Goods & Services

Chemical preparations for use in the manufacture of insecticides; chemical preparations for use in the manufacture of fungicides; chemical preparations for use in the manufacture of herbicides. Insecticides; fungicides; herbicides; preparations for killing weeds; preparations for destroying vermin.

Abstract

This installation assisting device for a radio wave sensor includes: a target position determining unit that determines, in an image including a crosswalk, the target position for emission of radio waves by the radio wave sensor; a candidate position specification unit that receives, from a user, a candidate position, which is a candidate for an installation position of the radio wave sensor, designated within the image; a radio wave emission area defined on the basis of the target position and the candidate position; an evaluation unit that evaluates the candidate position on the basis of a first area of the crosswalk in the image; and a display control unit that causes a display device to display evaluation results from the evaluation unit.

IPC Classes  ?

• G08G 1/04 - Detecting movement of traffic to be counted or controlled using optical or ultrasonic detectors
• G08G 1/01 - Detecting movement of traffic to be counted or controlled

Abstract

A method for manufacturing a semiconductor device includes forming, on a nitride semiconductor layer, a dielectric oxide film having a higher relative dielectric constant than silicon dioxide, forming a dielectric oxynitride film by nitriding the dielectric oxide film, and forming a gate electrode on the dielectric oxynitride film. The forming the dielectric oxynitride film includes disposing a substrate including the nitride semiconductor layer and the dielectric oxide film inside a reaction furnace including a catalyst metal therein, thermally decomposing an ammonia gas inside the reaction furnace to generate a dinitrogen monoxide gas from nitrogen atoms included in the ammonia gas and oxygen atoms diffused from the dielectric oxide film, and thermally decomposing the dinitrogen monoxide gas to generate a nitrogen monoxide gas.

IPC Classes  ?

• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
• H01L 21/28 - Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups
• H01L 29/66 - Types of semiconductor device

Abstract

An optical semiconductor element includes, a substrate having a silicon layer, and a semiconductor element made of a III-V compound semiconductor and bonded to the silicon layer. The silicon layer has a waveguide, a recess, a terrace, and a connecting portion. The recess is a recessed part lower than a surface of the waveguide, a surface of the terrace, and a surface of the connecting portion and is provided between the waveguide and the terrace. The semiconductor element is bonded on the waveguide, the recess, and the connecting portion and has a first tapered portion protruding in a direction in which the waveguide extends. The connecting portion crosses the recess and is connected to the waveguide and the terrace.

IPC Classes  ?

• G02B 6/42 - Coupling light guides with opto-electronic elements
• G02F 1/29 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the position or the direction of light beams, i.e. deflection

Abstract

A management device includes: an acquisition unit that acquires change information from which a change in an operational state of one or more functional units included in an onboard network is discernible, and from which a change in a state of use of a transmission path in the onboard network by the functional units is discernible; and a setting change unit that performs setting change to change settings for the onboard network based on the change information acquired by the acquisition unit.

IPC Classes  ?

• H04L 45/42 - Centralised routing
• H04L 12/46 - Interconnection of networks

Abstract

A semiconductor device includes a substrate having main and back surfaces, and a first transistor and a second transistor. A first end of a via hole which penetrates the substrate and is farther from the second transistor is farther from the second transistor than a second end of an active region which is farther from the second transistor in a region where a first gate electrode of the first transistor is disposed, as viewed from a first direction.

IPC Classes  ?

• H01L 27/02 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
• H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
• H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
• H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration

Abstract

This silicon carbide substrate has a main surface. The maximum diameter of the main surface is 100 mm or more. The main surface is composed of an outer edge, an outer peripheral region extending up to 5 mm from the outer edge, and a central region surrounded by the outer peripheral region. At 27°C, the electrical resistivity at an any position in the central region is 1 × 1012Ωcm or more. At 200°C, the average value of the electrical resistivity of the central region is 1 × 1010 Ωcm or more. The area of the region having an electrical resistivity within ±5% of the average value is 70% or more of the area of the central region.

IPC Classes  ?

• C30B 29/36 - Carbides
• C30B 23/06 - Heating of the deposition chamber, the substrate, or the materials to be evaporated
• H01L 21/20 - Deposition of semiconductor materials on a substrate, e.g. epitaxial growth
• H01L 21/205 - Deposition of semiconductor materials on a substrate, e.g. epitaxial growth using reduction or decomposition of a gaseous compound yielding a solid condensate, i.e. chemical deposition
• H01L 21/338 - Field-effect transistors with a Schottky gate
• H01L 29/778 - Field-effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT
• H01L 29/812 - Field-effect transistors with field effect produced by a PN or other rectifying junction gate with a Schottky gate

Abstract

A system according to one aspect of the present disclosure is an optical communication system in which a plurality of house-side devices and a station-side device which are connected via an optical network perform full duplex wavelength-division multiplexed communication. The optical network includes a main line to which the station-side device is connected and a plurality of branch lines which branch from the main line and to which the plurality of house-side devices are respectively connected. The branch lines are each an optical transmission path of one core via which both an uplink optical signal and a downlink optical signal are transmitted. The station-side device has an optical transceiver in which, for both reception wavelength and transmission wavelength, there are two or more wavelengths with which operation is possible. The house-side devices each have an optical transceiver in which, for both reception wavelength and transmission wavelength, there is one or more wavelengths with which operation is possible. The reception wavelengths and transmission wavelengths of the plurality of house-side devices satisfy expression (1) and expression (2).　(1): Rλi∩Tλi=φ (2): AR1∩AT1≠φ

IPC Classes  ?

• H04J 14/02 - Wavelength-division multiplex systems
• H04B 10/272 - Star-type networks

Abstract

A connector (100) is provided with: a terminal fitting (10) connected to a core wire (83); a housing (91) in which a plurality of recesses (91A) arranged in the left-right direction and accommodating the terminal fitting (10) are formed; and a covering part (92) having a covering surface (92G) covering the recesses (91A) from a direction intersecting the front-rear direction. The covering part (92) is separate from the terminal fitting (10), and the housing (91) has a receiving surface (91S) that faces the covering surface (92G). A region of the covering surface (92G) that faces the receiving surface (91S) is provided with a plurality of protrusions (92D) that are arranged so as to be spaced apart from each other in the left-right direction, the protrusions (92D) having a minimum separation dimension in the left-right direction smaller than the outer diameter dimension of a coating (82). In a state in which the covering surface (92G) covers the recesses (91A) accommodating the terminal fitting (10), the front end of the coating (82) is routed between the adjacent protrusions (92D).

IPC Classes  ?

• H01R 13/58 - Means for relieving strain on wire connection, e.g. cord grip

Abstract

This turning tool comprises: a rod-like body part having a tip part where a cutting tip is held and a base part which is an end part on the opposite side from the tip part in the longitudinal direction; and a strain sensor installed in the body part. The body part includes: a first part that includes the base part; and a second part that is formed at a position separated from the base part in the longitudinal direction so as to be continuous with the first part, and has a cross-sectional area perpendicular to the longitudinal direction larger than that of the first part. The strain sensor is disposed closer to the tip part side than the boundary between the first part and the second part in the longitudinal direction of the body part.

IPC Classes  ?

• B23B 27/00 - Tools for turning or boring machinesTools of a similar kind in generalAccessories therefor
• B23B 29/12 - Special arrangements on tool holders
• B23Q 17/09 - Arrangements for indicating or measuring on machine tools for indicating or measuring cutting pressure or cutting-tool condition, e.g. cutting ability, load on tool

Abstract

A lead wire according to the present invention comprises a conductor and an insulating film that covers the outer circumferential surface of the conductor between both ends in a first direction of the conductor but exposes both ends of the conductor. The conductor includes a base material that comprises copper or a copper alloy and a nickel plating layer that is provided on the base material and is disposed between the base material and the insulating film. The nickel plating layer includes a first region that contacts the insulating film. The first region includes a second region, and the developed interfacial area ratio Sdr of the second region as defined in JIS B 0681-2:2018 is at least 0.5.

IPC Classes  ?

• H01M 50/562 - Terminals characterised by the material
• H01B 7/02 - Disposition of insulation
• H01M 50/178 - Arrangements of electric connectors penetrating the casing adapted for the shape of the cells for pouch or flexible bag cells
• H01M 50/184 - Sealing members characterised by their shape or structure
• H01M 50/193 - Organic material
• H01M 50/197 - Sealing members characterised by the material having a layered structure
• H01M 50/534 - Electrode connections inside a battery casing characterised by the material of the leads or tabs

Abstract

This lead wire comprises a conductor and an insulating film that covers an outer peripheral surface of the conductor between both ends of the conductor while exposing both ends in a first direction of the conductor. The conductor is made of aluminum or an aluminum alloy. The conductor includes a first region in contact with the insulating film. The first region includes a second region. The development interface area ratio Sdr of the second region defined by JIS B 0681-2:2018 is 0.5 or more.

IPC Classes  ?

• H01M 50/562 - Terminals characterised by the material
• H01G 11/74 - Terminals, e.g. extensions of current collectors
• H01G 11/78 - CasesHousingsEncapsulationsMountings
• H01M 50/55 - Terminals characterised by the disposition of the terminals on the cells on the same side of the cell
• H01M 50/184 - Sealing members characterised by their shape or structure
• H01M 50/193 - Organic material
• H01M 50/197 - Sealing members characterised by the material having a layered structure
• H01M 50/534 - Electrode connections inside a battery casing characterised by the material of the leads or tabs
• H01M 50/591 - Covers

Abstract

This mesh is composed of a skeleton comprising a plurality of support parts and a plurality of node parts. Each of the plurality of node parts connects two or more support parts among the plurality of support parts. The skeleton consists of a skeleton body and an internal part surrounded by the skeleton body. The skeleton body consists essentially of nickel or a nickel alloy.

IPC Classes  ?

• C25B 11/03 - ElectrodesManufacture thereof not otherwise provided for characterised by shape or form perforated or foraminous
• C25B 11/042 - Electrodes formed of a single material
• D03D 9/00 - Open-work fabrics
• D03D 15/25 - Metal
• D03D 15/283 - Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the material of the fibres or filaments constituting the yarns or threads synthetic polymer-based, e.g. polyamide or polyester fibres
• D04C 1/02 - Braid or lace, e.g. pillow-laceProcesses for the manufacture thereof made from particular materials
• D04C 1/06 - Braid or lace serving particular purposes
• H01M 4/66 - Selection of materials
• H01M 4/74 - Meshes or woven materialExpanded metal
• H01M 8/0232 - Metals or alloys
• H01M 8/026 - CollectorsSeparators, e.g. bipolar separatorsInterconnectors characterised by the configuration of channels, e.g. by the flow field of the reactant or coolant characterised by grooves, e.g. their pitch or depth

Abstract

A wire harness (11) is provided with a first shield wire (12) and second shield wires (13, 14). The wire harness (11) is provided with: a core wire connection part (16) to which a first core wire (12a) and second core wires (13a, 14a) are connected; and a heat-shrink tube (34) that covers the outer periphery of the core wire connection part (16) and covers the outer periphery of a part of outer insulation coatings (12d, 13d, 14d). The wire harness (11) is provided with one or more joining parts in which resins having compatibility inside the heat-shrink tube (34) are joined to each other, so that entrance of liquid into the inside of the heat-shrink tube (34) is suppressed.

IPC Classes  ?

• H01R 4/72 - Insulation of connections using a heat shrinking insulating sleeve
• H01R 4/00 - Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one anotherMeans for effecting or maintaining such contactElectrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
• H01R 4/70 - Insulation of connections
• H01R 13/6593 - Specific features or arrangements of connection of shield to conductive members the conductive member being a shielded cable the shield being composed of different pieces
• H02G 1/14 - Methods or apparatus specially adapted for installing, maintaining, repairing, or dismantling electric cables or lines for joining or terminating cables
• H02G 15/08 - Cable junctions

Abstract

A wire harness (1) comprises: a first electric wire unit (4) in which a plurality of flexible electric wires (3) extend from a first connector (2); and a second electric wire unit (6) that includes a plurality of solid core electric wires (5), each of which is formed by making each of the plurality of flexible electric wires (3) into a single wire, and each of which is provided with a second connector (10) at one end thereof. Each of the plurality of flexible electric wires (3) is electrically connected by assembling each of first connection parts (9) provided at a tip of each of the plurality of flexible electric wire (3) to each of second connection parts (11) provided at the other end of each of the solid core electric wires (5).

IPC Classes  ?

• H01R 35/02 - Flexible line connectors
• H01R 4/34 - Conductive members located under head of screw
• H01R 13/73 - Means for mounting coupling parts to apparatus or structures, e.g. to a wall

Abstract

Provided is a substrate for cells, which has excellent capability of detecting a chemical substance such as a smell substance. The substrate for cells includes a compartment including a polypeptide-coated surface and is used for the measurement of an activity of a sensor protein.

IPC Classes  ?

• C12M 3/00 - Tissue, human, animal or plant cell, or virus culture apparatus
• C12N 5/10 - Cells modified by introduction of foreign genetic material, e.g. virus-transformed cells
• C12N 15/12 - Genes encoding animal proteins
• C12Q 1/02 - Measuring or testing processes involving enzymes, nucleic acids or microorganismsCompositions thereforProcesses of preparing such compositions involving viable microorganisms
• G01N 33/544 - ImmunoassayBiospecific binding assayMaterials therefor with an insoluble carrier for immobilising immunochemicals the carrier being organic

Abstract

Provided is a base material for cells, which has excellent detectability of chemical substances such as odorants. This base material for cells includes a compartment including a surface in which the molar ratio (O/C) of oxygen atoms with respect to carbon atoms is 0.150 or more.

IPC Classes  ?

• C12M 3/00 - Tissue, human, animal or plant cell, or virus culture apparatus
• C12N 5/10 - Cells modified by introduction of foreign genetic material, e.g. virus-transformed cells
• C12N 15/12 - Genes encoding animal proteins
• C12Q 1/02 - Measuring or testing processes involving enzymes, nucleic acids or microorganismsCompositions thereforProcesses of preparing such compositions involving viable microorganisms
• G01N 33/545 - Synthetic resin

Abstract

The purpose of the present invention is to provide: a molded body which exhibits excellent scattering prevention properties while increasing impact resistance and rigidity; a (meth)acrylic resin composition able to produce this molded body; a method for recycling the (meth)acrylic resin composition; a recycled (meth)acrylic resin composition; a method for producing the molded body; and a method for decomposing and recovering the (meth)acrylic resin composition. Provided are: a (meth)acrylic resin composition that contains a fibrous glass filler and a (meth)acrylic resin in which the content of a structural unit derived from a (meth)acrylic acid ester is 90-99.985 mol% and the content of a structural unit derived from (meth)acrylic acid is 0.015-9.0 mol%, each relative to a total of 100 mol% of all structural units; a method for recycling the (meth)acrylic resin composition; a recycled (meth)acrylic resin composition; a molded body of the (meth)acrylic resin composition; a method for producing the molded body; and a method for decomposing and recovering the (meth)acrylic resin composition.

IPC Classes  ?

• C08L 33/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
• B29B 17/00 - Recovery of plastics or other constituents of waste material containing plastics
• B29C 45/00 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor
• C08F 220/14 - Methyl esters
• C08J 11/12 - Recovery or working-up of waste materials of polymers by chemically breaking down the molecular chains of polymers or breaking of crosslinks, e.g. devulcanisation by dry-heat treatment only
• C08K 7/14 - Glass
• C08L 25/12 - Copolymers of styrene with unsaturated nitriles
• C08L 51/00 - Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers
• C08L 51/06 - Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond

Abstract

NN generated in the thermoelectric conversion section 202 due to the heat flow H input to the thermoelectric conversion section 202 from the outside along the first direction.

IPC Classes  ?

• H10N 15/00 - Thermoelectric devices without a junction of dissimilar materialsThermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
• H10B 61/00 - Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
• H10D 48/40 - Devices controlled by magnetic fields
• H10N 50/80 - Constructional details

Abstract

A gap filler composition according to embodiments of the present invention comprises: a siloxane-based resin; a filler including thermally conductive inorganic particles and hollow particles; a catalyst; and an amino-silicone-based dispersant. A gap filler composition is provided that maintains thermal conductivity by utilizing an amino-silicone-based dispersant and hollow particles and has low specific gravity and improved viscosity stability. A battery pack utilizing the gap filler composition is provided.

IPC Classes  ?

• H01M 10/655 - Solid structures for heat exchange or heat conduction
• H01M 10/613 - Cooling or keeping cold
• H01M 50/242 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by physical properties of casings or racks, e.g. dimensions adapted for protecting batteries against vibrations, collision impact or swelling
• C08L 83/04 - Polysiloxanes
• C08K 3/22 - OxidesHydroxides of metals
• C08G 77/12 - Polysiloxanes containing silicon bound to hydrogen
• C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups

Goods & Services

Sports equipment; golf equipment; golf clubs; golf club heads; stands specially adapted for holding golf clubs; golf club grips; golf club shafts; head covers for golf clubs.

Goods & Services

Sports equipment; golf equipment; golf clubs; golf club heads; stands specially adapted for holding golf clubs; golf club grips; golf club shafts; head covers for golf clubs.

Abstract

A molded article includes at least one of the following: an ethylene-based copolymer (A), a copolymer (B) derived from an aromatic vinyl compound and a conjugated diene compound, a propylene-based polymer (C), and a lubricant (D). The article has a flexural modulus of 20-300 MPa at room temperature, measured per JIS K7171. It also has a shear strength of 40 N/cm2 or less, determined by placing two test pieces (50 mm×6 mm×2 mm) from the article onto a flat plate, contacting them with a float glass plate (110 mm×110 mm×3 mm) as per JIS R 3202, and applying tension at 200 mm/min after conditioning at 80° C. for 50 hours.

IPC Classes  ?

• C08L 23/16 - Ethene-propene or ethene-propene-diene copolymers
• C08J 3/20 - Compounding polymers with additives, e.g. colouring
• C08K 5/20 - Carboxylic acid amides
• C08L 91/00 - Compositions of oils, fats or waxesCompositions of derivatives thereof

Abstract

An antenna structure includes a dielectric layer, an antenna unit disposed on the dielectric layer and comprising a radiator, a signal pad and a transmission line connecting the radiator and the signal pad to each other, and a ground separated from the antenna unit in a thickness direction with the dielectric layer interposed therebetween. At least one of a shortest distance between the ground and the radiator in the thickness direction, a shortest distance between the ground and the transmission line in the thickness direction, and a shortest distance between the ground and the signal pad in the thickness direction is different.

IPC Classes  ?

• H01Q 9/04 - Resonant antennas
• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support

Abstract

A tire includes a tread portion having a first land region provided with first axial grooves and a second land region provided with second axial grooves. The first axial grooves are arranged at intervals in a first arrangement over the entire tire circumference. In the first arrangement, in a pair of adjacent first axial grooves, a first end of one first axial groove is located at the same position in the tire circumferential direction as the second end of the other first axial groove. The second axial grooves are arranged at intervals in a second arrangement. The number of types of a second pitch of the second axial grooves in the second arrangement is greater than the number of types of a first pitch of the first axial grooves in the first arrangement.

IPC Classes  ?

• B60C 11/03 - Tread patterns

Abstract

A multicore cable includes an oil absorptive interposition, and a core disposed to surround the oil absorptive interposition and including electrical wires, the electrical wires being twisted together. In a cross-section perpendicular to a longitudinal direction of the core, the core has layers in which the electrical wires are arranged on circumferences, and an innermost layer of the layers is closest to the oil absorptive interposition. A twist pitch of the electrical wires in the innermost layer is greater than or equal to 0.45 times and less than 0.8 times a twist pitch of the electrical wires in an outermost layer of the layers.

IPC Classes  ?

• H01B 7/28 - Protection against damage caused by external factors, e.g. sheaths or armouring by moisture, corrosion, chemical attack or weather
• H01B 7/00 - Insulated conductors or cables characterised by their form

Abstract

A semiconductor device includes a nitride semiconductor layer, a dielectric oxynitride film provided on the nitride semiconductor layer and having a first surface facing the nitride semiconductor layer, and a gate electrode provided on the dielectric oxynitride film. A surface of the nitride semiconductor layer facing the dielectric oxynitride film has a nitrogen polarity.

IPC Classes  ?

• H01L 29/51 - Insulating materials associated therewith
• H01L 21/28 - Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups
• H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
• H01L 29/66 - Types of semiconductor device
• H01L 29/778 - Field-effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT

Abstract

A production method for a semiconductor device includes: forming a first nitride semiconductor layer having nitrogen polarity at upper surface; forming a first dielectric film on the first nitride semiconductor layer; forming a first opening in the first dielectric film, part of the first nitride semiconductor layer being exposed from the first opening; forming a second nitride semiconductor layer inward of the first opening and on the first nitride semiconductor layer; forming a second opening in the first dielectric film after the formation of the second nitride semiconductor layer, part of the first nitride semiconductor layer being exposed from the second opening; forming a second dielectric film inward of the second opening and on the first nitride semiconductor layer; forming an ohmic electrode that is in an ohmic contact with the second nitride semiconductor layer; and forming a gate electrode above the second opening and on the second dielectric film.

IPC Classes  ?

• H01L 29/778 - Field-effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT
• H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
• H01L 29/45 - Ohmic electrodes
• H01L 29/66 - Types of semiconductor device

Abstract

A cutting tool has a cutting bite, a power path, and a housing. The cutting bite includes a cutting edge, a shank that holds the cutting edge, and a sensor attached to the shank. The power path has a first terminal connected to the cutting bite and a second terminal opposite to the first terminal, and supplies power to the sensor. The housing accommodates a battery that stores power to be supplied to the power path, and is connected to the second terminal.

IPC Classes  ?

• B26D 5/08 - Means for actuating the cutting member to effect the cut
• B26D 11/00 - Combinations of several similar cutting apparatus

Abstract

A high frequency amplifier includes an asymmetrical Doherty amplifier having a carrier amplifier, a peak amplifier, a branch circuit, and a phase adjusting circuit, a driver amplifier, and a base member mounting a first circuit board mounting the driver amplifier, the carrier amplifier, and the peak amplifier and a second circuit board mounting the circuits. The branch circuit divides a path of a RF signal into input paths of the peak and carrier amplifiers. The driver amplifier, the carrier amplifier, and the peak amplifier have rear surfaces in contact with the base member. The electrical length from the output terminal of the driver amplifier to the input terminal of the peak amplifier, when converted based on a phase of the signal, is from (2n+1)×π−π/4 to (2n+1)×π+π/4, where n is an integer greater than or equal to zero.

IPC Classes  ?

• H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
• H03F 3/21 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
• H03K 5/00 - Manipulation of pulses not covered by one of the other main groups of this subclass
• H03K 5/01 - Shaping pulses
• H05K 1/02 - Printed circuits Details

Abstract

An MCF of one embodiment combines the adoption of a plurality of cores with different refractive indices with suppression of manufacturing costs. The MCF has a glass optical fiber having a plurality of cores and a cladding, and a resin coating. The plurality of cores includes a first core with a high refractive index and a second core with a low refractive index. On a cross-section of the MCF, an arrangement of centers of a plurality of portions has no rotational symmetry about the cross-section center, the portions having a refractive index higher than that of the cladding. Furthermore, a mode leakage adjustment structure is provided to reduce a difference between a cutoff wavelength of a residual higher-order mode in the second core and a cutoff wavelength of a residual higher-order mode in the first core.

IPC Classes  ?

• G02B 6/02 - Optical fibres with cladding

Abstract

A production method for a semiconductor device includes: forming a dielectric oxide film on a nitride semiconductor layer, where the dielectric oxide film has a higher relative permittivity than a relative permittivity of silicon dioxide; nitriding the dielectric oxide film to form a dielectric oxynitride film; forming a first silicon nitride film on the dielectric oxynitride film by a thermal film formation method; forming a second silicon nitride film on the first silicon nitride film; forming an opening in the second silicon nitride film and the first silicon nitride film, where the opening reaches the dielectric oxynitride film; and forming a gate electrode on the second silicon nitride film, where the gate electrode is in contact with the dielectric oxynitride film through the opening.

IPC Classes  ?

• H01L 21/28 - Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups
• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
• H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
• H01L 29/423 - Electrodes characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
• H01L 29/51 - Insulating materials associated therewith
• H01L 29/66 - Types of semiconductor device
• H01L 29/778 - Field-effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT

Abstract

A method according to the present disclosure is a method of manufacturing a multiplexer/demultiplexer including a substrate, a first port for inputting light, and a second port for outputting light, the first port and the second port being provided in the substrate. The method includes designing positions of a plurality of holes such that three adjacent holes among the plurality of holes are arranged in a triangle lattice, and forming the plurality of holes in a surface of the substrate.

IPC Classes  ?

• G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
• G02B 27/00 - Optical systems or apparatus not provided for by any of the groups ,

Abstract

A semiconductor device includes a barrier layer having a nitrogen polarity on an upper surface, a channel layer on the barrier layer, the channel layer having a nitrogen polarity on an upper surface, a first cap layer on the channel layer, the first cap layer having a nitrogen polarity on an upper surface, and a dielectric film in contact with the upper surface of the first cap layer. The first cap layer is an aluminum nitride layer.

IPC Classes  ?

• H01L 29/778 - Field-effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT
• H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
• H01L 29/423 - Electrodes characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
• H01L 29/66 - Types of semiconductor device

Abstract

The objective of the present invention is to reduce an amount of protrusion of an interlock connector, and to suppress mis-installation of the interlock connector. This cover with an interlock connector is provided with a cover portion including a seal member, and an interlock connector held by the seal member. The interlock connector includes a mating portion which mates with a counterpart-side connector, and a plate-shaped attachment portion, and the seal member includes a connector holding portion which movably holds the interlock connector. The attachment portion includes a first side portion, a second side portion, and a mis-installation prevention protruding portion. The connector holding portion includes a first guide channel and a second guide channel, a rear side receiving portion, and a retaining resilient piece. The connector holding portion includes a mis-installation prevention recessed portion which accepts the mis-installation prevention protruding portion, and which is formed continuously with the first guide channel in a position offset from the first guide channel in a direction intersecting a first direction.

IPC Classes  ?

• H01R 13/52 - Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
• H01R 13/631 - Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure for engagement only
• H01R 13/707 - Structural association with built-in electrical component with built-in switch interlocked with contact members or counterpart

Abstract

A relay connector that is configured to be attached to a device case to electrically connect an inside and an outside of the device case, the relay connector including: a terminal; a connector housing that holds the terminal; and a seal that is configured to seal between the connector housing and the device case, the seal having: an annular seal body that is configured to be sandwiched and compressed between the connector housing and the device case; and a fixing piece extending from the seal body outward of the seal body, and the connector housing having a positioning column that is configured to be fitted into a positioning recess provided in the device case, the positioning column extending through the fixing piece and holding the fixing piece.

IPC Classes  ?

• H01R 13/74 - Means for mounting coupling parts to apparatus or structures, e.g. to a wall for mounting coupling parts in openings of a panel
• H01R 13/52 - Dustproof, splashproof, drip-proof, waterproof, or flameproof cases

Abstract

A semiconductor device includes a substrate, first FETs having first gate electrodes and arranged in a first direction, second FETs having second gate electrodes and arranged in the first direction, third FETs having third gate electrodes and arranged in the first direction, the second FETs being interposed between the third and the first FETs in a second direction, wherein a first distance between two second gate electrodes with one second gate electrode interposed therebetween in a central portion of the first to third FETs in the first direction is larger than a second distance between two second gate electrodes with one second gate electrode interposed therebetween in a first end portion of the first to third FETs in the first direction, and the second distance is smaller than a third distance between two first gate electrodes with one first gate electrode interposed therebetween in the first end portion.

IPC Classes  ?

• H01L 27/02 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier

Abstract

An amplifier circuit includes a divider that divides an input signal into a first signal and a second signal, a first amplifier that amplifies the first signal and output a third signal to a first node, a second amplifier that amplifies the second signal and outputs a fourth signal to a second node, a combiner that combines the third signal and the fourth signal and outputs a combined signal to an output terminal as an output signal, and a processing circuit that includes an input node to which the first and the second nodes are electrically coupled, and allows a signal having a frequency lower than an operating band of the first amplifier and the second amplifier to pass through a reference potential, wherein a coupling degree between the first node and the input node is larger than a coupling degree between the second node and the input node.

IPC Classes  ?

• H03F 3/21 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
• H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation

Abstract

A semiconductor device includes a conductive base, a first chip and a second chip that are mounted on the base, and a first bonding wire that electrically connects the first chip to the second chip and transmits a high frequency signal. The base has a first opening extending through the base in a thickness direction of the base and overlapping at least a part of the first bonding wire with no conductor layer interposed between the first opening and the at least a part of the first bonding wire as viewed in the thickness direction of the base.

IPC Classes  ?

• H01L 23/66 - High-frequency adaptations
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H01L 23/495 - Lead-frames
• H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices
• H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits

Abstract

A semiconductor device includes a base, one or a plurality of chips that include a semiconductor chip provided on the base, a first bonding wire connected to at least one of the one or the plurality of chips, a second bonding wire that extends in a direction intersecting with an extending direction of the first bonding wire when viewed from a thickness direction of the base, and a resin layer that is provided on the base and seals the one or the plurality of chips, the first bonding wire and the second bonding wire. The first bonding wire and the second bonding wire are not in contact with each other, and the first bonding wire is contactable with the second bonding wire when the first bonding wire is inclined toward the second bonding wire.

IPC Classes  ?

• H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H01L 23/498 - Leads on insulating substrates
• H01L 23/66 - High-frequency adaptations

Abstract

A semiconductor device according to the present disclosure includes a source electrode provided on a substrate, a gate electrode provided-on the substrate and surrounding a part of the source electrode, a drain electrode provided on the substrate and surrounding the gate electrode, and a gate wiring provided on the substrate, wherein a first end of the gate wiring is connected to only one portion of the gate electrode and a second end of the gate wiring is connected to a first gate bus bar.

IPC Classes  ?

• H01L 29/423 - Electrodes characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
• H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
• H01L 23/528 - Layout of the interconnection structure
• H01L 29/417 - Electrodes characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched

Abstract

Provided is a battery pack member which includes a liquid crystal polyester and glass fibers, wherein: the length weighted average fiber length of the glass fibers is 0.3 mm or more; and the content of the glass fibers is 20% by mass to 70% by mass with respect to a total content of 100% by mass of the liquid crystal polyester and the glass fibers.

IPC Classes  ?

• H01M 50/28 - Composite material consisting of a mixture of organic and inorganic materials
• B29C 45/00 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor
• B29C 70/42 - Shaping or impregnating by compression for producing articles of definite length, i.e. discrete articles
• C08G 63/123 - Polyesters derived from hydroxy carboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
• C08J 5/04 - Reinforcing macromolecular compounds with loose or coherent fibrous material
• C08K 7/14 - Glass
• C08L 67/00 - Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chainCompositions of derivatives of such polymers
• H01M 50/229 - Composite material consisting of a mixture of organic and inorganic materials
• H01M 50/293 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by the material
• B29K 105/12 - Condition, form or state of moulded material containing reinforcements, fillers or inserts of short lengths, e.g. chopped filaments, staple fibres or bristles

Abstract

Provided is an optical laminate capable of gently increasing adhesion to a substrate due to heat and thus improving reworkability. An optical laminate according to the present invention has a resin film, a coat layer, and an adhesive layer in this order, wherein the coat layer contains carbon nanotubes, and the adhesive layer contains a (meth)acrylic resin (A), a crosslinking agent (B), a silane compound (C), and an antistatic agent (D).

IPC Classes  ?

• G02B 1/16 - Optical coatings produced by application to, or surface treatment of, optical elements having an anti-static effect, e.g. electrically conducting coatings
• B32B 27/00 - Layered products essentially comprising synthetic resin
• C09J 7/29 - Laminated material
• C09J 7/38 - Pressure-sensitive adhesives [PSA]
• C09J 11/06 - Non-macromolecular additives organic
• C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
• G02B 1/14 - Protective coatings, e.g. hard coatings
• G02B 5/30 - Polarising elements
• G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements

Abstract

The antenna structure includes: an antenna element including an antenna conductive layer and an antenna ground layer; a first circuit board electrically connected to the antenna conductive layer; a second circuit board electrically connected to the antenna ground layer; and a connector coupled to both the end of the first circuit board and the end of the second circuit board. The second circuit board may be used to improve radiation directivity, and may be connected to the first circuit board via the connector.

IPC Classes  ?

• H01Q 1/48 - Earthing meansEarth screensCounterpoises
• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
• H05K 1/02 - Printed circuits Details

Abstract

A bus bar 10 is configured by connecting a first member 10A and a second member 10B formed separately from the first member 10A, wherein the first member 10A and the second member 10B each include a connection part 11, the two connection parts 11 are arranged in a first direction D1, the first member 10A is provided with an extension part 13 that is formed extending from the connection part 11 and is disposed at a position offset from the connection part 11 in the first direction D1, the second member 10B has an overlapping part 14 disposed overlapping at least a portion of the extension part 13, the extension part 13 and the overlapping part 14 are electrically connected, and the distance SP1 between the two connection parts 11 in the first direction D1 can be adjusted by changing the first-direction D1 position of the overlapping part 14 in the second member 10B when the first member 10A and the second member 10B are not connected.

IPC Classes  ?

• H01M 50/503 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the shape of the interconnectors
• H01M 50/507 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing comprising an arrangement of two or more busbars within a container structure, e.g. busbar modules
• H01M 50/569 - Constructional details of current conducting connections for detecting conditions inside cells or batteries, e.g. details of voltage sensing terminals

Abstract

Provided is a single-wire steel cord having a flat shape with a thickness less than the width in a cross section perpendicular to a longitudinal direction, the thickness being between 0.31 mm and 0.55 mm (both inclusive) and the cross section having a cross-sectional area between 0.155 mm2and 0.250 mm2 (both inclusive).

IPC Classes  ?

• D07B 1/06 - Ropes or cables built-up from metal wires, e.g. of section wires around a hemp core
• B60C 9/00 - Reinforcements or ply arrangement of pneumatic tyres

Abstract

Provided is an aluminum alloy wire which is formed of an aluminum alloy, wherein: the aluminum alloy contains 1.0% by mass to 1.3% by mass of silicon, 0.5% by mass to 1.2% by mass of magnesium, 0.3% by mass to 0.8% by mass of iron, 0.1% by mass to 0.4% by mass of copper, 0.2% by mass to 0.5% by mass of manganese, 0.001% by mass to 0.3% by mass of chromium, 0% by mass to 0.25% by mass of zinc, 0% by mass to 0.075% by mass of titanium, 0% by mass to 0.17% by mass of zirconium, with the balance being made up of aluminum and inevitable impurities; the 0.2% proof stress at compression is 360 MPa or more; the crystal grain size of the aluminum alloy is 200 μm or less; and the compressive deformation degree is 0.6 to 1.0 inclusive.

IPC Classes  ?

• C22C 21/02 - Alloys based on aluminium with silicon as the next major constituent
• C22C 21/06 - Alloys based on aluminium with magnesium as the next major constituent
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22F 1/05 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys of the Al-Si-Mg type, i.e. containing silicon and magnesium in approximately equal proportions

Abstract

This onboard device is an onboard device mounted in a vehicle, comprising: a resource calculation unit that calculates available resources of the onboard device; a feasibility determination unit that determines, on the basis of the calculation results of the available resources by the resource calculation unit, the feasibility of realizing functions assigned to other onboard devices; and a processing unit that performs processing to realize the functions assigned to the other onboard devices, which have been determined to be realizable by the feasibility determination unit.

IPC Classes  ?

• G06F 9/50 - Allocation of resources, e.g. of the central processing unit [CPU]
• B60R 16/02 - Electric or fluid circuits specially adapted for vehicles and not otherwise provided forArrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric

Abstract

This reactor is provided with a coil and a magnetic core having: an inner-side core part which is disposed inside the coil; and an outer-side core part which is disposed outside the coil. The coil has a winding which is wound so as to be along the outer peripheral surface of the inner-side core part. The outer peripheral shape of the coil, viewed in a first direction along the axis of the coil, is a rectangular shape. The outer peripheral surface of the coil has a first coil surface and a second coil surface which are opposite to each other and are along each of the long sides of the outer peripheral shape of the coil. The first coil surface and the second coil surface are exposed from the outer-side core part. At least the outer peripheral region of the inner-side core part is constituted of a molding of composite material, and the outer peripheral surface of the inner-side core part has a plurality of groove portions arranged in the direction along the axis of the inner-side core part. The winding in respective turns of the coil is disposed in the plurality of groove portions.

IPC Classes  ?

• H01F 37/00 - Fixed inductances not covered by group
• H01F 27/24 - Magnetic cores

Abstract

A system according to an aspect of the present disclosure is an optical communication system in which a station-side device and a plurality of home-side devices connected through an optical line perform full-duplex wavelength division multiplex communication. The optical line includes a trunk line to which the station-side device is connected, and a plurality of branch lines which branch by means of an optical coupler and which are respectively connected to the home-side devices. Each of the branch lines is a single-core optical transmission path through which both an uplink optical signal and a downlink optical signal are transmitted. The station-side device has an optical transceiver in which at least two reception wavelengths and at least two transmission wavelengths can be utilized. Each of the home-side devices has an optical transceiver in which at least one reception wavelength and at least one transmission wavelength can be utilized. The reception wavelength and the transmission wavelength of each of the home-side devices satisfy the following expressions (1) and (2).　(1): Rλi∩Tλi=φ (2): AR1∩AT1≠φ

IPC Classes  ?

• H04J 14/02 - Wavelength-division multiplex systems
• H04B 10/272 - Star-type networks

Abstract

To provide a technology for controlling weeds and the like. A herbicidal composition comprising at least one compound selected from Group A, and dicamba N,N-bis-(3-aminopropyl)methylamine salt has a weed control effect: Group A: a group consisting of flumioxazin, sulfentrazone, saflufenacil, oxyfluorfen, fomesafen and a compound represented by the formula (I):

IPC Classes  ?

• A01N 37/40 - Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom having three bonds to hetero atoms with at the most two bonds to halogen, e.g. carboxylic acids containing at least one carboxylic group or a thio-analogue, or a derivative thereof, and a singly bound oxygen or sulfur atom attached to the same carbon skeleton, this oxygen or sulfur atom not being a member of a carboxylic group or of a thio-analogue, or of a derivative thereof, e.g. hydroxy-carboxylic acids having at least one oxygen or sulfur atom attached to an aromatic ring system having at least one carboxylic group or a thio-analogue, or a derivative thereof, and one oxygen or sulfur atom attached to the same aromatic ring system
• A01N 33/04 - Nitrogen directly attached to aliphatic or cycloaliphatic carbon atoms
• A01N 41/10 - SulfonesSulfoxides
• A01N 43/54 - 1,3-DiazinesHydrogenated 1,3-diazines
• A01N 43/653 - 1,2,4-TriazolesHydrogenated 1,2,4-triazoles
• A01N 57/20 - Biocides, pest repellants or attractants, or plant growth regulators containing organic phosphorus compounds having phosphorus-to-carbon bonds containing acyclic or cycloaliphatic radicals

Goods & Services

Golf clubs; Golf club heads

Abstract

A pneumatic tire of the present invention includes a tire inner cavity 1B and a porous sound damper 10. The sound damper 10 is an annular body extending in a tire circumferential direction and is not adhered to a surface of the tire inner cavity 1B. An average thickness T (mm) of the sound damper 10 and an inner cavity surface radius R (mm) satisfy the following formula (1). An average circumferential length L (mm) in a circumferential direction of the sound damper 10 in a state where the sound damper 10 is removed from the pneumatic tire, and an inner cavity surface circumferential length C (mm), satisfy the following formulas (2) and (3). A pneumatic tire of the present invention includes a tire inner cavity 1B and a porous sound damper 10. The sound damper 10 is an annular body extending in a tire circumferential direction and is not adhered to a surface of the tire inner cavity 1B. An average thickness T (mm) of the sound damper 10 and an inner cavity surface radius R (mm) satisfy the following formula (1). An average circumferential length L (mm) in a circumferential direction of the sound damper 10 in a state where the sound damper 10 is removed from the pneumatic tire, and an inner cavity surface circumferential length C (mm), satisfy the following formulas (2) and (3). 0.04 ≤ T / R ≤ 0 .18 ( 1 ) 1.02 - 1.1 × T / R ≤ L / C ≤ 0 . 9 ⁢ 5 + 1.4 × T / R ( 2 ) L / C ≤ 1 . 1 ( 3 )

IPC Classes  ?

• B60C 19/00 - Tyre parts or constructions not otherwise provided for

Abstract

The present disclosure provides a method for controlling a harmful arthropod showing resistance to at least one kind(s) of insecticide(s) selected from Group B, characterized by applying at least one compound(s) selected from Group A to said harmful arthropod showing resistance, or a habitat thereof, or a place where said harmful arthropod showing resistance is expected to appear: Group A: a group consisting of broflanilide, nicofluprole, isocycloseram, and cyproflanilide; Group B: a group consisting of fluxametamide, pyrethroid compound(s), oxadiazine compound(s), and phenylpyrazole compound(s).

IPC Classes  ?

• A01N 43/80 - Biocides, pest repellants or attractants, or plant growth regulators containing heterocyclic compounds having rings with nitrogen atoms and oxygen or sulfur atoms, as ring hetero atoms five-membered rings with one nitrogen atom and either one oxygen atom or one sulfur atom in positions 1,2
• A01N 37/22 - Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom having three bonds to hetero atoms with at the most two bonds to halogen, e.g. carboxylic acids containing the group —CO—N, e.g. carboxylic acid amides or imidesThio-analogues thereof the nitrogen atom being directly attached to an aromatic ring system, e.g. anilides
• A01N 43/56 - 1,2-DiazolesHydrogenated 1,2-diazoles
• A01P 7/04 - Insecticides

Abstract

An in-vehicle-component circuit unit includes a circuit constituent member, a case, a connection bus bar including an internal connection portion and an external connection portion, a first window portion facing the internal connection portion and a first bolt insertion hole in the case, and a second window portion facing the external connection portion and a second bolt insertion hole in the case, The first bolt insertion hole and the second bolt insertion hole are each sized to include a tolerance absorbing gap, the connection bus bar is accommodated so as to be displaceable relative to the case in a tolerance absorbing direction, the first window portion is open with a size that enables a bolt fastening operation to be performed through the first window portion, and the second window portion is open with a size that enables a bolt fastening operation to be performed through the second window portion.

IPC Classes  ?

• H02G 5/08 - Connection boxes therefor
• B60R 16/023 - Electric or fluid circuits specially adapted for vehicles and not otherwise provided forArrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric for transmission of signals between vehicle parts or subsystems
• H02G 3/08 - Distribution boxesConnection or junction boxes

Abstract

A printed wiring board includes: a base material having a main surface; a conductive pattern that is disposed on the main surface; and a plating layer. A through hole is formed in the base material. The through hole extends through the base material in a thickness direction. A thickness of the base material is 0.5 mm or more. The plating layer is disposed on at least an inner wall surface of the through hole and electrically connected to a portion of the conductive pattern around the through hole. A thickness of the plating layer on the inner wall surface of the through hole is greater than a thickness of the conductive pattern and 10 μm or more.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details

Abstract

An electrode for use in a redox-flow battery system comprises carbon fibers. A compressive strain factor determined by dividing a difference between a first thickness of the electrode and a second thickness of the electrode by the first thickness is more than 0.6. The first thickness is a thickness of the electrode measured in a state where a surface pressure of 0.7 kPa is applied to the electrode. The second thickness is a thickness of the electrode measured in a state where a surface pressure of 0.8 MPa is applied to the electrode.

IPC Classes  ?

• H01M 4/86 - Inert electrodes with catalytic activity, e.g. for fuel cells
• H01M 8/18 - Regenerative fuel cells, e.g. redox flow batteries or secondary fuel cells

Abstract

A multicore cable according to one embodiment of the present disclosure includes a core wire including a plurality of core electric wires stranded together; and a sheath layer disposed around the core wire, wherein each of the core wires includes a conductor including a plurality of elemental wires twisted together and an insulating layer that covers an outer periphery of the conductor, wherein the sheath layer includes an inner sheath layer and an outer sheath layer covering the inner sheath layer, wherein a main component of the inner sheath layer is a copolymer of ethylene and (meth) acrylic acid alkyl ester, and wherein a content of the (meth) acrylic acid alkyl ester in the copolymer is more than 7 mass %.

IPC Classes  ?

• H01B 7/02 - Disposition of insulation
• C08L 23/08 - Copolymers of ethene
• C08L 75/04 - Polyurethanes
• H01B 3/30 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes
• H01B 3/44 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes vinyl resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes acrylic resins

Abstract

A male connector 11 according to the present disclosure fits together with a female connector 12 along a fitting direction, said male connector 11 comprising: a male housing 13 that has a male hood part 17; a male terminal that has a tab which projects inside the male hood part 17 and is attached to the male housing 13; a male electric wire that is attached to the male terminal; a male rubber stopper that is fitted to the outside of the male electric wire; and a moving plate 15 that is provided inside the male hood part 17 and that is movable between an initial position in a state in which the tab is positioned and a fitting position which is rearward of the initial position in the fitting direction. The male housing 13 has a male cavity that accommodates the male terminal. The male cavity has a cylindrical male seal part inside which the male rubber stopper fits. The inner surface of the male seal part makes close contact with the male rubber stopper. The male housing 13 has a moving plate lock part 35 that engages with the moving plate 15 to hold the moving plate 15 at the initial position, and extends forward in the fitting direction in a region inward of an imaginary male seal surface 42, which is an imaginary forward extension of the inner surface of the male seal part in the fitting direction.

IPC Classes  ?

• H01R 13/52 - Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
• H01R 13/502 - BasesCases composed of different pieces

Abstract

A connector 10 that is attached to a substrate 11 that is housed in a case C includes: a housing including a fitting portion 20 for a mating connector 50, the fitting portion 20 being open forward; and terminal fittings 13 that include substrate connection portions 15 that extend rearward from the housing 12, wherein a wall 24 of the housing 12 on an inner side of the case C includes an opening 30 that passes through the wall 24 in a thickness direction thereof, and a lower surface 32 that is included in peripheral surfaces that define the opening 30 is inclined downwards in a direction towards an outside of the case C.

IPC Classes  ?

• H01R 12/70 - Coupling devices
• H01R 12/88 - Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts

Abstract

A lock arm has a first abutting surface at a position contactable with a lock portion in a fitting process of a first connector and a second connector. The first abutting surface includes a sliding section that extends rearward from a contact start position at which the first abutting surface starts to come into contact with the lock portion, which then slides on the sliding section. The sliding section is inclined relative to a front-rear direction. When the lock portion comes into contact with the first abutting surface at the contact start position in a fitting process of the first connector and the second connector, a first terminal and a second terminal are disposed in a non-contact state.

IPC Classes  ?

• H01R 13/639 - Additional means for holding or locking coupling parts together after engagement
• H01R 13/514 - BasesCases formed as a modular block or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
• H01R 13/627 - Snap-action fastening
• H01R 13/641 - Means for preventing, inhibiting or avoiding incorrect coupling by indicating incorrect couplingMeans for preventing, inhibiting or avoiding incorrect coupling by indicating correct or full engagement

Abstract

This EMC filter inhibits a common-mode noise generated in a power line. The EMC filter is to be coupled between a charging inlet of a vehicle and a charging cable connected to a charging station, and is capable of being attached to and detached from a conversion adapter which connects a power line of the charging inlet and a power line of the charging cable.

IPC Classes  ?

• B60L 53/16 - Connectors, e.g. plugs or sockets, specially adapted for charging electric vehicles

Abstract

This antenna comprises: a dielectric substrate provided with a grounding conductor and a power supply line; a first conductive element positioned at a prescribed distance from the substrate surface of the dielectric substrate and having a first end and a second end opposite the first end; a first conductive column extending from the first end to the dielectric substrate and connecting the first end to the grounding conductor; and a second conductive column extending from between the first end and the second end to the dielectric substrate and connecting the first conductive element to the power supply line.

IPC Classes  ?

• H01Q 13/08 - Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
• H01Q 9/42 - Resonant antennas with feed to end of elongated active element, e.g. unipole with folded element, the folded parts being spaced apart a small fraction of the operating wavelength

Abstract

An optical fiber production method according to the present disclosure is a method for producing an optical fiber from a glass fiber that is obtained by heating and drawing an optical fiber preform, the method including: a coating step for applying an ultraviolet curable resin to the glass fiber; and a curing step for curing the ultraviolet curable resin by irradiating the ultraviolet curable resin with ultraviolet rays. The curing step includes, in the following order, a first irradiation step for irradiating the ultraviolet curable resin with ultraviolet rays using an ultraviolet LED as a light source, and a second irradiation step for irradiating the ultraviolet curable resin with ultraviolet rays using an ultraviolet lamp as a light source. The surface temperature of the ultraviolet curable resin at the time when the second irradiation step is started is 300°C or less.

IPC Classes  ?

• C03C 25/6226 - Ultraviolet
• C03C 25/26 - Macromolecular compounds or prepolymers
• G02B 6/44 - Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables

Abstract

A fatigue level estimation system according to the present invention comprises: a sensor data acquisition unit that acquires sensor data from a seating sensor; a state information acquisition unit that acquires state information which indicates the state of a vehicle in which the seating sensor is provided; and a fatigue level estimation unit that estimates, on the basis of the sensor data and the state information, the fatigue level of an occupant of the vehicle who is seated on the seat in which the seating sensor is provided. The fatigue level estimation unit includes a state detection unit that detects, on the basis of the state information, the vehicle is in a first state in which the vehicle is stopped or a second state in which the vehicle is substantially stopped and an estimation unit that compares, with a threshold value, a fatigue level index of the occupant based on the sensor data in the first state or the second state, so as to estimate the fatigue level of the occupant.

IPC Classes  ?

• A61B 5/18 - Devices for psychotechnicsTesting reaction times for vehicle drivers
• A61B 5/11 - Measuring movement of the entire body or parts thereof, e.g. head or hand tremor or mobility of a limb
• A61B 5/16 - Devices for psychotechnicsTesting reaction times
• G08G 1/16 - Anti-collision systems

Abstract

The purpose of the present invention is to add a noise countermeasure to an electric device, while reducing design change as much as possible. This electric device comprises: a circuit board; a first board terminal connected to the circuit board; a magnetic body provided on the first board terminal; and a first wire having one end connected to the first board terminal.

IPC Classes  ?

• H05K 7/00 - Constructional details common to different types of electric apparatus
• H02G 3/08 - Distribution boxesConnection or junction boxes
• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields

Abstract

A first connector (10) comprises: a first terminal (30); a first housing (40) that holds the first terminal (30); a first bolt hole (33) that penetrates the first terminal (30) in a first direction (X1); and a fall prevention bolt (50) that is assembled to the first terminal (30). The fall prevention bolt (50) is inserted through the first bolt hole (33) in a state before the first connector (10) is connected to a second connector (100) which is a mating connector.

IPC Classes  ?

• H01R 13/621 - Bolt, set screw or screw clamp
• H01R 4/34 - Conductive members located under head of screw

Abstract

This optical fiber comprises a glass fiber that includes a core and a cladding, a primary resin layer that is in contact with the glass fiber and covers the glass fiber, a secondary resin layer that covers the primary resin layer, and a colored resin layer that covers the secondary resin layer. The colored resin layer contains a cured product of a resin composition containing a photopolymerizable compound, a photopolymerization initiator, and surface-treated titanium oxide particles. The colored resin layer contains lumpy aggregated particles formed by aggregation of primary particles of the surface-treated titanium oxide particles. The average grain size of the surface-treated titanium oxide particles measured by image analysis of the colored resin layer is 200-300 nm. The aggregation rate of the surface-treated titanium oxide particles is 8% or higher.

IPC Classes  ?

• C03C 25/47 - Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
• C03C 25/1065 - Multiple coatings
• C03C 25/26 - Macromolecular compounds or prepolymers
• C03C 25/48 - Coating with two or more coatings having different compositions
• G02B 6/44 - Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables

Abstract

A radio wave sensor system (1A) comprises a first radio wave sensor (10A) for detecting objects moving along a road and a second radio wave sensor (10B) for detecting objects moving along the road. The first radio wave sensor (10A) includes a first transmission unit (104) that repeats a first transmission cycle (TC1) that continuously transmits a plurality of first chirp signals that change frequency over time at a constant rate of change, and the second radio wave sensor (10B) includes a second transmission unit (104) that repeats a second transmission cycle (TC2) that continuously transmits a plurality of second chirp signals that change frequency over time at the same rate of change as the first chirp signals. The second transmission unit (104) sets the second transmission cycle (TC2) on a different cycle from the first transmission cycle (TC1).　The present disclosure makes it possible to suppress radio wave interference between radio wave sensors without reducing object detection resolution.

IPC Classes  ?

• G01S 7/36 - Means for anti-jamming
• G01S 13/34 - Systems for measuring distance only using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated using transmission of continuous, frequency-modulated waves while heterodyning the received signal, or a signal derived therefrom, with a locally-generated signal related to the contemporaneously transmitted signal
• G01S 13/87 - Combinations of radar systems, e.g. primary radar and secondary radar

Abstract

A device according to one aspect of the present disclosure is a device for analyzing a passage trajectory of a passage subject, the device comprising: a memory having a storage region for first detection data and second detection data which are defined below; and a processor for analyzing, on the basis of the first detection data and the second detection data, the passage trajectory. The processor executes integration processing for integrating the first and second detection data under an OR condition, and abnormality determination for determining the presence or absence of abnormal passage by the passage subject by using the integrated data as input data.　First detection data: data including the position and time of a passage subject detected by a first radio wave sensor Second detection data: data including the position and time of a passage subject detected by a second radio wave sensor

IPC Classes  ?

• G08G 1/01 - Detecting movement of traffic to be counted or controlled
• G08G 1/123 - Traffic control systems for road vehicles indicating the position of vehicles, e.g. scheduled vehicles

Abstract

This resin composition does not contain any fibrous fillers and contains a liquid crystal polyester resin, a fluororesin, and an oxide of a metal element belonging to Group 2 of the long-form periodic table. The content of the metal element belonging to Group 2 with respect to 100 mass% of the total mass of the resin composition is 0.01-2.0 mass%.

IPC Classes  ?

• C08L 67/00 - Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chainCompositions of derivatives of such polymers
• C08K 3/22 - OxidesHydroxides of metals
• C08L 27/12 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogenCompositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms

Abstract

A carboxylate represented by formula (I), a carboxylate or resin including a structural unit represented by formula (IP), an acid generator including the carboxylate, a carboxylic acid generator including the resin, or a resist composition including the carboxylic acid generator. A carboxylate represented by formula (I), a carboxylate or resin including a structural unit represented by formula (IP), an acid generator including the carboxylate, a carboxylic acid generator including the resin, or a resist composition including the carboxylic acid generator.

IPC Classes  ?

• G03F 7/004 - Photosensitive materials
• G03F 7/029 - Inorganic compoundsOnium compoundsOrganic compounds having hetero atoms other than oxygen, nitrogen or sulfur
• G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
• G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

Abstract

Disclosed herein is a method for producing a solid catalyst component for olefin polymerization that is capable of reducing the amount of fine powder contained in the solid catalyst component for olefin polymerization. The method includes the step of reacting a magnesium compound and a titanium halide compound with each other so that a maximum heat release rate per mole of the magnesium compound is 18 W or less. Also disclosed herein is a method for producing a solid catalyst component for olefin polymerization that is capable of preventing a reduction in polymerization activity caused by application of heat to the solid catalyst component for olefin polymerization. The method includes the step of reacting a magnesium compound and a titanium halide compound with each other so that a total heat release value per mole of the titanium compound is 6 kJ to 90 kJ.

IPC Classes  ?

• C08F 10/00 - Homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond

Abstract

A pneumatic tire can include a carcass, a belt layer, and reinforcing rubber layers. Turned-up portions of a carcass ply each include a first portion located between a body portion and the belt layer, a second portion adjacent to each reinforcing rubber layer in a tire axial direction, on an outer side in a tire radial direction with respect to a rim flange of a standardized rim, and a third portion located between the first portion and the second portion. A length of the third portion is 0.8 to 1.4 times a sum (La+Lb) of a length La of the first portion and a length Lb of the second portion.

IPC Classes  ?

• B60C 15/06 - Flipper strips, fillers, or chafing strips
• B60C 13/00 - Tyre sidewallsProtecting, decorating, marking, or the like, thereof
• B60C 15/00 - Tyre beads, e.g. ply turn-up or overlap

Abstract

A wire harness routing device 10 according to this disclosure is for routing a wire harness 60 under a sliding seat 1. The wire harness routing device 10 includes an extra length storing case 20 and a protector 30. The extra length storing case 20 is disposed on a floor 2 that is opposite a lower surface 5 of the sliding seat 1. The protector 30 is movable with respect to the extra length storing case 20. The wire harness 60 includes an inner extra length portion and an outer extra length portion. The inner extra length portion is disposed in the extra length storing case 20 and extends toward the protector 30 and the outer extra length portion extends outside the extra length storing case 20 from the protector 30 toward the lower surface 5 of the sliding seat 1. The sliding seat 1 includes a pair of contact members 6, 7 that come into contact with the protector 30 according to movement of the sliding seat 1 and move the protector 30.

IPC Classes  ?

• B60R 16/02 - Electric or fluid circuits specially adapted for vehicles and not otherwise provided forArrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric
• B60N 2/06 - Seats specially adapted for vehiclesArrangement or mounting of seats in vehicles the seat or part thereof being movable, e.g. adjustable the whole seat being movable slidable

Abstract

A semiconductor device includes a semiconductor chip including a semiconductor substrate and a main electrode provided on the semiconductor substrate, a buffer plate, and a bonding material provided between the main electrode and the buffer plate. The main electrode includes an aluminum or aluminum alloy layer. Each of a first coefficient of linear thermal expansion of the semiconductor substrate and a second coefficient of linear thermal expansion of the buffer plate is less than a third coefficient of linear thermal expansion of the main electrode. The second coefficient of linear thermal expansion is less than the first coefficient of linear thermal expansion.

IPC Classes  ?

• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/498 - Leads on insulating substrates

Abstract

A shield member includes a die-cast member and a plating layer provided on a surface of the die-cast member. The die-cast member contains zinc. The plating layer includes a third layer provided in an outermost surface of the plating layer. The third layer is made of pure tin. A thickness of the third layer is less than 5 μm.

IPC Classes  ?

• H01R 13/6581 - Shield structure
• C23C 28/02 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and only coatings of metallic material
• H01R 13/6598 - Shield material
• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields

Abstract

A flat curled cord 1 is formed by winding an insulated wire 2 into a helical shape, the insulated wire 2 including a conductor 12 and an insulation coating 13 covering the outer periphery of the conductor 12. The insulated wire 2 is a flat wire including the conductor 12 and the insulation coating 13 along an axial direction each having a flat cross-sectional shape. Flat surfaces, which are outer side surfaces of the flat wire 2 along a width direction of the flat shape, are facing outward and inward of the helical shape.

IPC Classes  ?

• H01B 7/08 - Flat or ribbon cables
• H01B 7/00 - Insulated conductors or cables characterised by their form

Abstract

An in-vehicle device is an in-vehicle device connected to an in-vehicle ECU mounted on a vehicle such that communication is available, and includes a control unit performing processing relevant to transmission data transmitted from the in-vehicle ECU, in which the control unit receives transmission data transmitted from the in-vehicle ECU, registers the received transmission data in association with a reception time point of the transmission data in a chronological database, specifies abnormal transmission data from the transmission data registered in the chronological database, and registers information relevant to the specified abnormal transmission data in an abnormality history database.

IPC Classes  ?

• H04L 43/0823 - Errors, e.g. transmission errors
• H04L 43/06 - Generation of reports
• H04L 67/2871 - Implementation details of single intermediate entities

Abstract

A cable includes a plurality of covered electric wires and an outer sheath, wherein the plurality of covered electric wires include two first covered electric wires, two second covered electric wires having a larger conductor cross-sectional area than the first covered electric wires, and two third covered electric wires having a smaller conductor cross-sectional area than the second covered electric wires, and wherein the two first covered electric wires are twisted together along a longitudinal direction thereof to form a first twisted wire pair, the two third covered electric wires are twisted together along a longitudinal direction thereof to form a second twisted wire pair, a twist pitch of the second twisted wire pair is longer than a twist pitch of the first twisted wire pair, the first twisted wire pair, the two second covered electric wires, and the second twisted wire pair are twisted together to form a core, in the core, at least a partial contact is provided between the first covered electric wires and the second covered electric wires, between the second covered electric wires and the third covered electric wires, and between the two first covered electric wires, and the outer sheath is arranged to cover the core.

IPC Classes  ?

• H01B 11/10 - Screens specially adapted for reducing interference from external sources
• B60R 16/023 - Electric or fluid circuits specially adapted for vehicles and not otherwise provided forArrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric for transmission of signals between vehicle parts or subsystems
• H01B 7/00 - Insulated conductors or cables characterised by their form
• H01B 7/18 - Protection against damage caused by external factors, e.g. sheaths or armouring by wear, mechanical force or pressure
• H01B 7/32 - Insulated conductors or cables characterised by their form with arrangements for indicating defects, e.g. breaks or leaks
• H01B 7/38 - Insulated conductors or cables characterised by their form with arrangements for facilitating removal of insulation
• H01B 9/00 - Power cables

Abstract

A wiring member includes: a base member; a first wire-like transmission member group including a plurality of first wire-like transmission members; and a second wire-like transmission member group including a plurality of second wire-like transmission members. The first wire-like transmission member group includes a first parallel section, the second wire-like transmission member group includes a second parallel section in a position adjacent to the first parallel section, and an interval between the first parallel section and the second parallel section is larger than an interval between the first wire-like transmission members in the first parallel section and an interval between the second wire-like transmission members in the second parallel section.

IPC Classes  ?

• H01B 7/08 - Flat or ribbon cables

Abstract

The printed wiring board substrate includes an insulating layer, a first copper foil, and a second copper foil. The insulating layer has a first main surface and a second main surface opposite to the first main surface. The insulating layer includes a plurality of polyimide layers and a plurality of fluororesin layers. The total number of the plurality of polyimide layers and the plurality of fluororesin layers is 5 or more. Each of the plurality of polyimide layers and each of the plurality of fluororesin layers are alternately stacked along a thickness direction of the insulating layer. One of the plurality of fluororesin layers constitutes a first outermost layer which is an outermost layer on the side of the first main surface. Another one of the plurality of fluororesin layers constitutes a second outermost layer which is an outermost layer on the side of the second main surface.

IPC Classes  ?

• H05K 1/03 - Use of materials for the substrate
• H05K 1/02 - Printed circuits Details
• H05K 1/09 - Use of materials for the metallic pattern

Abstract

This conversion adapter is connected between a charging inlet of a vehicle supporting a first charging method and a charging connector of a charging cable connected to a charging station supporting a second charging method, and is used for connecting a power line of the charging inlet and a power line of the charging cable. The conversion adapter includes: a housing; a first charging connector supporting the first charging method; a second charging connector supporting the second charging method; a power line connected to the first charging connector and the second charging connector, and placed in the housing; and a first EMC filter for suppressing common mode noise generated in the power line.

IPC Classes  ?

• B60L 53/16 - Connectors, e.g. plugs or sockets, specially adapted for charging electric vehicles

Abstract

A wire harness fixing component (10) comprises a wire harness holding part (30) that holds a wire harness (13) with a trim (20) as a support. The wire harness holding part (30) includes: a housing part (32) that houses the wire harness (13); and an attachment part (31) that is attached to the trim (20). In a state in which the wire harness holding part (30) is attached to the trim (20) by the attachment part (31), the housing part (32) is positioned on the outer (S1) side of the trim (20).

IPC Classes  ?

• H02G 3/30 - Installations of cables or lines on walls, floors or ceilings
• B60R 16/02 - Electric or fluid circuits specially adapted for vehicles and not otherwise provided forArrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric
• H02G 3/04 - Protective tubing or conduits, e.g. cable ladders or cable troughs

Abstract

This bus bar 10 comprises two connection parts 11 and a coupling part 12 for coupling and electrically connecting the two connection parts 11. The coupling part 12 comprises a first coupling part 12A and a second coupling part 12B different from the first coupling part 12A. The first coupling part 12A and the second coupling part 12B are configured to be elastically deformable. The coupling part 12 forms a conductive path between the two connection parts 11. The coupling part 12 is formed such that the cross-sectional area perpendicular to the conductive path is greater than the cross-sectional area perpendicular to the arrangement direction of the two connection parts 11.

IPC Classes  ?

• H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
• H01G 2/02 - Mountings
• H01G 4/228 - Terminals
• H01G 11/76 - Terminals, e.g. extensions of current collectors specially adapted for integration in multiple or stacked hybrid or EDL capacitors
• H01M 50/503 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the shape of the interconnectors
• H01M 50/505 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing comprising a single busbar
• H01M 50/569 - Constructional details of current conducting connections for detecting conditions inside cells or batteries, e.g. details of voltage sensing terminals
• H01M 50/588 - Means for preventing undesired use or discharge for preventing incorrect connections inside or outside the batteries outside the batteries, e.g. incorrect connections of terminals or busbars
• H01M 50/593 - SpacersInsulating plates
• H01R 4/58 - Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one anotherMeans for effecting or maintaining such contactElectrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members

Abstract

An electrical wire according to the present invention includes a conductor and an insulator that covers the conductor. The insulator contains a resin material that includes at least a fluorine resin. The stretch factor of the insulator at 260°C is at least 25, and the lubricant content of the insulator is 2.0–4.0 mass% of the resin material.

IPC Classes  ?

• H01B 7/295 - Protection against damage caused by external factors, e.g. sheaths or armouring by extremes of temperature or by flame using material resistant to flame
• H01B 7/02 - Disposition of insulation
• H01B 7/18 - Protection against damage caused by external factors, e.g. sheaths or armouring by wear, mechanical force or pressure

Abstract

3, a thickness of the first layer is 2 μm or more and 15 μm or less, on a cross section along a normal line of an interface between the base and the coating, a ratio N2/N1 is 0.60 or more, and on the cross section along the normal line of the interface between the base and the coating, a ratio N4/N3 and the ratio N2/N1 satisfy a relationship of a Formula 1.

IPC Classes  ?

• B23B 27/14 - Cutting tools of which the bits or tips are of special material
• C23C 16/34 - Nitrides
• C23C 16/40 - Oxides

Abstract

A pointing device operating sleeve includes a palm cover, an arm cover, and a band. The palm cover covers a heel of a palm of a player. The arm cover is continuous with the palm cover. The arm cover covers a forearm of the player. A band is sewed on the palm cover. The band suppresses displacement of the palm cover from the palm.

IPC Classes  ?

• G06F 3/0354 - Pointing devices displaced or positioned by the userAccessories therefor with detection of 2D relative movements between the device, or an operating part thereof, and a plane or surface, e.g. 2D mice, trackballs, pens or pucks
• G06F 1/16 - Constructional details or arrangements

Abstract

A correlated set of golf club heads comprises a first and second golf club head. Each club head has a striking face, a rear surface, a top portion, a sole portion, a toe portion, a heel portion, and a loft. The striking face has a first plurality of scorelines defining a scoreline heel-ward extent and a scoreline toe-ward extent. The plurality of scorelines comprises a scoreline length LS1 being the lateral distance between the heel-ward extent and the toe-ward extent. The loft of the second golf club head is greater than that of the first golf club head. The scoreline length LS2 of the second golf club head differs from that of the first scoreline length LS1.

IPC Classes  ?

• A63B 53/04 - Heads

Abstract

A radio-wave sensor installation assistance device includes: a target position determination unit that determines a target position to be irradiated with a radio wave emitted from a radio-wave sensor, in an image including a crosswalk; a candidate position designation unit that receives designation of a candidate position to install the radio-wave sensor; and a display control unit that causes a display device to display a radio-wave irradiation range of the radio-wave sensor so as to be superimposed on the image, the radio-wave irradiation range being determined based on the target position and the candidate position. The candidate position designation unit can receive an instruction of a movement of the designated candidate position. The display control unit changes the shape of the radio-wave irradiation range according to the instructed movement of the candidate position, with the target position being fixed.

IPC Classes  ?

• G01S 13/931 - Radar or analogous systems, specially adapted for specific applications for anti-collision purposes of land vehicles
• G01S 7/06 - Cathode-ray tube displays
• G01S 13/89 - Radar or analogous systems, specially adapted for specific applications for mapping or imaging

Abstract

A printed wiring board includes: a first conductive pattern; a dielectric layer that is disposed to cover the first conductive pattern; a second conductive pattern that is disposed on the dielectric layer; and a plating layer. A thickness of the dielectric layer is 50 μm or more and 500 μm or less. A hole from which the first conductive pattern is exposed is formed in the dielectric layer. An aspect ratio of the hole is 0.5 or more and 2.0 or less. The plating layer is disposed on at least an inner wall surface of the hole and the first conductive pattern exposed from the hole, and electrically connected to the second conductive pattern. A thickness of the plating layer disposed on the first conductive pattern exposed from the hole is greater than a thickness of the second conductive pattern.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/02 - Printed circuits Details
• H05K 3/42 - Plated through-holes

Abstract

A printed wiring board includes: a dielectric layer having a main surface; and a conductive pattern. The conductive pattern includes a metal layer that is disposed on the main surface, an electroless plating layer that is disposed on the metal layer, and an electrolytic plating layer that is disposed on the electroless plating layer. An average thickness of the metal layer is 2.1 μm or more and 9.0 μm or less. Maximum height roughness of a surface of the metal layer opposed to the main surface is 5.0 μm or less.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Abstract

An electrical-connector-equipped flat cable includes a first flat cable including a first signal line and a first ground line, a first ferrule holding a first front end region, a second flat cable including a second signal line and a second ground line, a second ferrule holding a second front end region, and a shell disposed so as to surround the first ferrule and the second ferrule. The shell includes a frame body and a plate, the frame body being disposed outside the first ferrule and the second ferrule, the plate being disposed between the first ferrule and the second ferrule and electrically connected to the frame body. The plate includes a main body portion and a coupling portion electrically connected to each of the main body portion, the first ground line, and the second ground line.

IPC Classes  ?

• H01R 12/77 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
• H01B 7/08 - Flat or ribbon cables

Abstract

An electrical-connector-equipped cable includes a flat cable and a connector. The flat cable includes a plurality of conductors arranged side by side, and a first dielectric covering the plurality of conductors to expose a distal end portion of each of the plurality of conductors. The connector holds the distal end portion of each of the plurality of conductors to expose a distal end surface of each distal end portion to an outside. A first opening is provided in the connector. The first opening exposes the distal end portion of at least one first conductor of the plurality of conductors. The distal end portion of the first conductor is positioned in the first opening, and a second dielectric is provided between a wall defining the first opening and the first conductor.

IPC Classes  ?

• H01R 12/77 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
• H01B 7/08 - Flat or ribbon cables

Abstract

An on-vehicle control device (10) has a measurement unit (e.g., a control unit (14)) that performs measurement processing, and a discharge control unit (e.g., said control unit (14)) that controls a discharge unit. The measurement processing is for causing a charging unit to perform a charging operation, and measuring internal resistance of a power storage unit (3) on the basis of a voltage change of the power storage unit (3) before and after the start of the charging operation. The measurement unit: performs the measurement processing when measurement conditions are satisfied during a measurement target period from when a vehicle enters the start state to when the vehicle enters the parking state; and omits the measurement processing when the measurement conditions are not satisfied during the measurement target period. The measurement conditions include a condition that the voltage of the power storage unit (3) is less than a determination value. When the number of times in which the measurement processing is omitted at the time when the vehicle enters the parking state is equal to or greater than an upper limit value, the discharge control unit causes the discharge unit to perform a discharge operation until the voltage of the power storage unit (3) becomes less than a first threshold value which is equal to or less than the determination value.

IPC Classes  ?

• H01M 10/48 - Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte

Abstract

The data analysis device according to the present disclosure analyzes a depth profile of a sample by using response signal data generated from the sample by the incidence of a probe. This data analysis device comprises: an input unit that receives response signal data obtained by a measurement device that measures a response signal while changing the probe incidence conditions so as to evaluate different depth regions of the sample; an analysis unit that, by analyzing the response signal data, estimates a relative concentration for each chemical species for each depth from the surface of the sample, and that determines average values and confidence intervals for the estimated relative concentration values; and an output unit that outputs a display of the average values and confidence intervals of the estimated relative concentration values.

IPC Classes  ?

• G01N 23/223 - Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups , or by measuring secondary emission from the material by irradiating the sample with X-rays or gamma-rays and by measuring X-ray fluorescence
• G01N 23/2273 - Measuring photoelectron spectra, e.g. electron spectroscopy for chemical analysis [ESCA] or X-ray photoelectron spectroscopy [XPS]

Abstract

This wire harness (11) is provided with a first shield electric wire (12) and second shield electric wires (13, 14). The wire harness (11) comprises: a core wire connection part (16) to which a first core wire (12a) and second core wires (13a, 14a) are connected; an internal heat-shrinkable tube (21) that covers the outer periphery of the core wire connection part (16); a shield connection member (31) that covers the outer periphery of the internal heat-shrinkable tube (21) and to which a first shield member (12c) and second shield members (13c, 14c) are connected; a heat-shrinkable tube (34) that covers the outer periphery of the shield connection member (31) and in which an adhesive (37) is provided inside; and a spacer (35) that is interposed between the two adjacent second shield electric wires (13, 14) and seals the adhesive (37) inside the heat-shrinkable tube (34).

IPC Classes  ?

• H02G 15/18 - Cable junctions protected by sleeves, e.g. for communication cable
• H01R 4/70 - Insulation of connections
• H01R 4/72 - Insulation of connections using a heat shrinking insulating sleeve

Abstract

Disclosed is an extruded aluminum wire including: Fe, Cu, Ti, Mn, Mg, Cr, B, Ga, V and Zn in the total content of 0.01% by mass or less, and one or more components selected from the group consisting of Ni, Y and Si, with the balance being Al and inevitable impurities, wherein, in a cross-section perpendicular to the longitudinal direction of the extruded wire, an average grain size measured by electron backscatter diffraction is 15 to 50 μm, respectively, in both a central measurement region including a center point of the cross-section and a peripheral measurement region in contact with the outer periphery of the cross-section.

IPC Classes  ?

• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys

Abstract

A salt represented by formula (I), a salt or resin including a structural unit represented by formula (IP), an acid generator including the salt, an acid generator including the resin, or a resist composition including the acid generator. A salt represented by formula (I), a salt or resin including a structural unit represented by formula (IP), an acid generator including the salt, an acid generator including the resin, or a resist composition including the acid generator.

IPC Classes  ?

• G03F 7/004 - Photosensitive materials
• C07C 309/12 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing oxygen atoms bound to the carbon skeleton containing esterified hydroxy groups bound to the carbon skeleton
• C07C 309/17 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing carboxyl groups bound to the carbon skeleton
• C07C 381/12 - Sulfonium compounds
• C07D 307/00 - Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom
• C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
• G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
• G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists