Fabricating a high refractive index photonic device includes disposing a polymerizable composition on a first surface of a first substrate and contacting the polymerizable composition with a first surface of a second substrate, thereby spreading the polymerizable composition on the first surface of the first substrate. The polymerizable composition is cured to yield a polymeric structure having a first surface in contact with the first surface of the first substrate, a second surface opposite the first surface of the polymeric structure and in contact with the first surface of the second substrate, and a selected residual layer thickness between the first surface of the polymeric structure and the second surface of the polymeric structure in the range of 10 μm to 1 cm. The polymeric structure is separated from the first substrate and the second substrate to yield a monolithic photonic device having a refractive index of at least 1.6.
G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
Asymmetric structures formed on a substrate and microlithographic methods for forming such structures. Each of the structures has a first side surface and a second side surface, opposite the first side surface. A profile of the first side surface is asymmetric with respect to a profile of the second side surface. The structures on the substrate are useful as a diffraction pattern for an optical device.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Fabricating a high refractive index photonic device includes disposing a polymerizable composition on a first surface of a first substrate and contacting the polymerizable composition with a first surface of a second substrate, thereby spreading the polymerizable composition on the first surface of the first substrate. The polymerizable composition is cured to yield a polymeric structure having a first surface in contact with the first surface of the first substrate, a second surface opposite the first surface of the polymeric structure and in contact with the first surface of the second substrate, and a selected residual layer thickness between the first surface of the polymeric structure and the second surface of the polymeric structure in the range of 10 μm to 1 cm. The polymeric structure is separated from the first substrate and the second substrate to yield a monolithic photonic device having a refractive index of at least 1.6.
B29D 11/00 - Producing optical elements, e.g. lenses or prisms
B29C 33/62 - Releasing, lubricating or separating agents based on polymers or oligomers
G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
An imprint lithography system includes: a first chuck configured to support a first substrate; a first bushing surrounding the first chuck and configured to pneumatically suspend the first chuck laterally within the first bushing; one or more supportive mechanisms disposed beneath the first chuck and configured to support the first chuck vertically within the first bushing, wherein the first chuck is configured to be forced in a downward direction against first vertical resistive forces provided by the one or more supportive mechanisms, while the first chuck is suspended laterally within the first bushing and while the first chuck is maintained in the first fixed rotational orientation.
G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Asymmetric structures formed on a substrate and microlithographic methods for forming such structures. Each of the structures has a first side surface and a second side surface, opposite the first side surface. A profile of the first side surface is asymmetric with respect to a profile of the second side surface. The structures on the substrate are useful as a diffraction pattern for an optical device.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A multi-waveguide optical structure, including multiple waveguides stacked to intercept light passing sequentially through each waveguide, each waveguide associated with a differing color and a differing depth of plane, each waveguide including: a first adhesive layer, a substrate having a first index of refraction, and a patterned layer positioned such that the first adhesive layer is between the patterned layer and the substrate, the first adhesive layer providing adhesion between the patterned layer and the substrate, the patterned layer having a second index of refraction less than the first index of refraction, the patterned layer defining a diffraction grating, wherein a field of view associated with the waveguide is based on the first and the second indices of refraction.
An imprint lithography method for positioning substrates includes supporting first and second substrates respectively atop first and second chucks, pneumatically suspending the first and second chucks laterally within first and second bushings, supporting the first and second chucks vertically within the first and second bushings, maintaining the first and second chucks respectively in first and second fixed rotational orientations, and forcing the first and second chucks in a downward direction independently of each other respectively against first and second vertical resistive forces until first and second top surfaces of the first and second substrates are coplanar, while maintaining the first and second chucks suspended laterally within the first and second bushings and while maintaining the first and second chucks in the first and second fixed rotational orientations.
G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Micro- and nano-patterns in imprint layers formed on a substrate and lithographic methods for forming such layers. The layers include a plurality of structures, and a residual layer having a residual layer thickness (RLT) that extends from the surface of the substrate to a base of the structures, where the RLT varies across the surface of the substrate according to a predefined pattern.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Asymmetric structures formed on a substrate and microlithographic methods for forming such structures. Each of the structures has a first side surface and a second side surface, opposite the first side surface. A profile of the first side surface is asymmetric with respect to a profile of the second side surface. The structures on the substrate are useful as a diffraction pattern for an optical device.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
An imprint lithography method of configuring an optical layer includes imprinting first features of a first order of magnitude in size on a side of a substrate with a patterning template, while imprinting second features of a second order of magnitude in size on the side of the substrate with the patterning template, the second features being sized and arranged to define a gap between the substrate and an adjacent surface.
G02B 1/118 - Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B29C 33/42 - Moulds or coresDetails thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
B29C 59/16 - Surface shaping, e.g. embossingApparatus therefor by wave energy or particle radiation
G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
11.
Nano imprinting with reusable polymer template with metallic or oxide coating
Methods and systems are provided for fabricating polymer-based imprint lithography templates having thin metallic or oxide coated patterning surfaces. Such templates show enhanced fluid spreading and filling (even in absence of purging gases), good release properties, and longevity of use. Methods and systems for fabricating oxide coated versions, in particular, can be performed under atmospheric pressure conditions, allowing for lower cost processing and enhanced throughput.
C23C 16/513 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B41C 1/10 - Forme preparation for lithographic printingMaster sheets for transferring a lithographic image to the forme
C23C 16/48 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
B29C 59/04 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
B29C 59/14 - Surface shaping, e.g. embossingApparatus therefor by plasma treatment
An imprint lithography method of configuring an optical layer includes depositing a set of droplets atop a side of a substrate in a manner such that the set of droplets do not contact a functional pattern formed on the substrate. The imprint lithography method further includes curing the set of droplets to form a spacer layer associated with the side of the substrate and of a height selected such that the spacer layer can support a surface adjacent the substrate and spanning the set of droplets at a position spaced apart from the functional pattern.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Micro- and nano-patterns in imprint layers formed on a substrate and lithographic methods for forming such layers. The layers include a plurality of structures, and a residual layer having a residual layer thickness (RLT) that extends from the surface of the substrate to a base of the structures, where the RLT varies across the surface of the substrate according to a predefined pattern.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
14.
Multi-waveguide optical structure with diffraction grating
A multi-waveguide optical structure, including multiple waveguides stacked to intercept light passing sequentially through each waveguide, each waveguide associated with a differing color and a differing depth of plane, each waveguide including: a first adhesive layer, a substrate having a first index of refraction, and a patterned layer positioned such that the first adhesive layer is between the patterned layer and the substrate, the first adhesive layer providing adhesion between the patterned layer and the substrate, the patterned layer having a second index of refraction less than the first index of refraction, the patterned layer defining a diffraction grating, wherein a field of view associated with the waveguide is based on the first and the second indices of refraction.
Methods, systems, and apparatus for a substrate transfer method, including positioning a tray handler device in a first position with i) cutouts of an aperture of the first tray in superimposition with respective pedestals of a pedestal platform and ii) a distal end of the pedestals extending away from a top surface of the first tray; increasing a distance between the top surface of the first tray and a top surface of the pedestal platform to transfer a first substrate from the pedestals to the tabs defined by the aperture of the first tray, while concurrently engaging the second tray handler with the second tray; and increasing a distance between the top surface of the second tray and the bottom surface of a chuck to transfer a second substrate from the chuck to the tabs defined by the second tray.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A method of generating a virtual image, including directing a light beam to a first side of an eyepiece, including transmitting the light beam into a first waveguide of the eyepiece; deflecting, by first diffractive elements of the first waveguide, a first portion of the light beam towards a second waveguide of the eyepiece, the first portion of the light beam associated with a first phase of light; deflecting, by protrusions on the first side of the eyepiece, a second portion of the light beam towards the second waveguide, the second portion of the light beam associated with a second phase of light differing from the first phase; and deflecting, by second diffractive elements of the second waveguide, some of the first and the second portions of the light beam to provide an exiting light beam associated with the virtual image that is based on the first and second phases.
An imprint lithography method of configuring an optical layer includes depositing a set of droplets atop a side of a substrate in a manner such that the set of droplets do not contact a functional pattern formed on the substrate. The imprint lithography method further includes curing the set of droplets to form a spacer layer associated with the side of the substrate and of a height selected such that the spacer layer can support a surface adjacent the substrate and spanning the set of droplets at a position spaced apart from the functional pattern.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Micro- and nano-patterns in imprint layers formed on a substrate and lithographic methods for forming such layers. The layers include a plurality of structures, and a residual layer having a residual layer thickness (RLT) that extends from the surface of the substrate to a base of the structures, where the RLT varies across the surface of the substrate according to a predefined pattern.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
19.
Strain and kinetics control during separation phase of imprint process
Systems and methods for improving robust layer separation during the separation process of an imprint lithography process are described. Included are methods of matching strains between a substrate to be imprinted and the template, varying or modifying the forces applied to the template and/or the substrate during separation, or varying or modifying the kinetics of the separation process.
B29C 37/00 - Component parts, details, accessories or auxiliary operations, not covered by group or
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
20.
Template having a varying thickness to facilitate expelling a gas positioned between a substrate and the template
A nanoimprint lithography template including, inter alia, a body having first and second opposed sides with a first surface disposed on the first side, the second side having a recess disposed therein, the body having first and second regions with the second region surrounding the first region and the recess in superimposition with the first region, with a portion of the first surface in superimposition with the first region being spaced-apart from the second side a first distance and a portion of the first surface in superimposition with the second region being spaced-apart from the second side a second distance, with the second distance being greater than the first distance; and a mold disposed on the first side of the body in superimposition a portion of the first region.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
21.
Edge sealant confinement and halo reduction for optical devices
Techniques are described for using confinement structures and/or pattern gratings to reduce or prevent the wicking of sealant polymer (e.g., glue) into the optically active areas of a multi-layered optical assembly. A multi-layered optical structure may include multiple layers of substrate imprinted with waveguide grating patterns. The multiple layers may be secured using an edge adhesive, such as a resin, epoxy, glue, and so forth. A confinement structure such as an edge pattern may be imprinted along the edge of each layer to control and confine the capillary flow of the edge adhesive and prevent the edge adhesive from wicking into the functional waveguide grating patterns of the layers. Moreover, the edge adhesive may be carbon doped or otherwise blackened to reduce the reflection of light off the edge back into the interior of the layer, thus improving the optical function of the assembly.
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Methods, systems, and apparatus for the loading and unloading of substrates, such as semiconductor wafers, involving microlithography and similar nano-fabrication techniques. The system includes two or more pedestals; a substrate chuck including two or more channels; a turntable having a top surface and a first end positioned opposite a second end, each of the first and second ends including a respective opening, each opening including two or more cutouts and two or more tabs, the turntable rotatable between first and second positions and an actuator system to adjust distances between the turntable and the substrate chuck and between the turntable and the pedestals.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
24.
OPTICAL POLYMER FILMS AND METHODS FOR CASTING THE SAME
An example system is configured to photocure a photocurable material to form a polymer film. The system includes a first chuck configured to support a first substantially planar mold, a second chuck configured to support a second substantially planar mold, and an actuable stage coupled to the first chuck and/or the second chuck. The actuable stage is configured to position the first chuck and/or the second chuck so that the first and second molds are separated by a gap. The system also includes a sensor arrangement for obtaining measurement information indicative of a distance between the first and second molds and/or a pressure between the first and second chucks at each of at least three locations. The system also includes a control module configured control the gap between the first and second molds based on the measurement information.
B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
B29C 35/08 - Heating or curing, e.g. crosslinking or vulcanising by wave energy or particle radiation
B29C 43/04 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles using movable moulds
An example system is configured to photocure a photocurable material to form a polymer film. The system includes a first chuck configured to support a first substantially planar mold, a second chuck configured to support a second substantially planar mold, and an actuable stage coupled to the first chuck and/or the second chuck. The actuable stage is configured to position the first chuck and/or the second chuck so that the first and second molds are separated by a gap. The system also includes a sensor arrangement for obtaining measurement information indicative of a distance between the first and second molds and/or a pressure between the first and second chucks at each of at least three locations. The system also includes a control module configured control the gap between the first and second molds based on the measurement information.
B29C 35/08 - Heating or curing, e.g. crosslinking or vulcanising by wave energy or particle radiation
G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
B29C 33/10 - Moulds or coresDetails thereof or accessories therefor with incorporated venting means
B29C 43/54 - Compensating volume change, e.g. retraction
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B29L 11/00 - Optical elements, e.g. lenses, prisms
B29C 37/00 - Component parts, details, accessories or auxiliary operations, not covered by group or
B29C 43/56 - Compression moulding under special conditions, e.g. vacuum
26.
CONFIGURING OPTICAL LAYERS IN IMPRINT LITHOGRAPHY PROCESSES
An imprint lithography method of configuring an optical layer includes depositing a set of droplets atop a side of a substrate in a manner such that the set of droplets do not contact a functional pattern formed on the substrate. The imprint lithography method further includes curing the set of droplets to form a spacer layer associated with the side of the substrate and of a height selected such that the spacer layer can support a surface adjacent the substrate and spanning the set of droplets at a position spaced apart from the functional pattern.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
An imprint lithography method of configuring an optical layer includes depositing a set of droplets atop a side of a substrate in a manner such that the set of droplets do not contact a functional pattern formed on the substrate. The imprint lithography method further includes curing the set of droplets to form a spacer layer associated with the side of the substrate and of a height selected such that the spacer layer can support a surface adjacent the substrate and spanning the set of droplets at a position spaced apart from the functional pattern.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
An imprint lithography method of configuring an optical layer includes imprinting first features of a first order of magnitude in size on a side of a substrate with a patterning template, while imprinting second features of a second order of magnitude in size on the side of the substrate with the patterning template, the second features being sized and arranged to define a gap between the substrate and an adjacent surface.
B29C 59/16 - Surface shaping, e.g. embossingApparatus therefor by wave energy or particle radiation
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B29C 33/42 - Moulds or coresDetails thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
29.
CONFIGURING OPTICAL LAYERS IN IMPRINT LITHOGRAPHY PROCESSES
An imprint lithography method of configuring an optical layer includes imprinting first features of a first order of magnitude in size on a side of a substrate with a patterning template, while imprinting second features of a second order of magnitude in size on the side of the substrate with the patterning template, the second features being sized and arranged to define a gap between the substrate and an adjacent surface.
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 20/00 - Nanooptics, e.g. quantum optics or photonic crystals
B82Y 40/00 - Manufacture or treatment of nanostructures
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A multi-waveguide optical structure, including multiple waveguides stacked to intercept light passing sequentially through each waveguide, each waveguide associated with a differing color and a differing depth of plane, each waveguide including: a first adhesive layer, a substrate having a first index of refraction, and a patterned layer positioned such that the first adhesive layer is between the patterned layer and the substrate, the first adhesive layer providing adhesion between the patterned layer and the substrate, the patterned layer having a second index of refraction less than the first index of refraction, the patterned layer defining a diffraction grating, wherein a field of view associated with the waveguide is based on the first and the second indices of refraction.
G02B 6/036 - Optical fibres with cladding core or cladding comprising multiple layers
G02B 6/10 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
A method of generating a virtual image, including directing a light beam to a first side of an eyepiece, including transmitting the light beam into a first waveguide of the eyepiece; deflecting, by first diffractive elements of the first waveguide, a first portion of the light beam towards a second waveguide of the eyepiece, the first portion of the light beam associated with a first phase of light; deflecting, by protrusions on the first side of the eyepiece, a second portion of the light beam towards the second waveguide, the second portion of the light beam associated with a second phase of light differing from the first phase; and deflecting, by second diffractive elements of the second waveguide, some of the first and the second portions of the light beam to provide an exiting light beam associated with the virtual image that is based on the first and second phases.
G02B 6/10 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
G02B 27/22 - Other optical systems; Other optical apparatus for producing stereoscopic or other three-dimensional effects
A multi-waveguide optical structure, including multiple waveguides stacked to intercept light passing sequentially through each waveguide, each waveguide associated with a differing color and a differing depth of plane, each waveguide including: a first adhesive layer, a substrate having a first index of refraction, and a patterned layer positioned such that the first adhesive layer is between the patterned layer and the substrate, the first adhesive layer providing adhesion between the patterned layer and the substrate, the patterned layer having a second index of refraction less than the first index of refraction, the patterned layer defining a diffraction grating, wherein a field of view associated with the waveguide is based on the first and the second indices of refraction.
G02B 6/036 - Optical fibres with cladding core or cladding comprising multiple layers
G02B 6/10 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
An imprint lithography method of configuring an optical layer includes imprinting first features of a first order of magnitude in size on a side of a substrate with a patterning template, while imprinting second features of a second order of magnitude in size on the side of the substrate with the patterning template, the second features being sized and arranged to define a gap between the substrate and an adjacent surface.
A multi-waveguide optical structure, including multiple waveguides stacked to intercept light passing sequentially through each waveguide, each waveguide associated with a differing color and a differing depth of plane, each waveguide including: a first adhesive layer, a substrate having a first index of refraction, and a patterned layer positioned such that the first adhesive layer is between the patterned layer and the substrate, the first adhesive layer providing adhesion between the patterned layer and the substrate, the patterned layer having a second index of refraction less than the first index of refraction, the patterned layer defining a diffraction grating, wherein a field of view associated with the waveguide is based on the first and the second indices of refraction.
A method of generating a virtual image, including directing a light beam to a first side of an eyepiece, including transmitting the light beam into a first waveguide of the eyepiece; deflecting, by first diffractive elements of the first waveguide, a first portion of the light beam towards a second waveguide of the eyepiece, the first portion of the light beam associated with a first phase of light; deflecting, by protrusions on the first side of the eyepiece, a second portion of the light beam towards the second waveguide, the second portion of the light beam associated with a second phase of light differing from the first phase; and deflecting, by second diffractive elements of the second waveguide, some of the first and the second portions of the light beam to provide an exiting light beam associated with the virtual image that is based on the first and second phases.
Methods, systems, and apparatus for a substrate transfer method, including positioning a tray handler device in a first position with i) cutouts of an aperture of the first tray in superimposition with respective pedestals of a pedestal platform and ii) a distal end of the pedestals extending away from a top surface of the first tray; increasing a distance between the top surface of the first tray and a top surface of the pedestal platform to transfer a first substrate from the pedestals to the tabs defined by the aperture of the first tray, while concurrently engaging the second tray handler with the second tray; and increasing a distance between the top surface of the second tray and the bottom surface of a chuck to transfer a second substrate from the chuck to the tabs defined by the second tray.
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
B29C 43/02 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles
B29C 59/00 - Surface shaping, e.g. embossingApparatus therefor
B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
Methods, systems, and apparatus for a substrate transfer method, including positioning a tray handler device in a first position with i) cutouts of an aperture of the first tray in superimposition with respective pedestals of a pedestal platform and ii) a distal end of the pedestals extending away from a top surface of the first tray; increasing a distance between the top surface of the first tray and a top surface of the pedestal platform to transfer a first substrate from the pedestals to the tabs defined by the aperture of the first tray, while concurrently engaging the second tray handler with the second tray; and increasing a distance between the top surface of the second tray and the bottom surface of a chuck to transfer a second substrate from the chuck to the tabs defined by the second tray.
B29C 43/02 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles
B29C 59/00 - Surface shaping, e.g. embossingApparatus therefor
B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
Methods, systems, and apparatus for a substrate transfer method, including positioning a tray handler device in a first position with i) cutouts of an aperture of the first tray in superimposition with respective pedestals of a pedestal platform and ii) a distal end of the pedestals extending away from a top surface of the first tray; increasing a distance between the top surface of the first tray and a top surface of the pedestal platform to transfer a first substrate from the pedestals to the tabs defined by the aperture of the first tray, while concurrently engaging the second tray handler with the second tray; and increasing a distance between the top surface of the second tray and the bottom surface of a chuck to transfer a second substrate from the chuck to the tabs defined by the second tray.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
39.
POSITIONING SUBSTRATES IN IMPRINT LITHOGRAPHY PROCESSES
An imprint lithography method for positioning substrates includes supporting first and second substrates respectively atop first and second chucks, pneumatically suspending the first and second chucks laterally within first and second bushings, supporting the first and second chucks vertically within the first and second bushings, maintaining the first and second chucks respectively in first and second fixed rotational orientations, and forcing the first and second chucks in a downward direction independently of each other respectively against first and second vertical resistive forces until first and second top surfaces of the first and second substrates are coplanar, while maintaining the first and second chucks suspended laterally within the first and second bushings and while maintaining the first and second chucks in the first and second fixed rotational orientations.
Micro- and nano- patterns in imprint layers formed on a substrate and lithographic methods for forming such layers. The layers include a plurality of structures, and a residual layer having a residual layer thickness (RLT) that extends from the surface of the substrate to a base of the structures, where the RLT varies across the surface of the substrate according to a predefined pattern.
B29C 33/38 - Moulds or coresDetails thereof or accessories therefor characterised by the material or the manufacturing process
B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
B82Y 40/00 - Manufacture or treatment of nanostructures
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
An imprint lithography method for positioning substrates includes supporting first and second substrates respectively atop first and second chucks, pneumatically suspending the first and second chucks laterally within first and second bushings, supporting the first and second chucks vertically within the first and second bushings, maintaining the first and second chucks respectively in first and second fixed rotational orientations, and forcing the first and second chucks in a downward direction independently of each other respectively against first and second vertical resistive forces until first and second top surfaces of the first and second substrates are coplanar, while maintaining the first and second chucks suspended laterally within the first and second bushings and while maintaining the first and second chucks in the first and second fixed rotational orientations.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Micro- and nano-patterns in imprint layers formed on a substrate and lithographic methods for forming such layers. The layers include a plurality of structures, and a residual layer having a residual layer thickness (RLT) that extends from the surface of the substrate to a base of the structures, where the RLT varies across the surface of the substrate according to a predefined pattern.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Asymmetric structures formed on a substrate and microlithographic methods for forming such structures. Each of the structures has a first side surface and a second side surface, opposite the first side surface. A profile of the first side surface is asymmetric with respect to a profile of the second side surface. The structures on the substrate are useful as a diffraction pattern for an optical device.
G03F 1/00 - Originals for photomechanical production of textured or patterned surfaces, e.g. masks, photo-masks or reticlesMask blanks or pellicles thereforContainers specially adapted thereforPreparation thereof
G03F 1/32 - Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portionPreparation thereof
Asymmetric structures formed on a substrate and microlithographic methods for forming such structures. Each of the structures has a first side surface and a second side surface, opposite the first side surface. A profile of the first side surface is asymmetric with respect to a profile of the second side surface. The structures on the substrate are useful as a diffraction pattern for an optical device.
H01L 21/302 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Fabricating a high refractive index photonic device includes disposing a polymerizable composition on a first surface of a first substrate and contacting the polymerizable composition with a first surface of a second substrate, thereby spreading the polymerizable composition on the first surface of the first substrate. The polymerizable composition is cured to yield a polymeric structure having a first surface in contact with the first surface of the first substrate, a second surface opposite the first surface of the polymeric structure and in contact with the first surface of the second substrate, and a selected residual layer thickness between the first surface of the polymeric structure and the second surface of the polymeric structure in the range of 10 μm to 1 cm. The polymeric structure is separated from the first substrate and the second substrate to yield a monolithic photonic device having a refractive index of at least 1.6.
B29D 11/00 - Producing optical elements, e.g. lenses or prisms
G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
B29C 33/62 - Releasing, lubricating or separating agents based on polymers or oligomers
B29C 35/08 - Heating or curing, e.g. crosslinking or vulcanising by wave energy or particle radiation
Techniques are described for using confinement structures and/or pattern gratings to reduce or prevent the wicking of sealant polymer (e.g., glue) into the optically active areas of a multi-layered optical assembly. A multi-layered optical structure may include multiple layers of substrate imprinted with waveguide grating patterns. The multiple layers may be secured using an edge adhesive, such as a resin, epoxy, glue, and so forth. A confinement structure such as an edge pattern may be imprinted along the edge of each layer to control and confine the capillary flow of the edge adhesive and prevent the edge adhesive from wicking into the functional waveguide grating patterns of the layers. Moreover, the edge adhesive may be carbon doped or otherwise blackened to reduce the reflection of light off the edge back into the interior of the layer, thus improving the optical function of the assembly.
G02B 6/00 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings
G02F 1/00 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/35 - Optical coupling means having switching means
Fabricating a high refractive index photonic device includes disposing a polymerizable composition on a first surface of a first substrate and contacting the polymerizable composition with a first surface of a second substrate, thereby spreading the polymerizable composition on the first surface of the first substrate. The polymerizable composition is cured to yield a polymeric structure having a first surface in contact with the first surface of the first substrate, a second surface opposite the first surface of the polymeric structure and in contact with the first surface of the second substrate, and a selected residual layer thickness between the first surface of the polymeric structure and the second surface of the polymeric structure in the range of 10 µm to 1 cm. The polymeric structure is separated from the first substrate and the second substrate to yield a monolithic photonic device having a refractive index of at least 1.6.
G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
B29D 11/00 - Producing optical elements, e.g. lenses or prisms
Techniques are described for using confinement structures and/or pattern gratings to reduce or prevent the wicking of sealant polymer (e.g., glue) into the optically active areas of a multi-layered optical assembly. A multi-layered optical structure may include multiple layers of substrate imprinted with waveguide grating patterns. The multiple layers may be secured using an edge adhesive, such as a resin, epoxy, glue, and so forth. A confinement structure such as an edge pattern may be imprinted along the edge of each layer to control and confine the capillary flow of the edge adhesive and prevent the edge adhesive from wicking into the functional waveguide grating patterns of the layers. Moreover, the edge adhesive may be carbon doped or otherwise blackened to reduce the reflection of light off the edge back into the interior of the layer, thus improving the optical function of the assembly.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
49.
EDGE SEALANT CONFINEMENT AND HALO REDUCTION FOR OPTICAL DEVICES
Techniques are described for using confinement structures and/or pattern gratings to reduce or prevent the wicking of sealant polymer (e.g., glue) into the optically active areas of a multi-layered optical assembly. A multi-layered optical structure may include multiple layers of substrate imprinted with waveguide grating patterns. The multiple layers may be secured using an edge adhesive, such as a resin, epoxy, glue, and so forth. A confinement structure such as an edge pattern may be imprinted along the edge of each layer to control and confine the capillary flow of the edge adhesive and prevent the edge adhesive from wicking into the functional waveguide grating patterns of the layers. Moreover, the edge adhesive may be carbon doped or otherwise blackened to reduce the reflection of light off the edge back into the interior of the layer, thus improving the optical function of the assembly.
B82Y 40/00 - Manufacture or treatment of nanostructures
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Methods, systems, and apparatus for the loading and unloading of substrates, such as semiconductor wafers, involving microlithography and similar nano-fabrication techniques. The system includes two or more pedestals; a substrate chuck including two or more channels; a turntable having a top surface and a first end positioned opposite a second end, each of the first and second ends including a respective opening, each opening including two or more cutouts and two or more tabs, the turntable rotatable between first and second positions and an actuator system to adjust distances between the turntable and the substrate chuck and between the turntable and the pedestals.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
51.
Nano imprinting with reusable polymer template with metallic or oxide coating
Methods and systems are provided for fabricating polymer-based imprint lithography templates having thin metallic or oxide coated patterning surfaces. Such templates show enhanced fluid spreading and filling (even in absence of purging gases), good release properties, and longevity of use. Methods and systems for fabricating oxide coated versions, in particular, can be performed under atmospheric pressure conditions, allowing for lower cost processing and enhanced throughput.
C23C 16/513 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B41C 1/10 - Forme preparation for lithographic printingMaster sheets for transferring a lithographic image to the forme
C23C 16/48 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
B29C 59/04 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
B29C 59/14 - Surface shaping, e.g. embossingApparatus therefor by plasma treatment
Methods, systems, and apparatus for the loading and unloading of substrates, such as semiconductor wafers, involving microlithography and similar nano-fabrication techniques. The system includes two or more pedestals; a substrate chuck including two or more channels; a turntable having a top surface and a first end positioned opposite a second end, each of the first and second ends including a respective opening, each opening including two or more cutouts and two or more tabs, the turntable rotatable between first and second positions and an actuator system to adjust distances between the turntable and the substrate chuck and between the turntable and the pedestals.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
53.
Nano imprinting with reusable polymer template with metallic or oxide coating
Methods and systems are provided for fabricating polymer-based imprint lithography templates having thin metallic or oxide coated patterning surfaces. Such templates show enhanced fluid spreading and filling (even in absence of purging gases), good release properties, and longevity of use. Methods and systems for fabricating oxide coated versions, in particular, can be performed under atmospheric pressure conditions, allowing for lower cost processing and enhanced throughput.
G03G 7/00 - Selection of materials for use in image-receiving members, i.e. for reversal by physical contactManufacture thereof
C23C 16/513 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
B41C 1/10 - Forme preparation for lithographic printingMaster sheets for transferring a lithographic image to the forme
C23C 16/48 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
B29C 59/04 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
B29C 59/14 - Surface shaping, e.g. embossingApparatus therefor by plasma treatment
54.
METHODS FOR UNIFORM IMPRINT PATTERN TRANSFER OF SUB-20 NM FEATURES
Methods of increasing etch selectivity in imprint lithography are described which employ material deposition techniques that impart a unique morphology to the multi-layer material stacks, thereby enhancing etch process window and improving etch selectivity. For example, etch selectivity of 50:1 or more between patterned resist layer and deposited metals, metalloids, or non-organic oxides can be achieved, which greatly preserves the pattern feature height prior to the etch process that transfers the pattern into the substrate, allowing for sub-20 nm pattern transfer at high fidelity.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
55.
Methods for uniform imprint pattern transfer of sub-20 nm features
Methods of increasing etch selectivity in imprint lithography are described which employ material deposition techniques that impart a unique morphology to the multi-layer material stacks, thereby enhancing etch process window and improving etch selectivity. For example, etch selectivity of 50:1 or more between patterned resist layer and deposited metals, metalloids, or non-organic oxides can be achieved, which greatly preserves the pattern feature height prior to the etch process that transfers the pattern into the substrate, allowing for sub-20 nm pattern transfer at high fidelity.
H01L 21/283 - Deposition of conductive or insulating materials for electrodes
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
56.
High throughput imprint based on contact line motion tracking control
Systems for controlling velocity of a contact line and height profile between a template and a substrate during imprinting of polymerizable material are described.
B29C 43/02 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles
B82Y 40/00 - Manufacture or treatment of nanostructures
In an imprint lithography system, a recessed support on a template chuck may alter a shape of a template positioned thereon providing minimization and/or elimination of premature downward deflection of outer edges of the template in a nano imprint lithography process.
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B25B 11/00 - Work holders or positioners not covered by groups , e.g. magnetic work holders, vacuum work holders
58.
Nano imprinting with reusable polymer template with metallic or oxide coating
Methods and systems are provided for fabricating polymer-based imprint lithography templates having thin metallic or oxide coated patterning surfaces. Such templates show enhanced fluid spreading and filling (even in absence of purging gases), good release properties, and longevity of use. Methods and systems for fabricating oxide coated versions, in particular, can be performed under atmospheric pressure conditions, allowing for lower cost processing and enhanced throughput.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
B29C 59/04 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
59.
NANO IMPRINTING WITH REUSABLE POLYMER TEMPLATE WITH METALLIC OR OXIDE COATING
Methods and systems are provided for fabricating polymer-based imprint lithography templates having thin metallic or oxide coated patterning surfaces. Such templates show enhanced fluid spreading and filling (even in absence of purging gases), good release properties, and longevity of use. Methods and systems for fabricating oxide coated versions, in particular, can be performed under atmospheric pressure conditions, allowing for lower cost processing and enhanced throughput.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
60.
Nanoimprint lithography processes for forming nanoparticles
A lithography method for forming nanoparticles includes patterning sacrificial material on a multilayer substrate. In some cases, the pattern is transferred to or into a removable layer of the multilayer substrate, and functional material is disposed on the removable layer of the multilayer substrate and solidified. At least a portion of the functional material is then removed to expose protrusions of the removable layer, and pillars of the functional material are released from the removable layer to yield nanoparticles. In other cases, the multilayer substrate includes the functional material, and the pattern is transferred to or into a removable layer of the multilayer substrate. The sacrificial layer is removed, and pillars of the functional material are released from the removable layer to yield nanoparticles.
Porous nano-imprint lithography templates may include pores, channels, or porous layers arranged to allow evacuation of gas trapped between a nano-imprint lithography template and substrate. The pores or channels may be formed by etch or other processes. Gaskets may be formed on an nano-imprint lithography template to restrict flow of polymerizable material during nano-imprint lithography processes.
B32B 37/14 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
Devices positioned between an energy source and an imprint lithography template may block exposure of energy to portions of polymerizable material dispensed on a substrate. Portions of the polymerizable material that are blocked from the energy may remain fluid, while the remaining polymerizable material is solidified.
Methods and systems are provided for patterning polymerizable material dispensed on flexible substrates or flat substrates using imprint lithography techniques. Template replication methods and systems are also presented where patterns from a master are transferred to flexible substrates to form flexible film templates. Such flexible film templates are then used to pattern large area flat substrates. Contact between the imprint template and substrate can be initiated and propagated by relative translation between the template and the substrate.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Methods and systems are provided for patterning polymerizable material dispensed on flexible substrates or flat substrates using imprint lithography techniques. Template replication methods and systems are also presented where patterns from a master are transferred to flexible substrates to form flexible film templates. Such flexible film templates are then used to pattern large area flat substrates. Contact between the imprint template and substrate can be initiated and propagated by relative translation between the template and the substrate.
B29C 35/08 - Heating or curing, e.g. crosslinking or vulcanising by wave energy or particle radiation
B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
65.
FABRICATION OF SEAMLESS LARGE AREA MASTER TEMPLATES FOR IMPRINT LITHOGRAPHY
Described are methods of forming large area templates useful for patterning large area optical devices including e.g. wire grid polarizers (WGPs). Such methods provide for seamless patterning of such large area devices.
Described are methods of forming large area templates useful for patterning large area optical devices including e.g. wire grid polarizers (WGPs). Such methods provide for seamless patterning of such large area devices.
B29D 11/00 - Producing optical elements, e.g. lenses or prisms
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
B82Y 30/00 - Nanotechnology for materials or surface science, e.g. nanocomposites
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
B29C 43/02 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles
B29C 43/00 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor
B29C 33/38 - Moulds or coresDetails thereof or accessories therefor characterised by the material or the manufacturing process
B29C 33/42 - Moulds or coresDetails thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
Imprint lithography templates having alignment marks with highly absorptive material. The alignment marks are insensitive to the effects of liquid spreading and can provide stability and increase contrast to alignment system during liquid imprint filling of template features
Imprint lithography templates having alignment marks with highly absorptive material. The alignment marks are insensitive to the effects of liquid spreading and can provide stability and increase contrast to alignment system during liquid imprint filling of template features.
B29C 59/00 - Surface shaping, e.g. embossingApparatus therefor
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
69.
Photocatalytic reactions in nano-imprint lithography processes
An imprint lithography template having a photoactive coating adhered to a surface of the template. Irradiation of the photoactive coating promotes cleaning of the template by decomposition of organic material proximate the template (e.g., organic material adsorbed on the template). An imprint lithography system may be configured such that template cleaning is achieved during formation of a patterned layer on an imprint lithography substrate. Cleaning of the template during an imprint lithography process reduces down-time that may be associated with template maintenance.
Thickness of a residual layer may be altered to control critical dimension of features in a patterned layer provided by an imprint lithography process. The thickness of the residual layer may be directly proportional or inversely proportional to the critical dimension of features. Dispensing techniques and material selection may also provide control of the critical dimension of features in the patterned layer.
Functional nanoparticles may be formed using at least one nanoimprint lithography step. In one embodiment, sacrificial material may be patterned on a multilayer substrate including one or more functional layers between removable layers using an imprint lithography process. At least one of the functional layers includes a functional material such as a pharmaceutical composition or imaging agent. The pattern may be further etched into the multilayer substrate. At least a portion of the functional material may then be removed to provide a crown surface exposing pillars. Removing the removable layers releases the pillars from the patterned structure to form functional nanoparticles such as drug or imaging agent carriers.
B82Y 5/00 - Nanobiotechnology or nanomedicine, e.g. protein engineering or drug delivery
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B82Y 15/00 - Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
Methods of making nano-scale structures with geometric cross-sections, including convex or non-convex cross-sections, are described. The approach may be used to directly pattern substrates and/or create imprint lithography templates or molds that may be subsequently used to directly replicate nano-shaped patterns into other substrates, such as into a functional or sacrificial resist to form functional nanoparticles.
B82Y 40/00 - Manufacture or treatment of nanostructures
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
73.
NANOIMPRINT LITHOGRAPHY FORMATION OF FUNCTIONAL NANOPARTICLES USING DUAL RELEASE LAYERS
BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM (USA)
Inventor
Singh, Vikramjit
Xu, Frank Y.
Sreenivasan, Sidlgata V.
Abstract
Functional nanoparticles may be formed using at least one nanoimprint lithography step. In one embodiment, sacrificial material may be patterned on a multilayer substrate including one or more functional layers between removable layers using an imprint lithography process. At least one of the functional layers includes a functional material such as a pharmaceutical composition or imaging agent. The pattern may be further etched into the multilayer substrate. At least a portion of the functional material may then be removed to provide a crown surface exposing pillars. Removing the removable layers releases the pillars from the patterned structure to form functional nanoparticles such as drug or imaging agent carriers.
B82B 3/00 - Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
B82B 1/00 - Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
B82Y 40/00 - Manufacture or treatment of nanostructures
BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM (USA)
Inventor
Sreenivasan, Sidlgata V.
Singh, Vikramjit
Xu, Frank Y.
Choi, Byung-Jin
Abstract
Methods of making nano-scale structures with geometric cross-sections, including convex or non-convex cross-sections, are described. The approach may be used to directly pattern substrates and/or create imprint lithography templates or molds that may be subsequently used to directly replicate nano-shaped patterns into other substrates, such as into a functional or sacrificial resist to form functional nanoparticles.
B29C 33/42 - Moulds or coresDetails thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
B82B 3/00 - Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
B82B 1/00 - Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
B82Y 40/00 - Manufacture or treatment of nanostructures
Methods for forming an imprint lithography template are provided. Materials for forming the imprint lithography template may be etched at different rates based on physical properties of the layers. Additionally, reflectance of the materials may be monitored to provide substantially uniform erosion of the materials.
Two-stage imprinting techniques capable of protecting fine patterned features of an imprint lithography template are herein described. In particular, such techniques may be used during fabrication of recessed high-contrast alignment marks for preventing deposited metal layers from coming into contact with fine features etched into the template.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B82Y 40/00 - Manufacture or treatment of nanostructures
77.
HIGH CONTRAST ALIGNMENT MARKS THROUGH MULTIPLE STAGE IMPRINTING
Two-stage imprinting techniques capable of protecting fine patterned features of an imprint lithography template are herein described. In particular, such techniques may be used during fabrication of recessed high-contrast alignment marks for preventing deposited metal layers from coming into contact with fine features etched into the template.
B29C 33/42 - Moulds or coresDetails thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
B82B 3/00 - Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
78.
VAPOR DELIVERY SYSTEM FOR USE IN IMPRINT LITHOGRAPHY
Described are systems and method of using a vapor delivery system for enabling delivery of an adhesion promoter material during an imprint lithography process.
Detection of periodically repeating nanovoids is indicative of levels of substrate contamination and may aid in reduction of contaminants on substrates. Systems and methods for detecting nanovoids, in addition to, systems and methods for cleaning and/or maintaining cleanliness of substrates are described.
Detection of periodically repeating nanovoids is indicative of levels of substrate contamination and may aid in reduction of contaminants on substrates. Systems and methods for detecting nanovoids, in addition to, systems and methods for cleaning and/or maintaining cleanliness of substrates are described.
Densifying a multi-layer substrate includes providing a substrate with a first dielectric layer on a surface of the substrate. The first dielectric layer includes a multiplicity of pores. Water is introduced into the pores of the first dielectric layer to form a water-containing dielectric layer. A second dielectric layer is provided on the surface of the water-containing first dielectric layer. The first and second dielectric layers are annealed at temperature of 600C or less. In an example, the multi-layer substrate is a nanoimprint lithography template. The second dielectric layer may have a density and therefore an etch rate similar to that of thermal oxide, yet may still be porous enough to allow more rapid diffusion of helium than a thermal oxide layer.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
H01L 21/316 - Inorganic layers composed of oxides or glassy oxides or oxide-based glass
82.
Release agent partition control in imprint lithography
Release agents with increased affinity toward nano-imprint lithography template surfaces interact strongly with the template during separation of the template from the solidified resist in a nano-imprint lithography process. The strong interaction between the surfactant and the template surface reduces the amount of surfactant pulled off the template surface during separation of a patterned layer from the template in an imprint lithography cycle. Maintaining more surfactant associated with the surface of the template after the separation of the patterned layer from the template may reduce the amount of surfactant needed in a liquid resist to achieve suitable release of the solidified resist from the template during an imprint lithography process. Strong association of the release agent with the surface of the template facilitates the formation of ultra-thin residual layers and dense fine features in nano-imprint lithography.
BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM (USA)
Inventor
Yang, Shuqiang
Miller, Michael, N.
Hilali, Mohamed
Wan, Fen
Schmid, Gerard
Wang, Liang
Sreenivasan, Sidlgata, V.
Xu, Frank, Y.
Abstract
Systems and methods for fabrication of nanostructured solar cells having arrays of nanostructures are described, including nanostructured solar cells having a repeating pattern of pyramid nanostructures, providing for low cost thin-film solar cells with improved PCE.
Systems and methods for fabrication of nanostructured solar cells having arrays of nanostructures are described, including nanostructured solar cells having a repeating pattern of pyramid nanostructures, providing for low cost thin-film solar cells with improved PCE.
H01L 31/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
H01L 31/0352 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
B82Y 20/00 - Nanooptics, e.g. quantum optics or photonic crystals
H01L 31/0376 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including amorphous semiconductors
H01L 31/0392 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates
H01L 31/075 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PIN type, e.g. amorphous silicon PIN solar cells
H01L 31/076 - Multiple junction or tandem solar cells
H01L 31/20 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor material
H01L 31/0463 - PV modules composed of a plurality of thin film solar cells deposited on the same substrate characterised by special patterning methods to connect the PV cells in a module, e.g. laser cutting of the conductive or active layers
86.
SEPARATION CONTROL SUBSTRATE/TEMPLATE FOR NANOIMPRINT LITHOGRAPHY
Control of lateral strain and lateral strain ratio (dt/db) between template and substrate through the selection of template and/or substrate thicknesses (Tt and/or Tb), control of template and/or substrate back pressure (Pt and/or Pb), and/or selection of material stiffness are described.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
4, where R is an organic substituent; a decomposable organic compound; a photoinitiator; and a release agent. The composition polymerizes upon exposure to UV radiation to form an inorganic silica network, and the decomposable organic compound decomposes upon exposure to heat to form pores in the inorganic silica network. The composition may be used to form a patterned dielectric layer in an integrated circuit device. A metallic film may be disposed on the patterned dielectric layer and then planarized.
G03F 7/028 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
Edge field patterning of a substrate having full fields and partial fields may include patterning using a template having multiple mesas with each mesa corresponding to a field on the substrate. Polymerizable material may be deposited solely between the template and the full fields of the substrate. A non-reactive material may be deposited between the template and partial fields of the substrate.
B29C 59/00 - Surface shaping, e.g. embossingApparatus therefor
B82Y 40/00 - Manufacture or treatment of nanostructures
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B29C 43/00 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B29C 43/02 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles
90.
PROCESS GAS CONFINEMENT FOR NANOIMPRINTING LITHOGRAPHY
Gas confinement systems and methods are described. In particular, systems and methods are described that include a barrier that confines purging gas and restricts flow of purging gas to other elements within a nano-lithography system. The barrier can be adjusted to accommodate and/or control desired pressure variations between working and external environments.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Described are systems and methods for formation of templates having alignment marks with high contrast material. High contrast material may be positioned within recesses of alignment marks.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
92.
ROLL-TO-ROLL IMPRINT LITHOGRAPHY AND PURGING SYSTEM
Droplets of polymerizable material may be patterned on a film sheet using a roll-to-roll system. The droplets of polymerizable material may be dispensed on the film sheet such that a substantially continuous patterned layer may be formed on the film sheet. A contact system provides for smooth fluid front progression the polymerizable material during imprinting. A gas purging system may be positioned during imprinting. Gas purging systems may provide for purging in parallel as fluid front of polymerizable material moves through roll-to- roll system.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B29C 43/00 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor
Fabricating a solar cell stack includes forming a nanopattemed polymeric layer on a first surface of a silicon wafer and etching the first surface of the silicon wafer to transfer a pattern of the nanopattemed polymeric layer to the first surface of the silicon wafer. A layer of reflective electrode material is formed on a second surface of the silicon wafer. The nanopattemed first surface of the silicon wafer undergoes a buffered oxide etching. After the buffered oxide etching, the nanopattemed first surface of the silicon wafer is treated to decrease a contact angle of water on the nanopattemed first surface. Electron donor material is deposited on the nanopattemed first surface of the silicon wafer to form an electron donor layer, and a transparent electrode material is deposited on the electron donor layer to form a transparent electrode layer on the electron donor layer.
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
H01L 51/42 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
H01L 51/44 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation - Details of devices
94.
MICRO-CONFORMAL TEMPLATES FOR NANOIMPRINT LITHOGRAPHY
A micro-conformal nanoimprint lithography template includes a backing layer and a nanopatterned layer adhered to the backing layer. The elastic modulus of the backing layer exceeds the elastic modulus of the nanopatterned layer. The micro-conformal nanoimprint lithography template can be used to form a patterned layer from an imprint resist on a substrate, the substrate having a micron-scale defect, such that an excluded distance from an exterior surface of the micron-scale defect to the patterned layer formed by the nanoimprint lithography template is less than a height of the defect. The nanoimprint lithography template can be used to form multiple imprints with no reduction in feature fidelity.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
95.
METHODS AND SYSTEMS OF MATERIAL REMOVAL AND PATTERN TRANSFER
Polymerized material on a substrate may be removed by exposure to vacuum ultraviolet (VUV) radiation from an energy source within a gaseous atmosphere of a controlled composition. Following such removal, additional etching techniques are also described for nano-imprinting.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A nanoimprint lithography method for forming nanoparticles includes patterning sacrificial material on a multilayer substrate. In some cases, the pattern is transferred to or into a removable layer of the multilayer substrate, and functional material is disposed on the removable layer of the multilayer substrate and solidified. At least a portion of the functional material is then removed to expose protrusions of the removable layer, and pillars of the functional material are released from the removable layer to yield nanoparticles. In other cases, the multilayer substrate includes the functional material, and the pattern is transferred to or into a removable layer of the multilayer substrate. The sacrificial layer is removed, and pillars of the functional material are released from the removable layer to yield nanoparticles.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
An ultra-compliant nanoimprint lithography template having a backing layer and a nanopatterned layer adhered to the backing layer. The nanopatterned layer includes nanoscale features formed by solidifying a polymerizable material in contact with a mold. The polymerizable material includes a fluoroelastomer and a photoinitiator. The backing layer has a higher elastic modulus than the nanopatterned layer. The ultra-compliant nanoimprint lithography template can be used to form multiple high fidelity imprints.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
98.
Methods and systems of material removal and pattern transfer
Polymerized material on a substrate may be removed by exposure to vacuum ultraviolet (VUV) radiation from an energy source within a gaseous atmosphere of a controlled composition. Following such removal, additional etching techniques are also described for nano-imprinting.
B82Y 40/00 - Manufacture or treatment of nanostructures
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
99.
Micro-conformal templates for nanoimprint lithography
A micro-conformal nanoimprint lithography template includes a backing layer and a nanopatterned layer adhered to the backing layer. The elastic modulus of the backing layer exceeds the elastic modulus of the nanopatterned layer. The micro-conformal nanoimprint lithography template can be used to form a patterned layer from an imprint resist on a substrate, the substrate having a micron-scale defect, such that an excluded distance from an exterior surface of the micron-scale defect to the patterned layer formed by the nanoimprint lithography template is less than a height of the defect. The nanoimprint lithography template can be used to form multiple imprints with no reduction in feature fidelity.
Droplets of polymerizable material may be patterned on a film sheet using a roll-to-roll system. The droplets of polymerizable material may be dispensed on the film sheet such that a substantially continuous patterned layer may be formed on the film sheet. A contact system provides for smooth fluid front progression the polymerizable material during imprinting. A gas purging system may be positioned during imprinting. Gas purging systems may provide for purging in parallel as fluid front of polymerizable material moves through roll-to-roll system.
B05D 3/12 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
