDUCTION SPEAKER

      
Application Number 19026717
Status Pending
Filing Date 2025-01-17
First Publication Date 2025-05-15
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Liao, Fengyun
  • Zheng, Jinbo
  • Chen, Qian
  • Chen, Hao
  • Qi, Xin

Abstract

Methods and apparatus are described herein related to improving the sound quality of a bone conduction speaker. The sound quality of the bone conduction speaker is adjusted in the sound generation, sound transferring, and sound receiving of the bone conduction speaker by designing vibration generation manners and vibration transfer structures.

IPC Classes  ?

14.

BONE CONDUCTION SPEAKER

      
Application Number 19026733
Status Pending
Filing Date 2025-01-17
First Publication Date 2025-05-15
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhang, Lei
  • Liao, Fengyun
  • Qi, Xin

Abstract

The present disclosure relates to a magnetic circuit assembly of a bone conduction speaker. The magnetic circuit assembly may generate a first magnetic field. The magnetic circuit assembly may include a first magnetic element, and the first magnetic element may generate a second magnetic field. The magnetic circuit may further include a first magnetic guide element and at least one second magnetic element. The at least one second magnetic element may be configured to surround the first magnetic element and a magnetic gap may be configured between the second magnetic element and the first magnetic element. A magnetic field strength of the first magnetic field within the magnetic gap may exceed a magnetic field strength of the second magnetic field within the magnetic gap.

IPC Classes  ?

  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details
  • H01F 7/08 - ElectromagnetsActuators including electromagnets with armatures
  • H01F 7/121 - Guiding or setting position of armatures, e.g. retaining armatures in their end position
  • H04R 1/10 - EarpiecesAttachments therefor
  • H04R 9/06 - Loudspeakers

15.

TRANSDUCER DEVICES, CORE MODULES, AND ELECTRONIC DEVICES

      
Application Number 19014153
Status Pending
Filing Date 2025-01-08
First Publication Date 2025-05-08
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor Fu, Junjiang

Abstract

The present disclosure relates to a transducer device, a core module, and an electronic device. The transducer device comprises a first coil and a magnet assembly, and at least one first vibration transmission plate connecting the first coil and the magnet assembly. The magnet assembly surrounds a periphery of the first coil, the magnet assembly and the first coil are spaced apart in a radial direction of the transducer device and at least partially overlap in an axial direction. In an operation state in which the transducer device is input with a first excitation signal, the first coil is energized and generates a first Ampere force in a magnetic field formed by the magnet assembly, and the first Ampere force causes the first coil to move relative to the magnet assembly without an iron core and a magnetic conductive plate, which is conducive to increasing sensitivity of the transducer device.

IPC Classes  ?

  • H04R 9/06 - Loudspeakers
  • H01F 7/02 - Permanent magnets
  • H01F 7/20 - ElectromagnetsActuators including electromagnets without armatures
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details
  • H04R 9/04 - Construction, mounting, or centering of coil

16.

MAIN CONTROL CIRCUIT BOARDS AND EARPHONES

      
Application Number 19017766
Status Pending
Filing Date 2025-01-12
First Publication Date 2025-05-08
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Yue, Gong
  • Wang, Chong
  • Chen, Yunbin

Abstract

The present disclosure relates to a main control circuit board and an earphone. The main control circuit board comprises a substrate, metal wires, and a load. The metal wires include a power source wire and a loop wire that are configured to connect the load to an external power source, the power source wire and the loop wire are arranged side by side, and a current direction of the power source wire is opposite to a current direction of the loop wire. A ratio of an absolute value of a difference between a width of the power source wire or the loop wire and an average width to the average width is less than or equal to 20%, the average width being defined as an average value of widths of the power source wire and the loop wire.

IPC Classes  ?

  • H04R 1/06 - Arranging circuit leadsRelieving strain on circuit leads
  • H04R 1/10 - EarpiecesAttachments therefor

17.

ACOUSTIC DEVICE AND SIGNAL PROCESSING METHOD

      
Application Number CN2023131090
Publication Number 2025/091562
Status In Force
Filing Date 2023-11-10
Publication Date 2025-05-08
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhu, Guanguyuan
  • Yue, Gong
  • Zhang, Lei
  • Qi, Xin

Abstract

An acoustic device (100, 200, 300) and a signal processing method. A bone-conduction sound generation assembly (110) of the acoustic device (100, 200, 300) produces a first delay when converting a first driving signal into a bone-conduction acoustic wave, and an air-conduction sound generation assembly (120) produces a second delay when converting a second driving signal into an air-conduction acoustic wave, the absolute value of the difference between the second delay and the first delay being greater than 100 microseconds. A signal processing circuit (130) obtains an audio signal when operating, generates the first driving signal on the basis of a first component of the audio signal and sends same to the bone-conduction sound generation assembly (110), and generates the second driving signal on the basis of a second component of the audio signal and sends same to the air-conduction sound generation assembly (120), wherein the transmission of one of the first driving signal and the second driving signal is delayed relative to the transmission of the other, such that the time difference between the time at which the bone-conduction acoustic wave is generated and the time at which the air-conduction acoustic wave is generated is less than or equal to 100 microseconds at at least some frequencies, thereby avoiding the problem of sound distortion.

IPC Classes  ?

18.

EARPHONES

      
Application Number 19014177
Status Pending
Filing Date 2025-01-08
First Publication Date 2025-05-08
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zheng, Zeying
  • Xu, Jiang
  • Yan, Zeteng

Abstract

An earphone comprises a core module located at a front side of an ear in a wearing state and a hook structure at least a portion of which is located at a rear side of the ear in the wearing state. A free end of the core module not connected to the hook structure extends into a concha cavity of the ear in the wearing state. In the wearing state, a first inner side surface of the core module covers at least a portion of a tragus of the ear, a transition portion of the hook structure is located at the front side of the ear, and a second inner side surface of the transition is bent along the thickness direction of the core module toward a direction away from an outer side surface of of the core module with respect to the first inner side surface.

IPC Classes  ?

  • H04R 1/10 - EarpiecesAttachments therefor
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details

19.

LOUDSPEAKERS

      
Application Number 19014180
Status Pending
Filing Date 2025-01-08
First Publication Date 2025-05-08
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Cui, Chaojie
  • Zhang, Lei

Abstract

Embodiments of the present disclosure provide a loudspeaker including a magnetic circuit assembly and a coil assembly. At least a portion of the coil assembly is provided in a magnetic gap formed by the magnetic circuit assembly, and the coil assembly is electrified to drive a vibrating member to vibrate to produce sound. The coil assembly includes a coil support and a coil. The coil support has an extended end extending toward the magnetic gap, and the extended end has a first step structure. The coil includes an outer coil and an inner coil. The outer coil and the inner coil form a second step structure in a direction close to the coil support. The first step structure and the second step structure are fitted to each other so that the coil is fixedly mounted on the coil support.

IPC Classes  ?

  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details
  • H04R 9/04 - Construction, mounting, or centering of coil
  • H04R 9/06 - Loudspeakers

20.

ELECTRONIC DEVICE

      
Application Number CN2023126020
Publication Number 2025/086056
Status In Force
Filing Date 2023-10-23
Publication Date 2025-05-01
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Xie, Shuailin
  • Liu, Chunjian

Abstract

An earphone (100), comprising: a compartment (200), a circuit board (210) and an antenna assembly (220), wherein the compartment (200) contains a plastic base material and reinforcing fibers doped in the plastic base material; the circuit board (210) is arranged in the compartment (200); and the antenna assembly (220) is arranged on a side wall of the compartment (200), comprising an antenna support (221) and an LDS antenna pattern (222) which is formed on the antenna support (221), the LDS antenna pattern (222) being electrically connected to the circuit board (210). According to the earphone (100), the size of the antenna assembly (220) can be reduced, facilitating the design of a clearance area, improving the space utilization rate inside the compartment (200) of the earphone (100); moreover, the earphone (100) enables the compartment (200) to be made of a material different from that of the antenna support (221), thereby reducing limitations on the material selection for the compartment (200), improving the diversity of the material selection for the compartment (200).

IPC Classes  ?

21.

LOUDSPEAKER ASSEMBLY AND EARPHONE

      
Application Number CN2023126021
Publication Number 2025/086057
Status In Force
Filing Date 2023-10-23
Publication Date 2025-05-01
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhu, Guangyuan
  • Zhang, Lei
  • Qi, Xin

Abstract

A loudspeaker assembly (10) and an earphone (1). The loudspeaker assembly (10) comprises a housing assembly (100), a bone conduction loudspeaker (200), and an air conduction loudspeaker (300), wherein the housing assembly (100) is provided with a first accommodating cavity (111), a second accommodating cavity (112), and a communicating hole (113) that communicates the first accommodating cavity (111) with the second accommodating cavity (112); the bone conduction loudspeaker (200) is arranged in the first accommodating cavity (111) and blocks the communicating hole (113), thus isolating the first accommodating cavity (111) and the second accommodating cavity (112) from each other; and the air conduction loudspeaker (300) is arranged in the second accommodating cavity (112). Thus, the volume of a sound cavity space formed in the internal space of the loudspeaker assembly (10) can be easily and effectively increased, thereby improving the sound quality of the loudspeaker assembly (10).

IPC Classes  ?

22.

LOUDSPEAKER ASSEMBLY AND EARPHONE

      
Application Number CN2023126026
Publication Number 2025/086060
Status In Force
Filing Date 2023-10-23
Publication Date 2025-05-01
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhu, Guangyuan
  • Zhang, Lei
  • Qi, Xin

Abstract

Disclosed in the present application are a loudspeaker assembly and an earphone. The loudspeaker assembly comprises a housing assembly, an air conduction loudspeaker, and a bone conduction loudspeaker, wherein the housing assembly is provided with an accommodating space; the air conduction loudspeaker is arranged in the accommodating space; and the bone conduction loudspeaker is arranged in the accommodating space. The housing assembly is further provided with a sound output hole and a pressure relief hole which are in communication with the accommodating space, wherein each of the sound output hole and the pressure relief hole is used for conducting some of the sound waves generated by the air conduction loudspeaker to the external environment; and the pressure relief hole and the sound output hole are respectively located on two opposite side surfaces of the housing assembly. By means of the described configuration, the present application can reduce the mutual impact between the sound waves conducted by the sound hole and those conducted by the pressure relief hole, so that low-frequency sound quality can be improved, thereby improving sound quality.

IPC Classes  ?

23.

LOUDSPEAKER ASSEMBLY AND EARPHONE

      
Application Number CN2023126027
Publication Number 2025/086061
Status In Force
Filing Date 2023-10-23
Publication Date 2025-05-01
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhu, Guangyuan
  • Zhang, Lei
  • Qi, Xin

Abstract

Disclosed in the present application are a loudspeaker assembly and an earphone. The earphone comprises a housing assembly, a bone conduction mechanism module and an air conduction mechanism module, wherein the housing assembly is provided with an accommodating space; the bone conduction mechanism module is arranged in the accommodating space and generates vibration in a first vibration direction; and the air conduction mechanism module is arranged in the accommodating space, the air conduction mechanism module and the bone conduction mechanism module being arranged in the first vibration direction and facing each other. By means of the described configuration, the present application can reduce the impact of the air conduction mechanism module on the vibration effect of the bone conduction mechanism module, thus improving the sound volume and enhancing the bone conduction effect of the loudspeaker assembly, and thereby improving the sound quality of the loudspeaker assembly.

IPC Classes  ?

24.

BONE CONDUCTION SPEAKER AND EARPHONE

      
Application Number CN2023126028
Publication Number 2025/086062
Status In Force
Filing Date 2023-10-23
Publication Date 2025-05-01
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhu, Guangyuan
  • Zhang, Lei
  • Xie, Zhao
  • Qi, Xin

Abstract

A bone conduction speaker and an earphone. The bone conduction speaker comprises a cylindrical housing, a driving assembly, and two sealing plates. The cylindrical housing defines an accommodating space. The driving assembly is disposed in the accommodating space, and is connected to the cylindrical housing. The two sealing plates are respectively arranged at two ends of the cylindrical housing, and seal the accommodating space. In this way, the driving assembly in the bone conduction speaker can be limited, thereby improving the sound quality effect of the bone conduction speaker, and prolonging the service life of the bone conduction speaker.

IPC Classes  ?

25.

EARPHONE

      
Application Number CN2023126055
Publication Number 2025/086075
Status In Force
Filing Date 2023-10-23
Publication Date 2025-05-01
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Xie, Zhao
  • Xie, Shuailin

Abstract

The present application relates to an earphone, which comprises a shell assembly, a bone conduction speaker and an air conduction speaker, wherein the shell assembly comprises a first shell, a second shell and a third shell, the second shell and the first shell being joined and fitting with each other to form a first accommodating cavity, and the third shell being joined with both the first shell and the second shell and fitting with the first shell to form a second accommodating cavity; the air conduction speaker is arranged in the first accommodating cavity; the bone conduction speaker is arranged in the second accommodating cavity; and the third shell is configured to be in contact with the face of a user when wearing the earphone, and the joint seam between the third shell and the second shell is not in contact with the face of the user. In this way, controlling the joint seam of the shell assembly not to be in contact with the face of the user can reduce the risk of the joint seam of the shell assembly pinching the face of the user, and can further reduce the risk of the sweat from the face of the user entering the shell assembly through the joint seam.

IPC Classes  ?

26.

ACOUSTIC OUTPUT DEVICE

      
Application Number CN2023138879
Publication Number 2025/086430
Status In Force
Filing Date 2023-12-14
Publication Date 2025-05-01
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhu, Guangyuan
  • Zhang, Lei
  • Qi, Xin

Abstract

Embodiments of the present description provide an acoustic output device, comprising: a shell; a bone conduction vibrator, configured to generate bone conduction sound waves and transmit same to the cochlea by means of the shell so as to generate sound; an air conduction vibrator, configured to generate air conduction sound waves, wherein the air conduction sound waves are transmitted to the ear by means of sound guide holes on the shell; and a signal processing module, configured to respectively provide a first audio signal and a second audio signal for the bone conduction vibrator and the air conduction vibrator, wherein the first audio signal and the second audio signal have a frequency division point, the first audio signal and the second audio signal respectively comprise components with frequencies above and below the frequency division point, the bone conduction vibrator has a first resonance peak at a first resonance frequency, the air conduction vibrator has a second resonance peak at a second resonance frequency, and the frequency division point is greater than the first resonance frequency and the second resonance frequency.

IPC Classes  ?

27.

EARPHONE

      
Application Number CN2023126022
Publication Number 2025/086058
Status In Force
Filing Date 2023-10-23
Publication Date 2025-05-01
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Tong, Peigeng
  • Xie, Shuailin
  • Zhang, Sifu

Abstract

An earphone (100), the earphone (100) comprising: a housing (10), the housing (10) comprising a bottom wall portion (110) and a side wall portion (120) connected to the bottom wall portion (110), wherein the bottom wall portion (110) and the side wall portion (120) are fitted to form an accommodating space (101), the side wall portion (120) is provided with a support surface (102) on the side facing the accommodating space (101), the support surface (102) being provided with a sound guide hole (103) for communicating the accommodating space (101) with the outside of the housing (10); a sealing ring (20), which is arranged on the support surface (102) and surrounds the sound guide hole (103); a microphone assembly (30), the microphone assembly (30) comprising a sound guide member (310) and a microphone (320), wherein the sound guide member (310) is used for pressing the sealing ring (20) against the support surface (102), and is provided with a sound guide channel (301) for guiding sound input through the sound guide hole (103) to the microphone (320); and a positioning member (40), the positioning member (40) being inserted between the housing (10) and the sound guide member (310), such that the sound guide member (310) maintains a pressing state against the sealing ring (20).

IPC Classes  ?

28.

EARPHONE

      
Application Number CN2023126025
Publication Number 2025/086059
Status In Force
Filing Date 2023-10-23
Publication Date 2025-05-01
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhu, Guangyuan
  • Zhang, Lei
  • Xie, Zhao
  • Qi, Xin

Abstract

The present application provides an earphone, comprising a housing assembly, a loudspeaker, and a protective net. The housing assembly is provided with an accommodating cavity and is provided with a pressure relief hole used for communicating the accommodating cavity with an external environment, and the opening of the pressure relief hole is formed in the bottom of the housing assembly in the height direction; the loudspeaker is arranged in the accommodating cavity; the protective net is connected to the housing assembly and covers the opening of the pressure relief hole; and when projection is carried out along the height direction, the length of the projection of the protective net is 0.4 times or more the length of the projection of the housing assembly. According to the present application, the overall size and area of the protective net can be effectively increased, and the risk of blocking the pressure relief hole as a result of sweat, rainwater, and other external adverse factors forming a water film on the protective net is reduced, thereby effectively ensuring that the pressure relief hole can normally carry out pressure relief work, and effectively improving sound production stability of the earphone.

IPC Classes  ?

29.

DEVICE FOR USING FRICTION SIGNAL TO IDENTIFY TOUCH OPERATION

      
Application Number CN2024127437
Publication Number 2025/087399
Status In Force
Filing Date 2024-10-25
Publication Date 2025-05-01
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Yuan, Yongshuai
  • Deng, Wenjun
  • Liao, Fengyun
  • Qi, Xin

Abstract

A device for using a friction signal to identify a touch operation. At least part of the surface of the device comprises a sliding area; the sliding area at least comprises a first sliding area and a second sliding area; the first sliding area and the second sliding area have different characteristics; and the characteristics show that a friction signal generated when a finger slides in the first sliding area and a friction signal generated when the finger slides in the second sliding area are distinguishable in the time domain or frequency.

IPC Classes  ?

  • G06F 3/043 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using propagating acoustic waves
  • G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
  • H04R 1/10 - EarpiecesAttachments therefor

30.

CORE MODULES AND ELECTRONIC DEVICES

      
Application Number 19000339
Status Pending
Filing Date 2024-12-23
First Publication Date 2025-04-24
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Li, Chaowu
  • Nie, Qianwen

Abstract

A core module and an electronic device are provided. The core module comprises a housing component, a transducer device, a vibration panel, and a face attachment component. The housing component includes a core housing and a core cover plate. The core cover plate is provided with a first avoidance hole allowing the vibration panel to be connected with the transducer device. The face attachment component covers the vibration panel. The core housing includes a cylindrical sidewall, an annular support, a plurality of buckle portions, a plurality of communication holes, and a plurality of columns. The core cover plate is supported on the annular support and plugged with the plurality of columns. The face attachment component snap-fits the plurality of buckle portions. The plurality of columns are arranged at intervals in a circumferential direction of the cylindrical sidewall.

IPC Classes  ?

31.

CORE MODULES AND ELECTRONIC DEVICES

      
Application Number 19000672
Status Pending
Filing Date 2024-12-23
First Publication Date 2025-04-24
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Li, Chaowu
  • Nie, Qianwen

Abstract

A core module and an electronic device are provided. The core module comprises a housing component, a transducer device, a vibration panel, and a face attachment component. The transducer device is disposed in the housing component. The vibration panel is connected with the transducer device and protrudes a preset distance with respect to the housing component along a vibration direction of the transducer device when the transducer device is in a non-vibration state. The face attachment component includes a face attachment sleeve. The face attachment sleeve includes a central portion, a transition portion connected with the central portion, and a fixed portion connected with the transition portion. The central portion covers the vibration panel. The fixed portion is connected with the housing component. At least the transition portion of the face attachment sleeve is a flexible braided fabric.

IPC Classes  ?

32.

CORE MODULES AND ELECTRONIC DEVICES

      
Application Number 19000773
Status Pending
Filing Date 2024-12-24
First Publication Date 2025-04-24
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Fu, Junjiang
  • Li, Chaowu
  • Tong, Peigeng

Abstract

A core module and an electronic device are provided. The core module comprises a housing component, a transducer device, and a vibration panel. The housing component includes a core housing, a core cover plate, and a sealing film. The transducer device includes a support. The core cover plate and the sealing film are respectively provided with a first avoidance hole and a second avoidance hole allowing the vibration panel to be connected with the support. The sealing film is configured to seal an assembly clearance of the first avoidance hole. At least one of the vibration panel and the support is provided with a support end surface corresponding to a surrounding region of the second avoidance hole. The sealing film is fixed on the support end surface.

IPC Classes  ?

  • H04R 1/10 - EarpiecesAttachments therefor
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details
  • H04R 9/06 - Loudspeakers

33.

ELECTRONIC DEVICES

      
Application Number 19000776
Status Pending
Filing Date 2024-12-24
First Publication Date 2025-04-24
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor Li, Chaowu

Abstract

An electronic device is provided. The electronic device comprises a housing component and a microphone disposed in the housing component. The housing component is provided with a sound pickup channel. The microphone is configured to pick up a sound transmitted through the sound pickup channel. The sound pickup channel includes a first channel section and a second channel section communicated with each other. The first channel section is closer to the microphone than the second channel section. A first central axis of the first channel section and a second central axis of the second channel section do not coincide. The first channel section and the second channel section of the sound pickup channel are staggered from each other, which helps avoid external droplets, or the like, from directly impacting the microphone, thereby extending the service life of the microphone.

IPC Classes  ?

  • H04R 1/08 - MouthpiecesAttachments therefor
  • H04R 1/10 - EarpiecesAttachments therefor
  • H04R 1/28 - Transducer mountings or enclosures designed for specific frequency responseTransducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means

34.

ACOUSTIC DEVICES

      
Application Number 19007599
Status Pending
Filing Date 2025-01-02
First Publication Date 2025-04-24
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Xiao, Le
  • Zheng, Jinbo
  • Zhang, Chengqian
  • Liao, Fengyun
  • Qi, Xin

Abstract

The present disclosure provides an acoustic device including a microphone array, a processor, and at least one speaker. The microphone array may be configured to acquire an environmental noise. The processor may be configured to estimate a sound field at a target spatial position using the microphone array. The target spatial position may be closer to an ear canal of a user than each microphone in the microphone array. The processor may be configured to generate a noise reduction signal based on the environmental noise and the sound field estimation of the target spatial position. The at least one speaker may be configured to output a target signal based on the noise reduction signal. The target signal may be used to reduce the environmental noise. The microphone array may be arranged in a target area to minimize an interference signal from the at least one speaker to the microphone array.

IPC Classes  ?

  • G10K 11/178 - Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effectsMasking sound by electro-acoustically regenerating the original acoustic waves in anti-phase
  • H04R 1/10 - EarpiecesAttachments therefor
  • H04R 1/40 - Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers
  • H04R 3/00 - Circuits for transducers

35.

Acoustic output apparatus

      
Application Number 18064282
Grant Number 12284477
Status In Force
Filing Date 2022-12-11
First Publication Date 2025-04-22
Grant Date 2025-04-22
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhu, Guangyuan
  • Zhang, Lei
  • Fu, Junjiang
  • Qi, Xin
  • Wang, Qingyi

Abstract

An acoustic output apparatus is provided. The acoustic output apparatus may include a vibration assembly and a mass element. The vibration assembly may include a piezoelectric structure and a vibration element. The piezoelectric structure may be configured to convert an electrical signal into mechanical vibrations, and the vibration element may be connected to the piezoelectric structure at a first position of the piezoelectric structure and configured to receive the mechanical vibrations to generate an acoustic signal. The mass element may be connected to the piezoelectric structure at a second position of the piezoelectric structure.

IPC Classes  ?

  • H04R 17/10 - Resonant transducers, i.e. adapted to produce maximum output at a predetermined frequency
  • H04R 1/02 - CasingsCabinetsMountings therein
  • H04R 1/28 - Transducer mountings or enclosures designed for specific frequency responseTransducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means

36.

MICROPHONE AND ELECTRONIC DEVICE HAVING THE SAME

      
Application Number 18984953
Status Pending
Filing Date 2024-12-17
First Publication Date 2025-04-17
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhou, Wenbing
  • Qi, Xin
  • Liao, Fengyun
  • Yuan, Yongshuai

Abstract

The present disclosure relates to microphones and electronic devices having the same. The microphone may include a housing for receiving sound signals, at least two transducers for vibrating to generate electrical signals in response to the sound signals, and a processing circuit for processing the electrical signals. Each of the at least two transducers may provide a distinctive resonance peak to the microphone.

IPC Classes  ?

  • H04R 3/00 - Circuits for transducers
  • H04R 1/04 - Structural association of microphone with electric circuitry therefor
  • H04R 1/24 - Structural combinations of separate transducers or of parts of the same transducer and responsive respectively to two or more frequency ranges
  • H04R 1/28 - Transducer mountings or enclosures designed for specific frequency responseTransducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
  • H04R 1/40 - Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers

37.

METHODS AND SYSTEMS FOR DETERMINING FINGER JOINT ANGLES

      
Application Number 18989029
Status Pending
Filing Date 2024-12-20
First Publication Date 2025-04-17
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Yuan, Yongshuai
  • Deng, Wenjun

Abstract

Embodiments of the present disclosure provide a method and a system for determining a finger joint angle. The method includes obtaining first sensor data relating to at least two target finger joints of a user, the first sensor data is obtained using at least two strain sensors, each of the strain sensors is arranged in a glove body worn by the user and located at one target finger joints, and the at least two target finger joints include at least two adjacent metacarpophalangeal joints of the user; obtaining a first mapping relationship, wherein the first mapping relationship reflects a relationship between sensor data corresponding to the at least two target finger joints and joint angles of the at least two target finger joints; and determining a first joint angle of each of the at least two target finger joints based on the first sensor data and the first mapping relationship.

IPC Classes  ?

  • G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer
  • A61B 5/00 - Measuring for diagnostic purposes Identification of persons
  • A61B 5/107 - Measuring physical dimensions, e.g. size of the entire body or parts thereof

38.

CORE MODULES AND ELECTRONIC DEVICES

      
Application Number 19000361
Status Pending
Filing Date 2024-12-23
First Publication Date 2025-04-17
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Fu, Junjiang
  • Tong, Peigeng
  • Li, Chaowu

Abstract

A core module and an electronic device are provided. The core module comprises a housing component, a transducer device, a vibration panel, and a face attachment component. The housing component includes a core housing and a core cover plate covering an open end of the core housing. The core cover plate and the core housing cooperate to form a first cavity. The face attachment component and the housing component cooperate to form a second cavity. The transducer device is at least partially located in the first cavity. The vibration panel is at least partially located in the second cavity. The core cover plate is provided with a first avoidance hole allowing the vibration panel to be connected with the transducer device. The core module is provided with a channel connecting the second cavity with the outside of the core module.

IPC Classes  ?

  • H04R 1/28 - Transducer mountings or enclosures designed for specific frequency responseTransducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
  • H04R 1/10 - EarpiecesAttachments therefor
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details

39.

ELECTRONIC DEVICES

      
Application Number 19000392
Status Pending
Filing Date 2024-12-23
First Publication Date 2025-04-17
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Nie, Qianwen
  • Li, Chaowu

Abstract

An electronic device is provided. The electronic device comprises a housing component, a circuit board, an antenna bracket, and a sliding key component. The circuit board and the antenna bracket are disposed in the housing component. The antenna bracket is supported on one side of the circuit board. The sliding key component extends from an outer side of the housing component into an inner side of the housing component through a sliding groove disposed on the housing component, and is further connected with a toggle switch on the circuit board through an avoidance groove disposed on the antenna bracket. A portion of the sliding key component is limited between the antenna bracket and the housing component. The sliding key component is capable of toggling the toggle switch along a sliding direction under the action of the external force.

IPC Classes  ?

40.

GLOVE SYSTEM

      
Application Number CN2024099228
Publication Number 2025/077256
Status In Force
Filing Date 2024-06-14
Publication Date 2025-04-17
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Yuan, Yongshuai
  • Deng, Wenjun

Abstract

A glove system (100), comprising a glove body (110), and multiple first strain sensors (120) and multiple second strain sensors (130) arranged on the glove body (110). When a user wears the glove body (110), each first strain sensor (120) among the multiple first strain sensors (120) is located at an interphalangeal joint of the user, and is configured to measure the deformation of the interphalangeal joint in a single degree of freedom; and each second strain sensor (130) among the multiple second strain sensors (130) is located at a metacarpophalangeal joint, and is configured to measure the deformation of the metacarpophalangeal joint in two degrees of freedom, wherein the single degree of freedom and the two degrees of freedom each comprise a degree of freedom corresponding to finger flexion.

IPC Classes  ?

  • G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer
  • A41D 19/00 - Gloves
  • G01B 7/16 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge

41.

LOUDSPEAKER DEVICE

      
Application Number 18985056
Status Pending
Filing Date 2024-12-18
First Publication Date 2025-04-17
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhang, Lei
  • Li, Yongjian
  • Zhou, Wenbing
  • Zheng, Jinbo
  • Jiang, Zhuyang

Abstract

A loudspeaker device includes a speaker component, a first microphone element, and a second microphone element. The speaker component includes an earphone core and a core housing. The first microphone element is disposed on a first branch circuit board of a circuit board. The second microphone element is disposed on a second branch circuit board of the circuit board. The circuit board is configured to electrically connect to an audio signal wire, a first auxiliary signal wire, and a second auxiliary signal wire of an external control circuit. The audio signal wire, the first auxiliary signal wire, and the second auxiliary signal wire are electrically and respectively connected to the earphone core, the first microphone element, and the second microphone element through the circuit board. A board surface of the second branch circuit board is tilt with respect to a board surface of the first branch circuit board.

IPC Classes  ?

  • H04R 1/10 - EarpiecesAttachments therefor
  • H04R 1/06 - Arranging circuit leadsRelieving strain on circuit leads
  • H04R 5/033 - Headphones for stereophonic communication
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details
  • H04R 9/06 - Loudspeakers

42.

METHODS AND SYSTEMS FOR DETERMINING CORRESPONDENCE RELATIONSHIPS BETWEEN SENSOR DATA AND FINGER JOINT ANGLES

      
Application Number 18988942
Status Pending
Filing Date 2024-12-20
First Publication Date 2025-04-17
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Yuan, Yongshuai
  • Deng, Wenjun

Abstract

Embodiments of the present disclosure provide methods and systems for determining a correspondence relationship between sensor data and finger joint angles. The methods include obtaining a plurality of sets of sample sensor data, each set of sample sensor data being related to at least two sample finger joints of a sample user and being collected using at least two sample strain sensors at a target moment, and each sample strain sensor being arranged in a sample glove and located at one of the at least two sample finger joints; for each set of sample sensor data, obtaining an optical image of a hand taken at the target moment; determining, based on the optical image, sample joint angles of the at least two sample finger joints of the sample user; and determining a correspondence relationship between each set of sample sensor data and sample joint angles.

IPC Classes  ?

  • G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer

43.

ELECTRONIC DEVICES

      
Application Number 18991321
Status Pending
Filing Date 2024-12-20
First Publication Date 2025-04-17
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Nie, Qianwen
  • Li, Chaowu

Abstract

An electronic device is provided. The electronic device comprises a housing component, a circuit board, and a sliding key component. An outer side of the housing component is provided with a concave region. A bottom of the concave region is provided with a sliding groove. A position of the bottom of the concave region connected with a sidewall of the concave region is provided with an annular groove surrounding the sliding groove. The circuit board is disposed in the housing component. The sliding key component is partially located in the concave region, and extends from the outer side of the housing component into an inner side of the housing component through the sliding groove to be connected with a toggle switch disposed on the circuit board to allow the sliding key component to toggle the toggle switch along a sliding direction under the action of an external force.

IPC Classes  ?

  • H01H 13/14 - Operating parts, e.g. push-button
  • G02C 11/00 - Non-optical adjunctsAttachment thereof
  • H01H 13/06 - Dustproof, splashproof, drip-proof, waterproof, or flameproof casings
  • H04R 1/10 - EarpiecesAttachments therefor

44.

ELECTRONIC DEVICES

      
Application Number 18991822
Status Pending
Filing Date 2024-12-23
First Publication Date 2025-04-17
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Nie, Qianwen
  • Li, Chaowu

Abstract

An electronic device is provided. The electronic device comprises a housing component, a circuit board, and a sliding key component. The circuit board is disposed in the housing component. The sliding key component includes an adapter frame and a sliding key. The adapter frame is disposed in the housing component and connected with a toggle switch on the circuit board. The sliding key extends from an outer side of the housing component into an inner side of the housing component through a sliding groove on the housing component to be assembled and connected with the adapter frame to allow the sliding key component to toggle the toggle switch along a sliding direction under the action of an external force. The adapter frame and the sliding key are two separate structural parts, and the sliding key and the adapter frame can be assembled and connected.

IPC Classes  ?

  • H04R 1/02 - CasingsCabinetsMountings therein

45.

CORE MODULES AND ELECTRONIC DEVICES

      
Application Number 19000648
Status Pending
Filing Date 2024-12-23
First Publication Date 2025-04-17
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Fu, Junjiang
  • Tong, Peigeng
  • Xiao, Le
  • Nie, Qianwen

Abstract

A core module and an electronic device are provided. The core module comprises a housing component, a transducer device, and a microphone component. The transducer device and the microphone component are disposed in the housing component. The microphone component includes a first microphone. The first microphone falls on the transducer device when being projected onto the transducer device along a vibration direction of the transducer device. The core module further comprises a limiting member disposed in the housing component. The limiting member is configured to stop the transducer device when a motion amplitude of the transducer device along the vibration direction exceeds a preset amplitude threshold, so as to maintain a preset distance between the transducer device and the first microphone to prevent the first microphone from being damaged by the transducer device, especially under an extreme operation condition such as the core module falling or colliding.

IPC Classes  ?

  • H04R 1/28 - Transducer mountings or enclosures designed for specific frequency responseTransducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
  • H04R 1/08 - MouthpiecesAttachments therefor
  • H04R 1/10 - EarpiecesAttachments therefor

46.

ELECTRONIC DEVICES

      
Application Number 19000658
Status Pending
Filing Date 2024-12-23
First Publication Date 2025-04-17
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor Li, Chaowu

Abstract

An electronic device (10) comprises a housing component (121), a circuit board (1221), and an antenna bracket (123). The housing component (121) includes a bin body (1211) and a lampshade (1222) disposed in a sidewall of the bin body (1211). The antenna bracket (123) and the circuit board (1221) are at least partially accommodated in the bin body (1211). An indicator light (1223) is disposed on a side of the circuit board (1221) facing the lampshade (1222), the antenna bracket (123) is disposed on the side of the circuit board (1221) facing the lampshade (1222). The antenna bracket (123) includes an antenna support portion (1231) and a light guide portion (1232) connected with the antenna support portion (1231). Light emitted by the indicator light (1223) is transmitted to the lampshade (1222) through the light guide portion (1232) and then emitted to the outside of the electronic device (10). The light emitted by the indicator light (1223) is guided by the light guide portion (1232), which reduces the loss of the light emitted by the indicator light (1223), such that the indicator light (1223) does not need to increase the luminous power, thereby reducing the power consumption of the indicator light (1223) and extending the service life of the indicator light (1223).

IPC Classes  ?

  • F21V 33/00 - Structural combinations of lighting devices with other articles, not otherwise provided for
  • H05K 1/18 - Printed circuits structurally associated with non-printed electric components

47.

SENSOR

      
Application Number CN2023124295
Publication Number 2025/076773
Status In Force
Filing Date 2023-10-12
Publication Date 2025-04-17
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Deng, Wenjun
  • Huang, Yujia
  • Yuan, Yongshuai
  • Liang, Xianrong
  • Zhou, Wenbing

Abstract

Embodiments of the present description provide a sensor. The sensor comprises: a flexible substrate; a first sensing structure and a second sensing structure, wherein the first sensing structure and the second sensing structure comprise multilayer structures arranged on the surface of a same side of the flexible substrate in the thickness direction, and layers of each multilayer structure are stacked in the thickness direction; and a processing circuit, wherein the processing circuit reads parameters, related to resistance or capacitance, of the first sensing structure and the second sensing structure, respectively, and determines deformation of the flexible substrate in at least two dimensions on the basis of the parameters.

IPC Classes  ?

  • G01B 7/16 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge

48.

FORCE FEEDBACK SYSTEM

      
Application Number CN2024099232
Publication Number 2025/077257
Status In Force
Filing Date 2024-06-14
Publication Date 2025-04-17
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Deng, Wenjun
  • Yuan, Yongshuai

Abstract

Embodiments of the present description provide a force feedback system, comprising: a glove body; a microprocessor coupled to the glove body, wherein the microprocessor is communicatively coupled to an external computing device; and a plurality of finger force feedback elements, wherein each finger force feedback element among the plurality of finger force feedback elements is mechanically coupled to the glove body and is communicatively coupled to the microprocessor, and is configured to provide, on the basis of an instruction of the microprocessor, force feedback to a finger corresponding to the finger force feedback element, each finger force feedback element comprises a pull rope for tracking movement of the corresponding finger, a transmission part moving along with the pull rope, and a stop part, a plurality of stop structures are sequentially arranged on the transmission part, and the stop part is configured to cooperate with any one of the plurality of stop structures to brake the corresponding finger.

IPC Classes  ?

  • G01B 7/16 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge

49.

METHOD AND SYSTEM FOR DETERMINING ANGLE OF FINGER JOINT

      
Application Number CN2024099237
Publication Number 2025/077258
Status In Force
Filing Date 2024-06-14
Publication Date 2025-04-17
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Yuan, Yongshuai
  • Deng, Wenjun

Abstract

Provided in the embodiments of the present description are a method and system for determining the angle of a finger joint. The method comprises: acquiring first sensor data related to at least two target finger joints of a user, wherein the first sensor data is collected by using at least two strain sensors, each strain sensor is arranged in a glove body worn by the user and is located at one of the at least two target finger joints, and the at least two target finger joints comprise at least two adjacent palm finger joints of the user; acquiring a first mapping relationship, wherein the first mapping relationship reflects the relationship between sensor data corresponding to the at least two target finger joints and joint angles; and on the basis of the first sensor data and the first mapping relationship, determining a first joint angle of each target finger joint.

IPC Classes  ?

  • G01B 7/16 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge

50.

METHOD AND SYSTEM FOR DETERMINING CORRESPONDENCE BETWEEN SENSOR DATA AND FINGER JOINT ANGLES

      
Application Number CN2024099238
Publication Number 2025/077259
Status In Force
Filing Date 2024-06-14
Publication Date 2025-04-17
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Yuan, Yongshuai
  • Deng, Wenjun

Abstract

Provided in the embodiments of the present specification are a method and a system for determining a correspondence between sensor data and finger joint angles. The method comprises: acquiring a plurality of groups of sample sensor data, wherein each group of sample sensor data is related to at least two sample finger joints of a sample user, and is collected by at least two sample strain sensors at a target moment, each sample strain sensor is arranged in the body of a sample glove worn by the sample user and is located at one of the at least two sample finger joints, and the at least two sample finger joints comprise at least two adjacent metacarpophalangeal joints of the sample user; for each group of sample sensor data, acquiring an optical hand image, which corresponds to the group of sample sensor data and is captured by the sample user at the target moment; on the basis of the optical hand image, determining sample joint angles, which correspond to the hand optical image, of the at least two sample finger joints of the sample user; and determining a correspondence between each group of sample sensor data and the sample joint angles corresponding thereto.

IPC Classes  ?

  • G01B 7/16 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
  • G06V 40/20 - Movements or behaviour, e.g. gesture recognition

51.

ACOUSTIC DEVICES AND MAGNETIC CIRCUIT ASSEMBLIES THEREOF

      
Application Number 18986758
Status Pending
Filing Date 2024-12-19
First Publication Date 2025-04-10
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Wang, Liwei
  • Zhang, Lei
  • Liao, Fengyun
  • Qi, Xin
  • Fu, Junjiang
  • Xie, Shuailin
  • Li, Chaowu

Abstract

The present disclosure provides an acoustic device. The acoustic device may include a shell including a first accommodation cavity, a speaker configured in the first accommodation cavity. The speaker may include one or more magnetic circuit assemblies, a voice coil, a vibration assembly, and a vibration transmission plate. The one or more magnetic circuit assemblies may form a magnetic gap. One end of the voice coil may be arranged in a magnetic gap, and another end of the voice coil may be connected with the vibration assembly. The vibration assembly may be connected with the vibration transmission plate, and the vibration transmission plate may be connected with the shell.

IPC Classes  ?

  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details
  • H04R 7/12 - Non-planar diaphragms or cones
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
  • H04R 9/04 - Construction, mounting, or centering of coil
  • H04R 9/06 - Loudspeakers
  • H04R 25/00 - Deaf-aid sets

52.

CORE MODULES AND ELECTRONIC DEVICES

      
Application Number 18989037
Status Pending
Filing Date 2024-12-20
First Publication Date 2025-04-10
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Li, Chaowu
  • Nie, Qianwen

Abstract

A core module and an electronic device are provided. The core module comprises a housing component, a transducer device, a vibration panel, and a face attachment component. The transducer device is disposed in the housing component. The vibration panel is connected with the transducer device. The face attachment component includes a face attachment sleeve connected with the vibration panel by a bonding medium to make the vibration panel contact a skin of a user through the face attachment component. The bonding medium is configured to allow the face attachment component to be removed from the vibration panel as a whole without damaging the face attachment component or the vibration panel. The face attachment component is detachable such that the user can easily replace the face attachment component with a new one when needed, and the face attachment component can be removed as a whole to avoid breakage.

IPC Classes  ?

53.

ELECTRONIC DEVICES

      
Application Number 18989052
Status Pending
Filing Date 2024-12-20
First Publication Date 2025-04-10
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Nie, Qianwen
  • Li, Chaowu

Abstract

An electronic device is provided. The electronic device comprises a housing component, a circuit board, and a key component. An outer side of the housing component is provided with a concave region. A bottom of the concave region is provided with a key through hole, and the circuit board is disposed in the housing component. The key component includes a key and a sealing ring. The key extends into the housing component through the key through hole. The sealing ring is located in the concave region and surrounds the key through hole. The key includes an operation portion, a plug-in post connected with the operation portion, and a buckle portion connected with the plug-in post. The operation portion is partially located in the concave region and supported on the sealing ring. The plug-in post penetrates through the sealing ring and the key through hole to extend into the housing component.

IPC Classes  ?

  • G06F 3/02 - Input arrangements using manually operated switches, e.g. using keyboards or dials
  • H04R 1/08 - MouthpiecesAttachments therefor

54.

ACOUSTIC OUTPUT DEVICE

      
Application Number 18983424
Status Pending
Filing Date 2024-12-17
First Publication Date 2025-04-10
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhang, Lei
  • Qi, Xin
  • Fu, Junjiang
  • Wang, Zhen
  • Wang, Liwei

Abstract

The present disclosure provides an acoustic output device. The acoustic output device may comprise a bone conduction speaker configured to generate bone conduction acoustic waves. The acoustic output device may also comprise an air conduction speaker configured to generate air conduction acoustic waves, the air conduction speaker being independent of the bone conduction speaker. The acoustic output device may further comprise at least one housing configured to accommodate the bone conduction speaker and the air conduction speaker.

IPC Classes  ?

  • H04R 1/24 - Structural combinations of separate transducers or of parts of the same transducer and responsive respectively to two or more frequency ranges
  • H04R 1/10 - EarpiecesAttachments therefor

55.

SOUND OUTPUT DEVICE, SENSORY SOUND SOURCE ADJUSTMENT METHOD, AND VOLUME ADJUSTMENT METHOD

      
Application Number 18984905
Status Pending
Filing Date 2024-12-17
First Publication Date 2025-04-10
Owner Shenzhen Shokz Co., Ltd. (China)
Inventor
  • Fu, Junjiang
  • Zhang, Lei
  • Liao, Fengyun
  • Qi, Xin

Abstract

The present disclosure provides a sound output device, a sensory sound source adjustment method, and a volume adjustment method. The sound output device includes: a signal processing circuit to generate, during operation, a first electrical signal and a second electrical signal based on target sound information; a first speaker, electrically connected to the signal processing circuit to receive, during operation, the first electrical signal from the signal processing circuit and convert the first electrical signal into a first excitation to excite a first mechanical structure to generate a first sound wave; and a second speaker, electrically connected to the signal processing circuit to receive, during operation, the second electrical signal from the signal processing circuit and convert the second electrical signal into a second excitation to excite a second mechanical structure to generate a second sound wave.

IPC Classes  ?

56.

ACOUSTIC DEVICE

      
Application Number 18979467
Status Pending
Filing Date 2024-12-12
First Publication Date 2025-04-03
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Wang, Yueqiang
  • Wu, Zhongqi
  • You, Fen
  • Li, Chaowu
  • Zeng, Qingyu

Abstract

The present disclosure discloses an acoustic device. The acoustic device may include a hanger assembly, at least one of an audio input component or an audio output component, a control circuit assembly, and a protection assembly. The hanger assembly may include a shell forming a space. The control circuit assembly may include one or more circuit boards arranged in the space. The protection assembly may include a protection plate. The protection plate may be arranged in the space and physically connected with the shell of the hanger assembly to form a protection barrier between at least one of the one or more circuit boards and the shell.

IPC Classes  ?

57.

EARPHONES

      
Application Number 18963742
Status Pending
Filing Date 2024-11-28
First Publication Date 2025-03-20
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Deng, Wenjun
  • Yuan, Yongshuai
  • Huang, Yujia
  • Zhou, Wenbing
  • Liao, Fengyun
  • Qi, Xin

Abstract

Disclosed is an earphone including: two speaker assemblies, a connection member, and a processing circuit. The connection member is configured to connect the two speaker assemblies, and the connection member provides, through a bending deformation, a clamping force for placing the two speaker assemblies on a head of a user, and the connection member includes a housing with an accommodation cavity. A bending sensor is disposed in the accommodating cavity, and the bending sensor is configured to generate a bending signal based on a bending state of the connection member. The processing circuit is configured to determine a placement state of the earphone based on the bending signal. The placement state includes one of a normal wearing state, an abnormal wearing state, or a free placement state.

IPC Classes  ?

  • H04R 1/10 - EarpiecesAttachments therefor
  • G01B 7/16 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge

58.

LOUDSPEAKERS

      
Application Number 18959542
Status Pending
Filing Date 2024-11-25
First Publication Date 2025-03-13
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhou, Wenbing
  • Zhang, Lei
  • Qi, Xin
  • Liao, Fengyun
  • Gu, Shanyong

Abstract

A loudspeaker comprising a diaphragm, a housing, and a cavity structure is provided. The diaphragm is configured to vibrate to produce air-conducted sound waves. The housing is configured to form an accommodation cavity for housing the diaphragm. The diaphragm divides the accommodation cavity into a front cavity and a rear cavity. The housing is provided with a sound outlet hole communicating with the front cavity, and at least a portion of the air-conducted sound waves is transmitted through the sound outlet hole to an exterior of the loudspeaker. The cavity structure is provided on the housing and communicated with at least one of the front cavity and the rear cavity, and the cavity structure is configured to absorb a sound wave with a target frequency in the air-conducted sound waves.

IPC Classes  ?

  • H04R 1/02 - CasingsCabinetsMountings therein

59.

TOUCH SENSOR DEVICES

      
Application Number 18955929
Status Pending
Filing Date 2024-11-21
First Publication Date 2025-03-13
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Deng, Wenjun
  • Yuan, Yongshuai
  • Huang, Yujia
  • Zhou, Wenbing
  • Liao, Fengyun
  • Qi, Xin

Abstract

The embodiments of the present disclosure provide a touch sensor device. The touch sensor device comprises a housing, configured to provide a touch region; and at least one sensor, configured to be fixed near the touch region. The at least one sensor includes: a signal transmitting unit, configured to generate a vibration signal under the action of an excitation signal; a signal receiving unit, configured to receive the vibration signal and generate an output signal; and a processor, configured to recognize a touch operation performed on the touch region according to the output signal.

IPC Classes  ?

  • G06F 3/043 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using propagating acoustic waves

60.

EARPHONES

      
Application Number 18956249
Status Pending
Filing Date 2024-11-22
First Publication Date 2025-03-13
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Huang, Yujia
  • Deng, Wenjun
  • Yuan, Yongshuai
  • Zhou, Wenbing
  • Liao, Fengyun
  • Qi, Xin

Abstract

Disclosed is an earphone comprising two speaker assemblies and a connection member. The connection member is used to connect the two speaker assemblies. The connection member provides a clamping force for placing the two speaker assemblies at a user's head through a bending deformation. The connection member includes a housing with an accommodation cavity, a capacitance sensor is disposed in the accommodation cavity, and the capacitance sensor is configured to identify a bending state of the connection member. The capacitance sensor includes a shielding structure that has a constant potential and is used to reduce an effect of an external electric field on the capacitance sensor.

IPC Classes  ?

61.

ACOUSTIC OUTPUT DEVICES

      
Application Number 18957926
Status Pending
Filing Date 2024-11-25
First Publication Date 2025-03-13
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Deng, Wenjun
  • Huang, Yujia
  • Yuan, Yongshuai
  • Zhou, Wenbing
  • Liao, Fengyun
  • Qi, Xin

Abstract

Embodiments of the present disclosure provide an acoustic output device, comprising: an acoustic output unit, a contact detection sensor, and a processor. The acoustic output unit includes a vibration unit and a casing, the casing at least including a contact region which is in contact with the face of a user; the contact detection sensor is located at the contact region; and the processor is configured to determine whether the user wears the acoustic output device based on an electrical signal generated when the contact detection sensor is in contact with the face of the user.

IPC Classes  ?

  • H04R 29/00 - Monitoring arrangementsTesting arrangements
  • H04R 1/10 - EarpiecesAttachments therefor

62.

LOUDSPEAKERS

      
Application Number 18959554
Status Pending
Filing Date 2024-11-25
First Publication Date 2025-03-13
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhou, Wenbing
  • Zhang, Lei
  • Qi, Xin
  • Liao, Fengyun
  • Gu, Shanyong

Abstract

Disclosed is a loudspeaker, comprising a vibration diaphragm configured to vibrate to generate air-conducted sound waves and a casing configured to form an accommodation cavity. The vibration diaphragm divides the accommodation cavity into a front cavity and a rear cavity, the casing being provided with a sound outlet hole in flow communication with the front cavity, and at least a portion of the air-conducted sound waves being transmitted to the outside of the loudspeaker via the sound outlet hole. The casing is provided with a sound absorption pipe, and the sound absorption pipe is in flow communication with at least one of the front cavity and the rear cavity and configured to absorb sound waves of a target frequency in the air-conducted sound waves, and a length of the sound absorption pipe being in a range of 3/20-2/5 of a wavelength of the sound waves of the target frequency.

IPC Classes  ?

  • H04R 1/28 - Transducer mountings or enclosures designed for specific frequency responseTransducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means

63.

SPEAKERS

      
Application Number 18959561
Status Pending
Filing Date 2024-11-25
First Publication Date 2025-03-13
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhou, Wenbing
  • Zhang, Lei
  • Qi, Xin
  • Liao, Fengyun
  • Gu, Shanyong

Abstract

A speaker includes a shell, a diaphragm, and a sliding connection portion. The shell includes a cavity. The diaphragm is accommodated within the cavity and separates the cavity to form at least two sub-cavities. The diaphragm is driven by an electrical signal to vibrate to generate sound. The sliding connection portion is configured to connect an edge of the diaphragm to an inner wall of the cavity. The sliding connection portion allows the edge of the diaphragm to slide relative to the inner wall of the shell. Therefore, the diaphragm can move (slide) relative to the inner wall of the shell. In other words, the diaphragm can make a piston-like movement relative to the inner wall of the shell, which allows the diaphragm to generate a greater displacement, push more air, and thereby improving the performance of the speaker, especially the sensitivity of the speaker at a low frequency range.

IPC Classes  ?

  • H04R 7/20 - Securing diaphragm or cone resiliently to support by flexible material, springs, cords, or strands
  • H04R 1/02 - CasingsCabinetsMountings therein
  • H04R 7/04 - Plane diaphragms

64.

SENSING DEVICES

      
Application Number 18948391
Status Pending
Filing Date 2024-11-14
First Publication Date 2025-03-06
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Deng, Wenjun
  • Yuan, Yongshuai
  • Huang, Yujia
  • Zhou, Wenbing
  • Liao, Fengyun
  • Qi, Xin

Abstract

Provide a sensing device comprising a cavity and an air pressure sensor disposed within the cavity. The cavity includes two elastic walls disposed opposite to each other and a rigid wall connecting the two elastic walls, wherein the rigid wall is in a form of a tubular structure, and the two elastic walls are configured to seal the tubular structure to form the cavity. A deformation of the two elastic walls changes air pressure within the cavity, and the air pressure sensor is configured to generate an electrical signal in response to the change of the air pressure.

IPC Classes  ?

  • G01L 1/00 - Measuring force or stress, in general

65.

EARPHONES

      
Application Number 18950235
Status Pending
Filing Date 2024-11-18
First Publication Date 2025-03-06
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zheng, Zeying
  • Xu, Jiang

Abstract

Provided is an earphone comprising a core module and a hook structure connected to the core module. In wearing state, the core module is located at a front side of ear, a free end of the core module extends into a cavity of auricular concha of the ear, and a portion of the hook structure is located on a rear side of the ear. Orthographic projections of the hook structure and the core module on a first reference plane do not overlap. A first reference line segment having a shortest length is between the orthographic projections of the hook structure and the core module. When the core module is fixed, the hook structure, when pulled 5 mm to 10 mm away from the core module along a direction parallel to the first reference line segment, has a pulling force between 0.6 N and 8 N at a measurement fixed position.

IPC Classes  ?

66.

ELECTRODE STRUCTURES AND WEARABLE DEVICES

      
Application Number 18954461
Status Pending
Filing Date 2024-11-20
First Publication Date 2025-03-06
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhou, Xin
  • Liao, Fengyun
  • Qi, Xin

Abstract

Embodiments of the present disclosure provide an electrode structure including: a plurality of electrodes. Each of the plurality of electrodes is flexibly connected to at least another of the plurality of electrodes through a connector. The connection member allows electrically conduction of the connected electrodes. Electrode structures provided by embodiments of the present disclosure have a great elasticity coefficient range, and the electrode structures are adjustable.

IPC Classes  ?

  • A61B 5/256 - Wearable electrodes, e.g. having straps or bands
  • A61B 5/271 - Arrangements of electrodes with cords, cables or leads, e.g. single leads or patient cord assemblies

67.

ACOUSTIC DEVICES AND SUPPORT ASSEMBLIES THEREOF

      
Application Number 18950147
Status Pending
Filing Date 2024-11-17
First Publication Date 2025-03-06
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Wang, Yonggen
  • Liu, Zhiqing
  • Wang, Zhen
  • Mao, Xinnan

Abstract

The present disclosure discloses an acoustic device and a support assembly thereof. The support assembly may include a shell configured to provide a space for accommodating one or more components of the acoustic device. The support assembly may further include an interaction assembly configured to realize an interaction between a user and the acoustic device, wherein the interaction assembly include a first component and one or more second components, in response to receiving an operation of the user, the first component is configured to trigger at least one of the one or more second components to cause the acoustic device to perform a function corresponding to the at least one of the one or more second components.

IPC Classes  ?

68.

EARPHONES

      
Application Number 18942356
Status Pending
Filing Date 2024-11-08
First Publication Date 2025-02-27
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Xu, Jiang
  • Zheng, Zeying

Abstract

Provided is an earphone comprising a core module and a hook structure connected to the core module. The hook structure includes a battery housing, and a battery connected to the core module is disposed within the battery housing. In a wearing state, the core module is located at a front side of an ear, and a free end of the core module that is not connected to the hook structure extends into a cavity of auricular concha of the ear. A portion of the hook structure is located on a rear side of the ear in the wearing state. The core module and the battery housing jointly clamp an ear region corresponding to the cavity of auricular concha from a front side and a rear side of the ear region. The battery housing contacts the skin of the head around the ear.

IPC Classes  ?

69.

EARPHONES

      
Application Number 18942751
Status Pending
Filing Date 2024-11-10
First Publication Date 2025-02-27
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhang, Haofeng
  • Li, Yongjian
  • Xu, Jiang
  • Zhao, Tao

Abstract

Provided is an earphone. The earphone may include a core module and a hook-like structure connected to the core module. The core module may be located on a front side of an ear in a wearing state, and at least part of the hook-like structure may be located on a rear side of the ear in the wearing state. The hook-like structure may include an adapter housing connected to the core module, and an accommodation cavity may be pre-formed in the adapter housing. The earphone may further include an electronic component that is subsequently mounted in the accommodating cavity.

IPC Classes  ?

70.

EARPHONES

      
Application Number 18942799
Status Pending
Filing Date 2024-11-11
First Publication Date 2025-02-27
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhang, Haofeng
  • Zheng, Zeying
  • Xu, Jiang
  • Wu, Duoduo

Abstract

Provided is an earphone. The earphone includes a core module and a hook-like structure connected to the core module. The core module has a connecting end connected to the hook-like structure and a free end not connected to the hook-like structure. The core module is located on a front side of an ear in a wearing state and the free end extends into a cavum conchae of the ear. At least a portion of the hook-like structure is located on a rear side of the ear in the wearing state, and the core module and the hook-like structure jointly clamp an ear region corresponding to the cavum conchae from a front side and a rear side of the ear region, which increases the resistance against the earphone falling off the ear, thereby improving the stability of the earphone during wear.

IPC Classes  ?

71.

STRAIN SENSORS AND METHODS FOR PREPARING THE SAME

      
Application Number 18943809
Status Pending
Filing Date 2024-11-11
First Publication Date 2025-02-27
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Yuan, Yongshuai
  • Deng, Wenjun
  • Huang, Yujia
  • Zhou, Wenbing
  • Liao, Fengyun
  • Qi, Xin

Abstract

A strain sensor comprising a substrate is provided. The substrate is provided with a groove structure. An electrically conductive film is affixed to a surface of the substrate, and a crack is provided at a position of the electrically conductive film corresponding to the groove structure.

IPC Classes  ?

  • G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
  • H04R 1/10 - EarpiecesAttachments therefor

72.

EARPHONES

      
Application Number 18943822
Status Pending
Filing Date 2024-11-11
First Publication Date 2025-02-27
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Wang, Chong
  • Han, Ruixin
  • Yue, Gong
  • Chen, Yunbin
  • Liu, Zhiqing
  • Xu, Jiang

Abstract

The present disclosure mainly relates to an earphone, comprising a core module and a hook structure. The core module is disposed on a front side of an ear in a wearing state. At least a portion of the hook structure is disposed at a rear side of the ear in the wearing state. The core module includes a core housing and a loudspeaker. The hook structure includes an adapter housing connected with the core housing. At least a portion of the adapter housing is disposed at the front side of the ear in the wearing state. The adapter housing forms an accommodation cavity and one or more through holes communicated with the accommodation cavity. The earphone includes one or more electrode terminals at least partially disposed in the one or more through holes.

IPC Classes  ?

73.

CHARGING CASES FOR EARPHONES

      
Application Number 18943834
Status Pending
Filing Date 2024-11-11
First Publication Date 2025-02-27
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Liu, Zhiqing
  • Zhang, Chenxi
  • Yan, Zeteng
  • Zhang, Haofeng

Abstract

The present disclosure provides a charging case for at least one earphone. Each of the at least one earphone may include a core module and a hook structure connected to the core module. The charging case may include a lower housing assembly. The lower housing assembly may be disposed with at least one profiling groove, and each of the at least one profiling groove may be configured to accommodate one of the at least one earphone. The lower housing assembly may be disposed with a first electrode terminal exposed in each of the at least one profiling groove, and an extension direction of the first electrode terminal may be inclined with respect to a thickness direction of the charging case. Therefore, the success rate of the connection of the electrode terminals can be improved.

IPC Classes  ?

74.

EARPHONES

      
Application Number 18944021
Status Pending
Filing Date 2024-11-12
First Publication Date 2025-02-27
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Yan, Zeteng
  • Zheng, Zeying
  • Xu, Jiang

Abstract

The present disclosure provides an earphone, comprising a core module and a hook structure. In a wearing state, the core module is disposed at a front side of an ear in a wearing state, and at least a portion of the hook structure is disposed at a rear side of the ear. A length of the core module is in a range of 22 mm-35 mm, which allows a free end of the core module to extend into a cavity of auricular concha. A transition portion of the hook structure is configured as a tapered structure, such that the earphone is smoother and more symmetrical in overall appearance. In the waring state and viewed along a direction of a human coronal axis, a connection end of the core module connected with the hook structure is closer to the top of the head of the user compared with the free end.

IPC Classes  ?

75.

WEARABLE DEVICES AND CARDIAC MONITORING SYSTEMS

      
Application Number 18945470
Status Pending
Filing Date 2024-11-12
First Publication Date 2025-02-27
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhou, Xin
  • Zhang, Yuxiang
  • Liu, Jia
  • Ning, Yixuan
  • Su, Lei
  • Li, Meiqi
  • Zhu, Huijin
  • Liao, Fengyun
  • Qi, Xin

Abstract

Provide is a wearable device comprising at least two electrodes and a wearable structure. The at least two electrodes are configured to fit against the skin of a human body to collect an electrocardiogram (ECG) signal of the human body, and the wearable structure is configured to carry the at least two electrodes and fit the at least two electrodes to a waist region of the human body. The at least two electrodes are spaced apart on the wearable structure, and disposed on two sides of a mid-sagittal plane of the human body when the human body wears the wearable structure.

IPC Classes  ?

  • A61B 5/318 - Heart-related electrical modalities, e.g. electrocardiography [ECG]
  • A61B 5/00 - Measuring for diagnostic purposes Identification of persons
  • A61B 5/0205 - Simultaneously evaluating both cardiovascular conditions and different types of body conditions, e.g. heart and respiratory condition
  • A61B 5/024 - Measuring pulse rate or heart rate
  • A61B 5/0245 - Measuring pulse rate or heart rate using sensing means generating electric signals
  • A61B 5/0531 - Measuring skin impedance

76.

EARPHONES

      
Application Number 18945738
Status Pending
Filing Date 2024-11-13
First Publication Date 2025-02-27
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Xu, Jiang
  • Hu, Cai
  • Zheng, Zeying
  • Zhang, Haofeng

Abstract

The present application relates to an earphone, comprising a hook portion and a retention portion connected to the hook portion. At least a part of the hook portion is hung between a rear side of an ear and the head of a user, the retention portion is configured to contact a front side of the ear, the hook portion includes a connection segment connected to the retention portion and a free segment connected to the connection segment, the connection segment and the free segment are located on opposite sides of the retention portion in the width direction, respectively. On a reference plane perpendicular to the thickness direction, a maximum spacing between the connection segment and the retention portion in the width direction is in a range of 10 mm-17 mm.

IPC Classes  ?

77.

ACOUSTIC OUTPUT DEVICES

      
Application Number 18942755
Status Pending
Filing Date 2024-11-10
First Publication Date 2025-02-27
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhang, Lei
  • Zhu, Guangyuan
  • Fu, Junjiang
  • Wang, Liwei
  • Qi, Xin

Abstract

Embodiments of the present disclosure provide an acoustic output device including: a transducer configured to generate a mechanical vibration based on an electrical signal, the transducer including a magnetic circuit assembly and a vibration transmission sheet; a housing configured to accommodate the transducer, the housing including a panel and a shell, the magnetic circuit assembly being elastically connected to the housing through the vibration transmission sheet, and the transducer transmitting the mechanical vibration to a user through the panel; and an additional element connected to the magnetic circuit assembly. The additional element is elastically connected to the panel through the magnetic circuit assembly.

IPC Classes  ?

  • H04R 1/28 - Transducer mountings or enclosures designed for specific frequency responseTransducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details
  • H04R 9/04 - Construction, mounting, or centering of coil
  • H04R 9/06 - Loudspeakers

78.

SENSOR DEVICES

      
Application Number 18945486
Status Pending
Filing Date 2024-11-12
First Publication Date 2025-02-27
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Deng, Wenjun
  • Yuan, Yongshuai
  • Huang, Yujia
  • Zhou, Wenbing
  • Liao, Fengyun
  • Qi, Xin

Abstract

The embodiments of the present disclosure provide a sensor device. The sensor device comprises a sensitive element and a substrate. The substrate is configured to carry the sensitive element. The sensitive element includes a first conductive layer and a sensitive layer. The first conductive layer includes at least two conductive units. The at least two conductive units are arranged in a distributed manner. At least a portion of the sensitive layer is disposed between and in contact with the at least two conductive units. A resistance value of the sensitive element changes in response to bending of the sensor device.

IPC Classes  ?

  • G01B 7/16 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
  • G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges

79.

ACOUSTIC OUTPUT DEVICES

      
Application Number 18761330
Status Pending
Filing Date 2024-07-02
First Publication Date 2025-02-20
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Huang, Yujia
  • Deng, Wenjun
  • Zhou, Wenbing
  • Yuan, Yongshuai
  • Liao, Fengyun
  • Qi, Xin

Abstract

An acoustic output device is provided. The acoustic output device includes a sound generation component, a support member, and a sensor. The sound generation component is configured to accommodate a sound generation unit that produces sound. The support member is configured to dispose the sound generation component near an ear without blocking an earhole. The sensor includes at least one ultrasonic transducer disposed inside the sound generation component. The sensor is configured to transmit a first ultrasonic signal to an outside of the sound generation component through the at least one ultrasonic transducer. The transducer is further configured to detect the second ultrasonic signal through the at least one ultrasonic transducer and determine a wearing state of the acoustic output device based on the detection. The second ultrasonic signal includes the first ultrasonic signal or a reflection signal of the first ultrasonic signal.

IPC Classes  ?

  • G01F 23/2962 - Measuring transit time of reflected waves
  • H04R 1/10 - EarpiecesAttachments therefor
  • H04R 1/40 - Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers

80.

CONDUCTIVE STRUCTURES AND FLEXIBLE SENSORS HAVING THE SAME

      
Application Number 18935631
Status Pending
Filing Date 2024-11-03
First Publication Date 2025-02-20
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Huang, Yujia
  • Deng, Wenjun
  • Yuan, Yongshuai
  • Zhou, Wenbing
  • Liao, Fengyun
  • Qi, Xin

Abstract

The embodiments of the present disclosure provide a conductive structure and a flexible sensor having the same. The conductive structure comprises a substrate, including an accommodation groove; a solid conductor, at least partially accommodated in the accommodation groove, the solid conductor and the accommodation groove forming a first accommodation region; and a fluid conductor, filled in the first accommodation region and extending outside the accommodation groove, a projection of a contact region between the fluid conductor and the solid conductor along a depth direction of the accommodation groove and a projection of the solid conductor along the depth direction having an overlapping region. The flexible sensor comprises at least one sensing structure. Each sensing structure includes two electrode plates; and a dielectric flexible body. The flexible sensor further comprises a processor. Each of the two electrodes includes the conductive structure.

IPC Classes  ?

  • G01B 7/16 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge

81.

ACOUSTIC OUTPUT DEVICES

      
Application Number 18935637
Status Pending
Filing Date 2024-11-03
First Publication Date 2025-02-20
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Wang, Zhen
  • Liang, Jianing
  • Zhang, Lei
  • Qi, Xin

Abstract

One or more embodiments of the present disclosure provide an acoustic output device, comprising a housing; a first loudspeaker disposed in the housing, the first loudspeaker being acoustically coupled with a first hole portion and a second hole portion disposed on the housing, respectively, and the first loudspeaker being driven by a first electrical signal to output a first sound wave and a second sound wave having a phase difference through the first hole portion and the second hole portion, respectively; and a second loudspeaker disposed in the housing, the second loudspeaker being driven by a second electrical signal to output a third sound wave. In a target frequency range, the superposition of the first sound wave, the second sound wave, and the third sound wave generates a directional far-field radiation from the acoustic output device.

IPC Classes  ?

  • H04R 1/32 - Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only

82.

ACOUSTIC OUTPUT DEVICES

      
Application Number 18936978
Status Pending
Filing Date 2024-11-04
First Publication Date 2025-02-20
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhang, Lei
  • Zhu, Guangyuan
  • Fu, Junjiang
  • Wang, Liwei
  • Qi, Xin

Abstract

Embodiments of the present disclosure provide an acoustic output device including: a transducer configured to generate a mechanical vibration based on an electrical signal; a housing configured to accommodate the transducer, the housing including a panel and a shell, the transducer being connected to the panel, and the transducer transmitting the mechanical vibration to a user through the panel; and an additional element elastically connected to the panel through a vibration path at least including one elastic element.

IPC Classes  ?

  • H04R 1/28 - Transducer mountings or enclosures designed for specific frequency responseTransducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details
  • H04R 9/04 - Construction, mounting, or centering of coil
  • H04R 9/06 - Loudspeakers

83.

WEARABLE DEVICE

      
Application Number 18936984
Status Pending
Filing Date 2024-11-04
First Publication Date 2025-02-20
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhou, Xin
  • Liu, Jia
  • Li, Meiqi
  • Su, Lei
  • Zhang, Yuxiang
  • Liao, Fengyun
  • Qi, Xin

Abstract

The present disclosure provides a wearable device. The wearable device comprises at least two electrodes, configured to be attached to a human skin to collect an electrocardiograph (ECG) signal of a human body; a wearable structure, configured to carry the at least two electrodes and attach the at least two electrodes to two sides of a midsagittal plane of the human body; and a processor, configured to determine a heart rate variability (HRV) of the human body based on the ECG signal, and determine a physical state of the human body based at least on the HRV.

IPC Classes  ?

  • A61B 5/318 - Heart-related electrical modalities, e.g. electrocardiography [ECG]
  • A61B 5/00 - Measuring for diagnostic purposes Identification of persons
  • A61B 5/0205 - Simultaneously evaluating both cardiovascular conditions and different types of body conditions, e.g. heart and respiratory condition
  • A61B 5/024 - Measuring pulse rate or heart rate
  • A61B 5/0245 - Measuring pulse rate or heart rate using sensing means generating electric signals
  • A61B 5/11 - Measuring movement of the entire body or parts thereof, e.g. head or hand tremor or mobility of a limb
  • A61B 5/256 - Wearable electrodes, e.g. having straps or bands
  • A61B 5/389 - Electromyography [EMG]

84.

DATA PROCESSING DEVICE AND METHOD

      
Application Number CN2023112935
Publication Number 2025/035362
Status In Force
Filing Date 2023-08-14
Publication Date 2025-02-20
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Tian, Qingyuan
  • Wang, Liang
  • Qiu, Jingbo

Abstract

The present application provides a data processing device and method. A processing circuit comprises a multi-core processor, and the multi-core processor comprises sub-processors of K cores, which are used to participate in a target process of performing N types of processing on target data to generate result data. Specifically, the processing circuit obtains the target data, determines N target computing powers corresponding to the N types of data processing, and determines, in the target process, allocation of the K cores in execution of the N types of data processing on the basis of the N target computing powers and a preset optimization objective. Therefore, by means of the solution provided in the present application, in an operating process of the data processing device, computing powers provided by K cores respectively for N types of data processing can be determined, and corresponding target computing powers are adaptively allocated to the different types of data processing, thereby improving the flexibility of computing power allocation.

IPC Classes  ?

  • G06F 9/50 - Allocation of resources, e.g. of the central processing unit [CPU]

85.

ACOUSTIC OUTPUT DEVICE

      
Application Number CN2023113119
Publication Number 2025/035388
Status In Force
Filing Date 2023-08-15
Publication Date 2025-02-20
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Huang, Yujia
  • Deng, Wenjun
  • Zhou, Wenbing
  • Yuan, Yongshuai
  • Liao, Fengyun
  • Qi, Xin

Abstract

An acoustic output device (100), comprising a sound production part (110), a support member (120), and a sensor (130). The sound production part (110) is configured to accommodate a sound production unit that produces sound. The support member (120) is configured to locate the sound production part (110) near the ear but not to block the position of the ear canal. The sensor (130) comprises at least one ultrasonic transducer located inside the sound production part. The sensor (130) is configured to transmit a first ultrasonic signal to the outside of the sound production part (110) by means of the at least one ultrasonic transducer. The sensor (130) is further configured to detect a second ultrasonic signal by means of the at least one ultrasonic transducer and determine a wearing state of the acoustic output device (100) on the basis of the detection. The second ultrasonic signal comprises the first ultrasonic signal or a reflected signal of the first ultrasonic signal. When the second ultrasonic signal detected by the sensor (130) changes after the wearing state of the acoustic output device (100) changes, the output state of the acoustic output device (100) changes.

IPC Classes  ?

86.

WEARABLE DEVICES

      
Application Number 18935633
Status Pending
Filing Date 2024-11-03
First Publication Date 2025-02-20
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor Zhou, Xin

Abstract

Provided is a wearable device comprising pants and a sensor assembly fixed on the pants. The sensor assembly includes at least one circumferential strain sensor. The at least one circumferential strain sensor extends along a circumferential direction of a pant leg of the pants and is configured to measure a circumferential dimension of a leg of a user.

IPC Classes  ?

  • A61B 5/00 - Measuring for diagnostic purposes Identification of persons
  • A61B 5/107 - Measuring physical dimensions, e.g. size of the entire body or parts thereof
  • A61B 5/389 - Electromyography [EMG]

87.

ACOUSTIC OUTPUT DEVICES

      
Application Number 18938456
Status Pending
Filing Date 2024-11-06
First Publication Date 2025-02-20
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Wang, Zhen
  • Liang, Jianing
  • Zhang, Lei
  • Qi, Xin

Abstract

An acoustic output device comprises a housing, a first loudspeaker and a second loudspeaker disposed in the housing. The first loudspeaker includes a first diaphragm. In the housing, a first front cavity and a first rear cavity are respectively disposed on a front side and a rear side of the first diaphragm, and the first front cavity and the first rear cavity are acoustically coupled with two hole portions disposed on the housing, respectively, to output a first sound wave and a second sound wave. The second loudspeaker includes a second diaphragm. In the housing, a second front cavity and a second rear cavity are respectively disposed on a front side and a rear side of the second diaphragm, and only one of the second front cavity and the second rear cavity is acoustically coupled with a hole portion disposed on the housing to output a third sound wave.

IPC Classes  ?

  • H04R 1/02 - CasingsCabinetsMountings therein
  • H04R 1/24 - Structural combinations of separate transducers or of parts of the same transducer and responsive respectively to two or more frequency ranges
  • H04R 7/16 - Mounting or tensioning of diaphragms or cones

88.

ACOUSTIC OUTPUT DEVICES

      
Application Number 18939466
Status Pending
Filing Date 2024-11-06
First Publication Date 2025-02-20
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhang, Lei
  • Zhu, Guangyuan
  • Fu, Junjiang
  • Wang, Liwei
  • Qi, Xin

Abstract

Embodiments of the present disclosure provide an acoustic output device comprising a transducer device configured to generate a mechanical vibration based on an electrical signal, the transducer device including a magnetic circuit assembly and an elastic support component; a housing configured to accommodate the transducer device, wherein the housing includes a panel and a shell, the transducer device transmitting the mechanical vibration to a user through the panel; and an additional element connected to the panel through a vibration path, the vibration path at least including an elastic element, the additional element being located at a sidewall of the shell adjacent to the panel, and the elastic support component connecting the magnetic circuit assembly and the sidewall disposed with the additional element.

IPC Classes  ?

  • H04R 1/28 - Transducer mountings or enclosures designed for specific frequency responseTransducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details
  • H04R 9/04 - Construction, mounting, or centering of coil
  • H04R 9/06 - Loudspeakers

89.

OPEN WEARABLE ACOUSTIC DEVICE AND ACTIVE NOISE REDUCTION METHOD

      
Application Number 18939629
Status Pending
Filing Date 2024-11-07
First Publication Date 2025-02-20
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhang, Chengqian
  • Zheng, Jinbo

Abstract

An open wearable acoustic device and an active noise reduction method are provided. The acoustic device includes a second sound sensor module, a speaker, and a noise reduction circuit. A first preset relationship is satisfied between a transfer function from the speaker to the second sound sensor module and a transfer function from the speaker to an eardrum, and the first preset relationship is independent of a pose of the acoustic device. The noise reduction circuit adjusts a noise reduction parameter based on a second sound signal and the first preset relationship, and performs active noise reduction based on the adjusted noise reduction parameter. The noise reduction parameter is adjusted based on the second sound signal and the first preset relationship. Hence, the noise reduction parameter complies with an accurate noise reduction aim, and a noise reduction effect of active noise reduction may be improved.

IPC Classes  ?

  • H04R 1/10 - EarpiecesAttachments therefor
  • G10K 11/178 - Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effectsMasking sound by electro-acoustically regenerating the original acoustic waves in anti-phase
  • H04R 29/00 - Monitoring arrangementsTesting arrangements

90.

OPEN WEARABLE ACOUSTIC DEVICE AND ACTIVE NOISE REDUCTION METHOD

      
Application Number 18939632
Status Pending
Filing Date 2024-11-07
First Publication Date 2025-02-20
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zheng, Jinbo
  • Zhang, Chengqian

Abstract

An open wearable acoustic device and an active noise reduction method are provided. The acoustic device includes a first sound sensor module, a speaker, and a noise reduction circuit. The first sound sensor module includes N sound sensors. The noise reduction circuit determines, based on a target direction from which ambient noise comes, N weights corresponding to the N sound sensors, so that a phase of an integrated ambient noise signal measured by the first sound sensor module based on the N weights is ahead of a phase of the ambient noise reaching a sound output end of the speaker. The noise reduction circuit generates a first noise cancellation signal based on N individual ambient noise signals captured by the N sound sensors, and the N weights. The speaker converts the first noise cancellation signal into a first noise cancellation audio, thereby achieving noise reduction.

IPC Classes  ?

  • G10K 11/178 - Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effectsMasking sound by electro-acoustically regenerating the original acoustic waves in anti-phase

91.

Hearing aid

      
Application Number 29875552
Grant Number D1063076
Status In Force
Filing Date 2023-05-05
First Publication Date 2025-02-18
Grant Date 2025-02-18
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Huang, Sunjie
  • Zhong, Lei
  • Li, Chaowu
  • Nie, Qianwen
  • Lou, Chenlu
  • Zeng, Qingyu
  • Liao, Fengyun

92.

CORE MODULES AND EARPHONES

      
Application Number 18929658
Status Pending
Filing Date 2024-10-29
First Publication Date 2025-02-13
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhang, Haofeng
  • Li, Yongjian
  • Xu, Jiang
  • Wu, Duoduo

Abstract

Provided are a core module and an earphone. The core module may include a core housing, and a speaker and a bracket provided in the core housing. The bracket and the speaker may enclose to form an acoustic cavity, the core housing may be provided with an acoustic hole, the bracket may be provided with an acoustic channel connecting the acoustic hole and the acoustic cavity, the bracket may cooperate with the core housing to form a first adhesive-containing groove surrounding at least a portion of the acoustic hole, and the first adhesive-containing groove may contain a first adhesive for sealing an assembly gap between the bracket and the core housing.

IPC Classes  ?

93.

HOUSING ASSEMBLIES AND ELECTRONIC DEVICES

      
Application Number 18931014
Status Pending
Filing Date 2024-10-29
First Publication Date 2025-02-13
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhang, Haofeng
  • Xu, Jiang
  • Wu, Duoduo
  • Ji, Ao

Abstract

Provided are a housing assembly and an electronic device. The housing assembly may include a first housing, an electrode terminal, a microphone, and a support assembly. The first housing may be provided with an accommodation cavity and a first through-hole and a second through-hole that are connected to the accommodation cavity, respectively. The first through-hole and the second through-hole are located on different side walls of the first housing. The electrode terminal may be at least partially provided in the first through-hole, the microphone may be provided in the accommodation cavity and configured to collect a sound outside the housing assembly through the second through-hole, and the support assembly may be provided in the accommodation cavity and configured to support and fix the electrode terminal and the microphone to the side walls corresponding to the first through-hole and the second through-hole, respectively.

IPC Classes  ?

94.

EARPHONES

      
Application Number 18920971
Status Pending
Filing Date 2024-10-20
First Publication Date 2025-02-06
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Xu, Jiang
  • Zheng, Zeying
  • Yan, Zeteng

Abstract

The present disclosure provides an earphone, comprising a core module and a hook structure. In a wearing state, the core module is disposed on a front side of the ear, and at least a portion of the hook structure is disposed at a rear side of the ear. Orthographic projections of the hook structure and the core module on a reference plane perpendicular to a thickness direction do not overlap. The hook structure includes a battery housing and a flexible coating. A battery coupled with the core module is disposed in the battery housing, and the battery housing includes a cover housing and a battery compartment connected with the cover housing. The flexible coating is configured to cover the cover housing. A first reference line segment with the shortest length is provided between the orthographic projection of the hook structure and the orthographic projection of the core module.

IPC Classes  ?

95.

AUDIO PROCESSING DEVICE AND METHOD

      
Application Number CN2023110885
Publication Number 2025/025189
Status In Force
Filing Date 2023-08-03
Publication Date 2025-02-06
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Qiu, Jingbo
  • Wang, Liang
  • Tian, Qingyuan

Abstract

An audio processing device (10) and method. The audio processing device (10) comprises a sound production module (100) and an audio processing module (200). The sound production module (100) comprises N sound production units (110), and during operation, each sound production unit (110) outputs an audio signal of a predetermined frequency range. After acquiring original audio data, the audio processing module (200) performs frequency division processing on the original audio data to at least obtain M pieces of sub audio data of corresponding M sub frequency ranges, wherein each sub frequency range corresponds to the predetermined frequency range of an output of a corresponding sound production unit (110) among the N sound production units (110). On the basis of target audio characteristics of the M pieces of sub audio data, the audio processing module (200) separately performs audio adjustment of the corresponding M pieces of sub audio data to obtain M pieces of adjusted audio data, and respectively inputs each piece of adjusted audio data into the corresponding sound production unit (110). The sound quality effect of audio processing for the plurality of sound units (110) can be improved.

IPC Classes  ?

96.

CORE MODULE AND EARPHONE

      
Application Number CN2023131093
Publication Number 2025/025393
Status In Force
Filing Date 2023-11-10
Publication Date 2025-02-06
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zheng, Zeying
  • Li, Yongjian
  • Xu, Jiang
  • Ji, Ao

Abstract

A core module (1) and an earphone (100). The core module (1) comprises: a housing assembly (10), a battery assembly (20), and a driving assembly (30), wherein a first accommodating space (121a) and a second accommodating space (122a) are formed in the housing assembly (10); the battery assembly (20) is accommodated in the first accommodating space (121a) in a first preset assembly direction (Z1), and the driving assembly (30) is accommodated in the second accommodating space (122a) in a second preset assembly direction (Z2), the first preset assembly direction (Z1) being set at an acute angle relative to the second preset assembly direction (Z2); and a first limiting portion (1211) is provided in the first accommodating space (121a), the projections of the first limiting portion (1211) and the battery assembly (20) on the cross-section perpendicular to the first preset assembly direction (Z1) do not overlap each other, and the first limiting portion (1211) is used for limiting the battery assembly (20). In this way, the stability of the connection between the battery assembly (20) and the housing assembly (10) can be effectively improved, thereby effectively preventing the battery assembly (20) and the housing assembly (10) from moving relative to each other and exacerbating the vibration of the earphone (100) during operation, thus effectively improving the sound quality of the earphone (100).

IPC Classes  ?

97.

EARPHONE

      
Application Number CN2023131096
Publication Number 2025/025394
Status In Force
Filing Date 2023-11-10
Publication Date 2025-02-06
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Yan, Zeteng
  • Zheng, Zeying
  • Zhang, Haofeng
  • Li, Yongjian
  • Xu, Jiang
  • Xie, Shuailin
  • Zhu, Guangyuan
  • Zhang, Lei
  • Xie, Guolin
  • Zhong, Lei
  • Tong, Peigeng
  • Ma, Xiaoyu

Abstract

An earphone (100), comprising: a housing assembly (10), wherein the housing assembly (10) is used for forming an accommodating space (101) and has a first direction and a second direction arranged orthogonally to the first direction, and the housing assembly (10) further has a first end (102) and a second end (103) arranged facing away from each other in the first direction; an ear hook (2), connected to the housing assembly (10), wherein during wearing, the ear hook (2) is at least partially located on the rear side of an ear of a user, the housing assembly (10) is arranged on the front side of the ear of the user in a stacking manner along a second direction, and the first end (102) of the housing assembly (10) at least partially extends into an auricular concha cavity (502) of the ear of the user; and a loudspeaker (13), arranged in the accommodating space (101) and used for providing sound to the ear of the user. During wearing, in the first direction, the outer wall surface of the housing assembly (10) on the side facing the ear of the user is configured in an arc shape away from the ear of the user.

IPC Classes  ?

98.

EARPHONE

      
Application Number CN2023131100
Publication Number 2025/025398
Status In Force
Filing Date 2023-11-10
Publication Date 2025-02-06
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Zhong, Lei
  • Yan, Zeteng
  • Zheng, Zeying
  • Xu, Jiang
  • Tong, Peigeng
  • Zhang, Haofeng
  • Li, Yongjian
  • Xie, Shuailin
  • Zhu, Guangyuan
  • Zhang, Lei
  • Xie, Guolin
  • Ma, Xiaoyu

Abstract

An earphone (100), comprising an ear hook (2) and a main unit module (1), wherein the main unit module (1) is connected to the ear hook (2), and the main unit module (1) comprises a housing (11), a decorative cover (12) and a touch-control module (18); the housing (11) has an outer side surface (OS1) facing away from the ear of a user in a wearing state, and the decorative cover (12) is arranged on the outer side surface (OS1) of the housing (11) and is used for forming a touch-control positioning area (120) for the user to perform touch-control positioning; a positioning protrusion (121) is provided on the housing (11) and/or the decorative cover (12), and the positioning protrusion (121) is located in the touch-control positioning area (120) and protrudes from an outer surface (OS2) of the decorative cover (12) facing away from the housing (11); and the touch-control module (18) is arranged on the housing (11) and has a touch-control detection area (182) that at least partially overlaps with the touch-control positioning area (120).

IPC Classes  ?

99.

WEARABLE DEVICES

      
Application Number 18919401
Status Pending
Filing Date 2024-10-17
First Publication Date 2025-02-06
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Xie, Shuailin
  • Liu, Chunjian
  • Yuan, Wenbin
  • Xie, Zhao
  • Guo, Burui

Abstract

Disclosed is a wearable device, comprising a casing assembly, a circuit board, an interface assembly, and a wire assembly. The casing assembly is provided with an accommodation slot and an accommodation cavity, the circuit board is disposed within the accommodation cavity, and the interface assembly is inserted into the accommodation slot, and electrically connected with the circuit board through the wire assembly. By setting the interface assembly separately from the circuit board and utilizing the wire assembly to establish an electrical connection between the interface assembly and the circuit board, a space occupied by the interface assembly on the circuit board can be reduced, which is conducive to reducing the size of the circuit board, adjusting a mounting position and mounting attitude of the interface assembly, and the overall miniaturized design of the wearable device may be realized.

IPC Classes  ?

  • H05K 5/00 - Casings, cabinets or drawers for electric apparatus

100.

SENSOR

      
Application Number CN2023110335
Publication Number 2025/025090
Status In Force
Filing Date 2023-07-31
Publication Date 2025-02-06
Owner SHENZHEN SHOKZ CO., LTD. (China)
Inventor
  • Deng, Wenjun
  • Huang, Yujia
  • Yuan, Yongshuai
  • Zhou, Wenbing

Abstract

A sensor. The sensor comprises: a flexible substrate (11); and a first sensing structure (12), wherein the first sensing structure (12) comprises a multi-layer structure arranged on one side surface of the flexible substrate (11) in the thickness direction. Layers of the multi-layer structure of the first sensing structure (12) are stacked in the thickness direction of the flexible substrate (11). The multi-layer structure of the first sensing structure (12) comprises a first conductive layer (121) and a second conductive layer (122), and the first conductive layer (121) and the second conductive layer (122) are arranged adjacent to each other. The second conductive layer (122) is located between the first conductive layer (121) and the flexible substrate (11), and the resistance of the second conductive layer (122) changes along with the deformation of the flexible substrate (11).

IPC Classes  ?

  • G01D 5/16 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying resistance
  • G01B 7/28 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring contours or curvatures
  • G01B 7/16 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
  • G01B 7/30 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring angles or tapersMeasuring arrangements characterised by the use of electric or magnetic techniques for testing the alignment of axes
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