A connector for contacting a semiconductor chip. The connector may include a tab, where the tab includes an outer portion, having a planar shape, the outer portion having a lower surface, adapted to contact a surface of the semiconductor chip, and an upper surface that defines a main plane of the tab. The tab may also include a ring portion, the ring portion connected to the outer portion and extending proud of the main plane, wherein the ring portion defines an inner hole within the tab structure, the inner hole being adapted to expose a contact portion of the surface of the semiconductor chip, wherein the ring portion includes at least two slots. The connector may further include a clip, comprising a connection portion, the connection portion having an aperture that is adapted to couple around the ring portion.
An electrical device assembly and method to attach an isolated single stud fuse assembly to an electrical device are disclosed. The electrical device assembly consists of multiple studs, one or more of which is replaced with the isolated single stud fuse. A conductive copper landing zone receives an electrically isolated steel stud. When the landing pad assembly is orbital riveted into a plastic housing of the electrical device, the stud is locked into the housing permanently. Electrical devices such as disconnect switches and power distribution modules, both of which include multiple studs, are good candidates for being adapted with the single stud fuse assembly.
H01H 85/143 - Electrical contactsFastening fusible members to such contacts
H01H 85/20 - Bases for supporting the fuseSeparate parts thereof
H01H 85/22 - Intermediate or auxiliary parts for carrying, holding, or retaining fuse, co-operating with base or fixed holder, and removable therefrom for renewing the fuse
H01H 85/08 - Fusible members characterised by the shape or form of the fusible member
H01H 85/175 - Casings characterised by the casing shape or form
H01R 4/30 - Clamped connectionsSpring connections using a screw or nut clamping member
An AC-to-DC converter circuit includes DC-to-DC converter that in turn includes a secondary side circuit. The secondary side circuit includes a secondary winding, a pair of bipolar transistor-based self-driven synchronous rectifiers, a pair of current splitting inductors, and an output capacitor. Each of the synchronous rectifiers includes a bipolar transistor and a diode whose anode is coupled to the transistor collector and whose cathode is coupled to the transistor emitter. The current splitting inductors provide the necessary base current to the bipolar transistors at the appropriate times such that the bipolar transistors operate as synchronous rectifiers. As compared to using conventional self-driven synchronous rectifiers based on field effect transistors in the secondary side, using the novel bipolar-transistor based synchronous rectifiers in the secondary side of the forward converter circuit results in lower power consumption and allows the converter to operate from a wider range of VAC input voltages.
H02M 3/335 - Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
4.
Thyristor and thermal switch device and assembly techniques therefor
A device may include a lead frame, where the lead frame includes a central portion, and a side pad, the side pad being laterally disposed with respect to the central portion. The device may further include a thyristor device, the thyristor device comprising a semiconductor die and further comprising a gate, wherein the thyristor device is disposed on a first side of the lead frame on the central portion. The device may also include a positive temperature coefficient (PTC) device electrically coupled to the gate of the thyristor device, wherein the PTC device is disposed on the side pad on the first side of the lead frame; and a thermal coupler having a first end connected to the thyristor device and a second end attached to the PTC device.
H01L 23/525 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
A press pack module includes a collector module terminal, an emitter module terminal, a gate module terminal, and an auxiliary module terminal. Each IGBT cassette within the module includes a set of shims, two contact pins, and an IGBT die. The first contact pin provides part of a first electrical connection between the gate module terminal and the IGBT gate pad. The second contact pin provides part of a second electrical connection between the auxiliary module terminal and a shim that in turn contacts the IGBT emitter pad. The electrical connection between the auxiliary emitter terminal and each emitter pad of the many IGBTs is a balanced impedance network. The balanced network is not part of the high current path through the module. By supplying a gate drive signal between the gate and auxiliary emitter terminals, simultaneous IGBT turn off in high speed and high current switching conditions is facilitated.
H01L 25/11 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass
H01L 29/739 - Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field effect
H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
H01L 23/367 - Cooling facilitated by shape of device
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 23/043 - ContainersSeals characterised by the shape the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
H01L 23/00 - Details of semiconductor or other solid state devices
An improved bi-stable electrical solenoid switch comprising a solenoid being wound with coil windings. The solenoid having a central aperture defined therein, and the coil windings, which when engaged by a power source, generates a magnetic field. A magnetic coupling member mounted on the solenoid. A plunger partially disposed in the central aperture for movement into and out of the central aperture. A conductive plate coupled to the plunger and provided with contacts on each end of the conductive plate. The conductive plate configured to electrically engage and disengage the solenoid upon respective application of power to the solenoid. The magnetic coupling member configured to reduce the force needed by the solenoid to remain in an open position when selectively energized for moving and retaining the conductive plate of the plunger against the solenoid for allowing wide operating voltage and reduced operating power.
2·atm·day at approximately 0% relative humidity and approximately 23° C. In certain embodiments, methods of curing the oxygen barrier compositions comprise partially curing the composition where, the partial cure is achieved through ultraviolet radiation or heat.
C09D 163/00 - Coating compositions based on epoxy resinsCoating compositions based on derivatives of epoxy resins
C08G 59/17 - Polycondensates modified by chemical after-treatment by monocarboxylic acids or by anhydrides, halides or low-molecular-weight esters thereof by acrylic or methacrylic acid
A power distribution module for a vehicle includes an insulating housing including a component grid, the component grid defining a plurality of circuit protection footprints, the housing further including at least one connector mount or terminal mating location; a printed circuit board (“PCB”) located within the housing and beneath the component grid, the PCB holding a plurality of fuse mounting terminals and at least one connector mounting terminal, the PCB including a plurality of conducting traces connecting the fuse mounting terminals to the at least one connector mounting terminal; and a cover that threadingly engages the housing, the threading engagement leading to a locking of the cover to the housing that tends to prevent the cover from loosening from the housing when the vehicle is being driven, the locking of the cover able to be overcome by a person so that the cover can be unthreaded readily from the housing.
B60R 16/023 - Electric or fluid circuits specially adapted for vehicles and not otherwise provided forArrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric for transmission of signals between vehicle parts or subsystems
A device for preventing arc flashes in electrical systems is provided. The device may include at least one heat sensor for measuring a temperature of an electrical conductor, and a controller operatively coupled to the at least one heat sensor and configured to arrest current in the electrical conductor if the measured temperature exceeds a predefined threshold temperature.
H02H 5/00 - Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection
H02H 5/04 - Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection responsive to abnormal temperature
H02H 1/00 - Details of emergency protective circuit arrangements
A circuit protection device includes a substrate with first and second electrodes connected to the circuit to be protected. The circuit protection device also includes a heater element. A sensing element facilitates an electrical connection between the first and second electrodes. A flux material is provided around the sensing element. In a preferred embodiment, the flux contains a first component that is a polar material and a second component that is a non-polar material. A spring element exerts a force on the sensing element. The sensing element resists the force applied by the spring element. Upon detection of an activation, or fault, condition, the sensing element loses resilience and no longer resists the force exerted by the spring element, resulting in the spring element severing the electrical connection between the first and second electrodes. The flux allows the spring element to sever the electrical connection without dragging the sensing element.
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
A single-coil, toroid-type current transformer circuit for detecting both AC and DC current. The current transformer circuit may include a current transformer and an oscillator electrically connected to the current transformer. The current transformer circuit may further include an open and short CT detection circuit electrically connected to the oscillator for facilitating determination of the connection and stability state of the current transformer. A processor may be electrically connected to an output of the open and short CT detection circuit for performing a series of operations on signal data generated by the open and short CT detection circuit and manipulating the operation of an electrical power system accordingly.
A circuit protection assembly includes a mounting block, a unitary fuse assembly, a post assembly and a plug connector. The unitary fuse assembly is disposed the mounting block and includes a plurality of fuses each of which is defined by a portion of a bus plate disposed on the lower surface of the mounting block to form a first terminal of the fuse, a second terminal disposed at least partially on the upper surface of the mounting block and a fuse element connecting the first terminal and the second terminal. The post assembly is disposed at least partially within the mounting block and a post extending from the block. The plug connector extends from a portion of the first terminal of at least one of the plurality of fuses.
H01H 85/02 - Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive Details
H01H 85/143 - Electrical contactsFastening fusible members to such contacts
An improved fusible element for use within a circuit protection device is provided which includes a double wound fusible element configured to withstand high surge current associated with inductive and capacitive loads. The fusible element includes an insulated core having a longitudinal axis, a first wire wound about the core along the longitudinal axis of the core, and a second wire wound substantially orthogonally about a longitudinal axis of the first wire such that the fusible element is configured to withstand an over-current surge condition.
A fuse for a moderately hazardous environment comprising includes: (i) a fuse element; (ii) first and second terminals connected to the fuse element; and (iii) a metal enclosure places around the fuse element, the enclosure configured to protect the environment from an opening of the fuse element, and wherein the first and second terminals extend from the metal enclosure.
A varistor has a disc of ceramic material having opposed faces with face edges. There is an electrode on each face with a gap between each electrode and the edge of the face. Glass passivation is on at least one face in the gap, the passivation not extending from one electrode to the other electrode around the surface of the disc. Because the passivation is only on the planar opposed disc faces, it may be applied in a simple operation such as screen printing. Indeed, the screen printing may be performed while the discs are in the same nest plates as are used for printing of electrode paste. Even though the passivation does not extend from one electrode to the other, it nevertheless breaks a potentially conductive path between the electrodes caused by interaction between the ceramic and encapsulant materials.
H01C 7/10 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
A fuse for a moderately hazardous environment comprising includes: (i) a fuse element; (ii) first and second terminals connected to the fuse element; and (iii) a metal enclosure placed around the fuse element, the enclosure configured to protect the environment from an opening of the fuse element, and wherein the first and second terminals extend from the metal enclosure.
