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Found results for
 patents
1.
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FLEXIBLE PIEZOELECTRIC ACOUSTIC SENSOR FABRICATED INTEGRALLY WITH SI AS THE SUPPORTING SUBSTRATE, VOICE SENSOR USING THIN FILM POLYMER AND VOICE SENSOR WITH DIFFERENT THICKNESS AND VOICE SENSING METHOD USING SAME
| Application Number |
KR2021013188 |
| Publication Number |
2023/054738 |
| Status |
In Force |
| Filing Date |
2021-09-28 |
| Publication Date |
2023-04-06 |
| Owner |
FRONICS INC. (Republic of Korea)
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| Inventor |
- Lee, Keonjae
- Jung, Young Hoon
- Han, Jae Hyun
- Wang, Hee Seung
- Chung, Mingi
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Abstract
Provided is a voice sensor comprising a piezoelectric material layer includes a substrate, a support layer, a metal layer, a piezoelectric material layer on the metal layer and an electrode on the piezoelectric material layer, and the substrate integrally supports a device layer of the voice sensor by exposing a part of a thin film including the piezoelectric material layer, the electrode and a polymer layer.
IPC Classes ?
- H04R 17/00 - Piezoelectric transducersElectrostrictive transducers
- H01L 41/083 - Piezo-electric or electrostrictive elements having a stacked or multilayer structure
- H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
- H01L 41/18 - Selection of materials for piezo-electric or electrostrictive elements
- G10L 15/28 - Constructional details of speech recognition systems
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2.
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Flexible piezoelectric acoustic sensor fabricated integrally with Si as the supporting substrate, voice sensor using thin film polymer and voice sensor with different thickness and voice sensing method using same
| Application Number |
17347415 |
| Grant Number |
11647338 |
| Status |
In Force |
| Filing Date |
2021-06-14 |
| First Publication Date |
2021-12-30 |
| Grant Date |
2023-05-09 |
| Owner |
- KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (Republic of Korea)
- FRONICS INC. (Republic of Korea)
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| Inventor |
- Lee, Keonjae
- Jung, Young Hoon
- Han, Jae Hyun
- Wang, Hee Seung
- Chung, Mingi
|
Abstract
Provided is a voice sensor comprising a piezoelectric material layer includes a substrate, a support layer, a metal layer, a piezoelectric material layer on the metal layer and an electrode on the piezoelectric material layer, and the substrate integrally supports a device layer of the voice sensor by exposing a part of a thin film including the piezoelectric material layer, the electrode and a polymer layer.
IPC Classes ?
- H04R 17/02 - Microphones
- H10N 30/88 - MountsSupportsEnclosuresCasings
- H10N 30/20 - Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N 30/853 - Ceramic compositions
- H10N 30/078 - Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
- H04R 3/04 - Circuits for transducers for correcting frequency response
- H04R 1/04 - Structural association of microphone with electric circuitry therefor
- H04R 17/00 - Piezoelectric transducersElectrostrictive transducers
- H04R 7/04 - Plane diaphragms
- H03F 3/183 - Low-frequency amplifiers, e.g. audio preamplifiers with semiconductor devices only
- H01L 41/053 - Mounts, supports, enclosures or casings
- H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
- H01L 41/187 - Ceramic compositions
- H01L 41/318 - Applying piezo-electric or electrostrictive parts or bodies onto an electrical element or another base by depositing piezo-electric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
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