Atomica Corporation

United States of America

Create a watch for Atomica Corporation
Total IP 38
Total IP Rank # 38,682
IP Activity Score 0.9/5.0    2
IP Activity Rank # 488,856
Dominant Nice Class Treatment of materials; recyclin...

Patents

Trademarks

36 1
0 0
1 0
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Last Patent 2024 - Overcurrent protection
First Patent 2001 - Method and apparatus for assembl...
Last Trademark 2021 - ATOMICA
First Trademark 2021 - ATOMICA

Industry (Nice Classification)

Latest Inventions, Goods, Services

2024 Invention Overcurrent protection. A microelectromechanical systems (MEMS) switch device including current s...
2021 G/S Custom manufacture of micro electro-mechanical systems (MEMS), photonic chips, sensors and biochi...
2019 Invention Resonant filter using mm wave cavity. Systems and methods for forming a mm wave resonant filter i...
2018 Invention Gas sensor comprising a rotatable fabry-perot multilayer etalon. Systems and methods for forming ...
Invention Gas sensor using mm wave cavity. Systems and methods for forming a compact gas sensor include usi...
Invention Microfabricated fiber optic platform. Described here is a platform for supporting a fiber optic c...
Invention Self-aligned silicon fiber optic connector. A transceiver and interconnect for connecting a plura...
Invention Microfabricated optical apparatus with grounded metal layer. A microfabricated optical apparatus ...
2017 Invention Thermocompression bonding with raised feature. A method for bonding two substrates is described, ...
Invention Microfabricated pressure transducer. A microfabricated pressure transducer is formed in a multila...
2016 Invention Anodic bonding of dielectric substrates. A first ion rich dielectric substrate with a patterned d...
2015 Invention Method for forming a microfabricated structure. A method for forming a feature in a device layer,...
2014 Invention Solder bump sealing method and device. A method for forming a cavity in a microfabricated structu...
Invention Method and device using silicon substrate to glass substrate anodic bonding. A bonding technology...
Invention Wafer level hermetic bond using metal alloy with raised feature and wetting layer. Systems and me...
Invention Device using glass substrate anodic bonding. A bonding technology is disclosed that can form an a...
2013 Invention Method using glass substrate anodic bonding. A bonding technology is disclosed that can form an a...
Invention Microfabricated magnetic field transducer with flux guide. A microfabricated magnetic field trans...
Invention Exothermic activation for high vacuum packaging. An approach to obtain localized heat within a se...
2012 Invention Wafer level hermetic bond using metal alloy with keeper layer. Systems and methods for forming an...
Invention Mems particle sorting actuator and method of manufacturing. A MEMS-based system and a method are ...
2011 Invention Method and apparatus for applying thin liquid coatings. Systems and methods for applying a thin l...
Invention Configurable power supply using mems switch. Systems and methods for forming a configurable power...
2010 Invention Plating process and apparatus for through wafer features. A method for forming through features i...
Invention In-plane electromagnetic mems pump. A micromechanical pumping system is formed on a substrate sur...
Invention Inlaid optical material and method of manufacture. An optical material is inlaid into a supportin...
2009 Invention Method of manufacturing a hysteretic mems two-dimensional thermal device. A MEMS hysteretic therm...
Invention Wafer level hermetic bond using metal alloy with raised feature. Systems and methods for forming ...
Invention Hysteretic mems thermal device and method of manufacture. A MEMS hysteretic thermal actuator may ...
2008 Invention Indented lid for encapsulated devices and method of manufacture. A method for providing improved ...
Invention System and method for providing access to an encapsulated device. A method for providing access t...
2007 Invention Wafer bonding material with embedded conductive particles. A material for bonding a first wafer t...
Invention Lid structure for microdevice and method of manufacture. A system and a method are described for ...
2006 Invention Contact electrode for microdevices and etch method of manufacture. A contact electrode for a devi...
Invention Interconnect structure using through wafer vias and method of fabrication. A device and a method ...
Invention Indented structure for encapsulated devices and method of manufacture. A method for providing imp...
Invention Wafer bonding material with embedded rigid particles. A material for bonding a lid wafer to a dev...
Invention Mems device using nimn alloy and method of manufacture. A material for forming a conductive struc...
Invention Mems thermal device with slideably engaged tether and method of manufacture. A MEMS thermal switc...
Invention System and method for forming moveable features on a composite substrate. A method for forming mo...
Invention Elastic interface for wafer bonding apparatus. An apparatus for bonding a lid wafer to a device w...
Invention Hysteretic mems thermal device and method of manufacture. A MEMS hysteretic thermal device may ha...
2005 Invention Method and apparatus for assembling an array of micro-devices. The invention describes a method a...
Invention Mems actuator and method of manufacture for mems particle sorting device. A micromechanical parti...
Invention Hermetic interconnect structure and method of manufacture. x alloy bond.
Invention Method and apparatus for sorting particles with a mems device. A micromechanical particle sorting...
2004 Invention Method and apparatus for sorting biological cells with a mems device. A micromechanical actuator ...