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2024
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Invention
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Logic drive using standard commodity programmable logic ic chips comprising non-volatile random a... |
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Invention
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Logic drive based on standard commodity fpga ic chips.
A chip package used as a logic drive, inc... |
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Invention
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Logic drive based on multichip package using interconnection bridge.
A multi-chip package compri... |
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Invention
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Vertical interconnect elevator based on through silicon vias.
A chip package includes a first in... |
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2023
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Invention
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Logic drive based on standard commodity fpga ic chips using non-volatile memory cells.
A field-p... |
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Invention
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Logic drive based on multichip package comprising standard commodity fpga ic chip with cooperatin... |
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Invention
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Non-volatile field programmable multichip package.
A multi-chip package includes a ball-grid-arr... |
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Invention
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Non-volatile field programmable multichip package.
A multi-chip package includes a first semicon... |
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Invention
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Logic drive based on chip scale package comprising standardized commodity programmable logic ic c... |
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Invention
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Multi-output look-up table (lut) for use in coarse-grained field-programmable-gate-array (fpga) i... |
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Invention
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Logic drive using standard commodity programmable logic ic chips.
An expandable logic scheme bas... |
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Invention
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Logic drive based on standard commodity fpga ic chips. A chip package used as a logic drive, incl... |
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Invention
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3d chip package based on through-silicon-via interconnection elevator.
A chip package includes a... |
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Invention
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Chip package based on through-silicon-via connector and silicon interconnection bridge.
A method... |
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2022
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Invention
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Logic drive based on standardized commodity programmable logic semiconductor ic chips.
A chip pa... |
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Invention
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Field programmable multichip package based on field-programmable-gate-array (fpga) integrated-cir... |
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Invention
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Logic drive using standard commodity programmable logic ic chips.
A three-dimensional programmab... |
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Invention
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Logic drive with brain-like elasticity and integrality based on standard commodity fpga ic chips ... |
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Invention
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3d chip package based on vertical-through-via connector. A connector may include: a first substra... |
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Invention
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Logic drive based on standard commodity fpga ic chips using non-volatile memory cells. A field-pr... |
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Invention
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Micro heat pipe for use in semiconductor ic chip package.
A micro heat transfer component includ... |
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2021
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Invention
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Logic drive using standard commodity programmable logic ic chips. An expandable logic scheme base... |
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Invention
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Logic drive based on standardized commodity programmable logic semiconductor ic chips. A chip pac... |
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Invention
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Chip package based on through-silicon-via connector and silicon interconnection bridge. A method ... |
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Invention
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Logic drive based on multichip package using interconnection bridge. A multi-chip package compris... |
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2020
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Invention
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Logic drive using standard commodity programmable logic ic chips. A three-dimensional programmabl... |
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Invention
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Method for data management and machine learning with fine resolution. A method for obtaining a pr... |
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Invention
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3d chip package based on through-silicon-via interconnection elevator. A chip package includes a ... |
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Invention
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Vertical interconnect elevator based on through silicon vias. A chip package includes a first int... |
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Invention
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Logic drive based on multichip package comprising standard commodity fpga ic chip with cryptograp... |
