Abstract

A method and a device for hermetically encapsulating components using at least one gas discharge lamp, an inorganic material that is transparent for light and a light-absorbing inorganic medium, are provided. With a suitable selection, inorganic materials or inorganic media guarantee a very low level of permeability for oxygen, water vapor and reactive gases in contrast to organic materials or organic media. The encapsulation occurs in a time period of less than one second. In addition, the average temperature of the component only increases slightly, such that even components with temperature-sensitive regions can be encapsulated.

IPC Classes  ?

• C03C 27/06 - Joining glass to glass by processes other than fusing
• H01L 51/52 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) - Details of devices
• H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups or
• C03C 27/00 - Joining pieces of glass to pieces of other inorganic materialJoining glass to glass other than by fusing
• C03C 3/072 - Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
• C03C 8/24 - Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metalGlass solders