Provided in the present disclosure are a piezoelectric acoustic device and an electronic apparatus. The piezoelectric acoustic device comprises a housing, and a vibration plate and a driving source assembly, which are accommodated in the housing, wherein the vibration plate is connected to the driving source assembly by means of buffer rubber; and the driving source assembly is used for driving, under the action of the buffer rubber, the vibration plate to integrally vibrate like a flat plate. In the present invention, transmission between the driving source assembly and the vibration plate is performed by means of the buffer rubber, such that the bending motion of the driving source assembly is converted into the parallel motion of the vibration plate, thereby achieving the purpose of compensating for high-frequency sound and improving the acoustic performance of the piezoelectric acoustic device.
The present application provides a key and an electronic device. The key comprises a frame, a sensor, a reinforcing member, and piezoelectric ceramic; the sensor is arranged at the side of the reinforcing member facing away from the piezoelectric ceramic; the piezoelectric ceramic is arranged at the side of the reinforcing member facing away from the frame; the reinforcing member comprises a fitting portion and connecting portions arranged at two ends of the fitting portion; the connecting portions are connected to the frame; and at least one connecting portion is provided with a hollow structure.
The present application discloses a button module (1) and an electronic device. The button module (1) comprises a support assembly (10), a button assembly (11) and a piezoelectric module. The button assembly (11) is mounted on the support assembly (10), and the piezoelectric module is mounted on the support assembly (10). The piezoelectric module comprises a piezoelectric sheet (12), and the piezoelectric sheet (12) has a first deformed side (121). The piezoelectric module further comprises a first protective plate (13) and a second protective plate (14), wherein the first protective plate (13) is connected to the first deformed side (121) of the piezoelectric sheet (12), and the second protective plate (14) is connected to the side of the first protective plate (13) away from the piezoelectric sheet (12). The stiffness of the second protective plate (14) is greater than that of the first protective plate (13). A part of the button assembly (11) is connected to the first protective plate (13).
H01H 13/85 - Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by ergonomic functions, e.g. for miniature keyboardsSwitches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by operational sensory functions, e.g. sound feedback characterised by tactile feedback features
The present application discloses a combined sensor, a microphone, and an electronic device. The combined sensor comprises a substrate, an outer housing, an isolation housing, a microphone MEMS chip, a microphone ASIC chip, a pressure MEMS chip, and a pressure ASIC chip. The substrate is provided with a sound hole; the outer housing is arranged on the surface of the substrate, and the outer housing and the substrate define an accommodating cavity; the isolation housing is arranged on the surface of the substrate and covers the sound hole; the pressure ASIC chip is arranged on the side of the isolation housing facing the substrate and is electrically connected to the substrate; the pressure MEMS chip is arranged on any side of the isolation housing and is electrically connected to the pressure ASIC chip; and the microphone MEMS chip and the microphone ASIC chip are both arranged on the side of the isolation housing facing the outer housing.
The present application provides a button structure, a vibration recognition method therefor, and an electronic device. The button structure comprises a button body configured to be connected to a mounting main body; and a functional assembly comprising a piezoelectric ceramic, a driving member and a sensor assembly. The driving member is provided with a middle component and edge components located on two sides of the middle component; the middle component of the driving member is configured to be fixedly connected to the mounting main body, and the piezoelectric ceramic is arranged on the middle component of the driving member; the edge components of the driving member are freely arranged; the piezoelectric ceramic and the sensor assembly are both arranged on the driving member, and the piezoelectric ceramic is electrically connected to the sensor assembly.
H01H 13/85 - Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by ergonomic functions, e.g. for miniature keyboardsSwitches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by operational sensory functions, e.g. sound feedback characterised by tactile feedback features
The present application relates to the technical field of electronics. Disclosed are a tactile feedback device and an electronic device. The tactile feedback device comprises a housing, a vibration assembly and a vibration transmission assembly, wherein the vibration assembly comprises a mounting member and a piezoelectric ceramic member which are arranged on the housing, the mounting member wrapping around the piezoelectric ceramic member and being capable of vibrating along with deformation of the piezoelectric ceramic member, and the toughness of the mounting member being greater than that of the piezoelectric ceramic member; and the vibration transmission assembly is arranged on the housing and abuts against the mounting member, and a touch portion is provided at the end of the vibration transmission assembly that faces away from the mounting member.
H01H 13/85 - Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by ergonomic functions, e.g. for miniature keyboardsSwitches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by operational sensory functions, e.g. sound feedback characterised by tactile feedback features
H01H 13/86 - Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by the casing, e.g. sealed casings or casings reducible in size
G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer
7.
CROSSTALK SHIELDING APPARATUS, CROSSTALK SHIELDING DEVICE AND INTELLIGENT TERMINAL DEVICE
Disclosed in the present application are a crosstalk shielding apparatus, a crosstalk shielding device and an intelligent terminal device. The crosstalk shielding apparatus comprises a substrate, a packaging cavity, a low-thermal-conductivity layer, a high-thermal-conductivity layer, and a chip assembly with a voice module and a sensor module integrated thereon, wherein the chip assembly is embedded into the substrate in such a manner that a bonding pad surface of the chip assembly faces the substrate, so as to form a chip layer, the chip layer being a panel area of the substrate where the chip assembly is embedded; the packaging cavity envelops the chip layer and is adhesively and fixedly connected to the chip layer; and the low-thermal-conductivity layer is provided on the side of the chip layer that is close to the packaging cavity, and the high-thermal-conductivity layer is provided on the side of the chip layer that is away from the packaging cavity.
The present application belongs to the technical field of combined sensors. Provided are a combined sensor and a smart wearable device. The combined sensor comprises a carrier board, and a housing and a base plate respectively mounted on two sides of the carrier board. The carrier board cooperates with the housing to form an accommodating cavity, and a MEMS chip is provided in the accommodating cavity. The combined sensor further comprises an ASIC chip signal-connected to the MEMS chip. The carrier board cooperates with the base plate to form an acoustic cavity; a waterproof membrane is also provided in the acoustic cavity; and the waterproof membrane divides the acoustic cavity into a first cavity and a second cavity. The carrier board is provided with an acoustic hole communicating the accommodating cavity and the first cavity, and an air inlet communicating the second cavity and the outside is formed in the base plate.
Disclosed in the present application are a working scenario determination method and apparatus, and a wearable device and a computer-readable storage medium. The working scenario determination method comprises: acquiring an acoustic time-domain signal, which is detected by an acoustic perception sensor, and a vibration time-domain signal, which is detected by a vibration perception sensor; preprocessing the acoustic time-domain signal and the vibration time-domain signal to obtain a target acoustic signal and a target vibration signal, and comparing signal parameters of the target acoustic signal and the target vibration signal to obtain signal parameter deviation information; and if the signal parameter deviation information is within a preset parameter deviation range, starting a preset working module of a wearable device, and entering an operating state.
The present application discloses a polyimide composite film and a preparation method therefor. The polyimide composite film comprises a polyimide base film and a polymer coating; the polyimide base film is a polyimide fiber film; the polyimide fiber film comprises a plurality of polyimide fibers which are arranged in a stacked and crossed mode; the surface of the polyimide fibers is coated with the polymer coating; and junctions are formed at the intersections of the polyimide fibers, so that the crossed polyimide fibers are connected by means of the junctions to form a net structure.
D06M 15/227 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of hydrocarbons, or reaction products thereof, e.g. afterhalogenated or sulfochlorinated
D04H 1/728 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres characterised by the method of forming fleeces or layers, e.g. reorientation of fibres the fibres being randomly arranged by electro-spinning
D06M 15/233 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of hydrocarbons, or reaction products thereof, e.g. afterhalogenated or sulfochlorinated aromatic, e.g. styrene
D06M 15/693 - Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials with macromolecular compoundsSuch treatment combined with mechanical treatment with natural or synthetic rubber, or derivatives thereof
D06M 15/248 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of halogenated hydrocarbons containing chlorine
D06M 101/30 - Synthetic polymers consisting of macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
11.
POLYIMIDE COMPOSITE MEMBRANE AND PREPARATION METHOD THEREFOR
The present application relates to the technical field of polymer membranes. Disclosed are a polyimide composite membrane and a preparation method therefor. The polyimide composite membrane comprises a polyimide base membrane and a coating; the polyimide base membrane is a polyimide fiber membrane; the polyimide fiber membrane comprises a plurality of stacked polyimide fibers; the surfaces of the polyimide fibers are coated with the coating; the material of the coating comprises a polymer material having low surface tension.
D06M 15/643 - Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds containing silicon in the main chain
D06M 15/00 - Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials with macromolecular compoundsSuch treatment combined with mechanical treatment
D06M 101/30 - Synthetic polymers consisting of macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
D06M 101/00 - Chemical constitution of the fibres, threads, yarns, fabrics or fibrous goods made from such materials, to be treated
D04H 1/40 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
Provided in the embodiments of the present disclosure are a sensor and an electronic product. The sensor comprises a substrate, a back electrode, a diaphragm and reinforcing ribs, wherein the substrate is provided with a first through hole; the back electrode is provided with second through holes, the back electrode is connected to the substrate by means of an insulating layer, and an accommodating cavity is formed between the back electrode and the substrate; the diaphragm is provided in the accommodating cavity and can separate the accommodating cavity into a first chamber that communicates with the first through hole and a second chamber that communicates with the second through holes; the diaphragm comprises a fixed area and a vibration area, the fixed area being connected to the insulating layer; and each reinforcing rib comprises a first end and a second end, the first end being fixed between the fixed area and the insulating layer, and the second end being fixed to the vibration area. By means of the provision of the reinforcing ribs, the stress concentration of the diaphragm is effectively reduced, and the reliability of the sensor is improved.
G01D 5/02 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using mechanical means
13.
MICRO-ELECTRO-MECHANICAL STRUCTURE, MEMS SENSOR AND ELECTRONIC DEVICE
A micro-electro-mechanical structure, a MEMS sensor and an electronic device. The micro-electro-mechanical structure comprises a structural layer; the structural layer comprises a sensing layer and an electrode layer which are stacked; a gap is formed between the sensing layer and the electrode layer; in a cross-section perpendicular to the height direction of the micro-electro-mechanical structure, the sensing layer comprises a first area, a second area and a first isolation gap; the first isolation gap separates the first area from the second area; the first area is provided with a first electrical connection point; the second area is used for sensing an external signal; a second electrical connection point is provided on the side of the electrode layer opposite to the first area; the first electrical connection point and the second electrical connection point are used for forming an electrical connection with the interior and/or the exterior of the micro-electro-mechanical structure.
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
14.
ELEVATOR FULL LOAD DETECTION METHOD AND APPARATUS, ELECTRONIC DEVICE, AND MEDIUM
An elevator full load detection method and apparatus, an electronic device, and a medium. The method comprises: acquiring a depth image collected by a depth camera; acquiring a first number of pixels occupied by an object at an elevator car bottom in the depth image and a second number of pixels occupied by the elevator car bottom in the depth image; determining the elevator occupancy rate of an elevator on the basis of the first number and the second number; and on the basis of the elevator occupancy rate, determining whether the elevator is fully loaded. According to the elevator full load detection method, the passenger face privacy can be well protected by means of a depth image, and on the basis of the elevator occupancy rate, it is determined whether an elevator is fully loaded, so that unnecessary staying of elevators can be reduced, improving the elevator operation efficiency and the passenger riding experience, saving electric energy, and reducing mechanical abrasion of the elevators.
Disclosed are a MEMS microphone and an electronic device. The MEMS microphone comprises a substrate, a diaphragm, and a backplate. The backplate is formed with a support, and comprises a first back-electrode region and a second back-electrode region which are connected to different electrodes.
H04R 1/28 - Transducer mountings or enclosures designed for specific frequency responseTransducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
Disclosed are a MEMS microphone and an electronic device. The MEMS microphone comprises a substrate, a diaphragm, and a backplate. The diaphragm has a fixed part and a suspended part, and the backplate is formed with a support thereon, which divides the suspended part into an inner suspended region and an outer suspended region.
Embodiments of the present application provide a piezoelectric microphone and a manufacturing method therefor, an electronic device and a sound source detection method. The piezoelectric microphone comprises: a substrate provided with a back hole; and a structural layer connected to the substrate and covering one side of the back hole, wherein the structural layer comprises a main body and a cantilever beam, and a gap exists between the cantilever beam and the main body; a piezoelectric layer is arranged on the cantilever beam, and a first electrode and a second electrode are arranged on two sides of the piezoelectric layer, respectively. The embodiments of the present application have the advantages of simple structure and low cost.
Disclosed are a vibration sensor, an electronic device and a vibration detection method. The vibration sensor comprises a circuit board assembly, a housing, a chip assembly, a vibration-pickup assembly and a through-hole. A back cavity is formed inside the circuit board assembly, the housing is mounted over the circuit board assembly, and the chip assembly is provided on a side of the circuit board assembly proximate to the housing and is electrically connected to the circuit board assembly. The vibration-pickup assembly is provided inside the cavity and dividing the cavity into a first cavity and a second cavity. The through-hole of the vibration sensor may be in communication with the back cavity and the second cavity.
B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
G01H 11/06 - Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
Provided in the embodiments of the present application are a sensor and an electronic product. The sensor comprises a housing, a substrate, a support plate, a buffer plate, a waterproof breathable membrane, an air pressure sensing module and an MIC module. The substrate is provided with a first through hole, and an inner chamber is formed by the substrate and the housing; the support plate is provided with a second through hole, the support plate being arranged in the inner chamber and forming an accommodation cavity with the substrate; the buffer plate is provided with a third through hole, the buffer plate being arranged in the accommodation cavity and dividing the accommodation cavity into a first chamber communicated with the first through hole and a second chamber communicated with the second through hole; the waterproof breathable membrane is arranged in the first chamber and divides the first chamber into a first sub-chamber communicated with the first through hole and a second sub-chamber communicated with the third through hole; the air pressure sensing module and the MIC module are arranged in the inner chamber. The sensor of the embodiments of the present application can measure the water depth.
Disclosed in the present application are a key, an electronic device, and a key control method. The key comprises a shell, piezoelectric sensors, a controller and a vibration feedback member, wherein the shell has a touch area; there are a plurality of piezoelectric sensors, and the plurality of piezoelectric sensors are arranged at intervals and are used for acquiring elastic-wave information of the touch area and outputting detection information; the controller is electrically connected to the piezoelectric sensors, and the controller is used for performing analysis on the basis of the detection information, so as to obtain feedback information, the feedback information comprising vibration information and instruction information; and the vibration feedback member is also electrically connected to the controller, such that the controller can control, on the basis of the vibration information, the vibration feedback member to drive at least part of the touch area to vibrate.
Disclosed in the present application are a sensor packaging structure, a sensor and an electronic device. The sensor packaging structure comprises a shell, a substrate, a sensing assembly and a waterproof film, wherein the shell is open at one end thereof; the substrate covers an opening and encloses together with the shell to form a packaging cavity, and a first sound hole in communication with the packaging cavity is formed in the substrate; the sensing assembly is accommodated in the packaging cavity, and the sensing assembly comprises a mounting plate, and a sensor chip and a signal processing chip which are mounted on the mounting plate side by side, the sensor chip being provided with a vibration cavity, a second sound hole, by means of which the vibration cavity is in communication with the packaging cavity, being formed in the mounting plate, and the second sound hole and the first sound hole being distributed in a staggered manner; and the waterproof film is accommodated in the packaging cavity and is located between the substrate and the sensing assembly, the waterproof film shields the first sound hole, and the first sound hole inclines towards a direction of the second sound hole in the direction close to the waterproof film, so as to compensate a dislocation difference between the first sound hole and the second sound hole.
Provided in the present application are a ranging sensor and an electronic device. The ranging sensor comprises a substrate, a packaging housing, a first chip and a second chip. The packaging housing covers the substrate, and encloses a packaging space with the substrate, the packaging housing being provided with a light inlet and a light outlet. The first chip and the second chip are respectively a photosensitive chip and a light-emitting chip, and are both located in the packaging space and electrically connected to the substrate, the first chip being arranged on the substrate, and the second chip being arranged above the first chip. A photosensitive area of the photosensitive chip and a light-emitting area of the light-emitting chip are spaced apart along a surface of the first chip, the photosensitive area and the light inlet being arranged opposite to each other, and the light-emitting area and the light outlet being arranged opposite to each other.
A MEMS microphone, a microphone unit and an electronic device are disclosed by the present disclosure. The micro-electro-mechanical system microphone comprises: a substrate; a back electrode plate comprising a supporting structure; and a diaphragm located between the substrate and the back electrode plate, wherein the supporting structure comprises a supporting portion used for supporting a periphery of a diaphragm, and a supporting electrode being insulated from the supported diaphragm, and wherein the diaphragm is a stress-free film when being applied no bias, and when being applied a bias, the supporting electrode constrains the periphery of the diaphragm on the supporting portion through electrostatic interaction so as to support the diaphragm in a clamped manner.
A charge pump circuit and an electronic device. The charge pump circuit comprises a charge pump module, wherein an input end of the charge pump module is connected to a reference power source module, and an output end of the charge pump module serves as an output end of the charge pump circuit; the charge pump module comprises N first charge pump units connected in series, and controlled switches corresponding to the first charge pump units on a one-to-one basis; and each controlled switch is connected between an output end of the reference power source module and an output end of the corresponding first charge pump unit.
H02M 3/07 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode
An electronic device and an electronic apparatus. The electronic device comprises a vibration electrode (4) and a plurality of release structures (100), wherein the vibration electrode (4) comprises an annular support portion (401) and an elastic portion (402), which is connected to a hollow region of the annular support portion (401). After the release structures (100) are arranged on the elastic portion (402) and enable two side surfaces of the vibration electrode (4) to be in communication with each other, air in cavities on two sides of the vibration electrode (4) in the electronic device can be ensured to circulate, such that the influence of air damping on the electronic device can be reduced; and the plurality of release structures (100) are distributed on the elastic portion (402), such that stress generated by the elastic portion (402) during vibration can be balanced.
Embodiments of the present application provide an MEMS inertial sensor, a detection method, and an electronic device. The MEMS inertial sensor comprises a substrate, a first electrode, a second electrode, a mass block, and an elastic beam. An insulating layer is arranged on one side of the substrate; the first electrode and the second electrode are spaced apart and arranged on the insulating layer; the mass block is suspended above the substrate; the mass block comprises a first part, a second part and a third part; the elastic beam is used for connecting the substrate and the mass block; the elastic beam is connected to an anchor point of the substrate; the first part, the third part and the second part are located on the two sides of the elastic beam; the second part and the second electrode form a first capacitor, and the third part and the first electrode form a second capacitor; the second capacitor has a collapse working mode, and in the collapse working mode, the first capacitor is used as a detection end, and the MEMS inertial sensor can perform detection and sensing according to an acquired capacitance change amount in the collapse working mode.
G01P 15/125 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
G01C 21/16 - NavigationNavigational instruments not provided for in groups by using measurement of speed or acceleration executed aboard the object being navigatedDead reckoning by integrating acceleration or speed, i.e. inertial navigation
27.
SENSOR, DETECTION METHOD OF SENSOR, AND ELECTRONIC DEVICE
A sensor (1), a detection method of the sensor (1), and an electronic device. The sensor (1) comprises a substrate (10), a first electrode (11), a second electrode (12) and an electrically conductive film (13), wherein the substrate (10) has a first surface; the first electrode (11) is arranged on the first surface, and is insulated from the substrate (10); the second electrode (12) is arranged on the first surface, and is insulated from both the substrate (10) and the first electrode (11); the electrically conductive film (13) is arranged opposite the first surface; an insulating layer is provided on at least the surface of the first electrode (11) that faces the electrically conductive film (13); and the first electrode (11) is configured to apply a voltage so that the electrically conductive film (13) abuts against and fits to the first electrode (11), and the second electrode (12) is configured to form, with the electrically conductive film (13), detection capacitance between the second electrode (12) and the electrically conductive film (13). In addition, the sensor further comprises a mass block (16), which is connected to the electrically conductive film (13) and located on the side of the electrically conductive film (13) facing away from the substrate (10).
G01P 15/125 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
G01P 21/00 - Testing or calibrating of apparatus or devices covered by the other groups of this subclass
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
A vehicle-mounted microphone and a vehicle, wherein the vehicle-mounted microphone comprises a housing (100), waterproof membrane assemblies (200), and a cover (300). The housing is used for mounting a microphone body, and sound holes (110) are formed in the housing (100). The waterproof membrane assemblies (200) are mounted on the housing (100) and used for covering the sound holes (110). The cover (300) is connected to the housing (100) and used for covering the waterproof membrane assemblies (200). Sound passing holes (310) and a plurality of drainage holes (320) are formed in the cover (300), a water passing cavity is formed between the cover (300) and each waterproof membrane assembly (200), and at least one drainage hole (320) is communicated with the outside and the water passing cavity.
Provided in the present application are a packaged product, an electronic device, and a packaging method for a packaged product. The packaging method for a packaged product comprises the following steps: providing a first substrate and a second substrate, mounting at least one first electronic component on the first substrate, and mounting at least one second electronic component on the second substrate; providing a conductive post on one of the first substrate and the second substrate; performing mounting to cause the first substrate to be electrically connected to the second substrate by means of the conductive post, wherein the first electronic component faces the second electronic component; mounting at least one third electronic component on the side of the first substrate facing away from the first electronic component to form a package; and performing plastic packaging on the package to form a plastic packaging layer, so as to wrap the first electronic component, the second electronic component and the third electronic component.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
30.
OPTICAL SENSOR, ELECTRONIC DEVICE, AND OPTICAL SENSOR PACKAGING METHOD
The present application provides an optical sensor, an electronic device, and an optical sensor packaging method. The optical sensor comprises a substrate and a housing mounted on the substrate, the substrate and the housing acting in concert to form a first accommodation cavity and a second accommodation cavity which are isolated from one another. The first accommodation cavity has a light source disposed therein, and the second accommodation cavity has a chip disposed therein. An upper surface of the housing has formed thereon a first groove and a second groove, and a position of the housing facing the second accommodation cavity has a mounting groove formed thereon. The housing further comprises a first light hole and a second light hole, the first light hole communicating the first groove and the first accommodation cavity, and the second light hole communicating the second groove and the mounting groove. The first groove has disposed therein a light diffuser which covers the first light hole and is directly opposite to the light source, the second groove has disposed therein a light filter which covers the second light hole, and the mounting groove has disposed therein a metasurface lens facing the chip.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
Disclosed are a vibration sensor and an electronic equipment. The vibration sensor includes a circuit board assembly, a shell, a vibration pick-up assembly, a support shell and a chip assembly. The shell is configured to cover a side of the circuit board assembly to form an installation space. The vibration pick-up assembly is provided in the installation space, and is configured to pick up an external bone vibration and generate a response vibration. The support shell is connected to a side of the vibration pick-up assembly away from the circuit board assembly. The chip assembly is connected to a side of the support shell away from the circuit board assembly, and is electrically connected to the circuit board assembly. The vibration pick-up assembly, the support shell and the chip assembly are enclosed to form a conduction cavity.
G01H 11/08 - Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
32.
UWB-BASED AUTOMOBILE POSITIONING METHOD AND SYSTEM CAPABLE OF REALIZING SPEECH RECOGNITION
Provided in the present application are a UWB-based automobile positioning method and system capable of realizing speech recognition. The method comprises: sending, by means of an automobile key, pulse signals to the position where an automobile is located; receiving the pulse signals by means of UWB positioning modules at various positions in the automobile, and labeling timestamps at which the pulse signals are received; processing the pulse signals and the corresponding timestamps, so as to determine the position of a user that carries the automobile key relative to the automobile; according to the relative position, determining a speech pickup module corresponding to the relative position; by means of a DSP, performing beamforming processing on a speech signal picked up by the speech pickup module, so as to acquire an enhanced speech signal; and according to the enhanced speech signal, controlling the automobile to complete an instruction corresponding to the enhanced speech signal. By using the present application, the existing problems, such as the accuracy of speech recognition out of a vehicle, can be solved.
A micro-electromechanical chip, comprising a substrate (1), a support structure layer (2), a diaphragm layer (3), and a back electrode layer (4). Cavities (5) are provided in the middle of the substrate (1) and in the middle of the support structure layer (2); the diaphragm layer (3) comprises an inner membrane (31), and a connecting shank (32) connected to the inner membrane (31); the inner membrane (31) and the back electrode layer (4) are both opposite the cavities (5), an airflow hole (33) is provided between the outside of the inner membrane (31) and of the connecting shank (32) and the support structure layer (2), and a top end of the connecting shank (32) is connected to the support structure layer (2); and a limiting protrusion (6) is provided on an inside surface of the airflow hole (33). By providing the limiting protrusion (6), tremor shaking and displacement of the inner membrane (31) are reduced, so as to reduce the risk of breakage of the connecting shank (32) due to the tremor shaking of the inner membrane (31).
Embodiments of the present application provide smart glasses. The smart glasses comprise: a glasses main body, wherein two lens frames are provided on the glasses main body, and an optical module is provided on at least one lens frame; and temples, wherein the temples are located on two sides of the glasses main body, the temples comprise circuit units and plastic packaging bodies, the circuit units are subjected to plastic packaging so as to form the plastic packaging bodies wrapping the circuit units, and the circuit units are electrically connected to the optical module.
The present application provides a transducer and an electronic device. The transducer comprises a substrate, a housing covering the substrate, and a solder ring connecting the substrate and the shell. The housing is fitted to the substrate to form an accommodating cavity, and a MEMS chip and an ASIC chip which have a signal connection are disposed in the accommodating cavity. A sound hole is provided in the substrate, and a waterproof film is disposed at the sound hole so as to block water from entering the accommodating cavity via the sound hole. An air leakage path is formed in the solder ring, the air leakage path comprising a first through hole facing the accommodating cavity and a second through hole facing away from the accommodating cavity, so that the accommodating cavity and the outside are in communication via the air leakage path.
Provided in the present application are an integrated device, an electronic device, and a method for manufacturing an integrated device. The integrated device comprises a substrate, the substrate comprising a first substrate and a second substrate, which are connected to each other, wherein a pressure sensor is arranged on the first substrate, the pressure sensor comprises a first electrode, a first P-type heavily-doped layer and a first P-type lightly-doped layer, and the first P-type heavily-doped layer is connected to the first electrode; and a temperature sensor is arranged on the second substrate, and the temperature sensor comprises a P-type diode.
H01L 27/10 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
H01L 29/84 - Types of semiconductor device controllable by variation of applied mechanical force, e.g. of pressure
An MEMS microphone and a microphone processing process. The MEMS microphone comprises a substrate, and a first diaphragm, a second diaphragm, and a back electret mounted on the substrate. Support columns are provided between the first diaphragm and the second diaphragm; through holes are formed on the back electret; the support columns pass through the through holes; the support columns comprise first support columns connected to the first diaphragm and second support columns connected to the second diaphragm; and the first support columns and/or the second support columns are made of a plastic material. One technical effect of embodiments of the present application is: the first support columns and/or the second support columns are made of the plastic material, so that the stress concentration effect is greatly reduced while sufficient support is provided to the diaphragms, thereby improving the structural reliability of the MEMS microphone.
A micro-electro-mechanical system microphone and an electronic device. The micro-electro-mechanical system microphone comprises a substrate, a diaphragm and a back plate. A support structure is formed on the back plate, and the back plate comprises a first back electrode area and a second back electrode area, the first back electrode area and the second back electrode area being connected to different electrodes.
A micro-electro-mechanical system microphone and an electronic device. The micro-electro-mechanical system microphone comprises a substrate, a diaphragm and a back electrode plate. The diaphragm has a fixed portion and a suspension portion; and a support structure is formed on the back electrode plate, and divides the suspension portion into an inner suspension region and an outer suspension region.
Provided in the present application are a sensor microphone output protection circuit and a sensor microphone. The sensor microphone comprises an amplification output circuit, a power supply end and an audio output end, wherein the amplification output circuit is respectively electrically connected to the power supply end and the audio output end. The sensor microphone output protection circuit comprises a voltage measurement module, a low-level trigger module and a switch module, wherein a measurement end of the voltage measurement module is connected to the power supply end, an output end of the voltage measurement module is electrically connected to a controlled end of the low-level trigger module, and a controlled end of the switch module is electrically connected to the low-level trigger module.
H02H 3/24 - Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition, with or without subsequent reconnection responsive to undervoltage or no-voltage
41.
VIBRATION SENSOR, ELECTRONIC DEVICE, AND VIBRATION DETECTION METHOD
A vibration sensor, an electronic device, and a vibration detection method. The vibration sensor comprises a circuit board assembly, a housing, a chip assembly, a vibration pickup assembly, and a through hole. A back cavity is formed in the circuit board assembly, the housing is fastened on the circuit board assembly, the chip assembly is disposed on the side of the circuit board assembly close to the housing, and is electrically connected to the circuit board assembly. The vibration pickup assembly is disposed in a cavity and divides the cavity into a first cavity and a second cavity. The through hole of the vibration sensor can communicate the back cavity and the second cavity.
A vibration sensor module including: a substrate, a first casing, a vibration pickup unit, and a sensor unit. The first casing has an open end on the substrate, the first casing and the substrate are enclosed to form a sealing chamber, and the first casing includes a first top plate opposite to the substrate. The vibration pickup unit is arranged in the sealing chamber, the vibration pickup unit includes a second casing with an open end and an elastic vibration pickup member arranged in the second casing, the open end of the second casing is arranged on the substrate or the first top plate, and the second casing is provided with a vibration transmission through hole. The sensor unit includes a sensor chip arranged on an outer surface of the second casing, and a back cavity of the sensor chip corresponds to the vibration transmission through hole.
The present application discloses a current sensor (100), an electronic device, and a measurement apparatus. The current sensor (100) comprises a measurement circuit (1) and a sensing assembly (2); the sensing assembly (2) comprises a plurality of magnetoresistive memory units (21) formed on a chip; the magnetization direction of the pinning layer of each magnetoresistive memory unit (21) is arranged in the thickness direction of the magnetoresistive memory unit; at least two of the plurality of magnetoresistive memory units (21) are connected to form a half-bridge circuit; and the measurement circuit (1) comprises a first measurement segment (111) and a second measurement segment (112).
Disclosed in the present application are a transmitting and receiving integrated acoustic circuit, an acoustic chip and a control method therefor, and a wearable device. The transmitting and receiving integrated acoustic circuit comprises: a first MEMS sensor unit provided with a first electrode plate and a second electrode plate which are oppositely disposed and a first diaphragm which is located between the first electrode plate and the second electrode plate; and a first switch circuit used for accessing a first electric signal and a second electric signal when a first sound production control signal is received, and outputting the first electric signal and the second electric signal to the first electrode plate and the second electrode plate.
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
A bone voiceprint sensor, comprising a housing, a PCB and a built-in assembly. A closed cavity is formed between the housing and the PCB. The built-in assembly is arranged in the closed cavity. The built-in assembly comprises a base, a vibration assembly and a microphone assembly. The base is arranged on the PCB. The vibration assembly and the microphone assembly are arranged on the base. A vibration cavity is formed between the base, the vibration assembly, the microphone assembly and the PCB. The vibration assembly senses an external vibration signal and drives the airflow in the vibration cavity to change, and the microphone assembly senses the change of the airflow in the vibration cavity so as to convert the vibration signal into an electric signal.
The present application provides a sensor and a wearable device. The sensor comprises a base layer. The base layer comprises a base body and an isolation layer arranged on the base body. A sensing assembly is connected to the side of the isolation layer facing away from the base body, and the sensing assembly comprises a vibrating diaphragm and a back electrode. The sensor comprises a sound inlet. An air release line passing through the vibrating diaphragm is formed at the position of the vibrating diaphragm facing the sound inlet, and the air release line is of a non-closed structure. The sensing assembly comprises a vibrating diaphragm and a back electrode, and an air release line passing through the vibrating diaphragm is formed on the vibrating diaphragm, so that the vibrating diaphragm can generate an air release path when subjected to blowing pressure or sound waves, to reduce the pressure borne by the vibrating diaphragm.
An electronic device, an interaction module, and a control method and control apparatus therefor. The control method for an interaction module comprises: controlling an ultrasound generation apparatus to transmit an ultrasonic signal, and controlling a pickup apparatus to receive an acoustic wave signal (S100); controlling a signal processing unit to determine, according to the acoustic wave signal, voice instruction information and/or posture instruction information of a user (S200); and controlling the signal processing unit to determine a user instruction according to the voice instruction information and/or the posture instruction information (S300). The method improves the human-computer interaction efficiency.
An electrostatic micro-electro-mechanical system transducer, a manufacturing method, and an electronic device. The electrostatic micro-electro-mechanical system transducer comprises: a first electrode (36); a second electrode (32) relative movable to the first electrode (36); and dielectric layers (35a, 35b) located between the first electrode (36) and the second electrode (32). The dielectric layers (35a, 35b) comprise a standard portion (35a) and a leakage portion (35b). The material of the standard portion (35a) is a standard dielectric material, and the material of the leakage portion (35b) is a leakage dielectric material.
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
A detection circuit and detection method for a piezoresistive pressure sensor, and an electronic device, wherein same belong to the technical field of power electronics. A Wheatstone bridge circuit is used for a piezoresistive pressure sensor, and the piezoresistive pressure sensor comprises a first voltage output end (INN) and a second voltage output end (INP), wherein the first voltage output end (INN) is connected to a first voltage input pin of a processing chip, and the second voltage output end (INP) is connected to a second voltage input pin of the processing chip. The detection circuit for a piezoresistive pressure sensor comprises at least one of a first detection unit, a second detection unit, a third detection unit, and a fourth detection unit, wherein each detection unit comprises a current source (IA, IB, IC, ID) and a switch (SA, SB, SC, SD), which is connected in series with the current source (IA, IB, IC, ID), and a control end of the switch (SA, SB, SC, SD) is connected to a processing chip.
G01L 25/00 - Testing or calibrating of apparatus for measuring force, torque, work, mechanical power, or mechanical efficiency
G01L 27/00 - Testing or calibrating of apparatus for measuring fluid pressure
G01L 1/20 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
G01L 9/06 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers of piezo-resistive devices
G01R 27/02 - Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
G01R 31/55 - Testing for incorrect line connections
The present application provides a microphone, comprising a diaphragm and a back pole plate. The back pole plate comprises a same-potential area and a first hole forming area; the first hole forming area is arranged around the same-potential area; the first hole forming area is uniformly provided with a plurality of first acoustic holes; the same-potential area is configured to be at the same potential as the diaphragm; and the same-potential area and the first hole forming area are insulated from each other. In the present application, by improving the microphone, the same-potential region of the back pole plate and the same-potential region of the diaphragm are set at the same potential, thereby greatly reducing the formation of parasitic capacitance, and achieving the effect of improving the acoustic performance of the microphone.
The present disclosure discloses a micro-electromechanical system microphone, a microphone body, and an electronic device. The micro-electromechanical system microphone comprises: a substrate; a back electret which comprises a support structure; and a diaphragm located between the substrate and the back electret, wherein the support structure comprises a support portion and a support electrode, the support portion is used to support the edge of the diaphragm, and the support electrode is insulated from the supported diaphragm; in a state where bias is not applied, the diaphragm is a stress-free membrane, and in a state where a bias is applied, the support electrode clamps the edge of the diaphragm to the support portion by means of electrostatic action so as to form a fixed support for the diaphragm.
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
A vibration sensor (100), comprising a circuit board assembly (10), a housing (20), a vibration pickup assembly (30), a support casing (50), and a chip assembly (40). The housing (20) covers one side of the circuit board assembly (10) to enclose a mounting space. The vibration pickup assembly (30) is disposed in the mounting space and is used for picking up an external bone vibration and generate a response vibration. The support casing (50) is connected to one side of the vibration pickup assembly (30) away from the circuit board assembly (10). The chip assembly (40) is connected to one side of the support casing (50) away from the circuit board assembly (10) and is electrically connected to the circuit board assembly (10). The vibration pickup assembly (30), the support casing (50) and the chip assembly (40) enclose to form a conduction cavity (60) such that the response vibration is transmitted to the chip assembly (40) via the conduction cavity (60). An electronic device comprising the vibration sensor (100) is further provided.
G01H 11/06 - Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
53.
MEMS DIFFERENTIAL PRESSURE SENSOR AND MANUFACTURING METHOD THEREFOR
A MEMS differential pressure sensor and a manufacturing method therefor. The MEMS differential pressure sensor comprises: a base layer (1) having a cavity (5); a pressure sensitive film (4) erected above the cavity (5) of the base layer (1); and a protective housing (3) arranged on the side of the pressure sensitive film (4) that is away from the base layer (1). In a static state, a vertical distance between the pressure sensitive film (4) and the bottom of the cavity (5), and between the pressure sensitive film (4) and the protective housing (3) is less than the minimum overload deformation amount of the pressure sensitive film (4); and limiting structures, for limiting two sides of the pressure sensitive film (4), are respectively formed by the bottom of the cavity (5) and the protective housing (3). Bidirectional high-overload resistance of the MEMS differential pressure sensor can thus be achieved, and the sensor is stable in performance and small in size.
G01L 13/02 - Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements
G01L 7/08 - Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges of the flexible-diaphragm type
54.
BONE VOICEPRINT SENSOR AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE
Disclosed in the present disclosure are a bone voiceprint sensor and a manufacturing method therefor, and an electronic device. The bone voiceprint sensor comprises a sensor unit and a vibration pickup unit, wherein the sensor unit is provided with a packaging cavity, the vibration pickup unit has an accommodating cavity, the packaging cavity is in communication with the accommodating cavity, the vibration pickup unit comprises a vibrating assembly arranged in the accommodating cavity, the vibrating assembly comprises a vibrating diaphragm and a mass block connected to each other, the mass block is provided with a pre-perforated recess, the pre-perforated recess is configured such that air-permeable micropores penetrating the vibrating assembly are formed by means of the pre-perforated recess, the sensor unit and/or the vibration pickup unit is/are provided with a gas leakage hole(s), and gas in the packaging cavity and the accommodating cavity is discharged through the air-permeable micropores and the gas leakage hole.
A packaging module and an electronic device. The packaging module (100) comprises a housing (1), a chip assembly (2), and a capacitor assembly (3); the housing (1) is provided with an accommodating cavity (14) and an inner cavity (111) which are arranged at intervals, a wire bonding pad (112) is provided on an inner wall of the accommodating cavity (14), and a soldering pad (113) is provided on an outer wall of the housing (1); the chip assembly (2) is disposed in the accommodating cavity (14), is spaced apart from the wire bonding pad (112), and is electrically connected to the wire bonding pad (112); and the capacitor assembly (3) is disposed in the inner cavity (111), and is electrically connected to the wire bonding pad (112) and the soldering pad (113).
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 23/488 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions
H01L 23/60 - Protection against electrostatic charges or discharges, e.g. Faraday shields
56.
PACKAGING MODULE, PACKAGING PROCESS, AND ELECTRONIC DEVICE
A packaging module (100), a packaging process, and an electronic device. The packaging module (100) comprises a substrate (1), a housing (2), a chip assembly (3) and a sealing pad (5). The substrate (1) is provided with a first air hole (11); the housing (2) is disposed on the substrate (1), and the housing (2) and the substrate (1) together define a first accommodating cavity (232) and a second accommodating cavity (233) which are spaced apart from each other; the first air hole (11) is communicated with the first accommodating cavity (232); the housing (2) is provided with a second air hole (231) communicated with the second accommodating cavity (233); the chip assembly (3) comprises a first chip (31) and a second chip (32); the first chip (31) is disposed in the first accommodating cavity (232) and is spaced apart from the first air hole (11); the second chip (32) is disposed in the second accommodating cavity (233); the first chip (31) and the second chip (32) are electrically connected to the substrate (1) by means of gold wires (4), respectively; the sealing pad (5) is disposed on the housing (2) and surrounds the second air hole (231), and the sealing pad (5) is adapted to be connected to a terminal system.
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
A sensor and an electronic device. The sensor (100) comprises: a fixed portion (51); a vibration portion (53), the vibration portion (53) being connected to the fixed portion (51) and capable of vibrating in a reciprocating manner with respect to the fixed portion (51); a permanent magnet (60), the permanent magnet (60) being provided on the vibration portion (53) and vibrating along with the vibration portion (53); a function sensor (70), the function sensor (70) being provided on the fixed portion (51), and the function sensor (70) being configured to sense a magnetic field change of the permanent magnet (60) during vibration of the vibration portion (53) and output a changed electrical signal; and a calibration sensor (80), the calibration sensor (80) being provided on the vibration portion (53) and vibrating along with the vibration portion (53), and the calibration sensor (80) being configured to sense a magnetic field of the permanent magnet (60) and correct the electrical signal output by the function sensor (70).
G01D 5/12 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means
G01D 18/00 - Testing or calibrating apparatus or arrangements provided for in groups
H04R 9/04 - Construction, mounting, or centering of coil
Disclosed in the present application are a sensor and an electronic device. The sensor comprises a fixing portion; a vibration portion, which is connected to the fixing portion and can vibrate relative to the fixing portion; and at least two sensing units, each of the sensing units comprising at least one permanent magnet and at least four functional sensing elements, wherein the permanent magnet is arranged on the vibration portion, the functional sensing elements are arranged on the fixing portion, the four functional sensing elements in each of the sensing units are connected to form a primary full-bridge structure, and four primary full-bridge structures are connected to form a secondary full-bridge structure.
Provided are an MEMS sensor and an electronic device. The MEMS sensor (100) comprises: a vibrating diaphragm layer (10), which comprises a fixing portion (11) and a sensitive portion (12) capable of vibrating relative to the fixing portion (11); a detection member, which comprises a first magnetoresistive unit (21) and a second magnetoresistive unit (22) connected in sequence, the long-axis directions of the first magnetoresistive unit (21) and the second magnetoresistive unit (22) being arranged at an included angle, and the included angle being less than 180°; and a wire (30), the extension direction of which is parallel to the arrangement directions of the first magnetoresistive unit (21) and the second magnetoresistive unit (22), wherein the detection member and the wire (30) are respectively fixed on the fixing portion (11) and the sensitive portion (12), and the magnetization directions of reference layers of the first magnetoresistive unit (21) and the second magnetoresistive unit (22) are perpendicular to the long-axis directions thereof, and respectively face and face away from the wire.
G01D 5/16 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying resistance
A sensor and an electronic device. The sensor comprises: a substrate; a first sensing unit (10), wherein the first sensing unit (10) detects a magnetic field in the direction of a first sensing axis, the first sensing unit (10) comprises two first magnetoresistive modules (11) and two second magnetoresistive modules (13) which are arranged on the substrate, the first magnetoresistive modules (11) and the second magnetoresistive modules (13) are connected to form a full-bridge circuit, an included angle between the magnetization direction of a pinning layer of each first magnetoresistive module (11) and the positive direction of the first sensing axis is defined as α, an included angle between the magnetization direction of a pinning layer of each second magnetoresistive module (13) and the positive direction of the first sensing axis is defined as β, and α and β are supplementary angles; and a plurality of magnetic flux collectors (20), wherein the plurality of magnetic flux collectors (20) are arranged on the substrate, a magnetic gap is formed between two adjacent magnetic flux collectors (20), and each first magnetoresistive module (11) and each second magnetoresistive module (13) are respectively located in a magnetic gap.
G01D 5/12 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means
61.
MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE AND ELECTRONIC DEVICE
The present disclosure relates to a micro-electro-mechanical system microphone and an electronic device. The micro-electro-mechanical system microphone comprises: an upper housing; a base, comprising a sound hole and forming a housing of the micro-electro-mechanical system microphone together with the upper housing; a microphone substrate, provided above the base and comprising at least two first openings, the at least two first openings being in communication with the sound hole; and at least two microphone units, formed on the substrate and respectively corresponding to the first openings. The at least two microphone units are acoustically provided in parallel on the microphone substrate, the at least two microphone units each comprise a diaphragm and a back plate, the diaphragm and the side wall of the first opening enclose at least a part of a front cavity of the microphone, and the at least two microphone units are connected in series in circuit.
A magnetic sensor and a manufacturing method therefor, and an electronic device. The magnetic sensor comprises a substrate (20) and a plurality of magnetoresistive modules. The plurality of magnetoresistive modules are disposed on the substrate (20) and form a Wheatstone bridge. The side of each magnetoresistive module facing away from the substrate (20) is provided with at least one metal film sheet (400). The design of covering the sides of the magnetoresistive modules facing away from the substrate (20) with metal film sheets (400) can reduce the interference of an external magnetic field, and reduce the noise of the magnetic sensor.
Disclosed by the present application are a capacitive sensor chip, sensor, and electronic device. The capacitive sensor chip comprises: a substrate; a diaphragm, said diaphragm being disposed on the surface of said substrate; a back electrode plate, said back electrode plate being disposed on the side of the diaphragm facing away from the substrate, and a vibration gap being formed between the plate and the diaphragm, the back electrode plate being provided with a projection on the side facing the diaphragm; the back electrode plate is provided with an electrically conductive layer, said electrically conductive layer being disposed on the side of the back electrode plate facing the diaphragm, the projection being disposed passing through the electrically conductive layer, the thickness of the electrically conductive layer being less than the height that the projection protrudes. The capacitive sensor chip of the technical solution of the present application can improve the robustness of the electrically conductive layer.
Disclosed are an MEMS sensor chip, a microphone and an electronic device. The MEMS sensor chip comprises a substrate, an induction assembly and an annular protective layer, wherein the substrate has a cavity; the induction assembly comprises a first annular support layer, a second annular support layer, a vibrating diaphragm, and a back plate which has a through hole; the first annular support layer is arranged on the substrate; the first annular support layer, the back plate, the second annular support layer and the vibrating diaphragm are sequentially stacked in a direction away from the substrate; the annular protective layer is arranged on a peripheral side of the induction assembly; and the annular protective layer at least covers the first annular support layer and/or the second annular support layer.
The present application discloses an MEMS sensor chip, a microphone and an electronic device. The MEMS sensor chip comprises a substrate, a sensing assembly and an annular protective layer; the sensing assembly comprises a first annular support layer, a second annular support layer, a third annular support layer, a first vibrating diaphragm, a second vibrating diaphragm and a back electrode plate; the first annular support layer is provided on the substrate, and the first annular support layer, the first vibrating diaphragm, the second annular support layer, the back electrode plate, the third annular support layer and the second vibrating diaphragm are sequentially stacked; and the annular protective layer is provided on the periphery of the sensing assembly, and the annular protective layer at least covers the first annular support layer and/or the second annular support layer and/or the third annular support layer.
A method for calibrating a bone voiceprint sensor. The method comprises: acquiring a first test signal and a first standard signal which are respectively sent by a bone voiceprint sensor to be calibrated and a standard bone voiceprint sensor in response to a first vibration signal (S101); determining a first deviation on the basis of the first test signal and the first standard signal, and determining whether the first deviation is within a preset range (S102); and if the first deviation is within the preset range, determining a gain value on the basis of a target signal and the first test signal, and calibrating, on the basis of the gain value, the bone voiceprint sensor to-be-calibrated (S103). Further provided are an apparatus and a device for calibrating a bone voiceprint sensor, and a computer-readable storage medium.
The present invention provides an MEMS piezoelectric microspeaker, a microspeaker unit, and an electronic device. The MEMS piezoelectric microspeaker comprises: an MEMS piezoelectric actuator for generating a speaker sound wave; and a miniature microphone integrated in the MEMS piezoelectric microspeaker and configured to generate a sound pressure signal on the basis of the speaker sound wave to adjust the sound output performance of the MEMS piezoelectric actuator. A sound pressure measurement portion of the miniature microphone is located outside the MEMS piezoelectric actuator and is separated from the MEMS piezoelectric actuator.
Disclosed in the present application are a preparation method for a chip passivation layer, the chip passivation layer and a chip. The method comprises: depositing silicon nitride or silicon oxide on a hard mask substrate to obtain a first structure; growing amorphous silicon on the surface of the first structure to obtain a second structure; carrying out silicon oxide deposition on the upper surface of the second structure to obtain a third structure; patterning a silicon oxide layer in the third structure to obtain a fourth structure; carrying out silicon etching on the fourth structure to obtain a fifth structure; and releasing silicon nitride and/or silicon oxide in the fifth structure to obtain the chip passivation layer.
C23C 16/50 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
A method for manufacturing a magnetic sensor, comprising the following steps: providing a semiconductor substrate (1), forming a first insulating layer (2) on a surface of the semiconductor substrate (1), and forming a magnetoresistive composite layer (3) on the first insulating layer (2), the magnetoresistive composite layer (3) comprising an effective magnetoresistive composite layer (31) and a process magnetoresistive composite layer (32); forming deposition recesses (33) on a surface of the magnetoresistive composite layer (3) by using photolithography technology, and forming a thin film electrode (4) in the deposition recesses (33); forming a second insulating layer (5) on the surfaces of the magnetoresistive composite layer (3) and the thin film electrode (4), and removing the second insulating layer (5) corresponding to the process magnetoresistive composite layer (32) by using photolithography technology such that the surface of the process magnetoresistive composite layer (32) is exposed; etching the process magnetoresistive composite layer (32) by taking the second insulating layer (5) corresponding to the effective magnetoresistive composite layer (31) as a hard mask; and removing part of the hard mask by using photolithography technology such that the surface of the thin film electrode (4) is at least partially exposed.
Disclosed by the present application are a bone voiceprint sensor module and an electronic device. The bone voiceprint sensor module comprises: a substrate; a first housing, wherein one end of the first housing is arranged as open, the open end of the first housing is mounted to the substrate, the first housing and the substrate are enclosed to form a packaging cavity, and the first housing comprises a first top plate arranged opposite to the substrate; a vibration pickup unit, which is disposed in the packaging cavity, and comprises a second housing one end of which is open, and an elastic pickup piece disposed within the second housing, the open end of the second housing being mounted on the substrate or the first top plate, and a vibrating transmission through hole being formed in the second housing; and a sensor unit, which comprises a sensor chip mounted on the outer surface of the second housing, a back cavity of the sensor chip being arranged corresponding to the vibration transmission through hole.
Disclosed in the present application are a bone voiceprint sensor module and an electronic device. The bone voiceprint sensor module comprises: an electric control board provided with a vibration transmission channel and having a first surface; a vibration pick-up unit mounted on the first surface and configured to pick up an external bone vibration signal to generate a response vibration signal; and a sensor unit mounted on the first surface, wherein the sensor unit and the vibration pick-up unit are sequentially distributed in the first direction, and the vibration transmission channel is communicated with the vibration pick-up unit and the sensor unit, such that the response vibration signal can be transmitted to the sensor unit by means of the vibration transmission channel.
A microelectromechanical system mechanical sensor, comprising: a first support member (110); a first element (120) located on the first support member (110); a movable component (130) capable of receiving mechanical action to generate a first displacement with respect to the first support member (110); and a second element (140) located on the movable component (130), wherein the second element (140) is located outside the element plane of the first element (120) under the working condition that the mechanical action is not applied; one of the first element (120) and the second element (140) is a magnetic resistor (140), and the other is a first current line (120); and a magnetic field applied to the magnetic resistor (140) by the first current line (120) varies with the first displacement, so that the resistance value of the magnetic resistor (140) varies, thereby generating a sensor signal. A microelectromechanical system mechanical sensor unit (600), comprising a unit housing (610), a microelectromechanical system mechanical sensor (620), and an integrated circuit chip (630); the microelectromechanical system mechanical sensor (620) and the integrated circuit chip (630) are disposed in the unit housing (610); the microelectromechanical system mechanical sensor (620) corresponds to an air inlet of the unit housing (610); circuits in the microelectromechanical system mechanical sensor (620), the integrated circuit chip (630), and the unit housing (610) are connected by means of a lead (640). An electronic device (700), comprising a microelectromechanical system mechanical sensor unit (710).
G01L 1/12 - Measuring force or stress, in general by measuring variations in the magnetic properties of materials resulting from the application of stress
G01L 9/14 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means involving the displacement of magnets, e.g. electromagnets
A micro-electro-mechanical system magnetoresistive sensor, a sensor unit and an electronic device. The micro-electro-mechanical system magnetoresistive sensor comprises: a first support member; a first magnetoresistor (42, 52) which is arranged on the first support member, a first pinning direction of the first magnetoresistor (42, 52) being an X direction; a second support member; a magnetic field forming unit (41, 51) which is arranged on the second support member and forms a magnetic field applied to the first magnetoresistor. Under the action of the physical quantity to be tested, the first support member moves relative to the second support member to generate a sensing signal. The second support member moves relative to the first support member in a Z direction. In a static work state, the magnetic field applied by the magnetic field forming unit (41, 51) to the first magnetoresistor (42, 52) has a bias magnetic field component in a Y direction.
patents
