Microneedle structure includes needle-shaped portions having hole portions formed therein and a base material having one surface side on which the needle-shaped portions are formed. Each of the needle-shaped portions is formed with a porous structure, and the value of tip strength of the needle-shaped portions is 40 mN or more. The method for producing a microneedle structure is used to produce the microneedle structure. Thus, it is possible to provide: a microneedle structure having needle-shaped portions that are suppressed in the defect or breakage during use; and a method for producing such a microneedle structure.
The present invention provides a label having excellent barrier property and transparency, wherein contamination of the container and adhesive residue due to the residual monomer in the adhesive layer are suppressed. The label is a label that is used for shrink-wrapping a container body of a resin container by wrapping around a barrel of the container body and heat-shrinking the shrinkable label, wherein the label comprises at least one heat shrinkable base material, a transparent vapor-deposited film consisting of an inorganic oxide, and an adhesive layer, and the adhesive layer comprises an adhesive composition comprising a triblock copolymer having a block structure of segment A1-segment B-segment A2.
A pellicle film has a porous structure. The pellicle film includes carbon nanotubes. The pellicle film has a first pellicle film surface and a second pellicle film surface on a side opposite to the first pellicle film surface, and a standard deviation of an orientation angle of the carbon nanotubes is 8.0 degrees or less, the standard deviation being determined based on an approximate ellipse of a power spectrum image acquired by subjecting an image obtained by imaging the first pellicle film surface or the second pellicle film surface of the pellicle film to two-dimensional Fourier transform.
G03F 1/64 - Pellicles or pellicle assemblies, e.g. having membrane on support framePreparation thereof characterised by the frames, e.g. structure or material thereof
G03F 1/70 - Adapting basic layout or design of masks to lithographic process requirements, e.g. second iteration correction of mask patterns for imaging
Provided is an adhesive which contains an oxygen absorbent and is used in optical applications. When a laminate obtained by bonding two 7.0 cm square soda-lime glass plates which has a thickness of 1.1 mm with an adhesive layer which is formed from the adhesive and has a thickness of 250 μm is placed under an endurance condition in which the laminate is put in an atmosphere at 170°C for 24 hours, there is no bubble at the edge of the laminate after the endurance condition, or when the laminate is placed under an endurance condition in which the laminate is put in an atmosphere at 170°C for 96 hours, the number of needle-shaped bubbles present at the edge of the laminate after the endurance condition is less than 5. This adhesive makes it possible to suppress the generation of needle-shaped bubbles at the edge of an optical member.
C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
C09J 11/00 - Features of adhesives not provided for in group , e.g. additives
C09J 133/04 - Homopolymers or copolymers of esters
C09J 133/10 - Homopolymers or copolymers of methacrylic acid esters
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
6.
BINDER FOR LITHIUM-ION BATTERY, AQUEOUS BINDER SOLUTION FOR LITHIUM-ION BATTERY, ELECTRODE SLURRY FOR LITHIUM-ION BATTERY, ELECTRODE FOR LITHIUM-ION BATTERY, AND LITHIUM-ION BATTERY
This binder for a lithium-ion battery contains a water-soluble polymer (A). The water-soluble polymer (A) contains, relative to all structural units in the water-soluble polymer (A), 5-80 mol% of a structural unit derived from a vinyl ether (a) having a hydroxypolyoxyalkylene chain including two or more C1-3 oxyalkylene units. Said binder is used for forming an electrode that includes an active material exhibiting a pH of 10 or more in an active-material aqueous dispersion as measured by a prescribed method.
H01M 4/505 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese of mixed oxides or hydroxides containing manganese for inserting or intercalating light metals, e.g. LiMn2O4 or LiMn2OxFy
H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
7.
BINDER FOR LITHIUM-ION BATTERY, AQUEOUS BINDER SOLUTION FOR LITHIUM-ION BATTERY, ELECTRODE SLURRY FOR LITHIUM-ION BATTERY, ELECTRODE FOR LITHIUM-ION BATTERY, AND LITHIUM-ION BATTERY
This binder for a lithium-ion battery contains a water-soluble polymer (A). The water-soluble polymer (A) contains, relative to all structural units in the water-soluble polymer (A), 5-50 mol% of a structural unit derived from a hydroxyl group-containing vinyl ether (a). Said binder is used for forming an electrode that includes an active material exhibiting a pH of 10 or more in an active-material aqueous dispersion as measured by a prescribed method.
H01M 4/505 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese of mixed oxides or hydroxides containing manganese for inserting or intercalating light metals, e.g. LiMn2O4 or LiMn2OxFy
H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
8.
COATING LAYER REMOVAL DEVICE AND COATING LAYER REMOVAL METHOD
A coating layer removal device 100 includes: a roll-out shaft 10 that rolls out a laminated film 90; a first backup roll 21 that contacts a base film of the laminated film 90 and transports the laminated film downstream; a first spray unit 31 that is disposed facing the first backup roll 21 and that includes one or more nozzles; a second spray unit 32 that is disposed downstream of the first spray unit, is disposed facing a second backup roll 22 and includes one or more nozzles; a pressurized water supply unit 50 that supplies pressurized water to the first spray unit 31 and the second spray unit 32; and a roll take-up shaft 40 that takes up the base film 91 into a roll shape after the coating layer has been removed. The pressurized water supply unit 50 includes one or more pumps.
Provided is a winding roll 1 in which a laminate film 90 includes: a release film including a base material film 91 and a release agent layer 92; and a ceramic green sheet including green sheet parts 931, 932. The green sheet parts 931, 932 are each arranged along a longitudinal direction of the laminate film 90. A recess 94 sandwiched by the green sheet parts 931, 932 is formed on the release agent layer 92. The laminate film 90 is wound around a shaft core 80 by traverse winding having a size of a swing width α. When viewed in a cross section orthogonal to the longitudinal direction of the laminate film 90, the size of the swing width α is, for example, greater than a width β1 from an edge end of the laminate film 90 on a first end part E1 side to an inner side of the first green sheet part 931.
This wiring sheet (100) comprises a wiring body (2) provided with electrically conductive linear bodies (21), and a pair of electrodes (4) that are in direct contact with the electrically conductive linear bodies (21), wherein the electrically conductive linear bodies (21) have an infrared reflectance of 0% to 90% inclusive at a wavelength of 1000 nm, and have a rate of change in resistance value of 50% or less after being allowed to stand for 1000 hours in a hot, humid environment at a temperature of 85°C and a relative humidity of 85% RH.
H05B 3/12 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
H05B 3/20 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
H05B 3/26 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
11.
PRESSURE-SENSITIVE ADHESIVE SHEET, LAMINATE, AND DEVICE
[Problem] To provide a pressure-sensitive adhesive sheet including a pressure-sensitive adhesive having excellent resistance to bleaching by humidity. [Solution] This pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive for bonding a first member to a second member, wherein the pressure-sensitive adhesive is a polyester-based pressure-sensitive adhesive containing a surfactant. The pressure-sensitive adhesive has a gel content of preferably 60% or less. The polyester-based pressure-sensitive adhesive preferably has a crosslinking structure including at least a polyester-based polymer and a crosslinking agent.
C09J 167/00 - Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chainAdhesives based on derivatives of such polymers
12.
WINDOW FILM AND METHOD FOR MANUFACTURING FRONT WINDOW EQUIPPED WITH WINDOW FILM
Provided is a window film having a high heat-insulating performance that is capable of suppressing the occurrence of wrinkles in a resin film when forming a hard coat layer and of following the shape of an adherend at the time of sticking. A window film (1) has a resin film (10) and a hard coat layer (11) disposed on one main surface of the resin film (10). Assuming that the shrinkage rate in an MD direction of the resin film (10) when the resin film (10) is held at 180°C for 5 minutes is A% and that the shrinkage rate in a CD direction is B%, A-B is 0.4% or more. The hard coat layer (11) contains tin-doped indium oxide.
[Problem] To provide a window film that, despite including a transparent resin film, achieves visibility with respect to an outside light source and the property of making it impossible to see an inside part. [Solution] A window film comprising a transparent resin film and a colored adhesive layer which is disposed on one main surface of the resin film, said window film exhibiting total light transmittance of not more than 70% and a haze value of not more than 5%.
Disclosed are: a method for producing a silane compound polymer, the method including a step in which a trifunctional alkoxysilane compound represented by formula (a-1) R133 (wherein R1 represents a hydrogen atom, an unsubstituted hydrocarbon group, or a hydrocarbon group having a substituent, each OR represents an alkoxy group, and OR may be the same as or different from each other) is hydrolyzed and polycondensed in the presence of a solvent that satisfies the requirements 1 and 2 described below; and a method for producing a semiconductor insulating film forming agent. Requirement 1: The solvent is azeotropic with water. Requirement 2: The solvent is a polyether-based solvent.
3/23/2 , and repeating units [repeating units (2)] represented by formula (a-2) (a-2) R13/23/2 [R1 represents an unsubstituted C6-12 aryl group or a C6-12 aryl group having a substituent]; a semiconductor insulating material comprising the silane compound polymer; and a semiconductor insulating film-forming agent containing the silane compound polymer.
3/23/2 [Me represents a methyl group], and repeating units [repeating units (2)] represented by formula (a-2) (a-2) R13/23/2 [R1 represents an unsubstituted C6-12 aryl group or a C6-12 aryl group having a substituent], wherein the weight average molecular mass (Mw) is 1,500 or more. The present invention further provides a semiconductor insulating material comprising the silane compound polymer, and a semiconductor insulating film-forming agent containing the silane compound polymer.
[Problem] To provide a window film that is suitable for high-mix low-volume production and demonstrates concealing properties as well as visibility of external light sources. [Solution] This window film has a transparent first resin film, a transparent second resin film, and a colored intermediate layer. The intermediate layer is disposed between one main surface of the first resin film and one main surface of the second resin film. The window film has a total light transmittance of 60% or less and a haze value of 8% or less.
A pellicle film having a porous structure includes carbon nanotubes. The pellicle film has a first pellicle film surface and a second pellicle film surface on a side opposite to the first pellicle film surface, a visible light transmittance calculated by a numerical formula (Numerical Formula 1) below is in a range from 60% to 85%, and a standard deviation of the visible light transmittance is 0.56% or less.
A pellicle film having a porous structure includes carbon nanotubes. The pellicle film has a first pellicle film surface and a second pellicle film surface on a side opposite to the first pellicle film surface, a visible light transmittance calculated by a numerical formula (Numerical Formula 1) below is in a range from 60% to 85%, and a standard deviation of the visible light transmittance is 0.56% or less.
T={(Tp−Td)/(Tb−Td)}×100 (Numerical Formula 1)
A pellicle film having a porous structure includes carbon nanotubes. The pellicle film has a first pellicle film surface and a second pellicle film surface on a side opposite to the first pellicle film surface, a visible light transmittance calculated by a numerical formula (Numerical Formula 1) below is in a range from 60% to 85%, and a standard deviation of the visible light transmittance is 0.56% or less.
T={(Tp−Td)/(Tb−Td)}×100 (Numerical Formula 1)
(In the numerical formula (Numerical Formula 1), T represents a visible light transmittance of the pellicle film, Tp represents a pixel value in the image of the pellicle film in the light-transmitting state, Tb represents a pixel value in the image of the image-capturing position in the bright state, and Td represents a pixel value in the image of the image-capturing position in the dark state.)
Provided is a thermoelectric conversion module including a release sheet in which thermoelectric performance is not suppressed, a function as a support base material during a manufacturing process is provided and deformation and damage during conveyance and handling are suppressed. The thermoelectric conversion module includes: a thermoelectric element layer in which a P-type thermoelectric element and an N-type thermoelectric element are arranged alternately and electrically connected in series; a first conductive layer provided on a first surface of the thermoelectric element layer; a first pressure sensitive adhesive layer provided on a surface of the first conductive layer on a side opposite to a surface on the thermoelectric element layer side; and a first release sheet provided on a surface of the first pressure sensitive adhesive layer on a side opposite to a surface on the first conductive layer side. A curvature of the first release sheet is R1000 or greater when the first release sheet is cut to a length of 250 mm and suspended at a center in a length direction.
B32B 3/08 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
B32B 3/30 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
B32B 7/06 - Interconnection of layers permitting easy separation
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
B32B 15/09 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyesters
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
This method for using a degradable film comprises: a step for preparing a degradable film containing an aliphatic polycarbonate and an acid/base generator that generates an acid or a base due to energy ray irradiation, the adhesive resin content of said degradable film other than the aliphatic polycarbonate being 10 mass% or less; an exposure step for exposing the entire surface of the degradable film or a portion thereof in plan view with an energy beam; and a decomposition step for heating the degradable film and decomposing the entire surface of the degradable film or the portion thereof in plan view. According to the aforementioned method for using the degradable film, the degradable film can easily be decomposed.
This binder for firing contains an aliphatic polycarbonate that has a carbonate structure in a main chain and has a hydrocarbon group having 2-8 carbon atoms in a side chain. The aliphatic polycarbonate preferably has a structural unit represented by general formula (1a). In the formula, R1, R2, R3, and R4 are each independently a hydrogen atom or a hydrocarbon group, and at least one thereof is a hydrocarbon group having 2-8 carbon atoms. By using the above binder for firing, solid matter of a carbon compound derived from the binder does not remain in a sintered body, carbon dioxide can be used as a production raw material, carbon dioxide is not substantially discharged during firing, and adhesion to metal is high.
BINDER FOR LITHIUM-ION BATTERY, AQUEOUS BINDER SOLUTION FOR LITHIUM-ION BATTERY, ELECTRODE SLURRY FOR LITHIUM-ION BATTERY, ELECTRODE FOR LITHIUM-ION BATTERY, AND LITHIUM-ION BATTERY
This binder for a lithium-ion battery contains a water-soluble polymer (A). The water-soluble polymer (A) contains a structural unit derived from a hydroxyl-group-containing vinyl ether (a), and a structural unit derived from an ethylenically unsaturated monomer (b) having a sulfonic acid group or a salt thereof. The amount of the structural unit derived from the hydroxyl-group-containing vinyl ether (a) contained in the water-soluble polymer (A) is 5-80 mol% in all structural units of the water-soluble polymer (A), and the amount of the structural unit derived from the ethylenically unsaturated monomer (b) having the sulfonic acid group or a salt thereof in the water-soluble polymer (A) is 5-30 mol% in all structural units of the water-soluble polymer (A).
BINDER FOR LITHIUM-ION BATTERY, AQUEOUS BINDER SOLUTION FOR LITHIUM-ION BATTERY, ELECTRODE SLURRY FOR LITHIUM-ION BATTERY, ELECTRODE FOR LITHIUM-ION BATTERY, AND LITHIUM-ION BATTERY
This binder for a lithium-ion battery contains a water-soluble polymer (A). The water-soluble polymer (A) contains, relative to all structural units in the water-soluble polymer (A), 5-80 mol% of a structural unit derived from a hydroxyl group-containing vinyl ether (a). The viscosity of an aqueous solution containing 13 mass% of the water-soluble polymer (A) as measured by a B-type viscometer at 23°C is 3,000 mPa·s or more. Said binder is used for forming an electrode that includes an active material exhibiting a pH of 10 or more in an active-material aqueous dispersion as measured by a prescribed method.
H01M 4/505 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese of mixed oxides or hydroxides containing manganese for inserting or intercalating light metals, e.g. LiMn2O4 or LiMn2OxFy
H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
24.
ADHESIVE SHEET, METHOD FOR PRODUCING SAME, AND OPTICAL LAMINATE
The present invention pertains to an adhesive sheet that is characterized by having a substrate layer and an adhesive agent layer, and that is characterized in that the thickness of the adhesive agent layer is 100 μm or more, and the adhesive agent layer is formed from an adhesive agent that exhibits, when an adhesive agent layer having a thickness of 500 μm is obtained, a chromaticity b*value of -3.0 or more stipulated by the CIE1976L*a*b* color system in a reflection mode of the adhesive agent layer. The present invention also pertains to: a method for producing the adhesive sheet; and an optical laminate provided with the adhesive sheet. The present invention provides: an adhesive sheet that improves, when an adhesive sheet having a thick adhesive agent layer is applied to the outermost surface of an optical laminate, the phenomenon in which the optical laminate appears bluish white; a method for producing the adhesive sheet; and an optical laminate comprising the adhesive sheet.
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
The present invention provides a thermoelectric conversion material layer having improved electrical conductivity and high thermoelectric performance. Provided is a thermoelectric conversion material layer comprising thermoelectric semiconductor particles and monometallic particles, wherein, in a longitudinal cross-section that includes the center part of the thermoelectric conversion material layer, the area ratio of a region occupied by the monometallic particles to a region occupied by the thermoelectric semiconductor particles and the monometallic particles is 1-50%.
Provided are: a curable composition comprising the following component (A) and component (B), wherein the total amount of the component (A) and the component (B) is at least 98 mass% with respect to the total amount of the curable composition; and a semiconductor insulating film-forming agent. The (A) component is a silane compound polymer having a repeating unit [repeating unit (1)] represented by formula (a-1) [R1represents a fluoroalkyl group] and a repeating unit [repeating unit (2)] represented by formula (a-2) [R2 represents an unsubstituted hydrocarbon group or a hydrocarbon group (excluding a fluoroalkyl group) having a substituent, wherein the amount of the repeating unit (1) is at least 40 mol% with respect to the total amount of the repeating unit (1) and the repeating unit (2). (B) is a solvent.
C08L 83/08 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
C08G 77/24 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen halogen-containing groups
H01L 21/316 - Inorganic layers composed of oxides or glassy oxides or oxide-based glass
27.
CURABLE COMPOSITION AND SEMICONDUCTOR INSULATING FILM FORMING AGENT
Provided are a curable composition and a semiconductor insulating film forming agent, the curable composition containing component (A) and component (B) and having a viscosity of 1,000 mPa·s or less at 23°C. Component (A): A silane compound polymer having a repeating unit [repeating unit (1)] represented by formula (a-1) (a-1): R13/23/2 [R1 represents a hydrogen atom, an unsubstituted hydrocarbon group, or a hydrocarbon group having a substituent.] Component (B): A solvent satisfying requirements 1 and 2 Requirement 1: A solvent azeotropic with water. Requirement 2: A polyether-based solvent.
This binder for firing contains an aliphatic polycarbonate having a carbonate structure in a main chain and a hydrocarbon group having 2-8 carbon atoms in a side chain. The aliphatic polycarbonate has a weight average molecular weight of 50,000-170,000 inclusive. The aliphatic polycarbonate preferably has a structural unit represented by general formula (1a). In the formula, R1, R2, R3and R4 are each independently a hydrogen atom or a hydrocarbon group, and at least one thereof is a hydrocarbon group having 2-8 carbon atoms. According to the binder for firing, the solid matter of the carbon compound derived from the binder does not remain in a sintered product, carbon dioxide can be used as a production raw material, carbon dioxide is not substantially discharged during firing, and adhesion to metal is high.
A pressure sensitive adhesive composition containing a multimer of modified cyclodextrin; a pressure sensitive adhesive obtained from the pressure sensitive adhesive composition; and a pressure sensitive adhesive sheet having a pressure sensitive adhesive layer formed of the pressure sensitive adhesive. The multimer of modified cyclodextrin is preferably a dimer. The pressure sensitive adhesive is preferably an acrylic-based pressure sensitive adhesive and, in particular, preferably contains a crosslinked product obtained by crosslinking a (meth)acrylic ester polymer using a crosslinker.
Provided is a workpiece processing sheet comprising: a release sheet having a release agent layer on one surface side of glassine paper; and a work attachment layer laminated on a surface of the release agent layer on the opposite side to the glassine paper. The workpiece processing sheet can greatly contribute to reducing carbon dioxide emissions and decreasing the use of plastic materials.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 7/00 - Adhesives in the form of films or foils
C09J 7/40 - Adhesives in the form of films or foils characterised by release liners
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
31.
ADHESIVE FOR HIGH-FREQUENCY DIELECTRIC HEATING AND STRUCTURE
An adhesive (1A) for high-frequency dielectric heating contains: (A) a thermoplastic resin containing a styrene-based thermoplastic elastomer (a1) and a thermoplastic resin (a2) other than the styrene-based thermoplastic elastomer (a1); and (B) a dielectric filler. The content of the styrene component with respect to the entirety of the thermoplastic resin (A) is 20.0-45.0 mass%, the storage elastic modulus in an environment at 110°C is 300 MPa or more, and the complex viscosity at a shear rate of 600 rad/s in an environment of 220°C is 350Pa·s or less.
C09J 123/00 - Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondAdhesives based on derivatives of such polymers
32.
ADHESIVE SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR PEELING OBJECT FROM ADHESIVE SHEET
The present invention makes it possible for an object that is being held on an adhesive sheet provided with an adhesive layer having protrusions and recessions on the surface thereof to be picked up by means of a milder operation. The adhesive sheet comprises a base material, and an adhesive layer that has protrusions and recessions on the front surface thereof. The adhesive layer has a polymer having an energy ray-curable group.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 133/04 - Homopolymers or copolymers of esters
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
C09J 201/02 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
33.
ADHESIVE SHEET AND METHOD FOR PEELING OBJECT FROM ADHESIVE SHEET
The present invention facilitates the pick up of an object held on an adhesive sheet having an adhesive layer comprising protrusions and recesses on the surface thereof. This adhesive sheet comprises a base material, and an adhesive layer that has protrusions and recesses on the surface thereof. The adhesive sheet can be extended in the surface direction. When the adhesive sheet is attached to an object, the bonding area ratio of the adhesive sheet to the object is 4%-60%.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 133/04 - Homopolymers or copolymers of esters
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
C09J 201/02 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
34.
ADHESIVE SHEET AND METHOD FOR PEELING OBJECT FROM ADHESIVE SHEET
The present invention suppresses the deformation of protrusions and recesses on the surface of an adhesive layer when an object is attached to the adhesive layer. This adhesive sheet comprises a base material, and an adhesive layer that has protrusions and recesses on the surface thereof. The gel fraction of the adhesive layer is 90%-100%.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 133/04 - Homopolymers or copolymers of esters
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
C09J 201/02 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
35.
METHOD OF PRODUCING AN ADHESIVE SHEET OR A RELEASE LINER
A release liner which makes it difficult for an adhesive layer to impair slidability and makes it easy to exhibit an adhesive force suitably, a method of producing a release liner, an adhesive sheet, and a method of producing an adhesive sheet. A release liner has a surface provided with a ridge portion extending linearly, and on the surface, a plurality of recesses having different depths are randomly formed in a surface direction and are continuously connected.
The present invention makes it possible for an object held on an adhesive sheet provided with an adhesive layer having protrusions and recesses on the surface thereof to be picked up by means of a milder operation. This adhesive sheet comprises a base material, and an adhesive layer that has protrusions and recesses on the surface thereof. The adhesive layer has energy ray reactivity, and the value of (loss tangent (tanδ) at 50° C) / (tanδ at 30° C) of the adhesive layer after energy ray irradiation is 1.30 or more.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 133/04 - Homopolymers or copolymers of esters
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
C09J 201/02 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
37.
ADHESIVE SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR PEELING OBJECT FROM ADHESIVE SHEET
The present invention makes it possible for an object held on an adhesive sheet provided with protrusions and recesses on the surface thereof to be picked up by means of a milder operation. This adhesive sheet comprises a base material, and an adhesive layer that has protrusions and recesses on the surface thereof. The adhesive layer contains an acrylic acid ester copolymer, and the copolymerization ratio of an energy ray-curable group-containing monomer in the acrylic acid ester copolymer is 20%-50%.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 133/04 - Homopolymers or copolymers of esters
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
C09J 201/02 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
38.
METHOD FOR PEELING OBJECT FROM ADHESIVE SHEET AND METHOD FOR MANUFACTURING ARTICLE
The present invention makes it possible for an object that is being held on an adhesive sheet provided with an adhesive layer having protrusions and recessions on the surface thereof to be picked up by means of a milder operation. Provided is a method for peeling an object from an adhesive sheet that comprises a base material and an energy reactive adhesive layer having protrusions and recessions on the surface thereof, the adhesive sheet holding the object on the adhesive layer. Energy is applied to the adhesive sheet. The adhesive sheet is expanded in the plane direction. The object is peeled from the adhesive layer of the adhesive sheet after energy has been applied and the sheet has been expanded in the plane direction.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 133/04 - Homopolymers or copolymers of esters
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
C09J 201/02 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
39.
SEMICONDUCTOR DEVICE AND COMPOSITION FOR FORMING BACK SURFACE PROTECTIVE FILM
This semiconductor device comprises a semiconductor substrate, a back surface protective film that protects the back surface of the semiconductor substrate, and a forgery prevention layer that is provided on the back surface protective film and contains a pattern-forming substance that forms an authenticity-determining pattern, wherein the back surface protective film contains an inorganic pigment.
The present invention provides a semiconductor device comprising a semiconductor substrate, a protective layer that protects the semiconductor substrate, and anti-counterfeit layer provided on the protective layer. The anti-counterfeit layer includes a pattern-forming substance that forms a pattern for determining the authenticity of the semiconductor device. The protective layer contains a spherical filler.
NATIONAL UNIVERSITY CORPORATION KOBE UNIVERSITY (Japan)
Inventor
Takano, Ken
Matsuno, Sayaka
Sugimoto, Hiroshi
Fujii, Minoru
Abstract
A composition for a forgery prevention layer for forming a forgery prevention layer in a semiconductor device includes pattern formation particles formed by an inorganic material having a refractive index n of 3 or more.
An LED lamp (1) that can be used in a low-temperature environment, comprising: an LED lamp unit (2) that has an LED element; a housing (3) that houses the LED lamp unit (2); and a transparent cover member (4) that transmits light from the LED lamp unit (2). The LED lamp (1) is also provided with an infrared absorption member (infrared absorption layer (6)) that absorbs infrared rays from the LED lamp unit (2) and generates heat, at a position at which heat generated by the infrared absorption member (infrared absorption layer (6)) is conducted to the transparent cover member (4). The LED lamp (1) makes it possible to heat the transparent cover member (4) and solve problems resulting from use in a low-temperature environment.
A LED lamp 1 that may be used in a low-temperature environment comprises: an LED lamp unit 2 having an LED element; a housing 3 that houses the LED lamp unit 2; and a transparent cover member 4 that transmits light from the LED lamp unit 2, an infrared absorbing member (infrared absorbing layer 6) that absorbs infrared rays from the LED lamp unit 2 and generates heat being provided at a position where heat generated by the infrared absorbing member (infrared absorbing layer 6) is conducted to the transparent cover member 4. According to this LED lamp 1, the transparent cover member 4 can be heated, and problems encountered in low-temperature environments can be overcome.
F21S 45/60 - Heating of lighting devices, e.g. for demisting
F21S 41/148 - Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
An LED lamp (1) that can be used in a low-temperature environment comprises: an LED lamp unit (2) having an LED element; a housing (3) that houses the LED lamp unit (2); a transparent cover member (4) that transmits light from the LED lamp unit (2); and a film heater (6). The film heater (6) is provided at a position at which heat generated by the film heater (6) is conducted to the transparent cover member (4). According to the LED lamp (1), ice, snow, and water droplets adhered to the transparent cover member (4) can be removed.
This mid-air image formation device 10a, 10b comprising a display part 1, a light transmission and image formation part 3, a light diffusion control part 2, and an adhesion layer 4, wherein the light transmission and image formation part 3 transmits light originating from the display part 1 and forms an image at a position on the surface side opposite from the display part 1, the light diffusion control part 2 diffuses or transmits light incident on the inside of the light diffusion control part 2 depending on the incident angle thereof, and has a louver-shaped regular internal structure comprising, within a region having a relatively low refractive index, a plurality of plate-shaped regions each having a relatively high refractive index, and the adhesion layer 4 comprises any one of an adhesive, a pressure-sensitive adhesive, and a hardenable pressure-sensitive adhesive, and the number of acidic groups present in the adhesion layer 4 with respect to all components constituting the adhesion layer 4 is 0.050 mmol/g or less. This mid-air image formation device 10a, 10b has excellent durability and makes it possible to satisfactorily view a mid-air image.
G02B 30/56 - Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images the image being built up from image elements distributed over a 3D volume, e.g. voxels by projecting aerial or floating images
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
The present invention provides an aerial image forming device 10a, 10b, 10c comprising: a display part 1 which has a display surface and emits light from the display surface; a light transmission and image formation part 2 which is arranged on the display surface side of the display part 1, transmits the light, and forms an image at a position on a surface side opposite to the display part 1; and a coat layer 3 which is laminated on the light transmission and image formation part 2, on the surface side opposite to the display part 1, and contains a plasticizer. The aerial image forming device 10a, 10b, 10c has excellent antifouling properties, and the visibility of an aerial image is improved.
G02B 30/56 - Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images the image being built up from image elements distributed over a 3D volume, e.g. voxels by projecting aerial or floating images
This operation detection device includes an operation detection unit that detects operation information relating to a part of a user in order to convert the operation information into an operation command corresponding to a device by an operation detection member attached to said part, the part being a body port that can be bent/stretched, the device being subject to an operation. Accordingly, operation information relating to a part of a user can be intuitively converted into an operation command corresponding to a device subject to an operation.
The present invention provides an aerial image forming device 10a, 10b comprising: a display unit 1 which has a display surface and which emits light from the display surface; a light-transmissive image forming unit 2 which is disposed on the display-surface side of the display unit 1, transmits the light, and causes an image to be formed at a position on the opposite side of the display unit 1; and an antistatic layer 3 containing an antistatic agent and laminated on the surface of the light-transmissive image forming unit 2 that is on the display unit 1 side or on the surface of the light-transmissive image forming unit 2 that is on the side opposite from the display unit 1. The aerial image forming device 10a, 10b has excellent antistatic properties and excellent visibility.
G02B 30/56 - Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images the image being built up from image elements distributed over a 3D volume, e.g. voxels by projecting aerial or floating images
A film for latex ink including a latex ink-receiving layer achieving excellent ink adhesion and excellent scratch resistance. A film having a laminate structure in which a latex ink-receiving layer and a substrate are layered, and the latex ink-receiving layer formed from a resin composition containing an acrylic resin having a cross-linkable functional group, a specific cross-linking agent, an ultraviolet curable acrylate compound, and a photopolymerization initiator.
C08J 7/043 - Improving the adhesiveness of the coatings per se, e.g. forming primers
B41M 5/00 - Duplicating or marking methodsSheet materials for use therein
B41M 5/50 - Recording sheets characterised by the coating used to improve ink, dye or pigment receptivity, e.g. for ink-jet or thermal dye transfer recording
An electromagnetic wave absorption member (1) has a resistance layer (10), a spacer layer (20), and a reflection layer (30). The resistance layer (10), the spacer layer (20), and the reflection layer (30) are laminated in this order. The resistance layer (10) has a conductor pattern (11). The conductor pattern (11) is embedded in the spacer layer (20) in a surface (20a) that is on the reverse side from a surface (20b) facing the reflection layer (30).
An electromagnetic wave absorption member (1) having a resistive layer (10), a spacer layer (30), and a reflective layer (40), wherein the resistive layer (10), the spacer layer (30), and the reflective layer (40) are laminated in that order, the spacer layer (30) includes a thermoplastic resin, a high-permittivity material, and a conductive material, and the relative permittivity of the spacer layer (30) is 5 or greater.
Provided is a semiconductor device manufacturing apparatus capable of verifying a semiconductor device by using a new verification technique. The semiconductor device manufacturing apparatus includes: a sticking means 10 that sticks a coating material AS containing a filler FL to a semiconductor body WF to form a semiconductor device SD; and a first image forming means 30 that images the coating material AS of the semiconductor device SD to form a first image PT1. The first image forming means 30 includes: a first image forming device 31 that forms the first image PT1 by capturing a unique feature appearing in the coating material AS due to the filler FL contained in the coating material AS; and an image output device 32 that outputs the first image PT1 to a verification device 50 that verifies the semiconductor device SD. Drawing_references_to_be_translated:
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
53.
ADHESIVE SHEET FOR WORKPIECE PROCESSING AND METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Provided are: an adhesive sheet for workpiece processing, the adhesive sheet having a buffer layer, a substrate, and an adhesive layer, wherein the buffer layer contains a cured product of a thermosetting resin composition; and a method for manufacturing an electronic device using said adhesive sheet for workpiece processing.
C09J 7/25 - PlasticsMetallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
An electromagnetic wave absorbing member (1) has a resistance layer (10), a spacer layer (30), and a reflection layer (40). The resistance layer (10), the spacer layer (30), and the reflection layer (40) are stacked in this order. The resistance layer (10) has three or more conductor patterns (12) having differing sizes in plan view. When the difference between the maximum length L1 of the largest pattern in the conductor patterns (12) and the maximum length L3 of the smallest pattern therein is defined as ΔL, there stands ΔL/L1 > 0.34; the thickness of the spacer layer (30) is 400 μm or less; and the dielectric constant of the spacer layer (30) is 5 or more.
Projection screen (1) includes a light diffusion control film (10) having an incident light diffusion angle region. When the projection screen (1) is installed vertically to the ground surface, the incident light diffusion angle region in an up-down direction does not include a front face 0° in the horizontal direction with respect to the ground surface, and the haze value at the above front face 0° is 1% or more and 80% or less. According to the projection screen (1), it is possible to suppress unwanted reflection of images projected from a projector onto those other than the projection screen.
A projection screen (1) comprising: a first light-scattering layer (11); a light diffusion control layer (10) laminated on one surface side of the first light-scattering layer (11), the light diffusion control layer (10) having a regular internal structure comprising a plurality of regions having a relatively high refractive index in a region having a relatively low refractive index; and a second light-scattering layer (12) laminated on a surface side of the light diffusion control layer (10) opposite to the first light-scattering layer (11). The projection screen (1) exhibits excellent visibility while suppressing unwanted reflection of images projected from the projector onto those other than the projection screen (1).
This release sheet comprises a base material and a release agent layer provided on at least one side of the base material, wherein: the release agent layer is formed from a release agent composition containing (A) an alicyclic epoxy group-containing cyclic siloxane compound, (B) a carbinol-modified polyorganosiloxane, and (C) an acid catalyst; and the blending amount of the carbinol-modified polyorganosiloxane (B) with respect to 100 parts by mass of the alicyclic epoxy group-containing cyclic siloxane compound (A) is 3-15 parts by mass. According to said release sheet, a silicone component hardly migrates from the release agent layer, and the release force can be set low.
This method comprises: a step for preparing a first board having a first main surface and a second main surface, with a thermoelectric element bonded to the first main surface; a step for applying a bonding material to a prescribed position on a third main surface of a second board having the third main surface and a fourth main surface; a step for aligning the thermoelectric element and the bonding material by disposing the first board on top of the second board, which has been placed so that the fourth main surface is in contact with a bearing surface of a jig, so that the first main surface faces the second board; and a step for bringing the thermoelectric element and the bonding material into contact with each other to bond the first board and the second board to each other via the thermoelectric element and the bonding material.
A processing method of a workpiece capable of reducing Total Thickness Variation (TTV) of the workpiece includes adhering a front surface protection sheet on a front surface of a workpiece having the front surface and a back surface; grinding the back surface of the workpiece on which the front surface protection sheet is adhered; wherein the front surface of the workpiece has bump electrodes, a raised pattern has been formed along an outer circumference part on the front surface of the workpiece which is an area different from an area where the bump electrodes are formed when adhering the front surface protection sheet, the front surface protection sheet is adhered on the front surface of the workpiece so as to embed the bump electrodes, and a height Hb of each of the bump electrodes and a height H1 of the raised pattern satisfy Hb/8
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
60.
PROTECTIVE FILM-EQUIPPED WRITING-PERFORMANCE ENHANCEMENT FILM
Provided is a protective film-equipped writing feel improving film which is formed by laminating a protective film on at least one surface of a writing feel improving film having a writing feel improving film base material layer and a writing feel improving layer, in which given that a linear expansion coefficient of the writing feel improving film is α (×10−5/K) and a linear expansion coefficient of the protective film is β (×10−5/K), the following formula is satisfied: −6.5<(α−β)<6.5. According to the disclosure, there is provided a protective film-equipped writing feel improving film, which does not curl even due to temperature changes during storage, transportation, processing, and the like and maintains the quality of the writing feel improving film.
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 33/00 - Layered products characterised by particular properties or particular surface features, e.g. particular surface coatingsLayered products designed for particular purposes not covered by another single class
61.
WRITING FEELING IMPROVEMENT FILM WITH PROTECTION FILM
According to the present disclosure, provided is a protective film-equipped writing feel improving film which is formed by laminating a writing feel improving film having a writing feel improving film base material layer and a writing feel improving layer with a protective film having an adhesive layer and a protective film base material layer, thereby allowing the writing feel improving layer of the writing feel improving film and the adhesive layer of the protective film to be in contact with each other, in which a ratio of a maximum height of rolling circle waviness profile (WEM) of the writing feel improving layer to a thickness a (μm) of the adhesive layer (WEM/a) is 0.01 to 1.00, and even with temperature changes occurring during storage, transportation, processing, or the like, lifting or peeling off does not occur, allowing the quality of the writing feel improving film to be maintained.
G06F 3/039 - Accessories therefor, e.g. mouse pads
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
An energy-ray-crosslinkable pressure-sensitive adhesive composition may contain a (meth)acrylic resin (A) having no energy ray crosslinkability and an acrylic resin (B) having energy ray crosslinkability. A pressure-sensitive adhesive sheet may use such a energy-ray-crosslinkable pressure-sensitive adhesive composition. A crosslinked pressure-sensitive adhesive may be obtained by subjecting the energy-ray-crosslinkable pressure-sensitive adhesive composition to energy ray crosslinking. A pressure-sensitive adhesive sheet may use the crosslinked pressure-sensitive adhesive.
Provided is a new method by which it is easier to remove an element after processing, so as to improve productivity in manufacturing an electronic component or a semiconductor device. An object to be processed used in manufacturing an electronic component or a semiconductor device is attached to an uneven surface of a pressure sensitive adhesive layer. The object to be processed on the pressure sensitive adhesive layer is processed to obtain a processed product. The processed product is removed from the pressure sensitive adhesive layer.
An element transfer sheet is provided. The element transfer sheet includes a base material and a pressure sensitive adhesion layer having unevenness on the surface. A tensile stress in the first direction of the base material at 100% elongation is larger than a tensile stress in the second direction orthogonal to the first direction. The tensile stress in the first direction is 12 MPa or more, and the tensile stress in the second direction is 9 MPa or more.
A pressure sensitive adhesive sheet includes a base material and a pressure sensitive adhesion layer having unevenness on the layer surface. The pressure sensitive adhesion layer includes an underlying base constituted by a part from a concave portion where, in the thickness direction of the pressure sensitive adhesion layer, a thickness of the pressure sensitive adhesion layer is smallest, to a face on the opposite side of the surface with the unevenness, and a convex portion provided on the underlying base. The pressure sensitive adhesion layer satisfies Relational Expression (1) given below.
A pressure sensitive adhesive sheet includes a base material and a pressure sensitive adhesion layer having unevenness on the layer surface. The pressure sensitive adhesion layer includes an underlying base constituted by a part from a concave portion where, in the thickness direction of the pressure sensitive adhesion layer, a thickness of the pressure sensitive adhesion layer is smallest, to a face on the opposite side of the surface with the unevenness, and a convex portion provided on the underlying base. The pressure sensitive adhesion layer satisfies Relational Expression (1) given below.
0
.
2
5
<
S
/
H
<
4
.
7
5
Relational
Expression
(
1
)
A pressure sensitive adhesive sheet includes a base material and a pressure sensitive adhesion layer having unevenness on the layer surface. The pressure sensitive adhesion layer includes an underlying base constituted by a part from a concave portion where, in the thickness direction of the pressure sensitive adhesion layer, a thickness of the pressure sensitive adhesion layer is smallest, to a face on the opposite side of the surface with the unevenness, and a convex portion provided on the underlying base. The pressure sensitive adhesion layer satisfies Relational Expression (1) given below.
0
.
2
5
<
S
/
H
<
4
.
7
5
Relational
Expression
(
1
)
(In Relational Expression (1), S represents a thickness of the underlying base, and H represents a height of the convex portion.)
C09J 151/00 - Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsAdhesives based on derivatives of such polymers
66.
ADHESIVE SHEET AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR SEMICONDUCTOR DEVICE
Provided is a new method by which it is easier to remove an element after processing, so as to improve productivity in manufacturing an electronic component or a semiconductor device. An object to be processed used in manufacturing an electronic component or a semiconductor device is attached to an uneven surface of a pressure sensitive adhesive layer. The object to be processed on the pressure sensitive adhesive layer is processed to obtain a processed product. The processed product is removed from the pressure sensitive adhesive layer.
C09J 7/10 - Adhesives in the form of films or foils without carriers
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
67.
PRESSURE SENSITIVE ADHESIVE SHEET AND METHOD FOR PRODUCING ELECTRONIC COMPONENT OR SEMICONDUCTOR DEVICE
A pressure sensitive adhesive sheet includes a pressure sensitive adhesive layer catching elements distant from a holding substrate. The pressure sensitive adhesive layer has unevenness on a surface and having a complex shear elastic modulus at 23° C. of 0.001 MPa or greater and 1.0 MPa or less.
C09J 7/10 - Adhesives in the form of films or foils without carriers
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
68.
SEMICONDUCTOR DEVICE PRODUCTION METHOD AND SEMICONDUCTOR DEVICE
Provided is a semiconductor device production method that makes it possible to produce a compact semiconductor device, wherein performed are: a coating material preparation step 10 for preparing a coating material AS which is for coating a semiconductor body WF; an identification member preparation step 20 for preparing an identification member WK in which an identifier ID is formed; and a layering step 50 for layering the identification member WK on the semiconductor body WF with the coating material AS therebetween, to form a semiconductor device SD. In the coating material preparation step 10, prepared as the coating material AS is a material that is capable of bonding to both the semiconductor body WF and the identification member WK. In the layering step 50, the identification member WK is layered on the semiconductor body WF in a state in which the identification member WK is in direct contact with the coating material AS.
An adhesive according to the present invention contains an oxygen absorbent and is to be used for optical purposes. The adhesive is such that, when a laminate obtained by bonding two 7.0 cm squared soda-lime glass panels having a thickness of 1.1 mm by using a 250 μm-thick adhesive layer formed from the adhesive is placed in a 140°C atmosphere under persistent conditions for 100 hours of insertion, the absolute value of the ratio of b*2 to b*1 is 4.5 or less when b*1 is the chromaticity b*, as defined by the CIE 1976 L*a*b* color space, of the adhesive layer before the persistent conditions, and b*2 is the chromaticity b*, as defined by the CIE 1976 L*a*b* color space, of the adhesive layer at an end of the laminate after the persistent conditions. The adhesive enables suppression of yellowing at the ends of an optical member.
Provided are a thinner thermoelectric conversion module in which a thermistor for temperature detection is embedded inside a substrate included in the thermoelectric conversion module, and a method for manufacturing the thermoelectric conversion module. The thermoelectric conversion module includes a first substrate having a first principal surface and a second principal surface opposite to the first principal surface, a second substrate having a third principal surface facing the second principal surface and a fourth principal surface opposite to the third principal surface, a first electrode provided on the second principal surface, a second electrode provided on the third principal surface, a P-type thermoelectric element layer and an N-type thermoelectric element layer sandwiched between the first electrode and the second electrode and arrayed along the second principal surface and the third principal surface, and a thermistor for temperature detection embedded inside the first substrate and/or the second substrate, and current-carrying electrodes that energize the thermistor are located on at least one of the first principal surface, the second principal surface, the third principal surface, or the fourth principal surface.
H10N 10/17 - Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
G01K 7/22 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a non-linear resistance, e.g. thermistor
A pressure sensitive adhesive sheet, including a laminate of: a substrate; and a pressure sensitive adhesive layer, where the substrate is formable by irradiating a resin film including a polymer and a hydrogen abstraction type photoinitiator with an energy ray, where the hydrogen abstraction type photoinitiator is capable of abstracting a hydrogen from the polymer, the pressure sensitive adhesive layer is formable by irradiating an energy ray-crosslinkable pressure sensitive adhesive composition layer including an energy ray-crosslinkable pressure sensitive adhesive composition with an energy ray, and the laminate of the substrate and the pressure sensitive adhesive layer is formed by irradiating a laminate of the resin film and the energy ray-crosslinkable pressure sensitive adhesive composition layer with an energy ray.
An energy-ray-crosslinkable pressure-sensitive adhesive composition containing an acrylic polymer having energy ray crosslinkability, and another acrylic polymer that is substantially free of radical-reactive unsaturated double bonds and has a weight-average molecular weight (Mw) of 280000 or less. The energy-ray-crosslinkable pressure-sensitive adhesive composition is included in a pressure-sensitive adhesive sheet and a crosslinked pressure-sensitive adhesive obtained by crosslinking the energy-ray-crosslinkable pressure-sensitive adhesive composition with an energy ray. A method for producing the crosslinked pressure-sensitive adhesive, a method for producing the crosslinked pressure-sensitive adhesive, and a method for producing the pressure-sensitive adhesive sheet are also provided.
A film-shaped firing material for heating and pressurizing, the material including: metal particles; and a binder component that contains a resin having a decomposition initiation temperature of 200° C. or less.
C09J 5/06 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
The exterior window film according to the present invention comprises a substrate, a hard coat layer provided on one surface side of the substrate, and a pressure-sensitive adhesive layer provided on the opposite surface side of the substrate from the side provided with the hard coat layer. The hard coat layer is composed of a material containing a (meth)acrylate-based resin having a urethane (meth)acrylate as a constituent component, a hindered amine light stabilizer, and an ultraviolet absorber. The exterior window film according to the present invention is characterized in that, relative to 100.0 parts by mass of the (meth)acrylate-based resin, a proportion of the hindered amine light stabilizer is 2.0 parts by mass or more and 15.0 parts by mass or less, and a proportion of the ultraviolet absorber is 5.0 parts by mass or more and 30.0 parts by mass or less.
Provided is a sheet for workpiece processing that includes a base material and a pressure sensitive adhesive layer laminated on one side of the base material. The pressure sensitive adhesive layer is composed of an active energy ray-curable pressure sensitive adhesive that contains a hindered amine-based stabilizer. Such a sheet for workpiece processing enables easy separation of workpieces even when a heating treatment is performed.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
A window film includes a substrate and an adhesive agent layer disposed on one main surface of the substrate, in which the creep compliance of the adhesive agent layer after 1200 seconds of continuous application of a shear stress of 3000 Pa at 23° C. is 200 (1/MPa) or less.
[Problem] To provide a microneedle structure capable of analyzing body fluids by using a means other than a functional member. [Solution] A microneedle structure 10 comprises: a liquid storage layer 20 for absorbing and storing a liquid derived from a living body; and a needle-shaped portion 11 in which a flow path 13 is formed, wherein the flow path 13 in the needle-shaped portion 11 is in contact with the liquid storage layer 20.
This microneedle structure comprises needle-shaped sections to be inserted into an object. The needle-shaped sections have a porous structure. The porous structure includes openings in the side surfaces of the needle-shaped sections, and holes through which a liquid to be injected into the object or a liquid received from the object flows. The side-surface opening count, which is the number of openings per 10,000 μm2 in the side surfaces of the needle-shaped sections, is 30 or greater.
A61M 37/00 - Other apparatus for introducing media into the bodyPercutany, i.e. introducing medicines into the body by diffusion through the skin
B29C 67/20 - Shaping techniques not covered by groups , or for porous or cellular articles, e.g. of foam plastics, coarse-pored
C08J 9/26 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof by elimination of a solid phase from a macromolecular composition or article, e.g. leaching out
A microneedle patch 1 comprises: a liquid absorbent layer 20 that absorbs liquid; needle-shaped parts 11 each including a flow path 13 formed therein, the flow path 13 in each needle-shaped part 11 being connected to one surface side of the liquid absorbent layer 20; and a cover layer disposed detachably on the other surface side of the liquid absorbent layer 20 and covering the liquid absorbent layer 20. Such a microneedle patch has adequate strength and enables a sufficient amount of body fluid to be drawn from a subject and analyzed. The present invention also provides an analysis method using the microneedle patch, with which a sufficient amount of body fluid can be drawn from a subject and analyzed.
The present invention provides a marking device (AE) which makes it possible to reduce the motivation for a third party to reproduce a semiconductor wafer or a semiconductor chip and which imparts a prescribed mark MK on, for example, a semiconductor wafer WF or a semiconductor chip CP. The marking device comprises: a first marking means (10) for imparting, in first impartation form (12), a first mark (MK1) on a semiconductor wafer (WF) or a semiconductor chip (CP); and a second marking means (29) for imparting, in second impartation form (22), a second mark (MK2) on the semiconductor wafer (WF) or the semiconductor chip (CP) on which the first marking means (10) has imparted the first mark (MK1).
In order to prevent a predetermined mark applied to a semiconductor wafer or a semiconductor chip from becoming unreadable later, a marking device (EA) for applying a predetermined mark (MK) to a semiconductor wafer (WF) or a semiconductor chip (CP) is provided with a marking means (10) for applying the predetermined mark (MK) to the semiconductor wafer (WF) or the semiconductor chip (CP), and a covering means (20) for providing a covering material (AS) so as to cover the predetermined mark (MK) applied to the semiconductor wafer (WF) or the semiconductor chip (CP). (FIG. 1)
This semiconductor device manufacturing system comprises: a curing device for irradiating a semiconductor device including a base layer formed of an energy ray-curable resin composition with an energy ray to cure the base layer; and an ink marking device that applies an ink on the base layer to make an identity determination mark for determining the identity of the semiconductor. The curing device and the ink marking device are in-line.
An information processing apparatus, an information processing program, and a system and a method for manufacturing a decorative sheet which can be applied for any article and easily customize a seal, a cover, or the like that covers the article. An information processing apparatus is applied to a system that manufactures a decorative sheet, which is attached to an article to decorate the article, and includes an acquisition unit, a model generation unit, and an image generation unit. The acquisition unit acquires an image of the article. The model generation unit generates a three-dimensional model of the article based on the image of the article. The image generation unit arranges a design on at least a part of a surface of the three-dimensional model, and generates image data for printing the arranged design on a pressure-sensitive adhesive sheet.
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR DETERMINING IDENTITY OF SEMICONDUCTOR DEVICE, AND SYSTEM FOR MANUFACTURING SEMICONDUCTOR DEVICE
Disclosed is a method for manufacturing a semiconductor device, the method including: a base layer formation step for forming a base layer, which is formed of a curable resin composition, on a semiconductor base material; an ink marking step for applying an identity determination mark onto the base layer with an ink, the identity determination mark being used for determination of the identity of a semiconductor device; and a curing step for curing the base layer after the ink marking step.
An adhesive (1A) for high-frequency dielectric heating contains a thermoplastic resin (A) and a dielectric filler (B). When a cut surface obtained by cutting, along the thickness direction, the adhesive (1A) for high-frequency dielectric heating is observed by a scanning electron microscope, the relationship of the distance Dg between nearest centroids of the dielectric filler (B) to the particle diameter Dn of the dielectric filler (B) satisfies formula (F1). (F1): 1.55 ≤ Dg/Dn ≤ 1.85
C09J 123/00 - Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondAdhesives based on derivatives of such polymers
A writing-feel-improving sheet 1 with a surface to be touched by a touch pen has an average vibration intensity of 1.2mm/s2 or more in a frequency range of 50-100Hz, the average vibration intensity being acquired from a vibration intensity-period chart obtained by: bringing the pen tip of a specific touch pen into contact with the surface to be touched by a touch pen; then applying a load of 200g to the touch pen and maintaining an angle formed by the touch pen and the surface at 45°; detecting, by an accelerometer, a change in power due to acceleration of vibrations in the same direction as the sliding direction of the touch pen while linearly sliding the touch pen at a speed of 16.6mm/s; and subjecting a power value-time chart, which is obtained between the start of sliding and a sliding distance of 100mm, to fast Fourier transform. The writing-feel-improving sheet 1 offers excellent writing feel with a touch pen.
B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
A writing feel improving sheet 1 having a surface with which a touch pen contacts. After a predetermined pen tip of the touch pen is brought into contact with the surface with which the touch pen is in contact, a load of 200 g is applied to the touch pen, an angle formed by the touch pen and the surface is maintained at 45°, and a change of electric power generated by acceleration of vibration in the same direction as a sliding direction of the touch pen is detected by an accelerometer while linearly sliding the touch pen at a speed of 16.6 mm/s, with the electric power value-time chart obtained in an interval from the start of sliding to a sliding distance of 100 mm being fast Fourier transformed. The average value of the vibration intensities in the range of frequencies 50-100 Hz acquired from the obtained vibration intensity-period is 1.5 mm/s 2 or less, and the arithmetic average roughness Ra of the surface with which the touch pen contacts is 0.1 μm or less, or the ten-point average roughness Rzjis is 1 μm or less. According to the writing feel improving sheet 1, the writing feel of the touch pen is excellent, and excellent transparency can be exhibited.
B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
A writing-feel improving sheet 1 having a surface on which a touch pen is brought into contact, wherein the distance between the center of gravity point of the writing-feel improving sheet 1 and the reference center of gravity point is 4.8 or lower, said reference center of gravity point being obtained by performing principal component analysis using, as data: an arithmetic average roughness Ra (μm), a ten-point average roughness Rzjis (μm), and a rolling circle maximum height waviness (μm) of a writing surface of a writing object serving as a reference and the surface of the writing-feel improving sheet on which the touch pen is brought into contact; a coefficient of static friction and a coefficient of dynamic friction measured by bringing a writing tool serving as a reference into contact with the writing surface of the writing object serving as a reference, then applying a load of 200 g on the writing tool, and linearly sliding the writing tool at 16.6 m/second while maintaining the angle between the writing tool and the writing surface at 45; and a coefficient of static friction and a coefficient of dynamic friction measured by the same method as above for the writing-feel improving sheet. This writing-feel improving sheet 1 makes it possible to obtain a desired writing feel.
To provide a gas barrier film having a high gas barrier property and a high modulus of surface elasticity and having excellent hygrothermal durability, a gas barrier film having less pinholes in the entire surface and having a high gas barrier property, and manufacturing methods of these. A first gas barrier film includes: a gas barrier layer containing silicon and oxygen, and a region in a thickness direction of the gas barrier layer, the region containing silicon, oxygen, and nitrogen, and having an element ratio of nitrogen of 5 at % or greater, and a thickness dM of the region being 30 nm or greater. A second gas barrier film includes a gas barrier layer containing silicon and oxygen, where, in a case where the gas barrier film having a predetermined size is sectioned into a predetermined number, a proportion of the number of sections having a water vapor transmission rate in a predetermined condition of less than 1.0×10−3 g/m2/day is not less than a predetermined proportion.
This electromagnetic wave absorbing member has a resistance layer that has conductor patterns. The resistance layer has first and second regions that have different electromagnetic wave transmission characteristics from each other. The first region has a conductor pattern having a plurality of first arrays in which a plurality of first units are arranged, and having a plurality of second arrays in which a plurality of second units that are different from the first units are arranged. The second region has a conductor pattern having a plurality of the first arrays and having a plurality of the second arrays. In the first region, a plurality of the first units and the second units are arranged in a first direction. In the second region, a plurality of the first units and the second units are arranged in a second direction that is different from the first direction. In the first region and the second region, the first arrays and the second arrays are arranged neighboring each other.
A wiring board (100) comprises: a substrate (1) having a transmittance of 70% or more of near-infrared light having a wavelength of 1000 nm; and an electrode (21) provided on the substrate (1) and comprising a conductive paste. The surface of the electrode (21) has a first electroless plating layer (22) formed by electroless plating and containing nickel and boron. The surface of the first electroless plating layer (22) has a second electroless plating layer (23) formed by electroless plating and comprising a metal.
H05B 3/84 - Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
H05B 3/20 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
H05K 1/09 - Use of materials for the metallic pattern
Provided is an adhesive sheet 1 having an adhesive layer 11, wherein, taking the haze value (%) of the adhesive layer 11 by 450 nm light as H(450) and the haze value by 650 nm light as H(650), the absolute value of slope S1 represented by formula (1) is more than 0.026, the haze value of the adhesive layer 11 is 10-100%, and the adhesive force of the adhesive sheet 1 to soda lime glass is 1 N/25 mm or more. S1 = (H(650) - H(450))/200 … (1) According to the adhesive sheet 1, the lighting color can be adjusted to a color other than white while manifesting a concealing property.
C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
C09J 7/10 - Adhesives in the form of films or foils without carriers
C09J 133/04 - Homopolymers or copolymers of esters
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
Provided is a curable resin film for use in forming a cured resin film as a protective film on a bump-formed surface of a semiconductor chip having the bump-formed surface provided with a bump, the curable resin film satisfying requirement (1) below: requirement (1): a near-infrared transmittance at 940 nm is less than 13% after thermal curing treatment at 130° C. and 0.5 MPa for 240 minutes.
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/552 - Protection against radiation, e.g. light
Provided is a sheet for inkjet printing, wherein an ink-receiving layer is in direct contact with one surface of a substrate layer or with an easy-adhesion layer formed on one surface of the substrate layer, the other surface of the substrate layer has, in this order, an adhesive layer and a release liner in a laminated structure. The release liner has a silicone-based release agent layer on the contact surface contacting the adhesive layer. The ink-receiving layer is a cured layer of a composition for forming the ink-receiving layer, contains an energy ray-curable compound (A), a silicone-based leveling agent (B), and a filler (C). The energy ray-curable compound (A) is an ester of a polyol compound and (meth)acrylic acid. The water contact angle of the ink-receiving layer is 80° or less, and the difference in refractive index [(X)-(Y)] between the refractive index (X) of the ink-receiving layer and the refractive index (Y) of the layer directly in contact with the ink-receiving layer is greater than -0.03.
B41M 5/50 - Recording sheets characterised by the coating used to improve ink, dye or pigment receptivity, e.g. for ink-jet or thermal dye transfer recording
Provided is a display body 1 comprising a light scattering layer 11, at least one light diffusion control layer 12 that is laminated on one surface side of the light scattering layer 11 and has a regular internal structure provided with a plurality of regions having a relatively high refractive index within a region having a relatively low refractive index, and a display device 13 laminated on a surface side of the light diffusion control layer 12 opposite the light scattering layer 11. At a position 0.3 cm from a display surface, the ratio (maximum inclination/0° luminance) of the maximum value of inclination (maximum inclination) of luminance to angles in a luminance distribution measured in a range of −70° to 70°, where 0° indicates a direction perpendicular to the display surface, to the luminance of light emitted in the direction perpendicular to the display surface (front direction) is 0.030 or lower. In the display body 1, the change in luminance resulting from the difference of the recognized angle is excellently uniformized.
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
An adhesive sheet 1 has an adhesive layer 11, wherein: an absolute value of an inclination S1 represented by formula (1) is 0.026 or less, where H(450) is a haze value (%) of the adhesive layer 11 under a light beam having a wavelength of 450 nm, and H(650) is a haze value (%) of the adhesive layer 11 under a light beam having a wavelength of 650 nm; the haze value of the adhesive layer 11 is 10%-100%; and the adhesive force of the adhesive sheet 1 to soda lime glass is 1 N or more per 25 mm. (1): S1 = (H(650) - H(450))/200 According to the adhesive sheet 1, the luminescent color can be adjusted to white while exhibiting concealability.
C09J 7/10 - Adhesives in the form of films or foils without carriers
C09J 133/04 - Homopolymers or copolymers of esters
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
Provided is a method for removing a coating layer, the method comprising: a step in which a stack (501) obtained by superposing layers of one sheet of a release film (50) including, for example, a substrate film and a coating layer is prepared or a stack obtained by superposing layers of a plurality of sheets of the release film (50) is prepared; a step in which the stack (501) is immersed in treatment water (W1); a step in which after the immersion in the treatment water (W1), the release film (50) is released from the stack (501); and a step in which the coating layer is removed from the released release film (50). The coating layer includes an interlayer and a releasant layer, the interlayer being interposed between the substrate film and the releasant layer.
A method for removing a coating layer is provided, the method comprising: a step for preparing a release film (50) comprising, for example, a substrate film and a coating layer; a step for introducing the release film (50) into a pressure vessel (400) (one example of a treatment vessel); a step for exposing the release film (50) to water vapor (V2, V3) inside the pressure vessel (400); and a step for removing the coating layer from the release film (50). The coating layer includes an interlayer and a releasant layer, the interlayer being interposed between the substate film and the releasant layer.
The present invention makes it possible to pick up, by a milder operation, an object held by a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer with an uneven surface. This pressure-sensitive adhesive sheet has a pressure-sensitive adhesive layer with an uneven surface. The pressure-sensitive adhesive layer has an adhesive force in application to a silicon mirror surface, as determined at a peel angle of 180° and a peel rate of 300 mm/min, of 35 mN/50 mm or less.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
The present invention makes it possible for an object held on an adhesive sheet provided with an adhesive layer having a relief pattern on the surface thereof to be picked up by means of a milder operation. This adhesive sheet comprises an adhesive layer having a relief pattern on the surface thereof. After the mirror surface of a silicon chip having a size of 5.0 mm × 5.0 mm is pressed against the adhesive layer of the adhesive sheet at a contact pressure of 0.3 MPa, the workload when peeling the silicon chip from the adhesive layer is 25 μJ or less.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
