A resin sealing device seals a workpiece with resin and processes it into a molded product using a press device including a sealing mold having an upper die and a lower die. The resin sealing device includes a loader that reciprocates in the left-right direction along a guide and that conveys the workpiece and the molded product, wherein the loader has: an in-loader section that is configured so as to be able to move in the front-rear direction and that carries the workpiece into the sealing mold; and an out-loader section that is configured so as to be able to move in the front-rear direction and that carries the molded product out of the sealing mold, the in-loader section and the out-loader section being arranged in parallel in the left-right direction.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A mounting device (1) comprises: a first mold (10) that is configured to hold substrates (SB1, SB2) on which electronic components (CH11, CH12, CH21, CH22) are placed; a second mold (20) having at least one movable mechanism (22A, 22B, 22C, 22D) that is connected to an internal space (23); and a pressure transmission mechanism (PR) for pressing a viscous member (23V) that is enclosed in the internal space (23) of the second mold (20), wherein, in a state in which the first mold (10) and the second mold (20) are closed, the electronic components (CH11, CH12, CH21, CH22) are pressed by the movable mechanisms (22A, 22B, 22C, 22D) with the viscous member (23V) interposed therebetween, on the basis of a pressing force with which the pressure transmission mechanism (PR) presses the viscous member (23V).
A mounting device (1) is provided with: a first mold (10) configured to hold substrates (SB1, SB2) on which electronic components (CH11, CH12, CH21, CH22) are placed; a second mold (20) disposed facing the first mold (10); and a gas supply mechanism for supplying an inert gas. The second mold (20) has movable mechanisms (22A, 22B, 22C, 22D) and elastic elements (23A, 23B, 23C, 23D). The electronic components (CH11, CH12, CH21, CH22) are pressurized by the movable mechanisms (22A, 22B, 22C, 22D) in accordance with the elastic force of the elastic elements (23A, 23B, 23C, 23D) in a state in which the first mold (10) and the second mold (20) are closed.
The purpose of the present invention is to provide a sealing mold that realizes, with a simple structure, a vertical movement mechanism for setting pins. As a solution, a sealing mold (202) according to the present invention includes a vertically movable support plate (215) between a chase block (213) and a plate (251), wherein: the support plate (215) has support members (221) that support a workpiece (W); and a pushing pin (226) is provided so as to be supported by a plate (252), the pushing pin pushing the support plate (215) away from a cavity plate (211) when the plate (251) and the plate (252) are put in a state in which said plates are brought even closer to each other from a state in which the mold is closed.
The purpose of the present invention is to provide a sealing mold that realizes, with a simple structure, a vertical movement mechanism for setting pins. As a solution, a sealing mold (202) according to the present invention includes a vertically movable support plate (215) between a chase block (213) and a plate (251), wherein: the support plate (215) has support members (221) that support a workpiece (W); and a pushing pin (226) is provided so as to be supported by a plate (252), the pushing pin pushing the support plate (215) away from a cavity plate (211) when the plate (251) and the plate (252) are put in a state in which said plates are brought even closer to each other from a state in which the mold is closed.
Representative drawing: FIG. 3
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
A resin-sealing method for resin-sealing an electronic component using a mold-clamping apparatus provided with raising-lowering mechanisms including a first raising-lowering mechanism and a second raising-lowering mechanism includes steps below. A resin-sealed product obtained by resin-sealing is measured to measure a total thickness variation which is a difference between a maximum value and a minimum value of a thickness. A height difference between a first part of a movable platen corresponding to the first raising-lowering mechanism and a second part of the movable platen corresponding to the second raising-lowering mechanism is determined such that the total thickness variation becomes smaller. The first raising-lowering mechanism and the second raising-lowering mechanism are driven such that the first part and the second part form the height difference. Mold clamping is performed in a state maintaining the height difference.
This invention addresses the problem of providing a compression molding device and a compression molding method that enable: a compression molding device to be made compact; the maintainability of a sealing mold to be improved; machining time to be reduced; and productivity to be improved. As a means for solving the problem, a compression molding device (1) uses a sealing mold (202) comprises: an upper mold (204) having a cavity (208); and a lower mold (206) having a workpiece retention section (205). The compression molding device seals a workpiece (W) with a sealing resin (R) and process the foregoing into a molded product (Wp). A conveyance device (302) for conveying the workpiece (W) and the sealing resin (R) into the sealing mold (202) is provided. The conveyance device (302) is provided with a workpiece hand (312) for holding the workpiece (W) and a resin hand (322) for holding the sealing resin (R). The workpiece hand (312) holds the workpiece (W) at a location directly under the sealing resin (R) held by the resin hand (322).
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B29C 43/34 - Feeding the material to the mould or the compression means
7.
FORMATION DEVICE FOR SEALING RESIN THAT IS USED FOR COMPRESSION MOLDING
The present invention addresses the problem of providing a formation device that is capable of forming a sealing resin with which it is possible to achieve a compression molding device and a compression molding method that are capable of preventing the occurrence of molding failure, the formation device being also capable of preventing the occurrence of a cracking loss of a sealing resin during the formation process. As a solution, a sealing resin formation device (100) according to the present invention is for forming a sealing resin (R) that is used for compression molding of a workpiece (W), the formation device being provided with: a forming die (102) that has a pair of a lower die (106) and an upper die (104) which are opened and closed, the forming die housing and applying heat and pressure to a base resin (Rm) in a state in which a release film (F) is interposed, thereby forming a sealing resin (R) that has a predetermined shape; and a film separation mechanism (170) that separates the release film (F) from the formed sealing resin (R).
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B29C 43/32 - Component parts, details or accessoriesAuxiliary operations
H01L 23/28 - Encapsulation, e.g. encapsulating layers, coatings
8.
APPARATUS AND METHOD FOR FORMING SEALING RESIN TO BE USED FOR COMPRESSION MOLDING
The present invention addresses the problem of providing an apparatus and a method for forming a sealing resin with which it is possible to achieve a compression molding device and a compression molding method capable of preventing the occurrence of molding defects. As a solution, an apparatus (100) for forming a sealing resin according to the present invention, which forms by tableting a base resin (Rm) a sealing resin (R) to be used for compression molding of a workpiece (W), comprises a tablet mold (102) that accommodates a predetermined amount of the base resin (Rm) in one or both of a pair of a lower mold (106) and an upper mold (104) subjected to mold opening/closing, and that performs tableting so as to form the sealing resin (R) into a predetermined shape corresponding to the shape of the workpiece (W).
The present invention addresses the problem of providing a device and method for accurately forming a sealing resin in a suitable amount, the device and method making it possible to achieve a compression molding device and a compression molding method that are able to prevent the occurrence of molding defects. As the solution, a device (100) for forming a sealing resin according to the present invention comprises: a preliminary molding unit (101) that preliminarily molds a base resin (Rm) to form a preliminary molded resin (R) to be used for sealing a workpiece (W); a measurement unit (190) that measures the weight or shape of the preliminary molded resin (R); and a removal mechanism (180) that removes part of the preliminary molded resin (R) if the measurement result from the measurement unit (190) is greater than the weight or larger than the shape required for sealing the workpiece (W).
The present invention addresses the problem of providing a sealing resin, and a forming method and a forming device for the same with which it is possible to achieve a compression molding device and a compression molding method capable of preventing the occurrence of molding defects. As the means for solving the problem, a forming method for a sealing resin according to the present invention forms a sealing resin (R) used in the compression molding of a workpiece (W) having a configuration in which electronic components (Wb) are mounted on a base material (Wa), the method comprising a forming step for forming a frame-shaped or grid-shaped sealing resin (R) having through-holes (Rh), wherein the forming step includes a step for setting and forming the position and shape of the through-holes (Rh) such that the electronic components (Wb) of the workpiece (W) are accommodated in the through-holes (Rh) and upper surfaces (Wbf) of the electronic components (Wb) are exposed.
The present invention addresses the problem of providing a compression molding apparatus and a compression molding method, which are capable of preventing the occurrence of molding defects caused by a flow of a sealing resin, uneven winding and a residual gas, which are also capable of forming a molded article having a large thickness dimension, and with which the handling of the sealing resin is easy. A compression molding apparatus (1) according to the present invention, as a means for solving the problem, is provided with: a provisional molding unit (51) which provisionally molds a base resin (Rm) and forms a provisionally molded resin (R) that is used for compression molding of a workpiece (W); a main molding unit (71) with which the provisionally molded resin (R) is disposed on the workpiece (W), and the workpiece (W) and the provisionally molded resin (R) are sealed and undergo main molding; a magazine (16) which stores the provisionally molded resin (R); and a first conveyance unit (21) which conveys the provisionally molded resin (R) carried out from the magazine (16) to the main molding unit (71).
B29C 43/34 - Feeding the material to the mould or the compression means
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
12.
COMPRESSION-MOLDING DEVICE AND COMPRESSION-MOLDING METHOD
The problem addressed is to prevent the occurrence of molding defects. A compression-molding device (1) according to the present invention uses a sealing mold (202) to seal a workpiece (W) having a configuration in which an electronic component (Wb) is mounted on a substrate (Wa) with a sealing resin (R) to process the workpiece (W) into a molded product (Wp), wherein a first sealing resin (R1) having a first amount, which is a solid or semi-solid resin the overall shape of which has been formed into a predetermined shape corresponding to the shape of the workpiece (W), is used as the sealing resin (R); the device is equipped with a control computation unit (30) that calculates the total amount of resin necessary based on data obtained by measuring the number of electronic components (Wb) mounted on a single substrate (Wa) for each workpiece (W) and comparing the total amount with the first amount; and the control computation unit (30) performs control to supply a second sealing resin (R2) having a second amount equivalent to the shortage to be used additionally as the sealing resin (R) when the first amount is insufficient relative to the total amount.
The present invention addresses the problem of providing a compression-molding device and a compression-molding method which make it possible to prevent molding failures from occurring. A compression-molding device (1) according to the present invention comprises: an upper mold half (204) having a cavity (208); a lower mold half (206) having a workpiece-holding part (205); and a conveyor (302) which places a sealing resin (R) on a workpiece (W) held in the workpiece-holding part (205) or makes the workpiece-holding part (205) hold a workpiece (W) having a sealing resin (R) placed thereon. As the sealing resin (R), a solid/semi-solid resin which as a whole has a given shape corresponding to the shape of the workpiece (W) is used.
B29C 43/34 - Feeding the material to the mould or the compression means
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
14.
SEALING RESIN USED FOR COMPRESSION MOLDING, AND FORMING METHOD FOR SAME
The present invention addresses the problem of providing a sealing resin and a forming method for the same with which it is possible to achieve a compression molding device and a compression molding method capable of preventing the occurrence of molding defects. As the means for solving the problem, a sealing resin (R) according to the present invention is used in the compression molding of a workpiece (W) having a configuration in which an electronic component (Wb) is mounted on a base material (Wa), the sealing resin including a plate-shaped or block-shaped body (Ra), and legs (Rb) provided upright on one surface of the body (Ra), and the sealing resin being formed in a shape that does not make contact with the electronic component (Wb) when mounted on the base material (Wa).
The present invention addresses the problem of providing a compression molding device and a compression molding method capable of preventing deformation of electronic components and the like, mounted on a substrate, due to positional displacement of resin during transport, and capable of preventing variation in molding quality. As a solution to this problem, a compression molding device (1) according to the present invention uses a sealing die (202) provided with an upper die (204) and a lower die (206) to seal, by means of block-shaped resin (R), a substrate (Wa) on which an electronic component (Wb) is mounted, to process the same into a molded article, wherein the compression molding device is provided with a resin welding mechanism (110) for welding the resin (R) to a predetermined position on the substrate (Wa).
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B29C 43/36 - Moulds for making articles of definite length, i.e. discrete articles
A resin-sealing method compression molds a resin on a workpiece having a plurality of components mounted on a carrier and manufactures a plurality of packages in each of which at least one of the components is sealed with the resin, the resin-sealing method including: setting a sheet resin in a resin molding die; and compression molding the sheet resin set in the resin molding die, wherein a penetrating hole is formed in a central portion of the sheet resin so that the amount of the resin is less in the central portion than in a peripheral portion of the sheet resin in plan view.
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B29C 43/40 - Moulds for making articles of definite length, i.e. discrete articles with means for cutting the article
A compression molding device compression-molds resin to a workpiece in which components are mounted on a carrier via connection members, and produces packages each having at least one component resin-sealed therein. The compression molding device comprises: a measuring part measuring the weight of the workpiece; a calculation part calculating the supply amount of the resin based on the weight of the workpiece measured by the measuring part; a supply part supplying the resin in the supply amount calculated by the calculation part; and a molding die for compression-molding, to the workpiece, the resin supplied by the supply part. The calculation part calculates the total volume of mounted objects, including the components and the connection members, based on the weight of the workpiece and calculates the supply amount of the resin based on the total volume of the mounted objects.
Provided are a resin sealing device and method with which it is possible to remove a gate part with high precision and to miniaturize and increase the mounting density of molded articles. This resin sealing method comprises: a resin sealing step for inputting a tablet-like resin (R) into a pot (240), and pressing with a plunger (242) to pump the resin into a cavity (208) through a runner (247) from a cull (246), so as to seal a workpiece (W) with the resin (R); and a degating step for extracting, from a sealing mold (202), a molded article (Wp) which has been subjected to the resin sealing step, and removing unnecessary resin portions from the molded article (Wp), wherein, in the degating step, a runner breaking step is carried out for removing a cull portion (Rc) and a runner portion (Rr), which are unnecessary resin portions formed at the positions of the cull (246) and the runner (247), and thereafter a gate cutting step is carried out for removing a gate portion (Rg), which is an unnecessary resin portion formed at the position of a gate (248) between the runner (247) and the cavity (208).
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
B29C 45/17 - Component parts, details or accessoriesAuxiliary operations
The present invention addresses the problem of realizing a resin sealing device capable of reducing the temperature of a sealing mold in a short time. As a solution, the present invention provides a resin sealing device (1) that uses a sealing mold (202) including an upper mold (204) and a lower mold (206), to seal a workpiece (W) with resin, thus processing the workpiece into a molded product (Wp). The resin sealing device includes a lower-mold mold base (236) to which the lower mold (206) is fixed. The lower-mold mold base (236) is fixed to a lower-mold backup plate (216) with a plurality of lower-mold pillars (276) being interposed therebetween, and is provided with a lower-mold cooling plate (286) that cools the lower-mold mold base (236) by being made to abut against or by being made to come close to a lower surface (236a) of the lower-mold mold base (236) in a lower-mold space section (296) where the lower-mold pillars (276) are arranged.
B29C 33/04 - Moulds or coresDetails thereof or accessories therefor with incorporated heating or cooling means using liquids, gas or steam
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B29C 43/34 - Feeding the material to the mould or the compression means
B29C 45/02 - Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
A resin sealing device (1) is provided with: a resin sealing mold (21) which seals an electronic component (P) with a resin by compression molding a resin material onto a workpiece (W); and a resin amount calculation unit (79) which calculates, for each workpiece, the resin amount in the resin material to be supplied to the workpiece (W) on the basis of the mounting state of the electronic component (P) on the workpiece (W). The resin material contains a first resin (R1) and a second resin (R2); the first resin (R1) is a sheet-like resin; the second resin is a granulated resin, a powdered resin or a liquid resin; and among the first resin (R1) and the second resin (R2), at least the amount of the second resin (R2) to be supplied is determined for each workpiece on the basis of the resin amount that is calculated by the resin amount calculation unit (79).
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B29C 43/34 - Feeding the material to the mould or the compression means
A resin sealing device seals, with a resin, an electronic component of a workpiece including a base material and the electronic component. This resin sealing device comprises: a resin sealing mold which seals, with a resin, an electronic component by molding a resin material with respect to a workpiece; a conveyance line for conveying the workpiece to the resin sealing mold; a workpiece accommodation part which can accommodate at least one workpiece; a workpiece support part which is provided between the workpiece accommodation part and the conveyance line and supports the workpiece; a pickup device which holds the workpiece supplied onto the workpiece support part from the workpiece accommodation part, and conveys the workpiece to the conveyance line; and a measurement part which is provided to at least one among the workpiece accommodation part, the workpiece support part, and the pickup device, and measures the weight of the workpiece.
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
The resin sealing apparatus according to the present invention includes a press device for closing and opening an upper mold and a lower mold. The press device includes a fixed platen to which one of the upper mold and the lower mold is fixed and a movable platen to which the other one is fixed, a tie bar fixing the fixed platen and holding the movable platen so that the movable platen can be lifted and lowered, and a drive device lifting and lowering the movable platen. The fixed platen has a fixed portion fixed to the tie bar on the side of a first surface of a main body portion and a bell-shaped portion provided on the side of a second surface opposite to the first surface, and one of the upper mold and the lower mold is fixed to the bell-shaped portion.
B29C 43/32 - Component parts, details or accessoriesAuxiliary operations
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
The present invention addresses the problem of providing a resin sealing device and a resin sealing method, wherein molding defects caused by a gradual decrease in the surface temperature of a sealing die when an automatic operation continues at a given cycle can be prevented. As a means for solving the problem, a resin sealing method according to the present invention is characterized in that when a normal set temperature is defined as a temperature of a sealing die (202) at which a resin (R) is appropriately thermoset during sealing, and a switching set temperature is defined as a temperature of the sealing die (202) which is higher than the normal set temperature by a predetermined temperature, the temperature of the sealing die (202) is controlled by changing the set temperature of at least one among an upper die (204) and a lower die (206) from the normal set temperature to the switching set temperature at a predetermined start timing, and the temperature of the sealing die (202) is controlled by changing the set temperature from the switching set temperature to the normal set temperature at a predetermined end timing, during a unit process in which a workpiece (W) and the resin (R) are carried into the sealing die (202), sealed, and then carried out as a molded product (Wp).
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
The purpose of the present invention is to provide a sealing mold that realizes, with a simple structure, a vertical movement mechanism for setting pins. As a solution, a sealing mold (202) according to the present invention includes a vertically movable support plate (215) between a chase block (213) and a plate (251), wherein: the support plate (215) has support members (221) that support a workpiece (W); and a pushing pin (226) is provided so as to be supported by a plate (252), the pushing pin pushing the support plate (215) away from a cavity plate (211) when the plate (251) and the plate (252) are put in a state in which said plates are brought even closer to each other from a state in which the mold is closed.
The present invention address the problem of providing a resin sealing device capable of improving productivity and simplifying a device configuration. As a solution, a resin sealing device (1) according to the present invention is a resin sealing device that uses a press device (250) comprising a sealing mold having an upper die (204) and a lower die (206) to seal a workpiece (W) with a resin (R) and form a molded product (Wp), the resin sealing device comprising a loader (122) that moves back and forth in the left-right direction along a guide (120) and that conveys the workpiece (W) and the molded product (Wp), wherein the loader (122) has: an in-loader section (124) that is configured so as to be able to move in the front-back direction and that conveys the workpiece (W) into the sealing mold (202); and an out-loader section (126) that is configured so as to be able to move in the front-back direction and that conveys the molded product (Wp) out of the sealing mold (202), the in-loader section (124) and the out-loader section (126) being disposed side-by-side in the left-right direction.
B29C 43/32 - Component parts, details or accessoriesAuxiliary operations
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
The present invention makes it possible to absorb variations in both workpiece thickness and resin quantity, and facilitates adjustment of workpiece clamping force and molding pressure. As a solution, in a sealing mold (202) according to the present invention, one workpiece holding part (205) for holding a plurality of workpieces (W) is provided to one of an upper mold (204) or a lower mold (206), and to the other of the two molds are provided a plurality of clampers (228) having mutually divided structures for individually clamping the plurality of workpieces (W) held by the workpiece holding part (205), and cavity pieces (226) capable of moving up and down without interlocking with the clampers (228) at the center position in each of the plurality of clampers (228) in plan view, the sealing mold (202) comprising clamper springs (232) that urge the clampers (228) toward the workpiece holding part (205), and cavity piece springs (230) that urge the cavity pieces (226) toward the workpiece holding part (205).
The present invention is capable of absorbing thickness variation of a workpiece, and performs molding that enables a molded article to have a constant total thickness. As a solution, a sealing mold (202) according to the present invention comprises: a pot (240) in a lower mold (206); a cull block (244), in which a cull (246) is bored, in an upper mold (204); a first workpiece holding part (205A) and a second workpiece holding part (205B) in one of the lower mold (206) and the upper mold (204); one or more first cavities (208A) and one or more second cavities (208B) in the other one of the lower mold (206) and the upper mold (204); a first cavity piece (226A) and a first clamper (228A), which constitute each of the first cavities (208A); a first clamper spring (232A) which urges the first clamper (228A); a second cavity piece (226B) and a second clamper (228B), which constitute each of the second cavities (208B); and a second clamper spring (232B) which urges the second clamper (228B).
A resin seal device (1) is provided with a workpiece supply unit (10), a resin supply unit (40), and a resin mold unit (20). The workpiece supply unit (10) has a read unit (130) for reading an identification mark for identifying a workpiece (W). Resin supply data based on an actual measurement value that indicates the mounting status of an electronic component (P) on a base material (S) is associated with the identification mark. The resin supply unit (40) supplies a prescribed amount of a resin (R) for each workpiece (W) on the basis of the resin supply data associated with the identification mark read by the read unit (130).
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B29C 43/34 - Feeding the material to the mould or the compression means
Provided is a mold clamping device capable of preventing in advance a movable platen from damaging a tie bar. A mold clamping device (1) is provided with: a movable platen (3) that moves along a tie bar (4); a driving mechanism (10) that has a plurality of elevating mechanisms (10A, 10B, 10C, 10D, ...) including a first elevating mechanism (10A) and a second elevating mechanism (10B), and that is configured to be capable of introducing a difference (β) so that a first portion (3A) of the movable platen (3) corresponding to the first elevating mechanism (10A) is set at a higher or lower position than a second portion (3B) of the movable platen (3) corresponding to the second elevating mechanism (10B), the driving mechanism (10) moving the movable platen (3); and a connecting structure (20) that connects the driving mechanism (10) to the movable platen (3). The connecting structure (20) is configured as a stopper that restricts movement of the movable platen (3) so that the difference (β) does not become greater than a prescribed value (α).
The present invention provides a resin sealing method capable of producing a high-precision resin-sealed product. This method for resin sealing an electronic component using a mold-clamping device (1) equipped with a plurality of raising/lowering mechanisms (10A, 10B, …) including a first raising/lowering mechanism (10A) and a second raising/lowering mechanism (10B) involves: measuring a resin-sealed product obtained through resin sealing to measure the TTV, which is the difference between maximum and minimum values of the thickness thereof (S1); determining the difference in height between a first site (3A) of a movable platen (3) corresponding to the first raising/lowering mechanism (10A) and a second site (3B) of the movable platen (3) corresponding to the second raising/lowering mechanism (10B) so as to reduce the TTV (S2); driving the first raising/lowering mechanism (10A) and the second raising/lowering mechanism (10B) such that the first site (3A) and the second site (3B) have the difference in height; and performing mold-clamping in a state in which the difference in height is maintained.
A problem is to provide a resin sealing device and a resin sealing method capable of suppressing warping of a molded product and improving quality. As a solution, a resin sealing device (1) according to the present invention uses a sealing mold (202) having an upper mold (204) and a lower mold (206) to seal a workpiece (W) with a resin (R) and process the workpiece into a molded product (Wp), the resin sealing device comprising a plurality of heating chambers (402) for post-curing the molded product (Wp) and a conveying device (102) that carries the molded product (Wp) into the heating chambers (402) and thereout, wherein the heating chambers (402) can be individually set to an arbitrary room temperature.
A resin sealing device (1) equipped with a workpiece supply unit (10), a resin supply unit (40), a functional member supply unit (50), a resin-molding unit (20), a first loader (60) for transporting a workpiece (W) supplied from the workpiece supply unit (10), and a second loader (70) which transports the resin (R) and/or the functional member (H) and has a transport path which is different from that of the first loader (60), wherein the workpiece supply unit (10), the resin-molding unit (20) and the resin supply unit (40) are positioned so as to align with one another in a first direction in a flat layout, and the functional member supply unit (50) is adjacent to the resin supply unit (40) in a second direction which intersects the first direction in the flat layout.
The present invention addresses the problem of providing a compression molding device capable of improving productivity and preventing the occurrence of a molding failure due to the attachment of foreign matter, to thereby improve molding quality. As a solution, a compression molding device 1 according to the present invention seals three or less workpieces (W) with a resin (R) all at once using a sealing mold (202) having three sets of cavities (208) provided in one of an upper mold (204) and a lower mold (206), and three sets of corresponding workpiece retention units (205) provided in the other. Along a prescribed X-direction, a workpiece supply unit (100A), a press unit (100B), a resin supply unit (100C), and a molded article accommodation unit (100D) are arranged in this order, or the workpiece supply unit (100A), the press unit (100B), the resin supply unit (100C), the press unit (100B), and the molded article accommodation unit (100D) are arranged in this order.
B29C 43/34 - Feeding the material to the mould or the compression means
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
The present invention is characterized by providing a resin sealing device and a resin sealing method capable of improving molding quality by preventing the occurrence of molding defects caused by resin leakage and the like in a configuration having a cavity in a bottom mold. As the means for solving the problem, a resin sealing device (1) according to the present invention uses a sealing mold (202) comprising a top mold (204) and a bottom mold (206) having a cavity (208) and uses a resin (R) to seal a workpiece (W) where an electronic component (Wb) is mounted on a base material (Wa), and then process the workpiece into a molded product (Wp), the resin sealing device comprising: a resin guard (400) that holds a film (F) on which the resin (R) has been placed; a resin guard loader (212) that conveys the resin guard (400); and a plunger (214) that discharges the air inside the resin (R) to reduce bulk by pressing the resin (R) in a state in which the film (F) on which the resin (R) has been placed is stored and held in the cavity (208).
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B29C 43/34 - Feeding the material to the mould or the compression means
There is provided a resin-sealing apparatus that supplies an appropriate amount of sheet-shaped resin for each workpiece, thereby improving the molding quality of a molded product without production of resin dust, such that no redundant resin is produced on a molded product. The resin-sealing apparatus includes a resin supply part that supplies a sheet-shaped resin by cutting out an amount of sheet-shaped resin appropriate for one-time compression molding from a long resin sheet formed to have a predetermined width and a predetermined thickness depending on an amount of resin required for each workpiece, and a transport part that transports the appropriate amount of sheet-shaped resin supplied by the resin supply part to a sealing mold.
B29C 43/34 - Feeding the material to the mould or the compression means
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
The present invention addresses the problem of providing a compression molding device and a compression molding method capable of preventing deformation of electronic components and the like, mounted on a substrate, due to positional displacement of resin during transport, and capable of preventing variability in molding quality. As a solution to this problem, a compression molding device (1) according to the present invention uses a sealed die (202) provided with an upper die (204) and a lower die (206) to seal, by means of block-shaped resin (R), a substrate (Wa) on which an electronic component (Wb) is mounted, to process the same into a molded article, wherein the compression molding device is provided with a resin welding mechanism (110) for welding the resin (R) to a predetermined position on the substrate (Wa).
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B29C 43/34 - Feeding the material to the mould or the compression means
Provided are a resin sealing apparatus wherein more reliable dust collection is possible, and a cleaning method for said apparatus. A resin sealing apparatus (1) is for sealing a workpiece (W) with a resin material (R), and comprises: an ultrasonic vibrator (12) that emits ultrasonic waves onto cleaning regions (22, 23A, 41A, 42A, 51A, 52A ...) of the resin sealing apparatus (1) or onto the workpiece (W), and causes a foreign substance to float; and a suction port (13) that suctions the foreign substance caused to float by the ultrasonic vibrator (12).
A compression molding device and compression molding method are provided that enable changing the number of molded products taken per sealing mold. This compression molding device (1) uses a sealing mold (202) which has three pairs of cavities (208) in one of an upper mold (204) and a lower mold (206) and three workpiece holding units (205) on the other of the upper mold (204) and the lower mold (206), and seals three or fewer workpieces (W) at once by means of a resin (R). The compression molding device (1) is provided with a preparation unit (101) for workpieces (W), a conveyance unit (210) for workpieces (W), a detection unit (114) which detects whether workpieces (W) are present in the preparation unit (101), a calculation unit (132) which, on the basis of the detection data from the detection unit (114), calculates the number of workpieces (W) conveyed into the sealing mold (202), and a control unit (130) which selects a workpiece holding unit (205) on the basis of the number data from the calculation unit (132), and causes the workpiece (W) to be conveyed by the conveyance unit (210) and held by that workpiece holding unit (205).
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B29C 43/34 - Feeding the material to the mould or the compression means
Provided are a resin sealing device and a resin sealing method with which a prescribed amount of a resin material can be spread uniformly in a short amount of time. A resin sealing device (1) seals a workpiece (W) with a resin material (R). The resin sealing device (1) comprises: a metal mold (41); a resin supply part (31); and a vibration mechanism (10). The metal mold (41) seals the workpiece (W) with the resin material (R) by molding the resin material (R) which has been conveyed to a space between an upper mold (42) and a lower mold (43). The resin supply part (31) supplies the resin material (R) into a supply area (A) partitioned on an upper surface (42) of a release film (F) that is conveyed into the metal mold (41), or on an upper surface of the workpiece (W) that is conveyed into the metal mold (41). The vibration mechanism (10) vibrates the supply area (A), thereby flattening the resin material (R) within the supply area (A). The vibration mechanism (10) is configured so as to be capable of vibrating the supply area (A) in the vertical direction (Z).
Provided are a resin sealing device and a resin sealing method which make it possible to uniformly spread a prescribed amount of resin material in a short time. This resin sealing method includes making a resin material (R) inside a supply area (A) have a uniform thickness (S3). Making the resin material (R) have a uniform thickness (S3) includes a first stage step (S31) for moving the resin material (R) in the horizontal direction to spread the resin material inside the supply area (A). The first stage step (S31) is performed by alternately repeating: a vibration operation for vibrating the supply area (A) with a movement in three directions including, i.e., a prescribed X direction in the horizontal direction, a Y direction intersecting the X direction in the horizontal direction, and a Z direction as the vertical direction; and an operation stop for stopping the vibration operation to thereby roll, in the horizontal direction, the resin material (R) to which the kinetic energy from the vibration has been applied.
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
A resin-sealing method for producing a plurality of packages by compression-molding a resin on a workpiece (10) in which a plurality of components (12) are mounted on a carrier (11) such that at least one of the components (12) is sealed by the resin in each of the packages, the method comprising: a step (S15) for setting a sheet resin (SP1) in a resin molding die (190); and a step (S16) for compression-molding the sheet resin (SP1) set in the resin molding die (190), wherein a penetrating hole (ST1) is formed at a center portion of the sheet resin (SP1) so that the amount of the resin is less at the center portion than at a peripheral portion of the sheet resin (SP1) in a plan view.
This compression molding apparatus (1) carries out compression molding of resin (R) to a work (10) in which a plurality of components (12) are mounted on a carrier (11), and manufactures a plurality of packages in each of which at least one component (12) is resin-sealed. The compression molding apparatus (1) comprises: a measuring unit (110) that measures the weight of the work (10); a calculation unit (120) that calculates a supply amount of the resin (R) on the basis of the weight of the work (10) measured by the measuring unit (110); a supplying unit (130) that supplies the supply amount of resin (R) calculated by the calculation unit (120); and a mold (190) that compression molds the resin (R) supplied by the supplying unit (130) with respect to the work (10).
The present invention provides a resin sealing device and a resin sealing method that do little damage to a workpiece and can improve molding quality. This resin sealing device (1) uses a sealing mold (202) that comprises an upper mold (204) and a lower mold (206) to seal a workpiece (W) in resin (R) and thereby form a molded article (Wp). The workpiece (W) comprises a substrate (Wa) and an electronic component (Wb) that is mounted thereon. The resin sealing device (1) comprises a heating mechanism that heats the upper mold (204) to a prescribed temperature, a suctioning mechanism that suctions and holds a film (F) inside a cavity (208) on a lower surface side of the upper mold (204), a pressing member (214) that has an upper surface (214a) on which the resin (R) is installed, and a moving and sticking mechanism (215) that moves the pressing member (214) upward so as to press the resin (R) installed on the pressing member (214) into the cavity (208) in the upper mold (204) as heated to the prescribed temperature and thereby stick the resin (R) onto a lower surface of the film (F).
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B29C 43/32 - Component parts, details or accessoriesAuxiliary operations
A compression molding device (1) compression molds a resin (R) to a workpiece (10) in which a plurality of components (12) are mounted on a carrier (11) via a plurality of connection members, and produces a plurality of packages each having at least one of the components (12) resin sealed therein. The compression molding device (1) comprises: a measuring unit (110) that measures the weight of the workpiece (10); a calculation unit (120) that calculates the supply quantity of the resin (R) on the basis of the weight of the workpiece (10) measured by the measuring unit (110); a supply unit (130) that supplies the resin (R) in the supply quantity calculated by the calculation unit (120); and a molding die (190) that is used for compression molding, to the workpiece (10), the resin (R) supplied by the supply unit (130). The calculation unit (120) calculates the total volume of a plurality of mounted articles including the plurality of components (12) and the plurality of connection members on the basis of the weight of the workpiece (10) and calculates the supply quantity of the resin on the basis of the total volume of the plurality of mounted articles.
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
B29C 31/06 - Feeding, e.g. into a mould cavity in measured doses
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B29C 43/34 - Feeding the material to the mould or the compression means
The objective of the present invention is to provide a resin sealing device with which the amount of operation that a loader performs until a work is transported to a sealing mold and/or the time required for pre-heating the work is been reduced to improve production efficiency. As a solution, a work transport mechanism (D) in the present invention comprises: a first transport path (1A) in which a plurality of transport units are disposed in tandem; a second transport path (1B) which is disposed parallel to the first transport path (1A) and in which a plurality of transport units are disposed in tandem; and a transport path switching mechanism (10) whereby the transport path along which a moving body (1c) moves is switched between the first transport path (1A) and the second transport path (1B).
There is provided a resin-sealing apparatus that supplies an appropriate amount of sheet-shaped resin for each workpiece, thereby improving the molding quality of a molded product without production of resin dust, such that no redundant resin is produced on a molded product. The resin-sealing apparatus includes a resin supply part that supplies a sheet-shaped resin by cutting out an amount of sheet-shaped resin appropriate for one-time compression molding from a long resin sheet formed to have a predetermined width and a predetermined thickness depending on an amount of resin required for each workpiece, and a transport part that transports the appropriate amount of sheet-shaped resin supplied by the resin supply part to a sealing mold.
B29C 43/34 - Feeding the material to the mould or the compression means
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
A resin supply apparatus includes a calculation unit for calculating a resin supply pattern based on the shape of a cavity of a resin sealing mold, and a supply unit for supplying a resin to an object to be coated along the resin supply pattern. The resin supply pattern has a plurality of linear paths, and one of mutually adjacent linear paths is inclined with respect to an axis of symmetry that divides a cavity in line symmetry, the other one of the mutually adjacent linear paths is inclined with respect to the one linear path, and a region between the mutually adjacent linear paths is opened to the outside of the object to be coated, at least on a side on which the other linear path is separated from the one linear path.
B29C 43/34 - Feeding the material to the mould or the compression means
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B29C 43/02 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles
48.
Resin supply apparatus, resin sealing apparatus, and method for manufacturing resin-sealed product
A resin supply apparatus, a resin sealing apparatus, and a method for manufacturing a resin-sealed product are provided. A resin supply apparatus supplies a resin onto a workpiece on which elements are arranged in a first direction and a second direction intersecting the first direction, respectively. The resin supply apparatus includes: an acquisition unit for acquiring arrangement information of the elements on the workpiece; a supply unit for supplying the resin onto the workpiece; a calculation unit for calculating a resin supply pattern based on the arrangement information; and a drive unit for moving at least one of the workpiece and the supply unit relative to the other along the resin supply pattern. The resin supply pattern has linear paths extending along the first direction, and a region between the mutually adjacent linear paths in the plurality of linear paths is opened to the outside of the workpiece.
B29C 43/34 - Feeding the material to the mould or the compression means
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
A resin molding device that is easy to handle until a thin and large-size workpiece is delivered to a loader, and can supply the workpiece to a mold frame while preventing the workpiece from losing its flatness and being damaged is provided.
A resin molding device that is easy to handle until a thin and large-size workpiece is delivered to a loader, and can supply the workpiece to a mold frame while preventing the workpiece from losing its flatness and being damaged is provided.
A resin molding device includes a workpiece transfer part (2) that reciprocates between a first position and a second position and transfers a workpiece (W), and in the workpiece transfer part (2), a holder plate (5) larger than an external form of the workpiece and having a thick plate thickness is mounted on a transfer part main body (2a), and the workpiece (W) that is positioned with respect to and overlaps the holder plate (5) based on the external form is transferred.
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
A resin molding device that can hold a thin and large-size workpiece without positional displacement when the workpiece is conveyed even if dimensional tolerance and rigidity are different, and can convey the workpiece to a mold frame without losing flatness or damage is provided.
A resin molding device that can hold a thin and large-size workpiece without positional displacement when the workpiece is conveyed even if dimensional tolerance and rigidity are different, and can convey the workpiece to a mold frame without losing flatness or damage is provided.
When a loader (4) holds a workpiece (W) aligned by a preheating part (10), a center position of a loader hand (4b) is aligned with a center position of the workpiece (W) according to an amount of positional displacement between an external form position of the workpiece (W) and a reference position in the X-Y direction and the workpiece (W) is then held.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B29C 43/36 - Moulds for making articles of definite length, i.e. discrete articles
A resin molding apparatus and a cleaning method of a workpiece which can prevent a workpiece from being carried into a mold die in a state where particles (dust) are adhered to the workpiece, and can prevent deterioration of molding quality. A resin molding apparatus according to the present invention, in which a workpiece with an electronic component mounted on a carrier and a mold resin are carried into a mold die, includes: a press part having the mold die for clamping and resin-sealing the workpiece and the mold resin; and a cleaning apparatus for cleaning a back surface of the workpiece conveyed to the press part, wherein the electronic component is not mounted on the back surface. The cleaning apparatus is arranged at a position overlapping a conveyance path of the workpiece on the upstream side of the press part.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B29C 43/36 - Moulds for making articles of definite length, i.e. discrete articles
To provide a resin molding apparatus capable of correcting the bending of a workpiece during preheating or the like, improving production efficiency, and preventing the occurrence of defective products. A resin molding apparatus according to the present invention includes: a molding die which performs resin molding of a workpiece W having an electronic component mounted inside a carrier; and a loader which transports the workpiece, the loader includes a frame body which comes into contact with and separates from an outer edge portion of an upper surface of the workpiece, a moving device which moves the frame body up and down, and a chuck claw which comes into contact with an outer edge portion of a lower surface of the workpiece, and the frame body includes a contact portion which is provided over the entire circumference of the outer edge portion in the upper surface of the workpiece.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
A resin molding apparatus that can prevent a workpiece from deflecting during transfer and prevent the occurrence of molding defects due to the deflection is provided. A resin molding apparatus according to the present invention includes a molding mold that molds a workpiece on which an electronic component is mounted inside a carrier with a resin and a loader that transfers the workpiece, the loader includes a chuck that comes into contact with and separates from an outer edge part on a lower surface of the workpiece, a moving device that moves the chuck, and a frame that comes into contact with and separates from an outer edge part on an upper surface of the workpiece, and at least during transfer, the workpiece is able to be interposed between the chuck and the frame.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
The present invention addresses the problem of providing a resin molding apparatus capable of responding to a need for various products by joint use of a transfer molding device and a compression molding device without significant modification of the devices. As a means of solving this problem, in a press part (C), an unmolded resin (R1) is supplied to a lower mold (16) without the use of a dedicated machine, the unmolded resin (R1) is pressure-fed to a cavity by a transfer molding device (13) and transfer molded, the unmolded resin (R1) supplied into the lower mold cavity is caused to overflow by a compression molding device (18), and any device used in the case of compression molding can be selected and used.
B29C 45/02 - Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
The present invention addresses the problem of providing a molding die that makes the molding area on a workpiece as wide as possible, facilitates air discharge, and prevents molding resin from leaking into unnecessary locations. The solution is to engrave an air vent groove (2j) that is connected to a cavity recess (2g) and serves as a passage for the movement of air or molding resin in a clamper (2d), and to dispose a shut-off pin (2k) for opening and closing the air vent groove (2j) so as to be capable of advancing and retreating within the air vent groove (2j) across the boundary between the outer peripheral end surface of the workpiece (W) and a die clamping surface.
B29C 45/02 - Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
To address the problem of preventing workpiece damage and resin flash, this resin molding mold (10) is for resin-molding a workpiece (W) in which a plurality of second members (Wb) have been mounted on a single first member (Wa), the resin molding mold comprising a first mold (20) provided with a workpiece supporting part (31) that supports the workpiece (W), and a second mold (21) provided with a cavity (18) that houses the second members (Wb) of the workpiece (W). The second mold (21) includes: a plurality of individually-movable pieces (23) that have one end exposed to the bottom of the cavity (18), that can move in the mold opening/closing direction, and that can contact the respective second members (Wb); a plurality of rods 27 that push the respective individual movable pieces (23); a plurality of elastic members (24) that exert an elastic force on the respective rods (27); and blocks (11), (12) for supporting the elastic members (24).
The present invention addresses the problem of providing a mold that can save on maintenance work by preventing resin leakage and that can maintain high molding quality regardless of the precision of a workpiece end surface, a level-difference occurring on the workpiece, and resin viscosity. To solve this problem, a movable piece (9) is provided on a lower mold (1) separated from a clamp surface of the lower mold so as to be capable of moving in a contacted/separated manner with respect to the lower mold. When the mold is closed, an end of a workpiece (W) intersecting the resin path is sandwiched between the movable piece (9) and the lower mold (1), and sections (2c, 9b) of the resin path communicating with a cavity recess (2e) are formed between the movable piece (9) and a clamp surface of an upper mold (2) facing the movable piece.
B29C 33/14 - Moulds or coresDetails thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
B29C 43/36 - Moulds for making articles of definite length, i.e. discrete articles
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
58.
FRAME BODY JIG, RESIN SUPPLY JIG AND WEIGHING METHOD THEREFOR, MOLDED RESIN WEIGHING DEVICE AND METHOD, RESIN SUPPLY DEVICE, RESIN SUPPLY AND WEIGHING DEVICE AND METHOD, AND RESIN MOLDING DEVICE AND METHOD
The present invention addresses the problem of providing the following: a frame body jig that covers an opening on one side of a frame body with a sheet film without creating wrinkles therein; a resin supply jig in which a resin accommodating part is formed, and with which a weight can be accurately measured using the frame body jig without connecting an air hose or the like thereto; and a weighing method of the resin supply jig. As a solution for the above problem, the present invention is provided with: a frame body (13a) in which an inner surface, which corresponds to a cavity recess formed in a clamp surface of a molding die, has an opening of a predetermined shape; and at least one pair of film gripping parts (13c) that are provided on opposing sides and that grip the outer peripheral edge of a sheet film F assembled to cover the opening on one side of the frame body (13a).
B29C 43/34 - Feeding the material to the mould or the compression means
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
59.
RESIN MOLDING METHOD, FILM CONVEYING DEVICE, AND RESIN MOLDING DEVICE
The present invention addresses the problem of providing a technology that enables reduction of manufacturing and running cost of a molded article. As a solution, the present invention comprises: a molding step for covering a die surface (21a) with a roll-shaped release film (F) supplied from film loader hands (40) which are provided on both sides of a molding die (20), and performing, multiple times, a step for closing the mold to perform resin molding, opening the mold, and releasing the molded article from a cavity (C); and a film supplying step for supplying, when it is determined that the release film (F) is unsuitable for use, an unused part of the release film (F) to the molding die (20) after the mold is opened, wherein a position at which the film loader hand (40) holds the release film (F) is controlled such that the release film (F) is moved to a position adjacent to the die surface (21a) in the molding step, and the release film (F) is moved to a position apart from the die surface (21a) in the film supplying step.
B29C 43/02 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles
The present invention addresses the problem of providing a resin supply device that makes the size of an installation area compact and reduces a work area to improve operability. As a solution, a resin supply unit (Ud) has a roll film accommodation section (10A) and a syringe supply section (11c) arranged to vertically overlap each other at the front end of a device, and has a resin mounting section (10c) arranged next to the syringe supply section (11c).
B29C 43/34 - Feeding the material to the mould or the compression means
B29C 31/06 - Feeding, e.g. into a mould cavity in measured doses
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
The present invention addresses the problem of providing a technique with which a trouble, such as the inclusion of air in resin, can be prevented. The solution comprises, in this order: evacuating an interior (30a) of a chamber (30); ejecting a liquid resin (R) onto a workpiece (W), which is an object to be supplied with, via a nozzle (22) in the interior (30a) of the evacuated chamber (30); stopping the ejection of the liquid resin (R) and the evacuation of the interior (30a) of the chamber (30), and then reciprocating the nozzle (22) in the interior (30a) of the chamber (30).
B29C 39/42 - Casting under special conditions, e.g. vacuum
B29C 39/10 - Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressureApparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
The present invention addresses the problem of providing a technology that enables improvement on molding quality. The problem is solved by a resin molding die (10) provided with: a cavity (C); a shut-off vent (26) that is connected to the cavity (C); a shut-off pin (40) that is capable of advancing/retreating to/from the shut-off vent (26); a return spring (41) that separates the shut-off pin (40) away from the shut-off vent (26); an air supply channel (42) that applies air pressure on the shut-off pin (40) against the force of the return spring (41); and an overflow cavity (25) that is connected to the cavity (C) at a place on the cavity (C) side of the shut-off vent (26).
[Problem] To suppress the occurrence of extraneous resin when using resin to fix a magnet piece. [Solution] This magnet embedded core manufacturing method involves: a placement step for placing a rotor core on a mounting platform such that one end surface contacts the mounting platform; a resin injection step for injecting a solid-state resin into a magnet insertion hole; a melting step for melting the resin in the magnet insertion hole; a magnet piece injection step for injecting the magnet piece into the magnet insertion hole; a closing step for closing the magnet insertion hole opening that is disposed towards the side opposite of the mounting platform; and a resin pressurizing step in which, after the closing step, the melted resin, which has flowed into a buffer chamber formed in the mounting platform, is pressurized from the mounting platform-side opening of the magnet insertion hole.
H02K 15/03 - Processes or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines of stator or rotor bodies having permanent magnets
The present invention addresses the problem of providing a molding die whereby misalignment or dropout of a workpiece retained on a die clamp surface is prevented, and large size in a resin package part can be ensured. As a means for solving this problem, a workpiece retaining part (6d) for pressing against an external peripheral surface of a workpiece (W) and retaining the workpiece (W) is provided on an upper die clamp surface (6a) in a molding die (6), the workpiece retaining part (6d) being disposed facing the workpiece (W) at a plurality of locations along the outer shape of the workpiece (W).
B29C 33/12 - Moulds or coresDetails thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B29C 43/32 - Component parts, details or accessoriesAuxiliary operations
B29C 43/36 - Moulds for making articles of definite length, i.e. discrete articles
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
The present invention addresses the problem of providing a molding die which can be used to resin-mold a workpiece having a member exposed from a resin package without leakage of resin and without breakage. As a solution, when a workpiece (1) is clamped by a pair of dies, a terminal pin (2c) is inserted into an insertion hole (5f), and an elastic member (6) surrounding the terminal pin (2c) is pressed and crushed by a movable pressing member (7), so that the workpiece (1) is resin-molded while a housing case (5c) limits the outward deformation of the elastic member (6), and the elastic member (6) is deformed to fill a gap between the terminal pin (2c) and the insertion hole (5f).
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
66.
RESIN MOLDING DIE, RESIN MOLDING METHOD, AND METHOD FOR PRODUCING RESIN MOLDED ARTICLE
The present invention addressed the problem of providing a technique that makes it possible to improve molding quality. As a solution, a resin molding die (210) is provided with an upper and lower pair of dies (11, 12) having a cavity (13), it being possible for the dies (11, 12) to be opened and closed. The resin molding die (210) is provided with a base (18), which is provided on the upper die (11) and which is moved in a relative manner so as to come closer to the lower die (12) when the dies are closed and to move away when the dies are opened, and a plurality of plungers (17) arranged around the cavity (13) as viewed from above, and provided on the base (18).
B29C 33/12 - Moulds or coresDetails thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B29C 43/36 - Moulds for making articles of definite length, i.e. discrete articles
B29C 45/02 - Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
The present invention addresses the problem of providing a technique capable of improving the quality of formed articles. As a solution, the present invention provides a resin formation device (10) comprising: an openable pair of molds (14) having a recessed cavity portion (12); and a pressure adjustment unit (22) that adjusts the pressure in the mold interior (20) that comprises the recessed cavity portion (12). The pair of molds (14) has a plurality of communication passages (34) that put the mold exterior and mold interior (20) in communication. The ends of the plurality of communication passages (34) on the mold interior side open on the periphery of an opening section of the recessed cavity portion (12) and the other ends of the plurality of communication passages on the mold exterior side are connected to the pressure adjustment unit (22). The pressure adjustment unit (22) comprises a pressure reducing unit (36) that reduces pressure in the mold interior (20) by suctioning gas from the mold interior (20) via the plurality of communication passages (34) when the mold is closed and a flow amount adjustment unit (38) that adjusts the gas flow amount in each of the plurality of communication passages (34).
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
H01L 23/552 - Protection against radiation, e.g. light
B05B 5/025 - Discharge apparatus, e.g. electrostatic spray guns
B05B 5/14 - Plant for applying liquids or other fluent materials to objects specially adapted for coating continuously moving elongated bodies, e.g. wires, strips, pipes
H01L 21/3205 - Deposition of non-insulating-, e.g. conductive- or resistive-, layers, on insulating layersAfter-treatment of these layers
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 23/00 - Details of semiconductor or other solid state devices
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
The present invention addresses the problem of providing a configuration capable of improving the manufacturing yield of resin molded products (moldings). As a means for solving the problem, a resin molding die (10) clamps a workpiece (W) having a mounted component (102) between an upper die (11) and a lower die (12), and thermally cures resin (R) filled in a cavity (C), the workpiece (W) is disposed on a parting face (11a) of the upper die (11), and a cavity recessed portion (14) constituting the cavity (C) is provided in a parting face (12a) of the lower die (12). At the bottom of the cavity recessed portion (14), a cavity piece (16) is provided. The cavity piece (16) is provided with a clamp piece (20) and a pressurization piece (21) which are provided separately so as to be relatively movable back and forth in a die opening/closing direction, the clamp piece (20) is provided so as to be in contact with the mounted component (102) and clamp the mounted component (102), and the pressurization piece (21) is provided so as to pressurize the resin (R) without being in contact with the mounted component (102).
The problem addressed by the present invention is to provide a technology able to improve the production yield of molded articles. As a solution, a film (F) is supplied to the die surface of a resin molding die (10). Next, the film (F) is adhered to the die surface and caused to be in a state separated from the die surface at the corner section (13a) of a cavity indentation (13). Next, the die is closed, thus clamping the film (F). Next, a resin (R) filling the interior of the cavity indentation (13) with the film (F) therebetween while adhering the film (F) to the corner section (13a) is thermoset.
The problem addressed by the present invention is to provide a resin mold tooling allowing the production yield of a resin-molded product to be improved. As a solution, provided is a resin mold tooling (10) whereby a workpiece (W) having a to-be-mounted component (102) is clamped with an upper mold (11) and a lower mold (12) and resin-molded in such a way that the back face (102a) of the to-be-mounted component (102) is left exposed, wherein: a parting face (11a) of the upper mold (11) is provided with a cavity recess (15); the workpiece (W) is disposed on a parting face (12a) of the lower mold (12); the resin mold tooling is provided with an elastic body (16) which is provided so as to protrude from an internal bottom face (15a) of the cavity recess (15) and which is for pressing onto the to-be-mounted component (102); and an opposing face (16ab) of the elastic body (16) which opposes the to-be-mounted component (102) and protrudes from the internal bottom face (15a) of the cavity recess (15) is larger than a back face (102a) of the to-be-mounted component (102).
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
B29C 33/12 - Moulds or coresDetails thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
B29C 45/02 - Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
72.
LEAD FRAME, SUBSTRATE FOR LED PACKAGE, REFLECTOR MEMBER, LED PACKAGE, LIGHT EMITTING DEVICE, LIGHT EMITTING SYSTEM, METHOD FOR MANUFACTURING SUBSTRATE FOR LED PACKAGE, AND METHOD FOR MANUFACTURING LED PACKAGE
Provided are: an LED package that can be easily used by providing an external connection terminal of the LED package on the upper surface side (LED chip mounting surface side) of the LED package; and a member or the like to be used for the LED package. This lead frame has: a die pad for mounting an LED chip; a first electrode section for electrically connecting to a first electrode of the LED chip; and a second electrode section for electrically connecting to a second electrode of the LED chip. The first electrode section has a first external connecting terminal that is bent to be exposed from a resin main surface on the LED chip mounting side, said resin constituting the LED package, and the second electrode section has a second external connecting terminal that is bent to be exposed from the resin main surface on the LED chip mounting side.
The purpose of the present invention is to provide a resin molding device that has high repetition accuracy and that makes it possible to repeatedly perform resin molding of a motor core at a constant level of quality by: performing pressure control in accordance with variation in the thickness of a motor core and the dimensional tolerance with respect to the motor core so that the clamping pressure of a molding die becomes uniform at a plurality of locations; or by performing position control of a movable platen at a plurality of locations. This resin molding device is provided with: a drive means that is supported by a device base section (7) and that comprises a plurality of drive motors (20) that cause a movable platen (10) to move along a plurality of tie bars (9); and a control unit (21) that controls each of the driving operations of the plurality of drive motors (20). The control unit (21) controls each of the driving operations of the drive motors (20) and thereby causes the movable platen (10) to move so that a predetermined clamping pressure is achieved along the plurality of tie bars (9).
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
B29C 33/10 - Moulds or coresDetails thereof or accessories therefor with incorporated venting means
The present invention addresses the problem of providing a resin-molding die that allows clamping without exerting excessive stress on the workpiece, regardless of the existence and magnitude of variations in the thickness of the workpiece. As a means for solving the problem, the height of a workpiece support (37) is adjusted by a thickness-varying mechanism to match the thickness of a substrate (1), and the height of a cavity recess (32) is adjusted by a cavity-height-varying mechanism to match the height of a semiconductor chip (5) before molding resin is injected into the cavity.
The present invention addresses the problem of providing technology that is capable of improving the quality of moldings. As a solution, the lower mold (32) is provided with: a lower mold cavity piece (34) for configuring the bottom of a cavity (33); lower mold clampers (35) for configuring the sides of the cavity (33); a film loader (57) capable of holding and conveying a film (F) on which a resin (R) has been loaded; and a suction section (67) for picking up the film (F), which is disposed so as to cover the edges of the lower mold cavity piece (34) and the edges of the lower mold clampers (35). The lower mold cavity piece (34) moves relative to the lower mold clampers (35). The film loader (57) disposes the film (F) on the lower mold (32), in which the edges of the lower mold cavity piece (34) are held level with the edges of the lower mold clampers (35), so that the resin (R) is positioned above the lower mold cavity piece (34). The suction section (67) picks up and holds the film (F) so as to conform to the inner surface of the cavity (33) and supplies the resin (R) to the cavity (33).
The present invention addresses the problem of providing a technique with which transfer moulding and compression moulding can be freely performed in one resin moulding device. A controller (130) is configured so as to be capable of selectively implementing moulding processing for causing transfer moulding to be performed, and moulding processing for causing compression moulding to be performed. Furthermore, the controller (130) is configured such that the selected and set moulding processing is performed on the basis of an external input result. In the transfer-moulding processing, processing is performed in which a transfer-moulding resin is supplied to a pot, and a plunger is used to pump the transfer-moulding resin into a cavity. In the compression-moulding processing, processing is performed in which a compression-moulding resin is supplied to a cavity. A resin supply unit (120) is configured so as to be capable of selectively supplying, to a moulding die, the transfer-moulding resin and the compression-moulding resin, in accordance with the selected moulding processing.
B29C 45/02 - Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
B29C 69/02 - Combinations of shaping techniques not provided for in a single one of main groups , e.g. associations of moulding and joining techniquesApparatus therefor of moulding techniques only
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
The present invention addresses the problem of providing a resin molding mold capable of improved resin filling. The solution is a resin molding mold (10) wherein a communicating path that connects a pot (13), a cull (14), a runner gate (15), a forming cavity (16), a through gate (17), a dummy cavity (18), and an air vent (19) is formed by closing an upper die (11) with a lower die, and resin (R) that has been force-fed from the pot (13) and filled in the forming cavity (16) is heat-cured. Here, the resin molding mold (10) is provided with: a plate-shaped middle mold (20), which is clamped between the upper die (11) and the lower die (12); an air suction mechanism (50) provided so as to communicate with the air vent (19); and a movable pin (53) provided so as to be capable of moving back and forth in the middle section of the air vent (19).
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
78.
RESIST FILM FORMING DEVICE AND METHOD, CONDUCTIVE FILM FORMING AND CIRCUIT FORMING DEVICE AND METHOD, ELECTROMAGNETIC WAVE SHIELD FORMING DEVICE AND METHOD, SHORTWAVE HIGH-TRANSMISSIBILITY INSULATION FILM FORMING DEVICE AND METHOD, FLUORESCENT LIGHT BODY FILM FORMING DEVICE AND METHOD, TRACE MATERIAL COMBINING DEVICE AND METHOD, RESIN MOLDING DEVICE, RESIN MOLDING METHOD, THIN FILM FORMING DEVICE, ORGANIC ELECTROLUMINESCENCE ELEMENT, BUMP FORMING DEVICE AND METHOD, WIRING FORMING DEVICE AND METHOD, AND WIRING STRUCTURE BODY
Provided is a resist film forming device which uses an electrostatic spray device which is capable of forming a thin film with a uniform thickness on a workpiece. A resist film forming device (100), which forms a resist film (108) on a substrate by electrostatic spraying, comprises: a nozzle (102) which, upon application of a prescribed voltage, sprays liquid particles which form the raw material for a resist film (108) toward a substrate (105) having stepped portions (105a); a driving means (111) for causing relative movement of the substrate (105) or the nozzle (102); and a control means (110) for controlling such that the resist film (108) is formed on the substrate (105) having the stepped portions (105a) by the liquid particles.
The method is capable of resin-molding one side face of a work in a molding die set, in which the work is sucked and held on at least one of clamping faces and resin-molded in a cavity concave section. The method comprises the steps of: sucking and holding a release film which covers at least one of the clamping faces of the molding die set; setting the work in the molding die set; sucking the other side face of the work through a work sucking hole of the release film, which is formed before or after holding the release film, so as to hold the work on the clamping face; closing the molding die set so as to clamp the work; and pressurizing and heating the resin, which has been accommodated in the cavity concave section, with resin.
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
The purpose of the present invention is to reduce mould defects such as incomplete filling. At a resin supply part, a base resin part (27a) is formed from a granular resin (27) on a workpiece (W), and a convex resin part (27b) is formed, from a smaller amount of granular resin (27) than was used to form the base resin part (27a), on the base resin part (27a). At a press part (21), an upper mould (43) and a lower mould (44) are brought closer to the workpiece (W) mounted on the lower mould (44), whereby the upper mould (43) is brought into contact with the convex resin part (27b), molten resin is spread out on the base resin part (27a), and a cavity (45) is filled with resin.
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
Provided is an RFID tag which can be firmly attached to clothes, and does not provide a sense of discomfort even if the tag is brought into contact with the human body. The RFID tag performs wireless communication and comprises a main antenna (30) formed by conductive fibers, a loop antenna (12) which does not have direct electrical conductive connection to the main antenna (30), but is electrically coupled to the main antenna (30), a semiconductor device (20) which is electrically connected to a terminal (16) of the loop antenna (12), and a resin (28) which seals the main antenna (30), the loop antenna (12), and the semiconductor device (20) together.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
H01Q 1/40 - Radiating elements coated with, or embedded in, protective material
H01Q 9/16 - Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
82.
COMPRESSION MOLDING METHOD AND DEVICE FOR LIGHT-EMITTING DEVICE REFLECTOR
Provided are a compression molding method and device for light-emitting device reflectors for which mold resin utilization rate is improved and molding quality is improved such that resin flash does not occur. The reflector (3) is compression molded by: supplying molding resin (26) into recessed cavities (16), in which a release film (21) is held by adsorption, and filling the resin around pressing pins (17); aligning a workpiece with the recessed cavities (16) and placing the workpiece in contact with a clamper block (14) and the pressing pins (17) through the release film (21); clamping the workpiece using the mold (8); and moving the bottoms of the recessed cavities (16) relative to the workpiece to bring same closer to the workpiece by further clamping of the workpiece.
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B29C 43/36 - Moulds for making articles of definite length, i.e. discrete articles
B29C 43/56 - Compression moulding under special conditions, e.g. vacuum
The molding die set includes: a first molding die having a first molding chase, a cavity piece, supported by the first molding chase, movably supported by the first molding chase and enclosing the cavity piece; a second molding die having a second molding chase, a work supporting section biased and supported by the second molding chase and on which a work will be mounted, and a center insert located adjacent to the work supporting section; and a pot being provided to one of the first molding die and the second molding die, the pot feeding resin for molding the work. The second molding die has a thickness adjusting mechanism, which makes the work supporting section absorb thickness variation of the work and brings the work into contact with the movable clamper when the work is clamped with the movable clamper of the first molding die.
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
The compact resin molding machine is capable of efficiently performing a sequence of molding actions from feeding a work and resin to accommodating the molded work. The resin molding machine comprises: a work conveying mechanism including a robot, which has a robot hand for holding the work and which is capable of rotating and linearly moving; a work feeding section for feeding the work; a resin feeding section for feeding the resin; a press section including a molding die set, in which the work is resin-molded; a work accommodating section for accommodating the molded work; and a control section controlling the entire resin molding machine. The work feeding section, the resin feeding section, the press section and the work accommodating section are located to enclose a moving area of the robot of the work conveying mechanism.
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B29C 31/00 - Handling, e.g. feeding of the material to be shaped
B29C 37/00 - Component parts, details, accessories or auxiliary operations, not covered by group or
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
B29C 35/02 - Heating or curing, e.g. crosslinking or vulcanising
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
semi-conductor packaging machines, namely, plastic molding machines, plastic processing machines, metal working machines, metal and plastic cutting machines and parts for all the foregoing goods
