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2025
|
Invention
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2.5d/3d system integration.
Methods and systems for stacking multiple chips with high speed seri... |
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2024
|
Invention
|
Apparatus and method for making a secured substrate.
Methods of forming secured substrates are p... |
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2023
|
Invention
|
3d system integration. Methods and systems for stacking multiple chips with high speed serializer... |
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2022
|
Invention
|
3d heterogeneous integrations and methods of making thereof.
An integrated circuit package compr... |
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|
Invention
|
Enhanced semiconductor structures.
A system in package comprising: one or more component(s); one... |
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Invention
|
3d integrations and methods of making thereof. Semiconductor packages are described which increas... |
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2021
|
Invention
|
Secure semiconductor integration and method for making thereof. An integrated circuit package com... |
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|
Invention
|
Semiconductor structure and method for making thereof. An integrated circuit package comprising o... |
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|
Invention
|
Secure semiconductor integration.
A system comprising a plurality of electronic components, wher... |
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2020
|
Invention
|
Stacking integrated circuits containing serializer and deserializer blocks using through. Methods... |
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2019
|
Invention
|
Scalable semiconductor interposer integration. An electronic package comprising a first substrate... |
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|
Invention
|
Stacking integrated circuits containing serializer and deserializer blocks using through via. Met... |
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G/S
|
custom manufacturing of semiconductors semiconductor design services, namely, engineering service... |
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|
Invention
|
Stacking integrated circuits containing serializer and deserializer blocks using through silicon ... |
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2018
|
Invention
|
Semiconductor structure and a method of making thereof. An integrated circuit package comprising ... |
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2016
|
Invention
|
Semiconductor structure and a method of making thereof. An integrated circuit package including a... |
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2015
|
Invention
|
Scalable semiconductor interposer integration. Semiconductor packages are described which increas... |
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|
Invention
|
Semiconductor interposer integration. Integrated circuits are described which directly connect a ... |
