A conductive paste is provided. The conductive paste includes a metal particulate material having a first metal powder having a having a D50 ranging from about 500 nm to about 1,500 nm, a second metal powder having a D50 ranging from about 10 nm to about 100 nm, and a third metal powder having a D50 ranging from about 3,000 nm to about 5,500 nm. The metal paste includes a solvent composition. The weight ratio of the third metal powder to the first metal powder is greater than 1. Electronic articles are also provided.
H01L 23/00 - Details of semiconductor or other solid state devices
B22F 1/103 - Metallic powder containing lubricating or binding agentsMetallic powder containing organic material containing an organic binding agent comprising a mixture of, or obtained by reaction of, two or more components other than a solvent or a lubricating agent
B22F 7/06 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite workpieces or articles from parts, e.g. to form tipped tools
A conductive paste is provided. The conductive paste includes a metal particulate material having a first metal powder having a having a D50 ranging from about 500 nm to about 1,500 nm, a second metal powder having a D50 ranging from about 10 nm to about 100 nm, and a third metal powder having a D50 ranging from about 3,000 nm to about 5,500 nm. The metal paste includes a solvent composition. The weight ratio of the third metal powder to the first metal powder is greater than 1. Electronic articles are also provided.
A semiconductor device including a semiconductor chip formed from a semiconductive material and a cover formed from a conductive material is provided. The semiconductor chip and cover are bonded with a thermal interface material composition that includes metal particles dispersed in a resin or resin blend and a silane-based adhesion promoter. The TIM composition may also include a rubber and a curing agent. Methods of making semiconductor devices are also provided.
C08F 297/04 - Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type polymerising vinyl aromatic monomers and conjugated dienes
4.
Semiconductor Device and Methods of Manufacturing a Semiconductor Device
A semiconductor device including a semiconductor chip formed from a semiconductive material and a cover formed from a conductive material is provided. The semiconductor chip and cover are bonded with a thermal interface material composition that includes metal particles dispersed in a resin or resin blend and a silane-based adhesion promoter. The TIM composition may also include a rubber and a curing agent. Methods of making semiconductor devices are also provided.
A sintering method for joining at least two components is provided. The method includes disposing a conductive paste on a first component. The conductive paste includes a metal powder dispersed in an organic vehicle. The metal powder has a D50 ranging from about 200 nm to about 500 nm. The method includes drying the conductive paste to form a dried conductive paste and disposing a second component on the dried conductive paste to form a component arrangement. The method includes sintering the component arrangement without applying external pressure to the component arrangement. Electronic articles are also provided.
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
B22F 7/06 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite workpieces or articles from parts, e.g. to form tipped tools
H01L 23/00 - Details of semiconductor or other solid state devices
A sintering method for joining at least two components is provided. The method includes disposing a conductive paste on a first component. The conductive paste includes a metal powder dispersed in an organic vehicle. The metal powder has a D50 ranging from about 200 nm to about 500 nm. The method includes drying the conductive paste to form a dried conductive paste and disposing a second component on the dried conductive paste to form a component arrangement. The method includes sintering the component arrangement without applying external pressure to the component arrangement. Electronic articles are also provided.
2522323255 is present in an amount of from about 15 wt.% to about 30 wt.% based on the total weight of the glass frit. Articles containing the conductive paste and methods for using the conductive paste are also provided.
A conductive paste is provided including a conductive material, glass frit and an organic vehicle. The glass frit includes V2O5, TeO2, Bi2O3, and Al2O3. V2O5 is present in an amount of from about 15 wt. % to about 30 wt. % based on the total weight of the glass frit. Articles containing the conductive paste and methods for using the conductive paste are also provided.
17 - Rubber and plastic; packing and insulating materials
Goods & Services
Conductive inks; semi-conductive inks; resistive inks having low electrical conductivity; solder conductive inks for use in soldering; conductive inks for use in thick film applications for manufacturing electronic circuits; conductive inks for use in the manufacture of electronic circuits for providing electrically conductive paths and films; resistive inks for use in the manufacture of electronic circuits for providing electrically resistive paths and films; resistive inks for use in thick film applications for manufacturing electronic circuits; coatings in the nature of conductive inks Dielectric Inks; dielectric inks for use in the manufacture of electronic circuits
The invention relates to a polymer thick film (PTF) conductive paste composition comprising a conductive powder, a fluoroelastomer, a silane coupling agent, and one or solvents. The PTF conductive paste composition can be used to form a printed conductor and to form an electrically conductive adhesive on various articles. The PTF conductive paste composition is provides a stretchable electrical conductor for wearables.
C09D 11/106 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
A polymer thick film carbon black composition comprising 6-13 wt % conductive carbon black powder; and 87-94 wt % organic medium comprising thermoplastic polyurethane resin dissolved in an organic solvent may be used to form the resistive element of heaters in applications where significant stretching is required, particularly on substrates that can be highly elongated and, in particular, that can be used in wearable garment applications.
H01B 1/24 - Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon, or silicon
This disclosure relates to a conductive paste comprising a fine silver particle dispersion and a glass frit, wherein the fine silver particle dispersion comprising: (1) 65 to 95.4% by weight of fine silver particles which have average primary particle diameter of 10 to 190 nm and which comprise 25% by number or less of silver particles having primary particle diameter of 100 nm or larger, (2) 4.5 to 34.5% by weight of a solvent, (3) 0.1 to 1.0% by weight of ethyl cellulose having weight average molecular weight of 10,000 to 120,000. Also provided are: a method of manufacturing an electrically conductive thick film comprising steps of: (a) applying said fine silver particle dispersion on a substrate, and (b) heating the applied fine silver particle dispersion at 80 to 1000° C.; and an electrical device comprising a conductive thick film made with the foregoing paste.
A method of manufacturing an electronic device comprising the steps of: preparing a substrate comprising an electrically conductive layer; applying a conductive paste on the electrically conductive layer; mounting an electrical component on the applied conductive paste; heating the conductive paste to bond the electrically conductive layer and the electrical component, wherein the conductive paste comprises 100 parts by weight of the metal powder, 5 to 20 parts by weight of a solvent, and 0.05 to 3 parts by weight of a polymer, wherein the polymer comprises a first polymer and a second polymer, wherein the molecular weight (Mw) of the first polymer is 5,000 to 95,000, and the molecular weight (Mw) of the second polymer is 100,000 to 300,000.
C09J 5/06 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
The invention relates to a method of manufacturing a dielectric filter. The method comprises the steps of: (a) preparing a ceramic substrate; (b) applying a conductive paste on the ceramic substrate, wherein the conductive paste comprises, (i) 100 parts by weight of a conductive powder, (ii) 0.1 to 10.0 parts by weight of a glass frit comprising silicon oxide, boron oxide, aluminum oxide and an alkaline metal oxide, and (iii) an organic vehicle; and (c) firing the applied conductive paste.
This invention provides a polymer thick film electrically conductive paste composition, comprising conductive metal powder, a resin blend of polyol and phenoxy resin, blocked aliphatic polyisocyanate and one or more polar, aprotic solvents. In one embodiment the paste composition is used to form electrically conductive adhesive. In another embodiment the paste composition is used to form an electrically conductive polymer thick film.
H01L 21/461 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
H01R 4/04 - Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one anotherMeans for effecting or maintaining such contactElectrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
H01R 13/03 - Contact members characterised by the material, e.g. plating or coating materials
This invention provides a polymer thick film dielectric paste composition, comprising a mixture of titanium dioxide and boron nitride powders, a resin blend of polyol and phenoxy resin, one or more additives selected from the group consisting of a linear aliphatic polyester, a block copolymer, a blocked aliphatic polyisocyanate, and a wetting and dispersing agent, and one or more polar, aprotic solvents. The paste composition may be used to form polymer thick film dielectric layers in electrical circuits subject to thermoforming and in articles requiring stretchable dielectric layers such as wearables.
H05K 1/09 - Use of materials for the metallic pattern
C09D 17/00 - Pigment pastes, e.g. for mixing in paints
C08G 59/06 - Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
C08G 63/00 - Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
This invention provides gloves and socks containing printed heaters. The glove or sock with a heater comprises a glove or sock, a substrate with the outline of the glove or sock, and a heater printed on the substrate wherein the substrate is laminated to the glove or sock. The heater comprises two printed conductive bus bars with extensions traversing the substrate and an array of printed resistive areas arranged so that each area is between and overlaps and is contiguous to two conductors, one of which is one of the bus bars or its extensions and the second is the other bus bar or its extensions.
A41D 13/005 - Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches with controlled internal environment with controlled temperature
B32B 1/00 - Layered products having a non-planar shape
H05B 3/34 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
The invention is directed to a polyimide-based polymer thick film paste composition for forming a polyimide-based polymer thick film resistor, a process for forming the resistor and an electrical device containing a resistor formed using the paste composition The paste composition comprise a functional component, a polyimide, and an organic solvent and can be cured by heating.
H01B 1/24 - Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon, or silicon
C09D 179/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
H01C 17/065 - Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick-film techniques, e.g. serigraphy
19.
Stretchable polymer thick film compositions for thermoplastic substrates and wearables electronics
This invention is directed to stretchable polymer thick film compositions useful for wearable garments. More specifically, the polymer thick film may be used in applications where significant stretching is required, particularly on substrates that can be highly elongated. A particular type of substrate is a thermoplastic polyurethane substrate.
The invention relates to a chip resistor. A method of manufacturing a chip resistor comprises the steps of: (a) applying a conductive paste on an insulating substrate, wherein the conductive paste comprises, (i) 40 to 80 weight percent (wt. %) of a conductive powder; (ii) 1 to 14 wt. % of a glass frit, (iii) 0.01 to 3 wt. % of magnesium oxide (MgO), and (iv) 10 to 55 wt. % of an organic vehicle, wherein the wt. % is based on weight of the conductive paste; (b) firing the applied conductive paste to form the front electrodes.
H01C 1/148 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals embracing or surrounding the resistive element
H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors
H01C 17/28 - Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
H01C 1/012 - MountingSupporting the base extending along, and imparting rigidity or reinforcement to, the resistive element
22.
Articles and substrates providing improved performance of printable electronics
This invention is directed to substrates and articles utilizing these substrates that provide improved performance of printable electronics on polymer substrates. In particular, the improved substrates relate to polymer films and electrical conductors printed on them. Application of a thin polymeric coating to the polymer film provides the improved performance of the printed conductors.
H05K 1/09 - Use of materials for the metallic pattern
C08J 7/043 - Improving the adhesiveness of the coatings per se, e.g. forming primers
C08J 7/044 - Forming conductive coatingsForming coatings having anti-static properties
B05D 3/02 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
B05D 3/14 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
The present invention relates to a conductive paste for bonding that comprises a metal powder and a solvent, wherein the metal powder comprises a first metal powder having a particle diameter (D50) of 10 to 150 nm and a second metal powder having a particle diameter (D50) of 151 to 500 nm. The paste is useful for manufacturing an electronic device comprising a substrate with an electrically conductive layer and an electrical or electronic component, which are reliably bonded together using the paste.
The present invention relates to a conductive paste for bonding comprising 100 parts by weight of the metal powder, 5 to 20 parts by weight of a solvent, and 0.05 to 3 parts by weight of a polymer, wherein the polymer comprises a first polymer and a second polymer, wherein the molecular weight (Mw) of the first polymer is 5,000 to 95,000, and the molecular weight (Mw) of the second polymer is 100,000 to 300,000.
C09J 5/06 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
An electric component comprising a terminal electrode and a hot-melt polymer layer formed on the terminal electrode, wherein the hot-melt polymer layer comprises (i) 100 parts by weight of a metal powder and (ii) 1 to 30 parts by weight of a polymer, wherein melt mass-flow rate (MFR) of the polymer is 0.5 to 20 g/10 min. at 120 to 200° C. and 0.3 to 8 kgf.
H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
H01G 2/06 - Mountings specially adapted for mounting on a printed-circuit support
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
B05D 7/14 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
The invention is directed to a polyimide-based polymer thick film paste composition for forming a polyimide-based polymer thick film resistor, a process for forming the resistor and an electrical device containing a resistor formed using the paste composition The paste composition comprise a functional component, a polyimide, and an organic solvent and can be cured by heating.
H01B 1/24 - Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon, or silicon
H01C 17/065 - Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick-film techniques, e.g. serigraphy
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
This invention is directed to polyimide-based polymer thick film compositions and particularly non-fluorinated polyimide-based polymer thick film compositions. These compositions are comprised of certain polyimide polymers and certain solvents. In some embodiments various functional components are added to the composition to provide compositions that can be used to form various elements of an electrical circuit.
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
C09D 11/033 - Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
C09D 11/037 - Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
C09D 11/102 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
This invention provides a polymer thick film copper conductor composition for forming an electrical conductor and a method for using the polymer thick film copper conductor composition to form an electrical conductor in an electrical circuit. The method subjects the deposited thick film copper conductor composition to photonic sintering. The invention further provides electrical devices containing electrical conductors made from the polymer thick film copper conductor composition and also those formed by the method.
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H05K 1/09 - Use of materials for the metallic pattern
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
31.
Photonic sintering of a solderable polymer thick film copper conductor composition
This invention provides a polymer thick film copper conductor composition for forming a solderable and highly solder leach resistant electrical conductor and a method for using the polymer thick film copper conductor composition to form the electrical conductor in an electrical circuit. The method subjects the deposited thick film copper conductor composition to photonic sintering. The invention further provides electrical devices containing electrical conductors made from the polymer thick film copper conductor composition and also those formed by the method.
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
The invention is directed to a paste composition and a process for forming a solderable polyimide-based polymer thick film conductor. The paste composition comprising an electrically conductive metal, a polyimide, an organosilicon compound and an organic solvent and can be cured by heating at a temperature of 320 to 380° C. The invention also provides an electrical device containing a solderable polyimide-based polymer thick film conductor formed using the paste composition.
B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
H05K 1/09 - Use of materials for the metallic pattern
B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxesSelection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
33.
Flexible white reflective dielectric for electronic circuits
This invention is directed to a polymer thick film white reflective flexible dielectric composition comprising urethane resin, thermoplastic phenoxy resin, and white reflective powder. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to reflect light in 3D circuits containing LED's.
H01B 3/30 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes
This invention is directed to stretchable polymer thick film compositions useful for wearable garments. More specifically, the polymer thick film may be used in applications where significant stretching is required, particularly on substrates that can be highly elongated. A particular type of substrate is a thermoplastic polyurethane substrate.
This invention relates to a copper thick film paste composition paste comprising copper powder, a Pb-free, Bi-free and Cd-free borosilicate glass frit, ruthenium-based powder, and an organic vehicle. The invention also provides methods of using the copper thick film paste composition to make a copper conductor on a substrate. Typical substrates are selected from the group consisting of aluminum nitride, aluminum oxide and silicon nitride.
H01B 1/16 - Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
C08L 61/28 - Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
C08L 67/00 - Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chainCompositions of derivatives of such polymers
C09D 161/28 - Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
C09D 167/00 - Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chainCoating compositions based on derivatives of such polymers
H01L 33/46 - Reflective coating, e.g. dielectric Bragg reflector
H01L 33/48 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor body packages
This invention is directed to a polymer thick film conductor composition. The polymer thick film (PTF) conductor composition may be used in applications where significant stretching is required, particularly on highly permeable substrates. A particular type of substrate which is suitable is a woven polyester coated with polyamide. An electrical circuit containing a conductor formed from the composition and a process to make such a circuit are provided.
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
C09D 171/00 - Coating compositions based on polyethers obtained by reactions forming an ether link in the main chainCoating compositions based on derivatives of such polymers
C09D 175/00 - Coating compositions based on polyureas or polyurethanesCoating compositions based on derivatives of such polymers
39.
Flexible white reflective dielectric for electronic circuits
This invention is directed to a polymer thick film white reflective flexible dielectric composition comprising urethane resin, thermoplastic phenoxy resin, and white reflective powder. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to reflect light in 3D circuits containing LED's.
F21K 99/00 - Subject matter not provided for in other groups of this subclass
H01B 3/30 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes
This invention provides a method for using a polymer thick film copper conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film copper conductor composition to photonic sintering. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to photonic sintering. The invention further provides devices containing electrical conductors made by these methods. The invention also provides a polymer thick film copper conductor composition.
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
H05K 1/09 - Use of materials for the metallic pattern
41.
UV-curable thermoformable dielectric for thermoformable circuits
This invention is directed to a polymer thick film UV-curable thermoformable dielectric composition. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive thermoformable silver and the polycarbonate substrate below it in capacitive switch applications. The thermoformed capacitive switch circuit may be subsequently subjected to an injection molding process.
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01B 3/44 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes vinyl resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes acrylic resins
C09D 175/16 - Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
C09D 133/14 - Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
H01B 3/30 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes
C08G 18/67 - Unsaturated compounds having active hydrogen
(b) conductive carbon powder. The composition may be processed at a time and temperature necessary to remove all solvent.
The invention is further directed to positive temperature coefficient (PTC) circuits comprising the composition of the invention which has been dried to remove the solvent and to articles, e.g., mirror heaters and seat heaters, containing such PTC circuits as well as a method for making such PTC circuits.
B60H 1/00 - Heating, cooling or ventilating devices
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
B60R 1/06 - Rear-view mirror arrangements mounted on vehicle exterior
H01B 1/24 - Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon, or silicon
H05B 3/84 - Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
H05B 3/14 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
A method of manufacturing a non-fired type electrode comprising the steps of: (a) applying a conductive paste on a substrate, the conductive paste comprising; (i) 100 parts by weight of a conductive powder; (ii) an organic boron compound comprising an amine borate, a boronic acid, a boronic acid ester, a trimer of the boronic acid or a mixture thereof, wherein the boron element of the organic boron compound is 0.03 to 1.4 parts by weight; and (iii) 20 to 150 parts by weight of an organic vehicle; and (b) heating the applied conductive paste at 100 to 300° C.
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
C09D 185/04 - Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbonCoating compositions based on derivatives of such polymers containing boron
A composition for forming transition vias and transition line conductors is disclosed for minimizing interface effects at electrical connections between dissimilar metal compositions. The composition has (a) inorganic components selected from the group consisting of (i) 20-45 wt % gold and 80-55 wt % silver and (ii) 100 wt % silver-gold solid solution alloys, and (b) an organic medium. The composition may also contain (c) 1-5 wt %, based upon the weight of the composition, of oxides or mixed oxides of metals selected from the group consisting of Cu, Co, Mg and Al and/or high viscosity glasses mainly containing refractory oxides. The composition may be used as a multi-layer composition in a via fill. Multi-layer circuits such as LTCC circuits and devices may also be formed using the composition for forming transition vias and transition line conductors.
This invention relates to a copper thick film paste composition paste comprising copper powder, a Pb-free, Bi-free and Cd-free borosilicate glass frit, a component selected from the group consisting of ruthenium-based powder, copper oxide powder and mixtures thereof and an organic vehicle. The invention also provides methods of using the copper thick film paste composition to make a copper conductor on a substrate. Typical substrates are selected from the group consisting of aluminum nitride, aluminum oxide and silicon nitride.
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
H01B 1/16 - Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
H05K 1/09 - Use of materials for the metallic pattern
48.
Lamination of polymer thick film conductor compositions
This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to lamination. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to lamination. The invention further provides devices containing electrical conductors made by these methods.
C08L 33/20 - Homopolymers or copolymers of acrylonitrile
H05K 1/09 - Use of materials for the metallic pattern
C09D 127/08 - Homopolymers or copolymers of vinylidene chloride
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
A conductive metal composition comprising 40 to 88 wt % of silver particles having an average particle size in the range of 10 to 100 nm and having an aspect ratio of 3 to 1:1, 2 to 20 wt % of a poly(2-ethyl-2-oxazoline) resin having a weight-average molar mass of 50,000 to 500,000 and 10 to 58 wt % of a solvent for the poly(2-ethyl-2-oxazoline) resin.
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
This invention is directed to a polymer thick film conductive composition that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. The electrical circuit is subsequently subjected to an injection molding process.
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H03K 17/00 - Electronic switching or gating, i.e. not by contact-making and -breaking
B29C 51/14 - Shaping by thermoforming, e.g. shaping sheets in matched moulds or by deep-drawingApparatus therefor using multilayered preforms or sheets
H01H 1/029 - Composite material comprising conducting material dispersed in an elastic support or binding material
H05K 1/09 - Use of materials for the metallic pattern
H01B 3/18 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances
An electrically conductive paste composition comprises: (a) silver powders comprising spherical silver powders having a mean particle size (D50) of over 0.1 μm and no more than 5 μm and flake-shaped silver powders having a mean particle size of no more than 10 μm; and (b) binder resins comprise (b-1) aliphatic thermoplastic resin and (b-2) self-polymerizing thermosetting resin; wherein the content of the silver powders is no more than 60 wt % based on the total weight of the paste composition, wherein the weight ratio of the aliphatic thermoplastic resin for the self-polymerizing thermosetting resin ((b-1)/(b-2)) is 99/1-67/33 and wherein the weight ratio of the silver powders for the binder resins ((a)/(b)) is 94/6-85/15.
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
C03C 3/062 - Glass compositions containing silica with less than 40% silica by weight
C03C 3/064 - Glass compositions containing silica with less than 40% silica by weight containing boron
C03C 3/066 - Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
C03C 8/14 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions
C03C 8/16 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions with vehicle or suspending agents, e.g. slip
C03C 8/18 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions containing free metals
H01C 17/065 - Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick-film techniques, e.g. serigraphy
H05B 3/12 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
53.
Lamination of polymer thick film conductor compositions
This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to lamination. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to lamination. The invention further provides devices containing electrical conductors made by these methods.
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
54.
Photonic sintering of polymer thick film conductor compositions
This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to photonic sintering. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to photonic sintering. The invention further provides devices containing electrical conductors made by these methods.
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
B22F 7/08 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxesSelection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
H05K 1/09 - Use of materials for the metallic pattern
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
This invention is directed to a polymer thick film conductive composition that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. The electrical circuit is subsequently subjected to an injection molding process.
2), magnesium oxide (MgO) and a mixture thereof; (ii) 5 to 30 parts by weight of a boron powder; and (iii) 0.1 to 10 parts by weight of a glass frit; dispersed in (iv) an organic vehicle; and firing the conductive paste in air.
A method of manufacturing a resistor paste comprising steps of: (a) preparing a basic resistor paste comprising, (i) a conductive powder, (ii) a first glass frit, and (iii) a first organic medium; and (b) preparing a glass paste as a TCR driver comprising, (iv) a second glass frit comprising manganese oxide, and (v) a second organic medium, (c) adding the glass paste to the basic resistor paste to obtain a resistor paste with a desired TCR.
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
58.
Polymer thick film solder alloy/metal conductor compositions
This invention provides a polymer thick film conductor composition comprising (a) a solder alloy powder selected from the group consisting of (i) a tin, silver, and copper alloy powder, (ii) a tin and bismuth alloy powder, and (iii) mixtures thereof, (b) a metal selected from the group consisting of silver, copper, gold, aluminum and mixtures thereof, and (c) an organic medium comprising a resin that is a vinyl co-polymer resin of vinylidene chloride and acrylonitrile or a phenoxy resin dissolved in an organic solvent, wherein the solder alloy powder and the metal are dispersed in the organic medium.
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
59.
Polymer thick film solder alloy conductor composition
The invention is directed to a polymer thick film composition comprising solder alloy powder and organic medium comprising organic polymeric binder and solvent. The composition may be processed at a time and temperature necessary to remove all solvent. The invention is further directed to method(s) of electrode formation on circuits using such compositions and to articles formed from such methods and/or compositions.
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
60.
Low temperature co-fired ceramic (LTCC) system in a package (SiP) configurations for microwave/millimeter wave packaging applications
A method is disclosed for forming a PDP front electrode by applying a particular type of photopolymerizable black paste, drying the black paste, and applying a particular type of photopolymerizable white paste on top of the dried black paste.
The invention relates to an electrode that can be formed by firing in air a conductive paste comprising a copper powder, a boron powder, an additional inorganic powder, a glass frit, and an organic medium, wherein the additional inorganic powder is zirconia powder.
The invention relates to an electrode that can be formed by firing in air a conductive paste comprising a copper powder, a boron powder, an additional inorganic powder, a glass frit, and an organic medium, wherein the additional inorganic powder is selected from the group consisting of silica powder, indium tin oxide powder, zinc oxide powder, alumina powder, and mixture thereof.
The present invention is directed to an electroconductive thick film paste composition comprising Ag and a Pb-free bismuth-tellurium oxide both dispersed in an organic medium, wherein the paste is fireable at temperatures below 420° C. The paste is especially useful for forming electrodes on substrates such as glass or films, particularly electrochromic glass or films, that would be damaged by higher firing temperatures. The present invention is further directed to a device comprising an electrode formed from the paste composition and, in particular, to an electrochromic device comprising such an electrode.
Disclosed herein is a multilayer low temperature co-fired ceramic (LTCC) structure comprising a multilayer low temperature co-fired ceramic comprising glass-ceramic dielectric layers with screen printed thick film inner conductors on portions of the layers and with thin film outer conductors deposited on the upper and lower outer surfaces of the LTCC. At least a portion of the thin film outer conductors is patterned in the form of lines and the spacings between the lines are less then 50 μm. Also disclosed is a process for making the LTCC structure.
H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
2 conductive material, 5 to 75% by weight Ag conductive material, 15 to 60% by weight glass frit and optionally up to 10% by weight copper oxide or precursor thereof, and up to 20% by weight bismuth oxide or precursor thereof.
tr) value between 0.75 and 1.50.
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
H01C 17/065 - Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick-film techniques, e.g. serigraphy
The present invention uses a silver/silver chloride composition and ink jet technology in the art of digital printing, especially for use in blood glucose sensors.
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
The invention is directed to a polymer thick film encapsulant composition comprising thermoplastic fluoropolymer resin and acrylic resin dissolved in organic solvents. The deposited encapsulant composition is processed at a time and energy sufficient to remove all solvent and form an encapsulant. The invention is further directed to using the encapsulant composition to form an encapsulant in PTC heater circuitry and, in particular, in PTC heater circuitry in mirror heater and seat heater applications.
C08L 27/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogenCompositions of derivatives of such polymers
B23K 13/08 - Electric supply or control circuits therefor
69.
Method of making non-hollow, non-fragmented spherical metal or metal alloy particles
The invention is directed to systems and methods for making non-hollow, non-fragmented spherical metal or metal alloy particles using diffusion dryers.
B22F 9/24 - Making metallic powder or suspensions thereofApparatus or devices specially adapted therefor using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
B22F 9/30 - Making metallic powder or suspensions thereofApparatus or devices specially adapted therefor using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
C22B 5/00 - General processes of reducing to metals
B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
B01J 2/02 - Processes or devices for granulating materials, in generalRendering particulate materials free flowing in general, e.g. making them hydrophobic by dividing the liquid material into drops, e.g. by spraying, and solidifying the drops
70.
UV-curable polymer thick film dielectric compositions with excellent adhesion to ITO
This invention provides a screen printable dielectric composition comprising finely divided particles of talc dispersed in a curable liquid composition containing an acrylated urethane resin oligomer, an alkyl acrylate, and phosphoric acid.
C08F 2/46 - Polymerisation initiated by wave energy or particle radiation
C08F 2/50 - Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
C08J 3/28 - Treatment by wave energy or particle radiation
H01B 3/30 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes
H01B 3/00 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties
H01B 3/02 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
71.
Polymer thick film encapsulant and enhanced stability PTC carbon system
The invention is directed to a polymer thick film encapsulant composition comprising thermoplastic fluoropolymer resin and acrylic resin dissolved in organic solvents. The deposited encapsulant composition is processed at a time and energy sufficient to remove all solvent and form an encapsulant. The invention is further directed to using the encapsulant composition to form an encapsulant in PTC heater circuitry and, in particular, in PTC heater circuitry in mirror heater and seat heater applications.
H01B 1/00 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors
72.
Method of manufacturing high frequency receiving and/or transmitting devices from low temperature co-fired ceramic materials and devices made therefrom
The invention relates to methods of forming high frequency receivers, transmitters and transceivers from Low Temperature Co-fired Ceramic (LTCC) materials. Two or more layers of a low k thick film dielectric tape and in contact with each other and two or more layers of a low k thick film dielectric tape and in contact with each other form a low k high k LTCC structure with improved properties and the ability to support economical mass production techniques for high frequency transceivers. The invention also relates to the LTCC receiving, transmitting and transceiving structures and the devices made from such structures.
A composition for forming transition vias and transition line conductors is disclosed for minimizing interface effects at electrical connections between dissimilar metal compositions. The composition has (a) inorganic components selected from the group consisting of (i) 20-45 wt % gold and 80-55 wt % silver and (ii) 100 wt % silver-gold solid solution alloys, and (b) an organic medium. The composition may also contain (c) 1-5 wt %, based upon the weight of the composition, of oxides or mixed oxides of metals selected from the group consisting of Cu, Co, Mg and Al and/or high viscosity glasses mainly containing refractory oxides. The composition may be used as a multi-layer composition in a via fill. Multi-layer circuits such as LTCC circuits and devices may also be formed using the composition for forming transition vias and transition line conductors.
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
2O α-oxide(s) and combinations thereof are present in the borosilicate glass composition. TCR values in the range of +/−100 ppm/° C. and R values of 100 ohms to 10 mega-ohms per square are obtained by resistors made from the paste composition.
H01B 1/20 - Conductive material dispersed in non-conductive organic material
C03C 8/02 - Frit compositions, i.e. in a powdered or comminuted form
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
76.
Polymer thick film silver electrode composition for use as a plating link
The invention is directed to a polymer thick film silver composition comprising: (a) conductive silver flakes and (b) an organic medium consisting of (1) acrylic organic polymeric binder; and (2) organic solvent. The composition may be processed at a time and energy sufficient to remove all solvent. The invention is further directed to novel method(s) of circuitry formation on printed wiring board constructions.
A low-resistance, fine electrode is formed by baking in air a photosensitive paste which has an inorganic component containing copper powder, boron powder, and glass frit, and an organic component containing a photopolymerization initiator, monomer, and organic vehicle, and in which the average particle size of the copper powder is 2.5 μm or less, and the content of boron powder based on the total amount of copper powder and boron powder is 8 to 25 wt %.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
G03F 7/028 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
Dispersed, crystalline, stable to oxidation copper particles are prepared in the absence of polymeric dispersants by rapidly reducing a Cu(I) salt with an Fe(II) carboxylic acid complex in water. The resulting microns sized copper powders contain only organics which decompose at temperatures low enough not to interfere with sintering processes and the formation of conductive copper structures.
B22F 9/24 - Making metallic powder or suspensions thereofApparatus or devices specially adapted therefor using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
79.
Photosensitive paste and process for production of pattern using the same
Disclosed is a photosensitive paste comprising a polymerizable monomer and a photopolymerization initiator, wherein the glass transition temperature of the polymerizable monomer is −10° C. or less. The present paste may be used for creating a fine pattern and prevents residue from remaining in the area where paste should be removed.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
Disclosed are thick film silver compositions comprised of silver flake and organic medium useful in radio frequency identification devices (RFID). The invention is further directed to method(s) of antenna formation using RFID circuits or other circuits using polymer thick film (PTF).
Described are LTCC devices, with external silver containing electrical contacts, that are sequentially plated with a nickel containing metal and a gold containing metal, with a defined silver paste composition for manufacture.
B32B 15/00 - Layered products essentially comprising metal
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
3 of diameter between 0.5 and 5 microns and a lead-free frit. The particles have had the lithium at or near primarily the surface of the particle at least partially exchanged for atoms of other metals.
H01B 1/08 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances oxides
C04B 35/622 - Forming processesProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products
84.
Co-processable photoimageable silver and corbon nanotube compositions and method for field emission devices
Described herein are methods of manufacturing an electrode and emitter in a field emission device, and devices formed from the methods. Compositions useful for the manufacture of an electrode and emitter in a field emission device are also described.
H01J 9/00 - Apparatus or processes specially adapted for the manufacture of electric discharge tubes, discharge lamps, or parts thereofRecovery of material from discharge tubes or lamps
85.
Resistor compositions using a Cu-containing glass frit
This invention relates to a composition using a ruthenium oxide and/or a polynary ruthenium oxide as conducting components and using a Cu containing glass frit.
3 of diameter between 0.5 and 5 microns and a lead-free frit. The particles have had the lithium at or near primarily the surface of the particle at least partially exchanged for atoms of other metals.
H01B 1/08 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances oxides
The black bus electrode of plasma display panel is formed from a conductive composition comprising a conductive powder, glass powder, organic binder, organic solvent, and black pigment, wherein the conductive powder is coated with metal selected from the group of Ru, Rh, Pd, Os, Ir, Pt and Au.
Dispersed uniform spherical silver particles were prepared in the absence of a protective colloid by rapidly mixing concentrated iso-ascorbic acid and silver-polyamine complex solutions.
B22F 9/24 - Making metallic powder or suspensions thereofApparatus or devices specially adapted therefor using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
90.
Conductor paste for ceramic substrate and electric circuit
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
A conductive paste for a solid electrolytic capacitor electrode contains an electroconductive powder having a mean particle size of no more than 1 μm and at least 90% thereof having a particle size of at least 0.3 μm; an organic binder; and a solvent.
This invention is related to thick film conductor compositions comprising electrically conductive gold powder, one or more glass frit or ceramic oxide compositions and an organic vehicle. It is further directed to the composition's uses for LTCC (low temperature co-fired ceramic) tape, for fabrication of multilayer electronic circuits and in high frequency microelectronic applications.
The present invention provides novel methods of forming component carriers, component modules, and the carriers and modules formed therefrom which utilize thick film technology. In some embodiments, these methods are used to form lighting device chip carriers and modules. In further embodiments, these lighting device chip carriers and modules are used in LED applications.
Disclosed is an improved process for making highly dispersible, spherical silver particles. In particular, the invention is directed to a process for making silver particles, which are very high solids and highly ordered. The silver particles formed are particularly useful in electronic applications.
This invention is related to thick film conductor compositions comprising electrically conductive gold powder, one or more glass frit or ceramic oxide compositions and an organic vehicle. It is further directed to the composition's uses for LTCC (low temperature co-fired ceramic) tape, for fabrication of multilayer electronic circuits and in high frequency microelectronic applications.
H01B 1/00 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors
H01B 1/12 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances organic substances
96.
Thick film conductor compositions and the use thereof in LTCC circuits and devices
The present invention is directed to a thick film composition for use in low temperature co-fired ceramic circuits comprising, based on weight percent total thick film composition: (a) 30-98 weight percent finely divided particles selected from noble metals, alloys of noble metals and mixtures thereof; (b) one or more selected inorganic binders and/or mixtures thereof, and dispersed in (c) organic medium, and wherein said glass compositions are immiscible or partially miscible with remnant glasses present in the low temperature co-fired ceramic substrate glasses at the firing conditions.
The present invention is further directed to methods of forming multilayer circuits utilizing the above composition and the use of the composition in high frequency applications (including microwave applications).
The invention relates to thick film conductor compositions which are useful in application to both via-fill and/or line conductors to manufacture of Low Temperature Co-fireable Ceramic (LTCC) devices and other Multilayer Interconnect (MLI) ceramic composite circuits such as Photosensitive Tape On Substrates (PTOS); gold, silver and mixed metal multilayer circuits and devices. The invention is useful for forming microwave and other high frequency circuit components selected from the group comprising: antenna, filters, baluns, beam former, I/O's, couplers, via feedthroughs, EM coupled feedthroughs, wirebond connection, and transmission lines.
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
98.
Lead free glass(es), thick film paste(s), tape composition(s) and low temperature cofired ceramic devices made therefrom
C03C 10/00 - Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
C03C 3/068 - Glass compositions containing silica with less than 40% silica by weight containing boron containing rare earths
The present invention is directed to the use of a thick film paste composition comprising, in weight percent total paste composition, materials selected from mixtures of lead iron tungstate niobate solid solutions 30 to 80%, calcined mixtures of barium titanate, lead oxide and fused silica 20 to 70%, barium titanate 30 to 50%, calcined mixtures of barium titanate 30 to 50%, barium titanate and calcined mixtures of barium titanate 30 to 50%, lead oxide and fused silica 50-80%, and a lead germanate glass 3-20%, as a thick film paste via fill composition for use in the formation of multilayer low temperature cofired ceramic circuits.
The present invention relates to a thick film composition comprising: a) functional component; b) PVDF/HFP polymer resin, a copolymer of PVDF/HFP polymer resin, or mixtures thereof; dissolved in c) organic solvent, with the provisos that the PVDF/HFP resin has i) a melt viscosity of 0.2-0.7 kPoise and ii) a DSC melt temperature in the range of 85-98° C.
H01B 1/20 - Conductive material dispersed in non-conductive organic material
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
H01J 1/62 - Luminescent screensSelection of materials for luminescent coatings on vessels
