Abstract

An oil-free water-based cutting fluid is disclosed. The cutting fluid comprises water, hexagonal boron nitride (hBN) particles, a dispersant, and a corrosion inhibitor. The hexagonal boron nitride (hBN) particles are hydrophilic particles having wettability in water. The hexagonal boron nitride (hBN) particle exhibits hydrophilicity solely through a heat-treatment synthesis process. The hexagonal boron nitride (hBN) particle exhibits hydrophilicity through dry surface treatment.

IPC Classes  ?

• C10M 125/26 - Compounds containing silicon or boron, e.g. silica, sand
• C10M 173/02 - Lubricating compositions containing more than 10% water not containing mineral or fatty oils
• C10N 30/04 - Detergent or dispersant property
• C10N 30/12 - Inhibition of corrosion, e.g. anti-rust agents, anti-corrosives
• C10N 40/22 - Metal working with essential removal of material

Abstract

Proposed is an aqueous suspension including water, a hexagonal boron nitride (hBN) particle, and a dispersant. A cutting fluid prepared by diluting the aqueous suspension with water is also proposed. The hexagonal boron nitride (hBN) particle is a hydrophilic particle that is wettable with water. The hexagonal boron nitride (hBN) particle has a particle size D50 of 30 to 250 nm and a particle size D90 of 1 um or less for a primary particle and a secondary particle through an application of ultrasound for 24 hours. The hexagonal boron nitride (hBN) particle is synthesized at a temperature of 1600° C. or lower. The hexagonal boron nitride (hBN) particle is mixed with water at a weight ratio of 10 or less, and the dispersant is mixed at a weight ratio of 10 or less.

IPC Classes  ?

• C10M 173/02 - Lubricating compositions containing more than 10% water not containing mineral or fatty oils
• C10N 40/22 - Metal working with essential removal of material
• C10N 50/04 - Aerosol

Abstract

Disclosed is an oil-free water-based cutting fluid comprising water, hexagonal boron nitride (hBN) particles, a dispersant, and a rust inhibitor, wherein the hexagonal boron nitride (hBN) particles are hydrophilic particles that are wettable by water.

IPC Classes  ?

• C10M 173/02 - Lubricating compositions containing more than 10% water not containing mineral or fatty oils
• C10N 30/12 - Inhibition of corrosion, e.g. anti-rust agents, anti-corrosives
• C10N 40/22 - Metal working with essential removal of material

Abstract

The present invention relates to an aqueous suspension and a cutting fluid comprising same. The aqueous suspension comprises: water; hexagonal boron nitride (hBN) particles, which are hydrophilic particles that are wettable in water, and a dispersant, wherein the hexagonal boron nitride particles are uniformly dispersed and remain in a colloidal state for a certain period of time, such that the aqueous suspension exhibits superior cutting performance compared to conventional water-soluble cutting fluids of the O/W emulsion type.

IPC Classes  ?

• C10M 173/02 - Lubricating compositions containing more than 10% water not containing mineral or fatty oils
• C10M 125/26 - Compounds containing silicon or boron, e.g. silica, sand
• C10N 50/00 - Form in which the lubricant is applied to the material being lubricated
• C10N 30/12 - Inhibition of corrosion, e.g. anti-rust agents, anti-corrosives
• C10N 30/18 - Anti-foaming property
• C10N 30/16 - AntisepticBiocidal
• C10N 20/06 - Particles of special shape or size
• C10N 40/22 - Metal working with essential removal of material

Abstract

Disclosed are low-melting point and high-reliability solder particles each comprising: a low-melting point alloy particle having a melting point of 200°C or lower; and a plurality of silver (Ag) particles attached to the surface of the low-melting point alloy particle, wherein the plurality of silver (Ag) particles are distributed and separated from each other at a predetermined distance range not to inhibit the melt-blending of neighboring low-melting point high-reliability solder particles in a soldering process using a plurality of low-melting point high-reliability solder particles.

IPC Classes  ?

• B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
• B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxesSelection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest