A contact, an inspection jig using the contact, an inspection device, and a method of manufacturing the contact are provided. A contact includes a coil spring including a slit formed in a cylindrical body and first and second conductors. A bottom wall portion, a first side wall portion, a second side wall portion, and a top wall portion are configured so a cross-sectional shape of the cylindrical body as viewed in the axial direction is rectangular, the slit includes a first slit, a second slit, a third slit, and a fourth slit, the third slit is continuous with the first slit and the second slit, the fourth slit is continuous with the second slit, the first slit and the second slit are rectangular in a side view of the cylindrical body, the first and second conductors respectively connected to first and second end portions of the cylindrical body.
A tubular body extending in a longitudinal direction and having conductivity includes a first spring portion having a spiral notch formed in a peripheral surface of the tubular body, a second spring portion having a spiral notch formed in the peripheral surface of the tubular body and a first body portion sandwiched between the first spring portion and the second spring portion in the longitudinal direction. The distance from the longitudinal direction center of the tubular body to the longitudinal direction inner end of the first spring portion is equal to the distance from the longitudinal direction center to the longitudinal direction inner end of the second spring portion. The number of turns of the first spring portion is equal to the number of turns of the second spring portion. The first spring portion includes a first winding spring portion and a second winding spring portion.
A contact terminal includes a tubular body and a first conductor. The tubular body has an end-side cutout provided in a shape cut out from one axial-direction end surface toward an other axial-direction side at one axial-direction end portion of the tubular body, a hole that is open at the one axial-direction end portion, and a pair of arms interposed between the end-side cutout and the hole. The first conductor includes a first insertion including an inclined portion having an outside diameter gradually increased toward one axial-direction side, and a first straight portion connected to the one axial-direction side of the inclined portion and having an outside diameter constant along the axial direction. The outside diameter of the first straight portion is larger than an inside diameter of the tubular body. The first straight portion is configured to be in contact with the pair of arms.
A bump inspection device images a wafer that includes a plurality of bumps arranged in parallel to each other. Each of the bumps is elongated along a first direction that is along a substrate surface. The bump inspection device includes: a laser-light source that emits laser light in a direction that is inclined relative to the substrate surface; a camera that images the substrate surface onto which the laser light is emitted; and a direction adjusting portion that adjusts an arrangement relation between the direction in which the laser light is emitted and an orientation of the wafer to allow the first direction to become inclined relative to the direction in which the laser light is emitted, in a plan view. The camera images the wafer while the first direction is inclined relative to the direction in which the laser light is emitted, in a plan view.
G01B 11/25 - Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. moiré fringes, on the object
A load port adapter is a load port adapter fixable on a mounting table of a load port. The load port adapter includes a holder capable of holding a cassette capable of accommodating a plurality of circuit boards. The holder is fixable on the mounting table of the load port. The holder includes a position adjustment mechanism configured to position the cassette at a reference position. In the cassette clamped on the load port adapter, the reference position is a reference position on a load port adapter side when the circuit board is taken out from the cassette.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
An inspection jig includes a rod-shaped probe, a first support portion that supports one end portion side of the probe, a second support portion that supports the other end portion side of the probe, and a separation holding member that holds the first support portion and the second support portion to be separated from each other. The first support portion includes a support plate in which a through hole through which the probe is inserted is formed. A reinforcing plate having bending strength stronger than that of the support plate is disposed on a surface of the support plate facing the second support portion.
A clamp-type AC voltage probe includes: a clamp portion that clamps a cable to be measured; an electrode disposed to be opposed to the cable clamped by the clamp portion; a parallel circuit in which a capacitor and a resistance are connected in parallel, and one end of which is connected to the electrode; a resistance one end of which is connected to the other end of the parallel circuit and the other end of which is connected to a circuit ground; a capacitor one end of which is connected to the other end of the parallel circuit and the other end of which is connected to the circuit ground; and an amplifier an input terminal of which is connected to the one end or the other end of the parallel circuit, and that amplifies and outputs a signal input into the input terminal.
A circuit board inspection apparatus includes an inspection processing portion that inspects an electric circuit of a board to be inspected, an inspection jig, and a position detector used to position the inspection processing portion relative to the board to be inspected. The inspection jig includes a probe unit having a probe, a first board, a second board located in parallel with the first board in a thickness direction of the first board, an electrical connection portion that electrically connects the first board and the second board, and a second board holding portion that holds the second board from the first board and holds the probe unit on a side opposite to the first board side. The second board holding portion has a position detection opening penetrating in the thickness direction, at a position overlapping the position detector as viewed from the thickness direction of the second board holding portion.
An inspection jig includes a first board, a probe unit including a probe, a second board located in parallel with the first board and electrically connected to the probe, an electrical connection portion electrically connecting the first board and the second board, and a board holding portion holding the second board in parallel with the first board in the thickness direction and holding the probe unit. The board holding portion includes a probe-side holding plate located on the probe unit side of the second board and a holding plate support portion that positions the probe-side holding plate at a position where the probe-side holding plate is in parallel with the first board in the thickness direction. The board holding portion holds the second board so that the first board and the second board are electrically connected via the electrical connection portion being sandwiched between the first board and second board.
A circuit board inspecting apparatus includes a rotary table having a mount surface, a rotary table support section, a suction device, a suction path having a first end connected to the suction device and a second end located at the mount surface, an adsorption mechanism that adsorbs the board onto the mount surface so that the suction device sucks in gas in the suction path, a flow rate detection section that detects a flow rate of gas flowing through a portion of the suction path, the portion located inside the rotary table support section, a flow rate determination section that determines whether the flow rate of the gas detected by the flow rate detection section is equal to or more than a predetermined value, a contactless detection section that detects a placement state of the board on the mount surface in a contactless manner, and an inspection section.
A coiled electronic component includes: an electronic component body which includes a coil portion having a spiral structure and formed of an electrically conductive material, and electrically conductive connection portions arranged on both ends of the coil portion; and a pair of electrodes for respectively connecting the electrically conductive connection portions to assembly portions arranged on an assembly object. The electrode includes a pair of pinching pieces for pinching the electrically conductive connection portion, and the pair of pinching pieces is opened in a manner that the electrically conductive connection portion is received and fitted therebetween.
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
H03H 7/075 - Ladder networks, e.g. electric wave filters
An upper mechanism including a table provided with a placement surface of an inspection target, a lower mechanism configured to rotatably support the upper mechanism, and a lifting operation unit configured to be supported by the upper mechanism so as to be movable up and down are provided. The lower mechanism includes a rotation drive unit configured to rotate the upper mechanism, and a push-up force output unit configured to lift and lower the lifting operation unit. A transmission member with which a tip of the push-up force output unit can contact or separate is provided at a lower end of the lifting operation unit.
[Problem] To provide a scanner device and electrical inspection device having reduced susceptibility to increases in size. [Solution] A scanner device 3 that is mounted in an electrical inspection device 1, the scanner device 3 comprising a first independent substrate 31 that is a board-shaped circuit board and extends in a first direction, a first common substrate 41 that is a board-shaped circuit board and is disposed in parallel with the first independent substrate 31, and a second common substrate 42 that is a board-shaped circuit board and electrically connects the first independent substrate 31 and first common substrate 41, wherein the X-direction length of the first common substrate 41 is longer than the X-direction length of the first independent substrate 31.
An inspection jig includes: film-shaped wiring substrates each having one surface provided with an electrode; a pedestal that supports the wiring substrates which are laminated such that electrode regions are exposed, the electrode region being a region where the electrode is provided in each of the wiring substrates; and a plurality of probes which have base end portions in contact with the electrode regions and extend in a direction away from the electrode regions.
An image processing unit including: a pad region extraction unit that executes pad region extraction processing of extracting a substantially rectangular pad region surrounding a plurality of pads from an image of an inspection target object; an imaginary straight line setting unit that executes imaginary straight line setting processing of setting an imaginary first straight line parallel to a side extending in an X direction of the pad region and setting an imaginary second straight line parallel to a side extending in a Y direction of the pad; and a reference point setting unit that executes reference point setting processing of setting an intersection between the first straight line and the second straight line as the reference point.
The present invention comprises: a clamp part 2; an electrode E1 and an electrode E2 that face a cable CBL; a stabilization part 5 for connecting the electrode E1 to the ground via capacitors C1 and C2; an amplifying part A that amplifies voltage Vin obtained from the electrode E1 and that can change the amplification factor; a mode inputting part 81 that receives mode setting; a reference voltage outputting part PS that outputs a periodically changing reference voltage Vs; a measurement part 7 that measures output voltage Vout of the amplifying part A; a switch SW for connecting the electrode E2 to the ground in a measurement mode, and for connecting the electrode E2 to the reference voltage outputting part PS in a calibration mode; and a calibration processing part 82 that, when being in the calibration mode, adjusts an amplification factor G on the basis of a measurement magnification M, a reference voltage Vs, and a measurement value Vm of the measurement part 7 so that the output voltage Vout of the amplifying part A becomes equal to the measurement magnification M-times the amount of a cable voltage Vx.
The present invention comprises a cylindrical socket 20, a contact 10 having a cylindrical body 11 and a cup 13, and a base plate 3 in which is formed an accommodating hole 30 that accommodates the socket 20. A pair of parallel slits SL, SL are formed in the peripheral wall of the socket 20. A holding section 25, which is a portion sandwiched by the slits SL, SL, includes a projecting part 251 that projects inside the socket 20 and a non-projecting part 253 that is connected to the projecting part 251. When the cylindrical body 11 is not positioned inside the socket 20, the holding unit 25 assumes a projecting orientation in which the projecting part 25 is caused to project into the space inside the socket 20. In the projecting orientation, the non-projecting part 253 does not project further radially inward than the inner periphery of the socket 20.
H01R 33/76 - Holders with sockets, clips or analogous contacts, adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
H01R 13/24 - Contacts for co-operating by abutting resilientContacts for co-operating by abutting resiliently mounted
In various examples, an inspection jig includes a plate-shaped insulating member having a recess; a first board having a first electrode; and a conducting wire electrically connected to a contact terminal. The insulating member is provided with a through hole penetrating a bottom portion of the recess. One end portion of the conducting wire is disposed in the through hole. The other end of the conducting wire is connected to the first electrode.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
In a contact terminal, the first insertion portion includes a first contact portion having a first flat surface along an axial direction, the second insertion portion includes a second contact portion having a second flat surface along the axial direction, the first flat surface and the second flat surface are in contact with each other, the tubular body includes at least one of a first end side notch provided along the axial direction on a peripheral surface of the one end portion in the axial direction of the tubular body and a second end side notch provided along the axial direction on a peripheral surface of the other end portion in the axial direction of the tubular body.
A contact terminal includes a tubular body extending in an axial direction parallel to a central axis of the contact terminal and a bar-shaped conductor having conductivity. The conductor includes a protrusion protruding toward one side in the axial direction from the tubular body, and an insertion portion disposed inside from an outer periphery of the tubular body. The tubular body includes an end side notch provided along the axial direction on a peripheral surface of the one end portion in the axial direction of the tubular body, and a first circumferential notch connected to another side in the axial direction of the end side notch and provided along a circumferential direction away from the end side notch with respect to a first end portion in a circumferential direction of the end side notch.
A detection value correction system is a detection value correction system that corrects detection values of a plurality of sensors that are arranged in a line and detect a physical quantity, and includes a correction processing unit that corrects a detection value of a target sensor, which is a sensor to be corrected, among the sensors based on at least detection values of sensors adjacent to the target sensor.
An inspection jig includes contact terminals and a pitch conversion unit electrically connected to the contact terminals and configured to convert a first pitch between adjacent two of the contact terminals into a second pitch different from the first pitch. The contact terminals each include a tubular body that extends in an axial direction of the contact terminal and is electrically conductive, and a conductor that is electrically conductive and has a stick shape. The tubular body includes a spring portion that has a helical shape along a peripheral surface of the tubular body. The conductor includes an uninserted portion that protrudes from the tubular body toward a first side in the axial direction, and an inserted portion that is disposed in the tubular body and is fixed to a first axial end portion of the tubular body. The pitch conversion unit includes a board portion and a protruding portion.
[Problem] To provide a contact terminal, an inspection jig, an inspection device, and a manufacturing method for easily reducing the likelihood of a conductor falling out of a tubular body. [Solution] A contact terminal Pr comprises a tubular body Pa and a substantially rod-shaped first conductor P1. A first slit SL1 is formed extending from one end of the tubular body Pa toward the other end side of the tubular body Pa. A narrow portion N1 in which the width of the first slit SL1 is reduced is provided in a position spaced apart by a first distance D1 from the end on the other end side toward the one end side of the first slit SL1. A rod-shaped body Pb1 of the first conductor P1 includes an engaging portion K1 positioned in a receiving portion A1 of the first slit SL1 which is a region between the end on the other end side and the narrow portion N1. The engaging portion K1 protrudes in a Y-direction to a position allowing for interference with the narrow portion N1, the Y-direction being perpendicular to an X-direction, which is the width direction of the first slit SL1, and an axial direction Z of the tubular body.
Provided are an inspection jig and an inspection apparatus in which a configuration for bending a plurality of contacts in the same direction can be simplified. The inspection jig includes a plurality of contacts each of which has a rod shape, a first support portion that supports the first end portion side of the plurality of contacts, and a second support portion that supports the second end portion side of the plurality of contacts. The first support portion includes a facing support plate that is disposed to face the second support portion in a manner separated from the second support portion and has a plurality of through holes through which the plurality of contacts are inserted, and a cross section of each of the through holes has an elliptical shape whose major axis extends in a predetermined specific direction along a plane direction of the facing support plate.
A computer-implemented method, an inspection system and a non-transitory storage medium are provided, for automatically generating defect classification models, using machine learning, for the inspection of semiconductor and/or Printed Circuit Board (PCB) parts. The defect classification models are automatically built from a first combination of a trained neural network binary classifier and optimizer and from a second combination of a trained neural network multi-class classifier and optimizer.
A computer-implemented method, an inspection system and a non-transitory storage medium are provided, for automatically generating defect classification models, using machine learning, for the inspection of semiconductor and/or Printed Circuit Board (PCB) parts. The defect classification models are automatically built from a first combination of a trained neural network binary classifier and optimizer and from a second combination of a trained neural network multi-class classifier and optimizer.
G01R 31/304 - Contactless testing of printed or hybrid circuits
G06V 10/764 - Arrangements for image or video recognition or understanding using pattern recognition or machine learning using classification, e.g. of video objects
G06V 10/774 - Generating sets of training patternsBootstrap methods, e.g. bagging or boosting
G06V 10/82 - Arrangements for image or video recognition or understanding using pattern recognition or machine learning using neural networks
G06N 3/082 - Learning methods modifying the architecture, e.g. adding, deleting or silencing nodes or connections
When a load necessary for inspection is applied to a cylindrical body in the axial direction thereof, an end of the first bar-like main body is located closer to the other end side of the cylindrical body than one end of a support portion in a support member that supports the body portion, an end of the second bar-like main body is located closer to one end side of the cylindrical body than the other end of the support portion, the body portion is located in the entire portion where the support portion is located, and a radial distance between the outer peripheral surface of the axial central portion of at least one of the first spring portion and the second spring portion and the support member is larger than the distance between the body portion and the support portion.
Provided is an inspection device and an inspection method that can easily correct variations in electrostatic capacitance due to variations in manufacture of substrates. A substrate inspection device 1 for inspecting a plurality of substrates A each having a wiring P and a reference wiring B formed thereon comprises: a measurement unit 22 that measures electrostatic capacitance of the wiring P and the reference wiring B of each substrate A as measurement capacitances C; an average capacitance calculation unit 23 that calculates, as an average capacitance Cav, an average value of the measurement capacitances C obtained from the reference wirings B provided as the same wiring in terms of design; and a capacitance correction unit 24 that calculates a corrected capacitance Cc, which is a corrected value of the measurement capacitance C of a target wiring P being inspected on a target substrate Ai, which is one of the plurality of substrates A, wherein the capacitance correction unit 24 calculates the corrected capacitance Cc by multiplying the ratio of the average capacitance Cav to the measurement capacitance C of the wiring of the target substrate Ai by the measurement capacitance C of the target wiring P.
G01R 27/26 - Measuring inductance or capacitanceMeasuring quality factor, e.g. by using the resonance methodMeasuring loss factorMeasuring dielectric constants
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
G01R 31/50 - Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
G01R 31/52 - Testing for short-circuits, leakage current or ground faults
An inspection jig 3 comprises: a rod-like contact element Pr; a first support portion 311 supporting one end side of the contact element Pr; a second support portion 312 supporting another end side of the contact element Pr; and a spacing/holding member 7 for holding the first support portion 311 and the second support portion 312 apart from each other. The first support portion 311 includes a support plate B2 having a through-hole B2H formed therein through which the contact element Pr is passed. The support plate B2 has an opposing surface opposing the second support portion 312, and a reinforcing plate 5 having a bending strength greater than that of the support plate B2 is disposed on the opposing surface.
A contact unit 2 is provided with a tubular socket 20 including a socket main body 21 which is inserted into an accommodating hole 30, a distal end part 22 which is inserted into a hole portion 50, and an intermediate portion 29 provided between the socket main body 21 and the distal end part 22, and a contact 10 which is held by the socket 20, wherein: the intermediate portion 29 is provided with a projecting portion 27 which projects from the peripheral surface of the intermediate portion 29 toward the radially outer side; a lower end surface 271, which is the outer edge of the projecting portion 27 on the socket main body 21 side, extends from the peripheral surface in such a way as to be contained in a first plane F1 orthogonal to an axis 28 of the socket 20; and an upper end surface 272, which is the outer edge of the projecting portion 27 on the distal end part 22 side extends from the peripheral surface in such a way as to be contained in a second plane F2 orthogonal to the axis 28 of the socket 20.
H01R 33/76 - Holders with sockets, clips or analogous contacts, adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
Provided is an inspection probe 2 that is used to inspect an inspection target provided with a plurality of inspection points. The inspection probe 2 comprises: a plurality of contact pads 22 that can contact the inspection points; a plurality of signal lines 23 that are each conductively connected to a contact pad 22; and a flat plate-shaped substrate 21 on which the contact pads 22 are arranged in a parallel state. The substrate 21 is provided with: a plurality of pad supporting parts 24 that respectively support the contact pads 22; and dividing parts comprising slits 25, etc., the dividing parts being capable of mutually dividing and individually displacing the pad supporting parts 24 that are adjacent to each other.
This substrate inspection device comprises: a rotary table having a mounting surface; a rotary table support unit; an attraction mechanism including a suction device and a suction path having one end connected to the suction device and another end positioned on the mounting surface, the attraction mechanism attracting a circuit substrate onto the mounting surface by suctioning gas inside the suction path by the suction device; a flow volume detection unit for detecting the flow volume of gas that flows in a portion of the suction path located inside the rotary table support unit; a flow volume determination unit for determining whether the flow volume of the gas detected by the flow volume detection unit is greater than or equal to a predetermined value; a contactless detection unit for contactlessly detecting the state of arrangement of the circuit substrate on the mounting surface; and an inspection unit for inspecting the circuit substrate in accordance with the results of detection by the flow volume determination unit and the contactless detection unit.
This contact terminal comprises: a cylindrical body; and a first conductor having a first insertion part. The cylindrical body has: an end-section-side cutout that is disposed in an end section on one side in an axial direction of the cylindrical body so as to have a shape that is obtained by cutting toward the other side in the axial direction from an end surface on the one side in the axial direction; a hole part open to the end section on the one side in the axial direction; and a pair of arm parts sandwiched between the end-section-side cutout and the hole part. The first insertion part has: an inclination section having an outer diameter that increases toward the one side in the axial direction; and a first straight section that is contiguous to the one side in the axial direction of the inclination section and that has a fixed outer diameter along the axial direction. The outer diameter of the first straight section is greater than the inner diameter of the cylindrical body. The first straight section is in contact with the arm parts. A wall surface portion disposed on an end on the one side in the axial direction of the first straight section can be brought into contact with the hole part.
A load port adapter 1 can be fixed on a mount base for a load port 100. The load port adapter 1 comprises a holding unit 10 in which a cassette 200 capable of storing a plurality of circuit substrates can be held. The holding unit 10 can be fixed on the mount base of the load port 100. The holding unit 10 includes a position adjustment mechanism 15 for positioning the cassette 200 in a reference position X. The reference position X provides a positional reference on the load port adapter 1 side when removing a circuit substrate from within the cassette 200 fixed on the load port adapter 1.
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
Provided is a clamp-type AC voltage probe enabling easy measurement of high AC voltage. A clamp-type AC voltage probe 1 comprises: a clamp part 2 for clamping a cable CBL to be measured; an electrode E which is arranged to face the cable CBL clamped by the clamp part 2; a parallel circuit 5 in which a capacitor C1 and a resistance R1 are connected in parallel, the parallel circuit 5 having one end P1 connected to the electrode E; a resistance R2 having one end connected to the other end P2 of the parallel circuit 5 and the other end connected to a circuit ground; a capacitor C2 having one end connected to the other end P2 of the parallel circuit 5 and the other end connected to the circuit ground; and an amplifier A1 having an input terminal to which one end P1 or the other end P2 of the parallel circuit 5 is connected, the amplifier A1 amplifying a signal inputted to the input terminal and outputting the same.
Provided is a configuration with which it is possible to suppress warping of a substrate used in an inspection jig. The inspection jig 4 has: a first substrate 10; a probe unit 70 having a probe 71; a second substrate 40 positioned aligned with the first substrate 10 and electrically connected to the probe 71; an electrical connection part 80 that electrically connects the first substrate 10 and the second substrate 40; and a substrate-holding part 50 that holds the second substrate 40 in a state aligned in the thickness direction with the first substrate 10, and holds the probe unit 70. The substrate-holding part 50 has: a probe-side holding plate part 52 positioned on the probe-unit 70 side of the second substrate 40; and a holding plate support part 53 that positions the probe-side holding plate part 52 in a position aligned in the thickness direction with the first substrate 10. The substrate-holding part 50 holds the second substrate 40 in a state in which the first substrate 10 and the second substrate 40 sandwich the electrical connection part 80, thereby electrically connecting the first substrate 10 and the second substrate 40 via the electrical connection part 80.
Provided is a circuit substrate inspection device with which it is possible to shorten an inspection time for a substrate to be inspected. A circuit substrate inspection device 1 has an inspection processing unit 3 that inspects an electrical circuit on a substrate W to be inspected, an inspection jig 4, and a position detection unit 6 used when positioning the inspection processing unit 3 relative to the substrate W to be inspected. The inspection jig 4 has: a probe unit 70 having a probe 71; a first substrate 10; a second substrate 40 positioned along the thickness direction of the first substrate 10 relative to the first substrate 10; an electrical connection unit 80 that electrically connects the first substrate 10 and the second substrate 40; and a second substrate holding part 50 that holds the second substrate 40 with respect to the first substrate, and holds the probe unit 70 on the side opposite from the first substrate 10. The second substrate holding part 50 has a position detection opening 54 that passes through in the thickness direction at a position overlapping the position detection unit 6, as seen from the thickness direction of the second substrate holding part 50.
A board-mounted connector 1 is provided with: a plurality of first linear terminals T1 extending substantially linearly along a direction X and comprising a first mounting part M1 at one end and a first connecting part C1 at the other end; a plurality of second bent terminals T2 comprising a second mounting part M2 extending substantially linearly along the direction X, a second joining part J2 extending from the end of the second mounting part M2 in the direction intersecting the direction X, and a second connecting part C2 extending substantially linearly from the end of the second joining part J2 along the direction X; and a holding part H for alternately holding the plurality of first linear terminals T1 and the plurality of second bent terminals T2 along the direction Y. In the holding part H, a plurality of the first mounting parts M1 and a plurality of the second mounting parts M2 are arranged on a first plane including the directions X and Y, and the second connecting parts C2 are held in a direction perpendicular to the first plane while being spaced apart from the first connecting parts C1 by a distance Dz.
This cylindrical body is conductive and extends in the longitudinal direction. The cylindrical body comprises: a first spring part where a spiral notch is formed on the circumferential surface of the cylindrical body; a second spring part where a spiral notch is formed on the circumferential surface of the cylindrical body; and a first body part that is disposed so as to be sandwiched between the first spring part and second spring part in the longitudinal direction. The distances from the center of the cylindrical body in the longitudinal direction to the inside end of the first spring part in the longitudinal direction and to the inside end of the second spring part in the longitudinal direction are the same. The number of coils in the first spring part and the number of coils in the second spring part are the same. The first spring part has a first winding spring part having a winding direction that is a first direction and a second winding spring part having a winding direction that is a second direction opposite from the first direction.
Provided are a semiconductor measurement device, a semiconductor measurement system, and a semiconductor measurement method with which it is easy to measure electrical characteristics of a to-be-measured block corresponding to a function element on a semiconductor substrate. A semiconductor inspection device 1 provided with: probe pairs PP0-PP7; a probe control unit 61 that causes a probe card 2 to move relative to a semiconductor substrate W, whereby at least one active pair among the probe pairs PP0-PP7 is brought into contact with a microphone element M, the at least one active pair having been selected in accordance with positioning of the microphone element M; a measurement unit 61 that floats the potential of an inactive probe pair different from the active pair and measures the capacitance Cm of the microphone element M as a measurement characteristic by using the active pair; a storage unit 67 that stores a correction value K, which corresponds to a combination pattern of the active pair and the inactive pair; and a correction unit 63 that corrects the capacitance Cm on the basis of the correction value K that corresponds to the combination pattern at the time of measurement.
G01R 27/26 - Measuring inductance or capacitanceMeasuring quality factor, e.g. by using the resonance methodMeasuring loss factorMeasuring dielectric constants
H01L 21/66 - Testing or measuring during manufacture or treatment
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
41.
CONTACTOR, INSPECTION JIG, INSPECTION DEVICE, AND METHOD FOR MANUFACTURING SAID CONTACTOR
Provided are: a contactor which can be manufactured easily; an inspection jig and an inspection device using said contactor; and a method for manufacturing said contactor. A contactor Pr is provided with a coil spring CS obtained by forming slits SL on a cylindrical body F; and first and second conductors P1, P2. A bottom wall part F4, a first lateral wall part F1, a second lateral wall part F2, and a top wall part F3 are configured such that a cross-sectional shape of the cylindrical body F when viewed in an axial direction becomes rectangular. The slits SL include a first slit SL1, a second slit SL2, a third slit SL3, and a fourth slit SL4. The third slit SL3 is contiguous to the first slit SL1 and the second slit SL2. The fourth slit SL4 is contiguous to the second slit SL2. In a side view of the cylindrical body F, the first slit SL1 and the second slit SL2 each have a rectangular shape. The first conductor P1 is connected to one end part Fx1 of the cylindrical body F. The second conductor P2 is connected to another end part Fx2 of the cylindrical body F.
This inspection device is provided with an upper mechanism that includes a table provided with a placement surface for inspection, a lower mechanism which supports the upper mechanism so as to allow rotation, and a lifting/lowering operation unit which is supported by the upper mechanism so as to allow lifting and lowering, wherein the lower mechanism comprises a rotation drive unit which rotates the upper mechanism, and a press-up force output unit which drives lifting and lowering of the lifting/lowering operation unit, and on the bottom end of the lifting/lowering operation unit, a transmission member is provided which the distal end of the press-up force output unit can contact or separate from.
A probe jig 3 for use in inspecting a tab terminal 114 in which a plurality of overlapped electrically conductive leads 103 are welded in a thickness direction at each interval of a first pitch PH from one surface side and at each interval of a second pitch PA from the other surface side. The probe jig 3 is provided with a plurality of probes P and a support member 31 supporting the plurality of probes P at substantially equal probe intervals PP, wherein the probe intervals PP are different from both the first pitch PH and the second pitch PA.
B23K 20/10 - Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
G01R 27/02 - Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
G01R 27/08 - Measuring resistance by measuring both voltage and current
A probe has a substantially bar shape, and includes a tip end, a base end, and a body portion that is located between the tip end and the base end and has a thickness in a thickness direction orthogonal to an axial direction of the substantially bar shape thinner than the tip end. The body portion includes a slope surface that is continuous with the tip end and is inclined with respect to the axial direction in a direction in which the thickness becomes gradually thinner with increasing distance from the tip end. A first region having a surface shape that bulges outward is provided in at least a part of the slope surface.
A substrate inspection method for inspecting a touch panel substrate P in which Y-electrodes and X-electrodes are disposed opposite each other. The substrate inspection method comprises: a first selecting step for selecting, when the number of Y-electrodes sandwiched between one Y-electrode and another Y-electrode is an inter-electrode number, one of the Y-electrodes as a first selected electrode and selecting a Y-electrode of which the inter-electrode number between the Y-electrode and the first selected electrode is one or more as a second selected electrode; a first grounding step for connecting the Y-electrodes other than the first and second selected electrodes and the X-electrodes to ground; a first measuring step for supplying an alternating-current voltage to the first selected electrode and measuring a first capacitance Ca on the basis of a current value measured at the second selected electrode; and a determining step for detecting, on the basis of the first capacitance Ca, the presence or absence of disconnection in the X-electrodes and/or the Y-electrodes in the region between the first selected electrode and the second selected electrode.
An MI sensor includes: an amorphous wire; an insulator layer formed on an outer peripheral surface of the amorphous wire; and an X-axis coil, a Y-axis coil, and a Z-axis coil which are formed, in a spiral shape, on an outer peripheral surface of the insulator layer. The X-axis coil, the Y-axis coil, and the Z-axis coil are formed of a conductive layer, and the X-axis coil, the Y-axis coil, and the Z-axis coil are arranged in directions orthogonal to each other.
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
47.
CIRCUIT CHARACTERISTIC MEASUREMENT SYSTEM AND CIRCUIT CHARACTERISTIC MEASUREMENT METHOD
This circuit characteristic measurement system 1 is provided with: a signal voltage generation circuit 2 which sequentially applies, to a circuit to be measured 51 that is a measurement target, a plurality of periodic voltage signals which respectively have a prescribed reference frequency, and frequencies of integral multiples of the reference frequency; a measurement circuit 3 which sequentially measures pieces of the power of signals generated from the circuit to be measured 51 by sequentially applying the period voltage signals to the circuit to be measured 51; a transfer function calculation unit 42 which calculates transfer functions H, H2 of the circuit to be measured 51 on the basis of the plurality of pieces of power measured in the measurement circuit 3 by using an equation set in advance, wherein the periodic voltage signal includes a high-frequency component.
G01R 27/28 - Measuring attenuation, gain, phase shift, or derived characteristics of electric four-pole networks, i.e. two-port networksMeasuring transient response
48.
Resistance measuring device and resistance measuring jig
A resistance measuring device includes: a first jig; a plurality of first contacts; a second jig; a plurality of second contacts; a resistance measuring unit that supplies a current between a first contact and a second contact, which correspond to each other, detects a voltage between a first contact and a second contact, and calculates a resistance value of an object to be measured based on a relationship between a value of the supplied current and a value of the detected voltage; first wirings connecting the resistance measuring unit and each of the first contacts, for the first contacts, respectively; and second wirings connecting the resistance measuring unit and each of the second contacts while passing from the resistance measuring unit through the first jig, for the second contacts, respectively.
An inspection jig 2 comprises: film-shaped wiring substrates 21 - 23 in which electrodes E are disposed on one surface thereof; a base 7 which supports the wiring substrates 21 - 23 which are layered while exposing electrode regions A1 - A3, said electrode regions A1 - A3 being the regions in which the electrodes E of the wiring substrates 21 – 23 are disposed; and a plurality of probes Pr having base end parts which contact the electrode regions A1 - A3 and extending in a direction away from the electrode regions A1 - A3.
An inspection jig includes a support member that supports a probe. The support member includes an inspection side plate-shaped body arranged on one end portion side, and an electrode side plate-shaped body arranged on the other end portion side of the support member. A probe support hole into which one end portion of the probe is inserted and supported is formed in the inspection side plate-shaped body. A probe insertion hole into which the other end portion of the probe is inserted is formed in the electrode side plate-shaped body. The probe is supported while the one end portion of the probe abuts on an inner wall of the probe support hole in a state in which a contact portion provided at the one end portion of the probe is not in contact with an inspected portion to be inspected.
A cylindrical body is formed of a conductive member provided with a spiral spring portion. Further, the cylindrical body includes a Ni metal layer and a Ni—W alloy layer containing W, and an end portion of the Ni—W alloy layer protrudes to an outer side of the Ni metal layer.
G01R 3/00 - Apparatus or processes specially adapted for the manufacture of measuring instruments
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
G01R 1/04 - HousingsSupporting membersArrangements of terminals
The present invention provides a contact terminal comprising an electroconductive cylindrical body extending in the axial direction of the contact terminal, a rod-shaped first conductor which is electroconductive and which can contact an inspection object, and rod-shaped second conductor which is electroconductive, the first conductor having a first protruding part protruding on one axial side from the cylindrical body, and a first insertion part which is provided to the end of the first conductor on the other axial side thereof and which is disposed inside the cylindrical body, the second conductor having a second insertion part disposed inside the cylindrical body, the cylindrical body having a spring part formed in a helical shape along the circumferential surface of the cylindrical body, and a first barrel part connected to one axial side of the spring part, the first insertion part being fixed to the first barrel part, and an end-side notch extending along the axial direction from the end surface on one axial side of the cylindrical body being provided in the circumferential surface of the first barrel part.
A contact terminal comprises: a first insertion section having a first contact portion having a first plane along an axial direction; a second insertion section having a second contact portion having a second plane along the axial direction, the second plane being in contact with the first plane; and a tubular body having at least one of a first end notch provided along the axial direction in a peripheral surface of one axial end of the tubular body and a second end notch provided along the axial direction in a peripheral surface of the other axial end of the tubular body. When the first end notch is provided, the first insertion section has a first end rib disposed between circumferential end surfaces of the first end notch. When the second end notch is provided, the second insertion section has a second end rib disposed between circumferential end surfaces of the second end notch.
Provided is a contact terminal comprising a tubular body extending axially in parallel to the central axis of the contact terminal, and a bar-like conductor having electrical conductivity. The conductor includes a protruding portion protruding from the tubular body toward one side axially, and an inserted portion disposed inside an outer periphery of the tubular body. The tubular body includes an end portion side cutout provided axially in a peripheral surface of one axial side end portion of the tubular body, and a first circumferential cutout continuous with an axially other side of the end portion side cutout and extending from a circumferential first end portion of the end portion side cutout circumferentially away from the end portion side cutout. The inserted portion includes a first inclined portion and a first wall surface portion which is disposed on one side axially of the first inclined portion. The first inclined portion includes an inclined surface which, when viewed in a direction perpendicular to the axial direction, is disposed with increasing distance from the central axis as the inclined surface becomes closer to the axially one side. The first wall surface portion is contactable with the tubular body.
An inspection jig comprising: a plate-shaped insulating member having a recess; a first substrate having a first electrode; and a conductive wire electrically connected to the contact terminal. The insulating member has a through-hole penetrating through the bottom of the recess. One end of the conductive wire is disposed in the through-hole, and the other end of the conductive wire is connected to the first electrode.
A battery inspection device 1 that is an inspection device comprises: a holding plate 3 that holds a secondary battery B that is an inspection object; a plate-shaped protective plate 4 placed facing the secondary battery B held by the holding plate 3; a magnetic sensor 5 that is placed facing the secondary battery B with the protective plate 4 interposed therebetween, and that detects a magnetic field generated by the secondary battery B; and an inspection processing unit 14 that inspects the secondary battery B based on the magnetic field detected by the magnetic sensor 5.
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
G01R 31/36 - Arrangements for testing, measuring or monitoring the electrical condition of accumulators or electric batteries, e.g. capacity or state of charge [SoC]
G01R 31/52 - Testing for short-circuits, leakage current or ground faults
58.
DETECTION VALUE CORRECTION SYSTEM, COEFFICIENT CALCULATING METHOD, AND DETECTION VALUE CORRECTION METHOD
G01R 35/00 - Testing or calibrating of apparatus covered by the other groups of this subclass
G01N 27/72 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
G01R 33/02 - Measuring direction or magnitude of magnetic fields or magnetic flux
G01N 23/04 - Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups , or by transmitting the radiation through the material and forming images of the material
This test jig comprises contact terminals and a pitch converting unit which is electrically connected to the contact terminals and converts a first pitch between the contact terminals into a second pitch different from the first pitch. The contact terminals each include an electrically conductive tubular body extending in an axial direction of the contact terminals, and an electrically conductive rod-like conductor. The tubular body includes a spring portion configured in a spiral shape and disposed along the circumferential surface of the tubular body. The conductor includes a non-inserted portion protruding from the tubular body toward one side in the axial direction, and an inserted portion disposed inside the tubular body and fixed to an end portion of the tubular body on one side in the axial direction. The pitch converting unit includes a substrate portion having a surface perpendicular to the axial direction, and an electrically conductive protruding portion protruding from the surface toward one side in the axial direction and mated with an end portion of the tubular body on the other side in the axial direction.
A coiled electronic component includes: an electronic component body which includes a coil portion having a spiral structure and formed of an electrically conductive material, and electrically conductive connection portions arranged on both ends of the coil portion; and a pair of electrodes for respectively connecting the electrically conductive connection portions to assembly portions arranged on an assembly object. The electrode includes a pair of pinching pieces for pinching the electrically conductive connection portion, and the pair of pinching pieces is opened in a manner that the electrically conductive connection portion is received and fitted therebetween.
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
H03H 7/075 - Ladder networks, e.g. electric wave filters
62.
CONTACT TERMINAL, INSPECTION TOOL, AND INSPECTION DEVICE
A probe Pr comprising: a conductive cylindrical body Pa having a cylindrical shape; and a conductive first central conductor Pc having a rod shape. The cylindrical body Pa has a cross section perpendicular to the axial direction that has a rectangular or hexagonal shape. The first central conductor Pc has a cross section perpendicular to the axial direction of the first central conductor Pc that has the same shape as the cross section of the cylindrical body Pa. The first central conductor Pc includes: a first insertion section inserted in one end side of the cylindrical body Pa; and a first protruding section Pc4 that protrudes from one end of the cylindrical body Pa.
Provided is an inspection method for inspecting a portion A to be inspected in which a plurality of current paths A1, A2 having diode characteristics are connected in parallel. The inspection method comprises a measuring process step in which, while allowing a current with a preset first current value Ia to flow between the ends of the portion A to be inspected, a voltage across the ends is measured as a first voltage value Va, wherein the first current value Ia is smaller than or equal to a current value at which the voltage across the ends of the portion A to be inspected, when normal, substantially becomes an on-voltage Von.
A bump inspection device images a wafer that includes a plurality of bumps arranged in parallel to each other. Each of the bumps is elongated along a first direction that is along a substrate surface. The bump inspection device includes: a laser-light source that emits laser light in a direction that is inclined relative to the substrate surface; a camera that images the substrate surface onto which the laser light is emitted; and a direction adjusting portion that adjusts an arrangement relation between the direction in which the laser light is emitted and an orientation of the wafer to allow the first direction to become inclined relative to the direction in which the laser light is emitted, in a plan view. The camera images the wafer while the first direction is inclined relative to the direction in which the laser light is emitted, in a plan view.
G01B 11/25 - Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. moiré fringes, on the object
INSPECTION INSTRUCTIONS INFORMATION GENERATION DEVICE, BOARD INSPECTION SYSTEM, INSPECTION INSTRUCTIONS INFORMATION GENERATION METHOD, AND INSPECTION INSTRUCTIONS INFORMATION GENERATION PROGRAM
An inspection instructions information generation device 1 according to the present invention comprises: a storage unit 34 for storing conductive structure information D1 indicating how a plurality of electroconductive parts P, wiring W, and vias V of a board B are conductively connected, the board B comprising a pair of front and rear board faces F1, F2 on which the conductive parts P are provided, a wiring layer L constituting a layer stacked between the board faces F1, F2, and the vias V, which connect the wiring of the wiring layer L and the plurality of conductive parts P; and an inspection instructions information generating unit 33 for performing an inspection instructions information generation process where, on the basis of the conductive structure information D1, the plurality of electroconductive parts P are combined two at a time by pairing conductive parts P formed on the same board face, and information indicating the combined pairs of electroconductive parts P is generated as inspection instructions information D2.
G01R 31/02 - Testing of electric apparatus, lines, or components for short-circuits, discontinuities, leakage, or incorrect line connection
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
66.
INSPECTION INSTRUCTION INFORMATION GENERATION DEVICE, SUBSTRATE INSPECTION SYSTEM, INSPECTION INSTRUCTION INFORMATION GENERATION METHOD, AND INSPECTION INSTRUCTION INFORMATION GENERATION PROGRAM
In the present invention, on the basis of conduction structure information D1 indicating how a planar conductor IP, a plurality of conduction parts P, wiring W, and a via V are conductively connected in a substrate comprising a conductor layer Lc, a substrate surface F upon which the conduction parts P are provided, a wiring layer L, and the via V, if there are a plurality of groups of conduction parts P electrically connected to each other via the wiring W of the wiring layer L, inspection instruction information generation processing is carried out in which conduction parts P are selected from the groups one pair at a time as first selected conduction parts and information indicating a plurality of the pairs of first selected conduction parts that have been selected is generated as inspection instruction information D2.
When a load necessary for inspection is applied in the axial direction to a cylindrical body 23, an end 21D of a first rod-form body 21A and an end 22D of a second rod-form body 22A are positioned on the inner-peripheral side of a barrel part 23B, the end 21D of the first rod-form body 21A is positioned closer to an other end of the cylindrical body 23 than one end of a support part 32B in a support member 31 for supporting the barrel part 23B, the end 22D of the second rod-form body 22A is positioned closer to the one end of the cylindrical body 23 than the other end of the support part 32B, the barrel part 23B is positioned at all portions where the support part 32B is positioned, and the radial distance between the support member 31 and an outer-peripheral surface of a radially central part of a first spring part 23S1 and/or a second spring part 23S2 is greater than the distance between the barrel part 23B and the support part 32B.
A battery impedance measuring device 1 is provided with: a connecting circuit unit 7 including a terminal Tp capable of being attached to and detached from a charging terminal TCp for charging a secondary battery B1, a terminal Tm capable of being attached to and detached from a charging terminal TCm for charging the secondary battery B1, a capacitor C1 connected to the terminal Tp, and a capacitor C2 connected to the terminal Tm; and a main unit 5 including an alternating current signal supply unit 51 for supplying an alternating current signal to the secondary battery B1 via the capacitors C1, C2, and a measuring unit 52 which detects at least one of a signal obtained from the secondary battery B1 via the terminal Tp and the capacitor C1, and a signal obtained from the secondary battery B1 via the terminal Tm and the second capacitor, and which measures the impedance of the secondary battery B1 on the basis of the detected signal.
G01R 31/389 - Measuring internal impedance, internal conductance or related variables
G01R 27/02 - Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
H01M 10/48 - Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
69.
PROBE, INSPECTION TOOL, INSPECTION DEVICE, AND METHOD FOR MANUFACTURING PROBE
A probe Pr is substantially rod-shaped, and is provided with a distal-end part Pa, a proximal-end part Pb, and a body part which is positioned between the distal-end part Pa and the proximal-end part Pb and has a thickness less than the thickness of the distal-end part Pa in the direction orthogonal to the axial direction of the substantial rod shape, the body part PC including a slope surface Fs1 which is continuous with the distal-end part Pa and which is inclined with respect to the axial direction in the direction in which the thickness thereof gradually decreases progressively away from the distal-end part Pa, and at least a portion of the slope surface Fs1 being provided with a first region having a surface shape swollen toward the outside.
A length measurement device includes: a placement table; cameras imaging images of imaging ranges including target points; first marks within the imaging ranges; a reference position storage unit storing positions of the first marks on a placement surface as first mark reference positions; an image position acquisition unit acquiring, on the basis of the imaged images of the cameras, the target image positions of the target points in the imaged images and the first mark image positions of the first marks in the imaged images; a target position acquisition unit determining positions of the target points on the placement surface on the basis of the target image positions and first mark image positions in the imaged images and the first mark reference positions on the placement surface; and a length acquisition unit determining, on the basis of positions of the target points, the length of a portion to have the length thereof measured.
G01B 11/02 - Measuring arrangements characterised by the use of optical techniques for measuring length, width, or thickness
G01B 11/14 - Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
G01B 11/25 - Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. moiré fringes, on the object
G01B 21/04 - Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
The present invention comprises a roughly rod-shaped probe Pr having one end part Pa conductively connected to an inspection point 101 of an object (100) of inspection, a body part Pc that is continuous with the one end part Pa, and an other end part Pb that is continuous with the body part Pc, and a support member 31 for supporting the probe Pr. The probe has a locking part that is removably locked to a contact part provided on the support member. The locking part separates from the contact part when a compressive load greater than or equal to a fixed value acts in the axial direction of the probe during inspection using the probe.
A probe is a probe having a substantially bar-like shape and includes a distal end portion with a substantially columnar shape adapted to be in contact with an inspection point provided on a device under test, a base end portion with a substantially columnar shape on an opposite side of the distal end portion, and a main body portion formed in a flat ribbon shape and extended to connect the distal end portion to the base end portion. The distal end portion is provided with a distal end surface inclined relative to and intersecting with an axial center of the probe.
This conveying device which conveys a plate-shaped workpiece comprises: a first suction portion that has a bottom surface that can abut on and suction hold the workpiece; and a first part and a second part that each have a bottom surface that can abut on the workpiece and a side surface adjacent to the first suction portion. The bottom surface of the first suction portion suction-holds the workpiece, the bottom surface of the first portion and the bottom surface of the second portion abut on the workpiece, and by positioning the bottom surface of the first suction portion further toward a first direction in which the workpiece is suction-held than the bottom surface of the first portion and the bottom surface of the second portion, the workpiece is bent.
This MI sensor 1A is provided with an amorphous wire 2, an insulator layer 3 formed on the outer circumferential surface of the amorphous wire 2, and an X-axis coil 6X, a Y-axis coil 6Y, and a Z-axis coil 6Z which are formed spirally on the outer circumferential surface of the insulator layer 3. The X-axis coil 6X, the Y-axis coil 6Y, and the Z-axis coil 6Z are formed on conductive layers, and the X-axis coil 6X, the Y-axis coil 6Y, and the Z-axis coil 6Z are disposed in directions perpendicular to each other.
A contact probe may include a Ni pipe that may include a coiled spring structure, and the Ni pipe 11 may contain 0.5 to 10 wt % of phosphorus (P). The contact probe may have improved durability, by reducing shrinkage, after probing performed in a high temperature environment.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
G01R 3/00 - Apparatus or processes specially adapted for the manufacture of measuring instruments
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
76.
Probe, inspection jig, inspection device, and method of manufacturing probe
SV Probe Technology Taiwan Co., Ltd. (Taiwan, Province of China)
Inventor
Kaida, Michio
Yu, Huei Che
Abstract
Provided are a probe that enables control of a bending direction and can be simply manufactured, an inspection jig using the probe, an inspection device, and a method of manufacturing the probe. A probe has a substantially bar-like shape extending linearly and includes: a tip end portion, a body portion continuous with the tip end portion Pa; and a base end portion continuous with the body portion. The body portion includes a first connection region having a thickness in a thickness direction perpendicular to an axial direction of the bar-like shape that gradually decreases away from the tip end portion, and a second connection region having a thickness that gradually decreases away from the base end portion. A dimension of the body portion in a width direction perpendicular to the thickness direction is larger than dimensions of the tip end portion and the base end portion.
A contact terminal defined by a probe may include a tubular body made of an electrically conductive material and central conductors, each of which is made of an electrically conductive material and has a stick shape. The central conductors and may include stick-shaped bodies inserted into the tubular body. The tubular body may include spring portions, which are defined by helical bodies formed by helical grooves along a circumference thereof and clasping portions, which are fitted onto proximal end portions of the stick-shaped bodies to fit the proximal end portions. The clasping portions may be defined by a circumferential wall of the tubular body and a slit extending from end portions of the helical grooves, which define the spring portions, in an axial direction of the tubular body, at which, portions are separated in a circumferential direction of the tubular body.
A cylindrical body (2) which is composed of a conductive member that is provided with a helical spring part, and which is configured such that: the cylindrical body has an Ni metal layer (5) and an Ni-W alloy layer (6) that contains W; and an end (62) of the Ni-W alloy layer protrudes beyond the Ni metal layer.
An inspection jig may include: an electrode; a probe, the probe having a rear end portion and a tip portion to contact a bump; and a support member supporting the probe. The probe may include: an outer tubular body that is electrically conductive; and an inner tubular body that is electrically conductive, the inner tubular body being inserted into the outer tubular body. The outer tubular body may include outer spring parts to bias the rear end portion. The inner tubular body may include inner spring parts. The tip portion may be a first end of the inner tubular body, and protrudes from a first end of the outer tubular body. The support member may hold the outer tubular body such that the rear end portion is brought into contact with the electrode by the biasing force of the outer spring parts.
An inspection jig 4 is provided with a support member 10 which supports a probe 3, wherein: the support member 10 has an inspection side plate-shaped body 5 disposed at one end portion side thereof, and an electrode side plate-shaped body 6 disposed at the other end portion side of the support member 10; a probe supporting hole 51 into which one end portion of the probe 3 is inserted to be supported thereby is formed in the inspection side plate-shaped body 5; a probe insertion hole 61 into which the other end portion of the probe 3 is inserted is formed in the electrode side plate-shaped body 6; the probe 3 is installed inclined at a certain angle θ relative to a reference line V extending in the axial direction of the probe insertion hole 61; and in a state in which a contacting portion 31c provided in one end portion of the probe 3 is not in contact with a portion 101 to be inspected of an inspection target, said one end portion of the probe 3 is supported in a state of contact with an inner wall of the probe supporting hole 51.
This electrical standard 10 is provided with a coaxial cable 1 having a core wire 11 and an external conductor 12, a resistor 2 connected at one end in series with the core wire 11, and a baseplate 3 having an opening 31 through which the core wire 11 is passed. The base end of a conductor tube 5 surrounding the coaxial cable 1 is attached to a first surface 3a of the baseplate 3. The core wire 11 is guided from the side of a second surface 3b of the baseplate 3 to pass through the opening 31 and into the conductor tube 5. The resistor 2 is arranged on the second surface 3b side, and the conductor tube 5 is conductively connected to the other end of the resistor 2 located on the second surface 3b side. The external conductor 12 is introduced into the conductor tube 5 from the leading end side of the conductor tube 5, and is arranged so as to fit over the core wire 11 positioned on the first surface 3a side; the electrostatic capacitance C4 occurring between the core wire 11 and the conductor tube 5 can be adjusted by sliding displacement of the baseplate 3 and the conductor tube 5 in the axial direction of the coaxial cable 1.
G01R 27/02 - Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
G01R 27/26 - Measuring inductance or capacitanceMeasuring quality factor, e.g. by using the resonance methodMeasuring loss factorMeasuring dielectric constants
G01R 35/00 - Testing or calibrating of apparatus covered by the other groups of this subclass
This connection jig (1) is for conductively connecting a standard to a second external device, the standard comprising a connection unit which can connect to a first external device over a coaxial connection cable, and at least an electrostatic capacitance that acts as a standard of an electrical property. The connection jig is provided with a substrate (9) covered on the surface by a planar pattern (90), and on said substrate, a coaxial connector (8) which can be detachably attached to the connector unit and a mounting pad (15) on which a capacitor (14) is mounted are provided. The mounting pad and the planar pattern are connected by only a connection pattern (16b) having a width dimension w2 smaller than the width direction W2 of the mounting pad.
G01R 1/04 - HousingsSupporting membersArrangements of terminals
G01R 27/26 - Measuring inductance or capacitanceMeasuring quality factor, e.g. by using the resonance methodMeasuring loss factorMeasuring dielectric constants
G01R 35/00 - Testing or calibrating of apparatus covered by the other groups of this subclass
83.
RESISTANCE MEASURING DEVICE, AND RESISTANCE MEASURING JIG
A resistance measuring device 1 is provided with a first jig 3U, a plurality of first contacts, a second jig 3D, a plurality of second contacts, a resistance measuring unit 5 which supplies a current between the mutually corresponding first contacts and second contacts, detects voltages between the first contacts and the second contacts, and calculates a resistance value of an object being measured on the basis of a relationship between the supplied current values and the detected voltage values, a first wire connecting the resistance measuring unit 5 with the first contact, for each first contact, and a second wire connecting the resistance measuring unit and the second contact, from the resistance measuring unit 5 via the first jig 3U, for each second contact, wherein the first wire and the second wire connected respectively to each mutually corresponding first contact and second contact are arranged adjacent to one another between the resistance measuring unit 5 and the first jig 3U.
A contact terminal 10 is provided with a pair of central conductors 1a, 1b each formed in the shape of a rod using an electrically conductive material, and a tubular body 2 which holds the pair of central conductors 1a, 1b, wherein: the tubular body 2 includes a spring portion 21 comprising a helical body; the pair of central conductors 1a, 1b each include a rod-shaped body 11 installed in a state of being inserted into the tubular body 2, and connecting portions 13, 14 installed in a state of projecting to the outside of the tubular body 2; at least one of the pair of central conductors 1a, 1b has an electrically conductive flexible body 4, which is electrically conductive and flexible, provided on a distal end surface of the rod-shaped body 11; and the pair of central conductors 1a, 1b have an axial length such that the distal end surfaces of the two rod-shaped bodies 11 inserted into the tubular body 2 are capable of being connected electrically to one another by way of the electrically conductive flexible body 4.
This inspection jig is provided with: an inspection-side support member having a counter plate (51) provided with a facing surface (F) disposed to face the substrate; and an electrode-side support member (6) having supporting plates (61-63) disposed to face an electrode plate (9) located on the side opposite to the facing surface (F) of the counter plate (51) A probe supporting hole (23), into and by which the rear end portion of the probe (Pr) is inserted and supported, is provided in the supporting plates (61-63), and the probe supporting hole (23) is provided with a restricting surface which is formed along a supporting line (V) inclined at a certain angle (θ) with respect to a reference line (Z), and which restricts the rear end portion of the probe (Pr) from moving in the direction perpendicular to the inclined direction of the supporting line (V).
This inspection jig is provided with: a plurality of probes (Pr) for bringing leading end portions (Pra) thereof into contact with a plurality of inspection points on a substrate (100); a support member (300) that supports the probes (Pr) in a state wherein the leading end portions (Pra) are disposed to be in contact with the inspection points on the substrate (100) respectively; device-side connecting terminals (36) electrically connected to an inspection device main body (2); a plurality of standard disposition electrodes (332), which are conducted to the device-side connecting terminals (36), and are disposed in previously set standard disposition; and a conversion block (31), which has a first surface (311) and a second surface (312) on sides opposite to each other, and in which first electrodes (E1) are formed on the first surface (311), and in which second electrodes (E2) are formed on the second surface (312).
This resistance measuring device is provided with: anisotropically conductive members 31, 32 each having a first surface S1 in contact with an electrode A1, A2 of a substrate A, and a second surface S2, and in which a resistance value in a first direction orthogonal to a surface direction can be smaller than a resistance value in a second direction in the surface direction; electrodes E1, E2 which are in contact with the second surfaces S2 and are disposed to correspond to the arrangement of the electrodes A1, A2; a resistor RC1 having one end connected to the electrode E1; a resistor RC2 having one end connected to the electrode E2; a power source unit 24 which supplies an electric current between the other end of the resistor RC1 and the other end of the resistor RC2; an ammeter 25 which detects the electric current flowing between said other end of the resistor RC1 and said other end of the resistor RC2; and a resistance acquiring unit 261 which, on the basis of the detected electric current, acquires a resistance value R including the resistances of the anisotropically conductive members 31, 32 and the resistance between the electrodes A1, A2.
This substrate inspecting device is provided with a substrate holding member 2 which holds a substrate 10 to be inspected, inspection jigs 4a, 4b including movable plates 6a, 6b having contacting portions 63, 63 which come into contact with inspection target portions 13D, 13U of the substrate 10 being held by the substrate holding member 2, and support members 7 which support the movable plates 6a, 6b, and raising and lowering drive mechanisms 5a, 5b which displace the inspection jigs 4a, 4b up or down to move the movable plates 6a, 6a into inspection standby positions in which the contacting portions 63, 63 are in close proximity to the inspection target portions 13D, 13U, wherein the support members 7 are each provided with a pivot portion 8 provided with a support shaft 81 which supports the movable plate 6a, 6b with freedom to swing, and a swing drive portion which causes the movable plate 6a, 6b to be displaced in such a way as to swing about the support shaft 81, to cause the contacting portion 63, 63 to come into contact with the inspection target portion 13D, 13U.
A transfer device 1 transfers stacked thin-board-shaped workpieces W by sequentially sucking and lifting the workpieces from the top. The transfer device is provided with: a suction transfer unit 10 that sucks and transfers each workpiece W by means of a suction nozzle 16; an air vibrator 20 that applies vibration to the suction nozzle 16; and an air discharge unit 30 that warps each workpiece W by blowing compressed air to the surface of the workpiece W sucked by means of the suction nozzle 16.
Provided is an inspection device 1, wherein: a second distance D2, which is the distance between a second jig 32 and an upper surface 101 of a substrate 100, is calculated on the basis of a first substrate distance Db1 that is the distance to the upper surface 101 as measured by a first distance-measuring sensor 11 and a second jig distance Dj2 that is the distance to an inspection surface 32P of the second jig 32 as measured by the first distance-measuring sensor 11; a first distance D1, which is the distance between a first jig 31 and a lower surface 102, is calculated on the basis of a second substrate distance Db2 that is the distance to the lower surface 102 as measured by a second distance-measuring sensor 12 and a first jig distance Dj1 that is the distance to an inspection surface 31P of the first jig 31 as measured by the second distance-measuring sensor 12; and the displacement of the first jig 31 and the second jig 32 relative to the substrate 100 is set on the basis of the first distance D1 and the second distance D2.
This production method of an MI element 1 involves: an insulating step for forming an insulation layer 3 on the outer periphery of an amorphous wafer 2; an electroless plating step for forming an electroless plating layer 4 on the outer peripheral surface of the insulation layer 3; an electrolytic plating step for forming an electrolytic plating layer 5 on the outer peripheral surface of the electroless plating layer 4; a resist step for forming a resist layer R on the outer peripheral surface of the electrolytic plating layer 5; an exposure step for forming a spiral groove GR on the outer peripheral surface of the resist layer R by exposing the resist layer R with a laser; and an etching step for etching with the resist layer R as the masking material to remove the electroless plating layer 4 and the electrolytic plating layer 5 in the groove GR, forming a coil 6 with the remaining electroless plating layer 4 and electrolytic plating layer 5.
H01L 43/00 - Devices using galvano-magnetic or similar magnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof
G01R 33/02 - Measuring direction or magnitude of magnetic fields or magnetic flux
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
H01L 43/12 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
92.
SUBSTRATE INSPECTION DEVICE, INSPECTION POSITION CORRECTION METHOD, POSITION CORRECTION INFORMATION GENERATION METHOD, AND POSITION CORRECTION INFORMATION GENERATION SYSTEM
This substrate inspection device 1 comprises: an inspection jig 3 that holds a plurality of probes U, D; a drive mechanism 801 that brings the plurality of probes U, D into contact with a surface of a substrate; a storage unit 86 that pre-stores position correction information which includes multiple combination patterns of the respective conduction states of the probes U, D and in which each combination pattern is associated with displacement information indicating displacement of the inspection jig 3; a conduction state detection unit 82 that moves the inspection jig 3 to a prescribed inspection position and brings, in said inspection position, the probes U, D into contact with the substrate, and detects the respective conduction states of the probes U, D; a displacement information acquisition unit 83 that selects one pattern from the multiple combination patterns on the basis of the detected respective conduction states of the probes and acquires, as a displacement correction amount, the displacement information associated with the selected combination pattern according to the position correction information; and a correction unit 84 that corrects the inspection position on the basis of the displacement correction amount.
This welding state detection method detects a welding state in a sheet member in which a plurality of conductive sheets overlap each other and the overlapping parts are welded in a stripe shape extended in a prescribed first direction. The welding state detection method includes: (a) a step for bringing one of a pair of probes into contact with one side surface of the sheet member and bringing the other of the pair of probes into contact with the other side surface of the sheet member at a plurality of spots positioned in a row along the first direction in a welding area in which welding is performed in the stripe shape; and (b) a step for measuring a resistance value between the pair of probes which have been brought into contact with both side surfaces of the sheet member at each of the plurality of spots.
G01N 27/04 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
G01R 27/02 - Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
A bump inspection device 1 is for imaging a wafer W in which a plurality of long bumps BP1 extending in a first direction A along a substrate surface are arranged in parallel, and is provided with: a laser beam source 4 that emits a laser beam L in an emission direction inclined with respect to the substrate surface; a camera 5 that images the substrate surface irradiated with the laser beam L; and a direction adjustment unit 92 that adjusts the relative arrangement relationship between the emission direction of the laser beam L and the direction of the wafer W so as to incline the first direction A with respect to the emission direction of the laser beam L in a plan view. The camera 5 images the wafer W in a state where the first direction A is inclined with respect to the emission direction in the plan view.
A contact terminal may include a tubular body made of an electrically conductive material; and stick-shaped first and second central conductors made of an electrically conductive material. The first and second central conductors may include first and second stick-shaped bodies, first and second clasped portions configured to have a diameter greater than that of each of the first and second stick-shaped bodies, and first and second swell portions configured to have a diameter greater than that of each of the first and second stick-shaped bodies. The first and second central conductors are arranged to have a distal end portion of the first and second swell portions inserted into a joining portion of the tubular body, and to have a distal end surface of the first swell portion and a distal end surface of the second swell portion opposite each other with a gap therebetween.
Provided is a contact probe which may achieve improved heat resistance even when a spring portion thereof is compressed and released in a high temperature environment. The contact probe includes an Ni—P layer, and the Ni—P layer has different concentrations of P at different positions in a thickness direction of the Ni—P layer.
C25D 5/48 - After-treatment of electroplated surfaces
C25D 3/12 - ElectroplatingBaths therefor from solutions of nickel or cobalt
C25D 5/14 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
C25D 5/12 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
G01R 35/00 - Testing or calibrating of apparatus covered by the other groups of this subclass
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
In an inspection jig 4 provided with a movable plate 8, a probe insertion hole 16 for insertion of a distal end portion of a probe Pr is formed in an opposing plate 51 of an inspection side supporting body 5, a probe supporting hole 23 through which a rear end portion of the Pr probe is inserted, and which supports the same, is provided in a supporting plate 61 of an electrode side supporting body 6, and a probe through hole 18 through which the probe Pr penetrates is provided in the movable plate 8. The inspection jig 4 is also provided with a positioning hole 19 and an accepting hole 20 which are capable of being switched between an allowing state in which the movable plate 8 is capable of moving in an allowed direction parallel to a flat surface X, and a restrained state in which the movable plate 8 is positioned in such a way that the center of the probe through hole 18 is offset by a prescribed offset amount La in the allowed direction relative to the center of the probe supporting hole 23.
This probe structure 1 is provided with: a holding plate 2 which has a first surface 21 and a second surface 22, and wherein at least the first surface 21 is insulated; a plurality of electrodes 3 which are formed on the first surface 21 of the holding plate 2 in such a manner that the plurality of electrodes 3 are separated from each other; and carbon nanotube structures 4 which are provided on the electrodes 3 in such a manner that the carbon nanotube structures 4 stand upright thereon. The holding plate 2 is provided with through holes 24 which correspond to the electrodes 3, respectively.
A coiled electronic component is provided with: an electronic component body which includes a coil portion having a spiral structure and formed of an electrically conductive material, and electrically conductive connection portions provided on both ends thereof; and a pair of electrodes respectively connected to assembly portions provided to be assembled to the electrically conductive connection portions. The electrodes include a pair of pinching pieces for pinching the electrically conductive connection portions, wherein the pair of pinching pieces are opened to receive the electrically conductive connection portions therebetween in a fitting manner.
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
H03H 7/075 - Ladder networks, e.g. electric wave filters
H04B 1/18 - Input circuits, e.g. for coupling to an antenna or a transmission line
The purpose of the present invention is to provide a contact probe, the durability of which is improved by reduction of the contraction amount after probing in a high temperature environment. A contact probe 1 is provided with a Ni pipe 11 having a coiled spring structure 11a, wherein the Ni pipe 11 contains 0.5-10% by weight of phosphorus (P).
