This processing sheet (10) comprises processing parts (15) for processing a workpiece, and a sheet-shaped mesh member (11) having bending portions (12). The bending portions (12) of the mesh member (11) are embedded in the processing parts (15).
B24D 3/06 - Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special natureAbrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic
A processing sheet (10) comprises a core material (11) made of fibers, and a plurality of processing parts (15) which are fixed to the core material (11) at positions spaced apart from each other. According to this configuration, the sharpness of the processing sheet (10) can be improved.
B24D 11/00 - Constructional features of flexible abrasive materialsSpecial features in the manufacture of such materials
B24D 5/00 - Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their peripheryBushings or mountings therefor
B24D 5/08 - Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their peripheryBushings or mountings therefor with inserted abrasive blocks, e.g. segmental with reinforcing means
B24D 13/04 - Wheels having flexibly-acting working parts, e.g. buffing wheelsMountings therefor acting by their periphery comprising a plurality of flaps or strips arranged around the axis
This grindstone is provided with a plurality of Y-shaped columnar sections (11) that are arranged with a gap therebetween along a processing surface for processing an object to be processed and that extend in a direction intersecting the processing surface. Each Y-shaped columnar section (11) is provided with a first plate-shaped section (11a) and a second plate-shaped section (11b) connected to the first plate-shaped section (11a) and extending in a direction different from that of the first plate-shaped section (11a).
B24D 3/00 - Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special natureAbrasive bodies or sheets characterised by their constituents
B24D 7/00 - Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front faceBushings or mountings therefor
4.
POROUS PAD, VACUUM CHUCK DEVICE, AND PLANE FORMING METHOD FOR POROUS PAD
This porous pad (20) is provided with: a porous ceramic portion (25) having formed a plurality of pores providing permeability to allow for passage of a fluid; and an antislip portion (27) which is formed on the porous ceramic portion (25) so as to contact a part of a work (W) as an example of an object to be mounted that is mounted on the porous ceramic portion (25), and which has a static coefficient of friction higher than that of the porous ceramic portion (25).
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
B23Q 3/08 - Work-clamping means other than mechanically-actuated
B24B 41/06 - Work supports, e.g. adjustable steadies
B25B 11/00 - Work holders or positioners not covered by groups , e.g. magnetic work holders, vacuum work holders
A grindstone that enables grinding, polishing, super-finish polishing by using the same grindstone, without clogging even if the grindstone is being used continuously, in which a grinding/polishing section for processing a workpiece has a honeycomb structure formed by arranging polygonal prisms with no clearance therebetween. The grindstone includes the grindstone columns consisting of abrasive grains and binder and having an axis in depth direction of grinding/polishing surface, which are disposed on intersections or wall portions of the honeycomb structure. Porous elastomer is disposed inside the honeycomb structure, thus making it possible to perform a super-finish polishing.
B24D 3/18 - Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special natureAbrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings for porous or cellular structure
B24D 3/10 - Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special natureAbrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic for porous or cellular structure, e.g. for use with diamonds as abrasives
B24D 3/32 - Resins for porous or cellular structure
B24D 7/10 - Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front faceBushings or mountings therefor with cooling provisions
B24D 3/26 - Rubbers for porous or cellular structure
B24D 3/00 - Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special natureAbrasive bodies or sheets characterised by their constituents
A three-dimensional structure body (2) such as a honeycomb structure body is formed from grindstone sheets each having a structure in which a plurality of abrasive grains (11) are disposed on a sheet (21). As a result, the abrasive grains (11) are dispersed on walls of the three-dimensional structure body (2). A space in the three-dimensional structure body (2), that is, a space between the sheets (21) serves as a chip pocket when polishing or grinding.
B24D 3/00 - Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special natureAbrasive bodies or sheets characterised by their constituents
B24D 7/00 - Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front faceBushings or mountings therefor
7.
POLISHING SHEET AND METHOD FOR PRODUCING POLISHING SHEET
A polishing sheet has a sheet-form base and abrasive grains disposed so as to penetrate from one surface of the base to the other surface. The abrasive grains are preferably disposed on the one surface with the tips, which will contact the object being polished, aligned in the same plane. Preferably, the abrasive grains are disposed apart and form a single particle layer. The average diameter of the abrasive grains is preferably 2-3 times the thickness of the base. The polishing sheet can be used as dicing blades and the kerf width is preferably 1.1-1.5 times the average diameter of the abrasive grains. The abrasive grains are preferably disposed concentrically.
B24D 3/00 - Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special natureAbrasive bodies or sheets characterised by their constituents
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
The purpose of the invention is to provide a grindstone such that grinding, polishing, and super-fine polishing can be achieved using the same grindstone and without causing clogging when used continuously. The invention provides a grindstone having a grinding/polishing part (1) which is for working a workpiece (W) and which has a honeycomb structure comprising polygonal columns arranged without any gap therebetween, wherein the grindstone is provided with grinding columns (2), each comprising abrasive grains (5) and a binding material (6), having an axis L in the depth direction of a surface to be ground/polished, and disposed at an intersection or on a wall part of the honeycomb structure. A porous elastomer disposed inside the honeycomb, thereby enabling super-fine polishing.
B24D 3/00 - Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special natureAbrasive bodies or sheets characterised by their constituents
B24D 3/10 - Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special natureAbrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic for porous or cellular structure, e.g. for use with diamonds as abrasives
B24D 3/18 - Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special natureAbrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings for porous or cellular structure
B24D 3/26 - Rubbers for porous or cellular structure
B24D 3/32 - Resins for porous or cellular structure
9.
CONVEYANCE PAD, AND CONVEYANCE DEVICE AND CONVEYANCE METHOD USING SAME
Provided are: a conveyance pad capable of reliably adhering and fixing or floating and contactlessly conveying an object to be conveyed that is loaded on a portion of a conveyance surface by means of the affixing force or floating force of the conveyance pad; and a conveyance device and a conveyance method using same. The conveyance pad (2) is obtained from a porous substrate having multiple air holes passing therethrough. An object (W) being conveyed that is loaded on the front surface of the conveyance pad (2) is affixed or floated by depressurizing or pressurizing the back surface of the conveyance pad (2). The relationship between the area ratio α of the surface of the conveyance pad (2) covered by the object being conveyed and the conductance ratio β satisfies a specific relational formula.
B25J 15/06 - Gripping heads with vacuum or magnetic holding means
B65G 49/07 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
10.
CONTACTLESS CARRIER DEVICE AND CONTACTLESS CARRIER SYSTEM
Provided are a contactless carrier device and a contactless carrier system that can move a carried object from a carrying path to a prescribed location without using another device and that can carry the carried object in a contactless manner without dropping the carried object even when the carrying path is tilted or made to face down. A contactless carrier device according to the present invention is provided with a holding device 11 for holding a carried object 1 in a contactless state and a moving device 10 for moving the holding device 11. The holding device 11 is provided with a separation device 7 for pushing away the carried object 1 and an attraction device for attracting the carried object 1. The separation device 7 is provided with a carrying plate 2 formed of a porous material having many pores and a compressor 6 that supplies a gas to the pores of the carrying plate and that causes the gas to gush from the pores towards the carried object. The moving device 10 is a moving device that is composed of a magnetic body 8 and a magnet 9 and that moves the carried object while attracting the carried object towards the carrying plate in a contactless manner.
B65G 49/07 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
11.
GRINDSTONE AND GRINDING/POLISHING DEVICE USING SAME
[Problem] To provide a grindstone and a grinding/polishing device using same with which, in addition to it being possible to perform the three processes of rough processing, lapping, and polishing with the same device: double-sided processing is also possible; processing rate does not decrease even when used continuously; and dressing can be omitted. [Solution] A grindstone for grinding/polishing a workpiece, the grindstone being characterized in comprising multiple grindstone bars, which are obtained from a binder and abrasive grains for grinding/polishing the workpiece and disposed in parallel with an axis (L) in the depth direction of the grinding/polishing surface, and a grindstone matrix integrally formed with the grindstone bars, and a grinding/polishing device using said grindstone.
B24D 7/06 - Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front faceBushings or mountings therefor with inserted abrasive blocks, e.g. segmental
B24B 7/22 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfacesAccessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
B24B 37/12 - Lapping plates for working plane surfaces
B24D 7/14 - Zonally-graded wheelsComposite wheels comprising different abrasives
Disclosed is a vacuum chuck which reliably sucks, with a suction force required to the vacuum chuck, a subject to be sucked, said subject being placed on a part of the suction surface. In the vacuum chuck, when atmospheric pressure is expressed as (P1), and the minimum required suction force of the vacuum chuck is expressed as (Fmin), a suction pad having the rear surface side thereof sucked by means of a vacuum pump, which has a reached pressure of (Pu) and an air-release efficiency of (Se), satisfies the inequality of Fmin≤n∙(P1-Pu) ∙Se/(Se+C), where (n) is an aperture ratio, i.e., the ratio between the unit surface area of the suction pad and the total opening area of through holes exposed in the unit surface area, and (C) is conductance of the whole suction pad with a plurality of through holes. The vacuum chuck reliably sucks and holds the subject to be sucked with a suction force of (Fmin) or more, even there is an air leakage from a part of the suction pad not covered with the subject.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
B25J 15/06 - Gripping heads with vacuum or magnetic holding means
patents
