An RF component with integrated EMI shielding may be used in an RF amplifier. The RF component includes a component housing made of a dielectric material, an RF component circuit, and an EMI shield integrated with the component housing for shielding the RF component circuit. The EMI shield may include a shielding portion located in the component housing and spaced from the RF component circuit by a predetermined distance and engaging members extending from the shielding portion inside the component housing to outside of the component housing. The engaging members contact an amplifier chassis for securing the RF component to the amplifier chassis and for grounding the EMI shield to the amplifier chassis. One example of the RF component includes a diplexer.
H03F 3/195 - High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only in integrated circuits
H04B 1/00 - Details of transmission systems, not covered by a single one of groups Details of transmission systems not characterised by the medium used for transmission
The present disclosure provides an RF line extender amplifier in a hybrid fiber-coaxial (HFC) network, the RF line extender amplifier including: RF amplifier circuitry; a service port communicatively coupled with the RF amplifier circuitry; and a wireless adapter communicatively coupled with the RF amplifier circuitry via the service port, the wireless adapter configured to communicatively couple with a user device to allow for wireless maintenance of the RF line extender amplifier.
A coaxial cable seizure assembly includes a includes a multi-part conductor to provide a coaxial cable connection inside an HFC network device, such as an HFC node or amplifier. The multi-part conductor portion includes a pin portion and separate a socket portion that engages the pin portion. The pin portion and the socket portion are located in an insulator portion. The insulator portion may be located inside a housing of the HFC network device adjacent a coaxial cable port such that the socket portion is aligned with and receives a coaxial cable center conductor pin of a coaxial cable connected to the coaxial cable port. In one embodiment, a coaxial cable seizure assembly includes a pin portion configured to mate with a coaxial RF connector (e.g., a G-type connector) inside the housing.
H01R 24/40 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
H01R 9/05 - Connectors arranged to contact a plurality of the conductors of a multiconductor cable for coaxial cables
The present disclosure provides a computer-implemented method for communication with radio frequency (RF) amplifiers in a hybrid fiber-coaxial (HFC) network, the computer-implemented method including: providing, by one or more computer processors, return communications from one or more RF amplifiers to a headend; and providing, by the one or more computer processors, forward communications from the headend to the one or more RF amplifiers, wherein: the return communications and the forward communications use out of band (OOB) communication protocols.
A hinged housing with a hinge retention mechanism may be used to house electronic equipment such as an RF amplifier in a hybrid fiber-coaxial (HFC) network delivering CATV services to subscriber locations. The hinged housing includes housing portions that may be separated by uncoupling hinge members forming one or more hinges, for example, to replace or repair the electronic equipment. The hinge retention mechanism prevents inadvertent uncoupling of the hinge members and separation of the housing portions. The hinge retention mechanism is retractable and push-activated to allow the hinge members to uncouple while the retention mechanism remains secured to one of the housing portions. In one embodiment, the retention mechanism may be provided on a replacement lid assembly of an electronic equipment housing (e.g., an RF amplifier housing), which is designed to replace a lid assembly on an existing housing in the field.
Low data rate, low power, bi-directional transmissions may be provided over existing physical communication media (e.g., coaxial cables) using a portable network communications module and in the presence of higher bandwidth, higher power primary signals currently being transmitted over the communication media. The low data rate, low power, bi-directional transmissions may be accomplished using spread-spectrum modulated signals that are positioned in frequency relative to the primary signals, such that the low data rate, low power transmissions occur without detectable interference with the primary signals, which include multiplexed narrowband modulated signals. The primary signals may be modulated using quadrature amplitude modulation (QAM) and multiplexed using orthogonal frequency division multiplexing (OFDM) and the spread-spectrum modulated signals may be chirp spread spectrum (CSS) modulated signals modulated using Gaussian frequency shift keying (GFSK). One example of the spread-spectrum modulated signals is implemented using LoRa technology and communication protocols defined by the LoRaWAN standard.
A coaxial cable seizure assembly includes a stamped conductor with a leaf spring receptacle portion to provide a coaxial cable connection inside an HFC network device, such as an HFC node or amplifier. The stamped conductor portion is stamped from a single piece of metal and is located in an insulator portion. The insulator portion may be located inside a housing of the HFC network device adjacent a coaxial cable port such that the leaf spring receptacle portion is aligned with and receives a coaxial cable center conductor pin of a coaxial cable connected to the coaxial cable port. In one embodiment, a coaxial cable seizure assembly further includes a pin portion formed from the same piece of metal as the leaf spring receptacle. In another embodiment, a PCB-mounted coaxial cable seizure assembly further includes a PCB mounting portion formed from the same piece of metal as the leaf spring receptacle.
H01R 24/54 - Intermediate parts, e.g. adapters, splitters or elbows
H01R 24/50 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
8.
METHOD OF MANUFACTURING EDGE EMITTING LASERS BY CLEAVING A SEMICONDUCTOR WAFER ALONG ONE OR MORE STREETS FORMED ON THE WAFER
Methods of manufacturing edge-emitting lasers include cleaving a semiconductor wafer along one or more streets formed on the wafer. A street is an extended region formed without dielectric and metal layers and may be formed on the semiconductor wafer, for example, by a selective wet etching process or a dry etching process. Cleaving along the street(s) without dielectric and metal layers achieves cleaved facets, which are substantially free from microstep defects and metal contamination. After cleaving, a dielectric material may be provided on the remaining street portions along the ends of the cleaved facets, for example, by intentional overspray deposition of facet coatings.
Low data rate, low power, bi-directional transmissions may be provided over existing physical communication media (e.g., coaxial cables and/or optical fiber) and in the presence of higher bandwidth, higher power primary signals currently being transmitted over the communication media. The low data rate, low power, bi-directional transmissions may be accomplished using spread-spectrum modulated signals that are positioned in frequency relative to the primary signals, such that the low data rate, low power transmissions occur without detectable interference with the primary signals, which include multiplexed narrowband modulated signals. In some embodiments, the primary signals may be modulated using quadrature amplitude modulation (QAM) and multiplexed using orthogonal frequency division multiplexing (OFDM) and the spread-spectrum modulated signals may be chirp spread spectrum (CSS) modulated signals modulated using Gaussian frequency shift keying (GFSK). One example of the spread-spectrum modulated signals is implemented using LoRa technology and communication protocols defined by the LoRaWAN standard.
Low data rate, low power, bi-directional transmissions may be provided over existing physical communication media (e.g., coaxial cables and/or optical fiber) and in the presence of higher bandwidth, higher power primary signals currently being transmitted over the communication media. The low data rate, low power, bi-directional transmissions may be accomplished using spread-spectrum modulated signals that are positioned in frequency relative to the primary signals, such that the low data rate, low power transmissions occur without detectable interference with the primary signals, which include multiplexed narrowband modulated signals. In some embodiments, the primary signals may be modulated using quadrature amplitude modulation (QAM) and multiplexed using orthogonal frequency division multiplexing (OFDM) and the spread-spectrum modulated signals may be chirp spread spectrum (CSS) modulated signals modulated using Gaussian frequency shift keying (GFSK). One example of the spread-spectrum modulated signals is implemented using LoRa technology and communication protocols defined by the LoRaWAN standard.
A multi-section semiconductor optical amplifier (SOA) includes at least two sections in series—an input section at an input side and an output section at an output side—with the input section having a higher optical confinement (also referred to as a high gamma) and the output section having a lower optical confinement (also referred to as a low gamma). The input section may also have a shorter length than the output section. The multi-section structure allows optimizing the input side and the output side design separately such that the input section provides a high gain section configured to quickly increase optical power and the output section provides a low differential gain section that improves saturation. As a result, the multi-section SOA can achieve higher output power with high gain and lower signal noise while demanding low input power.
09 - Scientific and electric apparatus and instruments
Goods & Services
optical communication instruments, namely, optical transmitters, and optical receivers; network communication equipment in the nature of equipment for communication of cable television signals, namely, amplifiers, signal generators, signal splitters, and signal optical nodes for optical and coaxial cable communication; optical fibers; transistors; lasers, not for medical purposes; photodiodes; photoelectric sensors; optical receivers; optics hardware, namely, optical nodes, optical amplifiers, and radio frequency (RF) amplifiers
13.
Forward and reverse test point circuit with switchable termination for use in an RF amplifier
A forward and reverse test point circuit with a switchable termination may be used to provide testing of forward and reverse RF signals in an RF amplifier before and/or after amplification. The switchable forward and reverse test point circuit includes at least one switchable termination circuit coupled between forward and reverse terminals of a directional coupler and at least one test point. During forward signal testing, the forward terminal is switched to the at least one test point and the reverse terminal is switched to a termination. During reverse signal testing, the reverse terminal is switched to the at least one test point and the forward terminal is switched to a termination. The RF amplifier including the switchable forward and reverse test point circuit may be used in a hybrid fiber-coaxial (HFC) network delivering CATV services and may be capable of amplifying RF signals up to 1.8 GHz.
A heat transfer device may be used to provide a thermal conduit from heat generating components mounted on transversely oriented circuit boards. The heat transfer device generally includes a base portion for supporting and thermally coupling with at least one heat generating component on a main circuit board and a transverse portion for supporting and thermally coupling with at least one heat generating component on a daughter circuit board that is oriented transverse to the main circuit board. The base and transverse portions may be made of a thermally conductive material with raised pedestals providing the thermal coupling with the heat generating components. The transverse portion of the heat transfer device may also be designed to facilitate connecting the daughter circuit board to the main circuit board. The heat transfer device may be used in an opto-electronic communications module, such as a broadband digital access (BDA) module used in a hybrid fiber-coaxial (HFC) network.
A lid assembly containing a lid gasket may be used to replace an existing lid assembly that forms part of a housing of an outdoor electronic device, such as an RF amplifier in a hybrid fiber-coaxial (HFC) network delivering CATV services to subscriber locations. The replacement lid assembly is configured to engage and cover an existing base of the electronic device, such as an RF amplifier, without disconnecting the electronic device (e.g., without interrupting CATV service). The lid gasket in the lid assembly may comply with current requirements and/or standards and is configured to engage the existing base adjacent an older gasket in the base to reinforce sealing of the electronic device housing. The lid assembly may also be configured to include improved or upgraded electronic components, such as an integrated power supply, and/or to provide improved heat transfer.
Automatic gain control (AGC) may be accomplished in a radio frequency (RF) amplifier in a hybrid fiber-coaxial (HFC) network using a wideband RF tuner to select multiple pilot channels (e.g., frequencies in lower and upper portions of an RF signals spectrum) for use in measuring power and determining a correction to be applied to the RF amplifier. The power of the pilot channel or channels may be measured, for example, using a received signal strength indicator (RSSI) from the wideband RF tuner or using a power detector circuit. Using the wideband RF tuner allows selectable gain and/or tilt control across a wideband spectrum, such as a channel spectrum of a CATV downstream RF signal, to maintain stable RF output levels of the amplifier as RF input levels vary. The RF amplifier may be a line extender amplifier used in a CATV HFC network to amplify a wideband RF spectrum of up to 1.8 GHz.
A semiconductor optical device including a buried heterostructure (BH) has reduced parasitic capacitance and reduced inter-diffusion. The semiconductor optical device is manufactured by a regrowth on both sides of a mesa structure with an Fe-doped current blocking layer and an n-type cladding layer outside of an active region in the mesa structure. The Fe-doped current blocking layer and the n-type cladding layer may be disposed and configured such that Fe/Zn inter-diffusion is reduced or prevented by minimal contact between the Fe-doped current blocking layer and a highly Zn-doped cladding layer and by the n-type cladding layer, as will be described in greater detail below. A low Zn-doped or undoped material may be used for a thin cladding layer above the active region in the mesa structure to further suppress Zn/Fe inter-diffusion.
09 - Scientific and electric apparatus and instruments
Goods & Services
(1) Electronic equipment, namely, signal generators for simulating channel loading on networks for transmitting and receiving cable television signals.
09 - Scientific and electric apparatus and instruments
Goods & Services
(1) Electronic equipment, namely, transponders for establishing remote communication with amplifiers used in connection with networks for transmitting and receiving cable television signals; electronic equipment, namely, gateways for establishing remote communication with amplifiers used in connection with networks for transmitting and receiving cable television signals.
09 - Scientific and electric apparatus and instruments
Goods & Services
(1) Electronic equipment, namely, transponders for establishing remote communication with amplifiers used in connection with networks for transmitting and receiving cable television signals; electronic equipment, namely, gateways for establishing remote communication with amplifiers used in connection with networks for transmitting and receiving cable television signals.
09 - Scientific and electric apparatus and instruments
Goods & Services
(1) Electronic equipment, namely, amplifiers, signal generators, signal splitters and signal optical nodes for optical and coaxial cable communication, used in connection with cable television converters, cable television transmitters, and cable television receivers.
26.
Optical transceiver housing with integrated vapor chamber and an optical transceiver module implementing same
The present disclosure is generally directed to an optical transceiver housing for use in an optical transceiver module with at least one vapor chamber integrated into the transceiver housing. In more detail, the transceiver housing includes at least first and second housing portions on opposite sides and forming a compartment defined by one or more inner surfaces therein. The vapor chamber includes a heat input side and a heat output side on opposite sides of the vapor chamber. An outer wall of at least one of the housing portions may be defined at least in part by the heat output side of the vapor chamber such that the heat output side is exposed to outside of the transceiver housing for transferring heat from inside to outside the optical transceiver module.
09 - Scientific and electric apparatus and instruments
Goods & Services
electronic equipment, namely, transponders for establishing remote communication with amplifiers and used in connection with,
and as component parts of, networks for transmitting and receiving cable television signals, not for end use by consumers of
telecommunication services to enable use of the telecommunicaton services; electronic equipment, namely, gateways for
establishing remote communication with amplifiers and used in connection with, and as component parts of, networks for
transmitting and receiving cable television signals, not for end use by consumers of telecommunication services to enable use of
the telecommunicaton services
An aspect of the present disclosure includes a node housing for use in a broadband distribution network that includes coupling the amplifier to a lid portion and providing an interface plate in a base portion that allows for RF and power signals to be provided to the RF amplifier within the lid portion. The interface plate disposed within the base portion further preferably provides power pass-through to downstream nodes that remains electrically connected even when the amplifier is decoupled from the lid portion. Thus, the amplifier and/or lid portion may be decoupled from the base portion without disrupting power distribution to the down-stream nodes.
A broadband digital access (BDA) architecture includes a BDA hub device in a headend/hub and one or more BDA node modules in one or more HFC nodes to enable digital communications between the headend/hub and the HFC node(s) in a CATV/HFC network. The BDA hub device and the BDA node module(s) are connected by one or more downstream optical fibers and one or more upstream optical fibers to enable digital optical communications therebetween. The BDA hub device provides an analog RF interface with equipment in the headend/hub and the BDA node module provides an analog RF interface with subscriber locations via one or more coaxial cables.
H04N 21/438 - Interfacing the downstream path of the transmission network originating from a server, e.g. retrieving encoded video stream packets from an IP network
H04N 21/414 - Specialised client platforms, e.g. receiver in car or embedded in a mobile appliance
H04N 21/236 - Assembling of a multiplex stream, e.g. transport stream, by combining a video stream with other content or additional data, e.g. inserting a URL [Uniform Resource Locator ] into a video stream, multiplexing software data into a video streamRemultiplexing of multiplex streamsInsertion of stuffing bits into the multiplex stream, e.g. to obtain a constant bit-rateAssembling of a packetised elementary stream
34.
RIDGE WAVEGUIDE LASER WITH DIELECTRIC CURRENT CONFINEMENT
An aspect of the present disclosure includes a direct modulated laser (DML) with a dielectric current confinement ridge waveguide (RWG) structure. The DML comprises a substrate, one or more layers of material disposed on the substrate to provide a multi quantum well (MQW), first and second insulation/dielectric structures disposed on opposite sides of the MQW, and one or more layers of material disposed on the MQW to provide a mesa structure for receiving a driving current. The mesa structure is preferably disposed between the first and second insulation structures to provide a dielectric current confinement (RWG) structure. The mesa structure further preferably includes an overall width that is greater than the overall width than the active region of the DML that provides the MQW.
H01S 5/343 - Structure or shape of the active regionMaterials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser
H01S 5/22 - Structure or shape of the semiconductor body to guide the optical wave having a ridge or a stripe structure
H01S 5/40 - Arrangement of two or more semiconductor lasers, not provided for in groups
The present disclosure is generally directed to an RF connector assembly for use within a node of a broadband distribution network, and can receive a center conductor pin of a coaxial cable, e.g., via insertion by a technician, and electrically couple the center conductor pin to circuitry within the node, such as an amplifier. The RF connector assembly preferably also securely physically couples to the center conductor pin via a spring-biased arrangement (and thus by extension securely couples the coaxial cable to the housing of the node) which can supply a bias force to the center conductor pin in response to insertion of the same into the RF connector assembly. This advantageously eliminates the necessity of opening the housing of the node to couple/decouple the center conducting pin of the coaxial cable to the node.
H01R 24/52 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted in or to a panel or structure
H01R 13/17 - Pins, blades or sockets having separate spring member for producing or increasing contact pressure the spring member being on the pin
H01R 13/187 - Pins, blades or sockets having separate spring member for producing or increasing contact pressure the spring member being in the socket
36.
Electro-absorption modulated laser with integrated filter layer
The present disclosure is generally directed to an EML with a filter layer disposed between an active region of the EML and a substrate of the EML to absorb a portion of unmodulated light energy, and preferably the unmodulated light energy caused by transverse electric (TE) substrate mode. The filter layer preferably comprises a material with an energy band gap (Eg) that is less than the energy band gap of the predetermined channel wavelength to absorb unmodulated laser light.
H01S 3/10 - Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
H01S 5/026 - Monolithically integrated components, e.g. waveguides, monitoring photo-detectors or drivers
H01S 5/12 - Construction or shape of the optical resonator the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
H01S 5/20 - Structure or shape of the semiconductor body to guide the optical wave
H01S 5/22 - Structure or shape of the semiconductor body to guide the optical wave having a ridge or a stripe structure
H01S 5/343 - Structure or shape of the active regionMaterials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser
The present disclosure is generally directed to a connector assembly that includes an increased outer diameter of the connector member relative to the equivalent G-type connector and an increased inner diameter of the receptable member relative to the equivalent G-type receptacle (also referred to as a seizure nut) to achieve higher current carrying capacity and target frequency rates of up to 3.0 Ghz, for example. In one preferred example, this results in a connector assembly consistent with the present disclosure having a connector member with an outer diameter of at least 10.70 mm, and more preferably 10.76±0.01 mm, rather than the 9.4 mm diameter of existing G-type connectors. Despite this increased diameter, a seizure assembly consistent with the present disclosure can achieve a functional impedance of 75 ohms to maintain nominal signal quality.
H01R 24/40 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
H03F 3/19 - High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
38.
Parabolic lens device for use in optical subassembly modules
A parabolic reflector device (also referred to herein as a parabolic lens device) is disclosed which includes a plurality of parabolic lens members and a mirror member which couple together and collectively provide a light-transmissive structure for multiplexing or demultiplexing of an optical signal. The parabolic reflector device can be implemented within optical subassembly modules to support operations of transmitter optical subassemblies (TOSAs) and/or receiver optical subassemblies (ROSAs).
An optical fiber holder is disclosed herein that includes at least one confinement slot for routing intermediate optical fibers within a housing of an optical assembly module, and preferably, a plurality of confinement slots for maintaining a target/nominal fiber bending radius for one or more intermediate optical fibers within the housing. Preferably, the optical fiber holder is disposed within the housing of an optical subassembly between an optical component, e.g., a TOSA arrangement and/or ROSA arrangement, and optical coupling receptacles, e.g., LC coupling receptacles, for optically coupling with external fibers for sending and/or receiving optical signals.
09 - Scientific and electric apparatus and instruments
Goods & Services
electronic equipment, namely, amplifiers, signal generators, signalsplitters and signaloptical nodes for optical and coaxial cable communication, used in connection with cable television converters, cable television transmitters, and cable television receivers
41.
Locking arrangements for pluggable optical subassembly modules
In general, the present disclosure is directed to locking arrangements for use with optical subassembly housings, such as small form-factor pluggable (SFFP) housings, that include a handle member configured to rotate about the housing to allow a user to select a target/desired orientation. Preferably, the locking arrangement couples to a pluggable housing that is configured to removably couple into a receptacle of an optical transceiver cage or other suitable enclosure. The locking arrangement further includes a handle member rotatably coupled to the pluggable housing, the handle member being configured to allow the pluggable housing to releasably lock within the receptacle. The handle member is also preferably configured to maintain a user-selected orientation such that the handle member remains at a given angle relative to the pluggable housing in the absence of a user-supplied force.
The present disclosure is generally directed to techniques for thermal management within optical subassembly modules that include thermally coupling heat-generating components, such as laser assemblies, to a temperature control device, such as a thermoelectric cooler, without the necessity of disposing the heat-generating components within a hermetically-sealed housing. Accordingly, this arrangement provides a thermal communication path that extends from the heat-generating components, through the temperature control device, and ultimately to a heatsink component, such as a sidewall of a transceiver housing, without the thermal communication path extending through a hermetically-sealed housing/cavity.
The present disclosure is generally directed to techniques for thermal management within optical subassembly modules that include thermally coupling heat-generating components, such as laser assemblies, to a temperature control device, such as a thermoelectric cooler, without the necessity of disposing the heat-generating components within a hermetically-sealed housing. Accordingly, this arrangement provides a thermal communication path that extends from the heat-generating components, through the temperature control device, and ultimately to a heatsink component, such as a sidewall of a transceiver housing, without the thermal communication path extending through a hermetically-sealed housing/cavity.
09 - Scientific and electric apparatus and instruments
Goods & Services
optical communication instruments, namely, optical transmitters, optical cables, optical receivers, photodetectors, lasers not for medical use, optical fiber, optical switches; network communication equipment, namely, amplifiers, signal generators, splitters and optical nodes for optical and coaxial cable communication, used in connection with cable television converters, cable television transmitters, and cable television receivers; optical fibers; transistors; photodiodes; photoelectric sensors; optical receivers; optical nodes; optical amplifiers; RF amplifiers
09 - Scientific and electric apparatus and instruments
Goods & Services
optical communication instruments, namely, optical transmitters, optical cables, optical receivers, photodetectors, lasers not for medical use, optical fiber, optical switches, optical routers; network communication equipment, namely, amplifiers, modems, signal generators, splitters and optical nodes for optical and coaxial cable communication, used in connection with cable television converters, cable television transmitters, and cable television receivers; optical fibers; transistors; photodiodes; photoelectric sensors; optical receivers; optical nodes; optical amplifiers; RF amplifiers
A coaxial seizure assembly is disclosed that includes an integrated mechanical stop that prevents over-insertion and maintains a nominal/expected impedance value to enable high-frequency switching, e.g., 1.8-3 Ghz or greater. In more detail, the coaxial seizure assembly includes a coaxial receptacle defined by an opening configured to at least partially receive and couple to a coaxial connector. The opening communicates with a seizure cavity defined within the coaxial seizure assembly. A radio frequency (RF) interconnect at least partially extends into the seizure cavity, with the RF interconnect having a first end to electrically couple to an electrical component and a second end that extends a predetermined angle relative to the first end, e.g., substantially 90 degrees. The second end defines a mating surface that aligns within the seizure cavity such that an imaginary line drawn along an insertion path of a coaxial cable conductor pin intersects with the mating surface.
H01R 13/52 - Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
H01R 24/52 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted in or to a panel or structure
H01R 24/54 - Intermediate parts, e.g. adapters, splitters or elbows
H01R 13/631 - Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure for engagement only
H01R 13/642 - Means for preventing, inhibiting or avoiding incorrect coupling by position or shape of contact members
48.
Component bridge for increasing mounting surface area on feedthrough device and an optical subassembly implementing same
The present disclosure is generally directed to a component bridge that couples to a feedthrough device to provide additional component mounting surface area within a TOSA housing, and preferably, within a hermetically-sealed TOSA housing. The component bridge includes a body that defines a component mounting surface to couple to electrical components, e.g., one or more filtering capacitors, and a notched portion to provide an accommodation groove. The component bridge includes at least one projection/leg for coupling to a mounting surface of a feedthrough device. The accommodation groove of the component bridge allows for other electrical components, e.g., RF traces, to be patterned/disposed on to the mounting surface and extend at least partially through the accommodation groove while remaining electrically isolated from the same. Accordingly, the component bridge further increases available component mounting surface area for existing feedthrough devices without necessity of re-design and/or modification.
H04B 10/00 - Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
The present disclosure is generally directed to a stepped profile for substrates that support “on board” optical subassembly arrangements. The stepped profile enables mounting TOSA modules to the substrate in a recessed orientation to reduce the overall distance between terminals of the substrate and associated components of the TOSA, e.g., RF terminals of the substrate and an LDD of the TOSA. In an embodiment, the stepped profile further simplifies mounting and optical alignment of TOSA modules by providing at least one mechanical stop to engage surfaces of the TOSA modules and limit travel by the same along one or more axis.
H04B 10/00 - Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
The present disclosure is generally directed to a monitor photodiode (MPD) submount for use in optical transceivers that includes a body with a conductive trace pattern disposed on multiple surfaces of the same to allow for vertical mounting of an associated MPD and simplified electrical interconnection with TOSA circuitry without the necessity of electrical interconnection. The MPD submount includes a body defined by a plurality of sidewalls. At least one surface of the body provides a mounting surface for coupling to and supporting an MPD. The MPD submount further includes a conductive trace pattern that provides at least one conductive path that is disposed on the mounting surface and on at least one adjoining sidewall. The portion of the at least one conductive path disposed on the adjoining sidewall extends substantially transverse relative to the surface defining the transceiver/transmitter substrate when the MPD submount is coupled to the same.
H04B 10/00 - Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
The present disclosure is generally directed to a housing for use with optical transceivers or transmitters that includes integrated heatsinks with a graphene coating to increase thermal dissipation during operation. In more detail, an embodiment of the present disclosures includes a housing that defines at least first and second sidewalls and a cavity disposed therebetween. The first and/or second sidewalls can include integrated heatsinks to dissipate heat generated by optical components, e.g., laser diodes, laser diode drivers, within the cavity of the housing. The integrated heatsinks can include at least one layer of graphene disposed thereon to increase thermal performance, and in particular, to decrease thermal resistance of the heatsink and promote heat dissipation.
The present disclosure is generally directed to an optical demultiplexer for use in an optical transceiver module having a truncated profile/shape to increase tolerance and accommodate adjacent optical components. In more detail, the optical demultiplexer comprises a body with at least one truncated corner at the input end. The at least one truncated corner allows the optical demultiplexer to be disposed/mounted, e.g., directly, on a densely populated transceiver substrate, e.g., a printed circuit board (PBC), and provide additional tolerance/space for mounting of circuitry and/or components within the region that would normally be occupied by corner(s) of the optical demultiplexer body. The at least one truncated corner may be introduced in a post-production step, e.g., via cut & polishing, or introduced during formation of the optical demultiplexer using, for instance, photolithography techniques.
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/42 - Coupling light guides with opto-electronic elements
G02B 6/35 - Optical coupling means having switching means
In general, a temperature control device for use in laser assemblies and optical subassemblies is disclosed that includes at least two electrically conductive terminals to enable flexible electrical coupling to associated components, e.g., monitor photodiodes and laser diodes, and accommodate a range of laser assembly configurations without the necessity of supplying a negative voltage rail. In more detail, a temperature control device consistent with the present disclosure includes a bottom plate, a top plate, and a plurality of semiconductor elements disposed therebetween. The top plate includes a component mounting surface that provides at least a first and second electrically conductive terminal/pad. The first and second electrically conductive terminals/pads can be electrically isolated, e.g., via a gap, and configured to provide first and second voltage potentials respectively.
The present disclosure is generally directed to utilizing capacitors stacks with capacitors mounted in a terminal-to-terminal mounting orientation to reduce overall footprint of capacitor arrays for bypass filtering circuits. In an embodiment, each capacitor stack includes at least a first capacitor, a second capacitor, and a ground plane interconnect. The first capacitor includes first and second terminals disposed opposite each other. The first terminal provides a mating surface to couple to the second capacitor, the second terminal couples to a ground plane. The second capacitor includes first and second terminals disposed opposite each other. The first terminal provides a mounting surface to electrically couple to and support the first capacitor, and the second terminal provides a mating surface to electrically and physically couple to the ground plane. Accordingly, the first capacitor can be inverted and mounted atop the second capacitor to eliminate the necessity of wire bonds, for example.
H03H 1/00 - Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
H03H 3/007 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
H01S 5/02326 - Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
55.
Holder element with integrated optical arrangement to offset an output light path
The present disclosure is generally directed to a holder element, also generally referred to herein as a welding element, configured to couple an optical coupling receptacle to a substrate and provide an integrated optical arrangement to redirect light received from the optical coupling receptacle along a receive light path to an output light path that is offset from the receive light path.
The present disclosure is generally directed to a lens clip that defines at least one mounting surface for coupling to and supporting an array of optical components, e.g., a laser diode and associated components, and an optical lens slot to receive and securely hold an array of optical lenses at a predetermined position relative to the optical components to ensure nominal optical coupling. The optical lens slot includes dimensions that permit insertion of each optical lens into the same and restrict travel along one or more axis. Accordingly, disposing an optical lens within the lens slot ensures correct alignment along at least two axis, e.g., Z and X, with the third axis (e.g., Y) extending parallel along the slot to permit lateral adjustment of each lens.
In general the present disclosure is directed to a temperature control device, e.g., a TEC, that includes a top plate with at least first and second contact pads to allow for a soldering process to attach optical components to the first contact pad without causing one or more layers of the second contact pad to reflow and solidify with an uneven mounting surface. Thus, optical components such as a focus lens can be mounted to the second contact pad via, for instance, thermal epoxy. This avoids the necessity of a submount to protect the focus lens from the relatively high heat introduced during a soldering process as well as maintain the flatness of the second contact pad within tolerance so that the mounted focus lens optically aligns by virtue of its physical location/orientation with other associated optical components coupled to the first contact pad, e.g., a laser diode.
In general, the present disclosure is directed to an optical turning mirror for receiving channel wavelengths along a first optical path and reflecting the same towards a fiber or photodetector (PD) without the necessity of disposing a highly reflective layer to increase reflectivity. In more detail, the optical turning mirror includes a substantially transparent body, e.g., capable of passing at least 80% of incident wavelengths, that defines an input region with integrated focus lens(es) for receiving channel wavelengths along a first optical path and a reflective surface disposed opposite the input region to direct/launch received channel wavelengths along a second optical path towards an output interface having an angled light-transmissive surface, with the second optical path extending substantially transverse relative to the first optical path.
A temperature controlled multi-channel transmitter optical subassembly (TOSA), consistent with embodiments described herein, may be used in a multi-channel optical transceiver. The temperature controlled multi-channel TOSA generally includes an array of lasers to emit a plurality of different channel wavelengths. The lasers may be thermally tuned to the channel wavelengths by establishing a global temperature for the array of lasers such that the amount of heat communicated to each laser is substantially the same. The global temperature may be established, at least in part, by monitoring the shortest channel wavelength and/or a temperature of the lasers. The temperature of the lasers may then get increased via a shared heating device in thermal communication with the lasers until the shortest monitored wavelength substantially reaches the nominal shortest wavelength or the measured temperature substantially equals the global temperature.
H04B 10/00 - Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
H01S 5/068 - Stabilisation of laser output parameters
H01S 5/0683 - Stabilisation of laser output parameters by monitoring the optical output parameters
Techniques for magnetic shielding of an optical isolator to maintain nominal magnetic flux density and a transmitter or transceiver system implementing same
In general, the present disclosure is directed to a transmitter optical subassembly (TOSA) module for use in an optical transceiver or transmitter that includes a magnetically-shielded optical isolator to minimize or otherwise reduce magnetization of TOSA components. An embodiment of the present disclosure includes a TOSA housing with magnetic shielding at least partially surrounding an optical isolator, with the magnetic shielding reflecting associated magnetic energy away from components, such as a metal TOSA housing or components disposed therein, that could become magnetized and adversely impact the magnetic flux density of the magnetic field associated with the optical isolator.
H04B 10/00 - Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
G02B 6/42 - Coupling light guides with opto-electronic elements
H04J 14/02 - Wavelength-division multiplex systems
The present disclosure is generally directed to a TO can laser package that includes an off-center focus lens integrated into a lens cap to compensate displacement of an associated laser diode. The TO can laser package includes a TO header with a mounting structure for directly electrically coupling an associated laser diode to electrical leads/pins without the use of an intermediate interconnect. The mounting structure displaces the laser diode such that an emission surface, and more particularly, an origin thereof, is displaced/offset relative to a center of the TO header. The integrated lens cap includes a focus lens with an optical center that is offset from a center of the TO header at a distance that is substantially equal to the displacement of the laser diode. Thus, the displacement of the laser diode is compensated for by the off-center focus lens to minimize or otherwise reduce optical misalignment.
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
The present disclosure is generally directed to a multi-channel TOSA arrangement with a housing that utilizes a feedthrough device with at least one integrated mounting surface to reduce the overall dimensions of the housing. The housing includes a plurality of sidewalls that define a hermetically-sealed cavity therebetween. The feedthrough device includes a first end disposed in the hermetically-sealed cavity of the housing and a second end extending from the cavity away from the housing. The feedthrough device provides the at least one integrated mounting surface proximate the first end within the hermetically-sealed cavity. At least a first laser diode driver (LDD) chip mounts to the at least one integrated mounting surface of the feedthrough device. A plurality of laser arrangements are also disposed in the hermetically-sealed cavity proximate the first LDD chip and mount to, for instance, a LD submount supported by a thermoelectric cooler.
The present disclosure is generally directed to a multi-channel TOSA arrangement with a housing that utilizes a feedthrough device with at least one integrated mounting surface to reduce the overall dimensions of the housing. The housing includes a plurality of sidewalls that define a hermetically-sealed cavity therebetween. The feedthrough device includes a first end disposed in the hermetically-sealed cavity of the housing and a second end extending from the cavity away from the housing. The feedthrough device provides the at least one integrated mounting surface proximate the first end within the hermetically-sealed cavity. At least a first laser diode driver (LDD) chip mounts to the at least one integrated mounting surface of the feedthrough device. A plurality of laser arrangements are also disposed in the hermetically-sealed cavity proximate the first LDD chip and mount to, for instance, a LD submount supported by a thermoelectric cooler.
This present disclosure is generally directed to an optical isolator array with a magnetic base that allows for mounting and alignment of N number of optical isolators modules within an optical subassembly module. In an embodiment, the magnetic base provides at least one mounting surface for coupling to N number of optical isolators, with N being equal to an optical channel count for the optical subassembly (e.g., 4-channels, 8-channels, and so on). The magnetic base includes an overall width that allows for a desired number of optical isolators to get mounted thereon. Each optical isolator can be uniformly disposed along the same axis on the magnetic base and at a distance D from adjacent optical isolators. An adhesive such as ultraviolet-curing (UV-curing) optical adhesives may be used to secure each optical isolator at a predefined position and increase overall structural integrity.
G02F 1/01 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour
G02F 1/09 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on magneto-optical elements, e.g. exhibiting Faraday effect
65.
Lens clip for coupling and optical alignment of an optical lens and an optical subassembly module implementing same
The present disclosure is generally directed to a lens clip that includes an optical lens slot to securely hold an optical lens at a predetermined position to mitigate effects of post-annealing shift. The lens clip includes a base that provides at least one substrate mating surface for mounting to a substrate, and at least first and second arms extending from the base. The first and second arms extend substantially parallel relative to each other and define at least a portion of an optical lens slot. The optical lens slot is configured to receive at least a portion of an optical lens and securely hold the optical lens at a predetermined position to ensure optical alignment of the optical lens, e.g., relative to an associated laser diode or other optical component, during fixation of the optical lens to the substrate using, for instance, UV-curing optical adhesives.
The present disclosure is generally directed to a multi-channel TOSA with vertically-mounted MPDs to reduce TOSA housing dimensions and improve RF driving signal quality. In more detail, a TOSA housing consistent with the present disclosure includes at least one vertical MPD mounting surface that extends substantially transverse relative to a LD mounting surface, with the result being that a MPD coupled to the vertical MPD mounting surface gets positioned above an associated LD coupled to the LD mounting surface. The vertically-mounted MPD thus makes regions adjacent an LD that would otherwise be utilized to mount an MPD available for patterning of conductive RF traces to provide an RF driving signal to the LD. The conductive RF traces may therefore extend below the vertically-mounted MPD to a location that is proximate the LD to allow for relatively short wire bonds therebetween.
The present disclosure is generally directed to an optical transceiver module that includes a mounting section for aligning and coupling to associated TOSA modules. In particular, an embodiment of the present disclosure includes TOSA and ROSA components disposed on a printed circuit board assembly (PCBA). The PCBA includes a plurality of grooves at a optical coupling end to provide a TOSA mounting section. Each of the grooves provides at least one mating surface to receive and couple to an associated TOSA module. Opposite the optical coupling end, the PCBA includes an electric coupling section for coupling to, for example, a transmit (RX) circuit that provides one or more electrical signals to drive TOSA modules coupled to the TOSA mounting section.
The present disclosure is generally directed to an optical transceiver that includes a multi-channel on-board ROSA arrangement that includes an optical demultiplexer, e.g., an arrayed waveguide grating (AWG) and an array of photodiodes disposed on a same substrate. The array of photodiodes may be optically aligned with an output port of the optical demultiplexer and be configured to detect channel wavelengths and output a proportional electrical signal to an amplification circuit, e.g., a transimpedance amplifier. Each of the photodiodes can include an integrated lens configured to increase the alignment tolerance between the demultiplexer and the light sensitive region such that relatively imprecise bonding techniques, e.g., die bonding, may be utilized while still maintaining nominal optical power.
H04B 10/00 - Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
G02B 27/09 - Beam shaping, e.g. changing the cross-sectioned area, not otherwise provided for
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
69.
Optical multiplexer\demultiplexer with input and output ports on a single side, and an optical transceiver implementing same
A multi-channel transceiver, consistent with the present disclosure, includes a multiplexer/demultiplexer (MUX/DEMUX) device configured to be shared by, and support operations of, a multi-channel transmitter optical subassembly (TOSA) and multi-channel receiver optical subassembly (ROSA) within a single transceiver housing. The shared MUX/DEMUX device may be referred to herein as simply a shared AWG for ease of description and not for purposes of limitation. The shared AWG receives optical signals from a plurality of TOSA modules at different channel wavelengths via a plurality of mux input ports, and then combines the optical signals into a multiplexed optical signal, with the multiplexed optical signal being output via a mux output port. In addition, the shared AWG receives an optical signal having different channel wavelengths at a demux input port and separates channel wavelengths to be output via a plurality of demux output ports.
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/42 - Coupling light guides with opto-electronic elements
H04J 14/02 - Wavelength-division multiplex systems
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
G02B 6/34 - Optical coupling means utilising prism or grating
70.
Thermoelectric cooler (TEC) having top and bottom plates with asymmetric thermal conductivity and an optical subassembly implementing the same
In general, the present disclosure is directed to a thermoelectric cooler (TEC) that includes a top plate or bottom plate being formed of a high thermal conductivity material, and the other of the top plate and bottom plate being formed of a low thermal conductivity material, with the high thermal conductivity material having a thermal conductivity at least twice, and preferably five times, that of the thermal conductivity of the low thermal conductivity material. This disparity in thermal conductivity between the top plate and bottom plate materials may be referred to herein as asymmetric thermal performance.
H04B 10/00 - Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
H01L 35/32 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof operating with Peltier or Seebeck effect only characterised by the structure or configuration of the cell or thermocouple forming the device
H01S 5/068 - Stabilisation of laser output parameters
F25B 21/02 - Machines, plants or systems, using electric or magnetic effects using Peltier effectMachines, plants or systems, using electric or magnetic effects using Nernst-Ettinghausen effect
The present disclosure is generally directed to a laser subassembly for use in a TOSA module that includes an integrated impedance matching network to enable a plurality of selectable resistance configurations to ensure the driving circuit and laser emitter of the TOSA module have matching, or substantially matching, impedances. The laser subassembly includes a substrate with a driving circuit disposed thereon. The driving circuit includes signal conductors for electrically coupling to an external transmit connecting circuit, a conductive laser mounting section, and an impedance matching network. The impedance matching network includes a plurality of resistors, with one or more of the resistors being selectively electrically coupled to the conductive laser mounting section to introduce a selected amount of impedance to minimize or otherwise reduce reflection.
In general, a TOSA consistent with the present disclosure includes a light driving circuit coupled to a hermetically-sealed light engine. The hermetically-sealed light engine includes a housing defined by a plurality of sidewalls. The housing defines a cavity that is hermetically-sealed to prevent introduction of contaminants that would otherwise reduce optical power. The hermetically-sealed light engine optically couples to an external arrayed waveguide grating (AWG), or other multiplexing device, by way of an optical receptacle. The optical receptacle can include a waveguide implemented external to the hermetically-sealed cavity and can include, for instance, an optical isolator, fiber stub, and fiber ferrule section. Thus, the external AWG and associated external optical coupling components advantageously allow for the hermetically-sealed light engine to have a cavity with dimensions relatively smaller than other approaches that dispose an AWG and associated components within a hermetically-sealed cavity.
G02B 6/34 - Optical coupling means utilising prism or grating
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/42 - Coupling light guides with opto-electronic elements
An optical transceiver includes a main body, an elastic component and a fastening component. The main body includes two lateral surfaces and an outer surface between the two lateral surfaces, and the outer surface defines a confined groove. The elastic component is disposed in the confined groove. The fastening component is movably disposed on the main body. The fastening component includes a linkage arm, two extending arms and a confined portion. The linkage arm is disposed on the outer surface of the main body, and the two extending arms are connected with the linkage arm. The two extending arms are respectively disposed on the two lateral surfaces. The confined portion is connected with the linkage arm and extends into the confined groove in order to press the elastic component. The two extending arms are detachably fasten-able with the cage.
The present disclosure is generally directed to an on-board ROSA arrangement where a fiber receptacle element, optical components such as optical de-multiplexer (e.g., an arrayed waveguide grating (AWG)), turning mirror, photodiodes and light receiving chip are mounted to a common substrate. The fiber receptacle element includes a body that defines a slot to at least partially receive an end of the substrate and mount thereto. The body of the fiber receptacle further includes an aperture that extends through the body to receive an optical fiber and/or associated connector and align the same with ROSA components mounted on a surface of the substrate. The fiber receptacle body may be solid, e.g., formed from a single, monolithic piece of material, and may be manufactured from metal, plastic or other suitably rigid material.
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/38 - Mechanical coupling means having fibre to fibre mating means
G02B 6/42 - Coupling light guides with opto-electronic elements
75.
TRANSMITTER OPTICAL SUBASSEMBLY WITH TRACE ROUTING TO PROVIDE ELECTRICAL ISOLATION BETWEEN POWER AND RF TRACES
The present disclosure is generally directed to a transmitter optical subassembly (TOSA) having a hermetically-sealed housing with a feedthrough device that electrically isolates RF and power traces. In more detail, a TOSA consistent with the present disclosure includes a substrate with driving circuitry disposed thereon. A first end of the substrate may electrically couple to transmit connecting circuitry and a second end may couple to a hermetically-sealed housing. The hermetically-sealed housing can include one or more laser packages for emitting associated channel wavelengths in addition to monitor photodiodes (PDs), and temperature control devices such as TECs. The hermetic-sealed housing includes a first end with a feedthrough device that provides traces to electrically couple to the circuitry of the substrate. The hermetic-sealed housing further includes an optical coupling port, e.g., a LC connector, for coupling to an external fiber, for example.
The present disclosure is generally directed to an optical transceiver module with a locking arrangement that allows the optical transceiver module to be releasably coupled into an associated receptacle of an optical transceiver cage. The locking arrangement includes a handle member with teeth configured to engage notches of an actuating member to allow rotational movement of the handle to be translated into linear movement by the actuating member. The linear movement of the actuating member may be independent of the housing of the optical transceiver module, and as the handle is transitioned from a locked position to a release position such movement of the actuating member can urge release of the locking members of the optical transceiver cage by way of the tab portions of the actuating member. A user may then supply a force, e.g., a pulling force, to remove the unlocked subassembly module from the receptacle.
The present disclosure is generally directed to a transmitter optical subassembly (TOSA) having a hermetically-sealed housing with a feedthrough device that electrically isolates RF and power traces. In more detail, a TOSA consistent with the present disclosure includes a substrate with driving circuitry disposed thereon. A first end of the substrate may electrically couple to transmit connecting circuitry and a second end may couple to a hermetically-sealed housing. The hermetically-sealed housing can include one or more laser packages for emitting associated channel wavelengths in addition to monitor photodiodes (PDs), and temperature control devices such as TECs. The hermetic-sealed housing includes a first end with a feedthrough device that provides traces to electrically couple to the circuitry of the substrate. The hermetic-sealed housing further includes an optical coupling port, e.g., a LC connector, for coupling to an external fiber, for example.
H04J 14/02 - Wavelength-division multiplex systems
H04B 10/00 - Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
The present disclosure discloses a high speed optical module having a PCBA component and a passive optical element. The PCBA component includes a receiver and a transmitter. The transmitter includes an amplifier chip and a photodiode array connected to pins of the amplifier chip. The transmitter includes a laser driving chip and a base. Multiple lasers are arranged side by side in the base. The lasers are connected to the laser driving chip. A plurality of fiber interfaces are arranged on output light paths corresponding to the plurality of lasers. The passive optical element includes ferrules corresponding to the plurality of fiber interfaces, and the ferrules are correspondingly inserted into the plurality of fiber interfaces in a one-to-one relationship. The passive optical element is inserted into the PCBA component by fiber interfaces arranged on the PCBA component.
G02B 6/43 - Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
79.
TECHNIQUES FOR INDIRECT OPTICAL COUPLING BETWEEN AN OPTICAL INPUT/OUTPUT PORT OF A SUBASSEMBLY HOUSING AND AN ARRAYED WAVEGUIDE GRATING (AWG) DEVICE DISPOSED WITHIN THE SAME
Techniques for flexible coupling between an optical coupling receptacle/port of an optical transceiver housing and optical components within the same are disposed. In an embodiment, an optical transceiver housing includes an intermediate fiber with a first end optically coupled to an optical coupling port and a second end optically coupled to a multiplexer/de-multiplexer device, e.g., an arrayed waveguide grating (AWG) device, PLC splitter, and so on. The intermediate fiber may be routed in the transceiver housing in a manner that and the radius of the bends may be optimized to reduce fiber bending losses. The techniques herein are equally applicable to both ROSA and TOSA modules and may be utilized to achieve flexible coupling for multi-channel transceiver devices.
Techniques for indirect optical coupling between an optical input/output port of a subassembly housing and an arrayed waveguide grating (AWG) device disposed within the same
Techniques for flexible coupling between an optical coupling receptacle/port of an optical transceiver housing and optical components within the same are disposed. In an embodiment, an optical transceiver housing includes an intermediate fiber with a first end optically coupled to an optical coupling port and a second end optically coupled to a multiplexer/de-multiplexer device, e.g., an arrayed waveguide grating (AWG) device, PLC splitter, and so on. The intermediate fiber may be routed in the transceiver housing in a manner that and the radius of the bends may be optimized to reduce fiber bending losses. The techniques herein are equally applicable to both ROSA and TOSA modules and may be utilized to achieve flexible coupling for multi-channel transceiver devices.
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/42 - Coupling light guides with opto-electronic elements
A coaxial transmitter optical subassembly (TOSA) including a side-by-side laser diode and monitor photodiode package, consistent with embodiments of the present disclosure, may be used in an optical transceiver for transmitting an optical signal at a channel wavelength. In an embodiment, the coaxial TOSA includes a laser sub-mount coupled to a mounting region defined by a body of the coaxial TOSA. The laser sub-mount includes a monitor photodiode disposed adjacent to a side of a laser diode such that a sensor region of the monitor photodiode is disposed within, or in close proximity to, a light cone emitted by a light emitting surface of the laser diode. The monitor photodiode is thus configured to directly receive a portion of emitted channel wavelengths from the laser diode for monitoring purposes.
H04B 10/00 - Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
A light engine is disclosed that includes an optical bench with a mirror etched therefrom to form a single, unitary structure. The integrated mirror may therefore be pre-aligned with an associated light path to reduce light path alignment errors. In an embodiment, the optical bench includes a first end extending to a second end along a longitudinal axis, a laser diode disposed on a mounting surface adjacent the first end of the optical bench and configured to output laser light along a first light path that extends substantially along the longitudinal axis, and an integrated mirror device disposed along the light path to receive and direct the laser light along a second light path to optically couple the laser light to a photonically-enabled complementary metal-oxide semiconductor (CMOS) die, the second light path being substantially orthogonal relative to the first light path.
In accordance with an embodiment, a welding assembly is disclosed that allows for a laser assembly to be coupled into a socket of the same and held at a fixed position, e.g., by a mechanical grabber of a welding system. The mechanical grabber may then travel along one or more axis to bring the TOSA module into mechanical alignment with an opening of an associated optical subassembly housing. The welding assembly may further include an alignment member that provides one or more alignment contact surfaces configured to be brought directly into contact with a surface of the associated subassembly housing. When the one or more alignment contact surfaces are “flush” with the surface of the subassembly housing the emission face of the TOSA module is substantially parallel, and by extension, optically aligned with the opening of the associated subassembly housing.
G02B 6/42 - Coupling light guides with opto-electronic elements
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
84.
Multilayered flexible printed circuit with both radio frequency (RF) and DC transmission lines electrically isolated from each other and an optical transceiver using same
In accordance with an embodiment, a multi-layered flexible printed circuit (FPC) is disclosed that includes two or more insulating layers to route conductive traces carrying radio frequency (RF) signals, e.g., data signals, and conductive traces carrying direct current (DC) signals, e.g., power signals and low-frequency control signals, while sufficiently isolating the RF signals from electrical interference by the DC transmission lines. This advantageously eliminates having two or more separate FPCs to electrically couple each optical subassembly, e.g., receiver optical subassemblies (ROSAs) and transmitter optical subassemblies (TOSAs), to associated circuitry in a transceiver housing, which saves space and reduces manufacturing complexity, for example.
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
85.
Mirror device with visual indicator to enable identification of highly-reflective region to ensure correct orientation of the same when disposed in an optical subassembly
A mirror device for use in an optical subassembly is disclosed that includes at least one surface with a visible indicator to allow a technician to differentiate a highly-reflective surface from relatively less reflective (e.g., un-coated) surfaces. The mirror device may be formed using known approaches, such as through the deposition of a metallic material on to a surface of the mirror device followed by one or more optional coating layers. Before, or after, forming the highly-reflective surface, a visual indicator may be introduced on to a surface of the mirror device that is opposite the highly-reflective surface. The visual indicator may comprise, for example, random scratches/scoring etched from a wire brush or tool, paint, epoxy, ink, or any other indicator that allows a technician to visually differentiate the portion of the mirror device having the visual indicator from the highly-reflective portion.
Techniques for shielding within an optical transceiver housing to mitigate electromagnetic interference between optical subassemblies disposed within the same
An optical transceiver module is disclosed having a housing that includes at least a first housing portion and a second housing portion, each of the first and second housing portions including a base portion having at least one sidewall extending therefrom that defines a compartment. The first housing portion is configured to couple to the second housing portion to form a cavity therebetween. A transmitter optical subassembly (TOSA) arrangement coupled to the base portion of the first housing portion and is electrically coupled to a first flexible printed circuit (FPC). A receiver optical subassembly (ROSA) arrangement is coupled to the base portion of the second housing portion and is electrically coupled to a second FPC. A first shield coupled to at least one of the first housing portion or the second housing portion to reduce electromagnetic interference between the TOSA arrangement and the ROSA arrangement.
A photodiode package is disclosed that includes a TO-Can style body with an exposed sensor cavity that eliminates the necessity of an encapsulant dispensing process. The TO-Can body of the photodiode package includes an integrated coupling member to allow for coupling to a ROSA housing without an intermediate member. The photodiode package includes a base portion with a cylindrical wall portion that extends therefrom to form an optical coupling cavity. A surface of the base portion provides at least one mounting surface within the optical coupling cavity for coupling to a photodiode chip. The cylindrical wall may function as an integrated coupling member and may be used to directly couple the photodiode package, e.g., without an intermediate cap/ring, into a socket of a ROSA housing. The base portion and cylindrical wall may be formed from a single piece of material, or from multiple pieces depending on a desired configuration.
In accordance with an embodiment, a transmitter optical subassembly (TOSA) module is disclosed with a base portion that provides one or more mounting surfaces to mount a laser diode and associated driver circuitry in close proximity to allow for direct coupling without the use of an intermediate interconnect device, such as a flexible printed circuit or other interconnect device. The TOSA module base further includes a cylindrical shaped portion with a passageway extending therethrough. The substantially cylindrical shaped portion allows the TOSA module base to mount to a multi-channel TOSA housing via a Z-ring or other suitable welding ring without the use of an intermediate device such as a welding cap.
An optical component holder having a base portion with a chamfered (or step) portion is disclosed herein that allows a technician to position and partially insert the same within an associated opening using a relatively minor amount of force. The chamfered portion of the base portion operates, in a general sense, as a guide that ensures proper alignment of the optical component holder and allows the same to travel a predetermined distance within the opening before being blocked from further travel by "bottoming" out when the wider portion of the base is at the edge of the associated opening. Thus, the chamfered portion provides an alignment feature to provide tactile feedback that indicates to the technician that the optical component holder is aligned and evenly inserted into an associated opening prior to supplying additional force to press the optical component holder fully into a housing.
G02B 7/182 - Mountings, adjusting means, or light-tight connections, for optical elements for prismsMountings, adjusting means, or light-tight connections, for optical elements for mirrors for mirrors
H04B 10/66 - Non-coherent receivers, e.g. using direct detection
90.
Optical component holder having alignment feature for forming press-fit and an optical subassembly using same
An optical component holder having a base portion with a chamfered (or step) portion is disclosed herein that allows a technician to position and partially insert the same within an associated opening using a relatively minor amount of force. The chamfered portion of the base portion operates, in a general sense, as a guide that ensures proper alignment of the optical component holder and allows the same to travel a predetermined distance within the opening before being blocked from further travel by “bottoming” out when the wider portion of the base is at the edge of the associated opening. Thus, the chamfered portion provides an alignment feature to provide tactile feedback that indicates to the technician that the optical component holder is aligned and evenly inserted into an associated opening prior to supplying additional force to press the optical component holder fully into a housing.
G02B 7/182 - Mountings, adjusting means, or light-tight connections, for optical elements for prismsMountings, adjusting means, or light-tight connections, for optical elements for mirrors for mirrors
G02B 6/42 - Coupling light guides with opto-electronic elements
H04B 10/00 - Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
H04B 10/66 - Non-coherent receivers, e.g. using direct detection
91.
Coaxial transmitter optical subassembly (TOSA) with cuboid type to laser package and optical transceiver including same
A coaxial transmitter optical subassembly (TOSA) including a cuboid type TO laser package may be used in an optical transceiver for transmitting an optical signal at a channel wavelength. The cuboid type TO laser package is made of a thermally conductive material and has substantially flat outer surfaces that may be thermally coupled to substantially flat outer surfaces on a transceiver housing and/or on other cuboid type TO laser packages. An optical transceiver may include multiple coaxial TOSAs with the cuboid type TO laser packages stacked in the transceiver housing. The cuboid type TO laser package may thus provide improved thermal characteristics and a reduced size within the optical transceiver.
In accordance with an embodiment, a transmitter optical subassembly (TOSA) module is disclosed with a base portion that provides one or more mounting surfaces to mount a laser diode and associated driver circuitry in close proximity to allow for direct coupling without the use of an intermediate interconnect device, such as a flexible printed circuit or other interconnect device. The TOSA module base further includes a cylindrical shaped portion with a passageway extending therethrough. The substantially cylindrical shaped portion allows the TOSA module base to mount to a multi-channel TOSA housing via a Z-ring or other suitable welding ring without the use of an intermediate device such as a welding cap.
Energy reduction in a CATV network device, such as an optical node, in a CATV network may be accomplished using a system and method for controlling an amplifier in response to channel loading. The system and method detects a channel loading condition for a CATV RF signal including a plurality of utilized channels across a channel spectrum defining a plurality of potential channels. The channel loading condition may be detected by scanning the CATV RF signal to measure the channel loading or by obtaining channel loading data from a remote PHY device (RPD) located in the optical node. The system and method then obtains an amplifier operating parameter associated with the channel loading condition and applies the amplifier operating parameter to control power consumption of an amplifier in the optical node (e.g., by changing bias current) in response to the channel loading condition.
A heat transfer assembly may be used to provide a thermal conduit from a module mounted on a circuit board through the circuit board, allowing a thermal path away from the module. The heat transfer assembly generally includes a thermally conductive base with at least one raised thermal pedestal accessible through at least one heat transfer aperture in the circuit board and in thermal contact with the module. In an embodiment, the heat transfer assembly is used in a remote PHY device (RPD) in an optical node, for example, in a CATV/HFC network. The RPD includes an enclosure having a base with at least one raised thermal pedestal in thermal contact with an optical module (e.g., an optical transmitter or transceiver) on a circuit board through at least one heat transfer aperture in the circuit board.
A heat transfer assembly may be used to provide a thermal conduit from a module mounted on a circuit board through the circuit board, allowing a thermal path away from the module. The heat transfer assembly generally includes a thermally conductive base with at least one raised thermal pedestal accessible through at least one heat transfer aperture in the circuit board and in thermal contact with the module. In an embodiment, the heat transfer assembly is used in a remote PHY device (RPD) in an optical node, for example, in a CATV/HFC network. The RPD includes an enclosure having a base with at least one raised thermal pedestal in thermal contact with an optical module (e.g., an optical transmitter or transceiver) on a circuit board through at least one heat transfer aperture in the circuit board.
In an embodiment, an optical component assembly is disclosed and is configured to be at least partially disposed within at least one first opening of an optical subassembly housing. The at least one optical component assembly comprising a base extending from a first end to a second end along a longitudinal axis, and a vertical mount disposed on the base and including a first surface that provides a mounting region to couple to an optical component, the first surface defining a vertical axis that extends substantially upright from the base and a horizontal axis that is angled relative to the longitudinal axis of the base at a first angle, the vertical mount further providing a channel that extends through the vertical mount, wherein the channel provides an optical pathway angled relative to the first surface at the first angle, the first angle being substantially between about 15 and 75 degrees.
G02B 6/42 - Coupling light guides with opto-electronic elements
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
97.
TECHNIQUES FOR REDUCING ELECTRICAL INTERCONNECTION LOSSES BETWEEN A TRANSMITTER OPTICAL SUBASSEMBLY (TOSA) AND ASSOCIATED DRIVER CIRCUITRY AND AN OPTICAL TRANSCEIVER SYSTEM USING THE SAME
Techniques are disclosed for providing relatively short distances between multi-channel transmitter optical subassemblies (TOSAs) and associated transmit connecting circuit in order to reduce losses due to signal propagation delays, also sometimes referred to as signal flight time delays. In an embodiment, a TOSA includes a plurality of laser assemblies disposed along a same sidewall of the TOSA along a longitudinal axis. The TOSA may be disposed within an optical transceiver housing in a transverse orientation, whereby a longitudinal center line of the multi-channel TOSA is substantially perpendicular to the longitudinal axis of the optical transceiver housing. The TOSA may be positioned adjacent an end of the optical transceiver housing having a transmit connecting circuit. Thus each of the plurality of laser assemblies may be positioned at a relatively short distance, e.g., 120 microns or less, away from the transmit connecting circuit.
In an embodiment, an optical component assembly is disclosed and is configured to be at least partially disposed within at least one first opening of an optical subassembly housing. The at least one optical component assembly comprising a base extending from a first end to a second end along a longitudinal axis, and a vertical mount disposed on the base and including a first surface that provides a mounting region to couple to an optical component, the first surface defining a vertical axis that extends substantially upright from the base and a horizontal axis that is angled relative to the longitudinal axis of the base at a first angle, the vertical mount further providing a channel that extends through the vertical mount, wherein the channel provides an optical pathway angled relative to the first surface at the first angle, the first angle being substantially between about 15 and 75 degrees.
G02B 6/42 - Coupling light guides with opto-electronic elements
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
G02B 7/00 - Mountings, adjusting means, or light-tight connections, for optical elements
99.
Techniques for reducing electrical interconnection losses between a transmitter optical subassembly (TOSA) and associated driver circuitry and an optical transceiver system using the same
Techniques are disclosed for providing relatively short distances between multi-channel transmitter optical subassemblies (TOSAs) and associated transmit connecting circuit in order to reduce losses due to signal propagation delays, also sometimes referred to as signal flight time delays. In an embodiment, a TOSA includes a plurality of laser assemblies disposed along a same sidewall of the TOSA along a longitudinal axis. The TOSA may be disposed within an optical transceiver housing in a transverse orientation, whereby a longitudinal center line of the multi-channel TOSA is substantially perpendicular to the longitudinal axis of the optical transceiver housing. The TOSA may be positioned adjacent an end of the optical transceiver housing having a transmit connecting circuit. Thus each of the plurality of laser assemblies may be positioned at a relatively short distance, e.g., 120 microns or less, away from the transmit connecting circuit.
H04B 10/00 - Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
H04J 14/02 - Wavelength-division multiplex systems
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
H01S 5/12 - Construction or shape of the optical resonator the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
100.
Optical transceiver with a multiplexing device positioned off-center within a transceiver housing to reduce fiber bending loss
offset may advantageously enable an intermediate optical fiber coupling the demultiplexer with an optical coupling receptacle, such as an LC connector, to be routed within the SFF optical transceiver housing in a manner that avoids introducing bends that are less than a minimum bending radius associated with the intermediate optical fiber cable. Thus some embodiments of the present disclosure enable greater tolerance when routing an intermediate optical fiber within housings that would otherwise introduce bending loss by virtue of their constrained dimensions.
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/42 - Coupling light guides with opto-electronic elements
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
