Provided is a semiconductor chip that can relay signals by inductive coupling. The semiconductor chip comprises a first reception coil that receives a signal generated by another adjacent first semiconductor chip from the other semiconductor chip, a second reception coil that receives a signal generated by another adjacent second semiconductor chip from the other semiconductor chip, a first transmission coil, a first reception circuit into which the signal received by the first reception coil is inputted, a second reception circuit into which the signal received by the second reception coil is inputted, a first transmission circuit that outputs a signal to the first transmission coil, and an intermediate circuit. When a first polarity of a signal inputted from the first reception circuit and a second polarity of a signal inputted from the second reception circuit are the same, the intermediate circuit outputs a signal generated on the basis of the signals from the first reception circuit and the second reception circuit to the first transmission circuit, and when the first polarity and the second polarity are opposite, the intermediate circuit eliminates the signals from the first reception circuit and the second reception circuit.
H04B 5/72 - Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes for local intradevice communication
2.
SEMICONDUCTOR MODULE MANUFACTURING METHOD AND SEMICONDUCTOR MODULE
A semiconductor module comprising: a first semiconductor chip having a first coil; a second semiconductor chip having a second coil capable of communication with the first coil via inductive coupling, the second semiconductor chip being disposed spaced apart in a horizontal direction perpendicular to an axial direction of the first coil; and a magnetic material disposed on a closed magnetic circuit relating to the inductive coupling at least between the first and second semiconductor chips.
H10D 80/20 - Assemblies of multiple devices comprising at least one device covered by this subclass the at least one device being covered by groups , e.g. assemblies comprising capacitors, power FETs or Schottky diodes
3.
COMMUNICATION APPARATUS, CONTROL METHOD, AND STORAGE MEDIUM
In a first communication apparatus, a transmission circuit including a transmitting coil performs wireless transmission to a second communication apparatus through inductive coupling between the transmitting coil of the first communication apparatus and a receiving coil of the second communication apparatus. A reception circuit including a receiving coil performs wireless reception from the second communication apparatus through inductive coupling between the receiving coil of the first communication apparatus and a transmitting coil of the second communication apparatus. A determination unit determines whether a collision occurred between wireless transmissions performed by a plurality of communication apparatuses, based on at least one of a frequency and a pulse width of a pulse sequence received via the reception circuit. In a case where the collision occurred, a control unit performs control to transmit a retransmission request to the second communication apparatus via the transmission circuit.
Provided is a communication chip comprising a control circuit, a transmission circuit, and a transmission coil. The control circuit transmits a transmission signal and a transmittable signal to the transmission circuit. The control circuit uses the transmittable signal to control whether the transmission circuit transmits or does not transmit the transmission signal to the transmission coil, and carries out communication on the basis of the transmission signal by inductive coupling generated between the transmission coil and a reception coil in another chip. The transmission circuit may carry out the control causing the transmission circuit not to transmit the transmission signal to the transmission coil by using the transmittable signal to set the transmission circuit to a high impedance.
There is provided a communication device including a sending unit which includes a first coil and a receiving unit which includes a second coil, wherein a resonance phenomenon of a magnetic field is generated in at least one of the first coil or the second coil, which causes the sending unit to send a signal to the receiving unit, and the signal is a signal at a secondary or higher resonant frequency. There may be provided a sending device including a sending unit which includes a coil, wherein a resonance phenomenon of a magnetic field at a secondary or higher resonant frequency in the coil causes a change in a magnetic field in a receiving unit, which causes communication from the sending unit to the receiving unit at the secondary or higher resonant frequency.
H01Q 7/00 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
6.
INFORMATION PROCESSING APPARATUS, INFORMATION ANALYSIS SYSTEM, AND MEASUREMENT METHOD
An apparatus includes first and second chips. The first chip includes a first transmission control portion to generate a transmission signal, and a first transmitting coil connected to the first transmission control portion to transmit the transmission signal. The second chip includes a second receiving coil capable of receiving the transmission signal by being inductively coupled with the first transmitting coil, and a second detection portion to detect a voltage or current applied to the second receiving coil. The first and second chips are in close proximity to enable wireless communication through inductive coupling. The second detection portion is configured to detect, when a change in voltage or current occurring in the second receiving coil satisfies a predetermined condition, a change in relative position between the first chip and the second chip, or vibration applied to the first and second chips, pressure change, temperature change, or electromagnetic wave.
G08C 19/08 - Electric signal transmission systems in which the signal transmitted is magnitude of current or voltage using variable inductance differentially influencing two coils
09 - Scientific and electric apparatus and instruments
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
Electric coils; Magnetic coils; Electronic resonators; Electromagnetic coils; Transmitters of electronic signals; Receivers of electronic signals; Electronic circuits for transmitting radio-frequency and electronic signals; Electronic circuits for receiving electronic signals and radio-frequency; Electronic circuits for transmitting and receiving electronic signals and radio-frequency; Computers; Integrated circuits; Large scale integrated circuits; Downloadable computer programs for designing, simulating, and programming integrated circuits; Downloadable computer programs for chip design; Recorded computer software for designing, simulating, and programming integrated circuits; Recorded computer software for chip design; Computer hardware; Microchips; Recorded computer programs for use in designing, simulating, and programming integrated circuits; Central processing units (CPU); Semiconductors; Printed circuits; Printed circuit boards; Microprocessors; Downloadable electronic publications in the nature of instruction manuals in the field of integrated circuit design; Electronic inductors; Electronic components in the nature of electrical signal isolators and digital electrical signal isolators; Semiconductor chips; Antennas Custom manufacturing of integrated circuit chips for others; Encapsulation of semiconductors for others; Custom manufacture of computers for others; Custom manufacture of electronic machines and apparatus and their components Design of integrated circuits; Design of computers for others; Computer system design; Design and development of computer hardware; Consultancy in the design and development of computer hardware; Custom design of prototypes; Development of computer platforms; Design and writing of computer software; Maintenance of computer software; Development of software for chip design; Design and development of computer software for use in managing, configuring, and executing functions of hardware implemented on integrated circuits; Consultation services relating to computer software; Data conversion of computer programs and data, not physical conversion; Data encryption services; Design of computer programs; Maintenance of computer programs; Writing of computer programs; Monitoring of computer systems for detecting unauthorized access or data breach; Computer technology consultancy; Computer virus protection services; Consultancy and design information services relating to information technology architecture and infrastructure; Providing technology information in the field of integrated circuits, microprocessors, microcontrollers, printed circuit boards, computer hardware and computer software design; Providing technology information in the field of design of electronic machines and apparatus and their components; Advice relating to the design of computer hardware; Consultancy in the field of software design; Quality control of integrated circuits, microprocessors, microcontrollers, printed circuit boards, computer hardware, and computer software for others; Consulting in the field of machinery design; Design of electric circuit boards; Technology consultation in the field of integrated circuits, microprocessors, microcontrollers, printed circuit boards, computer hardware and computer software design; Designing of electronic machines, apparatus, and components being instruments or systems composed of such machines, apparatus and instruments; Consulting in the field of auxiliary design for electronic machines and apparatus and their components; Design of semiconductor chips
8.
EVALUATION SYSTEM, SEMICONDUCTOR CHIP, CONTROL METHOD, AND PROGRAM
Provided is an evaluation system comprising: a first reception coil disposed in a first region and having a first self-inductance; a second reception coil disposed in the first region and having a second self-inductance different from the first self-inductance; and one or more processors. The one or more processors acquire a first evaluation value representing the quality of a first wireless signal received via a first inductive coupling between the first reception coil and a first transmission coil that is disposed in a second region different from the first region, and further acquire a second evaluation value representing the quality of a second wireless signal received via a second inductive coupling between the second reception coil and a second transmission coil that is disposed in the second region and is the same as or different from the first transmission coil.
H04B 5/73 - Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes for taking measurements, e.g. using sensing coils
Provided is a first communication device comprising: a communication circuit including a first coil, the communication circuit performing wireless communication with a second communication device via inductive coupling between the first coil and a second coil of the second communication device; and an application means for applying a plurality of voltage patterns to the first coil via the communication circuit, each of the voltage patterns including a first signal portion used for detecting the number of bit errors in the second communication device, and the first signal portion of each of the voltage patterns having different frequency characteristics.
This sensor unit is fixed to a movement path along which a moving body moves, and includes: an environmental power generation device that generates power using electromagnetic energy emitted into the surrounding environment when the moving body passes through the movement path; and a sensor that receives the power generated by the environmental power generation device and performs sensing. This sensing method for performing sensing with a sensor unit fixed to a movement path along which a moving body moves includes: an environmental power generation step for generating power using electromagnetic energy emitted into the surrounding environment when the moving body passes through the movement path; and a step for receiving the power generated in the environmental power generation step and performing sensing.
There is provided an information processing device including: a first coil; a second coil; and a calculation unit which calculates a state of a substance by detecting a state of communication between the first coil and the second coil, in which the substance is arranged in a gap between the first coil and the second coil, and the state of communication is associated with a change in the substance. There is provided an information processing device including: a first coil; a second coil; a support portion which supports the first coil and the second coil; and a calculation unit which detects a state of communication between the first coil and the second coil, and calculates a state of a substance that is arranged between the first coil and the second coil, in which the state of communication is associated with the state of the substance in advance.
Provided is an infection notice transmission apparatus permitted to send an infection notice to an external network if infected with a malicious program. The infection notice transmission apparatus may communicate with the external network by using a same global IP address as that used by one or more computers in a computer network. Communication from the infection notice transmission apparatus to the computer network is prohibited, and the infection notice transmission apparatus has a same software environment as that of the one or more computers.
[Abstract] [Problem] To provide a novel semiconductor device and the like. [Solution] This semiconductor device comprises a board and a semiconductor chip provided in the vertical direction of the board, wherein the semiconductor chip includes a processor or a memory, a communication coil performs magnetic field coupling communication with another communication coil provided at a location away from the board and the semiconductor chip, the communication coil transmits information inputted from the semiconductor chip or outputs received information to the semiconductor chip, the communication coil comprises a winding at least partially formed inside the board, and the central axis direction of the winding is different from the vertical direction. [Selected drawing] FIG. 2
There is provided an information processing apparatus comprising a first semiconductor chip and a second semiconductor chip that performs wireless communication with the first semiconductor chip. The first semiconductor chip includes a processor that executes information processing, and a communication circuit configured to receive a wireless signal from the second semiconductor chip. The processor functions as a state determination unit configured to determine a state of at least one of the first semiconductor chip and the second semiconductor chip on a basis of a time-series change in a measurement value of the wireless signal received from the second semiconductor chip via the communication circuit.
G06F 11/07 - Responding to the occurrence of a fault, e.g. fault tolerance
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H10B 80/00 - Assemblies of multiple devices comprising at least one memory device covered by this subclass
According to the present invention, a rail joint gap distance of an object to be measured is continuously observed. This information processing device comprises a plurality of chip pairs each having a first chip having a first coil and a second chip having a second coil for receiving a signal transmitted from the first coil by magnetic field coupling or magnetic field resonance, the plurality of chip pairs being fixed to the object to be measured, which has the rail joint gap. The information processing device comprises a control unit which detects communications between the first coil and the second coil to detect a state change in the object to be measured.
G01B 7/00 - Measuring arrangements characterised by the use of electric or magnetic techniques
B61K 9/08 - Measuring installations for surveying permanent way
G01B 7/14 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring distance or clearance between spaced objects or spaced apertures
[Problem] To provide a novel semiconductor device and the like. [Solution] This semiconductor device includes a substrate having a communication coil formed therein, and a semiconductor chip provided on an upper side of the substrate. The semiconductor chip includes a processor or a memory. The communication coil performs magnetic field coupling communication with another communication coil included in another device installed at a position away from the substrate and the semiconductor chip, and the communication coil transmits information input from the semiconductor chip or outputs received information to the semiconductor chip.
Provided is a first communication device comprising: a transmission circuit that includes a transmission coil and performs wireless transmission to a second communication device via inductive coupling between a transmission coil of the first communication device and a reception coil of the second communication device; a reception circuit that includes a reception coil and performs wireless reception from the second communication device via the inductive coupling between a reception coil of the first communication device and a transmission coil of the second communication device; a determination means that determines, on the basis of a reception signal received via the reception circuit, whether or not a collision of wireless transmission by the plurality of communication devices has occurred; and a control means that performs, when the collision occurs, control so as to transmit a retransmission request to the second communication device via the transmission circuit.
This information processing device comprises a first coil, a second coil which is disposed alongside a surface around which the first coil is wound, and which receives a signal transmitted from the first coil, by magnetic field coupling, and a calculating unit which calculates a state of a substance by detecting a state of communication between the first coil and the second coil, wherein the substance is disposed between the first coil and the second coil, and the state of communication is associated with a change in the substance. The information processing device comprises the first coil, the second coil which receives the signal transmitted from the first coil, by magnetic field coupling, a supporting unit for supporting the first coil and the second coil, and the calculating unit which detects the state of communication between the first coil and the second coil, and calculates the state of the substance, separate from the supporting unit, that is disposed between the first coil and the second coil, wherein the state of communication and the state of the substance are associated in advance.
G01N 22/00 - Investigating or analysing materials by the use of microwaves or radio waves, i.e. electromagnetic waves with a wavelength of one millimetre or more
G01B 7/24 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in magnetic properties
G01N 27/72 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
19.
SEMICONDUCTOR MODULE MANUFACTURING METHOD AND SEMICONDUCTOR MODULE
[Problem] To provide a semiconductor module and a semiconductor module manufacturing method that make easier manufacturing possible. [Solution] The present invention is characterized by comprising: a first semiconductor chip comprising a first coil; a second semiconductor chip comprising a second coil capable of communicating with the first coil via inductive coupling, said second semiconductor chip being arranged away in a horizontal direction perpendicular to the axial direction of the first coil; and a magnetic body arranged on a closed magnetic circuit related to inductive coupling, at least between the first and second semiconductor chips.
[Problem] To make it possible to configure an input device easily. [Solution] An information processing device characterized by comprising first and second coils capable of performing wireless communication by inductive coupling, and a detection unit that detects, as a trigger, the first and second coils becoming able to communicate.
A semiconductor chip including a processor, a coil for performing wireless communication with another semiconductor chip, a positive electrode power supply terminal, and a negative electrode power supply terminal. In a material including a positive electrode power supply area and a negative electrode power supply area, the positive electrode power supply area is bonded or abutted against the positive electrode power supply terminal, the negative electrode power supply area is bonded or abutted against the negative electrode power supply terminal, and an area size of at least one of the positive electrode power supply area and the negative electrode power supply area is wider than an area size of an end part of at least one of the positive electrode power supply terminal and the negative electrode power supply terminal.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
[Problem] The purpose of the present invention is to provide an information processing device with which it is possible to increase the distance for which communication is possible between a plurality of semiconductor chips included in the information processing device. [Solution] Provided is an information processing device comprising a plurality of semiconductor chips that are capable of wirelessly communicating in a direct or indirect manner, the plurality of semiconductor chips being positioned along a plane of the semiconductor chips, the information processing device characterized in that: each of the semiconductor chips is provided with a coil that utilizes inductive coupling to communicate with the other semiconductor chips, and a transmission/reception circuit that supplies a transmission signal to the coil and acquires a reception signal received by the coil; and the information processing device furthermore comprises a first element having reflection characteristics for reflecting a magnetic field, the first element being positioned at a position that covers at least one of gap positions between the plurality of semiconductor chips.
An apparatus includes first and second chips. The first chip includes a first transmission control portion to generate a transmission signal, and a first transmitting coil connected to the first transmission control portion to transmit the transmission signal. The second chip includes a second receiving coil capable of receiving the transmission signal by being inductively coupled with the first transmitting coil, and a second detection portion to detect a voltage or current applied to the second receiving coil. The first and second chips are in close proximity to enable wireless communication through inductive coupling. The second detection portion is configured to detect, when a change in voltage or current occurring in the second receiving coil satisfies a predetermined condition, a change in relative position between the first chip and the second chip, or vibration applied to the first and second chips, pressure change, temperature change, or electromagnetic wave.
G08C 19/08 - Electric signal transmission systems in which the signal transmitted is magnitude of current or voltage using variable inductance differentially influencing two coils
24.
INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND COMPUTER PROGRAM
To enable necessary information to be obtained from a sensor when necessary. An information processing device includes a processing unit including a memory, a sensing unit, a condition storage unit configured to store a condition for outputting a situation value indicating a state according to a situation in which the information processing device is disposed, a determination unit configured to determine whether the condition is satisfied, a situation value calculation unit configured to calculate the situation value based on a measured value acquired by the sensing unit, and an output unit configured to output the situation value when the condition is satisfied.
Provided is an information processing device comprising a first semiconductor chip, and a second semiconductor chip that performs wireless communication with the first semiconductor chip, the information processing device being characterized in that the first semiconductor chip includes a processor that performs information processing, and a communication unit that receives a wireless signal from the second semiconductor chip, and the processor has a state determination unit that determines a state of at least one among the first semiconductor chip and the second semiconductor chip on the basis of time-series changes in a measurement value of the wireless signal received via the communication unit from the second semiconductor chip.
[Solution] A semiconductor chip (1a) provided with a processor (10a), a coil (70a) for wirelessly communicating with another semiconductor chip (1b), a positive electrode power supply terminal (62a), and a negative electrode power supply terminal (61a), wherein, in a material provided with a positive electrode power supply area (52) and a negative electrode power supply area (51): the positive electrode power supply area (52) is bonded or brought into contact with the positive electrode power supply terminal (62a); the negative electrode power supply area (51) is bonded or brought into contact with the negative electrode power supply terminal (61a); the area of at least one of the positive electrode power supply area (52) and the negative electrode power supply area (51) is greater than the area of the end portion of at least one of the positive electrode power supply terminal (62a) and the negative electrode power supply terminal (61a).
H01L 25/04 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers
H01L 21/822 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
H01L 27/04 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
H04B 5/02 - Near-field transmission systems, e.g. inductive loop type using transceiver
27.
INFORMATION PROCESSING DEVICE, INFORMATION ANALYSIS SYSTEM, AND MEASUREMENT METHOD
[Problem] To detect a state amount, it was required to connect a sensing device in addition to an information processing device. [Solution] Provided is an information processing device which is characterized by comprising at least a first chip and a second chip, wherein the first chip includes a first transmission control unit that generates a transmission signal and a first transmission coil that is connected to the first transmission control unit and transmits the transmission signal, and the second chip includes a second reception coil that can receive the transmission signal by performing induction coupling with the first transmission coil, and a second detection unit that detects a voltage or current applied to the second reception coil. The first chip and the second chip are positioned in proximity to be capable of wirelessly communicating with each other through induction coupling, and a change in the relative positions of the first and second chips, vibrations applied to the first and second chips, a pressure change, a temperature change, or an electromagnetic wave are detected by the second detection unit when a current or voltage change generated in the second reception coil satisfies a prescribed condition.
[Problem] To make it possible to obtain necessary information from a sensor when necessary. [Solution] Provided is an information processing device characterized by comprising: a processor that has a memory; a sensing unit; a condition storage unit that stores a condition for outputting an environmental value indicating a state related to an environment in which the information processing device is disposed; a determination unit that determines whether or not the condition is satisfied; an environmental value calculation unit that calculates the environmental value on the basis of a measured value acquired by the sensing unit; and an output unit that outputs the environmental value when the condition is satisfied.
H04Q 9/00 - Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom
G08C 15/00 - Arrangements characterised by the use of multiplexing for the transmission of a plurality of signals over a common path
G08C 15/06 - Arrangements characterised by the use of multiplexing for the transmission of a plurality of signals over a common path successively, i.e. using time division
29.
INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND PROGRAM
Measurement of intended situation values. An information processing device, comprising: a processor having a memory; a sensing unit; an acquisition unit for acquiring, using the sensing unit, a measurement value corresponding to an situation in which the information processing apparatus is located; a logic storage unit for storing at least one of a plurality of calculation logics corresponding to a plurality of types of situation values indicating a state pertaining to the situation and a plurality of calculation logics corresponding to a plurality of types of calculation methods for the situation values; and a calculation unit for calculating the situation value from the measured value using the calculation logic corresponding to the set type of the situation value.
G01K 3/14 - Thermometers giving results other than momentary value of temperature giving differences of valuesThermometers giving results other than momentary value of temperature giving differentiated values in respect of space
30.
Information processing device, information processing method, and program
The data measured by the sensor can be stored in a way that is difficult to tamper with. An information processing device, comprising: a processor having a memory; a sensing unit; an acquisition unit for acquiring, using the sensing unit, a measurement value corresponding to the situation in which the information processing device is located; a calculation unit for calculating a situation value indicating a state pertaining to the situation based on the measured value; and a writing unit for issuing a write request to an external storage system via a communication network to write the situation value.
According to the present embodiment, a discrimination apparatus includes a processor. The processor extracts a plurality of instructions from binary data. The processor generates a plurality of input data strings by padding with a fixed character on data strings of the instructions so that the data strings of the instructions each have a fixed length. The processor generates a feature vector of a program including the instructions or a classification result related to the program by using the input data strings and a trained convolutional neural network including a convolution layer that performs processing in units of the instructions.
