Polyplastics-Evonik Corporation

Japan

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IPC Class
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins 6
B32B 27/34 - Layered products essentially comprising synthetic resin comprising polyamides 5
C08L 77/00 - Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chainCompositions of derivatives of such polymers 5
C08L 101/00 - Compositions of unspecified macromolecular compounds 3
A61C 13/087 - Artificial resin teeth 2
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NICE Class
01 - Chemical and biological materials for industrial, scientific and agricultural use 6
17 - Rubber and plastic; packing and insulating materials 6
25 - Clothing; footwear; headgear 4
02 - Paints, varnishes, lacquers 1
Status
Pending 6
Registered / In Force 28

1.

THERMOSETTING RESIN COMPOSITION AND THERMOSET PRODUCT

      
Application Number 18686178
Status Pending
Filing Date 2022-08-04
First Publication Date 2026-06-04
Owner POLYPLASTICS-EVONIK CORPORATION (Japan)
Inventor
  • Mutsuda, Mitsuteru
  • Ochiai, Takuya
  • Nakaie, Yoshiki
  • Fujiki, Daisuke

Abstract

The present disclosure is a thermosetting resin composition and the like, the thermosetting resin composition including: a first resin that is a thermosetting resin; and composite particles, wherein the composite particles contain a second resin and an inorganic filler, and an amount of the inorganic filler in a total amount of the second resin and the inorganic filler is from 0.1 to 70 wt. %.

IPC Classes  ?

  • C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins

2.

CROSSLINKED BODY AND METHOD FOR PRODUCING CROSSLINKED BODY

      
Application Number JP2025037250
Publication Number 2026/089009
Status In Force
Filing Date 2025-10-23
Publication Date 2026-04-30
Owner POLYPLASTICS-EVONIK CORPORATION (Japan)
Inventor
  • Kitagawa, Tomoki
  • Mutsuda, Mitsuteru
  • Ochiai, Takuya

Abstract

The present invention pertains to a crosslinked body. Said crosslinked body is formed from a composition containing a polyoctenamer and a crosslinking agent. The polyoctenamer has a structure represented by formula (1). The crosslinking agent contains an organic peroxide and does not contain a stabilizer.

IPC Classes  ?

  • C08G 61/06 - Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds
  • C08K 5/14 - Peroxides
  • C08L 65/00 - Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chainCompositions of derivatives of such polymers

3.

CROSSLINKED BODY

      
Application Number JP2025037264
Publication Number 2026/089013
Status In Force
Filing Date 2025-10-23
Publication Date 2026-04-30
Owner POLYPLASTICS-EVONIK CORPORATION (Japan)
Inventor
  • Kitagawa, Tomoki
  • Mutsuda, Mitsuteru
  • Ochiai, Takuya

Abstract

A crosslinked body which is a crosslinked body of a polyoctenamer, wherein the polyoctenamer has a structure represented by formula (1), and the crosslinked body does not contain an organic peroxide.

IPC Classes  ?

  • C08J 3/24 - Crosslinking, e.g. vulcanising, of macromolecules

4.

RESIN COMPOSITION AND CROSSLINKED PRODUCT

      
Application Number JP2025037272
Publication Number 2026/089017
Status In Force
Filing Date 2025-10-23
Publication Date 2026-04-30
Owner POLYPLASTICS-EVONIK CORPORATION (Japan)
Inventor
  • Kitagawa, Tomoki
  • Mutsuda, Mitsuteru
  • Ochiai, Takuya

Abstract

Provided are: a resin composition including a polyoctenamer having the structure represented by formula (1), and an organic natural filler; and a crosslinked product thereof.

IPC Classes  ?

  • C08L 65/00 - Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chainCompositions of derivatives of such polymers
  • C08G 61/06 - Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds
  • C08L 1/02 - CelluloseModified cellulose

5.

FIBER

      
Application Number JP2025037245
Publication Number 2026/089005
Status In Force
Filing Date 2025-10-23
Publication Date 2026-04-30
Owner
  • POLYPLASTICS-EVONIK CORPORATION (Japan)
  • KURARAY CO., LTD. (Japan)
Inventor
  • Kitagawa, Tomoki
  • Mutsuda, Mitsuteru
  • Ochiai, Takuya
  • Tachibana, Kaname
  • Kato, Masaya
  • Koizumi, Satoshi
  • Okamoto, Tetsuya

Abstract

This fiber comprises a crosslinked body, wherein the crosslinked body is a crosslinked body of a polyoctenomer, the polyoctenomer has a structure represented by formula (1), and the crosslinked body does not contain an organic peroxide.

IPC Classes  ?

  • D01F 6/04 - Monocomponent man-made filaments or the like of synthetic polymersManufacture thereof from homopolymers obtained by reactions only involving carbon-to-carbon unsaturated bonds from polyolefins
  • D06M 10/00 - Physical treatment of fibres, threads, yarns, fabrics or fibrous goods made from such materials, e.g. ultrasonic, corona discharge, irradiation, electric currents or magnetic fieldsPhysical treatment combined with treatment with chemical compounds or elements

6.

THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT

      
Application Number 19107429
Status Pending
Filing Date 2023-08-18
First Publication Date 2026-03-19
Owner POLYPLASTICS-EVONIK CORPORATION (Japan)
Inventor
  • Nakaie, Yoshiki
  • Fujiki, Daisuke

Abstract

The present disclosure provides a thermosetting resin composition containing: a first resin which is a thermosetting resin; and resin particles containing a second resin having an amide bond.

IPC Classes  ?

  • C08L 77/02 - Polyamides derived from omega-amino carboxylic acids or from lactams thereof
  • B32B 27/34 - Layered products essentially comprising synthetic resin comprising polyamides
  • C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
  • C08L 29/04 - Polyvinyl alcoholPartially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
  • C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins

7.

RESIN COMPOSITION FOR ADHESIVE LAYER, AND MULTILAYER TUBE

      
Application Number 18695046
Status Pending
Filing Date 2022-04-27
First Publication Date 2025-08-07
Owner
  • POLYPLASTICS-EVONIK CORPORATION (Japan)
  • TORAY INDUSTRIES, INC. (Japan)
Inventor
  • Ochiai, Takuya
  • Onoue, Yosuke
  • Sato, Rei
  • Okubo, Kazuya

Abstract

The present disclosure relates to a resin composition for an adhesive layer. The resin composition contains: a polyphenylene sulfide-based resin (A); a polyamide resin (B); a first thermoplastic resin (C) containing at least one type of functional group selected from the group consisting of an epoxy group, an acid anhydride group, a carboxyl group, a carboxylic acid salt, and a carboxylic acid ester; and a second thermoplastic resin (D) that is free of epoxy groups, acid anhydride groups, carboxyl groups, carboxylic acid salts, and carboxylic acid esters. The resin composition contains, with respect to 100 parts by weight of the polyphenylene sulfide-based resin (A), from 80 to 300 parts by weight of the polyamide resin (B), from 20 to 200 parts by weight of the first thermoplastic resin (C), and from 10 to 100 parts by weight of the second thermoplastic resin (D), and a terminal amino group concentration of the polyamide resin (B) is from 48 to 120 mmol/kg.

IPC Classes  ?

  • C09J 177/00 - Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chainAdhesives based on derivatives of such polymers
  • B29C 48/00 - Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired formApparatus therefor
  • B29C 48/09 - Articles with cross-sections having partially or fully enclosed cavities, e.g. pipes or channels
  • B29C 48/21 - Articles comprising two or more components, e.g. co-extruded layers the components being layers the layers being joined at their surfaces
  • B29K 23/00 - Use of polyalkenes as moulding material
  • B29K 33/04 - Polymers of esters
  • B29K 77/00 - Use of polyamides, e.g. polyesteramides, as moulding material
  • B29K 81/00 - Use of polymers having sulfur, with or without nitrogen, oxygen or carbon only, in the main chain, as moulding material
  • B29K 105/00 - Condition, form or state of moulded material

8.

DENTAL BLOCK MATERIAL AND DENTAL BLOCK

      
Application Number JP2024046065
Publication Number 2025/143080
Status In Force
Filing Date 2024-12-26
Publication Date 2025-07-03
Owner POLYPLASTICS-EVONIK CORPORATION (Japan)
Inventor
  • Akashi, Tatsuki
  • Isono, Komei

Abstract

Provided is a dental block material containing poly(ether ether ketone) and an inorganic filler. The content ratio of the inorganic filler in the dental block material is not less than 10 mass% but less than 30 mass%, and the melt viscosity of the dental block material at a temperature of 380°C and a shear rate of 1216 (sec-1) is 450-690 Pa·sec.

IPC Classes  ?

  • A61K 6/891 - Compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
  • A61C 5/70 - Tooth crownsMaking thereof
  • A61C 13/087 - Artificial resin teeth
  • A61K 6/15 - Compositions characterised by their physical properties
  • A61K 6/71 - Fillers
  • A61K 6/813 - Preparations for artificial teeth, for filling teeth or for capping teeth comprising ceramics comprising iron oxide
  • A61K 6/816 - Preparations for artificial teeth, for filling teeth or for capping teeth comprising ceramics comprising titanium oxide

9.

DENTAL BLOCK AND METHOD FOR PRODUCING DENTAL BLOCK

      
Application Number JP2024046068
Publication Number 2025/143083
Status In Force
Filing Date 2024-12-26
Publication Date 2025-07-03
Owner POLYPLASTICS-EVONIK CORPORATION (Japan)
Inventor
  • Fujii, Sayaka
  • Isono, Komei

Abstract

This dental block includes a pin section and a block section. The dental block is characterized by the following: the dental block contains a thermoplastic resin; the pin section and the block section are integrally formed; and product identification information is printed on the pin section.

IPC Classes  ?

  • A61C 5/77 - Methods or devices for making crowns
  • A61C 13/083 - Porcelain or ceramic teeth
  • A61C 13/087 - Artificial resin teeth
  • A61K 6/15 - Compositions characterised by their physical properties
  • A61K 6/71 - Fillers
  • A61K 6/891 - Compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds

10.

POLARIZING LAMINATE AND OPTICAL LENS

      
Application Number JP2024042417
Publication Number 2025/116030
Status In Force
Filing Date 2024-11-29
Publication Date 2025-06-05
Owner POLYPLASTICS-EVONIK CORPORATION (Japan)
Inventor
  • Fujinaka, Toshihiko
  • Omae, Hitomi
  • Akagi, Koki
  • Fujiki, Daisuke

Abstract

Provided is a polarizing laminate in which a first protective layer and a second protective layer are laminated onto the two surfaces of a polarizing layer with an adhesive layer therebetween, the polarizing laminate being characterized in that: if the peel strength of the polarizing laminate is measured under conditions in which the tensile speed is 100 mm/min, then the peel strength is 2.0-30.0 N/10 mm; and the absolute value of the difference between the peel strength between the polarizing layer and the first protective layer and the peel strength between the polarizing layer and the second protective layer is 0.2-8.0 N/10 mm.

IPC Classes  ?

  • G02B 5/30 - Polarising elements
  • B32B 7/022 - Mechanical properties
  • B32B 7/023 - Optical properties
  • B32B 27/40 - Layered products essentially comprising synthetic resin comprising polyurethanes
  • G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
  • G02C 7/12 - Polarisers

11.

POLARIZING LAMINATE AND OPTICAL LENS

      
Application Number JP2024040427
Publication Number 2025/105417
Status In Force
Filing Date 2024-11-14
Publication Date 2025-05-22
Owner POLYPLASTICS-EVONIK CORPORATION (Japan)
Inventor
  • Fujinaka, Toshihiko
  • Fujiki, Daisuke

Abstract

Provided is a polarizing laminate in which a first protective layer and a second protective layer are laminated on both surfaces of a polarizing layer via an adhesive layer, the polarizing laminate being characterized in that the polarizing laminate includes a base material layer, the base material layer includes an additive, and the additive satisfies one or more requirements selected from the group consisting of requirements (1) to (3). Requirement (1): the additive includes one or more compounds A selected from the group consisting of stearic acid and a stearate, and the content of the compound A is 10-5000 mass ppm with respect to the base material layer. Requirement (2): the additive includes an ultraviolet absorber, and the content of the ultraviolet absorber is 10-50,000 mass ppm with respect to the base material layer. Requirement (3): the additive includes a heat-resistant stabilizer, and the content of the heat-resistant stabilizer is 10-5000 mass ppm with respect to the base material layer.

IPC Classes  ?

  • G02B 5/30 - Polarising elements
  • B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
  • B32B 27/34 - Layered products essentially comprising synthetic resin comprising polyamides
  • G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics

12.

FOAMED BODY, FOAMED FILM, AND LAMINATED FILM

      
Application Number 18691707
Status Pending
Filing Date 2022-09-01
First Publication Date 2025-04-17
Owner
  • POLYPLASTICS-EVONIK CORPORATION (Japan)
  • INOAC CORPORATION (Japan)
Inventor
  • Akashi, Tatsuki
  • Mutsuda, Mitsuteru
  • Tanaka, Keisuke
  • Nishimura, Hiroyuki
  • Kondo, Yuji

Abstract

The present disclosure provides a foamed body or the like, the foamed body containing polyether ether ketone and polyetherimide, in which a ratio of the mass of the polyether ether ketone to the mass of the polyetherimide is from 50/50 to 87/13.

IPC Classes  ?

  • B32B 5/18 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material

13.

RESIN COMPOSITION AND GEAR

      
Application Number JP2024036062
Publication Number 2025/079594
Status In Force
Filing Date 2024-10-09
Publication Date 2025-04-17
Owner POLYPLASTICS-EVONIK CORPORATION (Japan)
Inventor
  • Akashi, Tatsuki
  • Iguchi, Hirofumi

Abstract

Provided is a resin composition containing a polyaryl ketone, wherein the resin composition contains a polysiloxane, the polysiloxane contains a structure represented by formula (1), a peak corresponding to a cyclic siloxane is detected in pyrolysis GC/MS of the resin composition, and the content ratio of the polysiloxane in the resin composition is 0.25-1.25 mass%. (In formula (1), R1and R2 each independently represent a C1-3 alkyl group.)

IPC Classes  ?

  • C08L 71/10 - Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
  • C08L 83/04 - Polysiloxanes
  • F16H 55/06 - Use of materialsUse of treatments of toothed members or worms to affect their intrinsic material properties

14.

WAVEGUIDE

      
Application Number JP2024015255
Publication Number 2025/027950
Status In Force
Filing Date 2024-04-17
Publication Date 2025-02-06
Owner POLYPLASTICS-EVONIK CORPORATION (Japan)
Inventor
  • Akashi, Tatsuki
  • Haga, Motoharu

Abstract

The present disclosure relates to a waveguide having a transmission layer for transmitting an electromagnetic wave and a coating layer for coating a surface of this transmission layer and provides a waveguide high in transmission efficiency and excellent in heat resistance and adhesion between the transmission layer and the coating layer 3. The present disclosure is a waveguide having a transmission layer for transmitting electromagnetic waves and a coating layer for coating the surface of the transmission layer, wherein the transmission layer contains an aromatic polyether ketone and the coating layer is a layer of a foam body containing an aromatic polyether ketone.

IPC Classes  ?

  • H01P 3/16 - Dielectric waveguides, i.e. without a longitudinal conductor

15.

THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT

      
Application Number 18681654
Status Pending
Filing Date 2023-05-10
First Publication Date 2024-10-31
Owner POLYPLASTICS-EVONIK CORPORATION (Japan)
Inventor
  • Mutsuda, Mitsuteru
  • Nakaie, Yoshiki
  • Fujiki, Daisuke

Abstract

The present disclosure provides a thermosetting resin composition which can give a cured product having high toughness and in which the resin particles are unlikely to absorb moisture, and the like. The present disclosure relates to a thermosetting resin composition containing a thermosetting resin and resin particles, in which the resin particles contain a polyamide resin and a polyolefin resin, and the content of the polyamide resin in the resin particles is 50% by weight or more, and the like.

IPC Classes  ?

  • C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
  • C08L 77/06 - Polyamides derived from polyamines and polycarboxylic acids

16.

THERMOPLASTIC RESIN COMPOSITION, RESIN SHEET, AND LAMINATED SHEET

      
Application Number 18580084
Status Pending
Filing Date 2022-06-15
First Publication Date 2024-10-17
Owner POLYPLASTICS-EVONIK CORPORATION (Japan)
Inventor
  • Mutsuda, Mitsuteru
  • Ochiai, Takuya
  • Fujiki, Daisuke

Abstract

The present disclosure provides a thermoplastic resin composition and the like to be used for molding a resin sheet, in which the resin sheet is to be used in cross-linking adhesion with rubber. The thermoplastic resin composition includes a thermoplastic resin including a first polyamide (A) having a melting point of from 180° C. to 230° C. and a block copolymer (B) containing a second polyamide and a polyether. A ratio of a weight of the first polyamide (A) to a weight of the block copolymer (B) is from 65/35 to 85/15, and the thermoplastic resin composition has an amino group concentration of 20 mmol/kg or more.

IPC Classes  ?

  • C08L 77/10 - Polyamides derived from aromatically bound amino and carboxyl groups of amino carboxylic acids or of polyamines and polycarboxylic acids
  • B32B 25/04 - Layered products essentially comprising natural or synthetic rubber comprising rubber as the main or only constituent of a layer, next to another layer of a specific substance
  • B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
  • B32B 27/34 - Layered products essentially comprising synthetic resin comprising polyamides
  • B32B 38/00 - Ancillary operations in connection with laminating processes
  • C08J 5/18 - Manufacture of films or sheets

17.

THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT

      
Application Number JP2023029838
Publication Number 2024/111181
Status In Force
Filing Date 2023-08-18
Publication Date 2024-05-30
Owner POLYPLASTICS-EVONIK CORPORATION (Japan)
Inventor
  • Nakaie, Yoshiki
  • Fujiki, Daisuke

Abstract

The present disclosure provides: a thermosetting resin composition from which a cured product having a higher level of toughness can be obtained; and the like. The present disclosure pertains to: a thermosetting resin composition containing a first resin which is a thermosetting resin and resin particles which contain a second resin having an amide bond; and the like. The second resin includes at least one second functional group selected from the group consisting of an amino group, a carboxy group, an isocyanate group, and a carboxylic anhydride group. The first resin includes a first functional group that can react with the second functional group. The second resin includes the second functional group in an amount of 25-190 mmol/kg. The relative viscosity of the second resin is 1.50-2.50.

IPC Classes  ?

  • C08L 101/00 - Compositions of unspecified macromolecular compounds
  • C08J 3/12 - Powdering or granulating
  • C08J 5/04 - Reinforcing macromolecular compounds with loose or coherent fibrous material
  • C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
  • C08L 77/00 - Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chainCompositions of derivatives of such polymers

18.

RESIN PARTICLE

      
Application Number JP2023017569
Publication Number 2023/223911
Status In Force
Filing Date 2023-05-10
Publication Date 2023-11-23
Owner POLYPLASTICS-EVONIK CORPORATION (Japan)
Inventor
  • Mutsuda, Mitsuteru
  • Nakaie, Yoshiki
  • Fujiki, Daisuke

Abstract

The present disclosure provides a resin particle which does not easily absorb moisture and in which the specific gravity of a resin composition for resin particles is low, said resin particle also containing a first resin that easily absorbs moisture and has an amide bond. The present disclosure relates to a resin particle containing: a first resin having an amide bond and a first functional group; and a second resin that is a polyolefin resin having a second functional group which can react with the first functional group.

IPC Classes  ?

  • C08J 3/12 - Powdering or granulating
  • C08L 77/00 - Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chainCompositions of derivatives of such polymers

19.

THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT

      
Application Number JP2023017570
Publication Number 2023/223912
Status In Force
Filing Date 2023-05-10
Publication Date 2023-11-23
Owner POLYPLASTICS-EVONIK CORPORATION (Japan)
Inventor
  • Mutsuda, Mitsuteru
  • Nakaie, Yoshiki
  • Fujiki, Daisuke

Abstract

The present disclosure provides a thermosetting resin composition from which a cured product having high toughness is obtained and which has resin particles that hardly absorb moisture. The present disclosure is a thermosetting resin composition containing a thermosetting resin and resin particles, wherein the resin particles contain a polyamide resin and a polyolefin resin, and the content of the polyamide resin in the resin particles is at least 50 wt%.

IPC Classes  ?

  • C08L 101/00 - Compositions of unspecified macromolecular compounds
  • C08L 23/00 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCompositions of derivatives of such polymers
  • C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
  • C08L 77/00 - Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chainCompositions of derivatives of such polymers

20.

Laminate, method for producing same, and use of same

      
Application Number 18013142
Grant Number 12472667
Status In Force
Filing Date 2021-06-09
First Publication Date 2023-08-03
Grant Date 2025-11-18
Owner POLYPLASTICS-EVONIK CORPORATION (Japan)
Inventor
  • Mutsuda, Mitsuteru
  • Fujinaka, Toshihiko
  • Fujiki, Daisuke
  • Nakaie, Yoshiki

Abstract

Prepared is a laminate including: a first layer formed of a first resin composition containing a first resin; and a second layer formed of a second resin composition containing a second resin, the first layer and the second layer being in contact with each other and integrated. The first resin includes an alicyclic polyamide resin having 20 mmol/kg or greater of amino groups, and the second resin includes an acid-modified (meth)acrylic resin. The second resin may have 100 mmol/kg or greater of carboxyl groups. The acid-modified (meth)acrylic resin may be an acid-modified polymethylmethacrylate resin. An average thickness of the first layer may be 0.15 times or more of an average thickness of the second layer. The average thickness of the first layer may be 200 μm or greater. When a weight is dropped onto the second layer side, the laminate may have a DuPont impact strength of 500 N/inch or greater. The laminate has excellent transparency, lightness, light resistance, and impact resistance.

IPC Classes  ?

  • B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
  • B29C 45/00 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor
  • B29K 33/00 - Use of polymers of unsaturated acids or derivatives thereof, as moulding material
  • B29K 77/00 - Use of polyamides, e.g. polyesteramides, as moulding material
  • B29K 105/00 - Condition, form or state of moulded material
  • B29L 31/10 - Building elements, e.g. bricks, blocks, tiles, panels, posts, beams
  • B29L 31/30 - Vehicles, e.g. ships or aircraft, or body parts thereof

21.

RESIN COMPOSITION FOR ADHESIVE LAYER, AND MULTILAYER TUBE

      
Application Number JP2022019171
Publication Number 2023/079775
Status In Force
Filing Date 2022-04-27
Publication Date 2023-05-11
Owner
  • POLYPLASTICS-EVONIK CORPORATION (Japan)
  • TORAY INDUSTRIES, INC. (Japan)
Inventor
  • Ochiai, Takuya
  • Onoue, Yosuke
  • Sato, Rei
  • Okubo, Kazuya

Abstract

The present disclosure pertains to a resin composition for an adhesive layer and the like, the resin composition containing: a polyphenylene sulfide-based resin (A); a polyamide resin (B); a first thermoplastic resin (C) which has at least one functional group selected from among an epoxy group, an acid anhydride group, a carboxyl group, a carboxylate, and a carboxylic acid ester; and a second thermoplastic resin (D) which does not have any of an epoxy group, an acid anhydride group, a carboxyl group, a carboxylate, and a carboxylic acid ester, wherein 80-300 parts by weight of the polyamide resin (B), 20-200 parts by weight of the first thermoplastic resin (C), and 10-100 parts by weight of the second thermoplastic resin (D) are contained with respect to 100 parts by weight of the polyphenylene sulfide-based resin (A), and the concentration of terminal amino groups in the polyamide resin (B) is 48-120 mmol/kg.

IPC Classes  ?

  • B32B 27/00 - Layered products essentially comprising synthetic resin
  • C08L 77/00 - Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chainCompositions of derivatives of such polymers
  • C08L 81/02 - PolythioethersPolythioether-ethers
  • C08L 101/02 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups
  • B32B 1/08 - Tubular products
  • F16L 11/06 - Hoses, i.e. flexible pipes made of rubber or flexible plastics with homogeneous wall

22.

FOAMED BODY, FOAMED FILM, AND LAMINATED FILM

      
Application Number JP2022033016
Publication Number 2023/047914
Status In Force
Filing Date 2022-09-01
Publication Date 2023-03-30
Owner
  • POLYPLASTICS-EVONIK CORPORATION (Japan)
  • INOAC CORPORATION (Japan)
Inventor
  • Akashi, Tatsuki
  • Mutsuda, Mitsuteru
  • Tanaka, Keisuke
  • Nishimura, Hiroyuki
  • Kondo, Yuji

Abstract

The present disclosure is a foamed body and the like, containing polyether ether ketone and polyether imide, wherein the mass ratio of polyether ether ketone to polyether imide is 50/50 to 87/13.

IPC Classes  ?

  • C08J 9/04 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent
  • B32B 5/18 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material
  • B32B 27/34 - Layered products essentially comprising synthetic resin comprising polyamides

23.

THERMOSETTING RESIN COMPOSITION AND HEAT CURED PRODUCT

      
Application Number JP2022030009
Publication Number 2023/026817
Status In Force
Filing Date 2022-08-04
Publication Date 2023-03-02
Owner POLYPLASTICS-EVONIK CORPORATION (Japan)
Inventor
  • Mutsuda, Mitsuteru
  • Ochiai, Takuya
  • Nakaie, Yoshiki
  • Fujiki, Daisuke

Abstract

The present disclosure relates to a thermosetting resin composition including a first resin which is a thermosetting resin, and compound particles. The compound particles contain a second resin and an inorganic filler, and the amount of inorganic filler in the total of the amount of second resin and the amount of inorganic filler is 0.1 to 70 wt%.

IPC Classes  ?

  • C08L 101/00 - Compositions of unspecified macromolecular compounds
  • C08J 3/16 - Powdering or granulating by coagulating dispersions
  • C08K 3/04 - Carbon
  • C08K 3/22 - OxidesHydroxides of metals
  • C08K 3/34 - Silicon-containing compounds
  • C08K 3/36 - Silica
  • C08K 9/04 - Ingredients treated with organic substances
  • C08L 61/06 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
  • C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
  • C08L 77/00 - Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chainCompositions of derivatives of such polymers
  • C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
  • C08L 81/06 - PolysulfonesPolyethersulfones

24.

THERMOPLASTIC RESIN COMPOSITION, RESIN SHEET, AND LAMINATED SHEET

      
Application Number JP2022023952
Publication Number 2023/002780
Status In Force
Filing Date 2022-06-15
Publication Date 2023-01-26
Owner POLYPLASTICS-EVONIK CORPORATION (Japan)
Inventor
  • Mutsuda, Mitsuteru
  • Ochiai, Takuya
  • Fujiki, Daisuke

Abstract

The present disclosure is, inter alia, a thermoplastic resin composition to be used to form a resin sheet, wherein the resin sheet is to be used in crosslinking adhesion with a rubber, the thermoplastic resin composition contains a thermoplastic resin, the thermoplastic resin includes a first polyamide (A) having a melting point of 180-230°C and a block copolymer (B) of a second polyamide and a polyether, the ratio of the weight of the first polyamide (A) to the weight of the block copolymer (B) is 65/35-85/15, and the amino group concentration in the thermoplastic resin composition is 20 mmol/kg or greater.

IPC Classes  ?

  • C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
  • B32B 25/08 - Layered products essentially comprising natural or synthetic rubber comprising rubber as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • B32B 27/00 - Layered products essentially comprising synthetic resin
  • B32B 27/34 - Layered products essentially comprising synthetic resin comprising polyamides
  • C09J 177/00 - Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chainAdhesives based on derivatives of such polymers

25.

PE POLYPLASTICS EVONIK

      
Application Number 1708531
Status Registered
Filing Date 2022-07-07
Registration Date 2022-07-07
Owner Polyplastics-Evonik Corporation (Japan)
NICE Classes  ?
  • 01 - Chemical and biological materials for industrial, scientific and agricultural use
  • 02 - Paints, varnishes, lacquers
  • 17 - Rubber and plastic; packing and insulating materials

Goods & Services

Industrial chemicals; chemical preparations for use in industry; chemical preparations for use in the manufacture of pharmaceuticals; chemical preparations for use in the manufacture of sanitary preparations for medical purposes; amino acids for industrial purposes; sizing compounds for use in manufacture; plasticizers for plastics; chemical intensifiers for rubber; catalysts for use in the manufacture of rubber; chemicals for use in the production of synthetic rubber; unprocessed plastics; plastics in unprocessed form, in powder, liquid or paste form; polyamide resins, unprocessed; artificial and synthetic resins, unprocessed; synthetic resin adhesives for industrial purposes; plastic adhesives for industrial purposes; adhesives for use in the construction industry; adhesives and glues for industrial and commercial use; groundwood pulp or chemical pulps for manufacturing purposes; chemimechanical pulp; cellulose pulp. Dyes; synthetic dyes; synthetic resin-based paints; coating compositions in the nature of paint; pigments; printing ink. Semi-processed plastics; semi-processed synthetic resins; plastics in the form of sheets, block and rods; plastics in extruded form for use in further manufacturing; flexible plastic tubes and pipes; rubber tubes and pipes; synthetic rubber; semi-worked rubber; unprocessed rubber; styrene-butadiene rubber; insulating coatings; semi-processed synthetic resins in the form of tubes and pipes for use in manufacture; thermoplastic elastomer resins in the form of tubes and pipes for use in manufacture.

26.

PE POLYPLASTICS EVONIK

      
Serial Number 79360691
Status Registered
Filing Date 2022-07-07
Registration Date 2025-05-20
Owner Polyplastics-Evonik Corporation (Japan)
NICE Classes  ?
  • 01 - Chemical and biological materials for industrial, scientific and agricultural use
  • 17 - Rubber and plastic; packing and insulating materials

Goods & Services

Industrial chemicals; chemical preparations for use in industry; chemical preparations for use in the manufacture of pharmaceuticals; chemical preparations for use in the manufacture of sanitary preparations for medical purposes; amino acids for industrial purposes; sizing compounds for use in the manufacture of paper, textile, and fiber; plasticizers for plastics; chemical intensifiers for rubber, namely, adhesive for rubber; catalysts for use in the manufacture of rubber; chemicals for use in the production of synthetic rubber; unprocessed plastics; plastics in unprocessed form, in powder, liquid or paste form; polyamide resins, unprocessed; artificial and synthetic resins, unprocessed; synthetic resin adhesives for industrial purposes; plastic adhesives for industrial purposes; adhesives for use in the construction industry; adhesives and glues for industrial and commercial use; groundwood pulp and chemical pulps for manufacturing purposes; chemimechanical pulp; cellulose pulp Semi-processed plastics; semi-processed synthetic resins; plastics in the form of sheets, block and rods for use in manufacturing; plastics in extruded form for use in further manufacturing; flexible plastic tubes and pipes; rubber tubes and pipes; synthetic rubber; semi-worked rubber; unprocessed rubber; styrene-butadiene rubber; insulating coatings; semi- processed synthetic resins in the form of tubes and pipes for use in manufacture; thermoplastic elastomer resins in the form of tubes and pipes for use in manufacture

27.

MENDEX

      
Application Number 1510699
Status Registered
Filing Date 2019-12-12
Registration Date 2019-12-12
Owner Polyplastics-Evonik Corporation (Japan)
NICE Classes  ? 01 - Chemical and biological materials for industrial, scientific and agricultural use

Goods & Services

Adhesives and glues for industrial purposes.

28.

MENDEX

      
Application Number 200896000
Status Registered
Filing Date 2019-12-12
Registration Date 2022-04-27
Owner Polyplastics-Evonik Corporation (Japan)
NICE Classes  ? 01 - Chemical and biological materials for industrial, scientific and agricultural use

Goods & Services

(1) Adhesives for use in the automotive industry; adhesives for use in the construction industry; glue for use in the automobile industry

29.

MENDEX

      
Serial Number 79277161
Status Registered
Filing Date 2019-12-12
Registration Date 2020-06-30
Owner Polyplastics-Evonik Corporation (Japan)
NICE Classes  ? 01 - Chemical and biological materials for industrial, scientific and agricultural use

Goods & Services

Adhesives and glues for industrial purposes

30.

R-COMPO

      
Application Number 015175375
Status Registered
Filing Date 2016-03-03
Registration Date 2016-07-06
Owner Polyplastics-Evonik Corporation (Japan)
NICE Classes  ?
  • 17 - Rubber and plastic; packing and insulating materials
  • 25 - Clothing; footwear; headgear

Goods & Services

Plastic sheets bonded with rubber pieces; plastic sheets bonded with anti-skid rubber sheets; plastic moldings bonded with rubber sheets; plastic sheets bonded with rubber sheets; other semi-worked plastic products; rubber (raw or semi-worked); semi-processed plastics; semi-worked plastic substances; self-adhesive plastic sheets for use in manufacturing. Plastic soles bonded with rubber pieces; plastic soles bonded with anti-skid rubber sheets; plastic soles moldings bonded with rubber pieces; plastic soles bonded with rubber sheets; boots for sports (other than horse riding boots); shoes and boots (other than shoe dowels, shoe pegs, shoe handles, hobnails and shoe protective metal members); soles for footwear; sports shoes; shoes.

31.

DAIAMID

      
Serial Number 86466859
Status Registered
Filing Date 2014-11-28
Registration Date 2015-11-10
Owner POLYPLASTICS-EVONIK CORPORATION (Japan)
NICE Classes  ? 01 - Chemical and biological materials for industrial, scientific and agricultural use

Goods & Services

Adhesive substances for use in industry; unprocessed artificial and synthetic resins; chemical additives for use in the manufacture of cosmetics and paints; plastic molding compounds for use in the manufacture of molded plastic articles; unprocessed polyamide resins; polymer beads for use in manufacturing; polymers and polymeric additives for use in the manufacture of pharmaceutical preparations, medical devices, plastics, cosmetics, personal care products, coatings, adhesives, and lubricants; polymers and polymeric additives for use in the manufacture of industrial products, consumer and household products, sealants, and automotive fluids; unprocessed synthetic resin compounds in the form of microspheres used to incorporate various other substances; unprocessed synthetic resins for use in the manufacture of molding compounds; unprocessed synthetic resins for use in manufacturing cosmetics; unprocessed plastic in the form of powder or granules; chemical preparations for use in the manufacture of paints

32.

Miscellaneous Design

      
Application Number 1057423
Status Registered
Filing Date 2010-07-26
Registration Date 2010-07-26
Owner Polyplastics-Evonik Corporation (Japan)
NICE Classes  ?
  • 17 - Rubber and plastic; packing and insulating materials
  • 25 - Clothing; footwear; headgear

Goods & Services

Plastic sheets bonded with rubber pieces; plastic sheets bonded with anti-skid rubber sheets; plastic moldings bonded with rubber sheets; plastic sheets bonded with rubber sheets; other semi-worked plastic products; rubber (raw or semi-worked). Plastic sloes bonded with rubber pieces; plastic soles bonded with anti-skid rubber sheets; plastic soles moldings bonded with rubber pieces; plastic soles bonded with rubber sheets; boots for sports (other than horse riding boots); shoes and boots (other than shoe dowels, shoe pegs, shoe handles, hobnails and shoe protective metal members).

33.

R-COMPO

      
Application Number 1057699
Status Registered
Filing Date 2010-07-26
Registration Date 2010-07-26
Owner Polyplastics-Evonik Corporation (Japan)
NICE Classes  ?
  • 17 - Rubber and plastic; packing and insulating materials
  • 25 - Clothing; footwear; headgear

Goods & Services

Plastic sheets bonded with rubber pieces; plastic sheets bonded with anti-skid rubber sheets; plastic moldings bonded with rubber sheets; plastic sheets bonded with rubber sheets; other semi-worked plastic products; rubber (raw or semi-worked). Plastic sloes bonded with rubber pieces; plastic soles bonded with anti-skid rubber sheets; plastic soles moldings bonded with rubber pieces; plastic soles bonded with rubber sheets; boots for sports (other than horse riding boots); shoes and boots (other than shoe dowels, shoe pegs, shoe handles, hobnails and shoe protective metal members).

34.

R-COMPO

      
Serial Number 79089763
Status Registered
Filing Date 2010-07-26
Registration Date 2011-08-16
Owner Polyplastics-Evonik Corporation (Japan)
NICE Classes  ?
  • 17 - Rubber and plastic; packing and insulating materials
  • 25 - Clothing; footwear; headgear

Goods & Services

Plastic sheets bonded with rubber pieces for use in the manufacture of shoes and shoe soles; plastic sheets bonded with anti-skid rubber sheets for use in the manufacture of shoes and shoe soles; plastic moldings bonded with rubber sheets; plastic sheets bonded with rubber sheets for use in the manufacture of shoes and shoe soles; rubber, raw or semi-worked Plastic shoe soles bonded with rubber pieces; plastic shoe soles bonded with anti-skid rubber sheets; plastic shoe soles moldings bonded with rubber pieces; plastic shoe soles bonded with rubber sheets