ASM Assembly Automation Ltd

The Hong Kong Special Administrative Region of the People's Republic of China

 
Total IP 67
Total IP Rank # 20,048
IP Activity Score 0/5.0    0
IP Activity Rank # 1,661,095
Parent Entity ASM Pacific Technology Ltd

Patents

Trademarks

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Last Patent 2012 - Die bonding method utilizing rot...
First Patent 1982 - Four-motion wire bonder

Latest Inventions, Goods, Services

2011 Invention Testing apparatus for electronic devices. A wafer processing apparatus used for the testing of e...
Invention Die bonding method utilizing rotary wafer table. An array of semiconductor components, comprising...
Invention Apparatus for transporting substrates for bonding. A bonding apparatus for conducting bonding on ...
2010 Invention Wedge bonding method incorporating remote pattern recognition system. A wire is bonded to a targe...
Invention Die bonder incorporating dual-head dispenser. Adhesive is dispensed for conducting die bonding on...
Invention Method for inspecting a photovoltaic substrate. A method for inspecting a substrate having intrin...
Invention Multiple-phase linear switched reluctance motor. A linear switched reluctance motor comprises a m...
Invention Method of die bonding onto dispensed adhesives. A method of bonding semiconductor dice onto a su...
Invention Universal die detachment apparatus. A die detachment apparatus for partially delaminating a die f...
Invention Rotary clip bonder. Multiple connector clips are bondable onto an electronic device simultaneousl...
Invention Integrated connector assembly for a rotary apparatus. A rotary apparatus comprises a rotary bobbi...
Invention System for dispensing soft solder for mounting semiconductor chips using multiple solder wires. ...
Invention Laser processing apparatus. A laser processing apparatus for cutting substrates comprises a laser...
Invention Apparatus for transferring electronic components in stages. A transfer assembly for transferring ...
Invention Actuator for maintaining alignment of die detachment tools. A die detachment apparatus for detach...
Invention Control and monitoring system for thin die detachment and pick-up. During detachment of a die fro...
2009 Invention Transfer apparatus for multiple adhesives. Multiple types of adhesives contained in separate cont...
Invention Apparatus and method for bonding multiple dice. An apparatus for bonding dice onto one or more su...
Invention Test handler for electronic devices. A test handler comprises a package support for holding an el...
Invention Driving mechanism having position encoder for two-dimensional positioning. A driving mechanism co...
Invention Rotary bonding tool which provides a large bond force. A die bonder comprises a bond head having ...
Invention Die bonding process incorporating infrared vision system. A method of aligning a die when the die...
Invention Acoustic cleaning system for electronic components. An apparatus for cleaning electronic packages...
Invention Die bonder providing a large bonding force. A die bonder is provided comprising a bond head inclu...
Invention Direct current motor incorporating thermal control. A direct current motor comprises a magnet ass...
Invention Alignment method for singulation system. A method for determining virtual cutting lines for a sub...
Invention Dual-axis planar motor providing force constant and thermal stability. A motor is provided compri...
Invention Device for thin die detachment and pick-up. A die detachment device for delaminating a die which ...
Invention Electronic device sorter comprising dual buffers. A device handler for testing and sorting electr...
Invention Flanged collet for die pick-up tool. A collet is provided for picking up a die mounted on an adhe...
Invention Transfer apparatus for handling electronic components. An apparatus for transferring a plurality ...
2008 Invention Nozzle device employing high frequency wave energy. A nozzle device comprising a nozzle chamber i...
Invention Bond head for heavy wire bonder. A bonding apparatus for bonding a length of wire comprises a fir...
Invention Vision system for positioning a bonding tool. An apparatus for correcting a positional offset of ...
Invention Test handler including gripper-type test contactor. A test handler is provided for testing electr...
Invention Apparatus for dispensing measured quantities of liquid. A liquid dispensing apparatus is provided...
Invention Collet mounting assembly for a die bonder. A collet mounting assembly for a die bonder comprises ...
Invention Bondhead alignment tool for a bonding apparatus. An alignment tool for a bonding apparatus compri...
Invention Apparatus for generating amplified cooling air flows. A linear motor comprising a coil assembly a...
2007 Invention Pick and place apparatus incorporating debris removal device. A pick and place apparatus is prov...
Invention Handling system for inspecting and sorting electronic components. A semiconductor package handlin...
Invention Damage and wear detection for rotary cutting blades. A method of detecting wear and damage to a r...
Invention Jet dispenser comprising magnetostrictive actuator. A jet dispenser is provided with a giant magn...
Invention Wire bonding system utilizing multiple positioning tables. A wire bonding apparatus and method in...
Invention Optical system having selectable field for inspection. An optical system for viewing an object ha...
Invention Drainage apparatus for a singulation system. A singulation system for a workpiece has a carrier f...
Invention Apparatus for maintaining a clean bonding enviroment. A bonding apparatus for bonding materials ...
Invention Megasonic cleaning system. A system for cleaning semiconductor packages is provided which include...
Invention Vibration-induced die detachment system. A die is detachable from an adhesive tape on which the d...