Resonac Corporation
Japan
New patents and trademarks in the last week
Last updated : 2026-08-01
Summary
Patents |
Trademarks |
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4 | 0 |
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0 | 0 |
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9 | 0 |
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Create a watch for Resonac Corporation
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Viewing 1 - 13 of 13
trademarks
patents
| # | ID | Jurisdiction | Title |
|---|---|---|---|
| 1 | 19141476 |
|
JOINING METHOD |
| 2 | 19143051 |
|
METHOD FOR PRODUCING FILM-LIKE BONDING MATERIAL |
| 3 | 18861932 |
|
BLOCK COPOLYMER, PROCESS FOR PRODUCING BLOCK COPOLYMER, INSULATING MATERIAL, POLYIMIDE, AND PRINTED BOARD |
| 4 | JP2026002030 |
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SLURRY, MULTIPLE-LIQUID-TYPE SLURRY, AND POLISHING METHOD |
| 5 | JP2026001725 |
|
FRP PRECURSOR, FRP, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE |
| 6 | JP2026001674 |
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LAMINATE, PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR PACKAGE |
| 7 | JP2025002221 |
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BONDED BODY, METAL PASTE FOR BONDING, AND METHOD FOR MANUFACTURING BONDED BODY |
| 8 | 19142988 |
|
ALUMINUM ALLOY FORGING MATERIAL, ALUMINUM ALLOY FORGED PRODUCT, AND METHOD FOR MANUFACTURING SAME |
| 9 | JP2025001748 |
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POLISHING LIQUID, POLISHING METHOD, COMPONENT MANUFACTURING METHOD, AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD |
| 10 | JP2025042200 |
|
METAL PASTE FOR BONDING, BONDED STRUCTURE, METHOD FOR PRODUCING BONDED STRUCTURE, AND METHOD FOR PRODUCING METAL PASTE FOR BONDING |
| 11 | JP2026001854 |
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METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND TEMPORARY FIXING MATERIAL FOR SILICON CARRIER SUBSTRATE |
| 12 | JP2025002296 |
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SLURRY, MULTIPLE-LIQUID SLURRY, AND POLISHING METHOD |
| 13 | JP2026000719 |
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POLYAMIDE-IMIDE RESIN COMPOSITION, POLYAMIDE-IMIDE RESIN, FILM, ELECTRODE FOR ENERGY DEVICE, AND ENERGY DEVICE |
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