Provided is a grinding apparatus that can efficiently and accurately measure the position of a work surface of a workpiece without preliminary preparations. Included are: a work table (14) configured to hold a workpiece (W); a grinding wheel (10) configured to grind the workpiece (W) while rotating; and a detection sensor (20) configured to detect the position of a work surface of the workpiece (W) in contact with the work surface, and relative positions of the detection sensor (20) and the work table (14) are changed by a manual operation, and the detection sensor (20) is brought into contact with the workpiece (W) to measure the workpiece (W). Consequently, it is possible to omit preliminary preparations for measurement such as creation of an NC program, initial settings, and operation confirmation and perform a highly efficient measurement with a significantly reduced time for the preliminary preparations.
B24B 47/20 - Drives or gearings for grinding machines or devicesEquipment therefor relating to feed movement
B24B 41/06 - Work supports, e.g. adjustable steadies
B24B 49/04 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
Provided is a grinding device whereby the position of a workpiece surface to be processed can be efficiently and precisely measured without advance preparation such as NC program creation. The present invention has a workpiece table (14) for holding a workpiece (W), a grinding wheel (10) for grinding the workpiece (W) while rotating, and a detection sensor (20) for contacting a workpiece (W) surface to be processed and detecting the position of the surface to be processed, the relative positions of the detection sensor (20) and the workpiece table (14) are changed by a manual operation, the detection sensor (20) is brought into contact with the workpiece (W), and measurement of the workpiece (W) is performed. Through this configuration, advance preparation such as creation of an NC program for measurement, initial setting, and operation confirmation can be omitted, and highly efficient measurement with greatly reduced time for advance preparation can be performed. Workpiece (W) yield using the grinding device (1) can thereby be enhanced.
B24B 49/02 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
B24B 7/02 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfacesAccessories therefor involving a reciprocatingly-moved work-table
3.
SUBSTRATE GRINDING DEVICE AND SUBSTRATE GRINDING METHOD
Provided is a substrate grinding device including: a work table; a first grinding wheel; and a second grinding wheel, wherein the work table is configured to rotate while sucking and holding a substrate, the first grinding wheel and the second grinding wheel are cup wheel type wheels, and provided at positions where the first grinding wheel and the second grinding wheel can be simultaneously in contact with the substrate rotating, the first grinding wheel and the second grinding wheel being configured to grind the substrate rotating, while rotating, and the work table is configured to be able to move a rotation center of the substrate from a first grinding position within a grinding range of the first grinding wheel to a second grinding position within a grinding range of the second grinding wheel.
B24B 7/22 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfacesAccessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
B24B 7/04 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfacesAccessories therefor involving a rotary work-table
B24B 41/06 - Work supports, e.g. adjustable steadies
B24D 13/14 - Wheels having flexibly-acting working parts, e.g. buffing wheelsMountings therefor acting by the front face
4.
Method for manufacturing semiconductor device and apparatus for manufacturing semiconductor device
There is provided a method for manufacturing a semiconductor device, including: attracting a semiconductor device wafer by a chuck mechanism and rotating the semiconductor device wafer horizontally; rotating a rotary blade horizontally by a vertical spindle to which ultrasonic waves are applied; trimming an outer peripheral end portion of the semiconductor device wafer that is horizontally rotating by the rotary blade that is horizontally rotating, to form a groove in the outer peripheral end portion; correcting a tip shape of the rotary blade that is horizontally rotating by a blade-forming grinding wheel during the trimming; and grinding one main surface of the semiconductor device wafer that is horizontally rotating by a cup grinding wheel that is horizontally rotating after the trimming.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
B24B 9/06 - Machines or devices designed for grinding edges or bevels on work or for removing burrsAccessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
H01L 21/66 - Testing or measuring during manufacture or treatment
There is provided a grinding method for grinding a substrate with a grinding wheel. A dissimilar material portion made of a material different from a main constituent material of the substrate is embedded in the substrate. The grinding method includes: lowering the grinding wheel toward the substrate rotating while rotating the grinding wheel, and grinding the substrate by the grinding wheel; continuously imaging a processed surface of the substrate by an image sensor during grinding the substrate; analyzing an amount of exposure of the dissimilar material portion based on data of an image captured by the image sensor; and continuously grinding the substrate from a state where the dissimilar material portion begins to be exposed to a stage where the amount of exposure of the dissimilar material portion reaches a predetermined set value, based on the amount of exposure analyzed.
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
B24B 7/04 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfacesAccessories therefor involving a rotary work-table
B24B 7/22 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfacesAccessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
B24B 49/04 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
A dressing apparatus includes a dresser provided in a polishing apparatus for polishing a board-like work by relative movement between the work and a polishing pad while bringing the polishing pad into contact with the work, the dresser having a dressing surface that slides relative to a polishing surface of the polishing pad to dress the polishing pad; a dresser drive member that rotates the dresser; a high-pressure water generating device that supplies high-pressure water pressurized to 1 to 15 MPa; and a high-pressure water injection nozzle that injects the high-pressure water toward the dressing surface rotating.
Provided is an automatic grinding apparatus, comprising a grinding wheel, a support, a feeding device, a control device, a first detector, a second detector, a third detector, and a fourth detector, wherein the control device is further configured to, before processing using the grinding wheel is started, calculate a range in which the grinding wheel and the support are relatively moved on the basis of information on positions of a surface of a workpiece and an outer peripheral end portion and an end surface of the grinding wheel detected by the first detector, the second detector, the third detector, and the fourth detector, to move the grinding wheel or the support by controlling the feeding device, and to automatically start the processing using the grinding wheel.
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
8.
Grinding method of composite substrate including resin and grinding apparatus thereof
A grinding apparatus and a grinding method of a composite substrate including resin, by which loading of a grinding wheel can be suppressed in grinding of a large-sized composite substrate including resin, and with which grinding can be effectively performed with high precision. This method for grinding a front surface of a composite substrate formed with a resin substrate embedded with at least one of a semiconductor device chip and an electrode, includes: bringing at least a part of a grinding member for grinding the front surface of the composite substrate into contact with the front surface; supplying water to at least one of a contacting part or a non-contacting part between the front surface of the composite substrate and the grinding member; and grinding the front surface of the composite substrate simultaneously with the supplying water.
B24B 7/22 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfacesAccessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
B24B 55/02 - Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
9.
Substrate grinding device and substrate grinding method
Provided is a substrate grinding device including: a work table rotatable with the work table sucking and holding a substrate; a cup wheel-type first grinding wheel configured to grind the rotating substrate while rotating, the substrate being held by the work table; and a cup wheel-type second grinding wheel configured to grind the substrate along with grinding by the first grinding wheel while rotating in a close vicinity of the substrate.
B24B 7/04 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfacesAccessories therefor involving a rotary work-table
B24B 7/22 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfacesAccessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
10.
Method and apparatus for manufacturing semiconductor device
A method for manufacturing a semiconductor device includes chucking in which a semiconductor device wafer is attached to an upper surface of a chuck mechanism with its device surface down; and edge trimming performed after the chucking, wherein the edge trimming comprises: rotating the semiconductor device water horizontally by the chuck mechanism; rotating a rotating blade horizontally by a vertical spindle to which an ultrasonic wave is applied and trimming a circumferential side surface of the semiconductor device wafer by the rotating blade.
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
B24B 9/06 - Machines or devices designed for grinding edges or bevels on work or for removing burrsAccessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B24B 7/22 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfacesAccessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
An embodiment of the present disclosure provides a method of manufacturing a semiconductor apparatus, including the following steps. A) forming a semiconductor device element in a Si active layer of an insulating isolation Si substrate including the Si active layer, a buried insulating layer, and a Si supporting substrate arranged in this order; B) forming a plurality of through electrode holes penetrating the Si active layer and the buried insulating layer to reach a partial region of the Si supporting substrate in an element region layer including the formed semiconductor device element; C) forming a through silicon via by sequentially forming an insulating film, a barrier film, and a Cu film inside the through electrode hole to completely fill the through electrode hole; D) forming a multilayer wiring layer including a wiring layer connected to the semiconductor device element on an outer surface of the element region layer in which the through silicon via is formed; and E) exposing the Cu film of the through silicon via by removing the Si supporting substrate after forming the multilayer wiring layer.
H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
12.
Electrostatic attachment chuck, method for manufacturing the same, and semiconductor device manufacturing method
An electrostatic attachment chuck includes: a substrate; a synthetic resin sheet joined to one main surface of the substrate; and at least a pair of electrodes disposed in the synthetic resin sheet. The synthetic resin sheet includes a planarized and ground surface serving as a surface on which a semiconductor wafer is abutted.
B24B 41/06 - Work supports, e.g. adjustable steadies
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
An automatic grinding apparatus includes: a grinding wheel configured to grind a workpiece; a support configured to support the workpiece; a feeding device configured to change a relative position between the grinding wheel and the workpiece; and a control device configured to, before processing using the grinding wheel is started, calculate a range in which the grinding wheel and the support are relatively moved on the basis of information on positions of the workpiece and the grinding wheel detected by a first detector, a second detector, and a third detector, move the grinding wheel or the support by performing numerical control with respect to the feeding device, and automatically start the processing using the grinding wheel.
B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
B24B 51/00 - Arrangements for automatic control of a series of individual steps in grinding a workpiece
B24D 5/00 - Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their peripheryBushings or mountings therefor
B24B 49/00 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
