Abstract

Provided are: a novel ergothioneine derivative and a method for producing the same; a composition containing the derivative; a hydrogen peroxide remover; and a cytotoxicity inhibitor.　Provided is a compound represented by formula (1) or a salt thereof.

IPC Classes  ?

• C07D 233/84 - Sulfur atoms
• A61K 31/4178 - 1,3-Diazoles not condensed and containing further heterocyclic rings, e.g. pilocarpine, nitrofurantoin
• A61P 43/00 - Drugs for specific purposes, not provided for in groups

Abstract

Provided is a thermosetting epoxy resin composition containing a main agent and a curing agent, wherein the biomass degree is 50% or more, and the main agent contains a sorbitol-type epoxy resin and can form a cured product having a glass transition temperature of 90°C or higher.

IPC Classes  ?

• C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
• C08J 5/04 - Reinforcing macromolecular compounds with loose or coherent fibrous material

Abstract

One purpose of the present disclosure is to provide a granule of a thermoplastic resin powder which, without passing through the step of subjecting a thermoplastic resin powder to melt-kneading pelletization, has a stable shape and a high bulk density, brings about an improvement in working environment, and has excellent feedability (stability, flowability) to processing machines, and which can contribute to a reduction in usage of electricity necessary for production, that is, a reduction in carbon dioxide generation, compared with melt-kneading pelletization.　One embodiment is a powder granule including a thermoplastic resin powder, the powder granule comprising an outer wall part formed by melting at least part of the thermoplastic resin powder located at the outer periphery of the powder granule, wherein a compacted thermoplastic resin powder is contained inside the outer wall part.

IPC Classes  ?

• B29B 9/08 - Making granules by agglomerating smaller particles
• B29B 9/12 - Making granules characterised by structure or composition
• C08J 3/12 - Powdering or granulating

Abstract

[Problem] To suppress warping of an electronic device. [Solution] An electronic device 100 includes a wiring layer 10 including an electroconductive member, a chip layer 20 provided to one surface side of the wiring layer 10, and a bridge layer 30 provided to the other surface side of the wiring layer 10. The chip layer 20 includes at least two chips 21, 22, and a first resin part 25 that seals the chips 21, 21. The bridge layer 30 includes: a plurality of bridge chips 31, 32 that are electrically connected to the chips 21, 22 by the electroconductive member of the wiring layer 10; one or more rigid members 33; and a second resin part 38 that seals the bridge chips 31, 32 and the rigid member 33. The one or more rigid members 33 include those disposed between the plurality of bridge chips 31, 32.

IPC Classes  ?

• H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
• H05K 1/02 - Printed circuits - Details
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

The present invention provides a method for producing a water-soluble polymer with high production efficiency, and a method for producing a water-absorbing resin having excellent water absorption performance. The present invention relates to a method for producing a water-soluble polymer, comprising: (a1) reducing the molecular weight of a starch to obtain a partially degraded starch; and (a2) introducing an ionic functional group into the partially degraded starch obtained in the step (a1).

IPC Classes  ?

• B01J 20/24 - Naturally occurring macromolecular compounds, e.g. humic acids or their derivatives
• B01J 20/30 - Processes for preparing, regenerating or reactivating
• C08B 30/20 - Amylose or amylopectin
• C08B 31/00 - Preparation of chemical derivatives of starch
• C08B 31/12 - Ethers having alkyl or cycloalkyl radicals substituted by hetero atoms

Abstract

An object is to realize a novel reverse osmosis membrane (more specifically, reverse osmosis composite membrane) that is capable of suppressing biofouling. The object is attained with use of a reverse osmosis composite membrane which is obtained by chemically modifying a surface thereof with a compound that has an amino group and that is obtained by modifying the amino group with two molecules of α-picolyl group and has a dipicolylamine structure.

IPC Classes  ?

• B01D 71/82 - Macromolecular material not specifically provided for in a single one of groups characterised by the presence of specified groups, e.g. introduced by chemical after-treatment
• B01D 61/02 - Reverse osmosis; Hyperfiltration
• B01D 69/12 - Composite membranes; Ultra-thin membranes

Abstract

A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.

IPC Classes  ?

• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
• B23K 1/00 - Soldering, e.g. brazing, or unsoldering
• B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials
• B23K 101/42 - Printed circuits

Abstract

The invention relates to a test contact (10) comprising a contact tip (11) and a contact body (12). The test contact (10) has an alignment direction (13), and the test contact (10) comprises a core (14) made of a ferromagnetic material. The core is arranged below the center of gravity (15) of the test contact (10) in the alignment direction (13). The invention additionally relates to a table device (20) for handling a test contact (10), to a method for handling a test contact (10) by means of the table device (20), to a test contact holding device comprising a test contact receiving area (40) for handling a test contact (10), and to a method for handling a test contact (10) by means of the test contact holding device comprising the test contact receiving area (40).

IPC Classes  ?

• G01R 1/067 - Measuring probes
• G01R 1/16 - Magnets

Abstract

Provided are: a MG-stabilized composition which comprises mycosporine-glycine (MG) and is acidic to weakly alkaline; an MG-stabilized composition which comprises MG and at most 10 parts by weight of 4-DG; and an MAA-stabilized composition which comprises MAA and at least one selected from a base constituting a nucleic acid, a nucleoside, a glycine, and a tranexamic acid.

IPC Classes  ?

• A61K 8/97 - Cosmetics or similar toiletry preparations characterised by the composition containing materials, or derivatives thereof, of undetermined constitution from derivatives thereof
• A61Q 17/04 - Topical preparations for affording protection against sunlight or other radiation; Topical sun tanning preparations

Abstract

A bonding head for holding a substrate to be soldered includes a laser source, a vacuum source, a main body and a holding nozzle. A laser duct extends through the main body to a laser exit. The vacuum source creates a vacuum in the laser duct. The laser source directs the laser beam through the laser duct towards the laser exit. The holding nozzle is connected to the main body. A nozzle duct extends through the holding nozzle from a nozzle entry to a nozzle exit. The nozzle entry is adjacent to the laser exit. The holding nozzle is configured to hold the substrate at the nozzle exit when the vacuum source creates the vacuum in the laser duct. The laser beam passes through the nozzle duct and is directed towards the substrate. The holding nozzle is configured to hold the substrate over a mounting face of a second substrate.

IPC Classes  ?

• B23K 37/04 - Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the other main groups of this subclass for holding or positioning work
• B23K 26/20 - Bonding
• B23K 26/70 - Auxiliary operations or equipment
• B23Q 3/08 - Work-clamping means other than mechanically-actuated

Abstract

Provided is a resin composition for three-dimensional photofabrication which, after curing, melts at a relatively low temperature of about 200° C. and which is excellent in fabricability. The present invention relates to a resin composition for three-dimensional photofabrication, containing a reactive material having in a molecule thereof an acetal structure and a crosslinkable double bond.

IPC Classes  ?

• C08L 33/08 - Homopolymers or copolymers of acrylic acid esters
• B22C 9/10 - Cores; Manufacture or installation of cores
• B29C 64/124 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
• B29L 31/00 - Other particular articles
• B33Y 10/00 - Processes of additive manufacturing
• B33Y 70/00 - Materials specially adapted for additive manufacturing
• B33Y 80/00 - Products made by additive manufacturing
• C08K 5/13 - Phenols; Phenolates
• C08K 5/37 - Thiols
• C08K 5/5397 - Phosphine oxides

Abstract

A device for handling a test contact in which the device includes a contact head provided with a test contact receptacle at its contact end, the test contact receptacle having a positioning unit having at least two, preferably three, positioning surfaces for coming into positioning contact with a test contact and for positioning the test contact relative to the contact end of the contact head. The at least one positioning surface of the positioning unit being formed as a base contact surface and at least one more positioning surface of the positioning unit being formed as an edge contact surface. Furthermore, a manufacturing system is also provided for manufacturing a test contact arrangement for testing semiconductor components.

IPC Classes  ?

• G01R 1/067 - Measuring probes
• G01R 3/00 - Apparatus or processes specially adapted for the manufacture of measuring instruments

Abstract

To improve convenience in providing a service using a blockchain.　This information processing system comprises: a main system 2 on an in-company network; and a node terminal 1 that is constituted of an operation terminal 1-1 that connects with the in-company network via a protected communication path L1 and a BC processing device 1-2 that connects with the operation terminal 1-1 via a directly connected communication path L2, and functions as a node belonging to a blockchain network pertaining to a blockchain. A processing execution unit 61 of the BC processing device 1-2 executes processing pertaining to the blockchain. A communication control unit 62 executes, in accompaniment with the processing, control to transmit transmission information from the processing execution unit 61 to the main system 2 via the operation terminal 1-1, and control to receive reception information from the main system 2 via the operation terminal 1-1 and provide the reception information to the processing execution unit 61.

IPC Classes  ?

• G06F 21/62 - Protecting access to data via a platform, e.g. using keys or access control rules
• G06F 21/44 - Program or device authentication
• G06F 21/64 - Protecting data integrity, e.g. using checksums, certificates or signatures

Abstract

According to the present invention, a conductive composition containing a carbon material improves filter filterability while maintaining conductivity. The present invention pertains to a conductive composition comprising a carbon material, a dispersant, and a solvent, wherein: the cumulative particle diameter D50 measured by a dynamic light scattering method is at most 200 nm; and the surface resistivity of a coating film formed with a film thickness of 1-100 nm is at most 1×1010 Ω/□.

IPC Classes  ?

• H01B 1/24 - Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon, or silicon
• B32B 7/025 - Electric or magnetic properties
• B32B 27/00 - Layered products essentially comprising synthetic resin
• C09J 7/38 - Pressure-sensitive adhesives [PSA]
• H01B 5/14 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
• H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables

Abstract

The purpose of the present invention is to provide a degradable crosslinking agent having an excellent degradation rate. The present invention pertains to a degradable crosslinking agent comprising a compound represented by formula (1). After crosslinking, the degradable crosslinking agent produces, through a reaction with an oxidizing agent, a water-soluble decomposition product that is a Z-containing carboxylic acid, alcohol, amine, or thiol, and that has a solubility to water of at least 30 g/L. In formula (1), • n≥1, k≥0, m≥0, p1≥1, p2≥1, and p3≥1 are satisfied. • R1, R2, and R3each independently represent a single bond or a hydrocarbon group that has 1-500 carbon atoms and that optionally has a substituent or a heteroatom. • Q1, Q2, and Q3 each independently represent at least one reactive functional group selected from the group consisting of a hydroxyl group, an amino group, a thiol group, a hydrazide group, a carboxylic acid group, an acid anhydride group, a vinyl group, an allyl group, an acrylate group, a methacrylate group, a crotonate group, an isoprenyl group, an acrylamide group, a methacrylamide group, a crotonamide group, an epoxy group, an oxetane group, an oxazoline group, an isocyanate group, a carbodiimide group, a methylol group, a silanol group, a hydroxysilyl group, and an alkoxysilyl group. • Each A independently represents a carbonyl group or a single bond. • Each Z independently represents a group having a valance of two or more and including a siloxane structure, or a hydrocarbon group having 1-500 carbon atoms and optionally having a heteroatom.

IPC Classes  ?

• C08L 101/00 - Compositions of unspecified macromolecular compounds
• C07C 271/12 - Esters of carbamic acids having oxygen atoms of carbamate groups bound to acyclic carbon atoms with the nitrogen atoms of the carbamate groups bound to hydrogen atoms or to acyclic carbon atoms to hydrogen atoms or to carbon atoms of unsubstituted hydrocarbon radicals
• C08F 16/28 - Monomers containing nitrogen
• C08F 20/60 - Amides containing nitrogen in addition to the carbonamido nitrogen

Abstract

The present invention provides a degradable crosslinking agent having high solubility in a solvent. The present invention pertains to a degradable crosslinking agent comprising a compound represented by formula (1). In formula (1), ∙ n≥0, k≥0, m≥0, p1≥1, p2≥1, and p3≥1. ∙ R1, R2, and R3are each independently a single bond or a C1-C500 hydrocarbon which may have a substituent or a heteroatom. ∙ Q1, Q2, and Q3are each independently at least one reactive functional group selected from the group consisting of a hydroxyl group, an amino group, a thiol group, a hydrazide group, a carboxylic acid group, an acid anhydride group, a vinyl group, an allyl group, an acrylate group a methacrylate group, a crotonate group, an isoprenyl group, an acrylamide group, a methacrylamide group, a crotonamide group, an epoxy group, an oxetane group, an oxazoline group, an isocyanate group, a carbodiimide group, a methylol group, a silanol group, a hydroxysilyl group, and an alkoxysilyl group. ∙ X1a, X1b, X2a, X2b, X3a, X3b, X4a, and X4bare each independently an oxygen atom, a sulfur atom, a single bond, a C1-C20 hydrocarbon group which may have a substituent, or –NB- (B is a hydrogen atom or a hydrocarbon group), where at least one among X1a, X1b, X2a, X2b, X3a, X3b, X4a, and X4bis an oxygen atom, a sulfur atom, or –NB- (B is a hydrogen atom or a hydrocarbon group). ∙ A1-A8are carbonyl groups or single bonds, at least one among A1and A2is a carbonyl group, at least one among A3and A4is a carbonyl group, at least one among A5and A6is a carbonyl group, and at least one among A7and A8 is a carbonyl group. ∙ Zs are each independently a di- or higher-valent group containing a siloxane structure or a C1-C500 hydrocarbon group which may have a heteroatom.

IPC Classes  ?

• C08L 101/00 - Compositions of unspecified macromolecular compounds
• C07C 271/12 - Esters of carbamic acids having oxygen atoms of carbamate groups bound to acyclic carbon atoms with the nitrogen atoms of the carbamate groups bound to hydrogen atoms or to acyclic carbon atoms to hydrogen atoms or to carbon atoms of unsubstituted hydrocarbon radicals
• C08K 5/24 - Derivatives of hydrazine

Abstract

This patent provides technology by which the risk of data destruction during data transmission can be further reduced. On the basis of sensor information, a data block generation unit 32g generates a data block BD1, a data block BD2, and a data block BD3. A first processing unit 33g generates second association information FT1, and appends the same to the data block BD2 as first association information HD2. A second processing unit 34g generates second association information FT2 including at least a hash value obtained from the data block BD2, and appends the same to the data block BD2. A storage control unit 36g executes control whereby the data block BD2, to which the first association information HD2 and the second association information FT2 have been appended, is correlated to at least one other unit of data, including the data block BD1, by using blockchain technology, and stores the same in a storage unit 12g. The abovementioned problem is thus solved.

IPC Classes  ?

• H04L 9/40 - Network security protocols

Goods & Services

Industrial chemicals; epoxy resins, unprocessed; plastics [raw materials].

Abstract

The present invention addresses the problem of providing means for enhancing the spiciness of a spice. The problem is solved by providing an agent for enhancing spiciness, the agent containing glucosyl naringenin.

IPC Classes  ?

• A23L 27/00 - Spices; Flavouring agents or condiments; Artificial sweetening agents; Table salts; Dietetic salt substitutes; Preparation or treatment thereof

Abstract

A method for producing a conductive member in which an insulating film is interposed between two metal plates includes: a first molding step for forming an intermediate product in which a solidified, insulating first resin covers the insulating film, such that the insulating film is at least partially exposed; and a second molding step for covering sandwiching parts of the two metal plates with an insulating second resin in a state where at least a portion of the exposed part of the insulating film of the intermediate product is sandwiched between the two metal plates.

IPC Classes  ?

• H01B 19/00 - Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
• B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
• B29C 45/16 - Making multilayered or multicoloured articles
• B29K 705/00 - Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
• B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof
• H01B 7/02 - Disposition of insulation

Abstract

An object of the present invention is to provide a moving object utilization system and a moving object utilization method capable of grasping whether a moving object to be used by a user is appropriately used or has appropriately been used. An object of the present invention is to provide a moving object utilization system and a moving object utilization method capable of grasping whether a moving object to be used by a user is appropriately used or has appropriately been used. A moving object utilization system comprising a plurality of user terminals operated by a plurality of respective users; and a server device capable of establishing communication connection with the user terminals, the moving object utilization system providing a service for the plurality of users to use a moving object in turn, wherein the server device includes an information transmitter that transmits user information on one user who is using a moving object and/or using state information on a using state of a moving object to another user terminal operated by another user different from the one user.

IPC Classes  ?

• G06Q 10/02 - Reservations, e.g. for tickets, services or events
• G06Q 30/0645 - Rental transactions; Leasing transactions
• G06Q 50/43 - Business processes related to the sharing of vehicles, e.g. car sharing
• G07C 5/00 - Registering or indicating the working of vehicles

Abstract

The present invention provides a water-absorbing resin that is excellent in water absorption performance and is easy to be degraded. The present invention relates to a water-absorbing resin, which is a crosslinked product of a glucose polymer and forms a physical gel upon absorption of water, wherein the glucose polymer is a starch or a partially degraded starch, with an acidic group introduced therein.

IPC Classes  ?

• C08J 3/075 - Macromolecular gels
• C08J 11/10 - Recovery or working-up of waste materials of polymers by chemically breaking down the molecular chains of polymers or breaking of crosslinks, e.g. devulcanisation

Abstract

A chip comprising a non-conductive substrate layer and at least one conductor path disposed on the substrate layer, the solder contact surface being at least partially formed on the conductor path, and a method for producing the solder contact surface on the chip including the steps of: applying a sinter paste to a contact location at least partially located on the conductor path, the sinter paste comprising particles of at least one soft-solderable and conductive material and at least one solvent; and evaporating the solvent.

IPC Classes  ?

• H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices

Goods & Services

Industrial chemicals; epoxy resins, unprocessed; unprocessed plastics being raw materials, all of the foregoing being environmentally friendly.

Abstract

A composition in which L-ergothioneine (EGT) and S-ribosylhomocysteine (SRH) coexist makes it is possible to suppress coloring of the composition. A composition comprising EGT and SRH is prepared in which the content of SRH is reduced.

IPC Classes  ?

• A61K 31/417 - Imidazole-alkylamines, e.g. histamine, phentolamine
• A61K 31/70 - Carbohydrates; Sugars; Derivatives thereof

Goods & Services

Chemicals; chemicals for use in industry; chemical preparations for use in industry; chemical additives for use in the manufacture of food; glue and adhesives for industrial purposes; plant growth regulating preparations; fertilizers; priming putty; higher fatty acids; non-metallic minerals; chemical compositions for developing and printing photographs; artificial sweeteners for industrial purposes; flour and starch for industrial purposes; plastics [raw materials]; groundwood pulp or chemical pulps for manufacturing purposes; carbonic hydrates; organic acids and their salts; chemical agents; chemical reagents, other than for medical or veterinary purposes; biological preparation for use in cell cultures other than for medical or veterinary use; cell culture reagents for scientific and research use; oligosaccharides; glycoprotein; enzymes for industrial purposes; antifreeze; damp proofing agents; surface-active agents [surfactants]; anti-aging agents in the nature of chemical preparations; starch for industrial purposes; excipients. Dietary fibre; nutritional supplements; pharmaceutical preparations; chemical preparations for medical purposes; sugar for medical purposes; saccharide preparations for medical purposes; trehalose for medical purposes; maltose for medical purposes; sucrose for medical purposes; fructose for medical purposes; glucose for medical purposes; amino acids for medical purposes; intravenous fluids used for rehydration, nutrition and the delivery of pharmaceutical preparations; lacteal flour for babies; pharmaceutical preparations and other preparations for destroying vermin fungicides herbicides; reagent paper for medical purposes; oiled paper for medical purposes; drug delivery agents in the form of edible wafers for wrapping powdered pharmaceuticals; gauze for dressings; empty capsules for pharmaceuticals; eyepatches for medical purposes; ear bandages; menstruation bandages; menstruation tampons; sanitary napkins; sanitary panties; absorbent cotton; adhesive plasters; bandages for dressings; liquid bandages; breast-nursing pads; cotton swabs for medical use; dental materials; dietary supplements for human beings; dietetic beverages adapted for medical purposes; dietetic foods adapted for medical purposes; beverages for babies; food for babies; dietary supplements for animals. Binding agents for ice cream; preparations for stiffening whipped cream; meat tenderizers for culinary purposes; aromatic preparations for food, not from essential oils; tea; prepared coffee and coffee-based beverages; cocoa [roasted, powdered, granulated, or in drinks]; ice; sweets, confectionery and cereal, rice, grain or chocolate based snacks, other than meat-based, fish-based, fruit-based, vegetable-based, bean-based or nut-based; bread and buns; sandwiches; steamed buns stuffed with minced meat [Chuka-manjuh]; hamburgers [sandwiches]; pizzas; hot dog sandwiches; meat pies; miso; cube sugar; fructose for culinary purposes; crystal sugar [not confectionery]; sugar; maltose for culinary purposes; honey; glucose for culinary purposes; powdered starch syrup for culinary purposes; starch syrup for culinary purposes; artificial sweeteners for culinary purposes; table salt mixed with sesame seeds; cooking salt; roasted and ground sesame seeds; celery salt; umami seasonings; spices; ice cream mixes; sherbet mixes; unroasted coffee beans; cereal preparations; chocolate spread; yeast powder; koji [fermented malted rice]; yeast; baking powder; instant confectionery mixes; pasta sauce; by-product of rice for food [sake lees]; husked rice; husked oats; husked barley; gluten for food; flour; trehalose for food; natural sweeteners; starch for food; mixed spice powder; bread mixes in powder form; tea-based beverages; coffee-based beverages; cocoa-based beverages; chocolate-based beverages; almond paste. Price comparison services; market intelligence services; provision of an online marketplace for buyers and sellers of goods and services; compilation of statistics; business management; import-export agencies; computerized file management; systemization of information into computer databases; updating and maintenance of data in computer databases; data search in computer files for others; registration of written communications and data; compilation of information into computer databases; providing commercial information and advice for consumers in the choice of products and services; providing information about newspaper articles being news clipping services; advertising and publicity services; planning and preparing of advertisements using brochures, catalogues and posters; production of advertising videos; production of models, reproductions, replicas and specimens for advertising; management of import and export business; commercial intermediation services; procurement services for others [purchasing goods and services for other businesses]; commercial information agency services; business management analysis or business consultancy; marketing research or analysis; providing information concerning commercial sales; business consultancy services relating to launching of products and sales promotions; investigation, analysis, diagnosis and consultancy relating to corporatization or new business; advisory services relating to professional business; consultancy services relating to corporate management and product sales; import-export agencies and consulting and providing information relating thereto; import-export agency services including business administration services relating to customs clearance; administrative services relating to customs clearance; retail services or wholesale services for chemicals; retail services or wholesale services for plastics [raw materials]; retail services or wholesale services for dyes and colorants; retail services or wholesale services for pigments; retail services or wholesale services for paints; retail services or wholesale services for cosmetics, toiletries, dentifrices, soaps and detergents; retail services or wholesale services for perfumery, fragrances and incense; retail services or wholesale services for pharmaceutical preparations and other preparations for destroying vermin fungicides herbicides; retail services or wholesale services for plastic processing machines; retail services or wholesale services for semiconductor manufacturing machines; retail services or wholesale services for liquid crystal displays manufacturing machines; retail services or wholesale services for laboratory apparatus and instruments; retail services or wholesale services for measuring or testing machines and instruments; retail services or wholesale services for telecommunications apparatus; retail services or wholesale services for electronic machines and apparatus; retail services or wholesale services for plastic semi-worked products; retail services or wholesale services for dietary supplements for humans; retail services or wholesale services for dietetic foods and beverages adapted for medical purposes; retail services or wholesale services for processed food; retail services or wholesale services for foods and beverages; retail services or wholesale services for electrical machinery and apparatuses; retail services or wholesale services for natural sweetener; retail services or wholesale services for artificial sweeteners; retail services or wholesale services for seasonings [other than spices]; retail services or wholesale services for fertilizers; retail services or wholesale services for plant growth regulating preparations; retail services or wholesale services for sharpening preparations; retail services or wholesale services for building materials; retail services or wholesale services for chemicals for use as an additive to foods.

Abstract

The purpose of the present invention is to provide a novel means for improving the mouthfeel of a protein-containing ingredient and to provide a food/beverage product composition containing a protein-containing ingredient that has an excellent mouthfeel.　Using glucosyl naringin makes it possible to improve the mouthfeel of a protein-containing ingredient.

IPC Classes  ?

• A23L 27/20 - Synthetic spices, flavouring agents or condiments
• A21D 13/064 - Products with modified nutritive value, e.g. with modified starch content with modified protein content
• A23C 11/02 - Milk substitutes, e.g. coffee whitener compositions containing at least one non-milk component as source of fats or proteins
• A23G 1/44 - Cocoa products, e.g. chocolate; Substitutes therefor characterised by the composition containing peptides or proteins
• A23G 9/38 - Frozen sweets, e.g. ice confectionery, ice-cream; Mixtures therefor characterised by the composition containing peptides or proteins
• A23J 3/08 - Dairy proteins
• A23J 3/14 - Vegetable proteins
• A23J 3/16 - Vegetable proteins from soybean
• A23L 2/00 - Non-alcoholic beverages; Dry compositions or concentrates therefor; Their preparation
• A23L 2/38 - Other non-alcoholic beverages
• A23L 2/52 - Adding ingredients
• A23L 2/66 - Proteins
• A23L 5/00 - Preparation or treatment of foods or foodstuffs, in general; Food or foodstuffs obtained thereby; Materials therefor
• A23L 11/00 - Pulses, i.e. fruits of leguminous plants, for production of food; Products from legumes; Preparation or treatment thereof
• A23L 11/65 - Soy drinks

Abstract

A method for producing ergothioneine or a related substance, where the method includes culturing a microorganism having an ergothioneine biosynthetic gene with an increased adenosine kinase (Adk) activity, and collecting the ergothioneine, a related substance thereof, or a mixture thereof from the medium obtained by the culture or the bacterial cells.

IPC Classes  ?

• C12P 13/04 - Alpha- or beta-amino acids
• C12N 9/12 - Transferases (2.) transferring phosphorus containing groups, e.g. kinases (2.7)
• C12N 15/70 - Vectors or expression systems specially adapted for E. coli

Abstract

An information processing apparatus includes a converting portion having a plurality of electrical conductors to be arranged in mutual separation and a medium arranged so as to mutually connect the plurality of electrical conductors, wherein the converting portion is the information processing apparatus to convert an input signal to an output signal. The medium includes the electrolyte and is configured to be capable of controlling an electrical conductivity of an electrically conductive path mutually electrically connecting the plurality of electrical conductors, and the medium is selected such that the electrical conductivity of the electrically conductive path changes over time with the input signal not being present.

IPC Classes  ?

• H01B 7/00 - Insulated conductors or cables characterised by their form

Abstract

Provided is a resin composition capable of providing a three-dimensionally photofabricated object having high heat resistance while having water solubility. The resin composition is a resin composition for three-dimensional photofabrication containing a reactive monomer, a water-soluble polymer, and a photopolymerization initiator. A cured product of the resin composition has a main tan δ peak temperature of 80° C. or higher. A 1-mm-thick cured product of the resin composition exhibits a remaining thickness of 0.7 mm or smaller after 5-hour immersion in water that is at room temperature.

IPC Classes  ?

• C08F 283/06 - Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass on to polyethers, polyoxymethylenes or polyacetals
• B29C 33/38 - SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING - Details thereof or accessories therefor characterised by the material or the manufacturing process
• B29C 33/76 - Cores
• B29C 45/26 - Moulds
• B29C 64/35 - Cleaning
• B33Y 10/00 - Processes of additive manufacturing
• B33Y 40/20 - Post-treatment, e.g. curing, coating or polishing
• B33Y 70/00 - Materials specially adapted for additive manufacturing
• B33Y 80/00 - Products made by additive manufacturing
• C08F 283/02 - Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass on to polycarbonates or saturated polyesters
• C09D 151/08 - Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds

Abstract

A soldering apparatus includes an application device, a conveying device and an application nozzle. The application device has a laser duct extending straight from a laser entry at the top to a laser exit at the bottom and a drop duct that extends from a drop entry at the top to a drop exit at the bottom of the application device. The conveying device separately conveys solder bodies to the drop entry. The application nozzle temporarily holds solder bodies received from the drop exit. The laser and drop ducts are interconnected over their entire lengths from the top to the bottom of the application device. The drop entry and laser entry are side by side and form a common entry. The drop exit and laser exit are spatially coincident and form a common exit that is smaller than the common entry. The application nozzle is connected to the common exit.

IPC Classes  ?

• B23K 1/005 - Soldering by means of radiant energy
• B23K 3/06 - Solder feeding devices; Solder melting pans
• B23K 3/08 - Auxiliary devices therefor

Abstract

The invention relates to a depositing station comprising a basin arrangement (11) having a basin (13) forming a processing chamber (12) and serving to receive a solution of a metal, in particular nickel, zinc, palladium, gold or the like, dissolved in a liquid, for a, preferably electroless, deposition on an object receivable in the processing chamber, in particular on a terminal face of a wafer receivable in the processing chamber, the basin having at least one inlet (17) for introducing the solution into the basin, the basin having a perforation (18) which forms at least part of the inlet of the basin and which is configured to homogeneously introduce the solution into the processing chamber. Furthermore, the invention relates to a device for producing contact metallizations on terminal faces of wafers, comprising at least one depositing station.

IPC Classes  ?

• C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, i.e. electroless plating

Abstract

Provided is a photocurable resin composition including a reactive compound, and a photopolymerization initiator. A cured product of the photocurable resin composition has two or more glass transition points including a TgA and a TgB. The TgA is less than 25° C., and the TgB is 25° C. or more. An elongation at break in accordance with ASTM D638 of the cured product of the photocurable resin composition is 130% or more, and a breaking strength in accordance with ASTM D638 of the cured product of the photocurable resin composition is 3 MPa or more.

IPC Classes  ?

• C08F 2/48 - Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
• B29C 64/129 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
• B33Y 10/00 - Processes of additive manufacturing

Abstract

The invention relates to a method for separating a semiconductor component (21) from a carrier (22), wherein the semiconductor component (21) is integrally bondedly held in a bonding plane (24) on a carrier (22) by means of a metal-containing bonding medium (23), comprising the following steps: a. liquefying the bonding medium (23) and taking hold of the semiconductor component (21) by means of a holding tool (11); b. oscillating the holding tool (11); and c. moving the holding tool (11) and separating the semiconductor component (21) from the carrier (22). Furthermore, the invention relates to a device (10) for separating a semiconductor component (21) integrally bondedly held on a carrier (22) by means of a bonding medium (23), comprising a holding tool (11) and at least one drive.

IPC Classes  ?

• H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
• H05K 13/04 - Mounting of components
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components

Abstract

A method for sealing an electronic component mounting substrate including: preparing an electronic component mounting substrate including a substrate and electronic components mounted thereon and having a space between an electronic component and the substrate; placing a thermosetting sheet on the electronic component mounting substrate; and heat-molding the placed thermosetting sheet, to allow a melt of the thermosetting sheet to fill the space between the electronic component and the substrate and be cured. When a distance between the center of the substrate and an optional point P on a frame line that surrounds all the electronic components and minimizes the surrounded area is denoted by Lp, a distance Lq between the center of the substrate and a point Q at which a straight line passing through the point P and the center of the substrate intersects with an outer periphery of the thermosetting sheet is 0.9Lp or more.

IPC Classes  ?

• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

Provided is a novel cupper efflux oxidase (CueO) variant having improved activity compared to wild types. A protein according to one or more embodiments of the present invention has laccase activity and comprises the amino acid sequence of [1] or [2]: [1] the amino acid sequence of SEQ ID NO: 14 into which mutations (a) and (b) have been introduced, mutation (a) being substitution of D360 with another amino acid other than D, and mutation (b) being at least one selected from substitution of G304 with another amino acid other than G, substitution of D373 with another amino acid other than D, and substitution of Q374 with another amino acid other than Q, the amino acid sequence including at least a region from position 29 to position 516; [2] the amino acid sequence having at least 90% sequence identity with the amino acid of [1], in which amino acid residues corresponding to position 360, position 304, position 373, and position 374 of the amino acid sequence of SEQ ID NO: 14 are identical to those of the amino acid sequences of [1].

IPC Classes  ?

• C12N 15/53 - Oxidoreductases (1)
• C12N 1/15 - Fungi ; Culture media therefor modified by introduction of foreign genetic material
• C12N 1/19 - Yeasts; Culture media therefor modified by introduction of foreign genetic material
• C12N 1/21 - Bacteria; Culture media therefor modified by introduction of foreign genetic material
• C12N 5/10 - Cells modified by introduction of foreign genetic material, e.g. virus-transformed cells
• C12N 9/02 - Oxidoreductases (1.), e.g. luciferase
• C12P 7/00 - Preparation of oxygen-containing organic compounds
• H01M 4/90 - Selection of catalytic material
• H01M 8/1004 - Fuel cells with solid electrolytes characterised by membrane-electrode assemblies [MEA]
• H01M 8/1016 - Fuel cells with solid electrolytes characterised by the electrolyte material
• H01M 8/16 - Biochemical fuel cells, i.e. cells in which microorganisms function as catalysts

Abstract

The present invention provides a method for manufacturing a three-dimensional shaped article and an inset for production of a three-dimensional shaped article which make it possible to produce a three-dimensional shaped article with good shaping precision, even when producing a three-dimensional shaped article that has a complex shape and that is made from a soft material, for example. The present invention relates to a method for manufacturing a three-dimensional shaped article, said method comprising: a step for respectively discharging (a) a model material ink which contains a photo-crosslinkable polymer and (b) a support material ink which contains a support material and a first crosslinking factor; a step for photo-curing the discharged photo-crosslinkable polymer; and a step for removing a molded article of the support material ink.

IPC Classes  ?

• B29C 64/40 - Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof
• B29C 64/112 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
• B33Y 10/00 - Processes of additive manufacturing
• B33Y 70/00 - Materials specially adapted for additive manufacturing

Abstract

There is a problem in the supply of ovothiol A and related substances. The present disclosure provides a method for manufacturing ovothiol A or a related substance.　This method for manufacturing ovothiol A or a related substance or a mixture of these includes: (a) cultivating, in a culture medium, a microorganism that has at least one gene selected from an ovoA gene, an ovoB gene, and an egt2 gene; and (b) harvesting ovothiol A or a related substance or a mixture of these from the culture medium and/or bacterial cells, said culture medium and/or bacterial cells having been obtained through the aforementioned cultivation.

IPC Classes  ?

• C12P 11/00 - Preparation of sulfur-containing organic compounds
• C12P 13/04 - Alpha- or beta-amino acids
• C12N 1/14 - Fungi ; Culture media therefor
• C12N 1/15 - Fungi ; Culture media therefor modified by introduction of foreign genetic material
• C12N 1/16 - Yeasts; Culture media therefor
• C12N 1/19 - Yeasts; Culture media therefor modified by introduction of foreign genetic material
• C12N 1/20 - Bacteria; Culture media therefor
• C12N 1/21 - Bacteria; Culture media therefor modified by introduction of foreign genetic material
• C12N 15/31 - Genes encoding microbial proteins, e.g. enterotoxins

Abstract

The present invention provides an absorbent article that contains a water absorbent resin having excellent water absorption performance. The present invention relates to an absorbent article that contains a water absorbent resin comprising a water-soluble polymer in which an acidic group is introduced into starch or a partial degradation product thereof.

IPC Classes  ?

• C08B 31/10 - Alkyl or cycloalkyl ethers
• A61F 13/53 - Absorbent pads, e.g. sanitary towels, swabs or tampons for external or internal application to the body; Supporting or fastening means therefor; Tampon applicators characterised by the absorbing medium
• A61K 47/36 - Polysaccharides; Derivatives thereof, e.g. gums, starch, alginate, dextrin, hyaluronic acid, chitosan, inulin, agar or pectin
• A61L 27/20 - Polysaccharides
• B01J 20/26 - Synthetic macromolecular compounds
• A23L 5/00 - Preparation or treatment of foods or foodstuffs, in general; Food or foodstuffs obtained thereby; Materials therefor
• A61L 15/22 - Bandages, dressings or absorbent pads for physiological fluids such as urine or blood, e.g. sanitary towels, tampons containing macromolecular materials

Abstract

A structure 100 is provided with a fiber substrate 35 and a resin matrix 30 impregnated in the fiber substrate 35. The fibers of the fiber substrate 35: comprise an organic material core and an organic material modified layer which covers at least a portion of the surface of the core; and satisfy either (a) or (b).　(a) An intermolecular attractive force acts between a functional group in the modified layer and a functional group in the resin matrix.　(b) The modified layer and the resin matrix are bonded by a molecular chain.

IPC Classes  ?

• C08J 5/04 - Reinforcing macromolecular compounds with loose or coherent fibrous material
• B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
• B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
• C08K 7/02 - Fibres or whiskers
• C08L 101/00 - Compositions of unspecified macromolecular compounds
• D06M 10/02 - Physical treatment of fibres, threads, yarns, fabrics or fibrous goods made from such materials, e.g. ultrasonic, corona discharge, irradiation, electric currents or magnetic fields; Physical treatment combined with treatment with chemical compounds or elements ultrasonic or sonic; Corona discharge
• H05K 1/03 - Use of materials for the substrate

Abstract

A sheet for molding/underfill encapsulation of a printed circuit board comprising a plurality of electronic components and a substrate and having spaces between the electronic components and the substrate, the sheet being made of a heat-curable resin composition. When examined at 125°C over 150 seconds, the sheet has an increase in viscosity, which is a ratio (V90/V0) of the viscosity V90 measured at 90 seconds after initiation of the examination of the sheet to the viscosity V0 measured at 0 second thereafter, of less than 9.

IPC Classes  ?

• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• C08L 101/00 - Compositions of unspecified macromolecular compounds
• C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Goods & Services

Binding agents for ice cream; preparations for stiffening whipped cream; meat tenderizers for culinary purposes; aromatic preparations for food, not from essential oils; tea; prepared coffee and coffee-based beverages; cocoa [roasted, powdered, granulated, or in drinks]; ice; sweets, confectionery and cereal, rice, grain or chocolate based snacks, other than meat-based, fish-based, fruit-based, vegetable-based, bean-based or nut-based; bread and buns; sandwiches; steamed buns stuffed with minced meat [Chuka-manjuh]; hamburgers [sandwiches]; pizzas; hot dog sandwiches; meat pies; miso; cube sugar; fructose for culinary purposes; crystal sugar [not confectionery]; sugar; maltose for culinary purposes; honey; glucose for culinary purposes; powdered starch syrup for culinary purposes; starch syrup for culinary purposes; artificial sweeteners for culinary purposes; table salt mixed with sesame seeds; cooking salt; roasted and ground sesame seeds; celery salt; umami seasonings; spices; ice cream mixes; sherbet mixes; unroasted coffee beans; cereal preparations; chocolate spread; yeast powder; koji [fermented malted rice]; yeast; baking powder; instant confectionery mixes; pasta sauce; by-product of rice for food [sake lees]; husked rice; husked oats; husked barley; gluten for food; flour; trehalose for food; natural sweeteners; starch for food; mixed spice powder; bread mixes in powder form; tea-based beverages; coffee-based beverages; cocoa-based beverages; chocolate-based beverages; almond paste.

Goods & Services

(1) Chemicals; chemicals for use in industry; chemical preparations for use in industry; chemical additives for use in the manufacture of food; glue and adhesives for industrial purposes; plant growth regulating preparations; fertilizers; priming putty; higher fatty acids; non-metallic minerals; chemical compositions for developing and printing photographs; artificial sweeteners for industrial purposes; flour and starch for industrial purposes; plastics [raw materials]; groundwood pulp or chemical pulps for manufacturing purposes; carbonic hydrates; organic acids and their salts; chemical agents; chemical reagents, other than for medical or veterinary purposes; biological preparation for use in cell cultures other than for medical or veterinary use; cell culture reagents for scientific and research use; oligosaccharides; glycoprotein; enzymes for industrial purposes; antifreeze; damp proofing agents; surface-active agents [surfactants]; anti-aging agents in the nature of chemical preparations; starch for industrial purposes; excipients. (2) Dietary fibre; nutritional supplements; pharmaceutical preparations; chemical preparations for medical purposes; sugar for medical purposes; saccharide preparations for medical purposes; trehalose for medical purposes; maltose for medical purposes; sucrose for medical purposes; fructose for medical purposes; glucose for medical purposes; amino acids for medical purposes; intravenous fluids used for rehydration, nutrition and the delivery of pharmaceutical preparations; lacteal flour for babies; pharmaceutical preparations and other preparations for destroying vermin fungicides herbicides; reagent paper for medical purposes; oiled paper for medical purposes; drug delivery agents in the form of edible wafers for wrapping powdered pharmaceuticals; gauze for dressings; empty capsules for pharmaceuticals; eyepatches for medical purposes; ear bandages; menstruation bandages; menstruation tampons; sanitary napkins; sanitary panties; absorbent cotton; adhesive plasters; bandages for dressings; liquid bandages; breast-nursing pads; cotton swabs for medical use; dental materials; dietary supplements for human beings; dietetic beverages adapted for medical purposes; dietetic foods adapted for medical purposes; beverages for babies; food for babies; dietary supplements for animals. (3) Binding agents for ice cream; preparations for stiffening whipped cream; meat tenderizers for culinary purposes; aromatic preparations for food, not from essential oils; tea; prepared coffee and coffee-based beverages; cocoa [roasted, powdered, granulated, or in drinks]; ice; sweets, confectionery and cereal, rice, grain or chocolate based snacks, other than meat-based, fish-based, fruit-based, vegetable-based, bean-based or nut-based; bread and buns; sandwiches; steamed buns stuffed with minced meat [Chuka-manjuh]; hamburgers [sandwiches]; pizzas; hot dog sandwiches; meat pies; miso; cube sugar; fructose for culinary purposes; crystal sugar [not confectionery]; sugar; maltose for culinary purposes; honey; glucose for culinary purposes; powdered starch syrup for culinary purposes; starch syrup for culinary purposes; artificial sweeteners for culinary purposes; table salt mixed with sesame seeds; cooking salt; roasted and ground sesame seeds; celery salt; umami seasonings; spices; ice cream mixes; sherbet mixes; unroasted coffee beans; cereal preparations; chocolate spread; yeast powder; koji [fermented malted rice]; yeast; baking powder; instant confectionery mixes; pasta sauce; by-product of rice for food [sake lees]; husked rice; husked oats; husked barley; gluten for food; flour; trehalose for food; natural sweeteners; starch for food; mixed spice powder; bread mixes in powder form; tea-based beverages; coffee-based beverages; cocoa-based beverages; chocolate-based beverages; almond paste.

Goods & Services

Adhesives for industrial purposes; plastics [raw materials]; synthetic resins, unprocessed; epoxy resins, unprocessed. Electrical insulating materials; electrical insulating materials in the form of films, tapes, pastes, liquids and sheets; plastic semi-worked products; synthetic resins, semi-processed.

Abstract

The present invention provides a method for manufacturing a three-dimensional object and an ink set for manufacturing a three-dimensional object, whereby it is possible to manufacture a three-dimensional object with good modeling accuracy, for example, even when manufacturing a complex-shaped three-dimensional object made of soft materials. The present invention pertains to a method for manufacturing a three-dimensional object, the method comprising the steps of: discharging (a) a modelling material ink containing a crosslinkable polymer and (b) a support material ink containing a support material, respectively; and removing an object from the support material ink after crosslinking the crosslinkable polymer, wherein either one of the modelling material ink (a) and the support material ink (b) further contains a hydrogen peroxide decomposer, the other further contains hydrogen peroxide or a hydrogen peroxide donor, and the discharged hydrogen peroxide decomposer decomposes discharged hydrogen peroxide and crosslinks the crosslinkable polymer, thereby creating a three-dimensional object.

IPC Classes  ?

• B29C 64/112 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
• B29C 64/314 - Preparation
• B29C 64/40 - Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof
• B33Y 10/00 - Processes of additive manufacturing
• B33Y 70/00 - Materials specially adapted for additive manufacturing

Abstract

The invention relates to a device (01) for establishing a contact connection between at least one connection contact (18) of a substrate (04) and at least one connection contact (19) of a semiconductor component (03), wherein a conductor material path is formed on the substrate (04) and the semiconductor component (03) is preferably a chip. The device has a joining tool (02) for positioning and joining the semiconductor component (03) on/to the substrate (04), a beam channel (20) for optical radiation being formed inside the joining tool (02), and has a laser apparatus (07) for applying laser radiation to the substrate (04) and/or the semiconductor component (03), and has a detection apparatus (14, 17) for detecting optical radiation, and has a substrate support (05) on which the substrate (04) can be fixed in place and with which at least one bottom side (41) of the substrate (04) can be brought into contact. An optical window (06) having an optically transparent window body is incorporated in the substrate support (05) for the unobstructed passage of optical radiation into and/or out of the substrate (04), wherein the optical window (06) is located in a beam path (10) of the laser apparatus (07) and/or in a beam path (15, 16) of the detection apparatus (14, 17). The invention further relates to a method for establishing a contact connection between at least one connection contact (18) of a conductor material path and at least one connection contact (19) of a semiconductor component (03), in particular a chip.

IPC Classes  ?

• B23K 1/005 - Soldering by means of radiant energy
• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• H01R 43/02 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
• B23K 101/40 - Semiconductor devices
• B23K 101/42 - Printed circuits
• H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation

Abstract

An electronic device includes an interconnect layer, a second chip and a third chip provided on a first side of the interconnect layer, and a first chip provided on a second side of the interconnect layer. The interconnect layer includes conductive members connecting between the first chip and the second chip, and connecting between the first chip and the third chip, respectively. The interconnect layer does not include a conductive member directly connecting between the second chip and the third chip.

IPC Classes  ?

• H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• G11C 5/04 - Supports for storage elements; Mounting or fixing of storage elements on such supports
• H01L 23/498 - Leads on insulating substrates

Abstract

Sedoheptulose, which is a saccharide falling within the categories of ketoses and heptuloses, is one of a small number of heptuloses occurring in nature. Provided are a method for producing sedoheptulose using a bacterium owing to the deletion or attenuation of a specific enzymatic function, a method for improving the productivity of sedoheptulose by the bacterium, and the bacterium.

IPC Classes  ?

• C12P 19/02 - Monosaccharides
• C12N 9/10 - Transferases (2.)
• C12N 9/90 - Isomerases (5.)
• C12N 9/00 - Enzymes, e.g. ligases (6.); Proenzymes; Compositions thereof; Processes for preparing, activating, inhibiting, separating, or purifying enzymes

Abstract

The present invention addresses the problem of providing a water-soluble adhesive composition for component capture and a water-soluble adhesive sheet for component capture that have exceptional shock-absorbing properties and tackiness/adhesiveness and are suited to capture of components, and providing a method for producing an electronic component that enables highly precise and efficient production using this composition and sheet.　In order to solve this problem, provided are: a composition that contains (A) a water-soluble adhesive agent and (B) a water-soluble plasticizer (excluding the component (A)), the (B) water-soluble plasticizer having a viscosity of 50,000 mPa∙s or lower at normal temperature (25°C), and the ratio ((B)/(A)) of the content value for the (B) water-soluble plasticizer to the content value for the (A) water-soluble adhesive agent being greater than 0.5 and not greater than 3.0; and a sheet including this composition.　According to the present invention: the shock-absorbing properties and tackiness/adhesiveness improve; the occurrence of damage or misalignment of components (elements), especially during, inter alia, production of semiconductor elements, is suppressed; and the sheet of the present invention in particular is easy to handle during attachment and detachment.

IPC Classes  ?

• C09J 11/06 - Non-macromolecular additives organic
• C09J 129/04 - Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
• C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, ; Adhesives based on derivatives of such polymers
• C09J 139/06 - Homopolymers or copolymers of N-vinyl-pyrrolidones
• C09J 201/00 - Adhesives based on unspecified macromolecular compounds
• C09J 7/38 - Pressure-sensitive adhesives [PSA]
• H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups
• H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
• H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof

Goods & Services

Adhesives for industrial purposes; unprocessed plastics; synthetic resins, unprocessed; epoxy resins, unprocessed; all the foregoing being environmentally friendly Electrical insulating materials; electrical insulating materials in the form of films, tapes, pastes, liquids and sheets; plastic semi-worked products, namely, semi-worked synthetic plastic as semi-finished products in form of pellets, rods, foils, forms, fibers, films and sheets; synthetic resins, semi-processed; all of the foregoing being environmentally friendly

Abstract

A method for forming a contact connection between a chip-and a conductor material formed on a non-conductive substrate, the chip being arranged on the substrate or on another conductor material track, a sinter paste consisting of at least 40% silver or copper being applied to respective chip contact surfaces of the chip and the conductor material track, a contact conductor being immersed in the sinter paste on the chip contact surface and in the sinter paste on the conductor material track, and the contact connection being formed by sintering the sinter paste by means of laser energy.

IPC Classes  ?

• H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
• H01L 23/498 - Leads on insulating substrates

Goods & Services

Chemicals; industrial chemicals; carbonic hydrates; trehalose as chemicals for industrial use; trehalose as chemicals for food industry; maltose as chemicals for industrial use; maltose as chemicals for food industry; sucrose as chemicals for industrial purposes; fructose as chemicals for industrial purpose; glucose for industrial purposes; amino acids for industrial purposes; sugar alcohols for industrial purposes; organic acids and their salts; ascorbic acid; derivatives of ascorbic acid; chemical preparations for use in industry; chemical additives for use in the manufacture of food; chemical reagents, other than for medical or veterinary purposes; food preservatives; anti-oxidizing agents; softening preparations; anti-freezing preparations; damp proofing agents; taste-improving agents for use in the manufacture of food; quality improving agents for food; glazing agents as chemicals; stabilizers as chemicals; surface-active agents; moisture retaining preparations as chemical preparations; anti-aging agents as chemical preparations; plant growth regulating preparations; fertilizers; artificial sweeteners for industry use; flour for industrial purposes; starch for industrial purposes; higher fatty acids; chemical compositions for developing photographs; excipient. Dietary fiber; dietary and nutritional supplements; dietary supplements for humans; dietary supplements for animals; pharmaceuticals; pharmaceutical preparations; chemical preparations for medical purposes; sugar for medical purposes; saccharide preparations for medical purposes; trehalose for medical purposes; maltose for medical purposes; sucrose for medical purposes; fructose for medical purposes; glucose for medical purposes; amino acids for medical purposes; intravenous fluids used for rehydration, nutrition and the delivery of pharmaceutical preparations; dental materials; dietetic beverages adapted for medical purposes; dietetic food adapted for medical purposes; beverages for babies; food for babies; lacteal flour for babies. Trehalose for food; maltose for food; confectionery; bread and buns; seasonings; natural sweeteners; artificial sweeteners for culinary purposes; cube sugar; crystal sugar, not confectionery; sugar; honey; powdered starch syrup for food; starch syrup for food; flour for food; starch for food; cereal preparations; instant confectionery mixes; biscuit mixes in powder form; bread mixes in powder form; cake mixes in powder form; cocoa mixes in powder form; coffee mixes in powder form; cookie mixes in powder form; crepe mixes in powder form; custard mixes in powder form; pancake mixes in powder form; pastry mixes in powder form; seasoning mixes in powder form; tea; tea-based beverages; coffee; coffee-based beverages; cocoa; cocoa-based beverages; chocolate-based beverages; chocolate spread; spices; aromatic preparations for food; ice cream mixes; sherbet mixes; almond paste; binding agents for ice cream; meat tenderizers for culinary purposes; preparations for stiffening whipped cream.

Abstract

According to the present invention, an endotoxin adsorbent comprising a silica monolith having a cation group including a nitrogen atom has an ET adsorption capacity that is practically sufficient. The silica monolith can have a communicating through-hole inside, and the ends of the through-hole can be open toward the outside of the silica monolith. The cation group including the nitrogen atom is coupled to the silica monolith with or without a spacer or a cross-linker interposed.

IPC Classes  ?

• B01D 15/00 - Separating processes involving the treatment of liquids with solid sorbents; Apparatus therefor
• B01J 20/22 - Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising organic material
• B01J 20/26 - Synthetic macromolecular compounds
• B01J 20/30 - Processes for preparing, regenerating or reactivating
• A23L 5/20 - Removal of unwanted matter, e.g. deodorisation or detoxification
• C02F 1/28 - Treatment of water, waste water, or sewage by sorption

Abstract

A method for electrolessly depositing a metal layer onto a substrate, including the following chronological steps: a) treating the substrate surface to be plated with an etching solution; b) treating the substrate surface to be plated with a polyelectrolyte or an organosilane compound; c) treating the surface to be plated with a solution containing metal particles; d) treating the surface to be plated with a solution containing at least one salt of the metal to be deposited onto the substrate.

IPC Classes  ?

• C23C 18/18 - Pretreatment of the material to be coated
• C23C 18/30 - Activating
• C23C 18/20 - Pretreatment of the material to be coated of organic surfaces, e.g. resins
• C23C 18/40 - Coating with copper using reducing agents

Abstract

The purpose of the present invention is to provide a method for producing a water absorbent resin that has high production efficiency and excellent water absorbing capability. The present invention pertains to a method for producing a water absorbent resin that forms a physical gel through water absorption, the method comprising: a step (a1) for obtaining a partial degradation product of starch by lowering the molecular weight of starch; a step (a2) for obtaining a water-soluble polymer by introducing an acidic group to the partial degradation product of starch obtained in the step (a1); and a step (a3) for drying the water-soluble polymer in the presence of water at 70-180°C so as to achieve a solid content of 90% or more.

IPC Classes  ?

• C08B 31/12 - Ethers having alkyl or cycloalkyl radicals substituted by hetero atoms
• A61F 13/15 - Absorbent pads, e.g. sanitary towels, swabs or tampons for external or internal application to the body; Supporting or fastening means therefor; Tampon applicators
• A61F 13/53 - Absorbent pads, e.g. sanitary towels, swabs or tampons for external or internal application to the body; Supporting or fastening means therefor; Tampon applicators characterised by the absorbing medium
• C08B 31/04 - Esters of organic acids

Abstract

The invention relates to a device for repairing a test contact assembly, comprising a test contact carrier (14) and a plurality of test contacts (16), which are arranged spaced apart from one another on at least one contact surface (18) of the test contact carrier (4) and of which at least two are connected by at least one solder connection (22) via a solder bridge to be repaired, wherein the device comprises the following: a moving cantilever arm (24) with at least one heat-conducting receiving means (28) on the end effector (26) thereof, on which a heat absorption surface (30) is formed; a control unit (32) which is designed to control a movement of the cantilever arm (24); a heating unit (34) which is designed to heat the heat absorption surface (30); and a temperature measuring unit (36) which is designed to measure a radiation temperature of a solder material of the solder connection (22), wherein the receiving means (28) is designed to receive at least one heat-conductive blade element (40), and the control unit (32) is designed to move the blade element (40) via a movement of the cantilever arm (24) relative to the test contact assembly, in order to cut through the at least one solder connection (22) such that the at least one solder bridge to be repaired can be removed.

IPC Classes  ?

• G01R 3/00 - Apparatus or processes specially adapted for the manufacture of measuring instruments

Abstract

The present invention utilizes an electric characteristic due to an electrochemical reaction corresponding to an environmental factor. An interconnection structure according to an embodiment of the present disclosure electrically connects a first portion and a second portion. The interconnection structure comprises a medium between the first portion and the second portion. The electrical connection between the first portion and the second portion is variable by a conductive path which is generated by an electrochemical reaction in the medium. The electrically conductive path has an electric characteristic that varies in accordance with the environment around the medium.

IPC Classes  ?

• H10B 63/00 - Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
• G06G 7/60 - Analogue computers for specific processes, systems, or devices, e.g. simulators for living beings, e.g. their nervous systems
• G11C 11/54 - Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using elements simulating biological cells, e.g. neuron
• G11C 13/00 - Digital stores characterised by the use of storage elements not covered by groups , , or
• H10N 70/20 - Multistable switching devices, e.g. memristors

Goods & Services

Chemicals for use in industry; industrial chemicals; carbonic hydrates; trehalose as chemicals for industrial use; trehalose as chemicals for the food industry; maltose as chemicals for industrial use; maltose as chemicals for the food industry; sucrose as chemicals for industrial purposes; fructose as chemicals for industrial purpose; glucose for industrial purposes; amino acids for industrial purposes; sugar alcohols for industrial purposes; organic acids and their salts, namely, citric acid for industrial purposes, fatty acids for industrial purposes, organic acid salts; ascorbic acid for industrial purposes; derivatives of ascorbic acid for industrial purposes; chemical preparations for use in industry; chemical additives for use in the manufacture of food; chemical reagents, other than for medical or veterinary purposes; food preservatives; anti-oxidizing agents; water softening preparations; anti-freezing preparations; damp proofing agents, namely, waterproofing chemical compositions; taste-improving agents for use in the manufacture of food, namely, fruit extracts, chemical additives; quality improving agents for food, namely, food preservatives; stabilizers as chemicals, namely, chemical products for stabilizing foodstuffs; surface-active agents for general use in the industrial arts, namely, as wetting, spreading, emulsifying, dispersing and penetrating agents; moisture retaining preparations as chemical preparations, namely, moistening agents; anti-aging agents as chemical preparations, namely, chemical preparations for preserving foodstuffs; plant growth regulating preparations; fertilizers; artificial sweeteners for industrial purposes; flour for industrial purposes; starch for industrial purposes; higher fatty acids for industrial purposes; chemical compositions for developing photographs; excipient for use in the manufacture of pharmaceutical preparations, dietary supplements. Dietary fiber to aid digestion; dietary and nutritional supplements; dietary supplements for humans; dietary supplements for animals; pharmaceuticals for treating weight gain, diabetes, eye diseases and conditions, allergies; pharmaceuticals for skin care; pharmaceutical preparations for treating weight gain, diabetes, eye diseases and conditions, allergies; pharmaceutical preparations for skin care; chemical preparations for medical purposes for treating weight gain, diabetes, eye diseases and conditions, allergies; chemical preparations for medical purposes for skin care; sugar for medical purposes; saccharide preparations for medical purposes in the nature of sugar for medical purposes; trehalose for medical purposes in the nature of sugar for medical purposes; maltose for medical purposes in the nature of sugar for medical purposes; sucrose for medical purposes in the nature of sugar for medical purposes; fructose for medical purposes in the nature of sugar for medical purposes; glucose for medical purposes; amino acids for medical purposes; intravenous fluids used for rehydration, nutrition and the delivery of pharmaceutical preparations; dental materials, namely, dental adhesives, dental alloys, dental cement, dental polish; dietetic beverages adapted for medical purposes; dietetic food adapted for medical purposes; beverages for babies, namely, liquid formula milk for babies, nutritionally fortified beverages for medical purposes; food for babies; lacteal flour for babies. Trehalose for food in the nature of sugar; maltose for food; confectionery made of sugar; confectionery made of sugar substitutes; bread and buns; seasonings; natural sweeteners; artificial sweeteners for culinary purposes; cube sugar; crystal sugar, not confectionery, namely, crystallized rock sugar; sugar; honey; powdered starch syrup for food; starch syrup for food; flour for food; starch for food; cereal preparations, namely, breakfast cereals, cereal bars, cereal based snack food, processed cereals; instant confectionery mixes, namely, brownie mixes, cake mixes, cocoa mixes; biscuit mixes in powder form; bread mixes in powder form; cake mixes in powder form; cocoa mixes in powder form; coffee mixes in powder form; cookie mixes in powder form; crepe mixes in powder form; custard mixes in powder form; pancake mixes in powder form; pastry mixes in powder form; seasoning mixes in powder form; tea; tea-based beverages; coffee; coffee-based beverages; cocoa; cocoa-based beverages; chocolate-based beverages; chocolate-based spread; spices; aromatic preparations for food, namely, food flavorings being non-essential oils, extracts used as food flavoring; ice cream mixes; sherbet mixes; almond paste; starch-based binding agents for ice cream; meat tenderizers for culinary purposes; preparations for stiffening whipped cream, namely, starch-based thickeners for whipped cream.

Abstract

The present invention provides a cathode mixture that can be suitably used in a cathode mixture layer of an all-solid-state lithium-sulfur battery having an excellent charge/discharge capacity and a method of producing the cathode mixture, by maximally utilizing excellent physical properties of sulfur. The present invention relates to a positive electrode mixture for composite all-solid-state lithium-sulfur batteries, the positive electrode mixture containing sulfur or its discharge product (A); phosphorus pentasulfide (B); conductive carbon (C); and lithium halide (D) at a weight ratio of A:B:C:D of 40-60:15-35:5-20:16-30, wherein a peak at 50 ppm in 31P-MAS NMR has a relative intensity of 40% or less.

IPC Classes  ?

• H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
• H01M 10/052 - Li-accumulators
• H01M 4/38 - Selection of substances as active materials, active masses, active liquids of elements or alloys
• H01M 4/58 - Selection of substances as active materials, active masses, active liquids of polyanionic structures, e.g. phosphates, silicates or borates

Goods & Services

(1) Chemicals; industrial chemicals; carbonic hydrates; trehalose as chemicals for industrial use; trehalose as chemicals for food industry; maltose as chemicals for industrial use; maltose as chemicals for food industry; sucrose as chemicals for industrial purposes; fructose as chemicals for industrial purpose; glucose for industrial purposes; amino acids for industrial purposes; sugar alcohols for industrial purposes; organic acids and their salts; ascorbic acid; derivatives of ascorbic acid; chemical preparations for use in industry; chemical additives for use in the manufacture of food; chemical reagents, other than for medical or veterinary purposes; food preservatives; anti-oxidizing agents; softening preparations; anti-freezing preparations; damp proofing agents; taste-improving agents for use in the manufacture of food; quality improving agents for food; glazing agents as chemicals; stabilizers as chemicals; surface-active agents; moisture retaining preparations as chemical preparations; anti-aging agents as chemical preparations; plant growth regulating preparations; fertilizers; artificial sweeteners for industry use; flour for industrial purposes; starch for industrial purposes; higher fatty acids; chemical compositions for developing photographs; excipient. (2) Dietary fiber; dietary and nutritional supplements; dietary supplements for humans; dietary supplements for animals; pharmaceuticals; pharmaceutical preparations; chemical preparations for medical purposes; sugar for medical purposes; saccharide preparations for medical purposes; trehalose for medical purposes; maltose for medical purposes; sucrose for medical purposes; fructose for medical purposes; glucose for medical purposes; amino acids for medical purposes; intravenous fluids used for rehydration, nutrition and the delivery of pharmaceutical preparations; dental materials; dietetic beverages adapted for medical purposes; dietetic food adapted for medical purposes; beverages for babies; food for babies; lacteal flour for babies. (3) Trehalose for food; maltose for food; confectionery; bread and buns; seasonings; natural sweeteners; artificial sweeteners for culinary purposes; cube sugar; crystal sugar, not confectionery; sugar; honey; powdered starch syrup for food; starch syrup for food; flour for food; starch for food; cereal preparations; instant confectionery mixes; biscuit mixes in powder form; bread mixes in powder form; cake mixes in powder form; cocoa mixes in powder form; coffee mixes in powder form; cookie mixes in powder form; crepe mixes in powder form; custard mixes in powder form; pancake mixes in powder form; pastry mixes in powder form; seasoning mixes in powder form; tea; tea-based beverages; coffee; coffee-based beverages; cocoa; cocoa-based beverages; chocolate-based beverages; chocolate spread; spices; aromatic preparations for food; ice cream mixes; sherbet mixes; almond paste; binding agents for ice cream; meat tenderizers for culinary purposes; preparations for stiffening whipped cream.

Abstract

The purpose of the present invention is to provide a thermosetting resin composition which has a low refractive index after curing and is capable of forming a thick film. The present invention relates to a thermosetting resin composition which contains (A) a polysiloxane that is a hydrolysis-condensation product of methyltrialkoxysilane and tetraethoxysilane and has a weight average molecular weight of 10,000 to 100,000 in an amount of 1 to 35% by weight of the solid content, and (B) beaded silica in an amount of 65 to 99% by weight of the solid content.

IPC Classes  ?

• C08L 83/04 - Polysiloxanes
• B32B 27/00 - Layered products essentially comprising synthetic resin
• C08K 3/36 - Silica

Abstract

A laser soldering system and a method for monitoring a laser soldering process by means of a monitoring device of the laser soldering system, wherein a solder ball is dispensed onto a solderable surface of a substrate by means of a solder ball feeding device of the laser soldering system, wherein the solder ball is at least partially melted by means of a laser device of the laser soldering system, wherein, during the laser soldering process, a light signal is formed which is detected by means of an optical detection unit of the monitoring device, wherein the light signal is dispersed into a spectrum of the light signal by means of a spectroscope device of the monitoring device, wherein the spectrum is analyzed by means of a processing device of the monitoring device, and it is identified on the basis of a composition of the spectrum whether or not a burning of the substrate has occurred during the laser soldering process.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 1/005 - Soldering by means of radiant energy
• G01N 21/88 - Investigating the presence of flaws, defects or contamination
• G01N 21/71 - Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light thermally excited

Abstract

The purpose of the present invention is to provide a thermosetting resin composition that has high impregnation property for an insulating sheet and excellent mechanical properties without causing cracks after curing. The present invention relates to a thermosetting resin composition containing a glycidyl ether compound (a), a diluent (b) and at least one latent curing agent (c) selected from the group consisting of a boron trichloride amine complex, a boron trifluoride amine complex and zinc octylate, wherein, per 100 parts by mass of the glycidyl ether compound (a), the amount of the diluent (b) is 1 part by mass or more and less than 30 parts by mass and the amount of the latent curing agent (c) is 0.0005-5 parts by mass.

IPC Classes  ?

• C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
• H01B 17/60 - Composite insulating bodies
• C08K 5/098 - Metal salts of carboxylic acids
• C08L 63/00 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• C08K 3/38 - Boron-containing compounds

Abstract

The purpose of the present invention is to provide a novel means for enhancing the saltiness of a composition for oral use.　Provided is a composition for oral use the saltiness of which can be enhanced by using glucosyl naringin.

IPC Classes  ?

• A23L 27/00 - Spices; Flavouring agents or condiments; Artificial sweetening agents; Table salts; Dietetic salt substitutes; Preparation or treatment thereof
• A01J 25/00 - Cheese-making
• A23B 7/10 - Preserving with acids; Acid fermentation
• A23L 11/50 - Fermented pulses or legumes; Fermentation of pulses or legumes based on the addition of microorganisms
• A23L 17/00 - Food-from-the-sea products; Fish products; Fish meal; Fish-egg substitutes; Preparation or treatment thereof
• A23L 19/00 - Products from fruits or vegetables; Preparation or treatment thereof
• A23L 19/18 - Roasted or fried products, e.g. snacks or chips
• A23L 23/00 - Soups; Sauces ; Preparation or treatment thereof
• A23L 23/10 - Soup concentrates, e.g. powders or cakes
• A23L 27/40 - Table salts; Dietetic salt substitutes
• A23L 27/50 - Soya sauce
• A23L 27/60 - Salad dressings; Mayonnaise; Ketchup
• A23L 29/00 - Foods or foodstuffs containing additives; Preparation or treatment thereof
• A23L 35/00 - Food or foodstuffs not provided for in groups ; Preparation or treatment thereof
• C12G 3/04 - Preparation of other alcoholic beverages by mixing, e.g. for preparation of liqueurs

Abstract

The present invention provides: a modified form of a SapB protein; a method for preparing a SapB protein and a modified form thereof; and an aqueous solution in which a SapB protein or a modified form thereof is dissolved.

IPC Classes  ?

• C07K 1/14 - Extraction; Separation; Purification
• C12N 15/31 - Genes encoding microbial proteins, e.g. enterotoxins

Abstract

A staining method includes staining a biological sample with a coumarin fluorescent dye to provide a fluorescent-stained sample, and bringing the fluorescent-stained sample into contact with osmium tetroxide, further embedding the sample in an epoxy resin, and subsequently slicing the sample to provide a section sample including the fluorescent-stained sample.

IPC Classes  ?

• G01N 1/30 - Staining; Impregnating
• G01N 21/64 - Fluorescence; Phosphorescence
• G01N 1/36 - Embedding or analogous mounting of samples
• G01N 33/58 - Chemical analysis of biological material, e.g. blood, urine; Testing involving biospecific ligand binding methods; Immunological testing involving labelled substances
• C09B 57/02 - Coumarine dyes
• C09K 11/06 - Luminescent, e.g. electroluminescent, chemiluminescent, materials containing organic luminescent materials

Goods & Services

Commercial intermediation services; procurement services for others [purchasing goods and services for other businesses]; commercial information agency services; marketing research or analysis; providing information concerning commercial sales; business advisory and consultancy services relating to planning and selling products; business research, analysis, investigation, evaluation, appraisal and consultancy relating to commercialization or new business; import-export agency services and consulting related to such services; retail services or wholesale services for chemicals; retail services or wholesale services for raw material plastics; retail services or wholesale services for dyes and pigments; retail services or wholesale services for paints; retail services or wholesale services for cosmetics, toiletries, dentifrices, soaps and detergents; retail services or wholesale services for extracts of flowers [perfumes] and fragrances; retail services or wholesale services for pharmaceutical preparations; retail services or wholesale services for plastic processing machines and apparatus; retail services or wholesale services for semiconductor manufacturing machines and systems; retail services or wholesale services for liquid crystal displays manufacturing machines and systems; retail services or wholesale services for laboratory apparatus and instruments; retail services or wholesale services for measuring and testing machines and instruments; retail services or wholesale services for telecommunication machines and apparatus; retail services or wholesale services for electronic machines and apparatus; retail services or wholesale services for plastic semi-worked products; retail services or wholesale services for dietary supplements; retail services or wholesale services for dietetic preparations adapted for medical purposes; retail services or wholesale services for processed food; retail services or wholesale services for foods and beverages; retail services or wholesale services for electrical machinery and apparatuses; retail services or wholesale services for natural sweetener; retail services or wholesale services for artificial sweeteners; retail services or wholesale services for condiments; retail services or wholesale services for fertilizers; retail services or wholesale services for plant growth regulating preparations; retail services or wholesale services for grinding preparations; retail services or wholesale services for building materials; retail services or wholesale services for chemicals used as food additives; compilation of information into computer databases; advertising and publicity services; providing commercial information and advice for consumers in the choice of products and services.

Abstract

In a composition in which L-ergothioneine (EGT) and N,N-dimethyl-L-2-thiohistidine (DTH), it makes possible to suppress coloring of the composition. A composition comprising EGT and DTH is prepared in which the content of DTH is reduced.

IPC Classes  ?

• A61K 31/4172 - Imidazole-alkanecarboxylic acids, e.g. histidine

Goods & Services

Contact metallizations for micro compounds made from soldering material, insofar as included in this class. Machines, in particular automatic machines, regarding micro periphery; machines, in particular automatic machines, for the application of connecting material on substrates; machines, in particular automatic machines, for producing micro compounds, in particular for forming substrate units from one or more substrates, in particular chips, combined to a module. Material processing of substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates. Development of contact metallizations for connection technology; development of connecting technologies for producing micro compounds; technological consultancy, in particular regarding the production of micro compounds.

Abstract

The present invention addresses the problem of providing a solid food that contains a protein and that has both excellent texture and dietary fiber-containing characteristics. Said problem is solved by providing a solid food that contains: a cyclic tetrasaccharide represented by cyclo{→6)-α-D-glucopyranosyl-(1→3)-α-D-glucopyranosyl-(1→6)-α-D-glucopyranosyl-(1→3)-α-D-glucopyranosyl-(1→} and/or a glycosyl derivative thereof; and a protein.

IPC Classes  ?

• A23L 5/00 - Preparation or treatment of foods or foodstuffs, in general; Food or foodstuffs obtained thereby; Materials therefor
• A23L 13/00 - Meat products; Meat meal; Preparation or treatment thereof
• A23L 13/60 - Comminuted or emulsified meat products, e.g. sausages; Reformed meat from comminuted meat product

Goods & Services

Contact metallizations for micro compounds made from soldering material, insofar as included in this class. Machines, in particular automatic machines, regarding micro periphery; machines, in particular automatic machines, for the application of connecting material on substrates; machines, in particular automatic machines, for producing micro compounds, in particular for forming substrate units from one or more substrates, in particular chips, combined to a module. Material processing of substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates. Development of contact metallizations for connection technology; development of connecting technologies for producing micro compounds; technological consultancy, in particular regarding the production of micro compounds.

Goods & Services

Contact metallizations for micro compounds made from soldering material, insofar as included in this class. Machines, in particular automatic machines, regarding micro periphery; machines, in particular automatic machines, for the application of connecting material on substrates; machines, in particular automatic machines, for producing micro compounds, in particular for forming substrate units from one or more substrates, in particular chips, combined to a module. Material processing of substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates. Development of contact metallizations for connection technology; development of connecting technologies for producing micro compounds; technological consultancy, in particular regarding the production of micro compounds.

Goods & Services

Contact metallizations for micro compounds made from soldering material, insofar as included in this class. Machines, in particular automatic machines, regarding micro periphery; machines, in particular automatic machines, for the application of connecting material on substrates; machines, in particular automatic machines, for producing micro compounds, in particular for forming substrate units from one or more substrates, in particular chips, combined to a module. Material processing of substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates. Development of contact metallizations for connection technology; development of connecting technologies for producing micro compounds; technological consultancy, in particular regarding the production of micro compounds.

Abstract

A press-forming device for forming individual solder bodies from a wire of soldering material includes a press-forming mechanism and a separation means. The press-forming mechanism forms a continuous strand of preformed solder sections from the wire by using two notched rollers that rotate in opposite directions and that press opposite notches into the wire. The preformed solder sections are disposed equidistantly along the strand and are connected to each other by connecting links disposed at the notches. The separation means forms individual solder bodies by separating the preformed solder sections one by one at the connecting links. The separation means separates individual preformed solder sections using a cutting mechanism that moves in a direction perpendicular to the length direction of the strand. Individual solder bodies are transported to a solder jetting section where they are liquefied by a laser beam and jetted from the solder jetting section by gas pressure.

IPC Classes  ?

• B23K 3/06 - Solder feeding devices; Solder melting pans
• B23K 1/005 - Soldering by means of radiant energy
• B23K 3/08 - Auxiliary devices therefor
• B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials

Abstract

A laser-assisted soldering apparatus includes a solder jetting section and a laser coupling unit. The solder jetting section includes a jetting nozzle and a solder body holding capillary adapted to hold a solder body that is being liquefied by a laser beam. The laser coupling unit includes an optical window, a laser entry, a laser passage, a fastening section, and a laser exit. The laser passage extends from the laser entry to the laser exit and is aligned with the solder body holding capillary. The optical window is transparent to the laser beam. The fastening section is fastened to the solder jetting section. A first pressure gas feeding passage merges into the laser passage between the optical window and the fastening section. The solder jetting section includes a second pressure gas feeding passage that merges into the solder body holding capillary between the laser exit and the jetting nozzle.

IPC Classes  ?

• B23K 3/06 - Solder feeding devices; Solder melting pans
• B23K 1/005 - Soldering by means of radiant energy

Abstract

A cell treatment agent containing alginate sulfate as an active ingredient, and a set reagent for activating suspended or dormant cells, which is a combination reagent of the cell treatment agent and an activator containing polyvalent cations are provided.

IPC Classes  ?

• C12N 5/00 - Undifferentiated human, animal or plant cells, e.g. cell lines; Tissues; Cultivation or maintenance thereof; Culture media therefor

Goods & Services

Industrial chemicals; epoxy resins, unprocessed; plastics [raw materials].

Abstract

Provided is a resin composition for three-dimensional photoshaping that melts at a comparatively low temperature of about 200°C after curing and has exceptional shapeability. The present invention relates to a resin composition for three-dimensional photoshaping that includes a reactive material having an acetal structure and a crosslinkable double bond in each molecule.

IPC Classes  ?

• C08F 20/28 - Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
• B33Y 10/00 - Processes of additive manufacturing
• B33Y 80/00 - Products made by additive manufacturing
• B22C 9/04 - Use of lost patterns
• B29C 64/124 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
• B29C 64/314 - Preparation
• B33Y 70/00 - Materials specially adapted for additive manufacturing

Goods & Services

Soldering materials in the nature of soft solder, solder wire and solder balls for the contact metallization for micro compounds Automatic machines, namely, automatic soldering machines with respect to micro periphery; machines, namely, automatic soldering machines, for the application of connecting material on substrates; machines, namely, automatic soldering machines, for producing micro compounds, in particular for forming substrate units from one or more substrates, specifically being chips, combined to a module Material processing, namely, jointing, in particular soldering, laser soldering, welding, glueing of substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates; metallization of contacts for producing micro compounds made of soldering material Development of contact metallization technology for connection technology; development of connecting technologies for producing micro compounds; technological consultancy in the field of the production of micro compounds

Goods & Services

Soldering materials in the nature of soft solder, solder wire and solder balls for the contact metallization for micro compounds Automatic machines, namely, automatic solder placing and solder ball placing machines with respect to micro periphery; machines, namely, automatic solder placing and solder ball placing machines, for the application of connecting material on substrates; machines, namely, automatic solder placing and solder ball placing machines, for producing micro compounds, in particular for forming substrate units from one or more substrates, specifically being chips, combined to a module Material processing, namely, jointing, in particular soldering, laser soldering, welding, glueing of substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates; metallization of contacts for producing micro compounds made of soldering material Development of contact metallization technology for connection technology; development of connecting technologies for producing micro compounds; technological consultancy in the field of the production of micro compounds

Abstract

The present invention provides a method for producing a molded article that has excellent airtightness and excellent adhesion between a thermoplastic resin composition and a member that is formed of a metal or a ceramic, the method being considerably suppressed in flowing out of a pre-gelled epoxy resin composition due to the temperature and pressure during insert molding. A method for producing a molded article, the method comprising: (1) a step in which an epoxy resin composition is applied to the surface of an insert member that is formed of a metal or a ceramic, thereby forming an epoxy resin composition layer; (2) a step in which the insert member obtained in the step (1) is heated, thereby pre-gelling the epoxy resin composition; and (3) a step in which the insert member obtained in the step (2) is arranged within a mold and a thermoplastic resin composition is insert molded on the epoxy resin composition layer, so that the epoxy resin composition is cured. With respect to this method for producing a molded article, the epoxy resin composition contains 1 to 80 parts by mass of a pre-gelling agent relative to 100 parts by mass of an epoxy resin.

IPC Classes  ?

• B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles

Goods & Services

Automatic machines, namely automatic plating machines with respect to micro periphery; machines, namely, automatic plating machines, for the application of connecting material on substrates; machines, namely, automatic plating machines, for producing micro compounds, in particular for forming substrate units from one or more substrates, specifically being chips, combined to a module Material processing, namely, jointing, in particular soldering, laser soldering, welding, glueing of substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates; metallization of contacts for producing micro compounds made of soldering material Development of contact metallization technology for connection technology; development of connecting technologies for producing micro compounds; technological consultancy in the field of the production of micro compounds

Goods & Services

Soldering materials in the nature of soft solder, solder wire and solder balls for the contact metallization for micro compounds Automatic machines, namely, automatic bonding machines with respect to micro periphery; machines, namely, automatic bonding machines, for the application of connecting material on substrates; machines, namely, automatic bonding machines, for producing micro compounds, in particular for forming substrate units from one or more substrates, specifically being chips, combined to a module Material processing, namely, jointing, in particular soldering, laser soldering, welding, glueing of substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates; metallization of contacts for producing micro compounds made of soldering material Development of contact metallization technology for connection technology; development of connecting technologies for producing micro compounds; technological consultancy in the field of the production of micro compounds

Abstract

Provided are: a MG-stabilized composition which comprises mycosporine-glycine (MG) and is acidic to weakly alkaline; a MG-stabilized composition which comprises MG and at most 10 parts by weight of 4-DG; and a MAA-stabilized composition which comprises MAA and at least one selected from among a base forming a nucleic acid, a nucleoside, a glycine, and a tranexamic acid.

IPC Classes  ?

• A61K 31/198 - Alpha-amino acids, e.g. alanine, edetic acid (EDTA)
• A61K 8/44 - Aminocarboxylic acids or derivatives thereof, e.g. aminocarboxylic acids containing sulfur; Salts, esters or N-acylated derivatives thereof
• A61K 9/08 - Solutions
• A61K 47/18 - Amines; Amides; Ureas; Quaternary ammonium compounds; Amino acids; Oligopeptides having up to five amino acids
• A61K 47/22 - Heterocyclic compounds, e.g. ascorbic acid, tocopherol or pyrrolidones
• A61K 47/26 - Carbohydrates, e.g. sugar alcohols, amino sugars, nucleic acids, mono-, di- or oligo-saccharides; Derivatives thereof, e.g. polysorbates, sorbitan fatty acid esters or glycyrrhizin
• A61P 17/00 - Drugs for dermatological disorders
• A61P 17/16 - Emollients or protectives, e.g. against radiation
• A61P 17/18 - Antioxidants, e.g. antiradicals
• A61Q 17/00 - Barrier preparations; Preparations brought into direct contact with the skin for affording protection against external influences, e.g. sunlight, X-rays or other harmful rays, corrosive materials, bacteria or insect stings

Abstract

Provided are a graph processing device, a graph processing system, and a graph processing method that generate a graph for obtaining proposals that satisfies a need. A graph processing server 1, for generating a graph that obtains a proposal for a product or service need, comprises: a raw material-related information storage unit 35 that stores related information related to raw materials, including physical properties data about raw materials for a product and/or service; and a graph generation unit 13 that categorizes related information from the raw material-related information storage unit 35 into prescribed categories, generates nodes, and generates a graph that shows the relationship between categories, by connected edges between nodes.

IPC Classes  ?

• G06F 16/28 - Databases characterised by their database models, e.g. relational or object models
• G06F 16/906 - Clustering; Classification
• G06Q 50/04 - Manufacturing

Abstract

Provided are a data trading device, a data trading system and a data trading method that provide a site pertaining to trading that is required for the creation of a knowledge graph. A data trading server 1 for trading the data related to technology information is communicably connected to a data storage device 4 which is provided with a database that stores technical document data including technical papers and technical materials and a knowledge dictionary storage unit that stores a knowledge dictionary used for analyzing technical document data pertaining to one or more technical fields and tagging to the technical document data based on the analysis result. The data trading server 1 outputs, to a user terminal 6, a sale screen that indicates in a selectable form a DB icon that indicates a database for each technical field and/or a dictionary icon that indicates a knowledge dictionary storage unit for each technical field.

IPC Classes  ?

• G06Q 30/06 - Buying, selling or leasing transactions

Abstract

Provided is an antifogging layer that uses a water-based solvent and exhibits excellent antifogging properties. The antifogging layer contains organic microparticles (A), and the surface roughness Ra is 5-200 nm, inclusive.

IPC Classes  ?

• C09D 201/00 - Coating compositions based on unspecified macromolecular compounds
• B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
• C09D 5/02 - Emulsion paints
• C09D 7/61 - Additives non-macromolecular inorganic
• C09D 133/00 - Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, a; Coating compositions based on derivatives of such polymers
• C09K 3/18 - Materials not provided for elsewhere for application to surface to minimize adherence of ice, mist or water thereto; Thawing or antifreeze materials for application to surfaces

Abstract

The present invention provides an antifogging layer which is able to be produced with use of an aqueous solvent, and which is suppressed in change of gloss value in cases where the antifogging layer is exposed to high temperatures. This antifogging layer contains organic fine particles (A); and the change ratio between the gloss value (at 60°) of this antifogging layer before being left at rest in a heating environment at 80°C and the gloss value (at 60°) of this antifogging layer after being left at rest in the heating environment for 240 hours and subsequently left at rest in an environment at 23°C and 50% RH for one hour is -5% to +5%.

IPC Classes  ?

• C09D 201/00 - Coating compositions based on unspecified macromolecular compounds
• B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
• C09D 133/00 - Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, a; Coating compositions based on derivatives of such polymers
• C09K 3/18 - Materials not provided for elsewhere for application to surface to minimize adherence of ice, mist or water thereto; Thawing or antifreeze materials for application to surfaces

Abstract

Provided is an anti-fog layer that uses a water-based solvent and has superior heat resistance. This anti-fog layer includes organic fine particles (A) and has a glass transition temperature of 60°C or greater.

IPC Classes  ?

• B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
• C09D 5/02 - Emulsion paints
• C09D 133/00 - Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, a; Coating compositions based on derivatives of such polymers
• C09D 201/00 - Coating compositions based on unspecified macromolecular compounds
• C09K 3/18 - Materials not provided for elsewhere for application to surface to minimize adherence of ice, mist or water thereto; Thawing or antifreeze materials for application to surfaces

Abstract

A composition for bonding that comprises component (A), which is a first polymerizable monomer, component (B), which is a rubber component, component (C), which is a polymer component having a first reactive functional group, and component (D), which is a polymerization initiator. The component (A) contains the components (B) and (C) dissolved therein.

IPC Classes  ?

• C09J 4/02 - Acrylmonomers
• B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
• B32B 25/04 - Layered products essentially comprising natural or synthetic rubber comprising rubber as the main or only constituent of a layer, next to another layer of a specific substance
• C09D 4/02 - Acrylmonomers
• C09D 5/00 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
• C09D 121/00 - Coating compositions based on unspecified rubbers
• C09D 201/00 - Coating compositions based on unspecified macromolecular compounds
• C09J 5/02 - Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
• C09J 121/00 - Adhesives based on unspecified rubbers
• C09J 201/00 - Adhesives based on unspecified macromolecular compounds

Abstract

A registration device of an individual identification system that includes the registration device, a verification device, and an identification device and that identifies an individual identification target, the registration device including: a registration unit that outputs verification information enabling verification of an identification key that is unique to the identification target, by using, as inputs, an input signal that depends on at least one of a physical property and an image feature of the identification target, and non-physical information that does not depend on the physical property and that differs for each identification target.

IPC Classes  ?

• H04L 9/08 - Key distribution

Goods & Services

Industrial chemicals; epoxy resins, unprocessed; unprocessed plastics being raw materials; all of the foregoing being environmentally friendly

Goods & Services

Commercial intermediation services, namely, mediation of trade business for third parties; procurement services for others, namely, procuring of contracts for purchasing goods and services for other businesses; commercial information agency services; marketing research and analysis services; providing information concerning commercial sales; business advisory and consultancy services relating to planning and selling products; business research, data analysis, investigation, evaluation, appraisal and consultancy relating to commercialization or new business; retail store services and wholesale store services featuring chemicals; retail store services and wholesale store services featuring raw material plastics; retail store services and wholesale store services featuring dyes and pigments; retail store services and wholesale store services featuring paints; retail store services and wholesale store services featuring cosmetics, toiletries, dentifrices, soaps and detergents; retail store services and wholesale store services featuring extracts of flowers being perfumes and fragrances; retail store services and wholesale store services featuring pharmaceutical preparations; retail store services and wholesale store services featuring plastic processing machines and apparatus; retail store services and wholesale store services featuring semiconductor manufacturing machines and systems; retail store services and wholesale store services featuring liquid crystal displays manufacturing machines and systems; retail store services and wholesale store services featuring laboratory apparatus and instruments; retail store services and wholesale store services featuring measuring and testing machines and instruments; retail store services and wholesale store services featuring telecommunication machines and apparatus; retail store services and wholesale store services featuring electronic machines and apparatus; retail store services and wholesale store services featuring plastic semi-worked products; retail store services and wholesale store services featuring dietary supplements; retail store services and wholesale store services featuring dietetic preparations adapted for medical purposes; retail store services and wholesale store services featuring processed food; retail store services and wholesale store services featuring foods and beverages; retail store services and wholesale store services featuring electrical machinery and apparatuses; retail store services and wholesale store services featuring natural sweetener; retail store services and wholesale store services featuring artificial sweeteners; retail store services and wholesale store services featuring condiments; retail store services and wholesale store services featuring fertilizers; retail store services and wholesale store services featuring plant growth regulating preparations; retail store services and wholesale store services featuring grinding preparations; retail store services and wholesale store services featuring building materials; retail store services and wholesale store services featuring chemicals used as food additives

Abstract

[Problem] To efficiently produce a conductive member in which two metal plates sandwiching an insulating film are covered with a resin. [Solution] A method for producing a conductive member 100 in which an insulating film 10 is interposed between two metal plates 30, 40, the method including: a first molding step for forming an intermediate product 60 in which a solidified, insulating first resin 20 covers the insulating film 10, such that the insulating film 10 is at least partially exposed; and a second molding step for covering sandwiching parts 32, 42 of the two metal plates 30, 40 with an insulating second resin 50 in a state where at least a portion of the exposed part of the insulating film 10 of the intermediate product 60 is sandwiched between the two metal plates 30, 40.

IPC Classes  ?

• B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
• B29C 45/16 - Making multilayered or multicoloured articles
• B29C 45/26 - Moulds
• H02G 3/04 - Protective tubing or conduits, e.g. cable ladders or cable troughs
• B29C 33/12 - SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING - Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels

Abstract

The present invention addresses the problem of achieving a novel reverse osmosis membrane (more specifically, reverse osmosis composite membrane) that is capable of suppressing biofouling. The problem is solved by using a reverse osmosis composite membrane which is obtained by chemically modifying a surface thereof with a compound that has an amino group, that is obtained by modifying the amino group with two molecules of an α-picolyl group, and that has a dipicolylamine structure.

IPC Classes  ?

• B01D 61/02 - Reverse osmosis; Hyperfiltration
• B01D 69/12 - Composite membranes; Ultra-thin membranes
• B01D 71/82 - Macromolecular material not specifically provided for in a single one of groups characterised by the presence of specified groups, e.g. introduced by chemical after-treatment

Abstract

The invention relates to a metabolic enzyme-disrupted aerobic strain and a method for culturing the strain. The present invention provides, for example, a culture comprising a culture medium that has been cultured under an aerobic condition, wherein the culture medium contains an aerobe, wherein the aerobe has a disrupted gene encoding a metabolic enzyme of glycolysis selected from the group consisting of the metabolic enzymes of glycolysis except hexokinase, thereby suppressing metabolism from a carbon source (e.g., glucose) to the TCA cycle in the aerobe.

IPC Classes  ?

• C12P 19/12 - Disaccharides
• C12P 19/02 - Monosaccharides
• C12N 1/20 - Bacteria; Culture media therefor
• C12N 15/52 - Genes encoding for enzymes or proenzymes

Abstract

A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.

IPC Classes  ?

• B23K 1/00 - Soldering, e.g. brazing, or unsoldering
• B23K 31/00 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups
• B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
• B23K 101/42 - Printed circuits

Abstract

A composition in which L-ergothioneine (EGT) and S-ribosylhomocysteine (SRH) coexist, wherein coloration of the composition can be suppressed. Prepared is a composition that contains EGT and SRH, the SRH content being reduced.

IPC Classes  ?

• A23L 33/10 - Modifying nutritive qualities of foods; Dietetic products; Preparation or treatment thereof using additives
• A61K 31/4172 - Imidazole-alkanecarboxylic acids, e.g. histidine
• A61K 47/22 - Heterocyclic compounds, e.g. ascorbic acid, tocopherol or pyrrolidones

Abstract

The present invention addresses the problem of providing a composition capable of effectively promoting GLP-1 secretion. This problem can be solved by providing a composition for promoting GLP-1 secretion that comprises, as active ingredients, glycosylnaringenin as component (A) together with at least one selected from the group consisting of α-pinene, β-pinene, sabinene, camphene, valencene, β-caryophyllene, β-ionone, methyl anthranilate, methyl N-methylanthranilate, thymol and nootkatone, as component (B).

IPC Classes  ?

• A23L 33/10 - Modifying nutritive qualities of foods; Dietetic products; Preparation or treatment thereof using additives
• A23F 3/16 - Tea extraction; Tea extracts; Treating tea extract; Making instant tea
• A23F 5/24 - Extraction of coffee; Coffee extracts; Making instant coffee
• A23G 3/36 - Sweetmeats, confectionery or marzipan; Processes for the preparation thereof characterised by the composition
• A23G 9/32 - Frozen sweets, e.g. ice confectionery, ice-cream; Mixtures therefor characterised by the composition
• A23L 2/52 - Adding ingredients
• A61K 9/06 - Ointments; Bases therefor
• A61K 9/08 - Solutions
• A61K 9/107 - Emulsions
• A61K 9/16 - Agglomerates; Granulates; Microbeadlets
• A61K 9/20 - Pills, lozenges or tablets
• A61K 9/48 - Preparations in capsules, e.g. of gelatin, of chocolate
• A61K 31/05 - Phenols
• A61K 31/122 - Ketones having the oxygen atom directly attached to a ring, e.g. quinones, vitamin K1, anthralin
• A61K 31/7048 - Compounds having saccharide radicals and heterocyclic rings having oxygen as a ring hetero atom, e.g. leucoglucosan, hesperidin, erythromycin, nystatin
• A61P 1/04 - Drugs for disorders of the alimentary tract or the digestive system for ulcers, gastritis or reflux esophagitis, e.g. antacids, inhibitors of acid secretion, mucosal protectants
• A61P 3/04 - Anorexiants; Antiobesity agents
• A61P 3/10 - Drugs for disorders of the metabolism for glucose homeostasis for hyperglycaemia, e.g. antidiabetics
• A61P 43/00 - Drugs for specific purposes, not provided for in groups
• C12G 3/05 - Preparation of other alcoholic beverages by mixing, e.g. for preparation of liqueurs with health-improving ingredients, e.g. flavonoids, flavones, polyphenols or polysaccharides

Abstract

The present invention provides a water-absorbent resin having excellent water-absorbing performance and water-retaining performance and high production efficiency. The present invention relates to a water-absorbent resin including a crosslinked product of a water-soluble polymer obtained by introducing an acidic group into a partial decomposition product of starch having a weight average molecular weight of 7.5 million or less.

IPC Classes  ?

• C08B 31/12 - Ethers having alkyl or cycloalkyl radicals substituted by hetero atoms
• C08L 3/08 - Ethers
• C12P 19/14 - Preparation of compounds containing saccharide radicals produced by the action of a carbohydrase, e.g. by alpha-amylase