A light system comprises at least three separate individual rigid metal LED heat sinks each having a respective substantially planar outwardly facing LED support surface and a flexible printed circuit board. The flexible printed circuit board comprises a flexible substrate carrying a plurality of LEDs, electrical control components, electrical input components and electrical traces. LED regions of the flexible printed circuit board carrying the LEDs are disposed on the outwardly facing LED support surfaces with light-emitting surfaces of the LEDs outwardly facing. Adjacent LED heat sinks are foldably coupled to one another by joints formed by fold regions of the flexible printed circuit board extending between respective spaced-apart edges of the adjacent ones of the LED heat sinks. Each adjacent pair of the outwardly facing LED support surfaces are non-parallel to one another whereby the outwardly facing LED support surfaces are disposed on notional faces of a notional polyhedron.
F21V 19/00 - Fastening of light sources or lamp holders
F21V 23/04 - Arrangement of electric circuit elements in or on lighting devices the elements being switches
F21V 29/70 - Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
F21Y 107/40 - Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
F21Y 107/70 - Light sources with three-dimensionally disposed light-generating elements on flexible or deformable supports or substrates, e.g. for changing the light source into a desired form
A light system comprises at least three rigid metal LED heat sinks each having a respective substantially planar outwardly facing LED support surface and a flexible printed circuit board. The flexible printed circuit board comprises a flexible substrate carrying a plurality of LEDs, electrical control components, electrical input components and electrical traces. LED regions of the flexible printed circuit board carrying the LEDs are disposed on the outwardly facing LED support surfaces with light-emitting surfaces of the LEDs outwardly facing. Adjacent ones of the LED heat sinks are foldably coupled to one another by joints formed by fold regions of the flexible printed circuit board extending between respective spaced-apart edges of the adjacent ones of the LED heat sinks. Each adjacent pair of the outwardly facing LED support surfaces are non-parallel to one another whereby the outwardly facing LED support surfaces are disposed on notional faces of a notional polyhedron.
F21V 29/70 - Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
F21V 29/508 - Cooling arrangements characterised by the adaptation for cooling of specific components of electrical circuits
F21V 29/73 - Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements being adjustable with respect to each other, e.g. hinged
F21K 9/00 - Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
F21S 45/47 - Passive cooling, e.g. using fins, thermal conductive elements or openings
H05B 45/10 - Controlling the intensity of the light
B60Q 1/52 - Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic for indicating other intentions or conditions, e.g. request for waiting or overtaking for indicating emergencies
