The invention provides a carrier in the form of a glass plate having recesses formed therein which extend through the full thickness of the carrier and whose opposing terminal cross-sections are open in the plane of the opposing surfaces of the glass plate. The recesses therefore form through-holes through the glass plate and have an inside diameter of 5 to 1000 μm.
C03C 17/30 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with organic material with silicon-containing compounds
C03C 15/00 - Surface treatment of glass, not in the form of fibres or filaments, by etching
C03C 23/00 - Other surface treatment of glass not in the form of fibres or filaments
2.
MONOLITHIC GLASS MEMBRANE, DOUBLE VERTICAL MEMBRANE ARRANGEMENT, MICROMECHANICAL SPRING STRUCTURE AND ASSOCIATED PRODUCTION METHOD
In order to expand the application possibilities of micromechanical bending structures 2 in glass, it is proposed to form vertical membranes 1 monolithically in the glass substrate 3 that extend transverse to a substrate plane 5 of a glass substrate 3, by creating blind holes 8 by means of a laser-induced modification of the glass substrate 3 and subsequent wet chemical etching. This makes it possible not only to arrange bending structures 2 inside the body 40 of the glass substrate 3, but also to form spring structures 19 and solid state joints 35 monolithically, in particular in the depth of the glass substrate 3. This also enables novel actuation concepts in glass.
A joining device for the laser-transmission joining of a thermoplastic component (2) to a glass-like component (3) comprises - a mount for mounting the thermoplastic component (2), - a clamping device (5) for securing the glass-like component (3) on the first component (2) and for applying a clamping force (F) to the two components (2, 3), wherein provided in the clamping device (5) is a window insert (8) for the laser beam (9) and provided in the glass-like component (3), passing through it in the direction of its thickness, are cavities (10) for the penetration and anchorage of thermoplastic material (11) of the thermoplastic component (2) that has melted during the joining process, and - a negative-pressure application device (6), which is assigned to the clamping device (5) and is intended for generating a suction effect on the thermoplastic material (11) of the thermoplastic component (2) that has melted during the joining process into the cavities (10) of the glass-like component (3).
B29C 65/78 - Means for handling the parts to be joined, e.g. for making containers or hollow articles
B29C 65/00 - Joining of preformed partsApparatus therefor
4.
PRINTING STENCIL AND PRINTING DEVICES FOR FORMING CONDUCTOR PATHS ON A SUBSTRATE AND METHOD FOR PRODUCING A METAL CONTACT STRUCTURE OF A PHOTOVOLTAIC CELL
FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E. V. (Germany)
LPKF LASER & ELECTRONICS AG (Germany)
Inventor
Lorenz, Andreas
Tepner, Sebastian
Karimi, Kiarash
Wenzel, Timo
Linse, Michael
Clement, Florian
Vogt, Aaron Michael
Abstract
The invention relates to a printing stencil (1) for forming conductor paths on a substrate. The printing stencil (1) has a plurality of recesses in the form of printing gaps (4) for forming the conductor paths. Each printing gap (4) of the plurality of printing gaps (4) has at least one print definition region (3) adjacent to the printing side and at least one printing medium supply region (2) adjacent to the squeegee side, wherein the volume of the print definition region (3) is smaller than the volume of the printing medium supply region. The invention also relates to a printing device for forming conductor paths on a substrate and a method for producing a metal contact structure of a photovoltaic solar cell.
The invention relates to a carrier which is suitable for the cultivation of cells and is preferably a plate-shaped carrier, e.g. made of glass, silicon or plastic or a combination thereof, in which carrier at least one first recess is formed which extends over a first thickness portion of the carrier, wherein an array of second recesses extends from the first recess into a second thickness portion of the carrier adjacent to the first thickness portion. The first thickness portion may have a thickness of a few micrometres to several centimetres. The second recesses, which extend from a first recess into the second thickness portion and each form a second array, form cups which are suitable for receiving cells and/or synthetic particles, e.g. made of plastic or glass.
A method for introducing a recess into a substrate, and/or for reducing a material, includes spatially beam shaping a focus of a laser beam along a beam axis, whereby defects are produced in the substrate along the beam axis without there being any material removal. One or more of the defects forms a modification in the substrate, so that subsequently the recess and/or the material thickness reduction is produced by action of an etching medium by an anisotropic material removal. An additional modification is introduced into the substrate along an additional beam axis that is parallel to and spaced from the beam axis, the additional modification having an extent between a first outer surface of the substrate and a position within the substrate that is at a distance from a second, opposite outer surface of the substrate.
C03C 15/00 - Surface treatment of glass, not in the form of fibres or filaments, by etching
B23K 26/53 - Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
B23K 26/00 - Working by laser beam, e.g. welding, cutting or boring
7.
Mounting method for an integrated semiconductor wafer device, and mounting device able to be used therefor
A mounting method for an integrated semiconductor wafer device including a glass substrate a recess, at least one semiconductor wafer that is arranged in the recess, and at least one spring element engaging in the recess for maintaining the position or orienting the semiconductor wafer, wherein the method includes providing the glass substrate with a relaxed spring element engaging in the contour space of the semiconductor wafer, providing a spring manipulator substrate with a manipulation element adapted to the contour space and/or the at least one spring element, displacing the glass substrate in relation to the spring manipulator substrate such that its manipulation element runs into the recess, placing the semiconductor wafer into the recess, and displacing the glass substrate back in relation to the spring manipulator substrate such that its manipulation element moves out of the contour space of the semiconductor wafer, releasing the spring element.
H01L 21/52 - Mounting semiconductor bodies in containers
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
8.
TWO-PART REACTION VESSELS MADE OF GLASS, PRODUCTION METHOD AND ANALYTICAL METHOD
The invention relates to a method for producing reaction vessels from glass and to the glass reaction vessels obtainable by this method. The method comprises the following steps: 1. irradiating the surface of a first glass sheet by means of a laser beam of a wavelength for which the first glass sheet is permeable, 2. etching the first glass sheet to form recesses that extend over the complete thickness of the first glass sheet, and 3. connecting a second sheet with a surface of the first glass plate.
A method of production of glass reaction vessels includes irradiating a laser beam of a wavelength for which a first glass plate is transparent onto the surface of the first glass plate. The first hiss plate is etched. Etching of the first glass plate is terminated when the recesses extend, over only a portion of the thickness of the first glass plate and therefore the recesses have a bottom formed in the first glass plate as a single piece.
The invention relates to a carrier which is suitable for the cultivation of cells and is preferably a plate-shaped carrier, e.g. made of glass, silicon or plastic or a combination thereof, in which carrier at least one first recess is formed which extends over a first thickness portion of the carrier, wherein an array of second recesses extends from the first recess into a second thickness portion of the carrier adjacent to the first thickness portion. The first thickness portion may have a thickness of a few micrometres to several centimetres. The second recesses, which extend from a first recess into the second thickness portion and each form a second array, form cups which are suitable for receiving cells and/or synthetic particles, e.g. made of plastic or glass.
The invention relates to a device for depositing drops of liquid on a carrier, comprising a drop generator, a holding device for the carrier, a detector which is configured to detect a signal for each liquid portion or drop, a transport device for the relative movement of the holding device to the drop generator, and preferably a store connected to the detector.
A device for depositing liquid droplets onto a carrier includes a droplet generator and a holding device for the carrier, and a detector arranged to detect a signal for each liquid section or droplet, and a transport device for moving the holding device relative to the droplet generator and preferably a memory connected to the detector.
A method for making a recess or opening in a planar workpiece with a thickness of less than 3 millimeters includes successively etching a plurality of flaws to form the recess or opening such that a contour of the recess or opening has a sequence of widenings and constrictions as a result of the etching.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
B23K 26/382 - Removing material by boring or cutting by boring
B23K 26/0622 - Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
14.
Method for producing a display having a carrier substrate, a carrier substrate produced according to said method, and a cover glass intended for a flexible display
A method for producing a display comprising a carrier substrate made of glass, the display having flexible, bendable and/or elastic properties in a predetermined region of the carrier substrate, includes introducing modifications into the carrier substrate within the region by laser radiation along a closed and/or linear contour and/or points. Within the region, a one flexible, bendable and/or elastic layer is applied. A side of the carrier substrate facing away from the layer is subjected to an etching attack, by which material removal from the carrier substrate takes place along the modifications along the contour and/or at the points of the region until recesses are produced that extend across or over a substantial part of a material thickness of the carrier substrate.
A method for producing microstructures includes introducing modifications by a laser beam into a volume between two opposite outer surfaces of a glass substrate. An etching method is carried out which provides anisotropic material removal in one of the outer surfaces so as to produce recesses that have a conical shape. A layer that is resistant to an etching effect of the etching method is applied as a cover layer to only one outer surface. Then, a further etching method is carried out so that material is removed in the other outer surface until recesses of this other outer surface, which are produced and/or enlarged by the further etching method, have reached the cover layer.
The invention relates to a process for connecting glass substrates which allows glass substrates to be aligned in a site-specific manner and to subsequently be connected to one another, and to the site-specifically aligned and interconnected glass substrates. Generally, the process relates to connecting glass substrates to one another, optionally also without site-specific alignment. The interconnected glass substrates obtainable by processes according to the invention are characterized by a firm bond with one another, which is preferably formed by solidified glass solder that is in form-fitting engagement with the glass substrates. Therein, recesses, which are preformed in the glass substrate, with glass solder are used for aligning and optionally for connecting the glass substrates.
B32B 3/24 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. apertured or formed of separate pieces of material characterised by an apertured layer, e.g. of expanded metal
C03C 27/08 - Joining glass to glass by processes other than fusing with the aid of intervening metal
B32B 3/26 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids
B32B 17/06 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance
C03C 23/00 - Other surface treatment of glass not in the form of fibres or filaments
A process for the production of a glass-plastic connection which is form-fitting, and to a form-fitting composite between glass and plastic which is obtainable by the process. The process and the glass-plastic composite are characterized in that a glass, which in particular is planar, neither during the process nor in the glass-plastic composite is subjected to a mechanical load which could lead to cracks, e.g. microcracks. Accordingly, in the composite, the glass is connected to a plastic in a stress-free manner The composite of glass with plastic is especially gas-proof and/or liquid-proof.
C03C 17/32 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with organic material with synthetic or natural resins
C03C 15/00 - Surface treatment of glass, not in the form of fibres or filaments, by etching
C03C 23/00 - Other surface treatment of glass not in the form of fibres or filaments
C03C 27/06 - Joining glass to glass by processes other than fusing
18.
METHOD FOR PRODUCING PLASTIC PARTS WITH GLASS INSERTS, AND PLASTIC PARTS WITH GLASS INSERTS
The invention relates to a method for producing plastic parts (20), each of which has at least one glass insert (1) that is connected to the plastic part (20) along a connection region (8), said glass insert (1) being free of plastic in the region surrounded by the connection region (8) and forming a glass window. The connection region (8) of the glass insert (1) is preferably closed along the periphery. The glass window (1) can have through-holes (6) or preferably recesses (2) which extend only over a part of the thickness of the glass window (1) and which have microstructures.
The invention relates to a substrate (1) with a flexible portion (5), in which a recess has been introduced into the substrate (1) and as a result the material thickness of the substrate (1) in the flexible portion (5) is reduced to a residual thickness (d) in comparison with the adjacent portion (4). For this purpose, firstly linear modifications are introduced into the substrate (1) with a defined spacing and with a modification depth. The spherical shape of the resulting microstructures (12) defines, between the depressions, intermediate regions (13) that taper to a point in the direction of the recess, and defines concave shapes in the direction of the glass substrate. This boundary surface formed by a multiplicity of mutually adjacent spherical or spheroidal surface portions results in both a sufficient load-bearing capacity in spite of the reduced residual thickness (d), and a flexibility in the direction of the recess that is filled with a polymer (7).
The invention relates to a method for introducing a recess in the form of an indentation into a substrate (2) by partially reducing the material thickness. A spatial beam forming of a laser beam along a beam axis (4) results in modifications (5) in the substrate (2) such that the recess is subsequently created by the action of an etching medium. A plurality of modifications (5) are introduced into the substrate (2) along parallel beam axes (4) having an extent (T) between a first outer face (6) and a position (P) within the substrate (2) with a distance a from a second outer face (7) opposite the first outer face (6). The adjacent modifications (5) have a lateral distance (S) with respect to their respective beam axes (4) that is dimensioned inversely proportional to the length or depth of the extent (T) in the substrate (2) in order to produce a nearly flat surface of the recess.
B23K 26/53 - Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
Method for producing a composite structure (1) on a carrier for one or more electronic components (4), which are circumferentially enclosed in a respective cutout (5) of a glass substrate (6), in particular a planar glass substrate (6), and are fixed in a predetermined desired position on the carrier (3), wherein a multiplicity of through-openings (8) with vertical interconnect access between the two outer sides of the glass substrate (6) are introduced into the glass substrate (6) and are connected to terminal contacts (2) of the carrier (3) and subsequently an electrically nonconducting potting compound (9) that encloses the at least one electronic component (4) on the carrier (3) is applied to the glass substrate (6) and to said at least one electronic component (4), wherein through-openings (10) corresponding to the vertical interconnect accesses of the glass substrate (6) are introduced into the potting compound (9) and subsequently an additive that is contained in the nonconducting potting compound (9) forms species that are catalytically active under the effect of laser radiation, which are subsequently metallized and connected in an electrically conductive manner to the vertical interconnect access of the glass substrate (6).
A method for producing a microstructure in a substrate with a membrane-like bridging or overhanging surface includes modifying the substrate, which is made of glass, by laser radiation along a peripheral contour. A membrane layer is applied over a surface of the substrate for producing the bridging or overhanging surface, wherein, at least in partial surfaces enclosing the peripheral contour of the laser modifications, a sacrificial layer is disposed between the substrate and the membrane layer. A side of the substrate facing away from the membrane layer is exposed to an etching attack such that material is removed primarily along the peripheral contour until the sacrificial layer is reached and there is a disintegration or reduction of the sacrificial layer and a separation of a connection of a part of the substrate enclosed by the peripheral contour from the surrounding substrate and from the membrane layer.
The invention relates to a method for producing conductor track structures on a non-conductive carrier substrate (1). In a first method step, an etch-resistant polymeric coating (5) is applied as an electrolytic resist to the respective base layer (2) in the carrier substrate (1) on the opposite outer sides. An electrical reinforcing layer (8) is applied to the base layer (2), in a section that is free of the etch-resistant coating (5), in accordance with the conductor track structure, said electrical reinforcing layer (8) at the same time electrically conductively connecting the opposite base layers as through-hole plating (7) in the region of possible apertures (3). Thereafter, in a manner directly adjoining the reinforcing layer (6) of the conductor track structure, a linear recess (9) is made in the resist coating (5) and the base layer (2) situated therebeneath by means of laser radiation, and the region to be removed is thermally insulated with respect to the adjacent reinforcing layer (6) of the conductor track structures. This is then heated in targeted fashion by a heat source until the adhesion of the base layer (2) on the carrier substrate (1) is significantly reduced, in order to extensively remove the base layer (2) together with the etch-resistant coating (5) from the carrier substrate (1) by way of the pressure difference (Δρ) of a suction-removal means (11) and so to produce the desired conductor track structures on the non-conductive carrier substrate (1).
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
24.
MOUNTING METHOD FOR AN INTEGRATED SEMICONDUCTOR WAFER DEVICE, AND MOUNTING DEVICE
A mounting method for an integrated semiconductor wafer device, in particular integrated semiconductor component arrangement, as an intermediate manufacturing product, comprising - a glass substrate (1) having at least one recess (2) formed by walls (3), - one or more semiconductor wafers, in particular semiconductor components (9) that are to be arranged in the recess (2), and - at least one spring element (19) that engages in the recess (2) and is formed on the glass substrate (1) for maintaining the position and/or orienting the semiconductor wafer or wafers (9) in the recess (2), comprises the following method steps: - providing the glass substrate (1) with a relaxed spring element (19) that engages in the contour space (K) of the semiconductor wafer (9) to be positioned, - providing a spring manipulator substrate (22) with a manipulation element (25) that is matched to the contour space (K) of the semiconductor wafer (9) to be positioned and/or the at least one spring element (19), - displacing the glass substrate (1) in relation to the spring manipulator substrate (22) in such a way that its manipulation element (25) moves into the recess (2) so as to pretension and deflect the spring element (19) out of the contour space (K) of the semiconductor wafer (9), - placing the semiconductor wafer (9) in the recess (2), and - displacing the glass substrate (1) back in relation to the spring manipulator substrate (22) in such a way that its manipulation element (25) moves out of the contour space (K) of the semiconductor wafer (9) so as to release the spring element (19), as a result of which the at least one spring element (19) acts on the semiconductor wafer (9) to maintain its position and/or orient it in the recess (2).
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
The invention relates to a substrate in the form of a glass plate in which recesses are formed which extend through the entire thickness of the substrate and of which the cross-sections at opposite ends are open in the plane of the mutually opposing surfaces of the glass plate. The recesses therefore form through holes through the glass plate and have an internal diameter from 5 to 1000 μm.
C03C 15/00 - Surface treatment of glass, not in the form of fibres or filaments, by etching
C03C 17/30 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with organic material with silicon-containing compounds
C03C 23/00 - Other surface treatment of glass not in the form of fibres or filaments
C12M 1/32 - Inoculator or sampler multiple field or continuous type
26.
METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE STRUCTURE
The invention relates to a method for producing a composite from at least one conductive structure, a carrier made of non-conductive carrier material made from thermosetting plastic, and at least one electronic component, wherein the non-conductive carrier material contains an additive which has a catalytically active species formed in an electroless metallization bath as a result of exposure to laser radiation. By using pulsed laser radiation, a quasi athermal treatment of the carrier material is achieved in that the material is evaporated directly as a result of the enormously high peak intensities, such that no melt or almost no melt is created.
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
27.
SINGLE-PIECE REACTION VESSEL MADE OF GLASS, PRODUCTION METHOD, AND ANALYSIS METHOD
The invention relates to a method for producing a reaction vessel made of glass and to a reaction vessel made of glass which can be obtained by means of the method. The method has the steps of: 1. emitting a laser beam with a wavelength, for which a first glass panel is permeable, onto the surface of the first glass panel, and 2. etching the first glass panel, wherein 3. the etching of the first glass panel is completed when the recesses extend only over a part of the thickness of the first glass panel, and the recesses therefore have a base which is integrally formed in the first glass panel.
The invention relates to a method for producing reaction vessels from glass and to the glass reaction vessels obtainable by this method. The method comprises the following steps: 1. irradiating the surface of a first glass sheet by means of a laser beam of a wavelength for which the first glass sheet is permeable, 2. etching the first glass sheet to form recesses that extend over the complete thickness of the first glass sheet, and 3. connecting a second sheet with a surface of the first glass plate.
An apparatus for joining, in particular laser welding, two components, in particular plastics components, comprises—two workpiece receptacles (1, 3) for respectively holding the two components (2, 4) to be connected, —in each case one bearing element, preferably a bearing plate (7), for each of the workpiece receptacles (1, 3), —a clamping drive (SA) for at least one bearing element for feeding and bracing of the two components (2, 4) held in the workpiece receptacles (1, 3) during the joining process, —a controller (9) for the clamping drive (SA) and in particular a laser welding device (LS), and—a mechanically loose coupling between the clamping drive (SA) and bearing element (7) such that the two workpiece receptacles (1, 3) are tiltable towards one another during feeding and bracing. Also disclosed is a method for operating such a joining apparatus during a joining process of two components (2, 4) held in the workpiece receptacles (1, 3), in particular during a laser welding process.
METHOD FOR PRODUCING A DISPLAY HAVING A CARRIER SUBSTRATE, A CARRIER SUBSTRATE PRODUCED ACCORDING TO SAID METHOD, AND A COVER GLASS INTENDED FOR A FLEXIBLE DISPLAY
The invention relates to a method for producing a flexible display on a carrier substrate (1). In a first step, modifications (5) are introduced, by means of laser radiation, into the carrier substrate (1) along a continuous or linear contour. A layer structure consisting of a plurality of layers (4) is then applied to the substrate surface at least in the region (2) having the modifications (5). A side of the carrier substrate (1) facing away from the layer (4) is subsequently etched, as a result of which material of the carrier substrate (1) is removed along the contour of the laser-modified regions (2) such that recesses (6) extend between the layer (4) and an outer surface of the carrier substrate (1) facing away from the layer (4). The carrier substrate (1) and the layers applied thereon are provided with the desired flexible properties in this way.
H01L 51/52 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) - Details of devices
H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
31.
METHOD FOR PRODUCING MICROSTRUCTURES IN A GLASS SUBSTRATE
The invention relates to a method for producing microstructures in a glass substrate (1), wherein firstly laser modifications are introduced into the glass substrate (1) in both outer surfaces (2, 3). Etching the glass substrate (1) that has been treated in this way gives rise to a multiplicity of conical cutouts (5) in the glass substrate (1) on account of anisotropic material removal. As soon as the cutouts (5) of the desired size have been produced, the etching process is interrupted and a capping layer (6) that is resistant to the etching attack is applied to the upper, first outer surface (2), said capping layer thus matching the contour of the cutouts (5). Afterward, the glass substrate (1) that has been coated in this way is etched further, further material removal occurring in the cutout (5) at the second outer surface (3) facing away from the capping layer (6), while the first outer surface (2), which is protected by the capping layer (6) as etching resist, is maintained unchanged. The progressive material removal results in a deepening (T) of the cutout (5) until the latter has finally reached a rear side (7) of the capping layer (6), and the etching process is ended. As a result, the capping layer (6) bridging the cutouts (5) acquires, according to the invention, a three-dimensionally contoured constitution which is usable for diverse application purposes.
An optical component, in particular a passive component, for optical waveguiding, includes: optical waveguides formed in a carrier substrate as a waveguide pattern. The optical waveguides are formed in the carrier substrate by recesses by cutting out the optical waveguide. In an embodiment, the optical waveguide is connected to the carrier substrate by web-shaped supporting structures.
G02B 6/122 - Basic optical elements, e.g. light-guiding paths
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems
33.
Method and device for the integration of semiconductor wafers
A method for the integration of semiconductor components in a confined space, in particular for 3D integration, in which, after positioning relative to a carrier substrate and/or a redistribution layer, the semiconductor components are protected and fixed in their relative position by introduction of a potting compound, characterized in that before the introduction of the potting compound, a glass substrate having a multiplicity of cutouts separated by partition walls and serving to receive a semiconductor component, is positioned in such a way that the semiconductor component is enclosed by the sidewall surfaces—facing it—of the respective partition walls of the glass substrate.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 23/00 - Details of semiconductor or other solid state devices
The invention relates to a method for producing metal tracks in microstructures formed in a glass slide by the locally specific metallization of microstructures formed in a glass slide. The microstructures are generated in cut-outs formed in the glass slide, particularly formed by irradiation with laser pulses at the points at which the cut-outs are to be generated and subsequent etching of the glass slides. The method has the benefit of selectively metallizing microstructures formed in glass slides so that the glass slides only have metal in microstructures, more particularly the method doing without a step of removing metal from the glass slide.
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
The invention relates to a method for connecting glass supports, which allows glass supports to be aligned in a location-specific manner and then connected to one another, and to the glass supports that have been aligned in a location-specific manner and connected to one another. In general terms, the method relates to connecting glass supports to one another, optionally also without location-specific alignment. The interconnected glass supports obtainable by the method according to the invention are characterised by a fixed bond to one another, which is preferably formed by solidified glass solder which engages interlockingly with the glass supports. Recesses pre-moulded in the glass support are used with glass solder to align and optionally to connect the glass supports.
C03C 15/00 - Surface treatment of glass, not in the form of fibres or filaments, by etching
C03C 17/04 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with glass by fritting glass powder
C03C 23/00 - Other surface treatment of glass not in the form of fibres or filaments
C03C 27/06 - Joining glass to glass by processes other than fusing
The invention relates to a method for producing glass substrates with conductor paths made of metal. The glass substrates have recesses, which form microstructures, wherein metal is arranged in the recesses and there is substantially no metal on the surface of the glass substrate, from which the recesses extend into the volume of the glass substrate.
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
The present invention relates to a method for producing a glass-plastic connection which is interlocking, and to an interlocking composite of glass and plastic, which is obtainable by the method. The method and the glass-plastic composite are characterized in that a glass, which is in particular planar, is not subjected to a mechanical load, which could lead to cracks, e.g. microcracks, either during the method or in the glass-plastic composite. Accordingly, the glass in the composite is connected to a plastic in a stress-free manner. The composite of glass and plastic is in particular gas-tight and/or fluid-tight.
C03C 15/00 - Surface treatment of glass, not in the form of fibres or filaments, by etching
C03C 17/32 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with organic material with synthetic or natural resins
C03C 17/42 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating of an organic material and at least one non-metal coating
C03C 23/00 - Other surface treatment of glass not in the form of fibres or filaments
C03C 27/06 - Joining glass to glass by processes other than fusing
38.
Method for microstructuring a glass substrate by means of laser radiation
A method for microstructuring a plate-shaped glass substrate by laser radiation includes: introducing one-sided recesses into the glass substrate, in which a focus of the laser radiation forms a spatial beam along a beam axis and in which the laser radiation creates modifications in the glass substrate along the beam axis so that an action of an etching medium subsequently creates the recesses in the glass substrate through anisotropic removal of material in a respective region of the modifications. A chemical composition of the glass substrate is partially changed and thus at least one region of changed properties is created before the action of the etching medium.
B23K 26/402 - Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
C03C 15/00 - Surface treatment of glass, not in the form of fibres or filaments, by etching
B23K 26/00 - Working by laser beam, e.g. welding, cutting or boring
B23K 26/361 - Removing material for deburring or mechanical trimming
C03B 33/02 - Cutting or splitting sheet glassApparatus or machines therefor
C03C 23/00 - Other surface treatment of glass not in the form of fibres or filaments
B23K 26/53 - Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
B23K 103/00 - Materials to be soldered, welded or cut
The method according to the invention relates to the production of microstructures in a substrate (1) having a membrane (2). The membrane (2) arises as a result of material weakening brought about by an etching process and as a result of material removal for producing a cut-out (3) in the substrate. For this purpose, in a first method step modifications (4) are introduced into the substrate (1) of glass along a peripheral contour (5) by means of laser radiation. In a first step, a sacrificial layer (6) not resistant to a wet-chemical etching bath is applied to the substrate (1) modified in such a way, and a membrane layer (7) resistant to the etching medium is applied to the sacrificial layer. Subsequently, an etching attack is performed by means of an etching medium, which is not described further. The etching attack leads to a line-shaped, groove-shaped removal of the substrate material along the peripheral contour (5). After the sacrificial layer (6) has been reached, the sacrificial layer disintegrates in accordance with the peripheral contour (5) and in the transverse direction. The region enclosed by the peripheral contour (5) thereby loses the adhesion or bonding thereof and can be removed from the substrate (1) in one piece.
A method for producing a technical mask includes: providing a technical mask including at least one plate-shaped substrate, the plate-shaped substrate being transparent to at least one laser wavelength; and producing at least one opening in the mask by laser-induced deep etching. In an embodiment, an etching attack takes place at least temporarily on one side during laser-induced deep etching.
B23K 26/53 - Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
C23C 14/04 - Coating on selected surface areas, e.g. using masks
B23K 103/00 - Materials to be soldered, welded or cut
42.
Method for producing at least one recess in a material by means of electromagnetic radiation and subsequent etching process
A method for creating at least one recess, in particular an aperture, in a transparent or transmissive material, includes: selectively modifying the material along a beam axis by electromagnetic radiation; and creating the at least one recess by one or more etching steps, using different etching rates in a modified region and in non-modified regions. The electromagnetic radiation produces modifications having different characteristics in the material along the beam axis such that the etching process in the material is heterogeneous and the etching rates differ from one another in regions modified with different characteristics under unchanged etching conditions.
B23K 26/53 - Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
C03C 15/00 - Surface treatment of glass, not in the form of fibres or filaments, by etching
B23K 26/00 - Working by laser beam, e.g. welding, cutting or boring
B23K 26/0622 - Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
B23K 26/402 - Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
The invention relates to the use of a component in a composition and/or the use of a composition comprising a component. The invention is characterized in that the component is a laser-activatable component which is activated by laser irradiation during use such that the viscosity and/or the elasticity and/or the tack of the composition is increased on the basis of the temperature increase of the composition.
An apparatus for joining, in particular laser welding, two components, in particular plastics components, comprises - two workpiece receptacles (1, 3) for respectively holding the two components (2, 4) to be connected, - in each case one bearing element, preferably a bearing plate (7), for each of the workpiece receptacles (1, 3), - a clamping drive (SA) for at least one bearing element for feeding and bracing of the two components (2, 4) held in the workpiece receptacles (1, 3) during the joining process, - a controller (9) for the clamping drive (SA) and in particular a laser welding device (LS), and - a mechanically loose coupling between the clamping drive (SA) and bearing element (7) such that the two workpiece receptacles (1, 3) are tiltable towards one another during feeding and bracing. Also disclosed is a method for operating such a joining apparatus during a joining process of two components (2, 4) held in the workpiece receptacles (1, 3), in particular during a laser welding process.
The invention relates to a method for the integration of semiconductor components (9) in a confined space, in particular for 3D integration, in which, after positioning relative to a supporting substrate (10) and/or redistribution layer RDL (13) the semiconductor components (9) are protected and fixed in their relative position by introduction of a potting compound (12), is characterised in that before the introduction of the potting compound (12) a glass substrate (1) having a plurality of recesses (2) separated by partitions (3) to receive a semiconductor component (9) is positioned in such a way that the semiconductor component (9) is surrounded by the side wall surfaces (8) facing the semiconductor component of the respective partitions (3) of the glass substrate (1).
The invention relates to an optical component for optical wave-guiding comprising an optical waveguide (3) formed in a carrier substrate (1) and generated by introducing recesses (2) and openings in the carrier substrate (1). For this purpose, two substantially parallel cutting lines are introduced by means of laser radiation, between which the optical waveguide (3) is thereby created. Connection regions remain as a support structure. The recesses (2) are introduced by means of the laser-induced deep etching method (LIDE). After the cutting free, an ion exchange occurs to change the refractive index of the carrier substrate (1). Subsequently, the surface of the edges of the optical waveguide (3) are treated with a thermal treatment, in particular with a selective thermal treatment, by means of laser radiation, in order to generate a rounded surface structure (5). In addition, scattering structures (6) are introduced for light de-coupling, which have a conical basic shape and are arranged on the rear side.
F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/122 - Basic optical elements, e.g. light-guiding paths
G02B 6/00 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings
09 - Scientific and electric apparatus and instruments
Goods & Services
(1) Machines and machine tools for treatment of printed circuit boards, ceramics, thin films, metals, glass and polymers using lasers; Precision machine tools, namely, laser cutting and engraving machines for machining workpieces
(2) Machine readable data carriers featuring programs for controlling machinery and mechanically operated equipment, namely, laser processing machines for manufacture of printed circuit boards and electronic components; Electrical circuit boards; Software for controlling laser operated machines used in manufacturing printed circuits boards and processing ceramics, thin films, metals, glass and polymers; Computer-aided design (CAD) software
09 - Scientific and electric apparatus and instruments
Goods & Services
(1) Milling machines; Milling tools [parts for machines]; Milling-drilling machines; Circuit board drills [machines and machine tools].
(2) Computer-aided design (CAD) software; X-Y plotters;Machine readable data carriers featuring programs for controlling machinery and mechanically operated equipment, namely, drilling and milling machines for manufacture of printed circuit boards, electric circuit boards and electric circuits; Electronic components, namely electric circuit boards, electric circuits, printed circuit boards; Electrical circuit boards;Software for controlling drilling and milling machines used in manufacturing printed circuits boards and processing ceramics, thin films, metals, glass and polymers.
49.
METHOD FOR PROCESSING, IN PARTICULAR SEPARATING, A SUBSTRATE BY MEANS OF LASER-INDUCED DEEP REACTIVE ETCHING
The invention relates to a method for processing a substrate by means of laser-induced deep reactive etching, wherein the laser radiation is moved along a processing line and individual pulses with a spatial laser pulse distance (d) are directed towards the substrate. An anisotropic material removal is then performed by means of etching at an etching rate (R) and an etching duration (t) under the condition 1 ᡶ d/(R*t) ᡶ 10-5.
B23K 26/402 - Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
C03B 33/02 - Cutting or splitting sheet glassApparatus or machines therefor
B23K 26/0622 - Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
B23K 26/53 - Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
B23K 103/00 - Materials to be soldered, welded or cut
50.
METHOD FOR PRODUCING AT LEAST ONE RECESS IN A MATERIAL BY MEANS OF ELECTROMAGNETIC RADIATION AND SUBSEQUENT ETCHING PROCESS
The invention relates to a method for producing at least one opening (1) in a transparent or transmissive glass substrate (2), the glass substrate (2) being selectively modified along a beam axis (s) by means of electromagnetic radiation, particularly a laser. By providing the modifications in the glass substrate (2) along the beam axis (s) by means of the electromagnetic radiation with different characteristics, for example by means of different pulse energy, the etching process in the glass substrate (2) is carried out non-homogeneously at different etching rates. This allows the possibility of forming the opening (1) created by the etching treatment in the transparent or transmissive material in a targeted and selective manner as a result of different characteristics of the modifications, and for example, varying the cone angle (α, β) of the opening (1).
C23C 14/04 - Coating on selected surface areas, e.g. using masks
B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
B23K 26/53 - Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
B23K 26/0622 - Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
B23K 103/00 - Materials to be soldered, welded or cut
The invention relates to a method for producing a technical mask (1) from a flat substrate (2), for example glass, sapphire or silicon. At least one opening of the mask (1) is produced by means of laser-induced deep etching, wherein the substrate (2) is transparent at least for the laser wavelength used during laser-induced deep etching. To this end, the substrate (2) is modified by the pulses of the laser along predefined machining lines (4) for isolating in particular closed contours (3). Local interruptions in the machining lines (4) in the form of connecting webs, known as break-out tabs, ensure that the contours (3) to be isolated are still initially connected to the flat substrate (2) after treatment with the etching solution. In the subsequent step, the flat substrate (2) pretreated in this way is treated with an etching solution, such as hydrofluoric acid (HF) or potassium hydroxide (KOH), as a result of which the non-modified regions of the substrate (2) are etched homogeneously and isotropically. The modified regions react anisotropically in relation to the non-treated regions of the substrate (2) and therefore directed depressions are initially formed at the treated sites until ultimately the material of the substrate (2) is completely dissolved at said sites.
An aspect of the invention provides a device, comprising: a laser machining head configured to deflect laser radiation onto an optical system comprising a substrate, the device being configured to carry out a method for separating the substrate using the optical system, the optical system being configured to provide the laser radiation, a thickness of the substrate not exceeding 2 mm in a region of a separating line, the method comprising: applying pulsed laser radiation having a pulse duration (t) to a substrate material of the substrate using the optical system, the substrate material being transparent at least in part to a laser wavelength of the pulsed laser radiation, the pulsed laser radiation being focused using the optical system at an original focal depth (f1), an intensity of the pulsed laser radiation leading to a modification of the substrate along a beam axis (Z) of the pulsed laser radiation.
C03B 33/02 - Cutting or splitting sheet glassApparatus or machines therefor
B23K 26/53 - Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
B23K 26/00 - Working by laser beam, e.g. welding, cutting or boring
B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
B23K 26/0622 - Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
C03B 33/033 - Apparatus for opening score lines in glass sheets
C03B 33/09 - Severing cooled glass by thermal shock
B23K 26/064 - Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
B23K 26/364 - Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
B23K 26/402 - Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
C03C 15/00 - Surface treatment of glass, not in the form of fibres or filaments, by etching
C03C 17/00 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating
A method for transferring a printing substance provided as a coating on a carrier onto a substrate by laser radiation from a laser beam source that comprises an amplifier and that has an output power includes initiating a transfer process at the start of an active phase during a first time period by a temporary increase in the output power above an upper power threshold of the laser radiation, and adjusting the output power during a second time period of the active phase following the first time period, wherein the output power is adjusted during the second time period constantly in the range between the upper power threshold and a lower power threshold. The laser radiation and the carrier are moved relative to one another and the output power of the laser beam source is time modulated.
B41J 2/44 - Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using single radiation source, e.g. lighting beams or shutter arrangements
B41J 2/47 - Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light
B41J 2/475 - Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material for heating selectively
B41J 2/455 - Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using laser arrays
54.
Method and a device for the welding of two parts to be joined made of thermoplastic synthetic materials along a weld seam by means of laser
A system for welding two parts to be joined made of thermoplastic synthetic materials along a weld seam by a laser operating with a laser beam having a beam direction within an operating field by a control method with control data corresponding to the weld-seam course to be produced, including a beam dimension in the region around its focus causing the welding, which is smaller in the joint plane than the target width of the weld seam to be produced, and is dependent upon the angle of incidence of the laser beam on the joint plane and/or upon the position of the focus relative to the joint plane, is displaced in a first movement component in a principal forward-feed direction along the track of the weld-seam to be produced, in a second, oscillating movement component superimposed over the former to cover the weld-seam width transversely to the principal forward-feed direction with an oscillation amplitude value, and is adjusted with a control method in its oscillation amplitude width in inverse dependence upon the beam dimension in the joint plane such that the width of the beam field covered by the laser beam in the transverse direction relative to the principal forward-feed direction corresponds to the target width of the weld seam.
The invention relates to a method for creating patterned coatings on a molded article, in particular for creating metal conductor path structures on non-planar, three-dimensional circuit substrates. In order to devise a subtractive method for the cost-effective mass production of such three-dimensional plastic circuit substrates having metal conductor path structures, the following steps are carried out: - providing a molded article which has a surface comprising a first area and a second area, at least one surface property in the first area of the surface being different from that in the second area; - applying a coating covering at least the first area and the second area to the surface of the molded article, the adhesion of said coating being greater in the first area than in the second area because of the at least one different surface property; and - partially removing the coating by means of a removal process which is applied to the entire coating at a constant removal power that is determined such that the entire coating is removed in the second area while the coating remains in place on the entire surface of each first area. Also disclosed is a device for carrying out said method.
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K 3/14 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material
C23C 24/04 - Impact or kinetic deposition of particles
H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
H05K 13/00 - Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
56.
METHOD FOR PRODUCING A MOLDED ITEM AND A COVERING LAYER FOR USE WITH THE METHOD
The invention relates to a method for producing an in particular three-dimensional molded item, in which first a covering layer is applied (1) to the molded item. Then, a plasma coating (2) is applied to the entire surface area of the surface of the molded item provided with the covering layer, by means of a plasma coating process. This produces, in part regions of the molded item in which the covering layer has been cut away, a strong adhesive connection (4) between the plasma coating (2) and the surface of the molded item. In this context, the material of the covering layer is altered in terms of its properties or is removed during the plasma coating (2), in that, prior to plasma coating (2) of the entire surface area, the covering layer is selectively modified (3) by means of laser radiation such that it forms, only in the non-modified regions, an anti-adhesion surface property during the subsequent plasma coating process. Surprisingly, covering layers which are not stable with respect to plasma coating (2) have considerable adhesion-reducing properties.
C23C 4/12 - Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
C23C 14/32 - Vacuum evaporation by explosionVacuum evaporation by evaporation and subsequent ionisation of the vapours
C23C 14/02 - Pretreatment of the material to be coated
C23C 14/20 - Metallic material, boron or silicon on organic substrates
57.
METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE STRUCTURE AND SUPPORT MATERIAL PRODUCED ACCORDING TO SAID METHOD
The invention relates to a method for producing an electrical conductive structure, in particular a conductor path, on a non-conductive support material which contains an additive having at least one metal compound. Said support material is at least partially exposed to electromagnetic radiation in order to activate the metal compounds contained in the additive, catalytically active germs thus forming in the activated areas with respect to an external, currentless metallization, said germs generating the electrically conductive structure on the non-conductive support material. During the method and prior to metallization, in order to efficiently and economically increase the proportion and the activity of the catalytically active germs, at least one part of the germs in the activated areas is substituted by a chemical exchange reaction by means of at least one catalytically active metal as an exchange metal. Also, the metallization takes place on the exchange metal and the optionally remaining, catalytically active germs in an external currentless metallization bath. As a result, in particular all two-step metallization processes become superfluous due to the fact that the claimed essentially increased catalytic activity allows a simple and fast metallization. The claimed method is suitable, preferably, also for plastic materials as support material which display a lower metallization suitability.
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 18/20 - Pretreatment of the material to be coated of organic surfaces, e.g. resins
The invention relates to a method for introducing at least one cutout (4), in particular in the form of an aperture, into a sheetlike workpiece (1) having a thickness of less than 3 millimetres. To this end, a laser beam (2) is directed onto the surface of the workpiece (1). The exposure time of the laser beam (2) is selected to be extremely short so that only a modification of the workpiece (1) concentrically around a beam axis of the laser beam occurs. Such a modified region having defects (3) results in a chain of blisters. In a subsequent method step, as a result of the action of a corrosive medium, anisotropic material removal takes place by successive etching in those regions of the workpiece (1) that are formed by the defects (3) and have previously been modified by the laser beam (2). As a result, along the cylindrical zone of action, a cutout (4) is produced as an aperture in the workpiece (1).
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
C03C 23/00 - Other surface treatment of glass not in the form of fibres or filaments
A method and device for separating a substrate with a laser beam. The duration of the laser beam's effect is extremely short, so the substrate is only modified concentrically about the laser beam axis (Z) without it degrading the substrate material. While the laser beam acts upon the substrate, the substrate moves relative to a laser machining head, producing plural filament-type modifications along a separating surface to be incorporated. The laser beam is initially diverted by a transmission medium having a higher intensity dependent refractive index than air, then reaches the substrate. The non-constant pulsed laser intensity increases to a maximum over the temporal course of the single pulse, then reduces, and the refractive index changes. The laser beam focus point moves between the substrate's outer surfaces along the beam axis (Z), reaching the desired modification along the beam axis (Z) without correcting the laser machining head in the z-axis.
A method for producing a recess or through-opening in a substrate includes applying pulsed laser radiation to the substrate. The laser radiation is focused using an optical system at an original focal depth and, by non-linear self-focusing within the pulse duration of an individual pulse, is also focused by the optical system at a focal depth different from the original focal depth. A difference between the focal depths corresponds to or is greater than the longitudinal extent of the recess or though-opening to be produced. The laser radiation modifies the substrate along a beam axis of the laser radiation in the region of the recess or through-opening, but does not result in removal of the substrate material necessary to form the recess or the through-opening. The substrate material in the modified region is anisotropically removed to produce the recess or through-opening in the substrate.
B23K 26/382 - Removing material by boring or cutting by boring
B23K 26/0622 - Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
B23K 26/064 - Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
B23K 26/53 - Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
B23K 26/00 - Working by laser beam, e.g. welding, cutting or boring
B23K 26/402 - Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
B23K 103/00 - Materials to be soldered, welded or cut
A system for welding two thermoplastic parts to be joined (8, 9) along a weld seam (3) by means of a laser works with a laser beam (2) which - is controlled in its beam direction (R) within a working area (A) by a control method using control data corresponding to the weld seam profile to be produced, - has in the region around its focal point (f) that brings about the welding a beam dimension, in particular a beam diameter (d), that in the joining plane (F) is smaller than the target width (B) of the weld seam (S) to be produced and also is dependent on the angle of incidence (W) of the laser beam (2) on the joining plane (F) and/or on the position of the focal point (f) in relation to the joining plane (F), - is moved in a first movement component in a main advancing direction (H) along the path of the weld seam (S) to be produced, - is moved in a second, oscillating movement component, overlaid on the first, to cover the weld seam width (B) transversely to the main advancing direction (H) with an oscillation amplitude swing (OAW), and - is set by a control method in its oscillation amplitude swing (OAW) in inverse dependence on the beam dimension in the joining plane (F), preferably the beam diameter (d), in such a way that the width of the beam area passed over by the laser beam (2) in the transverse direction with respect to the main advancing direction (H) corresponds to the target width (B) of the weld seam (S).
This invention relates to products of aqueous and other chemical synthetic routes for encapsulation of a core material with an inorganic shell and finished compositions of a core-shell particulate material for application in thermoplastic, thermoset, and coatings resins prior to compounding or application or subsequent thermal processing steps. Disclosed is a composition of particles containing a shell of inorganic oxides or mixed-metal inorganic oxides and a core material of complex inorganic colored pigment, laser direct structuring additives, laser marking, or other beneficial metal oxides, metal compounds, or mixed-metal oxide materials, wherein the shell material is comprised of any single oxide or combination of oxides is taught. Preferred elements of composition for the shell are oxides and silicates of B, Ni, Zn, Al, Zr, Si, Sn, Bi, W, Mo, Cr, Mg, Mn, Ce, Ti, and Ba (or mixtures thereof). Applications may include, but are not limited to, coatings or plastic articles or materials for molded interconnect devices, durable goods, housings, assemblies, devices, and articles that are to be exposed to additional thermal processing. The resulting core-shell materials function in plastic and coatings formulations by minimizing or eliminating detrimental interactions with the resins and metal containing additives resulting in loss of mechanical properties.
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
63.
BEAM-ASSISTED JOINING MACHINE, IN PARTICULAR LASER TRANSMISSION WELDING DEVICE HAVING A CLAMPING MEANS FORMED BY A FLEXIBLE CLAMPING HOSE
The invention relates to a beam-assisted joining machine, in particular a laser transmission welding device, comprising a beam head (1) for providing a joining beam (L) that produces a weld (5) between two components (3, 4), a holder (6) for supporting the first component (3), a clamping device (2) for clamping the components (3, 4), in particular for clamping components (3, 4) having a weld (5) extending in three dimensions, which clamping device (2) has a clamping frame (11) that cooperates with the holder (6) and has a clamping means for producing a clamping force (F) between the two components (3, 4) at least in the region of the particular joining zone to which the joining beam (L) is applied, and a flexible clamping hose (9), which acts on the two components (3, 4) as a clamping means and is arranged the cross-section of the clamping hose between the clamping frame (11) and the components (3, 4) and the clamping force (F) of which is produced by introducing a pressure fluid into the hose lumen (SL).
B23K 37/04 - Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
B25B 5/06 - Arrangements for positively actuating jaws
The invention relates to a method and device for creating, by means of a laser beam, a plurality of recesses (5) in a substrate (2) which can be used as an interposer, and to a substrate (2) produced in said manner. According to the invention, a laser beam (3) is directed to the surface of a substrate (2). The duration of the effect of the laser beam (3) is extremely short such that the substrate (2) is only modified concentrically about the laser beam axis (Z) without it reaching a recess of the substrate material. Said laser beam (3) is initially diverted by a transmission medium (8) having a higher intensity-dependent refractive index than air, and subsequently reaching the substrate (2). As the intensity of the used pulsed laser is not constant but increases to a maximum over the temporal course of the single pulse, and then reduces, the refractive index also changes. The focus point (9a) of the laser beam (3) moves between the outer surfaces (11, 12) of the substrate (2) along the beam axis (Z) such that it reaches the desired modification along the beam axis (Z) without correcting the laser processing head (10) in the z-axis.
The invention relates to a method and device for separating a substrate (2) by means of a laser beam (3). The duration of the effect of the laser beam (3) is extremely short such that the substrate (2) is only modified concentrically about the laser beam axis (Z) without it degrading the substrate material. Whilst the laser beam (3) acts upon the substrate (2), said substrate (2) moves relative to a laser machining head (10) such that a plurality of filament-type modifications are produced along a separating surface (5) which is to be incorporated. Said laser beam (3) is initially diverted by a transmission medium (8) having a higher intensity-dependent refractive index than air, and subsequently reaches the substrate (2). As the intensity of the used pulsed laser is not constant but increases to a maximum over the temporal course of the single pulse, and then reduces, the refractive index also changes. The focus point (9a) of the laser beam (3) moves between the outer surfaces (11, 12) of the substrate (2) along the beam axis (Z) such that it reaches the desired modification along the beam axis (Z) without correcting the laser machining head (10) in the z-axis.
H01S 3/00 - Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
66.
METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE STRUCTURE ON A NON-CONDUCTIVE SUBSTRATE MATERIAL, AND ADDITIVE AND SUBSTRATE MATERIAL INTENDED THEREFOR
The invention relates to a method for producing an electrically conductive structure, in particular a conducting track, on a non-conductive substrate material, which contains an additive (1) having at least one metal compound. For this purpose, the substrate material is irradiated by means of a laser in order to selectively activate the metal compounds, for example inorganic metal compounds, contained in the additive (1). The metal seeds formed by the activation are then metallized in order to create the electrically conductive structure on the substrate material. Because the additive (1) is provided with an in particular full-surface coating before the additive is introduced into the substrate material, such that the additive (1) is reduced and the coating is oxidized by the laser activation, the reaction partners necessary for the required chemical reaction with the additive (1) are provided by the coating. Because of the thereby significantly reduced interaction with the substrate material, the limitation to certain plastics or plastic groups also is lifted.
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 18/18 - Pretreatment of the material to be coated
C23C 18/20 - Pretreatment of the material to be coated of organic surfaces, e.g. resins
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
The invention relates to a method for the metallation of a workpiece surface. The workpiece surface is provided, in the regions to be metallized, with periodic microstructures (6) that are preferably transfered to the workpiece surface by forming or molding a tool (2) microstructured by means of laser radiation (5). Then at least the microstructured regions of the workpiece surface are metallized in an adhesive manner in order to produce the layer structure.
C25D 5/00 - Electroplating characterised by the processPretreatment or after-treatment of workpieces
C25D 5/02 - Electroplating of selected surface areas
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 18/20 - Pretreatment of the material to be coated of organic surfaces, e.g. resins
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
C23C 18/18 - Pretreatment of the material to be coated
A device and a method for performing and monitoring a plastic laser transmission welding process includes a processing beam source for emitting a processing radiation into a joining zone between two joining members so that a weld seam is formed, a measuring beam source for irradiating a measuring zone with a measuring radiation, a detection unit for detecting the measuring radiation reflected by an interface between the weld seam and its surroundings in the joining members, and an evaluation unit connected to the detection unit for determining the depth position of the interface in the joining members from the detected reflected measuring radiation.
B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
B29C 65/00 - Joining of preformed partsApparatus therefor
B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials
G01J 5/00 - Radiation pyrometry, e.g. infrared or optical thermometry
Disclosed is a method for joining a joining partner made of a thermoplastic material to a joining partner made of glass, characterised by the following method steps: producing a thermoplastic joining partner (2) made of a laser-absorbing thermoplastic material; producing a glass joining partner (1) made of a laser-transmissive glass material; superimposing the thermoplastic joining partner (2) and the glass joining partner (1) by applying a joining force (F) to the joining partners (1, 2); heating the glass joining partner (1), in particular using radiation (15); and applying a laser processing beam (3) onto the boundary surface (20) of the thermoplastic joining partner (2)through the glass joining partner (1) into a joining zone (18) so as to melt the thermoplastic joining partner (2) and so as to form a bond between the two joining partners (1, 2) in the joining zone (18) in conjunction with the cooling thereof.
The invention relates to device for position control of a laser machining beam relative to topographical structural markers, in particular of depressions, in surfaces of workpieces, comprising: a control apparatus (11), a laser beam feed apparatus (3, 4) for providing a laser machining beam (2), a laser beam positioning apparatus (5) controlled by the control apparatus (11), for position control of the laser machining beam (2) on the surface (14) relative to the structural markers (27), and an optical detection apparatus (16) for the structural markers (27), having an illumination apparatus (17) for generating a parallel beam bundle (24), which illuminates the surface (14) having the structural markers (27) to be detected in a scanning field (A), and a camera (25) capturing the scanning field (A) for recording the beam bundle (24), which is reflected by the surface (14) and changed by the structural markers (27), wherein the camera image can be evaluated by the control apparatus (11) for detection of the position of the structural markers (27) and for corresponding position control of the laser machining beam (2).
The invention relates to a method for producing a conductor trace structure (4) on a dielectric carrier material (1). The carrier material (1) is first furnished with a flat coating (2). Nanoscale particles containing a substantial material content of metal oxides such as copper oxides, which are coated with a suitable reduction agent, are contained in the coating (2). Then, the coating (2) is exposed selectively to an electromagnetic radiation from a laser (3). Due to selective action of radiation, this results in a sintering of particles contained in or generated in situ in the coating (2), producing the conductive trace structure (4).
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
72.
RADIATION BEAM-ASSISTED JOINING MACHINE, IN PARTICULAR LASER TRANSMISSION WELDING DEVICE
A radiation assisted joining machine, in particular laser transmission welding device, comprises an irradiation head (1) for providing a joining radiation beam (2) that generates a joint seam (5) between two components (3, 4), a receptacle (7) for mounting the first component (3), and a clamping device for clamping the components (3, 4), in particular for clamping components (3, 4) with a three-dimensionally running joint seam (5), which clamping device has clamping means (11, 19) adapted to the path of the joint seam for generating a clamping force between the two components (3, 4) at least in the region of each joining zone (F) to which the joining radiation beam (2) is applied, wherein a magnetic or magnetisable strip (11) that is adapted to the path of the joint seam (5) is provided as a clamping means and applies a clamping force (A) to the components (3, 4) by means of a control magnet (19) guided with the joining radiation beam (2), the clamping force being due to the magnetic forces acting between the strip (11) and the control magnet (19) at least in the region of the joining zone (F) to which the joining radiation beam (2) is applied.
B23K 37/04 - Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
B23K 26/08 - Devices involving relative movement between laser beam and workpiece
F21V 17/10 - Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
73.
Method for introducing electrical insulations in printed circuit boards
A method for introducing electrical insulations in a printed circuit board includes selectively introducing groove-shaped recesses between different regions of an electrically conductive layer on a substrate along a machining path using a thermal energy input such that end portions of each of the recesses or different ones of the recesses are joined to one another. The end portions are introduced parallel to one another without overlap such that a strip-shaped region of the conductive layer is initially retained between the end portions so as to insulate the different regions.
H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
74.
Method for partially stripping a defined area of a conductive layer
A method for partial detachment of a defined area of a conductive layer using a laser beam includes forming a conductor track with a defined path from the conductive layer on the substrate, the path defining main axes. The area is segmented into zones. A linear recess is provided along a respective perimeter of each of the zones. Each of the zones has a strip shape such that the recesses extend along paths that are substantially straight lines not parallel to either of the main axes. One of the zones to be removed is heated using laser radiation until adhesion of the conductive layer to the substrate is substantially reduced and the zone to be removed is detached in a surface-wide manner from the substrate under external influences. Laser-beam parameters are set such that only the conductive layer is removed without affecting an underlying substrate.
H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
In a method and device for laser welding of two plastic members to be joined, in which a focused laser beam (1) is irradiated into a welding zone (S) in the area of the boundary surfaces (4, 5) facing one another of the members to be joined (2, 3) in order to form a weld seam (7) with a defined seam depth (T) between the members to be joined (2, 3), it is provided that the laser power density in the direction (z) of the seam depth (T) in the welding zone (S) is modulated during the welding process.
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
76.
DEVICE AND METHOD FOR CARRYING OUT AND MONITORING A PLASTIC LASER TRANSMISSION WELDING PROCESS
A device and a method for carrying out and monitoring a plastic laser transmission welding process comprises a processing beam source for emitting a processing beam into a joining zone (1) between two parts being joined (2, 3) while forming a weld (4), a measuring beam source (6) for irradiating a measuring zone (12) with a measuring beam (7), a detection unit (13) for detecting the measuring beam (7) reflected by an interface (5) between the weld (4) and its surroundings in the parts being joined (2, 3), and an evaluation unit (15), connected to the detection unit (13), for determining the depth position of the interface (5) in the parts being joined (2, 3) from the reflected measuring beam (7) that is detected.
The invention relates to a method for partially stripping a defined area of a conductive layer from a substrate (1). For this purpose, in a first method step, the area is firstly subdivided into regions (4) by means of a laser beam (3). For this purpose, the laser beam parameters are set in such a way that only the conductive layer is removed, without the underlying substrate (1) that carries the conductive layer also being impaired at the same time in the process. For this purpose, each of these strip-shaped regions (4) is thermally insulated from the adjoining regions (4) of the conductive layer by the introduction of a linear cutout (5) along a respective periphery of the regions (4). For this purpose, the cutouts (5) are introduced as substantially parallel straight lines that form an acute angle (α) of 22.5° with the principal axes (X, Y) determined by the known course of the conductor track (2). In this way, a parallel course of the cutouts (5) with respect to a conductor track (2) is approximately precluded in practice, such that a thermal energy input parallel to the conductor track (2) during the process of stripping away the region (4) adjacent to the conductor track (2) and thus damage to the latter are avoided. In a subsequent method step, the regions (4) are removed upon simultaneous heating by means of a fluid flow, the orientation of which relative to the cutouts (5) is set in such a way that the fluid flow impinges on the cutouts (5) neither parallel nor orthogonally.
H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
The invention relates to a method for introducing grooved cutouts (2, 3) between different regions (4, 5) of a printed circuit board. In order to reliably produce the electrical insulation between the regions (4, 5) in a simple manner, the end sections (7, 8) of the cutouts (2, 3) run along parallel straight lines and enclose a strip-shaped region (9) between them. On account of the introduction of heat during the introduction of the end sections (7, 8), the adhesion forces of the strip-shaped region (9) are reduced in such a way that the latter independently detaches from the substrate or can be removed effortlessly with the aid of a jet of compressed air. Direct laser radiation directed onto said strip-shaped region (9) is therefore dispensable.
H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
79.
ARRAY HAVING AN ACOUSTO-OPTIC SWITCH COMPRISING AN ACOUSTO-OPTIC MODULATOR
The invention relates to an array having an acousto-optic switch (2) which comprises an acousto-optic modulator (3) and through which a fed laser beam (4) passes multiple times in order to increase the efficiency. A small residual amount strikes a first mirror (10) as an undiffracted laser beam (9). Said first mirror (10) is inclined with respect to the second main plane (11) of the acousto-optical modulator (3) by an angle (α) that is large compared to the Bragg angle (ΘB) such that the laser beam (7, 9) deflected at the first mirror (10) passes through the acousto-optic modular (3) practically without being influenced. The laser beams (7, 9) are reflected by a further mirror (12) and again deflected to the acousto-optic modulator (3). For this purpose, the further mirror (12) is not disposed parallel to the first mirror (10), but inclined relative thereto by the amount of the Bragg angle (ΘB). Accordingly, the residual amount of the laser beam (9), which is not diffracted during the first passage thereof through the acousto-optic modulator (3) and reflected by the two mirrors (10, 12), enters the acousto-optic modulator (3) at a negative Bragg angle (-ΘB). As a result, the orientations of all decoupled laser beams (7, 15, 16) deviate from each other such that said beams can easily be separated.
G02F 1/11 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on acousto-optical elements, e.g. using variable diffraction by sound or like mechanical waves
A printing machine having a colorant support, a transfer device, a delivery apparatus, and a colorant stripper. The transfer device is arranged to transfer colorant from a reservoir onto the colorant support such that during operation of the printing machine, a colorant is transferred from the transfer device onto the colorant support. The delivery apparatus is arranged to deliver at least part of the colorant from the colorant support onto a printing medium or a transfer means. The colorant support and the colorant stripper are arranged so that during operation of the printing machine, non-consumed colorant is transferred from the colorant support onto the colorant stripper. The invention is also a method for printing using such an apparatus.
09 - Scientific and electric apparatus and instruments
40 - Treatment of materials; recycling, air and water treatment,
Goods & Services
(1) Machinery and mechanically operated devices, namely laser engraving and welding machines for manufacturing printed circuit boards and electronic components and structural parts therefor; machine-readable data carriers, namely optical discs, CDs and DVDs, hard discs, floppy discs, minidiscs, memory cards, memory sticks, USB flash drives, magneto-optical discs and magnetic tapes, all of the foregoing containing programs for controlling machinery and mechanically operated equipment, and electronically controlled equipment for the milling and drilling of electronic and electrical components, printed circuit boards, material and interconnected electrical components. (1) Machining of materials using laser technology, milling and drilling of electronic and electrical components, printed circuit boards, materials and interconnected electrical components.
82.
Clamping apparatus for clamping at least two component parts
The invention relates to a clamping device for clamping at least two components (6, 7) in a radiation-protected machine tool, particularly in a laser welding device (1), comprising—a receptacle (18) for supporting the first component (6), —a clamping head (16) for applying a force to the second component (7) in order to generate clamping pressure at the joint surface (8, 9) between the two components (6, 7), —an inner clamping jaw (11) located within the peripheral beam path (10) of the machine tool, the jaw having a clamping surface (12) for internally clamping the components (6, 7), and—narrow connecting struts (15) for connecting the inner clamping jaw (11) to the external clamping head (16), said connecting struts (15) bridging the passage gap (7) in the clamping head (16) allowing access for the beam path (10) of the machine tool to the components (6, 7).
09 - Scientific and electric apparatus and instruments
Goods & Services
(1) Machinery and mechanically operated equipment for the milling and drilling of printed circuit boards, also electronically controlled; parts of the aforesaid apparatus and equipment; machine-readable data carriers containing programs for controlling machinery and mechanically operated equipment (also electronically controlled) for the milling and drilling of printed circuit boards; electrical printed circuit boards.
09 - Scientific and electric apparatus and instruments
Goods & Services
(1) Machine-readable data carriers, namely, optical discs, namely, CD's and DVD's, hard discs, floppy discs, minidiscs, memory cards, memory sticks USB flash drives, magneto-optical discs and magnetic tapes, all of the foregoing containing programs for controlling machinery, mechanically operated equipment, and electronically controlled equipment for laser and mechanical processing of various substrates and substrate materials.
85.
METHOD AND DEVICE FOR MACHINING A PRINTED CIRCUIT BOARD
The invention relates to a method and to a device (1) for machining a printed circuit board (2). The device (1) is used to introduce a groove-shaped recess (3) in the form of a milled channel into a conductive layer (4) of the printed circuit board (2) in order to produce conductors along a predetermined movement path that are electrically insulated from each other. To this end, the device (1) has a conical milling tool (5), by which the conductive layer (4) disposed on a substrate (6) is removed. In order to machine the printed circuit board (2), the milling tool (5) is disposed on a machining head (7) that can be displaced in different spatial axes. The device (1) is furthermore equipped with an optical sensor (8) configured as a camera in order to detect the width (b) and accordingly displace the machining head (7) in the direction of the z-axis. During the milling operation, the milling result is detected a short spatial distance behind the milling tool (5) either continuously or in short time intervals. To this end, the optical sensor (8) not only detects the width (b) of the groove-shaped recess (3), but additionally, on the basis of the different reflection properties of the conductive layer (4) and the substrate (6), also the complete removal of the conductive layer (4) in a groove base (9).
H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
B23Q 17/24 - Arrangements for indicating or measuring on machine tools using optics
86.
DEVICE FOR MACHINING A WORKPIECE BY MEANS OF PARALLEL LASER BEAMS
The invention relates to a device (1) for machining a workpiece (2) by means of a number of at least approximately parallel laser beams (3', 3', 4', 4'), which form an outer, first pair of laser beams (3) and an inner, second pair of laser beams (4). The laser beams (3', 3') of the outer, first pair of laser beams (3) are deflected precisely three times and the laser beams (4', 4') of the inner, second pair of laser beams (4) are deflected precisely once at a number of reflection surfaces (8', 8', 9', 9', 10', 10', 11', 11', 12', 12'). This reflection ratio of 3:1 has the effect that the spacing (a', a') of all the laser beams (3', 3', 4', 4') from the respectively adjacent laser beam (3', 3', 4', 4') remains constant, irrespective of the absolute position, which can be set as desired. To avoid shifting of the focusing plane (6), the focusing optics (5) respectively assigned to the laser beams (3', 3', 4', 4') are in this case jointly movable together with the reflection surfaces (10', 10', 11', 11', 12', 12') of the reflector (14', 14') by means of a single drive.
The invention relates to a clamping device for clamping at least two components (6, 7) in a radiation-protected machine tool, particularly in a laser welding device (1), comprising - a receptacle (18) for supporting the first component (6), - a clamping head (16) for applying a force to the second component (7) in order to generate clamping pressure at the joint surface (8, 9) between the two components (6, 7), - an inner clamping jaw (11) located within the peripheral beam path (10) of the machine tool, the jaw having a clamping surface (12) for internally clamping the components (6, 7), and - narrow connecting struts (15) for connecting the inner clamping jaw (11) to the external clamping head (16), said connecting struts (15) bridging the passage gap (7) in the clamping head (16) allowing access for the beam path (10) of the machine tool to the components (6, 7).
The invention relates to a device for machining a workpiece (3) by means of a laser beam, comprising an extraction head (1), which is designed for the suction (5) of the emissions released, can be positioned in relation to the workpiece (3), includes a working zone and is connected to working optics (2). Furthermore, the invention relates to a method for protecting working optics (2) for laser working from emissions of the working process, in which the air is laterally extracted in a working zone. The invention is designed to extract fumes and particles that are produced during the cutting of a workpiece (3), in particular of semiconductor materials, and to avoid contamination of the focusing and working optics (2). For this purpose, the extraction head (1) is additionally equipped with a lateral air supply (4) for an essentially horizontal flow at high flow velocity in the region between the suction (5) and the working optics (2). This device carries out the method according to the invention, in which particles and gases are initially removed by suction (5) between the workpiece (3) and the working optics, the particles and gases that are not taken up by the extractor (5) being deflected in their direction of movement by an air supply (4) parallel to the workpiece and removed.
B23K 26/14 - Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beamNozzles therefor
B23K 26/16 - Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
B08B 5/04 - Cleaning by suction, with or without auxiliary action
89.
DEVICE FOR MACHINING A WORKPIECE BY MEANS OF LASER RADIATION
The invention relates to a device (1) for machining a workpiece (2) by means of parallel partial beams (3, 4) of a laser radiation (5). Arranged in the beam path of each partial beam (3, 4) is a reflector (8, 9) that deflects the respective partial beam (3, 4) into a common plane (10) parallel to a focusing plane (11) - corresponding to the surface of the workpiece (2) - in the direction of mutually opposite deflection surfaces (12, 13) of a common deflection element (14). The deflection surfaces (12, 13) are in each case arranged in a manner inclined by an angle (ß = 45°) with respect to the focusing plane (11), such that the partial beams (3, 4) are focused onto the workpiece (2) in parallel fashion. In order to enable the distance (A1, A2) between the parallel partial beams (3, 4) on the workpiece (2) without any change in the focusing plane (11), an assigned focusing optical unit (15, 16) in the beam path of each partial beam (3, 4) is arranged such that it can be moved vertically together with the respective reflector (8, 9) of the same partial beam (3, 4) relative to the deflection surface (12, 13) perpendicular to the focusing plane (11) into different positions (y1, y2) by a difference magnitude (ﶴy). The respective distance (A1, A2) between the partial beams (3, 4) thereby changes by a corresponding matching difference magnitude (ﶴx) with respect to a central position (17) between the partial beams (3, 4) such that the ray path is unchanged independently of the position (y1, y2).
The invention relates to a method for production of a support material (2) in currentless metallization baths and a conductor track structure (1) correspondingly produced on the support material (2). The sheet of support material (2) is firstly subject to a selective electromagnetic radiation (3) from a Nd:YAG laser to generate the conductor track structures (1) on the support material (2) in the form of highly reactive aluminium particles by the decomposition of non-conducting aluminium nitride which is finely dispersed in the support material (2). Nitrogen is simultaneously released which prevents an undesirable oxidation of the aluminium particles. At least one copper layer is then currentlessly deposited on the conductor track structure (1). An accelerated process for generation of adhered metallisation of a surface structure in currentless baths is thus achieved.
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
