Abstract

The present invention aims to provide a method for producing a water-absorbing resin having excellent water absorption performance with high productivity. The present invention relates to a method for producing a water-absorbing resin that forms a physical gel upon absorption of water, the method including: (a1) reducing the molecular weight of a starch to obtain a partially degraded starch; (a2) introducing an acidic group into the partially degraded starch obtained in (a1) to obtain a water-soluble polymer; and (a3) drying the water-soluble polymer at 70° C. to 180° C. in the presence of water so that it has a solid content of 90% or more.

IPC Classes  ?

• B01J 20/24 - Naturally occurring macromolecular compounds, e.g. humic acids or their derivatives
• B01J 20/30 - Processes for preparing, regenerating or reactivating
• C08B 30/12 - Degraded or non-chemically modified starchBleaching of starch
• C08B 31/04 - Esters of organic acids
• C08B 31/12 - Ethers having alkyl or cycloalkyl radicals substituted by hetero atoms

Abstract

Provided is a method for efficiently recovering polyester from a polyester composite material containing polyester and a resin material other than polyester. This polyester substrate recovery method comprises a step for inducing contact between: a polyester composite material containing a polyester substrate and an easily degradable crosslinked layer; and a solution containing an oxidant.

IPC Classes  ?

• B29B 17/02 - Separating plastics from other materials
• B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
• B32B 38/18 - Handling of layers or the laminate
• C08F 8/30 - Introducing nitrogen atoms or nitrogen-containing groups

Abstract

An endotoxin adsorbent comprising a silica monolith having a nitrogen atom-containing cationic group has a sufficient ET adsorption capacity in practice. The silica monolith may have through-holes interconnected therein, and the ends of the through-holes are open to the outside of the silica monolith. The nitrogen atom-containing cationic group is bonded to the silica monolith through or without a spacer or a crosslinking agent.

IPC Classes  ?

• B01J 39/09 - Inorganic material
• B01J 20/10 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof comprising inorganic material comprising silica or silicate
• C08B 37/00 - Preparation of polysaccharides not provided for in groups Derivatives thereof

Abstract

501050105050 is 0.9-1.5.

IPC Classes  ?

• C09D 17/00 - Pigment pastes, e.g. for mixing in paints
• C08K 9/06 - Ingredients treated with organic substances with silicon-containing compounds
• C08L 101/00 - Compositions of unspecified macromolecular compounds
• C09C 1/36 - Compounds of titanium
• C09C 3/12 - Treatment with organosilicon compounds
• C09D 7/62 - Additives non-macromolecular inorganic modified by treatment with other compounds
• C09D 201/00 - Coating compositions based on unspecified macromolecular compounds

Abstract

The present invention relates to a thermosetting sealing sheet which includes at least a first layer and is used for sealing a mounting structure including a first circuit member and a plurality of second circuit members mounted on the first circuit member. The first layer is composed of a first thermosetting resin composition. The first thermosetting resin composition contains a first filler. The first filler includes non-spherical particles. A gap is interposed between the first circuit member and the second circuit member. The average distance L between the first circuit member and the second circuit member and the average value Dma of the maximum diameters Dm of the non-spherical particles satisfy Dma/L≥0.1.

IPC Classes  ?

• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H03H 3/08 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
• H03H 9/25 - Constructional features of resonators using surface acoustic waves

Abstract

The present invention aims to provide a thermosetting resin composition that has a low refractive index after curing and can also form a thick film. The present invention relates to a thermosetting resin composition containing, based on the solid content thereof: (A) 1 to 35% by weight of a polysiloxane that is a hydrolysis condensation product of a methyltrialkoxysilane and tetraethoxysilane and has a weight average molecular weight of 10,000 to 100,000; and (B) 65 to 99% by weight of a moniliform silica.

IPC Classes  ?

• C08L 83/04 - Polysiloxanes
• C08G 77/08 - Preparatory processes characterised by the catalysts used
• C08K 3/36 - Silica

Abstract

An objective of the present invention is to provide a conductive composition useful for manufacturing a conductive laminate that undergoes a small change in conductivity over time. The conductive composition contains a carbon nanotube (A), a dispersant (B), and a phenol (C), wherein the phenol (C) has a carboxyl group or an alkoxycarbonyl group that may have a hetero atom, and the molecular weight thereof is 100-1000.

IPC Classes  ?

• H01B 1/24 - Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon, or silicon

Abstract

Provided is an adhesive obtained by combining a base agent and a curing agent, wherein the degree of biomass is not less than 50%, the base agent includes a sorbitol-type epoxy resin, and the shear adhesive strength of a cured product obtained by curing the adhesive at a temperature of 20-50°C is not less than 5 MPa, said shear adhesive strength being measured at a temperature of 25°C and at a tensile speed of 5mm/min using JIS K 6850 as a related test method.

IPC Classes  ?

• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins

Abstract

Provided are a method for manufacturing a three-dimensional-shaped article and an ink set for production of a three-dimensional-shaped article which make it possible to manufacture a three-dimensional-shaped article with good shaping precision, even when manufacturing a three-dimensional-shaped article that has a complex shape and that is made from a soft material, for example. The present invention relates to a method for manufacturing a three-dimensional-shaped article, said method comprising: a step for respectively discharging (a) a model material ink which contains an ion-crosslinkable polymer and (b) a support material ink which contains a support material and a crosslinking factor; a step for curing the discharged ion-crosslinkable polymer; and a step for removing a shaped article of the support material ink.

IPC Classes  ?

• B29C 64/106 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
• B29C 64/40 - Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof
• B33Y 70/00 - Materials specially adapted for additive manufacturing

Abstract

123181234567812121233 is different, and/or (c-2) at least one Z having an asymmetric structure Z is included.

IPC Classes  ?

• C08G 83/00 - Macromolecular compounds not provided for in groups
• C08L 101/00 - Compositions of unspecified macromolecular compounds

Abstract

The purpose of the present invention is to provide a degradable compound having high solubility in a solvent and not being susceptible to precipitation. The present invention relates to a degradable compound represented by formula (1). In formula (1): n ≥ 0, k ≥ 0, m ≥ 0, p1 ≥ 1, p2 ≥ 1, and p3 ≥ 1; R1, R2, and R3are independently a hydrocarbon group, a group containing a siloxane structure, or a single bond; Z1and Z2are independently a hydrocarbon group or a group containing a siloxane structure; At least one item selected from the group consisting of R1, R2, and R3, and/or at least one molecular weight selected from the group consisting of Z1and Z2is 200 or more; Q1, Q2, and Q3are independently a reactive functional group, or hydrogen or halogen; and A1to A8are independently a carbonyl group or a single bond, at least one of A1and A2is a carbonyl group, at least one of A3and A4is a carbonyl group, at least one of A5and A6is a carbonyl group, and at least one of A7and A8 is a carbonyl group.)

IPC Classes  ?

• C08G 83/00 - Macromolecular compounds not provided for in groups
• C08L 101/00 - Compositions of unspecified macromolecular compounds

Abstract

Provided is a thermosetting epoxy resin composition containing a main agent and a curing agent, wherein the biomass degree is 50% or more, and the main agent contains a sorbitol-type epoxy resin and can form a cured product having a glass transition temperature of 90°C or higher.

IPC Classes  ?

• C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
• C08J 5/04 - Reinforcing macromolecular compounds with loose or coherent fibrous material

Abstract

The present invention provides a method for producing a water-soluble polymer with high production efficiency, and a method for producing a water-absorbing resin having excellent water absorption performance. The present invention relates to a method for producing a water-soluble polymer, comprising: (a1) reducing the molecular weight of a starch to obtain a partially degraded starch; and (a2) introducing an ionic functional group into the partially degraded starch obtained in the step (a1).

IPC Classes  ?

• B01J 20/24 - Naturally occurring macromolecular compounds, e.g. humic acids or their derivatives
• B01J 20/30 - Processes for preparing, regenerating or reactivating
• C08B 30/20 - Amylose or amylopectin
• C08B 31/00 - Preparation of chemical derivatives of starch
• C08B 31/12 - Ethers having alkyl or cycloalkyl radicals substituted by hetero atoms

Abstract

Provided is a resin composition for three-dimensional photofabrication which, after curing, melts at a relatively low temperature of about 200° C. and which is excellent in fabricability. The present invention relates to a resin composition for three-dimensional photofabrication, containing a reactive material having in a molecule thereof an acetal structure and a crosslinkable double bond.

IPC Classes  ?

• C08L 33/08 - Homopolymers or copolymers of acrylic acid esters
• B22C 9/10 - CoresManufacture or installation of cores
• B29C 64/124 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
• B29L 31/00 - Other particular articles
• B33Y 10/00 - Processes of additive manufacturing
• B33Y 70/00 - Materials specially adapted for additive manufacturing
• B33Y 80/00 - Products made by additive manufacturing
• C08K 5/13 - PhenolsPhenolates
• C08K 5/37 - Thiols
• C08K 5/5397 - Phosphine oxides

Abstract

According to the present invention, a conductive composition containing a carbon material improves filter filterability while maintaining conductivity. The present invention pertains to a conductive composition comprising a carbon material, a dispersant, and a solvent, wherein: the cumulative particle diameter D50 measured by a dynamic light scattering method is at most 200 nm; and the surface resistivity of a coating film formed with a film thickness of 1-100 nm is at most 1×1010 Ω/□.

IPC Classes  ?

• H01B 1/24 - Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon, or silicon
• B32B 7/025 - Electric or magnetic properties
• B32B 27/00 - Layered products essentially comprising synthetic resin
• C09J 7/38 - Pressure-sensitive adhesives [PSA]
• H01B 5/14 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
• H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables

Abstract

The purpose of the present invention is to provide a degradable crosslinking agent having an excellent degradation rate. The present invention pertains to a degradable crosslinking agent comprising a compound represented by formula (1). After crosslinking, the degradable crosslinking agent produces, through a reaction with an oxidizing agent, a water-soluble decomposition product that is a Z-containing carboxylic acid, alcohol, amine, or thiol, and that has a solubility to water of at least 30 g/L. In formula (1), • n≥1, k≥0, m≥0, p1≥1, p2≥1, and p3≥1 are satisfied. • R1, R2, and R3each independently represent a single bond or a hydrocarbon group that has 1-500 carbon atoms and that optionally has a substituent or a heteroatom. • Q1, Q2, and Q3 each independently represent at least one reactive functional group selected from the group consisting of a hydroxyl group, an amino group, a thiol group, a hydrazide group, a carboxylic acid group, an acid anhydride group, a vinyl group, an allyl group, an acrylate group, a methacrylate group, a crotonate group, an isoprenyl group, an acrylamide group, a methacrylamide group, a crotonamide group, an epoxy group, an oxetane group, an oxazoline group, an isocyanate group, a carbodiimide group, a methylol group, a silanol group, a hydroxysilyl group, and an alkoxysilyl group. • Each A independently represents a carbonyl group or a single bond. • Each Z independently represents a group having a valance of two or more and including a siloxane structure, or a hydrocarbon group having 1-500 carbon atoms and optionally having a heteroatom.

IPC Classes  ?

• C08L 101/00 - Compositions of unspecified macromolecular compounds
• C07C 271/12 - Esters of carbamic acids having oxygen atoms of carbamate groups bound to acyclic carbon atoms with the nitrogen atoms of the carbamate groups bound to hydrogen atoms or to acyclic carbon atoms to hydrogen atoms or to carbon atoms of unsubstituted hydrocarbon radicals
• C08F 16/28 - Monomers containing nitrogen
• C08F 20/60 - Amides containing nitrogen in addition to the carbonamido nitrogen

Abstract

The present invention provides a degradable crosslinking agent having high solubility in a solvent. The present invention pertains to a degradable crosslinking agent comprising a compound represented by formula (1). In formula (1), ∙ n≥0, k≥0, m≥0, p1≥1, p2≥1, and p3≥1. ∙ R1, R2, and R3are each independently a single bond or a C1-C500 hydrocarbon which may have a substituent or a heteroatom. ∙ Q1, Q2, and Q3are each independently at least one reactive functional group selected from the group consisting of a hydroxyl group, an amino group, a thiol group, a hydrazide group, a carboxylic acid group, an acid anhydride group, a vinyl group, an allyl group, an acrylate group a methacrylate group, a crotonate group, an isoprenyl group, an acrylamide group, a methacrylamide group, a crotonamide group, an epoxy group, an oxetane group, an oxazoline group, an isocyanate group, a carbodiimide group, a methylol group, a silanol group, a hydroxysilyl group, and an alkoxysilyl group. ∙ X1a, X1b, X2a, X2b, X3a, X3b, X4a, and X4bare each independently an oxygen atom, a sulfur atom, a single bond, a C1-C20 hydrocarbon group which may have a substituent, or –NB- (B is a hydrogen atom or a hydrocarbon group), where at least one among X1a, X1b, X2a, X2b, X3a, X3b, X4a, and X4bis an oxygen atom, a sulfur atom, or –NB- (B is a hydrogen atom or a hydrocarbon group). ∙ A1-A8are carbonyl groups or single bonds, at least one among A1and A2is a carbonyl group, at least one among A3and A4is a carbonyl group, at least one among A5and A6is a carbonyl group, and at least one among A7and A8 is a carbonyl group. ∙ Zs are each independently a di- or higher-valent group containing a siloxane structure or a C1-C500 hydrocarbon group which may have a heteroatom.

IPC Classes  ?

• C08L 101/00 - Compositions of unspecified macromolecular compounds
• C07C 271/12 - Esters of carbamic acids having oxygen atoms of carbamate groups bound to acyclic carbon atoms with the nitrogen atoms of the carbamate groups bound to hydrogen atoms or to acyclic carbon atoms to hydrogen atoms or to carbon atoms of unsubstituted hydrocarbon radicals
• C08K 5/24 - Derivatives of hydrazine

Abstract

The present invention provides a water-absorbing resin that is excellent in water absorption performance and is easy to be degraded. The present invention relates to a water-absorbing resin, which is a crosslinked product of a glucose polymer and forms a physical gel upon absorption of water, wherein the glucose polymer is a starch or a partially degraded starch, with an acidic group introduced therein.

IPC Classes  ?

• C08J 3/075 - Macromolecular gels
• C08J 11/10 - Recovery or working-up of waste materials of polymers by chemically breaking down the molecular chains of polymers or breaking of crosslinks, e.g. devulcanisation

Abstract

Provided is a resin composition capable of providing a three-dimensionally photofabricated object having high heat resistance while having water solubility. The resin composition is a resin composition for three-dimensional photofabrication containing a reactive monomer, a water-soluble polymer, and a photopolymerization initiator. A cured product of the resin composition has a main tan δ peak temperature of 80° C. or higher. A 1-mm-thick cured product of the resin composition exhibits a remaining thickness of 0.7 mm or smaller after 5-hour immersion in water that is at room temperature.

IPC Classes  ?

• C08F 283/06 - Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass on to polyethers, polyoxymethylenes or polyacetals
• B29C 33/38 - Moulds or coresDetails thereof or accessories therefor characterised by the material or the manufacturing process
• B29C 33/76 - Cores
• B29C 45/26 - Moulds
• B29C 64/35 - Cleaning
• B33Y 10/00 - Processes of additive manufacturing
• B33Y 40/20 - Post-treatment, e.g. curing, coating or polishing
• B33Y 70/00 - Materials specially adapted for additive manufacturing
• B33Y 80/00 - Products made by additive manufacturing
• C08F 283/02 - Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass on to polycarbonates or saturated polyesters
• C09D 151/08 - Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsCoating compositions based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds

Abstract

Provided is a photocurable resin composition including a reactive compound, and a photopolymerization initiator. A cured product of the photocurable resin composition has two or more glass transition points including a TgA and a TgB. The TgA is less than 25° C., and the TgB is 25° C. or more. An elongation at break in accordance with ASTM D638 of the cured product of the photocurable resin composition is 130% or more, and a breaking strength in accordance with ASTM D638 of the cured product of the photocurable resin composition is 3 MPa or more.

IPC Classes  ?

• C08F 2/48 - Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
• B29C 64/129 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
• B33Y 10/00 - Processes of additive manufacturing

Abstract

A method for sealing an electronic component mounting substrate including: preparing an electronic component mounting substrate including a substrate and electronic components mounted thereon and having a space between an electronic component and the substrate; placing a thermosetting sheet on the electronic component mounting substrate; and heat-molding the placed thermosetting sheet, to allow a melt of the thermosetting sheet to fill the space between the electronic component and the substrate and be cured. When a distance between the center of the substrate and an optional point P on a frame line that surrounds all the electronic components and minimizes the surrounded area is denoted by Lp, a distance Lq between the center of the substrate and a point Q at which a straight line passing through the point P and the center of the substrate intersects with an outer periphery of the thermosetting sheet is 0.9Lp or more.

IPC Classes  ?

• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

The present invention provides a method for manufacturing a three-dimensional shaped article and an inset for production of a three-dimensional shaped article which make it possible to produce a three-dimensional shaped article with good shaping precision, even when producing a three-dimensional shaped article that has a complex shape and that is made from a soft material, for example. The present invention relates to a method for manufacturing a three-dimensional shaped article, said method comprising: a step for respectively discharging (a) a model material ink which contains a photo-crosslinkable polymer and (b) a support material ink which contains a support material and a first crosslinking factor; a step for photo-curing the discharged photo-crosslinkable polymer; and a step for removing a molded article of the support material ink.

IPC Classes  ?

• B29C 64/40 - Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof
• B29C 64/112 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
• B33Y 10/00 - Processes of additive manufacturing
• B33Y 70/00 - Materials specially adapted for additive manufacturing

Abstract

The present invention provides an absorbent article that contains a water absorbent resin having excellent water absorption performance. The present invention relates to an absorbent article that contains a water absorbent resin comprising a water-soluble polymer in which an acidic group is introduced into starch or a partial degradation product thereof.

IPC Classes  ?

• C08B 31/10 - Alkyl or cycloalkyl ethers
• A61F 13/53 - Absorbent pads, e.g. sanitary towels, swabs or tampons for external or internal application to the bodySupporting or fastening means thereforTampon applicators characterised by the absorbing medium
• A61K 47/36 - PolysaccharidesDerivatives thereof, e.g. gums, starch, alginate, dextrin, hyaluronic acid, chitosan, inulin, agar or pectin
• A61L 27/20 - Polysaccharides
• B01J 20/26 - Synthetic macromolecular compounds
• A23L 5/00 - Preparation or treatment of foods or foodstuffs, in generalFood or foodstuffs obtained therebyMaterials therefor
• A61L 15/22 - Bandages, dressings or absorbent pads for physiological fluids such as urine or blood, e.g. sanitary towels, tampons containing macromolecular materials

Abstract

A sheet for molding/underfill encapsulation of a printed circuit board comprising a plurality of electronic components and a substrate and having spaces between the electronic components and the substrate, the sheet being made of a heat-curable resin composition. When examined at 125°C over 150 seconds, the sheet has an increase in viscosity, which is a ratio (V90/V0) of the viscosity V90 measured at 90 seconds after initiation of the examination of the sheet to the viscosity V0 measured at 0 second thereafter, of less than 9.

IPC Classes  ?

• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• C08L 101/00 - Compositions of unspecified macromolecular compounds
• C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

The present invention provides a method for manufacturing a three-dimensional object and an ink set for manufacturing a three-dimensional object, whereby it is possible to manufacture a three-dimensional object with good modeling accuracy, for example, even when manufacturing a complex-shaped three-dimensional object made of soft materials. The present invention pertains to a method for manufacturing a three-dimensional object, the method comprising the steps of: discharging (a) a modelling material ink containing a crosslinkable polymer and (b) a support material ink containing a support material, respectively; and removing an object from the support material ink after crosslinking the crosslinkable polymer, wherein either one of the modelling material ink (a) and the support material ink (b) further contains a hydrogen peroxide decomposer, the other further contains hydrogen peroxide or a hydrogen peroxide donor, and the discharged hydrogen peroxide decomposer decomposes discharged hydrogen peroxide and crosslinks the crosslinkable polymer, thereby creating a three-dimensional object.

IPC Classes  ?

• B29C 64/112 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
• B29C 64/314 - Preparation
• B29C 64/40 - Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof
• B33Y 10/00 - Processes of additive manufacturing
• B33Y 70/00 - Materials specially adapted for additive manufacturing

Abstract

The present invention addresses the problem of providing a water-soluble adhesive composition for component capture and a water-soluble adhesive sheet for component capture that have exceptional shock-absorbing properties and tackiness/adhesiveness and are suited to capture of components, and providing a method for producing an electronic component that enables highly precise and efficient production using this composition and sheet.　In order to solve this problem, provided are: a composition that contains (A) a water-soluble adhesive agent and (B) a water-soluble plasticizer (excluding the component (A)), the (B) water-soluble plasticizer having a viscosity of 50,000 mPa∙s or lower at normal temperature (25°C), and the ratio ((B)/(A)) of the content value for the (B) water-soluble plasticizer to the content value for the (A) water-soluble adhesive agent being greater than 0.5 and not greater than 3.0; and a sheet including this composition.　According to the present invention: the shock-absorbing properties and tackiness/adhesiveness improve; the occurrence of damage or misalignment of components (elements), especially during, inter alia, production of semiconductor elements, is suppressed; and the sheet of the present invention in particular is easy to handle during attachment and detachment.

IPC Classes  ?

• C09J 11/06 - Non-macromolecular additives organic
• C09J 129/04 - Polyvinyl alcoholPartially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
• C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
• C09J 139/06 - Homopolymers or copolymers of N-vinyl-pyrrolidones
• C09J 201/00 - Adhesives based on unspecified macromolecular compounds
• C09J 7/38 - Pressure-sensitive adhesives [PSA]
• H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups or
• H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
• H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof

Abstract

According to the present invention, an endotoxin adsorbent comprising a silica monolith having a cation group including a nitrogen atom has an ET adsorption capacity that is practically sufficient. The silica monolith can have a communicating through-hole inside, and the ends of the through-hole can be open toward the outside of the silica monolith. The cation group including the nitrogen atom is coupled to the silica monolith with or without a spacer or a cross-linker interposed.

IPC Classes  ?

• B01D 15/00 - Separating processes involving the treatment of liquids with solid sorbentsApparatus therefor
• B01J 20/22 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof comprising organic material
• B01J 20/26 - Synthetic macromolecular compounds
• B01J 20/30 - Processes for preparing, regenerating or reactivating
• A23L 5/20 - Removal of unwanted matter, e.g. deodorisation or detoxification
• C02F 1/28 - Treatment of water, waste water, or sewage by sorption

Abstract

The purpose of the present invention is to provide a method for producing a water absorbent resin that has high production efficiency and excellent water absorbing capability. The present invention pertains to a method for producing a water absorbent resin that forms a physical gel through water absorption, the method comprising: a step (a1) for obtaining a partial degradation product of starch by lowering the molecular weight of starch; a step (a2) for obtaining a water-soluble polymer by introducing an acidic group to the partial degradation product of starch obtained in the step (a1); and a step (a3) for drying the water-soluble polymer in the presence of water at 70-180°C so as to achieve a solid content of 90% or more.

IPC Classes  ?

• C08B 31/12 - Ethers having alkyl or cycloalkyl radicals substituted by hetero atoms
• A61F 13/15 - Absorbent pads, e.g. sanitary towels, swabs or tampons for external or internal application to the bodySupporting or fastening means thereforTampon applicators
• A61F 13/53 - Absorbent pads, e.g. sanitary towels, swabs or tampons for external or internal application to the bodySupporting or fastening means thereforTampon applicators characterised by the absorbing medium
• C08B 31/04 - Esters of organic acids

Abstract

The present invention provides a cathode mixture that can be suitably used in a cathode mixture layer of an all-solid-state lithium-sulfur battery having an excellent charge/discharge capacity and a method of producing the cathode mixture, by maximally utilizing excellent physical properties of sulfur. The present invention relates to a positive electrode mixture for composite all-solid-state lithium-sulfur batteries, the positive electrode mixture containing sulfur or its discharge product (A); phosphorus pentasulfide (B); conductive carbon (C); and lithium halide (D) at a weight ratio of A:B:C:D of 40-60:15-35:5-20:16-30, wherein a peak at 50 ppm in 31P-MAS NMR has a relative intensity of 40% or less.

IPC Classes  ?

• H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
• H01M 10/052 - Li-accumulators
• H01M 4/38 - Selection of substances as active materials, active masses, active liquids of elements or alloys
• H01M 4/58 - Selection of substances as active materials, active masses, active liquids of inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFySelection of substances as active materials, active masses, active liquids of polyanionic structures, e.g. phosphates, silicates or borates

Abstract

The purpose of the present invention is to provide a thermosetting resin composition which has a low refractive index after curing and is capable of forming a thick film. The present invention relates to a thermosetting resin composition which contains (A) a polysiloxane that is a hydrolysis-condensation product of methyltrialkoxysilane and tetraethoxysilane and has a weight average molecular weight of 10,000 to 100,000 in an amount of 1 to 35% by weight of the solid content, and (B) beaded silica in an amount of 65 to 99% by weight of the solid content.

IPC Classes  ?

• C08L 83/04 - Polysiloxanes
• B32B 27/00 - Layered products essentially comprising synthetic resin
• C08K 3/36 - Silica

Abstract

The purpose of the present invention is to provide a thermosetting resin composition that has high impregnation property for an insulating sheet and excellent mechanical properties without causing cracks after curing. The present invention relates to a thermosetting resin composition containing a glycidyl ether compound (a), a diluent (b) and at least one latent curing agent (c) selected from the group consisting of a boron trichloride amine complex, a boron trifluoride amine complex and zinc octylate, wherein, per 100 parts by mass of the glycidyl ether compound (a), the amount of the diluent (b) is 1 part by mass or more and less than 30 parts by mass and the amount of the latent curing agent (c) is 0.0005-5 parts by mass.

IPC Classes  ?

• C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
• H01B 17/60 - Composite insulating bodies
• C08K 5/098 - Metal salts of carboxylic acids
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08K 3/38 - Boron-containing compounds

Abstract

A cell treatment agent containing alginate sulfate as an active ingredient, and a set reagent for activating suspended or dormant cells, which is a combination reagent of the cell treatment agent and an activator containing polyvalent cations are provided.

IPC Classes  ?

• C12N 5/00 - Undifferentiated human, animal or plant cells, e.g. cell linesTissuesCultivation or maintenance thereofCulture media therefor

Abstract

Provided is a resin composition for three-dimensional photoshaping that melts at a comparatively low temperature of about 200°C after curing and has exceptional shapeability. The present invention relates to a resin composition for three-dimensional photoshaping that includes a reactive material having an acetal structure and a crosslinkable double bond in each molecule.

IPC Classes  ?

• C08F 20/28 - Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
• B33Y 10/00 - Processes of additive manufacturing
• B33Y 80/00 - Products made by additive manufacturing
• B22C 9/04 - Use of lost patterns
• B29C 64/124 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
• B29C 64/314 - Preparation
• B33Y 70/00 - Materials specially adapted for additive manufacturing

Abstract

The present invention provides a method for producing a molded article that has excellent airtightness and excellent adhesion between a thermoplastic resin composition and a member that is formed of a metal or a ceramic, the method being considerably suppressed in flowing out of a pre-gelled epoxy resin composition due to the temperature and pressure during insert molding. A method for producing a molded article, the method comprising: (1) a step in which an epoxy resin composition is applied to the surface of an insert member that is formed of a metal or a ceramic, thereby forming an epoxy resin composition layer; (2) a step in which the insert member obtained in the step (1) is heated, thereby pre-gelling the epoxy resin composition; and (3) a step in which the insert member obtained in the step (2) is arranged within a mold and a thermoplastic resin composition is insert molded on the epoxy resin composition layer, so that the epoxy resin composition is cured. With respect to this method for producing a molded article, the epoxy resin composition contains 1 to 80 parts by mass of a pre-gelling agent relative to 100 parts by mass of an epoxy resin.

IPC Classes  ?

• B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles

Abstract

A composition for bonding that comprises component (A), which is a first polymerizable monomer, component (B), which is a rubber component, component (C), which is a polymer component having a first reactive functional group, and component (D), which is a polymerization initiator. The component (A) contains the components (B) and (C) dissolved therein.

IPC Classes  ?

• C09J 4/02 - Acrylmonomers
• B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
• B32B 25/04 - Layered products essentially comprising natural or synthetic rubber comprising rubber as the main or only constituent of a layer, next to another layer of a specific substance
• C09D 4/02 - Acrylmonomers
• C09D 5/00 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects producedFilling pastes
• C09D 121/00 - Coating compositions based on unspecified rubbers
• C09D 201/00 - Coating compositions based on unspecified macromolecular compounds
• C09J 5/02 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
• C09J 121/00 - Adhesives based on unspecified rubbers
• C09J 201/00 - Adhesives based on unspecified macromolecular compounds

Abstract

The present invention provides a water-absorbent resin having excellent water-absorbing performance and water-retaining performance and high production efficiency. The present invention relates to a water-absorbent resin including a crosslinked product of a water-soluble polymer obtained by introducing an acidic group into a partial decomposition product of starch having a weight average molecular weight of 7.5 million or less.

IPC Classes  ?

• C08B 31/12 - Ethers having alkyl or cycloalkyl radicals substituted by hetero atoms
• C08L 3/08 - Ethers
• C12P 19/14 - Preparation of compounds containing saccharide radicals produced by the action of a carbohydrase, e.g. by alpha-amylase

Abstract

Provided is an enzyme composition that has little foreign substances and enables the production of a food having excellent flavor and texture. This enzyme composition for a food contains a peptidase and has substantially no foreign activity.

IPC Classes  ?

• C12N 9/52 - Proteinases derived from bacteria
• A23C 13/00 - CreamCream preparationsMaking thereof
• A23L 5/00 - Preparation or treatment of foods or foodstuffs, in generalFood or foodstuffs obtained therebyMaterials therefor
• A23L 13/00 - Meat productsMeat mealPreparation or treatment thereof
• A23L 15/00 - Egg productsPreparation or treatment thereof
• A23L 17/00 - Food-from-the-sea productsFish productsFish mealFish-egg substitutesPreparation or treatment thereof

Abstract

The present invention provides a method for highly efficiently producing a water-soluble polymer and a method for producing a water-absorbing resin having excellent ability to absorb water. The method for producing a water-soluble polymer comprises step (a1) in which starch is reduced in molecular weight to thereby obtain a partial-starch-decomposition product and step (a2) in which an ionic functional group is introduced into the partial-starch-decomposition product obtained in the step (a1).

IPC Classes  ?

• C08B 31/12 - Ethers having alkyl or cycloalkyl radicals substituted by hetero atoms
• C08H 99/00 - Subject matter not provided for in other groups of this subclass

Abstract

The present invention provides a water-absorbing resin that has excellent water-absorbing performance and that easily degrades. The present invention relates to a water-absorbing resin: which is a crosslinked product of a glucose polymer having an acidic group introduced to starch or a starch partial decomposition product; and which forms a physical gel by absorbing water.

IPC Classes  ?

• C08B 31/12 - Ethers having alkyl or cycloalkyl radicals substituted by hetero atoms
• C08L 3/08 - Ethers
• C12P 19/14 - Preparation of compounds containing saccharide radicals produced by the action of a carbohydrase, e.g. by alpha-amylase

Abstract

[Problem] To provide a multi-layer sheet for mold underfill encapsulation, which exhibits good infiltrability between electrodes. [Solution] In order to solve the aforementioned problem, the present invention provides a multi-layer sheet for mold underfill encapsulation, which is characterized by having provided as an outermost layer thereof an (A) layer that comprises a resin composition having a local maximum loss tangent (tan δ) value of 3 or more at a measurement temperature of 125° C. for a measurement time of 0-100 seconds.

IPC Classes  ?

• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Abstract

3s are present, they may be different from one another; and a, b, c, and d are numbers satisfying the following conditions: 0.001≤a≤1.00, 0≤b≤0.999, 0≤c≤0.30, 0≤d≤0.30, and a+b+c+d=1.0; and (B) a fine particulate inorganic oxide, wherein the ratio by weight of the sum of the polysiloxane resin (A) and optionally an alkoxysilane compound and a curable resin to the fine particulate inorganic oxide (B) is 0.2 to 2.5.

IPC Classes  ?

• C09D 183/04 - Polysiloxanes
• C08K 3/22 - OxidesHydroxides of metals
• C08K 5/5419 - Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
• C08L 83/04 - Polysiloxanes
• B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
• B29K 83/00 - Use of polymers having silicon, with or without sulfur, nitrogen, oxygen or carbon only, in the main chain, as moulding material
• B29K 105/16 - Fillers
• B29K 509/02 - Ceramics

Abstract

m− represents a polyoxometalate anion; m represents an integer of 1 to 20; n represents an integer of 1 to 20, provided that n is determined such that the charge of the whole formula (I) becomes zero).

IPC Classes  ?

• C07F 11/00 - Compounds containing elements of Groups 6 or 16 of the Periodic Table
• C09B 23/04 - Methine or polymethine dyes, e.g. cyanine dyes characterised by the methine chain containing an odd number of CH groups one CH group, e.g. cyanines, isocyanines, pseudocyanines
• C09B 23/08 - Methine or polymethine dyes, e.g. cyanine dyes characterised by the methine chain containing an odd number of CH groups more than three CH groups, e.g. polycarbocyanines
• G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
• H10K 85/60 - Organic compounds having low molecular weight
• G02B 5/22 - Absorbing filters

Abstract

Provided is a resin composition which is water-soluble and nevertheless can produce highly heat-resistant, three-dimensional photoshaped object. This resin composition for three-dimensional photoshaping comprises a reactive monomer, a water-soluble polymer, and a photopolymerization initiator, and gives a cured object having a tanδ main-peak temperature of 80°C or higher and gives a 1-mm-thick cured object which, after having been immersed in room-temperature water for five hours, has a residual thickness of 0.7 mm or less.

IPC Classes  ?

• C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
• B29C 64/106 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
• B29C 64/35 - Cleaning
• B29C 64/379 - Handling of additively manufactured objects, e.g. using robots
• B33Y 10/00 - Processes of additive manufacturing
• B33Y 70/00 - Materials specially adapted for additive manufacturing
• B33Y 80/00 - Products made by additive manufacturing
• C08F 2/50 - Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents

Abstract

Provided is a photocurable resin composition which contains a reactive compound and a photopolymerization initiator. A cured product of the photocurable resin composition has two or more glass transition points including TgA and TgB. TgA is lower than 25ºC. TgB is 25°C or higher. A cured product of the photocurable resin composition has a breaking elongation of 130% or more when measured in accordance with ASTM D638. A cured product of the photocurable resin composition has a breaking strength of 3 MPa or more when measured in accordance with ASTM D638.

IPC Classes  ?

• C08F 290/06 - Polymers provided for in subclass
• C08F 2/50 - Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
• B33Y 80/00 - Products made by additive manufacturing
• B29C 64/106 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
• B29C 64/264 - Arrangements for irradiation
• B33Y 70/00 - Materials specially adapted for additive manufacturing

Abstract

Provided is a method for sealing an electronic component mounting substrate, the method including: a step for preparing an electronic component mounting substrate, which is a substrate on which a plurality of electronic components are mounted, the electronic component mounting substrate being such that spaces are provided between the electronic components and the substrate; a step for placing a heat-curable sheet on the electronic component mounting substrate so as to contact the electronic components; and a step for heating and molding the heat-curable sheet placed on the electronic component mounting substrate, filling the spaces between the electronic components and the substrate with molten material of the heat-curable sheet, and curing the molten material. The distance Lq between the center of the substrate and a point Q at which the outer edge of the heat-curable sheet and a straight line passing through the center of the substrate and a point P intersect, P being a discretionary point on an enclosing line which surrounds all of the plurality of electronic components and with which the surrounded area is minimized, is equal to or greater than 0.9 Lp, where Lp is the distance between the center of the substrate and the point P.

IPC Classes  ?

• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings

Abstract

The present invention addresses the problem of providing a solder joining resin composition for securing an electrical component so that there is no position deviation of the electrical component in solder joining.　To solve this problem, the present invention provides a solder joining resin composition, characterized by including a thermoplastic resin (A) and a crosslinking agent (B). Through this feature, it is possible to provide a solder joining resin composition that has high fixing force and good solder joining properties, and due to the high fixing force, an electrical component can be disposed in a precise position on a substrate without being prone to position deviation, and solder joining can be performed satisfactorily.

IPC Classes  ?

• B23K 35/363 - Selection of compositions of fluxes for soldering or brazing
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Abstract

The present invention addresses the problem of providing a flux sheet having excellent shock absorption properties and tackiness-adhesion properties, and having flux activity and excellent washability. In order to solve this problem, provided is a flux sheet for semiconductor transfer, said flux sheet including (A) a water-soluble adhesive and (B) a water-soluble plasticizer (excluding the component (A)). With the flux sheet for semiconductor transfer of the present invention, it is possible to provide a flux sheet having excellent shock absorption properties and tackiness-adhesive properties, and having excellent solder bondability and washability.

IPC Classes  ?

• B23K 35/363 - Selection of compositions of fluxes for soldering or brazing
• H01L 33/48 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor body packages

Abstract

A cured product of a curable material is a cured product of a curable material containing a benzoxazine compound and a polymerization initiator. The benzoxazine compound has a polymerizable functional group on a nitrogen atom constituting an oxazine ring. The cured product has a curing rate of 60% or more. The present invention also encompasses a polymer composition including a polymer including repeating units of a polymerizable monomer having a benzoxazine ring.

IPC Classes  ?

• C08F 26/06 - Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a heterocyclic ring containing nitrogen
• C08F 36/14 - Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having only two carbon-to-carbon double bonds conjugated containing elements other than carbon and hydrogen

Abstract

A photocurable resin composition includes a reactive monomer, a reactive oligomer, and a photopolymerization initiator. A cured product of the reactive monomer has a glass transition point of less than 20° C., and a cured product of the reactive oligomer has a glass transition point of less than 20° C. A cured product of the photocurable resin composition has a loss tangent tan δ at 25° C. of 0.2 or less. The cured product of the photocurable resin composition has an elongation at break in accordance with ASTM D638 of 150% or more.

IPC Classes  ?

• C08F 2/46 - Polymerisation initiated by wave energy or particle radiation
• C08F 2/50 - Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
• C08G 61/04 - Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
• B33Y 10/00 - Processes of additive manufacturing
• B33Y 70/00 - Materials specially adapted for additive manufacturing
• B29C 64/129 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
• C08F 222/10 - Esters
• C08F 220/30 - Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
• C08F 220/20 - Esters of polyhydric alcohols or phenols
• C08F 224/00 - Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a heterocyclic ring containing oxygen
• C08K 3/36 - Silica
• C08K 5/5397 - Phosphine oxides
• C08K 9/04 - Ingredients treated with organic substances
• B29K 33/00 - Use of polymers of unsaturated acids or derivatives thereof, as moulding material

Abstract

Provided are: a laminate that has a functional film having both durability and dust resistance; and a composition for forming the functional film. Moreover, provided are: a fabric coating composition that can exhibit excellent dust resistance against powder dust fouling when applied to a fabric; and a functional fabric that has a functional film composed of a cured product of said fabric coating composition. The present invention pertains to a laminate having an arithmetic average height Sa of 10-50 nm and a minimum autocorrelation length Sal of 300-2,000 nm, and composed of a base material and a functional film having a water contact angle of 70-130º, wherein the functional film contains silicon, oxygen, carbon, and fluorine. Moreover, the present invention pertains to a fabric coating composition containing fluoro group-containing alkoxysilane or a hydrolyzed partial condensate thereof.

IPC Classes  ?

• B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
• B32B 27/00 - Layered products essentially comprising synthetic resin
• B32B 27/12 - Layered products essentially comprising synthetic resin next to a fibrous or filamentary layer
• C09D 5/16 - Anti-fouling paintsUnderwater paints
• C08L 83/04 - Polysiloxanes
• C09D 183/04 - Polysiloxanes
• C09D 183/08 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
• C09D 7/40 - Additives
• C09D 7/61 - Additives non-macromolecular inorganic
• C09D 7/62 - Additives non-macromolecular inorganic modified by treatment with other compounds

Abstract

2 of Hansen Solubility Parameter of the second reactive compound differ by 1.8 or more.

IPC Classes  ?

• C08F 2/48 - Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
• C08F 299/06 - Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polyurethanes

Abstract

A curable resin composition includes: a first epoxy resin having a polyoxyalkylene chain; a second epoxy resin different from the first epoxy resin; a thermoplastic resin having a weight average molecular weight of 300,000 or less, and having a reactive functional group; at least one selected from the group consisting of a curing agent and a curing accelerator; and an inorganic filler.

IPC Classes  ?

• B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
• C09J 7/35 - Heat-activated
• C09J 7/10 - Adhesives in the form of films or foils without carriers
• B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
• B32B 9/04 - Layered products essentially comprising a particular substance not covered by groups comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance
• B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
• B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
• B32B 27/30 - Layered products essentially comprising synthetic resin comprising vinyl resinLayered products essentially comprising synthetic resin comprising acrylic resin
• B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
• B32B 27/38 - Layered products essentially comprising synthetic resin comprising epoxy resins
• C09J 11/04 - Non-macromolecular additives inorganic
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material

Abstract

The present invention provides: a positive electrode mixture that fully exploits the excellent physical properties of sulfur, has excellent charge-discharge capacity, and is suitable for use in a positive electrode mixture layer of an all-solid-state lithium sulfur battery; and a production method for the positive electrode mixture. The present invention pertains to a positive electrode mixture for a composite all-solid-state lithium sulfur battery, said positive electrode mixture including sulfur or a discharge product thereof (A), phosphorus pentasulfide (B), an electrically conductive carbon (C), and a lithium halide (D), at a weight ratio A : B : C : D of 40-60 : 15-35 : 5-20 : 16-30, wherein when subjected to 31P-MAS NMR, the 50 ppm peak relative intensity is 40% or less.

IPC Classes  ?

• H01M 4/136 - Electrodes based on inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFy
• H01M 4/1397 - Processes of manufacture of electrodes based on inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFy
• H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers

Abstract

Provided is a method for producing a target protein while stably maintaining a vector, without performing a special genetic operation on a host cell and without the use of drug resistance genes, etc. A method for producing a target protein, the method including a step for culturing cells transformed by a vector, wherein the method is characterized in that the vector includes a gene for the target protein and does not include an antibiotic resistance gene, a recombinase recognition sequence, or a gene essential for survival of the cells.

IPC Classes  ?

• C12N 15/09 - Recombinant DNA-technology
• C12N 15/52 - Genes encoding for enzymes or proenzymes
• C12P 21/02 - Preparation of peptides or proteins having a known sequence of two or more amino acids, e.g. glutathione

Abstract

3), (B) a dispersant, (C) an alkoxysilane compound, and (D) a solvent having the following Hansen solubility parameters: a hydrogen bonding component (dH) of 11 or less and a polar component (dP) of 4 or more; and wet grinding the resulting mixture.

IPC Classes  ?

• C09D 17/00 - Pigment pastes, e.g. for mixing in paints
• C09D 7/20 - Diluents or solvents
• C09D 7/45 - Anti-settling agents
• C09D 7/61 - Additives non-macromolecular inorganic
• C09D 7/63 - Additives non-macromolecular organic
• C09D 7/65 - Additives macromolecular
• C09D 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
• C09D 183/04 - Polysiloxanes

Abstract

A manufacturing method of a mounting structure includes: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a disposing step of disposing a thermosetting sheet and a thermoplastic sheet on the mounting member, with the thermosetting sheet interposed between the thermoplastic sheet and the first circuit member; a first sealing step of pressing a stack of the thermosetting sheet and the thermoplastic sheet against the first circuit member, and heating the stack, to seal the second circuit members and to cure the thermosetting sheet into a cured layer; and a removal step of removing the thermoplastic sheet from the cured layer. At least one of the second circuit members is a hollow member having a space from the first circuit member, and in the first sealing step, the second circuit members are sealed so as to maintain the space.

IPC Classes  ?

• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H05K 3/46 - Manufacturing multi-layer circuits
• H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H03H 3/08 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
• H03H 9/25 - Constructional features of resonators using surface acoustic waves
• H05K 1/14 - Structural association of two or more printed circuits

Abstract

This phosphorus adsorbent, which is provided with a complex including (A) a base material, (B) an acidic group-containing polymer, and (C) a polyvalent metal ion, has a high phosphorus adsorbing ability, suppresses the elution of unnecessary components therefrom after adsorbing phosphorus, and can hold the adsorbed phosphorus. This phosphorus adsorbent is preferably porous. (A) The base material can be a water-insoluble polymer, and (B) the acidic group-containing polymer can be a water-soluble polymer. The complex is obtained by bringing a solution or suspension including (A) the base material and (B) the acidic group-containing polymer into contact with an aqueous solution including a salt of (C) the polyvalent metal ion, and the amount of (A) the base material used is preferably 1-50 parts by weight with respect to 1 part by weight of (B) the acidic group-containing polymer.

IPC Classes  ?

• B01J 20/02 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof comprising inorganic material
• A61M 1/36 - Other treatment of blood in a by-pass of the natural circulatory system, e.g. temperature adaptation, irradiation
• B01D 15/00 - Separating processes involving the treatment of liquids with solid sorbentsApparatus therefor
• B01J 20/281 - Sorbents specially adapted for preparative, analytical or investigative chromatography
• B01J 20/285 - Porous sorbents based on polymers
• B01J 20/30 - Processes for preparing, regenerating or reactivating
• G01N 30/00 - Investigating or analysing materials by separation into components using adsorption, absorption or similar phenomena or using ion-exchange, e.g. chromatography

Abstract

An object of the present invention is to provide a resin composition for encapsulation capable of suppressing warpage even when a large-area substrate is encapsulated. In order to solve the above problems, a resin composition for encapsulating an electronic member containing an epoxy resin (A), a compound having a polyalkylene glycol chain (B), and an inorganic filler (C) is provided. Thus, even when a large-area substrate is encapsulated, an effect of suppressing the warpage can be obtained.

IPC Classes  ?

• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08G 59/42 - Polycarboxylic acidsAnhydrides, halides, or low-molecular-weight esters thereof
• C08G 59/50 - Amines
• C08G 59/62 - Alcohols or phenols
• C08K 3/36 - Silica
• C08K 5/06 - EthersAcetalsKetalsOrtho-esters
• C08K 7/18 - Solid spheres inorganic

Abstract

A method of producing a sealed structure, the method including: preparing a substrate and a curable resin composition in a liquid form; and sealing the substrate with the curable resin composition, to form a sealed body including the substrate and a cured product of the curable resin composition. The sealing step includes: printing the curable resin composition onto the substrate, to cover the substrate with a first coating film of the curable resin composition; and compression-molding the first coating film and the substrate together using a mold, with a pressing surface of the mold abut against the first coating film, to convert the first coating film into a second coating film. A ratio of a projected area S1 of the first coating film onto the substrate to a projected area S2 of the second coating film onto the substrate: S1/S2 is 0.9 or more.

IPC Classes  ?

• B29C 43/14 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles in several steps
• C08K 7/18 - Solid spheres inorganic
• B29C 43/00 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor
• B29K 63/00 - Use of epoxy resins as moulding material
• B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof
• B29K 105/00 - Condition, form or state of moulded material
• B29K 509/08 - Glass
• B29K 105/16 - Fillers

Abstract

[Problem] To provide a multi-layer sheet for mold underfill encapsulation, which exhibits good infiltrability between electrodes. [Solution] In order to solve the aforementioned problem, the present invention provides a multi-layer sheet for mold underfill encapsulation, which is characterized by having provided as an outermost layer thereof an (A) layer that comprises a resin composition having a local maximum loss tangent (tan δ) value of 3 or more at a measurement temperature of 125°C for a measurement time of 0-100 seconds.

IPC Classes  ?

• B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation

Abstract

Provided is a resin composition for imprinting, said resin composition having superior imprintability as well as superior optical characteristics such as high refractive index and low haze. The present invention relates to a resin composition for imprinting, said resin composition including (A) a polysiloxane resin expressed by general formula (1), and (B) inorganic oxide fine particles, wherein the weight ratio of the total weight of the polysiloxane resin (A) and an alkoxysilane compound and a curable resin, which are optional components, in relation to the weight of the inorganic oxide fine particles (B) is 0.2 to 2.5. General formula (1): (R13/2aa(R222/2bb(R331/2c4/2dd (In general formula (1), R1, R2, and R3each independently represent a hydrogen atom, a hydroxyl group, an alkoxy group, a C1-12 hydrocarbon group, or a C1-12 substituent group having one or more cross-linkable functional groups; if there are a plurality of any of R1, R2, and R3, these may be different; at least one of R1, R2, and R3 is a C1-12 substituent group having one or more cross-linkable functional groups; and a, b, c, and d are numbers satisfying the expressions 0.001≤a≤1.00, 0≤b≤0.999, 0≤c≤0.30, 0≤d≤0.30, and a+b+c+d=1.0.)

IPC Classes  ?

• C08L 83/04 - Polysiloxanes
• H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
• C08K 3/20 - OxidesHydroxides

Abstract

A manufacturing method of a mounting structure, the method including a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a disposing step of disposing a thermosetting sheet and a thermoplastic sheet on the mounting member, with the thermosetting sheet interposed between the thermoplastic sheet and the first circuit member; a first sealing step of pressing a stack of the thermosetting sheet and the thermoplastic sheet against the first circuit member, and heating the stack, to seal the second circuit members and to cure the thermosetting sheet into a first cured layer; a removal step of removing the thermoplastic sheet from the first cured layer; and a coating film formation step of forming a coating film on the first cured layer, after the removal step. At least one of the second circuit members is a hollow member having a space from the first circuit member, and in the first sealing step, the second circuit members are sealed so as to maintain the space.

IPC Classes  ?

• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H03H 3/08 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
• H03H 9/25 - Constructional features of resonators using surface acoustic waves
• H05K 1/14 - Structural association of two or more printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A manufacturing method of a mounting structure, the method including: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member via bumps, the mounting member having a space between the first circuit member and the second circuit member; a step of preparing a sheet having a space maintaining layer; a disposing step of disposing the sheet on the mounting member such that the space maintaining layer faces the second circuit members; and a sealing step of pressing the sheet against the first circuit member and heating the sheet, to seal the second circuit members so as to maintain the space, and to cure the sheet. The bumps are solder bumps. The space maintaining layer after curing has a glass transition temperature of higher than 125° C., and a coefficient of thermal expansion at 125° C. or lower of 20 ppm/K or less.

IPC Classes  ?

• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

The present invention provides an amylase composition capable of stably storing an amylase over a long period without using chemical substances that are feared to have an effect on the human body when used in a food product. The present invention relates to an amylase composition that contains: a sugar that includes glucose as a structural unit; a polyhydric alcohol; and an amylase.

IPC Classes  ?

• A23L 33/10 - Modifying nutritive qualities of foodsDietetic productsPreparation or treatment thereof using additives
• C12N 9/26 - Hydrolases (3.) acting on glycosyl compounds (3.2) acting on alpha-1, 4-glucosidic bonds, e.g. hyaluronidase, invertase, amylase

Abstract

The present invention provides an amylase composition capable of stably storing an amylase over a long period without using chemical substances that are feared to have an effect on the human body when used in a food product. The present invention relates to an amylase composition that contains: a sugar that includes glucose as a structural unit; a polyhydric alcohol; and an amylase.

IPC Classes  ?

• A23L 33/10 - Modifying nutritive qualities of foodsDietetic productsPreparation or treatment thereof using additives
• C12N 9/26 - Hydrolases (3.) acting on glycosyl compounds (3.2) acting on alpha-1, 4-glucosidic bonds, e.g. hyaluronidase, invertase, amylase

Abstract

A manufacturing method of a mounting structure, the method including: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member, the mounting member having a space between the first circuit member and the second circuit member; a step of preparing a laminate sheet including a first thermal-conductive layer and a second thermal-conductive layer, the first thermal-conductive layer disposed at least on one outermost side; a disposing step of disposing the laminate sheet on the mounting member such that the first thermal-conductive layer faces the second circuit members; and a sealing step of pressing the laminate sheet against the first circuit member and heating the laminate sheet, to seal the second circuit members so as to maintain the space, and to cure the laminate sheet. The first thermal-conductive layer after curing has a coefficient of thermal conductivity in a thickness direction at room temperature being equal to or greater than that in a principal surface direction, and the second thermal-conductive layer after curing has a coefficient of thermal conductivity in a principal surface direction at room temperature being greater than that in a thickness direction.

IPC Classes  ?

• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H03H 9/08 - Holders with means for regulating temperature
• H03H 3/08 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
• H03H 9/05 - Holders or supports
• H03H 9/10 - Mounting in enclosures
• H10N 30/02 - Forming enclosures or casings
• H10N 30/88 - MountsSupportsEnclosuresCasings
• H10N 30/088 - Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
• H10N 30/87 - Electrodes or interconnections, e.g. leads or terminals

Abstract

A cured product of a curable material according to the present invention is a cured product of a curable material that contains a benzoxazine compound and a polymerization initiator. The benzoxazine compound includes a polymerizable functional group on a nitrogen atom composing an oxazine ring thereof. The curing ratio for the cured product is at least 60%. The present invention also encompasses a polymer composition comprising a polymer that contains a repeat unit of a benzoxazine ring-bearing polymerizable monomer.

IPC Classes  ?

• C08G 14/073 - Amines
• C08F 20/36 - Esters containing nitrogen containing oxygen in addition to the carboxy oxygen
• C08L 33/14 - Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
• C08L 61/34 - Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups , , and

Abstract

The photocurable resin composition includes a reactive monomer, a reactive oligomer, and a photopolymerization initiator. The glass transition point of a cured product of the reactive monomer is less than 20°C, and the glass transition point of a cured product of the reactive oligomer is less than 20°C. The loss tangent tanδ of a cured product of the photocurable resin composition at 25°C is 0.2 or lower. The elongation at break according to ASTM D638 of a cured product of the photocurable resin composition is 150% or higher.

IPC Classes  ?

• C08F 290/06 - Polymers provided for in subclass
• C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
• C08F 2/50 - Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
• B29C 64/314 - Preparation

Abstract

A manufacturing method of a mounting structure, the method including: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a step of preparing a sheet having thermosetting property; a disposing step of disposing the sheet on the mounting member so as to face the second circuit members; and a sealing step of pressing the sheet against the first circuit member and heating the sheet, to seal the second circuit members and to cure the sheet, wherein the second circuit members include a reference member, and a first adjacent member and a second adjacent member each adjacent to the reference member, a separation distance D1 between the reference member and the first adjacent member is different from a separation distance D2 between the reference member and the second adjacent member, at least one of the plurality of the second circuit members is a hollow member to be provided with a space from the first circuit member, and in the sealing step, the plurality of the second circuit members are sealed so as to maintain the space.

IPC Classes  ?

• H03H 9/10 - Mounting in enclosures
• B29C 51/12 - Shaping by thermoforming, e.g. shaping sheets in matched moulds or by deep-drawingApparatus therefor of articles having inserts or reinforcements
• B29C 51/14 - Shaping by thermoforming, e.g. shaping sheets in matched moulds or by deep-drawingApparatus therefor using multilayered preforms or sheets
• B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
• H03H 9/05 - Holders or supports
• H05K 3/28 - Applying non-metallic protective coatings
• H10N 30/02 - Forming enclosures or casings
• H10N 30/88 - MountsSupportsEnclosuresCasings
• H10N 30/87 - Electrodes or interconnections, e.g. leads or terminals
• B29K 101/10 - Thermosetting resins
• B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof

Abstract

The present invention addresses the problem of providing a flux sheet which exhibits strong adhesion to a substrate, while being free from displacement of a solder ball during a reflow process. In order to solve the above-described problem, the present invention provides a flux sheet containing a resin (A), which is characterized in that the resin (A) contains a resin (a1) which has a glass transition point of 40°C or less and a melt viscosity at 150°C of 500 Pa∙s or less (as measured at a shear rate of 10 mm/minute). Consequently, this flux sheet exhibits strong adhesion to a substrate during bonding of the substrate and a solder, and is able to achieve such an effect that displacement of a solder ball does not occur during a reflow process.

IPC Classes  ?

• B23K 1/00 - Soldering, e.g. brazing, or unsoldering
• B23K 3/00 - Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
• C22C 12/00 - Alloys based on antimony or bismuth
• C22C 13/00 - Alloys based on tin
• C22C 28/00 - Alloys based on a metal not provided for in groups
• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
• B23K 35/363 - Selection of compositions of fluxes for soldering or brazing
• H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Abstract

The present invention addresses the problem of providing a resin composition that can be cured at a low temperature and that has both heat resistance and flexibility after being cured. In order to solve the problem, the present invention provides a thermosetting resin composition characterized by containing components (A)-(D): (A) a poly-maleimide compound having two or more maleimide groups and having a weight average molecular weight not less than 500 g/mol; (B) an epoxy compound; (C) a polyester; and (D) an aromatic amine compound.

IPC Classes  ?

• C08G 59/50 - Amines
• C08K 5/18 - AminesQuaternary ammonium compounds with aromatically bound amino groups
• C08L 67/02 - Polyesters derived from dicarboxylic acids and dihydroxy compounds
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins

Abstract

2 area is one or less, the pores derived from cross sections of the hollow particles; and the polished surface is coated with a coating material.

IPC Classes  ?

• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
• C08K 3/36 - Silica
• C08K 7/26 - Silicon-containing compounds
• C08L 63/04 - Epoxynovolacs
• B29C 43/00 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor
• B29K 63/00 - Use of epoxy resins as moulding material
• C08G 59/42 - Polycarboxylic acidsAnhydrides, halides, or low-molecular-weight esters thereof
• C08K 5/18 - AminesQuaternary ammonium compounds with aromatically bound amino groups

Abstract

This curable resin composition includes a first epoxy resin having a polyoxyalkylene chain, a second epoxy resin different from the first epoxy resin, a thermoplastic resin having a reactive functional group as well as a weight-average molecular weight of 300,000 or lower, at least one selected from the group consisting of curing agents and curing accelerators, and an inorganic filler.

IPC Classes  ?

• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08L 33/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofCompositions of derivatives of such polymers
• C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

122 of the Hansen parameter of the second reactive compound is not less than 1.8.

IPC Classes  ?

• C08F 290/00 - Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
• C08F 299/06 - Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polyurethanes
• C08F 2/48 - Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light

Abstract

A polymer comprising at least 1% by mole of a structural unit represented by Formula (2); 3 is an alkyl group having 1 to 6 carbon atoms; m is an integer of 1 to 10; and n is an integer of 2 to 10; and having a number average molecular weight of 5,000 or more has various characteristics suitable for use in contact with a living organism and can be easily produced.

IPC Classes  ?

• C07C 309/14 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing nitrogen atoms, not being part of nitro or nitroso groups, bound to the carbon skeleton containing amino groups bound to the carbon skeleton
• C08G 18/38 - Low-molecular-weight compounds having hetero atoms other than oxygen
• A61L 31/06 - Macromolecular materials obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
• C08G 18/44 - Polycarbonates
• C08G 18/65 - Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
• C08G 18/76 - Polyisocyanates or polyisothiocyanates cyclic aromatic
• C08J 5/18 - Manufacture of films or sheets

Goods & Services

Reagents for research purposes, other than for medical or veterinary purposes; biological cell culture mediums for scientific and research purposes; biological cell culture mediums for industrial purposes; chemicals; plant growth regulating preparations; higher fatty acids; artificial sweeteners; gelatine for use in the manufacture of cosmetics; collagen peptides for use in the manufacture of cosmetics; chemical compositions for developing photographs. Gelatine for medical purposes; collagen for medical purposes; collagen peptides for medical purposes; diagnostic reagents; microorganism culture mediums for medical purposes; nutritional additives for medical purposes; pharmaceutical preparations and other preparations for destroying vermin, fungicides, herbicides; dietetic food adapted for medical purposes consisting primarily of gelatine, in the form of powder, granules, tablets, jellies, gels or capsules; dietetic food adapted for medical purposes consisting primarily of collagen peptides in the form of powder, granules, tablets, jellies, gels or capsules; gelatine capsules for pharmaceuticals; empty capsules for pharmaceuticals; dental materials; lactose for pharmaceutical purposes; lacteal flour for babies; cotton swabs for medical use. Medical apparatus and instruments; pacifiers for babies; ice bag pillows for medical purposes; triangular bandages; supportive bandages; surgical catguts; feeding cups for medical purposes; dropping pipettes for medical purposes; teats; medical ice bags; medical ice bag holders; baby bottles; nursing bottles; finger guards for medical purposes; non-chemical contraceptives; artificial tympanic membranes; prosthetics or fillings materials, namely, artificial materials for use in the replacement of bones and cartilage; bracelets for medical purposes.

Abstract

2233); (B) a dispersant; (C) an alkoxysilane compound; and (D) a solvent having Hansen solubility parameters of hydrogen bond energy (dH) of 11 or lower and polar energy (dP) of 4 or higher; and a step for wet-grinding the mixture.

IPC Classes  ?

• C01G 25/02 - Oxides
• C01G 23/00 - Compounds of titanium
• C01G 23/047 - Titanium dioxide

Abstract

An endotoxin adsorbent comprising a crystalline cellulose having a nitrogen atom-containing cationic group can sufficiently remove endotoxin from a material containing endotoxin to be removed and containing a substance having a cationic group and can efficiently remove endotoxin also from a highly viscous material. The nitrogen atom-containing cationic group may be typically a functional group derived from a polyvalent amine and/or a quaternary ammonium salt. The crystalline cellulose having a nitrogen atom-containing cationic group may comprise the nitrogen atom-containing cationic group at a content of 0.05 to 3 meq/dry·g in terms of anion exchange capacity.

IPC Classes  ?

• B01J 20/22 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof comprising organic material
• B01D 15/22 - Selective adsorption, e.g. chromatography characterised by constructional or operational features relating to the construction of the column
• B01J 41/16 - Cellulose or woodDerivatives thereof

Goods & Services

(1) Reagents for research purposes for pharmaceuticals, regenerative medicine, and implantable medical apparatus and instruments, namely, cell culture reagents for scientific and research purposes, chemical reagents for use in genetic research, diagnostic reagents for medial-scientific research use, chemical reagents for research on pharmaceutical additives, other than for medical and veterinary purposes; biological cell culture mediums for scientific and research purposes for pharmaceuticals, regenerative medicine, and implantable medical apparatus and instruments; biological cell culture mediums used for regenerative medicine and for use in the manufacture of pharmaceuticals; chemicals, namely, proteins, peptides, enzymes, and polysaccharides for research purposes for pharmaceuticals, regenerative medicine, and implantable medical apparatus and instruments; chemicals, namely, proteins, peptides, enzymes, and polysaccharides for use in the manufacture of biological cell culture media for pharmaceuticals and regenerative medicine; chemicals, namely, proteins, peptides, enzymes, and polysaccharides for use in the manufacture of pharmaceuticals and implantable medical apparatus and instruments; plant growth regulating preparations; higher fatty acids; artificial sweeteners, gelatine for use in the manufacture of cosmetics; collagen peptides for use in the manufacture of cosmetics; chemical compositions for developing photographs (2) Gelatine for medical purposes; collagen for medical purposes; collagen peptides for medical purposes, in vitro diagnostic reagents for medical purposes; microorganism culture mediums for regenerative medicine and biological preparations; biological cell culture mediums for regenerative medicine, biological preparations; hemostatic drugs for use in association with implantable medical apparatus and instruments; drugs, namely, adhesion (scar tissue) preventing agent for organs after surgery for use in association with implantable medical apparatus and instruments; dental materials, namely, dental ceramics, dental cement; lactose for pharmaceutical purposes; lacteal flour for babies; cotton swabs for medical use; wound covering gel and dressings; adhesion (scar tissue) preventing drugs, gel and sheets used for preventing scar tissue formation between organs after surgery (3) Medical apparatus and instruments, namely, medical endoscopes, catheters, medical ultrasound apparatus, medical devices for nonsurgical cosmetic treatments, namely, microneedles and facial massagers , hemostats artificial blood vessels, artificial joints; pacifiers for babies; ice bag pillows for medical purposes; triangular bandages; supportive bandages; surgical catguts; feeding cups for medical purposes; dropping pipettes for medical purposes; teats; medical ice bags; medical ice bag holders; baby bottles; nursing bottles; finger guards for medical purposes; non-chemical contraceptives; artificial tympanic membranes; prosthetic ligaments; artificial bones for implantation; artificial cartilage; artificial limbs; bone implants made from artificial materials; artificial dermis; artificial skin; magnetic bracelets for medical purposes

Goods & Services

Reagents for research purposes for pharmaceuticals, regenerative medicine, and implantable medical apparatus and instruments, other than for medical or veterinary purposes; biological cell culture mediums for scientific and research purposes for pharmaceuticals, regenerative medicine, and implantable medical apparatus and instruments; biological cell culture mediums used for regenerative medicine or for use in the manufacture of pharmaceuticals; industrial chemicals for research purposes for pharmaceuticals, regenerative medicine, and implantable medical apparatus and instruments; chemicals for use in the manufacture of biological cell culture media for pharmaceuticals and regenerative medicine; chemicals for use in the manufacture of pharmaceuticals and implantable medical apparatus and instruments; plant growth regulating preparations; higher fatty acids for industrial use; artificial sweeteners; gelatine for use in the manufacture of cosmetics; collagen peptides for use in the manufacture of cosmetics; chemical compositions for developing photographs Gelatine for medical purposes, namely, gelatine for use as a hemostatic, gelatine for use as an adhesive for binding wounds, gelatine for use as anti-adhesion gels for wound drainage devices, gelatine for use as a lubricant for artificial blood vessels and catheters, and gelatine for use as an adhesive to biotissue for artificial blood vessels and catheters; collagen for medical purposes; collagen peptides for medical purposes; in vitro diagnostic reagents for medical and veterinary use; microorganism culture mediums for regenerative medicine purposes; pharmaceutical preparations, namely, hemostatics, medical adhesives for binding wounds, and anti-adhesion gels for use with wound drainage devices for surgical treatment; pharmaceutical preparations, namely, biological cell culture mediums for regenerative medicine purposes and biological preparations for use as a hemostatic, for use as an adhesive for binding wounds, for use as anti-adhesion gels for wound drainage devices, for use as a medical lubricant for artificial blood vessels and catheters, and for use as a medical adhesive to biotissue for artificial blood vessels and catheters; dental materials, namely, dental ceramics, dental cement; lactose for pharmaceutical purposes; lacteal flour for babies; cotton swabs for medical use Medical apparatus and instruments, namely, medical endoscopes, catheters, medical ultrasound apparatus, medical devices for nonsurgical cosmetic treatments, medical devices for closing wounds, hemostatic suture instruments, medical and surgical instruments and apparatus for preventing the formation of adhesions after surgical procedures, artificial blood vessels, artificial joints; pacifiers for babies; ice bag pillows for medical purposes; triangular bandages for anatomical joints; supportive bandages; surgical catguts; feeding cups for medical purposes; dropping pipettes for medical purposes; feeding bottle teats; medical ice bags; medical ice bag holders, namely, medical apparatus in the nature of dispensers for plastic ice bags; baby bottles; nursing bottles; finger guards for medical purposes; non-chemical contraceptives, namely, contraceptive apparatus; artificial tympanic membranes; prosthetics or fillings materials, namely, artificial materials for use in the replacement of bones and cartilage; bracelets for medical purposes

Abstract

Provided is a latent curing catalyst for epoxy resin which has a small particle size, exhibits excellent miscibility with epoxy resin, has high storage stability as a composition with the epoxy resin, and has excellent curability. The latent curing catalyst for epoxy resin comprises particles which have an average particle size of 0.01 to 50 μm, wherein each particle comprises: a core that is formed from a phosphorus-based curing catalyst and a vinyl-based polymer; an inner shell layer that covers the core and is formed from a first vinyl resin which is a polymer of monomer components including a first vinyl-based monomer and a first cross-linkable vinyl-based monomer or a polymer of the first vinyl-based monomer; and an outer shell layer that covers the inner shell layer and is formed from a second vinyl resin which is a polymer of monomer components including a second vinyl-based monomer and a second cross-linkable vinyl-based monomer or a polymer of the second cross-linkable vinyl-based monomer.

IPC Classes  ?

• C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
• C08F 265/06 - Polymerisation of acrylate or methacrylate esters on to polymers thereof
• H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

An acrylic resin which contains a unit of a (meth)acrylate monomer A that has a polyalkylene glycol moiety, and which has a carboxylic acid group and/or a carboxylic acid salt group at least at one end; and a fine metal particle dispersion which contains this acrylic resin.

IPC Classes  ?

• C08F 290/06 - Polymers provided for in subclass
• C08F 2/38 - Polymerisation using regulators, e.g. chain terminating agents
• C08F 20/28 - Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
• C08K 3/08 - Metals
• C08L 33/14 - Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen

Abstract

Provided is an alkali-soluble resin that is used to obtain an alkali-soluble radiation-sensitive resin composition having excellent alkali solubility and resolution, and developability with a close fit. The present invention pertains to an unsaturated group-containing alkali-soluble resin which is a reaction product of: (a) an epoxy (meth)acrylate having a fluorene skeleton; (b) a hydroxyl-group containing compound represented by the chemical formula A-OH (where A is an organic group having 1 to 10 carbon atoms or a hydrogen atom) and having one hydroxyl group in the molecule; and (c) a two- or higher-valent carboxylic acid or an anhydride thereof.

IPC Classes  ?

• C08G 59/17 - Polycondensates modified by chemical after-treatment by monocarboxylic acids or by anhydrides, halides or low-molecular-weight esters thereof by acrylic or methacrylic acid
• C08F 290/14 - Polymers provided for in subclass
• C08L 63/10 - Epoxy resins modified by unsaturated compounds

Abstract

The problem addressed by the present invention is to provide a resin composition for sealing capable of suppressing warpage even when sealing a large-area substrate. To solve this problem, a resin composition for sealing electronic components that contains (A) an epoxy resin, (B) a compound having a polyalkylene glycol chain, and (C) an inorganic filler is provided. The effect of being able to suppress warpage even when sealing a large-area substrate is obtained thereby.

IPC Classes  ?

• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08G 59/22 - Di-epoxy compounds
• C08K 3/36 - Silica
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

A metal ink according to the present invention, which is applied to a substrate for the purpose of forming a metal pattern, contains a metal colloid and a dispersion medium. With respect to the substrate, at least a region where the metal pattern is to be formed contains a thermoplastic resin. The distance Dc between the Hansen solubility parameter of the dispersion medium and the Hansen solubility parameter of the metal colloid is 10 MPa0.5or less; and the distance Ds between the Hansen solubility parameter of the dispersion medium and the Hansen solubility parameter of the thermoplastic resin is 10 MPa0.5 or more.

IPC Classes  ?

• C09D 11/52 - Electrically conductive inks
• C09D 11/033 - Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
• C09D 11/326 - Pigment inks characterised by the pigment dispersant
• C09D 11/36 - Inkjet printing inks based on non-aqueous solvents
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
• H05K 1/09 - Use of materials for the metallic pattern

Abstract

This manufacturing method of a mounting structure involves: a step for preparing a mounting member comprising a first circuit member and multiple second circuit members mounted on the first circuit member; an arrangement step for arranging a thermosetting sheet and a thermoplastic sheet on the mounting member such that the thermosetting sheet is interposed between the thermoplastic sheet and the first circuit member; a first sealing step in which a laminate of the thermosetting sheet and the thermoplastic sheet is pressed against the first circuit member, the laminate is heated to seal the second circuit members, and the thermosetting sheet is cured and converted into a cured layer; a removal step for removing the thermoplastic sheet from the cured layer; and a step, after the removal step, for forming a film on the cured layer. At least one of the multiple second circuit members is a hollow member having a space formed between said second circuit member and the first circuit member, and in the first sealing step, the multiple second circuit members are sealed while the space is maintained.

IPC Classes  ?

• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H03H 3/08 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
• H03H 9/25 - Constructional features of resonators using surface acoustic waves

Abstract

This manufacturing method of a mounting structure involves: a step for preparing a mounting member comprising a first circuit member and multiple second circuit members mounted on the first circuit member; an arrangement step for arranging a thermosetting sheet and a thermoplastic sheet on the mounting member such that the thermosetting sheet is interposed between the thermoplastic sheet and the first circuit member; a first sealing step in which a laminate of the thermosetting sheet and the thermoplastic sheet is pressed against the first circuit member, the laminate is heated to seal the second circuit members, and the thermosetting sheet is cured and converted into a cured layer; and a removal step for removing the thermoplastic sheet from the cured layer. At least one of the multiple second circuit members is a hollow member having a space formed between said second circuit member and the first circuit member, and in the first sealing step, the multiple second circuit members are sealed while the space is maintained.

IPC Classes  ?

• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H03H 3/08 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
• H03H 9/25 - Constructional features of resonators using surface acoustic waves

Abstract

A method for producing a package structure, which comprises: a step for preparing a package member which is provided with a first circuit member and a plurality of second circuit members that are mounted on the first circuit member, with bumps being interposed therebetween, and which is provided with a space between the first circuit member and the second circuit members; a step for preparing a sheet which is provided with a space retention layer; an arrangement step for arranging the sheet in the package member so that the space retention layer faces the second circuit members; and a sealing step wherein the sheet is pressed against the first circuit member, while being heated, so that the second circuit members are sealed, while maintaining the space, and the sheet is cured. The bumps are solder bumps; the glass transition temperature of the space retention layer after curing is higher than 125°C; and the linear expansion coefficient for the range of 125°C or less is 20 ppm/K or less.

IPC Classes  ?

• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H03H 3/08 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
• H03H 9/25 - Constructional features of resonators using surface acoustic waves

Abstract

This method for producing a mounting structure is provided with: a step for preparing a mounting member which is provided with a first circuit member, and a plurality of second circuit members, and in which spaces are formed between the first circuit member and the second circuit members; a step for preparing a layered sheet which is provided with first and second thermally conductive layers, and in which the first thermally conductive layer is provided as at least one of the outermost layers; an arrangement step in which the layered sheet is arranged on the mounting member such that the first thermally conductive layer faces the second circuit members; and a sealing step in which the layered sheet is pressed against the first circuit member and heated to seal the second circuit members while maintaining the spaces, and the layered sheet is cured. The thermal conductivity of the first thermally conductive layer in the thickness direction at room temperature after curing is equal to or greater than that in a main surface direction. The thermal conductivity of the second thermally conductive layer in the main surface direction at room temperature after curing is greater than that in the thickness direction.

IPC Classes  ?

• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

This method for producing a mounting structure is provided with: a step for preparing a mounting member provided with a first circuit member, and a plurality of second circuit members mounted on the first circuit member; a step for preparing a thermosetting sheet; an arrangement step in which the sheet is arranged on the mounting member so as to face the second circuit members; and a sealing step in which the sheet is pressed against the first circuit member and heated to seal the second circuit members, and the sheet is cured. The second circuit members are provided with reference members, and first and second adjacent members which are respectively disposed adjacent to the reference members. The clearance D1 between the reference members and the first adjacent members is different to the clearance D2 between the reference members and the second adjacent members. Furthermore, at least one of the plurality of second circuit members is a hollow member provided with a space which is formed between said at least one second circuit member and the first circuit member. In the sealing step, the plurality of second circuit members are sealed while maintaining said space.

IPC Classes  ?

• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/02 - ContainersSeals
• H01L 23/10 - ContainersSeals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H01L 25/04 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers
• H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
• H03H 3/08 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
• H03H 9/25 - Constructional features of resonators using surface acoustic waves
• H05K 3/28 - Applying non-metallic protective coatings

Abstract

An electric conductive fiber structure includes an electric conductive resin containing electric conductive polymer(s), the electric conductive resin being filled in gaps between single fibers included in a fiber structure, the electric conductive fiber structure having 15% or more area ratio of the electric conductive resin present in an area of 15 to 30 μm from a surface when a cross section in a thickness direction of the fiber structure is observed.

IPC Classes  ?

• H01B 1/24 - Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon, or silicon
• A61B 5/00 - Measuring for diagnostic purposes Identification of persons
• D06M 15/233 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of hydrocarbons, or reaction products thereof, e.g. afterhalogenated or sulfochlorinated aromatic, e.g. styrene
• D06M 15/63 - Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds containing sulfur in the main chain, e.g. polysulfones
• D06M 23/08 - Processes in which the treating agent is applied in powder or granular form
• D06M 15/227 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of hydrocarbons, or reaction products thereof, e.g. afterhalogenated or sulfochlorinated
• H01B 1/12 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances organic substances
• H01B 1/20 - Conductive material dispersed in non-conductive organic material
• A61B 5/25 - Bioelectric electrodes therefor
• A61B 5/291 - Bioelectric electrodes therefor specially adapted for particular uses for electroencephalography [EEG]
• C08L 25/06 - Polystyrene
• C08L 67/02 - Polyesters derived from dicarboxylic acids and dihydroxy compounds
• C08L 77/00 - Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chainCompositions of derivatives of such polymers
• A61B 5/296 - Bioelectric electrodes therefor specially adapted for particular uses for electromyography [EMG]
• D06M 101/18 - Synthetic fibres consisting of macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
• D06M 101/32 - Polyesters
• D06M 101/34 - Polyamides

Abstract

[Problem] To provide an epoxy resin composition which allows high flatness of a polished surface obtained by polishing a surface after the epoxy resin composition is cured, and a production method for an electronic component mounting structure body which allows high flatness of a polished surface obtained by polishing a surface of a sealing body. [Solution] Provided are: an epoxy resin composition containing an epoxy resin, a molten silica which can contain hollow particles, and a curing agent, wherein in a polished surface which is obtained by polishing a cured product of the epoxy resin composition, the number of holes observed within the range of 25 mm2 and having a diameter of more than 5 μm derived from cross-sections of the hollow particles is equal to or less than 1, and a coating material is applied to the polished surface; an electronic component mounting structure body using the epoxy resin composition; and a production method for the electronic component mounting structure body.

IPC Classes  ?

• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08K 3/36 - Silica
• H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

The present invention provides an alkali soluble resin preferably used to obtain an alkali soluble radiation-sensitive resin composition that is highly soluble, highly sensitive, has a high thermal resistance and transparency, and high solvent resistance. The present invention relates to an unsaturated group-containing alkali soluble resin represented by formula (1). (In the formula: each A is, in a mutually independent manner,, -CO-, -SO2-, -C(CF3)2-, -Si(CH3)2-, -CH2-, -C(CH3)2-, -O-, a 4,4-cyclohexylidene group, or singly bonded; B is a tetracarboxylic acid residue having an alicyclic skeleton; G is a hydrogen atom or -CO-X-(COOH)x (X represents a bivalent to tetravalent polyhydric carboxylic acid residue, and x represents an integer of 1-3); R1 is, independently of one another, a hydrogen atom or a methyl group; R2 is, independently of one another, a C1-C5 alkyl group or a halogen group; k is an integer of 0 to 10; n is an integer of 0 to 4; and m is an integer of 1 to 50.)

IPC Classes  ?

• C08F 290/14 - Polymers provided for in subclass
• C08G 59/14 - Polycondensates modified by chemical after-treatment
• G02B 5/20 - Filters
• G03F 7/004 - Photosensitive materials
• G03F 7/027 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

Abstract

The present invention addresses the problem of improving the quality of bread by the action of an enzyme. The present invention provides a bread quality improving agent containing exomaltotetraohydrolase.

IPC Classes  ?

• A21D 2/26 - Proteins
• A21D 13/062 - Products with modified nutritive value, e.g. with modified starch content with modified sugar contentSugar-free products

Abstract

[Problem] To suppress the generation of ionic impurities from a sheet material even in an environment like that of a high temperature, high humidity bias test. [Solution] A method for manufacturing a mounting structure, the method comprising: a step for preparing a mounting member that is provided with a first circuit member and a plurality of second circuit members to be loaded on the first circuit member, and that has a space formed between the first circuit member and the second circuit members; a step for preparing a sheet material containing a thermosetting resin, a curing agent, a thermoplastic resin, and an inorganic filler; a step for disposing the sheet material on the mounting member so as to face the second circuit members; and a sealing step for pressing the sheet material against the first circuit member, heating the sheet material, and sealing the second circuit members while maintaining the space. The total of chloride ions, sodium ions, and potassium ions contained in the thermoplastic resin is 30 ppm or less on a mass basis.

IPC Classes  ?

• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

A polymer containing at least 1 mol% of structural units represented by formula 2 and having a number average molecular weight of 5,000 or more has properties suited for use by being brought into contact with living organisms, and can be easily produced (where, in formula (2): the two R1s may be the same or different and represent a hydrogen atom or a C1-6 alkyl group; X represents a single bond, an oxygen atom, or any group represented by -COO-, -OOC-, -CONH-, -NH-, -NHCO-, -NR3-, or -CH2O-; Y represents a single bond or an oligooxyalkylene group; the two R2s may be the same or different and represent a C1-6 alkyl group; R3 represents a C1-6 alkyl group; m represents an integer from 1 to 10; and n represents an integer from 2 to 10).

IPC Classes  ?

• C07C 309/14 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing nitrogen atoms, not being part of nitro or nitroso groups, bound to the carbon skeleton containing amino groups bound to the carbon skeleton
• C08G 18/10 - Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step

Abstract

An endotoxin adsorbent, said endotoxin adsorbent comprising crystalline cellulose having a nitrogen atom-containing cationic group, can sufficiently remove endotoxins from a material, from which the endotoxins are to be removed, containing a substance having a cationic group. Also, the endotoxin adsorbent can efficiently remove endotoxins from a highly viscous material. In a typical case, the nitrogen atom-containing cationic group may be a functional group derived from a polyvalent amine and/or a quaternary ammonium salt. In the crystalline cellulose having the nitrogen atom-containing cationic group, the content of the nitrogen atom-containing cationic group may be 0.05-3 meq/dry.g in terms of anion exchange capacity.

IPC Classes  ?

• B01J 20/22 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof comprising organic material
• A23P 30/00 - Shaping or working of foodstuffs characterised by the process or apparatus
• G01N 30/02 - Column chromatography
• G01N 30/88 - Integrated analysis systems specially adapted therefor, not covered by a single one of groups
• A61K 47/36 - PolysaccharidesDerivatives thereof, e.g. gums, starch, alginate, dextrin, hyaluronic acid, chitosan, inulin, agar or pectin
• A61K 47/42 - ProteinsPolypeptidesDegradation products thereofDerivatives thereof, e.g. albumin, gelatin or zein

Abstract

Means for removing endotoxin is provided. Endotoxin is removed by contacting an endotoxin adsorbent including a cellulose nanofiber having an amino group with a liquid containing endotoxin.

IPC Classes  ?

• B01J 20/24 - Naturally occurring macromolecular compounds, e.g. humic acids or their derivatives
• B01D 15/36 - Selective adsorption, e.g. chromatography characterised by the separation mechanism involving ionic interaction, e.g. ion-exchange, ion-pair, ion-suppression or ion-exclusion
• A61K 9/70 - Web, sheet or filament bases
• A61K 47/38 - CelluloseDerivatives thereof
• B01J 20/22 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof comprising organic material
• B01D 15/00 - Separating processes involving the treatment of liquids with solid sorbentsApparatus therefor
• C02F 1/28 - Treatment of water, waste water, or sewage by sorption
• B01J 20/30 - Processes for preparing, regenerating or reactivating
• B01J 20/26 - Synthetic macromolecular compounds
• B01J 20/32 - Impregnating or coating
• B01J 20/28 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof characterised by their form or physical properties
• C02F 1/42 - Treatment of water, waste water, or sewage by ion-exchange
• C02F 101/34 - Organic compounds containing oxygen

Abstract

The purpose of the present invention is to provide: a thermosetting resin composition or a photocurable resin composition, which enables the achievement of a cured product that has excellent mechanical strength and excellent heat resistance. A thermosetting resin composition which contains (A) an epoxy resin having an average number of epoxy groups of 2 or more, (B) a silsesquioxane derivative which has a weight average molecular weight Mw of from 2,000 to 10,000 (inclusive), while containing RSiO3/2 groups as repeating constituent units, and wherein from 50% by mole to 100% by mole (inclusive) of all the repeating constituent units contained in each molecule are essential repeating constituent units wherein R is an organic group containing a glycidyl group and from 0% by mole to 50% by mole (inclusive) of all the repeating constituent units contained in each molecule are optional repeating constituent units wherein R is an aryl group and/or an alkyl group having 1 to 12 carbon atoms (inclusive), and (C) an amine compound having two or more amino groups which are reactive with the epoxy groups. From 5 parts by weight to 30 parts by weight (inclusive) of the silsesquioxane derivative (B) is contained per 100 parts by weight of the epoxy resin (A).

IPC Classes  ?

• C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
• C08G 59/50 - Amines

Abstract

6-14 alkylamine.

IPC Classes  ?

• C09D 11/101 - Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
• C09D 11/52 - Electrically conductive inks
• C08K 3/08 - Metals
• C08K 5/17 - AminesQuaternary ammonium compounds
• C09D 11/03 - Printing inks characterised by features other than the chemical nature of the binder
• C09D 11/102 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
• C09D 163/08 - Epoxidised polymerised polyenes
• C09D 171/02 - Polyalkylene oxides
• H01B 1/00 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors
• H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• C09D 11/037 - Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment