Abstract

A method of manufacturing at least a first electronic device (1, 1a) comprising a first plurality of components (11, 12, 13, 131, 132, 14, 15, 16) is disclosed. The method comprises: providing a substrate (2) to support the first electronic device, at least during its manufacture; and selectively depositing over a first limited (bounded) portion (LP1, 201) of the substrate, by atomic layer deposition (ALD), a first thin film (T1) of conductive, semiconductive, resistive, or dielectric material, the first thin film providing at least one of the first plurality of components.

IPC Classes  ?

• C23C 16/04 - Coating on selected surface areas, e.g. using masks
• H10D 30/01 - Manufacture or treatment
• H10P 14/24 -

Abstract

Methods of, and apparatus for, manufacturing integrated circuits (ICs) are disclosed. The method includes processing a carrier for supporting a plurality ICs during fabrication and for aiding release of the ICs following fabrication. Processing the carrier includes providing a layer of a release material thereon, which is subsequently patterned prior to the deposition of substrate materials upon which ICs are formed.

IPC Classes  ?

• H10P 72/70 -
• H10P 50/00 -
• H10P 50/28 -
• H10P 76/40 -

Abstract

An electronic circuit assembly comprising an application circuit comprising a plurality of application circuit electrical contact pads; and a flexible integrated circuit comprising a first surface, a second surface on an opposite face of the flexible integrated circuit to the first surface, and a plurality of integrated circuit electrical contact pads located on the second surface. The flexible integrated circuit is arranged such that the first surface faces the application circuit and each of the application circuit electrical contact pads is located at least partially outside of a footprint of the flexible integrated circuit. Each of the integrated circuit electrical contact pads is electrically connected to a respective one of the application circuit electrical contact pads by a respective one of a plurality of solidified fluid conductors.

IPC Classes  ?

• H10W 72/30 -
• H10W 72/00 -
• H10W 72/90 -
• H10W 90/00 -
• H10W 90/28 -

Abstract

An integrated circuit chip (100) is disclosed that is formed on a substrate (102) and has connection regions (104b) for facilitating external electrical connections. A passivation layer (106) extends over an active surface of at least a portion of the integrated circuit. A plurality of projecting features (108) formed of a dielectric material extend from the passivation layer, in a direction away from the active surface. The surface density and arrangement of projecting features are configured for providing additional protection of the integrated circuit, for supporting the integrated circuit during assembly of the integrated circuit chip with external circuitry to form an electronic device, and for limiting wafer-level deformation during manufacture.

IPC Classes  ?

• H10W 42/00 -
• H10W 20/41 -
• H10W 44/20 -
• H10W 72/00 -
• H10W 74/10 -
• H10W 90/00 -
• H10W 72/90 -

Abstract

A method for fabricating one or more integrated circuits (ICs) on a carrier, the method comprising: identifying, from a first orientation of the carrier and a second orientation of the carrier, an orientation of the carrier in which an upper surface of the carrier has a smaller concave bow; and fabricating the one or more ICs on the upper surface of the carrier when the carrier is in the identified orientation.

IPC Classes  ?

• H10P 72/70 -

Abstract

An integrated circuit comprising a stacked structure having first and second conductive layers and a dielectric layer arranged therebetween. The first conductive layer comprises an electrical contact pad having a first shape, in a cross section taken through the contact pad and orthogonal to a stacking axis of the stacked structure. The second conductive layer comprises a structure electrically connected to the contact pad by one or more vias across the dielectric layer. The structure has a second shape, in a cross section taken through the structure and orthogonal to the stacking axis, the second shape being a different geometric shape from the first shape.

IPC Classes  ?

• H10W 72/90 -

Abstract

Heater apparatus is disclosed. The heater apparatus includes a heating surface and heater devices arranged to provide heat for heating the heating surface. The heater devices include one or more heater field effect transistors (FETs), each having a gate, a source, and a drain. Each heater FET is arranged to generate heat for heating the heating surface when a control signal is applied to the gate of that heater FET, and a corresponding current flows between the drain and the source of that heater FET.

IPC Classes  ?

• H05B 3/14 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
• H05B 3/00 - Ohmic-resistance heating
• H05B 3/26 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base

Abstract

A photolithographic method of forming a tapered via channel in an integrated circuit, IC. The tapered via channel extends through an insulator layer sandwiched between a first conductive layer and a second conductive layer. The insulator layer comprises a photopatternable material. The tapered via channel comprises a lower opening at the boundary between the insulator layer and the first conductive layer and an upper opening at the boundary between the insulator layer and the second conductive layer. The method comprises depositing a layer of the photopatternable material onto the first conductive layer, and exposing the photopatternable material using a photomask comprising a feature corresponding to the upper opening of the tapered via channel. The exposing is arranged to facilitate tapering of the via channel.

IPC Classes  ?

• H10P 50/68 -
• H10W 20/00 -
• H10W 20/41 -

Abstract

An integrated circuit chip is disclosed. The integrated circuit chip comprises a substrate on which is formed an integrated circuit and at least one connection region for forming an external electrical connection to the integrated circuit. The integrated circuit chip also comprises a plurality of shielding elements for providing protection of the integrated circuit and/or supporting the integrated circuit during assembly of the integrated circuit chip with external circuitry to form an electronic device. The shielding elements are arranged in a tessellating pattern with gaps between adjacent shielding elements within the tessellating pattern.

IPC Classes  ?

• H01L 23/58 - Structural electrical arrangements for semiconductor devices not otherwise provided for
• G06F 30/39 - Circuit design at the physical level
• H01L 23/498 - Leads on insulating substrates
• H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Abstract

An integrated circuit comprising a temperature sensor. The temperature sensor is configured to measure temperature across a predetermined temperature range. The temperature sensor comprises a sensing resistor and a reference resistor. The sensing resistor comprises a metal track having a first temperature coefficient of resistance. The reference resistor has a second temperature coefficient of resistance less than the first temperature coefficient of resistance.

IPC Classes  ?

• G01K 7/20 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer in a specially-adapted circuit, e.g. bridge circuit
• G01K 7/18 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer

Abstract

A method of generating a design for a processor in accordance with a subset instruction set architecture is disclosed in which a subset of one or more instructions, from a set of instructions for an instruction set architecture is obtained. A representation of hardware for implementing each instruction of the subset is retrieved from a library that includes a representation of hardware for implementing each instruction of the set of instructions. A further representation of hardware for implementing the processor in accordance with the subset instruction set architecture is generated using the retrieved representations of hardware for implementing the instructions of the subset.

IPC Classes  ?

• G06F 15/78 - Architectures of general purpose stored program computers comprising a single central processing unit
• G06F 9/30 - Arrangements for executing machine instructions, e.g. instruction decode

Abstract

An electronic circuit comprising a first transistor coupled between a voltage supply and a first node, a second transistor coupled between the voltage supply and a second node, and a differential amplifier comprising first and second input terminals and an output terminal. The differential amplifier is coupled to an input terminal of the first transistor and to an input terminal of the second transistor. The first node is coupled to the first input terminal of the differential amplifier. The second node is coupled to the second input terminal of the differential amplifier.

IPC Classes  ?

• G05F 3/24 - Regulating voltage or current wherein the variable is DC using uncontrolled devices with non-linear characteristics being semiconductor devices using diode-transistor combinations wherein the transistors are of the field-effect type only
• G05F 3/26 - Current mirrors
• G05F 3/30 - Regulators using the difference between the base-emitter voltages of two bipolar transistors operating at different current densities

Abstract

A semiconductor wafer is presented. The semiconductor wafer (100) includes a plurality of integrated circuits (112-11N) arranged in a plurality of sets (110, 110', 101) that include at least one test set (110, 110'). For each test set the semiconductor wafer has one or more test contact areas (130a 130b); and at least one integrated circuit in the test set is coupled to the one or more test contact areas. Also presented are a testing device and a method of testing a plurality of ICs on a semiconductor wafer.

IPC Classes  ?

• G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
• H01L 21/66 - Testing or measuring during manufacture or treatment

Abstract

Methods and apparatus for supporting the assembly of electronic devices comprising integrated circuits (ICs), and in particular, but not exclusively to, the assembly of an IC formed on a flexible substrate (flexible ICs) together with corresponding electronic circuitry (e.g., forming an antenna) to form an electronic device, such as a radio-frequency identification (RFID) inlays or tags.

IPC Classes  ?

• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H01L 23/66 - High-frequency adaptations

Abstract

Apparatus for identifying a position of an object, each object having an associated tag. Signals are received from a tag associated with the object, as the object is conveyed through one or more coverage areas. The coverage areas in which signals have been received from the tag are identified and a position of the object is determined to be a position corresponding to a path through the localisation region that passes through the identified coverage areas.

IPC Classes  ?

• G01S 13/75 - Systems using reradiation of radio waves, e.g. secondary radar systemsAnalogous systems using transponders powered from received waves, e.g. using passive transponders
• B07C 5/34 - Sorting according to other particular properties
• B65G 43/00 - Control devices, e.g. for safety, warning or fault-correcting
• G06K 7/10 - Methods or arrangements for sensing record carriers by electromagnetic radiation, e.g. optical sensingMethods or arrangements for sensing record carriers by corpuscular radiation

Abstract

A flexible integrated circuit comprising a temperature sensor. The temperature sensor comprises: an array of thermistors coupled between a first voltage supply and an output node of the temperature sensor; and a further thermistor coupled between the output node and a second voltage supply.

IPC Classes  ?

• G01K 7/24 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a non-linear resistance, e.g. thermistor in a specially-adapted circuit, e.g. bridge circuit

Abstract

An electronic circuit comprising a latch comprising a first inverter and a second inverter, wherein an output of the first inverter is coupled to an input of the second inverter and an output of the second inverter is coupled to an input of the first inverter; and an output stage comprising a first transistor coupled between a first supply voltage and a first output node, a second transistor coupled between the first output node and ground, a third transistor coupled between a second supply voltage and a second output node, and a fourth transistor coupled between the second output node and ground. The output of the first inverter is coupled to the gate terminals of the first transistor and the fourth transistor. The output of the second inverter is coupled to the gate terminals of the second transistor and the third transistor.

IPC Classes  ?

• H03K 3/356 - Bistable circuits
• G06F 1/26 - Power supply means, e.g. regulation thereof
• H03K 3/012 - Modifications of generator to improve response time or to decrease power consumption
• H03K 19/003 - Modifications for increasing the reliability

Abstract

An integrated circuit comprising a temperature sensor, the temperature sensor comprising a negative temperature coefficient thermistor comprising doped metal oxide semiconductor material and coupled between a supply voltage and an output node of the temperature sensor, and a resistor coupled between the output node and ground.

IPC Classes  ?

• G01K 7/20 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer in a specially-adapted circuit, e.g. bridge circuit
• G01K 7/24 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a non-linear resistance, e.g. thermistor in a specially-adapted circuit, e.g. bridge circuit

Abstract

Apparatus comprising a level shifting circuit configured to: receive a control signal operable to control an electronic device, the control signal having either a first voltage for switching the electronic device from a deactivated state to an activated state or a second voltage for switching the electronic device from the activated state to the deactivated state, the first voltage and the second voltage defining respective endpoints of a voltage range of the control signal; shift each endpoint of the voltage range of the control signal by a voltage offset to generate a level shifted control signal; and output the level shifted control signal to control the electronic device.

IPC Classes  ?

• H03K 19/0175 - Coupling arrangementsInterface arrangements
• H05B 41/16 - Circuit arrangements in which the lamp is fed by DC or by low-frequency AC, e.g. by 50 cycles/sec AC
• H05B 41/36 - Controlling
• H03K 19/0185 - Coupling arrangementsInterface arrangements using field-effect transistors only

Abstract

A method for forming a stacked electronic structure, the method comprising: providing a first integrated circuit (IC) on a carrier, the first IC having a first surface and a second surface, wherein the first surface of the first IC is proximal to an upper surface of the carrier and the second surface of the first IC opposing the first surface of the first IC; and contacting a second IC with the first IC and mechanically coupling the second IC with the first IC to form a stacked electronic structure, wherein at least a portion of a first surface of the second IC is arranged to contact at least a portion of the second surface of the first IC, and wherein the second IC has a second surface opposing the first surface of the second IC; and separating the stacked electronic structure from the carrier; wherein the first IC is a flexible IC.

IPC Classes  ?

• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Abstract

A method for manufacturing a flexible integrated circuit (IC), the method comprising: depositing a first polymer layer on a first carrier; depositing a second polymer layer on the first polymer layer; forming a component layer on the second polymer layer; and detaching the second polymer layer from the first polymer layer to separate the flexible IC from the first carrier.

IPC Classes  ?

• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

An electronic circuit comprises a first resistor and a second resistor. The first resistor comprises: a first sheet (e.g. layer or film) of resistive (i.e. electrically resistive) material; and a first pair of conductive contacts, each arranged in electrical contact with the first sheet, and arranged such that a shortest resistive path in the first sheet between the first pair of contacts passes through the first sheet and has a length equal to a thickness of the first sheet. The second resistor comprises: a second sheet (e.g. layer or film) of resistive material; and a second pair of conductive contacts, each arranged in electrical contact with the second sheet, and arranged such that a shortest resistive path in the second sheet between the second pair of contacts passes along at least a portion of a length of the second sheet.

IPC Classes  ?

• H10D 86/85 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
• H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
• H10D 84/00 - Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
• H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
• H10D 86/80 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors

Goods & Services

Machines for use in industry for the manufacture of integrated circuits, semiconductors and electronics; semiconductor wafer processing machines; controlled atmosphere machines and installations for manufacturing integrated circuits, semiconductors and electronics; controlled atmosphere semiconductor wafer processing machines; machine systems for the automated production of integrated circuits, semiconductors and electronics; parts, fittings and accessories for all of the aforesaid goods. Semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, and apparatus and equipment incorporating such circuits and components; transparent electronics circuits, wearable electronics circuits, ultra-thin electronics circuits; integrated circuits, semiconductors and electronics for displays, electronic tags, smart labels, smart cards, smart packaging, intelligent everyday objects, toys, games, telecommunication devices, RFID devices, near field communication (NFC) devices, memory devices, sensing devices, intelligent appliance consumables, product authentication devices; computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable brochures and instruction manuals; parts, fittings, accessories, downloadable brochures, datasheets, instruction manuals and semiconductor component layouts for all of the aforesaid goods; semiconductors; semiconductor devices; semiconductor wafers for integrated circuits; flexible electronic circuits; downloadable data files, text files, image files, instruction manuals, documents, brochures and datasheets, all for use in the design of semiconductors, integrated circuits, electronics and flexible electronic circuits; biochips; encoded key cards; microprocessors; printed circuit board assemblies; resistors [electronic]; transistors [electronic]; receivers and transmitters for communicating with RFID devices and chips; apparatus, instruments and equipment for near field communications (NFC); computer software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; computer software for the virtual manufacture of integrated circuits, semiconductors and electronics. Semiconductor fabrication services; custom manufacture of semiconductors, semiconductor devices, semiconductor chips, semiconductor wafers, integrated circuits, electronics and flexible electronic circuits; custom manufacture, processing and assembly of semiconductors, integrated circuits and electronics for others; foundry services in relation to the custom manufacture, processing and assembly of integrated circuits, semiconductors and electronics for others; information, advisory and consultancy services relating to the aforesaid. Scientific and technological services in the fields of integrated circuits, semiconductors and electronics, and research and design relating thereto; custom design of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, of apparatus and equipment using such circuits and components, and of machines and systems for the manufacture of such circuits and components; design and development of hardware and software; software-as-a-service (SaaS) for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; SaaS for the virtual manufacture of integrated circuits, semiconductors and electronics; product research, custom design and testing for new product development in the fields of integrated circuits, semiconductors and electronics; technology consultation services regarding electrical and electronic products, semiconductors, semiconductor systems and integrated circuits; technical consultancy and support services relating to the design and/or use of machines and systems for the preparation of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components and electronic components; technology consultation services regarding the design, test and assembly of semiconductors, integrated circuits, electronics and flexible electronic circuits; custom testing of semiconductors, integrated circuits and electronics for others; information, advisory and consultancy services relating to the aforesaid.

Abstract

A method of processing an amplitude modulated, AM, signal, the method comprising: receiving an AM signal comprising an encoded sequence of symbols, each symbol in the encoded sequence being from a set of predefined symbols, wherein each predefined symbol in the set of predefined symbols, when encoded, comprises an AM signal portion comprising one or more high amplitude signal periods and a low amplitude signal period, wherein the low amplitude signal period is in a different position in the AM signal portion for different predefined symbols in the set of predefined symbols; processing the received AM signal to measure an interval between two successive low amplitude signal periods in the received AM signal; based at least in part on the measured interval, identifying a symbol of the sequence of symbols encoded in the received AM signal; and performing an action based on the identified symbol.

IPC Classes  ?

• H04B 14/02 - Transmission systems not characterised by the medium used for transmission characterised by the use of pulse modulation
• H04B 5/00 - Near-field transmission systems, e.g. inductive or capacitive transmission systems
• H04B 5/77 - Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes for interrogation
• H04L 7/00 - Arrangements for synchronising receiver with transmitter
• H04L 27/06 - Demodulator circuitsReceiver circuits
• H04L 25/49 - Transmitting circuitsReceiving circuits using code conversion at the transmitterTransmitting circuitsReceiving circuits using predistortionTransmitting circuitsReceiving circuits using insertion of idle bits for obtaining a desired frequency spectrumTransmitting circuitsReceiving circuits using three or more amplitude levels

Goods & Services

Semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, and apparatus and equipment incorporating such circuits and components; transparent electronics circuits, wearable electronics circuits, ultra-thin electronics circuits; integrated circuits, semiconductors and electronics for displays, electronic tags, smart labels, smart cards, smart packaging, intelligent everyday objects, toys, games, telecommunication devices, RFID devices, near field communication (NFC) devices, memory devices, sensing devices, intelligent appliance consumables, product authentication devices; computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable brochures and instruction manuals; parts, fittings, accessories, downloadable brochures, datasheets, instruction manuals and semiconductor component layouts for all of the aforesaid goods; semiconductors; semiconductor devices; semiconductor wafers for integrated circuits; flexible electronic circuits; downloadable data files, text files, image files, instruction manuals, documents, brochures and datasheets, all for use in the design of semiconductors, integrated circuits, electronics and flexible electronic circuits; biochips; encoded key cards; microprocessors; printed circuit board assemblies; resistors [electronic]; transistors [electronic]; receivers and transmitters for communicating with RFID devices and chips; apparatus, instruments and equipment for near field communications (NFC); computer software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; computer software for the virtual manufacture of integrated circuits, semiconductors and electronics.

Goods & Services

Machines for use in industry for the manufacture of integrated circuits, semiconductors and electronics; semiconductor wafer processing machines; controlled atmosphere machines and installations for manufacturing integrated circuits, semiconductors and electronics, namely filters and purifiers for removing contaminants from gases used in the semiconductor industry; controlled atmosphere semiconductor wafer processing machines; machine systems comprised of semiconductor and integrated circuit manufacturing machines for the automated production of integrated circuits, semiconductors and electronics; structural parts for all of the aforesaid goods Electronic components in the nature of semiconductors, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies being printed circuit boards, computer components being electronic components for computers, electronic components being semiconductor chip housings, micro-processors, computer memory devices and electrical connectors, and apparatus and equipment incorporating such circuits and components, namely, semiconductor devices; transparent electronic circuits, wearable electronic circuits, ultra-thin electronic circuits; integrated circuits, semiconductors and electronics circuits for displays, electronic tags, smart labels, smart cards, smart packaging, intelligent everyday objects, toys, games, telecommunication devices, RFID devices, near field communication (NFC) devices, memory devices, sensing devices, intelligent appliance consumables, and product authentication devices; downloadable computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; downloadable computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable electronic publications in the nature of brochures and instruction manuals in the fields of semiconductors, integrated circuits and electronics and their manufacture; structural and replacement parts and fittings for the aforesaid goods, downloadable brochures, datasheets, instruction manuals and semiconductor component layout images for use with, and in the field of, all of the aforesaid goods; semiconductors; semiconductor devices; semiconductor wafers for integrated circuits; flexible electronic circuits; downloadable electronic data files, text files, and image files in the field of designing semiconductors, integrated circuits, and electronics and flexible electronic circuits; downloadable electronic publications in the nature of instruction manuals, brochures and datasheets in the field of designing semiconductors, integrated circuits, electronics and flexible electronic circuits; biochips for research or scientific purposes; encoded key cards; microprocessors; printed circuit boards; electric resistors; transistors; electronic receivers and transmitters for communicating with RFID devices being readers and tags and computer chips; apparatus, instruments and equipment for near field communications (NFC), namely, near field communication (NFC) technology-enabled readers; downloadable computer software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; downloadable computer software for the virtual manufacture of integrated circuits, semiconductors and electronics Custom fabrication of semiconductors; custom manufacture of semiconductors, semiconductor devices, semiconductor chips, semiconductor wafers, integrated circuits, electronics and flexible electronic circuits; custom manufacture and assembly of semiconductors, integrated circuits and electronics for others; foundry services, namely, custom manufacture and assembly of integrated circuits, semiconductors and electronics for others; information, advisory and consultancy services relating to the aforesaid Scientific and technological services, namely scientific research and technological research in the fields of integrated circuits, semiconductors and electronics; design of integrated circuits, semiconductors and electronics; custom design of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, of apparatus and equipment using such circuits and components, and of machines and systems for the manufacture of such circuits and components; design and development of computer hardware and software; software-as-a-service (SaaS) services featuring software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; software as a service (SaaS) services featuring software for the virtual manufacture of integrated circuits, semiconductors and electronics; product research, custom design and testing for new product development in the fields of integrated circuits, semiconductors and electronics; technology consultation services regarding electrical and electronic products, semiconductors, semiconductor systems and integrated circuits; technical consultancy and support services being troubleshooting in the nature of diagnosing and resolving problems with manufacturing machine hardware and systems, all relating to the design and use of machines for the manufacture of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components and electronic components; technology consultation services regarding the design, test and assembly of semiconductors, integrated circuits, electronics and flexible electronic circuits; custom testing of new products, namely, semiconductors, integrated circuits and electronics for others; information, advisory and consultancy services relating to the aforesaid

Abstract

A sensor system configured to provide an indication of a sensed parameter, the sensor system comprising: a reader comprising a reader antenna configured to transmit a carrier signal; a tag comprising: a tag antenna configured to receive the carrier signal; power harvesting circuitry coupled to the tag antenna and configured to produce an operating voltage from the receiver carrier signal; the voltage-controlled oscillator, VCO, circuitry coupled to the power harvesting circuitry and configured to receive the operating voltage therefrom, wherein the VCO circuitry comprises a VCO configured to generate an output signal having a frequency which varies based on the sensed parameter, and wherein the VCO circuitry is configured to modulate an impedance of the tag antenna according to a timing parameter selected based on the frequency of the output signal from the VCO; a controller coupled to the reader antenna and configured to: (i) identify an indication of the timing parameter of the impedance modulation of the tag antenna based on detected changes in the reader antenna impedance, and (ii) determine an indication of the sensed parameter based on the identified indication of the timing parameter.

IPC Classes  ?

• G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
• G06K 7/10 - Methods or arrangements for sensing record carriers by electromagnetic radiation, e.g. optical sensingMethods or arrangements for sensing record carriers by corpuscular radiation

Goods & Services

Machines for use in industry for the manufacture of integrated circuits, semiconductors and electronics; semiconductor wafer processing machines; controlled atmosphere machines and installations for manufacturing integrated circuits, semiconductors and electronics; controlled atmosphere semiconductor wafer processing machines; machine systems for the automated production of integrated circuits, semiconductors and electronics; parts, fittings and accessories for all of the aforesaid goods. Semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, and apparatus and equipment incorporating such circuits and components; transparent electronics circuits, wearable electronics circuits, ultra-thin electronics circuits; integrated circuits, semiconductors and electronics for displays, electronic tags, smart labels, smart cards, smart packaging, intelligent everyday objects, toys, games, telecommunication devices, RFID devices, near field communication (NFC) devices, memory devices, sensing devices, intelligent appliance consumables, product authentication devices; computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable brochures and instruction manuals; parts, fittings, accessories, downloadable brochures, datasheets, instruction manuals and semiconductor component layouts for all of the aforesaid goods; semiconductors; semiconductor devices; semiconductor wafers for integrated circuits; flexible electronic circuits; downloadable data files, text files, image files, instruction manuals, documents, brochures and datasheets, all for use in the design of semiconductors, integrated circuits, electronics and flexible electronic circuits; biochips; encoded key cards; microprocessors; printed circuit board assemblies; resistors [electronic]; transistors [electronic]; receivers and transmitters for communicating with RFID devices and chips; apparatus, instruments and equipment for near field communications (NFC); computer software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; computer software for the virtual manufacture of integrated circuits, semiconductors and electronics. Semiconductor fabrication services; custom manufacture of semiconductors, semiconductor devices, semiconductor chips, semiconductor wafers, integrated circuits, electronics and flexible electronic circuits; custom manufacture, processing and assembly of semiconductors, integrated circuits and electronics for others; foundry services in relation to the custom manufacture, processing and assembly of integrated circuits, semiconductors and electronics for others; information, advisory and consultancy services relating to the aforesaid. Scientific and technological services in the fields of integrated circuits, semiconductors and electronics, and research and design relating thereto; custom design of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, of apparatus and equipment using such circuits and components, and of machines and systems for the manufacture of such circuits and components; design and development of hardware and software; software-as-a-service (SaaS) for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; software-as-a-service (SaaS) for the virtual manufacture of integrated circuits, semiconductors and electronics; product research, custom design and testing for new product development in the fields of integrated circuits, semiconductors and electronics; technology consultation services regarding electrical and electronic products, semiconductors, semiconductor systems and integrated circuits; technical consultancy and support services relating to the design and/or use of machines and systems for the preparation of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components and electronic components; technology consultation services regarding the design, test and assembly of semiconductors, integrated circuits, electronics and flexible electronic circuits; custom testing of semiconductors, integrated circuits and electronics for others; information, advisory and consultancy services relating to the aforesaid.

Goods & Services

Semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, and apparatus and equipment incorporating such circuits and components; transparent electronics circuits, wearable electronics circuits, ultra-thin electronics circuits; integrated circuits, semiconductors and electronics for displays, electronic tags, smart labels, smart cards, smart packaging, intelligent everyday objects, toys, games, telecommunication devices, RFID devices, near field communication (NFC) devices, memory devices, sensing devices, intelligent appliance consumables, product authentication devices; computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable brochures and instruction manuals; parts, fittings, accessories, downloadable brochures, datasheets, instruction manuals and semiconductor component layouts for all of the aforesaid goods; semiconductors; semiconductor devices; semiconductor wafers for integrated circuits; flexible electronic circuits; downloadable data files, text files, image files, instruction manuals, documents, brochures and datasheets, all for use in the design of semiconductors, integrated circuits, electronics and flexible electronic circuits; biochips; encoded key cards; microprocessors; printed circuit board assemblies; resistors [electronic]; transistors [electronic]; receivers and transmitters for communicating with RFID devices and chips; apparatus, instruments and equipment for near field communications (NFC); computer software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; computer software for the virtual manufacture of integrated circuits, semiconductors and electronics.

Goods & Services

Semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, and apparatus and equipment incorporating such circuits and components; transparent electronics circuits, wearable electronics circuits, ultra-thin electronics circuits; integrated circuits, semiconductors and electronics for displays, electronic tags, smart labels, smart cards, smart packaging, intelligent everyday objects, toys, games, telecommunication devices, RFID devices, near field communication (NFC) devices, memory devices, sensing devices, intelligent appliance consumables, product authentication devices; computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable brochures and instruction manuals; parts, fittings, accessories, downloadable brochures, datasheets, instruction manuals and semiconductor component layouts for all of the aforesaid goods; semiconductors; semiconductor devices; semiconductor wafers for integrated circuits; flexible electronic circuits; downloadable data files, text files, image files, instruction manuals, documents, brochures and datasheets, all for use in the design of semiconductors, integrated circuits, electronics and flexible electronic circuits; biochips; encoded key cards; microprocessors; printed circuit board assemblies; resistors [electronic]; transistors [electronic]; receivers and transmitters for communicating with RFID devices and chips; apparatus, instruments and equipment for near field communications (NFC); computer software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; computer software for the virtual manufacture of integrated circuits, semiconductors and electronics.

Goods & Services

Machines for use in industry for the manufacture of integrated circuits, semiconductors and electronics; semiconductor wafer processing machines; controlled atmosphere machines and installations for manufacturing integrated circuits, semiconductors and electronics; controlled atmosphere semiconductor wafer processing machines; machine systems for the automated production of integrated circuits, semiconductors and electronics; parts, fittings and accessories for all of the aforesaid goods. Semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, and apparatus and equipment incorporating such circuits and components; transparent electronics circuits, wearable electronics circuits, ultra-thin electronics circuits; integrated circuits, semiconductors and electronics for displays, electronic tags, smart labels, smart cards, smart packaging, intelligent everyday objects, toys, games, telecommunication devices, RFID devices, near field communication (NFC) devices, memory devices, sensing devices, intelligent appliance consumables, product authentication devices; computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable brochures and instruction manuals; parts, fittings, accessories, downloadable brochures, datasheets, instruction manuals and semiconductor component layouts for all of the aforesaid goods; semiconductors; semiconductor devices; semiconductor wafers for integrated circuits; flexible electronic circuits; downloadable data files, text files, image files, instruction manuals, documents, brochures and datasheets, all for use in the design of semiconductors, integrated circuits, electronics and flexible electronic circuits; biochips; encoded key cards; microprocessors; printed circuit board assemblies; resistors [electronic]; transistors [electronic]; receivers and transmitters for communicating with RFID devices and chips; apparatus, instruments and equipment for near field communications (NFC); computer software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; computer software for the virtual manufacture of integrated circuits, semiconductors and electronics. Semiconductor fabrication services; custom manufacture of semiconductors, semiconductor devices, semiconductor chips, semiconductor wafers, integrated circuits, electronics and flexible electronic circuits; custom manufacture, processing and assembly of semiconductors, integrated circuits and electronics for others; foundry services in relation to the custom manufacture, processing and assembly of integrated circuits, semiconductors and electronics for others; information, advisory and consultancy services relating to the aforesaid. Scientific and technological services in the fields of integrated circuits, semiconductors and electronics, and research and design relating thereto; custom design of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, of apparatus and equipment using such circuits and components, and of machines and systems for the manufacture of such circuits and components; design and development of hardware and software; software-as-a-service (SaaS) for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; software-as-a-service (SaaS) for the virtual manufacture of integrated circuits, semiconductors and electronics; product research, custom design and testing for new product development in the fields of integrated circuits, semiconductors and electronics; technology consultation services regarding electrical and electronic products, semiconductors, semiconductor systems and integrated circuits; technical consultancy and support services relating to the design and/or use of machines and systems for the preparation of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components and electronic components; technology consultation services regarding the design, test and assembly of semiconductors, integrated circuits, electronics and flexible electronic circuits; custom testing of semiconductors, integrated circuits and electronics for others; information, advisory and consultancy services relating to the aforesaid.

Goods & Services

Semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, and apparatus and equipment incorporating such circuits and components; transparent electronics circuits, wearable electronics circuits, ultra-thin electronics circuits; integrated circuits, semiconductors and electronics for displays, electronic tags, smart labels, smart cards, smart packaging, intelligent everyday objects, toys, games, telecommunication devices, RFID devices, near field communication (NFC) devices, memory devices, sensing devices, intelligent appliance consumables, product authentication devices; computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable brochures and instruction manuals; parts, fittings, accessories, downloadable brochures, datasheets, instruction manuals and semiconductor component layouts for all of the aforesaid goods; semiconductors; semiconductor devices; semiconductor wafers for integrated circuits; flexible electronic circuits; downloadable data files, text files, image files, instruction manuals, documents, brochures and datasheets, all for use in the design of semiconductors, integrated circuits, electronics and flexible electronic circuits; biochips; encoded key cards; microprocessors; printed circuit board assemblies; resistors [electronic]; transistors [electronic]; receivers and transmitters for communicating with RFID devices and chips; apparatus, instruments and equipment for near field communications (NFC); computer software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; computer software for the virtual manufacture of integrated circuits, semiconductors and electronics.

Goods & Services

Machines for use in industry for the manufacture of integrated circuits, semiconductors and electronics; semiconductor wafer processing machines; controlled atmosphere machines and installations for manufacturing integrated circuits, semiconductors and electronics; controlled atmosphere semiconductor wafer processing machines; machine systems for the automated production of integrated circuits, semiconductors and electronics; parts, fittings and accessories for all of the aforesaid goods. Semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, and apparatus and equipment incorporating such circuits and components; transparent electronics circuits, wearable electronics circuits, ultra-thin electronics circuits; integrated circuits, semiconductors and electronics for displays, electronic tags, smart labels, smart cards, smart packaging, intelligent everyday objects, toys, games, telecommunication devices, RFID devices, near field communication (NFC) devices, memory devices, sensing devices, intelligent appliance consumables, product authentication devices; computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable brochures and instruction manuals; parts, fittings, accessories, downloadable brochures, datasheets, instruction manuals and semiconductor component layouts for all of the aforesaid goods; semiconductors; semiconductor devices; semiconductor wafers for integrated circuits; flexible electronic circuits; downloadable data files, text files, image files, instruction manuals, documents, brochures and datasheets, all for use in the design of semiconductors, integrated circuits, electronics and flexible electronic circuits; biochips; encoded key cards; microprocessors; printed circuit board assemblies; resistors [electronic]; transistors [electronic]; receivers and transmitters for communicating with RFID devices and chips; apparatus, instruments and equipment for near field communications (NFC); computer software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; computer software for the virtual manufacture of integrated circuits, semiconductors and electronics. Semiconductor fabrication services; custom manufacture of semiconductors, semiconductor devices, semiconductor chips, semiconductor wafers, integrated circuits, electronics and flexible electronic circuits; custom manufacture, processing and assembly of semiconductors, integrated circuits and electronics for others; foundry services in relation to the custom manufacture, processing and assembly of integrated circuits, semiconductors and electronics for others; information, advisory and consultancy services relating to the aforesaid. Scientific and technological services in the fields of integrated circuits, semiconductors and electronics, and research and design relating thereto; custom design of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, of apparatus and equipment using such circuits and components, and of machines and systems for the manufacture of such circuits and components; design and development of hardware and software; software-as-a-service (SaaS) for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; software-as-a-service (SaaS) for the virtual manufacture of integrated circuits, semiconductors and electronics; product research, custom design and testing for new product development in the fields of integrated circuits, semiconductors and electronics; technology consultation services regarding electrical and electronic products, semiconductors, semiconductor systems and integrated circuits; technical consultancy and support services relating to the design and/or use of machines and systems for the preparation of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components and electronic components; technology consultation services regarding the design, test and assembly of semiconductors, integrated circuits, electronics and flexible electronic circuits; custom testing of semiconductors, integrated circuits and electronics for others; information, advisory and consultancy services relating to the aforesaid.

Goods & Services

Machines for use in industry for the manufacture of integrated circuits, semiconductors and electronics; semiconductor wafer processing machines; controlled atmosphere machines and installations for manufacturing integrated circuits, semiconductors and electronics; controlled atmosphere semiconductor wafer processing machines; machine systems for the automated production of integrated circuits, semiconductors and electronics; parts, fittings and accessories for all of the aforesaid goods. Semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, and apparatus and equipment incorporating such circuits and components; transparent electronics circuits, wearable electronics circuits, ultra-thin electronics circuits; integrated circuits, semiconductors and electronics for displays, electronic tags, smart labels, smart cards, smart packaging, intelligent everyday objects, toys, games, telecommunication devices, RFID devices, near field communication (NFC) devices, memory devices, sensing devices, intelligent appliance consumables, product authentication devices; computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable brochures and instruction manuals; parts, fittings, accessories, downloadable brochures, datasheets, instruction manuals and semiconductor component layouts for all of the aforesaid goods; semiconductors; semiconductor devices; semiconductor wafers for integrated circuits; flexible electronic circuits; downloadable data files, text files, image files, instruction manuals, documents, brochures and datasheets, all for use in the design of semiconductors, integrated circuits, electronics and flexible electronic circuits; biochips; encoded key cards; microprocessors; printed circuit board assemblies; resistors [electronic]; transistors [electronic]; receivers and transmitters for communicating with RFID devices and chips; apparatus, instruments and equipment for near field communications (NFC); computer software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; computer software for the virtual manufacture of integrated circuits, semiconductors and electronics. Semiconductor fabrication services; custom manufacture of semiconductors, semiconductor devices, semiconductor chips, semiconductor wafers, integrated circuits, electronics and flexible electronic circuits; custom manufacture, processing and assembly of semiconductors, integrated circuits and electronics for others; foundry services in relation to the custom manufacture, processing and assembly of integrated circuits, semiconductors and electronics for others; information, advisory and consultancy services relating to the aforesaid. Scientific and technological services in the fields of integrated circuits, semiconductors and electronics, and research and design relating thereto; custom design of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, of apparatus and equipment using such circuits and components, and of machines and systems for the manufacture of such circuits and components; design and development of hardware and software; software-as-a-service (SaaS) for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; software-as-a-service (SaaS) for the virtual manufacture of integrated circuits, semiconductors and electronics; product research, custom design and testing for new product development in the fields of integrated circuits, semiconductors and electronics; technology consultation services regarding electrical and electronic products, semiconductors, semiconductor systems and integrated circuits; technical consultancy and support services relating to the design and/or use of machines and systems for the preparation of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components and electronic components; technology consultation services regarding the design, test and assembly of semiconductors, integrated circuits, electronics and flexible electronic circuits; custom testing of semiconductors, integrated circuits and electronics for others; information, advisory and consultancy services relating to the aforesaid.

Goods & Services

Machines for use in industry for the manufacture of integrated circuits, semiconductors and electronics; semiconductor wafer processing machines; controlled atmosphere machines and installations for manufacturing integrated circuits, semiconductors and electronics; controlled atmosphere semiconductor wafer processing machines; machine systems for the automated production of integrated circuits, semiconductors and electronics; parts, fittings and accessories for all of the aforesaid goods. Semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, and apparatus and equipment incorporating such circuits and components; transparent electronics circuits, wearable electronics circuits, ultra-thin electronics circuits; integrated circuits, semiconductors and electronics for displays, electronic tags, smart labels, smart cards, smart packaging, intelligent everyday objects, toys, games, telecommunication devices, RFID devices, near field communication (NFC) devices, memory devices, sensing devices, intelligent appliance consumables, product authentication devices; computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable brochures and instruction manuals; parts, fittings, accessories, downloadable brochures, datasheets, instruction manuals and semiconductor component layouts for all of the aforesaid goods; semiconductors; semiconductor devices; semiconductor wafers for integrated circuits; flexible electronic circuits; downloadable data files, text files, image files, instruction manuals, documents, brochures and datasheets, all for use in the design of semiconductors, integrated circuits, electronics and flexible electronic circuits; biochips; encoded key cards; microprocessors; printed circuit board assemblies; resistors [electronic]; transistors [electronic]; receivers and transmitters for communicating with RFID devices and chips; apparatus, instruments and equipment for near field communications (NFC); computer software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; computer software for the virtual manufacture of integrated circuits, semiconductors and electronics. Semiconductor fabrication services; custom manufacture of semiconductors, semiconductor devices, semiconductor chips, semiconductor wafers, integrated circuits, electronics and flexible electronic circuits; custom manufacture, processing and assembly of semiconductors, integrated circuits and electronics for others; foundry services in relation to the custom manufacture, processing and assembly of integrated circuits, semiconductors and electronics for others; information, advisory and consultancy services relating to the aforesaid. Scientific and technological services in the fields of integrated circuits, semiconductors and electronics, and research and design relating thereto; custom design of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, of apparatus and equipment using such circuits and components, and of machines and systems for the manufacture of such circuits and components; design and development of hardware and software; software-as-a-service (SaaS) for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; software-as-a-service (SaaS) for the virtual manufacture of integrated circuits, semiconductors and electronics; product research, custom design and testing for new product development in the fields of integrated circuits, semiconductors and electronics; technology consultation services regarding electrical and electronic products, semiconductors, semiconductor systems and integrated circuits; technical consultancy and support services relating to the design and/or use of machines and systems for the preparation of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components and electronic components; technology consultation services regarding the design, test and assembly of semiconductors, integrated circuits, electronics and flexible electronic circuits; custom testing of semiconductors, integrated circuits and electronics for others; information, advisory and consultancy services relating to the aforesaid.

Goods & Services

Machines for use in industry for the manufacture of integrated circuits, semiconductors and electronics; semiconductor wafer processing machines; controlled atmosphere machines and installations for manufacturing integrated circuits, semiconductors and electronics; controlled atmosphere semiconductor wafer processing machines; machine systems for the automated production of integrated circuits, semiconductors and electronics; parts, fittings and accessories for all of the aforesaid goods. Semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, and apparatus and equipment incorporating such circuits and components; transparent electronics circuits, wearable electronics circuits, ultra-thin electronics circuits; integrated circuits, semiconductors and electronics for displays, electronic tags, smart labels, smart cards, smart packaging, intelligent everyday objects, toys, games, telecommunication devices, RFID devices, near field communication (NFC) devices, memory devices, sensing devices, intelligent appliance consumables, product authentication devices; computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable brochures and instruction manuals; parts, fittings, accessories, downloadable brochures, datasheets, instruction manuals and semiconductor component layouts for all of the aforesaid goods; semiconductors; semiconductor devices; semiconductor wafers for integrated circuits; flexible electronic circuits; downloadable data files, text files, image files, instruction manuals, documents, brochures and datasheets, all for use in the design of semiconductors, integrated circuits, electronics and flexible electronic circuits; biochips; encoded key cards; microprocessors; printed circuit board assemblies; resistors [electronic]; transistors [electronic]; receivers and transmitters for communicating with RFID devices and chips; apparatus, instruments and equipment for near field communications (NFC); computer software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; computer software for the virtual manufacture of integrated circuits, semiconductors and electronics. Semiconductor fabrication services; custom manufacture of semiconductors, semiconductor devices, semiconductor chips, semiconductor wafers, integrated circuits, electronics and flexible electronic circuits; custom manufacture, processing and assembly of semiconductors, integrated circuits and electronics for others; foundry services in relation to the custom manufacture, processing and assembly of integrated circuits, semiconductors and electronics for others; information, advisory and consultancy services relating to the aforesaid. Scientific and technological services in the fields of integrated circuits, semiconductors and electronics, and research and design relating thereto; custom design of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, of apparatus and equipment using such circuits and components, and of machines and systems for the manufacture of such circuits and components; design and development of hardware and software; software-as-a-service (SaaS) for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; software-as-a-service (SaaS) for the virtual manufacture of integrated circuits, semiconductors and electronics; product research, custom design and testing for new product development in the fields of integrated circuits, semiconductors and electronics; technology consultation services regarding electrical and electronic products, semiconductors, semiconductor systems and integrated circuits; technical consultancy and support services relating to the design and/or use of machines and systems for the preparation of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components and electronic components; technology consultation services regarding the design, test and assembly of semiconductors, integrated circuits, electronics and flexible electronic circuits; custom testing of semiconductors, integrated circuits and electronics for others; information, advisory and consultancy services relating to the aforesaid.

Goods & Services

Machines for use in industry for the manufacture of integrated circuits, semiconductors and electronics; semiconductor wafer processing machines; controlled atmosphere machines and installations for manufacturing integrated circuits, semiconductors and electronics; controlled atmosphere semiconductor wafer processing machines; machine systems for the automated production of integrated circuits, semiconductors and electronics; parts, fittings and accessories for all of the aforesaid goods. Semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, and apparatus and equipment incorporating such circuits and components; transparent electronics circuits, wearable electronics circuits, ultra-thin electronics circuits; integrated circuits, semiconductors and electronics for displays, electronic tags, smart labels, smart cards, smart packaging, intelligent everyday objects, toys, games, telecommunication devices, RFID devices, near field communication (NFC) devices, memory devices, sensing devices, intelligent appliance consumables, product authentication devices; computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable brochures and instruction manuals; parts, fittings, accessories, downloadable brochures, datasheets, instruction manuals and semiconductor component layouts for all of the aforesaid goods; semiconductors; semiconductor devices; semiconductor wafers for integrated circuits; flexible electronic circuits; downloadable data files, text files, image files, instruction manuals, documents, brochures and datasheets, all for use in the design of semiconductors, integrated circuits, electronics and flexible electronic circuits; biochips; encoded key cards; microprocessors; printed circuit board assemblies; resistors [electronic]; transistors [electronic]; receivers and transmitters for communicating with RFID devices and chips; apparatus, instruments and equipment for near field communications (NFC); computer software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; computer software for the virtual manufacture of integrated circuits, semiconductors and electronics. Semiconductor fabrication services; custom manufacture of semiconductors, semiconductor devices, semiconductor chips, semiconductor wafers, integrated circuits, electronics and flexible electronic circuits; custom manufacture, processing and assembly of semiconductors, integrated circuits and electronics for others; foundry services in relation to the custom manufacture, processing and assembly of integrated circuits, semiconductors and electronics for others; information, advisory and consultancy services relating to the aforesaid. Scientific and technological services in the fields of integrated circuits, semiconductors and electronics, and research and design relating thereto; custom design of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, of apparatus and equipment using such circuits and components, and of machines and systems for the manufacture of such circuits and components; design and development of hardware and software; software-as-a-service (SaaS) for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; software-as-a-service (SaaS) for the virtual manufacture of integrated circuits, semiconductors and electronics; product research, custom design and testing for new product development in the fields of integrated circuits, semiconductors and electronics; technology consultation services regarding electrical and electronic products, semiconductors, semiconductor systems and integrated circuits; technical consultancy and support services relating to the design and/or use of machines and systems for the preparation of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components and electronic components; technology consultation services regarding the design, test and assembly of semiconductors, integrated circuits, electronics and flexible electronic circuits; custom testing of semiconductors, integrated circuits and electronics for others; information, advisory and consultancy services relating to the aforesaid.

Goods & Services

Semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, and apparatus and equipment incorporating such circuits and components; transparent electronics circuits, wearable electronics circuits, ultra-thin electronics circuits; integrated circuits, semiconductors and electronics for displays, electronic tags, smart labels, smart cards, smart packaging, intelligent everyday objects, toys, games, telecommunication devices, RFID devices, near field communication (NFC) devices, memory devices, sensing devices, intelligent appliance consumables, product authentication devices; computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable brochures and instruction manuals; parts, fittings, accessories, downloadable brochures, datasheets, instruction manuals and semiconductor component layouts for all of the aforesaid goods; semiconductors; semiconductor devices; semiconductor wafers for integrated circuits; flexible electronic circuits; downloadable data files, text files, image files, instruction manuals, documents, brochures and datasheets, all for use in the design of semiconductors, integrated circuits, electronics and flexible electronic circuits; biochips; encoded key cards; microprocessors; printed circuit board assemblies; resistors [electronic]; transistors [electronic]; receivers and transmitters for communicating with RFID devices and chips; apparatus, instruments and equipment for near field communications (NFC); computer software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; computer software for the virtual manufacture of integrated circuits, semiconductors and electronics.

Goods & Services

Electronic components in the nature of semiconductors, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies being printed circuit boards, computer components being electronic components for computers, electronic components being semiconductor chip housings, micro-processors, computer memory devices and electrical connectors, and apparatus and equipment incorporating such circuits and components, namely, semiconductor devices; transparent electronic circuits, wearable electronic circuits, ultra-thin electronic circuits; integrated circuits, semiconductors and electronics circuits for displays, electronic tags, smart labels, smart cards, smart packaging, intelligent everyday objects, toys, games, telecommunication devices, RFID devices, near field communication (NFC) devices, memory devices, sensing devices, intelligent appliance consumables, and product authentication devices; downloadable computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; downloadable computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable electronic publications in the nature of brochures and instruction manuals in the fields of semiconductors, integrated circuits and electronics and their manufacture; structural and replacement parts and fittings for the aforesaid goods, downloadable brochures, datasheets, instruction manuals and semiconductor component layout images for use with, and in the field of, all of the aforesaid goods; semiconductors; semiconductor devices; semiconductor wafers for integrated circuits; flexible electronic circuits; downloadable electronic data files, text files, and image files in the field of designing semiconductors, integrated circuits, and electronics and flexible electronic circuits; downloadable electronic publications in the nature of instruction manuals, brochures and datasheets in the field of designing semiconductors, integrated circuits, electronics and flexible electronic circuits; biochips for research or scientific purposes; encoded key cards; microprocessors; printed circuit boards; electric resistors; transistors; electronic receivers and transmitters for communicating with RFID devices being readers and tags and computer chips; apparatus, instruments and equipment for near field communications (NFC), namely, near field communication (NFC) technology-enabled readers; downloadable computer software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; downloadable computer software for the virtual manufacture of integrated circuits, semiconductors and electronics

Abstract

The present invention provides for an interposer subassembly that is suitable for an electronic system having at least one integrated circuit (1C) component. The interposer subassembly comprises a flexible base layer, having a first surface and an opposing second surface, at least one active electronic circuit component, operatively integrated within said flexible base layer, and at least one first patterned contact layer, provided on any one of said first surface and said second surface of said flexible base layer and which is configured to operably interface with said at least one active electronic circuit component and the at least one 1C component.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/367 - Cooling facilitated by shape of device
• H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
• H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Abstract

An electronic circuit assembly comprising an application circuit comprising a plurality of application circuit electrical contact pads; and a flexible integrated circuit comprising a first surface, a second surface on an opposite face of the flexible integrated circuit to the first surface, and a plurality of integrated circuit electrical contact pads located on the second surface. The flexible integrated circuit is arranged such that the first surface faces the application circuit and each of the application circuit electrical contact pads is located at least partially outside of a footprint of the flexible integrated circuit. Each of the integrated circuit electrical contact pads is electrically connected to a respective one of the application circuit electrical contact pads by a respective one of a plurality of solidified fluid conductors.

IPC Classes  ?

• H01L 23/00 - Details of semiconductor or other solid state devices
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Goods & Services

Electronic components in the nature of semiconductors, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies being printed circuit boards, computer components being electronic components for computers, electronic components being semiconductor chip housings, micro-processors, computer memory devices and electrical connectors, and apparatus and equipment incorporating such circuits and components, namely, semiconductor devices; transparent electronics circuits, wearable electronics circuits, ultra-thin electronics circuits; integrated circuits, semiconductors and electronics circuits for use in the manufacture of electronic display interfaces, electronic tags, smart labels, smart cards, smart packaging comprised of coded electronic chips, intelligent everyday objects, toys, games, telecommunication devices, RFID devices, near field communication (NFC) devices, memory devices, sensing devices, intelligent appliance consumables, and electronic product authentication devices; recorded and downloadable computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; recorded and downloadable computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable electronic brochures and instruction manuals in the fields of semiconductors, integrated circuits, and electronics and their manufacture; structural and replacement parts and fittings for the aforesaid goods, downloadable brochures, datasheets, instruction manuals and semiconductor component layout images for use with, and in the field of, all of the aforesaid goods; semiconductors; semiconductor devices; semiconductor wafers for integrated circuits; flexible electronic circuits; downloadable data files, text files, image files, instruction manuals, documents, brochures and datasheets, all for use with, and in the field of, the design of semiconductors, integrated circuits, electronics and flexible electronic circuits; biochips for research or scientific purposes; encoded key cards; microprocessors; printed circuit boards, namely, printed circuit board assemblies; electric resistors; transistors; electronic receivers and transmitters for communicating with RFID devices being readers and tags and computer chips; apparatus, instruments and equipment for near field communications (NFC), namely, NFC technology-enabled readers; downloadable computer software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; downloadable computer software for the virtual manufacture of integrated circuits, semiconductors and electronics

Goods & Services

Electronic components in the nature of semiconductors, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies being printed circuit boards, computer components being electronic components for computers, electronic components being semiconductor chip housings, micro-processors, computer memory devices and electrical connectors, and apparatus and equipment incorporating such circuits and components, namely, semiconductor devices; transparent electronics circuits, wearable electronics circuits, ultra-thin electronics circuits; integrated circuits, semiconductors and electronics circuits for use in the manufacture of electronic display interfaces, electronic tags, smart labels, smart cards, smart packaging comprised of coded electronic chips, intelligent everyday objects, toys, games, telecommunication devices, RFID devices, near field communication (NFC) devices, memory devices, sensing devices, intelligent appliance consumables, and electronic product authentication devices; recorded and downloadable computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; recorded and downloadable computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable electronic brochures and instruction manuals in the fields of semiconductors, integrated circuits, and electronics and their manufacture; structural and replacement parts and fittings for the aforesaid goods, downloadable brochures, datasheets, instruction manuals and semiconductor component layout images for use with, and in the field of, all of the aforesaid goods; semiconductors; semiconductor devices; semiconductor wafers for integrated circuits; flexible electronic circuits; downloadable data files, text files, image files, instruction manuals, documents, brochures and datasheets, all for use with, and in the field of, the design of semiconductors, integrated circuits, electronics and flexible electronic circuits; biochips for research or scientific purposes; encoded key cards; microprocessors; printed circuit boards, namely, printed circuit board assemblies; electric resistors; transistors; electronic receivers and transmitters for communicating with RFID devices being readers and tags and computer chips; apparatus, instruments and equipment for near field communications (NFC), namely, NFC technology-enabled readers; downloadable computer software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; downloadable computer software for the virtual manufacture of integrated circuits, semiconductors and electronics

Goods & Services

Electronic components in the nature of semiconductors, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies being printed circuit boards, computer components being electronic components for computers, electronic components being semiconductor chip housings, micro-processors, computer memory devices and electrical connectors, and apparatus and equipment incorporating such circuits and components, namely, semiconductor devices; transparent electronics circuits, wearable electronics circuits, ultra-thin electronics circuits; integrated circuits, semiconductors and electronics circuits for use in the manufacture of electronic display interfaces, electronic tags, smart labels, smart cards, smart packaging comprised of coded electronic chips, intelligent everyday objects, toys, games, telecommunication devices, RFID devices, near field communication (NFC) devices, memory devices, sensing devices, intelligent appliance consumables, and electronic product authentication devices; recorded and downloadable computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; recorded and downloadable computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable electronic brochures and instruction manuals in the fields of semiconductors, integrated circuits, and electronics and their manufacture; structural and replacement parts and fittings for the aforesaid goods, downloadable brochures, datasheets, instruction manuals and semiconductor component layout images for use with, and in the field of, all of the aforesaid goods; semiconductors; semiconductor devices; semiconductor wafers for integrated circuits; flexible electronic circuits; downloadable data files, text files, image files, instruction manuals, documents, brochures and datasheets, all for use with, and in the field of, the design of semiconductors, integrated circuits, electronics and flexible electronic circuits; biochips for research or scientific purposes; encoded key cards; microprocessors; printed circuit boards, namely, printed circuit board assemblies; electric resistors; transistors; electronic receivers and transmitters for communicating with RFID devices being readers and tags and computer chips; apparatus, instruments and equipment for near field communications (NFC), namely, NFC technology-enabled readers; downloadable computer software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; downloadable computer software for the virtual manufacture of integrated circuits, semiconductors and electronics

Goods & Services

Machines for use in industry for the manufacture of integrated circuits, semiconductors and electronics; semiconductor wafer processing machines; controlled atmosphere machines and installations for manufacturing integrated circuits, semiconductors and electronics, namely, filters and purifiers for removing contaminants from gases used in the semiconductor industry; controlled atmosphere semiconductor wafer processing machines, namely, filters and purifiers for removing contaminants from gases used in the semiconductor industry; machine systems comprised of semiconductor and integrated circuit manufacturing machines for the automated production of integrated circuits, semiconductors and electronics; parts for all of the aforesaid goods Electronic components in the nature of semiconductors, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies being printed circuit boards, computer components being electronic components for computers, electronic components being semiconductor chip housings, micro-processors, computer memory devices and electrical connectors, and apparatus and equipment incorporating such circuits and components, namely, semiconductor devices; transparent electronics circuits, wearable electronics circuits, ultra-thin electronics circuits; integrated circuits, semiconductors and electronics circuits for use in the manufacture of electronic display interfaces, electronic tags, smart labels, smart cards, smart packaging comprised of coded electronic chips, intelligent everyday objects, toys, games, telecommunication devices, RFID devices, near field communication (NFC) devices, memory devices, sensing devices, intelligent appliance consumables, and electronic product authentication devices; recorded and downloadable computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; recorded and downloadable computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable electronic brochures and instruction manuals in the fields of semiconductors, integrated circuits, and electronics and their manufacture; structural and replacement parts and fittings for the aforesaid goods, downloadable brochures, datasheets, instruction manuals and semiconductor component layout images for use with, and in the field of, all of the aforesaid goods; semiconductors; semiconductor devices; semiconductor wafers for integrated circuits; flexible electronic circuits; downloadable data files, text files, image files, instruction manuals, documents, brochures and datasheets, all for use with, and in the field of, the design of semiconductors, integrated circuits, electronics and flexible electronic circuits; biochips for research or scientific purposes; encoded key cards; microprocessors; printed circuit boards, namely, printed circuit board assemblies; electric resistors; transistors; electronic receivers and transmitters for communicating with RFID devices being readers and tags and computer chips; apparatus, instruments and equipment for near field communications (NFC), namely, NFC technology-enabled readers; downloadable computer software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; downloadable computer software for the virtual manufacture of integrated circuits, semiconductors and electronics Semiconductor fabrication services for others; custom manufacture of semiconductors, semiconductor devices, semiconductor chips, semiconductor wafers, integrated circuits, electronics and flexible electronic circuits; custom manufacture, processing and assembly of semiconductors, integrated circuits and electronics for others; foundry services, in particular, the custom manufacture, processing and assembly of integrated circuits, semiconductors and electronics for others; information, advisory and consultancy services relating to the aforesaid Scientific and technological services, namely, scientific research and technological research, in the fields of integrated circuits, semiconductors and electronics; research and design services relating to integrated circuits, semiconductors and electronics; custom design of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, of apparatus and equipment using such circuits and components, and of machines and systems for the manufacture of such circuits and components; design and development of computer hardware and software; software-as-a-service (SaaS) services featuring software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; software as a service (SaaS) services featuring software for the virtual manufacture of integrated circuits, semiconductors and electronics; product research, custom design and testing for new product development in the fields of integrated circuits, semiconductors and electronics; technology consultation services regarding electrical and electronic products, semiconductors, semiconductor systems and integrated circuits; technical consultancy and support services being troubleshooting in the nature of diagnosing and resolving computer hardware and software problems, all relating to the design and use of machines for the manufacture of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components and electronic components; technical consultancy and support services being troubleshooting in the nature of diagnosing and resolving problems with manufacturing machine hardware and systems, all relating to the design and use of machines for the manufacture of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components and electronic components; technology consultation services regarding the design, test and assembly of semiconductors, integrated circuits, electronics and flexible electronic circuits; custom testing of semiconductors, integrated circuits and electronics for others; information, advisory and consultancy services relating to the aforesaid

Goods & Services

Machines for use in industry for the manufacture of integrated circuits, semiconductors and electronics; semiconductor wafer processing machines; controlled atmosphere machines and installations for manufacturing integrated circuits, semiconductors and electronics, namely, filters and purifiers for removing contaminants from gases used in the semiconductor industry; controlled atmosphere semiconductor wafer processing machines, namely, filters and purifiers for removing contaminants from gases used in the semiconductor industry; machine systems comprised of semiconductor and integrated circuit manufacturing machines for the automated production of integrated circuits, semiconductors and electronics; parts for all of the aforesaid goods Electronic components in the nature of semiconductors, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies being printed circuit boards, computer components being electronic components for computers, electronic components being semiconductor chip housings, micro-processors, computer memory devices and electrical connectors, and apparatus and equipment incorporating such circuits and components, namely, semiconductor devices; transparent electronics circuits, wearable electronics circuits, ultra-thin electronics circuits; integrated circuits, semiconductors and electronics circuits for use in the manufacture of electronic display interfaces, electronic tags, smart labels, smart cards, smart packaging comprised of coded electronic chips, intelligent everyday objects, toys, games, telecommunication devices, RFID devices, near field communication (NFC) devices, memory devices, sensing devices, intelligent appliance consumables, and electronic product authentication devices; recorded and downloadable computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; recorded and downloadable computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable electronic brochures and instruction manuals in the fields of semiconductors, integrated circuits, and electronics and their manufacture; structural and replacement parts and fittings for the aforesaid goods, downloadable brochures, datasheets, instruction manuals and semiconductor component layout images for use with, and in the field of, all of the aforesaid goods; semiconductors; semiconductor devices; semiconductor wafers for integrated circuits; flexible electronic circuits; downloadable data files, text files, image files, instruction manuals, documents, brochures and datasheets, all for use with, and in the field of, the design of semiconductors, integrated circuits, electronics and flexible electronic circuits; biochips for research or scientific purposes; encoded key cards; microprocessors; printed circuit boards, namely, printed circuit board assemblies; electric resistors; transistors; electronic receivers and transmitters for communicating with RFID devices being readers and tags and computer chips; apparatus, instruments and equipment for near field communications (NFC), namely, NFC technology-enabled readers; downloadable computer software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; downloadable computer software for the virtual manufacture of integrated circuits, semiconductors and electronics Semiconductor fabrication services for others; custom manufacture of semiconductors, semiconductor devices, semiconductor chips, semiconductor wafers, integrated circuits, electronics and flexible electronic circuits; custom manufacture, processing and assembly of semiconductors, integrated circuits and electronics for others; foundry services, in particular, the custom manufacture, processing and assembly of integrated circuits, semiconductors and electronics for others; information, advisory and consultancy services relating to the aforesaid Scientific and technological services, namely, scientific research and technological research, in the fields of integrated circuits, semiconductors and electronics; research and design services relating to integrated circuits, semiconductors and electronics; custom design of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, of apparatus and equipment using such circuits and components, and of machines and systems for the manufacture of such circuits and components; design and development of computer hardware and software; software-as-a-service (SaaS) services featuring software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; software as a service (SaaS) services featuring software for the virtual manufacture of integrated circuits, semiconductors and electronics; product research, custom design and testing for new product development in the fields of integrated circuits, semiconductors and electronics; technology consultation services regarding electrical and electronic products, semiconductors, semiconductor systems and integrated circuits; technical consultancy and support services being troubleshooting in the nature of diagnosing and resolving computer hardware and software problems, all relating to the design and use of machines for the manufacture of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components and electronic components; technical consultancy and support services being troubleshooting in the nature of diagnosing and resolving problems with manufacturing machine hardware and systems, all relating to the design and use of machines for the manufacture of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components and electronic components; technology consultation services regarding the design, test and assembly of semiconductors, integrated circuits, electronics and flexible electronic circuits; custom testing of semiconductors, integrated circuits and electronics for others; information, advisory and consultancy services relating to the aforesaid

Goods & Services

Machines for use in industry for the manufacture of integrated circuits, semiconductors and electronics; semiconductor wafer processing machines; controlled atmosphere machines and installations for manufacturing integrated circuits, semiconductors and electronics, namely, filters and purifiers for removing contaminants from gases used in the semiconductor industry; controlled atmosphere semiconductor wafer processing machines, namely, filters and purifiers for removing contaminants from gases used in the semiconductor industry; machine systems comprised of semiconductor and integrated circuit manufacturing machines for the automated production of integrated circuits, semiconductors and electronics; parts for all of the aforesaid goods Electronic components in the nature of semiconductors, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies being printed circuit boards, computer components being electronic components for computers, electronic components being semiconductor chip housings, micro-processors, computer memory devices and electrical connectors, and apparatus and equipment incorporating such circuits and components, namely, semiconductor devices; transparent electronics circuits, wearable electronics circuits, ultra-thin electronics circuits; integrated circuits, semiconductors and electronics circuits for use in the manufacture of electronic display interfaces, electronic tags, smart labels, smart cards, smart packaging comprised of coded electronic chips, intelligent everyday objects, toys, games, telecommunication devices, RFID devices, near field communication (NFC) devices, memory devices, sensing devices, intelligent appliance consumables, and electronic product authentication devices; recorded and downloadable computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; recorded and downloadable computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable electronic brochures and instruction manuals in the fields of semiconductors, integrated circuits, and electronics and their manufacture; structural and replacement parts and fittings for the aforesaid goods, downloadable brochures, datasheets, instruction manuals and semiconductor component layout images for use with, and in the field of, all of the aforesaid goods; semiconductors; semiconductor devices; semiconductor wafers for integrated circuits; flexible electronic circuits; downloadable data files, text files, image files, instruction manuals, documents, brochures and datasheets, all for use with, and in the field of, the design of semiconductors, integrated circuits, electronics and flexible electronic circuits; biochips for research or scientific purposes; encoded key cards; microprocessors; printed circuit boards, namely, printed circuit board assemblies; electric resistors; transistors; electronic receivers and transmitters for communicating with RFID devices being readers and tags and computer chips; apparatus, instruments and equipment for near field communications (NFC), namely, NFC technology-enabled readers; downloadable computer software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; downloadable computer software for the virtual manufacture of integrated circuits, semiconductors and electronics. Semiconductor fabrication services for others; custom manufacture of semiconductors, semiconductor devices, semiconductor chips, semiconductor wafers, integrated circuits, electronics and flexible electronic circuits; custom manufacture, processing and assembly of semiconductors, integrated circuits and electronics for others; foundry services, in particular, the custom manufacture, processing and assembly of integrated circuits, semiconductors and electronics for others; information, advisory and consultancy services relating to the aforesaid Scientific and technological services, namely, scientific research and technological research, in the fields of integrated circuits, semiconductors and electronics; research and design services relating to integrated circuits, semiconductors and electronics; custom design of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, of apparatus and equipment using such circuits and components, and of machines and systems for the manufacture of such circuits and components; design and development of computer hardware and software; software-as-a-service (SaaS) services featuring software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; software as a service (SaaS) services featuring software for the virtual manufacture of integrated circuits, semiconductors and electronics; product research, custom design and testing for new product development in the fields of integrated circuits, semiconductors and electronics; technology consultation services regarding electrical and electronic products, semiconductors, semiconductor systems and integrated circuits; technical consultancy and support services being troubleshooting in the nature of diagnosing and resolving computer hardware and software problems, all relating to the design and use of machines for the manufacture of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components and electronic components; technical consultancy and support services being troubleshooting in the nature of diagnosing and resolving problems with manufacturing machine hardware and systems, all relating to the design and use of machines for the manufacture of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components and electronic components; technology consultation services regarding the design, test and assembly of semiconductors, integrated circuits, electronics and flexible electronic circuits; custom testing of semiconductors, integrated circuits and electronics for others; information, advisory and consultancy services relating to the aforesaid

Goods & Services

Machines for use in industry for the manufacture of integrated circuits, semiconductors and electronics; semiconductor wafer processing machines; controlled atmosphere machines and installations for manufacturing integrated circuits, semiconductors and electronics, namely, filters and purifiers for removing contaminants from gases used in the semiconductor industry; controlled atmosphere semiconductor wafer processing machines, namely, filters and purifiers for removing contaminants from gases used in the semiconductor industry; machine systems comprised of semiconductor and integrated circuit manufacturing machines for the automated production of integrated circuits, semiconductors and electronics; parts for all of the aforesaid goods Electronic components in the nature of semiconductors, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies being printed circuit boards, computer components being electronic components for computers, electronic components being semiconductor chip housings, micro-processors, computer memory devices and electrical connectors, and apparatus and equipment incorporating such circuits and components, namely, semiconductor devices; transparent electronics circuits, wearable electronics circuits, ultra-thin electronics circuits; integrated circuits, semiconductors and electronics circuits for use in the manufacture of electronic display interfaces, electronic tags, smart labels, smart cards, smart packaging comprised of coded electronic chips, intelligent everyday objects, toys, games, telecommunication devices, RFID devices, near field communication (NFC) devices, memory devices, sensing devices, intelligent appliance consumables, and electronic product authentication devices; recorded and downloadable computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; recorded and downloadable computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable electronic brochures and instruction manuals in the fields of semiconductors, integrated circuits, and electronics and their manufacture; structural and replacement parts and fittings for the aforesaid goods, downloadable brochures, datasheets, instruction manuals and semiconductor component layout images for use with, and in the field of, all of the aforesaid goods; semiconductors; semiconductor devices; semiconductor wafers for integrated circuits; flexible electronic circuits; downloadable data files, text files, image files, instruction manuals, documents, brochures and datasheets, all for use with, and in the field of, the design of semiconductors, integrated circuits, electronics and flexible electronic circuits; biochips for research or scientific purposes; encoded key cards; microprocessors; printed circuit boards, namely, printed circuit board assemblies; electric resistors; transistors; electronic receivers and transmitters for communicating with RFID devices being readers and tags and computer chips; apparatus, instruments and equipment for near field communications (NFC), namely, NFC technology-enabled readers; downloadable computer software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; downloadable computer software for the virtual manufacture of integrated circuits, semiconductors and electronics Semiconductor fabrication services for others; custom manufacture of semiconductors, semiconductor devices, semiconductor chips, semiconductor wafers, integrated circuits, electronics and flexible electronic circuits; custom manufacture, processing and assembly of semiconductors, integrated circuits and electronics for others; foundry services, in particular, the custom manufacture, processing and assembly of integrated circuits, semiconductors and electronics for others; information, advisory and consultancy services relating to the aforesaid Scientific and technological services, namely, scientific research and technological research, in the fields of integrated circuits, semiconductors and electronics; research and design services relating to integrated circuits, semiconductors and electronics; custom design of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, of apparatus and equipment using such circuits and components, and of machines and systems for the manufacture of such circuits and components; design and development of computer hardware and software; software-as-a-service (SaaS) services featuring software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; software as a service (SaaS) services featuring software for the virtual manufacture of integrated circuits, semiconductors and electronics; product research, custom design and testing for new product development in the fields of integrated circuits, semiconductors and electronics; technology consultation services regarding electrical and electronic products, semiconductors, semiconductor systems and integrated circuits; technical consultancy and support services being troubleshooting in the nature of diagnosing and resolving computer hardware and software problems, all relating to the design and use of machines for the manufacture of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components and electronic components; technical consultancy and support services being troubleshooting in the nature of diagnosing and resolving problems with manufacturing machine hardware and systems, all relating to the design and use of machines for the manufacture of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components and electronic components; technology consultation services regarding the design, test and assembly of semiconductors, integrated circuits, electronics and flexible electronic circuits; custom testing of semiconductors, integrated circuits and electronics for others; information, advisory and consultancy services relating to the aforesaid

Goods & Services

Electronic components in the nature of semiconductors, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies being printed circuit boards, computer components being electronic components for computers, electronic components being semiconductor chip housings, micro-processors, computer memory devices and electrical connectors, and apparatus and equipment incorporating such circuits and components, namely, semiconductor devices; transparent electronic circuits, wearable electronic circuits, ultra-thin electronic circuits; integrated circuits, semiconductors and electronics circuits for displays, electronic tags, smart labels, smart cards, smart packaging, intelligent everyday objects, toys, games, telecommunication devices, RFID devices, near field communication (NFC) devices, memory devices, sensing devices, intelligent appliance consumables, and product authentication devices; downloadable computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; downloadable computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable electronic publications in the nature of brochures and instruction manuals in the fields of semiconductors, integrated circuits and electronics and their manufacture; structural and replacement parts and fittings for the aforesaid goods, downloadable brochures, datasheets, instruction manuals and semiconductor component layout images for use with, and in the field of, all of the aforesaid goods; semiconductors; semiconductor devices; semiconductor wafers for integrated circuits; flexible electronic circuits; downloadable electronic data files, text files, and image files in the field of designing semiconductors, integrated circuits, and electronics and flexible electronic circuits; downloadable electronic publications in the nature of instruction manuals, brochures and datasheets in the field of designing semiconductors, integrated circuits, electronics and flexible electronic circuits; biochips for research or scientific purposes; encoded key cards; microprocessors; printed circuit boards; electric resistors; transistors; electronic receivers and transmitters for communicating with RFID devices being readers and tags and computer chips; apparatus, instruments and equipment for near field communications (NFC), namely, near field communication (NFC) technology-enabled readers; downloadable computer software for the custom design and testing of new products in the field of integrated circuits, semiconductors and electronics; downloadable computer software for the virtual manufacture of integrated circuits, semiconductors and electronics

Abstract

Methods of, and apparatus for, manufacturing integrated circuits (ICs) are disclosed. The method includes processing a carrier for supporting a plurality ICs during fabrication and for aiding release of the ICs following fabrication. Processing the carrier includes providing a layer of a release material thereon, which is subsequently patterned prior to the deposition of substrate materials upon which ICs are formed.

IPC Classes  ?

• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping

Abstract

Heater apparatus is disclosed. The heater apparatus includes a heating surface and heater devices arranged to provide heat for heating the heating surface. The heater devices include one or more heater field effect transistors (FETs), each having a gate, a source, and a drain. Each heater FET is arranged to generate heat for heating the heating surface when a control signal is applied to the gate of that heater FET, and a corresponding current flows between the drain and the source of that heater FET.

IPC Classes  ?

• H05B 3/26 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
• H05B 3/34 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
• H05B 3/00 - Ohmic-resistance heating
• H01L 29/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor bodies or of electrodes thereof
• H10N 97/00 - Electric solid-state thin-film or thick-film devices, not otherwise provided for

Abstract

A thin-film resistor and a method for fabricating a thin-film resistor are provided. The thin-film resistor comprises a first terminal, a second terminal, and a resistor body providing a resistive current path between the first terminal and the second terminal, and the method comprises depositing a first layer of conductive material onto at least one of the supporting structure and the resistor body, applying a first lithographic mask to the first layer, and etching the first layer to form the first terminal; and depositing a second layer of conductive material onto at least one of the supporting structure and the resistor body, applying a second lithographic mask to the second layer, and etching the second layer to form the second terminal, wherein the first lithographic mask is different to the second lithographic mask, and a lateral separation of the first terminal and the second terminal is less than an in-plane minimum feature size of the first and second lithographic masks

IPC Classes  ?

• H01C 1/01 - MountingSupporting
• H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
• H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
• H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors
• H01C 17/075 - Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin-film techniques
• H01C 17/28 - Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
• H01L 21/8256 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using technologies not covered by one of groups , or
• H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
• H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
• H01L 27/13 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body combined with thin-film or thick-film passive components
• H01L 29/24 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only inorganic semiconductor materials not provided for in groups , ,  or
• H01L 29/66 - Types of semiconductor device
• H01L 29/786 - Thin-film transistors
• H01L 29/872 - Schottky diodes

Abstract

A method is disclosed for configuring each item, of a batch of items, with a respective unique identifier. A key set is obtained in which each key of the key set is a random, or pseudo-random, number having a key width that is equal to a predefined code width. For each seed of a set of locally unique seeds, a uniquely invertible function is applied to generate a corresponding code. The uniquely invertible function is configured to convert a seed into a corresponding code using the key set. Every code generated for a given seed of the set of seeds is therefore unique for that set of seeds. The unique identifier is formed from the corresponding code and assigned to an electronic device.

IPC Classes  ?

• G06F 7/58 - Random or pseudo-random number generators

Abstract

A method of generating a design for a processor in accordance with a subset instruction set architecture is disclosed in which a subset of one or more instructions, from a set of instructions for an instruction set architecture is obtained. A representation of hardware for implementing each instruction of the subset is retrieved from a library that includes a representation of hardware for implementing each instruction of the set of instructions. A further representation of hardware for implementing the processor in accordance with the subset instruction set architecture is generated using the retrieved representations of hardware for implementing the instructions of the subset.

IPC Classes  ?

• G06F 30/327 - Logic synthesisBehaviour synthesis, e.g. mapping logic, HDL to netlist, high-level language to RTL or netlist
• G06F 9/30 - Arrangements for executing machine instructions, e.g. instruction decode
• G06F 8/41 - Compilation
• G06F 115/10 - Processors

Abstract

A method of manufacturing at least a first electronic device (1, 1a) comprising a first plurality of components (11, 12, 13, 131, 132, 14, 15, 16) is disclosed. The method comprises: providing a substrate (2) to support the first electronic device, at least during its manufacture; and selectively depositing over a first limited (bounded) portion (LP1, 201) of the substrate, by atomic layer deposition (ALD), a first thin film (T1) of conductive, semiconductive, resistive, or dielectric material, the first thin film providing at least one of the first plurality of components.

IPC Classes  ?

• C23C 16/04 - Coating on selected surface areas, e.g. using masks
• C23C 16/455 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into the reaction chamber or for modifying gas flows in the reaction chamber
• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
• H01L 21/285 - Deposition of conductive or insulating materials for electrodes from a gas or vapour, e.g. condensation

Abstract

Circuitry for providing output from a memory is disclosed. The circuitry includes array circuitry forming a memory array and reader circuitry for reading data stored in the memory array. The reader circuitry comprises a first reader portion and a second reader portion. The second reader portion is configured for reading one data bit of at least one group of bits, and for providing the corresponding output, at the same time the first reader portion reads a different data bit of the that group of data bits and provides another corresponding output.

IPC Classes  ?

• G06F 11/10 - Adding special bits or symbols to the coded information, e.g. parity check, casting out nines or elevens

Abstract

The invention relates to a system for manufacturing a plurality of integrated circuits, IC, mounted on a common support, the system comprising: an input station configured (adapted, arranged) to receive at least one common support; an output station configured (adapted, arranged) to receive at least one common support having a plurality of integrated circuits formed thereon; a plurality of processing modules each module being operable (configured, arranged, adapted) to perform at least one of the processing steps (e.g. deposition, patterning, etching) for forming an integrated circuit on the common support; a transfer means operable (configured, arranged, adapted) to transfer the at least one common support from the input station to the output station and to one or more of the processing modules therebetween; control means (e.g. a control system, or at least one controller, control unit, or control module) operable to direct the at least one common support from the input station to the output station through one or more of the plurality of processing modules according to at least one processing protocol comprising a selected one of a plurality of changeable pre-programmed protocols; the control means being operable to direct the movement of a common support from the input station to the output station and through one or more of the processing modules independently of any other common support. The invention also relates to a method for manufacturing a plurality of integrated circuits, IC, mounted on a common support.

IPC Classes  ?

• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
• C23C 14/56 - Apparatus specially adapted for continuous coatingArrangements for maintaining the vacuum, e.g. vacuum locks
• C23C 16/54 - Apparatus specially adapted for continuous coating
• H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
• H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Abstract

An integrated circuit (IC) is disclosed that comprises at least one p-type thin film transistor, 'TFT', and at least one further electronic device, formed from a plurality of layers fabricated on a substrate. The at least one p-type TFT comprises a channel region formed from at least partially crystalline silicon. The partially crystalline silicon may comprise low temperature polycrystalline silicon (LTPS). The channel region of the at least one p-type TFT may be formed of at least partially crystalline silicon that has a charge carrier mobility within the range of 1 to 40 cm2/V.s inclusive. The at least one further electronic device may comprise at least one n-type TFT having a channel region formed from semiconducting oxide.

IPC Classes  ?

• H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body

Abstract

A transistor is disclosed, comprising: a layer of semiconductor material comprising a first portion, a second portion, and a third portion connecting the first portion to the second portion and providing a semiconductive channel between the first portion and the second portion; a conductive first terminal covering and in electrical contact with said first portion of the layer of semiconductor material; a conductive second terminal covering and in electrical contact with said second portion of the layer of semiconductor material; a conductive gate terminal comprising a first overlapping portion covering at least part of the first terminal, and a channel portion covering the third portion of the layer of semiconductor material; and a layer of a first dielectric material, having a first dielectric constant, arranged between the first overlapping portion and the first terminal, and between the channel portion of the gate terminal and the third portion of the layer of semiconductor material. The transistor further comprises a layer of a second dielectric material having a second dielectric constant, the second dielectric constant being lower than the first dielectric constant, the layer of second dielectric material being arranged between at least part of the first overlapping portion and the first terminal, whereby at least part of the first overlapping portion of the gate terminal is separated from the first terminal by the layer of first dielectric material and the layer of second dielectric material.

IPC Classes  ?

• H10D 30/67 - Thin-film transistors [TFT]

Abstract

A flexible electronic structure for bonding with an external circuit. The flexible electronic structure comprising a flexible body having a first surface, the flexible body comprising at least one electronic component, at least one contact element configured to bond with the external circuit, the at least one contact element operatively coupled with the at least one electronic component and provided at the first surface of the flexible body, and arranged to operably interface with the external circuit after bonding, and at least one support element provided at the first surface of the flexible body, each support element including a contact area arranged to contact a first surface of an external structure comprising the external circuit or a corresponding surface element disposed on the first surface of the external structure, wherein the contact area of each of the at least one support element does not overlie one or more predetermined types of electronic component among the at least one electronic component or one or more predetermined types of element of the at least one electronic component.

IPC Classes  ?

• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
• H01Q 1/22 - SupportsMounting means by structural association with other equipment or articles

Abstract

An electronic circuit assembly comprises: a first electronic circuit module; a second electronic circuit module; and a quantity of anisotropic conductive adhesive, ACA, comprising a plurality of electrically conductive particles and an electrically non-conductive adhesive, arranged to bond the first electronic circuit module to the second electronic circuit module. The first electronic circuit module comprises a first surface and a first pair of electrical contacts each provided on said first surface, the second electronic circuit module comprises a second surface and a second pair of electrical contacts each provided on said second surface, said first surface is arranged to face said second surface, said first pair of electrical contacts is aligned with said second pair of electrical contacts such that a first electrical contact of the first pair opposes a first electrical contact of the second pair and a second electrical contact of the first pair opposes a second electrical contact of the second pair, said quantity of ACA occupies a volume between the first and second surfaces, and conductive particles of the ACA provide a first electrical connection between the first electrical contacts of the first and second pairs, and a second electrical connection between the second electrical contacts of the first and second pairs. The first electronic circuit module further comprises at least one member provided on and protruding from said first surface and arranged between the first pair of electrical contacts, and at least one channel provided through a said member or defined between a plurality of said members, each said channel providing a flow channel, in a direction parallel to the first surface, for at least said non-conductive adhesive during manufacture of the assembly.

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/14 - Structural association of two or more printed circuits
• H05K 1/189 -
• H05K 3/321 -

Abstract

Apparatus for identifying a position of an object, each object having an associated tag. Signals are received from a tag associated with the object, as the object is conveyed through one or more coverage areas. The coverage areas in which signals have been received from the tag are identified and a position of the object is determined to be a position corresponding to a path through the localisation region that passes through the identified coverage areas.

IPC Classes  ?

• G01S 13/46 - Indirect determination of position data
• G01S 13/48 - Indirect determination of position data using multiple beams at emission or reception
• G01S 7/42 - Diversity systems specially adapted for radar
• H04B 5/00 - Near-field transmission systems, e.g. inductive or capacitive transmission systems
• G01S 7/40 - Means for monitoring or calibrating

Abstract

A structure is disclosed, comprising: a first field effect transistor, FET, comprising a first source terminal, a first drain terminal, a first layer or body of semiconductive material arranged to provide a first semiconductive channel connecting the first source terminal to the first drain terminal, and a gate terminal arranged with respect to the first semiconductive channel such that a conductivity of the first semiconductive channel may be controlled by application of a voltage to the gate terminal; and a second FET comprising a second source terminal, a second drain terminal, a second layer or body of semiconductive material arranged to provide a second semiconductive channel connecting the second source terminal to the second drain terminal, and the gate terminal, the second conductive channel being arranged with respect to the gate terminal such that a conductivity of the second channel may be controlled by application of a voltage to the gate terminal. Methods of manufacturing such structures are also disclosed.

IPC Classes  ?

• H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
• H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
• H01L 21/285 - Deposition of conductive or insulating materials for electrodes from a gas or vapour, e.g. condensation
• H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
• H01L 21/3213 - Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
• H01L 29/40 - Electrodes
• H01L 29/417 - Electrodes characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched

Abstract

A signal measuring apparatus comprising: signal circuitry configured to receive an input signal to be measured; and memory circuitry coupled to the signal circuitry and configured to store information representing a magnitude of a voltage or a current of the input signal; wherein the memory circuitry comprises a first memory cell having a material which is arranged to switch from a first material state to a second material state in response to a first switching signal being applied thereto, wherein the first memory cell is tuned to a first value for the first switching signal so that a current or voltage with a magnitude at or above the first value will cause the material of the first memory cell to switch from the first material state to second material state; wherein the apparatus is configured to apply a measurement signal indicative of the input signal to the first memory cell for switching the material of the first memory cell from the first material state to the second material state in dependence on a magnitude of the voltage or current of the measurement signal.

IPC Classes  ?

• G01R 19/165 - Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values
• G01D 9/00 - Recording measured values
• G01D 21/00 - Measuring or testing not otherwise provided for
• G01R 19/00 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof
• H10B 63/10 - Phase change RAM [PCRAM, PRAM] devices

Abstract

A sensor system configured to provide an indication of a sensed parameter, the sensor system comprising: a reader comprising a reader antenna configured to transmit a carrier signal; a tag comprising: a tag antenna configured to receive the carrier signal; power harvesting circuitry coupled to the tag antenna and configured to produce an operating voltage from the received carrier signal; and voltage-controlled oscillator, VCO, circuitry coupled to the power harvesting circuitry and configured to receive the operating voltage therefrom, wherein the VCO circuitry comprises a VCO configured to generate an output signal having a frequency which varies based on the sensed parameter, and wherein the VCO circuitry is configured to modulate an impedance of the tag antenna according to a timing parameter selected based on the frequency of the output signal from the VCO; a controller coupled to the reader antenna and configured to: (i) identify an indication of the timing parameter of the impedance modulation of the tag antenna based on detected changes in the reader antenna impedance, and (ii) determine an indication of the sensed parameter based on the identif ied indication of the timing parameter.

IPC Classes  ?

• G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
• G06K 7/10 - Methods or arrangements for sensing record carriers by electromagnetic radiation, e.g. optical sensingMethods or arrangements for sensing record carriers by corpuscular radiation

Abstract

A Schottky diode comprises: a first electrode; a second electrode; and a body of semiconductive material connected to the first electrode at a first interface and connected to the second electrode at a second interface, wherein the first interface comprises a first planar region lying in a first plane and the first electrode has a first projection onto the first plane in a first direction normal to the first plane, the second interface comprises a second planar region lying in a second plane and the second electrode has a second projection onto the first plane in said first direction, at least a portion of the second projection lies outside the first projection, said second planar region is offset from the first planar region in said first direction, and one of the first interface and the second interface provides a Schottky contact.

IPC Classes  ?

• H10D 8/60 - Schottky-barrier diodes
• H10D 8/01 - Manufacture or treatment
• H10D 30/67 - Thin-film transistors [TFT]
• H10D 64/23 - Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
• H10D 64/64 - Electrodes comprising a Schottky barrier to a semiconductor
• H10D 84/80 - Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups or , e.g. integration of IGFETs
• H10D 99/00 - Subject matter not provided for in other groups of this subclass
• H10K 10/23 - Schottky diodes
• H10D 62/40 - Crystalline structures
• H10D 62/80 - Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
• H10D 62/83 - Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
• H10D 62/85 - Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
• H10D 62/86 - Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group II-VI materials, e.g. ZnO

Abstract

An electronic circuit comprises a first resistor (1) and a second resistor (2). The first resistor comprises: a first sheet (10) of resistive material; and a first pair (11, 12) of conductive contacts, each arranged in electrical contact with the first sheet, and arranged such that a shortest resistive path in the first sheet between the first pair of contacts passes through the first sheet and has a length equal to a thickness (LI) of the first sheet. The second resistor comprises: a second sheet (20) of resistive material; and a second pair (21, 22) of conductive contacts, each arranged in electrical contact with the second sheet, and arranged such that a shortest resistive path (L2) in the second sheet between the second pair of contacts passes along at least a portion of a length of the second sheet.

IPC Classes  ?

• H10D 86/80 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
• H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
• H10D 84/00 - Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
• H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
• H10D 86/85 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components

Goods & Services

Machines for use in industry for the manufacture of integrated circuits, semiconductors and electronics; controlled atmosphere machines and installations for manufacturing integrated circuits, semiconductors and electronics; machine systems for the automated production of integrated circuits, semiconductors and electronics; parts, fittings and accessories for all of the aforesaid goods. Semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, and apparatus and equipment incorporating such circuits and components; transparent electronics circuits, wearable electronics circuits, ultra-thin electronics circuits; integrated circuits, semiconductors and electronics for displays, electronic tags, smart labels, smart cards, smart packaging, intelligent everyday objects, toys, games, telecommunication devices, RFID devices, near field communication (NFC) devices, memory devices, sensing devices, intelligent appliance consumables, product authentication devices; computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable brochures and instruction manuals; parts, fittings, accessories, downloadable brochures, datasheets, instruction manuals and semiconductor component layouts for all of the aforesaid goods; semiconductors; semiconductor devices; wafers for integrated circuits; flexible electronic circuits; downloadable data files, text files, image files, instruction manuals, documents, brochures and datasheets, all for use in the design of semiconductors, integrated circuits, electronics and flexible electronic circuits; biochips; encoded key cards; microprocessors; printed circuit board assemblies; resistors [electronic]; transistors [electronic]; receivers and transmitters for communicating with RFID devices and chips; apparatus, instruments and equipment for near field communications (NFC). Semiconductor fabrication services; custom manufacture of semiconductors, semiconductor devices, semiconductor chips, wafers, integrated circuits, electronics and flexible electronic circuits; custom manufacture and assembly of semiconductors, integrated circuits and electronics for others; foundry services in relation to the custom manufacture and assembly of integrated circuits, semiconductors and electronics for others; advisory and consultancy services relating to the aforesaid. Scientific and technological services in the fields of integrated circuits, semiconductors and electronics, and research and design relating thereto; custom design of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, of apparatus and equipment using such circuits and components, and of machines and systems for the manufacture of such circuits and components; design and development of hardware and software; product research, custom design and testing for new product development in the fields of integrated circuits, semiconductors and electronics; technology consultation services regarding electrical and electronic products, semiconductors, semiconductor systems and integrated circuits; technical consultancy and support services relating to the design and/or use of machines and systems for the preparation of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components and electronic components; technology consultation services regarding the design, test and assembly of semiconductors, integrated circuits, electronics and flexible electronic circuits; custom testing of semiconductors, integrated circuits and electronics for others; information, advisory and consultancy services relating to the aforesaid.

Goods & Services

Machines for use in industry for the manufacture of integrated circuits, semiconductors and electronics; controlled atmosphere machines and installations for manufacturing integrated circuits, semiconductors and electronics; machine systems for the automated production of integrated circuits, semiconductors and electronics; parts, fittings and accessories for all of the aforesaid goods. Semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, and apparatus and equipment incorporating such circuits and components; transparent electronics circuits, wearable electronics circuits, ultra-thin electronics circuits; integrated circuits, semiconductors and electronics for displays, electronic tags, smart labels, smart cards, smart packaging, intelligent everyday objects, toys, games, telecommunication devices, RFID devices, near field communication (NFC) devices, memory devices, sensing devices, intelligent appliance consumables, product authentication devices; computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable brochures and instruction manuals; parts, fittings, accessories, downloadable brochures, datasheets, instruction manuals and semiconductor component layouts for all of the aforesaid goods; semiconductors; semiconductor devices; wafers for integrated circuits; flexible electronic circuits; downloadable data files, text files, image files, instruction manuals, documents, brochures and datasheets, all for use in the design of semiconductors, integrated circuits, electronics and flexible electronic circuits; biochips; encoded key cards; microprocessors; printed circuit board assemblies; resistors [electronic]; transistors [electronic]; receivers and transmitters for communicating with RFID devices and chips; apparatus, instruments and equipment for near field communications (NFC). Semiconductor fabrication services; custom manufacture of semiconductors, semiconductor devices, semiconductor chips, wafers, integrated circuits, electronics and flexible electronic circuits; custom manufacture and assembly of semiconductors, integrated circuits and electronics for others; foundry services in relation to the custom manufacture and assembly of integrated circuits, semiconductors and electronics for others; advisory and consultancy services relating to the aforesaid. Scientific and technological services in the fields of integrated circuits, semiconductors and electronics, and research and design relating thereto; custom design of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, of apparatus and equipment using such circuits and components, and of machines and systems for the manufacture of such circuits and components; design and development of hardware and software; product research, custom design and testing for new product development in the fields of integrated circuits, semiconductors and electronics; technology consultation services regarding electrical and electronic products, semiconductors, semiconductor systems and integrated circuits; technical consultancy and support services relating to the design and/or use of machines and systems for the preparation of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components and electronic components; technology consultation services regarding the design, test and assembly of semiconductors, integrated circuits, electronics and flexible electronic circuits; custom testing of semiconductors, integrated circuits and electronics for others; information, advisory and consultancy services relating to the aforesaid.

Abstract

A method is disclosed for configuring each item, of a batch of items, with a respective unique identifier. A key set is obtained in which each key of the key set is a random, or pseudo-random, number having a key width that is equal to a predefined code width. For each seed of a set of locally unique seeds, a uniquely invertible function is applied to generate a corresponding code. The uniquely invertible function is configured to convert a seed into a corresponding code using the key set. Every code generated for a given seed of the set of seeds is therefore unique for that set of seeds. The unique identifier is formed from the corresponding code and assigned to an electronic device.

IPC Classes  ?

• H04L 9/06 - Arrangements for secret or secure communicationsNetwork security protocols the encryption apparatus using shift registers or memories for blockwise coding, e.g. D.E.S. systems
• H04L 9/08 - Key distribution

Goods & Services

Machines for use in industry for the manufacture of integrated circuits, semiconductors and electronics; controlled atmosphere machines and installations for manufacturing integrated circuits, semiconductors and electronics; machine systems comprised of industrial machines for the automated production of integrated circuits, semiconductors and electronics; structural parts, structural fittings and structural accessories for all of the aforesaid goods Semiconductor components, namely, diodes, transistors, optoelectronics, resistors, thyristors, capacitors, fuses, thermistors, heatsinks, thermal interface materials, inductors, oscillators, sensors, transducers, switches, relays, solenoids, interposers, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies comprised of insulating materials, electronic components, interconnections; computer components, namely, central processing units, motherboards, random access memory modules, read-only memory modules, video graphic array ports, power suppliers, cooling fans, hard drives, graphics cards, sound cards, memory expansion cards; electronic components, namely, diodes, transistors, optoelectronics, resistors, thyristors, capacitors, fuses, thermistors, heatsinks, thermal interface materials, inductors, oscillators, sensors, transducers, switches, relays, solenoids, interposers; electric apparatus, namely, microprocessors, memory chips in the nature of integrated circuits, power transistors, light-emitting diodes, photovoltaic cells, charge-coupled devices, complementary metal-oxide semiconductors, radio frequency amplifiers, field effect transistors, analog to digital converter (ADCs), digital to analog converters (DACs), micromechanical systems (MEMS) comprised of microsensors, microprocessors, microactuators, units for data processing, voltage regulators, radio frequency identification (RFID) tags, voltage-controlled oscillators (VCOs), electric sensors; communications equipment, namely, electronic sensors, electric actuators, infotainment systems comprised of GPS and wireless interconnection modules, electric switches, wireless routers, telecommunications base stations, amplifiers, modems, multiplexers, programmable logic controllers, smartphone, laptops, tablet computers, digital cameras, smartwatches, inverters, electric power converters, oscilloscopes, spectrum analyzers for the generation, measurement and analysis of audio signals in the nature of audio analyzers, signal generators, digital multimeters; transparent electronic circuits; wearable electronic circuits; ultra-thin electronic circuits; integrated circuits; semiconductors; electronics for displays, namely, electronic display boards, plasma display boards, electronic display screens; electronic tags for goods; smart labels in the nature of electronic tags for goods; blank smart cards; telecommunication devices, namely, teleconferencing systems comprised of computer hardware, telephones and downloadable software for teleconferencing; modems; network routers; telephone call routers; radios; transponders; audio-video receivers; cellular telephones; smartphones; tablet computers; laptops; computers; computer hardware, namely wireless Access points (WAPs); digital television; Radio frequency identification (RFID) tags, RFID readers, Blank near field communication (NFC) labels and tags, computer memory devices, electric sensors, optical sensors, touchscreen sensors; computer screen filters; computer game cartridges; thermometers other than for medical use; product authentication devices, namely, Radio frequency identification (RFID) tags, Near field communication (NFC) tags, Radio frequency identification (RFID) readers, Near field communication (NFC) technology-enabled readers, smart encoded bar code labels, secure authentication microchips, smart packaging comprised of encoded electronic chips, blank electronic secure storage media, secure encoded electronic tokens for product authentication and secure encoded electronic cards for product authentication; secure authentication tokens and secure authentication cards; downloadable computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; downloadable computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable brochures and instruction manuals for computer controlled and monitored systems, installations and machinery for the manufacture of integrated circuits, semiconductors and electronics; downloadable brochures, datasheets, instruction manuals and semiconductor component layouts for computer controlled and monitored systems, installations and machinery for the manufacture of integrated circuits, semiconductors and electronics; structural parts and fittings for systems, installations and machinery for the manufacture of integrated circuits, semiconductors and electronics; accessories for computer controlled and monitored systems, installations and machinery for the manufacture of integrated circuits; semiconductors and electronics, namely, semiconductor wafer carriers and cassettes, dispensers for measuring and dispensing chemicals, semiconductor wafer ID readers, chillers and thermal control units being temperature controllers for controlling temperature of equipment during the manufacturing process, particle counters for measuring and monitoring air quality, RFID asset tracking systems comprised of RFID tags, labels chips, readers and writers, process residual gas analysers, semiconductor wafer barcode and RFID labels; semiconductor devices; wafers for integrated circuits; flexible electronic circuits; downloadable data files, text files, image files, instruction manuals, documents, brochures and datasheets, all for use in the design of semiconductors, integrated circuits, electronics, namely, diodes, transistors, optoelectronics, resistors, thyristors, capacitors, fuses, thermistors, heatsinks, thermal interface materials, inductors, oscillators, sensors, transducers, switches, relays, solenoids, interposers, central processing units, motherboards, random access memory modules, read-only memory modules, video graphic array ports, power suppliers, cooling fans, hard drives, graphics cards, sound cards, expansion cards, microprocessors, memory chips, power transistors, light-emitting diodes, photovoltaic cells, charge-coupled devices, complementary metal-oxide semiconductors, radio frequency amplifiers, field effect transistors, analog to digital converter (ADCs), digital to analog converters (DACs), micromechanical systems (MEMS), voltage regulators, radio frequency identification (RFID) tags, voltage-controlled oscillators (VCOs), sensors, sensors, actuators, infotainment systems comprised of GPS and wireless interconnection modules, switches, routers, base stations, amplifiers, modems, multiplexers, programmable logic controllers, smartphone, laptops, tablets, digital cameras, smartwatches, home entertainments systems, inverters, battery management systems (BMS), power converters, oscilloscopes, spectrum analyzers, signal generators, multimeters, data acquisition systems, security systems and flexible electronic circuits; biochips for research or scientific purposes; encoded key cards; microprocessors; printed circuit board assemblies; electric resistors; transistors; receivers and transmitters for communicating with RFID devices and chips; apparatus, instruments and equipment for near field communications (NFC), namely NFC tags for making mobile payments and providing advertising information, NFC readers, downloadable software for use as an NFC tag, chip and label writer, NFC antennas, NFC memory modules, NFC-enabled wearables in the nature of smart watches, activity tracker wristbands, fitness activity trackers, activity tracker rings, activity tracker bracelets, NFC labels for making mobile payments and providing advertising information, Blank NFC labels, Blank NFC tags. Semiconductor fabrication services for others; custom manufacture of semiconductors, semiconductor devices, semiconductor chips, wafers, integrated circuits, electronics and flexible electronic circuits; custom manufacture and assembly of semiconductors, integrated circuits and electronics for others; foundry services in relation to the custom manufacture and assembly of integrated circuits, semiconductors and electronics for others; advisory and consultancy services relating to the aforesaid Scientific and technological research and design in the fields of integrated circuits, semiconductors and electronics; custom design of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, of apparatus and equipment using such circuits and components, and of machines and systems for the manufacture of such circuits and components; design and development of hardware and software; product research, custom design and testing for new product development in the fields of integrated circuits, semiconductors and electronics; technology consultation services regarding electrical and electronic products, semiconductors, semiconductor systems and integrated circuits; technical consultancy in regard to the design and use of computerized systems and machines used in the manufacture and preparation of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components and electronic components; Technical support, namely, monitoring technological functions of computer network systems and computerized machines used in the manufacture and preparation of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components and electronic components; technology consultation services regarding the design, testing and manufacture of semiconductors, integrated circuits, electronics and flexible electronic circuits; custom testing of semiconductors, integrated circuits and electronics for others; information, advisory and consultancy services relating to the aforesaid

Abstract

A method, apparatus and system for secure one-way RFID tag identification is provided. The method comprising generating, at an RFID tag, an auxiliary identifier; generating, at an RFID tag, a secure representation based on the auxiliary identifier; transmitting, from the RFID tag and receiving at an RFID reader, one or more representations of the auxiliary identifier and the tag identifier including the secure representation; and verifying the identity of the RFID tag based on the received representations.

IPC Classes  ?

• H04L 9/40 - Network security protocols
• H04L 9/08 - Key distribution
• H04L 9/32 - Arrangements for secret or secure communicationsNetwork security protocols including means for verifying the identity or authority of a user of the system
• H04W 12/47 - Security arrangements using identity modules using near field communication [NFC] or radio frequency identification [RFID] modules

Abstract

The present invention provides processes for manufacturing a plurality of discrete integrated circuits (ICs) on a carrier, the process comprising the steps of: providing a carrier for a flexible substrate; depositing a flexible substrate of uniform thickness on said carrier; removing at least a portion of the thickness of the flexible substrate from at least a portion of the IC connecting areas to form channels in the flexible substrate and a plurality of IC substrate units spaced apart from one another on the carrier by said channels; forming an integrated circuit on at least one of the IC substrate units.

IPC Classes  ?

• H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
• H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body

Abstract

A method of manufacturing an electronic circuit (or circuit module) (100) is disclosed. The electronic circuit comprises a transistor (1) and a resistor (2), the transistor comprising a source terminal (11), a drain terminal (12), a gate terminal (13), and a first body (10) of material providing a controllable semi-conductive channel between the source and drain terminals, and the resistor comprises a first resistor terminal (21), a second resistor terminal (22), and a second body (20) of material providing a resistive current path between the first resistor terminal and the second resistor terminal. The method comprises: forming the first body (10); and forming the second body (20), wherein the first body comprises a first quantity (100) of a metal oxide and the second body comprises a second quantity (200) of said metal oxide. Corresponding electronic circuits are disclosed.

IPC Classes  ?

• H10D 84/80 - Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups or , e.g. integration of IGFETs
• H01C 1/01 - MountingSupporting
• H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
• H01C 17/28 - Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
• H10D 1/47 - Resistors having no potential barriers
• H10D 8/60 - Schottky-barrier diodes
• H10D 30/67 - Thin-film transistors [TFT]
• H10D 62/80 - Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
• H10D 84/00 - Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
• H10D 84/02 - Manufacture or treatment characterised by using material-based technologies
• H10D 86/01 - Manufacture or treatment
• H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
• H10D 86/60 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
• H10D 99/00 - Subject matter not provided for in other groups of this subclass

Abstract

A thin-film resistor and a method for fabricating a thin-film resistor are provided. The thin-film resistor comprises a first terminal, a second terminal, and a resistor body providing a resistive current path between the first terminal and the second terminal, and the method comprises depositing a first layer of conductive material onto at least one of the supporting structure and the resistor body, applying a first lithographic mask to the first layer, and etching the first layer to form the first terminal; and depositing a second layer of conductive material onto at least one of the supporting structure and the resistor body, applying a second lithographic mask to the second layer, and etching the second layer to form the second terminal, wherein the first lithographic mask is different to the second lithographic mask, and a lateral separation of the first terminal and the second terminal is less than an in-plane minimum feature size of the first and second lithographic masks

IPC Classes  ?

• H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
• H01C 1/01 - MountingSupporting
• H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
• H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors
• H01C 17/075 - Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin-film techniques
• H01C 17/28 - Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
• H01L 21/8256 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using technologies not covered by one of groups , or
• H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
• H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
• H01L 27/13 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body combined with thin-film or thick-film passive components
• H01L 29/24 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only inorganic semiconductor materials not provided for in groups , ,  or
• H01L 29/66 - Types of semiconductor device
• H01L 29/786 - Thin-film transistors
• H01L 29/872 - Schottky diodes
• H01L 49/02 - Thin-film or thick-film devices

Abstract

A thin-film electronic component includes a first terminal, a second terminal, and a first current path between the first terminal and the second terminal, wherein the first current path is formed from a first segment of a first material and a first segment of a second material arranged in series between the first terminal and the second terminal.

IPC Classes  ?

• H10D 1/47 - Resistors having no potential barriers
• H01C 1/01 - MountingSupporting
• H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
• H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
• H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors
• H01C 17/075 - Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin-film techniques
• H01C 17/28 - Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
• H10D 8/60 - Schottky-barrier diodes
• H10D 30/67 - Thin-film transistors [TFT]
• H10D 62/80 - Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
• H10D 84/00 - Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
• H10D 84/02 - Manufacture or treatment characterised by using material-based technologies
• H10D 84/80 - Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups or , e.g. integration of IGFETs
• H10D 86/01 - Manufacture or treatment
• H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
• H10D 86/60 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
• H10D 86/80 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
• H10D 99/00 - Subject matter not provided for in other groups of this subclass

Abstract

A thin-film integrated circuit comprising a first semiconductor device, a second semiconductor device, a first resistor, and a second resistor is provided. A semiconducting region of the first semiconductor device, a resistor body of the first resistor, a semiconducting region of the second semiconductor device, and a resistor body of the second resistor are formed from at least one of a first source material and a second source material, and a material of the resistor body of the first resistor and a material of the resistor body of the second resistor have different electrical properties.

IPC Classes  ?

• H10D 1/47 - Resistors having no potential barriers
• H01C 1/01 - MountingSupporting
• H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
• H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
• H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors
• H01C 17/075 - Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin-film techniques
• H01C 17/28 - Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
• H10D 8/60 - Schottky-barrier diodes
• H10D 30/67 - Thin-film transistors [TFT]
• H10D 62/80 - Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
• H10D 84/00 - Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
• H10D 84/02 - Manufacture or treatment characterised by using material-based technologies
• H10D 84/80 - Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups or , e.g. integration of IGFETs
• H10D 86/01 - Manufacture or treatment
• H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
• H10D 86/60 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
• H10D 86/80 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
• H10D 99/00 - Subject matter not provided for in other groups of this subclass

Abstract

There is provided a flexible electronic structure for bonding with an external circuit, comprising a flexible substrate, having a first surface, configured for bonding with the external circuit, and an opposing second surface, configured for engagement with a bonding tool, comprising at least one electronic component; at least one contact member, operatively coupled with said at least one electronic component and provided at said first surface of said flexible substrate, and adapted to operably interface with the external circuit after bonding, and at least one shield member, provided at said first surface so as to shieldingly overlap at least a portion of said at least one electronic component, adapted to withstand a predetermined pressure applied to said first surface and/or said opposing second surface during bonding with the external circuit.

IPC Classes  ?

• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/367 - Cooling facilitated by shape of device
• H01L 23/498 - Leads on insulating substrates
• H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

There is provided a flexible electronic structure for bonding with an external circuit. The flexible electronic structure comprising: a flexible body having a first surface, the flexible body comprising at least one electronic component; at least one contact element configured to bond with the external circuit, the at least one contact element operatively coupled with the at least one electronic component and provided at the first surface of the flexible body, and arranged to operably interface with the external circuit after bonding, and at least one support element provided at the first surface of the flexible body, each support element arranged to contact a corresponding surface element disposed on a first surface of an external structure comprising the external circuit.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/367 - Cooling facilitated by shape of device
• H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

A method for fabricating a thin-film integrated circuit, IC, including a plurality of electronic components, the method comprising: forming, using a first fabrication technique, the plurality of electronic components, and forming, using a second fabrication technique, a conductive layer on the plurality of electronic components to form a redistribution layer, RDL, wherein the first fabrication technique includes photolithographic patterning, and the first fabrication technique is different to the second fabrication technique.

IPC Classes  ?

• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/367 - Cooling facilitated by shape of device
• H01L 23/498 - Leads on insulating substrates
• H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

A flexible electronic structure for bonding with an external circuit. The flexible electronic structure comprising a flexible body having a first surface, the flexible body comprising at least one electronic component, at least one contact element configured to bond with the external circuit, the at least one contact element operatively coupled with the at least one electronic component and provided at the first surface of the flexible body, and arranged to operably interface with the external circuit after bonding, and at least one support element provided at the first surface of the flexible body, each support element including a contact area arranged to contact a first surface of an external structure comprising the external circuit or a corresponding surface element disposed on the first surface of the external structure, wherein the contact area of each of the at least one support element does not overlie one or more predetermined types of electronic component among the at least one electronic component or one or more predetermined types of element of the at least one electronic component.

IPC Classes  ?

• H01L 23/16 - Fillings or auxiliary members in containers, e.g. centering rings
• H01L 23/552 - Protection against radiation, e.g. light
• H01L 23/66 - High-frequency adaptations

Abstract

An electronic circuit assembly comprises: a first electronic circuit module; a second electronic circuit module; and a quantity of anisotropic conductive adhesive, ACA, comprising a plurality of electrically conductive particles and an electrically non-conductive adhesive, arranged to bond the first electronic circuit module to the second electronic circuit module. The first electronic circuit module comprises a first surface and a first pair of electrical contacts each provided on said first surface, the second electronic circuit module comprises a second surface and a second pair of electrical contacts each provided on said second surface, said first surface is arranged to face said second surface, said first pair of electrical contacts is aligned with said second pair of electrical contacts such that a first electrical contact of the first pair opposes a first electrical contact of the second pair and a second electrical contact of the first pair opposes a second electrical contact of the second pair, said quantity of ACA occupies a volume between the first and second surfaces, and conductive particles of the ACA provide a first electrical connection between the first electrical contacts of the first and second pairs, and a second electrical connection between the second electrical contacts of the first and second pairs. The first electronic circuit module further comprises at least one member provided on and protruding from said first surface and arranged between the first pair of electrical contacts, and at least one channel provided through a said member or defined between a plurality of said members, each said channel providing a flow channel, in a direction parallel to the first surface, for at least said non-conductive adhesive during manufacture of the assembly.

IPC Classes  ?

• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

An interposer subassembly that is suitable for an electronic system having at least one integrated circuit (1C) component. The interposer subassembly includes a flexible base layer, having a first surface and an opposing second surface, at least one active electronic circuit component, operatively integrated within the flexible base layer, and at least one first patterned contact layer, provided on any one of the first surface and the second surface of the flexible base layer and which is configured to operably interface with the at least one active electronic circuit component and the at least one 1C component.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/367 - Cooling facilitated by shape of device
• H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
• H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Goods & Services

Semiconductors, semiconductor devices, semiconductor chips, wafers and integrated circuits; flexible electronic circuits; downloadable data files, text files, image files, instruction manuals, documents, brochures and datasheets, all for use in the design of semiconductors, integrated circuits, electronics and flexible electronic circuits. Custom manufacture of semiconductors, semiconductor devices, semiconductor chips, wafers, integrated circuits, electronics and flexible electronic circuits; custom manufacture and assembly of semiconductors, integrated circuits and electronics for others. Technology consultation services regarding the design, test and assembly of semiconductors, integrated circuits, electronics and flexible electronic circuits; custom testing of semiconductors, integrated circuits and electronics for others.

Abstract

A signal measuring apparatus comprising: signal circuitry configured to receive an input signal to be measured; and memory circuitry coupled to the signal circuitry and configured to store information representing a magnitude of a voltage or a current of the input signal; wherein the memory circuitry comprises a first memory cell having a material which is arranged to switch from a first material state to a second material state in response to a first switching signal being applied thereto, wherein the first memory cell is tuned to a first value for the first switching signal so that a current or voltage with a magnitude at or above the first value will cause the material of the first memory cell to switch from the first material state to second material state; wherein the apparatus is configured to apply a measurement signal indicative of the input signal to the first memory cell for switching the material of the first memory cell from the first material state to the second material state in dependence on a magnitude of the voltage or current of the measurement signal.

IPC Classes  ?

• G01D 21/00 - Measuring or testing not otherwise provided for

Abstract

A structure is disclosed, comprising: a first field effect transistor, FET, comprising a first source terminal, a first drain terminal, a first layer or body of semiconductive material arranged to provide a first semiconductive channel connecting the first source terminal to the first drain terminal, and a gate terminal arranged with respect to the first semiconductive channel such that a conductivity of the first semiconductive channel may be controlled by application of a voltage to the gate terminal; and a second FET comprising a second source terminal, a second drain terminal, a second layer or body of semiconductive material arranged to provide a second semiconductive channel connecting the second source terminal to the second drain terminal, and the gate terminal, the second conductive channel being arranged with respect to the gate terminal such that a conductivity of the second channel may be controlled by application of a voltage to the gate terminal. Methods of manufacturing such structures are also disclosed.

IPC Classes  ?

• H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
• H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
• H01L 21/285 - Deposition of conductive or insulating materials for electrodes from a gas or vapour, e.g. condensation
• H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
• H01L 21/3213 - Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
• H01L 29/40 - Electrodes
• H01L 29/417 - Electrodes characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched

Goods & Services

Semiconductors, semiconductor devices, semiconductor chips, semiconductor wafers and integrated circuits; flexible electronic circuits; downloadable data files, text files, image files, datasheets and documents, all featuring information and guidance to support the design of semiconductors, integrated circuits, electronics and flexible electronic circuits, and all provided via a website and downloadable electronic publications in the nature of instruction manuals and brochures, all for use in the design of semiconductors, integrated circuits, electronics and flexible electronic circuits Custom manufacture of semiconductors, semiconductor devices, semiconductor chips, semiconductor wafers, integrated circuits, electronics and flexible electronic circuits; custom manufacture and assembly of semiconductors, integrated circuits and electronics for others Engineering and manufacturing technology consultation services regarding the design, test and assembly of semiconductors, integrated circuits, electronics and flexible electronic circuits; custom testing of semiconductors, integrated circuits and electronics for others

Abstract

A system is disclosed, comprising a base and at least a first moveable entity, the first moveable entity being moveable with respect to the base and positionable in at least a first position with respect to the base. The base comprises a first base electrode and a second base electrode, and the moveable entity comprises a first moveable entity electrode and a second moveable entity electrode. The electrodes are arranged such that when the moveable entity is in the first position the first base electrode and the first moveable entity electrode align to form a first capacitor and the second base electrode and second moveable entity electrode align to form a second capacitor. The first moveable entity further comprises a first resistor connecting the first moveable entity electrode to the second moveable entity electrode, and the base further comprises: signal supply means arranged to supply a time-varying electrical signal to the first base electrode; and signal detection means arranged to detect an electrical signal from the second base electrode.

IPC Classes  ?

• G01D 5/241 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes

Abstract

The present invention provides processes for manufacturing a plurality of discrete integrated circuits (ICs) on a carrier, the process comprising the steps of: providing a carrier for a flexible substrate; depositing a flexible substrate of uniform thickness on said carrier; removing at least a portion of the thickness of the flexible substrate from at least a portion of the IC connecting areas to form channels in the flexible substrate and a plurality of IC substrate units spaced apart from one another on the carrier by said channels; forming an integrated circuit on at least one of the IC substrate units.

IPC Classes  ?

• H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
• H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Abstract

Measurement apparatus, for generating a first output signal indicative of a measurand, comprises: a first oscillator circuit and a second oscillator circuit, each oscillator circuit being arranged to generate a respective oscillating output signal and comprising at least a respective first component having a property determining a respective output frequency of the respective oscillating output signal; a sensor for sensing said measurand, the sensor comprising said first component of the first oscillator circuit, said property of said first component of the first oscillator circuit being dependent upon said measurand; and circuitry arranged to receive said oscillating output signals and generate said first output signal, said first output signal being indicative of a number of cycles of one of the first and second oscillating output signals in a time period determined by a period of the other of said first and second oscillating output signals.

IPC Classes  ?

• G01K 7/24 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a non-linear resistance, e.g. thermistor in a specially-adapted circuit, e.g. bridge circuit
• G01D 5/12 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means
• G01K 7/20 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer in a specially-adapted circuit, e.g. bridge circuit
• G01K 7/34 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using capacitative elements
• G01L 1/14 - Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
• G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
• G01L 9/02 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers
• G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
• G01N 27/22 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
• H03K 3/03 - Astable circuits
• H03M 1/60 - Analogue/digital converters with intermediate conversion to frequency of pulses

Abstract

One exemplary aspect relates to a process and apparatus for selectively changing adhesion strength between a flexible substrate and a carrier at specific locations to facilitate shipping and subsequent removal of the flexible substrate from the carrier. The process includes providing a flexible substrate comprising a plurality of integrated circuits thereon providing a carrier for the flexible substrate and adhering the flexible substrate to the carrier by creating an interface between the flexible substrate and the carrier. The process further includes changing the adhesion force between the flexible substrate and the carrier at selected locations by non-uniform treatment of the interface between the flexible substrate and the carrier with an electromagnetic radiation source (e.g. a laser, flashlamp, high powered LED, an infrared radiation source or the like) so as to decrease or increase the adhesion force between a portion of the flexible substrate and the carrier at the selected location.

IPC Classes  ?

• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 3/36 - Assembling printed circuits with other printed circuits
• B29C 65/14 - Joining of preformed partsApparatus therefor by heating, with or without pressure using wave energy or particle radiation
• B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof

Abstract

transferring the flexible first structure, comprising the electronic circuits, between the heated surface and the opposing surface such that the adhesive is cured by application of heat and pressure from the heated surface and the opposing surface thereby adhering the IC onto the respective first portion.

IPC Classes  ?

• H05K 3/36 - Assembling printed circuits with other printed circuits
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Abstract

A method, apparatus and system for secure one-way RFID tag identifications provided. The method comprising generating, at an RFID tag, an auxiliary identifier; generating, at an RFID tag, a secure representation based on the auxiliary identifier; transmitting, from the RFID tag and receiving at an RFID reader, one or more representations of the auxiliary identifier and the tag identifier including the secure representation; and verifying the identity of the RFID tag based on the received representations.

IPC Classes  ?

• H04L 9/40 - Network security protocols
• H04L 9/08 - Key distribution
• H04L 9/32 - Arrangements for secret or secure communicationsNetwork security protocols including means for verifying the identity or authority of a user of the system
• H04W 12/47 - Security arrangements using identity modules using near field communication [NFC] or radio frequency identification [RFID] modules

Abstract

A system is disclosed, comprising a base and at least a first moveable entity, the first moveable entity being moveable with respect to the base and positionable in at least a first position with respect to the base. The base comprises a first base electrode and a second base electrode, and the movable entity comprises a first moveable entity electrode and a second moveable entity electrode. The electrodes are arranged such that when the moveable entity is in the first position the first base electrode and the first moveable entity electrode align to form a first capacitor and the second base electrode and second moveable entity electrode align to form a second capacitor. The first moveable entity further comprises a first resistor connecting the first moveable entity electrode to the second moveable entity electrode, and the base further comprises: signal supply means arranged to supply a time-varying electrical signal to the first base electrode; and signal detection means arranged to detect an electrical signal from the second base electrode.

IPC Classes  ?

• G01D 5/241 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes

Abstract

A method of manufacturing a plurality of electronic circuits is disclosed. Each electronic circuit comprises a respective first portion, comprising a respective group of contact pads, and a respective integrated circuit, IC, comprising a respective group of terminals and mounted on the respective group of contact pads with each terminal in electrical contact with a respective contact pad. The method comprises: providing a first structure comprising the plurality of first portions; providing a second structure comprising the plurality of ICs and a common support arranged to support the plurality of ICs; transferring said ICs from the common support onto a first roller having a removable surface portion; and transferring said ICs from the first roller onto the first structure such that each group of terminals is mounted on a respective group of contact pads.

IPC Classes  ?

• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
• H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices

Abstract

A structure is disclosed, comprising: a first field effect transistor, FET, comprising a first source terminal, a first drain terminal, a first layer or body of semiconductive material arranged to provide a first semiconductive channel connecting the first source terminal to the first drain terminal, and a gate terminal arranged with respect to the first semiconductive channel such that a conductivity of the first semiconductive channel may be controlled by application of a voltage to the gate terminal; and a second FET comprising a second source terminal, a second drain terminal, a second layer or body of semiconductive material arranged to provide a second semiconductive channel connecting the second source terminal to the second drain terminal, and the gate terminal, the second conductive channel being arranged with respect to the gate terminal such that a conductivity of the second channel may be controlled by application of a voltage to the gate terminal. Methods of manufacturing such structures are also disclosed.

IPC Classes  ?

• H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
• H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
• H01L 21/285 - Deposition of conductive or insulating materials for electrodes from a gas or vapour, e.g. condensation
• H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
• H01L 21/3213 - Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
• H01L 29/40 - Electrodes
• H01L 29/417 - Electrodes characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched

Goods & Services

Semiconductor components being parts of semiconductor apparatus, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components and electronic components providing wireless or contactless connectivity; flexible, transparent, ultra-thin electronic instruments and components for wireless or contactless connectivity; integrated circuits and electronic components for RFID devices and chips; RFID devices and chips for labels, tags, cards, packaging, everyday objects, toys, games, sensing devices and appliance consumables; receivers and transmitters for communicating with RFID devices and chips; apparatus, instruments and equipment for Near Field Communications (NFC); parts, fittings, downloadable publications being brochures, datasheets, instruction manuals and semiconductor integrated circuit layouts for all of the aforesaid goods.

Goods & Services

Machines for use in industry for the manufacture of integrated circuits, semiconductors and electronics; controlled atmosphere machines and installations for manufacturing integrated circuits, semiconductors and electronics; machine systems for the automated production of integrated circuits, semiconductors and electronics; parts, fittings and accessories for all of the aforesaid goods. Computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable brochures and instruction manuals; downloadable brochures and instruction manuals for all of the aforesaid goods. Custom manufacture of integrated circuits, semiconductors and electronics; foundry services, namely custom manufacture and assembly of integrated circuits, semiconductors and electronics.

Goods & Services

Machines for use in industry in the fields of integrated circuits, semiconductors and electronics; controlled atmosphere facilities and installations, namely machines for manufacturing integrated circuits, semiconductors and electronics; machine systems for the automated production of integrated circuits, semiconductors and electronics; parts, fittings and accessories, for all of the aforesaid goods. Semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, and apparatus for recording, transmission, reception, processing or reproduction of sound, images or data incorporating such circuits and components; flexible electronic circuits; transparent electronic circuits; wearable electronics, namely, wearable activity trackers, displays, cameras, computers in the nature of smartwatches and smartglasses; ultra-thin chips or circuits for high-performance electronics; integrated circuits, semiconductors and electronic components for displays, electronic tags, smart labels, smart cards, smart packaging, intelligent everyday objects, toys, games, telecommunication devices, RFID devices, Near Field Communication (NFC) devices, memory devices, sensing devices, intelligent appliance consumables, product authentication devices; computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable brochures and instruction manuals; parts, fittings, accessories, downloadable brochures, datasheets, instruction manuals and semiconductor component layouts for all of the aforesaid goods. Custom manufacture of integrated circuits, semiconductors and electronics; foundry services, namely custom manufacture and assembly of integrated circuits, semiconductors and electronics. Scientific and technological services in the fields of integrated circuits, semiconductors and electronics, and research and design relating thereto; custom design of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, of apparatus and equipment using such circuits and components, and of machines and systems for the manufacture of such circuits and components; design and development of hardware and software; product research, custom design and testing for new product development in the fields of integrated circuits, semiconductors and electronics; technology consultation services regarding electrical and electronic products, semiconductors, semiconductor systems and integrated circuits; technical consultancy and support services relating to the design of machines and systems for the preparation of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components and electronic components; technological consultancy and support services relating to the use of machines and systems for the preparation of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components and electronic components.

Abstract

A comparator is disclosed, for comparing a first input voltage with a second input voltage and generating a corresponding output voltage. The comparator includes a follower stage coupled to a first supply rail and a second supply rail, a follower stage input terminal for the second input voltage, and a follower stage output terminal. The comparator also includes an inverter stage comprising a first inverter stage supply terminal coupled to the first supply rail, a second inverter stage supply terminal coupled to the follower stage output terminal, an inverter stage input terminal for the first input voltage, and an inverter stage output terminal for providing an inverter stage output voltage having a first range. A signal conditioning means is coupled to the inverter stage output terminal and generates a comparator output voltage at a comparator output terminal having a second range larger than the first range.

IPC Classes  ?

• H03K 5/24 - Circuits having more than one input and one output for comparing pulses or pulse trains with each other according to input signal characteristics, e.g. slope, integral the characteristic being amplitude
• H03K 19/094 - Logic circuits, i.e. having at least two inputs acting on one outputInverting circuits using specified components using semiconductor devices using field-effect transistors