The present disclosure provides a method for forming a contacting arrangement for a back contact solar cell. The method comprises forming a polymeric layer comprising a plurality of openings on a back portion of the solar cell. Further, the method comprises forming a patterned conductive layer on the polymeric layer. The patterned conductive layer comprises a plurality of conductive regions electrically isolated from each other. At least some of the conductive regions have portions extending into at least one of the openings to form an electric contact with the solar cell. The method also comprises forming a plurality of metallic elements onto the patterned conductive layer, each metallic element being arranged to be in electrical contact with at least some of the plurality of regions of the patterned conductive layer. The plurality of openings and conductive regions are arranged in manner such that each metallic element is in electrical contact with a plurality of regions of the solar cell of the same polarity.
The invention relates to a method for cutting a workpiece (30) on a wire saw (1) comprising a cutting wire (3) that runs, preferably in multiple loops, around at least two wire guide rollers (14) thereby forming a wire web for cutting the workpiece (30).
B23D 57/00 - Sawing machines or sawing devices not covered by one of groups
B28D 5/04 - Fine working of gems, jewels, crystals, e.g. of semiconductor materialApparatus therefor by tools other than of rotary type, e.g. reciprocating tools
B23D 63/00 - Dressing the tools of sawing machines or sawing devices for use in cutting any kind of material, e.g. in the manufacture of sawing tools
The invention relates to a method of disposing a cutting wire (4) in multiple loops over at least two rotatable wire guide rollers (2, 3) of a wire saw (1), wherein a wire web is formed, and wherein the cutting wire (4) runs within grooves (9) formed on the wire guide rollers (2, 3), comprising the steps of: (a) winding up the cutting wire (4) on the wire guide rollers (2, 3) until a wire web portion (WO) is formed; (b) forming a gap (G) in the wire web portion (WO), wherein the gap (G) is greater than the distance between two neighboring grooves (9) of a wire guide roller (2, 3); (c) subsequent to step (b): further winding up the cutting wire (4) by rotating the wire guide rollers (2, 3).
B23D 57/00 - Sawing machines or sawing devices not covered by one of groups
B28D 5/04 - Fine working of gems, jewels, crystals, e.g. of semiconductor materialApparatus therefor by tools other than of rotary type, e.g. reciprocating tools
The invention relates to a wafer aligning system (1), comprising a transporting means (3) for transporting a wafer (2) in a transporting direction (4), the transporting means (3) defining a transporting plane (5), characterized in that the wafer aligning system (1) comprises a delimiting means (6) limiting within the transporting plane (5) a movement of the wafer (2) perpendicular to the transport direction (4), wherein the delimiting means (6) defines an alignment line (7) extending essentially parallel to the transporting direction (4) of the transporting means (3), and a fluid flow generating means (9) for generating a fluid flow (10) forcing the wafer (2) against the delimiting means (6).
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
The invention relates to a wafer processing method performed subsequent to cutting (1), the wafer processing method comprising: a) a step of transporting (2); b) a first wafer processing step comprising charging (4) the wafer receiving container (17) with a first processing fluid (21); e) a step of removing (5) the first processing fluid (21) from the wafer receiving container (17); d) a second wafer processing step by charging (7) the wafer receiving container (17) with a second processing fluid (22), wherein preferably the second processing fluid (22) is different from the first processing fluid (21); wherein the wafer block (16) is accommodated in the wafer receiving container (17) during the steps a) to d) without removing it from the wafer receiving container (17) between those steps.
B28D 5/00 - Fine working of gems, jewels, crystals, e.g. of semiconductor materialApparatus therefor
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
The invention relates to a system for transporting workpieces (3', 3") such as wafers or solar cells. The system consisting of a mainly vertical (10) and a downstream mainly horizontal (12) conveyor belt and being capable of transferring the workpieces (3', 3") from the former to the latter. by means of flow generating means that make the workpiece fall over from the vertical to the horizontal conveyer belt. The workpieces (3', 3") are thus aligned to a large degree with the upper edge portion of the vertical conveyor belt (10), thus reducing the need for expensive orientation adjusting means downstream of the horizontal conveyor belt.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B28D 5/00 - Fine working of gems, jewels, crystals, e.g. of semiconductor materialApparatus therefor
The invention relates to methods and systems for forming the lay-up of a solar module (6), encapsulant of the module being at least partially provided as granules (2) in a structured manner. The lay-up (16) is introduced into the laminator (15) with the granules still is this form.
B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure
The invention relates to a mounting system for frameless solar panels that enables water to run of more easily. Moreover the water does not collect near or on the module and runs of in transversal direction of the mounting rail holding the lower end of the module.
The invention relates to a wire saw with pulleys that have a longer life time. The pulleys have in their wire supporting surface recesses that enable the wire supporting surface to expand and retract with the wire as tension builds up or falls off in the wire as it runs around the pulley.
B23D 57/00 - Sawing machines or sawing devices not covered by one of groups
B28D 5/04 - Fine working of gems, jewels, crystals, e.g. of semiconductor materialApparatus therefor by tools other than of rotary type, e.g. reciprocating tools
The invention relates to a wire saw (1), preferably a wafer cutting saw, comprising: a cutting wire (3), preferably forming a wire web, for cutting a workpiece (2), application means (6) for applying a cutting fluid to the cutting wire (3), wire breakage sensing means (8) for detecting a broken cutting wire (3), - a shield (7) for shielding the wire breakage sensing means (8) from the cutting fluid coming from the application means (6), wherein the application means (6), the wire breakage sensing means (8) and the shield (7) form within the wire saw (1) a constructional unit (10).
B28D 5/00 - Fine working of gems, jewels, crystals, e.g. of semiconductor materialApparatus therefor
B28D 5/04 - Fine working of gems, jewels, crystals, e.g. of semiconductor materialApparatus therefor by tools other than of rotary type, e.g. reciprocating tools
11.
MONITORING DEVICE AND METHOD FOR WIRE WEB MONITORING AND WIRE SAW
An improved and simplified system and method for monitoring the wire web of a wire saw is described. The system contains a sensor that is moved over the wire web and thus determines the deflection of individual wires of the wire web or of wire groups thereof.
B23D 59/00 - Accessories specially designed for sawing machines or sawing devices
B28D 5/00 - Fine working of gems, jewels, crystals, e.g. of semiconductor materialApparatus therefor
B28D 5/04 - Fine working of gems, jewels, crystals, e.g. of semiconductor materialApparatus therefor by tools other than of rotary type, e.g. reciprocating tools
12.
LAMINATOR FOR SOLAR MODULES USING A TUBE LIKE PRESSING MEMBER
An improved and simplified system (1) and method for laminating sandwiched bodies (7), lay-ups, and more particular for the lamination of solar modules is described which can be adapted for mass production inexpensively. The present invention is simple, cost effective, reliable, and environmentally friendly in operation. A tube like inflatable member (4) is used to create a pressing chamber (5) for moving a heating plate (2) toward a base (3) holding the lay-up (7).
B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure
B30B 1/00 - Presses, using a press ram, characterised by the features of the drive therefor, pressure being transmitted directly, or through simple thrust or tension members only, to the press ram or platen
The invention relates to a wire management system (7) for a wire saw (8) having a cutting wire (3) which is guided through a cutting area (13), the wire management system (7) comprising a wire supplying unit (5) for supplying cutting wire (3) to the cutting area (13) of the wire saw (8) and a wire receiving unit (6) for receiving cutting wire (3) from the cutting area (13) of the wire saw (8), wherein at least one of the wire supplying unit (5) and the wire receiving unit (6) comprises: at least one rotatable reservoir spool (1) for carrying the cutting wire (3) in overlapping windings, at least one rotatable storage spool (2) for temporarily receiving the cutting wire (3) in windings, wherein the rotational axis (2b) of the storage spool (2) coincides with the rotational axis (1 b) of the reservoir spool (1), a wire guiding means (9) for guiding the cutting wire (3) when being wound up on the storage spool (2), such that the wire windings on the storage spool (2) do not overlap each other and/or have a lower density than the windings on the reservoir spool (1 ).
The invention relates to a wafer handling system (1) for handling a plurality of essentially parallel aligned wafers (2), the system comprising: a wafer interacting part (10) comprising wafer interacting means for acting upon the plurality of wafers (2), and at least one wafer receiving part (11, 12) for receiving the plurality of wafers (2), characterized in that the wafer interacting part (10) and the at least one wafer receiving part (11) are dimensioned relative to each other such that one of the wafer interacting part (10) and the wafer receiving part (11, 12) may inserted into the other of the wafer interacting part (10) and the wafer receiving part (11, 12).
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
The invention relates to a method of making wafers (5) from an ingot (4) which is fixed to a beam (19) by means of a gluing layer (10) wherein the beam (19) has at least one internal channel (11), the method comprising the steps of: cutting the ingot (4) into a plurality of wafers (5), separating the wafers (5) from the beam (19) by introducing a de-gluing fluid to the internal channel (11), subsequent to the step of cutting the steps of: - moving the beam (19) with the cut wafers (5) relative to the wire web (18) in a direction opposite to the cutting direction into a de-gluing position in which the wire web (18) is located below the gluing layer (10) in the gaps (6) between the wafers (5), holding the beam (19) with the cut wafers (5) relative to the wire web (18) in that de-gluing position while de-gluing fluid (7) is delivered through the internal channel (11) to the gluing layer (10).
The invention relates to a wafer receiving box (3) for receiving wafers (5), the wafer receiving box (3) having in a first area (1 1) a width (W1), characterized in that the wafer receiving box (3) has in a further area (12, 13) which is above and/or below said first area portions (6) laterally extending beyond the width (W1) of said first area (1 1) such that the width (W2) of the wafer receiving box (3) in said further area (12, 13) is larger than the width (W1) of said first area (11).
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B28D 5/00 - Fine working of gems, jewels, crystals, e.g. of semiconductor materialApparatus therefor
17.
THRUST ELEMENT AND INNER DIAMETER SAW FOR INGOTS WITH SUCH A THRUST ELEMENT
A thrust element (1), preferably thrust ring, for a tensioning system for an inner diameter ingot saw, is intended to be biased onto the saw blade (2) by at least one adjustable tensioning element (6). The radial cross section of the surface of the thrust element (1) facing the saw blade (2) is formed as convex curve (1a) with an essentially circular center segment (1b) abutting the saw blade (2). The radius (R) of the center segment (1b) is 8 to 12 mm. Said thrust element (1) is used preferably in an inner diameter ingot saw with a supporting ring (3) and a tensioning system for the saw blade (2).
The invention relates to a holding device (1) for holding and rocking a work piece (2) in a cutting machine (20), the holding device (1) comprising: - a supporting part (9), - a rocking part (5), being movably mounted relative to the supporting part (9), - a fixing mechanism (6) arranged on the rocking part (5) for fixing a work piece (2) on the rocking part (5), - a drive mechanism (26) for moving said rocking part (5) with respect to said supporting part (9), the drive mechanism (26) comprising: - at least one drive pulley (16) rotatably mounted to the supporting part (9), and - flexible pulling means (15) cooperating with the drive pulley (16) and having a first section (15a) and a second section (15b) extending from the drive pulley (16) towards the rocking part (5), the end of the first section (15a) and the end of the second section (15b) being fixedly mounted to the rocking part (5), so that the first pulling means section (15a) pulls the rocking part (5) in a first moving direction (R1) when the drive pulley (16) rotates in a first direction and the second pulling means section (15b) pulls the rocking part (5) in a second moving direction (R2) being opposed to the first moving direction (R1) when the drive pulley (16) rotates in opposite direction.
The invention relates to a sacrificial substrate (1) having a mounting surface (2) for holding a piece of material (3), such as an ingot, brick or core, for cutting a plurality of wafers from the piece of material (3), wherein the sacrificial substrate (1) has an E-modulus smaller than 6000 MPa, more preferably smaller than 5000 MPa, most preferably smaller than 4000 MPa. The invention also relates to a method of making a plurality of wafers of a piece of material (3), such as an ingot, brick or core, comprising the steps of: mounting the piece of material (3) to a sacrificial substrate (1), preferably by gluing; mounting the sacrificial substrate (1) with the piece of material (3) in a cutting device; and cutting the piece of material (3) into a plurality of wafers.
B28D 5/00 - Fine working of gems, jewels, crystals, e.g. of semiconductor materialApparatus therefor
B23D 45/04 - Sawing machines or sawing devices with circular saw blades or with friction saw discs with a circular saw blade or the stock carried by a pivoted lever
B23D 47/02 - Sawing machines or sawing devices working with circular saw blades, characterised only by constructional features of particular parts of framesSawing machines or sawing devices working with circular saw blades, characterised only by constructional features of particular parts of guiding arrangements for work-table or saw-carrier
B23D 47/04 - Sawing machines or sawing devices working with circular saw blades, characterised only by constructional features of particular parts of devices for feeding, positioning, clamping, or rotating work
B23D 51/10 - Sawing machines or sawing devices working with straight blades, characterised only by constructional features of particular partsCarrying or attaching means for tools, covered by this subclass, which are connected to a carrier at both ends of devices for mounting straight saw blades or other tools for hand-held or hand-operated devices
B23D 59/00 - Accessories specially designed for sawing machines or sawing devices
B27B 5/29 - Sawing machines working with circular saw bladesComponents or equipment therefor DetailsComponent partsAccessories
B27B 7/00 - Sawing machines working with circular saw blades, specially designed for length sawing of trunks
B27B 7/04 - Sawing machines working with circular saw blades, specially designed for length sawing of trunks by making use of a plurality of circular saws mounted on a single spindleArrangements for adjusting the mutual distances
B28D 1/04 - Working stone or stone-like materials, e.g. brick, concrete, not provided for elsewhereMachines, devices, tools therefor by sawing with circular saw blades or saw discs
The invention relates to an apparatus for driving a wire or wire-like objects, the apparatus comprising at least one roller unit(1), the roller unit (1) comprises: a support (2), a support roller (3) which is rotatably mounted to the support (2), a wire receiving surface (4) which is provided on the support roller (3) for communicating with the wire, wherein the support roller (3) extends in axial direction beyond the wire receiving surface (4) at least at one side, a drive for driving the support roller (3) with respect to the support (2), the drive comprising a stator (6) and a rotor (7), the rotor (6) being fastened to the support roller (3) and the stator (7) being fastened to the support (2), wherein the rotor (6) and the stator (7) are fastened to the support roller (3) and to the support (2) in an area, which extends in axial direction beyond said wire receiving surface (4).
The invention relates to a method for fixing a single-crystal workpiece (1 ) on a holding means (2), the holding means (2) comprising a mounting surface (4) for mounting the holding means (2) on a processing device (6); wherein the method comprising the steps of: - measuring the crystal orientation of said single-crystal workpiece (1 ) with respect to a workpiece surface (5), - forming, in dependence of the crystal orientation of said single-crystal workpiece (1 ) with respect to said workpiece surface (5), on the holding means (2) a holding surface (3) for abuttingly receiving said workpiece surface (5), thereby defining the crystal orientation of the single-crystal workpiece (1 ) with respect to the mounting surface (4) of the holding means (2), and - gluing said workpiece surface (5) to said holding surface (3).
B28D 5/00 - Fine working of gems, jewels, crystals, e.g. of semiconductor materialApparatus therefor
B28D 5/04 - Fine working of gems, jewels, crystals, e.g. of semiconductor materialApparatus therefor by tools other than of rotary type, e.g. reciprocating tools
22.
SYSTEMS AND METHODS FOR ELECTROSTATICALLY HANDLING ATLEAST A MEMBER OF ATLEAST A LAY-UP OF PLURALITY OF SOLAR MODULE MEMBERS
Disclosed are methods and system for forming atleast a solar module of a plurality of module members. The method comprises the steps of: positioning atleast a first module member at a predefined position on a holding member; charging electrostatically atleast any of the first module member and the holding member as to stick to each other at the predefined position; joining atleast the first module member with atleast a second module member to form at least part of the solar module.
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure
23.
CUTTING FLUID CLEANING ARRANGEMENT FOR A WIRE SAW, WIRE SAW ARRANGEMENTS AND USE OF THE WIRE SAW ARRANGEMENT
A purification arrangement (53) for supplying wire saws (51) with cutting fluid comprises at least two purification devices (1, 69) producing cutting fluid of lower (57) and higher (59) degree of purity, both purities however sufficient to be used in the process executed by the wire saws (51). In dependence on the stage of the process in a wire saw (51), either one or the other of the purity grades are supplied. Instead of or additionally to a purification device for a higher purity grade, a fresh cutting fluid supply unit (83) may be connected to the wire saws (51) in order to add fresh cutting fluid, preferably in the end of the cutting process.
The device (4) for clamping a fixture attachment (19) to a machine comprises tension rods (20) for fixing the fixture attachment to an adapter piece (21) attached to a machine part, whereby the adapter piece (21) is provided at one side of the tension rods with at least a guiding means (22) cooperating with a matching groove (23) at the fixture attachment (19). On the other side of the tension rods a guide bar ( (24) is arranged operating with a matching groove (25) in the fixture attachment. Providing the fixture element with a guiding means, which can have a prismatic or rectangular end enhances on the one hand the precision of the clamping and of the position of the workpiece within the machine and gives on the other hand the customer the choice to introduce the fixture element in one orientation only or in both orientations under the adapter piece.
The invention is directed to a method for loading and unloading at least one work piece (1) to and from a machine such as a wire saw cutting machine (20), whereby the workpiece is fixed to a fixture attachment (3, 41), the machine comprising tensions means (47) for fixing the fixture attachment, the top surface of the fixture attachment being provided with a T-shaped groove (46). The work piece (s) is/are suspended in a transfer appliance (35) comprising a loading device (35) and a unloading device (35), the loading device is brought in front of the machine and carried into the machine under the tension means without being supported by a machine part and the fixture attachment with the work piece (s) is clamped to the machine, the loading device carried back outside the machine, whereupon the work piece (s) is/are processed, then the unloading device is brought under the processed work piece (s), the work piece (s) loaded on the unloading device and carried back for being further treated. Preferentially, at least the unloading device is operating without being supported by a machine part. With this loading and unloading method slipstick effects are avoided and much bigger and heavier work pieces can be more easily handled.
The invention relates to a method for monitoring for wire breaks while hard solids are cut by means of a span of wire, wherein the solid is guided through the span of wire, and a direct current is conducted by the span of wire. The direct current produces a voltage across the span of wire. The voltage is monitored by a sensor, which interrupts the cutting process when a voltage-deviation signal caused by a wire break is received. The invention further relates to a wire saw for carrying out said method and to the use of the method and/or of the wire saw to cut hard, preferably brittle solids, preferably metals and semimetals, preferably mono- and polycrystalline silicon crystals, ceramics, sapphire, and germanium.
B26D 1/547 - Cutting through work characterised by the nature or movement of the cutting memberApparatus or machines thereforCutting members therefor involving a cutting member which does not travel with the work having a wire-like cutting member
B26D 5/00 - Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
B23D 57/00 - Sawing machines or sawing devices not covered by one of groups
B23Q 17/09 - Arrangements for indicating or measuring on machine tools for indicating or measuring cutting pressure or cutting-tool condition, e.g. cutting ability, load on tool
B28D 5/04 - Fine working of gems, jewels, crystals, e.g. of semiconductor materialApparatus therefor by tools other than of rotary type, e.g. reciprocating tools
27.
WIRE SAW COMPRISING A WIRE WEB AND CLEANING NOZZLES
The present application relates to a wire saw (1) comprising a wire web (2) equipped with cutting means, wherein at least one nozzle (5) blasts the cutting chips from the wire web (2) at least over the width of the cutting surface of the wire web (2) using liquid. Furthermore, the application relates to related cutting methods and to uses of said wire saw (1).
The present invention relates to methods for the shaping of a silicon crystal, in which at least on the contact face worked by a shaping device, the silicon crystal is brought into contact with an alkaline liquid, and also to the use of alkaline liquids in this method.
In a wire saw that serves for cutting polygonal, columnar bricks out of an ingot of a generally inorganic crystalline material, more particularly a semiconductor material, a cutting yoke (5) having at least two angularly offset saw wire fields is provided that is displaceable in the saw feed direction (7). The yoke is coupled to a carrier (38) by means of an assembly of two rails (40, 42). In this manner, the yoke (5) is easily removable from the process chamber (1) of the wire saw by pulling one rail (42) out of the other rail (40) in order to perform maintenance operations etc. The saw wire in the cutting yoke (5) is guided in an essentially meander-shaped path so that the cutting wire essentially only extends in the wire fields (sections 14, 16) and on the sides of the frame (20) of the cutting yoke (5).
B23D 57/00 - Sawing machines or sawing devices not covered by one of groups
B28D 5/04 - Fine working of gems, jewels, crystals, e.g. of semiconductor materialApparatus therefor by tools other than of rotary type, e.g. reciprocating tools
30.
DEVICE FOR HOLDING COLUMNAR WORKPIECES AND USE OF THE DEVICE
A device (20) for holding a workpiece (3), more particularly a columnar silicon ingot, comprises two opposed retaining heads (22, 24) that are provided with at least two clamping elements (28) each. By pressing the clamping elements (28) against the front surfaces of the workpiece (3), an immobilisation of the workpiece (3) between the retaining heads (22, 24) is achieved. The presence of at least two clamping elements (28) in each head (22, 24) allows inserting a cutting means (29) between the latter in order to carry out one or a plurality of longitudinal cuts through the workpiece (3) to divide the latter into two or more also columnar portions. In this manner, the workpiece portions still remain clamped after carrying out the cut.
B28D 7/04 - Accessories specially adapted for use with machines or devices of the other groups of this subclass for supporting or holding work
B28D 5/04 - Fine working of gems, jewels, crystals, e.g. of semiconductor materialApparatus therefor by tools other than of rotary type, e.g. reciprocating tools
B23D 57/00 - Sawing machines or sawing devices not covered by one of groups
31.
MULTI-WIRE CUTTING DEVICE WITH A REVOLVING WORKPIECE MOUNT
The present invention relates to a multi-wire cutting device (1) with a revolving workpiece mount (2) and a method for cutting solid substrates, for example, for use as wafers in the semiconductor, photovoltaics, optical, ceramics, electro- and magnetotechnical industry.
The present invention relates to a device and a method for cleaning flat substrates, in particular silicon wafers, in a stacked upright position by a combined rinse and ultrasonic treatment directed at the substrate sides.
The invention relates to the use of a mixture of a thixotropic dispersant and abrasive grains as abrasives for machining workpieces, especially semiconductor crystals. The invention thus provides a method for recovering the mixture in an especially easy manner and an especially functional separation method for the workpiece to be machined.
The invention relates to a method and a device for recovering a mixture of a dispersant and abrasive grains as abrasives. The mixture is used for machining, especially for separating by machining, workpieces, preferably semiconductor crystals. The invention is characterized in that a thixotropic and substantially water-based dispersant is used.
patents